Color conversion module manufacturing method, color conversion module and display equipment

Abstract

The invention discloses a color conversion module manufacturing method, a color conversion module and display equipment, and relates to the technical field of semiconductors. The manufacturing method of the color conversion module comprises the steps that a substrate is provided, and a fence layer is manufactured on one side of the substrate; grooving the enclosure layer to obtain an accommodating groove for exposing the substrate and a retaining wall surrounding the accommodating groove; a hydrophobic layer is manufactured on the side, away from the substrate, of the retaining wall; a hydrophilic layer is manufactured on the inner wall of the side, facing the containing groove, of the retaining wall; and filling a color conversion material in the accommodating groove at the preset position, and curing to form a color conversion unit.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a method for manufacturing a color conversion module, a color conversion module, and a display device. Background Art

[0002] Micro-LEDs (Micro Light Emitting Diodes) are densely integrated LED arrays with advantages such as low power consumption, high brightness, long life, and high contrast. With the gradual development of display technology, Micro-LED displays have gradually become a trend in new display technologies.

[0003] The full-colorization of Micro-LEDs has become a mainstream research direction by adopting color conversion solutions, which can circumvent the difficulties of multi-color chip transfer. However, the display effect of display devices using color conversion modules for full-color Micro-LEDs needs to be improved. Summary of the Invention

[0004] The present application provides a color conversion module manufacturing method, a color conversion module and a display device to reduce the probability of occurrence of optical crosstalk problems in the display device.

[0005] In a first aspect, the present application provides a method for manufacturing a color conversion module, comprising:

[0006] Providing a substrate, and manufacturing a barrier layer on one side of the substrate;

[0007] Cutting grooves in the enclosure layer to obtain a receiving groove exposing the substrate and a retaining wall surrounding the receiving groove;

[0008] forming a hydrophobic layer on a side of the retaining wall facing away from the substrate;

[0009] A hydrophilic layer is formed on the inner wall of the retaining wall facing the accommodating tank;

[0010] The color conversion material is filled in the accommodating groove at the preset position and solidified to form a color conversion unit.

[0011] In some possible implementations, the hydrophobic layer includes at least one of hydrophobic photoresist, Teflon, a silane coupling agent, octadecyltrichlorosilane, and polydimethylsiloxane.

[0012] In some possible implementations, the hydrophilic layer includes at least one of aluminum, silver, polyethylene glycol derivatives, modified polyvinyl alcohol, and photocurable hydrophilic acrylate resin.

[0013] In some possible embodiments, the thickness n of the hydrophilic layer satisfies 50 nm ≤ n ≤ 100 nm.

[0014] In some possible embodiments, fabricating the hydrophilic layer on the inner wall of the retaining wall facing the accommodating groove includes:

[0015] Depositing a hydrophilic material on the retaining wall and the substrate to obtain an initial hydrophilic layer, and covering the hydrophobic layer with the initial hydrophilic layer;

[0016] Etching the initial hydrophilic layer to expose the substrate and the surface of the hydrophobic layer facing away from the substrate, and fabricating the hydrophilic layer on the inner wall of the retaining wall facing the accommodating groove.

[0017] In some possible embodiments, before filling the accommodating groove with a color conversion material and curing to form a color conversion unit, it further includes:

[0018] Fabricating a light filtering layer in the accommodating groove.

[0019] In a second aspect, the present application further provides a color conversion module, including:

[0020] A substrate;

[0021] A retaining wall, disposed on one side of the substrate and enclosing to form an accommodating groove;

[0022] A hydrophilic layer, disposed on the inner wall of the retaining wall facing the accommodating groove;

[0023] A hydrophobic layer, disposed on the surface of the retaining wall facing away from the substrate;

[0024] A color conversion unit, filled in the accommodating groove at a preset position.

[0025] In some possible embodiments, both the retaining wall and the hydrophobic layer are made of a hydrophobic photoresist, and the retaining wall and the hydrophobic layer are an integral structure.

[0026] In some possible embodiments, the color conversion module further includes a light filtering layer, and the light filtering layer is disposed in the accommodating groove;

[0027] In the accommodating groove at the preset position, the light filtering layer is located between the substrate and the color conversion unit.

[0028] In a third aspect, the present application further provides a display device, including a display module and the color conversion module provided in each of the above embodiments;

[0029] One side of the hydrophilic layer facing away from the substrate and one side of the hydrophobic layer facing away from the substrate are both bonded to the display module.

