Grid line transfer printing adhesive film preparation method and device and grid line preparation method

Abstract

The invention relates to a grid line transfer printing adhesive film preparation method and device and a grid line preparation method. The preparation method of the transfer printing film comprises the following steps: providing a transfer printing adhesive film, forming a grid line groove corresponding to a solar cell grid line on the surface of the transfer printing adhesive film, filling slurry in the grid line groove to form a grid line pattern, and further performing reinforcement treatment on the transfer printing adhesive film so that the slurry is fixed in the grid line groove. The transfer printing adhesive film prepared by the preparation method of the transfer printing film can be directly used for preparing the grid electrode, the grid line pattern is transferred to the solar cell substrate, and then the grid line pattern is sintered, so that the preparation steps of the grid line are reduced, and the productivity of the solar cell is improved.

Description

Technical Field

[0001] The present application relates to the technical field of the preparation of solar cell grid lines, in particular to a method and device for preparing a grid line transfer adhesive film and a method for preparing grid lines. Background Art

[0002] The grid lines of a solar cell can collect and transport photo-generated carriers to achieve the electrical energy conversion of solar energy. Therefore, for a solar cell, the cell grid lines are a key structure affecting the conductivity of the solar cell.

[0003] Currently, in the technical field of the preparation of solar cell grid lines, common methods for preparing solar cell grid lines include screen printing. Screen printing requires distributed printing on the front and back of the solar cell substrate, with more steps, a large consumption of the screen plate, and low productivity. Summary of the Invention

[0004] Based on this, it is necessary to provide a method and device for preparing a grid line transfer adhesive film and a method for preparing grid lines for the above technical problems.

[0005] In a first aspect, the present application provides a method for preparing a grid line transfer adhesive film, including:

[0006] Providing a transfer adhesive film;

[0007] Forming grid line grooves on the surface of the transfer adhesive film; the grid line grooves correspond to the solar cell grid lines;

[0008] Filling the grid line grooves with a paste;

[0009] Performing a reinforcement treatment on the transfer adhesive film to fix the paste in the grid line grooves.

[0010] The above method for preparing a grid line transfer adhesive film includes providing a transfer adhesive film, forming grid line grooves corresponding to the solar cell grid lines on the surface of the transfer adhesive film, filling the grid line grooves with a paste to form a grid line pattern, and further performing a reinforcement treatment on the transfer adhesive film to fix the paste in the grid line grooves. The transfer adhesive film prepared by the transfer film preparation method of the present application can be directly used for gate preparation, transfer the grid line pattern onto the solar cell substrate, and then sinter the grid line pattern, reducing the grid line preparation steps and being beneficial to improving the productivity of solar cells.

[0011] In one embodiment, the performing a reinforcement treatment on the transfer adhesive film includes:

[0012] Heating the transfer adhesive film at a first preset temperature.

[0013] In one embodiment, the first preset temperature includes 30 °C to 200 °C.

[0014] In one embodiment, the reinforcement treatment of the transfer adhesive film includes:

[0015] Freezing the transfer adhesive film at a second preset temperature.

[0016] In one embodiment, the second preset temperature includes -50 °C to 0 °C.

[0017] In one embodiment, before the reinforcement treatment of the transfer adhesive film, it further includes:

[0018] Cleaning the transfer adhesive film to remove the paste in the transfer adhesive film except for the grid line grooves.

[0019] In one embodiment, the filling of the paste in the grid line grooves includes:

[0020] Filling various types of the paste in each of the grid line grooves in a preset order.

[0021] In one embodiment, before the filling of the paste in the grid line grooves, it further includes:

[0022] Adjusting the humidity of the environment where the transfer adhesive film is located to a target humidity.

[0023] In one embodiment, the target humidity includes 40% Rh to 50% Rh.

[0024] In one embodiment, the width of the grid line grooves includes 10 μm to 50 μm.

[0025] In one embodiment, it further includes:

[0026] Winding the transfer adhesive film into a preset shape; the preset shape includes at least one of a cylinder, a cube, and a cuboid.

