Optical module, communication device, communication system, chip and method

Abstract

The invention provides an optical module, communication equipment, a communication system, a chip and a method, which are used for reducing the layout space occupied by a single optical assembly on a circuit board, thereby facilitating the integration of more optical assemblies on the circuit board with a fixed size. The DSP chip in the optical module not only can be used for carrying out equalization processing and the like on an electric signal, but also can realize the function of a line side framer when the optical module is mounted on a circuit board and the DSP is directly connected with an electric cross board, so that the framer chip can be prevented from being mounted in a single optical component of the circuit board, and the cost is reduced. The cost and the power consumption of OTN hardware equipment are reduced, and the layout space occupied by a single optical assembly on the circuit board is reduced, so that more optical assemblies can be integrated on the circuit board with a fixed size. Moreover, the manufacturer can realize the function of processing the electric signal and the function of the line side framer by investing a single DSP chip, so that the manufacturer can reduce the overall research and development cost of the chip, and the research and development period of the product is shortened.

Description

Technical Field

[0001] This application relates to the field of optical communication technologies, and in particular, to an optical module, a communication device, a communication system, a chip, and a method. Background Art

[0002] An optical transmission network (OTN) is a transmission network that organizes a network at the optical layer based on wavelength division multiplexing technology. The data frame used by an OTN device can be an OTN data frame (or simply referred to as an OTN frame). The OTN frame can be used to carry various types of service data and can achieve the management and monitoring of service data.

[0003] An OTN device with an electrical cross-connect function generally includes multiple tributary boards, multiple line boards, and at least one electrical cross-connect board. The tributary board and the line board are respectively integrated with multiple optical components. The optical components in the tributary board generally include a service-side optical module and a tributary-side framing chip. The optical components in the line board generally include a line-side optical module and a line-side framing chip. The service-side optical module is used to receive an optical signal carrying service data and perform optoelectronic conversion on the optical signal to obtain an electrical signal. The tributary-side framer is used to frame the electrical signal to obtain service data and map the service data into an optical data unit. The electrical cross-connect board is used to perform cross-scheduling on the optical data units received from the tributary-side framer. After encapsulating the optical data units into cross data units, the cross data units are sent to the destination line-side framer. The line-side framer is used to receive the cross data units, de-encapsulate the cross data units to obtain optical data units, map and / or multiplex the de-encapsulated optical data units into optical transmission units, and frame the optical transmission units to obtain electrical signals. The line-side optical module is used to perform electro-optical conversion on the electrical signal to obtain an optical signal. This optical signal can be transmitted through an optical fiber link to other OTN devices in the OTN.

[0004] With the continuous improvement of the transmission capacity of OTN devices, higher requirements are put forward for the integration degree of optical components on the line board. However, since the size of the line board is usually fixed, how to integrate more optical components on a line board with a fixed size has become an urgent problem to be solved. Summary of the Invention

[0005] This application provides an optical module, a communication device, a communication system, a chip, and a method, which are used to reduce the layout space occupied by a single optical component on a line board, thereby facilitating the integration of more optical components on a line board with a fixed size.

[0006] Through analysis, it is found that equipment manufacturers usually invest in single-chip solutions to manufacture tributary-side framer chips and line-side framer chips, in order to reduce the overall R & D cost of framer chips and shorten the R & D cycle of products. That is to say, a single framer chip not only integrates circuits for implementing the functions of a line-side framer (abbreviated as line frame processing circuits), but also integrates circuits for implementing the functions of a tributary-side framer (abbreviated as tributary frame processing circuits). However, when the framer chip is integrated and used in the optical components of a circuit board, the tributary frame processing circuits in the framer chip are not used. This part of the circuit not only generates a large static circuit power consumption, increasing the power consumption of the circuit board, but also occupies a large layout space and heat dissipation space on the circuit board.

[0007] Based on the above analysis, on the one hand, the present application provides an optical module. The optical module may include an optical connector, an optical device, a digital signal processor DSP, and an electrical connector. The DSP is used to receive a data frame through the electrical connector, and when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, the data frame is unpacked to obtain an optical data unit, the obtained optical data unit is mapped and / or multiplexed into an optical transmission unit, and the obtained optical transmission unit is framed to obtain an electrical signal. The DSP is also used to process the obtained electrical signal. The optical device is used to convert the processed electrical signal into an optical signal and send the optical signal through the optical connector.

[0008] An optical module generally integrates a DSP chip, and the DSP chip is used to process the electrical signal received from the electrical connector. For example, the DSP is used to perform equalization processing and / or digital-to-analog conversion on the electrical signal. The DSP can send the processed electrical signal to the optical device to improve the signal quality. When the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, since the DSP can also implement the functions of a line-side framer, this is beneficial to avoiding installing a framer chip in a single optical component of the circuit board, which is not only beneficial to reducing the cost and power consumption of OTN hardware devices, but also beneficial to reducing the layout space occupied by a single optical component on the circuit board, thus facilitating the integration of more optical components on a circuit board with a fixed size. And since the manufacturer can realize the functions of processing electrical signals and the line-side framer by investing in a single DSP chip solution, it is beneficial for the manufacturer to reduce the overall R & D cost of the chip and shorten the R & D cycle of the product.

[0009] In addition, since different chips generally communicate through a serializer / deserializer SerDes, compared with the DSP chip being connected to the electrical cross-connect board via a framer chip, the DSP chip being directly connected to the electrical cross-connect board is beneficial to reducing the number of SerDes that the data transmitted between the two experiences, thereby reducing the data transmission delay between the DSP and the electrical cross-connect board and reducing the power consumption of the OTN device.

[0010] Based on the above analysis, it is found that this application proposes that an optical module applicable to multiple application scenarios can be prepared, which is beneficial to reducing the overall R & D cost of optical communication devices and shortening the R & D cycle of products. Therefore, this application proposes that, optionally, the DSP is further configured to, when the optical module is installed on a combined branch and line board, map the data frame to an optical data unit, map and / or multiplex the obtained optical data unit to an optical transmission unit, and frame the obtained optical transmission unit to obtain an electrical signal. Wherein, the data frame can also be referred to as service data. And / or, the DSP is further configured to, when the optical module is installed on a line board and the electrical connector is directly connected to the framer on the line board, frame the data frame to obtain an electrical signal. As introduced above, the framer is configured to de-encapsulate the cross-connect data unit sent by the electrical cross-connect board to obtain an optical data unit, map and / or multiplex the obtained optical data unit to an optical transmission unit, and send the obtained optical transmission unit to the electrical connector.

[0011] Through analysis, it is found that a part of the functions executed by the DSP when the optical module is installed on a combined branch and line board are the same as a part of the functions executed by the DSP when the optical module is installed on a line board and the electrical connector is directly connected to the framer. This part of the functions includes, for example, mapping and / or multiplexing the optical data unit to an optical transmission unit, and framing the obtained optical transmission unit to obtain an electrical signal. In this way, it is beneficial to reuse the same circuit in the DSP to implement this part of the functions in different scenarios, which is beneficial for the DSP to be applicable to multiple application scenarios with a smaller size, saves the layout space occupied by a single optical component on the line board, and improves the integration degree of optical components on the line board.

[0012] Optionally, a serializer / deserializer (SerDes) is integrated in the DSP. The rate of the SerDes is adjustable. For example, the SerDes is configured to receive the data frame at a first data transmission rate when the optical module is installed on a line board and the electrical connector is directly connected to the electrical cross-connect board; the SerDes is configured to receive the data frame at a second data transmission rate when the optical module is installed on a combined branch and line board, and / or when the optical module is installed on a line board and the electrical connector is directly connected to the framer on the line board. Wherein, the first data transmission rate can be greater than the second data transmission rate.

[0013] Optionally, the DSP is further configured to receive a configuration signal. When the configuration signal is at a first logic level, the DSP determines that the optical module is installed on a line board and the electrical connector is directly connected to the electrical cross-connect board. When the configuration signal is at a second logic level, the DSP determines that the optical module is installed on a combined branch and line board, and / or the optical module is installed on a line board and the electrical connector is directly connected to the framer on the line board.

[0014] Optionally, the optical module further includes a controller configured to send the configuration signal to the DSP; and / or, the DSP is directly connected to a configuration pin of the electrical connector, and the configuration pin is used to receive the configuration signal.

[0015] Optionally, the optical module may be a color optical module, and the optical signal obtained by the optical device through electro-optical conversion of the electrical signal may be a color optical signal. Optionally, the color optical signal may be a coherent optical signal. In this way, it is beneficial to improve the signal quality of optical communication.

[0016] In a second aspect, the present application provides an optical module, including an optical connector, an optical device, a digital signal processor (DSP), and an electrical connector; the optical device is configured to receive an optical signal through the optical connector and convert the optical signal into an electrical signal; the DSP is configured to process the electrical signal; the DSP is further configured to frame the electrical signal to obtain an optical transmission unit, and when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, demap and / or demultiplex the optical transmission unit to obtain an optical data unit, encapsulate the obtained optical data unit into a data frame, and send the obtained data frame through the electrical connector.

[0017] Optionally, the DSP is further configured to, when the optical module is installed on a combined branch and line board, demap and / or demultiplex the optical transmission unit to obtain an optical data unit, demap the obtained optical data unit into a data frame, and send the obtained data frame through the electrical connector; and / or, the DSP is further configured to, when the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board, send the optical transmission unit through the electrical connector, where the framer is configured to demap and / or demultiplex the optical transmission unit into an optical data unit, encapsulate the obtained optical data unit into a cross data unit, and send the cross data unit to the electrical cross-connect board.

[0018] Optionally, a serializer / deserializer (SerDes) is integrated in the DSP; the SerDes is configured to send the obtained data frame at a first data transmission rate when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board; the SerDes is configured to send the obtained data frame at a second data transmission rate when the electrical connector is installed on a combined branch and line board, and / or when the electrical connector is installed on a circuit board and is directly connected to a framer on the circuit board. Wherein, the first data transmission rate may be greater than the second data transmission rate.

[0019] Optionally, the DSP is further configured to receive a configuration signal; when the configuration signal is at a first logic level, the DSP determines that the optical module is installed on the circuit board and the electrical connector is directly connected to the electrical cross-connect board; when the configuration signal is at a second logic level, the DSP determines that the optical module is installed on the combined branch and line board, and / or the optical module is installed on the circuit board and the electrical connector is directly connected to the framer on the circuit board.

[0020] Optionally, the optical module further includes a controller, and the controller is configured to send the configuration signal to the DSP; and / or, the DSP is directly connected to the configuration pin of the electrical connector, and the configuration pin is configured to receive the configuration signal.

[0021] Optionally, the DSP is configured to perform equalization processing and / or analog-to-digital conversion on the electrical signal.

[0022] Optionally, the optical module may be a color optical module, and the optical signal obtained by the optical device through electro-optical conversion of the electrical signal may be a color optical signal. Optionally, the color optical signal may be a coherent optical signal. In this way, it is beneficial to improve the signal quality of optical communication.

[0023] Compared with the optical module provided in the first aspect, the main difference of the optical module provided in the second aspect is that the optical module provided in the first aspect is used to transmit downstream data, and the optical module provided in the second aspect is used to transmit upstream data. Among them, downstream data refers to the data transmitted from the electrical connector of the optical module to the optical connector direction, and upstream data refers to the data transmitted from the optical connector of the optical module to the electrical connector direction. It can be considered that the method executed by the optical module provided in the second aspect is the reverse process of the method executed by the optical module provided in the first aspect, and the beneficial effects of the second aspect can be understood by referring to the beneficial effects of the relevant content of the first aspect.

[0024] In a third aspect, the present application provides a communication device, which includes a main board and one or more optical modules installed on the main board, and the one or more optical modules are the optical modules according to any one of the implementation manners described in the first aspect or the second aspect.

[0025] Optionally, the main board is a circuit board, and the communication device further includes an electrical cross-connect board, and the one or more optical modules are respectively directly connected to the electrical cross-connect board.

[0026] In a fourth aspect, the present application provides a communication system, which includes a plurality of communication devices and an optical transmission network. The optical transmission network is configured to transmit optical signals between different communication devices among the plurality of communication devices, and the plurality of communication devices include at least one communication device according to any one of the third aspect.

[0027] Since the communication device provided by the third party and the communication system provided by the fourth party are integrated with the optical module provided by the first party and / or the second party, the technical effects and technical details that can be obtained by the third party and the fourth party can refer to the corresponding content of the foregoing first party and second party, and will not be elaborated here.

[0028] In a fifth aspect, the present application provides a data transmission method, which is applied to an optical module. The method includes: receiving a data frame through an electrical connector of the optical module; when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, unpacking the data frame to obtain an optical data unit, mapping and / or multiplexing the unpacked optical data unit into an optical transmission unit, framing the obtained optical transmission unit to obtain an electrical signal; processing the obtained electrical signal, and the processed electrical signal is used to be converted into an optical signal, and the optical signal is used to be sent out through an optical connector of the optical module.

