Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an isolation structure and a plurality of light-emitting devices, wherein the isolation structure and the light-emitting devices are located on the substrate. The isolation structure is located on the substrate and forms a plurality of isolation openings in a surrounding mode, the light-emitting devices correspond to the isolation openings respectively, each light-emitting device comprises a first electrode, a light-emitting function layer and a second electrode which are sequentially stacked on the substrate, and at least part of the light-emitting function layer and at least part of the second electrode are located in the corresponding isolation openings. The light-emitting devices comprise the first type of light-emitting devices and the second type of light-emitting devices, the first type of light-emitting devices and the second type of light-emitting devices are different in light emitting color, and the first portions of the first electrodes of the first type of light-emitting devices and the first portions of the first electrodes of the second type of light-emitting devices are different in thickness. The display panel with the structure can ensure the quality of the prepared light-emitting device.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin-film electroluminescent device. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] Traditional OLED display panel manufacturing typically uses a fine metal mask (FMM) to pattern luminescent pixels. FMM technology is mature and boasts extensive mass production experience. However, FMM technology also suffers from limitations such as limited precision and high cost. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-area scalability, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe the FMM-free technology for reference.

[0004] However, the display performance of current OLED display products needs to be improved. Summary of the Invention

[0005] The first aspect of the present disclosure provides a method for preparing a display panel, which comprises: providing a substrate and forming a plurality of first electrodes spaced from each other on the substrate; forming an isolation structure having a plurality of isolation openings on the substrate on which the first electrodes are formed; depositing a light-emitting material film and a conductive material film, wherein the light-emitting material film and the conductive material film cover the isolation structure and the isolation opening, wherein the portions of the light-emitting material film and the conductive material film located in the isolation opening form a light-emitting functional layer and a second electrode respectively, and the first electrode, the light-emitting functional layer and the second electrode stacked on each other form a light-emitting device; depositing a packaging material film layer to cover the isolation structure and the light-emitting device; forming a photoresist layer on the packaging material film layer, and patterning the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening, and the isolation opening covered by the photoresist pattern is a target isolation opening; dry-etching the packaging material film layer based on the photoresist pattern, and removing the portion of the packaging material film layer not covered by the photoresist pattern. The method comprises the following steps: removing the etched portion of the packaging material film layer, the remaining portion of the packaging material film layer forming a packaging unit covering the target isolation opening; performing a stripping process to remove the etching residues of the packaging material film layer, the photoresist pattern and at least a portion of the light-emitting functional layer in the light-emitting device not covered by the packaging unit, and retaining the second electrode in the isolation opening not covered by the packaging unit; performing wet etching to remove the second electrode not covered by the packaging unit, wherein, in the isolation opening not covered by the packaging unit, at least a portion of the surface of the first electrode facing away from the substrate is etched, and the etched portion of the first electrode is the first portion, which is located in the light-emitting area of the light-emitting device; repeating the above process to form a light-emitting device and a packaging unit at the isolation opening where no light-emitting device is formed, and all the packaging units form a first packaging layer, wherein the light-emitting devices formed in different batches have different light-emitting colors, and at least the portion of the first electrode corresponding to the isolation opening of the light-emitting devices with different light-emitting colors is wet-etched different times to have different thicknesses.

[0006] In a process for batch-fabricating light-emitting devices based on an isolation structure, if a wet etching process is performed directly after the aforementioned dry etching process for the encapsulation material film layer, the etching residues left in the encapsulation material film layer during the dry etching process may adversely affect the wet etching process, resulting in incomplete etching of the film structure in the isolation openings (other isolation openings other than the target isolation opening), thereby affecting the quality of the light-emitting devices subsequently formed (formed in "repeating the aforementioned process"). In the aforementioned process of the present disclosure, after the dry etching process for the encapsulation material film layer is completed, a stripping process is first performed to remove exposed organic material and clean the dry etching residues. The organic material includes the residual photoresist pattern and at least a portion of the light-emitting functional layer of the light-emitting device not covered by the encapsulation unit. In the process for fabricating light-emitting devices based on an isolation structure, the second electrode of the light-emitting device does not completely cover the light-emitting functional layer in some areas, allowing the stripping solution in the stripping process to etch the light-emitting functional layer. In this way, because the surface of the display panel has been cleaned by the stripping process, the quality of the subsequent wet etching process can be improved. It should be noted that due to the aforementioned adjustment in the process sequence, during the wet etching process, since the first electrode is no longer covered by the light-emitting functional layer, the etching solution will etch the surface of the first electrode to a certain extent during the etching of the second electrode. As a result, except for the light-emitting devices formed in the first batch, the first electrodes of light-emitting devices formed later will undergo more wet etching processes and thus be etched to a greater extent. This will result in light-emitting devices with different light emission colors having different thicknesses in at least the portion corresponding to the isolation opening in the first electrode.