[0027] In a second aspect, the present application provides a method for preparing grid lines, including:

[0028] Providing a substrate;

[0029] Forming grid lines on the surface of the substrate through a transfer adhesive film; the transfer adhesive film is prepared by the above-mentioned method for preparing a grid line transfer adhesive film.

[0030] In the above method for preparing grid lines, grid lines are formed on the surface of the substrate by using a transfer adhesive film, and a fixed grid line pattern is formed on the surface of the transfer adhesive film, so that the transfer adhesive film can directly transfer the grid line pattern onto the solar cell substrate. After the grid lines are formed on the surface of the substrate, the grid lines are sintered, which reduces the grid line preparation steps and is beneficial to improving the production capacity of solar cells.

[0031] In a third aspect, the present application provides a device for preparing a grid line transfer adhesive film, including:

[0032] A pattern transfer module for forming grid line grooves on the surface of the transfer adhesive film; the grid line grooves correspond to the grid lines of the solar cell;

[0033] A paste filling module for filling the grid line grooves with paste;

[0034] A paste reinforcement module for performing a reinforcement treatment on the transfer adhesive film to fix the paste in the grid line grooves.

[0035] The above-mentioned device for preparing a grid line transfer adhesive film includes a pattern transfer module, a paste filling module, and a paste reinforcement module. The pattern transfer module is used to form grid line grooves on the surface of the transfer adhesive film; the grid line grooves correspond to the grid lines of the solar cell; the paste filling module is used to fill the grid line grooves with paste; the paste reinforcement module is used to perform a reinforcement treatment on the transfer adhesive film to fix the paste in the grid line grooves. After the transfer adhesive film is prepared by the device for preparing a grid line transfer adhesive film of the present application, the transfer adhesive film can be directly used for grid preparation, transfer the grid line pattern onto the solar cell substrate, and then sinter the grid line pattern, reducing the grid line preparation steps and being beneficial to improving the production capacity of solar cells.

[0036] In one embodiment, the paste reinforcement module includes:

[0037] A heating unit for heating the transfer adhesive film at a first preset temperature.

[0038] In one embodiment, the paste reinforcement module includes:

[0039] A cooling unit for performing a freezing treatment on the transfer adhesive film at a second preset temperature.

[0040] In one embodiment, it further includes:

[0041] A cleaning module for performing a cleaning treatment on the transfer adhesive film to remove the paste in the transfer adhesive film except for the grid line grooves.

[0042] In one embodiment, it further includes:

[0043] A humidity adjustment module for adjusting the humidity of the environment where the transfer adhesive film is located to a target humidity. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is one of the schematic flowcharts of the method for preparing a grid line transfer adhesive film in an embodiment of the present application;

[0045] Figure 2Schematic diagram of the structure when silver paste and aluminum paste are sequentially filled in each gate line groove in an embodiment of the present application;

[0046] Figure 3 Schematic diagram of the structure when silver paste and copper paste are filled in different gate line grooves respectively in an embodiment of the present application;

[0047] Figure 4 Schematic diagram of filling the paste by a squeegee in an embodiment of the present application;

[0048] Figure 5 Second schematic flow diagram of the method for preparing the gate line transfer film in an embodiment of the present application;

[0049] Figure 6 Third schematic flow diagram of the method for preparing the gate line transfer film in an embodiment of the present application;

[0050] Figure 7 Fourth schematic flow diagram of the method for preparing the transfer film in an embodiment of the present application;

[0051] Figure 8 Schematic diagram of the structure of the transfer film in an embodiment of the present application;

[0052] Figure 9 Fifth schematic flow diagram of the method for preparing the transfer film in an embodiment of the present application;

[0053] Figure 10 Schematic flow diagram of the method for preparing the gate line in an embodiment of the present application;

[0054] Figure 11 Schematic diagram of preparing the gate line transfer film by the gate line transfer film preparation device in an embodiment of the present application.