[0029] Optionally, the method further includes: when the optical module is installed on a combined branch and line board, mapping the data frame into an optical data unit, mapping and / or multiplexing the mapped optical data unit into an optical transmission unit, and framing the obtained optical transmission unit to obtain an electrical signal; and / or, when the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board, framing the data frame to obtain an electrical signal, where the framer is used to unpack a cross data unit sent by an electrical cross-connect board to obtain an optical data unit, map and / or multiplex the obtained optical data unit into an optical transmission unit, and send the obtained optical transmission unit to the electrical connector.

[0030] Optionally, the optical module has a serializer / deserializer (SerDes). The receiving of the data frame through the electrical connector of the optical module includes: when the optical module is installed on a circuit board and the optical module is directly connected to an electrical cross-connect board, controlling the SerDes to receive the data frame at a first data transmission rate; when the optical module is installed on a combined branch and line board, and / or, when the optical module is installed on a circuit board and the optical module is directly connected to a framer on the circuit board, controlling the SerDes to receive the data frame at a second data transmission rate; where the first data transmission rate can be greater than the second data transmission rate.

[0031] Optionally, the method further includes: receiving a configuration signal; when the configuration signal is a first logic level, determining that the optical module is installed on a circuit board and the optical module is directly connected to an electrical cross-connect board; when the configuration signal is a second logic level, determining that the optical module is installed on a combined branch and line board, and / or, the optical module is installed on a circuit board and the optical module is directly connected to a framer on the circuit board.

[0032] Optionally, the processing of the obtained electrical signal includes: performing equalization processing and / or digital-to-analog conversion on the obtained electrical signal.

[0033] In a sixth aspect, the present application provides a data transmission method, which is applied to an optical module. The method includes: processing an electrical signal, where the electrical signal is obtained by performing optoelectronic conversion on an optical signal, and the optical signal is received through an optical connector of the optical module; framing the electrical signal to obtain an optical transmission unit; when the optical module is installed on a circuit board and the electrical connector of the optical module is directly connected to an electrical cross-connect board, demapping and / or demultiplexing the optical transmission unit to obtain an optical data unit, encapsulating the obtained optical data unit to obtain a data frame, and sending the obtained data frame through the electrical connector.

[0034] Optionally, the method further includes: when the optical module is installed on a combined branch and line board, demapping and / or demultiplexing the optical transmission unit to obtain an optical data unit, demapping the obtained optical data unit into a data frame, and sending the obtained data frame through the electrical connector; and / or when the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board, sending the optical transmission unit through the electrical connector, where the framer is configured to demap and / or demultiplex the optical transmission unit into an optical data unit, encapsulate the obtained optical data unit into a cross data unit, and send the cross data unit to the electrical cross-connect board.

[0035] Optionally, a serializer / deserializer (SerDes) is integrated in the optical module. The data frame sent through the electrical connector includes: when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, controlling the SerDes to send the obtained data frame at a first data transmission rate; when the electrical connector is installed on a combined branch and line board, and / or when the electrical connector is installed on a circuit board and is directly connected to a framer on the circuit board, controlling the SerDes to send the obtained data frame at a second data transmission rate; where the first data transmission rate can be greater than the second data transmission rate.

[0036] Optionally, the method further includes: receiving a configuration signal; when the configuration signal is at a first logic level, determining that the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board; when the configuration signal is at a second logic level, determining that the optical module is installed on a combined branch and line board, and / or the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board.

[0037] Optionally, the processing of the electrical signal includes: performing equalization processing and / or analog-to-digital conversion on the electrical signal.

[0038] The method provided by the fifth aspect can be executed by the optical module provided by the first aspect, or the DSP in the optical module, or the optical communication device installed with the optical module provided by the first aspect. The method provided by the sixth aspect can be executed by the optical module provided by the second aspect, or the DSP in the optical module, or the optical communication device installed with the optical module provided by the second aspect.

[0039] Since the optical module provided by the first aspect or the DSP in the optical module can execute the method provided by the fifth aspect, and the optical module provided by the second aspect or the DSP in the optical module can execute the method provided by the sixth aspect, therefore, the technical effects that can be obtained by each method and the technical details for implementing the above methods can refer to the corresponding content of the foregoing first aspect and second aspect, and will not be elaborated herein.

[0040] In a seventh aspect, the present application provides a chip, which is used to be integrated in an optical module. The chip includes a plurality of circuits, and at least one of the plurality of circuits is used to execute the method as described in any possible implementation manner of the fifth aspect and the sixth aspect. Optionally, the chip can be the DSP in the optical module provided by any possible implementation manner of the first aspect and the second aspect. The beneficial effects of the chip provided by the seventh aspect can refer to the corresponding content of the foregoing first aspect and second aspect, and will not be elaborated herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 Schematically shows a possible structure of a communication system;

[0042] Figure 2 Schematically shows Figure 1 A possible structure of the OTN device shown;

[0043] Figure 3 Schematically shows Figure 1 Another possible structure of the OTN device shown;

[0044] Figure 4-1 And Figure 4-2 Schematically show a possible structure of an optical module respectively;

[0045] Figure 5-1 Schematically shows Figure 4-1 Another possible structure of the optical module shown;

[0046] Figure 5-2 And Figure 5-3 Show schematic diagrams of installing an optical module on a main board respectively;

[0047] Figure 6 Schematically shows another possible structure of the OTN device;

[0048] Figure 7Schematically shows a possible structure of a forwarding device integrated with an optical module;

[0049] Figure 8-1 Schematically shows Figure 5-1 Another possible implementation of the service processing unit in;

[0050] Figure 8-2 Schematically shows the functional units enabled by the service processing unit in each scenario in the downlink data transmission direction;

[0051] Figure 8-3 Schematically shows the functional units enabled by the service processing unit in each scenario in the uplink data transmission direction;

[0052] Figure 8-4 Schematically shows another possible implementation of the line frame processing subunit;

[0053] Figure 9 Schematically shows a possible structure of a rate - adjustable SerDes;

[0054] Figures 10 to 12 Schematically shows the data transmission methods in Scenarios 1 - 3 respectively. Detailed implementation manners

[0055] An optical transmission network (OTN) is a transmission network that organizes the network at the optical layer based on wavelength - division multiplexing technology and can be widely applied to access networks, metropolitan area networks, aggregation networks, data center networks, mobile networks, backbone networks, space optical communication networks, power optical communication networks, etc. Wavelength - division multiplexing is to multiplex optical signals of different wavelengths onto the same optical fiber for transmission.

[0056] An OTN network is usually composed of multiple OTN devices connected by optical fiber links and can be configured into different topological types such as linear, ring, and mesh according to specific needs. Figure 1 Schematically shows a possible structure of a communication system. Figure 1 The shown communication system includes OTN Network 1 and OTN Network 2. The two OTN networks can be of the same type or different types of networks introduced above. This application does not limit the number of OTN networks in the communication system, and the communication system can include more or fewer OTN networks.

[0057] Figure 1 Use a rectangle to represent an OTN device and the connection line between rectangles to represent an optical fiber link. As Figure 1 shown, each OTN network includes a certain number of OTN devices, and different OTN devices are connected by optical fiber links. Figure 1Taking the example that OTN network 1 includes OTN devices N1 to N4 and OTN network 2 includes OTN devices N5 to N7, the number of OTN devices in the OTN network is not limited in this application.

[0058] OTN devices can have rich interfaces. For example, they can be compatible with perfect traditional SDH interfaces and can also provide rich data interfaces such as Gigabit Ethernet. As an example, it can support at least one of the following interfaces: Ethernet interface, STM-1 / 4 / 16 / 64 interface, Multiprotocol Label Switching (MPLS) interface, and any rate data interface from 100M to 5G. Correspondingly, OTN devices can carry multiple types of service data (or called client signals).

[0059] The data frames used by OTN devices can be OTN data frames (or simply called OTN frames) for carrying service data and can achieve the management and monitoring of service data. OTN frames can be optical data units (ODU), such as ODUk, ODUCn, or ODUflex, or optical transport units (OTU), such as OTUk, OTUCn, or flexible OTN (FlexO) frames, etc. OTN frames can also be other frame structures suitable for optical networks. The specific value of k is not limited in this application. For example, k = 0 / 1 / 2 / 2e / 3 / 4 / C1 / 25 / 50, etc.

[0060] Traditional WDM devices do not have switching functions, while OTN devices provide a solution for switching functions for wavelength division devices, enabling them to better support switching optical network functions.

[0061] Figure 2 Schematically shows a possible structure of an OTN device. As Figure 2 shown, the OTN device can include multiple tributary boards, an electrical cross-connect board, multiple line boards, a multiplexer / demultiplexer board, and an optical amplifier board. In the drawings of this application, dashed lines with arrows represent optical signals, and solid lines with arrows represent electrical signals.

[0062] Tributary boards can provide client-side interfaces for accessing service data on the client side. Tributary boards can use service-side optical modules to receive service data carried by optical signals, complete optical-electrical (O / E) conversion, and then use a framer to map the service data to the Optical Data Unit (ODU) k and send it to the electrical cross-connect board for scheduling. And / or, tributary boards can be used to implement the reverse process of the above process.

[0063] This application does not limit the OTN frame structure used by the framer in the tributary board to ODUk. The framer can use other types of OTN frames. The tributary board can provide multiple types of client - side interfaces. For example, it can provide at least one of the following interfaces: Ethernet interface, STM - 1 / 4 / 16 / 64 interface, Multiprotocol Label Switching (MPLS) interface, and data interfaces with any rate from 100M to 5G. Correspondingly, the service data can be the service data transmitted by the corresponding interface.

[0064] The electrical cross - connect board is used to complete the electrical signal scheduling between the tributary board and the line board. After receiving ODUk from the tributary board, the electrical cross - connect board can perform cross - scheduling on ODUk, determine the path (or line board) selected for ODUk, map ODUk to the cross - data unit, and send the cross - data unit to the corresponding line board.

[0065] The line board can provide line - side interfaces and mainly implement the processing of line - side data frames. For example, the line board can use a framer to receive the cross - data unit scheduled by the electrical cross - connect board, and demap the cross - data unit into ODUk. Then, the line board can use the line - side optical module to map and / or multiplex ODUk into an Optical Transport Unit (OTU), and then perform electrical - optical (E / O) conversion. And / or, the line board can be used to implement the reverse process of the above process.

[0066] This application does not limit the types of optical modules (or optical interfaces) in the tributary board and the line board. For example, the service - side optical module can be a gray - light module, and the line - side optical module can be a color - light module. Among them, the wavelength of the optical signal transmitted and received by the gray - light module fluctuates within a relatively wide range and has no standard wavelength, while the wavelength of the optical signal transmitted and received by the color - light module fluctuates within a very small range near a certain central wavelength and has a standard wavelength. The color - light module can be a coherent optical module.

[0067] Optionally, the optical module in the tributary board can be replaced with an electrical interface. Correspondingly, the tributary board receives service data through the electrical interface.

[0068] The multiplexer / demultiplexer board is used to multiplex or demultiplex optical signals with different wavelengths. Its multiplexing function is reflected in that in the downlink data transmission direction, the multiplexer / demultiplexer board can multiplex multiple optical signals sent by multiple line boards into 1 optical signal and send this 1 optical signal to other OTN devices. Its demultiplexing function is reflected in that in the uplink data transmission direction, the multiplexer / demultiplexer board can demultiplex 1 optical signal received from other OTN devices into multiple optical signals and send the multiple optical signals to multiple line boards. Optionally, the OTN device may not include a multiplexer / demultiplexer board. For example, different line boards can transmit optical signals through different optical fibers.

[0069] An optical amplifier (OA) may be provided in the optical amplification board to amplify the power of the optical signal (hereinafter referred to as optical power). The optical amplification board may amplify the optical signal received by the OTN device from other OTN devices and / or the optical signal sent by the OTN device to other OTN devices. The optical amplification board is optional. For example, when long-distance transmission of optical signals is required, the OTN device may use the optical amplification board to amplify the optical power, while when short-distance transmission of optical signals is performed, the OTN device may not use the optical amplification board to amplify the optical power.

[0070] According to specific requirements, the types and quantities of single boards included in an OTN device may vary. For example, a network device serving as a core node may not have tributary boards. A network device serving as an edge node may have multiple tributary boards. For example, an OTN device may include multiple electrical cross-connect boards, and the multiple electrical cross-connect boards can share the traffic load. When a certain electrical cross-connect board among the multiple electrical cross-connect boards malfunctions, the traffic switching load can be evenly distributed to other electrical cross-connect boards, thereby improving the reliability of the OTN device.

[0071] Optionally, the OTN device may further include a rack provided with multiple slots, and multiple single boards in the OTN device may be respectively disposed in the multiple slots of the rack.

[0072] The OTN device may further include Figure 2 other modules not shown. For example, the OTN device may further include a fan, a power supply, an auxiliary unit, a system control and communication single board, etc. Among them, the power supply is used to supply power to the OTN device and may include a main power supply and a standby power supply. The fan is used to dissipate heat from the device. The auxiliary single board is used to provide auxiliary functions such as external alarm or access to an external clock. The system control and communication single board is used to implement system control and communication. Specifically, information can be collected from different single boards through the backplane, or control instructions can be sent to the corresponding single boards.

[0073] Figure 1 Taking a line board including a set of framers and line-side optical modules as an example, multiple sets of framers and line-side optical modules may be provided on a single line board. Moreover, as the requirements for the data transmission rate of OTN devices continue to increase, the number of framers and line-side optical modules integrated on the line board is constantly increasing, which poses higher requirements for the integration level of the line board.

