Display panel and display device

Abstract

The invention provides a display panel and a display device. The display panel includes a first substrate; the second substrate is arranged opposite to the first substrate; the display layer is arranged between the first substrate and the second substrate; the first frame glue is arranged between the first substrate and the second substrate, and at least part of the first frame glue surrounds the display layer; the second frame glue is arranged on the side, away from the display layer, of the first frame glue, and at least part of the second frame glue surrounds the first frame glue; the adhesive force between the first frame glue and the first substrate and / or the second substrate is larger than the adhesive force between the second frame glue and the first substrate and / or the second substrate, and the moisture resistance of the second frame glue is larger than that of the first frame glue. According to the display panel, collaborative optimization of the adhesion performance and the moisture resistance can be achieved, so that the reliability of the display panel is improved, the service life of the display panel is prolonged, and the overall performance of the display panel is optimized.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In the field of liquid crystal display (LCD) panel manufacturing, sealant is a key packaging material, and its performance directly affects the reliability and service life of the display panel.

[0003] In existing LCD panel designs, a single-layer sealant structure is typically used to encapsulate the display layer. However, during high-temperature vacuum processing or during transport, the pressure differential between the panel's interior and exterior can lead to insufficient adhesion between the sealant and the substrate, resulting in peeling, which can cause leakage or even panel cracking. While improving the sealant's moisture resistance, it often increases the risk of contamination. For example, during reliability testing, organic components in the sealant can leach into the liquid crystal and react with it, causing contamination issues such as bright spots or bubbles. Water vapor intrusion further exacerbates this problem.

[0004] Existing sealant materials exhibit a trade-off between performance, failing to simultaneously optimize reliability, adhesion, and moisture resistance, severely impacting the reliability and stability of display panels. Therefore, an improved display panel design is urgently needed to overcome these technical limitations and enhance overall display panel performance.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0006] Based on this, the present application provides a display panel and a display device that can achieve coordinated optimization of bonding performance and moisture resistance, thereby improving the reliability and service life of the display panel and optimizing the overall performance of the display panel.

[0007] The present application provides a display panel, comprising:

[0008] a first substrate;

[0009] a second substrate, disposed opposite to the first substrate;

[0010] A display layer is disposed between the first substrate and the second substrate;

[0011] A first frame glue is disposed between the first substrate and the second substrate, and at least a portion of the first frame glue surrounds the display layer;

[0012] The second frame glue is arranged on a side of the first frame glue away from the display layer, and at least a portion of the second frame glue surrounds the first frame glue;

[0013] The bonding strength between the first sealant and the first substrate and / or the second substrate is greater than the bonding strength between the second sealant and the first substrate and / or the second substrate, and the moisture resistance of the second sealant is greater than the moisture resistance of the first sealant.

[0014] Based on the same inventive concept, the present application also provides a display device, including the above-mentioned display panel.

[0015] Compared to the prior art, the display module and display device provided by the present invention achieve at least the following beneficial effects: In the embodiments of the present application, a first sealant is disposed between the first substrate and the second substrate, with at least a portion of the first sealant surrounding the display layer, and a second sealant is disposed on a side of the first sealant away from the display layer, with at least a portion of the second sealant surrounding the first sealant. The bonding strength between the first sealant and the first substrate and / or the second substrate is greater than the bonding strength between the second sealant and the first substrate and / or the second substrate, and the moisture resistance of the second sealant is greater than the moisture resistance of the first sealant.

[0016] In the embodiment of the present application, the first frame glue can be used as the inner frame glue, and the second frame glue can be used as the outer frame glue, thereby forming a double-layer frame glue design. The bonding strength between the first frame glue (inner frame glue) and the first substrate and / or the second substrate is greater than the bonding strength between the second frame glue (outer frame glue) and the first substrate and / or the second substrate, significantly improving the overall bonding strength between the frame glue and the substrate, effectively reducing the peeling phenomenon caused by insufficient bonding strength during high-temperature vacuum processes or movement in traditional single-layer frame glue designs. At the same time, it can block water vapor penetration and reduce the dissolution of organic matter, thereby reducing the risk of foreign matter formation and liquid crystal contamination, and reducing contamination problems such as broken bright spots and bubbles. On this basis, the second frame glue is arranged on the side of the first frame glue away from the display layer, and its moisture resistance is greater than that of the first frame glue, thereby effectively improving the overall moisture resistance of the frame glue structure.

