Display substrate, preparation method thereof and display device

Abstract

The invention provides a display substrate, a preparation method thereof and a display device. The display substrate comprises a substrate, an insulating layer, a first electrode layer, a light-emitting function layer and a second electrode layer, wherein the insulating layer, the first electrode layer, the light-emitting function layer and the second electrode layer are arranged on one side of the substrate. The insulating layer comprises a plurality of electrode grooves and filling parts located between the adjacent electrode grooves. The first electrode layer comprises a plurality of first electrodes, each first electrode is arranged in one electrode groove, each first electrode comprises a middle part, an edge part and a partition groove located between the middle part and the edge part, and the partition grooves are formed around the middle parts. And at least one conductive layer in the light-emitting functional layer is disconnected at the position of the partition groove.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and particularly to a display substrate, a preparation method thereof, and a display device. Background Art

[0002] With the continuous development of display technologies, silicon-based organic light-emitting diode (OLED) display devices have attracted wide attention due to their advantages such as high resolution, low power consumption, small size, and light weight, and have good application prospects in high-resolution near-eye display industries such as wearable devices, industrial security, and medical fields. Summary of the Invention

[0003] Some embodiments of the present disclosure provide a display substrate, a preparation method thereof, and a display device, which are beneficial to improving the crosstalk problem between adjacent sub-pixels while reducing the pitch between adjacent sub-pixels.

[0004] In a first aspect of the present disclosure, a display substrate is provided, including: a substrate; an insulating layer disposed on one side of the substrate, the insulating layer including a plurality of electrode grooves spaced apart from each other and a filling portion located between adjacent electrode grooves, an opening of the electrode groove facing away from the substrate side of the insulating layer; a first electrode layer including a plurality of first electrodes, each first electrode being disposed in one of the electrode grooves and the first electrodes in adjacent electrode grooves being insulated from each other, the first electrode including a middle portion, an edge portion, and a partition groove located between the middle portion and the edge portion, the edge portion being in contact with a side surface of the electrode groove, the partition groove surrounding the middle portion, and an opening of the partition groove facing away from the substrate side of the first electrode; a light-emitting functional layer disposed on the side of the first electrode layer away from the substrate, the light-emitting functional layer including a plurality of sub-functional layers stacked, and at least one conductive layer in the plurality of sub-functional layers being disconnected at a position where the partition groove is located; and a second electrode layer disposed on the side of the light-emitting functional layer away from the substrate, the second electrode layer including a plurality of second electrodes, and the first electrode, the second electrode, and the light-emitting functional layer located between the first electrode and the second electrode form a light-emitting device.

[0005] In combination with the first aspect of the present disclosure, in some embodiments, the middle portion and the edge portion are connected at a bottom of the partition groove.

[0006] In combination with the first aspect of the present disclosure, in some embodiments, with respect to a direction perpendicular to the substrate, a central axis of the partition groove is inclined toward the surrounded middle portion.

[0007] In connection with the first aspect of the present disclosure, in some embodiments, the partition groove includes a first side surface and a second side surface that are oppositely arranged. Relative to the direction perpendicular to the substrate, the first side surface and the second side surface are inclined towards the middle part surrounded by the partition groove. In the same first electrode, the first side surface is located on the side closer to the middle part than the second side surface, and the inclination angle of the first side surface is greater than that of the second side surface. The inclination angle is the included angle with the direction perpendicular to the substrate.

[0008] In connection with the first aspect of the present disclosure, in some embodiments, the inclination angle of the first side surface is 30° to 45°.

[0009] In connection with the first aspect of the present disclosure, in some embodiments, the distance between the first ends of the first side surface and the second side surface is less than the distance between the second ends of the first side surface and the second side surface. The first end is the end closer to the substrate, and the second end is the end farther from the substrate.

[0010] In connection with the first aspect of the present disclosure, in some embodiments, from the opening of the partition groove to the bottom of the partition groove, the spacing distance between the first side surface and the second side surface shows a decreasing trend.

[0011] In connection with the first aspect of the present disclosure, in some embodiments, the first ends of the first side surface and the second side surface are connected. The first end is the end closer to the substrate.

[0012] In connection with the first aspect of the present disclosure, in some embodiments, along the direction of the line connecting the center points of the middle parts of two adjacent first electrodes, the width of the opening of the partition groove is 0.03 to 0.06 micrometers.

[0013] In connection with the first aspect of the present disclosure, in some embodiments, along the central axis direction of the partition groove, the depth of the partition groove is 0.05 to 0.1 micrometers.

[0014] In connection with the first aspect of the present disclosure, in some embodiments, for the same first electrode, along the direction of the line connecting the center points of the middle parts of two adjacent first electrodes, the distance between the opening of the partition groove and the center point of the middle part is a first distance, and the distance between the opening of the partition groove and the edge of the edge part far from the middle part is a second distance. The first distance is greater than the second distance.

[0015] In connection with the first aspect of the present disclosure, in some embodiments, a groove is provided at the connection position between the side surface and the bottom surface of at least one electrode groove, and the height of the lowest point of the groove is less than the height of the bottom surface of the electrode groove.

[0016] In combination with the first aspect of the present disclosure, in some embodiments, the lowest point of the groove is located on the side away from the middle portion of the lowest point of the partition groove.

[0017] In combination with the first aspect of the present disclosure, in some embodiments, the above display substrate further includes: a pixel defining layer disposed on the side of the first electrode layer away from the substrate, the pixel defining layer having a plurality of pixel openings, each pixel opening corresponding to one of the first electrodes, each pixel opening exposing at least a partial region of the surface of the middle portion of the corresponding first electrode, the pixel defining layer at least conformally covering the partition groove, the edge portion, and the filling portion, and the positive projection of the pixel opening on the substrate is within the positive projection range of the first surface of the middle portion on the substrate, where the first surface is the surface away from the substrate.

[0018] In combination with the first aspect of the present disclosure, in some embodiments, the material of the pixel defining layer includes a metal oxide or a silicon-based compound having insulating properties.

[0019] In combination with the first aspect of the present disclosure, in some embodiments, the metal oxide includes aluminum oxide and / or titanium oxide.

[0020] In combination with the first aspect of the present disclosure, in some embodiments, in the direction perpendicular to the substrate, the thickness of the pixel defining layer is less than the thickness of the first electrode.

[0021] In combination with the first aspect of the present disclosure, in some embodiments, in the direction perpendicular to the substrate, the thickness of the pixel defining layer is less than 300 angstroms.

[0022] In combination with the first aspect of the present disclosure, in some embodiments, the first electrode includes a first sub-electrode layer and a second sub-electrode layer stacked in sequence in the direction away from the substrate, the first sub-electrode layer includes a first covering portion covering the bottom surface of the electrode groove and a second covering portion covering the side surface of the electrode groove, the second sub-electrode layer fills the space surrounded by the first covering portion and the second covering portion, and in the direction perpendicular to the substrate, the thickness of the second sub-electrode layer is greater than the thickness of the first covering portion.

[0023] In combination with the first aspect of the present disclosure, in some embodiments, the partition groove is disposed in the second sub-electrode layer and is located in the corner region between the first covering portion and the second covering portion, and the partition groove does not penetrate the second sub-electrode layer.

[0024] In connection with the first aspect of the present disclosure, in some embodiments, the surface of the second sub-electrode layer remote from the substrate, the surface of the second covering portion remote from the substrate, and the surface of the filling portion remote from the substrate are flush.

[0025] In connection with the first aspect of the present disclosure, in some embodiments, the step coverage of the material of the second sub-electrode layer is less than the step coverage of the material of the first sub-electrode layer.

[0026] In connection with the first aspect of the present disclosure, in some embodiments, the first sub-electrode layer includes a titanium layer and / or a titanium nitride layer, and the second sub-electrode layer is an aluminum layer or a silver layer.

[0027] In connection with the first aspect of the present disclosure, in some embodiments, the second electrode layer includes a first flat portion, a second flat portion, and a recess connecting the first flat portion and the second flat portion. The recess is disposed around the first flat portion and recesses toward the side close to the substrate of the first flat portion and the second flat portion. The orthographic projection of the first flat portion on the substrate is within the orthographic projection range of the middle portion on the substrate, and the orthographic projection of the lowest point of the recess on the substrate is within the orthographic projection range of the opening of the partition groove on the substrate.

[0028] In connection with the first aspect of the present disclosure, in some embodiments, the at least one conductive layer includes a charge generation layer and / or a hole injection layer.

[0029] In a second aspect of the present disclosure, a method for manufacturing a display substrate is provided, including: providing a substrate; forming an insulating layer on the substrate, the insulating layer including a plurality of electrode grooves arranged at intervals and filling portions located between adjacent electrode grooves, openings of the electrode grooves facing away from the substrate side of the insulating layer; forming an electrode material layer on the insulating layer and performing a polishing process on the electrode material layer to form a first electrode layer including a plurality of first electrodes arranged at intervals, each first electrode being disposed in one of the electrode grooves and the first electrodes in adjacent electrode grooves being insulated from each other, the first electrode including a middle portion, an edge portion, and a partition groove located between the middle portion and the edge portion, the edge portion contacting the side surface of the electrode groove, the partition groove surrounding the middle portion, and an opening of the partition groove facing away from the substrate side of the first electrode; forming a light-emitting functional layer on the first electrode layer, the light-emitting functional layer including a plurality of sub-functional layers stacked, at least one conductive layer among the plurality of sub-functional layers being disconnected at a position where the partition groove is located; forming a second electrode layer on the light-emitting functional layer, the second electrode layer including a plurality of second electrodes, and the first electrode, the second electrode, and the light-emitting functional layer located between the first electrode and the second electrode constituting a light-emitting device.

[0030] In combination with the second aspect of the present disclosure, in some embodiments, the electrode material layer includes a first electrode material sub-layer and a second electrode material sub-layer. Forming an electrode material layer on the insulating layer and performing a polishing process on the electrode material layer to form a first electrode layer including a plurality of first electrodes arranged at intervals includes: depositing a first material on the insulating layer to form a first electrode material sub-layer, the first electrode material sub-layer conformally covering the bottom surface, side surface of the electrode groove, and the top of the filling portion; depositing a second material on the first electrode material sub-layer to form a second electrode material sub-layer, a step coverage rate of the second material being less than a step coverage rate of the first material, and a thickness of the second electrode material sub-layer being greater than a thickness of the first electrode material sub-layer; performing a polishing process on the second electrode material sub-layer and the first electrode material sub-layer to remove the second electrode material sub-layer exceeding the opening of the electrode groove and the second electrode material sub-layer and the first electrode material sub-layer located on the top of the filling portion to form the first electrode layer.

