Circuit board and server

Abstract

The present application discloses a circuit board and server, relating to the field of server technology. The circuit board includes a rigid board and multiple flexible boards. The rigid board is connected to a processor. The multiple flexible boards are stacked and arranged on a side of the rigid board facing away from the processor. The flexible board can be folded relative to the rigid board to form a folded portion. Storage bars are connected to the folded portion of the flexible board, and the individual storage bars are arranged at intervals. A wiring structure for connecting the storage bars and the processor is provided between the storage bars and the processor. Based on the arrangement of the flexible board, the circuit board can transfer a portion of the storage bars to the flexible board, solving the problem that circuit boards hinder the miniaturization of servers and limit server functionality, and is conducive to the miniaturization design of servers and improving server functionality.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a circuit board and a server. Background Art

[0002] With the development of modern technology, the requirements for various signal processing are getting higher and higher, and the computing pressure of servers is getting greater and greater. This requires servers to have more memory channels to meet the throughput of parallel data, which means that more and more memory strips need to be arranged on the circuit board, which requires the circuit board area to be designed larger, the circuit board structure becomes more complex, and the design difficulty of the circuit board becomes higher. The circuit board needs to occupy a larger space in the server, which hinders the miniaturization trend of the server and also limits the function of the server to a certain extent. Summary of the Invention

[0003] The present application provides a circuit board to at least solve the problem in the related art that the circuit board hinders the miniaturization development of servers and limits the functions of servers.

[0004] In a first aspect, the present application provides a circuit board, comprising:

[0005] a rigid board body, on which a processor is connected;

[0006] And multiple flexible boards, multiple flexible boards are stacked and arranged on the side of the rigid board away from the processor, the flexible board can be folded relative to the rigid board to form a folding portion, along the direction of the rigid board, each of the folding portions gradually becomes longer, and a storage bar is connected to the folding portion away from the flexible board, each of the storage bars is arranged at intervals, and a routing structure for connecting each of the storage bars and the processor is arranged between the storage bar and the processor.

[0007] The present invention stacks multiple flexible boards on one side of a rigid board, allowing the flexible boards to be folded to form a folding portion. A storage bar can be positioned on the folding portion, allowing the circuit board to transfer at least a portion of the storage bars originally connected to the rigid board to the flexible board. A wiring structure forms a connection between the rigid and flexible boards. Combined with the flexible board's foldability, the circuit board can fully utilize server space, facilitating a miniaturized server design. Furthermore, by transferring at least a portion of the storage bars to the flexible board and spacing the storage bars apart, each storage bar can be isolated from the rigid board as much as possible through the rational design of the number and position of the flexible boards and the design of the wiring structure. This circuit board design fully achieves structural and performance independence for each storage bar, achieving the goal of placing only the processor on the rigid board and all the storage bars on the flexible board. This simplifies the circuit board's structure and reduces design complexity. Controlling the thickness of the rigid board facilitates processing, resulting in more stable circuit board performance and improved server functionality.

[0008] A second aspect of the present application provides a server, comprising the circuit board of the first aspect.

[0009] The server is based on a circuit board design, and the server can be designed to be smaller and more functionally stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] Figure 1 A side view of a circuit board provided in an embodiment of the present application;

[0012] Figure 2 A top view of a circuit board provided in an embodiment of the present application;

[0013] Figure 3 A bottom view of a circuit board provided in an embodiment of the present application;

[0014] Figure 4 A schematic diagram of the three-dimensional structure of a circuit board provided in an embodiment of the present application;

[0015] Figure 5 An exploded schematic diagram of a circuit board provided in an embodiment of the present application;

[0016] Figure 6A schematic diagram of a circuit board assembly process provided in an embodiment of the present application;

[0017] Figure 7 A schematic diagram of the installation state of a circuit board provided in an embodiment of the present application;

[0018] Figure 8 A schematic diagram of the wiring of a circuit board provided in an embodiment of the present application;

[0019] Figure 9 A schematic diagram of a signal via on a circuit board provided in an embodiment of the present application;

[0020] Figure 10 A schematic diagram of a signal via on a rigid board of a circuit board provided in an embodiment of the present application.

[0021] The above drawings include the following reference numerals:

[0022] 100 - Rigid board; 101 - First surface; 102 - Second surface; 103 - Overlapping area; 110 - Processor; 120 - First signal pin;

[0023] 200-flexible board; 200a-first flexible board; 200b-second flexible board; 200c-third flexible board; 200d-fourth flexible board; 201-folding portion; 210-storage strip;

[0024] 300 - routing structure; 310 - signal via; 320 - flexible routing; 310a - first signal via; 310c - third signal via. DETAILED DESCRIPTION

[0025] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0026] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0027] Modern servers need to meet the demand for increasing data and computing power. Modern servers are evolving towards multi-core, and multi-core processor technology has emerged. To support the operation of the supporting processors, more storage strips need to be set up to establish more memory channels to meet the throughput of more parallel data.

