Display device

Abstract

A display device is disclosed. The display device includes: a display panel including a substrate including ultra-thin glass and a plurality of pixels disposed on the substrate; and a cover plate including a first sheet disposed below the display panel and a second sheet in direct contact with a lower surface of the first sheet and having a modulus of about 30 Gpa or more.

Description

Technical Field

[0001] Embodiments generally provide a display device. More specifically, embodiments relate to a display device that provides visual information. Background Art

[0002] With the development of information technology, the importance of display devices is emerging. A display device is a medium for communication between a user and information. Therefore, the use of display devices such as liquid crystal display devices, organic light emitting display devices, and plasma display devices is increasing. Summary of the Invention

[0003] Embodiments provide a display device including an ultra-thin glass substrate.

[0004] A display device according to an embodiment of the present disclosure includes: a display panel including a substrate including ultra-thin glass and a plurality of pixels disposed on the substrate; and a cover plate including a first sheet disposed below the display panel and a second sheet in direct contact with a lower surface of the first sheet and having a modulus of about 30 GPa or more.

[0005] In an embodiment, the second sheet may include stainless steel (SUS).

[0006] In an embodiment, the second sheet may include aluminum (Al).

[0007] In an embodiment, the second sheet may have a rectangular planar shape.

[0008] In an embodiment, an end portion of the second sheet may include a protrusion protruding toward the display panel.

[0009] In an embodiment, the second sheet may have a counterclockwise-rotated L-shape in a cross-section.

[0010] In an embodiment, a bending stiffness of the second sheet in a width direction may be about 1.04 kgf·m or more.

[0011] In an embodiment, the cover plate may further include a frame base disposed below the first sheet and facing a side surface of the second sheet.

[0012] In an embodiment, a sum of a bending stiffness of the second sheet in a width direction and a bending stiffness of the frame base in a width direction may be about 1.04 kgf·m or more.

[0013] In an embodiment, the frame base may have a shape of a rectangular ring surrounding the second sheet in a plan view.

[0014] In an embodiment, an end portion of the frame base may include a protrusion protruding toward the display panel.

[0015] In an embodiment, the frame base may include at least one selected from the group consisting of aluminum and stainless steel.

[0016] In an embodiment, the frame base may include the same material as that of the second sheet.

[0017] In an embodiment, the first sheet may include an embossed sheet.

[0018] A display device according to an embodiment of the present disclosure includes: a display panel including a substrate including ultra-thin glass and a plurality of pixels disposed in a display area on the substrate; a cover plate including a first sheet disposed below the display panel and including an embossed sheet, and a second sheet in direct contact with the lower surface of the first sheet and having a modulus of about 30 GPa or more and a bending stiffness of about 1.04 kgf·m or more in the width direction; a first circuit board, a first end of the first circuit board being coupled to a first pad portion disposed in a sub-region positioned around the display area of the display panel, and a part of the first circuit board being bent toward the lower portion of the display panel; and a second circuit board disposed below the cover plate and including a second pad portion coupled to a second end of the first circuit board opposite to the first end.

[0019] In an embodiment, the second sheet may include stainless steel.

[0020] In an embodiment, the second sheet may include aluminum.

[0021] In an embodiment, the second sheet may have a rectangular planar shape.

[0022] In an embodiment, an end portion of the second sheet may include a protrusion protruding toward the display panel.

[0023] In an embodiment, the second sheet may have a counterclockwise-rotated L shape in cross section.

[0024] A display device according to an embodiment of the present disclosure may include: a display panel including a substrate including ultra-thin glass and a cover plate disposed below the display panel. The cover plate may include a first sheet and a second sheet disposed below the first sheet, and the cover plate has a relatively large modulus and a predetermined bending stiffness. Optionally, the cover plate of the display device may further include a frame base disposed below the display panel, and in this case, the sum of the bending stiffness of the second sheet and the bending stiffness of the frame base may have a predetermined value.

[0025] Accordingly, the impact resistance of the display device can be improved. In addition, the bending phenomenon of the display device can be minimized or reduced. In this case, the flatness of the display device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Exemplary, non - limiting embodiments will be more clearly understood from the following detailed description in conjunction with the accompanying drawings.

[0027] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure.

[0028] Figure 2 is taken along Figure 1 a sectional view taken along line I - I'.

[0029] Figure 3 is a sectional view showing Figure 2 the bent shape of the first circuit board of

[0030] Figure 4 is a sectional view showing Figure 1 the display panel of Figure 2 and the rear view of the cover plate of

[0031] Figure 5 is Figure 3 an enlarged sectional view of region A of

[0032] Figure 6 is a sectional view for explaining Figure 3 the impact resistance evaluation of the display device of

[0033] Figure 7 is a sectional view showing Figure 3 another example of the display device of

[0034] Figure 8 is a sectional view showing Figure 3 yet another example of the display device of

[0035] Figure 9 is a sectional view showing Figure 8 the rear view of the display panel, the second sheet, and the frame base of

[0036] Figure 10 is a sectional view showing Figure 3 yet another example of the display device of Detailed Description of the Embodiment

[0037] Hereinafter, a display device according to an embodiment of the present disclosure will be explained in detail with reference to the accompanying drawings. The same components in the drawings are denoted by the same reference numerals, and redundant descriptions of the same components will be omitted.

[0038] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure.

[0039] Refer to Figure 1, a display device DD according to an embodiment of the present disclosure may include a display panel PN, a driving integrated circuit DIC, a first circuit board CB1, and a second circuit board CB2.

[0040] The display panel PN may include a display area DA and a peripheral area PA. The display area DA may be defined as an area capable of displaying an image by generating light or adjusting the transmittance of light provided from an external light source. The peripheral area PA may be defined as an area that does not display an image. The peripheral area PA may surround at least a part of the display area DA. For example, the peripheral area PA may completely surround the display area DA.