[0031] In combination with the second aspect of the present disclosure, in some embodiments, the second electrode material sub-layer formed on the first electrode material sub-layer includes a first deposition portion, a second deposition portion, and a gap located between the first deposition portion and the second deposition portion, the gap surrounding the first deposition portion, the gap extending into the electrode groove and being close to the side surface of the electrode groove, and the gap being inclined toward the central axis of the electrode groove;

[0032] The first deposition portion and the second deposition portion are connected at the bottom of the gap. The first deposition portion covers a first sub-layer of electrode material located on the bottom surface of the electrode groove, and the second deposition portion covers the first sub-layer of electrode material located on the top of the filling portion and the side surface of the electrode groove;

[0033] The included angle between the side surface of the first deposition portion facing the gap and the first surface of the first deposition portion is an obtuse angle, and the included angle between the side surface of the second deposition portion facing the gap and the first surface of the second deposition portion is an acute angle. A transition surface is connected between the side surface of the second deposition portion facing the gap and the first surface of the second deposition portion, and the transition surface is an arc surface. The first surface is the surface away from the substrate.

[0034] In a third aspect of the present disclosure, a display device is provided, including the display substrate provided in the first aspect of the present disclosure.

[0035] In the display substrate provided in some embodiments of the present disclosure, an electrode groove is provided on an insulating layer, a first electrode of a light-emitting device is provided in the electrode groove, and a partition groove is provided on the first electrode so that at least one conductive layer in the light-emitting functional layer is disconnected at the position where the partition groove is located. In this way, on the one hand, the lateral conduction of charges in the conductive layer can be blocked, thereby improving the crosstalk problem between adjacent sub-pixels. On the other hand, since the partition groove is provided on the first electrode, it does not need to occupy the area between adjacent sub-pixels, which is beneficial to reducing the pitch between adjacent sub-pixels, thereby improving the anode opening ratio and / or pixel density of the sub-pixels.

[0036] The above description is only an overview of the technical solutions provided by the embodiments of the present disclosure. In order to be able to understand the technical means of the embodiments of the present disclosure more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the embodiments of the present disclosure more obvious and understandable, the following specifically describes the specific implementation manners of the embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present invention. And throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0038] Figure 1 is a plan view of a display substrate according to some embodiments of the present disclosure;

[0039] Figure 2 is a cross-sectional view of a display substrate according to some embodiments of the present disclosure along Figure 1 the A-A direction in

[0040] Figure 3 A cross-sectional schematic view of the display substrate according to some other embodiments of the present disclosure along Figure 1 the A-A direction in

[0041] Figure 4 is Figure 2 a plan schematic view of a single first electrode in

[0042] Figure 5A a structural schematic view of an exemplary electrode groove;

[0043] Figure 5B a structural schematic view of another exemplary electrode groove;

[0044] Figure 6 is Figure 3 a structural schematic view of a single first electrode in

[0045] Figure 7 is Figure 6 a partial schematic view of

[0046] Figure 8A an exemplary film layer structure diagram of the first electrode;

[0047] Figure 8B an exemplary film layer structure diagram of another first electrode;

[0048] Figure 8C a film layer structure diagram of yet another first electrode;

[0049] Figure 9 A cross-sectional schematic view of the display substrate according to some other embodiments of the present disclosure along Figure 1 the A-A direction in

[0050] Figure 10 a flowchart of a method for manufacturing a display substrate according to some embodiments of the present disclosure;

[0051] Figure 11A , Figure 11B and Figure 11C an exemplary processing flowchart of the insulating layer;

[0052] Figure 12 is Figure 10 a flowchart of step S130 in

[0053] Figure 13A and Figure 13B an exemplary processing flowchart of the first electrode layer;

[0054] Figure 14A , Figure 14B and Figure 14C an exemplary processing flowchart of the pixel defining layer;

[0055] Figure 15 The structural schematic diagram after forming a light-emitting functional layer on the Figure 14C substrate structure;

[0056] Figure 16 The structural schematic diagram of a display device according to some embodiments of the present disclosure. Detailed implementation manners

[0057] Hereinafter, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be fully conveyed to those skilled in the art.

[0058] It should be noted that the term "and / or" as used herein merely describes an association relationship of associated objects and indicates that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. The term "a plurality" as used herein includes two or more than two. "Including" or "comprising" and other similar words mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. "Up", "down", "left", "right", etc. are only used to represent relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0059] As used herein, "parallel", "perpendicular", "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, and the acceptable deviation range of approximate parallelism may be, for example, within 5° deviation; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, and the acceptable deviation range of approximate perpendicularity may also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality may be, for example, that the difference between the two equal ones is less than or equal to 5% of either one of them.

[0060] It should be understood that when a layer or component is referred to as being on another layer or substrate, it can be that the layer or component is directly on the other layer or substrate, or there can be an intermediate layer between the layer or component and the other layer or substrate. "The positive projection of B is within the range of the positive projection of A" means that the boundary of the positive projection of B falls within the boundary of the positive projection of A, or the boundary of the positive projection of A overlaps with the boundary of the positive projection of B. "Conformal coverage" means that a film layer or coating can closely follow the shape of the substrate surface for coverage. For example, A "conformally covers" B means that A follows the shape of B for coverage. The "thickness" in this article refers to the thickness in the direction perpendicular to the substrate.

[0061] In the light-emitting functional layer of an OLED display device, there will be some film layers with relatively high conductivity. Charges conduct laterally in these film layers, which easily causes signal crosstalk between adjacent sub-pixels, thus affecting the display quality. For example, in order to further reduce power consumption and achieve high brightness, in some OLED display devices, the single light-emitting layer in the OLED light-emitting device is replaced with two light-emitting layers, and a charge generation layer (Charge Generation Layer, CGL) is added between the two light-emitting layers to achieve a tandem EL design. However, for high-resolution display products, since the charge generation layer has strong conductivity and the light-emitting functional layers of adjacent sub-pixels (here referring to the film layer including two light-emitting layers and the charge generation layer) are connected, charges are likely to conduct laterally in the charge generation layer, resulting in crosstalk problems between adjacent sub-pixels.

[0062] Therefore, it is necessary to isolate the film layer with relatively high conductivity (such as the charge generation layer) in the light-emitting functional layer. The inventors of this application have conducted long-term research on the isolation structure that can achieve the above isolation effect and found that if a scheme of setting an isolation structure between adjacent sub-pixels is adopted, sufficient space needs to be reserved between adjacent sub-pixels (for example, the pitch between adjacent sub-pixels needs to be greater than or equal to 0.9 μm), which will limit the anode aperture ratio and / or pixel density of the sub-pixels.

[0063] In view of this, embodiments of the present disclosure provide a display substrate, a method for manufacturing the same, and a display device. The display substrate includes: a substrate substrate, an insulating layer, a first electrode layer, a light-emitting functional layer, and a second electrode layer. The insulating layer is disposed on one side of the substrate substrate. The insulating layer includes a plurality of electrode grooves disposed at intervals and a filling portion located between adjacent electrode grooves. The opening of the electrode groove faces away from the substrate substrate side of the insulating layer. The first electrode layer includes a plurality of first electrodes. Each first electrode is disposed in one electrode groove, and the first electrodes in adjacent electrode grooves are insulated from each other. The first electrode includes a middle portion, an edge portion, and a partition groove located between the middle portion and the edge portion. The edge portion is in contact with the side surface of the electrode groove. The partition groove surrounds the middle portion, and the opening of the partition groove faces away from the substrate substrate side of the first electrode. The light-emitting functional layer is disposed on the side of the first electrode layer away from the substrate substrate. The light-emitting functional layer includes a plurality of sub-functional layers stacked. At least one conductive layer among the plurality of sub-functional layers is disconnected at the position where the partition groove is located. The second electrode layer is disposed on the side of the light-emitting functional layer away from the substrate substrate. The second electrode layer includes a plurality of second electrodes. The first electrode, the second electrode, and the light-emitting functional layer located between the first electrode and the second electrode form a light-emitting device. Thus, the display substrate can improve the crosstalk problem between adjacent sub-pixels caused by the conductive layer with relatively high conductivity in the light-emitting functional layer by providing a partition groove on the first electrode. On the other hand, since the partition groove is provided on the first electrode, it does not occupy the area between adjacent sub-pixels, which is beneficial to reducing the pitch between adjacent sub-pixels, thereby improving the anode opening ratio and / or pixel density of the sub-pixels.

[0064] Next, the display substrate, the method for manufacturing the same, and the display device provided by the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0065] An embodiment of the present disclosure provides a display substrate. Figure 1 is a plan view of a display substrate according to some embodiments of the present disclosure; Figure 2 is a cross-sectional view of a display substrate according to some embodiments of the present disclosure along Figure 1 the A-A direction in Figure 1 and Figure 2 The X-axis direction in

[0066] As shown in Figure 1As shown, the display substrate 10 includes a plurality of sub-pixels, and the plurality of sub-pixels may include sub-pixels of multiple different colors to achieve color display. In some embodiments, the display substrate 10 may include a first sub-pixel p1 that emits first-color light, a second sub-pixel p2 that emits second-color light, and a third sub-pixel p3 that emits third-color light. For example, the first sub-pixel p1 may be a red sub-pixel, the second sub-pixel p2 may be a green sub-pixel, and the third sub-pixel p3 may be a blue sub-pixel. It should be noted that Figure 1 The pixel arrangement and sub-pixel shape shown are only illustrative and not restrictive, and can be actually set according to the needs of the product.

[0067] Each sub-pixel includes a light-emitting device and a pixel driving circuit that drives the light-emitting device to emit light. For example, the light-emitting device may be an OLED light-emitting device or a quantum dot organic light-emitting diode (QLED). In some embodiments, the light-emitting device may be a white light-emitting device, and the white light emitted by the white light-emitting device is filtered by a color film layer disposed above it to obtain light of a corresponding color.

[0068] The pixel driving circuit may include electronic components such as a plurality of transistors and capacitors. For example, the pixel driving circuit may include three transistors and one capacitor, constituting 3T1C (i.e., one driving transistor, two switching transistors, and one capacitor). Another example is that the pixel driving circuit may further include more than three transistors and at least one capacitor, such as 4T1C (i.e., one driving transistor, three switching transistors, and one capacitor), 5T1C (i.e., one driving transistor, four switching transistors, and one capacitor), or 7T1C (i.e., one driving transistor, six switching transistors, and one capacitor), etc. Among them, the transistor may be a thin film transistor (TFT), a metal oxide semiconductor field-effect transistor (MOSFET), or other switching devices with the same characteristics.