[0017] Therefore, compared with the contradiction between adhesion performance and moisture resistance in the traditional single-layer frame glue design, the embodiment of the present application achieves synergistic optimization of adhesion performance and moisture resistance by combining the high adhesion strength of the first frame glue with the high moisture resistance of the second frame glue, which helps to improve the reliability and service life of the display panel, thereby optimizing the overall performance of the display panel.

[0018] Other advantages, objectives, and features of the present application will be described in detail in the following description and, to some extent, will be apparent to those skilled in the art upon examination and study of the following, or may be taught from practice of the present application. The objectives and other advantages of the present application may be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Other features, objects and advantages of the present application will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings.

[0020] Figure 1 is a cross-sectional view of a display panel without the third sealant in one embodiment of the present invention;

[0021] Figure 2 yes Figure 1 The cross-sectional structure diagram of the display panel shown in the AA' direction;

[0022] Figure 3 is a schematic cross-sectional structural diagram of a display panel provided by another embodiment of the present invention;

[0023] Figure 4 is a schematic cross-sectional structural diagram of a display panel provided by yet another embodiment of the present invention;

[0024] Figure 5 yes Figure 4 A top view of the display panel shown;

[0025] Figure 6 is a schematic cross-sectional structure diagram of a display panel provided by another embodiment of the present invention, in which the orthographic projections of the alignment layer and the transparent conductive layer on the first substrate do not overlap;

[0026] Figure 7 yes Figure 6 A top view of the display panel shown;

[0027] Figure 8 is a schematic diagram of a cross-sectional structure of a display panel provided by another embodiment of the present invention, in which an alignment layer partially exposes a passivation layer;

[0028] Figure 9 1 is a schematic cross-sectional structural diagram of a portion of the second sealant in contact with the interlayer dielectric layer in a display panel provided by yet another embodiment of the present invention;

[0029] Figure 10 1 is a schematic cross-sectional structural diagram of a display panel provided by another embodiment of the present invention, in which a groove is provided on the surface of a passivation layer;

[0030] Figure 11 FIG. 1 is a schematic structural diagram of a display device according to an embodiment of the present invention.

[0031] Description of reference numerals:

[0032] 1. Display device; 10. Display panel; 10B. Step area;

[0033] 110. First substrate; 120. Second substrate;

[0034] 200, display layer;

[0035] 310, first sealant; 320, second sealant; 330, third sealant;

[0036] 400, isolation structure;

[0037] 510 , alignment layer; 520 , transparent conductive layer; 530 , interlayer dielectric layer; 540 , metal layer; 550 , planarization layer; 560 , passivation layer. DETAILED DESCRIPTION

[0038] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0040] It should be understood that when an element or layer is referred to as being "on" or "electrically connected to," it may be directly located on or electrically connected to other elements or layers, or there may be intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, sealants, and / or parts, these elements, components, regions, layers, sealants, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, sealant, or part from another element, component, region, layer, sealant, or part. Therefore, without departing from the teachings of this application, the first element, component, region, layer, sealant, or part discussed below may be represented as a second element, component, region, layer, or part; for example, the first sealant may be referred to as the second sealant, and similarly, the second sealant may be referred to as the first sealant; the first sealant and the second sealant are different sealants.

[0041] Spatially relative terms such as "on..." may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the drawings is flipped, the element or feature described as "on..." will be oriented "under" the other elements or features. Therefore, the exemplary term "on..." may include both upper and lower orientations. In addition, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0042] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "comprising" and / or "including" are used in this specification, they may specify the presence of the stated features, integers, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, elements, components, and / or groups. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0043] Existing single-layer sealant structures cannot achieve both good adhesion and moisture resistance, severely impacting the reliability and stability of display panels. Therefore, this application aims to provide an improved display panel design that can achieve synergistic optimization of adhesion and moisture resistance, thereby increasing the reliability and service life of the display panel and optimizing its overall performance. This will be detailed in subsequent examples.

[0044] In one embodiment, Figure 1 This is a cross-sectional view of the display panel without the third sealant. Figure 2 for Figure 1 The cross-sectional structure diagram of the display panel in the AA' direction is shown. Figure 1 and Figure 2 The display panel provided in this application includes a first substrate 110 , a second substrate 120 , a display layer 200 , a first sealant 310 and a second sealant 320 .