[0041] A plurality of pixels PX may be arranged in the display area DA. Each of the plurality of pixels PX may emit light. When each of the plurality of pixels PX emits light, the display area DA may display an image. For example, the plurality of pixels PX may be arranged in a matrix form along a first direction DR1 and a second direction DR2 intersecting the first direction DR1. However, the embodiments of the present disclosure are not limited thereto.

[0042] Lines connected to the plurality of pixels PX may be further provided in the display area DA. For example, the lines may include data signal lines, gate signal lines, power lines, and the like.

[0043] A driver for driving the plurality of pixels PX may be provided in the peripheral area PA. For example, the driver may include a data driver, a gate driver, a light-emitting driver, a power voltage generator, and a timing controller. The plurality of pixels PX may emit light based on signals received from the driver.

[0044] The peripheral area PA may include a sub-area SA. The sub-area SA may be positioned at a distance from one side of the display area DA in a direction opposite to the second direction DR2. The sub-area SA may have a shape extending in the first direction DR1.

[0045] The driving integrated circuit DIC may be mounted in the sub-area SA on the display panel PN. In this case, in a plan view, the driving integrated circuit DIC may be positioned between the first circuit board CB1 and the display area DA. The driving integrated circuit DIC may convert a digital data signal among driving signals into an analog data signal, and provide the converted data signal to the plurality of pixels PX. For example, the driving integrated circuit DIC may be a data driver. Optionally, the driving integrated circuit DIC may be provided on the first circuit board CB1.

[0046] The driving integrated circuit DIC can be provided in multiple numbers in the sub-region SA. In this case, the driving integrated circuits DIC can be arranged at intervals along the first direction DR1. For example, the number of driving integrated circuits DIC can be two. However, the number of driving integrated circuits DIC is not limited to this, and the number of driving integrated circuits DIC can be one or three or more.

[0047] The display device DD may further include a first pad portion PD1 provided in the sub-region SA on the display panel PN. The first pad portion PD1 may include pad electrodes for receiving signals from the outside of the display panel PN. A part of the pad electrodes of the first pad portion PD1 may be electrically connected to the driving integrated circuit DIC through a wire, and other parts of the pad electrodes of the first pad portion PD1 may be electrically connected to the multiple pixels PX through a wire.

[0048] The first circuit board CB1 can be provided in the sub-region SA on the display panel PN. Specifically, the first circuit board CB1 can be arranged to overlap with a part of the sub-region SA. The first end of the first circuit board CB1 can be bonded to the first pad portion PD1 provided in the sub-region SA. For example, the first circuit board CB1 may include a flexible printed circuit board (FPCB). A part of the first circuit board CB1 can be bent toward the lower part of the display panel PN (see Figure 3 ).

[0049] The first circuit boards CB1 can be provided in multiple numbers. In this case, the first circuit boards CB1 can be spaced apart along the first direction DR1. For example, the number of the first circuit boards CB1 can be two. However, the number of the first circuit boards CB1 is not limited to this, and the number of the first circuit boards CB1 can be one or three or more.

[0050] The second circuit board CB2 can be bonded to the second end of the first circuit board CB1 opposite to the first end. Specifically, the second pad portion PD2 included in the second circuit board CB2 can be bonded to the second end of the first circuit board CB1. The second circuit board CB2 can have a shape extending in the first direction DR1. For example, the second circuit board CB2 may include a printed circuit board (PCB).

[0051] In this specification, the first direction DR1 and the second direction DR2 can define a plane. For example, the second direction DR2 can be perpendicular to the first direction DR1. In addition, the third direction DR3 can be perpendicular to this plane.

[0052] Figure 2 is a cross-sectional view taken along the line I-I' Figure 1 . Figure 3 is a cross-sectional view showing the bent shape of the first circuit board of Figure 2 .Figure 4 is a rear view of a display panel shown as Figure 1 and a cover plate shown as Figure 2 .

[0053] For example, Figure 2 the display device DD shown in Figure 3 is in a state before the first circuit board CB1 is bent, and

[0054] the display device DD shown in Figure 1 is in a state where the first circuit board CB1 is bent. The display device DD can be provided in a state where the first circuit board CB1 is bent. Figure 2 Figure 3 and Figure 4 , the display device DD according to an embodiment of the present disclosure may further include a polarization member POL, a cover window CW, and a cover plate CVP.

[0055] The display panel PN may include a substrate SUB, a display unit DP provided on the substrate SUB, and a packaging layer ENC provided on the display unit DP.

[0056] The substrate SUB may include a transparent or opaque material. In an embodiment, the substrate SUB may include ultra-thin glass. Since the substrate SUB includes ultra-thin glass, the thickness TH1 of the display panel PN can be relatively thin. For example, when the substrate SUB includes ultra-thin glass, the thickness TH1 of the display panel PN can be about 0.222 mm. However, the embodiments of the present disclosure are not limited thereto.

[0057] The display unit DP may include a plurality of pixels (e.g., Figure 1 the plurality of pixels PX in

[0058] ). The display unit DP can display an image through the plurality of pixels. For example, each of the plurality of pixels may include electrical components such as transistors, capacitors, and light-emitting elements. In addition, the display unit DP may further include an insulating layer that insulates or protects the electrical components included in each of the plurality of pixels. The components of the display unit DP will be described in detail later.

[0059] ​The polarization member POL may be disposed on the display panel PN. The polarization member POL may reduce the light reflected by the display unit DP. For example, the polarization member POL may include a polarization layer and a phase retardation layer. Optionally, the polarization member POL may be omitted, and a light blocking layer and a color filter may be disposed on the display panel PN. Optionally, the polarization member POL may be omitted, and a reflective layer causing destructive interference may be disposed on the display panel PN.

[0060] The cover window CW may be disposed on the polarization member POL. The cover window CW may transmit the image displayed by the display unit DP. In addition, the cover window CW may protect the display panel PN from the external environment. For example, the cover window CW may include a transparent material such as glass or plastic. The cover window CW may be attached to the polarization member POL through an adhesive member.