[0055] Explanation of the reference numerals in the drawings:

[0056] Gate line groove: 210; Silver paste: 220; Aluminum paste: 230; Transfer film: 240; Copper paste: 250; Squeegee: 410; Paste: 420; Pattern transfer module: 1110; Paste filling module: 1120; Paste reinforcement module: 1130. Detailed description of the specific implementation

[0057] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the specific implementation of the present application in detail with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0058] In the description of the present application, it should be understood that the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0059] In the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on the surface" of the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under the surface" of the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0060] In one embodiment, a method for preparing a grid line transfer adhesive film is provided. As Figure 1 one of the flow schematic diagrams of the method for preparing the grid line transfer adhesive film shown, the method for preparing the grid line transfer adhesive film includes the following steps S10Z to step S108.

[0061] Step S102: Provide a transfer adhesive film.

[0062] Among them, the transfer adhesive film can be prepared from any insulating, soft, easily shaped, and having a certain thickness material. It should be noted that although the material for preparing the transfer adhesive film needs to be easily shaped, it is also necessary to ensure that the shaped shape is maintained without deformation after shaping. Further, the color of the transfer adhesive film can be flexibly set according to actual use. Exemplarily, the transfer adhesive film can be transparent, black or other colors. If the light transmittance during the preparation of the transfer adhesive film needs to be satisfied, the transfer adhesive film can be set to be transparent. If it is desired to make the slurry more easily fall off from the grid line grooves, the transfer adhesive film can be prepared from a photosensitive material, and the photosensitive material can be set to black.

[0063] Step S104: Form grid line grooves on the surface of the transfer adhesive film; the grid line grooves correspond to the solar cell grid lines.

[0064] Wherein, there are multiple grid line grooves, and the extension directions of the multiple grid line grooves can be flexibly set according to the actual extension directions of the solar cell grid lines, that is, the extension directions of the multiple grid line grooves can be the same or different. The multiple grid line grooves are set at a preset distance. Wherein, the width and depth of the grid line groove can be flexibly set according to actual needs. For example, the width of the grid line groove can be set to 10um to 50um, specifically, it can be 10um, 15um, 20um, 30um, 35um, 40um, 50um, etc., but not limited thereto. The depth of the grid line groove can be flexibly set according to the slurry filling amount, and the specific value is not limited in this embodiment.

[0065] Step S106 , filling the gate line grooves with slurry.

[0066] The gate line grooves are filled with a paste to form a gate line pattern. For example, the paste filled in step S106 may be silver paste, copper paste, aluminum paste, etc.

[0067] In another exemplary embodiment, the filling of the slurry in the gate line grooves 210 in step S106 may be performed by filling multiple types of slurries in each gate line groove 210 in a predetermined order. Figure 2 The figure is a schematic diagram of the structure in which silver paste 220 and aluminum paste 230 are sequentially filled into each grid line groove 210 in this embodiment. For example, in order to meet the functional requirements of a solar cell substrate for different grid lines, it is necessary to respectively arrange grid lines prepared with silver paste 220 and grid lines prepared with aluminum paste 230 in the metal region on the surface of the solar cell substrate. In this way, silver paste 220 and aluminum paste 230 can be sequentially filled into each grid line groove 210 in the transfer film 240 to form a grid line pattern that meets the requirements for solar cell grid line preparation, thereby transferring the grid line patterns filled with silver paste 220 and aluminum paste 230 to the back side of the solar cell substrate, respectively.

[0068] As another example, different types of slurries may be filled in different gate line grooves 210. Figure 3 This is a schematic diagram of the structure of different gate line grooves 210 in this embodiment when silver paste 220 and copper paste 250 are respectively filled. For example, to meet the requirement of a solar cell substrate to place gate lines made of different types of pastes at different locations, such as placing gate lines made of silver paste 220 at locations with higher requirements for conductivity and environmental adaptability, and placing gate lines made of copper paste 250 at locations that need to withstand a certain weight, different gate line grooves 210 can be filled with silver paste 220 and copper paste 250 to meet these requirements.

[0069] In other examples, it can be understood that, in order to make the preparation of the gate line pattern more stable, slurries containing different organic components can also be filled in the gate line grooves. A slurry containing volatile organic components is provided on one side close to the bottom of the gate line groove, and a slurry containing non-volatile organic components is provided on the side far from the bottom of the gate line groove. Therefore, those skilled in the art can flexibly set the type of slurry filled in the gate line groove according to actual needs, and are not limited to the settings of the above examples in this embodiment.

