Display device and manufacturing method thereof

Abstract

The present disclosure relates to a display device and a method of manufacturing the same, in which the display device according to an embodiment of the present disclosure may include: a substrate including a display area on which a plurality of sub-pixels are disposed and a non-display area outside the display area; a circuit unit disposed on the substrate and disposed in the non-display area; a protection layer disposed on the circuit unit; an outer coating layer disposed on the protective layer; a common electrode extending from the display area to the non-display area and disposed on the overcoat layer; an inorganic encapsulation layer extending from the display area to the non-display area and disposed on the top and side surfaces of the common electrode; a first protrusion protruding from the substrate, positioned further outward than the common electrode, and having a first eave portion; a second protrusion protruding from the substrate, located between the first protrusion and the display area, and having a second eave portion; and a first separation inorganic layer disposed on the first protrusion, the first separation inorganic layer including the same material as the inorganic encapsulation layer, and being separated from the inorganic encapsulation layer.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2024 - 0013632, filed on January 30, 2024, which is incorporated herein by reference in its entirety for all purposes as if fully set forth herein. Technical field

[0003] Embodiments of the present disclosure relate to a display device and a method of manufacturing the same. Background art

[0004] With the development of the information society, the demand for display devices for displaying images in various forms has been continuously increasing, and in recent years, various display devices such as liquid crystal display devices (or liquid crystal displays) and organic light - emitting display devices have been used.

[0005] The display panel of a display device may include a display area for displaying an image and a non - display area for not displaying an image. For various reasons, there is an increasing need to reduce the size of the non - display area (also referred to as the "bezel") of the display panel. However, various structures, circuits, and lines may be placed on the bezel of the display panel, making it difficult to reduce the size of the bezel of the display panel.

[0006] In addition, the bezel of the display panel may be an area with a high probability of moisture or oxygen penetration. Therefore, if the size of the bezel is reduced, the probability of moisture or oxygen penetration may increase accordingly. Summary of the invention

[0007] Embodiments of the present disclosure may provide a display device having a structure with a narrow bezel and robust reliability (or robustness of high reliability) and a method of manufacturing the same.

[0008] Embodiments of the present disclosure may provide a display device having a structure conducive to achieving a narrow bezel and a method of manufacturing the same.

[0009] Embodiments of the present disclosure may provide a display device having a structure capable of preventing cracks from spreading in the encapsulation layer within the display panel and a method of manufacturing the same.

[0010] Embodiments of the present disclosure may provide a display device having a structure capable of preventing penetration of external substances such as moisture or oxygen and a method of manufacturing the same.

[0011] Embodiments of the present disclosure may provide a display device having a structure capable of preventing external substances introduced into the interior from diffusing into the display area and a method of manufacturing the same

[0012] Embodiments of the present disclosure may provide a display device having a structure capable of preventing image abnormalities caused by external substances introduced therein and a method of manufacturing the same.

[0013] A display device according to an embodiment of the present disclosure may include: a substrate including a display area on which a plurality of sub-pixels are disposed and a non-display area outside the display area; a circuit unit disposed on the substrate and in the non-display area; a protective layer disposed on the circuit unit; an outer coating disposed on the protective layer; a common electrode extending from the display area to the non-display area and disposed on the outer coating; an inorganic encapsulation layer extending from the display area to the non-display area and disposed on the top and side of the common electrode; a first undercut structure area and a second undercut structure area in the non-display area (the first undercut structure area is positioned further away from the display area than the second undercut structure area); a first protrusion protruding from the substrate in the first undercut structure area, positioned further outward than the common electrode, and having a first eaves portion; a second protrusion protruding from the substrate in the second undercut structure area, positioned between the first protrusion and the display area, and having a second eaves portion; and a first separated inorganic layer disposed on the first protrusion, including the same material as (or formed of the same material as) the inorganic encapsulation layer and separated from the inorganic encapsulation layer.

[0014] The inorganic encapsulation layer may be disconnected around the first protrusion and may not be disconnected around the second protrusion.

[0015] A first thickness of the inorganic encapsulation layer around the first protrusion may be less than a second thickness of the inorganic encapsulation layer around the second protrusion.

[0016] The first eaves portion may have a larger size than the second eaves portion.

[0017] A method of manufacturing a display device according to an embodiment of the present disclosure may include: a basic step of forming a first bottom metal on the substrate in the first undercut structure area, forming a second bottom metal on the substrate in the second undercut structure area, forming a protective layer on the first bottom metal and the second bottom metal, and forming an outer coating on the protective layer; and a heterogeneous protrusion forming step of forming a first protrusion inside a first trench of the outer coating in the first undercut structure area and forming a second protrusion inside a second trench of the outer coating in the second undercut structure area.

[0018] The first protrusion may include: a first base metal formed by reducing the first bottom metal; a first bottom insulating layer disposed on the first base metal and having a lower surface (or rear surface) whose area is larger than the upper surface of the first base metal and including the same material as (or formed of the same material as) the protective layer; and a first top insulating layer disposed on the first bottom insulating layer and including the same material as (or formed of the same material as) the outer coating.

[0019] The second protrusion may include: a second base metal corresponding to the second bottom metal; a second bottom insulating layer located on the second base metal and including the same material as (or formed of the same material as) the protective layer; and a second top insulating layer located on the second bottom insulating layer and having a lower surface (or rear surface) whose area is larger than the upper surface of the second bottom insulating layer and including the same material as (or formed of the same material as) the outer coating.

[0020] The substrate may be divided into a display area where an image is displayed and a non-display area outside the display area. The first undercut structure area and the second undercut structure area may be included in the non-display area, and the first undercut structure area may be positioned farther from the display area than the second undercut structure area.

[0021] According to an embodiment of the present disclosure, a display device having a structure with a narrow border and robust reliability and a manufacturing method thereof may be provided.

[0022] According to an embodiment of the present disclosure, a display device having a structure conducive to achieving a narrow border and a manufacturing method thereof may be provided.

[0023] According to an embodiment of the present disclosure, a display device having a structure capable of preventing cracks from spreading in the encapsulation layer within the display panel and a manufacturing method thereof may be provided.

[0024] According to an embodiment of the present disclosure, a display device having a structure capable of preventing penetration of external substances such as moisture or oxygen and a manufacturing method thereof may be provided.

[0025] According to an embodiment of the present disclosure, a display device having a structure capable of preventing external substances introduced into the interior from diffusing into the display area and a manufacturing method thereof may be provided.

[0026] According to an embodiment of the present disclosure, a display device having a structure capable of preventing image abnormalities caused by external substances introduced into the interior and a manufacturing method thereof may be provided.

[0027] According to an embodiment of the present disclosure, it is possible to reduce the weight of the display device by having an extremely narrow border structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a system configuration diagram of a display device according to an embodiment of the present disclosure.

[0029] Figure 2 Shows a display panel according to an embodiment of the present disclosure.

[0030] Figure 3 Shows an example of system implementation of a display device according to an embodiment of the present disclosure.

[0031] Figure 4 is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0032] Figure 5 Shows the shading (or shadow) phenomenon of the inorganic encapsulation layer of the display panel according to an embodiment of the present disclosure.

[0033] Figure 6 is a graph for explaining image abnormalities of a display panel according to an embodiment of the present disclosure.

[0034] Figure 7 is a cross-sectional view of a display panel having a narrow border and robust reliability according to an embodiment of the present disclosure.

[0035] Figure 8 is a detailed cross-sectional view of a first undercut structure area in a display panel having a narrow border and robust reliability according to an embodiment of the present disclosure.

[0036] Figure 9 is a detailed cross-sectional view of a second undercut structure area in a display panel having a narrow border and robust reliability according to an embodiment of the present disclosure.

[0037] Figure 10 More specifically shows a circuit unit in a display panel according to an embodiment of the present disclosure.

[0038] Figures 11A to 11E Shows a first undercut process (or technique) in a display panel according to an embodiment of the present disclosure.

[0039] Figures 12A to 12H Shows a second undercut process (or technique) in a display panel according to an embodiment of the present disclosure. Detailed Description of the Invention

[0040] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. When assigning reference numerals to components (or constituent elements) of the respective drawings, even when the same components are shown in different drawings, the same reference numerals may be assigned thereto. When it is determined that the subject matter of the present disclosure is unclear, details of known technologies or functions may be skipped (or omitted). As used herein, when a component "comprises (or includes)", "has" another component or "consists of" another component, unless a component "only" comprises, has another component or consists of another component, other components may be added to the component. As used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0041] Expressions such as "first", "second", "A", "B", "(a)", and "(b)" may be used to describe components of the present disclosure. These expressions are provided merely to distinguish one component from another, and the nature, order, or quantity of the components is not limited by these expressions.

[0042] When describing the positional relationship between components, when two or more components are described as "connected", "coupled", or "linked", the two or more components may be directly "connected", "coupled", or "linked", or another component may be inserted therebetween. Here, the other component may include one or more (i.e., one or more) of the two or more components that are "connected", "coupled", or "linked" to each other.

[0043] When using terms such as "after", "next", and "before" to describe the temporal flow relationship related to components, operation methods, and manufacturing methods, unless the term "immediately" or "directly" is used, it may include a non - continuous relationship.

[0044] When a component is assigned a value or its corresponding information (e.g., level), the value or corresponding information may be interpreted as including tolerances that may arise due to various factors (e.g., process factors, internal or external influences, or noise).

[0045] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0046] Figure 1 is a system configuration diagram of a display device 100 according to an embodiment of the present disclosure.

[0047] Reference Figure 1 , a display device 100 according to an embodiment of the present disclosure may include a display panel 110 and a driving circuit for driving the display panel 110.

[0048] The driving circuit may include a data driving circuit 120 and a gate driving circuit 130, and may further include a controller 140 for controlling the data driving circuit 120 and the gate driving circuit 130.

[0049] The display panel 110 may include a substrate SUB and signal lines such as a plurality of data lines DL and a plurality of gate lines GL provided on the substrate SUB. The display panel 110 may include a plurality of sub - pixels SP connected to the plurality of data lines DL and the plurality of gate lines GL.