[0030] Advantages of the present application: In the method for manufacturing a color conversion module provided in the present application, a hydrophobic layer is provided on the side of the partition wall facing away from the substrate. Thus, the possibility of the color conversion material adhering to the side of the partition wall facing away from the substrate can be reduced. Furthermore, when filling the color conversion material into the accommodation groove, the probability of the color conversion material overflowing from the accommodation groove can be reduced, that is, the probability of the color conversion unit overflowing relative to the accommodation groove can be reduced. In addition, in the present application, a hydrophilic layer is provided on the inner wall of the partition wall facing the accommodation groove, which is more conducive to the color conversion material entering the accommodation groove. When filling the color conversion material into the accommodation groove, the probability of the color conversion unit having depressions and defects can be reduced. Furthermore, after applying the color conversion module to a display device, the light generated by the light-emitting points in the display module can be prevented from being transmitted to adjacent positions through the overflow part of the color conversion unit, thereby causing optical crosstalk, and the display effect of the display device can be improved. Description of the Drawings

[0031] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0032] Figure 1 Shows a schematic flow chart of a method for manufacturing a color conversion module in some embodiments;

[0033] Figure 2 Shows a schematic structural diagram of a substrate and a surrounding layer in some embodiments;

[0034] Figure 3 Shows a schematic structural diagram of a partition wall and an accommodation groove in some embodiments;

[0035] Figure 4 Shows a schematic flow chart of manufacturing a hydrophilic layer in some embodiments;

[0036] Figure 5 Shows a schematic structural diagram of manufacturing an initial hydrophilic layer in some embodiments;

[0037] Figure 6 Shows a schematic structural diagram of manufacturing a hydrophilic layer in some embodiments;

[0038] Figure 7 Shows a schematic structural diagram of manufacturing a light filtering layer in some embodiments;

[0039] Figure 8 Shows a schematic structural diagram of a color conversion module in some embodiments;

[0040] Figure 9The structural schematic diagram of a display device in some embodiments is shown.

[0041] Description of main component symbols:

[0042] 100 - Color conversion module;

[0043] 110 - Substrate;

[0044] 120 - Enclosure layer; 121 - Retaining wall; 122 - Accommodating groove;

[0045] 131 - Hydrophobic layer; 132 - Hydrophilic layer; 1321 - Initial hydrophilic layer;

[0046] 140 - Filter layer;

[0047] 150 - Color conversion unit;

[0048] 200 - Display module; 210 - Light - emitting chip; 220 - Driving board. Detailed implementation manners

[0049] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application.

[0050] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application.

[0051] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0052] In this application, unless otherwise clearly specified or limited, the terms "installed", "connected", "connected", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] In this application, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0054] As Figure 1 and Figure 8 shown, in an embodiment, a method for manufacturing a color conversion module is provided, which can be used to manufacture the color conversion module 100 in a display device, provide a color conversion function, and realize the full-colorization of the display device.

[0055] As Figure 1 , Figure 2 and Figure 8 shown, in some embodiments, the method for manufacturing a color conversion module may include:

[0056] S100, provide a substrate 110, and fabricate a surrounding layer 120 on one side of the substrate 110.

[0057] In some embodiments, the substrate 110 may be selected from substrate structures such as a silicon glass substrate or a quartz glass substrate.

[0058] In some embodiments, before fabricating the surrounding layer 120 on one side of the substrate 110, the surface of the substrate 110 may be cleaned by an ion cleaning process to remove contaminants on the surface of the substrate 110. On the one hand, the connection strength between the surrounding layer 120 and the substrate 110 can be ensured, and on the other hand, the influence of contaminants on the light transmission can be avoided.

[0059] In some embodiments, a hydrophobic photoresist may be coated on one side of the substrate 110 by a spin coating process, and the hydrophobic photoresist may be cured by thermal curing, ultraviolet curing or natural curing to fabricate the surrounding layer 12 on one side of the substrate 110. That is, the surrounding layer 120 may be made of a hydrophobic photoresist.

[0060] In the embodiment, the thickness of the enclosure layer 120 can be set to be from 1 μm to 3 μm, which can provide a manufacturing space for the subsequent filter layer 140 and color conversion unit 150. Exemplarily, the thickness of the enclosure layer 120 can be set to 1 μm, 1.2 μm, 1.5 μm, 1.8 μm, 2.2 μm, 2.5 μm, 2.7 μm, 3 μm or any other thickness within the range of 1 μm to 3 μm.