[0070] Among them, the filled slurry needs to be flush with the gate line groove to ensure the quality of the prepared transfer film. Therefore, after filling the slurry, the transfer film can be cleaned to prevent the slurry from overflowing the gate line groove. The method of filling the slurry in the gate line groove includes but is not limited to scraping, injection, printing, etc. Exemplarily, referring to Figure 4 , attached Figure 4 is a schematic diagram of filling the slurry by the squeegee 410 in this embodiment. Specifically, a preset volume of slurry 420 can be placed at the gate line groove 210; the slurry 420 is filled into the gate line groove 210 by the squeegee 410. It can be understood that with higher requirements for the quality of the solar cell gate lines, gate lines with smaller or larger widths may be prepared. Correspondingly, the width of the gate line groove 210 will also be smaller or larger, and the method of filling the slurry 420 into the gate line groove 210 in this embodiment also needs to meet the above requirements.

[0071] Step S108, perform a reinforcement treatment on the transfer film to fix the slurry in the gate line groove.

[0072] Performing a reinforcement treatment on the transfer film to fix the slurry in the gate line groove to form the final gate line pattern is beneficial for storing the prepared transfer film.

[0073] Exemplarily, the position of the filled gate line groove in the transfer film can be heated to fix the slurry in the gate line groove. The heating temperature can be the first preset temperature, which can be flexibly set according to the material of the transfer film. For example, 30 degrees Celsius to 200 degrees Celsius, specifically, it can be 30°C, 35°C, 40°C, 50°C, 70°C, 90°C, 100°C, 120°C, 150°C, 170°C, 190°C, 200°C, etc.

[0074] Another exemplarily, the position of the filled gate line groove in the transfer film can also be frozen to fix the slurry in the gate line groove. Among them, the temperature of the freezing treatment can be the second preset temperature, which is flexibly set according to the material of the transfer film. For example, below 0 degrees Celsius, it can be -50 degrees Celsius to 0 degrees Celsius, specifically, it can be -50°C, -45°C, -40°C, -30°C, -25°C, -15°C, -10°C, -5°C, 0°C, etc.

[0075] In this embodiment, the method for preparing the above-mentioned gate line transfer film includes providing a transfer film, forming gate line grooves corresponding to the gate lines of the solar cell on the surface of the transfer film, filling the gate line grooves with a paste to form a gate line pattern, and further strengthening the transfer film so that the paste is fixed in the gate line grooves. The transfer film prepared by the transfer film preparation method in this embodiment can be directly used for gate preparation, transfer the gate line pattern onto the solar cell substrate, and then sinter the gate line pattern, which reduces the gate line preparation steps and is beneficial to improving the production capacity of solar cells.

[0076] In one embodiment, as Figure 5 shown in the second flow schematic diagram of the method for preparing the gate line transfer film, before strengthening the transfer film, it further includes step S502: cleaning the transfer film to remove the paste in the transfer film except for the gate line grooves.

[0077] Among them, the methods for cleaning the transfer film include but are not limited to scraping with a scraper, dissolving with chemical agents, etc. Exemplarily, when the adhesion between the paste used and the transfer film is poor, in order to improve the cleaning efficiency, a scraper can be selected to scrape it. Another exemplarily, when the adhesion between the paste used and the transfer film is strong, a sealing fitting or an isolation coating can be provided in the gate line grooves filled with the paste to avoid the influence of chemical agents on the paste in the gate line grooves, and the corresponding chemical agents are used to clean the positions in the transfer film except for the gate line grooves.

[0078] In one embodiment, in order to reduce the difficulty of filling the paste in the gate line grooves and make the paste more easily fall off from the container loading the paste and fall into the gate line grooves, a proper preparation environment for the transfer film can be provided. Therefore, as Figure 6 shown in the third flow schematic diagram of the method for preparing the gate line transfer film, before filling the gate line grooves with the paste, the preparation environment for preparing the transfer film can also be set through the following step S602. Step 602: Adjust the humidity of the environment where the transfer film is located to the target humidity. The target humidity can be flexibly set according to the material of the transfer film and the type of the paste, such as 40% Rh - 50% Rh. Specifically, it can be 40% Rh, 41% Rh, 42% Rh, 43% Rh, 44% Rh, 45% Rh, 46% Rh, 47% Rh, 48% Rh, 49% Rh, 50% Rh, etc.