[0045] For example, the display panel involved in this application may include a liquid crystal display panel, in which case the display layer 200 is a liquid crystal layer. The display panel may also be an organic light-emitting display panel, in which case the display layer 200 is an organic light-emitting material layer, but the present invention is not limited thereto. The embodiments of this application are described using a liquid crystal display panel as an example.

[0046] A liquid crystal display panel may include a color filter (CF) substrate and a thin film transistor (TFT) array substrate. For example, one of the first substrate 110 and the second substrate 120 involved in this application may be a TFT substrate, and the other a CF substrate. This embodiment of the application is described using the example of the first substrate 110 being a TFT substrate and the second substrate 120 being a CF substrate.

[0047] like Figure 1As shown, the second substrate 120 is arranged opposite to the first substrate 110; the display layer 200 is arranged between the first substrate 110 and the second substrate 120; the first frame glue 310 is arranged between the first substrate 110 and the second substrate 120, and at least a portion of the first frame glue 310 surrounds the display layer 200; the second frame glue 320 is arranged on the side of the first frame glue 310 away from the display layer 200, and at least a portion of the second frame glue 320 surrounds the first frame glue 310.

[0048] The bonding strength between the first sealant 310 and the first substrate 110 and / or the second substrate 120 is greater than the bonding strength between the second sealant 320 and the first substrate 110 and / or the second substrate 120 , and the moisture resistance of the second sealant 320 is greater than the moisture resistance of the first sealant 310 .

[0049] The display panel provided herein utilizes a dual-layer sealant design, wherein the bonding strength between the first sealant 310 (inner sealant) and the first substrate 110 and / or the second substrate 120 is greater than the bonding strength between the second sealant 320 (outer sealant) and the first substrate 110 and / or the second substrate 120, significantly improving the overall bonding strength between the sealant and the substrates. If only the second sealant 320 were used as a single-layer sealant structure, while having good moisture resistance, its bonding strength would be relatively weak, failing to meet the high bonding strength requirements between the sealant and the substrate during high-temperature vacuum processing or during movement of the display panel, and thus prone to peeling, thereby affecting the reliability and service life of the display panel. However, by utilizing a dual-layer sealant design of the first sealant 310 and the second sealant 320, the high bonding strength of the first sealant 310 compensates for the insufficient bonding strength of the second sealant 320, effectively reducing the peeling phenomenon caused by insufficient bonding strength in traditional single-layer sealant designs during high-temperature vacuum processing or during movement. Meanwhile, in the double-layer sealant design, the second sealant 320 is disposed on the side of the first sealant 310 away from the display layer 200 , and its moisture resistance is greater than that of the first sealant 310 , thereby effectively improving the overall moisture resistance of the sealant structure.

[0050] Compared to the contradiction between adhesion performance and moisture resistance in traditional single-layer frame glue designs, the display panel combines the high adhesion of the first frame glue 310 with the high moisture resistance of the second frame glue 320. The high adhesion of the first frame glue 310 (inner frame glue) compensates for the adhesion that may be compromised by the second frame glue 320 (outer frame glue) to achieve high moisture resistance. The high moisture resistance of the second frame glue 320 can effectively block the intrusion of external moisture, achieving synergistic optimization of adhesion performance and moisture resistance. It can effectively block moisture penetration and reduce the dissolution of organic matter, thereby reducing the risk of foreign matter formation and liquid crystal contamination, reducing pollution problems such as broken bright spots and bubbles, improving the reliability and service life of the display panel, and thus optimizing the overall performance of the display panel.

[0051] The present embodiment does not specifically limit the width of the first sealant 310 and the width of the second sealant 320. For example, see Figure 1 It is understood that the overall width CD of the first and second sealants 310 and 320 may be greater than or equal to 1000 μm. For example, the overall width CD of the first and second sealants 310 and 320 may be 1000 μm, 1200 μm, or 1500 μm, but is not limited thereto.

[0052] The overall width CD of the first frame glue 310 and the second frame glue 320 is set to be greater than or equal to 1000μm, which can meet the requirements of existing border CD (the key dimension of the display panel border area, approximately 2.0mm) products, so that the border size meets the design standards and requirements of existing products, thereby ensuring the dimensional compatibility and versatility of the display panel.