[0028] When selecting and designing a circuit board, the relevant technology typically places all required components on the board, and then interconnects the components on the board through routing. This applies to components such as the central processing unit (CPU), graphics processing unit (GPU), and dual inline memory modules (DIMM) on the board. With the technological evolution of modern servers, the number of memory modules required on the circuit board is increasing. The higher the integration of the circuit board, the more difficult the design. This, on the one hand, results in increasingly complex circuit board structures and larger board areas, requiring the board to occupy more space in the server, hindering the trend toward miniaturization of servers. On the other hand, due to the high design requirements of the circuit board, functional instability may occur, which to a certain extent limits the functionality of the server.

[0029] Generally speaking, to ensure structural reliability, the circuit boards installed in servers utilize a rigid structure. The processor and memory modules are all mounted on this rigid circuit board, and connections between the processor, memory module, and circuit board are achieved through pins. It's easy to understand that as the number of memory modules increases, the circuit board area must be sufficiently large to accommodate the connections. The combination of more memory modules and the circuit board (including wiring, etc.) inevitably leads to increasingly complex circuit boards, increasing their surface area and thickness, hindering their processing and thus hindering the trend toward server miniaturization. Furthermore, to manage the server's size and avoid completely ignoring the trend toward server miniaturization, the components on the circuit board must be arranged more densely, resulting in a higher density of pins or wiring. These highly integrated, high-standard designs result in a higher level of circuit board integration, but also, of course, greater design complexity, leading to functional instability and, to a certain extent, limiting the server's functionality.

[0030] Therefore, for the server in the related technology, due to the increase in the number of storage bars on the circuit board and the current combination method of the circuit board and the storage bars, the circuit board will become structurally complex and difficult to design, which ultimately makes the server insufficient in the miniaturization development trend and functional performance.

[0031] Based on the above-mentioned status quo and problems, an embodiment of the present application provides a circuit board that changes the conventional structural type of current circuit boards so that it can adapt to the installation of small servers and ensure the functional stability of the server even when multiple storage strips are provided.

[0032] To this end, the circuit board in the embodiment of the present application is designed to include a rigid part and a flexible part, which are connected to each other, and signals are conducted between the two. The number of flexible parts can be set according to needs, and at least a portion of the storage bars can be set on the flexible part and the routing and related settings can be completed on the corresponding flexible part. Therefore, the design of the circuit board can fully realize the independence of each storage bar in structure and performance, making the circuit board more stable in performance, thereby improving the function of the server, and the flexible part can be folded from the edge of the rigid part, so that the entire circuit board can be installed in the server in a folded state, thereby making full use of the server space, which is in line with the miniaturization development trend of the server.

[0033] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0034] Figure 1 A side view of a circuit board provided in an embodiment of the present application; Figure 2 A top view of a circuit board provided in an embodiment of the present application; Figure 3 A bottom view of a circuit board provided in an embodiment of the present application; Figure 4 A schematic diagram of the three-dimensional structure of a circuit board provided in an embodiment of the present application; Figure 5 An exploded schematic diagram of a circuit board provided in an embodiment of the present application; Figure 6 A schematic diagram of a circuit board assembly process provided in an embodiment of the present application; Figure 7 A schematic diagram of the installation status of a circuit board provided in an embodiment of the present application.

[0035] In the examples of this application, please refer to Figures 1 to 7 The circuit board in the embodiment of the present application includes a rigid board body 100 and a plurality of flexible boards 200 .

[0036] Among them, the rigid board body 100 is a rigid structure, which can be made of common circuit board materials. For example, the rigid board body 100 can use glass fiber cloth, epoxy resin, etc. as the base material. The rigid board body 100 has an overall hard texture and does not easily deform.

[0037] Core components such as a processor 110 are connected to the rigid board 100. Of course, components such as a memory stick 210 may also be connected to the rigid board 100. Placing core components such as the processor 110 on the rigid board 100 can leverage the inherent properties of the rigid board 100 and maintain stable processing performance.

[0038] Multiple flexible boards are stacked on the side of the rigid board away from the processor 110. The flexible board 200 is a flexible structure that can be deformed to a certain extent. The flexible board 200 can use polyimide or polyester film as the base material. The flexible board 200 is soft and can be deformed.