[0061] S200, a groove is formed in the enclosure layer 120 to obtain a receiving groove 122 exposing the substrate 110 and a retaining wall 121 surrounding the receiving groove 122.

[0062] As Figures 1 to 3 , in some embodiments, the enclosure layer 120 can be etched through a photolithography process to achieve patterning of the enclosure layer 120, obtaining the receiving groove 122 and the retaining wall 121. It can be understood that the hydrophobic photoresist at the position of the receiving groove 122 can be etched away, exposing the substrate 110 at the corresponding position of the receiving groove 122, and the hydrophobic photoresist at the position of the retaining wall 121 is retained.

[0063] In some embodiments, the enclosure layer 120 can be provided with a plurality of receiving grooves 122, and the plurality of receiving grooves 122 can be arranged in an array. The retaining walls 121 between two adjacent receiving grooves 122 can be shared.

[0064] S300, a hydrophobic layer 131 is formed on the side of the retaining wall 121 facing away from the substrate 110.

[0065] In the embodiment, when the hydrophobic layer 131 is formed on the side of the retaining wall 121 facing away from the substrate 110, during the subsequent process of filling the color conversion material, it can prevent the color conversion material from adhering to the side of the retaining wall 121 facing away from the substrate 110, reducing the probability of the color conversion material overflowing. Furthermore, it can avoid the overflowed color conversion material from conducting light to adjacent positions, avoid the overlap of different color spectra, reduce the occurrence probability of the optical crosstalk problem, improve the color gamut coverage of the display device, enhance the contrast of the display device and improve the display effect.

[0066] In some embodiments, the hydrophobic layer 131 can also be made of hydrophobic photoresist. Correspondingly, the hydrophobic layer 131 can be realized synchronously during the process of forming the retaining wall 121, that is, the hydrophobic layer 131 and the retaining wall 121 can be an integral structure. Thus, the processing technology of the color conversion module 100 can be simplified, the processing flow can be reduced, the processing efficiency of the color conversion module 100 can be improved, and the production capacity can be enhanced.

[0067] In some other embodiments, the retaining wall 121 can also be made of metals such as aluminum, titanium or copper. A hydrophobic material can be coated on the side of the retaining wall 121 facing away from the substrate 110 by means of a spraying process or the like to obtain the hydrophobic layer 131. Among them, the hydrophobic material can be a combination of one or more of hydrophobic photoresist, Teflon, silane coupling agent, octadecyltrichlorosilane and polydimethylsiloxane.

[0068] S400, fabricate a hydrophilic layer 132 on the inner wall of the side of the retaining wall 121 facing the receiving groove 122.

[0069] Such as Figures 3 to 6 shown, in some embodiments, step S400 may include:

[0070] S410, deposit a hydrophilic material on the retaining wall 121 and the substrate 110 to obtain an initial hydrophilic layer 1321, and make the initial hydrophilic layer 1321 cover the hydrophobic layer 131.

[0071] In some embodiments, a metal-based hydrophilic material can be deposited on the substrate 110 and the retaining wall 121 by means of magnetron sputtering. Among them, the initial hydrophilic layer 1321 can cover the surface of the hydrophobic layer 131 facing away from the substrate 110, the inner wall of the side of the retaining wall 121 facing the receiving groove 122, and the surface of the substrate 110 facing the receiving groove 122. In the embodiment, the thickness of the hydrophilic material deposited on the substrate 110 and the surface of the hydrophobic layer 131 facing away from the substrate 110 can be 200 nm to 500 nm.

[0072] In some embodiments, the hydrophilic material can include at least one of aluminum and silver.

[0073] S420, etch the initial hydrophilic layer 1321 to expose the surface of the substrate 110 and the side of the hydrophobic layer 131 facing away from the substrate 110, and fabricate the hydrophilic layer 132 on the inner wall of the side of the retaining wall 121 facing the receiving groove 122.