[0074] Equipment manufacturers usually invest in single-chip solutions to manufacture the framer chips in tributary boards and line boards. That is to say, the framer chips not only have the client-side mapping function of the framer in the tributary board to perform the mapping and demapping between service data and ODUk, but also have the line-side mapping function of the framer in the line board to perform the mapping and demapping between ODU and OTU, and also have the line frame processing function to perform the encapsulation and decapsulation between ODUk and cross data units. In this way, it is not only beneficial to reduce the overall R & D cost of the framer chips, but also beneficial to shorten the R & D cycle of the products.

[0075] As the services to be processed by the line-side framer and tributary-side framer continue to increase, the size of the framer chips continues to increase, occupying a large layout and heat dissipation space on the line board, which restricts the further improvement of the line board integration and is not conducive to heat dissipation.

[0076] Through analysis, it is found that since the client-side mapping function needs to map and demap various service data with ODUk, the scale of the logic circuit used to implement the client-side mapping function in the framer chip is usually much larger than that of the logic circuit used to implement the line-side mapping function. Taking the current 800G framer as an example, the power consumption ratio and area ratio of the logic circuit for implementing the line board framer function and the logic circuit for implementing the tributary board framer function are about 1:3 and 1:3.5 respectively. When the framer chip is installed on the line board for use, the circuit used to implement the client-side mapping function in the framer chip is not used. That is to say, a large number of circuits in the framer chip are not used. This part of the circuit not only has a large static circuit power consumption, but also occupies a large layout and heat dissipation space on the line board.

[0077] In addition to the optical transmitter and optical receiver, a digital signal processor (DSP) chip is generally set in the line-side optical module. The DSP mentioned in this application can also be replaced by an optical digital signal processor (ODSP). This application does not limit the type of the DSP chip. For example, the DSP can be an application specific integrated circuit (ASIC). The DSP chip can complete signal shaping, generate digital baseband signals, and complete the conversion between analog signals and digital signals. The DSP chip can also receive the integrated coherent receiver (ICR) signals, complete the conversion from analog signals to digital signals, and then perform equalization / compensation on the digital signals.

[0078] Based on the above findings, this application proposes that the DSP can also complete various service interfaces and processing. For example, a line frame processing subunit and a line-side mapping subunit can be integrated in the DSP to implement the line frame processing function and the line-side mapping function respectively. In this way, it is beneficial for the optical module to be directly connected to the electrical cross-connect board, and a framer does not need to be additionally provided in the line board, reducing the cost and power consumption of the OTN hardware device. Correspondingly, the OTN device can be as Figure 3 shown. Moreover, since the size of the circuit for implementing the line frame processing subunit and the line-side mapping subunit is smaller than the size of the framer, even if a line frame processing subunit and a line-side mapping subunit are newly added to the existing DSP chip, the increased size of the DSP chip is smaller than the size of the framer. In this way, it is beneficial to save the layout and heat dissipation space on the line board, improve the integration degree of the line board, optimize the layout of the line board in the OTN device, and ensure heat dissipation.

[0079] Figure 4-1 Schematically shows a possible structure of the optical module. Refer to Figure 4-1 , the optical module can integrate optical devices and a DSP.

[0080] Among them, the optical device can integrate an optical transmitter and / or an optical receiver. Optionally, when the optical device is used to transmit coherent optical signals, the optical device can also include a light source for generating an optical carrier. The optical transmitter can receive a digital electrical signal, and by using an external modulation method, load the digital electrical signal onto the amplitude or phase of the optical carrier, and send the modulated optical carrier signal to the optical fiber channel. The optical receiver can receive the optical carrier signal from the optical fiber channel and output an electrical signal based on the optical carrier (as the local oscillator light). The optical carriers on which the optical transmitter and the optical receiver are based can come from the same or different light sources. The optical carrier can be wavelength-tunable, and the wavelength range includes bands such as S, C, L, O, etc., and the wavelength interval can be adjusted, such as 37.5 GHz / 50 GHz / 100 GHz / 150 GHz, etc. The optical transmitter can include an electro-optic modulator to complete dual-polarization amplitude or phase modulation. If the Vpi of the modulator is large, in order to obtain sufficient output optical power and performance, the electrical signal entering the modulator can be amplified first. Therefore, the signal output by the DSP generally needs to pass through an amplifier / driver to meet the input signal swing requirement of the modulator. The optical receiver mainly completes the coherent reception function, including coherent mixing of the optical carrier and the received signal, and completing coherent demodulation and optoelectronic conversion. Optionally, the optical transmitter and the optical receiver can be co-packaged or integrated into a single chip as a functional unit. Optionally, the light source (such as a laser) for generating the optical carrier can also be co-packaged or integrated into a single chip with the optical transmitter and the optical receiver as a functional unit. Or, the optical transmitter, the optical receiver, and the light source are all independently packaged functional units.

[0081] Among them, the DSP can be used to directly connect to the electrical cross-connect board. In the downlink data transmission direction, the line frame processing subunit is used to receive the cross data unit obtained by encapsulating the scheduled ODUk by the electrical cross-connect board, demap the cross data unit into ODUk, and then, the line-side mapping subunit is used to multiplex and / or map the ODUk to obtain FlexO. The optical transmitter is used to perform electro-optical conversion on the electrical signal carrying FlexO to obtain and emit an optical signal. In the uplink data transmission direction, the optical receiver is used to receive the optical signal, perform opto-electrical conversion on the optical signal to obtain the electrical signal carrying FlexO. The line-side mapping subunit is used to demultiplex and / or demap FlexO to obtain ODUk. The line frame processing subunit is used to map ODUk into a cross data unit and send the cross data unit to the electrical cross-connect board.

[0082] By adding the circuit corresponding to the line-side framer in the existing DSP chip of the optical module to implement the line frame processing function, since there is no need to invest in a new chip solution, therefore, it will not cause an increase in the overall R & D cost and R & D cycle of the device. And, by analyzing the logic circuit of the framer, it is found that the scale of the logic circuit corresponding to the client-side framer is much larger than that of the logic circuit corresponding to the line-side framer. Therefore, after adding the circuit corresponding to the line-side framer of the line frame processing subunit in the DSP, the new size of the DSP is much smaller than that of the framer, which is beneficial to saving the layout and heat dissipation space on the circuit board, increasing the number of optical modules integrated on a single circuit board, and is also beneficial to heat dissipation.

[0083] Optionally, the optical device and the DSP can be co-packaged or integrated into a single chip as a functional unit. Or, the optical transmitter, the optical receiver, and the DSP are co-packaged or integrated into a single chip as a functional unit, and the light source for generating the optical carrier can be a different functional unit.

[0084] Optionally, a single optical module can support the transmission of more channels / wavelengths. Correspondingly, the optical module can be integrated with multiple optical devices. As Figure 4-2 shown, the optical module can be integrated with the optical device of channel 1, the optical device of channel 2, and the DSP. The DSP is respectively connected to these two optical devices, and these two optical devices are used to transmit data of different channels, and the wavelengths of these two optical devices can be different. Optionally, the optical module can be integrated with more optical devices to support the transmission of optical signals of more channels / wavelengths.

[0085] Figure 4-1 The DSP shown can have more functions. Correspondingly, more functional units can be integrated. Figure 5-1 Schematically shows Figure 4-1 Another possible structure of the optical module shown. As Figure 5-1As shown, the optical module may include a printed circuit board (PCB). Figure 4-1 The optical device and DSP shown can be integrated on the PCB. As Figure 5-1 shown, an optical connector and a gold finger can also be installed on the PCB. The optical connector can be used to connect an optical fiber to send a downstream optical signal output by an optical transmitter and / or input an upstream optical signal received from the optical fiber to an optical receiver. The gold finger is used to be matched and installed in a slot of the main board, so as to realize the electrical connection between the optical module and the main board. Among them, the type of the main board is not limited in this application, and examples will be introduced later. Data streams of multiple services can be input and output through the gold finger. Other components can also be integrated on the PCB, such as a power module and a structural member, etc. The structural member can be used for positioning, supporting, protecting, etc. For example, the structural member can be the housing of the optical module.

[0086] The gold finger can be designed on the PCB or installed on the PCB by soldering. The gold finger and the structural member can cooperate to complete the pluggable and fixed functions of the optical module. Correspondingly, the optical module can be applied to scenarios that require plugging and unplugging. As Figure 5-2 shown, the optical module can be installed on the edge of the main board through the gold finger along a direction parallel to the PCB, and the optical connector faces outward, and the optical module optical fiber can be plugged and unplugged.

[0087] The gold finger can also be replaced with other types of electrical connectors, and the direction in which the optical module is plugged into the main board can be not parallel to the PCB. As Figure 5-3 shown, an electrical connector (such as a high-speed connector) can be assembled on the PCB of the optical module, and the optical module can be installed on the main board through the electrical connector along a direction perpendicular to the PCB. The electrical connector in the vertical direction can have a larger number of connection pins (PINs), which is beneficial to supporting a larger transmission capacity and is beneficial to supporting Figure 4-1 the single-channel / wavelength shown in Figure 4-2 and the two specific implementations of multi-channel / wavelength shown in

[0088] As Figure 5-1 shown, a serializer / deserializer (SerDes) interface can also be integrated in the DSP. The SerDes can perform high-speed data serial / parallel conversion or parallel / serial conversion, serial input and output, and realize the service data transmission with upstream and downstream chips. The SerDes can be used to directly connect to an electrical cross-connect board. As Figure 5-1 shown, the SerDes can be connected to one or more conductive contacts (or called pins) of the gold finger. In Figure 3For the OTN device shown, assuming that the electrical cross-connect board is electrically connected to the pins of the slots on the circuit board through the traces in the circuit board, and by mating the gold fingers to the slots, the SerDes can be directly connected to the SerDes of the electrical cross-connect board.

[0089] In Figure 3 , the rectangles marked with numbers represent SerDes. The DSP and the electrical cross-connect board can each set SerDes1, and the DSP and the electrical cross-connect board communicate through a first-level SerDes.

[0090] In Figure 2 , the rectangles marked with letters represent SerDes. As Figure 2 shown, communication between the electrical cross-connect board and the framer is through SerDesa, and communication between the framer and the coherent optical module is through SerDesb. That is to say, the data transmitted between the optical module and the electrical cross-connect board needs to go through two levels of SerDes. The delay and power consumption of SerDes are relatively large. Taking the 14nm CMOS process as an example, the transceiver transmission of a first-level 56G PAM4 SerDes interconnection increases the signal delay by about 3us or more, and the power consumption of a pair of SerDes increases by 0.5W @ 112Gbps.

[0091] Adding a line frame processing sub-unit in the DSP is beneficial for the DSP to be directly connected to the electrical cross-connect board, which is beneficial for the DSP and the electrical cross-connect board to communicate through a first-level SerDes, which is beneficial for reducing the data transmission delay between the DSP and the electrical cross-connect board, and is beneficial for reducing the power consumption of the OTN device.

[0092] Since the cross data unit is generally larger than ODUk, therefore, in Figure 2 , the transmission rate of SerDesa for transmitting the cross data unit is higher than that of SerDesb for transmitting ODUk.

[0093] In Figure 3 the OTN device shown, since the cross data unit is transmitted between the line-side optical module and the electrical cross-connect board, therefore, compared with the SerDesb of the line-side optical module shown in Figure 2 , the SerDes1 of the line-side optical module shown in Figure 3 needs to use a higher transmission rate to communicate with the electrical cross-connect board. For example, Figure 3 the transmission rate of SerDes1 of the line-side optical module shown is the same as the data transmission rate of SerDesa of the electrical cross-connect board shown in Figure 2 .

[0094] On the transmission link of optical communication, there are various impairments, mainly including various losses, dispersion, polarization state rotation, nonlinear effects, and channel impairments introduced by various optoelectronic devices. Additionally, there are also frequency offsets and phase noises of the lasers at the transmitter and receiver ends. Optionally, continue to refer to Figure 5-1 , the DSP may also be integrated with an optical port digital signal processing unit, which is used to compensate for various impairments in the electrical signals in the downlink data transmission direction and / or the uplink data transmission direction. The electrical signal may be a digital electrical signal. As an example, the optical port digital signal processing unit may perform equalization processing on the electrical signal. For example, it may complete at least one of various equalization processes such as polarization multiplexing recovery, clock recovery, dispersion compensation and channel equalization, frequency offset estimation and compensation, carrier phase recovery and signal decision, demodulation, and dispersion, polarization mode dispersion (PMD), state of polarization (SOP), and nonlinear compensation of the optical fiber channel in the digital signal domain.

[0095] Continue to refer to Figure 5-1 , for an optical module with an optical transmitter, the DSP may also be integrated with a digital-to-analog converter (DAC). In the downlink data transmission direction, the DAC is used to receive a digital signal from the optical port digital signal processing unit, convert the digital signal into an analog signal, and send the analog signal to the optical transmitter. For an optical module with an optical receiver, the DSP may also be integrated with an analog-to-digital converter (ADC). In the uplink data transmission direction, the ADC is used to receive an analog signal from the optical receiver, convert the analog signal into a digital signal, and send the digital signal to the optical port digital signal processing unit.