[0007] In a specific embodiment of the first aspect of the present disclosure, the plurality of light-emitting devices include a first type of light-emitting device, a second type of light-emitting device, and a third type of light-emitting device, wherein the light emission colors of the first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device are different, and the first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device are prepared in batches in sequence. The surface of the first electrode of the second type of light-emitting device facing away from the substrate is wet-etched at least once, and the surface of the first electrode of the third type of light-emitting device facing away from the substrate is wet-etched at least twice, so that the thickness of the first portion of the first electrode of the first type of light-emitting device is greater than the thickness of the first portion of the first electrode of the second type of light-emitting device, and the thickness of the first portion of the first electrode of the second type of light-emitting device is greater than the thickness of the first portion of the first electrode of the third type of light-emitting device.

[0008] In the above scheme, after preparing the first type of light-emitting device, no impurities will remain in the isolation opening corresponding to the second type of light-emitting device (the second type of light-emitting device has not yet been formed at this time), thereby ensuring the preparation quality of the second type of light-emitting device. During this process, the surfaces of the first electrodes of the second type of light-emitting device and the third type of light-emitting device are partially etched; similarly, after preparing the second type of light-emitting device, no impurities will remain in the isolation opening corresponding to the third type of light-emitting device (the third type of light-emitting device has not yet been formed at this time), thereby ensuring the preparation quality of the third type of light-emitting device. During this process, the surface of the first electrode of the third type of light-emitting device is partially etched again.

[0009] In a specific embodiment of the first aspect of the present disclosure, the preparation method may further include: after forming the first electrode and before forming the isolation structure, forming a pixel defining material layer covering the first electrode on the substrate; after forming the isolation structure, patterning the pixel defining material layer to form a pixel defining layer, the pixel defining layer is located between the isolation structure and the substrate and a plurality of pixel openings are formed in the pixel defining layer, the pixel openings correspond to the isolation openings respectively and are connected to each other, and the light-emitting functional layer and the second electrode of the light-emitting device are located in the corresponding isolation openings.

[0010] Optionally, the pixel defining layer is an inorganic film layer. In the process of manufacturing a light-emitting device based on an isolation structure, the pixel defining layer does not need to be thick enough to accommodate the light-emitting device, thereby facilitating a thinner and lighter design of the display panel. The thickness of the inorganic film layer is significantly reduced compared to the thickness of the organic film layer, thereby meeting the thickness requirement of the pixel defining layer for light-emitting devices manufactured based on the isolation structure. In addition, as an inorganic film layer, the pixel defining layer can have a high bonding strength with the isolation structure and the first electrode, thereby reducing the risk of the isolation structure and the first electrode falling off. In addition, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the packaging effect of the display panel.

[0011] In one specific embodiment of the first aspect of the present disclosure, the orthographic projection of the pixel opening on the substrate lies within the orthographic projection of the first electrode on the substrate. For the wet-etched first electrode, the area of the surface of the first electrode facing away from the substrate, exposed by the pixel opening, is etched such that the thickness of the first portion corresponding to the pixel opening in the first electrode of light-emitting devices emitting light of different colors differs. The edge portion of the first electrode is covered by the pixel defining layer and is thus not affected by the wet etching. This results in different thicknesses between the middle portion (the first portion corresponding to the pixel opening) and the edge portion of the etched first electrode.

[0012] In a specific embodiment of the first aspect of the present disclosure, in the light-emitting devices formed in the first batch, the thickness of the portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening. In the light-emitting devices not formed in the first batch, the thickness of the portion of the first electrode covered by the pixel defining layer is greater than the thickness of the first portion of the first electrode corresponding to the pixel opening. For the light-emitting devices formed in the first batch, when wet etching is performed, the light-emitting devices will be covered by the packaging unit and will not be affected by the wet etching. In this way, the thickness of each portion of the first electrode is the same.