[0050] The display panel 110 may include a display area DA for displaying an image and a non-display area NDA for not displaying an image. In the display panel 110, a plurality of sub-pixels SP for displaying an image may be provided in the display area DA. In the non-display area NDA, a driving circuit (e.g., a data driving circuit 120, a gate driving circuit 130, and a controller 140) may be electrically connected, or a driving circuit (e.g., a data driving circuit 120, a gate driving circuit 130, and a controller 140) may be installed, and a pad portion may be provided, to which an integrated circuit or a printed circuit may be connected.

[0051] The data driving circuit 120 is a circuit for driving a plurality of data lines DL, and may output data signals to the plurality of data lines DL.

[0052] The gate driving circuit 130 is a circuit for driving a plurality of gate lines GL, and may output gate signals to the plurality of gate lines GL.

[0053] The controller 140 may supply a data control signal DCS to the data driving circuit 120 to control the operation timing of the data driving circuit 120, and may supply a gate control signal GCS to the gate driving circuit 130 to control the operation timing of the gate driving circuit 130.

[0054] The controller 140 may start scanning according to the timing implemented in each frame, may convert the input image data input from the outside into a data signal format adapted for use in the data driving circuit 120, and may supply the converted image data to the data driving circuit 120 and control the data driving at an appropriate time according to the scanning.

[0055] In addition to the input image data from the outside (e.g., the host system 150), the controller 140 may also receive various timing signals, including a vertical synchronization signal VSYNC, a horizontal synchronization signal HSYNC, an input data enable signal DE, and a clock signal CLK.

[0056] To control the data driving circuit 120 and the gate driving circuit 130, the controller 140 may receive timing signals such as a vertical synchronization signal VSYNC, a horizontal synchronization signal HSYNC, an input data enable signal DE, and a clock signal CLK, and generate various control signals (e.g., a data control signal DCS and a gate control signal GCS) and output them to the data driving circuit 120 and the gate driving circuit 130.

[0057] For example, the controller 140 may output various gate control signals GCS, which include a gate start (or start) pulse GSP, a gate shift clock GSC, and a gate output enable signal GOE, to control the gate driving circuit 130.

[0058] In addition, to control the data driving circuit 120, the controller 140 may output various data control signals DCS, including a source start (or initiation) pulse SSP, a source sampling clock SSC, and a source output enable signal SOE.

[0059] The controller 140 may be implemented as a component separate from the data driving circuit 120, or may be integrated with the data driving circuit 120 and implemented as an integrated circuit.

[0060] The data driving circuit 120 may receive image data Data from the controller 140 and supply data voltages to a plurality of data lines DL, thereby driving the plurality of data lines DL. Here, the data driving circuit 120 may also be referred to as a source driving circuit.

[0061] The data driving circuit 120 may include one or more source driver integrated circuits SDIC.

[0062] Each source driver integrated circuit SDIC may include a shift register, a latch circuit, a digital-to-analog converter DAC, and an output buffer. In some cases, each source driver integrated circuit SDIC may further include an analog-to-digital converter ADC.

[0063] For example, each source driver integrated circuit SDIC may be connected to the display panel 110 using a tape automated bonding (TAB) method, or may be connected to the (bonding) pads of the display panel 110 using a chip on glass (COG) or chip on panel (COP) method, or may be implemented to be connected to the display panel 110 using a chip on film (COF) method.

[0064] The gate driving circuit 130 may output a gate signal with a conductive level voltage or a gate signal with a non-conductive level voltage according to the control of the controller 140. The gate driving circuit 130 may sequentially drive a plurality of gate lines GL by sequentially supplying gate signals with a conductive level voltage to the plurality of gate lines GL.

[0065] The gate driving circuit 130 may be connected to the display panel 110 using a tape automated bonding (TAB) method, or may be connected to the bonding pads of the display panel 110 using a chip on glass (COG) or chip on panel (COP) method, or may be connected to the display panel 110 using a chip on film (COF) method. Alternatively, the gate driving circuit 130 may be of the gate in panel (GIP) type and may be formed in the non-display area NDA of the display panel 110. The gate driving circuit 130 may be disposed on the substrate SUB or connected to the substrate SUB. That is, if the gate driving circuit 130 is of the GIP type, it may be disposed in the non-display area NDA of the substrate SUB. In the case of the chip on glass (COG) type, the chip on film (COF) type, etc., the gate driving circuit 130 may be connected to the substrate SUB.

[0066] Meanwhile, at least one of the data driving circuit 120 and the gate driving circuit 130 may be disposed in the display area DA.

[0067] For example, the gate driving circuit 130 may be disposed in the display area DA. In this case, the gate driving circuit 130 may be disposed over the entire display area DA, or only disposed in a part of the display area DA. The gate driving circuit 130 may be disposed so as not to overlap with the sub-pixels SP, or may be disposed so as to partially or entirely overlap with the sub-pixels SP.

[0068] As another example, the data driving circuit 120 may be disposed in the display area DA. In this case, the data driving circuit 120 may be disposed throughout the display area DA, or only disposed in a part of the display area DA. The data driving circuit 120 may be disposed so as not to overlap with the sub-pixels SP, or may be disposed so as to partially or entirely overlap with the sub-pixels SP.

[0069] When a specific gate line GL is selected by the gate driving circuit 130, the data driving circuit 120 may convert the image data Data received from the controller 140 into an analog data voltage and supply it to the plurality of data lines DL.

[0070] The data driving circuit 120 may be connected to one side (e.g., the upper side or the lower side) of the display panel 110. Depending on the driving method or the panel design method, the data driving circuit 120 may be connected to both sides (e.g., the upper side and the lower side) of the display panel 110, or may be connected to two or more sides among the four sides of the display panel 110.

[0071] The gate driving circuit 130 may be connected to one side (e.g., the left side or the right side) of the display panel 110. Depending on the driving method or the panel design method, the gate driving circuit 130 may be connected to both sides (e.g., the left side and the right side) of the display panel 110, or may be connected to two or more sides among the four sides of the display panel 110.

[0072] The controller 140 may be a timing controller used in typical display technologies, or may be a control device capable of further performing other control functions including a timing controller, or may be a control device different from the timing controller (in other words, may be a control device other than the timing controller), or may be a circuit within the control device. The controller 140 may be implemented using various circuits or electronic components such as an integrated circuit (IC), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), or a processor.

[0073] The controller 140 may be mounted on a printed circuit board, a flexible printed circuit, etc., and may be electrically connected to the data driving circuit 120 and the gate driving circuit 130 through a printed circuit board, a flexible printed circuit, etc.

[0074] The controller 140 may transmit / receive signals to / from the data driving circuit 120 using one or more predetermined interfaces. For example, the interface may include a low voltage differential signaling (LVDS) interface, an embedded clock point-to-point interface (EPI) interface, or a serial peripheral interface (SPI).

[0075] The controller 140 may include a storage medium such as one or more registers.

[0076] The display device 100 according to an embodiment of the present disclosure may be a display device in which the display panel 110 itself cannot emit light. For example, the display device 100 according to an embodiment of the present disclosure may be a liquid crystal display device including a backlight unit.

[0077] Alternatively, the display device 100 according to an embodiment of the present disclosure may be a self-emitting display device in which the display panel 110 itself can emit light. For example, the display device 100 according to an embodiment of the present disclosure may be one of display devices including an organic light emitting diode (OLED) display device, a quantum dot display device (or quantum dot display), and a micro light emitting diode (Micro LED) display device.

[0078] If the display device 100 according to an embodiment of the present disclosure is an organic light-emitting diode display device, each sub-pixel SP may include an organic light-emitting diode that emits light by itself as a light-emitting device. If the display device 100 according to an embodiment of the present disclosure is a quantum dot display device, each sub-pixel SP may include a light-emitting element made of quantum dots, which are semiconductor crystals that emit light by themselves. If the display device 100 according to an embodiment of the present disclosure is a micro light-emitting diode display device, each sub-pixel SP may include a micro light-emitting diode as a light-emitting device, and the micro light-emitting diode emits light by itself and is made of an inorganic material.

[0079] Figure 2 A display panel 110 according to an embodiment of the present disclosure is shown.

[0080] Reference Figure 2 , the display panel 110 may include a substrate SUB and a encapsulation layer 200, where a plurality of sub-pixels SP are disposed on the substrate SUB, and the encapsulation layer 200 is disposed on the substrate SUB. Here, the encapsulation layer 200 may also be referred to as an encapsulation substrate or an encapsulation portion.

[0081] Reference Figure 2 , when the display device 100 according to an embodiment of the present disclosure is a self-emitting display device, each of the plurality of sub-pixels SP disposed on the substrate SUB may include a light-emitting device ED and a sub-pixel circuit SPC for driving the light-emitting device ED.

[0082] Reference Figure 2 , the sub-pixel circuit SPC may include a plurality of pixel driving transistors and at least one capacitor, which are used to drive the light-emitting device ED. In the present disclosure, the sub-pixel circuit SPC may drive the light-emitting device ED by supplying a driving current to the light-emitting device ED in a predetermined timing sequence. The light-emitting device ED may be driven by the driving current and emit light.

[0083] The plurality of pixel driving transistors may include a driving transistor DRT for driving the light-emitting device ED and a scanning transistor SCT that is turned on or off depending on a scan signal SC.

[0084] The driving transistor DRT may supply a driving current to the light-emitting device ED.

[0085] The scanning transistor SCT may be configured to control the electrical state of a corresponding node (e.g., the second node N2) in the sub-pixel circuit SPC or control the state or operation of the driving transistor DRT.

[0086] The at least one capacitor may include a storage capacitor Cst to maintain a constant voltage during one frame period.

[0087] To drive the sub-pixel SP, a data signal VDATA as an image signal and a scan signal SC as a gate signal may be applied to the sub-pixel SP. In addition, a common driving voltage including a first driving voltage VDD and a second driving voltage VSS may be applied to the sub-pixel SP to drive the sub-pixel SP.

[0088] The light-emitting device ED may include a pixel electrode PE, an intermediate layer EL, and a common electrode CE. The intermediate layer EL may be disposed between the pixel electrode PE and the common electrode CE.