[0061] The cover plate CVP may be disposed below the display panel PN. The cover plate CVP may include a first sheet ST1 and a second sheet ST2.

[0062] The first sheet ST1 may cover the rear surface of the display panel PN. The first sheet ST1 may be attached to the display panel PN through an adhesive member. Specifically, the first sheet ST1 may be attached to the substrate SUB through an adhesive member. The first sheet ST1 may include a front surface having minute curves. In an embodiment, the first sheet ST1 may include an embossed sheet. In this case, the front surface of the first sheet ST1 facing the display panel PN may be a curved surface. The curves formed in the first sheet ST1 may prevent the formation of non-uniform bubbles between the display panel PN and the first sheet ST1, and may improve the bonding force between the display panel PN and the first sheet ST1.

[0063] For example, the first sheet ST1 may have a rectangular planar shape (see Figure 4 ). However, the embodiments of the present disclosure are not limited thereto, and the first sheet ST1 may have various planar shapes.

[0064] For example, the size of the first sheet ST1 may be smaller than the size of the display panel PN. That is, the edges of the first sheet ST1 may be closer to the center of the first sheet ST1 than the edges of the display panel PN. However, the embodiments of the present disclosure are not limited thereto.

[0065] The second sheet ST2 may be disposed below the first sheet ST1. Specifically, the second sheet ST2 may be in direct contact with the lower surface of the first sheet ST1. For example, the second sheet ST2 may be in direct contact with the entire lower surface of the first sheet ST1. The second sheet ST2 may improve the impact resistance of the display device DD. Due to the second sheet ST2, the display device DD may ensure sufficient stiffness. That is, the second sheet ST2 may improve the flatness of the display device DD. In addition, the second sheet ST2 may shield electrostatic discharge (ESD) and electromagnetic interference (EMI), etc.

[0066] For example, the second sheet ST2 may include a metallic material. In an embodiment, the second sheet ST2 may include aluminum (Al). In this case, the thickness TH2 of the second sheet ST2 may be about 0.2 mm. In another embodiment, the second sheet ST2 may include stainless steel (SUS). In this case, the thickness TH2 of the second sheet ST2 may be about 0.1 mm.

[0067] However, embodiments of the present disclosure are not limited thereto. For example, the second sheet ST2 may include glass fiber reinforced plastic (GRFP). Alternatively, the second sheet ST2 may include titanium (Ti).

[0068] The second sheet ST2 may have a relatively large modulus. In an embodiment, the second sheet ST2 may have a modulus of about 30 GPa or more. Preferably, the second sheet ST2 may have a modulus of about 30 GPa or more and about 200 GPa or less. If the second sheet ST2 has a modulus of less than about 30 GPa, cracks may occur in the display panel PN when evaluating a dropped ball. If the second sheet ST2 has a modulus of more than about 200 GPa, it may be difficult to lighten the display device DD.

[0069] In an embodiment, the second sheet ST2 may have a bending stiffness of about 1.04 kgf·m or more in the width direction (e.g., in the first direction DR1 or in the second direction DR2). If the second sheet ST2 has a bending stiffness of less than about 1.04 kgf·m in the width direction, a bending phenomenon may occur in the display device DD.

[0070] For example, the second sheet ST2 may have a rectangular planar shape (see Figure 4 ). However, embodiments of the present disclosure are not limited thereto, and the second sheet ST2 may have various planar shapes.

[0071] For example, the size of the second sheet ST2 may be smaller than the size of the display panel PN. That is, the edge of the second sheet ST2 may be closer to the center of the second sheet ST2 than the edge of the display panel PN. However, embodiments of the present disclosure are not limited thereto.

[0072] As described above, a part of the first circuit board CB1 may be bent toward the lower part of the display panel PN. In this case, the second circuit board CB2 may be in contact with the lower surface of the second sheet ST2 of the cover plate CVP.

[0073] Figure 5 is Figure 3 an enlarged cross-sectional view of region A. For example, Figure 5 is Figure 3 an enlarged cross-sectional view of a part of the display panel PN.

[0074] Reference Figure 5 , the display panel PN may include a substrate SUB, a display portion DP disposed on the substrate SUB, and a packaging layer ENC disposed on the display portion DP. The display portion DP may include a buffer layer BFR, a transistor TR, a gate insulating layer GI, an interlayer insulating layer ILD, a via insulating layer VIA, a pixel defining layer PDL, and a light emitting element LED.

[0075] Here, the transistor TR may include an active pattern ACT, a gate electrode GAT, a source electrode SE, and a drain electrode DE, and the light emitting element LED may include an anode electrode ADE, a light emitting layer EL, and a cathode electrode CTE.

[0076] The buffer layer BFR may be disposed on the substrate SUB. The buffer layer BFR may prevent metal atoms or impurities from diffusing from the substrate SUB to the transistor TR. In addition, when the surface of the substrate SUB is uneven, the buffer layer BFR may improve the flatness of the surface of the substrate SUB. For example, the buffer layer BFR may include an inorganic material such as silicon oxide (SiO x ), silicon nitride (SiN x ), and silicon oxynitride (SiO x N y ), etc. These may be used alone or in combination with each other.

[0077] The active pattern ACT may be disposed on the buffer layer BFR. The active pattern ACT may include a metal oxide semiconductor, an inorganic semiconductor (e.g., amorphous silicon and polysilicon, etc.), or an organic semiconductor.

[0078] The active pattern ACT may include a source region, a drain region, and a channel region positioned between the source region and the drain region. For example, the source region and the drain region may be doped with impurities (e.g., N-type impurities or P-type impurities). The channel region may not be doped with impurities, or may be doped with impurities having a lower concentration than the concentration of the source region and the drain region.