[0013] In a specific embodiment of the first aspect of the present disclosure, the isolation structure includes a support portion and a crown portion, and the support portion is located between the crown portion and the substrate. The orthographic projection of the end of the support portion away from the substrate on the substrate is located within the orthographic projection of the crown portion on the substrate, the edge of the crown portion is the edge of the isolation opening, the support portion is a conductive structure, and the second electrode is connected to the side surface of the support portion. In this way, the size of the crown portion is larger than the top size of the support portion to ensure that the isolation structure has a blocking effect on the film layer of the light-emitting device. In addition, this arrangement can limit the evaporation angle of the film layer of the light-emitting device during evaporation, so as to ensure that the second electrode can overlap with the isolation structure while reducing the overlapping area of the light-emitting functional layer and the isolation structure or avoiding the overlapping of the light-emitting functional layer and the isolation structure, thereby reducing the occurrence of horizontal current crosstalk problems.

[0014] In a specific embodiment of the first aspect of the present disclosure, the isolation opening includes a first side and a second side opposite to each other along the first direction, and a third side and a fourth side opposite to each other along the second direction.

[0015] The step of depositing the light-emitting material film and the conductive material film may include: relative movement of the evaporation source and the display panel along a second direction to evaporate the light-emitting material film and the conductive material film, such that after forming the light-emitting functional layer and the second electrode, the edge of the light-emitting functional layer is covered by the second electrode at the first side and / or the second side, and at least a portion of the side surface of the edge of the light-emitting functional layer is uncovered by the second electrode at the third side and the fourth side. In this manner, in a direction perpendicular to the direction of movement of the evaporation source (the direction from the first side to the second side), the evaporation range of the evaporated material radiated by the evaporation source is larger (the evaporation angle is larger), thereby making it easier for the evaporated material to accumulate below the crown portion, that is, the edge of the evaporated film layer is more likely to be deposited on the side surface of the support portion at the first and second sides; conversely, in the direction of movement of the evaporation source (the direction from the third side to the fourth side), that is, at the third and fourth sides, the edge of the evaporated film layer is less likely to be deposited on the side surface of the support portion. In this way, during actual evaporation, at the third side and the fourth side, it is difficult for the second electrode to cover the side surface of the light-emitting functional layer, or the film quality of the covered part is poor, so that when the stripping process is performed, the stripping liquid can easily invade under the second electrode at this position to etch the light-emitting functional layer, thereby removing at least part of the light-emitting functional layer.

[0016] Regarding performing a stripping process, the step of removing etching residues of the packaging material film layer, the photoresist pattern, and at least a portion of the light-emitting functional layer in the light-emitting device not covered by the packaging unit may include: in the isolation opening that does not cover the packaging unit, a stripping liquid used in the stripping process enters between the second electrode and the first electrode from at least the third side and the fourth side to remove the light-emitting functional layer, wherein after at least a portion of the light-emitting functional layer is removed, at least a portion of the second electrode sinks onto the first electrode. During the stripping process, the second electrode is difficult to etch, while the light-emitting functional layer below the second electrode will be etched and removed, so the second electrode will directly sink and contact the first electrode. As a result, in the subsequent wet etching process of the second electrode, in order to ensure that the second electrode is completely etched, it is inevitable to etch the surface of the first electrode.

[0017] Optionally, the distance between the orthographic projections of the first side and the second side on the substrate is smaller than the distance between the orthographic projections of the third side and the fourth side on the substrate. For example, the lengths of the first side and the second side are greater than the lengths of the third side and the fourth side. In this manner, the first side and the second side are effectively the long sides of the isolation opening. Furthermore, in conjunction with the description of the aforementioned solution, when preparing the second electrode, the evaporated material is more easily deposited on the first side and the second side, thereby resulting in a relatively small impedance between the second electrode and the isolation structure.

[0018] Optionally, the stripping solution used in the stripping process is alkaline, and the wet etching solution is acidic.

[0019] Optionally, before performing the stripping process, in isolation openings other than the target isolation opening, at least part of the etching residues of the packaging material film layer adheres to the sidewalls of the isolation structure facing the isolation openings, and the etching residues of the packaging material film layer are acid-resistant.

[0020] Optionally, the corrosion resistance of the etching residue of the packaging material film layer to the wet etching solution is greater than the corrosion resistance of the etching residue of the packaging material film layer to the stripping solution used in the stripping process.