[0039] The flexible board body 200 can be folded relative to the rigid board body 100 to form a folding portion 201. Each folding portion 201 gradually becomes longer in the direction away from the rigid board body 100. A storage bar 210 is connected to the folding portion 201 of the flexible board body 200. Each storage bar 210 is arranged at intervals. A routing structure 300 for connecting the storage bar 210 and the processor 110 is arranged between the storage bar 210 and the processor 110.

[0040] Because the flexible board 200 can be folded to form the folding portion 201, the circuit board can change its shape. When installed in a server, the circuit board can more effectively utilize the space within the server. For example, a server typically includes a tall radiator. By folding the flexible board 200 in the circuit board, the radiator's surroundings can be adjusted to fit the radiator, thereby fully utilizing the vertical space within the server. At the same time, the area of ​​the rigid board 100 can be designed to be smaller, thereby saving horizontal space within the server and making the circuit board more adaptable to smaller servers.

[0041] As can be seen from the following embodiments, the wiring structure 300 here may mainly include necessary signal vias 310 and necessary inter-board circuit layouts, etc. The via structure can form a signal connection between the memory bar 210 and the processor 110.

[0042] It should be understood that the embodiments of the present application are intended to dispose at least a portion of the memory bars 210 originally disposed on the rigid board 100 on the flexible board 200. The specific number of memory bars 210 disposed on the flexible board 200 can be set according to actual needs. For example, it will be appreciated in some of the following embodiments that all memory bars 210 can be disposed on the flexible board 200. Furthermore, the present application does not impose any restrictions on the number of flexible circuit boards, nor does it impose any particular restrictions on the correspondence between the flexible circuit boards and the memory bars 210.

[0043] In an embodiment of the present application, multiple flexible board bodies 200 are stacked and arranged on one side of a rigid board body 100, and the flexible board body 200 can be folded to form a folding portion 201. A storage bar can be set on the folding portion 201, so that the circuit board can transfer at least a portion of the storage bar 210 originally connected to the rigid board body 100 to the flexible board body 200, and form a connection between the rigid board body 100 and the flexible board body 200 through the routing structure 300. Combined with the foldable performance of the flexible board body 200, the circuit board can make full use of the space of the server, which is conducive to the miniaturization design of the server. On the other hand, since at least a portion of the storage bars 210 are transferred to the flexible board 200 and the storage bars 210 are arranged at intervals, by reasonably designing the number and position of the flexible board 200 and matching the design of the routing structure 300, each storage bar 210 can be separated from the rigid board 100 as much as possible. The design of the circuit board can fully realize the independence of the structure and performance of each storage bar 210, and can achieve the purpose of only setting the processor 110 on the rigid board 100 and setting all the storage bars 210 on the flexible board 200. This can simplify the structure of the circuit board and reduce the design difficulty, control the thickness of the rigid board 100 to facilitate the processing of the rigid board 100, and make the circuit board more stable in performance.

[0044] In addition, it can be known that for circuit boards in current technology, the processor 110 and the storage bars 210 are both connected to the same circuit board and the number of storage bars 210 is relatively large. The storage bars 210 are arranged at intervals on the surface of the circuit board, and the routing between the storage bars 210 and the processor 110 also becomes complicated accordingly. In order to realize the routing, the circuit board needs to be provided with the same number of routing layers as the storage bars 210, which will cause the thickness of the circuit board to become larger and larger, and the processing difficulty of the circuit board will increase or even become impossible to process.

[0045] In this regard, when the solution in the embodiments of the present application is adopted, namely, by providing a flexible board 200 and connecting a storage bar 210 to the flexible board 200, the wiring can be formed on the flexible board 200 without affecting the thickness of the rigid board 100 or reducing the impact on the thickness. This can reduce the design thickness of the rigid board 100 and reduce the difficulty of circuit board processing. Furthermore, in conjunction with some of the following embodiments, it can be seen that when one flexible board 200 is designed to correspond to one storage bar 210, all wiring layers can be distributed on each flexible board 200, thereby even achieving the connection of multiple storage bars 210 without increasing the thickness of the rigid board 100.

[0046] The circuit board in the embodiment of the present application can be used in various types of servers. Based on the design of the circuit board, the server can be designed to be smaller and have higher functional stability.

[0047] In some embodiments, please refer to Figures 1 to 3 、 Figure 7 The processor 110 is connected to the first surface 101 of the rigid board 100, the flexible board 200 is connected to the second surface 102 of the rigid board 100 opposite to the first surface 101, and the flexible board 200 extends out of the rigid board 100 and the part extending out of the rigid board 100 forms a folding portion 201.

[0048] Combine Figure 1 and Figure 7 As shown, the rigid board 100 includes a front and back surface facing each other. These front and back surfaces are defined based on the assembly state of the board. For example, when the board is assembled into a server, the processor 110 faces upward. The front surface is the aforementioned first surface 101, and the back surface is the aforementioned second surface 102. In this case, the processor 110 and the flexible board 200 are located on opposite sides of the rigid board 100, facilitating a stable connection and maintaining the functional stability of the processor 110.

