Base plate leveling method and base plate leveling device of 3D printer and 3D printer

Abstract

The invention relates to the technical field of printers, and discloses a substrate leveling method and device of a 3D printer and the 3D printer. The method is applied to a substrate leveling device in the 3D printer. The method comprises the steps that the measured height between a jacking point on a substrate in the 3D printer and a printing mechanism in the 3D printer is collected; under the condition that it is determined that the base plate is inclined based on the measured height, the target height of the jacking point is determined based on the measured height, the fixing point position of a fixing point for fixing the base plate in the 3D printer and the preset height between the fixing point and the printing mechanism; and the jacking mechanism is controlled to adjust the jacking point to ascend or descend by the target height. According to the method, the inclination of the base plate is determined by automatically collecting the measured height between the jacking point and the printing mechanism, meanwhile, the base plate can be automatically leveled, and the base plate leveling efficiency of the 3D printer is improved.

Description

Technical Field

[0001] The present application relates to the technical field of printers, and in particular, to a substrate leveling method, a substrate leveling device, and a 3D printer for a 3D printer. Background Art

[0002] With the development of technology, 3D printers are widely used in various industries. Among them, the most direct factor affecting the printing quality of a 3D printer is whether the substrate in the printer is horizontal.

[0003] In the existing substrate leveling method for 3D printers, multiple pressure sensors or mechanical contact sensors are usually used to detect the flatness of the substrate. The pressure sensors are easily affected by factors such as external vibration and temperature change, resulting in inaccurate measurement. In the long-term use process of mechanical contact sensors, the contact parts are easily worn, affecting the measurement accuracy; and in the leveling process of most 3D printers, the operator needs to manually rotate the leveling nut to level the printer substrate, and the operation process is relatively cumbersome. Summary of the Invention

[0004] In view of this, the purpose of the present application is to overcome the deficiencies in the prior art and provide a substrate leveling method for a 3D printer. The method is applied to a substrate leveling device in a 3D printer, and the method includes:

[0005] Collect the measured height between the jacking points on the substrate in the 3D printer and the printing mechanism in the 3D printer;

[0006] When it is determined that the substrate is inclined based on the measured height, based on the measured height, the fixed point position of the fixed point that fixes the substrate in the 3D printer, and the preset height between the fixed point and the printing mechanism, determine the target height of the jacking point;

[0007] Control the jacking mechanism to adjust the jacking point to rise or fall by the target height.

[0008] In an embodiment, the substrate includes a first jacking point and a second jacking point. The step of collecting the measured height between the jacking points on the substrate in the 3D printer and the printing mechanism in the 3D printer includes:

[0009] Collect the first measured height between the first jacking point and the printing mechanism in the 3D printer, and collect the second measured height between the second jacking point and the printing mechanism;

[0010] The step of determining whether the substrate is inclined based on the measured height includes:

[0011] Calculate a first height difference between the first measured height and a preset height, and calculate a second height difference between the second measured height and the preset height;

[0012] If the first height difference and / or the second height difference do not meet the preset conditions, determine that the substrate is tilted.

[0013] In one embodiment, the step of determining a target height of the jacking point based on the measured height, a fixed point position of a fixed point for fixing the substrate in the 3D printer, and a preset height between the fixed point and the printing mechanism includes:

[0014] Based on the first measured height, the second measured height, a first position of the first jacking point, a second position of the second jacking point, a fixed point position of a fixed point for fixing the substrate in the 3D printer, and a preset height between the fixed point and the printing mechanism, determine a first tilt angle of the substrate relative to an ideal horizontal state in the direction of the first jacking point and a second tilt angle of the substrate relative to the ideal horizontal state in the direction of the second jacking point;

[0015] Based on the first measured height, the preset height, and the first tilt angle, determine a first target height of the first jacking point;

[0016] Based on the second measured height, the preset height, and the second tilt angle, determine a second target height of the second jacking point.

[0017] In one embodiment, the jacking mechanism includes a first jacking mechanism and a second jacking mechanism. The step of controlling the jacking mechanism to adjust the jacking point to rise or fall by the target height includes:

[0018] Based on the first target height, send a first control signal to the first jacking mechanism so that the first jacking mechanism controls and adjusts the first jacking point to rise or fall by the first target height based on the first control signal;

[0019] Based on the second target height, send a second control signal to the second jacking mechanism so that the second jacking mechanism controls and adjusts the second jacking point to rise or fall by the second target height based on the second control signal.

