Display panel and display device

Abstract

The embodiment of the invention provides a display panel and a display device, the display panel comprises a display area and a non-display area surrounding at least part of the display area, and the display panel comprises a substrate; the pixel defining layer is arranged on the substrate, the pixel defining layer comprises a pixel limiting part located in the display area and a defining part located in the non-display area, and a plurality of pixel openings are formed in the pixel limiting part; the light-emitting layer comprises light-emitting units located at the pixel openings; the packaging layer is located on the side, away from the substrate, of the light-emitting layer, the packaging layer comprises a first packaging layer and a second packaging layer located on the side, away from the light-emitting layer, of the first packaging layer, the first packaging layer is located in the display area and used for packaging the light-emitting units, and at least part of the second packaging layer extends to the non-display area and is in contact connection with the defining part. According to the embodiment of the invention, the packaging performance of the packaging layer can be improved, and the overall processing performance of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) displays, also known as organic electroluminescent displays, offer a host of advantages over existing liquid crystal displays (LCDs), including autonomous illumination, wide viewing angles, ultra-lightness, ultra-thinness, high brightness, low power consumption, and fast response times. Their response speed can be up to 1,000 times that of LCDs. Consequently, OLED displays have become a highly popular flat-panel display product both domestically and internationally, boasting broad application prospects.

[0003] However, the current process performance of display panels needs to be improved. Summary of the Invention

[0004] Embodiments of the present application provide a display panel and a display device, aiming to improve the process performance of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, which includes a display area and a non-display area arranged around at least part of the display area, the display panel including: a substrate; a pixel definition layer arranged on the substrate, the pixel definition layer including a pixel defining portion located in the display area and a definition portion located in the non-display area, a plurality of pixel openings being provided on the pixel defining portion; a light-emitting layer including a light-emitting unit located in the pixel opening; an encapsulation layer located on a side of the light-emitting layer away from the substrate, the encapsulation layer including a first encapsulation layer and a second encapsulation layer located on a side of the first encapsulation layer away from the light-emitting layer, the first encapsulation layer being located in the display area and including an encapsulation portion that encapsulates the light-emitting unit, and at least part of the second encapsulation layer extending to the non-display area and being in contact with and connected to the definition portion.

[0006] According to an embodiment of the first aspect of the present application, the material of the pixel definition layer includes an inorganic material.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the second encapsulation layer includes an organic material.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first encapsulation layer includes an inorganic material.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the pixel definition layer includes at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel definition layer is a single film layer, or the pixel definition layer includes a plurality of stacked film layers.

[0011] According to any of the foregoing embodiments of the first aspect of the present application, the encapsulation layer further includes a third encapsulation layer on the side of the second encapsulation layer facing away from the substrate. The portion of the third encapsulation layer in the non-display area extends out of the second encapsulation layer and is in contact connection with the defining portion.

[0012] According to any of the foregoing embodiments of the first aspect of the present application, the edge of the orthographic projection of the second encapsulation layer on the substrate is located on the side of the outer edge of the orthographic projection of the defining portion on the substrate facing the display area.

[0013] According to any of the foregoing embodiments of the first aspect of the present application, the orthographic projection of the second encapsulation layer on the substrate is located within the orthographic projection of the third encapsulation layer on the substrate.

[0014] According to any of the foregoing embodiments of the first aspect of the present application, the material of the third encapsulation layer includes an inorganic material.

[0015] According to any of the foregoing embodiments of the first aspect of the present application, a dam is provided in the non-display area. The dam is provided on the substrate and on the side of the pixel defining layer facing the substrate. The second encapsulation layer is located on the side of the dam facing the display area. The defining portion and the third encapsulation layer extend to the side of the dam facing away from the display area.

[0016] According to any of the foregoing embodiments of the first aspect of the present application, the defining portion and the third encapsulation layer are in contact connection on the side of the dam facing away from the substrate.

[0017] According to any of the foregoing embodiments of the first aspect of the present application, the dam includes an organic layer. The organic layer and the defining portion are in contact connection with each other. A first through hole is provided in the defining portion. The orthographic projection of the first through hole on the substrate is located within the orthographic projection of the organic layer on the substrate.

[0018] According to any of the foregoing embodiments of the first aspect of the present application, a plurality of first through holes are provided at intervals along the extending direction of the dam.

[0019] According to any of the foregoing embodiments of the first aspect of the present application, a signal line is further provided on the substrate. At least a part of the signal line is located on the side of the organic layer facing the substrate. A second through hole is provided in the signal line. The orthographic projection of the first through hole on the substrate is located within the orthographic projection of the second through hole on the substrate.

[0020] According to any of the foregoing embodiments of the first aspect of the present application, the signal line includes a first sub-layer and a second sub-layer on the side of the first sub-layer facing away from the substrate. The material of the first sub-layer includes aluminum, and the material of the second sub-layer includes titanium.

[0021] According to any of the foregoing embodiments of the first aspect of the present application, the signal line further includes a third sub-layer on the side of the first sub-layer facing away from the second sub-layer. The material of the third sub-layer includes titanium.

[0022] According to any of the foregoing embodiments of the first aspect of the present application, a buffer layer is further provided on the substrate, the buffer layer is located on the side of the signal line facing the substrate, and the material of the buffer layer includes an organic material.

[0023] According to any of the foregoing embodiments of the first aspect of the present application, it further includes:

[0024] An isolation structure is provided on the substrate, and the isolation structure encloses an isolation opening, and at least a part of the orthographic projection of the isolation opening on the substrate overlaps with the orthographic projection of the pixel opening on the substrate;

[0025] The orthographic projection of the isolation opening on the substrate is located within the orthographic projection of the pixel opening on the substrate;

[0026] The first encapsulation layer includes a plurality of encapsulation parts, and each of the encapsulation parts correspondingly encapsulates the light-emitting units located in each of the isolation openings.