[0049] The flexible board 200 can extend beyond the rigid board 100 to form a folded portion 201, thereby providing a connection base for the memory stick 210, which can be connected to the folded portion 201. It is understood that the folded portion 201 can be regarded as an extension of the rigid board 100. By supplementing this extension, the board space of the rigid board 100 can be expanded, so that even if the rigid board 100 is designed to be smaller, the circuit board can still meet the connection requirements of a large number of memory sticks 210.

[0050] In some embodiments, a plurality of flexible boards 200 are stacked and connected to the second surface 102 of the rigid board 100 , and at least one storage bar 210 is disposed on each flexible board 200 .

[0051] It is understandable that the provision of multiple flexible boards 200 can provide more board space for the rigid board 100 , so that more storage bars 210 can be installed on the circuit board.

[0052] It should be noted that for each flexible board 200, there can be one or more memory bars 210 on the flexible board 200. To simplify the description and facilitate understanding, the following embodiments of the present application will mainly be described as one flexible board 200 corresponding to one memory bar 210. Of course, in the circuit board structure below using a symmetrical design, when the flexible board 200 is a single board structure, two memory bars 210 can also be symmetrically connected on one flexible board 200.

[0053] In some embodiments, please refer to Figures 1 to 3The number of flexible boards 200 and storage bars 210 is the same. In the direction from the first surface 101 to the second surface 102 of the rigid board 100, the folding portion 201 of each flexible board 200 gradually becomes longer, and each storage bar 210 is spaced along the direction in which the folding portion 201 becomes longer and is correspondingly arranged on each folding portion 201.

[0054] Combine Figure 1 and Figure 4 Assume that four flexible boards 200 are disposed on a rigid board 100, with a storage bar 210 disposed on each of the four flexible boards 200. The four flexible boards 200 are respectively a first flexible board 200a, a second flexible board 200b, a third flexible board 200c, and a fourth flexible board 200d. It is understood that the lengths of the four flexible boards 200 increase sequentially, with the first flexible board 200a having the smallest length and the fourth flexible board 200d having the largest length. This allows each flexible board 200 to expose a folded portion 201, and the folded portions 201 are stacked sequentially, leaving space for connecting a storage bar 210. Ultimately, the storage bars 210 are arranged in a spaced pattern.

[0055] In some embodiments, a portion of each flexible board body 200 overlaps on the second surface 102 of the rigid board body 100, and each flexible board body 200 will overlap on the second surface 102 of the rigid board body 100. In order to ensure the connection reliability of each flexible board body 200, the overlapping portions of each flexible board body 200 on the second surface 102 can be pressed and combined to form a whole and located in the overlapping area 103, thereby improving the overall integrity and structural strength of the circuit board, facilitating the transportation and high-stability installation of the circuit board, etc.

[0056] Figure 8 A schematic diagram of the wiring of a circuit board provided in an embodiment of the present application; Figure 9 A schematic diagram of a signal via 310 of a circuit board provided in an embodiment of the present application; Figure 10 Schematic diagram of a signal via 310 of a rigid board 100 of a circuit board provided in an embodiment of the present application.

[0057] In some embodiments, please refer to Figures 8 to 10The routing structure 300 includes a signal via 310 and a flexible routing 320. The signal via 310 includes a first signal via 310a formed on the rigid board 100 and corresponding to the processor 110, a third signal via 310c formed on the flexible board 200 and corresponding to the first signal via 310a, and a second signal via (not shown in the figure) formed on the flexible board 200 and corresponding to the storage bar 210. The flexible routing 320 is formed on the flexible board 200 and connected between the second signal via and the third signal via 310c. The first signal via 310a is signal-connected to the third signal via 310c.

[0058] Taking the above-mentioned first flexible board 200a and the storage bar 210 set on the first flexible board 200a as an example, in order to realize the connection between the storage bar 210 and the processor 110, it is necessary to form a signal path between the memory and the processor 110. The signal path is realized by the above-mentioned routing structure 300. Specifically, the connection between the first signal via 310a and the third signal via 310c can form a connection between the two originally separated structures of the rigid board 100 and the first flexible board 200a. At this time, the processor 110 can be connected to the first flexible board 200a, and then based on the flexible routing 320 formed on the first flexible board 200a, the signal connection can be transmitted to the storage bar 210, thereby realizing the connection from the processor 110 to the storage bar 210. For other flexible boards 200 and corresponding storage bars 210, the formation methods and principles of each routing structure 300 are basically the same and will not be repeated here. Except for the part of the rigid board 100, each routing structure 300 connected between the processor 110 and each storage bar 210 is an independent structure, which can improve the performance of the circuit board.