[0020] In one embodiment, after the step of controlling the jacking mechanism to adjust the jacking point to rise or fall by the target height, it includes:

[0021] Re-collect a reference height between the adjusted jacking point and the printing mechanism;

[0022] If the height difference between the reference height and the preset height meets the preset condition, it is determined that the substrate leveling is completed;

[0023] If the height difference between the reference height and the preset height does not meet the preset condition, the substrate is leveled again until the height difference between the reference height and the preset height meets the preset condition.

[0024] This application also provides a substrate leveling device, which is arranged directly below the substrate of a 3D printer. The substrate leveling device includes: a distance sensor and a lifting mechanism;

[0025] The distance sensor is arranged on the printing mechanism in the 3D printer; the lifting mechanism is arranged below the lifting point of the substrate in the 3D printer;

[0026] The distance sensor is used to collect the measured height between the lifting point and the printing mechanism;

[0027] The lifting mechanism is used to adjust the lifting point to rise or fall to a target height. The target height is determined by the substrate leveling device based on the measured height when the substrate is tilted, based on the measured height, the fixed point position of the fixed point that fixes the substrate in the 3D printer, and the preset height between the fixed point and the printing mechanism.

[0028] In one embodiment, the substrate leveling device includes: a first lifting mechanism and a second lifting mechanism;

[0029] The first lifting mechanism is arranged below the first lifting point of the substrate, and the second lifting mechanism is arranged below the second lifting point of the substrate.

[0030] In one embodiment, the upper surface of the substrate is rectangular, the fixed point is arranged at any vertex of the upper surface of the substrate, the first lifting point is arranged at any vertex adjacent to the fixed point on the upper surface of the substrate, and the second lifting point is arranged at the midpoint of the side opposite to the connection line between the fixed point and the first lifting point on the upper surface of the substrate.

[0031] In one embodiment, the distances between the first lifting point, the second lifting point and the fixed point are equal to each other pairwise.

[0032] This application also provides a 3D printer, in which the substrate leveling device is arranged, and the substrate leveling device is used to execute the substrate leveling method of the above 3D printer.

[0033] The present application also provides a computer-readable storage medium for storing a computer program used in the substrate leveling device. When the computer program is run by the substrate leveling device, it executes the substrate leveling method of the above 3D printer.

[0034] The embodiments of the present application have the following beneficial effects:

[0035] Collect the measured height between the jacking points on the substrate in the 3D printer and the printing mechanism in the 3D printer; when it is determined that the substrate is tilted based on the measured height, determine the target height of the jacking points based on the measured height, the fixed point position of the fixed points that fix the substrate in the 3D printer, and the preset height between the fixed points and the printing mechanism; control the jacking mechanism to adjust the jacking points to rise or fall by the target height. This method determines the substrate tilt by autonomously collecting the measured height between the jacking points and the printing mechanism, and at the same time can automatically level the substrate, improving the efficiency of substrate leveling of the 3D printer. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the present application, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the protection scope of the present application. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0037] Figure 1 It is a schematic flowchart of the first embodiment of the substrate leveling method of the 3D printer provided by the present application;

[0038] Figure 2 It is a schematic flowchart of the second embodiment of the substrate leveling method of the 3D printer provided by the present application;

[0039] Figure 3 It is a schematic flowchart of the third embodiment of the substrate leveling method of the 3D printer provided by the present application;

[0040] Figure 4 It is a schematic flowchart of the fourth embodiment of the substrate leveling method of the 3D printer provided by the present application;

[0041] Figure 5 It is a schematic flowchart of the fifth embodiment of the substrate leveling method of the 3D printer provided by the present application;

[0042] Figure 6 It is a schematic structural diagram of the substrate leveling device provided by the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0043] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0044] Generally, the components of the embodiments of the present application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0045] Hereinafter, the terms "including", "having" and their cognates that can be used in various embodiments of the present application are only intended to represent specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be construed as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or increasing the possibility of one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0046] In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0047] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the various embodiments of the present application belong. The terms (such as those defined in a commonly used dictionary) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning unless clearly defined in the various embodiments of the present application.

[0048] It can be understood that the method of the present application is applied to the substrate leveling device in a 3D printer, and the substrate leveling device executes the substrate leveling method of the 3D printer to level the substrate in the 3D printer.