[0027] According to any of the foregoing embodiments of the first aspect of the present application, the display panel further includes a second electrode layer, the second electrode layer includes a second electrode located on the side of each light-emitting unit facing away from the substrate, and the second electrode is electrically connected to the isolation structure.

[0028] According to any of the foregoing embodiments of the first aspect of the present application, the orthographic projection of each isolation opening on the substrate is located within the orthographic projection of each encapsulation part on the substrate.

[0029] According to any of the foregoing embodiments of the first aspect of the present application, there is a gap between adjacent encapsulation parts, and the gap is located on the side of the isolation structure facing away from the substrate.

[0030] According to any of the foregoing embodiments of the first aspect of the present application, the isolation structure includes a first layer and a second layer located on the side of the first layer facing away from the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate.

[0031] According to any of the foregoing embodiments of the first aspect of the present application, the material of the first layer includes a conductive material.

[0032] According to any of the foregoing embodiments of the first aspect of the present application, the isolation structure further includes a third layer, the third layer is located on the side of the first layer facing the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0033] According to any of the foregoing embodiments of the first aspect of the present application, the non-display area is the border area of the display panel.

[0034] An embodiment of the first aspect of the present application also provides a display panel, which has a display area and a non-display area surrounding at least part of the display area, the display panel including: a substrate; a light-emitting layer including a plurality of light-emitting units; an encapsulation layer located on a side of the light-emitting layer away from the substrate, the encapsulation layer including a first encapsulation layer and a second encapsulation layer located on a side of the first encapsulation layer away from the light-emitting layer, the first encapsulation layer being located in the display area and including a plurality of encapsulation portions corresponding to and covering the plurality of light-emitting units, and the second encapsulation layer covering the plurality of encapsulation portions.

[0035] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projections of the multiple packaging parts on the substrate are located within the orthographic projection of the second packaging layer on the substrate.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, the second encapsulation layer extends from the display area to the non-display area.

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel includes a dam located in the non-display area, and the second encapsulation layer is located on the side of the dam facing the display area, or at least part of the second encapsulation layer extends from the display area to the side of the dam facing away from the display area.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the dam includes an organic layer, the organic layer and the definition portion are in contact and connected with each other, a first through hole is opened on the definition portion, and the orthographic projection of the first through hole on the substrate is located within the orthographic projection of the organic layer on the substrate.

[0039] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a pixel definition layer arranged on the substrate, the pixel definition layer includes a pixel defining portion located in the display area and a definition portion located in the non-display area, a plurality of pixel openings are opened on the pixel defining portion, the light-emitting unit is located in the pixel opening, and the definition portion and the second encapsulation layer are in contact and connected on the side of the dam facing the display area.

[0040] According to any of the aforementioned embodiments of the first aspect of the present application, the defining portion extends to a side of the dam away from the display area.

[0041] According to any of the aforementioned embodiments of the first aspect of the present application, the encapsulation layer further includes a third encapsulation layer located on the side of the second encapsulation layer facing away from the substrate, and the third encapsulation layer extends out of the second encapsulation layer in the non-display area and is in contact with the contact portion defining portion.

[0042] According to any of the aforementioned embodiments of the first aspect of the present application, the second encapsulation layer is located on a side of the dam facing the display area, and the definition portion and the third encapsulation layer are in contact and connected on the dam.

[0043] An embodiment of the second aspect of the present application further provides a display device, comprising a display panel according to any one of the above-mentioned embodiments of the first aspect.

[0044] In the display panel provided by the embodiment of the present application, the display panel includes a substrate, a pixel definition layer, a light-emitting layer, and a packaging layer. The pixel definition layer includes a pixel defining portion located in the display area and a defining portion located in the non-display area. A pixel opening is formed in the pixel defining portion of the display area, and a light-emitting unit is disposed in the pixel opening to realize light-emitting display in the display area of the display panel. The packaging layer includes a first packaging layer and a second packaging layer. The packaging portion of the first packaging layer is used to package the light-emitting unit to improve the influence of water and oxygen intrusion on the light-emitting effect of the light-emitting unit. The second packaging layer is in contact and connected with the defining portion of the pixel definition layer in the non-display area, that is, the defining portion and the second packaging layer extend out of the first packaging layer and are in contact and connected with each other outside the first packaging layer, which can improve the problem that the contact area between the first packaging layer and the second packaging layer is too large, resulting in too good fluidity of the second packaging layer and affecting its packaging performance. Therefore, the embodiment of the present application can improve the packaging performance of the packaging layer, and further improve the overall process performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Other features, objects, and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which like or similar reference numerals denote like or similar features.

[0046] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application;

[0047] Figure 2 is Figure 1 a cross-sectional view taken along line A-A in

[0048] Figure 3 is Figure 2 a partially enlarged schematic structural diagram of

[0049] Figure 4 is in another example Figure 1 a cross-sectional view taken along line A-A in

[0050] Figure 5 is a schematic structural diagram of a display panel provided by another embodiment of the present application.