[0069] As Figure 2 shown, the display substrate 10 includes a substrate 11, an insulating layer 12, a first electrode layer 13, a light-emitting functional layer 15, and a second electrode layer 16. The first electrode layer 13, the light-emitting functional layer 15, and the second electrode layer 16 are configured to form the light-emitting device of each sub-pixel.

[0070] The substrate substrate 11 includes a substrate layer and a driving circuit provided on the substrate layer. For example, the substrate layer may include a display area and a non-display area. The display area includes a plurality of sub-pixel areas, and the driving circuit includes a pixel driving circuit. Each sub-pixel area is provided with a pixel driving circuit for one sub-pixel. For example, the driving circuit may further include a gate driving circuit provided in the non-display area. In some embodiments, the substrate layer may be a silicon substrate, such as a P-type substrate or an N-type substrate. At this time, the substrate substrate 11 may be referred to as a silicon substrate, and the display substrate 10 may be referred to as a silicon-based display substrate. Of course, in other embodiments, the substrate layer may also be made of other materials, such as other rigid substrate materials or flexible substrate materials, and the present disclosure does not limit this.

[0071] The insulating layer 12 is provided on one side of the substrate substrate 11. The insulating layer 12 includes a plurality of electrode grooves 121 arranged at intervals and a filling portion 120 located between adjacent electrode grooves 121. The openings of the electrode grooves 121 face away from the substrate substrate 11 side of the insulating layer 12. That is, the adjacent electrode grooves 121 are separated by the filling portion 120. In some embodiments, the depth of the electrode groove 121 may be less than or equal to the thickness of the insulating layer 12. Here, "equal" includes absolute equality and approximate equality. Approximate equality means that the deviation between the depth of the electrode groove 121 and the thickness of the insulating layer 12 is small and within an acceptable error range. As Figure 2 shown, the electrode groove 121 may penetrate the insulating layer 12. The orthographic projection of the insulating layer 12 on the substrate substrate 11 is a mesh region. The opening part of the mesh region corresponds to the electrode groove 121, and the grid line part corresponds to the filling portion 120.

[0072] The insulating layer 12 may be a single-layer structure, or may also be a multi-layer structure. Figure 3 For the display substrate 10 of some other embodiments of the present disclosure along Figure 1 the cross-sectional schematic diagram in the A-A direction of Figure 3 shown, the insulating layer 12 may include a first sub-insulating layer 1201 and a second sub-insulating layer 1202 that are sequentially stacked on the substrate substrate 11. For example, the materials of the first sub-insulating layer 1201 and the second sub-insulating layer 1202 may include inorganic insulating materials, and the material of the first sub-insulating layer 1201 is different from the material of the second sub-insulating layer 1202. For example, the material of the first sub-insulating layer 1201 includes silicon nitride, and the material of the second sub-insulating layer 1202 includes silicon oxide. The thickness of the second sub-insulating layer 1202 may be greater than the thickness of the first sub-insulating layer 1201. For example, the thickness of the first sub-insulating layer 1201 may be 200 - 300 angstroms.

[0073] As Figure 2 and Figure 3As shown, the first electrode layer 13 includes a plurality of first electrodes 130, and each first electrode 130 is disposed within an electrode groove 121. The first electrodes 130 located within adjacent electrode grooves 121 are insulated from each other. The first electrode 130 includes a middle portion 131, an edge portion 132, and a partition groove 133 located between the middle portion 131 and the edge portion 132. The edge portion 132 is in contact with the side surface of the electrode groove 121. The partition groove 133 is disposed around the middle portion 131, and the opening of the partition groove 133 faces away from the substrate 11 side of the first electrode 130.

[0074] For example, for the sake of easy distinction, the surface of the structure involved in this article that is away from the substrate 11 is referred to as the first surface, and the surface close to the substrate 11 is referred to as the second surface. The orthographic projection area of the first surface of the middle portion 131 on the substrate 11 is the first projection area, the orthographic projection area of the opening of the partition groove 133 on the substrate 11 is the second projection area, and the orthographic projection area of the first surface of the edge portion 132 on the substrate 11 is the third projection area. The second projection area and the third projection area are annular areas. The second projection area surrounds the outside of the first projection area, and the inner boundary of the second projection area coincides with the boundary of the first projection area. The third projection area surrounds the outside of the second projection area, and the inner boundary of the third projection area coincides with the outer boundary of the second projection area. The orthographic projection of the light-emitting area of the light-emitting device (i.e., the light-emitting area of the sub-pixel) on the substrate 11 is located within the first projection area.

[0075] Figure 4 For Figure 2 the planar schematic diagram of a single first electrode 130 in Figure 4 taking the shape of the sub-pixel as a hexagon as an example, as Figure 4 shown, the dark-filled annular area represents the partition groove 133 in the first electrode 130, the dot-filled area within the partition groove 133 represents the middle portion 131 of the first electrode 130, the dot-filled area outside the partition groove 133 represents the edge portion 132 of the first electrode 130, the dashed box represents the pixel opening 141, that is, the light-emitting area of the light-emitting device (i.e., the light-emitting area of the sub-pixel). The boundary of the middle portion 131 can extend outward compared to the boundary of the pixel opening 141. The partition groove 133 surrounds the middle portion 131, and the edge portion 132 surrounds the partition groove 133.

[0076] As Figure 2 and Figure 3 shown, the light-emitting functional layer 15 is disposed on the side of the first electrode layer 13 away from the substrate 11. The light-emitting functional layer 15 includes a plurality of sub-functional layers stacked (such as Figure 2 and Figure 3152, 154, 155, and 156 in). It should be noted that the above-mentioned light-emitting functional layer 15 not only includes the film layer that directly emits light, but also includes the functional film layer for assisting light emission, such as: hole injection layer, hole transport layer, electron transport layer, and electron injection layer, etc.

[0077] Among the above-mentioned multiple sub-functional layers, there are a conductive layer with a relatively high conductivity and at least one light-emitting layer. The conductivity of the conductive layer is greater than that of the light-emitting layer and less than that of the first electrode layer 13 and the second electrode layer 16. At least one conductive layer among the multiple sub-functional layers is disconnected at the position where the partition groove 133 is located. For example, the above-mentioned at least one conductive layer may include a charge generation layer and / or a hole injection layer.

[0078] In some embodiments, when the above-mentioned multiple sub-functional layers include a charge generation layer and a first light-emitting layer and a second light-emitting layer located on both sides of the charge generation layer, the above-mentioned at least one conductive layer may include a charge generation layer, and the charge generation layer is disconnected at the position where the partition groove 133 is located. For example, the charge generation layer may be Figure 2 and Figure 3 The sub-functional layer 154 in is disconnected at the partition groove 133. It should be noted that the charge generation layer is a non-continuous structure or a non-integral structure at the disconnected position, so that the charge can be blocked from being laterally conducted from the charge generation layer to the adjacent sub-pixels.

[0079] In some embodiments, in addition to the charge generation layer being disconnected at the position where the partition groove 133 is located, among the above-mentioned multiple sub-functional layers, the film layer located between the charge generation layer and the first electrode 130 may also be disconnected at the position where the partition groove 133 is located. For example, the film layer located between the charge generation layer and the first electrode 130 may include a hole injection layer, a hole transport layer, and a first light-emitting layer, and the hole injection layer, the hole transport layer, the first light-emitting layer, and the charge generation layer are respectively disconnected at the position where the partition groove 133 is located.

[0080] When the above-mentioned multiple sub-functional layers include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer that are sequentially stacked in a direction away from the substrate 11, the above-mentioned at least one conductive layer may include a hole injection layer, and the hole injection layer is disconnected at the position where the partition groove 133 is located.

[0081] As Figure 2 and Figure 3 shown, the second electrode layer 16 is disposed on the side of the light-emitting functional layer 15 away from the substrate 11. The second electrode layer 16 includes a plurality of second electrodes. The first electrode 130, the second electrode, and the light-emitting functional layer 15 located between the first electrode 130 and the second electrode form a light-emitting device. For example, the first electrode 130 may be an anode, and the second electrode may be a cathode.

[0082] In the display substrate 10 provided by some embodiments of the present disclosure, by providing a partition groove 133 on the first electrode 130, at least one conductive layer in the light-emitting functional layer 15 is disconnected at the position where the partition groove 133 is located. On the one hand, it can improve the crosstalk problem between adjacent sub-pixels caused by the conductive layer with relatively high conductivity in the light-emitting functional layer 15. On the other hand, since the partition groove 133 is provided on the first electrode 130, it does not need to occupy the area between adjacent sub-pixels, which is beneficial to reducing the pitch of adjacent sub-pixels, thereby improving the anode opening ratio and / or pixel density of the sub-pixels. For example, according to the current lithography machine accuracy, the minimum pitch of adjacent sub-pixels can be controlled at about 0.2 μm, and the anode opening ratio can be increased by more than 15%. "Adjacent sub-pixels" means that there are no other sub-pixels arranged between two sub-pixels.

[0083] In some embodiments, the first electrode layer 13 may be prepared by a damascene process, and the above-mentioned partition groove 133 is formed during the process of preparing the first electrode layer 13 by the damascene process. For example, first, an insulating material layer is formed on the substrate 11, an electrode groove 121 is etched on the insulating material layer, and the material of the first electrode layer 13 is deposited in the electrode groove 121, and combined with a chemical mechanical polishing (CMP) process, the first electrode layer 13 is formed on the substrate 11. For example, the first electrode 130 may include a reflective metal layer with a relatively high reflectivity, and the material of the reflective metal layer includes a metal material with a relatively high reflectivity and poor step coverage ability, such as aluminum (Al), silver (Ag), or a highly reflective alloy material, etc. When depositing the metal material for forming the reflective metal layer on the insulating material layer with the electrode groove 121 by a sputtering process, due to the poor step coverage ability of the metal material, a gap will be formed at the side step of the electrode groove 121, and thus the partition groove 133 located on the first electrode 130 is formed by using this gap. In this way, the partition groove 133 located on the first electrode 130 can be formed while preparing the first electrode 130, without first forming the first electrode 130 and then additionally processing the partition groove 133 on the first electrode 130, which is beneficial to reducing the process steps and the processing difficulty. The specific preparation process will be described in detail in the method embodiments below.