[0096] As Figure 5-1 shown, in this application, the logic power supply used for data processing between the SerDes and the optical port digital signal processing unit in the DSP is referred to as the service processing unit. For example, the service processing unit is used to receive data from the SerDes, process the data, and send it to the optical port digital signal processing unit. And / or, the service processing unit is used to receive data from the optical port digital signal processing unit, process the data, and send it to the SerDes. Correspondingly, it can be considered that the service processing unit includes the line frame processing subunit and the line-side mapping subunit introduced above. The service processing unit may be used to complete the processing and conversion of OTN transmission-related protocols.

[0097] The service processing unit may have multiple functions. Correspondingly, the service processing unit may be integrated with multiple functional modules. For example, the service processing unit may include Figure 5-1The functional module 1 shown has a line frame processing function and a line side mapping function.

[0098] In order to Figure 4-1 make the optical module shown compatible with other application scenarios, such as Figure 5-1 shown, the service processing unit can also integrate functional modules corresponding to other application scenarios. For example, at least one of the functional modules 2 to 4. Different functional modules can be applicable to different application scenarios. Optionally, the service processing unit can also integrate other functional modules other than the functional modules 2 to 4 to make the optical module applicable to other application scenarios.

[0099] The DSP can also integrate a control unit, and the control unit is used to control one or more units in the DSP. For example, it is used to control the service processing unit to process data using the functional module corresponding to the application scenario.

[0100] This application does not limit the number and type of other functional modules of the service processing unit. The following examples introduce possible application scenarios of the line side optical module provided by this application and the corresponding functional modules used by the service processing unit.

[0101] Figure 6 Schematically shows another possible structure of the OTN device. Figure 6 The OTN device shown includes a plurality of branch-line combined boards. The branch-line combined board is equivalent to combining the functions of the branch board and the line board. For example, in the downlink data transmission direction, the branch-line combined board (muxponder) can use the service side optical module to receive the optical signal carrying the service data, perform O / E conversion on the optical signal, use the line side optical module to map the service data to ODUk, and then perform mapping and / or multiplexing on the ODUk to obtain FlexO, and carry the FlexO on the optical signal and send it out. In the uplink data transmission direction, the branch-line combined board can use the line side optical module to receive the optical signal carrying FlexO, perform O / E conversion on the optical signal, and then perform demapping and / or demultiplexing on the FlexO to obtain ODUk, demap the ODUk to service data, and use the service side optical module to carry the service data on the optical signal and send it out.

[0102] This application does not limit the type of each optical module in the branch-line combined board. For example, the service side optical module can be a gray optical module, and the line side optical module can be a colored optical module (such as a coherent optical module). And, optionally, the service side optical module in the branch-line combined board can be replaced with an electrical interface to receive service data through the electrical interface. The service side optical module can be an optical module with a DSP or an optical module with a CDR or a linear-drive pluggable optics (LPO).

[0103] In Figure 6 the OTN device shown, assuming that the optical module on the service side is electrically connected to the pins of the slot on the combined line and branch board through the wiring in the combined line and branch board, by installing Figure 5-1 the shown gold fingers matchingly in the slot, the SerDes can be connected to the SerDes of the optical module on the service side.

[0104] And Figure 2 different from the OTN device shown, Figure 6 the OTN device shown may not have the function of electrical switching. The multiplexing and demultiplexing board and the optical amplifier board in the OTN device can be understood with reference to the relevant content above and will not be elaborated here.

[0105] To reduce the overall R & D cost and also help shorten the R & D cycle of the product, optionally, Figure 5-1 the service processing unit shown may also be integrated with a function module 2. The function module 2 has a client-side mapping function and a line-side mapping function. When Figure 5-1 the shown optical module is directly connected to the electrical cross-connect board (for example, applied to Figure 3 the line board shown), the control unit is used to control the service processing unit to process data using the function module 1, and when Figure 5-1 the shown optical module is used as the line-side optical module in the combined line and branch board, the service processing unit is controlled to process data using the function module 2. The function module 2 can be used to map service data to ODUk, and then map and / or multiplex ODUk to FlexO, and / or demap and / or demultiplex FlexO to ODUk and then demap ODUk to service data.

[0106] In this way, the device manufacturer can apply a single optical module or DSP solution to Figure 3 the line-side optical module in the scenario shown (referred to as scenario 1) and Figure 6 the line-side optical module in the scenario shown (referred to as scenario 2). Scenario 1 can be application scenarios such as long-haul dense wavelength division multiplexing (DWDM) or metro DWDM. Scenario 2 can be application scenarios such as metro DWDM or data center (DC) or datacenter interconnection (DCI). The optical module provided in this application can be used as the core component of the combined line and branch board, and the external service interface is a gray optical module or LPO.

[0107] To be backward compatible with Figure 2 the line board shown, optionally, Figure 5-1The DSP shown may also integrate a functional module 3, and the functional module 3 may have a line - side transparent transmission function. The control unit is used to control the service processing unit to use the functional module 3 to process data when the optical module is applied to the Figure 2 line - side optical module in the shown scenario (referred to as scenario 3). The functional module 3 is used to perform other data processing except for OTN frame processing, or in other words, perform transparent transmission processing on the OTN frame.

[0108] In this way, by investing in a single optical module or DSP solution, the device manufacturer can apply it to the Figure 3 line - side optical module in the shown scenario (referred to as scenario 1) and Figure 2 the line - side optical module in the shown scenario (referred to as scenario 3).

[0109] In Figure 2 the shown OTN device, assuming that the framer integrated on the line board is electrically connected to the pins of the slot on the line board through the traces in the line board, and the SerDes can be connected to the SerDes of the framer by mating the gold fingers to the slot.

[0110] The optical module can be applied not only to OTN devices but also to optical devices in non - OTN (referred to as non - OTN optical devices). For example Figure 7 as shown, the non - OTN optical device can be a forwarding device, such as a switch / router. The host of the forwarding device is connected to multiple optical modules, and a multiplexer / demultiplexer board and an optical amplifier board can also be set on the optical paths of the multiple optical modules. The forwarding device has a colored - light interface, and the external service interface can be a switch. The optical module can be a colored - light module (such as a coherent optical module). Optionally, a single optical module can be connected to the host. Correspondingly, a multiplexer / demultiplexer board may not be set on the optical path of the optical module. The optical module can be a gray - light module. Or, although the optical module is applied to an OTN device, it is not used to process OTN frames. In order to apply the Figure 5-1 shown optical module to such a scenario (referred to as scenario 4) where OTN frame processing is not required, optionally, Figure 5-1 the DSP shown may also integrate a functional module 4. The functional module 4 is used to perform other data processing except for OTN frame processing, or in other words, perform transparent transmission processing on the OTN frame. The control unit is used to control the service processing unit to use the functional module 4 to process data when the Figure 5-1 shown optical module is applied to scenario 4.

[0111] In this way, by investing in a single optical module or DSP solution, the device manufacturer can apply it to the Figure 3 line - side optical module in the shown scenario (referred to as scenario 1) and Figure 7 the line - side optical module in the shown scenario (referred to as scenario 4).

[0112] In Figure 7In the forwarding device with an optical interface shown, it is assumed that the forwarding device is electrically connected to the pins of the slot on the PCB through the traces in the Figure 7 shown PCB, and the SerDes in the optical module can be connected to the SerDes of the forwarding device by mating and installing the gold fingers in the slot.

[0113] Figure 5-1 The division of the described modules or units is only a logical function division, and there may be other division methods in actual implementation. For example, the logic circuits for implementing different functional modules may be different. Or, for example, the logic circuits for implementing different functional modules may all be the same or part of them may be the same. That is to say, the DCP may include at least one shared logic circuit, and this shared logic circuit can be used to implement part or all of the functions of multiple functional modules. In this way, it is beneficial to reduce the logic scale of the DSP, reduce the size of the optical module, and improve the integration degree of the device.

[0114] Figure 8-1 Schematically shows another possible implementation manner of the service processing unit shown in Figure 5-1 As shown in Figure 8-1 shown, the service processing unit may include a client-side processing subunit, a line-side processing subunit, a line frame processing subunit, a line-side mapping subunit, and a client-side mapping subunit.

[0115] Figure 8-1 Each subunit in all or part of the subunits shown may include multiple functional units. Figure 8-2 Schematically shows the functional units enabled by the service processing unit in the downlink data transmission direction. Figure 8-3 Schematically shows the functional units enabled by the service processing unit in the uplink data transmission direction.

[0116] When the optical module is applied to Scenario 1, the control unit can control the service processing unit to use the client-side processing subunit, the line frame processing subunit, the line-side mapping subunit, and the line-side processing subunit to process data. For example, after receiving an electrical signal from the SerDes, the client-side processing subunit recovers the cross data unit from the electrical signal. The line frame processing subunit can process the cross data unit according to the interface protocol with the electrical cross-connect board. For example, it demaps the cross data unit into ODUk. The line-side mapping subunit maps and / or multiplexes the ODUk into FlexO. The line-side processing subunit performs framing processing on the FlexO to obtain a digital electrical signal, and then sends the digital electrical signal to the Figure 5-1 shown optical port digital signal processing unit. In Scenario 1, the optical module is directly connected to the electrical cross-connect board, and can support optical data unit cross-connect services and electrical layer protection applications.

[0117] Next, in combination with Figure 8-2Describe the processing procedure performed by the service processing unit on the data in the downlink data transmission direction in Scenario 1.

[0118] The SDSIF unit can receive an electrical signal (or Serdes input / output data) from SerDes and process the data, including at least one of spatial division cross-connection, 1588 timestamp extraction, and clock domain conversion.

[0119] The physical medium attachment (PMA)_RX unit can perform at least one of the following processes on the data processed by the SDSIF unit: distribution scheduling, AM locking, bit reordering (MSB / LSB), bit width conversion, and clock domain isolation processing.

[0120] The Reed-Solomon Forward Error Correction (RSFEC) unit can perform RS FEC decoding on the data processed by the PMA_RX unit.

[0121] The physical coding sublayer (PCS)_RX unit can perform cross-board interface transmission direction processing on the data decoded by the RSFEC unit, including at least one of byte / CRC reordering, 64 / 66B encoding, scrambling, interface adaptation, and cross-connection.

[0122] The egress share memory (ESM) unit can process the cells inserted by the electrical cross-connect board during the framing of the cross-data unit. The format of the cross-data unit is not limited in this application. For example, the cross-data unit can be a data structure defined by the next generation switch fabric (NGSF) protocol. The cross-data unit can include a 16-byte control cell and 192 bytes or 384 bytes of data. The ESM unit can support the insertion of control cells defined by the NGSF protocol by the electrical cross-connect board and support functions such as cyclic redundancy check (CRC) addition to the cell header and CRC8 error correction.

[0123] The EBM unit can perform downlink caching processing based on the cells processed by the ESM and support at least one of sorting, OTN service delay symmetry processing, in-board multicast, and service bandwidth exception protection.

[0124] The OTN2SMDMP unit can support the demapping process from the cross-connect data unit to the OTN frame, for example, obtaining ODUk. Or rather, it can restore the cross-connect data unit to ODUk. Among them, the cross-connect data unit can also be called the section monitor (SM) cell.

[0125] The ODU_RX unit can perform WTT reception processing on ODUk. For example, it can have at least one of the functions such as framing, descrambling, overhead extraction, maintenance signal insertion, TCMi clearing, and test signal detection.

[0126] The SWITCH unit can perform cross-connect processing on the ODUk after being processed by ODU_RX and support loopback.

[0127] The LODU unit can perform WTT transmission processing on low-order ODUk / ODUCn. For example, it can have at least one of the functions such as header insertion and tracking, overhead insertion (from OHP), maintenance signal insertion, delay measurement, and test signal insertion.

[0128] The ODUCnMP unit can map low-order ODUk to line high-order ODUCn and perform WTT transmission processing on high-order ODUCn. For example, it can have at least one of the functions such as header insertion and tracking, overhead insertion (from OHP), maintenance signal insertion, delay measurement, and test signal insertion. For example, it can perform ODUCn processing in the line-side transmission direction, such as including at least one of OA11 insertion, AIS insertion, LS scrambling, and ODU scrambling.

[0129] The FLEXOM unit can complete the mapping of ODUC to FLEXO.

[0130] The line-side processing subunit can complete the framing process of the downstream data (such as FLEXO). After that, the line-side processing subunit can send the obtained digital electrical signal to the optical port digital signal processing unit. The line-side processing subunit can also be called the FLEXF unit.

[0131] Next, combined with Figure 8-3 introduce the processing process performed by the service processing unit on the data in the upstream data transmission direction in Scenario 1.

[0132] The FLEXODF unit and the FLEXODM unit can perform at least one of the processing such as FlexO overhead monitoring, demapping to ODUCn, ODUCn framing, and deskew. For example, the FLEXODF unit can receive the digital electrical signal from the optical port digital signal processing unit, perform deframing (or framing) processing on the digital electrical signal, and obtain the upstream data (such as FLEXO). The FLEXODM unit can demap FLEXO to ODUC.