[0059] For example, with the arrangement of the above-mentioned wiring structure 300, the first signal via 310a corresponding to the processing above the rigid board 100 can be directly connected to the third signal via 310c on the flexible board 200. After the signal is transmitted to the flexible board 200, it is then passed to each storage bar 210 through each independent flexible wiring 320, so that the flexible wiring 320 leading to each storage bar 210 can all be on an independent flexible board 200, and each flexible wiring 320 has an independent isolation layer, which is beneficial to improving signal quality.

[0060] For another example, the arrangement of the routing structure 300 can reduce signal crosstalk at the memory bars 210 to improve signal quality. Specifically, in current circuit board structures, multiple signal vias 310 need to be provided on the circuit board, and the routing lines connected to the memory bars 210 located at the rear need to cover the signal vias 310 in the front, thereby causing signal crosstalk. However, in the routing structure 300 in the embodiment of the present application, the flexible routing lines 320 are all located on an independent flexible board 200, and the model vias corresponding to each memory bar 210 do not appear on other flexible boards 200. Therefore, each memory bar 210 is not affected by other signal vias 310, thereby reducing crosstalk and improving signal quality.

[0061] For another example, the arrangement of the routing structure 300 can avoid differential signal decoupling. Specifically, in the circuit board structure of the current technology, multiple signal vias 310 need to be provided on the circuit board. The routing lines connected to the memory bars 210 located at the rear need to cover the signal vias 310 in the front. This will result in differential signal routing with ground vias, resulting in differential signal decoupling. However, in the routing structure 300 of the embodiment of the present application, the flexible routing lines 320 are all located on an independent flexible board 200. The model vias corresponding to each memory bar 210 will not appear on other flexible boards 200, and the differential signal routing with ground vias will not occur. This avoids the decoupling of differential signals of the memory bars and is conducive to improving signal quality.

[0062] For another example, the arrangement of the routing structure 300 can increase routing and winding space. Specifically, in current circuit board structures, multiple signal vias 310 are required on the circuit board. Routes connected to the rear-positioned memory bars 210 must cover the front signal vias 310, which affects the routing space and is not conducive to routing. However, in the routing structure 300 of the embodiment of the present application, the flexible routing 320 is located on an independent flexible board 200. The model vias corresponding to each memory bar 210 do not appear on other flexible boards 200, which facilitates routing arrangement.

[0063] In addition, please combine Figure 9 and Figure 10The arrangement of the routing structure 300 can fully utilize each signal via 310, eliminating the situation where some portions of the signal via 310 are left unused, thereby improving signal quality. Specifically, taking the first flexible board 200a as an example, the first signal via 310a located on the rigid board 100 corresponds to the third signal via 310c on the first flexible board 200a. The third signal via 310c can penetrate the first flexible board 200a. During signal transmission, the first signal via 310a and the third signal via 310c fully participate in signal transmission, thereby improving signal quality.

[0064] In some embodiments, please refer to Figure 2 and Figure 8 A first signal pin 120 is provided on the rigid board 100, the processor 110 is connected to the first signal pin 120, the first signal hole corresponds to the first signal pin 120 and passes through the second surface 102 of the rigid board 100, a second signal pin is provided on the flexible board 200, the storage bar 210 is connected to the second signal pin, and the routing structure 300 is connected between the first signal pin 120 and the second signal pin.

[0065] The first signal pin 120 is a connection structure for the processor 110, and the second signal pin is a connection structure for the memory stick 210. The wiring structure 300 is connected between the first signal pin 120 and the second signal pin to achieve a connection between the processor 110 and the memory stick 210. It will be appreciated that when multiple memory sticks 210 are provided on a circuit board, the first signal pins 120 need to be arranged in multiple groups.

[0066] In some embodiments, there are multiple groups of first signal needles 120, and the multiple groups of first signal needles 120 are spaced apart on the rigid board body 100 along the edge direction of the rigid board body 100. The multiple groups of first signal needles 120 include a first group of first signal needles 120, a second first signal needle 120, and up to the nth group of first signal needles 120 along the edge of the rigid board body 100. The multiple groups of second signal needles are spaced apart along the direction in which the folding portion 201 becomes longer. The multiple groups of second signal needles include a first group of second signal needles, a second group of second signal needles, and up to the nth group of second signal needles along the direction in which the folding portion 201 becomes longer. The first group of first signal needles 120 is connected to the first group of second signal needles, the second group of first signal needles 120 is connected to the second group of second signal needles, and the nth group of first signal needles 120 is connected to the nth group of second signal needles, where n is an integer greater than or equal to 3.