[0079] Furthermore, in order to ensure the quality of the prepared transfer film, other conditions in the preparation environment of the transfer film can also be set, such as providing a constant temperature, constant pressure, dust-free environment, etc., which is not limited thereto.

[0080] In one embodiment, asFigure 7 Figure 4 is a schematic flow chart of a method for preparing a transfer adhesive film. The method for preparing a grid line transfer adhesive film further includes step S703: winding the transfer adhesive film into a preset shape.

[0081] The preset shape includes at least one of a cylinder, a cube, and a cuboid. Exemplarily, as Figure 8 shown in the schematic structural diagram of the transfer adhesive film, Figure 8 as an example, the transfer adhesive film is wound into a cylinder. In other examples, the winding shape of the transfer adhesive film can be flexibly set according to the equipment and method for transferring the grid line pattern in the prepared transfer adhesive film to the solar cell substrate, and is not limited thereto. Winding the transfer adhesive film into a preset shape in this embodiment is beneficial to the storage, transportation, and use of the transfer adhesive film.

[0082] In one embodiment, as Figure 9 shown in Figure 5 of the schematic flow chart of the method for preparing the transfer adhesive film, the method for preparing the grid line transfer adhesive film includes the following steps S902 to S9014.

[0083] Step S902: Provide a transfer adhesive film.

[0084] Step S904: Form grid line grooves on the surface of the transfer adhesive film; the grid line grooves correspond to the solar cell grid lines.

[0085] Step S906: Adjust the humidity of the environment where the transfer adhesive film is located to a target humidity.

[0086] Step S908: Fill the grid line grooves with a paste.

[0087] Step S910: Clean the transfer adhesive film to remove the paste in the transfer adhesive film except for the grid line grooves.

[0088] Step S9121: Heat the transfer adhesive film at a first preset temperature to fix the paste in the grid line grooves. Or, step S9122: Freeze the transfer adhesive film at a second preset temperature to fix the paste in the grid line grooves.

[0089] Step S914: Wind the transfer adhesive film into a cylinder.

[0090] In this embodiment, the transfer adhesive film prepared by the above method for preparing the grid line transfer adhesive film can be directly used for gate preparation. The grid line pattern is transferred onto the solar cell substrate, and then the grid line pattern is sintered, reducing the grid line preparation steps and being beneficial to improving the production capacity of solar cells.

[0091] In one embodiment, a method for preparing grid lines is provided. As Figure 10Schematic flow chart of the method for preparing grid lines. The method for preparing grid lines in this embodiment includes the following steps S1002 to S1004.

[0092] Step S1002: Provide a substrate.

[0093] Step S1004: Form grid lines on the surface of the substrate through a transfer film; the transfer film is prepared by the method for preparing a grid line transfer film in any of the above embodiments.

[0094] Specifically, the method for preparing the grid line transfer film in the above embodiment may be steps S102 to S108, step S102 → step S104 → step S106 → step S502 → step S108, step 602 → step S102 → step S104 → step S106 → step S108, step S102 → step S104 → step S106 → step S108 → step S702, etc.

[0095] It can be understood that in addition to the above steps S1002 to S1004, the method for preparing grid lines in this embodiment may further include other necessary steps, such as cleaning and drying the substrate, and sintering the substrate after forming the grid lines.

[0096] In this embodiment, the above method for preparing grid lines uses a transfer film to form grid lines on the surface of the substrate. A fixed grid line pattern is formed on the surface of the transfer film, so that the transfer film can directly transfer the grid line pattern onto the solar cell substrate. After forming the grid lines on the surface of the substrate, the grid lines can be sintered, reducing the steps for preparing grid lines and being beneficial to improving the production capacity of solar cells.