[0133] The ODUCnDMP unit can perform line - side receive - direction ODUCn processing on ODUC, including at least one of ODUC / 1 - 50 framing, LS descrambling, ODU descrambling, OA11 extraction, AIS detection, and ODUCn alignment; perform WTT receive processing on high - order line ODUCn, such as at least one of framing, descrambling, overhead extraction (output to OHP), maintenance signal insertion, TCMi clearing, and test signal detection, etc.

[0134] The LODUDMP unit can perform WTT receive processing on low - order ODUCn, such as at least one of framing, descrambling, overhead extraction (output to OHP), maintenance signal insertion, TCMi clearing, and test signal detection, etc.

[0135] Optionally, the ODUCnDMP unit can also perform line demapping processing, for example, demapping ODUcn to ODUk / ODUflex. Correspondingly, the LODUDMP unit can perform WTT receive processing on low - order ODUk / ODUflex.

[0136] The SWITCH unit can perform cross - connection processing on ODUk / flex and support loopback.

[0137] The ODU_TX unit can perform WTT transmit processing on ODUk / ODUflex processed by the SWITCH unit, such as at least one of header insertion and tracking, overhead insertion, maintenance signal insertion, delay measurement, and test signal insertion.

[0138] The OTN2SMDMP unit can support OTN - to - SM cell mapping processing.

[0139] The IBM unit can perform uplink buffering processing, such as supporting at least one of OTN data buffering, scheduled bandwidth supervision, abnormal protection of service bandwidth, and time - scale processing, etc.

[0140] The ingress share memory (ISM) unit can perform cross - data - unit framing processing and insert cells into the cross - data unit. The format of the cross - data unit is not limited in this application. For example, the cross - data unit can be a data structure defined by the NGSF protocol. The cross - data unit can include a 16 - byte (byte) control cell and 192 - byte or 384 - byte data. The ISM unit can support inserting control cells defined by the NGSF protocol and support functions such as adding cell - header Cyclic Redundancy Check (CRC) and CRC8 error correction.

[0141] The PCS_TX unit can perform interface transmission direction processing on the data processed by the ISM unit, including at least one of byte / CRC reordering, 6466B encoding, scrambling, interface adaptation, and cross-connection.

[0142] The RSFEC_TX unit can perform RSFEC encoding on the data processed by the PCS_TX unit.

[0143] The PMA_TX unit can perform at least one of distribution scheduling, AM unlocking, bit reordering (MSB / LSB), bit width conversion, and clock domain isolation processing on the data encoded by the RSFEC_TX unit.

[0144] The SDSIF unit can perform Serdes input / output data processing on the data processed by the PMA_TX unit, including at least one of space division cross-connection, 1588 timestamp extraction, and clock domain conversion. After that, the SDSIF unit can send the obtained data to the SerDes.

[0145] When the optical module is applied to Scenario 2, the control unit can control the service processing unit to process data using the client-side processing subunit, client-side mapping subunit, line-side mapping subunit, and line-side processing subunit. For example, after the client-side processing subunit receives the electrical signal from the SerDes, it recovers the service data from the electrical signal. The client-side mapping subunit maps the service data to ODUk. The line-side mapping subunit maps and / or multiplexes ODUk into FlexO. The line-side processing subunit performs framing processing on FlexO to obtain a digital electrical signal, and then sends the digital electrical signal to Figure 5-1 the optical port digital signal processing unit shown. The specific functions of the client-side processing subunit and the line-side processing subunit can refer to the relevant descriptions above and will not be elaborated here. In Scenario 2, the client side can be docked with switches / routers / third-party OTN devices, etc. through standardized gray optical modules such as quad small form-factor pluggable (QSFP) 28 / QSFP-DD. The client side can support the access of 100GE / flexible ethernet (FlexE), 200GE / FlexE, 400GE / FlexE, 800GE, and future 1.6TE, 3.2TE, etc. ethernet services, and can also support the mixed access of the above services, and can also support the access of OTU4 and client-side FlexO, and can support the ethernet (ETH) / FlexE high-precision 1588 feature. The line side can support FlexO output and support mapping and / or demapping such as GMP / BMP.

[0146] When the optical module is applied to Scenario 3, the control unit can control the service processing unit to use the client-side processing subunit and the line-side processing subunit to process data. For example, the line-side processing subunit is docked with the optical port digital signal processing unit. After the client-side processing subunit receives the electrical signal sent by the framing chip through SerDes, it recovers FlexO from the electrical signal. The line-side processing subunit performs framing processing on FlexO to obtain a digital electrical signal, and then sends the digital electrical signal to Figure 5-1 the optical port digital signal processing unit shown. It is equivalent to the service processing unit performing transparent transmission on FlexO. The specific functions of the client-side processing subunit and the line-side processing subunit can refer to the relevant descriptions above and will not be elaborated here. In Scenario 3, the client-side processing subunit is docked with Figure 2 the framing chip shown, and the interface can use a fiberoptic interface connector (FOIC) interface. The FOIC interface is used to adapt to a multi-channel parallel interface. For example, it can split the scrambled FlexO frame into 4 logical signals and transmit them through 4 parallel physical links. The line-side processing subunit is docked with the optical port digital signal processing unit.

[0147] When the optical module is applied to Scenario 4, the control unit can control the service processing unit to use the client-side processing subunit and the line-side processing subunit to process data. For example, after the client-side processing subunit receives the electrical signal from SerDes, it recovers FlexO-zr from the electrical signal. Among them, "zr" is the abbreviation of "Ze best range", indicating that the longest distance is 80 km. The line-side processing subunit performs framing processing on FlexO-zr to obtain a digital electrical signal, and then sends the digital electrical signal to Figure 5-1 the optical port digital signal processing unit shown. The specific functions of the client-side processing subunit and the line-side processing subunit can refer to the relevant descriptions above and will not be elaborated here.

[0148] Figure 5-1 The functional module shown may include more or fewer subunits than Figure 8-1 shown. For example, Figure 5-1 in addition to including the client-side processing subunit and the line-side processing subunit, the functional module 3 shown may also include a data regeneration subunit (refer to the Figure 8-1 dashed box shown). The data regeneration subunit is used to demap and / or demultiplex the FlexO obtained by the client-side processing subunit into ODUCn, and then map and / or multiplex ODUCn into FlexO. Optionally, the data regeneration subunit can also be used to monitor the overhead of the FlexO obtained by the client-side processing subunit and process the ODUCn obtained by demapping and / or demultiplexing.

[0149] ThroughFigure 8-1 From the implementation method of the service processing unit, it can be seen that Figure 5-1 For the function modules 1 to 4 shown, the customer-side processing sub-unit and the line-side processing sub-unit can be shared to process data. Function modules 1 and 2 also share the line-side mapping sub-unit. That is to say, based on the DSP solution of the line-side optical module shown Figure 6 , only by adding a line frame processing sub-unit, it is possible to integrate the line frame processing sub-unit and the line-side mapping sub-unit in the DSP, so as to realize the direct connection between the optical module and the electrical cross-connect board and complete the corresponding service transmission with the electrical cross-connect board. The framer can no longer be additionally set in the line board. Since the size of the circuit used to implement the line frame processing sub-unit is much smaller than that of the framer, for example, less than 10% of the logic units are added. Therefore, when adding a line frame processing sub-unit to the DSP chip, the increased size of the DSP chip is much smaller than that of the framer. In this way, it is beneficial to further save the layout and heat dissipation space on the line board, improve the integration degree of the line board, and ensure heat dissipation. By designing a single optical module to support multiple application scenarios, the function of the line-side framer can be integrated only by adding 10% of the logic gates, which greatly reduces the system power consumption and chip cost.

[0150] Figure 8-4 Another implementation method of the line frame processing sub-unit is schematically shown. As Figure 8-4 shown, the line frame processing sub-unit includes an ISM unit, an IBM unit, a buffer management data mapper (BMDM) unit, a BPWTT unit, an ESM unit, and an EBM unit.

[0151] After the line frame processing sub-unit receives the downlink data from the customer-side processing sub-unit, the ESM unit, the EBM unit, the BMDM unit, and the BPWTT unit can process the downlink data in sequence. Among them, the processing of the downlink data by the ESM unit and the EBM unit can refer to the relevant introduction in the previous text. The ESM unit can complete the downlink processing of the data transmission protocol, and the EBM unit can complete the downlink (from the cross-connect board direction) caching, which is used to cache ODU / SDH / OSU Cell and realize sorting caching, bandwidth supervision, and three-level multicast processing. The BMDM unit can recover the ODU unit from the cross data unit. For example, it can include the OTN2SMDMP unit introduced in the previous text. The BPWTT unit can complete the overhead processing of ODUk. For example, it can include at least one of the ODU_RX unit, the SWITCH unit, and the LODU unit introduced in the previous text.

[0152] After the line frame processing subunit receives the upstream data from the line side mapping subunit, the BPWTT unit, BMDM unit, IBM unit, and ISM unit can process the upstream data in sequence. Among them, the BPWTT unit can complete the overhead processing of ODUk. For example, it can include at least one of the LODUDMP unit, SWITCH unit, and ODU_TX unit introduced above. The BMDM unit can complete the slicing of ODU into cross data units. For example, it can include the OTN2SMDMP unit introduced above. The processing of the upstream data by the IBM unit and ISM unit can refer to the relevant introduction above. The IBM unit can be used to complete the upstream (towards the cross-connect board direction) buffering for buffering ODU / SDH / OSU units (cells), etc. The ISM unit can be used to complete the upstream processing of the data transmission protocol.

[0153] In Figure 3 In the OTN device shown, the upstream data transmission direction of the electrical port is from the optical module to the device (such as a framer or an electrical cross-connect board, etc.) connected by the electrical port, and the downstream data transmission direction of the electrical port is from the device (such as a framer or an electrical cross-connect board) connected by the electrical port to the optical module. As mentioned above, the downstream data transmission direction of the DSP refers to the data transmission direction from the SerDes to the optical device, and the upstream data transmission direction of the DSP refers to the data transmission direction from the optical device to the SerDes. Upstream data refers to the data transmitted along the upstream data transmission direction, and downstream data refers to the data transmitted along the downstream data transmission direction.

[0154] The specific functions and the specific data processing processes of the above-mentioned subunits and / or units can refer to the relevant content of the OTN interface standard G709 published by the Telecommunication Standardization Sector of the International Telecommunication Union (ITU-T).

[0155] The present application does not limit the error correction technology used by the service processing unit. Reed-Solomon forward error correction (RSFEC) is only taken as an example. The present application does not limit the type of cross-data unit received by the line frame processing subunit in the downlink data transmission direction, nor does it limit the type of cross-data unit sent by it in the uplink data transmission direction. The foregoing takes the cross-data unit as the data structure defined by the NGSF protocol as an example. The present application does not limit the type of service data received by the client-side mapping subunit in the downlink data transmission direction, nor does it limit the type of service data output in the uplink data transmission direction. The present application does not limit the type of OTN frame received by the line-side mapping subunit in the downlink data transmission direction, nor does it limit the type of OTN frame sent by it in the uplink data transmission direction. The foregoing takes the OTN frame as ODUk as an example. The present application does not limit the specific process or path of multiplexing and / or mapping of the OTN frame performed by the line-side mapping subunit in the downlink data transmission direction, nor does it limit the specific process or path of demultiplexing and / or demapping of the OTN frame performed by the line-side mapping subunit in the uplink data transmission direction. For example, the line-side mapping unit performs the above process of the OTN frame by using at least one of a generic mapping procedure (GMP), a bit-synchronous mapping procedure (BMP), and an asynchronous mapping procedure (AMP). The present application does not limit the type of OTN frame output by the line-side mapping subunit in the downlink data transmission direction, nor does it limit the type of OTN frame received by it in the uplink data transmission direction. The foregoing takes the OTN frame as data in the FlexO format as an example.

[0156] In different application scenarios, the service processing units in the DSP generally involve different service processing methods, and different service processing methods generally need to cooperate with different SerDes rates to be implemented. Compared with integrating multiple SerDes with different rates in the DSP, the present application proposes to integrate a SerDes with adjustable rate in the DSP, which is beneficial for the SerDes in the DSP to transmit data at different data transmission rates in different application scenarios. Optionally, the control unit can control the SerDes to transmit data at the rate required by the application scenario with the connected device. For example, in scenario 1, the control unit can control the SerDes to transmit data at rate 1 with the electrical cross-connect board; in scenario 2, the control unit can control the SerDes to transmit data at rate 2 with the service-side optical module; in scenario 3, the control unit can control the SerDes to transmit data at rate 3 with the framer on the circuit board; in scenario 4, the control unit can control the SerDes to transmit data at rate 4 with the forwarding device.

[0157] The present application does not limit that the data transmission rates of the SerDes required for different application scenarios must be different. For example, rate 2 and rate 3 can be the same. However, as introduced above, Figure 3 the data transmission rate of the shown SerDes1 is generally greater than Figure 2 the data transmission rate of the shown SerDesb. Therefore, rate 1 is generally greater than rate 3. The present application can refer to rate 1 as the high rate, and rate 2 and rate 3 as the low rates respectively.

[0158] The present application does not limit the implementation manner of the rate-adjustable SerDes. Figure 9 Schematically shows a possible structure of the SerDes. As Figure 9 described, the SerDes can include an M frequency divider, a K frequency divider, an N frequency divider, a phase-frequency detector (PFD), a charge pump, a wideband voltage controlled oscillator (VCO), and a SerDes core.