[0084] It should be noted that, when the film quality parameters remain unchanged (such as the deposition parameters are not changed), the stability of the partition groove 133 formed is controllable, and the partition effect can depend on the depth of the partition groove 133. For example, the depth and width of the partition groove 133 can be controlled by adjusting the depth of the electrode groove 121 and the slope (Taper) angle of the filling part 120. The deeper the depth of the electrode groove 121, the larger the gap formed at the side step of the electrode groove 121 after depositing the above metal material; the steeper the slope angle, the larger the above gap. For example, Figure 5A is a schematic structural diagram of an exemplary electrode groove 121, Figure 5B is a schematic structural diagram of another exemplary electrode groove 121. Figure 5A and Figure 5B In, H represents the depth of the electrode groove 121, and α represents the slope angle of the side of the filling part 120. As Figure 5A shown, the side 1011 of the electrode groove 121 can be perpendicular to the substrate 11, and the slope angle α of the filling part 120 is 90 degrees. As Figure 5B shown, the side 1011 of the electrode groove 121 can also be inclined towards the central axis of the electrode groove 121, the slope angle α is greater than 90 degrees, and the cross-sectional shape of the filling part 120 is an inverted trapezoid. Figure 2 and Figure 3 take the slope angle α of the filling part 120 being 90 degrees as an example for illustration.

[0085] Figure 6 is Figure 3 a schematic structural diagram of a single first electrode 130 in. For ease of understanding, Figure 6 also shows the electrode groove 121 where the first electrode 130 is located. Now refer to Figure 6 to describe the structure of the partition groove 133. It should be noted that, Figure 2 , Figure 3 and Figure 6 take the structure of the partition groove 133 in some embodiments of the present disclosure as an example for illustration, which is not a limitation. In other embodiments of the present disclosure, the morphology of the partition groove 133 can also be different from Figure 2 , Figure 3 and Figure 6 , as long as the above partition effect can be achieved. Figure 6 In, M1 represents the central axis of the middle part 131 of the first electrode 130; M2 represents the central axis of the partition groove 133; a represents the width of the opening of the partition groove 133 along the direction of the connection line between the center points of the middle parts 131 of two adjacent first electrodes 130 (similar to the connection line L direction in Figure 1 ); h represents the depth of the partition groove 133 along the central axis M2 of the partition groove 133, and β represents the inclination angle of the first side of the partition groove 133.

[0086] In some embodiments, the middle portion 131 and the edge portion 132 of the first electrode 130 are connected at the bottom of the partition groove 133, that is, the partition groove 133 does not penetrate the first electrode 130. Although the first surfaces of the middle portion 131 and the edge portion 132 are separated by the partition groove 133 in this way, they are still electrically connected, which facilitates the signal access of the first electrode 130.

[0087] In some embodiments, relative to the direction perpendicular to the substrate 11, the central axis M2 of the partition groove 133 is inclined toward the surrounded middle portion 131. For example, the central axis M2 of the partition groove 133 can be determined according to the center point of the groove opening and the center point of the groove bottom, or can be determined according to the center point of the groove opening and the lowest point of the groove bottom, depending on the shape of the isolation groove. When the isolation groove is Figure 6 the inclined "V"-shaped groove as shown, the central axis of the partition groove 133 can be a straight line determined based on the center point of the groove opening and the lowest point of the partition groove 133. For example, as Figure 6 shown, the intersection end of the two side surfaces of the "V"-shaped groove points to the corner position between the side surface and the bottom surface of the electrode groove 121. The inclined arrangement of the partition groove 133 can make the slope angle of the slope surface of the middle portion 131 larger, which is beneficial to the reflection of large-angle light.

[0088] When the central axis M2 of the partition groove 133 is inclined toward the surrounded middle portion 131 relative to the direction perpendicular to the substrate 11, in some embodiments, along the direction of the central axis M2 of the partition groove 133, the depth h of the partition groove 133 can be 0.05 μm to 0.1 μm, for example, it can be 0.05 μm, 0.07 μm or 0.1 μm. The partition groove 133 is inclined and has a small depth, which can play the above-mentioned partition role while reducing the influence on the first electrode 130.

[0089] In some embodiments, along the direction of the line connecting the center points of the middle portions 131 of two adjacent first electrodes 130, the width a of the opening of the partition groove 133 can be 0.03 μm to 0.06 μm, for example, it can be 0.03 μm, 0.04 μm, 0.05 μm or 0.06 μm. The center point of the middle portion 131 here can be the geometric center point of the middle portion 131. This is beneficial to reducing the occupation of the first electrode 130 while achieving the above-mentioned partition effect, and is beneficial to increasing the anode opening ratio.

[0090] In some embodiments, the partition groove 133 includes a first side surface 1331 and a second side surface 1332 which are oppositely arranged. Relative to the direction perpendicular to the substrate 11, the first side surface 1331 and the second side surface 1332 are inclined towards the middle portion 131 surrounded by the partition groove 133. That is to say, the whole partition groove 133 is inclined. The bottom of the partition groove 133 is closer to the surrounding filling portion 120 than the opening, that is, the distance between the bottom of the partition groove 133 and the filling portion 120 is less than the distance between the opening of the partition groove 133 and the filling portion 120.

[0091] For the convenience of distinction, the end of the first side surface 1331 close to the substrate 11 is called the first end (i.e., Figure 6 the lower end in Figure 6 ), and the end far from the substrate 11 is called the second end (i.e.,

[0092] the upper end in

[0092] ). Since the first side surface 1331 and the second side surface 1332 are inclined towards the middle portion 131 surrounded by the partition groove 133, in the same first electrode 130, the distance between the first end of the first side surface 1331 and the central axis M1 of the middle portion 131 is greater than the distance between the second end of the first side surface 1331 and the central axis M1 of the middle portion 131, and the distance between the first end of the second side surface 1332 and the central axis M1 of the middle portion 131 is greater than the distance between the second end of the second side surface 1332 and the central axis M1 of the middle portion 131.

[0092] In the same first electrode 130, the first side surface 1331 of the partition groove 133 is located on the side closer to the middle portion 131 than the second side surface 1332. Since the first side surface 1331 and the second side surface 1332 are inclined towards the middle portion 131 surrounded by the partition groove 133, the inclination angle of the first side surface 1331 is greater than that of the second side surface 1332. The inclination angle is the angle with the direction perpendicular to the substrate 11. In some embodiments, the inclination angle β of the first side surface 1331 can be 30° - 45°, for example, it can be 30°, 40° or 45°, etc.

[0093] In some embodiments, the distance between the first end of the first side surface 1331 and the first end of the second side surface 1332 is less than the distance between the second end of the first side surface 1331 and the second end of the second side surface 1332, that is, the notch size is greater than the bottom size. For example, from the opening of the partition groove 133 to the bottom of the partition groove 133, the interval distance between the first side surface 1331 and the second side surface 1332 shows a decreasing trend. This is beneficial to reducing the influence on the first electrode 130 while achieving the partition effect. For example, the first end of the first side surface 1331 can be connected to the first end of the second side surface 1332, that is, the bottom ends of the two side surfaces are connected, and the cross-sectional shape of the partition groove 133 is Figure 6 the inclined "V" shape shown in

[0094] As shown Figure 6 in FIG. 1, the partition groove 133 is disposed on the side surface of the electrode groove 121 close to the electrode groove 121 (i.e., the slope surface of the filling portion 120) to increase the size of the middle portion 131 as much as possible and ensure the anode opening ratio. For example, for the same first electrode 130, along the direction of the line connecting the center points of the middle portions 131 of two adjacent first electrodes 130, the distance between the opening of the partition groove 133 and the center point of the middle portion 131 is the first distance, and the distance between the opening of the partition groove 133 and the edge of the edge portion 132 far from the middle portion 131 is the second distance, and the first distance is greater than the second distance. For example, Figure 6 in [reference document], the distance between the first edge of the opening of the partition groove 133 and the center point of the middle portion 131 is taken as the first distance d1, and the distance between the second edge of the opening of the partition groove 133 and the edge of the edge portion 132 far from the middle portion 131 is taken as the second distance d2, and the first distance d1 is greater than the second distance d2.

[0095] In some embodiments, a groove is provided at the connection position between the side surface and the bottom surface of at least one electrode groove 121. The groove is recessed downward in the direction of the bottom surface of the substrate with respect to the bottom surface of the electrode groove 121, and the height of the lowest point of the groove is less than the height of the bottom surface of the electrode groove 121. The height here refers to the distance from the bottom surface of the substrate 11. For example, in the process of fabricating the first electrode 130 using the damascene process, when etching the electrode groove 121, the density of the etching medium (such as plasma) is relatively high at the corner position between the side surface and the bottom surface of the electrode groove 121, so that the above-mentioned groove will be formed at this corner position. The depth and size of the groove can be controlled by adjusting parameters such as the longitudinal and lateral etching voltages of the etching process. The presence of the groove is more conducive to forming a gap at the side step of the electrode groove 121 when sputtering and depositing a metal material with poor step coverage ability subsequently, so as to facilitate the formation of the first electrode 130 with the partition groove 133.

[0096] In some embodiments, the lowest point of the above groove is located on the side far from the middle portion 131 of the lowest point of the partition groove 133. For example, when the first end of the first side surface 1331 of the partition groove 133 is connected to the first end of the second side surface 1332, the lowest point of the partition groove 133 may be the intersection point of the first end of the first side surface 1331 and the first end of the second side surface 1332.

[0097] Figure 7 is Figure 6 a partial enlarged view of. As shown Figure 7 in FIG. 2 Figure 7At the junction of the bottom surface 1211 and the side surface 1212 of the electrode groove 121 shown, it is concave compared to the bottom surface 1211 of the electrode groove 121, that is, there is a groove 122. For example, the groove 122 can be surrounded by a curved surface that is concave with respect to the bottom surface of the electrode groove 121, and the center of curvature of the curved surface is located on the side of the curved surface facing the first electrode. For example, the above-mentioned curved surface can include a first sub-curved surface 1221 and a second sub-curved surface 1222. The bottom surface of the electrode groove 121 is connected to the top end of the first sub-curved surface 1221. The bottom end of the first sub-curved surface 1221 and the bottom end of the second sub-curved surface 1222 are connected. The top end of the second sub-curved surface 1222 is connected to the side surface of the electrode groove 121, where the top end is the end relatively far from the bottom surface of the substrate, and the bottom end is the end relatively close to the bottom surface of the substrate. For example, Figure 7 The point Q1 in represents the lowest point of the partition groove 133, and the point Q2 represents the lowest point of the groove 122. The point Q2 is located on the side away from the middle part 131 of the point Q1 (such as Figure 7 the right side in).