[0089] In the case where the light-emitting device ED is an organic light-emitting device, the intermediate layer EL may include an emission layer EML and a common intermediate layer EL_COM. The common intermediate layer EL_COM may include a first common intermediate layer COM1 and a second common intermediate layer COM2. The first common intermediate layer COM1 may be disposed between the pixel electrode PE and the emission layer EML and may include at least one layer (e.g., an organic layer). The second common intermediate layer COM2 may be disposed between the emission layer EML and the common electrode CE and may include at least one layer (e.g., an organic layer).

[0090] For example, the emission layer EML may be disposed in each of the plurality of sub-pixels SP, or in another example, may be commonly disposed in the plurality of sub-pixels SP. The common intermediate layer EL_COM may be commonly disposed across the plurality of sub-pixels SP.

[0091] The emission layer EML may be disposed in each emission region, and the common intermediate layer EL_COM may be commonly disposed across a plurality of emission regions and non-emission regions.

[0092] The pixel electrode PE may be an electrode disposed in each sub-pixel SP, and the common electrode CE may be an electrode commonly disposed in the plurality of sub-pixels SP.

[0093] For example, the pixel electrode PE may be an anode, and the common electrode CE may be a cathode. As another example, the pixel electrode PE may be a cathode, and the common electrode CE may be an anode. Hereinafter, an example in which the pixel electrode PE is an anode and the common electrode CE is a cathode will be illustrated.

[0094] For example, the first common intermediate layer COM1 of the common intermediate layer EL_COM may include a hole injection layer HIL and a hole transport layer HTL, and the second common intermediate layer COM2 of the common intermediate layer EL_COM may include an electron transport layer ETL and an electron injection layer EIL.

[0095] The hole injection layer can inject holes from the pixel electrode PE into the hole transport layer, the hole transport layer can transport the holes to the emission layer EML, the electron injection layer can inject electrons from the common electrode CE into the electron transport layer, and the electron transport layer can transport the electrons to the emission layer EML.

[0096] For example, the common electrode CE can be electrically connected to the second driving voltage line VSSL. The second driving voltage VSS, which is a type of common driving voltage, can be applied to the common electrode CE through the second driving voltage line VSSL. The pixel electrode PE can be directly or indirectly (via another transistor) electrically connected to the first node N1 of the driving transistor DRT of each sub-pixel SP. In the present disclosure, the "second common driving voltage VSS" can also be referred to as the "base voltage VSS", and the "second common driving voltage line VSSL" can also be referred to as the "base voltage line VSSL".

[0097] Each light-emitting device ED can be composed of an overlapping portion of the pixel electrode PE, the emission layer EML in the intermediate layer EL, and the common electrode CE. A predetermined emission region can be formed by each light-emitting device ED. For example, the emission region of each light-emitting device ED can include an overlapping region of the pixel electrode PE, the emission layer EML in the intermediate layer EL, and the common electrode CE.

[0098] For example, the light-emitting device ED can be an organic light-emitting diode OLED, an inorganic light-emitting diode, or a quantum dot light-emitting device. For example, in the case where the light-emitting device ED is an organic light-emitting diode OLED, the intermediate layer EL in the light-emitting device ED can include an organic film containing an organic material.

[0099] The driving transistor DRT can be a driving transistor for supplying a driving current to the light-emitting device ED. The driving transistor DRT can be connected between the first driving voltage line VDDL and the light-emitting device ED.

[0100] The driving transistor DRT can include a first node N1, a second node N2, and a third node N3. The first node N1 can be electrically connected to the light-emitting device ED, the second node N2 can be applied with a data signal VDATA, and the third node N3 can be applied with a first common driving voltage VDD from the first common driving voltage line VDDL.

[0101] In the driving transistor DT, the second node N2 can be a gate node, the first node N1 can be a source node or a drain node, and the third node N3 can be a drain node or a source node. Hereinafter, for the sake of convenience of explanation, the case where the second node N2 in the driving transistor DRT is a gate node, the first node N1 is a source node, and the third node N3 is a drain node will be described.

[0102] Included in Figure 2 The scan transistor SCT in the sub-pixel circuit SPC shown can be a switching transistor for sending a data signal VDATA, which is an image signal, to a second node N2 that is a gate node of the driving transistor DRT.

[0103] The scan transistor SCT can be turned on and off by a scan signal SC (the scan signal SC is a gate signal applied through a scan line SCL that is a type of gate line GL), and can control the electrical connection between the second node N2 of the driving transistor DRT and the data line DL. The drain electrode or source electrode of the scan transistor SCT can be electrically connected to the data line DL, and the source electrode or drain electrode of the scan transistor SCT can be electrically connected to the second node N2 of the driving transistor DRT. The gate electrode of the scan transistor SCT can be electrically connected to the scan line SCL.

[0104] The storage capacitor Cst can be electrically connected between a first node N1 and a second node N2 of the driving transistor DRT. The storage capacitor Cst can include a first capacitor electrode electrically connected to the first node N1 of the driving transistor DRT or corresponding to the first node N1 of the driving transistor DRT, and a second capacitor electrode electrically connected to the second node N2 of the driving transistor DRT or corresponding to the second node N2 of the driving transistor DRT.

[0105] The storage capacitor Cst can be an external capacitor intentionally designed outside the driving transistor DRT, rather than a parasitic capacitor (e.g., Cgs, Cgd) that can exist as an internal capacitor between the first node N1 and the second node N2 of the driving transistor DRT.

[0106] Each of the driving transistor DRT and the scan transistor SCT can be an n-type transistor or a p-type transistor.

[0107] The display panel 110 can have a top emission structure or a bottom emission structure.

[0108] In the case where the display panel 110 has a top emission structure, at least a part of the sub-pixel circuit SPC can overlap at least a part of the light-emitting device in the vertical direction. Thus, the area of the emission region and the aperture ratio (or opening rate) can be increased.

[0109] If the display panel 110 has a bottom emission structure, the sub-pixel circuit SPC may not overlap the light-emitting device ED in the vertical direction.

[0110] Such as Figure 2As shown, the sub-pixel circuit SPC may have a 2T-1C structure including two transistors (i.e., a driving transistor DRT and a scanning transistor SCT) and one capacitor (i.e., a storage capacitor Cst). In some cases, the sub-pixel circuit SPC may further include one or more transistors or one or more capacitors.

[0111] Depending on the structure of the sub-pixel circuit SPC, the type and number of gate signals and / or gate lines supplied to the sub-pixel SP may be changed. In addition, depending on the structure of the sub-pixel circuit SPC, the type and number of common driving voltages supplied to the sub-pixel SP may be changed.

[0112] Since circuit elements within each sub-pixel SP (in particular, a light-emitting device ED implemented using an organic light-emitting diode OLED including an organic material) are vulnerable to external moisture or oxygen, a encapsulation layer 200 may be provided on the display panel 110 (more specifically, on the substrate SUB) to prevent oxygen from penetrating into the circuit elements (in particular, the light-emitting device ED). The encapsulation layer 200 may be configured in various shapes to prevent the light-emitting device ED from coming into contact with moisture or oxygen.

[0113] The display device 100 according to an embodiment of the present disclosure may have an extremely narrow bezel structure in which the non-display area NDA of the display panel 110 is very small.

[0114] Figure 3 An example of a system implementation of the display device 100 according to an embodiment of the present disclosure is shown.

[0115] Reference Figure 3 , the display panel 110 of the display device 100 may include a display area DA for displaying an image and a non-display area NDA for not displaying an image.

[0116] Reference Figure 3 , in the case where the data driving circuit 120 includes one or more source driver integrated circuits SDICs and is implemented by a chip on film (COF) method, each source driver integrated circuit SDIC may be mounted on a circuit film SF connected to the non-display area NDA of the display panel 110.

[0117] Reference Figure 3 , the gate driving circuit 130 may be implemented as a gate in panel (GIP) type. In this case, the gate driving circuit 130 may be formed in the non-display area NDA of the display panel 110. Different from Figure 3 , the gate driving circuit 130 may be implemented as a chip on film (COF) type.

[0118] For circuit connections between one or more source driver integrated circuits SDICs and other devices, the display device 100 may include at least one source printed circuit board SPCB and a control printed circuit board CPCB for mounting control components and various electrical devices (or equipment).

[0119] A film SF on which a source driver integrated circuit SDIC is mounted may be connected to at least one source printed circuit board SPCB. That is, one side of the film SF on which the source driver integrated circuit SDIC is mounted may be electrically connected to the display panel 110, and the other side of the film SF may be electrically connected to the source printed circuit board SPCB.

[0120] The controller 140 and the power management integrated circuit PMIC 310 may be mounted on the control printed circuit board CPCB. The controller 140 may perform overall control functions related to driving the display panel 110 and control the operations of the data driver circuit 120 and the gate driver circuit 130. The power management integrated circuit 310 may supply various voltages or currents to the data driver circuit 120 and the gate driver circuit 130, or control the various voltages or currents to be supplied.

[0121] At least one source printed circuit board SPCB and the control printed circuit board CPCB may be electrically connected through at least one connection cable CBL. Here, the connection cable CBL may be, for example, a flexible printed circuit FPC, a flexible flat cable FFC, etc.

[0122] At least one source printed circuit board SPCB and the control printed circuit board CPCB may be integrated and implemented as one printed circuit board.

[0123] The display device 100 according to an embodiment of the present disclosure may further include a level shifter 300 for adjusting a voltage level (or level). For example, the level shifter 300 may be provided on the control printed circuit board CPCB or the source printed circuit board SPCB.

[0124] In the display device 100 according to an embodiment of the present disclosure, the level shifter 300 may supply signals required for gate driving to the gate driver circuit 130. For example, the level shifter 300 may supply a plurality of clock signals (i.e., gate clock signals) to the gate driver circuit 130. Accordingly, the gate driver circuit 130 may generate a plurality of gate signals based on the plurality of gate clock signals input from the level shifter 300 and output the plurality of gate signals to a plurality of gate lines GL. Here, the plurality of gate lines GL may send the plurality of gate signals to sub-pixels SP provided in a display area DA of the display panel 110 (in other words, a substrate SUB).