[0074] In some embodiments, a dry etching process such as ion beam etching (IBE) or inductively coupled plasma (ICP) can be used to etch the initial hydrophilic layer 1321 to remove the hydrophilic material at the position on the substrate 110 opposite to the receiving groove 122 and the hydrophilic material on the side of the hydrophobic layer 131 facing away from the substrate 110, so that the surface of the substrate 110 and the side of the hydrophobic layer 131 facing away from the substrate 110 are exposed. Exemplarily, when using the IBE etching process, the working parameters can be set as follows: the argon flow rate is 20 sccm, the beam voltage is 500 V, and the etching time is 3 min to 5 min.

[0075] In an embodiment, the hydrophilic layer 132 is made of aluminum and / or silver, and the hydrophilic layer 132 can be used as a reflective layer. During the use of the display device, the hydrophilic layer 132 can reflect the light generated by the display module 200, so that the light is emitted from the light-emitting side of the display device as much as possible, improving the display brightness of the display device and the display effect of the display device.

[0076] In other embodiments, the hydrophilic layer 132 can also be made of at least one of polyethylene glycol derivatives, modified polyvinyl alcohol, and photocurable hydrophilic acrylate resin. Alternatively, the hydrophilic layer 132 can be made of a combination of multiple materials including aluminum, silver, polyethylene glycol derivatives, modified polyvinyl alcohol, and photocurable hydrophilic acrylate resin.

[0077] During the etching process of the initial hydrophilic layer 1321, there will be an anti-sputtering effect, causing the etched hydrophilic material on the surface of the substrate 110 to be deposited on the inner wall of the retaining wall 121 facing the accommodating groove 122, increasing the thickness of the hydrophilic material on the inner wall of the retaining wall 121 facing the accommodating groove 122, and obtaining the hydrophilic layer 132 with the required thickness. Thus, the utilization of the hydrophilic material can be improved and the waste of the hydrophilic material can be reduced.

[0078] In some embodiments, the angle α between the retaining wall 121 and the substrate 110 can be set such that 70° ≤ α ≤ 85°, that is, the inner wall of the retaining wall 121 facing the accommodating groove 122 is inclined towards the inner cavity of the accommodating groove 122. Thus, the possibility of the hydrophilic material being deposited on the retaining wall 121 during the etching process can be increased, so as to obtain the hydrophilic layer 132 with the required thickness on the inner wall of the retaining wall 121 facing the accommodating groove 122, further reducing the waste of the hydrophilic material. Exemplarily, the angle α between the retaining wall 121 and the substrate 110 can be set to 70°, 72°, 75°, 80°, 81°, 83°, 85°, or any other angle between 70° and 85°.

[0079] In some embodiments, the thickness n of the hydrophilic layer 132 can be set such that 50nm ≤ n ≤ 100nm. While ensuring the provision of an effective hydrophilic function to better fill the quantum dot material in the accommodating groove 122, it can also ensure that the enclosure layer 120 has a larger aperture ratio, ensuring the smooth output of light, improving the light extraction efficiency, and improving the display effect of the display structure. In the embodiment, the aperture ratio of the enclosure layer 120 can reach more than 60%. Exemplarily, the thickness n of the hydrophilic layer 132 can be set to 50nm, 55nm, 65nm, 68nm, 72nm, 75nm, 80nm, 85nm, 88nm, 90nm, 92nm, 95nm, 97nm, 100nm, or any other value between 50nm and 100nm.

[0080] S500, fabricate a light filtering layer 140 in the accommodating groove 122.

[0081] AsFigure 1 and Figure 7 In some embodiments, a negative photoresist may be filled in the receiving groove 122 through a spin coating process, and the negative photoresist may be etched in combination with a photolithography process to retain the photoresist in the receiving groove 122 and form a filter layer 140 in the receiving groove 122. Thus, the filter layer 140 can filter the passing light to achieve filtering of a specific wavelength band and reduce the leakage of un-converted color laser light emission. Among them, when performing photolithography, the alignment accuracy of the mask plate needs to be controlled within 0.5 μm.

[0082] In the embodiment, three adjacent receiving grooves 122 may form a unit, which may correspond to three different light-emitting points of the same pixel point in the display device. In the receiving grooves 122 corresponding to the three different light-emitting points of the same pixel point, different types of filter layers 140 may be respectively arranged. Specifically, the filter layer 140 in one of the receiving grooves 122 can be used to filter other light except blue light, that is, the filter layer 140 in this receiving groove 122 can be a blue light filter layer. The filter layer 140 in one of the receiving grooves 122 can be used to filter other light except green light, that is, the filter layer 140 in this receiving groove 122 can be a green light filter layer. The filter layer 140 in another receiving groove 122 can be used to filter other light except red light, that is, the filter layer 140 in this receiving groove 122 can be a red light filter layer. Correspondingly, different types of negative photoresists can be filled in the receiving grooves 122 at different light-emitting point positions of the same pixel point to achieve different filtering effects.