[0049] Next, some embodiments of the present application will be described in detail in conjunction with the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0050] Please refer to Figure 1 , Figure 1 which is a schematic flowchart of the first embodiment of the substrate leveling method for a 3D printer provided by the present application. The method is applied to a substrate leveling device in a 3D printer, and the method includes:

[0051] Step S101, collect the measured height between the lifting points on the substrate in the 3D printer and the printing mechanism in the 3D printer.

[0052] In this embodiment, the substrate leveling device measures and collects the measured height between the lifting points on the substrate in the 3D printer and the printing mechanism in the 3D printer through a distance sensor arranged on the printing mechanism in the 3D printer, and determines whether the substrate in the 3D printer is in an inclined state based on the measured height and the preset height.

[0053] It should be noted that the printing mechanism is arranged above the substrate, and the substrate is used to carry the printing material ejected by the printing mechanism, so that the required item can be printed on the substrate. The lifting point refers to the point where the lifting mechanism contacts the substrate during the leveling process. The lifting mechanism can control the rise and fall of the lifting point so that the substrate reaches a horizontal state.

[0054] It can be understood that when the substrate leveling device determines that the measured height is different from the preset height, it can determine that the substrate is in an inclined state. When the substrate leveling device determines that the measured height is the same as the preset height, it can determine that the substrate is in a horizontal state.

[0055] Step S102, when it is determined that the substrate is inclined based on the measured height, determine the target height of the lifting point based on the measured height, the fixed point position of the fixed point for fixing the substrate in the 3D printer, and the preset height between the fixed point and the printing mechanism.

[0056] In this embodiment, when the substrate leveling device determines that the substrate is inclined based on the measured height, it determines the target height of the lifting point based on the measured height, the fixed point position of the fixed point for fixing the substrate in the 3D printer, and the preset height between the fixed point and the printing mechanism.

[0057] It should be noted that the fixed point is used to fix the substrate, and the plane of the fixed point and the substrate in the horizontal state are located on the same horizontal plane. Therefore, the preset height between the fixed point and the printing mechanism is the vertical height from each point on the substrate in the horizontal state to the plane where the printing mechanism is located. The target height refers to the height that the lifting point needs to rise or fall so that the substrate returns to a horizontal state.

[0058] Step S103, control the lifting mechanism to adjust the lifting point to rise or fall by the target height.

[0059] In this embodiment, after determining the target height of the jacking point, the substrate leveling device generates a corresponding control signal according to the target height, and sends the control signal to the jacking mechanism corresponding to the jacking point, thereby controlling the jacking mechanism to adjust the jacking point to rise or fall by the target height. It should be noted that the jacking mechanism is arranged below the substrate and contacts the preset jacking points on the substrate, and can control the jacking points to rise or fall by the corresponding height.

[0060] The substrate leveling device in this embodiment collects the measured height between the jacking points on the substrate in the 3D printer and the printing mechanism in the 3D printer; when it is determined that the substrate is tilted based on the measured height, based on the measured height, the fixed point position of the fixed points for fixing the substrate in the 3D printer, and the preset height between the fixed points and the printing mechanism, determine the target height of the jacking point; control the jacking mechanism to adjust the jacking point to rise or fall by the target height. By autonomously collecting the measured height between the jacking points and the printing mechanism to determine the substrate tilt, the substrate can be automatically leveled at the same time, improving the efficiency of substrate leveling of the 3D printer.

[0061] Please refer to Figure 2 , Figure 2 which is a schematic flowchart of the second embodiment of the substrate leveling method for a 3D printer provided by this application. The difference between the second embodiment and the first embodiment is that the substrate includes a first jacking point and a second jacking point, and the step of collecting the measured height between the jacking points on the substrate in the 3D printer and the printing mechanism in the 3D printer includes:

[0062] Step S201, collect the first measured height between the first jacking point and the printing mechanism in the 3D printer, and collect the second measured height between the second jacking point and the printing mechanism.

[0063] In this embodiment, the distance sensor in the substrate leveling device is arranged on the printing mechanism of the 3D printer. The printing mechanism is movable. The substrate leveling device controls the printing mechanism to move above the first jacking point, collects the first measured height between the first jacking point and the printing mechanism in the 3D printer, and then controls the printing mechanism to move above the second jacking point, and collects the second measured height between the second jacking point and the printing mechanism in the 3D printer.