[0125] Reference Figure 3, the non-display area NDA of the display panel 110 may include a gate border area GBZ, and the gate driving circuit 130 and its related lines are disposed at the gate border area GBZ.

[0126] Reference Figure 3 , in addition to the GIP type gate driving circuit 130, various lines required for the operation of the gate driving circuit 130 may need to be disposed in the gate border area GBZ. Here, the various lines required for the operation of the gate driving circuit 130 may include a plurality of gate clock lines, at least one high-level gate voltage line, and at least one low-level gate voltage line.

[0127] Hereinafter, the structure of the gate border area GBZ of the display panel 110 according to an embodiment of the present disclosure will be described.

[0128] Figure 4 is a cross-sectional view (or cross-sectional view) of the display panel 110 according to an embodiment of the present disclosure. However, Figure 4 the cross-sectional view shows the state before performing a scribing (scoring) process during the manufacturing process (or process) of the display panel 110.

[0129] Reference Figure 4 , the display panel 110 according to an embodiment of the present disclosure may include a substrate SUB, a circuit unit 410, an outer coating 430, a bank 440, an intermediate layer EL, a common electrode CE, and an inorganic encapsulation layer 460.

[0130] The circuit unit 410 may include a GIP type gate driving circuit 130.

[0131] The circuit unit 410 may be disposed on the substrate SUB and may be disposed in the gate border area GBZ within the non-display area NDA.

[0132] The outer coating 430 may be disposed on the circuit unit 410.

[0133] The bank 440 may be disposed on the outer coating 430.

[0134] The intermediate layer EL may be disposed on the bank 440 by extending from the display area DA to the non-display area NDA. The intermediate layer EL may overlap at least a part of the circuit unit 410 disposed in the gate border area GBZ within the non-display area NDA.

[0135] The common electrode CE may extend from the display area DA to the non-display area NDA and may be disposed on the intermediate layer EL. The common electrode CE may overlap at least a part of the circuit unit 410 disposed in the gate border area GBZ within the non-display area NDA.

[0136] The inorganic encapsulation layer 460 may be an inorganic layer included in the encapsulation layer 200. The inorganic encapsulation layer 460 may extend from the display area DA to the non-display area NDA and may be disposed on the common electrode CE. The inorganic encapsulation layer 460 may overlap at least a portion of the circuit unit 410 in the gate border area GBZ provided in the non-display area NDA. For example, the inorganic encapsulation layer 460 may include one or more (i.e., one or more kinds) of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0137] Reference Figure 4 , the display panel 110 according to an embodiment of the present disclosure may further include an adhesion (or adhesive) layer 470 and a metal encapsulation layer 480 on the adhesion layer 470. The encapsulation layer 200 may include the inorganic encapsulation layer 460, the adhesion layer 470, and the metal encapsulation layer 480.

[0138] Reference Figure 4 , the display panel 110 according to an embodiment of the present disclosure may further include a ground line 420 disposed further outward from the circuit unit 410.

[0139] Reference Figure 4 , the display panel 110 according to an embodiment of the present disclosure may further include a cover (or capping) layer 450 on the common electrode CE. The cover layer 450 may be considered a layer included in the encapsulation layer 200.

[0140] Reference Figure 4 , in the display panel 110 according to an embodiment of the present disclosure, the pixel area PA in the display area DA may be an area where sub-pixels SP are formed, and a plurality of signal lines, a plurality of transistors, a plurality of capacitors, and a plurality of pixel electrodes may be disposed in the pixel area PA. In addition, various metal layers and various insulating layers may be disposed in the pixel area PA to arrange the plurality of signal lines, the plurality of transistors, the plurality of capacitors, and the plurality of pixel electrodes.

[0141] For example, a plurality of transistors including a driving transistor DRT and a scanning transistor SCT and a plurality of storage capacitors Cst may be disposed in the pixel area PA. In addition, a plurality of signal lines including a plurality of data lines DL, a plurality of gate lines GL, and a plurality of first common driving voltage lines VDDL may be disposed in the pixel area PA.

[0142] Figure 5 is a graph for explaining the umbra (or shadow) phenomenon of the inorganic encapsulation layer 460 of the display panel 110 according to an embodiment of the present disclosure.

[0143] Reference Figure 5When depositing the inorganic encapsulation layer 460 during the manufacturing process of the display panel 110, as in Case 1, if the gap GAP between the deposition mask 500 and the substrate SUB is too small, there may be a problem that the common electrode CE is torn during or after the deposition process.

[0144] To prevent the tearing problem of the common electrode CE, as in Case 2, the deposition process of the inorganic encapsulation layer 460 can be performed by coating a floating metal bump (FME) 510 on the back surface of the deposition mask 500 to widen the gap GAP between the deposition mask 500 and the substrate SUB.

[0145] The minimum gap GAP between the deposition mask 500 and the substrate SUB to prevent the tearing of the common electrode CE can be greater than or equal to the threshold value determined for each type of display panel 110.

[0146] Reference Figure 5 When performing the deposition process of the inorganic encapsulation layer 460 as in Case 2, due to the widened gap GAP between the deposition mask 500 and the substrate SUB, the inorganic encapsulation layer 460 can be deposited further outward than the desired point.

[0147] In an embodiment of the present disclosure, the phenomenon that the inorganic encapsulation layer 460 extends further outward than the desired point may be referred to as the "shadow phenomenon of the inorganic encapsulation layer 460". In addition, the portion of the inorganic encapsulation layer 460 that extends further outward than the desired point may be referred to as the "shadow portion".

[0148] Due to the shadow phenomenon of the inorganic encapsulation layer 460, the bezel may become larger. That is, the shadow phenomenon of the inorganic encapsulation layer 460 may be a limiting factor for achieving a narrow bezel.

[0149] Figure 6 is a graph for explaining the image abnormality of the display panel 110 according to an embodiment of the present disclosure.

[0150] Reference Figure 6 The inventors of the present application analyzed the image abnormality phenomenon of the display panel 110 and found the reason through a large number of experiments and analyses. Therefore, it has been found that when external substances (such as moisture, oxygen, etc.) flow into the display panel 110 and reach a certain point, an abnormal image phenomenon occurs.

[0151] Reference Figure 6 External substances (such as moisture, oxygen, etc.) present in the atmosphere may flow into the display panel 110 through the adhesion layer 470.

[0152] Reference Figure 6, the external substances flowing into the display panel 110 may flow into the intermediate layer EL after reaching the point where the adhesion layer 470 and the intermediate layer EL are in contact with each other. The external substances introduced into the intermediate layer EL along the first movement path 610 may reach the display area DA. The movement path of these external substances may be referred to as the first movement path 610.

[0153] The external substances introduced into the intermediate layer EL along the first movement path 610 may oxidize the common electrode CE in contact with the intermediate layer EL. This phenomenon may continue to spread to various points within the display area DA and may be perceptible to the naked eye of the user.

[0154] Reference Figure 6 , the external substances introduced into the display panel 110 may reach the defective portion 600 of the common electrode CE along the adhesion layer 470. The movement path of these external substances may be referred to as the second movement path 620.

[0155] The external substances reaching the defective portion 600 of the common electrode CE along the second movement path 620 may oxidize the common electrode CE. This phenomenon may continue to spread to various points within the display area DA and may be perceptible to the naked eye.

[0156] The above-mentioned image abnormality caused by the inflow and internal movement of external substances may occur during the manufacturing process of the display panel 110, or may even occur after the manufacturing of the display panel 110 is completed.

[0157] Therefore, considering the shadowing phenomenon and the image abnormality phenomenon of the inorganic encapsulation layer 460, the display panel 110 according to an embodiment of the present disclosure may have a structure with a narrow border and robust reliability. Hereinafter, the structure of the narrow border and robust reliability of the display panel 110 according to an embodiment of the present disclosure will be described in detail.

[0158] Figure 7 is a cross-sectional view of the display panel 110 having a structure with a narrow border and robust reliability according to an embodiment of the present disclosure. However, hereinafter, the description of the same content as the Figure 4 cross-sectional view will be omitted, and the description will mainly focus on the content different from the Figure 4 cross-sectional view.

[0159] Reference Figure 7 , in the display panel 110 according to an embodiment of the present disclosure, the inorganic encapsulation layer 460 deposited according to the deposition process described in the reference Figure 5 may extend in the external region of the common electrode CE. The portion extending from the inorganic encapsulation layer 460 to the external region of the common electrode CE (i.e., a part of the inorganic encapsulation layer 460) may be referred to as the "shadow portion".

[0160] ReferenceFigure 7 According to an embodiment of the present disclosure, the display panel 110 may include a first undercut structure region UCA1 and a second undercut structure region UCA2 to prevent side effects caused by the shadow portion of the inorganic encapsulation layer 460 and prevent image abnormalities.

[0161] Side effects caused by the shadow portion of the inorganic encapsulation layer 460 may include bezel swelling due to the shadow portion of the inorganic encapsulation layer 460 and moisture diffusion due to cracks in the shadow portion of the inorganic encapsulation layer 460. Here, moisture diffusion due to cracks in the shadow portion of the inorganic encapsulation layer 460 may mean that moisture penetration due to cracks in the shadow portion of the inorganic encapsulation layer 460 deeply spreads or diffuses into other regions.

[0162] Reference Figure 7 The first undercut structure region UCA1 may be a region where a first protrusion 710 is formed inside a first groove of the outer coating 430. Here, the first protrusion 710 may also be referred to as a first tip (or apex).

[0163] By using the first undercut structure region UCA1, bezel swelling due to the shadow portion of the inorganic encapsulation layer 460 can be prevented, and moisture diffusion due to cracks in the shadow portion of the inorganic encapsulation layer 460 can be blocked.

[0164] Reference Figure 7 The second undercut structure region UCA2 may be a region where a second protrusion 720 is formed inside a second groove of the outer coating 430. Here, the second protrusion 720 may also be referred to as a second tip (or apex).

[0165] Due to the second undercut structure region UCA2, external substances (e.g., moisture, oxygen, etc.) flowing into the common electrode CE from the non-display region NDA can be prevented from spreading into the common electrode CE in the display region DA.

