A single crystal material processing apparatus and method for a levitation apparatus

Abstract

A single crystal material processing device and method for a suspension device, wherein the processing device comprises: a grinding body fixed on a support, a grinding chamber is arranged in the grinding body, and the grinding chamber penetrates through the bottom of the grinding body; a rotor, which seals the lower end of the grinding chamber, is used to drive the single crystal material to be processed to do centrifugal motion in the grinding chamber; a gas passage is arranged on the grinding body, and the gas passage is used for inert gas to enter or exit the grinding chamber or to be vacuumized; a driving part fixed on the support is used to drive the rotor to rotate; a grinding material, which is a grinding layer arranged on the inner side of the grinding chamber and the side of the rotor facing the grinding chamber, and / or a grinding particle located in the grinding chamber; through the combination of centrifugal collision grinding and inert gas cooling and protection, the shape of the sample can be processed into a high-precision small-size spherical shape without destroying the internal crystal structure of the sample.

Description

Technical Field

[0001] This invention relates to the fields of single crystal material processing, precision manufacturing, and experimental physical instruments, and in particular to a single crystal material processing apparatus and method that can be used in levitation devices. Background Technology

[0002] An electrostatic levitation device is a device that uses an electric field to levitate an object. Electrostatic levitation devices are commonly used in high-temperature physics experiments, especially in the study of liquid metals. This is because at high temperatures, traditional containers can react chemically with the liquid or become contaminated; electrostatic levitation avoids these problems and provides a "containerless" experimental environment.

[0003] In electrostatic levitation experiments, only spherical samples can maintain a stable levitation state in an electrostatic field. Any deviation in shape, such as sharp edges or asymmetrical surfaces, can cause the sample to become unstable in its levitation state, thus affecting the accuracy of the experimental data. In electrostatic levitation experiments, the charge on the sample needs to be uniformly distributed to achieve stable levitation. For irregularly shaped samples, the distribution of the electric field in different parts will generate uneven charge, causing the sample to fail to levitate evenly.

[0004] Therefore, materials must be processed into a spherical shape before electrostatic levitation experiments. The spherical samples used in electrostatic levitation experiments are generally obtained by melting in an electric arc furnace. Due to the contact between the sample and the container during the melting process, a small plane easily appears on the sample surface. The larger the sample size, the more obvious the plane becomes. This planar structure will seriously affect the stability of the sample in the electrostatic levitation experiment, increasing the complexity and uncertainty of the experiment.

[0005] Traditional methods for processing materials into a spherical shape include:

[0006] Free forging: By placing a high-temperature spherical billet into a molding die, pressing, releasing pressure, and cooling it at high temperature, the billet gradually forms a spherical shape. Forged parts may exhibit various defects during processing, such as: heating cracks: rapid heating leads to excessive internal and external temperature differences, causing thermal stress cracks; uneven grain size: uneven deformation across the billet, with some areas falling into the critical deformation zone; surface cracks: excessively high forging temperature or excessive hammering speed leads to surface cracks; surface oxidation: during the heating process, the metal surface reacts chemically with oxidizing gases in the air (such as O2, CO2, H2O, SO2, etc.) to form an oxide layer.

[0007] Casting: Metal is melted and poured into a specially designed spherical mold, then cooled and solidified. Casting can result in various defects, such as: Porosity: Circular or irregular holes appear inside or on the surface of the casting, with a smooth surface. This may be caused by damp furnace charge, poor gas venting from the mold cavity, or an improperly designed gating system. Shrinkage Cavities: Irregular holes appear inside or on the surface of the casting, usually located in thick-walled areas, caused by volume shrinkage during metal solidification. Cold Shuts: Incompletely fused areas appear on the surface of the casting, usually due to insufficient molten metal temperature or excessively fast pouring speed. Lack of Fusion: Incomplete fusion occurs inside or on the surface of the casting, usually due to low pouring temperature or an improperly designed gating system. Rough Surface: The surface of the casting is not smooth, possibly due to poor mold surface quality or insufficient lubrication. Hot Cracks: Cracks appear on the surface or inside the casting, usually due to rapid temperature changes during metal solidification or an improperly designed mold.

[0008] Spinning: A spherical blank is placed in a specially designed spinning machine and gradually formed into a sphere through rolling. This method is suitable for processing large spherical shell parts. Spinning may produce various defects, such as: Peeling: During the rolling process, uneven hardness of the blank or unreasonable process parameters can cause separation on the metal surface after processing, resulting in a fish-scale-like phenomenon; Ripple: Insufficient rigidity of the mechanical equipment, resulting in vibration, or excessively high mold speed can cause ripple defects on the surface of the processed parts; Cracks: Uneven hardness and wall thickness of the blank, or excessive feed rate can cause cracks on the surface of the processed parts.

[0009] Turning: Special fixtures or lathe attachments are used to hold the workpiece, and the spherical surface is machined by the feed motion of the cutting tool. For single-crystal materials, the manufacturing process is quite unique, and their dimensions are typically only a few millimeters, making it difficult for ordinary lathes to effectively hold them. During turning, the local temperature of the workpiece can reach several hundred degrees Celsius, which can easily induce a lattice phase transition, causing the single-crystal material to transform into a polycrystalline material. The use of coolant may also introduce impurities, adversely affecting experimental results and material quality.

[0010] While forging and spinning are efficient methods for plastic deformation and shaping, these processes can fracture the internal crystal structure of materials, causing single-crystal materials to transform into polycrystalline materials and thus lose their single-crystal properties. Furthermore, in casting, the metal material is first heated to a molten state and then poured into a specially designed spherical mold for shaping. While this process is suitable for most materials, for single-crystal materials, the internal crystal structure and microstructure undergo irreversible changes after heating and melting, causing the material to lose its single-crystal integrity. Therefore, traditional forging, spinning, and casting methods are unsuitable for processing and shaping single-crystal materials. Electric arc furnace melting utilizes the high temperatures generated by an electric arc discharge to melt metal. Although this process is widely used in the melting of common metals and alloys, for single-crystal materials, the heating and melting process also destroys the crystal structure. Therefore, the processing and shaping of single-crystal materials requires special processes and technologies to ensure the integrity of their crystal structure and the stability of their properties.