[0021] In a specific embodiment of the first aspect of the present disclosure, the preparation method may further include: after performing wet etching to remove the second electrode not covered by the encapsulation unit, performing a stripping process to remove etching residues located in the isolation opening. In this way, any residues that may be present in the isolation opening after the wet etching process can be further removed to ensure the quality of the light-emitting device formed in subsequent processes.

[0022] A second aspect of the present disclosure provides a method for preparing a display panel, the method comprising: providing a substrate and forming a plurality of first electrodes spaced apart from each other on the substrate; forming an isolation structure having a plurality of isolation openings on the substrate having the first electrodes formed thereon, and depositing a light-emitting material film, a conductive material film, and an encapsulation material film layer, wherein the plurality of isolation openings include a first isolation opening and a second isolation opening, portions of the light-emitting material film and the conductive material film located in the first isolation opening form a light-emitting functional layer and a second electrode, respectively, and the first electrode, the light-emitting functional layer, and the second electrode stacked on each other form a first type of light-emitting device; forming a photoresist layer on the encapsulation material film layer, and performing a patterning process on the photoresist layer to form a photoresist pattern , a photoresist pattern covers the first isolation opening, and the photoresist pattern exposes the second isolation opening; based on the photoresist pattern, the packaging material film layer is dry-etched to remove the packaging material film layer at the second isolation opening, and the packaging material film layer at the first isolation opening is retained; a stripping process is performed to remove the photoresist pattern, the etching residues of the packaging material film layer at the second isolation opening, and at least part of the light-emitting material film at the second isolation opening, and the second electrode at the second isolation opening is retained; wet etching is performed to remove the conductive material film at the second isolation opening, wherein at least part of the surface of the first electrode at the second isolation opening facing away from the substrate is etched; and at least part of the film layer of the second type of light-emitting device is formed at the second isolation opening.

[0023] A third aspect of the present disclosure provides a display panel comprising a substrate, an isolation structure located on the substrate, and a plurality of light-emitting devices. The isolation structure is located on the substrate and encloses a plurality of isolation openings. The light-emitting devices correspond to the isolation openings, and each light-emitting device comprises a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate and away from the substrate. At least a portion of the light-emitting functional layer and at least a portion of the second electrode are located in the corresponding isolation opening. The first electrode comprises a first portion, which is located in a light-emitting region of the light-emitting device. The plurality of light-emitting devices include first-type light-emitting devices and second-type light-emitting devices. The first-type light-emitting devices and the second-type light-emitting devices emit light of different colors. The first portion of the first electrode of the first-type light-emitting device and the first portion of the first electrode of the second-type light-emitting device have different thicknesses. In the manufacturing process of this display panel, light-emitting devices of different light-emitting colors (e.g., first-type light-emitting devices and second-type light-emitting devices) can be manufactured in batches based on the isolation structure. In the manufacturing process of each batch of light-emitting devices, a portion of a film layer of light-emitting devices of the same color is formed entirely across the entire display panel. A portion of this film layer is then selectively removed through a process such as etching to obtain the light-emitting devices that are ultimately retained. During the entire fabrication process of these light-emitting devices, dry etching is performed first, followed by a stripping process before the wet etching process (etching the film layer corresponding to the second electrode) to remove exposed organic material and clean the dry etching residue. This organic material includes at least a portion of the light-emitting functional layer to be etched. This stripping process cleans the surface of the display panel, thereby improving the quality of the subsequent wet etching process and ensuring the quality of subsequent light-emitting devices of other colors. It should be noted that due to the specific nature of the aforementioned process sequence, during the wet etching process, since the first electrode is no longer covered by the light-emitting functional layer, the etching solution will etch the surface of the first electrode to a certain extent during the etching of the second electrode. As a result, with the exception of the light-emitting devices formed in the first batch (e.g., the first type of light-emitting devices), the first electrodes of later-formed light-emitting devices (e.g., the second type of light-emitting devices) undergo more wet etching processes and are etched to a greater extent. This results in different thicknesses of at least the portion of the first electrode corresponding to the isolation opening in light-emitting devices of different light-emitting colors.