[0166] Reference Figure 7 According to an embodiment of the present disclosure, the display panel 110 may include a substrate SUB having a display region DA in which a plurality of sub-pixels SP are disposed and a non-display region NDA located outside the display region DA, a circuit unit 410 disposed on the substrate SUB and in the non-display region NDA, a protective layer 700 disposed on the circuit unit 410, an outer coating 430 on the protective layer 700, a common electrode CE extending from the display region DA to the non-display region NDA and disposed on the outer coating 430, and an inorganic encapsulation layer 460 extending from the display region DA to the non-display region NDA and disposed on the top and side surfaces of the common electrode CE (in other words, disposed above the common electrode CE and on the side of the common electrode CE).

[0167] Reference Figure 7 , according to an embodiment of the present disclosure, the display panel 110 may further include a first protrusion 710 and a second protrusion 720. Among them, the first protrusion 710 protrudes from the substrate SUB, is positioned further outward (or more outward) than the common electrode CE, and has a first eaves portion EVS1 (as Figure 8 shown); the second protrusion 720 protrudes from the substrate SUB, is located between the first protrusion 710 and the display area DA, and has a second eaves portion EVS2 (as Figure 9 shown).

[0168] Reference Figure 7 , according to an embodiment of the present disclosure, the display panel 110 may further include a first separation inorganic layer 740. The first separation inorganic layer 740 is disposed on the first protrusion 710, is made of the same material as the inorganic encapsulation layer 460, and is separated from the inorganic encapsulation layer 460.

[0169] In addition, according to an embodiment of the present disclosure, the display panel 110 may further include a second separation inorganic layer 750. The second separation inorganic layer 750 is disposed outside the first protrusion 710, is made of the same material as the inorganic encapsulation layer 460, and is separated from the first separation inorganic layer 740.

[0170] During the process of forming the first protrusion 710, a hill portion 770 may exist outside the first protrusion 710. The hill portion 770 may have the same stacking structure as the portion located inside the first protrusion 710. That is to say, the hill portion 770 may include a protective layer 700, an outer coating 430, etc.

[0171] Due to the formation of the first protrusion 710, the inorganic encapsulation layer 460 may be broken or disconnected. That is to say, during the process of forming the first protrusion 710, the inorganic sealing layer 460 may be broken or disconnected inside and outside the first protrusion 710 (in other words, around the first protrusion 710).

[0172] Specifically, the inorganic encapsulation layer 460 may be broken or disconnected inside the first protrusion 710.

[0173] Inside the first protrusion 710, the inorganic encapsulation layer 460 extends from the display area DA, and the broken inorganic encapsulation layer 460 may remain on the upper portion of the first protrusion 710 (in other words, may remain on the top of the first protrusion 710). The inorganic encapsulation layer 460 remaining on the first protrusion 710 may correspond to the first separation inorganic layer 740.

[0174] The inorganic encapsulation layer 460 may also be broken or disconnected outside the first protrusion 710.

[0175] The broken inorganic encapsulation layer 460 outside the first protrusion 710 can be retained on the upper portion of the hill portion 770 located outside the first protrusion 710 (in other words, it can be retained at the top of the hill portion 770). The inorganic encapsulation layer 460 retained on the upper portion of the hill portion 770 located outside the first protrusion 710 can correspond to the second separated inorganic layer 750.

[0176] Reference Figure 7 , in the process of forming the first protrusion 710, a first trench of the material layer including the protective layer 700 and the outer coating 430 can be formed ( Figure 8 TRC1 in).

[0177] The first protrusion 710 can be located inside the first trench ( Figure 8 TRC1 in) of the material layer including the protective layer 700 and the outer coating 430.

[0178] The inorganic encapsulation layer 460 can be disposed in the outer region of the first trench TRC1. The inorganic encapsulation layer 460 disposed in the outer region of the first trench TRC1 can correspond to the second separated inorganic layer 750.

[0179] Reference Figure 7 , the inorganic encapsulation layer 460 can be broken or disconnected on the inner and outer sides of the first protrusion 710, but the inorganic encapsulation layer 460 can be unbroken or disconnected at and around the second protrusion 720.

[0180] That is to say, the inorganic encapsulation layer 460 can be disposed on the second protrusion 720, and can be disposed seamlessly in the outer region and the inner region of the second trench TRC2 (as [[ID=A]] Figure 9 shown) without being disconnected.

[0181] Since the inorganic encapsulation layer 460 near the first protrusion 710 corresponds to the shaded part, it can have a thin first thickness. In contrast, the inorganic encapsulation layer 460 near the second protrusion 720 can have a second thickness that is relatively greater than the first thickness.

[0182] Reference Figure 7 , in the process of forming the second protrusion 720, a second trench of the material layer including the protective layer 700 and the outer coating 430 can be formed ( Figure 9 TRC2 in).

[0183] The second protrusion 720 can be located inside the second trench ( Figure 9 TRC2 in) of the material layer including the protective layer 700 and the outer coating 430.

[0184] Reference Figure 7, the first protrusion 710 may be located outside the circuit unit 410, and the second protrusion 720 may be located between the circuit unit 410 and the display area DA.

[0185] Reference Figure 7 , a ground wire 420 may be disposed between the first protrusion 710 and the circuit unit 410.

[0186] The inorganic encapsulation layer 460 may extend to the outside of the ground wire 420.

[0187] Reference Figure 7 , the first protrusion 710 may further include an adhesion functional layer 730 on the outer coating 430 (in other words, as will be described below Figure 8 shown, the first protrusion 710 may further include an adhesion functional layer 730 on the first top insulation layer 830 corresponding to the outer coating 430).

[0188] The adhesion functional layer 730 may include an adhesion material having a relatively high adhesion force (i.e., bonding force) with the inorganic encapsulation layer 460. Here, the adhesion material may be an adhesion material used in the display panel.

[0189] The adhesion functional layer 730 may be further disposed on the outer coating 430 located outside the first protrusion 710. The adhesion functional layer 730 may be further disposed on the outer coating 430 located inside the first protrusion 710.

[0190] Hereinafter, the first undercut structure region UCA1 where the first protrusion 710 is located and the second undercut structure region UCA2 where the second protrusion 720 is located will be described in more detail. First, as a non-limiting example, reference will be made to Figure 8 to describe the vertical structure of the first undercut structure region UCA1 where the first protrusion 710 is located.

[0191] Figure 8 is a detailed cross-sectional view of the first undercut structure region UCA1 in the display panel 110 having a narrow border and robust reliability according to an embodiment of the present disclosure.

[0192] Reference Figure 8 , the first protrusion 710 present in the first undercut structure region UCA1 may include a first base metal 810, a first bottom insulation layer 820 located on the first base metal 810 and having a lower surface (or rear surface) whose area is larger than the upper surface of the first base metal 810, and a first top insulation layer 830 on the first bottom insulation layer 820.

[0193] Reference Figure 8, the first bottom insulating layer 820 may include the same material as the protective layer 700 (or be formed of the same material as the protective layer 700), and may be separated from the protective layer 700.

[0194] The first top insulating layer 830 may include the same material as the outer coating 430 (or be formed of the same material as the outer coating 430), and may be separated from the outer coating 430.

[0195] As described above, the first protrusion 710 may have an undercut structure in which the first base metal 810 located below the first bottom insulating layer 820 containing the same material as the protective layer 700 is recessed (or indented) inward.

[0196] The first separation inorganic layer 740 on the top of the first protrusion 710 (or on the upper part of the first protrusion 710) may be a part of the inorganic encapsulation layer 460, which is disconnected from the inorganic encapsulation layer 460 extending from the display area DA inside the first protrusion 710.

[0197] The second separation inorganic layer 750 on the hill portion 770 outside the first protrusion 710 may be a part of the inorganic encapsulation layer 460, which is disconnected from the first separation inorganic layer 740 outside the first protrusion 710.

[0198] The inorganic encapsulation layer 460, the first separation inorganic layer 740, and the second separation inorganic layer 750 may be separated from each other only during the formation of the first protrusion 710, and may include the same inorganic material (or be formed of the same inorganic material).

[0199] Reference Figure 8 , the first eaves portion EVS1 of the first protrusion 710 may include a portion of the first bottom insulating layer 820 that extends further outward than the first base metal 810.

[0200] The first eaves portion EVS1 of the first protrusion 710 may have a first length L1. Here, the first length L1 of the first eaves portion EVS1 may correspond to the size of the first eaves portion EVS1. That is, if the first length L1 of the first eaves portion EVS1 is long, the size of the first eaves portion EVS1 may be large. If the first length L1 of the first eaves portion EVS1 is short, the size of the first eaves portion EVS1 may be small.

[0201] Reference Figure 8 , the inorganic encapsulation layer 460 is disconnected or broken by the first eaves portion EVS1 of the first protrusion 710.

[0202] In the first undercut structure region UCA1, the inorganic encapsulation layer 460 may have a first thickness T1, and the thickness of the first separation inorganic layer 740 may be equal to or less than the first thickness T1. The thickness of the second separation inorganic layer 750 may be equal to or less than the thickness of the first separation inorganic layer 740.

[0203] Reference Figure 8 , the first protrusion 710 may further include an adhesion functional layer 730 on the first top insulating layer 830.

[0204] The adhesion functional layer 730 and the inorganic encapsulation layer 460 may be disconnected by the first eaves portion EVS1 of the first protrusion 710.

[0205] Reference Figure 8 , the display panel 110 according to an embodiment of the present disclosure may further include a base insulating layer INS between the substrate SUB and the first protrusion 710, and a first shielding metal 800 located between the substrate SUB and the base insulating layer INS and overlapping with the first protrusion 710.

[0206] Reference Figure 8 , the display panel 110 according to an embodiment of the present disclosure may further include a first external metal pattern 805a and a first internal metal pattern 805b, wherein the first external metal pattern 805a is located outside the first protrusion 710 and is disposed between the base insulating layer INS and the protective layer 700, and the first internal metal pattern 805b is located inside the first protrusion 710 and is disposed between the base insulating layer INS and the protective layer 700.

[0207] The first external metal pattern 805a may be connected to a part of the first shielding metal 800 through a hole in the base insulating layer INS, and the first internal metal pattern 805b may be connected to another part of the first shielding metal 800 through a hole in the base insulating layer INS.