[0079] The metal oxide semiconductor may include binary compounds (AB x ) containing indium (In), zinc (Zn), gallium (Ga), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr), and magnesium (Mg), etc., ternary compounds (AB x C y ), and quaternary compounds (AB x C y D z ), etc. For example, the metal oxide semiconductor may include zinc oxide (ZnO x ), gallium oxide (GaO x ), tin oxide (SnO x ), indium oxide (InOx ) indium gallium oxide (IGO), indium zinc oxide (IZO), indium tin oxide (ITO), indium zinc tin oxide (IZTO), indium gallium zinc oxide (IGZO), etc. These can be used alone or in combination with each other.

[0080] The gate insulating layer GI can be disposed on the buffer layer BFR. The gate insulating layer GI can sufficiently cover the active pattern ACT and can have a substantially flat upper surface without generating steps around the active pattern ACT. Optionally, the gate insulating layer GI can cover the active pattern ACT and can be disposed with a uniform thickness along the contour of the active pattern ACT. For example, the gate insulating layer GI can include an inorganic material such as silicon oxide (SiO x ), silicon nitride (SiN x ), silicon carbide (SiC x ), silicon oxynitride (SiO x N y ), and silicon oxycarbide (SiO x C y ), etc. These can be used alone or in combination with each other.

[0081] The gate electrode GAT can be disposed on the gate insulating layer GI. The gate electrode GAT can be stacked with the channel region of the active pattern ACT. The gate electrode GAT can include metals, alloys, metal nitrides, conductive metal oxides, and transparent conductive materials, etc. Examples of metals can include silver (Ag), molybdenum (Mo), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), titanium (Ti), tantalum (Ta), platinum (Pt), and scandium (Sc), etc. Examples of conductive metal oxides can include indium tin oxide and indium zinc oxide. In addition, examples of metal nitrides can include aluminum nitride (AlN x ), tungsten nitride (WN x ), and chromium nitride (CrN x ), etc. These can be used alone or in combination with each other.

[0082] The interlayer insulating layer ILD can be disposed on the gate insulating layer GI. The interlayer insulating layer ILD can sufficiently cover the gate electrode GAT and can have a substantially flat upper surface without generating steps around the gate electrode GAT. Optionally, the interlayer insulating layer ILD can cover the gate electrode GAT and can be disposed with a uniform thickness along the contour of the gate electrode GAT. For example, the interlayer insulating layer ILD can include an inorganic material such as silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, and silicon oxycarbide, etc. These can be used alone or in combination with each other.

[0083] The source electrode SE and the drain electrode DE may be disposed on the interlayer insulating layer ILD. The source electrode SE may be connected to the source region of the active pattern ACT through a contact hole penetrating through the gate insulating layer GI and a first portion of the interlayer insulating layer ILD, and the drain electrode DE may be connected to the drain region of the active pattern ACT through a contact hole penetrating through the gate insulating layer GI and a second portion of the interlayer insulating layer ILD. For example, each of the source electrode SE and the drain electrode DE may include a metal, an alloy, a metal nitride, a conductive metal oxide, and a transparent conductive material, etc. These may be used alone or in combination with each other.

[0084] Accordingly, the transistor TR including the active pattern ACT, the gate electrode GAT, the source electrode SE, and the drain electrode DE may be disposed in the display area DA on the substrate SUB.

[0085] The via insulating layer VIA may be disposed on the interlayer insulating layer ILD. The via insulating layer VIA may sufficiently cover the source electrode SE and the drain electrode DE. That is, the via insulating layer VIA may have a substantially flat upper surface.

[0086] The via insulating layer VIA may include an inorganic material or an organic material. In an embodiment, the via insulating layer VIA may include an organic material. For example, the via insulating layer VIA may include an organic material such as a phenolic resin, a polyacrylate resin, a polyimide resin, a polyamide resin, a silicone resin, and an epoxy resin, etc. These may be used alone or in combination with each other.

[0087] The anode electrode ADE may be disposed on the via insulating layer VIA. The anode electrode ADE may be connected to the drain electrode DE (or the source electrode SE) through a contact hole penetrating through the via insulating layer VIA. For example, the anode electrode ADE may include a metal, an alloy, a metal nitride, a conductive metal oxide, and a transparent conductive material, etc. These may be used alone or in combination with each other. In an embodiment, the anode electrode ADE may have a layered structure including ITO / Ag / ITO. However, the embodiments of the present disclosure are not necessarily limited thereto. The anode electrode ADE may be a reflective electrode.

[0088] The pixel defining layer PDL may be disposed on the via insulating layer VIA. The pixel defining layer PDL may cover the edge of the anode electrode ADE. In addition, an opening exposing at least a part of the upper surface of the anode electrode ADE may be defined in the pixel defining layer PDL. For example, the pixel defining layer PDL may include an inorganic material or an organic material. In an embodiment, the pixel defining layer PDL may include an organic material such as an epoxy resin and a silicone resin, etc. These may be used alone or in combination with each other. In another embodiment, the pixel defining layer PDL may include an inorganic material and / or an organic material containing a light blocking material (such as a black pigment and a black dye, etc.).

[0089] The light-emitting layer EL can be disposed on the anode electrode ADE. Specifically, the light-emitting layer EL can be disposed in the opening of the pixel defining layer PDL. The light-emitting layer EL can include an organic material that emits light of a predetermined color. For example, the light-emitting layer EL can include an organic material that emits red light, green light, or blue light.

[0090] The cathode electrode CTE can be disposed on the pixel defining layer PDL and the light-emitting layer EL. For example, the cathode electrode CTE can include metals, alloys, metal nitrides, conductive metal oxides, and transparent conductive materials, etc. These can be used alone or in combination with each other. The cathode electrode CTE can be a transmissive electrode or a semi-transmissive electrode.

