Chip surface defect detection device and method

Abstract

The invention discloses a chip surface defect detection device and method. The chip surface defect detection device comprises a workbench, a detection assembly and a chip fixing assembly, the detection assembly and the chip fixing assembly are installed on the upper end face of the workbench. The chip fixing assembly comprises a fixing frame, a fixing plate and a vibration motor; a plurality of springs are arranged on the fixing frame, the fixing plate is fixedly connected with the ends, away from the fixing frame, of the springs, a plurality of fixing grooves matched with chips to be detected are formed in the fixing plate, the vibration motor is connected with the fixing plate and used for driving the fixing plate to vibrate, and limiting frames are arranged on the four side edges of the fixing plate; the detection assembly can move to the position over the fixing frame to take a picture of the chip in the chip fixing assembly and carry out image detection on the picture obtained through shooting. In the process that the vibration motor in the chip fixing assembly drives the fixing plate to vibrate, a part of chips on the fixing plate can fall into the fixing groove, so that automatic positioning of the chips is achieved, and the detection efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and particularly relates to a chip surface defect detection device and method. Background Art

[0002] With the development of modern informatization, electronization, and intelligence, chips, as the core of modern electronic products and production equipment, have seen a year-on-year increase in usage. Moreover, due to the needs of production and life, the performance requirements for chips themselves have also been continuously improved. Therefore, chips are an essential component in modern industries. Chip quality inspection is a key link in the chip production line. In the existing chip surface defect detection operation, the chip is photographed by the shooting end of a chip appearance detector, converted into an image data signal according to an optical lens, and transmitted to a dedicated image processing system in the background to obtain relevant information such as clarity distribution, chroma, and hue, and then calculate and analyze whether there are surface defect problems on the chip.

[0003] In the existing chip surface defect detection devices, the chip is generally directly placed on a tray and then collected by a camera. However, since the chip is not fixed, it is easy for the chip to shift due to external forces during the detection process. Once the shift occurs, it will directly affect the detection result of the chip. Therefore, people think of using a clamping structure to clamp and fix the chip and then perform the detection to prevent the chip from shifting.

[0004] However, in the actual use process of the existing chip surface defect detection devices, it is necessary to manually fix the chip using the clamping structure and then take a photo with a camera, resulting in low efficiency. Summary of the Invention

[0005] The problem to be solved by the present invention is to provide a chip surface defect detection device and method. During the process that the vibration motor in the chip fixing component drives the fixing plate to vibrate, a part of the chips on the fixing plate will fall into the fixing grooves, thereby realizing the automatic positioning of the chips and improving the detection efficiency.

[0006] The technical solution provided by the present invention to solve the above problems is: a chip surface defect detection device, including a workbench, a detection component, and a chip fixing component; the detection component and the chip fixing component are installed on the upper end surface of the workbench; the chip fixing component includes a fixing frame, a fixing plate, and a vibration motor;

[0007] A plurality of springs are provided on the fixing frame, the fixing plate is fixedly connected to the end of the spring away from the fixing frame, a plurality of fixing grooves for cooperating with the chips to be detected are provided on the fixing plate, the vibration motor is connected to the fixing plate for driving the fixing plate to vibrate, and a limiting frame is provided on four sides of the fixing plate;

[0008] The detection component can be moved directly above the fixed frame to take pictures of the chips in the chip fixing component and perform image detection on the taken pictures.

[0009] Preferably, it further includes a flipping component which is in transmission connection with the chip fixing component and is used to drive the chip fixing component to flip.

[0010] Preferably, the flipping component includes a first flipping motor, a fixed outer frame and two rotating shafts. The first flipping motor is installed on the fixed outer frame. The two rotating shafts are respectively installed on both sides of the fixed frame and are rotationally connected to the fixed outer frame. The output end of the first flipping motor is in transmission connection with one of the two rotating shafts.

[0011] Preferably, a pressing mechanism for limiting and fixing the chips is arranged in the fixing groove.

[0012] Preferably, the pressing mechanism includes an airbag and an air source device. A plurality of installation cavities are arranged in the fixing plate near the fixing groove. The installation cavities are communicated with the fixing groove. The airbag is installed in the installation cavities. The airbag is provided with a wrinkled section. The air source device is communicated with the airbag. After the airbag is inflated, the wrinkled section unfolds and extends into the fixing groove to squeeze and fix the chips.