[0024] In a specific embodiment of the third aspect of the present disclosure, the plurality of light-emitting devices further include a third type of light-emitting device, and the first, second, and third type of light-emitting devices each emit light of different colors. The thickness of the first portion of the first electrode of the first type of light-emitting device is greater than the thickness of the first portion of the first electrode of the second type of light-emitting device. The thickness of the first portion of the first electrode of the second type of light-emitting device is greater than the thickness of the first portion of the first electrode of the third type of light-emitting device. In a corresponding manufacturing process for the display panel, after manufacturing the first type of light-emitting device, no impurities remain in the isolation openings corresponding to the second type of light-emitting device (at this time, the second type of light-emitting device has not yet been formed), thereby ensuring the manufacturing quality of the second type of light-emitting device. During this process, the surfaces of the first electrodes of the second and third type of light-emitting devices are partially etched. Similarly, after manufacturing the second type of light-emitting device, no impurities remain in the isolation openings corresponding to the third type of light-emitting device (at this time, the third type of light-emitting device has not yet been formed), thereby ensuring the manufacturing quality of the third type of light-emitting device. During this process, the surfaces of the first electrodes of the third type of light-emitting device are again partially etched.

[0025] In a specific embodiment of the third aspect of the present disclosure, the display panel may further include a pixel defining layer, which is located between the isolation structure and the substrate and includes pixel openings corresponding to the isolation openings respectively, the pixel openings are connected to the corresponding isolation openings, at least part of the light-emitting functional layer and at least part of the second electrode of the light-emitting device are located in the corresponding pixel openings, and the orthographic projection of the pixel opening on the substrate overlaps with the orthographic projection of the first part on the substrate.

[0026] Optionally, an orthographic projection of the pixel opening on the substrate coincides with an orthographic projection of the first portion on the substrate.

[0027] Optionally, the pixel defining layer is an inorganic film layer. In the process of manufacturing a light-emitting device based on an isolation structure, the pixel defining layer does not need to be thick enough to accommodate the light-emitting device, thereby facilitating a thinner and lighter design of the display panel. The thickness of the inorganic film layer is significantly reduced compared to the thickness of the organic film layer, thereby meeting the thickness requirement of the pixel defining layer for light-emitting devices manufactured based on the isolation structure. In addition, as an inorganic film layer, the pixel defining layer can have a high bonding strength with the isolation structure and the first electrode, thereby reducing the risk of the isolation structure and the first electrode falling off. In addition, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the packaging effect of the display panel.

[0028] In a specific embodiment of the third aspect of the present disclosure, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, and the thickness of the first portion exposed by the pixel opening in the first electrode of the light-emitting device with different light output colors is different.

[0029] In a specific embodiment of the third aspect of the present disclosure, for the second type of light-emitting device, a surface of the first electrode opposite to the substrate has a groove, and an orthographic projection of the groove on the substrate coincides with an orthographic projection of the pixel opening on the substrate. For the first type of light-emitting device, a surface of the first electrode opposite to the substrate is flat in a light-emitting region of the first type of light-emitting device, and an orthographic projection of the light-emitting region on the substrate coincides with an orthographic projection of the pixel opening on the substrate.

[0030] Optionally, for the third type of light-emitting device, a surface of the first electrode opposite to the substrate has a groove, and an orthographic projection of the groove on the substrate coincides with an orthographic projection of the pixel opening on the substrate.

[0031] Optionally, the depth of the groove of the first electrode of the second type light-emitting device is less than the depth of the groove of the first electrode of the third type light-emitting device. The first electrode includes a first film layer, a second film layer, and a third film layer stacked sequentially in a direction away from the substrate. The thickness of the third film layer of the first portion of the first electrode of the first type light-emitting device is greater than the thickness of the third film layer of the first portion of the first electrode of the second type light-emitting device. The thickness of the third film layer of the first portion of the first electrode of the second type light-emitting device is greater than the thickness of the third film layer of the first portion of the first electrode of the third type light-emitting device.

[0032] Optionally, the first film layer includes an indium tin oxide film, the second film layer includes silver, and the third film layer includes an indium tin oxide film.

[0033] In one specific embodiment of the third aspect of the present disclosure, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the first electrode on the substrate. The edge portion (second portion) of the first electrode is covered by the pixel defining layer and is therefore not affected by wet etching. Consequently, the etched thickness of the middle portion (the first portion corresponding to the pixel opening) and edge portion of the first electrode are different.