[0051] DESCRIPTION OF REFERENCE NUMERALS:

[0052] 100, substrate; 110, dam; 111, organic layer; 120, signal line; 121, second through hole; 130, pad layer; 140, planarization layer;

[0053] 200, pixel definition layer; 210, pixel defining portion; 220, defining portion; 230, pixel opening; 240, first through hole;

[0054] 300, light-emitting layer; 310, light-emitting unit;

[0055] 400, Encapsulation layer; 410, First encapsulation layer; 411, Encapsulation part; 420, Second encapsulation layer; 430, Third encapsulation layer;

[0056] 500, Isolation structure; 510, Isolation opening; 520, First layer; 530, Second layer; 540, Third layer;

[0057] 700, First electrode layer; 710, First electrode;

[0058] 800, Second electrode layer; 810, Second electrode;

[0059] AA, Display area; NA, Non - display area. Detailed implementation manners

[0060] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, many specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be practiced without some of these specific details. The description of the embodiments below is only intended to provide a better understanding of the present application by showing examples of the present application. In the drawings and the following description, at least some of the well - known structures and technologies are not shown in order to avoid unnecessarily obscuring the present application; and, for clarity, the dimensions of some structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0061] In the description of the present application, it should be noted that unless otherwise specified, the meaning of "a plurality" is more than two; the orientation or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0062] The orientation terms appearing in the following description are all the directions shown in the figures and do not specifically limit the structure of the embodiments of the present application. In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0063] A display panel includes a light-emitting unit and an encapsulation layer for encapsulating the light-emitting unit. The encapsulation layer typically includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The organic encapsulation layer typically needs to be located within the area enclosed by the display panel's dams. In related art, there are cases where the organic encapsulation layer overflows beyond portions of the dams.

[0064] Patents PCT / CN2023 / 134518, 202311499823.9, 202310707209.0, 202311346196.5, 202310692671.8, and 202311091555.7 record the relevant contents of the isolation structure and encapsulation layer for reference.

[0065] The applicant's research has found that because the first inorganic encapsulation layer is typically made of SiOx and the organic encapsulation layer primarily consists of small organic molecules, the oxygen bonds in the SiOx can bridge the valence bonds in the organic encapsulation layer, increasing the fluidity of the organic encapsulation layer. This makes it easier for the organic encapsulation layer to flow over the innermost dam and between the innermost and outermost dams, thereby reducing the package length and lowering the yield of the encapsulation layer.

[0066] In order to improve the above technical problems, this application is proposed. Figures 1 to 5 The display panel and the display device according to the embodiments of the present application are described in detail.

[0067] Please also refer to Figures 1 to 3 , Figure 1 A schematic structural diagram of a display panel provided in an embodiment of the present application; Figure 2 yes Figure 1 Cross-sectional view at AA in the middle; Figure 3 yes Figure 2 Schematic diagram of the local enlarged structure.

[0068] like Figures 1 to 3As shown, an embodiment of the first aspect of the present application provides a display panel, comprising a display area AA and a non-display area NA disposed around at least a portion of the display area AA. The display panel includes a substrate 100 and a pixel definition layer 200, a light-emitting layer 300, and an encapsulation layer 400 disposed on the substrate 100. The pixel definition layer 200 includes a pixel defining portion 210 located in the display area AA and a definition portion 220 located in the non-display area NA. The pixel defining portion 210 has a plurality of pixel openings 230 defined therein. The light-emitting layer 300 includes light-emitting units 310 located in the pixel openings 230. The encapsulation layer 400 is located on a side of the light-emitting layer 300 facing away from the substrate 100. The encapsulation layer 400 includes a first encapsulation layer 410 and a second encapsulation layer 420 located on a side of the first encapsulation layer 410 facing away from the light-emitting layer 300. The first encapsulation layer 410 is located in the display area AA and encapsulates the light-emitting units 310. At least a portion of the second encapsulation layer 420 extends into the non-display area NA and contacts and connects to the definition portion 220.

[0069] In the display panel provided in the embodiment of the present application, the display panel includes a substrate 100, a pixel definition layer 200, a light-emitting layer 300 and an encapsulation layer 400. The pixel definition layer 200 includes a pixel defining portion 210 located in the display area AA and a definition portion 220 located in the non-display area NA. A pixel opening 230 is provided on the pixel defining portion 210 of the display area AA, and a light-emitting unit 310 is provided in the pixel opening 230 to achieve a light-emitting display in the display area AA of the display panel. The encapsulation layer 400 includes a first encapsulation layer 410 and a second encapsulation layer 420. The encapsulation portion 411 of the first encapsulation layer 410 is used to encapsulate the light-emitting unit 310 to improve the light-emitting effect of the light-emitting unit 310 affected by water and oxygen intrusion. The second encapsulation layer 420 is in contact with and connected to the definition portion 220 of the pixel definition layer 200 in the non-display area NA. That is, the definition portion 220 and the second encapsulation layer 420 extend outside the first encapsulation layer 410 and are in contact with and connected to each other outside the first encapsulation layer 410. This can improve the fluidity of the second encapsulation layer 420, which can affect its encapsulation performance due to excessive contact area between the first encapsulation layer 410 and the second encapsulation layer 420. Therefore, the embodiments of the present application can improve the encapsulation performance of the encapsulation layer 400, thereby enhancing the overall process performance of the display panel.

[0070] There are many ways to set up the substrate 100. The substrate 100 may include a substrate and a first conductive layer, a second conductive layer, and a third conductive layer arranged on one side of the substrate and stacked. An insulating layer is provided between adjacent conductive layers. Exemplarily, a pixel driving circuit is provided in the substrate 100, and the pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source and a drain. The storage capacitor includes a first plate and a second plate. As an example, the gate and the first plate can be located in the first conductive layer, the second plate can be located in the second conductive layer, and the source and drain can be located in the third conductive layer.

[0071] Optionally, a first electrode layer 700 is provided on the substrate 100. The first electrode layer 700 includes a plurality of first electrodes 710 distributed at intervals. The orthographic projection of each first electrode 710 on the substrate 100 and the orthographic projection of each pixel opening 230 on the substrate 100 at least partially overlap, so that each first electrode 710 can drive the light-emitting unit 310 located in the pixel opening 230 to emit light.

[0072] There are various settings for the non-display area NA. For example, the non-display area NA is a light-transmitting hole area, and the non-display area NA is used to allow ambient light to pass through so that the photosensitive element can obtain ambient light information. Alternatively, the non-display area NA is the border area of the display panel. The size of the border area is relatively large, and the edge length of the encapsulation layer 400 in the border area is longer. The defining part 220 and the second encapsulation layer 420 are in contact and connected with each other in the border area, which can better improve the encapsulation performance of the encapsulation layer 400.