[0091] Therefore, the light-emitting element LED including the anode electrode ADE, the light-emitting layer EL, and the cathode electrode CTE can be disposed in the display area DA on the substrate SUB. The light-emitting element LED can be electrically connected to the transistor TR. Therefore, the light-emitting element LED can receive a driving signal from the transistor TR and generate light based on the driving signal.

[0092] Figure 6 is a cross-sectional view for explaining Figure 3 the impact resistance evaluation of the display device.

[0093] Referring to Figure 6 , the impact resistance of the display devices according to the comparative examples and the embodiments was evaluated. The display devices according to the comparative examples and the embodiments include a display panel PN, a polarization member POL disposed on the display panel PN, and a cover glass CVP disposed below the display panel PN. The display panel PN uses a substrate SUB including ultra-thin glass. The cover glass CVP includes a first sheet ST1 including an embossed sheet and a second sheet disposed below the first sheet ST1. At this time, the thickness TH1 of the display panel PN is about 0.222 mm, the thickness T1 of the polarization member POL is about 0.147 mm, and the thickness T2 of the first sheet ST1 is about 0.03 mm. Except for the second sheet, the display devices according to the comparative examples and the embodiments are substantially the same.

[0094] In the comparative example, the second sheet was formed into a molded structure using an epoxy resin. In this case, referring to Table 1 below, the modulus of the second sheet is about 12 GPa, and the thickness of the second sheet is about 0.2 mm.

[0095] In Embodiment 1, the second sheet ST2 was formed using glass fiber reinforced plastic (GFRP). In this case, referring to Table 1 below, the modulus of the second sheet ST2 is about 30 GPa, and the thickness TH2 of the second sheet ST2 is about 0.2 mm.

[0096] In Example 2, the second sheet ST2 is formed using aluminum (Al). In this case, referring to Table 1 below, the modulus of the second sheet ST2 is approximately 70 GPa, and the thickness TH2 of the second sheet ST2 is approximately 0.2 mm.

[0097] In Example 3, the second sheet ST2 is formed using titanium (Ti). In this case, referring to Table 1 below, the modulus of the second sheet ST2 is approximately 120 GPa, and the thickness TH2 of the second sheet ST2 is approximately 0.2 mm.

[0098] In Example 4, the second sheet ST2 is formed using stainless steel (SUS). In this case, referring to Table 1 below, the modulus of the second sheet ST2 is approximately 200 GPa, and the thickness TH2 of the second sheet ST2 is approximately 0.1 mm.

[0099] To evaluate the impact resistance of the display device, a ball drop evaluation was performed on the display device. The mass of the ball BA used in the ball drop evaluation is approximately 5.6 grams, and the diameter R of the ball BA is approximately 11 mm. The ball BA is dropped from a height H of approximately 19 cm or more from the top of the display device.

[0100]

[0101]

[0102] As a result, referring to Table 1, it can be confirmed that cracks have occurred in the display devices that satisfy the comparative examples. On the other hand, it can be confirmed that no cracks have occurred in the display devices DD that satisfy Example 1, Example 2, Example 3, and Example 4.

[0103] Thus, since the second sheet ST2 of the display device DD according to the embodiments of the present disclosure includes any one of glass fiber reinforced plastic, aluminum, titanium, and stainless steel, the second sheet ST2 can have a modulus of approximately 30 GPa or more, and in this case, it can be confirmed that the display device DD has sufficient impact resistance.

[0104] Figure 7 is a cross-sectional view of another example of the Figure 3 display device shown.

[0105] Referring to Figure 7 , the display device DD' may include a display panel PN, a polarizing member POL, a cover window CW, a cover plate CVP', a driving integrated circuit DIC, a first circuit board CB1, a second circuit board CB2, a first pad portion PD1, and a second pad portion PD2. However, except for the cover plate CVP', the display device DD' described with reference to Figure 7 may be the same as the display device DD' described with reference to Figure 3The described display device DD is substantially the same or similar. Hereinafter, descriptions that are repetitive of the description of the display device DD described with reference to Figure 3 will be omitted or simplified.

[0106] The cover plate CVP' may include a first sheet ST1 and a second sheet ST2'.

[0107] The first sheet ST1 may cover the rear surface of the display panel PN. The first sheet ST1 may be attached to the display panel PN through an adhesive member. Specifically, the first sheet ST1 may be attached to the substrate SUB through an adhesive member. The first sheet ST1 may include a front surface having minute curves. In an embodiment, the first sheet ST1 may include an embossed sheet. In this case, the front surface of the first sheet ST1 facing the display panel PN may be a curved surface.

[0108] For example, the first sheet ST1 may have a rectangular planar shape (see Figure 4 ). However, embodiments of the present disclosure are not limited thereto, and the first sheet ST1 may have various planar shapes.

[0109] For example, the size of the first sheet ST1 may be smaller than the size of the display panel PN.

[0110] The second sheet ST2' may be disposed below the first sheet ST1. Specifically, the second sheet ST2' may be in direct contact with the lower surface of the first sheet ST1. For example, the second sheet ST2' may be in direct contact with the entire lower surface of the first sheet ST1.

[0111] For example, the second sheet ST2' may include a metallic material. In an embodiment, the second sheet ST2' may include aluminum (Al) or stainless steel (SUS). However, embodiments of the present disclosure are not limited thereto. For example, the second sheet ST2' may include glass fiber reinforced plastic (GFRP) or titanium (Ti).

[0112] In an embodiment, an end portion of the second sheet ST2' facing the first circuit board CB1 may include a protrusion PP1 protruding toward the display panel PN. That is, the second sheet ST2' may include a main body portion BP1 and a protrusion PP1 protruding from an upper surface of an end portion of the main body portion BP1 facing the first circuit board CB1 toward the display panel PN. In other words, the second sheet ST2' may have an L shape rotated counterclockwise in cross section. In this case, the second sheet ST2' may cover a part of the end portion of the first sheet ST1.