[0053] For ease of description, the following embodiments of this specification are described by taking as an example that the first sealant 310 includes a first adhesive material and the second sealant 320 includes a second adhesive material.

[0054] Considering that the second sealant 320 is disposed on the side of the first sealant 310 away from the display layer 200, i.e., the outside, and thus may be exposed to the outside world, a material that effectively blocks external moisture is selected. For example, the second adhesive material includes a resin component containing a methacrylate group. Exemplarily, the second adhesive material may include one or more of a methacrylic resin and a derivative of a methacrylic resin.

[0055] The methacrylate (Methacryl) group has high hydrophobicity due to the methyl group in its molecular structure, which can significantly enhance the moisture resistance of the second sealant 320, thereby more effectively blocking external water vapor from invading the interior of the display panel, reducing water vapor damage to the display layer 200, and helping to maintain the reliability and reliability of the display panel.

[0056] Considering that the first sealant 310 is disposed between the first substrate 110 and the second substrate 120 and is closer to the display layer than the second sealant, i.e., located on the inner side, the first sealant 310 may directly contact the display layer 200. Therefore, in some embodiments, the first adhesive material uses a resin component that does not contain a methacrylate group. Exemplarily, the first adhesive material includes a resin component containing an acrylic acid group, such as an acrylic resin, an acrylic resin derivative, or a combination of more than one of these.

[0057] Because the first sealant 310 (inner sealant) is closer to the display layer 200 than the second sealant 320, it requires stronger adhesion. The acrylic resin group can enhance the interfacial adhesion between the first sealant 310 and the first substrate 110 and / or the second substrate 120, effectively preventing the first sealant 310 from peeling off from the substrate due to insufficient adhesion.

[0058] At the same time, the chemical structure of the acrylic group is relatively stable and is not easily hydrolyzed or decomposed to produce low-molecular organic matter. Therefore, the risk of the first sealant 310 dissolving organic impurities into the display layer 200 in a humid environment or during long-term use is significantly reduced, thereby effectively reducing contamination problems caused by the dissolution of organic components in the sealant, such as broken bright spots and bubbles.

[0059] In some optional embodiments, considering that the edge area of the sealant is usually a location where stress is concentrated, peeling is likely to occur. Figure 3 In some embodiments, the display panel may further include a third frame glue 330 , which may also be called a Dummy frame glue and is disposed on a side of the second frame glue 320 away from the first frame glue 310 .

[0060] Specifically, the third sealant 330 can generate additional adhesion outside the second sealant 320 , thereby enhancing the adhesion between the entire sealant structure and the substrate, and further reducing the risk of the sealant structure being peeled off from the substrate due to insufficient adhesion.

[0061] During the actual production process, when the display panel is still in the form of a large or medium panel, it is prone to peeling during vacuum coating or transportation of the large or medium panel. Using the above embodiment, by disposing the third sealant 330 on the side of the second sealant 320 away from the first sealant 310, when in the large or medium panel form, the third sealant 330 can provide additional adhesive support for the sealant structure on the outside, effectively strengthening the adhesion between the sealant structure as a whole and the substrate, significantly reducing the risk of the sealant structure peeling from the substrate due to insufficient adhesion during vacuum coating or transportation of the large or medium panel, where peeling is likely to occur. This ensures the stability and integrity of the display panel in subsequent production processes, avoids production losses and product defects caused by peeling, and improves production efficiency and product yield.

[0062] For example, after the display panel is cut into small pieces, the third sealant 330 can fall off along with the cutting waste, so that the final product is not affected and no additional removal process is required, thereby not adding any additional production process flow.

[0063] As an example, the third sealant 330 may include the same adhesive material as the first sealant 310. For example, the third sealant 330 may also be made of one or more adhesive materials selected from acrylic resin and acrylic resin derivatives.

[0064] The third sealant 330 and the first sealant 310 are made of the same adhesive material, which ensures better matching and consistency in material properties across the entire sealant structure. This reduces uneven adhesion due to differences in material properties (such as thermal expansion coefficient and elastic modulus), thereby improving the overall structural stability of the sealant structure.