[0064] It should be noted that the non-contact measurement method using a distance sensor avoids the measurement errors caused by wear of traditional contact sensors. Moreover, the distance sensor is less affected by external environmental factors and can work stably in a complex working environment, ensuring the stability and reliability of the leveling result, and thus ensuring the consistency of the metal 3D printing quality. At the same time, the distance sensor has the characteristics of high precision, high reliability and fast response, and can accurately measure the distance from the jacking point to the printing mechanism, with an accuracy up to the micron level. Through the collaborative measurement of two sensors and precise algorithm calculation, high-precision adjustment of the substrate flatness can be achieved.

[0065] Further, the step of determining the inclination of the substrate based on the measured height includes:

[0066] Step S202, calculating a first height difference between the first measured height and a preset height, and calculating a second height difference between the second measured height and the preset height.

[0067] In this embodiment, after the substrate leveling device acquires the first measured height and the second measured height, it calculates the first height difference between the first measured height and the preset height, and calculates the second height difference between the second measured height and the preset height.

[0068] It should be noted that the preset height is the height between the fixed point for fixing the substrate in the 3D printer and the printing mechanism, and usually the preset height is set in advance. Further, during the long-term use of the 3D printer, the height between the fixed point and the printing mechanism may change. At the same time, substrate leveling usually requires a small error. Therefore, the substrate leveling device can control the printing mechanism to move above the fixed point, and acquire the measured height between the fixed point and the printing mechanism in the 3D printer as the preset height, so as to acquire the preset height in real time and avoid the problem of inaccurate subsequent substrate leveling caused by the change in the height between the fixed point and the printing mechanism.

[0069] Step S203, if the first height difference and / or the second height difference do not meet the preset conditions, determine that the substrate is inclined.

[0070] In this embodiment, if the first height difference and / or the second height difference is greater than a preset height difference threshold, the substrate leveling device determines that the substrate is inclined. It can be understood that as long as one of the first height difference and / or the second height difference is greater than the preset height difference threshold, it can be determined that the substrate is inclined.

[0071] The substrate leveling device of this embodiment collects the first measured height between the first lifting point and the printing mechanism in the 3D printer, and collects the second measured height between the second lifting point and the printing mechanism, calculates the first height difference between the first measured height and the preset height, and calculates the second height difference between the second measured height and the preset height. If the first height difference and / or the second height difference do not meet the preset conditions, it is determined that the substrate is tilted. By determining the height difference between the measured height between the two preset lifting points on the substrate and the printing mechanism and the preset height, it is possible to determine whether the substrate is tilted, avoiding a complex tilt judgment process and improving the efficiency of substrate tilt judgment.

[0072] Please refer to Figure 3 , Figure 3 FIG. is a schematic flowchart of the third embodiment of the substrate leveling method for a 3D printer provided by this application. The difference between the third embodiment and the first and second embodiments is that the step of determining the target height of the lifting point based on the measured height, the fixed point position of the fixed point in the 3D printer that fixes the substrate, and the preset height between the fixed point and the printing mechanism includes:

[0073] Step S301, based on the first measured height, the second measured height, the first position of the first lifting point, the second position of the second lifting point, the fixed point position of the fixed point in the 3D printer that fixes the substrate, and the preset height between the fixed point and the printing mechanism, determine a first tilt angle of the substrate relative to the ideal horizontal state in the direction of the first lifting point and a second tilt angle of the substrate relative to the ideal horizontal state in the direction of the second lifting point.

[0074] In this embodiment, the substrate leveling device determines the first tilt angle of the substrate relative to the ideal horizontal state in the direction of the first lifting point based on the first measured height, the first position of the first lifting point, the fixed point position of the fixed point in the 3D printer that fixes the substrate, and the preset height between the fixed point and the printing mechanism; based on the second measured height, the second position of the second lifting point, the fixed point position of the fixed point in the 3D printer that fixes the substrate, and the preset height between the fixed point and the printing mechanism, determine the second tilt angle of the substrate relative to the ideal horizontal state in the direction of the second lifting point.

[0075] Specifically, the formula for calculating the tilt angle is: theta = 90 - α = 90 - arctan(tanα), tanα = height difference / (lifting point position - fixed point position).