[0098] The first electrode 130 can be a single-layer structure, or it can also be a multi-layer structure. Figure 8A is an exemplary film layer structure diagram of the first electrode 130, Figure 8B is another exemplary film layer structure diagram of the first electrode 130, and 8C is another film layer structure diagram of the first electrode 130. As Figure 8A shown, the first electrode 130 can include a first sub-electrode layer 1301 and a second sub-electrode layer 1302 that are sequentially stacked in a direction away from the substrate 11. For example, the second sub-electrode layer 1302 can function as a reflective layer and an electrode layer, and the first sub-electrode layer 1301 functions to increase the adhesion between the first electrode 130 and the substrate 11 and to inhibit the electromigration of the second sub-electrode layer 1302.

[0099] As Figure 8A shown, the first sub-electrode layer 1301 includes a first covering portion 201 that covers the bottom surface of the electrode groove 121 and a second covering portion 202 that covers the side surface of the electrode groove 121. The second sub-electrode layer 1302 fills the space surrounded by the first covering portion 201 and the second covering portion 202. The thickness of the second sub-electrode layer 1302 is greater than the thickness of the first covering portion 201.

[0100] In some embodiments, the step coverage of the material of the second sub-electrode layer 1302 is less than the step coverage of the material of the first sub-electrode layer 1301. For example, if the first sub-electrode layer 1301 includes a first material and the second sub-electrode layer 1302 includes a second material, then the step coverage of the second material is less than the step coverage of the first material. As Figure 8AAs shown, the above-mentioned partition groove 133 can be provided in the second sub-electrode layer 1302 and is located in the corner area between the first covering portion 201 and the second covering portion 202. The partition groove 133 does not penetrate through the second sub-electrode layer 1302, that is, the second sub-electrode layer 1302 is integrally conductive and is not partitioned by the partition groove 133 into two insulated parts from each other.

[0101] In some embodiments, the first sub-electrode layer 1301 may include a titanium layer and / or a titanium nitride layer. For example, the first sub-electrode layer 1301 may be a titanium layer, or may also be a titanium nitride layer, or may further be a stacked structure of a titanium layer and a titanium nitride layer. The second sub-electrode layer 1302 may be a reflective metal layer, which is prepared from a metal material with a relatively high reflectivity and a relatively low step coverage rate, that is, a relatively poor step coverage ability, such as an aluminum layer, a silver layer, or an alloy material layer with a relatively high reflectivity. Taking the first sub-electrode layer 1301 as a titanium layer and the second sub-electrode layer 1302 as an aluminum layer as an example, the aluminum layer can function as a reflective layer and an electrode layer, and the titanium layer can increase the adhesion between the aluminum and the substrate 11 and inhibit the electromigration of the aluminum.

[0102] In some embodiments, the first electrode 130 is an anode. When the second sub-electrode layer 1302 is a reflective metal layer, in addition to the first sub-electrode layer 1301 and the second sub-electrode layer 1302, the first electrode 130 may further include a third sub-electrode layer 1303, which is provided on the side of the second sub-electrode layer 1302 away from the substrate 11 and functions as an electrode layer. The third sub-electrode layer 1303 may be prepared from a material with a relatively high work function. For example, the third sub-electrode layer 1303 may be a transparent conductive oxide thin film, and the material of the transparent conductive oxide thin film may include, for example, one of indium tin oxide (ITO) and indium zinc oxide (IZO). By providing the third sub-electrode layer 1303 with a relatively high work function, it is beneficial to improve the hole injection efficiency of the anode.

[0103] As Figure 8B and Figure 8C shown, the first electrode 130 includes a first sub-electrode layer 1301, a second sub-electrode layer 1302, and a third sub-electrode layer 1303 that are sequentially stacked in a direction away from the substrate 11. The second sub-electrode layer 1302 includes a main body portion 301, an epitaxial portion 302, and a gap 303 that is located between the main body portion 301 and the epitaxial portion 302 and does not penetrate through the second sub-electrode layer 1302. The gap 303 surrounds the main body portion 301, and the epitaxial portion 302 surrounds the gap 303. It should be noted that the morphology of the gap 303 is similar to the above-mentioned partition groove 133 and will not be elaborated here. As Figure 8BAs shown, the third sub-electrode layer 1303 can conformally cover the main body portion 301, the epitaxial portion 302, and the above-mentioned gap 303. At this time, the above-mentioned partition groove 133 is formed by the gap 303 on the second sub-electrode layer 1302 and the third sub-electrode layer 1303 that conformally covers this gap 303. As Figure 8C shown, the third conductive layer can only cover the main body portion 301. The middle portion 131 of the first electrode 130 includes a partial area of the first covering portion 201, the main body portion 301, and the third sub-electrode layer 1303, while the edge portion 132 does not include the third sub-electrode layer 1303. At this time, the gap 303 on the second sub-electrode layer 1302 is the above-mentioned partition groove 133.

[0104] As Figure 8A , 8B and as shown in 8C, the first surface of the second sub-electrode layer 1302 (i.e., the surface away from the substrate 11), the first surface of the second covering portion 202, and the first surface of the filling portion 120 are flush. It should be noted that the flush here can include absolute flush and approximate flush. Approximate flush means that the step difference is within an acceptable error range. For example, the step difference is within 20 angstroms.

[0105] It should be noted that during the process of forming the above-mentioned first electrode 130 with the partition groove 133 by using the damascene process, it is necessary to polish the excess material, such as polishing by using the CMP process. After the polishing process, the first surface of the second sub-electrode layer 1302, the first surface of the second covering portion 202, and the first surface of the filling portion 120 are approximately flush, and the step difference can be controlled within 20 angstroms.

[0106] As Figure 2 and Figure 3 shown, in some embodiments, the display substrate 10 further includes a pixel defining layer 14, which is disposed on the side of the first electrode layer 13 away from the substrate 11. The pixel defining layer 14 has a plurality of pixel openings 141. One pixel opening 141 is configured to define the light-emitting interval of a light-emitting device, that is, the light-emitting area of a sub-pixel. Each pixel opening 141 corresponds to a first electrode 130, and each pixel opening 141 exposes at least a partial area of the surface of the middle portion 131 of the corresponding first electrode 130. The orthographic projection of the pixel opening 141 on the substrate 11 is located within the orthographic projection range of the first surface of the middle portion 131 on the substrate 11.

[0107] The pixel defining layer 14 conformally covers at least the partition groove 133, the edge portion 132 of the first electrode 130, and the filling portion 120. Conformally covering the partition groove 133 means covering the first side surface and the second side surface of the partition groove 133 following the shape of the partition groove 133. For example, the pixel opening 141 may expose a partial area of the first surface of the middle portion 131, cover the remaining area surrounding this partial area, and conformally cover the partition groove 133, the edge portion 132 of the first electrode 130, and the filling portion 120. That is to say, the orthographic projection of the first surface of the middle portion 131 on the substrate 11 is expanded compared to the orthographic projection of the pixel opening 141 on the substrate 11, and the boundary of the orthographic projection of the pixel opening 141 on the substrate 11 is within the boundary of the first projection area.

[0108] For example, the pixel defining layer 14 may include a first flat portion 142, a second flat portion 144, and a concave portion 143 located between the first flat portion 142 and the second flat portion 144. The first flat portion 142 covers the edge area of the first surface of the middle portion 131 of the first electrode 130, and this edge area refers to the remaining area except for the partial area exposed by the pixel opening 141. The concave portion 143 wraps the partition groove 133, that is, conformally covers the first side surface and the second side surface of the partition groove 133. The second flat portion 144 covers the first surface of the edge portion 132 of the first electrode 130 and the first surface of the filling portion 120. The first flat portion 142, the concave portion 143, and the second flat portion 144 are connected in sequence.

[0109] In some embodiments, the material of the pixel defining layer 14 may include a metal oxide or a silicon-based compound having insulating properties. The above metal oxide may include, for example, aluminum oxide (such as Al2O3) and / or titanium oxide (such as TiO and / or TiO2). In some embodiments, the material of the pixel defining layer 14 is aluminum oxide. On the one hand, aluminum oxide has good step coverage ability, and when depositing aluminum oxide by atomic layer deposition to form the pixel defining layer 14, it can cover the partition groove 133 as much as possible. On the other hand, aluminum oxide has good insulating properties.

[0110] The thickness of the pixel defining layer 14 is less than the thickness of the first electrode 130. For example, the thickness of the pixel defining layer 14 may be less than 300 angstroms. Compared with designing a partition structure using the pixel defining layer 14 between adjacent sub-pixels, the embodiments of the present disclosure provide a partition groove 133 on the first electrode 130, which is beneficial to reducing the thickness of the pixel defining layer 14, thereby reducing the influence of the step difference caused by the thickness of the pixel defining layer 14 on the distortion degree of the light-emitting device, being beneficial to improving the transfer efficiency of the light-emitting device, and reducing the leakage degree.

[0111] The light-emitting functional layer 15 covers the middle portion 131 region exposed at the pixel opening 141 and the pixel defining layer 14. Taking the light-emitting device as a tandem light-emitting device as an example, the light-emitting functional layer 15 may include a first light-emitting layer, a charge generation layer, and a second light-emitting layer sequentially stacked on the first electrode 130. For example, Figure 2 and Figure 3 the sub-functional layer 152 in may be the first light-emitting layer, the sub-functional layer 154 may be the charge generation layer, the sub-functional layer 156 may be the second light-emitting layer, and the first light-emitting layer and the charge generation layer are disconnected at the position where the partition groove 133 is located. In some embodiments, the light-emitting functional layer 15 may further include a buffer layer disposed between the charge generation layer and the second light-emitting layer. The buffer layer fills the partition gap formed due to the existence of the partition groove 133. The film layer of the light-emitting functional layer 15 on the side away from the substrate 11 of the buffer layer, such as the second light-emitting layer, is no longer partitioned by the partition groove 133 and is a continuous structure or an integral structure. For example, Figure 2 and Figure 3 the sub-functional layer 155 in may be the buffer layer. It should be noted that Figure 2 and Figure 3 the four sub-functional layers shown in are only for illustration. In an actual product, the light-emitting functional layer 15 may include more or fewer film layers. For example, it may further include a hole injection layer and a hole transport layer between the first electrode 130 and the first light-emitting layer, and an electron transport layer and an electron injection layer between the first light-emitting layer and the charge generation layer, which are set according to the needs of the actual product, and the present disclosure does not limit this.