[0208] A ground voltage may be applied to the first shielding metal 800.

[0209] The first shielding metal 800 may be a part of the ground wire 420, or may be a pattern electrically connected to the ground wire 420.

[0210] Reference Figure 8 , the first protrusion 710 may be considered to be located inside the first trench TRC1 formed by removing the outer coating 430 and the protective layer 700.

[0211] Hereinafter, as a non-limiting example, the vertical structure of the second undercut structure region UCA2 where the second protrusion 720 is located will be described.

[0212] Figure 9It is a detailed cross-sectional view of a second undercut structure region UCA2 in a display panel 110 having a narrow border and a robust reliability structure according to an embodiment of the present disclosure.

[0213] Reference Figure 9 , the second protrusion 720 may include a second base metal 910, a second bottom insulating layer 920 located on the second base metal 910 and having a lower surface (or rear surface) whose area is smaller than the upper surface of the second base metal 910, a second top insulating layer 930 located on the second bottom insulating layer 920 and having a lower surface (or rear surface) whose area is larger than the upper surface of the second bottom insulating layer 920, an organic material layer 940 located on the second top insulating layer 930, and a top metal 950 located on the organic material layer 940.

[0214] Reference Figure 9 , the second bottom insulating layer 920 may include the same material as the protective layer 700 (or be formed of the same material as the protective layer 700) and may be separated from the protective layer 700, and the second top insulating layer 930 may include the same material as the outer coating 430 (or be formed of the same material as the outer coating 430) and may be separated from the outer coating 430.

[0215] The organic material layer 940 may include the organic material contained in the intermediate layer EL and may be separated from the intermediate layer EL, and the top metal 950 may include the same metal as the common electrode CE (or be formed of the same metal as the common electrode CE) and may be separated from the common electrode CE.

[0216] Therefore, the second protrusion 720 may have a structure in which the second bottom insulating layer 920 located below the second top insulating layer 930 containing the same material as the outer coating 430 is recessed inward.

[0217] The second eaves portion EVS2 may include a portion of the second top insulating layer 930 that extends further outward than the second bottom insulating layer 920.

[0218] The second eaves portion EVS2 may further include the organic material layer 940 and the top metal 95 in the side surface of the second top insulating layer 930.

[0219] The total length of the second eaves portion EVS2 may be the sum of the second length L2, the thickness of the organic material layer 940, and the thickness of the top metal 950, where the second length L2 is the length of the extended portion of the second top insulating layer 930 that extends further outward than the second bottom insulating layer 920.

[0220] For example, the first length L1 of the first eaves portion EVS1 may be greater than the total length of the second eaves portion EVS2. Accordingly, the inorganic encapsulation layer 460 may be easily broken or disconnected around the first protrusion 710.

[0221] The second protrusion 720 may further include a separation cover (or cap) layer 960 on the top metal 950.

[0222] During the formation of the second protrusion 720, the separation cover layer 960 may be a layer separated from the cover layer 450. The separation cover layer 960 may include the same material as (or be formed of the same material as) the cover layer 450 located around the second protrusion 720.

[0223] Reference Figure 9 , the display panel 110 according to an embodiment of the present disclosure may further include a base insulating layer INS between the substrate SUB and the second protrusion 720, and a second shielding metal 900 located between the substrate SUB and the base insulating layer INS and overlapping with the second protrusion 720.

[0224] Reference Figure 9 , the display panel 110 according to an embodiment of the present disclosure may further include a second external metal pattern 905a located outside the second protrusion 720 and disposed between the base insulating layer INS and the protective layer 700, and a second internal metal pattern 905b located inside the second protrusion 720 and disposed between the base insulating layer INS and the protective layer 700.

[0225] The second external metal pattern 905a may be connected to a part of the second shielding metal 900 through a hole in the base insulating layer INS, and the second internal metal pattern 905b may be connected to another part of the second shielding metal 900 through a hole in the base insulating layer INS.

[0226] The second protrusion 720 may be disposed in the area of the circuit unit 410 and the display area DA.

[0227] The signal output from the circuit unit 410 may be applied to the second shielding metal 900.

[0228] The second shielding metal 900 may be electrically connected to the signal line and the circuit unit 410 disposed in the display area DA.

[0229] In the second undercut structure area UCA2, the inorganic encapsulation layer 460 may not be disconnected or cut in and around the second protrusion 720.

[0230] In the second undercut structure region UCA2, the inorganic encapsulation layer 460 may have a second thickness T2. The second thickness T2 of the inorganic encapsulation layer 460 in the second undercut structure region UCA2 may be greater than the first thickness T1 of the inorganic encapsulation layer 460 in the first undercut structure region UCA1.

[0231] Reference Figure 9 , the second protrusion 720 may be considered to be located inside the second trench TRC2 formed by removing the outer coating 430 and the protective layer 700. The second trench TRC2 may be a trench of the intermediate layer EL.

[0232] Figure 10 The circuit unit 410 in the display panel 110 according to an embodiment of the present disclosure is shown in more detail.

[0233] Reference Figure 10 , the circuit unit 410 may include a gate circuit GIPC in the panel that outputs a scan signal to a plurality of sub-pixels SP, a plurality of gate clock lines GCLKL disposed between the first protrusion 710 and the gate circuit GIPC in the panel, a first gate voltage line GVDDL disposed between the plurality of gate clock lines GCLKL and the gate circuit GIPC in the panel, and a second gate voltage line GVSSL disposed between the gate circuit GIPC in the panel and the second protrusion 720.

[0234] Figures 11A to 11E The first undercut process in the display panel 110 according to an embodiment of the present disclosure is shown, and Figures 12A to 12H The second undercut process in the display panel 110 according to an embodiment of the present disclosure is shown. However, in the following description, reference is also made to Figures 7 to 9 .

[0235] Figures 11A to 11E The process of forming the first protrusion 710 in the first undercut structure region UCA1 is shown, and Figures 12A to 12H The process of forming the second protrusion 720 in the second undercut structure region UCA2 is shown.

[0236] Reference Figures 11A to 11E And Figures 12A to 12H , a method of manufacturing a display device 100 according to an embodiment of the present disclosure may include a basic step (S110, S210) and a heterogeneous protrusion forming step (S120 to S150, S220 to S280).

[0237] In the basic steps (S110, S210), a first bottom metal BM1 can be formed on a substrate SUB in a first undercut structure region UCA1, a second bottom metal BM2 can be formed on the substrate SUB in a second undercut structure region UCA2, a protective layer 700 can be formed on the first bottom metal BM1 and the second bottom metal BM2, and an outer coating 430 can be formed on the protective layer 700.

[0238] Hereinafter, the first stage corresponding to the basic steps (i.e., steps S110 and S210) will be described in more detail.

[0239] In the basic steps (S110, S210), a first shielding metal 800 can be formed on a substrate SUB in a first undercut structure region UCA1, and a second shielding metal 900 can be formed on the substrate SUB in a second undercut structure region UCA2.

[0240] In addition, in the basic steps (S110, S210), an insulating layer INS can be formed on the first shielding metal 800 and the second shielding metal 900. For example, the insulating layer INS can include a buffer layer and a gate insulating layer.

[0241] In addition, in the basic steps (S110, S210), a first external metal pattern 805a and a first internal metal pattern 805b can be formed on the insulating layer INS, and can be connected to one side and the other side of the first shielding metal 800 through holes in the insulating layer INS in the first undercut structure region UCA1.

[0242] In addition, in the basic steps (S110, S210), a second external metal pattern 905a and a second internal metal pattern 905b can be formed on the insulating layer INS, and can be connected to one side and the other side of the second shielding metal 900 through holes in the insulating layer INS in the second undercut structure region UCA2.

[0243] In addition, in the basic steps (S110, S210), a protective layer 700 can be formed on the first external metal pattern 805a, the first internal metal pattern 805b, the second external metal pattern 905a, and the second internal metal pattern 905b. Thereafter, an outer coating 430 can be formed on the protective layer 700.

[0244] In the heterogeneous protrusion formation steps (S120 to S150, S220 to S280), a first protrusion 710 can be formed inside a first trench TRC1 of the outer coating 430 in the first undercut structure region UCA1, and a second protrusion 720 can be formed inside a second trench TRC2 of the outer coating 430 in the second undercut structure region UCA2.

[0245] The first protrusion 710 may include a first base metal 810 formed by reducing the first bottom metal BM1.

[0246] The first protrusion 710 may include a first bottom insulating layer 820 and a first top insulating layer 830. The first bottom insulating layer 820 is located on the first base metal 810, has a lower surface (or rear surface) whose area is larger than the upper surface of the first base metal 810, and includes the same material as the protective layer 700 (or is formed of the same material as the protective layer 700). The first top insulating layer 830 is located on the first bottom insulating layer 820 and includes the same material as the outer coating 430 (or is formed of the same material as the outer coating 430).

[0247] The second protrusion 720 may include a second base metal 910 corresponding to the second bottom metal BM2, a second bottom insulating layer 920 located on the second base metal 910 and including the same material as the protective layer 700 (or formed of the same material as the protective layer 700), and a second top insulating layer 930. The second top insulating layer 930 is located on the second bottom insulating layer 920, has a lower surface (or rear surface) whose area is larger than the upper surface of the second bottom insulating layer 920, and includes the same material as the outer coating 430 (or is formed of the same material as the outer coating 430).

[0248] The substrate SUB may be divided into a display area DA for displaying an image and a non-display area NDA located outside the display area DA.

[0249] A first undercut structure area UCA1 and a second undercut structure area UCA2 may be included in the non-display area NDA, and the first undercut structure area UCA1 may be located farther from the display area DA than the second undercut structure area UCA2.

[0250] The basic step may be the first step (S110, S210), and the heterogeneous protrusion formation step performed after the first step (S110, S210) may include a second step (S120, S220), a third step (S130, S230), a fourth step (S140, S240), a fifth step (S150, S250), a sixth step (S260), a seventh step (S270), and an eighth step (S280).