[0011] It is important to emphasize that while forging and spinning can rapidly plastically deform metallic materials, they can disrupt the internal lattice integrity of single-crystal materials. The drastic deformation introduces dislocations and forms grain boundaries, transforming the single-crystal material into a polycrystalline material and causing it to lose its original single-crystal properties. Casting, which requires heating the material to a molten state, also causes irreversible changes to the original crystal structure of single-crystal materials. Furthermore, even with common methods like electric arc furnace melting, the resolidification process after melting also damages the single-crystal structure of single-crystal materials. Therefore, traditional forging, spinning, and casting methods are unsuitable for small-scale forming of single-crystal materials. Spherical forming of single-crystal materials requires specialized processes and techniques to ensure the integrity of their crystal structure and the stability of their performance during processing. Summary of the Invention

[0012] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a single crystal material processing device and processing method for a suspension device, which solves the technical problems such as the easy breakage of the internal structure of single crystal materials during processing, and the transformation from single crystal to polycrystalline, resulting in the loss of the integrity and performance stability of single crystal materials.

[0013] To achieve the above objectives, the present invention provides a single-crystal material processing apparatus that can be used in levitation devices, comprising:

[0014] A grinding body fixed to a bracket, the grinding body having a grinding chamber that extends through the bottom of the grinding body;

[0015] The rotor encloses the lower end of the grinding chamber and is used to drive the single crystal material to be processed to perform centrifugal motion within the grinding chamber. The grinding body is provided with a gas channel for inert gas to enter and exit the grinding chamber or for evacuation.

[0016] A drive component fixed to a bracket, the drive component driving the rotor to rotate;

[0017] The abrasive material is an abrasive layer disposed inside the grinding chamber and on the side of the rotor facing the grinding chamber, and / or abrasive particles located inside the grinding chamber.

[0018] Optionally, the polishing layer is made of the same material as the single crystal material to be processed, or its hardness is greater than that of the single crystal material to be processed.

[0019] Optionally, the abrasive layer is a diamond particle coating, a ceramic abrasive coating, or sandpaper.

[0020] Optionally, the abrasive particles are made of the same material as the single crystal material to be processed or a material with a hardness greater than that of the single crystal material to be processed.

[0021] Optionally, the lower end of the grinding body is provided with a connecting support column, and the grinding body is connected to the bracket through the connecting support column.

[0022] Optionally, the side of the rotor facing the grinding chamber has a planar structure, and this side is provided with radial centrifugal blades.

[0023] Optionally, the rotor includes a rotating shaft and a rotating disk. The rotating disk is connected to the rotating shaft on the side away from the grinding chamber. The rotating shaft is connected to a driving component. The middle part of the side of the rotating disk facing the grinding chamber is recessed towards the side away from the grinding chamber, and the recess depth is 1-3 mm.

[0024] Optionally, multiple grinding bodies, rotors, and driving components are provided, and each corresponds to one another. The grinding chambers of the multiple grinding bodies are interconnected, and each of the multiple grinding chambers is provided with a switch component to block the connection. The multiple grinding chambers perform staged grinding on the single crystal material. When a certain stage of grinding is completed, the switch component is opened, and the single crystal material enters another grinding chamber for grinding processing.

[0025] The present invention also provides a method for processing single-crystal materials for levitation devices, comprising:

[0026] Using the single crystal material processing apparatus for the suspension device as described above, the single crystal material is placed in the grinding chamber, and the single crystal material parameters are input into the single crystal material processing system. The single crystal material parameters include the type, initial shape and size of the single crystal material.

[0027] The system matches preset rotor speed, processing time, inert gas flow rate, or vacuum level based on the single crystal material parameters. The inert gas flow rate is 2–3 liters per minute, and the vacuum level is 10. -1 ~10 -2 Pa; if inert gas is used, the preset rotor speed is 3000-4000 rpm; if vacuum is used, the preset rotor speed is 2000-3000 rpm; rotor acceleration is 20-38 rpm squared; processing time is 5-10 minutes.

[0028] Inert gas is introduced into the grinding chamber or a vacuum is drawn to start the drive unit;

[0029] If inert gas is introduced into the grinding chamber: when the temperature inside the grinding chamber is greater than 50℃, increase the inert gas flow rate while reducing the rotor speed to half of the initial speed; when the temperature inside the grinding chamber drops below 50℃, adjust the inert gas flow rate to the initial flow rate while adjusting the rotor speed to the initial speed; when the cleanliness inside the grinding chamber is greater than ISO 6, increase the inert gas flow rate; when the cleanliness inside the grinding chamber returns to normal, adjust the inert gas flow rate to the initial flow rate.

[0030] If you choose to evacuate the grinding chamber: when the temperature inside the grinding chamber is greater than 50°C, the cooling function of the chiller will be automatically activated; when the temperature inside the grinding chamber drops to below 50°C, the cooling function of the chiller will be automatically shut off; when the cleanliness inside the grinding chamber is greater than ISO6, the pumping speed of the vacuum pump will be increased to remove contaminants from the grinding chamber; when the cleanliness inside the grinding chamber is restored, the pumping speed of the vacuum pump will be adjusted back to the normal level.

[0031] The machine will stop working when the temperature is abnormal or the preset processing time has ended.

[0032] Repeat the above steps until you obtain a spherical single-crystal material.

[0033] This invention uses a rotor to drive a single crystal material in centrifugal motion. The single crystal material collides and rubs against the grinding material, which can grind single crystal materials of any shape, gradually grinding away the sharp edges on the surface of the single crystal material, making its surface shape tend to be smooth, minimizing the impact load on the material, and avoiding severe stress concentration or sudden temperature changes, so as to prevent plastic deformation from damaging the crystal lattice.

[0034] This invention prevents the temperature of single-crystal materials from exceeding their lattice stability threshold by limiting the heat generated during processing. The invention primarily utilizes the gas channel to continuously introduce inert gas into the grinding chamber (forming a protective atmosphere). The rapidly flowing inert gas continuously carries away the heat generated by friction, reducing the temperature inside the grinding chamber and on the surface of the single-crystal material. This keeps the temperature rise of the single-crystal material surface at an extremely low level, effectively controlling the surface temperature and preventing phase transformation or thermal stress microcrack defects caused by localized overheating. Simultaneously, the introduced inert gas or vacuuming prevents oxidation of the single-crystal material surface. Furthermore, by controlling the flow rate of the inert gas or the degree of vacuuming, the cleanliness of the grinding chamber can be adjusted. Specifically, tiny debris and abrasive shavings generated during processing are discharged from the grinding chamber through the gap between the rotor and the grinding chamber under the action of airflow, preventing debris from circulating and affecting the grinding effect or adhering to the surface of the single-crystal material. This avoids the formation of an oxide layer or adsorption of impurities on the surface of single-crystal materials, prevents the induction of crystal structure defects and the induction or acceleration of their polycrystalline tendency, and ensures that single-crystal materials retain their single-crystal characteristics after processing, thus guaranteeing the high purity of spherical single-crystal material samples.