[0034] In a specific embodiment of the third aspect of the present disclosure, in the first type of light-emitting devices, the thickness of the second portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening. In the second type of light-emitting devices and the third type of light-emitting devices, the thickness of the second portion of the first electrode covered by the pixel defining layer is greater than the thickness of the first portion of the first electrode corresponding to the pixel opening. For light-emitting devices formed in the first batch, when wet etching is performed, the light-emitting devices will be covered by the encapsulation unit and will not be affected by the wet etching. As a result, the thickness of each portion of the first electrode is the same.

[0035] In a specific embodiment of the third aspect of the present disclosure, the isolation structure includes a support portion and a crown portion, the support portion is located between the crown portion and the substrate, the orthographic projection of the end of the support portion away from the substrate on the substrate is located within the orthographic projection of the crown portion on the substrate, and the edge of the crown portion is the edge of the isolation opening. Optionally, the support portion is a conductive structure, and the second electrode is connected to the side surface of the support portion. In this way, the size of the crown portion is larger than the top size of the support portion to ensure that the isolation structure has a blocking effect on the film layer of the light-emitting device. In addition, this arrangement can limit the evaporation angle of the film layer of the light-emitting device during evaporation, so as to ensure that the second electrode can overlap with the isolation structure while reducing the overlapping area of the light-emitting functional layer and the isolation structure or avoiding the overlapping of the light-emitting functional layer and the isolation structure, thereby reducing the occurrence of horizontal current crosstalk problems.

[0036] Optionally, the isolation structure includes a bottom portion, the bottom portion being located between the support portion and the substrate, with an orthographic projection of an end of the support portion facing the substrate on the substrate being located within an orthographic projection of the bottom portion on the substrate. The bottom portion is a conductive structure, and an edge of the second electrode is connected to a portion of a surface of the bottom portion facing away from the substrate that is not covered by the support portion. The second electrode is more easily deposited on the surface area of the bottom portion facing away from the substrate than on the sidewalls of the support portion, thereby reducing impedance at the connection between the second electrode and the isolation structure.

[0037] In a specific embodiment of the third aspect of the present disclosure, the isolation opening includes a first side and a second side that are opposite to each other along a first direction, and a third side and a fourth side that are opposite to each other along a second direction. A climbing height of the edge of the second electrode on the side surface of the support portion at the location of the first side and / or the second side is greater than a climbing height of the edge of the second electrode on the side surface of the support portion at the location of the third and fourth sides; alternatively, the edge of the second electrode extends to the side surface of the support portion at the first side and / or the second side, and a gap exists between the edge of the second electrode and the support portion at the third and fourth sides. During the evaporation process of the light-emitting functional layer and the second electrode of the light-emitting device, in the direction perpendicular to the direction of movement of the evaporation source (the direction from the first side to the second side), the evaporation range of the evaporation material radiated by the evaporation source is larger (the evaporation angle is larger), causing the evaporation material to accumulate under the crown. In other words, the edges of the evaporation film layer are more likely to deposit on the side surface of the support portion at the first and second sides. Conversely, in the direction of movement of the evaporation source (the direction from the third side to the fourth side), that is, at the third and fourth sides, the edges of the evaporation film layer are less likely to deposit on the side surface of the support portion. As a result, during actual evaporation, the second electrode has difficulty covering the side surface of the light-emitting functional layer at the third and fourth sides, or the film quality of the covered portion is poor. As a result, during the stripping process, the stripping solution is more likely to intrude under the second electrode at these locations, etching the light-emitting functional layer and removing at least part of the light-emitting functional layer.

[0038] Optionally, the climbing height of the edge of the second electrode on the side surface of the support portion at the first side is greater than the climbing height of the edge of the second electrode on the side surface of the support portion at the second side; alternatively, at the first side, the edge of the second electrode extends to the side surface of the support portion, and at the second side, there is a gap between the edge of the second electrode and the support portion. If the tilt direction of the display panel and the evaporation source is controlled, the evaporation material can be evaporated to different degrees at the first side and the second side, so that the second electrode is unilaterally overlapped with the isolation structure at one of the first side and the second side, and correspondingly, the degree of overlap of the second electrode with the isolation structure at the other of the first side and the second side is limited or there is a gap. This method can ensure that there is at least one area between the second electrode and the isolation structure that is definitely overlapped and has high overlap quality, so as to ensure that there is a small impedance between the second electrode and the isolation structure.