[0065] In other optional embodiments, considering that the sealant will generate stress during curing and use, the continuous sealant structure will cause the stress to accumulate along the continuous transfer path of the sealant, resulting in debonding between the sealant and the substrate or cracking inside the sealant. Figure 4 and Figure 5 In some embodiments, an isolation structure 400 may be provided between the first sealant 310 and the second sealant 320, and the isolation structure 400 is connected to at least one of the first substrate 110 and the second substrate 120. For example, Figure 4 The isolation structure 400 shown is connected to the second substrate 120 .

[0066] The isolation structure 400 can break the continuity between the first sealant 310 and the second sealant 320, cut off the stress transmission path, and disperse and buffer the stress at the isolation structure 400, thereby avoiding excessive stress concentration at a certain point. This significantly reduces the risk of failure of the sealant structure due to stress concentration, enhances the overall strength and reliability of the sealant structure, and improves the reliability of the display panel.

[0067] During the display panel manufacturing process, particularly during the lamination process between the first substrate 110 and the second substrate 120, the vacuum pumping operation can easily cause the display layer 200 to impact the sealant structure, causing punctures in the first sealant 310 near the display layer 200, damaging the integrity of the sealant structure, affecting the normal operation of the display layer 200, and causing display panel defects. Furthermore, if moisture from the external environment intrudes into the display panel, it will react with substances in the display layer 200, resulting in defects such as bright spots and bubbles, seriously affecting display quality.

[0068] In the above embodiment, the isolation structure 400 is disposed between the first sealant 310 and the second sealant 320. This not only helps prevent puncture caused by the display layer 200 impacting the sealant structure due to vacuum during the substrate bonding process, but also protects the first sealant 310, thereby preventing damage to the display layer 200. It also effectively blocks moisture from the external environment, preventing it from invading the interior of the display panel, thereby preventing substances in the display layer 200 from reacting with moisture and generating undesirable phenomena such as bright spots and bubbles. This ensures the stability of the display panel during production and use, helping to improve the display quality and reliability of the display panel.

[0069] As an example, the material constituting the isolation structure 400 may include methyl 3-methoxypropionate (MMP). MMP has high hardness and rigidity, and can form a strong isolation structure 400, ensuring that the isolation structure 400 can maintain its shape and position during long-term use, and continue to play the role of blocking stress transmission and preventing the intrusion of liquids and water vapor.

[0070] For example, the constituent materials of the isolation structure 400 may also include 1-methoxy-2-propanol (MFG for short), diethylene glycol methyl ethyl ether (MEC for short), acrylate, etc., which is not specifically limited in the present application.

[0071] In some alternative embodiments, see Figure 6 The display panel of the embodiment of the present application may further include an alignment layer 510 , which is at least disposed between the first sealant 310 and the first substrate 110 .

[0072] The present embodiment does not specifically limit the preparation method of the alignment layer 510. As an example, the alignment layer 510 can be formed by transferring the alignment liquid through a relief printing (APR) printing process.

[0073] The alignment liquid can be, for example, a polyimide (PI) alignment liquid. The relief printing process specifically includes the following steps: transferring the alignment liquid to a relief plate mounted on a printing roller; and transferring the alignment liquid to the underlying structure surface through contact and compression between the rotating relief plate and the horizontal printing press platform.

[0074] The production process of the above-mentioned alignment layer 510 can utilize the letterpress printing equipment that has been widely used in liquid crystal panel manufacturing to complete the pattern transfer of the alignment layer 510 without adding additional coating or etching processes, avoiding the problem of increased production costs due to additional process steps.

[0075] As an example, the alignment layer 510 may also be prepared by inkjet printing (IJP) technology. For example, after the alignment liquid is applied by inkjet printing, the alignment liquid undergoes polymerization reaction at high temperature to form the alignment layer 510.

[0076] Please continue reading Figure 6 The display panel of the embodiment of the present application may further include a transparent conductive layer 520, and the transparent conductive layer 520 is disposed between at least a portion of the second sealant 320 and the first substrate 110. Since the adhesion between the second sealant 320 and the transparent conductive layer 520 is generally better than the adhesion between the second sealant 320 and the alignment layer 510, compared to connecting both the first sealant 310 and the second sealant 320 to the alignment layer 510, the above embodiment enables at least a portion of the second sealant 320 to be in contact with the transparent conductive layer 520, thereby improving the adhesion between the second sealant 320 and the interface, reducing the risk of the second sealant 320 peeling off, and further improving the reliability of the display panel. For example, in the above embodiment, the adhesion between the second sealant 320 and the interface can be increased from 2.1 kgf / cm to 4.0 kgf / cm.