[0013] Preferably, the fixing groove is a through groove.

[0014] Preferably, it further includes an intercepting mechanism. The intercepting mechanism includes an intercepting net, a rotating rod and a second flipping motor. The rotating rod is rotatably installed at the lower end of the fixing plate. One side of the intercepting net is fixedly connected to the rotating rod. The intercepting net can intercept the chips in the fixing groove to prevent the chips from falling out of the fixing groove. The second flipping motor is in transmission connection with the rotating rod.

[0015] Preferably, a collecting component is arranged at the lower end of the fixed outer frame and is communicated with the fixed outer frame.

[0016] Preferably, the collecting component includes a rotating disk and three collecting frames. The rotating disk is rotatably installed on the workbench and is driven to rotate by a driving member. The three collecting frames are annularly and arrayedly installed on the upper end surface of the rotating disk. The lower end surface of the fixed outer frame is funnel-shaped. A blanking port is arranged at the bottom of the fixed outer frame. The rotating disk is installed at the lower end of the blanking port.

[0017] The present invention also discloses a method for detecting surface defects of chips. The method includes the following steps.

[0018] Put the chips to be detected on the fixing plate.

[0019] Turn on the vibration motor, the fixed plate vibrates, and a part of the chips fall into the fixed slots. The impurities mixed in the chips pass through the interception net and fall from the fixed outer frame into a collection box on the rotating disk;

[0020] Turn on the air source device to inflate the airbag, and the folded section of the airbag unfolds and extends into the fixed slot to fix the chips;

[0021] Start the driving member to drive the rotating disk to rotate 120°, so that another collection box on the rotating disk is aligned with the blanking port;

[0022] Turn on the first flipping motor to drive the fixed plate and the fixing frame to rotate 180°. The chips not fixed on the fixed plate fall from the fixed outer frame onto the collection box on the rotating disk;

[0023] Turn on the second flipping motor, and the rotating rod drives the interception net to rotate 90°;

[0024] The detection component moves directly above the fixing frame to take pictures of the chips on the fixed plate;

[0025] Turn on the first flipping motor to drive the fixed plate and the fixing frame to rotate 180°, and the detection component takes pictures of the other side of the chips;

[0026] Start the driving member to drive the rotating disk to rotate 120°, so that the last collection box on the rotating disk is aligned with the blanking port;

[0027] Turn on the air source device to deflate the airbag, and the folded section of the airbag retracts into the installation cavity. The chips fall from the fixed outer frame onto the collection box on the rotating disk under the action of their own gravity;

[0028] The detection component performs image detection on the taken pictures.

[0029] Compared with the prior art, the advantages of the present invention are as follows: During the process of the vibration motor in the chip fixing component of the present invention driving the fixed plate to vibrate, a part of the chips on the fixed plate will fall into the fixed slots, thereby realizing automatic positioning of the chips and improving the detection efficiency. Description of the Drawings

[0030] The drawings described herein are used to provide a further understanding of the present invention, and constitute a part of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention.

[0031] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 It is a top view of the fixed outer frame of the present invention;

[0033] Figure 3 It is a main cross-sectional view of the fixed outer frame of the present invention;

[0034] Figure 4 is Figure 3 An enlarged schematic view of location A in it;

[0035] Figure 5 Is the bottom view of the fixing plate and the interception component of the present invention;

[0036] Figure 6 Is the top view of the collection component of the present invention.

[0037] Reference numerals in the drawings: 1, workbench; 2, fixed outer frame; 3, moving frame; 4, first driving motor; 5, first guide rail; 6, second driving motor; 7, second guide rail; 8, mounting frame; 9, photographing device; 10, first flipping motor; 11, fixing frame; 12, limiting frame; 13, fixing plate; 14, second flipping motor; 15, vibration motor; 16, collection box; 17, interception net; 18, rotating rod; 19, rotating shaft; 20, fixing groove; 21, spring; 22, airbag; 23, rotating disk. Detailed implementation manners

[0038] The following will, in conjunction with the drawings and embodiments, elaborate in detail on the implementation manners of the present invention, so as to fully understand how the present invention applies technical means to solve technical problems and achieve the realization process of technical effects and implement accordingly.