[0113] Since the second sheet ST2' includes the protrusion PP1, the thickness TH2' of the second sheet ST2' may be thinner than Figure 2 and Figure 3 the thickness TH2 of the second sheet ST2 shown therein. Specifically, the thickness TH2' of the main body portion BP1 of the second sheet ST2' may be thinner thanFigure 2 and Figure 3 is thinner than the thickness TH2 of the second sheet ST2 shown in Figure 3 . For example, when the second sheet ST2' includes aluminum (Al), the thickness TH2' of the second sheet ST2' can be about 0.16 mm.

[0114] In an embodiment, the second sheet ST2' can have a modulus of about 30 GPa or greater. Preferably, the second sheet ST2' can have a modulus of about 30 GPa or greater and about 200 GPa or less. If the second sheet ST2' has a modulus less than about 30 GPa, cracks will occur in the display panel PN when evaluating the dropped ball. If the second sheet ST2' has a modulus exceeding about 200 GPa, it may be difficult to lighten the display device DD'.

[0115] In an embodiment, the second sheet ST2' can have a bending stiffness of about 1.04 kgf·m or greater in the width direction (e.g., in the first direction DR1 or the second direction DR2). If the second sheet ST2' has a bending stiffness less than about 1.04 kgf·m in the width direction, a bending phenomenon will occur in the display device DD'.

[0116] As a result, since the second sheet ST2' includes the protrusion PP1, even though the second sheet ST2' has a relatively thin thickness TH2', the second sheet ST2' can have a desired bending stiffness. That is, compared with the display device DD of Figure 3 , Figure 7 the display device DD' can be thinner.

[0117] For example, the second sheet ST2' can have a rectangular planar shape (see Figure 4 ). However, the embodiments of the present disclosure are not limited thereto, and the second sheet ST2' can have various planar shapes.

[0118] For example, the size of the second sheet ST2' can be smaller than the size of the display panel PN. However, the embodiments of the present disclosure are not limited thereto.

[0119] Figure 8 is a cross-sectional view showing still another example of the display device of Figure 3 . Figure 9 is a rear view showing the display panel, the second sheet, and the frame base of Figure 8 .

[0120] Referring to Figure 8 and Figure 9 , the display device DD” can include a display panel PN, a polarization member POL, a cover window CW, a cover plate CVP”, a driving integrated circuit DIC, a first circuit board CB1, a second circuit board CB2, a first pad portion PD1, and a second pad portion PD2. However, except for the cover plate CVP”, referring toFigure 8 and Figure 9 the display device DD” described can be substantially the same as or similar to the reference Figure 3 display device DD described. Hereinafter, descriptions that are repetitive of the description of the reference Figure 3 display device DD will be omitted or simplified.

[0121] The cover plate CVP” may include a first sheet ST1 and a second sheet ST2”.

[0122] The first sheet ST1 may cover the rear surface of the display panel PN. The first sheet ST1 may be attached to the display panel PN by an adhesive member. Specifically, the first sheet ST1 may be attached to the substrate SUB by an adhesive member. The first sheet ST1 may include a front surface having minute curves. In an embodiment, the first sheet ST1 may include an embossed sheet. In this case, the front surface of the first sheet ST1 facing the display panel PN may be a curved surface.

[0123] For example, the first sheet ST1 may have a rectangular planar shape (see Figure 4 ). However, embodiments of the present disclosure are not limited thereto, and the first sheet ST1 may have various planar shapes.

[0124] For example, the size of the first sheet ST1 may be smaller than the size of the display panel PN.

[0125] The second sheet ST2” may be disposed below the first sheet ST1. Specifically, the second sheet ST2” may directly contact the lower surface of the first sheet ST1. For example, the second sheet ST2” may directly contact a portion of the lower surface of the first sheet ST1.

[0126] For example, the second sheet ST2” may include a metallic material. In an embodiment, the second sheet ST2” may include aluminum (Al) or stainless steel (SUS). However, embodiments of the present disclosure are not limited thereto. For example, the second sheet ST2” may include glass fiber reinforced plastic (GFRP) or titanium (Ti).

[0127] In an embodiment, the cover plate CVP” may further include a frame base FC. The frame base FC may be disposed below the first sheet ST1 and may face the second sheet ST2”. Due to the frame base FC, the display device DD” can ensure sufficient stiffness.

[0128] For example, the frame base FC may include a metallic material. In an embodiment, the frame base FC may include aluminum (Al) or stainless steel (SUS). However, embodiments of the present disclosure are not limited thereto, and the frame base FC may include glass fiber reinforced plastic (GFRP) or titanium (Ti).

[0129] The frame base FC may include the same material as that of the second sheet ST2”. However, embodiments of the present disclosure are not limited thereto, and the frame base FC may include a material different from that of the second sheet ST2”.

[0130] In an embodiment, the frame base FC may have a shape of a quadrilateral (e.g., rectangular) ring surrounding the second sheet ST2” in a plan view. That is, the frame base FC may have a shape surrounding the second sheet ST2” along the outer edge of the second sheet ST2” in a plan view. However, the shape of the frame base FC is not limited thereto.

[0131] The sum of the thickness TH2” of the second sheet ST2” and the thickness of the second circuit board CB2 may be thicker than the thickness TH3 of the frame base FC. For example, the thickness TH3 of the frame base FC may be about 3 mm, and the thickness of the second circuit board CB2 may be about 4 mm or more. In this case, when the second sheet ST2” includes aluminum (Al), the thickness TH2” of the second sheet ST2” may be about 0.038 mm.

[0132] In an embodiment, the second sheet ST2” may have a modulus of about 30 GPa or more. Preferably, the second sheet ST2” may have a modulus of about 30 GPa or more and about 200 GPa or less. If the second sheet ST2” has a modulus less than about 30 GPa, cracks will occur in the display panel PN when evaluating the dropped ball. If the second sheet ST2” has a modulus exceeding about 200 GPa, it may be difficult to make the display device DD” lightweight.