[0073] There are various ways to set the material of the pixel defining layer 200. The material of the pixel defining layer 200 may include an organic material.

[0074] Alternatively, in some other optional embodiments, the material of the pixel defining layer 200 may further include an inorganic material, so that the pixel defining layer 200 has good denseness. That is, the material of the defining part 220 includes an inorganic material, so that the defining part 220 has good denseness.

[0075] Optionally, the material of the pixel defining layer 200 includes silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0076] Optionally, the pixel defining layer 200 is a single-layer film, or the pixel defining layer 200 includes a plurality of film layers stacked on top of each other, that is, the pixel defining layer 200 can be formed by stacking multiple film layers.

[0077] Optionally, the film-forming conditions of the pixel defining layer 200 are above 150 °C. Therefore, the film quality is denser than that of the first encapsulation layer 410. Therefore, the free bonds of O are relatively few, so it will play a certain buffering role in the overflow of the second encapsulation layer 420.

[0078] Optionally, the material of the first encapsulation layer 410 includes an inorganic material, that is, the material of each encapsulation part 411 includes an inorganic material, so that the encapsulation part 411 has good denseness, and the encapsulation part 411 can provide better denseness protection for each light-emitting unit 310.

[0079] Optionally, the material of the second encapsulation layer 420 includes an organic material, so that the second encapsulation layer 420 can have a relatively thick thickness, and can adjust the flatness of the overall surface of the encapsulation layer 400.

[0080] In some alternative embodiments, the encapsulation layer 400 further includes a third encapsulation layer 430 located on the side of the second encapsulation layer 420 facing away from the substrate 100. A portion of the third encapsulation layer 430 in the non-display area NA extends beyond the second encapsulation layer 420 and is in contact connection with the defining portion 220.

[0081] In these alternative embodiments, the encapsulation layer 400 further includes a third encapsulation layer 430. The third encapsulation layer 430 extends beyond the second encapsulation layer 420 in the non-display area NA, that is, the size of the third encapsulation layer 430 is larger than that of the second encapsulation layer 420. The third encapsulation layer 430 is in contact connection with the defining portion 220 outside the second encapsulation layer 420, which can improve the overall sealing performance of the encapsulation layer 400.

[0082] Optionally, the orthographic projection edge of the second encapsulation layer 420 on the substrate 100 is located on the side of the outer edge of the orthographic projection of the defining portion 220 on the substrate 100 facing the display area AA. That is, the edge of the defining portion 220 extends beyond the second encapsulation layer 420 along the direction from the display area AA to the non-display area NA. The defining portion 220 can be hermetically connected to the third encapsulation layer 430 outside the second encapsulation layer 420. That is, a part of the defining portion 220 is in contact connection with the second encapsulation layer 420, and another part of the defining portion 220 is in contact connection with the third encapsulation layer 430, which can increase the contact area between the defining portion 220 and the second encapsulation layer 420 and the third encapsulation layer 430, and further improve the sealing effect of the encapsulation layer 400.

[0083] Optionally, the orthographic projection of the second encapsulation layer 420 on the substrate 100 is located within the orthographic projection of the third encapsulation layer 430 on the substrate 100. That is, the size of the third encapsulation layer 430 is larger than that of the second encapsulation layer 420. The third encapsulation layer 430 can provide a longer sealing length, and further improve the sealing effect of the encapsulation layer 400.

[0084] Optionally, the material of the third encapsulation layer 430 includes an inorganic material, so that the third encapsulation layer 430 has a better densification effect and can improve the overall sealing performance of the encapsulation layer 400.

[0085] In some alternative embodiments, a dam 110 is provided in the non-display area NA. The dam 110 is provided on the substrate 100 and is located on the side of the pixel defining layer 200 facing the substrate 100. The second encapsulation layer 420 is located on the side of the dam 110 facing the display area AA. The defining portion 220 and the third encapsulation layer 430 extend to the side of the dam 110 facing away from the display area AA.

[0086] In these optional embodiments, the second encapsulation layer 420 is located on the side of the dam 110 facing the display area AA, the second encapsulation layer 420 is confined by the dam 110 within the area enclosed by it, and the third encapsulation layer 430 and the definition portion 220 extend to the side of the dam 110 away from the display area AA, that is, the third encapsulation layer 430 and the definition portion 220 extend to the outside of the dam 110, which can lengthen the packaging length and improve the packaging yield.

[0087] Optionally, the defining portion 220 and the third encapsulation layer 430 are in contact with each other on the dam 110. That is, the defining portion 220 and the third encapsulation layer 430 are in contact with each other on the side of the dam 110 facing away from the substrate 100. The dam 110 is typically high, and the dam 110 can increase the height difference. The defining portion 220 and the third encapsulation layer 430 are in contact with each other at a location with a high height, which can further improve the packaging yield.

[0088] In some optional embodiments, the dam 110 includes an organic layer 111, the organic layer 111 and the definition portion 220 are in contact and connected with each other, a first through hole 240 is opened on the definition portion 220, and the orthographic projection of the first through hole 240 on the substrate 100 is located within the orthographic projection of the organic layer 111 on the substrate 100.

[0089] In these optional embodiments, the organic layer 111 within the dam 110 is in direct contact with the defining portion 220, and gas may be generated during the preparation process of the organic layer 111. A first through hole 240 is provided in the defining portion 220, and the orthographic projection of the first through hole 240 on the substrate 100 is located within the orthographic projection of the organic layer 111 on the substrate 100. In other words, at least a portion of the organic layer 111 can be exposed through the first through hole 240, allowing gas generated in the organic layer 111 to escape through the first through hole 240. This improves the film delamination phenomenon caused by gas trapped between the organic layer 111 and the defining portion 220, and further enhances the encapsulation effect of the encapsulation layer 400.