[0067] Taking the above-mentioned arrangement of four flexible boards 200 as an example, n is 4, that is, the plurality of groups of first signal pins 120 include the first group of first signal pins 120 to the fourth group of first signal pins 120. For ease of explanation, please refer to Figure 4In the coordinate system in FIG, the first surface 101 and the second surface 102 of the rigid board 100 are located in the XY plane. The rigid board 100 is designed as a rectangular parallelepiped structure, including a long side corresponding to the Y direction and a short side corresponding to the X direction. Each flexible board 200 gradually becomes longer in the X direction, that is, the first flexible board 200a has the shortest dimension in the X direction, and the fourth flexible board 200d has the longest dimension in the X direction. The direction of lengthening along the folded portion 201 is along the X direction. In this case, the first group of second signal pins to the fourth group of second signal pins are arranged at intervals along the X direction. The first signal pins 120 are arranged from the middle position of the rigid board 100 to the edge of the rigid board 100. The direction along the edge of the rigid board 100 is along the X direction. In this case, the first group of first signal pins 120 to the fourth group of first signal pins 120 are arranged at intervals along the X direction.

[0068] Therefore, it can be understood that in the X direction, the first group of first signal pins 120 is connected to the first group of second signal pins, the second group of first signal pins 120 is connected to the second group of second signal pins, the third group of first signal pins 120 is connected to the third group of second signal pins, and the fourth group of first signal pins 120 is connected to the fourth group of second signal pins. The first signal pins 120 and the second signal pins are connected in sequence in the X direction, which can evenly distribute the signal trace lengths on all storage bars 210, avoid the situation on traditional rigid PCB boards where the longest trace length increases infinitely as the number of storage bars 210 increases, reduce the length of the longest signal trace, and help improve signal quality.

[0069] In combination with the foregoing, the flexible board 200 is connected to the second surface 102 of the rigid board 100. The flexible board 200 and the rigid board 100 are originally two independent structures. To ensure that a good signal transmission channel can be established between the flexible board 200 and the rigid board and to ensure the connection between the first signal via 310a and the third signal via 310c, a conductive structure can be provided between the first signal via 310a and the third signal via 310c.

[0070] In some embodiments, the flexible board 200 is provided with a pin at a position corresponding to the third signal via hole 310 c , and the pin is correspondingly inserted into the first signal via hole 310 a , and the pin forms a conductive structure.

[0071] In the above embodiment, the specific structure of the pin is not limited. For example, the pin can be fisheye-shaped. The pin can be inserted into the first signal via 310a to achieve signal connection, which is convenient for plugging and maintenance.

[0072] In some specific embodiments, in order to prevent the pin from damaging the rigid board 100, a positioning structure can be set on the rigid board 100 and / or the flexible board 200. For example, a positioning post or a positioning hole for positioning can be set on the edge of the rigid board 100 or the flexible board 200. The cooperation between the positioning post and the positioning hole can enable the pin to accurately locate the position of the first signal via 310a, which can prevent the pin from being accurately inserted into the first signal via 310a.

[0073] In some embodiments, a conductive pad is provided on the flexible board 200 corresponding to the third signal via 310c, and a spring pin is provided on the rigid board 100 corresponding to the first signal via 310a. The spring pin is pressed onto the conductive pad, and the conductive pad and the spring pin form a conductive structure.

[0074] In the above embodiment, the spring pins and the conductive pads form two components of the conductive structure. By applying pressure, the spring pins are deformed and abut against the conductive pads to achieve signal connection between the rigid board 100 and the flexible board 200, which is easy to operate and low in cost.

[0075] In some embodiments, the flexible board 200 is provided with a first magnetic contact corresponding to the third signal via 310c, and the rigid board 100 is provided with a second magnetic contact corresponding to the first signal via 310a. The second magnetic contact contacts the first magnetic contact, and the first magnetic contact and the second magnetic contact form a conductive structure.

[0076] In the above embodiment, the first magnetic contact is exposed from the flexible board 200, and the second magnetic contact is exposed from the rigid board 100. The flexible board 200 can be connected to the rigid board 100 through magnetic action, and the signal connection between the rigid board 100 and the flexible board 200 can be achieved.

[0077] In some embodiments, a conductive adhesive strip is disposed between the third signal via 310 c and the first signal via 310 a , and the conductive adhesive strip forms a contact structure.

[0078] In the above embodiment, the flexible board 200 and the rigid board 100 can be connected by a mechanical connection method, such as by screws or snaps. After the two are connected, signal connection can be achieved through the conductive adhesive strip set in the first signal via 310a and / or the second signal via.