[0083] In some embodiments, the thickness m of the filter layer 140 can be set such that 1.5 μm ≤ m ≤ 2 μm. Exemplarily, the thickness m of the filter layer 140 can be set to 1.5 μm, 1.65 μm, 1.7 μm, 1.9 μm, 2 μm or any other value between 1.5 μm and 2 μm.

[0084] S600, fill a color conversion material in the receiving groove 122 at a preset position and cure it to form a color conversion unit 150.

[0085] Such as Figure 1 、 Figure 7 and Figure 8As shown, in some embodiments, the color conversion material can be filled in the accommodation groove 122 at a preset position. Wherein, a hydrophobic layer 131 is provided on the side of the retaining wall 121 facing away from the substrate 110, and the contact angle between the hydrophobic layer 131 and the color conversion material is > 100°, which can prevent the color conversion material from adhering to the side of the retaining wall 121 facing away from the substrate 110, that is, it can prevent the color conversion material from overflowing relative to the accommodation groove 122. In addition, a hydrophilic layer 132 is provided on the inner wall of the retaining wall 121 facing the accommodation groove 122, and the contact angle between the hydrophilic layer 132 and the color conversion material is < 30°. The color conversion material can be evenly spread along the hydrophilic layer 132 to avoid missing, so that the color conversion material can be better filled in the accommodation groove 122. In the embodiment, the color conversion material can be a quantum dot photoresist, and the quantum dot material can be a quantum dot material such as cadmium-based quantum dots (CdSe / ZnS) or perovskite quantum dots.

[0086] In other embodiments, the color conversion material can also be other materials such as phosphors, or a composition of a quantum dot photoresist and other materials such as phosphors.

[0087] In the embodiment, in the accommodation grooves 122 corresponding to different light-emitting points of the same pixel, different types of color conversion materials can be filled to convert different colors of light, that is, different colors of light can be emitted at different light-emitting point positions of the same pixel, realizing the full-colorization of the display device.

[0088] In some embodiments, the display module 200 of the display device can be a blue light display module. Correspondingly, there is no need to provide a color conversion unit 150 in the accommodation groove 122 corresponding to the blue light position.

[0089] In other embodiments, the display module 200 can be a purple light display module. Correspondingly, a corresponding color conversion unit 150 can also be provided in the accommodation groove 122 corresponding to the blue light position to provide a color conversion function.

[0090] In the embodiment, the color conversion material can be filled in the accommodation groove 122 at a preset position by processes such as lithography, deposition, or inkjet printing.

[0091] After that, the filled color conversion material can be cured by ultraviolet light to form the color conversion unit 150. Among them, the parameters of the ultraviolet light can be set as a wavelength of 365 nm and a dose of 200 mJ / cm 2 。

[0092] In the embodiments of the present application, a hydrophobic layer 131 is provided on the side of the retaining wall 121 facing away from the substrate 110, which can reduce the possibility of the color conversion material adhering to the side of the retaining wall 121 facing away from the substrate 110. Furthermore, when filling the color conversion material into the accommodating groove 122, the probability of the color conversion material overflowing from the accommodating groove 122 can be reduced, that is, the probability of the color conversion unit 150 overflowing relative to the accommodating groove 122 can be reduced. In the embodiments of the present application, a hydrophilic layer 132 is provided on the inner wall of the retaining wall 121 facing the accommodating groove 122, which is more conducive to the color conversion material entering the accommodating groove 122. When filling the color conversion material into the accommodating groove 122, the probability of the color conversion unit 150 having depressions and deficiencies can be reduced. Furthermore, after applying the color conversion module 100 to a display device, the light generated by the light-emitting points in the display module 200 passing through the overflow part of the color conversion unit 150 to adjacent positions can be reduced, thereby improving the display effect of the display device.

[0093] As Figure 8 shown, in the embodiments, a color conversion module 100 is further provided, which can be made by the color conversion module manufacturing method provided in the embodiments.