[0251] In the second step (S120, S220), by using a halftone photomask, a first hole H1a and a second hole H1b may be formed in the outer coating 430 on the first bottom metal BM1, and a third groove G2a and a fourth groove G2b may be formed in the outer coating 430 on the second bottom metal BM2.

[0252] In the third step (S130, S230), the protective layer 700 may be wet-etched, and the overcoat layer 430 may be ashed. In step S130, in the first undercut structure area UCA1, the protective layer 700 overlapping the first hole H1a and the second hole H1b may be etched. In step S230, in the second undercut structure area UCA2, the third groove G2a and the fourth groove G2b of the overcoat layer 430 may be penetrated to form the third hole H2a and the fourth hole H2b in the overcoat layer 430.

[0253] In step S230 , in the second undercut structure area UCA2 , portions of the protection layer 700 overlapping the third hole H2 a and the fourth hole H2 b may not be etched, or may be etched only to a partial thickness.

[0254] In the fourth step ( S140 , S240 ), a pixel electrode material PEM may be deposited in the first undercut structure area UCA1 and the second undercut structure area UCA2 .

[0255] In the fifth step ( S150 , S250 ), the pixel electrode material PEM may be etched, and a first protrusion 710 may be formed in the first undercut structure area UCA1 .

[0256] In the sixth step (S260), the bank 440 may be patterned outside the second undercut structure area UCA2 ( Figure 12F At this time, the protection layer 700 may remain in the second undercut structure area UCA2.

[0257] In the seventh step (S270), a photoresist (or photoresist) PR can be formed on the outer coating layer 430 located on one side of the third hole H2a and the other side of the fourth hole H2b. The photoresist PR can also be formed on the side of the outer coating layer 430 located on one side of the third hole H2a and the other side of the fourth hole H2b. This is used to prevent the formation of an undercut structure in which the protective layer 700 below the outer coating layer 430 located on one side of the third hole H2a and the other side of the fourth hole H2b is recessed inward in the eighth step (S280). At this time, the protective layer 700 can remain in the second undercut structure area UCA2.

[0258] In the eighth step (S280), the protective layer 700 may be wet-etched so that the area of the upper surface of the protective layer 700 (corresponding to the second bottom insulating layer 920) below the outer coating layer 430 between the third hole H2a and the fourth hole H2b is smaller than the area of the lower surface (or rear surface) of the outer coating layer 430 between the third hole H2a and the fourth hole H2b. Thus, an undercut structure is formed in which the protective layer 700 below the outer coating layer 430 between the third hole H2a and the fourth hole H2b is recessed. Thus, a second protrusion 720 may be formed.

[0259] In the fifth step (S150, S250), the pixel electrode material PEM can be removed, and the portions of the first bottom metal BM1 overlapping with the first hole H1a and the second hole H1b can be removed. Additionally, the portions of the protective layer 700 overlapping with the third hole H2a and the fourth hole H2b may not be etched, or may be etched only to a partial thickness.

[0260] After the hetero-protrusion formation step (S120 to S150, S220 to S280), a deposition process of the inorganic encapsulation layer 460 can be performed.

[0261] As a result of the deposition of the inorganic encapsulation layer 460, the inorganic encapsulation layer 460 can break or disconnect around the first protrusion 710, and can remain unbroken or connected around the second protrusion 720.

[0262] The inorganic encapsulation layer 460 can become thinner as its position changes away from the display area DA. That is, the farther away from the display area DA, the thinner the inorganic encapsulation layer can become.

[0263] The embodiments of the present disclosure described above are briefly described as follows.

[0264] A display device according to an embodiment of the present disclosure may include (or comprise): a substrate including a display area on which a plurality of sub-pixels are provided and a non-display area outside the display area; a circuit unit provided on the substrate and in the non-display area; a protective layer provided on the circuit unit; an outer coating provided on the protective layer; a common electrode extending from the display area to the non-display area and provided on the outer coating; an inorganic encapsulation layer extending from the display area to the non-display area and provided on the top and side of the common electrode; a first undercut structure area and a second undercut structure area in the non-display area (the first undercut structure area is positioned farther away from the display area than the second undercut structure area); a first protrusion protruding from the substrate in the first undercut structure area, positioned further outward than the common electrode, and having a first eaves; a second protrusion protruding from the substrate in the second undercut structure area, located between the first protrusion and the display area, and having a second eaves; and a first separated inorganic layer provided on the first protrusion, including the same material as (or formed of the same material as) the inorganic encapsulation layer, and separated from the inorganic encapsulation layer.

[0265] The display device may further include a second separated inorganic layer provided outside the first protrusion, made of the same material as the inorganic encapsulation layer, and separated from the first separated inorganic layer.

[0266] The inorganic encapsulation layer can be disconnected around the first protrusion and can remain connected around the second protrusion.

[0267] The first protrusion may be located inside a first trench of a material layer including a protective layer and an outer coating.

[0268] A first thickness of the inorganic encapsulation layer around the first protrusion may be less than a second thickness of the inorganic encapsulation layer around the second protrusion.

[0269] The second protrusion may be located inside a second trench of a material layer including a protective layer and an outer coating.

[0270] The first protrusion may be located outside the circuit unit, and the second protrusion may be located between the circuit unit and the display area.

[0271] A ground wire may be provided between the first protrusion and the circuit unit, and the inorganic encapsulation layer may extend to the outside of the ground wire.

[0272] The first protrusion may include a first base metal, a first bottom insulating layer located on the first base metal and including a lower surface (or rear surface) having an area larger than the upper surface of the first base metal, and a first top insulating layer on the first bottom insulating layer.

[0273] The first eaves portion may include a portion of the first bottom insulating layer that extends further outward than the first base metal.

[0274] The first bottom insulating layer may include the same material as the protective layer and may be separated from the protective layer, and the first top insulating layer may include the same material as the outer coating and may be separated from the outer coating.

[0275] The first protrusion may further include an adhesion functional layer on the first top insulating layer.

[0276] The adhesion functional layer may be further provided on the outer coating located outside the first protrusion, and / or the adhesion functional layer may be further provided on the outer coating located inside the first protrusion.

[0277] The inorganic encapsulation layer may be disconnected or broken by the first eaves portion of the first protrusion, and in the first undercut structure region, the inorganic encapsulation layer may have a first thickness, the first separated inorganic layer may have a thickness equal to or less than the first thickness, and the second separated inorganic layer may have a thickness equal to or less than the thickness of the first separated inorganic layer.

[0278] The display device according to an embodiment of the present disclosure may further include a base insulating layer located between the substrate and the first protrusion, and a first shielding metal located between the substrate and the base insulating layer and overlapping with the first protrusion.

[0279] A ground voltage may be applied to the first shielding metal.

[0280] The second protrusion may include a second base metal, a second bottom insulating layer located on the second base metal and having a lower surface with an area smaller than the upper surface of the second base metal, a second top insulating layer located on the second bottom insulating layer and having a lower surface (or rear surface) with an area larger than the upper surface of the second bottom insulating layer, an organic material layer located on the second top insulating layer, and a top metal located on the organic material layer.

[0281] The second eaves may include a portion of the second top insulating layer that extends further outward than the second bottom insulating layer.

[0282] The second bottom insulating layer may include the same material as the protective layer and may be separated from the protective layer, and the second top insulating layer may include the same material as the outer coating and may be separated from the outer coating.

[0283] The display device according to an embodiment of the present disclosure may further include a plurality of pixel electrodes provided in each of the plurality of sub-pixels, and an intermediate layer between the plurality of pixel electrodes and the common electrode.

[0284] The organic material layer may include the organic material included in the intermediate layer and may be separated from the intermediate layer. The top metal may include the same metal as the common electrode and may be separated from the common electrode.

[0285] The second eaves may include a portion of the second top insulating layer that extends further outward than the second bottom insulating layer, and an organic material layer and a top metal located on the side surface of the second top insulating layer.

[0286] The first eaves may have a first length, and the second eaves may have a total length equal to the sum of the second length, the thickness of the organic material layer, and the thickness of the top metal, where the second length is the length of the extended portion of the second top insulating layer that extends further outward than the second bottom insulating layer, and the first length of the first eaves may be greater than the total length of the second eaves.

[0287] The second protrusion may further include a separation cover layer on the top metal.

[0288] The display device according to an embodiment of the present disclosure may further include a base insulating layer located between the substrate and the second protrusion, and a second shielding metal located between the substrate and the base insulating layer and overlapping with the second protrusion.

[0289] The signal output from the circuit unit may be applied to the second shielding metal.

[0290] The circuit unit may include a gate circuit in the panel configured to output a scan signal to the plurality of sub-pixels, a plurality of gate clock lines disposed between the first protrusion and the gate circuit in the panel, a first gate voltage line disposed between the plurality of gate clock lines and the gate circuit in the panel, and a second gate voltage line disposed between the gate circuit in the panel and the second protrusion.

[0291] The first eaves portion may have a larger size than the second eaves portion.

[0292] A method of manufacturing a display device according to an embodiment of the present disclosure may include: a base step in which a first bottom (lower) metal is formed on a substrate in a first undercut structure region, a second bottom (lower) metal is formed on the substrate in a second undercut structure region, a protective layer is formed on the first bottom metal and the second bottom metal, and an outer coating is formed on the protective layer; and a heterogeneous protrusion forming step in which a first protrusion is formed inside a first trench of the outer coating in the first undercut structure region, and a second protrusion is formed inside a second trench of the outer coating in the second undercut structure region.

[0293] The first protrusion may include a first base metal formed by reducing the first bottom metal, a first bottom insulating layer disposed on the first base metal and having a lower surface (or rear surface) whose area is larger than the upper surface of the first base metal and including the same material as the protective layer (or formed of the same material as the protective layer), and a first top insulating layer disposed on the first bottom insulating layer and including the same material as the outer coating (or formed of the same material as the outer coating).

[0294] The second protrusion may include a second base metal corresponding to the second bottom metal, a second bottom insulating layer disposed on the second base metal and including the same material as the protective layer (or formed of the same material as the protective layer), and a second top insulating layer disposed on the second bottom insulating layer and having a lower surface (or rear surface) whose area is larger than the upper surface of the second bottom insulating layer and including the same material as the outer coating (or formed of the same material as the outer coating).