[0159] Among them, the M-frequency divider is used to divide the input signal by M, and the frequency of the output signal is 1 / M of the frequency of the input signal. M is a positive integer. The N-frequency divider is used to divide the carrier signal generated by the wideband VCO by N, and N is a positive integer. The PFD is used to compare the differences in frequency and / or phase between the output signal of the M-frequency divider and the output signal of the N-frequency divider, and output an error signal, which can indicate the magnitude of the difference in the form of voltage. The charge pump is used to generate and output a control signal according to the error signal, and the voltage magnitude of the control signal is related to the voltage magnitude of the error signal. The wideband VCO is used to generate a carrier signal under the control of the control signal output by the charge pump. The carrier signal is, for example, a sine signal, and the frequency magnitude of the carrier signal is related to the voltage magnitude of the control signal. The K-frequency divider is used to divide the carrier signal output by the wideband VCO by K, and K is a positive integer. The carrier signal output by the K-frequency divider can be used as a reference electrical signal (or clock electrical signal), and the SerDes core is used to transmit a serial electrical signal based on the reference electrical signal and the data to be transmitted. The transmission rate of the serial electrical signal by the SerDes core is related to the frequency of the reference electrical signal. Therefore, the control unit can adjust the data transmission rate of the SerDes core by adjusting at least one of M, N, and K.

[0160] As introduced above, the control unit can control the service processing unit to process data using the function module corresponding to the application scenario, and can also control the SerDes to transmit data at the rate required by the application scenario. And, as introduced above, the optical module provided in this application can be installed on various types of motherboards. For example, in Scenario 1 and Scenario 3, the gold fingers of the optical module can be installed in the slots on the circuit board. In Scenario 2, the gold fingers of the optical module can be installed in the slots on the branch-line combined board. In Scenario 3, the gold fingers of the optical module can be installed in the slots on the optical interface PCB. As Figure 5-1 shown, the control unit can connect one or more pins in the gold fingers. For the sake of easy distinction, this application refers to this one or more pins as configuration pins. After the optical module is connected to the motherboard through the gold fingers, the control unit can receive the configuration signal fed back by the motherboard through the configuration pins. The configuration signals fed back by the motherboard to the control unit through the configuration pins can be different in different scenarios. The configuration signal is used to instruct the control unit to control the function module used by the service processing unit, and can also instruct the control unit to control the data transmission rate used by the SerDes.

[0161] For example, when Figure 5-1 the optical module shown is installed on the Figure 3 shown circuit board through the gold fingers, the circuit board can feed back the configuration signal 1 to the control unit through the configuration pins in the gold fingers. The control unit can control the service processing unit to process data using the function module 1 according to the configuration signal 1, and can also control the SerDes to transmit data at the rate 1. WhenFigure 5-1 When the optical module shown is installed on the Figure 6 branch-line combined board shown, the branch-line combined board can feedback a configuration signal 2 to the control unit through the configuration pins in the gold fingers. The control unit can control the service processing unit to use the function module 2 to process data according to the configuration signal 2, and can also control the SerDes to transmit data at rate 2. When Figure 5-1 the optical module shown is installed on the Figure 2 circuit board shown, the circuit board can feedback a configuration signal 3 to the control unit through the configuration pins in the gold fingers. The control unit can control the service processing unit to use the function module 3 to process data according to the configuration signal 3, and can also control the SerDes to transmit data at rate 3. When Figure 5-1 the optical module shown is installed on the Figure 7 optical interface PCB shown, the optical interface PCB can feedback a configuration signal 4 to the control unit through the configuration pins in the gold fingers. The control unit can control the service processing unit to use the function module 4 to process data according to the configuration signal 4, and can also control the SerDes to transmit data at rate 4.

[0162] As Figure 5-1 shown, a module central processor can also be set in the optical module. The module central processor is respectively connected to the control unit and one or more pins (referred to as control pins) in the gold fingers. The module central processor can communicate with the main board through the control pins and configure the DSP. For example, after the optical module is connected to the main board through the gold fingers, the module central processor can receive the configuration information feedback sent by the main board through the control pins, and then send a configuration signal to the control unit based on the configuration information. The configuration signal is used to instruct the control unit to control the function module used by the service processing unit, and can also instruct the control unit to control the data transmission rate used by the SerDes. The configuration information feedback by the main board to the module central processor through the control pins can be different in different scenarios. Correspondingly, the module central processor can send different configuration signals to the control unit based on different configuration information.

[0163] For example, when Figure 5-1 the optical module shown is installed on the Figure 3 circuit board shown, the circuit board can send configuration information 1 to the module central processor through the control pins in the gold fingers. The module central processor sends a configuration signal 1 to the control unit based on the configuration information 1. When Figure 5-1 the optical module shown is installed on the Figure 6 branch-line combined board shown, the branch-line combined board can send configuration information 2 to the module central processor through the control pins in the gold fingers. The module central processor sends a configuration signal 2 to the control unit based on the configuration information 2. When Figure 5-1The optical module shown is installed on the Figure 2 circuit board shown through a gold finger. The circuit board can send configuration information 3 to the module central processor through the control pins in the gold finger, and the module central processor sends a configuration signal 3 to the control unit based on the configuration information 1. When Figure 5-1 the optical module shown is installed on the Figure 7 optical interface PCB shown through a gold finger, the optical interface PCB can send configuration information 4 to the module central processor through the control pins in the gold finger, and the module central processor sends a configuration signal 4 to the control unit based on the configuration information 1. Among them, the functions of configuration signals 1 to 4 can be understood with reference to the relevant content introduced above. The logic levels of configuration signals 1 to 4 can be referred to as shown in Table 1.

[0164] Table 1

[0165]

[0166] The module central processor can communicate with the motherboard by executing the code stored in the memory and send a control signal to the control unit based on the configuration information received from the motherboard, so as to realize the configuration of the DSP. Therefore, this control method for the DSP can also be called a software control method. And the control unit directly receives the configuration signal fed back by the motherboard through the configuration pins in the gold finger, so as to realize the configuration of the DSP. This control method for the DSP can also be called a control method of hardware pins.

[0167] In Scenario 2, when the service-side optical module docked with the optical module provided by the present application is an LPO, in the Serdes design of the optical module provided by the present application, through register configuration, equalization and / or pre-emphasis adaptive adaptation can be performed when communicating with the Serdes of the docked LPO, so as to optimize the transmission capacity when docking with the LPO optical module to the greatest extent. For example, the Serdes of the DSP enables an equalizer and / or a pre-emphasis device to perform pre-emphasis processing on the electrical signal sent to the LPO and perform equalization processing on the electrical signal received from the LPO. Equalization is proposed with the goal of overcoming intersymbol interference and generally has two basic approaches, namely frequency-domain equalization and time-domain equalization. Pre-emphasis is a signal processing technology mainly used to improve the signal-to-noise ratio of electrical signals. By compensating the high-frequency components of the input signal at the sending end, the attenuation suffered by the high-frequency signal due to line and equipment limitations during transmission can be reduced.

[0168] Previously, the optical module provided by the present application was used as an example for being set in an OTN device. Optionally, the optical module provided by the present application can also be used for being set in a wavelength division multiplexing (WDM) device.

[0169] The circuit board, branch board, combined branch line board, electrical cross-connect board, etc. mentioned in this application can be replaced by circuit unit, branch unit, combined branch line unit, and electrical cross-connect unit (or cross-connect unit) respectively.

[0170] The following combines Figure 10 , and introduces the data transmission method in Scenario 1 by way of example. Scenario 1 can be application scenarios such as long-haul OTN or metro OTN. As Figure 10 shown, Scenario 1 includes OTN device s1 and OTN device r1, and OTN device s1 and OTN device r1 can transmit service data through OTN frames. The optical module provided in this application can be installed on the circuit board as the core component of the circuit board. This method can include S1001 to S1009.

[0171] S1001. The gray optical module s1 receives the optical signal carrying the service data;

[0172] The gray optical module s1 can receive the optical signal carrying the service data. This application does not limit the type of service data. As introduced above, the service data can include at least one of synchronous digital hierarchy (SDH) data, synchronous transfer module (STM)-N data, Ethernet data, asynchronous transfer mode (ATM) data, and internet protocol (IP) data.

[0173] S1002. The gray optical module s1 converts the optical signal into an electrical signal carrying the service data, and sends the electrical signal to the framer s1;

[0174] After receiving the optical signal, the gray optical module s1 can perform optoelectronic conversion on the optical signal to obtain an electrical signal, and send the service data to the framer s1 through the electrical signal.

[0175] S1003. The framer s1 receives the electrical signal, maps the service data carried by the electrical signal to obtain an optical data unit, and sends the optical data unit to the electrical cross-connect board s1;

[0176] The framer s1 can receive the electrical signal, frame the electrical signal to obtain the service data, map the service data to an optical data unit, and then send the optical data unit to the electrical cross-connect board s1.

[0177] Optionally, the gray optical module s1 in the branch board s1 can be replaced by an electrical interface, and the framer s1 can receive the electrical signal carrying the service data through the electrical interface. Correspondingly, this method may not include S1001 and S1002.

[0178] S1004. The electrical cross-connect board s1 performs cross-connection scheduling on the optical data unit, encapsulates the optical data unit into a cross-connection data unit, and sends the cross-connection data unit to the coherent optical module s1.

[0179] After receiving the optical data unit, the electrical cross-connect board s1 can perform cross-connection scheduling on it. Suppose the output port selected by the electrical cross-connect board s1 for the optical data unit is directly connected to the coherent optical module s1 on the circuit board s1. The electrical cross-connect board s1 can encapsulate the optical data unit into a cross-connection data unit and then send the cross-connection data unit to the coherent optical module s1.

[0180] S1005. The coherent optical module s1 unpacks the cross-connection data unit to obtain the optical data unit, maps and / or multiplexes the unpacked optical data unit into an optical transmission unit, and sends the optical signal carrying the optical transmission unit through an optical connector.

[0181] The coherent optical module s1 can receive the electrical signal carrying the cross-connection data unit through its own electrical connector. The coherent optical module s1 can receive the cross-connection data unit, unpack the cross-connection data unit to obtain the optical data unit, map and / or multiplex the unpacked optical data unit into an optical transmission unit, and then frame the optical transmission unit to obtain an electrical signal. This process can be understood by referring to the relevant content of functional module 1 introduced above. For example, the process of the optical module receiving the cross-connection data unit can be understood by referring to the relevant descriptions of the client-side processing subunit or the client-side processing subunit and SerDes above, the process of the optical module unpacking the cross-connection data unit to obtain the optical data unit can be understood by referring to the relevant descriptions of the line frame processing subunit above, the process of the optical module mapping and / or multiplexing the unpacked optical data unit into an optical transmission unit can be understood by referring to the relevant descriptions of the line-side mapping subunit above, and the process of the optical module framing the optical transmission unit to obtain an electrical signal can be understood by referring to the relevant descriptions of the line-side processing subunit above.

[0182] After that, the coherent optical module s1 processes the obtained electrical signal. This process can be understood by referring to the relevant descriptions of the optical port digital signal processing unit and / or DAC above.

[0183] After that, the coherent optical module s1 can perform electro-optical conversion on the processed electrical signal to obtain an optical signal and send the optical signal through an optical connector. This process can be understood by referring to the relevant descriptions of the optical transmitter above.

[0184] S1006. The coherent optical module r1 converts the optical signal into an electrical signal, demaps and / or demultiplexes the optical transmission unit carried by the electrical signal into an optical data unit, encapsulates the optical data unit into a cross-connection data unit, and sends the cross-connection data unit to the electrical cross-connect board r1.

[0185] The coherent optical module r1 can receive an optical signal through its own optical connector and convert the optical signal into an electrical signal. This process can be understood with reference to the relevant descriptions of the optical receiver in the previous text.

[0186] The coherent optical module r1 can process the electrical signal. This process can be understood with reference to the coherent content of the ADC and / or the optical port digital signal processing unit in the previous text.

[0187] After that, the coherent optical module r1 can frame the processed electrical signal to obtain an optical transport unit, demap and / or demultiplex the optical transport unit to obtain an optical data unit, encapsulate the obtained optical data unit to obtain a data frame, and send the obtained data frame through the electrical connector. This process can be understood with reference to the relevant descriptions of functional module 1 in the previous text. The process of the coherent optical module r1 framing the processed electrical signal to obtain an optical transport unit can be understood with reference to the relevant descriptions of the line-side processing subunit in the previous text. The process of the coherent optical module r1 demapping and / or demultiplexing the optical transport unit to obtain an optical data unit can be understood with reference to the relevant descriptions of the line-side mapping subunit in the previous text. The process of the coherent optical module r1 encapsulating the obtained optical data unit to obtain an electrical cross-connect unit can be understood with reference to the relevant descriptions of the line-frame processing subunit in the previous text. The process of the coherent optical module r1 sending the obtained data frame through the electrical connector can be understood with reference to the relevant descriptions of the client-side processing subunit or the client-side processing subunit and SerDes in the previous text.