[0035] The method of this invention has comprehensive temperature monitoring and control measures. The temperature of the single crystal material being processed and the temperature inside the grinding chamber are monitored in real time by a temperature sensor. Once the temperature approaches the dangerous threshold of the single crystal material, the system automatically adjusts the inert gas flow rate or rotation speed. If necessary, an additional cooling device is activated to prevent the temperature from rising further. This measure ensures that the single crystal material will not recrystallize or develop microcracks due to overheating, and achieves precise control of the material temperature during processing, ensuring that the processing is carried out within a safe temperature range. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of Embodiment 1;

[0037] Figure 2 This is a structural schematic diagram from another angle of Embodiment 1, wherein the grinding body is shown in an exploded view;

[0038] Figure 3 This is a schematic diagram of the structure of the grinding body;

[0039] Figure 4 for Figure 3 Sectional view of AA;

[0040] Figure 5 This is a schematic diagram of the rotor from one perspective in Embodiment 2;

[0041] Figure 6 This is a schematic diagram of the rotor from another perspective, as described in Embodiment 2;

[0042] Figure 7 This is a three-dimensional structural diagram of the rotor described in Embodiment 2;

[0043] Figure 8 A schematic diagram illustrating the principle of spherical processing of single-crystal materials when an inert gas is introduced into the grinding body;

[0044] Figure 9 Figure 4 shows the physical images of single crystal copper at different stages in Example 4. Figure (a) is the physical image before grinding, Figure (b) is the physical image after grinding 3 times, and Figure (c) is the physical image after grinding 4 times.

[0045] Explanation of reference numerals in the attached figures:

[0046] 1. Grinding body, 2. Support, 3. Rotor, 4. Drive component, 5. Sandpaper, 6. First gas channel, 7. Second gas channel, 8. Quick-connect nozzle, 9. Connecting support, 10. Centrifugal blade, 11. Single crystal material. Detailed Implementation

[0047] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0048] Example 1

[0049] To meet the stringent shape requirements for single-crystal material samples in electrostatic levitation experiments, and to prevent single-crystal materials from becoming polycrystalline during processing, this invention proposes a single-crystal material processing device for levitation devices. This device is specifically designed to process small cylindrical, cubic, or arbitrarily shaped single-crystal blanks into small spherical samples with a diameter of 2–6 mm. The design of this device fully considers preventing phase transformations of single-crystal materials due to plastic deformation or high temperatures during processing. Its core concept involves using centrifugal force generated by rotation within a relatively enclosed cavity to continuously collide and rub the small single-crystal blank against a grinding medium, gradually rounding it through this process. Simultaneously, a special atmosphere or vacuum environment is used to control and protect the material's properties. Furthermore, this device can grind 1–5 single-crystal materials at a time.

[0050] like Figure 1-4 As shown in Figure 8, a single-crystal material processing apparatus for a levitation device includes:

[0051] A grinding body 1 is fixed on a bracket 2. The grinding body 1 has a grinding chamber inside, which extends through the bottom of the grinding body 1. Specifically, the grinding body 1 has a cylindrical structure, and the grinding chamber also has a cylindrical structure.

[0052] Rotor 3, which closes the lower end of the grinding chamber, is used to drive the single crystal material 11 to be processed to perform centrifugal motion in the grinding chamber; the grinding body 1 is provided with a gas channel, which is used for inert gas to enter and exit the grinding chamber or for evacuation;

[0053] A drive component 4 is fixed on the bracket 2, and the drive component 4 drives the rotor 3 to rotate;

[0054] The abrasive material is a grinding layer disposed on the inner side of the grinding chamber and the side of the rotor 3 facing the grinding chamber, and / or abrasive particles located within the grinding chamber. In other words, the abrasive material is a grinding layer disposed on the inner side of the grinding chamber and the side of the rotor 3 facing the grinding chamber; or the abrasive material is abrasive particles located within the grinding chamber; or the abrasive material is a grinding layer disposed on the inner side of the grinding chamber and the side of the rotor 3 facing the grinding chamber, and abrasive particles located within the grinding chamber. The abrasive particles are made of the same material as the single crystal material 11 to be processed or a material with a hardness greater than that of the single crystal material 11 to be processed, such as tiny alumina balls, silicon carbide particles, and other hard particles. The number of abrasive particles is 2000 to 3000, and the size of the abrasive particles ranges from 1 mm to 2 mm. When the rotor 3 rotates and drives the single crystal material 11, these free abrasive particles will also move with the airflow within the grinding chamber and impact the surface of the single crystal material 11, achieving a grinding effect similar to that of the grinding layer. In this embodiment, a grinding layer is provided on the inner side of the grinding chamber and on the side of the rotor 3 facing the grinding chamber.

[0055] Because excessive plastic deformation during machining can cause single-crystal lattice dislocation and the formation of new grain boundaries, ultra-precision micro-force machining methods are required. This invention uses the rotor 3 to drive the single-crystal material 11 in centrifugal motion. The single-crystal material 11 collides and rubs against the grinding material, enabling grinding of single-crystal materials 11 of arbitrary shapes. This gradually wears away the sharp edges of the single-crystal material 11, making its surface shape smoother, minimizing the impact load on the material, and avoiding severe stress concentration or sudden temperature changes to prevent damage to the crystal lattice caused by plastic deformation. Specifically, a small-sized single-crystal material 11 is placed on the horizontally mounted rotor 3. When the driving component 4 drives the rotor 3 to rotate at high speed, the single-crystal material 11 gains initial rotational motion under the frictional force of the grinding layer on the rotor 3 surface. Under the combined action of friction and centrifugal force, the single-crystal material 11 is thrown against the inner wall of the grinding chamber, where it undergoes circular motion and rebounds during collisions. Each time the single crystal material 11 impacts the inner wall of the grinding chamber, it will have a violent collision and friction with the grinding layer, which makes the single crystal material 11 come into frequent contact with the grinding layer, greatly increasing the number of collision grinding times and processing efficiency.

[0056] Since the processing only occurs on the surface of the single crystal material 11 and does not disturb the internal lattice structure of the single crystal material 11, it ensures that the processed single crystal material 11 still maintains its single crystal characteristics and does not exhibit polycrystalline phenomena caused by mechanical stress.