[0077] The present embodiment does not specifically limit the material constituting the transparent conductive layer 520. As an example, the material constituting the transparent conductive layer 520 may include at least one of ITO (indium tin oxide), IZO (indium zinc oxide), and IGZO (indium gallium zinc oxide), but is not limited thereto.

[0078] Please continue reading Figure 6 In some optional embodiments, the orthographic projection of the alignment layer 510 on the first substrate 110 does not overlap with the orthographic projection of the transparent conductive layer 520 on the first substrate 110 .

[0079] In the above embodiment, the transparent conductive layer 520 is only disposed between a portion of the second sealant 320 and the first substrate 110 and does not contact the alignment layer 510. This prevents moisture from invading the display layer 200 through the transparent conductive layer 520 and the alignment layer 510, reducing the risk of moisture entering the display area. This reduces the risk of liquid crystal contamination caused by moisture and further improves the reliability of the display panel.

[0080] In the complex circuit design of the display panel, various complex metal traces exist under the sealant structure. When the display panel is operating, the current flowing in these metal traces may induce charge in the transparent conductive layer 520, thereby generating coupled static electricity. The accumulation of coupled static electricity may cause electrostatic discharge, causing damage to the circuits and components of the display panel.

[0081] In some optional embodiments, the transparent conductive layer 520 can be electrically connected to the ground trace GND of the display panel. By extending the transparent conductive layer 520 and electrically connecting it to the ground trace GND, the induced charge can be effectively discharged to the ground, preventing the accumulation of static electricity and the occurrence of discharge phenomena, thereby protecting the circuits and components of the display panel from damage by static electricity, and further improving the reliability of the display panel.

[0082] As an example, the ground trace GND in the above embodiment can be arranged in the step area 10B of the non-display area, that is, Figure 7 The bottom border position of the display panel is shown.

[0083] See also Figure 8 In some optional embodiments, the display panel may include an interlayer dielectric layer 530, a metal layer 540, a planarization layer 550, a passivation layer 560, and an alignment layer 510 stacked sequentially along the direction from the first substrate 110 to the second substrate 120. The first sealant 310 and the second sealant 320 are disposed between the alignment layer 510 and the second substrate 120.

[0084] The interlayer dielectric layer 530 may be made of silicon oxide (SiO x ), silicon nitride (SiN x ) and other inorganic materials, thereby playing the role of blocking water oxygen and alkaline ions, but is not limited to this.

[0085] The metal layer 540 may include a metal material layer or an alloy material layer, wherein the metal material layer may include a metal single layer or multilayer structure formed by molybdenum (Mo), aluminum (Al) and titanium (Ti), for example, the multilayer structure is a multi-metal layer stack, but is not limited thereto.

[0086] The planarization layer 550 can be made of organic materials such as acrylic polymers, silicon polymers, etc.

[0087] The passivation layer 560 may include a single layer or a stacked layer structure formed of silicon oxide, silicon monoxide, etc., but is not limited thereto.

[0088] Specifically, the alignment layer 510 can be transferred to the surface of the passivation layer 560 by the alignment liquid through a letterpress printing process, which can specifically include the following steps: transferring the alignment liquid to a letterpress mounted on a printing roller; transferring the alignment liquid to the surface of the passivation layer 560 through contact and extrusion between the rotating letterpress and the horizontal printing machine platform.

[0089] In some optional embodiments, such as Figure 8 As shown, the alignment layer 510 may have a first opening, and the orthographic projection of the alignment layer 510 on the first substrate 110 at least partially surrounds the orthographic projection of the second sealant 320 on the first substrate 110 .

[0090] By forming the first opening in the alignment layer 510, the bonding area between the second sealant 320 and the alignment layer 510 is reduced, while the bonding area between the second sealant 320 and the passivation layer 560 is expanded, thereby improving the bonding strength of the second sealant 320 in high-temperature environments. For example, in high-temperature environments, the bonding strength between the second sealant 320 and the alignment layer 510 is approximately 0.4 kgf / cm, while the bonding strength between the second sealant 320 and the passivation layer 560 is approximately 2.9 kgf / cm.