[0188] S1007. The electrical cross-connect board r1 de-encapsulates the cross-connected data unit to obtain an optical data unit, performs cross-connection scheduling on the optical data unit, and sends the optical data unit to the framer r1.

[0189] After receiving the cross-connected data unit, the electrical cross-connect board r1 can de-encapsulate the cross-connected data unit to obtain an optical data unit and perform cross-connection scheduling on the optical data unit. Assuming that the output port selected by the electrical cross-connect board r1 for the optical data unit is connected to the framer r1 on the tributary board r1, the electrical cross-connect board r1 can send the optical data unit to the framer r1.

[0190] S1008. The framer r1 demaps the optical data unit to obtain service data, frames the service data to obtain an electrical signal, and sends the electrical signal to the gray optical module r1.

[0191] After receiving the optical data unit, the framer r1 can demap the optical data unit to obtain service data, frame the service data to obtain an electrical signal, and send the electrical signal to the gray optical module r1.

[0192] S1009. The gray optical module r1 converts the electrical signal into an optical signal carrying service data and emits the optical signal.

[0193] Optionally, the gray optical module r1 in the tributary board r1 can be replaced with an electrical interface, and the framer r1 can send an electrical signal carrying service data through the electrical interface. Correspondingly, this method may not include S1009.

[0194] As introduced above, Figure 10 the OTN device shown may not include a tributary board. For example, a network device serving as a core node may not have a tributary board. As introduced above, the OTN device can integrate more tributary boards and / or more line boards and / or more electrical cross-connect boards, and more optical modules can be integrated on the line board. For example, the OTN device can be as Figure 3 shown. The optical fiber link between the coherent optical module s1 and the coherent optical module r1 can include other optical transmission components in addition to the optical fiber, for example, it can also include an optical cross-connect unit. Figure 10 Taking the transmission of an optical transmission unit from the OTN device s1 to the OTN device r1 as an example, optionally, the OTN device r1 can also transmit an optical transmission unit to the OTN device s1. The OTN device s1 and the OTN device r1 can be Figure 1 any two OTN devices shown.

[0195] Next, in combination with Figure 11 , an example is given to introduce the data transmission method in Scenario 2. As Figure 11 shown, Scenario 2 includes a combined tributary and line board s2 and a combined tributary and line board r2, and the two can transmit service data through an OTN frame. Scenario 2 can be an application scenario such as metro DWDM or DC or DCI. As the core component of the combined tributary and line unit, the coherent module has a gray optical module or an LPO module as its external service interface. This method may include S1101 to S1105.

[0196] S1101. The gray optical module s2 receives an optical signal carrying service data;

[0197] Step S1101 can be understood by referring to step S1001 and will not be elaborated here.

[0198] S1102. The gray optical module s2 converts the optical signal into an electrical signal carrying the service data and sends the electrical signal to the coherent optical module s2;

[0199] After receiving the optical signal, the gray optical module s2 can perform optoelectronic conversion on the optical signal to obtain an electrical signal and send the service data to the coherent optical module s2 through the electrical signal.

[0200] Optionally, the gray optical module s2 in the combined tributary and line board s2 can be replaced with an electrical interface, and the coherent optical module s2 can receive an electrical signal carrying service data through the electrical interface. Correspondingly, this method may not include S1101 and S1102.

[0201] S1103. Coherent optical module s2 maps the data frame into an optical data unit, maps and / or multiplexes the obtained optical data unit into an optical transmission unit, and sends an optical signal carrying the optical transmission unit through an optical connector;

[0202] Coherent optical module s2 can receive an electrical signal carrying service data through its own electrical connector. Coherent optical module s2 can receive service data, map the service data into an optical data unit, map and / or multiplex the obtained optical data unit into an optical transmission unit, and frame the obtained optical transmission unit to obtain an electrical signal. This process can be understood with reference to the relevant content of functional module 2 introduced above. For example, the process of the optical module receiving service data can be understood with reference to the relevant descriptions of the client-side processing subunit or the client-side processing subunit and SerDes above, the process of the optical module mapping service data into an optical data unit can be understood with reference to the relevant descriptions of the client-side mapping subunit introduced above, the process of the optical module mapping and / or multiplexing the obtained optical data unit into an optical transmission unit can be understood with reference to the relevant content of the line-side mapping subunit introduced above, and the process of the optical module framing the obtained optical transmission unit to obtain an electrical signal can be understood with reference to the relevant content of the line-side processing subunit introduced above.

[0203] After the coherent optical module obtains an electrical signal, it can process the electrical signal. This process can be understood with reference to the relevant descriptions of the optical port digital signal processing unit and / or DAC above.

[0204] After that, coherent optical module s2 can perform electro-optical conversion on the processed electrical signal to obtain an optical signal, and send the optical signal through an optical connector. This process can be understood with reference to the relevant description of the optical transmitter above.

[0205] S1104. Coherent optical module r2 converts the optical signal into an electrical signal, demaps and / or demultiplexes the optical transmission unit carried by the electrical signal to obtain an optical data unit, demaps the obtained optical data unit into service data, and sends an electrical signal carrying the service data to gray optical module r2;

[0206] Coherent optical module r2 can receive an optical signal through its own optical connector and convert the optical signal into an electrical signal. This process can be understood with reference to the relevant description of the optical receiver above.

[0207] Coherent optical module r2 can process the electrical signal. This process can be understood with reference to the relevant content of ADC and / or the optical port digital signal processing unit above.

[0208] After that, the coherent optical module r2 can frame the processed electrical signal to obtain an optical transmission unit, demap and / or demultiplex the optical transmission unit to obtain an optical data unit, demap the obtained optical data unit into service data, and send the obtained service data through the electrical connector. This process can be understood by referring to the relevant description of functional module 2 above. The process of the coherent optical module r2 framing the processed electrical signal to obtain an optical transmission unit can be understood by referring to the relevant description of the line-side processing subunit above. The process of the coherent optical module r2 demapping and / or demultiplexing the optical transmission unit to obtain an optical data unit can be understood by referring to the relevant description of the line-side mapping subunit above. The process of the coherent optical module r2 encapsulating the obtained optical data unit to obtain service data can be understood by referring to the relevant description of the client-side mapping subunit above. The process of the coherent optical module r2 sending the obtained service data through the electrical connector can be understood by referring to the relevant description of the client-side processing subunit or the client-side processing subunit and SerDes above.

[0209] S1105. The gray optical module r2 converts the electrical signal into an optical signal carrying service data and emits the optical signal.

[0210] After receiving the electrical signal, the gray optical module r2 can perform electro-optical conversion on the electrical signal to obtain an optical signal carrying service data and emit the optical signal.

[0211] Optionally, the gray optical module r2 in the branch-line integrated board r2 can be replaced with an electrical interface, and the coherent optical module can send an electrical signal carrying service data through the electrical interface. Correspondingly, this method may not include S1105.

[0212] As introduced above, the branch-line integrated board can be integrated with other branch-line integrated boards in the same OTN device. For example, the OTN device can be as Figure 6 shown, and more optical modules can be integrated on the branch-line integrated board. Figure 11 Taking the branch-line integrated board s2 transmitting an optical transmission unit to the branch-line integrated board r2 as an example, optionally, the branch-line integrated board r2 can also transmit an optical transmission unit to the branch-line integrated board s2. The branch-line integrated board s2 and the branch-line integrated board r2 can be integrated in Figure 1 any two different OTN devices shown.

[0213] Next, in combination with Figure 12 , an example is given to introduce the data transmission method in Scenario 3. As Figure 12 described, this method may include S1201 to S1211.

[0214] S1201. The gray optical module s3 receives an optical signal carrying service data;

[0215] S1202. The gray optical module s3 converts the electrical signal into an electrical signal carrying the service data and sends the electrical signal to the framer s3.

[0216] S1203. The framer s3 frames the electrical signal to obtain the service data, maps the service data to obtain the optical data unit, and sends the optical data unit to the electrical cross-connect board s3.

[0217] S1204. The electrical cross-connect board s3 performs cross-scheduling on the optical data unit, encapsulates the optical data unit into a cross-data unit, and sends the cross-data unit to the framer s3.

[0218] S1201 to S1204 can be understood by referring to the relevant content of S1001 to S1004 introduced above and will not be elaborated here.

[0219] S1205. The framer s3 de-encapsulates the cross-data unit to obtain the optical data unit, maps and / or multiplexes the de-encapsulated optical data unit into an optical transmission unit, and sends the electrical signal carrying the optical transmission unit to the coherent optical module s3.

[0220] The framer s3 not only has the function of a tributary-side framer but also can have the function of a line-side framer. After receiving the electrical signal, the framer s3 can obtain the cross-data unit from the electrical signal, de-encapsulate the cross-data unit to obtain the optical data unit, map and / or multiplex the de-encapsulated optical data unit into an optical transmission unit, frame the obtained optical transmission unit to obtain the electrical signal, and send the electrical signal to the coherent optical module s3.

[0221] S1206. The coherent optical module s3 processes the electrical signal, converts the processed electrical signal into an optical signal, and sends the optical signal through the optical connector.

[0222] The coherent optical module s3 can receive the electrical signal carrying the optical transmission unit through its own electrical connector. The coherent optical module s3 can receive the optical transmission unit and frame the optical transmission unit to obtain the electrical signal. This process can be understood by referring to the relevant content of functional module 3 introduced above. For example, the process of the optical module receiving the cross-data unit can be understood by referring to the relevant descriptions of the client-side processing subunit or the client-side processing subunit and SerDes above, and the process of the optical module framing the optical transmission unit to obtain the electrical signal can be understood by referring to the relevant descriptions of the line-side processing subunit above.

[0223] After that, the coherent optical module s3 processes the obtained electrical signal, and this process can be understood by referring to the relevant descriptions of the optical port digital signal processing unit and / or DAC above.

[0224] After that, the coherent optical module s3 can perform electro-optical conversion on the processed electrical signal to obtain an optical signal, and send the optical signal through an optical connector. This process can be understood with reference to the relevant description of the optical transmitter above.

[0225] S1207. The coherent optical module r3 converts the optical signal into an electrical signal, processes the electrical signal, and sends it to the framer r3;

[0226] The coherent optical module r3 can receive the optical signal through its own optical connector and convert the optical signal into an electrical signal. This process can be understood with reference to the relevant description of the optical receiver above.

[0227] The coherent optical module r3 can process the electrical signal. This process can be understood with reference to the relevant content of the ADC and / or the optical port digital signal processing unit above.

[0228] After that, the coherent optical module r3 can frame the processed electrical signal to obtain an optical transmission unit, and send the obtained optical transmission unit through the electrical connector. This process can be understood with reference to the relevant description of functional module 3 above. The coherent optical module r3 framing the processed electrical signal to obtain an optical transmission unit can be understood with reference to the relevant description of the line-side processing subunit above. The coherent optical module r3 sending the obtained optical transmission unit through the electrical connector can be understood with reference to the relevant description of the client-side processing subunit or the client-side processing subunit and SerDes above.

[0229] S1208. The framer r3 demaps and / or demultiplexes the optical transmission unit carried by the electrical signal into optical data units, encapsulates the optical data units into cross data units, and sends the cross data units to the electrical cross-connect board r3;

[0230] After receiving the electrical signal, the framer r3 can frame the electrical signal to obtain an optical transmission unit, demap and / or demultiplex the optical transmission unit to obtain optical data units, encapsulate the obtained optical data units to obtain cross data units, and send the obtained cross data units through the electrical connector.

[0231] S1209. The electrical cross-connect board r3 de-encapsulates the cross data units to obtain optical data units, performs cross-scheduling on the optical data units, and sends the optical data units to the framer r3;

[0232] S1210. The framer r3 demaps the optical data units to obtain service data, frames the service data into an electrical signal, and sends the electrical signal to the gray optical module r3;

[0233] S1211. The gray optical module r3 converts the electrical signal into an optical signal carrying service data and emits the optical signal.

[0234] Steps S1209 to S1211 can be understood with reference to the relevant content of S1007 to S1009 introduced above.

[0235] Figures 10 to 12 The shown coherent optical module s and coherent optical module r can be replaced with other types of optical modules. That is to say, this application does not limit the use of optical module s and optical module r for transmitting coherent light. Coherent optical module s and coherent optical module r can be understood with reference to Figure 4-1 or Figure 5-1 the shown optical modules. The electrical connectors of coherent optical module s and coherent optical module can be understood with reference to Figure 5-1 the shown gold fingers. This application does not limit the type of electrical connectors. The optical fiber link between coherent optical module s and coherent optical module r can include other optical transmission components in addition to optical fibers. For example, it can also include an optical cross-connect unit.

[0236] Figure 11 The shown coherent optical module s2 and / or Figure 12 the shown coherent optical module s3 can be the same optical module as Figure 10 the shown coherent optical module s1. Taking Figure 10 the shown coherent optical module s1, Figure 11 the shown coherent optical module s2 and Figure 12 the shown coherent optical module s3 as the same optical module s as an example, as Figure 5-1 introduced, optionally, this optical module s can have a serializer / deserializer (SerDes). In Figure 10 the shown scenario 1, this SerDes can receive cross-data units at rate 1. In Figure 11 the shown scenario 2, this SerDes can receive service data at rate 2. In Figure 12 the shown scenario 3, this SerDes can receive optical transmission units at rate 3. Rates 1 to 3 can be referred to as shown in Table 1. Rate 1 can be greater than rate 2 and / or rate 3. Rates 2 and 3 can be the same or different.