[0057] Single-crystal material 11 is easily transformed into polycrystalline material through recrystallization at high temperatures. Therefore, the processing temperature should be strictly controlled below the recrystallization temperature of single-crystal material 11. This invention prevents the temperature of single-crystal material 11 from exceeding its lattice stability threshold by limiting the heat generated during processing. This invention mainly uses the gas channel to continuously introduce inert gas into the grinding chamber (forming a protective atmosphere). The rapidly flowing inert gas continuously carries away the heat generated by friction, reducing the temperature inside the grinding chamber and on the surface of single-crystal material 11. This keeps the temperature rise on the surface of single-crystal material 11 at an extremely low level, effectively controlling the surface temperature of single-crystal material 11 and preventing phase transformation or thermal stress microcrack defects caused by local overheating. Simultaneously, the introduction of inert gas or vacuuming prevents oxidation of the surface of the single crystal material 11. Furthermore, by controlling the flow rate of the inert gas or the degree of vacuuming, the cleanliness of the grinding chamber can be adjusted. When inert gas is introduced, tiny debris and abrasive shavings generated during processing are discharged from the grinding chamber through the gap between the rotor 3 and the grinding chamber under the action of airflow. When vacuuming is applied, small debris within the grinding chamber is also carried away, preventing debris from circulating and affecting the grinding effect or adhering to the surface of the single crystal material 11. This avoids the formation of an oxide layer or the adsorption of impurities on the surface of the single crystal material 11, prevents the induction of crystal structure defects and the induction or acceleration of its polycrystalline tendency, ensuring that the single crystal material 11 retains its single-crystal characteristics after processing and guaranteeing the high purity of the spherical single crystal material 11 sample.

[0058] Inert gases, such as nitrogen and argon, can provide an oxygen-free and temperature-controlled processing environment for the processing of single crystal material 11.

[0059] In summary, by combining centrifugal impact grinding with inert gas cooling and protection, this invention can process a sample into a high-precision, small-sized sphere without damaging its internal crystal structure. It can rapidly process millimeter-sized single-crystal blanks, which were previously difficult to process, into spherical samples that meet experimental requirements, solving the technical problem of non-destructive processing of single-crystal material 11 into small spheres in existing technologies. Furthermore, it significantly improves grinding efficiency while ensuring that the single-crystal material 11 is processed in a safe environment. Compared to traditional methods, the processing device of this invention effectively avoids internal cracks and grain breakage that may occur during forging, high-temperature phase transformations during machining, and structural defects from casting, greatly improving the quality and reliability of the finished single-crystal material 11 sample.

[0060] The processing apparatus of this invention not only meets the sample shape requirements of electrostatic levitation experiments but also ensures that the processed single-crystal material 11 retains its single-crystal characteristics without introducing contamination or structural damage during processing. It is worth mentioning that this apparatus is not only applicable to the field of electrostatic levitation experiments but also to other fields requiring high-quality spherical single-crystal materials 11, such as precision optical component manufacturing, aerospace materials science experiments, and high-end medical material preparation. It provides a novel solution; that is, its principle is also applicable to the sphericalization or precision polishing of other small-sized single-crystal materials 11 (including single-crystal metals, semiconductor crystals, and even single-crystal ceramics), requiring only adjustment of the corresponding parameter settings according to the characteristics of different materials. Therefore, this invention not only fills the technological gap in the sphericalization processing of single-crystal materials 11 but also provides a novel solution for related scientific research and industrial applications.

[0061] Furthermore, the grinding layer is made of the same material as the single crystal material 11 to be processed, or its hardness is greater than that of the single crystal material 11 to be processed. The grinding layer can be understood as a rough, wear-resistant material coated on the inner side of the grinding chamber and the side of the rotor 3 facing the grinding chamber. Specifically, the grinding layer is a diamond particle coating or a ceramic abrasive coating, making the inner wall itself a grinding surface. Alternatively, the grinding layer can be sandpaper 5. In this embodiment, the grinding layer is sandpaper 5, which is attached to the inner side of the grinding chamber and the side of the rotor 3 facing the grinding chamber. The sandpaper 5 can be of different grits (coarseness) depending on the initial shape of the single crystal material 11 and the processing requirements, to balance processing efficiency and surface quality. Coarse-grit sandpaper 5 is suitable for quickly removing sharp edges, while fine-grit sandpaper 5 is used for later polishing and finishing. In this example, the sandpaper 5 is 800-10000 grit. Under the continuous collision and friction between the single crystal material 11 and the sandpaper 5, the sharp edges of the single crystal material 11 are gradually worn away, and the surface becomes increasingly closer to a smooth sphere. In addition, the grinding layer can also be understood as the inner wall of the grinding body 1. In this case, the material of the grinding body 1 is the same as the material of the single crystal material 11 to be processed, or its hardness is greater than that of the single crystal material 11 to be processed.

[0062] To improve processing efficiency, in some embodiments, the present invention also introduces a multi-stage grinding design concept. The sandpaper 5 on the inner wall of the grinding chamber adopts a modular, replaceable structure, such as a roll. The inner wall of the roll is pre-loaded with strips of sandpaper 5 of different grit sizes. The grit size of the sandpaper 5 strips gradually decreases from bottom to top or from top to bottom. The degree of grinding is controlled by controlling the rise or fall of the rotor 3. At the beginning of processing, coarser grit sandpaper 5 is used for rapid shaping and grinding of the single-crystal material 11. After the main edges are removed, the rotor 3 is then raised or lowered to perform fine polishing of the single-crystal material 11. This multi-stage, progressive grinding method allows the surface of the single-crystal material 11 to be gradually optimized, with the entire process from initial shaping to final high-gloss finish achieved continuously within the same equipment.

[0063] In this example, the gas channels on the grinding body 1 include a first gas channel 6 and a second gas channel 7. The first gas channel 6 is used to introduce inert gas or to create a vacuum, and the second gas channel 7 is used to discharge inert gas. The diameter of the second gas channel 7 is smaller than the diameter of the first gas channel 6. Introducing inert gas into the grinding chamber and creating a vacuum are optional. Specifically, when inert gas is introduced, the first gas channel 6 serves as the inlet and the second gas channel 7 serves as the outlet. When vacuuming is selected, the first gas channel 6 is the outlet, and the second gas channel 7 can be sealed. Vacuuming the grinding chamber can fundamentally prevent oxidation of the surface of the single crystal material 11. Under vacuum conditions, since there is no airflow for cooling, other cooling methods can be added to the outside of the grinding body 1, such as covering with a circulating water cooling jacket or a heat pipe heat dissipation device (which can also be applied to the case of introducing inert gas), to conduct the processing heat away through the wall of the grinding body 1. Under vacuum conditions, the single crystal material 11 will not oxidize, but care must be taken to control the rotation speed and processing time of the rotor 3 to prevent the sample temperature from accumulating too high.