[0094] In some embodiments, the color conversion module 100 may include a substrate 110, a retaining wall 121, a hydrophilic layer 132, a hydrophobic layer 131, and a color conversion unit 150.

[0095] Among them, the retaining wall 121 is disposed on one side of the substrate 110 and encloses an accommodating groove 122. In the embodiments, a plurality of accommodating grooves 122 may be provided and may be arranged in an array. The retaining wall 121 between two adjacent accommodating grooves 122 may be shared.

[0096] In some embodiments, the included angle α between the inner wall of the retaining wall 121 facing the substrate 110 and the substrate 110 may be set to 70° ≤ α ≤ 85°, that is, the inner wall of the retaining wall 121 facing the accommodating groove 122 inclines towards the inner cavity of the accommodating groove 122. Thus, during the manufacturing process of the color conversion module 100, the possibility of the hydrophilic material being deposited on the retaining wall 121 during the etching process can be increased, so as to obtain a hydrophilic layer 132 with a required thickness on the inner wall of the retaining wall 121 facing the accommodating groove 122, improving the material utilization rate.

[0097] In some embodiments, the hydrophilic layer 132 is disposed on the inner wall of the retaining wall 121 facing the accommodating groove 122. Among them, the hydrophilic layer 132 may be made of at least one of aluminum, silver, polyethylene glycol derivatives, modified polyvinyl alcohol, and photocurable hydrophilic acrylate resin. In addition, the thickness n of the hydrophilic layer 132 may be set to 50 nm ≤ n ≤ 100 nm.

[0098] In an embodiment, the hydrophobic layer 131 may be disposed on a surface of the retaining wall 121 facing away from the substrate 110. In some embodiments, both the hydrophobic layer 131 and the retaining wall 121 may be made of a hydrophobic photoresist, and the hydrophobic layer 131 and the retaining wall 121 may be an integral structure. Thus, the processing steps of the color conversion module 100 can be reduced, and the processing efficiency of the color conversion module 100 can be improved.

[0099] In some other embodiments, the retaining wall 121 may be made of a metal such as aluminum, titanium, or copper. The hydrophobic layer 131 may be made of one or a combination of a hydrophobic photoresist, Teflon, a silane coupling agent, octadecyltrichlorosilane, and polydimethylsiloxane.

[0100] In an embodiment, the color conversion unit 150 may be disposed in the receiving groove 122 at a preset position. In some embodiments, the color conversion module 100 may include different types of color conversion units 150. Three adjacent receiving grooves 122 may form a unit, which may correspond to the settings of three different light-emitting points of the same pixel in the display device. In the receiving grooves 122 corresponding to different light-emitting points of the same pixel, different types of color conversion units 150 may be disposed to achieve the conversion of different color lights, so that different color lights can be emitted from different light-emitting points of the same pixel. In some embodiments, the color conversion unit 150 may not be disposed in some of the receiving grooves 122. For example, when the display module 200 of the display device is a blue light display module, the color conversion unit 150 may not be required to be disposed in the receiving groove 122 at the position for emitting blue light.

[0101] In an embodiment, a surface of the color conversion unit 150 facing away from the substrate 110 may be flush with a surface of the hydrophobic layer 131 facing away from the substrate 110.

[0102] In some embodiments, the color conversion module 100 further includes a filter layer 140, and the filter layer 140 may be disposed in the receiving groove 122. In an embodiment, the filter layer 140 may also include multiple types. For example, the filter layer 140 may include a red light filter layer, a blue light filter layer, and a green light filter layer. Among them, in the receiving groove 122 corresponding to the position for emitting red light of the same pixel, a red light filter layer may be disposed, in the receiving groove 122 corresponding to the position for emitting green light of the same pixel, a green light filter layer may be disposed, and in the receiving groove 122 corresponding to the position for emitting blue light of the same pixel, a blue light filter layer may be disposed.

[0103] Such as Figure 8 and Figure 9As shown in the figure, an embodiment also provides a display device, including a display module 200 and the color conversion module 100 provided in the embodiment. Among them, both the side of the hydrophilic layer 132 facing away from the substrate 110 and the side of the hydrophobic layer 131 facing away from the substrate 110 in the color conversion module 100 can be bonded to the display module 200 by means of adhesion. In the embodiment, the display module 200 may include a light-emitting chip 210 and a driving board 220 connected by bonding. The color conversion module 100 may be bonded to the side of the light-emitting chip 210 facing away from the driving board 220.