[0133] In an embodiment, the sum of the bending stiffness of the second sheet ST2” in the width direction (e.g., the first direction DR1 or the second direction DR2) and the bending stiffness of the frame base FC in the width direction may be about 1.04 kgf·m or more. If the sum of the bending stiffness of the second sheet ST2” and the bending stiffness of the frame base FC is less than about 1.04 kgf·m, a bending phenomenon will occur in the display device DD”.

[0134] As a result, since the cover plate CVP" also includes the frame base FC, even if the second sheet ST2” has a relatively thin thickness TH2”, the second sheet ST2” and the frame base FC can be combined to achieve the desired bending stiffness. That is, compared with Figure 3 the display device DD and Figure 7 the display device DD', Figure 8 the display device DD” is thinner.

[0135] For example, the second sheet ST2” may have a rectangular planar shape (see Figure 9 ). However, embodiments of the present disclosure are not limited thereto, and the second sheet ST2” may have various planar shapes.

[0136] For example, the size of the second sheet ST2” may be smaller than the size of the display panel PN. However, embodiments of the present disclosure are not limited thereto.

[0137] Figure 10 is a cross-sectional view showing Figure 3 yet another example of the display device.

[0138] Referring to Figure 10 , the display device DD”' may include a display panel PN, a polarization member POL, a cover window CW, a cover plate CVP”', a driving integrated circuit DIC, a first circuit board CB1, a second circuit board CB2, a first pad portion PD1, and a second pad portion PD2. However, except for the cover plate CVP”', the display device DD”' described with reference to Figure 10 may be substantially the same as or similar to the display device DD” described with reference to Figure 8 and Figure 9 . Hereinafter, descriptions that are repetitive of the descriptions of the display device DD” described with reference to Figure 8 and Figure 9 will be omitted or simplified.

[0139] The cover plate CVP”' may include a first sheet ST1, a second sheet ST2”, and a frame base FC'.

[0140] The first sheet ST1 may cover the rear surface of the display panel PN. The first sheet ST1 may be attached to the display panel PN through an adhesive member. Specifically, the first sheet ST1 may be attached to the substrate SUB through an adhesive member. The first sheet ST1 may include a front surface having minute curves. In an embodiment, the first sheet ST1 may include an embossed sheet. In this case, the front surface of the first sheet ST1 facing the display panel PN may be a curved surface.

[0141] For example, the first sheet ST1 may have a rectangular planar shape (see Figure 4 ). However, embodiments of the present disclosure are not limited thereto, and the first sheet ST1 may have various planar shapes.

[0142] For example, the size of the first sheet ST1 may be smaller than the size of the display panel PN.

[0143] The second sheet ST2” may be disposed below the first sheet ST1. Specifically, the second sheet ST2” may directly contact the lower surface of the first sheet ST1. For example, the second sheet ST2” may directly contact a part of the lower surface of the first sheet ST1.

[0144] For example, the second sheet ST2” may include a metallic material. In an embodiment, the second sheet ST2” may include aluminum (Al) or stainless steel (SUS). However, embodiments of the present disclosure are not limited thereto. For example, the second sheet ST2” may include glass fiber reinforced plastic (GFRP) or titanium (Ti).

[0145] The frame base FC' may be disposed below the first sheet ST1 and may face the second sheet ST2”. Due to the frame base FC', the display device DD”' may ensure sufficient stiffness.

[0146] For example, the frame base FC' may include a metallic material. In one embodiment, the frame base FC' may include aluminum (Al) or stainless steel (SUS). However, embodiments of the present disclosure are not limited thereto, and the frame base FC' may include glass fiber reinforced plastic (GFRP) or titanium (Ti).

[0147] The frame base FC' may include the same material as that of the second sheet ST2”. However, embodiments of the present disclosure are not limited thereto, and the frame base FC' may include a material different from that of the second sheet ST2”.

[0148] In an embodiment, the frame base FC' may have a shape of a ring of a quadrilateral (e.g., a rectangle) surrounding the second sheet ST2” in a plan view. However, the shape of the frame base FC' is not limited thereto.

[0149] In an embodiment, an end portion of the frame base FC' facing the first circuit board CB1 may include a protrusion PP2 protruding toward the display panel PN. That is, the frame base FC' may include a main body portion BP2 and a protrusion PP2 protruding from an upper surface of an end portion of the main body portion BP2 facing the first circuit board CB1 toward the display panel PN. In other words, the frame base FC' may have a counterclockwise-rotated L shape in a cross section. In this case, the frame base FC' may cover a part of an end portion of the first sheet ST1.

[0150] Since the frame base FC' includes the protrusion PP2, the thickness TH3' of the frame base FC' may be thinner than Figure 8 the thickness TH3 of the frame base FC shown in. Specifically, the thickness TH3' of the main body portion BP2 of the frame base FC' may be thinner than Figure 8 the thickness TH3 of the frame base FC shown in.

[0151] The sum of the thickness TH2” of the second sheet ST2” and the thickness of the second circuit board CB2 can be greater than the thickness TH3' of the frame base FC'. For example, the thickness TH3' of the frame base FC' can be less than about 3 mm, and the thickness of the second circuit board CB2 can be about 4 mm or greater. In this case, when the second sheet ST2” includes aluminum (Al), the thickness TH2” of the second sheet ST2” can be about 0.038 mm.

[0152] In an embodiment, the second sheet ST2” can have a modulus of about 30 GPa or greater. Preferably, the second sheet ST2” can have a modulus of about 30 GPa or greater and about 200 GPa or less. If the second sheet ST2” has a modulus less than about 30 GPa, cracks will occur in the display panel PN when evaluating the dropped ball. If the second sheet ST2” has a modulus exceeding about 200 GPa, it may be difficult to make the display device DD”' lightweight.