[0076] It can be understood that the position of the jacking point is the two-dimensional coordinate of the jacking point on the substrate plane, and the position of the fixed point is the two-dimensional coordinate of the fixed point on the substrate plane. The difference between the two is the distance between the jacking point and the fixed point on the substrate plane. The ideal horizontal state refers to the state where the difference between the vertical heights of each point on the substrate to the plane where the printing mechanism is located is less than the preset difference.

[0077] Step S302: Determine the first target height of the first jacking point based on the first measured height, the preset height, and the first inclination angle.

[0078] In this embodiment, the substrate leveling device determines the first target height of the first jacking point based on the first measured height, the preset height, and the first inclination angle. Specifically, after the substrate leveling device determines the first inclination angle of the substrate relative to the ideal horizontal state in the direction of the first jacking point, it determines the target compensation coefficient according to the first inclination angle in the preset mapping relationship between the inclination angle and the compensation coefficient. Then, based on the first measured height, the preset height, and the target compensation coefficient, it determines the first target height of the first jacking point. The specific formula is: First target height = First measured height - Preset height + Compensation coefficient.

[0079] It should be noted that through experiments, it is determined that the larger the inclination angle, the larger the corresponding compensation coefficient, and the mapping relationship between the inclination angle and the compensation coefficient is determined in advance through experiments.

[0080] Step S303: Determine the second target height of the second jacking point based on the second measured height, the preset height, and the second inclination angle.

[0081] In this embodiment, the substrate leveling device determines the second target height of the second jacking point based on the second measured height, the preset height, and the second inclination angle. Specifically, after the substrate leveling device determines the second inclination angle of the substrate relative to the ideal horizontal state in the direction of the second jacking point, it determines the target compensation coefficient according to the second inclination angle in the preset mapping relationship between the inclination angle and the compensation coefficient. Then, based on the second measured height, the preset height, and the target compensation coefficient, it determines the second target height of the second jacking point. The specific formula is: Second target height = Second measured height - Preset height + Compensation coefficient.

[0082] The substrate leveling device of this embodiment determines the corresponding target heights for two preset jacking points respectively, which helps the subsequent jacking mechanism to adjust at the two jacking points respectively, and helps to improve the efficiency of substrate tilt leveling.

[0083] Please refer to Figure 4 , Figure 4Schematic flow chart of the fourth embodiment of the substrate leveling method for the 3D printer provided in this application. The difference between the fourth embodiment and the first to third embodiments is that the lifting mechanism includes a first lifting mechanism and a second lifting mechanism. The step of controlling the lifting mechanism to adjust the lifting point to rise or fall by the target height includes:

[0084] Step S401: Based on the first target height, send a first control signal to the first lifting mechanism, so that the first lifting mechanism controls and adjusts the first lifting point to rise or fall by the first target height based on the first control signal.

[0085] Step S402: Based on the second target height, send a second control signal to the second lifting mechanism, so that the second lifting mechanism controls and adjusts the second lifting point to rise or fall by the second target height based on the second control signal.

[0086] In this embodiment, the substrate leveling device includes a first lifting mechanism and a second lifting mechanism. The first lifting mechanism is arranged below the first lifting point, and the second lifting mechanism is arranged below the second lifting point. After the substrate leveling device determines the first target height, it determines the first control signal according to the first target height and sends the first control signal to the first lifting mechanism, so that the first lifting mechanism controls the movement of the lead screw nut mechanism based on the first control signal and then drives the movement of the first lifting point to adjust the first lifting point to rise or fall by the first target height. After the substrate leveling device determines the second target height, it determines the second control signal according to the second target height and sends the second control signal to the second lifting mechanism, so that the second lifting mechanism controls the movement of the lead screw nut mechanism based on the second control signal and then drives the movement of the second lifting point to adjust the second lifting point to rise or fall by the second target height.

[0087] It should be noted that the calculated target height may be positive or negative. When the target height is positive, the lifting mechanism controls the lifting point to rise by the target height. When the target height is negative, the lifting mechanism controls the lifting point to fall by the target height.

[0088] In this embodiment, the substrate leveling device only needs two lifting mechanisms to adjust the heights of two lifting points to complete the leveling of the substrate, greatly reducing the complexity of substrate leveling and effectively improving the efficiency of substrate leveling.

[0089] Please refer to Figure 5 , Figure 5 Schematic flow chart of the fifth embodiment of the substrate leveling method for the 3D printer provided in this application. The difference between the fifth embodiment and the first to fourth embodiments is that after the step of controlling the lifting mechanism to adjust the lifting point to rise or fall by the target height, it includes:

[0090] Step S501, re-collect the reference height between the adjusted jacking point and the printing mechanism.