[0237] Figure 11 The shown coherent optical module r2 and / or Figure 12 the shown coherent optical module r3 can be the same optical module as Figure 10 the shown coherent optical module r1. Taking Figure 10 the shown coherent optical module r1, Figure 11 the shown coherent optical module r2 and Figure 12 the shown coherent optical module r3 as the same optical module r as an example, as Figure 5-1 introduced, optionally, this optical module r can have a serializer / deserializer (SerDes). In Figure 10In the shown scenario 1, the SerDes can receive cross data units at rate 1. In Figure 11 In the shown scenario 2, the SerDes can receive service data at rate 2. In Figure 12 In the shown scenario 3, the SerDes can receive optical transmission units at rate 3. Rates 1 to 3 can be referred to as shown in Table 1. Rate 1 can be greater than rate 2 and / or rate 3, and rate 2 and rate 3 can be the same or different.

[0238] The following describes how optical module r and / or optical module s determine their own application scenarios. As introduced above, the optical module can receive a configuration signal. When the configuration signal is configuration signal 1 (for example, the logic level is "00"), the optical module can determine that it is applied to scenario 1, that is, installed on the circuit board and its electrical connector is directly connected to the electrical cross-connect board, and enable the Figure 5-1 shown functional module 1 during the execution of S1005; when the configuration signal is configuration signal 2 (for example, the logic level is "01"), the optical module can determine that it is applied to scenario 2, that is, installed on the combined branch and line board, and enable the Figure 5-1 shown functional module 2 during the execution of S1003; when the configuration signal is configuration signal 3 (for example, the logic level is "10"), the optical module can determine that it is applied to scenario 3, that is, installed on the circuit board and its electrical connector is directly connected to the framer on the circuit board, and enable the Figure 5-1 shown functional module 3 during the execution of S1206.

[0239] As introduced above, optionally, as Figure 5-1 shown, the optical module may further include a controller such as a module central processor. The controller is used to send the configuration signal to the DSP; and / or, the DSP is directly connected to the configuration pins of the electrical connector, and the configuration pins are used to receive the configuration signal.

[0240] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described systems, devices, and units can refer to the corresponding processes in the foregoing method examples and will not be elaborated herein. The "A and / or B" involved in the examples of this application can be understood to include both "A and B" and "A or B" these two scenarios. The terms "first", "second", etc. in the description, claims, and drawings of this application are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances, which is only a way of distinguishing objects with the same attributes when describing the examples of this application.

[0241] In several examples provided in this application, it should be understood that the disclosed modules, devices, or equipment can be implemented in other ways. For example, the device examples described above are merely illustrative. For instance, the above division of units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling, direct coupling, or communication connection between each other can be through some interfaces. The indirect coupling or communication connection of devices or units can be in electrical or other forms.

[0242] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments or equivalently replace some of the technical features. However, such modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optical module, characterized in that, It includes an optical connector, an optical device, a digital signal processor (DSP), and an electrical connector; The DSP is used to receive a data frame through the electrical connector, and when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, it unpacks the data frame to obtain an optical data unit, maps and / or multiplexes the obtained optical data unit into an optical transmission unit, and frames the obtained optical transmission unit to obtain an electrical signal; The DSP is also used to process the obtained electrical signal; The optical device is used to convert the processed electrical signal into an optical signal and send the optical signal through the optical connector.

2. The optical module according to claim 1, wherein The DSP is used to map the data frame into an optical data unit when the optical module is installed on a combined branch and line board, map and / or multiplex the obtained optical data unit into an optical transmission unit, and frame the obtained optical transmission unit to obtain an electrical signal; and / or The DSP is used to frame the data frame to obtain an electrical signal when the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board. The framer is used to unpack the cross data unit sent by the electrical cross-connect board to obtain an optical data unit, map and / or multiplex the obtained optical data unit into an optical transmission unit, and send the obtained optical transmission unit to the electrical connector.

3. The optical module according to claim 2, wherein A serializer / deserializer (SerDes) is integrated in the DSP; The SerDes is used to receive the data frame at a first data transmission rate when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board; The SerDes is used to receive the data frame at a second data transmission rate when the optical module is installed on a combined branch and line board, and / or when the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board; wherein, the first data transmission rate is greater than the second data transmission rate.

4. The optical module according to claim 3, wherein The SerDes is used to receive the data frame using an equalizer when the optical module is installed on a combined branch and line board and the electrical connector is directly connected to a linear drive pluggable optical module (LPO).

5. The optical module according to any one of claims 2-4, characterized in that, The DSP is also used to receive a configuration signal; When the configuration signal is at a first logic level, the DSP determines that the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board; When the configuration signal is at a second logic level, the DSP determines that the optical module is installed on a combined branch and line board, and / or the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board.

6. The optical module according to claim 5, wherein The optical module further includes a controller, and the controller is used to send the configuration signal to the DSP; and / or The DSP is directly connected to the configuration pin of the electrical connector, and the configuration pin is used to receive the configuration signal.

7. The optical module according to any one of claims 1-6, characterized in that, The DSP is used to perform equalization processing and / or digital-to-analog conversion on the obtained electrical signal.

8. An optical module, characterized in that, It includes an optical connector, an optical device, a digital signal processor (DSP), and an electrical connector; The optical device is used to receive an optical signal through the optical connector and convert the optical signal into an electrical signal; The DSP is used to process the electrical signal; The DSP is also used to frame the electrical signal to obtain an optical transmission unit. When the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, the optical transmission unit is de-mapped and / or de-multiplexed to obtain an optical data unit, and the obtained optical data unit is encapsulated to obtain a data frame, and the obtained data frame is sent through the electrical connector.

9. The optical module according to claim 8, wherein The DSP is also used to, when the optical module is installed on a combined branch and line board, de-map and / or de-multiplex the optical transmission unit to obtain an optical data unit, de-map the obtained optical data unit into a data frame, and send the obtained data frame through the electrical connector; and / or, The DSP is also used to, when the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board, send the optical transmission unit through the electrical connector, where the framer is used to de-map and / or de-multiplex the optical transmission unit into an optical data unit, encapsulate the obtained optical data unit into a cross data unit, and send the cross data unit to the electrical cross-connect board.

10. The optical module according to claim 9, wherein A serializer / deserializer SerDes is integrated in the DSP; The SerDes is used to send the obtained data frame at a first data transmission rate when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board; The SerDes is used to send the obtained data frame at a second data transmission rate when the electrical connector is installed on a combined branch and line board, and / or, when the electrical connector is installed on a circuit board and is directly connected to a framer on the circuit board; Wherein, the first data transmission rate is greater than the second data transmission rate.

11. The optical module according to claim 10, wherein, The SerDes is used to send the obtained data frame using a pre-emphasis when the optical module is installed on a combined branch and line board and the electrical connector is directly connected to a linear drive pluggable optical module LPO.

12. The optical module according to any one of claims 9-11, characterized in that, The DSP is also used to receive a configuration signal; When the configuration signal is at a first logic level, the DSP determines that the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board; When the configuration signal is at a second logic level, the DSP determines that the optical module is installed on a combined branch and line board, and / or, the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board.

13. The optical module according to claim 12, characterized in that, The optical module further includes a controller, and the controller is used to send the configuration signal to the DSP; and / or, The DSP is directly connected to a configuration pin of the electrical connector, and the configuration pin is used to receive the configuration signal.

14. The optical module according to any one of claims 8-13, characterized in that, The DSP is used to perform equalization processing and / or analog-to-digital conversion on the electrical signal.

15. The optical module according to any one of claims 1-14, characterized in that, The optical signal is a coherent optical signal.

16. A communication device, characterized in that, The communication device includes a main board and one or more optical modules installed on the main board, and the one or more optical modules are as described in any one of claims 1 to 15.

17. The communication device according to claim 16, characterized in that, The main board is a circuit board, the communication device further includes an electrical cross-connect board, and the one or more optical modules are respectively directly connected to the electrical cross-connect board.

18. A communication system, characterized in that, The communication system includes a plurality of communication devices and an optical transmission network, and the optical transmission network is used to transmit optical signals between different communication devices among the plurality of communication devices. Moreover, the plurality of communication devices includes at least one communication device as described in claim 16 or 17.

19. A data transmission method, characterized in that, The method is applied to an optical module, and the method includes: Receiving a data frame through an electrical connector of the optical module; When the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, unpacking the data frame to obtain an optical data unit, mapping and / or multiplexing the unpacked optical data unit into an optical transmission unit, and framing the obtained optical transmission unit to obtain an electrical signal; Processing the obtained electrical signal, and the processed electrical signal is used to be converted into an optical signal, and the optical signal is used to be sent out through an optical connector of the optical module.

20. The method according to claim 19, wherein The method further includes: When the optical module is installed on a combined branch and line board, mapping the data frame into an optical data unit, mapping and / or multiplexing the mapped optical data unit into an optical transmission unit, and framing the obtained optical transmission unit to obtain an electrical signal; and / or, When the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board, framing the data frame to obtain an electrical signal, where the framer is used to unpack a cross data unit sent by an electrical cross-connect board to obtain an optical data unit, map and / or multiplex the obtained optical data unit into an optical transmission unit, and send the obtained optical transmission unit to the electrical connector.

21. The method according to claim 20, wherein The optical module has a serializer / deserializer (SerDes), and the receiving the data frame through the electrical connector of the optical module includes: When the optical module is installed on a circuit board and the optical module is directly connected to an electrical cross-connect board, controlling the SerDes to receive the data frame at a first data transmission rate; When the optical module is installed on a combined branch and line board, and / or, the optical module is installed on a circuit board and the optical module is directly connected to a framer on the circuit board, controlling the SerDes to receive the data frame at a second data transmission rate; Wherein, the first data transmission rate is greater than the second data transmission rate.

22. The method according to claim 21, wherein, The receiving the data frame through the electrical connector of the optical module includes: When the optical module is installed on a combined branch and line board and the electrical connector is directly connected to a linear drive pluggable optical module (LPO), controlling the SerDes to receive the data frame using an equalizer.

23. The method according to claims 20-22, characterized in that, The method further includes: Receiving a configuration signal; When the configuration signal is at a first logic level, determining that the optical module is installed on a circuit board and the optical module is directly connected to an electrical cross-connect board; When the configuration signal is at a second logic level, determining that the optical module is installed on a combined branch and line board, and / or, the optical module is installed on a circuit board and the optical module is directly connected to a framer on the circuit board.

24. The method according to any one of claims 19 - 23, characterized in that, The processing the obtained electrical signal includes: Performing equalization processing and / or digital-to-analog conversion on the obtained electrical signal.

25. A data transmission method, characterized in that, The method is applied to an optical module, and the method includes: Process an electrical signal, where the electrical signal is obtained by performing optoelectronic conversion on an optical signal, and the optical signal is received through an optical connector of the optical module; Perform framing on the electrical signal to obtain an optical transmission unit; When the optical module is installed on a circuit board and the electrical connector of the optical module is directly connected to an electrical cross-connect board, demap and / or demultiplex the optical transmission unit to obtain an optical data unit, encapsulate the obtained optical data unit into a data frame, and send the obtained data frame through the electrical connector.

26. The method according to claim 25, wherein The method further includes: When the optical module is installed on a combined branch and line board, demap and / or demultiplex the optical transmission unit to obtain an optical data unit, demap the obtained optical data unit into a data frame, and send the obtained data frame through the electrical connector; and / or, When the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board, send the optical transmission unit through the electrical connector, where the framer is configured to demap and / or demultiplex the optical transmission unit into an optical data unit, encapsulate the obtained optical data unit into a cross data unit, and send the cross data unit to the electrical cross-connect board.

27. The method according to claim 26, wherein A serializer / deserializer (SerDes) is integrated in the optical module, and the data frame sent through the electrical connector includes: When the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, control the SerDes to send the obtained data frame using a first data transmission rate; When the electrical connector is installed on a combined branch and line board, and / or, the electrical connector is installed on a circuit board and is directly connected to a framer on the circuit board, control the SerDes to send the obtained data frame using a second data transmission rate; Wherein, the first data transmission rate is greater than the second data transmission rate.

28. The method according to claim 27, wherein The data frame sent through the electrical connector includes: When the optical module is installed on a combined branch and line board and the electrical connector is directly connected to a linear drive pluggable optical module (LPO), control the SerDes to send the obtained data frame using a pre-emphasis device.

29. The method according to any one of claims 26 - 28, characterized in that, The method further includes: Receive a configuration signal; When the configuration signal is at a first logic level, determine that the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board; When the configuration signal is at a second logic level, determine that the optical module is installed on a combined branch and line board, and / or, the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board.

30. The method according to any one of claims 25-29, characterized in that, The processing of the electrical signal includes: Perform equalization processing and / or analog-to-digital conversion on the electrical signal.

31. A chip, characterized in that, The chip is configured to be integrated in the optical module, and the chip includes a plurality of circuits, and at least one of the plurality of circuits is configured to execute the method according to any one of claims 19 to 30.

Images