[0104] In the embodiment, when bonding the color conversion module 100 to the display module 200, glue may be coated on the surface of the color conversion module 100 and / or the light-emitting chip 210 facing away from the driving board 220, and the color conversion module 100 and the display module 200 may be aligned and bonded through a high-precision alignment system. The alignment accuracy is controlled within 0.5 μm to ensure that each color conversion unit 150 in the color conversion module 100 is accurately aligned with each light-emitting point in the display module 200 one by one. Then, the color conversion module 100 and the display module 200 may be pressed tightly through a hot pressing process to enhance the connection strength between the color conversion module 100 and the display module 200. Among them, the temperature during the hot pressing process may be set to 80 - 100 °C, and the pressure may be set to 0.5 - 1 MPa.

[0105] In some embodiments, the display device may be applied to an electronic device to implement extended reality (XR) technologies such as augmented reality (AR), virtual reality (VR), and mixed reality (MR). When implemented, the display device may be the projection part of the electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the display device may also be the display part of the electronic device. For example, the electronic device may include: any device with a display screen such as a smartphone, a smartwatch, a laptop computer, a tablet computer, a driving recorder, a navigator, a head-mounted device, etc.; for still another example, the display device may also be the lighting part of the electronic device. For example, the electronic device may include: any device with a lighting component such as a vehicle, a street lamp, etc.

[0106] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0107] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A method for manufacturing a color conversion module, characterized in that, include: Providing a substrate, and manufacturing a barrier layer on one side of the substrate; Cutting grooves in the enclosure layer to obtain a receiving groove exposing the substrate and a retaining wall surrounding the receiving groove; forming a hydrophobic layer on a side of the retaining wall facing away from the substrate; A hydrophilic layer is formed on the inner wall of the retaining wall facing the accommodating tank; The color conversion material is filled in the accommodating groove at the preset position and solidified to form a color conversion unit.

2. The method for manufacturing a color conversion module according to claim 1, wherein The hydrophobic layer includes at least one of hydrophobic photoresist, Teflon, a silane coupling agent, octadecyltrichlorosilane and polydimethylsiloxane.

3. The method for manufacturing the color conversion module according to claim 1, wherein The hydrophilic layer includes at least one of aluminum, silver, polyethylene glycol derivatives, modified polyvinyl alcohol, and photocurable hydrophilic acrylate resin.

4. The method for manufacturing a color conversion module according to claim 1, wherein The thickness n of the hydrophilic layer is 50 nm ≤ n ≤ 100 nm.

5. The method for manufacturing a color conversion module according to any one of claims 1 to 4, characterized in that The step of forming a hydrophilic layer on the inner wall of the retaining wall facing the accommodating groove comprises: Depositing a hydrophilic material on the retaining wall and the substrate to form an initial hydrophilic layer, and making the initial hydrophilic layer cover the hydrophobic layer; The initial hydrophilic layer is etched to expose the substrate and the surface of the hydrophobic layer facing away from the substrate, and the hydrophilic layer is formed on the inner wall of the retaining wall facing the receiving groove.

6. The method for manufacturing the color conversion module according to claim 1, wherein The color conversion material is filled in the containing groove and solidified to form the color conversion unit, and the method further includes: A filter layer is manufactured in the accommodating groove.

7. A color conversion module, characterized in that, include: substrate; A retaining wall is provided on one side of the base plate and encloses a receiving groove; A hydrophilic layer is provided on the inner wall of the retaining wall facing the accommodating groove; a hydrophobic layer, disposed on a surface of the retaining wall facing away from the substrate; The color conversion unit is filled in the accommodating groove at a preset position.

8. The color conversion module according to claim 7, wherein The retaining wall and the hydrophobic layer are both made of hydrophobic photoresist, and the retaining wall and the hydrophobic layer are an integrated structure.

9. The color conversion module according to claim 7 or 8, wherein The color conversion module further includes a filter layer, and the filter layer is disposed in the receiving groove; In the accommodating groove at a preset position, the filter layer is located between the substrate and the color conversion unit.

10. A display device, characterized in that, comprising a display module and a color conversion module as claimed in any one of claims 7 to 9; The side of the hydrophilic layer facing away from the substrate and the side of the hydrophobic layer facing away from the substrate are both bonded to the display module.

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