[0079] In the above embodiment, it can be understood that each flexible board 200 can be connected to the rigid board 100 along the X-direction, with each flexible board 200 extending toward the same side of the rigid board 100, thereby forming a single-sided circuit board structure. Based on the above, it can be understood that the flexible board 200 can also be extended bidirectionally with respect to the rigid board 100, with a portion of the flexible board 200 extending along the X-direction and another portion extending in the direction opposite to the X-direction. This can further expand the board surface space of the circuit board and accommodate more memory strips 210, thereby forming a double-sided circuit board structure.

[0080] For the above-mentioned double-sided circuit board structure, in order to ensure the structural balance and functional stability of the circuit board, the double-sided circuit board structure can be designed as or approximately as a symmetrical structure based on the rigid board body 100 .

[0081] In the aforementioned embodiment in which the flexible board body 200 is stacked on the second surface 102 of the rigid board body 100, the flexible board body 200 can be designed as a split structure or a whole board structure, wherein the split structure means that each flexible board body 200 includes two components, and the two components can be connected, and the whole board structure means that the flexible board body 200 is an integral plate structure.

[0082] Please refer to Figure 4 When the flexible board 200 is a whole board structure, the flexible board 200 of the whole board structure is connected to the second surface 102 of the rigid board 100 and extends from both sides of the rigid board 100 to form a folding portion 201 .

[0083] It can be understood at this point that two storage bars 210 can be set on the same flexible board 200, and the routing structure 300 between the storage bar 210 and the processor 110 can also be symmetrically distributed on the circuit board. Each routing structure 300 will not be interfered with by other routing structures 300. Its function is the same as described above and will not be repeated here.

[0084] Please refer to Figure 5 and Figure 6 When the flexible board 200 is a split structure, the split flexible board 200 is symmetrically connected to the second surface 102 of the rigid board 100 and the flexible board 200 forms folding portions 201 on both sides of the rigid board 100 .

[0085] It can be understood that two components of the flexible board 200 can be set on the same level, and each component has the performance of an independent flexible board 200. The functions of the routing structure 300 remain unchanged and will not be repeated.

[0086] In addition to the aforementioned single-sided and double-sided circuit board structures, the circuit board can also be designed in a cross-type form. The cross-type circuit board structure is similar to the aforementioned double-sided circuit board structure in overall structure, but the cross-type circuit board structure has more levels.

[0087] In the specific design, a flexible board 200 is set on each level. The flexible board 200 extends only toward one side of the rigid board 100. It can be designed to be similar to a component of the aforementioned flexible board 200. Therefore, for the same side of the rigid board 100, each flexible board 200 can be separated by the flexible board 200 located on the other side of the rigid board 100, which can further improve the signal quality.

[0088] In some embodiments, the flexible board 200 is detachably connected to the rigid board 100 , such that the flexible board 200 and the rigid board 100 can be assembled and disassembled with each other.

[0089] Based on the detachable connection between the flexible board body 200 and the rigid board body 100 , both the rigid board body 100 and the flexible board body 200 can be disassembled, which facilitates maintenance of the circuit board.

[0090] Furthermore, because the flexible board 200 and the rigid board 100 can be assembled and disassembled, the rigid board 100 can be used with different numbers of flexible boards 200, allowing the circuit board to be flexibly used in different application scenarios to meet the needs of different memory channels. Specifically, different application scenarios have different requirements for memory capacity. When the required capacity is large, the rigid board 100 can be used with more flexible boards 200, while when the required capacity is small, the rigid board 100 can be used with fewer flexible boards 200. By combining different numbers of flexible boards 200 with the same rigid board 100 to meet different capacity requirements, there is neither a waste of memory resources nor a situation where insufficient memory resources require the redevelopment of the circuit board.

[0091] The above is a detailed introduction to the circuit board and server provided by this application. This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the method and core concept of this application. It should be noted that for ordinary technicians in this technical field, without departing from the principles of this application, various improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A circuit board, characterized in that: include: A rigid board (100), with a processor (110) connected to the rigid board (100); and a plurality of flexible boards (200), wherein the plurality of flexible boards (200) are stacked and arranged on a side of the rigid board (100) away from the processor (110), the flexible board (200) can be folded relative to the rigid board (100) to form a folding portion (201), and each of the folding portions (201) gradually becomes longer in a direction away from the rigid board (100), a storage bar (210) is connected to the folding portion (201) of the flexible board (200), each of the storage bars (210) is arranged at intervals, and a routing structure (300) for connecting each of the storage bars (210) and the processor (110) is provided between the storage bar (210) and the processor (110).