[0090] Optionally, a planarization layer 140 is provided on the substrate 100. When forming the planarization layer 140, a portion of the material within the dam 110 region can be retained to form the organic layer 111, thereby increasing the height of the dam 110. Specifically, the organic layer 111 can be provided in the same layer and with the same material as the planarization layer 140, thereby simplifying the display panel manufacturing process and increasing the height of the dam 110.

[0091] Optionally, the substrate 100 further includes multiple conductive layers, and an insulating layer is provided between the multiple conductive layers. When preparing the insulating layer, part of the material in the dam 110 can be retained to form the organic layer 111, that is, the insulating layer and the organic layer 111 are provided in the same layer and with the same material.

[0092] Optionally, the material of the organic layer 111 includes an organic material. The organic layer 111 can have a relatively thick thickness to ensure that the dam 110 has a relatively high height.

[0093] The number of the first vias 240 can be one or more, and the multiple first vias 240 can be distributed at intervals along the extending direction of the dam 110. By providing the multiple first vias 240, the gas at different positions in the organic layer 111 can be released, and the problem of easy film peeling between the organic layer 111 and the defining portion 220 can be better improved.

[0094] Optionally, the number of the dams 110 can be one, and one dam 110 surrounds the display area AA in a closed loop.

[0095] Alternatively, the number of the dams 110 can be two or more, and the two or more dams 110 are sleeved with each other. Each dam 110 is correspondingly provided with a first via 240, that is, the organic layer 111 of each dam 110 is correspondingly provided with a first via 240, so as to better improve the problem of easy film peeling between the organic layer 111 and the defining portion 220.

[0096] In some alternative embodiments, as Figure 4 shown, a signal line 120 is further provided on the substrate 100, at least a part of the signal line 120 is located on the side of the organic layer 111 facing the substrate 100, a second via 121 is formed on the signal line 120, and the orthographic projection of the first via 240 on the substrate 100 is located within the orthographic projection of the second via 121 on the substrate 100.

[0097] In these alternative embodiments, a second via 121 is also formed on the signal line 120, the orthographic projection of the first via 240 on the substrate 100 is located within the orthographic projection of the second via 121 on the substrate 100, that is, the size of the first via 240 is smaller than the size of the second via 121, and a part of the defining portion 220 extends into the second via 121 to wrap the inner wall surface of the signal line 120 facing the second via 121, so as to provide protection for the signal line 120.

[0098] Optionally, the signal line 120 can be arranged to cross the dam 110 in the direction from the display area AA to the non-display area NA, or the signal line 120 can be arranged parallel to a part of the dams 110.

[0099] Optionally, the signal line 120 can be a power signal line 120. For example, the signal line 120 is used to transmit a low-level voltage signal, or the signal line 120 is used to transmit a driving power voltage signal.

[0100] Optionally, the signal line 120 can be a single-layer film layer, or the signal line 120 includes a plurality of conductive layers arranged in a stacked manner. For example, the signal line 120 includes a first sub-layer and a second sub-layer arranged in a stacked manner, and the second sub-layer is located on the side of the first sub-layer facing away from the substrate 100. The material of the first sub-layer can be aluminum, and the material of the second sub-layer can be titanium. Optionally, the signal line 120 can further include a third sub-layer located on the side of the first sub-layer facing away from the second sub-layer, and the material of the third sub-layer can include titanium.

[0101] Optionally, a pad layer 130 is provided on the side of the signal line 120 facing the substrate 100, and the material of the pad layer 130 can include an organic material. During the manufacturing process, due to the fluidity of the organic material during coating and patterning, the thickness of the organic layer 111 above the signal line 120 is relatively thin. During the etching process of the defining portion 220 including an inorganic material, the etching gas contains an oxygen element gas, and the oxygen element gas may etch away the relatively thin organic layer 111, resulting in the second sub-layer. And the etching gas of the defining portion 220 containing an inorganic material may contain a fluorine element gas, and the fluorine element gas can react with titanium, damaging the second sub-layer and possibly causing the first sub-layer to be exposed. When the material of the first sub-layer includes aluminum, aluminum may react with the oxygen element to generate aluminum oxide with a larger volume, thereby causing film layer separation and resulting in package degradation.

[0102] In the embodiment of the present application, the regions where the signal line 120 exists are all covered by the defining portion 220, which can reduce the probability of the signal line 120 being etched and deformed or reacting with the oxygen element, thereby further improving the package yield.

[0103] In some optional embodiments, as Figure 5 shown, the display panel further includes an isolation structure 500. The isolation structure 500 is disposed on the substrate 100, and the isolation structure 500 encloses an isolation opening 510. The orthographic projection of the isolation opening 510 on the substrate 100 and the orthographic projection of the pixel opening 230 on the substrate 100 at least partially overlap. The orthographic projection of the isolation opening 510 on the substrate 100 is located within the orthographic projection of the pixel opening 230 on the substrate 100. The first encapsulation layer 410 includes a plurality of encapsulation portions 411, and each encapsulation portion 411 is used to encapsulate the light-emitting unit 310 located in each isolation opening 510.

[0104] In these alternative embodiments, by providing the isolation structure 500, the light-emitting material can be separated into a plurality of mutually independent light-emitting units 310 located within respective isolation openings 510, thereby omitting the evaporation process using a precision mask plate and simplifying the manufacturing process of the display panel. The orthographic projection of the isolation opening 510 on the substrate 100 and the orthographic projection of the pixel opening 230 on the substrate 100 at least partially overlap, such that the light-emitting unit 310 can be located within both the isolation opening 510 and the pixel opening 230 simultaneously. Each encapsulation portion 411 is used to encapsulate the light-emitting unit 310 located within each isolation opening 510, improving the encapsulation performance of each light-emitting unit 310.