[0039] In the description of the present invention, it should be noted that for orientation terms, such as terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the orientation and position relationships indicated are based on the orientation or position relationships shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present invention.

[0040] In addition, for terms "first" and "second", they are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise specifically and clearly defined.

[0041] In the present invention, unless otherwise clearly defined and limited, terms such as "assembled", "connected", and "linked" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can also be a mechanical connection; it can be directly connected, or connected through an intermediate medium, and can be internally connected and communicated between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0043] It should also be understood that the terms used in the description of the embodiments of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the description of the embodiments of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural forms.

[0044] Embodiment 1

[0045] This embodiment discloses a chip surface defect detection device, including a workbench 1, a detection component, and a chip fixing component; the detection component and the chip fixing component are installed on the upper end surface of the workbench 1; the chip fixing component includes a fixing frame 11, a fixing plate 13, and a vibration motor 15;

[0046] A plurality of springs 21 are arranged on the fixing frame 11, the fixing plate 13 is fixedly connected to the end of the spring 21 away from the fixing frame 11, a plurality of fixing grooves 20 adapted to the chips to be detected are arranged on the fixing plate 13, the vibration motor 15 is connected to the fixing plate 13 for driving the fixing plate 13 to vibrate, and limiting frames 12 are arranged on four sides of the fixing plate 13;

[0047] The detection component can move directly above the fixing frame 11 to take pictures of the chips in the chip fixing component and perform image detection on the taken pictures.

[0048] In the above solution, during the process of the vibration motor in the chip fixing component driving the fixing plate to vibrate, some of the chips on the fixing plate will fall into the fixing grooves, thereby realizing the automatic positioning of the chips and improving the detection efficiency.

[0049] As is known to those skilled in the art, after some chips are detected, it is also necessary to detect the back side of the chips. After the above-mentioned detection device detects the chips, if it is necessary to detect the back side of the chips, the chips can only be removed, then flipped and fixed, and then the detection can be carried out, which is very cumbersome and greatly prolongs the detection time and the workload of the staff.

[0050] Therefore, this embodiment further includes a flipping component. The flipping component is in transmission connection with the chip fixing component, and the flipping component is used to drive the chip fixing component to flip. In this embodiment, specifically, the flipping component includes a first flipping motor 10, a fixed outer frame 2, and two rotating shafts 19. The first flipping motor 10 is installed on the fixed outer frame 2. The two rotating shafts 19 are respectively installed on both sides of the fixed frame 11 and are rotationally connected to the fixed outer frame 2. The output end of the first flipping motor 10 is in transmission connection with one of the two rotating shafts 19.

[0051] Furthermore, a pressing mechanism for limiting and fixing the chips is arranged in the fixing groove 20. Specifically, the pressing mechanism includes an airbag 22 and an air source device. A plurality of installation cavities are arranged in the fixing plate 13 near the fixing groove 20. The installation cavities are communicated with the fixing groove 20. The airbag 22 is installed in the installation cavities. The airbag 22 is provided with a pleated section. The air source device is communicated with the airbag 22. After the airbag 22 is inflated, the pleated section expands and extends into the fixing groove 20 to squeeze and fix the chips. Among them, the fixing groove 20 is a through groove. Clamping the chips with the airbag can achieve soft clamping of the chips, prevent the chips from being clamped and damaged. At the same time, the airbags are communicated with each other, and when the air source device inflates the airbags, it can fix a plurality of chips at the same time.

[0052] This embodiment further includes an intercepting mechanism. The intercepting mechanism includes an intercepting net 17, a rotating rod 18, and a second flipping motor 14. The rotating rod 18 is rotatably installed at the lower end of the fixing plate 13. One side of the intercepting net 17 is fixedly connected to the rotating rod 18. The intercepting net 17 can intercept the chips in the fixing groove 20 to prevent the chips from falling out of the fixing groove 20. The second flipping motor 14 is in transmission connection with the rotating rod 18. Among them, on the one hand, the intercepting net in the intercepting mechanism can prevent the chips from falling out of the fixing groove when the chips are fixed. On the other hand, the impurities mixed in the chips can fall into the fixed outer frame from the intercepting net under the vibration of the vibration motor, so as to realize the filtering of the chip impurities.