2. The circuit board according to claim 1, wherein: The processor (110) is connected to the first surface (101) of the rigid board (100), the flexible board (200) is connected to the second surface (102) of the rigid board (100) which is opposite to the first surface (101), and the flexible board (200) extends out of the rigid board (100), and the portion extending out of the rigid board (100) forms the folding portion (201).

3. The circuit board according to claim 2, wherein: At least one storage bar (210) is provided on each of the flexible plates (200).

4. The circuit board according to claim 3, wherein: The number of the flexible board body (200) and the storage bars (210) is the same. In the direction from the first surface (101) to the second surface (102) of the rigid board body (100), the storage bars (210) are spaced apart along the direction in which the folding portion (201) becomes longer and are correspondingly arranged on each folding portion (201).

5. The circuit board according to claim 4, wherein: The wiring structure (300) includes a signal via (310) and a flexible wiring (320). The signal via (310) includes a first signal via (310a) formed on the rigid board (100) and corresponding to the processor (110), a third signal via (310c) formed on the flexible board (200) and corresponding to the first signal via (310a), and a second signal via formed on the flexible board (200) and corresponding to the storage bar (210). The flexible wiring (320) is formed on the flexible board (200) and connected between the second signal via and the third signal via (310c). The first signal via (310a) and the third signal via (310c) are signal-connected.

6. The circuit board according to claim 5, characterized in that A first signal pin (120) is provided on the rigid board (100), the processor (110) is connected to the first signal pin (120), the first signal via (310a) corresponds to the first signal pin (120) and passes through the second surface (102) of the rigid board (100), a second signal pin is provided on the flexible board (200), the storage bar (210) is connected to the second signal pin, and the routing structure (300) is connected between the first signal pin (120) and the second signal pin.

7. The circuit board according to claim 6, wherein: The first signal needles (120) are a plurality of groups, and the plurality of groups of the first signal needles (120) are arranged on the rigid plate (100) at intervals along the direction in which the folding portion (201) becomes longer. The plurality of groups of the first signal needles (120) include a first group of first signal needles (120), a second group of first signal needles (120) and up to an nth group of first signal needles (120) along the direction in which the folding portion (201) becomes longer. The plurality of groups of the second signal needles are arranged at intervals along the direction in which the folding portion (201) becomes longer. The plurality of groups of the second signal needles include a first group of second signal needles, a second group of second signal needles and up to an nth group of second signal needles along the direction in which the folding portion (201) becomes longer. The first group of first signal needles (120) is connected to the first group of second signal needles, the second group of first signal needles (120) is connected to the second group of second signal needles, and the nth group of first signal needles (120) is connected to the nth group of second signal needles, where n is an integer greater than or equal to 3.

8. The circuit board according to claim 5, wherein: A conductive structure is provided between the third signal via (310c) and the first signal via (310a).

9. The circuit board according to claim 8, wherein: The flexible board (200) is provided with a pin at a position corresponding to the third signal via (310c), the pin being correspondingly inserted into the first signal via (310a), and the pin forming the conductive structure; or, the flexible board (200) is provided with a conductive pad at a position corresponding to the third signal via (310c), and the rigid board (100) is provided with a spring pin corresponding to the first signal via (310a), the spring pin being pressed onto the conductive pad, and the conductive pad and the spring pin forming the conductive structure. structure; or, the flexible board (200) is provided with a first magnetic contact at a position corresponding to the third signal via (310c), and the rigid board (100) is provided with a second magnetic contact at a position corresponding to the first signal via (310a), the second magnetic contact contacts the first magnetic contact, and the first magnetic contact and the second magnetic contact form the conductive structure; or, a conductive rubber strip is provided between the third signal via (310c) and the first signal via (310a), and the conductive rubber strip forms the contact structure.

10. The circuit board according to claim 1, wherein: The flexible plate body (200) forms a symmetrical structure relative to the rigid plate body (100), and the folding portions (201) are respectively formed on both sides of the rigid plate body (100).

11. The circuit board according to any one of claims 2 to 10, characterized in that: The flexible plate body (200) is a split structure, the flexible plate body (200) of the split structure is symmetrically connected to the second surface (102) of the rigid plate body (100), and the flexible plate body (200) forms the folding portions (201) on both sides of the rigid plate body (100).

12. The circuit board according to any one of claims 2 to 10, characterized in that: The flexible plate body (200) is a whole plate structure, the flexible plate body (200) of the whole plate structure is connected to the second surface (102) of the rigid plate body (100) and extends from both sides of the rigid plate body (100) to form the folding portion (201).

13. The circuit board according to any one of claims 1 to 10, characterized in that: The flexible plate body (200) is connected to the rigid plate body (100) in a detachable manner.

14. A server, characterized in that: A circuit board comprising the circuit board according to any one of claims 1 to 13.

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