[0295] The substrate may be divided into a display area where an image is displayed and a non-display area outside the display area. The first undercut structure region and the second undercut structure region may be included in the non-display area, and the first undercut structure region may be positioned farther from the display area than the second undercut structure region.

[0296] The base step is the first step, and the heterogeneous protrusion forming step performed after the first step may include a second step in which first holes and second holes are formed in an outer coating on a first bottom metal using a halftone photomask, and third trenches and fourth trenches are formed in an outer coating on a second bottom metal; a third step in which a portion of the protective layer overlapping the first holes and the second holes is etched by wet etching the protective layer, and the outer coating is ashed to penetrate (or drill through) the third trenches and the fourth trenches of the outer coating, thereby forming third holes and fourth holes in the outer coating; a fourth step of depositing a pixel electrode material; a fifth step of forming a first protrusion by etching the pixel electrode material; a sixth step of removing a portion of the protective layer overlapping the third and fourth holes; a seventh step of forming a photoresist on the outer coating on one side of the third hole and the other side of the fourth hole; and an eighth step of forming a second protrusion by wet etching the protective layer such that the area of the upper surface of the protective layer under the outer coating between the third hole and the fourth hole is smaller than the area of the lower surface (or back surface) of the outer coating between the third hole and the fourth hole.

[0297] In the third step, a portion of the protective layer overlapping the third holes and the fourth holes may not be etched, or may be etched only to a partial thickness.

[0298] In the fifth step, the pixel electrode material may be removed, a portion of the first base metal overlapping the first holes and the second holes may be removed, and a portion of the protective layer overlapping the third holes and the fourth holes may not be etched, or may be etched only to a partial thickness.

[0299] A step of depositing an inorganic encapsulation layer may be performed after the heterogeneous protrusion forming step. As a result of depositing the inorganic encapsulation layer, the inorganic encapsulation layer may be disconnected around the first protrusion and may not be disconnected around the second protrusion.

[0300] The inorganic encapsulation layer may be formed such that the farther away from the display area, the thinner the inorganic encapsulation layer may become.

[0301] According to an embodiment of the present disclosure, a display device having a structure with a narrow border and robust reliability and a manufacturing method thereof can be provided.

[0302] According to an embodiment of the present disclosure, a display device having a structure conducive to achieving a narrow border and a manufacturing method thereof can be provided.

[0303] According to an embodiment of the present disclosure, a display device having a structure capable of preventing cracks from spreading in an encapsulation layer within a display panel and a manufacturing method thereof can be provided.

[0304] According to an embodiment of the present disclosure, a display device having a structure capable of preventing penetration of external substances such as moisture or oxygen and a manufacturing method thereof can be provided.

[0305] According to an embodiment of the present disclosure, a display device having a structure capable of preventing external substances introduced into the interior from diffusing into the display area and a manufacturing method thereof can be provided.

[0306] According to an embodiment of the present disclosure, a display device having a structure capable of preventing image abnormalities caused by external substances introduced into the interior and a manufacturing method thereof can be provided.

[0307] The above description and the drawings provide examples of the technical idea of the present disclosure for illustrative purposes only. Various modifications, additions, and substitutions to the described embodiments will be apparent to those skilled in the art without departing from the spirit and scope of the present disclosure. In addition, the disclosed embodiments are intended to illustrate the scope of the technical idea of the present disclosure. Therefore, the scope of the present disclosure is not limited to the illustrated embodiments.

Claims

1. A display device, comprising: a substrate including a display area on which a plurality of sub-pixels are disposed and a non-display area outside the display area; a circuit unit disposed on the substrate and in the non-display area; a protective layer disposed on the circuit unit; an outer coating disposed on the protective layer; a common electrode extending from the display area to the non-display area and disposed on the outer coating; an inorganic encapsulation layer extending from the display area to the non-display area and disposed on the top and sides of the common electrode; a first undercut structure area and a second undercut structure area in the non-display area, wherein the first undercut structure area is positioned further away from the display area than the second undercut structure area; a first protrusion protruding from the substrate in the first undercut structure area, positioned further outward than the common electrode, and having a first eaves portion; a second protrusion protruding from the substrate in the second undercut structure area, positioned between the first protrusion and the display area, and having a second eaves portion; and a first separated inorganic layer disposed on the first protrusion, including the same material as the inorganic encapsulation layer and separated from the inorganic encapsulation layer.

2. The display device according to claim 1, wherein, The inorganic encapsulation layer is disconnected around the first protrusion and is not disconnected around the second protrusion.

3. The display device according to claim 1, wherein, A first thickness of the inorganic encapsulation layer around the first protrusion is less than a second thickness of the inorganic encapsulation layer around the second protrusion.

4. The display device according to claim 1, wherein, The first protrusion is located outside the circuit unit, and the second protrusion is located between the circuit unit and the display area.

5. The display device according to claim 1, wherein, The first protrusion includes: a first base metal; a first bottom insulating layer located on the first base metal and including a lower surface having an area larger than an upper surface of the first base metal; and a first top insulating layer on the first bottom insulating layer, wherein the first eaves portion includes a portion of the first bottom insulating layer extending further outward than the first base metal.

6. The display device according to claim 5, wherein, The first bottom insulating layer includes the same material as the protective layer and is separated from the protective layer, wherein the first top insulating layer includes the same material as the outer coating and is separated from the outer coating.

7. The display device according to claim 5, wherein, The first protrusion further includes an adhesion functional layer on the first top insulating layer.

8. The display device according to claim 5, further comprising: a base insulating layer between the substrate and the first protrusion; and a first shielding metal located between the substrate and the base insulating layer and overlapping the first protrusion.

9. The display device according to claim 8, wherein, A ground voltage is applied to the first shielding metal.

10. The display device according to claim 1, wherein, The second protrusion includes: a second base metal; a second bottom insulating layer located on the second base metal and having a lower surface with an area smaller than an upper surface of the second base metal; a second top insulating layer located on the second bottom insulating layer and having a lower surface with an area larger than an upper surface of the second bottom insulating layer; an organic material layer located on the second top insulating layer; and a top metal located on the organic material layer, Wherein the second eaves portion includes a portion of the second top insulating layer that extends further outward than the second bottom insulating layer.

11. The display device according to claim 10, wherein, The second bottom insulating layer includes the same material as the protective layer and is separated from the protective layer. Wherein the second top insulating layer includes the same material as the outer coating and is separated from the outer coating.

12. The display device according to claim 10, further comprising: A plurality of pixel electrodes provided in each of the plurality of sub-pixels; And An intermediate layer between the plurality of pixel electrodes and the common electrode, Wherein the organic material layer includes an organic material contained in the intermediate layer and is separated from the intermediate layer, and Wherein the top metal includes the same metal as the common electrode and is separated from the common electrode.

13. The display device according to claim 10, further comprising: A base insulating layer between the substrate and the second protrusion; And A second shielding metal located between the substrate and the base insulating layer and overlapping with the second protrusion.

14. The display device according to claim 13, wherein, A signal output from the circuit unit is applied to the second shielding metal.

15. The display device according to claim 1, wherein, The circuit unit includes: A gate circuit in the panel configured to output a scan signal to the plurality of sub-pixels; A plurality of gate clock lines provided between the first protrusion and the gate circuit in the panel; A first gate voltage line provided between the plurality of gate clock lines and the gate circuit in the panel; and A second gate voltage line provided between the gate circuit in the panel and the second protrusion.

16. The display device according to claim 1, wherein, The first eaves portion has a larger size than the second eaves portion.

17. A method of manufacturing a display device, comprising: A basic step, wherein a first bottom metal is formed on a substrate in a first undercut structure region, a second bottom metal is formed on the substrate in a second undercut structure region, a protective layer is formed on the first bottom metal and the second bottom metal, and an outer coating is formed on the protective layer; And A heterogeneous protrusion forming step, wherein a first protrusion is formed inside a first trench of the outer coating in the first undercut structure region, and a second protrusion is formed inside a second trench of the outer coating in the second undercut structure region. Wherein the first protrusion includes: A first base metal formed by reducing the first bottom metal; A first bottom insulating layer located on the first base metal, having a lower surface with an area larger than the upper surface of the first base metal, and including the same material as the protective layer; and A first top insulating layer located on the first bottom insulating layer and including the same material as the outer coating. Wherein the second protrusion includes: A second base metal corresponding to the second bottom metal; A second bottom insulating layer located on the second base metal and including the same material as the protective layer; and A second top insulating layer located on the second bottom insulating layer, having a lower surface with an area larger than the upper surface of the second bottom insulating layer, and including the same material as the outer coating. Wherein the substrate is divided into a display area for displaying an image and a non-display area outside the display area. The first undercut structure region and the second undercut structure region are included in the non-display region, and the first undercut structure region is positioned farther away from the display region than the second undercut structure region.

18. The method according to claim 17, wherein, The step of forming the heterogeneous protrusions includes: forming a first hole and a second hole in an outer coating on the first bottom metal, and forming a third trench and a fourth trench in an outer coating on the second bottom metal, using a halftone photomask; etching a portion of the protective layer that overlaps with the first hole and the second hole by wet-etching the protective layer, and ashing the outer coating to penetrate through the third trench and the fourth trench of the outer coating, thereby forming a third hole and a fourth hole in the outer coating; depositing a pixel electrode material; forming the first protrusion by etching the pixel electrode material; forming a photoresist on the outer coating on one side of the third hole and the other side of the fourth hole; and forming the second protrusion by wet-etching the protective layer such that an area of an upper surface of the protective layer below the outer coating between the third hole and the fourth hole is smaller than an area of a lower surface of the outer coating between the third hole and the fourth hole.

19. The method according to claim 17, further comprising a step of depositing an inorganic encapsulation layer after the step of forming the heterogeneous protrusions, Among them, as a result of depositing the inorganic encapsulation layer, the inorganic encapsulation layer is disconnected around the first protrusion and is not disconnected around the second protrusion.

20. The method according to claim 19, wherein, The inorganic encapsulation layer is formed such that the farther away from the display region, the thinner the inorganic encapsulation layer becomes.

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