[0053] Specifically, a collection assembly is provided at the lower end of the fixed outer frame 2, and the collection assembly is in communication with the fixed outer frame 2. Further, the collection assembly includes a rotating disk 23 and three collection boxes 16. The rotating disk 23 is rotatably mounted on the workbench 1 and is driven to rotate by a driving member. The three collection boxes 16 are annularly arrayed on the upper end surface of the rotating disk 23. Still further, the lower end surface of the fixed outer frame 2 is funnel-shaped, a blanking port is provided at the bottom of the fixed outer frame 2, and the rotating disk 23 is mounted at the lower end of the blanking port.

[0054] In the above solution, the specific functions of the three collection boxes are as follows: one is for collecting impurities mixed in the chip, one is for collecting chips that have not been detected, and the last one is for collecting chips that have been photographed and detected.

[0055] It should be noted that the detection assembly in this embodiment includes a first driving motor, a second driving motor, a first guide rail, a second guide rail, a moving frame, a mounting frame, and a photographing device. The first driving motor and the first guide rail are mounted on the workbench, the moving frame is mounted on the first guide rail, the first driving motor is used to drive the moving frame to move left and right on the guide rail, the second driving motor and the second guide rail are mounted on the moving frame, the mounting frame is movably mounted on the second guide rail, the second driving motor drives the mounting frame to move up and down on the second guide rail, and the photographing device is mounted on the mounting frame, so that the photographing device can move up, down, left, and right on the workbench.

[0056] Embodiment 2

[0057] This embodiment discloses a method for detecting a chip by using the chip surface defect detection device as described in the embodiment. The method includes the following steps:

[0058] Place the chip to be detected on the fixed plate;

[0059] Turn on the vibration motor, the fixed plate vibrates, a part of the chips fall into the fixed slots, and the impurities mixed in the chips pass through the intercepting net and fall from the fixed outer frame into one of the collection boxes on the rotating disk;

[0060] Turn on the air source device to inflate the airbag, and the folded section of the airbag unfolds and extends into the fixed slots to fix the chips;

[0061] Start the driving member to drive the rotating disk to rotate 120°, so that another collection box on the rotating disk is aligned with the blanking port;

[0062] Turn on the first flipping motor to drive the fixed plate and the fixing frame to rotate 180°, and the chips not fixed on the fixed plate fall from the fixed outer frame onto the collection box on the rotating disk;

[0063] Turn on the second flipping motor, and the rotating rod drives the intercepting net to rotate 90°;

[0064] The detection component moves directly above the fixed frame to take a picture of the chip on the fixed plate;

[0065] Turn on the first flipping motor to drive the fixed plate and the fixed frame to rotate 180°, and then the detection component takes a picture of the other side of the chip;

[0066] Start the driving component to drive the rotating disk to rotate 120°, so that the last collection box on the rotating disk is aligned with the blanking port;

[0067] Turn on the air source device to pump air out of the airbag, the folded section of the airbag retracts into the installation cavity, and the chip falls from the fixed outer frame onto the collection box on the rotating disk under the action of its own gravity;

[0068] The detection component performs image detection on the taken pictures.

[0069] The above only describes the best embodiments of the present invention, but it should not be construed as a limitation on the claims. The present invention is not limited to the above embodiments, and its specific structure is allowed to change. All changes made within the protection scope of the independent claims of the present invention are within the protection scope of the present invention.

Claims

1. A chip surface defect detection device, comprising a workbench (1), a detection component, and a chip fixing component; the detection component and the chip fixing component are installed on the upper end surface of the workbench (1); characterized in that: The chip fixing component includes a fixing frame (11), a fixing plate (13) and a vibration motor (15); A plurality of springs (21) are arranged on the fixing frame (11), the fixing plate (13) is fixedly connected to the end of the spring (21) away from the fixing frame (11), a plurality of fixing grooves (20) adapted to the chips to be detected are arranged on the fixing plate (13), the vibration motor (15) is connected to the fixing plate (13) for driving the fixing plate (13) to vibrate, and limiting frames (12) are arranged on four sides of the fixing plate (13); The detection component can move directly above the fixing frame (11) to take pictures of the chips in the chip fixing component and perform image detection on the taken pictures.