[0105] Optionally, the orthographic projection of the pixel opening 230 on the substrate 100 is located within the orthographic projection of the isolation opening 510 on the substrate 100, that is, the size of the isolation opening 510 is larger than the size of the pixel opening 230, so that more light-emitting material can fall into the pixel opening 230.

[0106] Optionally, the display panel further includes a second electrode layer 800. The second electrode layer 800 includes a second electrode 810 located on the side of each light-emitting unit 310 facing away from the substrate 100. The second electrode 810 and the first electrode 710 can interact to drive the light-emitting unit 310 to emit light. Optionally, the material of the isolation structure 500 includes a conductive material, and the second electrode 810 and the isolation structure 500 are in contact and connected to each other, such that the second electrodes 810 can be interconnected into a whole-surface electrode through the isolation structure 500.

[0107] Optionally, each encapsulation portion 411 is located on the side of each second electrode 810 facing away from the substrate 100, such that the encapsulation portion 411 can provide protection to each second electrode 810.

[0108] Optionally, the orthographic projection of each second electrode 810 on the substrate 100 is located within the orthographic projection of each encapsulation portion 411 on the substrate 100, that is, the size of the encapsulation portion 411 is larger than the size of the second electrode 810, such that the encapsulation portion 411 can provide better protection to the second electrode 810.

[0109] Optionally, the orthographic projection of each isolation opening 510 on the substrate 100 is located within the orthographic projection of each encapsulation portion 411 on the substrate 100, that is, the size of the encapsulation portion 411 is larger, and the encapsulation portion 411 can extend to the surface of the isolation structure 500 facing away from the substrate 100 to provide better encapsulation performance.

[0110] Optionally, there is a gap between adjacent encapsulation portions 411. The gap is located on the side of the isolation structure 500 facing away from the substrate 100, that is, the plurality of encapsulation portions 411 are independently arranged.

[0111] The isolation structure 500 can be arranged in various ways. For example, the isolation structure 500 is a single-layer structure, which includes a first surface facing the substrate 100 and a second surface facing away from the substrate 100. The orthographic projection of the first surface on the substrate 100 is located within the orthographic projection of the second surface on the substrate 100. That is, the size of the first surface is smaller than that of the second surface, so that a concave structure can be formed under the second surface. When the light-emitting unit 310 is prepared subsequently, the light-emitting material will break into a plurality of independent light-emitting units 310 at the edge of the second surface.

[0112] Alternatively, in other embodiments, the isolation structure 500 includes a first layer 520 and a second layer 530 arranged in a stacked manner. The second layer 530 is located on the side of the first layer 520 facing away from the substrate 100. The orthographic projection of the first layer 520 on the substrate 100 is located within the orthographic projection of the second layer 530 on the substrate 100. That is, the size of the first layer 520 is smaller than that of the second layer 530, so that a concave structure can be formed under the second layer 530. When the light-emitting unit 310 is prepared subsequently, the light-emitting material will break into a plurality of independent light-emitting units 310 at the edge of the second layer 530.

[0113] Optionally, the material of the first layer 520 includes a conductive material and is in contact connection with the second electrode 810 described above, so that a plurality of second electrodes 810 can be interconnected into a whole-surface electrode through the first layer 520.

[0114] Optionally, the material of the second layer 530 includes a conductive material, and the material of the second layer 530 is different from that of the first layer 520. In these optional embodiments, the material of the second layer 530 includes a conductive material, which can increase the distribution area of the conductive structure and reduce the overall resistance of the second electrode 810. The material of the second layer 530 is different from that of the first layer 520, which is convenient for forming the first layer 520 and the second layer 530 with different sizes by using the different etching rates when different materials react with the same etching solution.

[0115] Optionally, the isolation structure 500 further includes a third layer 540 located on the side of the first layer 520 facing the substrate 100. The orthographic projection of the first layer 520 on the substrate 100 is located within the orthographic projection of the third layer 540 on the substrate 100. When the side etching is performed on the first layer 520 to form the isolation structure 500, the third layer 540 can play a protective role and improve the influence of the etching on the film layer on the side of the third layer 540 facing the substrate 100.

[0116] An embodiment of the first aspect of the present application further provides a display panel. The display panel has a display area AA and a non-display area NA surrounding at least a part of the display area AA. The display panel includes: a substrate 100; a light-emitting layer 300 including a plurality of light-emitting units 310; and a packaging layer 400 located on a side of the light-emitting layer 300 facing away from the substrate 100. The packaging layer 400 includes a first packaging layer 410 and a second packaging layer 420 located on a side of the first packaging layer 410 facing away from the light-emitting layer 300. The first packaging layer 410 is located in the display area AA and includes a plurality of packaging portions 411 correspondingly covering the plurality of light-emitting units 310, and the second packaging layer 420 covers the plurality of packaging portions 411.

[0117] In the display panel provided by the embodiment of the present application, the display panel includes a substrate 100, a light-emitting layer 300, and a packaging layer 400. The packaging layer 400 includes a first packaging layer 410 and a second packaging layer 420. The packaging portions 411 of the first packaging layer 410 are used to package the light-emitting units 310 to improve the influence of water and oxygen intrusion on the light-emitting effect of the light-emitting units 310. The second packaging layer 420 has a larger size to cover the plurality of packaging portions 411, which can improve the packaging performance of the packaging layer 400.

[0118] Optionally, the substrate 100, the pixel definition layer 200, the light-emitting layer 300, the packaging layer 400, and the dam 110 are arranged as above, which will not be elaborated here.