[0064] Furthermore, a quick-connect fitting 8 for a gas nozzle is installed at the end of the first channel away from the grinding body 1, which can be connected to an inert gas source, such as a high-pressure argon cylinder.

[0065] The grinding body 1 is provided with a connecting support column 9 at its lower end, and the grinding body 1 is connected to the support 2 through the connecting support column 9. Specifically, the connecting support column 9 includes a vertical support column and a horizontal support column. The upper end of the vertical support column is connected to the lower end of the grinding body 1, and the lower end is perpendicularly connected to the horizontal support column. The horizontal support column is detachably connected to the support 2. In this embodiment, there are three connecting support columns 9, which are evenly distributed at their lower ends. The connecting support columns 9 support the grinding body 1, leaving a gap between the grinding body 1 and the support 2. After the rotor 3 exits the grinding chamber, it is convenient for the operator to place and remove the single crystal material 11 from the rotor 3.

[0066] In this example, the support 2 includes an upper plate and a lower plate, which are vertically connected by four support bars. The upper plate has a through hole A in its center, and the lower plate has a through hole B in its center. The driving component 4 is located between the upper and lower plates and is detachably connected to the upper plate. The working part of the driving component 4 passes through the through hole A and connects to the rotor 3. The top surface of the upper plate is connected to the connecting support column 9, and a gap is left between the grinding body 1 and the upper plate. The lower plate has a connecting strip for detachable connection to the processing platform. The connecting strip has a strip-shaped interface; bolts are passed through the strip-shaped interface to fix the connecting strip to the processing platform, thereby fixing the support 2.

[0067] Furthermore, the side of the rotor 3 facing the grinding chamber has a planar structure. Specifically, the rotor 3 includes a shaft and a turntable. The side of the turntable facing away from the grinding chamber is connected to the shaft, and the shaft is connected to the drive component 4. The turntable has a flat plate structure. Preferably, the rotor 3 is made of a higher strength and lighter material and undergoes precise dynamic balancing calibration to ensure stability and durability at higher speeds.

[0068] Specifically, the precision dynamic balancing calibration involves performing a rigorous dynamic balancing calibration after the rotor 3 is machined. By removing a small amount of material from the periphery of the rotor 3, the center of gravity of the rotor 3 during high-speed rotation coincides with the axis of rotation, thereby eliminating unbalanced torques, ensuring the stability of the rotor 3 during high-speed rotation, and avoiding vibration and eccentricity. This invention provides a systematic dynamic balancing optimization for the structure of the rotor 3, including the following specific aspects:

[0069] Mass symmetry design: The rotor 3 adopts an axisymmetric structure in the mechanical design stage to ensure that its geometric center coincides with the mass center as much as possible, and its thickness distribution remains symmetrical in the radial direction to avoid eccentric rotation caused by uneven mass distribution.

[0070] Symmetrical drilling or counterweight correction: If, due to process reasons, the material of rotor 3 has slight density differences or inconsistent processing tolerances, resulting in excessive dynamic balance deviation of the original prototype, then fine-tuning counterweight slots are designed on the edge of rotor 3. Mass compensation is achieved by slightly removing or adding counterweight materials (such as tungsten balls or copper plugs), thereby bringing its dynamic balance accuracy to within ±0.01 g·cm.

[0071] High-speed dynamic balancing test: The assembled rotor 3 is dynamically tested using a laser vibration meter in conjunction with a high-speed dynamic balancing instrument. Under conditions close to the operating speed (e.g., 3000–6000 rpm), the eccentricity distribution of rotor 3 is determined by measuring the radial vibration amplitude and phase difference, and fine adjustments are made on the test platform to ensure that the maximum eccentric displacement does not exceed 0.01 mm at the operating speed.

[0072] Optimized bearing fit: The rotor 3 shaft and the motor shaft are fitted with a high-precision fit. In some embodiments, low-friction, high-rigidity ceramic ball bearings or magnetic levitation bearings are selected to reduce radial runout and axial movement, thereby improving the overall rotational stability and service life of the rotor 3.

[0073] Finite element simulation-aided design: During the structural design phase, finite element simulation software (such as ANSYS or COMSOL) is introduced to analyze the stress distribution, modal response and vibration mode of rotor 3 under high-speed rotation, ensuring that it will not have risks such as resonance or structural instability at the upper speed limit (e.g., 7000 rpm).

[0074] Furthermore, in some other embodiments, the turntable is recessed from the center of the side facing the grinding chamber towards the side opposite to the grinding chamber, with a recess depth of 1-3 mm. Specifically, the turntable gradually concaves inward from its periphery towards its center to provide a certain degree of coating and guiding effect on the single crystal material 11 during rotation, which helps to improve the performance of the device. The recessed design helps the abrasive material to exert a uniform force on the single crystal material during the grinding process, thereby improving grinding efficiency and the surface grinding quality of the single crystal material. In addition, the recessed design can increase the contact area between the abrasive material and the single crystal material, such as increasing the contact area between the sandpaper on the rotor and the single crystal material, thereby improving grinding efficiency.

[0075] The drive component 4 described in this invention uses a DC motor, but it is not limited to a DC motor. The drive component 4 can be replaced with other types of motors, such as variable frequency speed control motors, brushless motors, or not limited to motor drives, such as magnetic coupling drives (the rotor 3 is rotated by transmitting magnetic torque, and there is a gap between the motor body and the rotor 3). Different drive implementation methods, as long as they can provide the rotor 3 with the required high-speed rotational power and meet the installation space requirements, are all equivalent variations of the concept of this invention.

[0076] In this example, the grinding body 1 is equipped with sensors for detecting the motion state and temperature of the single crystal material 11. The motion state includes impact frequency and vibration. Specifically, temperature sensors are installed at multiple locations inside the grinding chamber, such as near the single crystal material 11 and on the walls of the grinding chamber. The temperature sensors monitor the temperature changes of the single crystal material 11 and the environment in real time during the processing.