[0091] Therefore, the above embodiment reduces the bonding area between the second frame glue 320 and the alignment layer 510 by forming the first opening in the alignment layer 510, and at the same time expands the bonding area between the second frame glue 320 and the passivation layer 560, which can significantly reduce the risk of the second frame glue 320 peeling off, ensure the long-term stable and good moisture resistance of the second frame glue 320, and is conducive to improving the overall moisture resistance of the frame glue structure bonding interface.

[0092] Please continue reading Figure 8 In some embodiments, the first opening of the alignment layer 510 exposes the passivation layer 560 located below the first sealant 310 and the second sealant 320 , and the first sealant 310 and the second sealant 320 are in contact with the passivation layer 560 through the first opening.

[0093] The above embodiment further enlarges the first opening, so that both the first sealant 310 and the second sealant 320 are in contact with the passivation layer 560 through the first opening, so that the first sealant 310 and the second sealant 320 can be fully adhered to the passivation layer 560. By utilizing the higher adhesion of the passivation layer 560 compared to the alignment layer 510, the risk of the sealant structure peeling off in a high temperature and high humidity environment is effectively prevented.

[0094] See also Figure 9 In some other optional embodiments, the passivation layer 560 has a second opening, which exposes a portion of the interlayer dielectric layer 530 located below the second sealant 320, and the first portion of the second sealant 320 contacts the interlayer dielectric layer 530 through the second opening.

[0095] In the above embodiment, by providing a second opening to expose a portion of the interlayer dielectric layer 530 located below the second sealant 320, the first portion of the second sealant 320 can contact the interlayer dielectric layer 530 through the second opening, thereby improving the adhesion of the second sealant 320 in high-temperature environments. For example, in a high-temperature environment, the adhesion between the second sealant 320 and the alignment layer 510 is approximately 0.4 kgf / cm, while the adhesion between the second sealant 320 and the interlayer dielectric layer 530 is approximately 2.9 kgf / cm.

[0096] Therefore, the above embodiment forms a second opening in the passivation layer 560 so that the first portion of the second sealant 320 contacts the interlayer dielectric layer 530, which can significantly reduce the risk of the second sealant 320 peeling off, ensure the long-term stable and good moisture resistance of the second sealant 320, and help improve the overall moisture resistance of the sealant structure bonding interface.

[0097] Alternatively, as Figure 9 As shown, the first opening of the alignment layer 510 can expose the passivation layer 560 located below the second portion of the first and second sealants 310 and 320. At this time, the second portions of the first and second sealants 310 and 320 are in contact with the passivation layer 560 through the first opening.

[0098] It is worth noting that the first and second openings provided in the above embodiment both utilize the structure of the passivation layer 560 and the alignment layer 510. Through the opening and / or hollowing design, direct contact between the sealant and the passivation layer 560 and / or the interlayer dielectric layer 530 is achieved. This eliminates the need for adding new process steps. Instead, the passivation layer 560 and the alignment layer 510 are patterned, and the desired functional requirements are achieved through a single patterning process such as etching or photolithography. This avoids the complex operation of multiple patterning processes, thereby effectively simplifying the process, improving production efficiency, and reducing production costs.

[0099] See also Figure 10 In some alternative embodiments, a groove may be formed on the surface of the passivation layer 560 facing the second substrate 120. Furthermore, the orthographic projection of the first sealant 310 on the passivation layer 560 overlaps with the groove.

[0100] In the above embodiment, by providing a groove on the surface of the passivation layer 560, the actual bonding area between the first frame glue 310 and the passivation layer 560 is increased, thereby improving the bonding strength between the first frame glue 310 and the passivation layer 560, further reducing the risk of the first frame glue 310 peeling off during use, thereby enhancing the overall stability and reliability of the frame glue structure and effectively ensuring the good sealing performance of the frame glue structure.

[0101] In the above embodiment, based on the embodiment in which the first sealant 310 and the second sealant 320 are in contact with the passivation layer 560 via the first opening, a groove can be dug in the passivation layer 560. In this way, no new process or complicated steps are required, thereby ensuring that production efficiency and production costs are not affected.

[0102] Based on the same inventive concept, the present application also provides a display device. Figure 11The display device 1 of the embodiment of the present application includes the display panel 10 provided in the aforementioned embodiment. The technical effects that can be achieved by the aforementioned display panel 10 can also be achieved by the display device 1, which will not be described in detail here.