[0112] The second electrode layer 16 covers the light-emitting functional layer 15. The second electrode layer 16 may include a plurality of second electrodes, and each light-emitting device corresponds to one second electrode. For example, the second electrodes of adjacent light-emitting devices may be connected to each other, that is, the second electrode layer 16 is a continuous structure or an integral structure, which is beneficial to the signal input of the second electrodes of each light-emitting device. For example, the second electrode may be a transparent cathode. The light-emitting functional layer 15 may emit light from the side away from the substrate 11 through the transparent cathode to achieve top emission. For example, the second electrode layer 16 may be made of any one or more of magnesium (Mg), silver (Ag), aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material such as ITO, or a multi-layer composite structure of a metal and a transparent conductive material.

[0113] In some embodiments, there is a depression at a position in the second electrode layer 16 corresponding to the partition groove 133. For example, the second electrode layer 16 may include a first flat portion 161, a second flat portion 162, and a depression portion 163 connecting the first flat portion 161 and the second flat portion 162. The depression portion 163 is disposed around the first flat portion 161. The depression portion 163 is recessed toward the side of the first flat portion 161 and the second flat portion 162 close to the substrate 11. The orthographic projection of the first flat portion 161 on the substrate 11 is within the orthographic projection range of the middle portion 131 on the substrate 11. The orthographic projection of the second flat portion 162 on the substrate 11 covers the orthographic projection of the filling portion 120 on the substrate 11. The orthographic projection of the lowest point of the depression portion 163 on the substrate 11 is within the orthographic projection range of the opening of the partition groove 133 on the substrate 11.

[0114] In addition to the above structure, the display substrate 10 may further include other film layer structures, which can be set according to the actual needs of the product, and the present disclosure does not limit this.

[0115] Figure 9 For the display substrate 10 of still other embodiments of the present disclosure along Figure 1 the cross-sectional schematic diagram taken along the A-A direction in Figure 9 As shown, the display substrate 10 may further include a packaging layer 17, which is disposed on the side of the second electrode layer 16 away from the substrate 11 to block the intrusion of water and oxygen into the light-emitting device.

[0116] In some embodiments, the packaging layer 17 may include a plurality of sub-packaging layers. In some embodiments, the plurality of sub-packaging layers include a first sub-packaging layer, a second sub-packaging layer, and a third sub-packaging layer that are sequentially stacked. The first sub-packaging layer and the third sub-packaging layer may be inorganic packaging layers. For example, the materials of the first sub-packaging layer and the third sub-packaging layer may be silicon nitride or other suitable inorganic packaging materials. The second sub-packaging layer may be a metal oxide layer or an organic packaging layer. For example, the materials of the metal oxide layer here may include alumina and titanium oxide, etc. Based on this, in some embodiments, there is also a depression at a position in the first sub-packaging layer corresponding to the partition groove 133. The shape and position of the depression are similar to those of the depression portion 163 in the second electrode layer 16, and will not be described in detail here.

[0117] In another embodiment, the multiple sub-encapsulation layers may include a first inorganic encapsulation layer and a second inorganic encapsulation layer that are alternately stacked. For example, the materials of the first inorganic encapsulation layer and the second inorganic encapsulation layer may be silicon nitride and silicon oxide respectively, or other suitable inorganic encapsulation materials may also be used. Based on this, in some embodiments, there are also depressions at the positions of the first inorganic encapsulation layer and the second inorganic encapsulation layer corresponding to the partition groove 133, and the shapes and positions of the depressions are similar to those of the depression portion 163 in the second electrode layer 16, which will not be elaborated here.

[0118] As Figure 9 shown, the display substrate 10 may further include a color filter layer 18, which is disposed on the side of the encapsulation layer 17 away from the substrate 11. The color filter layer 18 may include multiple color filter regions 181 and light-shielding regions 182 located between adjacent color filter regions 181. The orthographic projection of each color filter region 181 on the substrate 11 is located in a sub-pixel region. The color filter layer 18 includes multiple color filter units, and each sub-pixel may further include a color filter unit corresponding to the light-emitting device. For example, in the same sub-pixel, the orthographic projection of the geometric center point of the color filter unit on the substrate 11 may coincide with the orthographic projection of the geometric center point of the light-emitting region of the light-emitting device on the substrate 11. The light emitted by the light-emitting device is output after passing through the color filter unit.

[0119] In some embodiments, adjacent color filter units have different colors, and adjacent color filter units of different colors overlap in the light-shielding region 182 to achieve light shielding in the light-shielding region 182. For example, the plurality of color filter regions 181 includes a red filter region, a green filter region, and a blue filter region. The red filter region transmits red light, the green filter region transmits green light, and the blue filter region transmits blue light. Accordingly, the plurality of color filter units may include a red color filter unit, a green color filter unit, and a blue color filter unit. The red color filter unit covers the red filter region, the light-shielding region 182 between the red filter region and the blue filter region, and the light-shielding region 182 between the red filter region and the green filter region. The green color filter unit covers the green filter region, the light-shielding region 182 between the red filter region and the green filter region, and the light-shielding region 182 between the green filter region and the blue filter region. The blue color filter unit covers the blue filter region, the light-shielding region 182 between the blue filter region and the red filter region, and the light-shielding region 182 between the blue filter region and the green filter region. The red filter unit and the blue filter unit are overlapped and arranged in the light-shielding region 182 between the red filter region and the blue filter region to achieve light shielding of the light-shielding region 182. The red filter unit and the green filter unit are overlapped and arranged in the light-shielding region 182 between the red filter region and the green filter region to achieve light shielding of the light-shielding region 182. The green filter unit and the blue filter unit are overlapped and arranged in the light-shielding region 182 between the green filter region and the blue filter region to achieve light shielding of the light-shielding region 182.

[0120] In other embodiments, adjacent color filter units in the color filter layer 18 are spaced apart from each other, and the display substrate 10 further includes a light-shielding portion located in the light-shielding region 182, and the light-shielding portion is disposed between adjacent color filter units. For example, the material of the light-shielding portion may include a black matrix (BM) material or other light-shielding materials.

[0121] As Figure 9 shown, the display substrate 10 may further include a light-dimming layer 19, which is disposed on the side of the color filter layer 18 away from the substrate 11, and dims the light filtered by the color filter layer 18. For example, the light emitted by each sub-pixel can be converged or diverged. For example, the light-dimming layer 19 may include a microlens array, and the microlens array includes a plurality of microlens units, and each microlens unit corresponds to one or more sub-pixels. For details, reference can be made to the related art.

[0122] Figure 10 is a flowchart of a method for manufacturing a display substrate according to some embodiments of the present disclosure. As Figure 10 shown, the manufacturing method may at least include the following steps S110 to step S150.

[0123] Step S110, providing a substrate 11.

[0124] Step S120: Form an insulating layer 12 on the substrate 11.

[0125] Among them, the insulating layer 12 includes a plurality of electrode grooves 121 arranged at intervals and a filling portion 120 located between adjacent electrode grooves 121. The openings of the electrode grooves 121 face away from the substrate 11 side of the insulating layer 12. The structure of the insulating layer 12 can refer to the relevant description in the above embodiments and will not be elaborated here.

[0126] Step S130: Form an electrode material layer on the insulating layer 12 and polish the electrode material layer to form a first electrode layer 13 including a plurality of first electrodes 130 arranged at intervals.

[0127] Among them, each first electrode 130 is disposed in one electrode groove 121, and the first electrodes 130 in adjacent electrode grooves 121 are insulated from each other. The first electrode 130 includes a middle portion 131, an edge portion 132, and a partition groove 133 located between the middle portion 131 and the edge portion 132. The edge portion 132 contacts the side surface of the electrode groove 121. The partition groove 133 is arranged around the middle portion 131, and the opening of the partition groove 133 faces away from the substrate 11 side of the first electrode 130. The structure of the first electrode layer 13 can refer to the relevant description in the above embodiments and will not be elaborated here.

[0128] Step S140: Form a light-emitting functional layer 15 on the first electrode layer 13.

[0129] Among them, the light-emitting functional layer 15 includes a plurality of sub-functional layers stacked. At least one conductive layer among the plurality of sub-functional layers is disconnected at the position where the partition groove 133 is located. The structure of the light-emitting functional layer 15 can refer to the relevant description in the above embodiments and will not be elaborated here.

[0130] Step S150: Form a second electrode layer 16 on the light-emitting functional layer 15.

[0131] Among them, the second electrode layer 16 includes a plurality of second electrodes. The structure of the second electrode layer 16 can refer to the relevant description in the above embodiments and will not be elaborated here. The first electrode 130, the second electrode, and the light-emitting functional layer 15 located between the first electrode 130 and the second electrode form a light-emitting device.

[0132] Taking the substrate 11 as a silicon substrate as an example, step S110 may include providing a silicon substrate, such as a P-type substrate or an N-type substrate, and fabricating a driving circuit on the silicon substrate, including fabricating structures such as transistors, capacitors, connection lines, and vias included in the driving circuit. The specific implementation process can refer to the related technology and will not be elaborated here.

[0133] Figure 11A 、 Figure 11Band Figure 11C FIG. 4 is an exemplary process flow chart of the insulating layer 12. In some embodiments, a first insulating film 401 and a second insulating film 402 may be sequentially deposited on the base substrate 11 to form a film on the base substrate 11. Figure 11A Then a patterned photoresist layer 501 is formed on the stacked structure, as shown Figure 11B Then, under the protection of the patterned photoresist layer 501, the electrode groove 121 is etched in the above-mentioned laminated structure to form the above-mentioned insulating layer 12, as shown Figure 11C As shown. It should be noted that the shape of the electrode groove 121 determines the shape of the first electrode 130, and the pattern of the photoresist layer can be determined according to the shape of the sub-pixel, so as to obtain the electrode groove 121 of the desired shape. For example, the first insulating film 401 can be a silicon nitride film, and the second insulating film 402 can be a silicon oxide film. The silicon nitride film plays a role in capturing the glow signal in the etching (Etch) process of the electrode groove 121, and the deposition thickness can be relatively thin, which can be about 200-300 angstroms, for example, 200 angstroms, 250 angstroms or 300 angstroms. In actual implementation, the depth of the electrode groove 121 to be formed can be determined according to the width and depth of the isolation groove to be formed on the first electrode 130 as needed, and the depth of the electrode groove 121 can be controlled by regulating the thickness of the silicon oxide film.

[0134] In some embodiments, during the etching process of the electrode grooves 121, due to the high density of the etching medium (e.g., plasma) at the corner between the side and bottom of the electrode grooves 121, a groove is formed at the junction of the side and bottom of at least one electrode groove 121. The morphology of the groove can be found in the relevant description above and will not be repeated here.

[0135] After the electrode groove 121 is prepared, step S130 may be performed.

[0136] In some embodiments, the electrode material layer in step S130 includes a first electrode material sub-layer and a second electrode material sub-layer. Figure 12 for Figure 10 Flowchart of step S130 in FIG. Figure 12 As shown, step S130 may include the following steps S131, S132 and S133.