[0119] For example, the orthographic projection of the plurality of packaging portions 411 on the substrate 100 is located within the orthographic projection of the second packaging layer 420 on the substrate 100. The second packaging layer 420 has a larger size to cover the plurality of packaging portions 411, which can improve the packaging performance of the packaging layer 400. Optionally, the second packaging layer 420 can extend from the display area AA to the non-display area NA to increase the coverage range of the second packaging layer 420.

[0120] Optionally, the display panel 10 includes a dam 110 located in the non-display area NA. The second packaging layer 420 is located on a side of the dam 110 facing the display area, and the dam 110 can limit the second packaging layer 420 within the dam 110. Optionally, at least a part of the second packaging layer 420 extends from the display area AA to a side of the dam 110 facing away from the display area AA, and the second packaging layer 420 may overflow to the side of the dam 110 facing away from the display area AA.

[0121] In some optional embodiments, the display panel 10 further includes a pixel definition layer 200 disposed on the substrate 100. The pixel definition layer 200 includes a pixel defining portion 210 located in the display area AA and a defining portion 220 located in the non-display area NA. A plurality of pixel openings 230 are formed in the pixel defining portion 210, and the light-emitting units 310 are located in the pixel openings 230. The defining portion 220 and the second packaging layer 420 are in contact and connected on a side of the dam 110 facing the display area AA.

[0122] In these embodiments, the first encapsulation layer 410 and the dam 110 are spaced apart, and there is a gap between the first encapsulation layer 410 and the dam 110. The second encapsulation layer 420 and the definition portion 220 can be in contact and connected with each other within the gap, which can improve the problem that the contact area between the first encapsulation layer 410 and the second encapsulation layer 420 is too large, causing the second encapsulation layer 420 to have excessive fluidity, thereby affecting its encapsulation performance.

[0123] Optionally, as described above, the dam 110 includes an organic layer 111 , the organic layer 111 and the definition portion 220 are in contact with each other, a first through hole 240 is provided on the definition portion 220 , and the orthographic projection of the first through hole 240 on the substrate 100 is located within the orthographic projection of the organic layer 111 on the substrate 100 .

[0124] In these optional embodiments, the organic layer 111 within the dam 110 is in direct contact with the contact defining portion 220, and gas may be generated during the preparation process of the organic layer 111. A first through hole 240 is defined in the contact defining portion 220, and the orthographic projection of the first through hole 240 on the substrate 100 is located within the orthographic projection of the organic layer 111 on the substrate 100. This means that at least a portion of the organic layer 111 can be exposed through the first through hole 240, allowing gas generated within the organic layer 111 to escape through the first through hole 240. This mitigates film delamination caused by gas trapped between the organic layer 111 and the contact defining portion 220, further enhancing the encapsulation effect of the encapsulation layer 400.

[0125] In some optional embodiments, the defining portion 220 extends to the side of the dam 110 away from the display area AA, thereby increasing the distribution area of the defining portion 220 and the contact area between the defining portion 220 and the second encapsulation layer 420 .

[0126] In some optional embodiments, the encapsulation layer 400 further includes a third encapsulation layer 430 located on the side of the second encapsulation layer 420 facing away from the substrate 100 . Part of the third encapsulation layer 430 in the non-display area NA extends out of the second encapsulation layer 420 and contacts and connects to the definition portion 220 .

[0127] In these optional embodiments, the encapsulation layer 400 also includes a third encapsulation layer 430, which extends from the second encapsulation layer 420 in the non-display area NA, that is, the size of the third encapsulation layer 430 is larger than the size of the second encapsulation layer 420. The third encapsulation layer 430 is in contact with and connected to the definition portion 220 outside the second encapsulation layer 420, which can improve the overall sealing performance of the encapsulation layer 400.

[0128] Optionally, the second encapsulation layer 420 is located on the side of the dam 110 facing the display area AA, and the defining portion 220 and the third encapsulation layer 430 are in contact connection on the dam 110. That is, the defining portion 220 and the third encapsulation layer 430 are in contact connection on the side of the dam 110 away from the substrate 100. The height of the dam 110 is usually relatively high, and a relatively large step difference can be increased by the dam 110. The defining portion 220 and the third encapsulation layer 430 are in contact connection at a position with a relatively high segment height, which can further improve the encapsulation yield.

[0129] An embodiment of the second aspect of the present application further provides a display device, including the display panel of any one of the above-mentioned first aspect embodiments. Since the display device provided by the embodiment of the second aspect of the present application includes the display panel of any one of the above-mentioned first aspect embodiments, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel of any one of the above-mentioned first aspect embodiments, which will not be elaborated herein.

[0130] The display device in the embodiments of the present application includes, but is not limited to, devices with a display function such as mobile phones, personal digital assistants (Personal Digital Assistant, abbreviated as: PDA), tablet computers, e-books, televisions, access control systems, smart landline telephones, consoles, etc.

[0131] Although the present application has been described with reference to the preferred embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area disposed around at least part of the display area, and the display panel includes: a substrate; a pixel definition layer disposed on the substrate, the pixel definition layer including a pixel defining portion located in the display area and a defining portion located in the non-display area, and a plurality of pixel openings are formed in the pixel defining portion; a light-emitting layer including light-emitting units located in the pixel openings; a packaging layer located on a side of the light-emitting layer facing away from the substrate, the packaging layer including a first packaging layer and a second packaging layer located on a side of the first packaging layer facing away from the light-emitting layer, the first packaging layer being located in the display area and encapsulating the light-emitting units, and at least part of the second packaging layer extends to the non-display area and is in contact connection with the defining portion.

2. The display panel according to claim 1, wherein The material of the pixel definition layer includes an inorganic material; Preferably, the material of the second packaging layer includes an organic material; Preferably, the material of the first packaging layer includes an inorganic material; Preferably, the material of the pixel definition layer includes at least one of silicon oxide, silicon nitride, and silicon oxynitride; Preferably, the pixel definition layer is a single-layer film, or the pixel definition layer includes a plurality of film layers stacked.