[0097] It should be understood that although the steps in the flowcharts of the above-described embodiments are shown in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear indication in this article, the execution of these steps has no strict order limit, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts of the above-described embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0098] In one embodiment, a device for preparing a grid line transfer film is provided, such as Figure 11Schematic diagram of preparing a grid line transfer film by a grid line transfer film preparation device. The grid line transfer film preparation device in this embodiment includes a pattern transfer module 1110, a paste filling module 1120, and a paste reinforcement module 1130. The pattern transfer module 1110 is used to form grid line grooves 210 on the surface of the transfer film 240; the grid line grooves 210 correspond to the grid lines of the solar cell; the paste filling module 1120 is used to fill the paste 420 into the grid line grooves 210; the paste reinforcement module 1130 is used to perform a reinforcement treatment on the transfer film 240 so that the paste 420 is fixed in the grid line grooves 210.

[0099] Among them, the pattern transfer module 1110 may be an imprinting structure corresponding to the shape of the grid line grooves 210, and is used to imprint and form the grid line grooves 210 in the transfer film 240 under pressure. Exemplarily, in this embodiment Figure 11 shows a pattern transfer module 1110 with a spherical main body structure. A protruding structure corresponding to the shape of the grid line grooves 210 is provided around the sphere. The spherical pattern transfer module 1110 rolls clockwise or counterclockwise on the surface of the transfer film 240 under the action of pressure, so as to form grid line grooves 210 on the surface of the transfer film 240.

[0100] In other examples, the pattern transfer module 1110 may also be a pressure column structure. The contact end of the pressure column with the transfer film 240 is provided with an engraving structure having a certain weight and corresponding to the grid line grooves 210. The other end of the pressure column is connected to a power device and moves up and down and moves under the power of the power device. During the process of the pressure column descending, an engraving structure forms a grid line groove 210 in the transfer film 240 under the action of gravity, and then rises and moves in the direction of the next grid line groove 210 to be engraved, and repeats the above engraving operation until all grid line grooves 210 are formed on the surface of the transfer film 240.

[0101] Among them, the paste filling module 1120 may be a feeding device with a preset capacity, which can move and perform the paste 420 feeding operation according to a preset program. The paste filling module 1120 is arranged above the transfer film 240. When moving to the positions corresponding to the formed grid line grooves 210, it feeds a preset capacity of the paste 420 into the grid line grooves 210. When filling the paste of the entire transfer film 240 or the paste 420 of a grid line groove 210, the squeegee 410 performs a filling operation to fill the paste 420 into the grid line grooves 210.

[0102] In this embodiment, the above-mentioned grid line transfer film preparation device includes a pattern transfer module 1110, a paste filling module 1120, and a paste reinforcement module 1130. The pattern transfer module 1110 is used to form grid line grooves 210 on the surface of the transfer film 240; the grid line grooves 210 correspond to the grid lines of the solar cell; the paste filling module 1120 is used to fill the paste 420 into the grid line grooves 210; the paste reinforcement module 1130 is used to perform a reinforcement treatment on the transfer film 240 so that the paste 420 is fixed in the grid line grooves 210. After the transfer film 240 is prepared by the grid line transfer film preparation device in this embodiment, the transfer film 240 can be directly used for grid line preparation, transfer the grid line pattern onto the solar cell substrate, and then sinter the grid line pattern, which reduces the grid line preparation steps and is beneficial to improving the production capacity of solar cells.

[0103] In one embodiment, the paste reinforcement module includes a heating unit, and the heating unit is used to heat the transfer film at a first preset temperature.

[0104] Among them, the first preset temperature can be 30 degrees Celsius to 200 degrees Celsius. Specifically, it can be 30°C, 35°C, 40°C, 50°C, 70°C, 90°C, 100°C, 120°C, 150°C, 170°C, 190°C, 200°C, and so on.

[0105] In one embodiment, the paste reinforcement module includes a cooling unit, and the cooling unit is used to freeze the transfer film at a second preset temperature.

[0106] Among them, the second preset temperature can be -50 degrees Celsius to 0 degrees Celsius. Specifically, it can be -50°C, -45°C, -40°C, -30°C, -25°C, -15°C, -10°C, -5°C, 0°C, and so on.