[0103] It can be understood that the display device 1 in the embodiment of the present application can be any product or component with a display function, such as a liquid crystal display device, electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a wearable device, an Internet of Things device, etc., and the embodiment of the present application does not limit this.

[0104] It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present application in a schematic manner. Although the illustrations only show components related to the present application and are not drawn according to the number, shape and size of components in actual implementation, the type, quantity and proportion of each component in actual implementation can be changed at will, and the component layout type may also be more complicated.

[0105] It will be apparent to those skilled in the art that various modifications and variations can be made in this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and variations of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the embodiments provided in the examples of this application can be combined with each other without contradiction.

[0106] In the description of this specification, descriptions with reference to terms such as "some embodiments," "as an example," and "exemplarily" mean that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0107] The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0108] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: include: a first substrate; a second substrate, disposed opposite to the first substrate; A display layer is provided between the first substrate and the second substrate; A first sealant is disposed between the first substrate and the second substrate, and at least a portion of the first sealant surrounds the display layer; A second frame glue is provided on a side of the first frame glue away from the display layer, and at least a portion of the second frame glue surrounds the first frame glue; The bonding strength between the first sealant and the first substrate and / or the second substrate is greater than the bonding strength between the second sealant and the first substrate and / or the second substrate, and the moisture resistance of the second sealant is greater than the moisture resistance of the first sealant.

2. The display panel according to claim 1, wherein: The second sealant includes a second adhesive material, and the second adhesive material includes one or more of methacrylic resin and a derivative of methacrylic resin.

3. The display panel according to claim 1, wherein: The first sealant includes a first adhesive material, and the first adhesive material includes one or more of acrylic resin and a derivative of acrylic resin.

4. The display panel according to claim 1, wherein: The display panel further includes a third sealant; the third sealant is disposed on a side of the second sealant away from the first sealant, and the third sealant and the first sealant include the same adhesive material.

5. The display panel according to claim 1, wherein: An isolation structure is provided between the first sealant and the second sealant; and the isolation structure is connected to at least one of the first substrate and the second substrate.

6. The display panel according to claim 5, wherein: The constituent material of the isolation structure includes methyl 3-methoxypropionate.

7. The display panel according to claim 1, wherein: The display panel further includes: an alignment layer, at least disposed between the first sealant and the first substrate; The transparent conductive layer is disposed between at least a portion of the second sealant and the first substrate.

8. The display panel according to claim 7, wherein: An orthographic projection of the alignment layer on the first substrate does not overlap with an orthographic projection of the transparent conductive layer on the first substrate.

9. The display panel according to claim 7, wherein: The display panel further includes a grounding wire; the transparent conductive layer is electrically connected to the grounding wire.

10. The display panel according to claim 1, wherein The display panel further includes an interlayer dielectric layer, a metal layer, a planarization layer, a passivation layer, and an alignment layer stacked in sequence along a direction from the first substrate to the second substrate, and the first sealant and the second sealant are disposed between the alignment layer and the second substrate; The alignment layer has a first opening, and an orthographic projection of the alignment layer on the first substrate at least partially surrounds an orthographic projection of the second sealant on the first substrate.

11. The display panel according to claim 10, wherein: The first opening of the alignment layer exposes the passivation layer below the first sealant and the second sealant, and the first sealant and the second sealant are in contact with the passivation layer through the first opening.

12. The display panel according to claim 10, wherein: The passivation layer has a second opening, the second opening exposes a portion of the interlayer dielectric layer located below the second sealant, and a first portion of the second sealant contacts the interlayer dielectric layer via the second opening; The first opening of the alignment layer exposes the passivation layer below the second portions of the first and second sealants, and the second portions of the first and second sealants are in contact with the passivation layer via the first opening.

13. The display panel according to claim 10, wherein: A groove is formed on a surface of the passivation layer facing the second substrate; The orthographic projection of the first sealant on the passivation layer overlaps with the groove.

14. The display panel according to claim 10, wherein: The alignment layer is transferred onto the surface of the passivation layer by an alignment liquid through a relief printing process; or, the alignment layer is formed on the surface of the passivation layer by an inkjet printing process.

15. A display device, characterized in that: The display device includes the display panel according to any one of claims 1 to 14.

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