[0077] This device is equipped with an intelligent control module to achieve precise control and stable operation of the processing of single crystal material 11. Once the temperature is detected to be close to the set safety upper limit, the intelligent control module will automatically take measures to adjust the processing parameters, such as temporarily reducing the rotor speed 3 and increasing the flow rate of inert gas to reduce heat generation at the source. At the same time, for long-term continuous operation or higher cooling requirements, an additional cooling device can be integrated into the outer wall of the grinding body 1 to keep the processing environment temperature stable within a safe range, that is, always below the recrystallization temperature of single crystal material 11. Through the above temperature control design, single crystal material 11 is kept in a low-temperature and safe state throughout the entire processing, which greatly reduces the risk of phase transformation or performance degradation of single crystal material 11 due to overheating.

[0078] The intelligent control module adjusts the motor's speed and acceleration in real time based on sensor feedback to adapt to the needs of the processing. This adaptive speed control design ensures that the centrifugal force and impact intensity experienced by the single crystal material 11 are always within the optimal range: sufficient to grind the surface of the single crystal material 11 without damaging it due to excessive impact or generating excessively high temperatures. Simultaneously, the mechanical structure of the rotor 3 undergoes dynamic balancing optimization, maintaining extremely high stability during high-speed rotation, minimizing the impact of eccentric vibration on processing uniformity, and reducing mechanical wear and noise. This intelligent control combined with a highly stable design makes the processing process more controllable and reliable, further ensuring the quality and safety of processing the single crystal material 11.

[0079] In addition, the wear degree of the sandpaper 5 is also monitored by the sensor. When the sandpaper 5 is detected to be severely worn or has too much attached debris affecting the grinding effect, the intelligent control module will remind the operator to replace the sandpaper 5 module, so as to always maintain good grinding performance.

[0080] Example 2

[0081] This embodiment provides a single-crystal material processing apparatus for a levitation device. Most of its contents are the same as in Embodiment 1; please refer to Embodiment 1 for details. The difference lies in, for example... Figure 5-7 As shown, the rotor 3 has a planar structure on the side facing the grinding chamber, and radial centrifugal blades 10 are provided on this side. That is, the rotor 3 has radial centrifugal blades 10 on the side facing the grinding chamber. The rotor 3 includes a shaft and a turntable. The turntable is connected to the shaft on the side facing away from the grinding chamber, and the shaft is connected to a drive component. The turntable has a flat plate structure. The turntable has a circular plate structure, and the centrifugal blades 10 are arranged along the radius of the turntable, that is, one end of the centrifugal blade 10 is close to the center of the turntable, and the other end is close to the circumference of the turntable. The centrifugal blades 10 can enhance the throwing and disturbance effect on the single crystal material, promoting more uniform impact of the single crystal material on the inner wall of the grinding chamber.

[0082] The centrifugal blade 10 has an arc-shaped sheet structure, and the centrifugal blade 10 has multiple blades, which are evenly distributed. In this example, the centrifugal blade 10 has six blades.

[0083] Example 3

[0084] This embodiment provides a single-crystal material processing device for a suspension device. Most of the contents are the same as those in Embodiment 1, and specific details can be found in Embodiment 1. The difference is that multiple grinding bodies, rotors, and driving components are provided, and they correspond one-to-one. The grinding chambers of the multiple grinding bodies are interconnected, and each of the multiple grinding chambers is provided with a switch component to block the connection. The multiple grinding chambers perform staged grinding of the single-crystal material. When a certain stage of grinding is completed, the switch component is opened, and the single-crystal material enters another grinding chamber for grinding processing.

[0085] In this example, taking the grinding body, rotor, and drive component as having two components each, the two grinding chambers are designated as a first grinding chamber and a second grinding chamber. The first grinding chamber uses coarser abrasives for rapid shaping, while the second grinding chamber uses finer abrasives for fine polishing. By using a staged, chamber-based process, surface quality can be improved while maintaining efficiency.

[0086] The multiple grinding chambers can be connected using existing technologies, such as connecting the multiple grinding chambers through an inclined pipe. When it is necessary to enter the next stage of the grinding chamber, the switch component is turned on, and the rotor rotates the single crystal material into the inclined pipe, and then into another grinding chamber through the pipe.

[0087] Example 4

[0088] This embodiment provides a method for processing single-crystal materials using a levitation device, which enables real-time control, dynamic optimization, and high-quality output of single-crystal materials during centrifugal grinding. The device in Embodiment 1 uses this method for processing. Taking the grinding of single-crystal copper as an example, the single-crystal copper is ground into a 2.5mm sphere. The method includes:

[0089] Using the single crystal material processing apparatus for the suspension device as described in Example 1, the single crystal material is placed in the grinding chamber. The sandpaper is 800-10000 grit. In this example, 2000 grit sandpaper is used. The single crystal material parameters are input into the single crystal material processing system. The single crystal material parameters include the type, initial shape, and size of the single crystal material. Specifically, the type of single crystal material is single crystal copper, the initial shape is cylindrical, and the initial size is 3mm in diameter and 3mm in height.

[0090] The system matches preset rotor speed, processing time, inert gas flow rate, or vacuum level based on the single crystal material parameters. In this example, inert gas is introduced, the rotor speed is 3000-4000 rpm, the rotor acceleration is 20-38 rpm squared, the processing time is 5-10 minutes, and the inert gas flow rate is 2-3 liters / minute. Furthermore, the matched parameters can be adjusted and optimized according to user needs. The processing time is related to the material hardness; high-hardness materials are prone to abrasion of the sandpaper, so the processing time is generally set to 5 minutes. For low-hardness materials, the processing time is generally set to 10 minutes. After processing, the condition of the single crystal material is observed, and the sandpaper is replaced for reprocessing if necessary. In this example, the preset rotor speed is 3000 rpm, the rotor acceleration is 38 rpm squared, the processing time is 6 minutes, and the inert gas flow rate is 2 liters / minute.

[0091] The formula for calculating the preset rotor speed is as follows:

[0092] n = n0k S k D k H

[0093] In the formula, n represents the rotor speed in revolutions per minute (rpm); n0 represents the preset rotor speed in revolutions per minute (rpm); k S k represents the initial shape factor of the single-crystal material. If the single-crystal material to be processed is approximately spherical, then k S =1, if it is approximately cylindrical, then k S =1.5, if it is an approximate cube or other arbitrary shape, then k S =1.25; k D k represents the initial size factor for processing single-crystal materials. When the maximum outer length of the single-crystal material to be processed is greater than 4 mm and less than 8 mm, k D =0.75, when less than 4mm, k D =1; k H This represents the hardness coefficient of the single-crystal material to be processed. When the Vickers hardness of the material is greater than 100, k represents the coefficient of hardness. H =0.75, when less than 100, k H =1; In practical applications, k can be adjusted according to specific circumstances. D and k H The value should be adjusted to achieve the best adjustment effect.