[0107] In one embodiment, the grid line transfer film preparation device further includes a cleaning module, and the cleaning module is used to clean the transfer film to remove the paste in the transfer film except for the grid line grooves.

[0108] In one embodiment, the grid line transfer film preparation device further includes a humidity adjustment module, and the humidity adjustment module is used to adjust the humidity of the environment where the transfer film is located to a target humidity.

[0109] The technical features of the above-mentioned embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as the combinations of these technical features do not conflict, they should be considered as the scope described in this specification.

[0110] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A preparation method of a gate line transfer adhesive film, characterized in that Including: Providing a transfer adhesive film; Forming grid line grooves on the surface of the transfer adhesive film; the grid line grooves correspond to the grid lines of the solar cell; Filling the grid line grooves with paste; Performing a strengthening treatment on the transfer adhesive film so that the paste is fixed in the grid line grooves.

2. The method for preparing a gate line transfer adhesive film according to claim 1, wherein The performing a strengthening treatment on the transfer adhesive film includes: Heating the transfer adhesive film at a first preset temperature.

3. The method for preparing a gate line transfer adhesive film according to claim 2, characterized in that, The first preset temperature includes 30 °C to 200 °C.

4. The method for preparing a gate line transfer adhesive film according to claim 1, wherein The performing a strengthening treatment on the transfer adhesive film includes: Performing a freezing treatment on the transfer adhesive film at a second preset temperature.

5. The method for preparing a gate line transfer adhesive film according to claim 4, characterized in that, The second preset temperature includes -50 °C to 0 °C.

6. The method for preparing a gate line transfer adhesive film according to any one of claims 1 to 5, characterized in that, Before performing the strengthening treatment on the transfer adhesive film, it further includes: Performing a cleaning treatment on the transfer adhesive film to remove the paste in the transfer adhesive film except for the grid line grooves.

7. The method for preparing a gate line transfer adhesive film according to claim 1, wherein The filling the grid line grooves with paste includes: Filling various types of the paste in each of the grid line grooves in a preset order.

8. The method for preparing a gate line transfer adhesive film according to claim 1 or 7, characterized in that, Before filling the grid line grooves with paste, it further includes: Adjusting the humidity of the environment where the transfer adhesive film is located to a target humidity.

9. The method for preparing a gate line transfer adhesive film according to claim 8, characterized in that, The target humidity includes 40% Rh to 50% Rh.

10. The method for preparing a gate line transfer adhesive film according to claim 1, wherein The width of the grid line grooves includes 10 μm to 50 μm.

11. The method for preparing a gate line transfer adhesive film according to claim 1, wherein It further includes: Winding the transfer adhesive film into a preset shape; the preset shape includes at least one of a cylinder, a cube, and a cuboid.

12. A method for preparing grid lines, characterized in that, Including: Providing a substrate; Forming grid lines on the surface of the substrate through the transfer adhesive film; the transfer adhesive film is prepared by the grid line transfer adhesive film preparation method according to any one of claims 1 to 11.

13. A preparation device for a grid line transfer adhesive film, characterized in that, Including: A pattern transfer module for forming grid line grooves on the surface of the transfer adhesive film; the grid line grooves correspond to the grid lines of the solar cell; A paste filling module for filling the grid line grooves with paste; A paste strengthening module for performing a strengthening treatment on the transfer adhesive film so that the paste is fixed in the grid line grooves.

14. The grid line transfer adhesive film preparation device according to claim 13, characterized in that, The paste strengthening module includes: A heating unit for heating the transfer adhesive film at a first preset temperature.

15. The apparatus for preparing a grid line transfer adhesive film according to claim 13, wherein, The paste strengthening module includes: A cooling unit for performing a freezing treatment on the transfer adhesive film at a second preset temperature.

16. The device for preparing the grid line transfer adhesive film according to claim 13, characterized in that, It further includes: A cleaning module for performing a cleaning treatment on the transfer adhesive film to remove the paste in the transfer adhesive film except for the grid line grooves.

17. The device for preparing the grid line transfer adhesive film according to claim 13, characterized in that It further includes: A humidity adjustment module for adjusting the humidity of the environment where the transfer adhesive film is located to a target humidity.

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