3. The display panel according to claim 1, wherein The packaging layer further includes a third packaging layer located on a side of the second packaging layer facing away from the substrate, and a portion of the third packaging layer in the non-display area extends out of the second packaging layer and is in contact connection with the defining portion; Preferably, an edge of a positive projection of the second packaging layer on the substrate is located on a side of an outer edge of a positive projection of the defining portion on the substrate facing the display area; Preferably, a positive projection of the second packaging layer on the substrate is located within a positive projection of the third packaging layer on the substrate; Preferably, the material of the third packaging layer includes an inorganic material.

4. The display panel according to claim 3, wherein, A dam is provided in the non-display area, the dam is disposed on the substrate and on a side of the pixel definition layer facing the substrate, the second packaging layer is located on a side of the dam facing the display area, and the defining portion and the third packaging layer extend to a side of the dam facing away from the display area; Preferably, the defining portion and the third packaging layer are in contact connection on a side of the dam facing away from the substrate.

5. The display panel according to claim 4, wherein The dam includes an organic layer, the organic layer and the defining portion are in contact connection with each other, a first through hole is formed in the defining portion, and a positive projection of the first through hole on the substrate is located within a positive projection of the organic layer on the substrate; Preferably, a plurality of the first through holes are spaced apart along an extending direction of the dam.

6. The display panel according to claim 5, wherein A signal line is further provided on the substrate, at least part of the signal line is located on a side of the organic layer facing the substrate, a second through hole is formed in the signal line, and a positive projection of the first through hole on the substrate is located within a positive projection of the second through hole on the substrate; Preferably, the signal line includes a first sub-layer and a second sub-layer located on a side of the first sub-layer facing away from the substrate, the material of the first sub-layer includes aluminum, and the material of the second sub-layer includes titanium; Preferably, the signal line further includes a third sub-layer on a side of the first sub-layer facing away from the second sub-layer, and the material of the third sub-layer includes titanium; Preferably, a pad layer is further provided on the substrate, the pad layer is located on a side of the signal line facing the substrate, and the material of the pad layer includes an organic material.

7. The display panel according to claim 1, characterized in that, Further included are: An isolation structure disposed on the substrate, the isolation structure enclosing an isolation opening, and at least a part of a positive projection of the isolation opening on the substrate overlaps with a positive projection of the pixel opening on the substrate; Preferably, a positive projection of the isolation opening on the substrate is located within a positive projection of the pixel opening on the substrate; The first encapsulation layer includes a plurality of encapsulation portions, and each of the encapsulation portions correspondingly encapsulates the light-emitting units located in each of the isolation openings; Preferably, the display panel further includes a second electrode layer, the second electrode layer includes a second electrode on a side of each of the light-emitting units facing away from the substrate, and the second electrode is electrically connected to the isolation structure; Preferably, a positive projection of each of the isolation openings on the substrate is located within a positive projection of each of the encapsulation portions on the substrate; Preferably, there is a gap between adjacent encapsulation portions, and the gap is located on a side of the isolation structure facing away from the substrate.

8. The display panel according to claim 7, wherein The isolation structure includes a first layer and a second layer on a side of the first layer facing away from the substrate, and a positive projection of the first layer on the substrate is located within a positive projection of the second layer on the substrate; Preferably, the material of the first layer includes a conductive material; Preferably, the isolation structure further includes a third layer, the third layer is located on a side of the first layer facing the substrate, and a positive projection of the first layer on the substrate is located within a positive projection of the third layer on the substrate.

9. The display panel according to claim 1, characterized in that, The non-display area is a border area of the display panel.

10. A display panel, characterized in that, The display panel has a display area and a non-display area surrounding at least a part of the display area, and the display panel includes: A substrate; A light-emitting layer including a plurality of light-emitting units; An encapsulation layer located on a side of the light-emitting layer facing away from the substrate, the encapsulation layer includes a first encapsulation layer and a second encapsulation layer on a side of the first encapsulation layer facing away from the light-emitting layer, the first encapsulation layer is located in the display area and includes a plurality of encapsulation portions correspondingly covering the plurality of light-emitting units, and the second encapsulation layer covers the plurality of encapsulation portions.

11. The display panel according to claim 10, wherein, A positive projection of the plurality of encapsulation portions on the substrate is located within a positive projection of the second encapsulation layer on the substrate; Preferably, the second encapsulation layer extends from the display area to the non-display area.

12. The display panel according to claim 11, wherein The display panel includes a dam located in the non-display area, and the second encapsulation layer is located on a side of the dam facing the display area, or at least a part of the second encapsulation layer extends from the display area to a side of the dam facing away from the display area.

13. The display panel according to claim 12, wherein, The display panel further includes a pixel definition layer disposed on the substrate, the pixel definition layer including a pixel definition portion located in the display area and a definition portion located in the non-display area, a plurality of pixel openings being formed on the pixel definition portion, the light-emitting units being located in the pixel openings, and the definition portion and the second encapsulation layer being in contact and connected on a side of the dam facing the display area; Preferably, the defined portion extends to a side of the dam away from the display area; Preferably, the dam includes an organic layer, the organic layer and the definition portion are in contact with each other, a first through hole is provided on the definition portion, and the orthographic projection of the first through hole on the substrate is located within the orthographic projection of the organic layer on the substrate.

14. The display panel according to claim 13, wherein The encapsulation layer further includes a third encapsulation layer located on a side of the second encapsulation layer facing away from the substrate, wherein the third encapsulation layer extends out of the second encapsulation layer in the non-display area and contacts and connects with the contact portion defining portion; Preferably, the second encapsulation layer is located on a side of the dam facing the display area, and the defining portion and the third encapsulation layer are in contact and connected on the dam.

15. A display device, characterized in that, The display panel comprises the display panel according to any one of claims 1 to 14.

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