2. The chip surface defect detection device according to claim 1, wherein: It further includes a flipping component, the flipping component is in transmission connection with the chip fixing component, and the flipping component is used to drive the chip fixing component to flip.

3. The chip surface defect detection device according to claim 2, characterized in that: The flipping component includes a first flipping motor (10), a fixed outer frame (2) and two rotating shafts (19), the first flipping motor (10) is installed on the fixed outer frame (2), the two rotating shafts (19) are respectively installed on both sides of the fixing frame (11) and are rotatably connected to the fixed outer frame (2), and the output end of the first flipping motor (10) is in transmission connection with one of the two rotating shafts (19).

4. The chip surface defect detection device according to claim 3, characterized in that: A pressing mechanism for limiting and fixing the chips is arranged in the fixing groove (20).

5. The chip surface defect detection device according to claim 4, wherein: The pressing mechanism includes an airbag (22) and an air source device, a plurality of installation cavities are arranged in the fixing plate (13) near the fixing groove (20), the installation cavities are communicated with the fixing groove (20), the airbag (22) is installed in the installation cavities, the airbag (22) is provided with a corrugated section, the air source device is communicated with the airbag (22), and after the airbag (22) is inflated, the corrugated section expands and extends into the fixing groove (20) to squeeze and fix the chips.

6. The chip surface defect detection device according to claim 5, wherein: The fixing groove (20) is a through groove.

7. An apparatus for detecting surface defects of a chip according to claim 6, characterized in that: It further includes an intercepting mechanism, the intercepting mechanism includes an intercepting net (17), a rotating rod (18) and a second flipping motor (14), the rotating rod (18) is rotatably installed at the lower end of the fixing plate (13), one side of the intercepting net (17) is fixedly connected to the rotating rod (18), the intercepting net (17) can intercept the chips in the fixing groove (20) to prevent the chips from falling out of the fixing groove (20), and the second flipping motor (14) is in transmission connection with the rotating rod (18).

8. The surface defect detection device for a chip according to claim 7, wherein: A collecting component is arranged at the lower end of the fixed outer frame (2), and the collecting component is communicated with the fixed outer frame (2).

9. The chip surface defect detection device according to claim 8, characterized in that: The collecting component includes a rotating disk (23) and three collecting frames (16), the rotating disk (23) is rotatably installed on the workbench (1) and is driven to rotate by a driving member, and the three collecting frames (16) are annularly arrayed on the upper end surface of the rotating disk (23); the lower end surface of the fixed outer frame (2) is funnel-shaped, a blanking port is arranged at the bottom of the fixed outer frame (2), and the rotating disk (23) is installed at the lower end of the blanking port.

10. A method for detecting surface defects of a chip, characterized in that: The method includes the following steps, Put the chips to be detected on the fixing plate; Turn on the vibration motor, the fixed plate vibrates, and a part of the chips fall into the fixed slots. The impurities mixed in the chips pass through the intercepting net and fall into a collection frame on the rotating disk from the fixed outer frame; Turn on the air source device to inflate the airbag, and the folded section of the airbag unfolds and extends into the fixed slot to fix the chips; Start the driving member to drive the rotating disk to rotate 120°, so that another collection frame on the rotating disk is aligned with the blanking port; Turn on the first flipping motor to drive the fixed plate and the fixing frame to rotate 180°. The chips not fixed on the fixed plate fall from the fixed outer frame onto the collection frame on the rotating disk; Turn on the second flipping motor, and the rotating rod drives the intercepting net to rotate 90°; The detection component moves directly above the fixing frame to take pictures of the chips on the fixed plate; Turn on the first flipping motor to drive the fixed plate and the fixing frame to rotate 180°, and the detection component takes pictures of the other side of the chips; Start the driving member to drive the rotating disk to rotate 120°, so that the last collection frame on the rotating disk is aligned with the blanking port; Turn on the air source device to deflate the airbag, and the folded section of the airbag retracts into the installation cavity. The chips fall from the fixed outer frame onto the collection frame on the rotating disk under the action of their own gravity; The detection component performs image detection on the taken pictures.

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