[0091] In this embodiment, after the substrate leveling device completes one substrate leveling, it re-drives the printing mechanism above the jacking point, and re-collects the reference height between the jacking point and the printing mechanism through the distance sensor on the printing mechanism.

[0092] Step S502, if the height difference between the reference height and the preset height meets the preset conditions, it is determined that the substrate leveling is completed;

[0093] In this embodiment, the substrate leveling device calculates the height difference between the re-collected reference height and the preset height, compares the height difference with the preset height difference. If the height difference is less than the preset height difference, it is determined that the substrate leveling is completed.

[0094] Step S503, if the height difference between the reference height and the preset height does not meet the preset conditions, re-level the substrate until the height difference between the reference height and the preset height meets the preset conditions.

[0095] In this embodiment, the substrate leveling device calculates the height difference between the re-collected reference height and the preset height. If the height difference is less than the preset height difference, it is determined that the substrate has not reached the ideal horizontal state, and the above substrate leveling process needs to be executed again until the height difference between the reference height and the preset height is less than the preset height difference, and the final substrate leveling is completed.

[0096] It should be noted that the first jacking point and the second jacking point are set on the substrate. If the height differences between the re-collected reference heights of the two jacking points and the preset height do not meet the preset conditions, re-adjust the heights of the two jacking points to achieve substrate leveling. If the height difference between the re-collected reference height of the first jacking point or the second jacking point and the preset height does not meet the preset conditions, only re-adjust the height of the first jacking point or the second jacking point to achieve substrate leveling.

[0097] The substrate leveling device of this embodiment, after completing one substrate leveling, re-collects the reference height between the jacking point and the printing mechanism through the distance sensor on the printing mechanism, calculates the height difference between the re-collected reference height and the preset height to verify whether the substrate is in a horizontal state. If it is not in a horizontal state, re-level it. The leveling result of the substrate can be quickly verified through the distance sensor, which can ensure the accuracy of substrate leveling.

[0098] In the specific implementation process, the substrate leveling device first levels the first jacking point and then levels the second jacking point.

[0099] Specifically, the substrate leveling device first collects the first measured height between the first lifting point and the printing mechanism through a distance sensor, and then determines whether the substrate is tilted based on the difference between the first measured height and the preset height. If it is determined that the substrate is tilted, based on the first measured height, the first position of the first lifting point, the fixed point position of the fixed point for fixing the substrate in the 3D printer, and the preset height between the fixed point and the printing mechanism, the first tilt angle of the substrate relative to the ideal horizontal state in the direction of the first lifting point is determined. Based on the first measured height, the preset height, and the first tilt angle, the first target height of the first lifting point is determined. Based on the first target height, a first control signal is sent to the first lifting mechanism, so that the first lifting mechanism controls and adjusts the first lifting point to rise or fall by the first target height based on the first control signal.

[0100] After leveling the first lifting point, the substrate leveling device then levels the second lifting point, and the specific process will not be elaborated here.

[0101] After completing the leveling of the first lifting point and the second lifting point, the substrate leveling device re-collects the reference height between the adjusted first lifting point (second lifting point) and the printing mechanism. If the height difference between the reference height and the preset height meets the preset conditions, it is determined that the substrate leveling is completed. If the height difference between the reference height and the preset height does not meet the preset conditions, the substrate is leveled again until the height difference between the reference height and the preset height meets the preset conditions.

[0102] Reference Figure 6 , Figure 6 FIG. is a schematic structural diagram of the substrate leveling device provided by the present application. Among them, the substrate leveling device is arranged directly below the substrate of the 3D printer, and the substrate leveling device includes: a distance sensor and a lifting mechanism;

[0103] The distance sensor is arranged on the printing mechanism in the 3D printer; the lifting mechanism is arranged below the lifting point of the substrate in the 3D printer;

[0104] The distance sensor is used to collect the measured height between the lifting point and the printing mechanism;

[0105] The lifting mechanism is used to adjust the lifting point to rise or fall by the target height, and the target height is determined based on the measured height, the fixed point position of the fixed point for fixing the substrate in the 3D printer, and the preset height between the fixed point and the printing mechanism when the substrate leveling device determines that the substrate is tilted based on the measured height.