[0153] In an embodiment, the sum of the bending stiffness of the second sheet ST2” in the width direction (e.g., the first direction DR1 or the second direction DR2) and the bending stiffness of the frame base FC' in the width direction can be about 1.04 kgf·m or greater. If the sum of the bending stiffness of the second sheet ST2” and the bending stiffness of the frame base FC' is less than about 1.04 kgf·m, a bending phenomenon will occur in the display device DD”'.

[0154] As a result, since the cover plate CVP”' also includes the frame base FC', even if each of the second sheet ST2” and the frame base FC' has a relatively thin thickness, the second sheet ST2” and the frame base FC' can be combined to achieve the desired bending stiffness. That is, compared with the Figure 8 display device DD”, Figure 10 the display device DD”' is thinner.

[0155] For example, the second sheet ST2” can have a rectangular planar shape (see Figure 4 ). However, the embodiments of the present disclosure are not limited thereto, and the second sheet ST2” can have various planar shapes.

[0156] For example, the size of the second sheet ST2” can be smaller than the size of the display panel PN. However, the embodiments of the present disclosure are not limited thereto.

[0157] Referring again to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 and Figure 10, a display device DD and DD' according to an embodiment of the present disclosure may include a display panel PN including a substrate SUB (including ultra-thin glass), and a cover plate CVP and CVP' disposed below the display panel PN. The cover plates CVP and CVP' may include a first sheet ST1, and a second sheet ST2 and ST2' disposed below the first sheet ST1, having a relatively large modulus (e.g., a modulus of about 30 GPa or greater) and having a predetermined bending stiffness (e.g., a bending stiffness of about 1.04 kgf·m or greater). Optionally, the cover plates CVP'' of the display device DD'' and the cover plates CVP''' of the display device DD''' may further include a frame base FC and FC' disposed below the display panel PN, and in this case, the sum of the bending stiffness of the second sheet ST2'' and the bending stiffness of the frame base FC and the sum of the bending stiffness of the second sheet ST2''' and the bending stiffness of the frame base FC' may have a predetermined value (e.g., a bending stiffness of about 1.04 kgf·m or greater).

[0158] Accordingly, the impact resistance of the display devices DD, DD', DD'' and DD''' can be improved. In addition, the bending phenomenon of the display devices DD, DD', DD'' and DD''' can be minimized or reduced. In this case, the flatness of the display devices DD, DD', DD'' and DD''' can be improved.

[0159] The present disclosure can be applied to various display devices. For example, the present disclosure can be applied to various display devices, such as display devices for vehicles, ships and airplanes, portable communication devices, display devices for exhibitions or information transmission, and medical display devices, etc.

[0160] The above content is an illustration of the embodiments and should not be construed as a limitation of the embodiments. Although several embodiments have been described, it will be readily understood by those skilled in the art that many modifications can be made to the embodiments without substantially departing from the novel teachings and advantages of the inventive concept. Therefore, all such modifications are intended to be included within the scope of the inventive concept as defined by the claims. Accordingly, it should be understood that the above content is an illustration of various embodiments and should not be construed as limited to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the appended claims.

Claims

1. A display device, wherein, The display device includes: A display panel, including: a substrate including ultra-thin glass; and a plurality of pixels disposed on the substrate; and A cover plate, including: a first sheet disposed below the display panel; and a second sheet in direct contact with the lower surface of the first sheet and having a modulus of 30 GPa or greater.

2. The display device according to claim 1, wherein, The second sheet includes stainless steel.

3. The display device according to claim 1, wherein, The second sheet includes aluminum.

4. The display device according to claim 1, wherein, The second sheet has a rectangular planar shape.

5. The display device according to claim 1, wherein The end of the second sheet includes a protrusion protruding toward the display panel.

6. The display device according to claim 5, wherein, The second sheet has a counterclockwise-rotated L shape in cross-section.

7. The display device according to claim 1, wherein, The bending stiffness of the second sheet in the width direction is 1.04 kgf·m or greater.

8. The display device according to claim 1, wherein, The cover plate further includes: A frame base disposed below the first sheet and facing the side surface of the second sheet.

9. The display device according to claim 8, wherein, The sum of the bending stiffness of the second sheet in the width direction and the bending stiffness of the frame base in the width direction is 1.04 kgf·m or greater.

10. The display device according to claim 8, wherein, The frame base has a shape of a rectangular ring surrounding the second sheet in a plan view.

11. The display device according to claim 8, wherein, The end of the frame base includes a protrusion protruding toward the display panel.

12. The display device according to claim 8, wherein, The frame base includes at least one selected from the group consisting of aluminum and stainless steel.

13. The display device according to claim 8, wherein, The frame base includes the same material as the material of the second sheet.

14. The display device according to claim 1, wherein, The first sheet includes an embossed sheet.

15. A display device, wherein, The display device includes: A display panel, including: a substrate including ultra-thin glass; and a plurality of pixels disposed in a display area on the substrate; A cover plate, including: a first sheet disposed below the display panel and including an embossed sheet; and a second sheet in direct contact with the lower surface of the first sheet, and having a modulus of 30 GPa or greater and a bending stiffness of 1.04 kgf·m or greater in the width direction; A first circuit board, a first end of the first circuit board being coupled to a first pad portion disposed in a sub-region positioned around the display area of the display panel, and a portion of the first circuit board being bent toward the lower portion of the display panel; and A second circuit board disposed below the cover plate and including a second pad portion coupled to a second end of the first circuit board opposite to the first end.

16. The display device according to claim 15, wherein, The second sheet includes stainless steel.

17. The display device according to claim 15, wherein, The second sheet includes aluminum.

18. The display device according to claim 15, wherein, The second sheet has a rectangular planar shape.

19. The display device according to claim 15, wherein, The end of the second sheet includes a protrusion protruding toward the display panel.

20. The display device according to claim 19, wherein, The second sheet has a counterclockwise-rotated L shape in cross-section.

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