[0137] In step S131 , a first material is deposited on the insulating layer 12 to form a first electrode material sublayer. The first electrode material sublayer conformally covers the bottom and side surfaces of the electrode groove 121 and the top of the filling portion 120 .

[0138] Step S132: Deposit a second material on the first electrode material sub-layer to form a second electrode material sub-layer. The step coverage rate of the second material is less than that of the first material, and the thickness of the second electrode material sub-layer is greater than that of the first electrode material sub-layer.

[0139] Step S133: Polish the second electrode material sub-layer and the first electrode material sub-layer to remove the second electrode material sub-layer that extends beyond the opening of the electrode groove 121, and the second electrode material sub-layer and the first electrode material sub-layer located on the top of the filling portion 120, thereby forming the first electrode layer 13.

[0140] Due to the poor step coverage ability of the second material, during the step of depositing the second material by sputtering process, a gap will be formed at the position of the side step near the electrode groove 121, such that the formed second electrode material sub-layer includes a first deposition portion, a second deposition portion, and a gap located between the first deposition portion and the second deposition portion. The gap surrounds the first deposition portion. The gap extends into the electrode groove 121 and is close to the side surface of the electrode groove 121. In addition, the gap is inclined towards the central axis of the electrode groove 121.

[0141] The first deposition portion and the second deposition portion are connected at the bottom of the gap. The first deposition portion covers the first electrode material sub-layer located on the bottom surface of the electrode groove 121, and the second deposition portion covers the first electrode material sub-layer located on the top of the filling portion 120 and the side surface of the electrode groove 121. The angle between the side surface of the first deposition portion facing the gap and the first surface of the first deposition portion is an obtuse angle. The angle between the side surface of the second deposition portion facing the gap and the first surface of the second deposition portion is an acute angle. The first surface is the surface away from the substrate 11. There is a transition surface connected between the side surface of the second deposition portion facing the gap and the first surface of the second deposition portion, and the transition surface is an arc surface.

[0142] Figure 13A and Figure 13B is an exemplary processing flow chart of the first electrode layer 13. The following will refer to Figure 13A and Figure 13B , taking the first material as titanium, the first electrode material sub-layer as a titanium layer, the second material as aluminum, the second electrode material sub-layer as an aluminum layer, and the first electrode 130 including a titanium layer and an aluminum layer stacked in sequence on the substrate 11, with the aluminum layer serving as a reflective layer and an electrode layer as an example, to illustrate an exemplary processing process of the first electrode layer 13.

[0143] As Figure 13AAs shown, a titanium layer 610 with a first thickness and an aluminum layer 620 with a second thickness can be sequentially deposited on the substrate 11 through a sputtering process, and the first thickness is less than the second thickness. Titanium has relatively good step coverage ability and relatively thin deposition thickness. The titanium layer 610 can conformally cover the bottom surface, side surfaces of the electrode groove 121, and the top of the filling portion 120 between adjacent electrode grooves 121. Aluminum has relatively poor step coverage ability and relatively thick deposition thickness. The deposited aluminum layer 620 will form a gap 623 extending into the electrode groove 121 at the side step near the electrode groove 121, and this gap 623 is inclined towards the central axis direction of the electrode groove 121, and the bottom end of the gap 623 points to the corner position between the side surface and the bottom surface of the electrode groove 121.

[0144] As Figure 13A shown, the inclined gap 623 divides the deposited aluminum layer 620 into a first deposition portion 621 and a second deposition portion 622. The gap 623 surrounds the outside of the first deposition portion 621. Although the first deposition portion 621 and the second deposition portion 622 are separated by the gap, since aluminum will still be deposited at the corner position between the side surface and the bottom surface of the electrode groove 121, the gap 623 will not penetrate the aluminum layer 620 deposited in the electrode groove 121. That is to say, the first deposition portion 621 and the second deposition portion 622 are connected to each other at the bottom end of the gap 623. The first deposition portion 621 covers the titanium layer 610 located on the bottom surface of the electrode groove 121. In the Figure 13A cross-sectional view shown, it presents a structure similar to a regular trapezoid, and the area of the first surface of the first deposition portion 621 is smaller than the area of the second surface. The second deposition portion 622 covers the titanium layer 610 located on the top of the filling portion 120 and the side surfaces of the electrode groove 121, that is, the second deposition portion 622 Figure 13A shown wraps the titanium layer 610 covering the side surface and the top of the filling portion 120. The thickness of the second deposition portion 622 covering the side wall of the filling portion 120 gradually increases in the direction away from the substrate 11. The thickness of the second deposition portion 622 covering the top of the filling portion 120 is greater than the thickness of the second deposition portion 622 covering the side wall of the filling portion 120. It should be noted that the thickness of the second deposition portion 622 covering the top of the filling portion 120 is the thickness in the direction perpendicular to the substrate 11, and the thickness of the second deposition portion 622 covering the side wall of the filling portion 120 is the thickness in the direction perpendicular to the side surface of the filling portion 120.

[0145] As Figure 13AAs shown, the included angle γ1 between the side surface 6211 of the first deposition part 621 facing the gap 623 and the first surface 6212 of the first deposition part 621 is an obtuse angle. The included angle γ2 between the side surface 6221 of the second deposition part 622 facing the gap 623 and the first surface 6223 of the second deposition part 622 is an acute angle. A transition surface 6222 as shown in Figure 13A is connected between the side surface of the second deposition part 622 facing the gap 623 and the first surface of the second deposition part 622. The transition surface 6222 is an arc surface, and the center of curvature of the arc surface is located on the side close to the filling part 120 of the arc surface. That is to say, there is an arc transition between the top of the side surface 6221 of the second deposition part 622 facing the gap and the first surface 6223 of the second deposition part 622.

[0146] Thereafter, the substrate on which the aluminum layer deposition is completed is polished by a CMP process to remove the excess aluminum and titanium, so that the reflective layer of the formed first electrode 130 is flat and the titanium layer adjacent to the first electrode 130 is disconnected at the top of the filling part 120. For example, when the titanium layer covering the top of the filling part 120 is ground off, the grinding can be stopped, that is, ground to the Figure 13A reference line K in, and the substrate structure as shown in Figure 13B is obtained. By polishing through the CMP process, the step difference between the first surface of the filling part 120 and the first surface of the ground aluminum layer and titanium layer can be controlled within 20 angstroms. Since the above gap 623 penetrates into the electrode groove 121, after grinding off the part exceeding the electrode groove 121, the remaining part will be retained in the remaining aluminum layer, and the opening is flush with the first surface of the ground aluminum layer. The remaining gap after grinding can divide the aluminum layer in the electrode groove 121 into two parts, namely the connected main part 301 and the epitaxial part 302, so as to form the first electrode 130 with the partition groove 133.

[0147] In some embodiments, after forming the first electrode layer 13 and before forming the light-emitting functional layer 15, the above preparation method may further include: forming a pixel defining layer 14 on the first electrode layer 13.

[0148] Figure 14A 、 Figure 14B and Figure 14C is an exemplary processing flow chart of the pixel defining layer 14. Taking the material of the pixel defining layer 14 as aluminum oxide as an example, an aluminum oxide thin film 700 can be deposited on the Figure 13B substrate structure as shown in, as shown in Figure 14AAs shown, the alumina thin film 700 conformally covers the first electrode 130 and the filling portion 120 between adjacent first electrodes 130. It should be noted that since the thickness of the alumina thin film 700 is relatively thin, it can conformally cover the inner wall of the partition groove 133 on the first electrode 130 and will not fill the partition groove 133, without affecting the partitioning effect of the partition groove 133 on at least one conductive layer in the light-emitting functional layer 15. Then, a patterned photoresist layer 502 is formed on the alumina thin film 700. Next, the alumina thin film 700 exposed at the opening of the photoresist layer 502 is etched to form the pixel defining layer 14. It should be noted that during the etching process, in addition to etching away the alumina thin film 700 exposed at the opening of the photoresist layer 502, a little of the aluminum layer below the alumina thin film 700 may also be etched away due to over-etching, so that a small step is formed between the first surface of the aluminum layer exposed at the pixel opening 141 and the first surface of the aluminum layer covered by the pixel defining layer 14.

[0149] After forming the pixel defining layer 14, step S140 is then executed to prepare the light-emitting functional layer 15 on the pixel defining layer 14 and the first electrode 130 exposed at the pixel opening 141. The film layers included in the light-emitting functional layer 15 can be determined according to the needs of the actual product. Figure 15 For forming Figure 14C Schematic diagram of the structure after forming the light-emitting functional layer 15 on the substrate structure of. Figure 15 In, taking the light-emitting functional layer 15 including a first light-emitting layer, a charge generation layer, and a second light-emitting layer as an example, as Figure 15 shown, due to the existence of the partition groove 133, the formed charge generation layer (such as Figure 15 the sub-functional layer 154 in) will be partitioned at the partition groove 133, which can effectively reduce the lateral transfer of charges and is beneficial to improving the crosstalk problem between adjacent sub-pixels.

[0150] After forming the light-emitting functional layer 15, step S140 can be executed to deposit the material of the second electrode layer 16 on the light-emitting functional layer 15 to form the second electrode layer 16. Due to the existence of the partition groove 133, the cross-section of the second electrode layer 16 presents a undulating structure as Figure 3 shown. For the specific structure, reference can be made to the relevant description above and will not be elaborated here.

[0151] It should be noted that the preparation method provided in the above embodiment only describes the preparation of some film layer structures in the display substrate 10. In the case where the display substrate 10 further includes other more film layer structures such as a packaging layer and a color filter layer, etc., the preparation method of the display substrate 10 provided by the embodiments of the present disclosure further includes the preparation steps of other more film layers. For details, reference can be made to the related art.

[0152] Figure 16Schematic structural diagram of a display device according to some embodiments of the present disclosure. As Figure 16 shown, the display device 1000 provided by some embodiments of the present disclosure includes the display substrate 10 provided by any one of the above embodiments. For example, the display device 1000 may be an augmented reality (AR) device, a virtual reality (VR) device, a wearable display device, a mobile phone, a laptop computer, a tablet computer, a monitor, a television, an in-vehicle display screen, a digital photo frame, or any other product or component with a display function. Of course, the display device 1000 provided by the embodiments of the present disclosure is not limited to the types listed above.

[0153] In the above description, technical details such as the layout of each layer of the product are not described in detail. However, those skilled in the art should understand that various technical means can be used to form layers, regions, etc. of the required shapes. In addition, in order to form the same structure, those skilled in the art can also design methods that are not exactly the same as the methods described above. Although the above embodiments are described separately, this does not mean that the measures in each embodiment cannot be used advantageously in combination.