[0106] Specifically, the substrate leveling device includes: a first distance sensor 2 and a second distance sensor 3. The first distance sensor 2 is used to measure the preset height between the fixed point 11 on the substrate 4 and the printing mechanism 1, and the second distance sensor 3 is used to measure the first measured height between the first lifting point 9 on the substrate 4 and the printing mechanism 1, and measure the second measured height between the second lifting point 10 on the substrate 4 and the printing mechanism 1.

[0107] Specifically, the substrate leveling device includes: a first lifting mechanism and a second lifting mechanism. The first lifting mechanism includes a first lifting motor 5 and a first lead screw nut mechanism 7, and the second lifting mechanism includes a second lifting motor 6 and a second lead screw nut mechanism 8. The first lifting mechanism is disposed below the first lifting point 9 of the substrate 4, and the second lifting mechanism is disposed below the second lifting point 10 of the substrate 4.

[0108] Specifically, the upper surface of the substrate 4 is rectangular. The fixed point 11 is disposed at any vertex of the upper surface of the substrate 4, the first lifting point 9 is disposed at any vertex adjacent to the fixed point 11 on the upper surface of the substrate 4, and the second lifting point 10 is disposed at the midpoint of the side opposite to the connection line between the fixed point 11 and the first lifting point 9 on the upper surface of the substrate 4. It can provide a more uniform support force distribution for the substrate 4 or the articles on the substrate 4, which helps to disperse the load and reduce the local pressure, thereby enhancing the stability of the entire substrate leveling device. Especially for the situation of bearing a large weight or external force, the first lifting point 9 disposed at the edge can better prevent the substrate 4 from deforming or being damaged due to excessive local stress.

[0109] Specifically, the distances between the first lifting point 9, the second lifting point 10 and the fixed point 11 are equal to each other. That is, the distance between the first lifting point 9 and the second lifting point 10, the distance between the first lifting point 9 and the fixed point 11, and the distance between the first lifting point 10 and the fixed point 11 are equal.

[0110] By providing two lifting points and two lifting mechanisms in the substrate leveling device, the substrate leveling of the 3D printer can be achieved, and the hardware cost can be reduced.

[0111] The present application also provides a computer device. Exemplarily, the computer device includes a processor and a memory. Among them, the memory stores a computer program, and the processor runs the computer program to enable the computer device to execute the above-mentioned substrate leveling method of the 3D printer or the functions of each module in the above-mentioned substrate leveling device of the 3D printer.

[0112] Among them, the processor can be an integrated circuit chip with signal processing capabilities. The processor can be a general-purpose processor, including at least one of a central processing unit (CPU), a graphics processing unit (GPU), a network processor (NP), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc., and can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present application.

[0113] The memory can be, but is not limited to, a random access memory (RAM), a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), etc. Among them, the memory is used to store a computer program, and after receiving an execution instruction, the processor can execute the computer program accordingly.

[0114] The present application also provides a computer storage medium for storing the computer program used in the above computer device. Among them, the computer storage medium can be a readable storage medium, a non-volatile storage medium, or a volatile storage medium. For example, the computer storage medium can include, but is not limited to: a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disc, etc., various media that can store program codes.

[0115] In several embodiments provided by the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely illustrative. For example, the flowcharts and structural diagrams in the accompanying drawings show the possible architectures, functions, and operations of devices, methods, and computer program products according to multiple embodiments of the present application. In this regard, each block in the flowchart or block diagram can represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in an alternative implementation, the functions marked in the blocks can occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks can actually be executed substantially in parallel, and they can sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the structural diagram and / or flowchart, as well as the combination of blocks in the structural diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0116] In addition, in each embodiment of the present application, the various functional modules or units can be integrated together to form an independent part, or each module can exist alone, or two or more modules can be integrated to form an independent part.

[0117] If the described function is implemented in the form of a software functional module and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to enable a computer device (which can be a smart phone, a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present application.

[0118] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered by the protection scope of the present application.

Claims

1. A substrate leveling method for a 3D printer, characterized in that, The method is applied to a substrate leveling device in a 3D printer, and the method includes: Collecting the measured height between the jacking points on the substrate in the 3D printer and the printing mechanism in the 3D printer; When it is determined that the substrate is tilted based on the measured height, determining the target height of the jacking point based on the measured height, the fixed point position of the fixed point for fixing the substrate in the 3D printer, and the preset height between the fixed point and the printing mechanism; Controlling the jacking mechanism to adjust the jacking point to rise or fall by the target height.