[0094] Before processing, various sensors (temperature, vibration, position detection) in the grinding chamber can be calibrated and put into standby mode.

[0095] Inert gas is introduced into the grinding chamber or a vacuum is drawn. In this example, inert gas is introduced. Then the drive unit is started. Specifically, the drive motor is accelerated to the set speed, so that the rotor generates centrifugal force to perform dynamic grinding of single crystal copper. Under the centrifugal force, the single crystal copper continuously impacts the sandpaper attached in the grinding chamber, realizing toolless spheroidization.

[0096] During processing, the intelligent controller adjusts the inert gas flow rate and pressure, dynamically regulating the temperature and cleanliness within the grinding chamber. A temperature sensor monitors the temperature of the single-crystal copper and the ambient temperature within the grinding chamber. If the temperature exceeds a safety threshold, the system automatically reduces the rotational speed and increases the gas flow rate for cooling. Specifically, when the temperature within the grinding chamber exceeds 50°C, the inert gas flow rate is increased, while the rotor speed is reduced to half of its initial speed (in this example, 1500 rpm). When the temperature within the grinding chamber drops below 50°C, the inert gas flow rate is adjusted back to its initial flow rate, and the rotor speed is also adjusted back to its initial speed. When the cleanliness within the grinding chamber exceeds ISO 6 (standard number: ISO 14644-1), the inert gas flow rate is increased. When the cleanliness within the grinding chamber returns to normal, the inert gas flow rate is adjusted back to its initial flow rate.

[0097] The flow rate of the inert gas is increased by the following expression:

[0098] Q = Q0 + max(0,k) T (T-50))+max(0,k C (C-6)

[0099] In the formula, Q represents the flow rate of the inert gas, in liters per minute; Q0 represents the initial inert gas flow rate, in liters per minute; T represents the temperature inside the grinding chamber, in degrees Celsius; C represents the cleanliness of the grinding chamber, using ISO standards; k T k represents the temperature coefficient. C k represents the cleanliness coefficient. T and k C Both are dimensionless variables representing proportions, k T =k C =0.1; In practical applications, k can be adjusted according to specific circumstances. T and k C The value should be adjusted to achieve the best adjustment effect.

[0100] In addition, during the processing, the vibration and impact frequencies of the single-crystal copper are monitored simultaneously. Accelerometers or optical displacement sensors are used to monitor the impact frequency and path distribution of the single-crystal copper, and the processing uniformity is analyzed. By monitoring the impact frequency and path distribution, the stress situation of the single-crystal copper during processing can be analyzed, thereby assessing the processing uniformity. Real-time monitoring data can be used to dynamically adjust processing parameters, such as rotational speed, acceleration, and the amount of inert gas, to ensure that the processing is always in the best state. Based on the results of data analysis, the processing parameters can be continuously optimized to achieve continuous improvement.

[0101] When the temperature becomes abnormal or the preset processing time ends, the drive unit is triggered to stop working, the inert gas supply is stopped, the sample grinding effect is checked, and it is determined whether the sandpaper needs to be replaced and grinding repeated. It should be noted that abnormal temperature means that the temperature in the grinding chamber exceeds the preset temperature safety threshold. In this example, the preset temperature safety threshold is 80℃.

[0102] After stopping the operation, the operator is prompted by a buzzer or interface to remove the single crystal copper, and then the processing equipment is cleaned, specifically to remove residual dust and sandpaper debris, in preparation for the next processing cycle, that is, to repeat the above method.

[0103] For multi-stage grinding, the sandpaper is changed after each processing cycle to begin the next stage. The sandpaper replacement depends on the grinding requirements; the grit size is adjusted to achieve coarse grinding → medium grinding → fine polishing. In this example, there are four grinding stages, meaning the above method is repeated until the single-crystal copper is ground into a 2.5mm sphere. The shape changes of the single-crystal material before, during, and after grinding in this example are shown below. Figure 9 As shown.

[0104] By monitoring the motion and temperature during the processing of single-crystal materials, the control system can adaptively adjust the rotor's speed and acceleration, ensuring the grinding process is always under optimal conditions. This not only improves processing efficiency but also prevents damage to the material from excessive impact or overheating.

[0105] During processing, the sharp edges of single-crystal materials of any shape can be gradually ground away, making their surface shape smoother. By adjusting the rotor speed, the impact load on the material during processing is ensured to be within a safe range, and severe stress concentration is avoided. This invention features comprehensive temperature monitoring and control measures. Temperature sensors monitor the temperature of the processed single-crystal material and the interior of the grinding chamber in real time. Once the temperature approaches the dangerous threshold of the single-crystal material, the system automatically adjusts the inert gas flow rate or rotation speed to control the temperature within the safe threshold, avoiding sudden temperature changes and preventing plastic deformation from damaging the crystal lattice of the single-crystal material or causing cracks. If necessary, an additional cooling device is activated to prevent further temperature increases. This measure ensures that the single-crystal material will not recrystallize or develop microcracks due to overheating, achieving precise temperature control during processing and ensuring that the processing is carried out within a safe temperature range.

[0106] Example 5

[0107] This embodiment provides a method for processing single-crystal materials for a suspension device. Taking grinding single-crystal copper as an example, the single-crystal copper is ground into a 3.5mm sphere using the device described in Embodiment 1. The device is evacuated, and additional cooling methods are added externally. In this example, a circulating water cooling jacket is added, and the cooling water inside the jacket is circulated by connecting to a chiller, thereby achieving an effective cooling effect. The device uses 5000-grit sandpaper. Specifically, the method is as follows:

[0108] Place the single-crystal copper into the grinding chamber described in Example 1, and input the single-crystal material parameters, including that the type of single-crystal material is single-crystal copper, the initial shape is a cube, and the initial size is 4mm×4mm.

[0109] In a vacuum environment, the heat generated during processing can only be dissipated through thermal radiation. Therefore, the rotor speed cannot be too high. The system is matched with a preset rotor speed of 2000-3000 rpm based on the single crystal material parameters, and the vacuum degree is 10. -1 ~10 -2 In this example, the preset rotor speed is 2500 rpm, the processing time is 10 minutes, and the vacuum degree is 10. -2 Pa.