[0154] In addition, those of ordinary skill in the art should understand that: the discussion of any of the above embodiments is only exemplary and is not intended to imply that the scope of the present disclosure is limited to these examples; under the concept of the present disclosure, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of one or more embodiments of the present disclosure as described above, which are not provided in detail for the sake of brevity.

[0155] Although the preferred embodiments of the present disclosure have been described, those skilled in the art can make additional changes and modifications once they learn the basic creative concept. Therefore, the appended claims are intended to be interpreted to include the preferred embodiments and all changes and modifications falling within the scope of the present disclosure.

Claims

1. A display substrate, characterized in that, Comprising: A substrate; An insulating layer disposed on one side of the substrate, the insulating layer including a plurality of electrode grooves spaced apart from each other and filling portions located between adjacent electrode grooves, the openings of the electrode grooves facing away from the substrate side of the insulating layer; A first electrode layer including a plurality of first electrodes, each first electrode being disposed in one of the electrode grooves and the first electrodes in adjacent electrode grooves being insulated from each other, the first electrode including a middle portion, an edge portion, and a partition groove located between the middle portion and the edge portion, the edge portion being in contact with the side surface of the electrode groove, the partition groove surrounding the middle portion, and the opening of the partition groove facing away from the substrate side of the first electrode; A light-emitting functional layer disposed on the side of the first electrode layer away from the substrate, the light-emitting functional layer including a plurality of sub-functional layers stacked, and at least one conductive layer among the plurality of sub-functional layers being disconnected at the position where the partition groove is located; A second electrode layer disposed on the side of the light-emitting functional layer away from the substrate, the second electrode layer including a plurality of second electrodes, and the first electrode, the second electrode, and the light-emitting functional layer located between the first electrode and the second electrode form a light-emitting device.

2. The display substrate according to claim 1, wherein The middle portion and the edge portion are connected at the bottom of the partition groove.

3. The display substrate according to claim 1, wherein Relative to the direction perpendicular to the substrate, the central axis of the partition groove is inclined towards the surrounded middle portion.

4. The display substrate according to claim 3, wherein The partition groove includes a first side surface and a second side surface disposed opposite to each other, and relative to the direction perpendicular to the substrate, the first side surface and the second side surface are inclined towards the middle portion surrounded by the partition groove; In the same first electrode, the first side surface is located on the side closer to the middle portion than the second side surface, and the inclination angle of the first side surface is greater than the inclination angle of the second side surface, and the inclination angle is the angle with the direction perpendicular to the substrate.

5. The display substrate according to claim 4, characterized in that, The inclination angle of the first side surface is 30° to 45°.

6. The display substrate according to claim 4, wherein The distance between the first end of the first side surface and the first end of the second side surface is smaller than the distance between the second end of the first side surface and the second end of the second side surface, the first end being the end closer to the substrate, and the second end being the end away from the substrate.

7. The display substrate according to claim 6, wherein From the opening of the partition groove to the bottom of the partition groove, the spacing distance between the first side surface and the second side surface shows a decreasing trend.

8. The display substrate according to claim 6, wherein The first end of the first side surface is connected to the first end of the second side surface, and the first end is the end closer to the substrate.

9. The display substrate according to claim 1, characterized in that Along the direction of the connection line between the center points of the middle portions of two adjacent first electrodes, the width of the opening of the partition groove is 0.03 to 0.06 micrometers.

10. The display substrate according to claim 1, wherein, Along the central axis direction of the partition groove, the depth of the partition groove is 0.05 to 0.1 micrometers.

11. The display substrate according to claim 1, wherein For the same first electrode, along the direction of the line connecting the center points of the middle parts of two adjacent first electrodes, the distance between the opening of the partition groove and the center point of the middle part is a first distance, and the distance between the opening of the partition groove and the edge of the edge part far from the middle part is a second distance, and the first distance is greater than the second distance.

12. The display substrate according to claim 1, wherein At least one groove is provided at the connection position between the side surface and the bottom surface of the electrode groove, and the height of the lowest point of the groove is less than the height of the bottom surface of the electrode groove.

13. The display substrate according to claim 12, wherein The lowest point of the groove is located on the side far from the middle part of the lowest point of the partition groove.

14. The display substrate according to any one of claims 1-13, characterized in that, Further comprising: A pixel defining layer is disposed on the side of the first electrode layer away from the substrate. The pixel defining layer has a plurality of pixel openings, each pixel opening corresponding to one of the first electrodes. Each pixel opening exposes at least a partial area of the surface of the middle part of the corresponding first electrode. The pixel defining layer at least conformally covers the partition groove, the edge part, and the filling part. The orthographic projection of the pixel opening on the substrate is within the orthographic projection range of the first surface of the middle part on the substrate, and the first surface is the surface away from the substrate.

15. The display substrate according to claim 14, characterized in that, The material of the pixel defining layer includes a metal oxide or a silicon-based compound having insulating properties.

16. The display substrate according to claim 15, wherein The metal oxide includes alumina and / or titanium oxide.

17. The display substrate according to claim 14, wherein In the direction perpendicular to the substrate, the thickness of the pixel defining layer is less than the thickness of the first electrode.

18. The display substrate according to claim 17, wherein In the direction perpendicular to the substrate, the thickness of the pixel defining layer is less than 300 angstroms.

19. The display substrate according to any one of claims 1-13, characterized in that, The first electrode includes a first sub-electrode layer and a second sub-electrode layer stacked in sequence along the direction away from the substrate. The first sub-electrode layer includes a first covering part covering the bottom surface of the electrode groove and a second covering part covering the side surface of the electrode groove. The second sub-electrode layer fills the space surrounded by the first covering part and the second covering part. In the direction perpendicular to the substrate, the thickness of the second sub-electrode layer is greater than the thickness of the first covering part.

20. The display substrate according to claim 19, wherein The partition groove is provided in the second sub-electrode layer and is located in the corner area between the first covering part and the second covering part, and the partition groove does not penetrate the second sub-electrode layer.

21. The display substrate according to claim 20, wherein The surface of the second sub-electrode layer away from the substrate, the surface of the second covering part away from the substrate, and the surface of the filling part away from the substrate are flush.

22. The display substrate according to claim 19, wherein The step coverage rate of the material of the second sub-electrode layer is less than the step coverage rate of the material of the first sub-electrode layer.

23. The display substrate according to claim 19, wherein The first sub-electrode layer includes a titanium layer and / or a titanium nitride layer, and the second sub-electrode layer is an aluminum layer or a silver layer.

24. The display substrate according to any one of claims 1-13, wherein The second electrode layer includes a first flat portion, a second flat portion, and a recessed portion connecting the first flat portion and the second flat portion. The recessed portion is disposed around the first flat portion, and the recessed portion is recessed toward the side of the first flat portion and the second flat portion close to the substrate. The orthographic projection of the first flat portion on the substrate is located within the orthographic projection of the middle portion on the substrate. The orthographic projection of the lowest point of the recessed portion on the substrate is located within the orthographic projection of the opening of the partition groove on the substrate.

25. The display substrate according to any one of claims 1-13, characterized in that, The at least one conductive layer includes a charge generation layer and / or a hole injection layer.

26. A method for preparing a display substrate, characterized in that, Comprising: Providing a substrate; Forming an insulating layer on the substrate, the insulating layer including a plurality of electrode grooves arranged at intervals and a filling portion located between adjacent electrode grooves, and the opening of the electrode groove faces away from the substrate side of the insulating layer; Forming an electrode material layer on the insulating layer and performing a polishing process on the electrode material layer to form a first electrode layer including a plurality of first electrodes arranged at intervals. Each first electrode is disposed in one of the electrode grooves, and the first electrodes in adjacent electrode grooves are insulated from each other. The first electrode includes a middle portion, an edge portion, and a partition groove located between the middle portion and the edge portion. The edge portion is in contact with the side surface of the electrode groove. The partition groove is disposed around the middle portion, and the opening of the partition groove faces away from the substrate side of the first electrode; Forming a light-emitting functional layer on the first electrode layer, the light-emitting functional layer including a plurality of sub-functional layers stacked, and at least one conductive layer in the plurality of sub-functional layers is disconnected at the position where the partition groove is located; Forming a second electrode layer on the light-emitting functional layer, the second electrode layer including a plurality of second electrodes, and the first electrode, the second electrode, and the light-emitting functional layer located between the first electrode and the second electrode form a light-emitting device.

27. The method according to claim 26, characterized in that, The electrode material layer includes a first electrode material sub-layer and a second electrode material sub-layer. Forming an electrode material layer on the insulating layer and performing a polishing process on the electrode material layer to form a first electrode layer including a plurality of first electrodes arranged at intervals, including: Depositing a first material on the insulating layer to form a first electrode material sub-layer, and the first electrode material sub-layer conformally covers the bottom surface, side surface of the electrode groove, and the top of the filling portion; Depositing a second material on the first electrode material sub-layer to form a second electrode material sub-layer, and the step coverage rate of the second material is less than the step coverage rate of the first material, and the thickness of the second electrode material sub-layer is greater than the thickness of the first electrode material sub-layer; Performing a polishing process on the second electrode material sub-layer and the first electrode material sub-layer to remove the second electrode material sub-layer exceeding the opening of the electrode groove, and the second electrode material sub-layer and the first electrode material sub-layer located on the top of the filling portion to form the first electrode layer.

28. The method according to claim 27, wherein The second electrode material sub-layer formed on the first electrode material sub-layer includes a first deposition portion, a second deposition portion, and a gap located between the first deposition portion and the second deposition portion. The gap surrounds the first deposition portion, extends into the electrode groove, and is close to the side surface of the electrode groove. The gap is inclined toward the central axis of the electrode groove; The first deposition portion and the second deposition portion are connected at the bottom of the gap. The first deposition portion covers the first electrode material sub-layer located on the bottom surface of the electrode groove, and the second deposition portion covers the first electrode material sub-layer located on the top of the filling portion and the side surface of the electrode groove; The included angle between the side surface of the first deposition portion facing the gap and the first surface of the first deposition portion is an obtuse angle. The included angle between the side surface of the second deposition portion facing the gap and the first surface of the second deposition portion is an acute angle, and a transition surface is connected between the side surface of the second deposition portion facing the gap and the first surface of the second deposition portion. The transition surface is an arc surface, and the first surface is the surface away from the substrate; 29. A display device, characterized in that, A display substrate according to any one of claims 1-25 is included.

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