2. The substrate leveling method of the 3D printer according to claim 1, characterized in that, The substrate includes a first jacking point and a second jacking point. The step of collecting the measured height between the jacking points on the substrate in the 3D printer and the printing mechanism in the 3D printer includes: Collecting the first measured height between the first jacking point and the printing mechanism in the 3D printer, and collecting the second measured height between the second jacking point and the printing mechanism; The step of determining whether the substrate is tilted based on the measured height includes: Calculating a first height difference between the first measured height and the preset height, and calculating a second height difference between the second measured height and the preset height; If the first height difference and / or the second height difference do not meet the preset conditions, it is determined that the substrate is tilted.

3. The substrate leveling method of the 3D printer according to claim 2, characterized in that, The step of determining the target height of the jacking point based on the measured height, the fixed point position of the fixed point for fixing the substrate in the 3D printer, and the preset height between the fixed point and the printing mechanism includes: Determining a first tilt angle of the substrate relative to the ideal horizontal state in the direction of the first jacking point and a second tilt angle of the substrate relative to the ideal horizontal state in the direction of the second jacking point based on the first measured height, the second measured height, the first position of the first jacking point, the second position of the second jacking point, the fixed point position of the fixed point for fixing the substrate in the 3D printer, and the preset height between the fixed point and the printing mechanism; Determining the first target height of the first jacking point based on the first measured height, the preset height, and the first tilt angle; Determining the second target height of the second jacking point based on the second measured height, the preset height, and the second tilt angle.

4. The substrate leveling method of the 3D printer according to claim 3, characterized in that, The jacking mechanism includes a first jacking mechanism and a second jacking mechanism. The step of controlling the jacking mechanism to adjust the jacking point to rise or fall by the target height includes: Sending a first control signal to the first jacking mechanism based on the first target height, so that the first jacking mechanism controls and adjusts the first jacking point to rise or fall by the first target height based on the first control signal; Sending a second control signal to the second jacking mechanism based on the second target height, so that the second jacking mechanism controls and adjusts the second jacking point to rise or fall by the second target height based on the second control signal.

5. The substrate leveling method of the 3D printer according to any one of claims 1-4, characterized in that, After the step of controlling the jacking mechanism to adjust the jacking point to rise or fall by the target height, it further includes: Re-collect the reference height between the adjusted jacking point and the printing mechanism; If the height difference between the reference height and the preset height meets the preset condition, it is determined that the substrate leveling is completed; If the height difference between the reference height and the preset height does not meet the preset condition, re-level the substrate until the height difference between the reference height and the preset height meets the preset condition.

6. A substrate leveling device, characterized in that, The substrate leveling device is arranged directly below the substrate of the 3D printer, and the substrate leveling device includes: a distance sensor and a jacking mechanism; The distance sensor is arranged on the printing mechanism in the 3D printer; the jacking mechanism is arranged below the jacking point of the substrate in the 3D printer; The distance sensor is used to collect the measured height between the jacking point and the printing mechanism; The jacking mechanism is used to adjust the jacking point to rise or fall by a target height, and the target height is determined based on the measured height, the fixed point position of the fixed point for fixing the substrate in the 3D printer, and the preset height between the fixed point and the printing mechanism when the substrate leveling device determines that the substrate is tilted based on the measured height.

7. The substrate leveling device according to claim 6, wherein The substrate leveling device includes: a first jacking mechanism and a second jacking mechanism; The first jacking mechanism is arranged below the first jacking point of the substrate, and the second jacking mechanism is arranged below the second jacking point of the substrate.

8. The substrate leveling device according to claim 7, wherein, The upper surface of the substrate is rectangular, the fixed point is arranged at any vertex of the upper surface of the substrate, the first jacking point is arranged at any vertex adjacent to the fixed point on the upper surface of the substrate, and the second jacking point is arranged at the midpoint of the side opposite to the connection line between the fixed point and the first jacking point on the upper surface of the substrate.

9. The substrate leveling device according to claim 7, wherein The distances between the first jacking point, the second jacking point and the fixed point are equal to each other in pairs.

10. A 3D printer, characterized in that, The 3D printer is provided with the substrate leveling device according to any one of claims 6-9 above.

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