[0110] Evacuate the grinding chamber to 10 -2 Pa, then start the drive unit;

[0111] During the grinding process, the chiller keeps the cooling water circulating. When the temperature inside the grinding chamber is greater than 50°C, the chiller automatically starts its cooling function; when the temperature inside the grinding chamber drops to below 50°C, the chiller automatically shuts off its cooling function; when the cleanliness inside the grinding chamber is greater than ISO6, the vacuum pump's pumping speed is increased to remove contaminants from the grinding chamber; when the cleanliness inside the grinding chamber is restored, the vacuum pump's pumping speed is adjusted back to normal.

[0112] When the preset processing time ends, the drive component is triggered to stop working. The grinding effect of the sample is checked to determine whether the sandpaper needs to be replaced and the grinding is repeated. If grinding needs to continue, the above method is repeated.

[0113] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A method for processing single-crystal materials for levitation devices, characterized in that, include: The processing is performed using a single-crystal material processing apparatus, which includes: A grinding body fixed to a bracket, the grinding body having a grinding chamber that extends through the bottom of the grinding body; The rotor encloses the lower end of the grinding chamber and is used to drive the single crystal material to be processed to perform centrifugal motion within the grinding chamber. The grinding body is provided with a gas channel for inert gas to enter and exit the grinding chamber or for evacuation. A drive component fixed to a bracket, the drive component driving the rotor to rotate; The abrasive material is an abrasive layer disposed inside the grinding chamber and on the side of the rotor facing the grinding chamber, and / or abrasive particles located inside the grinding chamber; The processing includes: The single crystal material is placed in the grinding chamber, and the single crystal material parameters are input into the single crystal material processing system. The single crystal material parameters include the type, initial shape and size of the single crystal material. The system matches preset rotor speed, processing time, inert gas flow rate, or vacuum level based on the single crystal material parameters. The inert gas flow rate is 2–3 liters per minute, and the vacuum level is 10. -1 ~10 -2 Pa; if inert gas is used, the preset rotor speed is 3000-4000 rpm; if vacuum is used, the preset rotor speed is 2000-3000 rpm; rotor acceleration is 20-38 rpm squared; processing time is 5-10 minutes. Inert gas is introduced into the grinding chamber or a vacuum is drawn to start the drive unit; If inert gas is introduced into the grinding chamber: when the temperature inside the grinding chamber is greater than 50℃, increase the inert gas flow rate while reducing the rotor speed to half of the initial speed; when the temperature inside the grinding chamber drops below 50℃, adjust the inert gas flow rate to the initial flow rate while adjusting the rotor speed to the initial speed; when the cleanliness inside the grinding chamber is greater than ISO 6, increase the inert gas flow rate; when the cleanliness inside the grinding chamber returns to normal, adjust the inert gas flow rate to the initial flow rate. If you choose to evacuate the grinding chamber: when the temperature inside the grinding chamber is greater than 50°C, the cooling function of the chiller will be automatically activated; when the temperature inside the grinding chamber drops to below 50°C, the cooling function of the chiller will be automatically shut off; when the cleanliness inside the grinding chamber is greater than ISO6, the pumping speed of the vacuum pump will be increased to remove contaminants from the grinding chamber; when the cleanliness inside the grinding chamber is restored, the pumping speed of the vacuum pump will be adjusted back to the normal level. The machine will stop working when the temperature is abnormal or the preset processing time has ended. Repeat the above steps until a spherical single-crystal material is obtained; Before processing, the formula for calculating the preset rotor speed is: In the formula, This indicates the rotor speed, measured in revolutions per minute (rpm). This indicates the preset rotational speed of the rotor, in revolutions per minute (rpm). This represents the initial shape factor of the single-crystal material. If the single-crystal material to be processed is approximately spherical, then... =1, if approximately cylindrical, then =1.5, if it approximates a cube or other arbitrary shapes, then =1.25; This represents the initial size factor for processing single-crystal materials. It is used when the maximum outer length of the single-crystal material to be processed is greater than 4 mm but less than 8 mm. =0.75, less than 4mm, =1; This indicates the hardness coefficient of the single-crystal material to be processed. When the Vickers hardness of the material is greater than 100... =0.75, less than 100, =1; The formula for increasing the inert gas flow rate during processing is as follows: In the formula, Q represents the flow rate of the inert gas, in liters per minute; The initial inert gas flow rate is expressed in liters per minute; T represents the temperature inside the grinding chamber in degrees Celsius; and C represents the cleanliness level inside the grinding chamber. Temperature coefficient Indicates the cleanliness coefficient. and All are dimensionless variables representing proportions. = =0.

1.

2. The method for processing single-crystal materials for a levitation device according to claim 1, characterized in that, The grinding layer is made of the same material as the single crystal material to be processed, or its hardness is greater than that of the single crystal material to be processed.

3. The method for processing single-crystal materials for a levitation device according to claim 1, characterized in that, The abrasive layer is a diamond particle coating, a ceramic abrasive coating, or sandpaper.

4. The method for processing single-crystal materials for a levitation device according to claim 1, characterized in that, The abrasive particles are made of the same material as the single crystal material to be processed or a material with a hardness greater than that of the single crystal material to be processed.

5. The method for processing single-crystal materials for a levitation device according to claim 1, characterized in that, The grinding body is provided with a connecting support at its lower end, and the grinding body is connected to the bracket through the connecting support.

6. The method for processing single-crystal materials for a levitation device according to claim 1, characterized in that, The rotor has a planar structure on the side facing the grinding chamber, and radial centrifugal blades are provided on this side.

7. The method for processing single-crystal materials for a levitation device according to claim 1, characterized in that, The rotor includes a rotating shaft and a rotating disk. The rotating disk is connected to the rotating shaft on the side away from the grinding chamber. The rotating shaft is connected to a driving component. The middle part of the side of the rotating disk facing the grinding chamber is recessed towards the side away from the grinding chamber, with a recess depth of 1 to 3 mm.

8. The method for processing single-crystal materials for a levitation device according to claim 1, characterized in that, The grinding body, the rotor, and the driving component are provided in multiple ways, and each corresponds to the other. The grinding chambers of the multiple grinding body components can be connected, and each of the multiple grinding chambers is provided with a switch component to block the connection. The multiple grinding chambers perform staged grinding on the single crystal material. After a certain stage of grinding is completed, the switch component is opened, and the single crystal material enters another grinding chamber for grinding processing.

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