[0039] In a specific embodiment of the third aspect of the present disclosure, at the first side edge and / or the second side edge, the edge of the light-emitting functional layer is covered by the second electrode, and at the third side edge and the fourth side edge, at least a portion of the side surface of the edge of the light-emitting functional layer is not covered by the second electrode. During the stripping process, although the second electrode is difficult to etch, at the third side edge and the fourth side edge, because the second electrode is difficult to completely cover the light-emitting functional layer below, the stripping liquid can enter from the third side edge and the fourth side edge to the bottom of the second electrode to etch the light-emitting functional layer.

[0040] In a specific embodiment of the third aspect of the present disclosure, the distance between the orthographic projections of the first side and the second side on the substrate is smaller than the distance between the orthographic projections of the third side and the fourth side on the substrate. Thus, the first side and the second side are effectively the long sides of the isolation opening. Furthermore, in conjunction with the description of the aforementioned solution, when preparing the second electrode, the evaporated material is more easily deposited on the first side and the second side, thereby resulting in a relatively small impedance between the second electrode and the isolation structure.

[0041] In a specific embodiment of the third aspect of the present disclosure, the display panel may further include a first encapsulation layer, the first encapsulation layer being located on a side of the isolation structure and the light-emitting devices, away from the substrate. The first encapsulation layer includes encapsulation units corresponding to the light-emitting devices, the encapsulation units covering the isolation openings corresponding to the light-emitting devices to encapsulate the light-emitting devices. During the batch production of light-emitting devices based on the isolation structure, the encapsulation units are produced simultaneously with the light-emitting devices, so that during the process (involving etching) of producing a subsequent batch of light-emitting devices, the light-emitting devices can protect the already produced light-emitting devices.

[0042] Optionally, the edge of the package unit extends to a side of the isolation structure away from the substrate to overlap with the isolation structure, and a portion of the edge of the package unit overlapping with the isolation structure is spaced apart from the isolation structure to form a suspended portion.

[0043] Optionally, the first encapsulation layer is an inorganic film layer.

[0044] Optionally, the packaging units corresponding to adjacent light-emitting devices with different light-emitting colors are spaced apart from each other.

[0045] A fourth aspect of the present disclosure provides a display panel, which includes a substrate and an isolation structure and a plurality of light-emitting devices located on the substrate. The isolation structure is located on the substrate and encloses a plurality of isolation openings, the light-emitting devices correspond to the isolation openings respectively, and each light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on the substrate in a direction away from the substrate, and at least part of the light-emitting functional layer and at least part of the second electrode are located in the corresponding isolation openings. The plurality of light-emitting devices include a first type of light-emitting device and a second type of light-emitting device, the light-emitting colors of the first type of light-emitting device and the second type of light-emitting device are different, the side surface of the first electrode of the first type of light-emitting device opposite to the substrate is flat in the light-emitting area of the first type of light-emitting device, and the side surface of the first electrode of the second type of light-emitting device opposite to the substrate has a groove in the light-emitting area of the second type of light-emitting device; Alternatively, the plurality of light-emitting devices include a second type of light-emitting device and a third type of light-emitting device, the light-emitting colors of the second type of light-emitting device and the third type of light-emitting device are different, the surface of the first electrode of the second type of light-emitting device opposite to the substrate has a groove in the light-emitting area of the second type of light-emitting device, and the surface of the first electrode of the third type of light-emitting device opposite to the substrate has a groove in the light-emitting area of the third type of light-emitting device; the depth of the groove of the first electrode of the second type of light-emitting device is less than the depth of the groove of the first electrode of the third type of light-emitting device.

[0046] A fifth aspect of the present disclosure provides a display device, which includes a display panel obtained by the preparation method of the first aspect or the second aspect, or the display panel of the third aspect or the fourth aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 A flowchart of a method for manufacturing a display panel provided in one embodiment of the present disclosure.

[0048] Figure 2 A schematic diagram of the planar structure of a display panel provided in one embodiment of the present disclosure.

[0049] Figure 3 for Figure 2 The diagram shows an enlarged view of a region S1 of a display panel under one design.

[0050] Figure 4A for Figure 3 The display panel is shown in a cross-sectional view along line M1-N1.

[0051] Figure 4B for Figure 4A An enlarged view of the portion of the display panel indicated by the dotted box is shown.

[0052] Figure 4C for Figure 4B An enlarged view of a portion of the structure of the S2 region of the display panel is shown.

[0053] Figure 5A for Figure 2 and Figure 3 The diagram shows a planar structure of a sub-pixel of a display panel.

[0054] Figure 5B for Figure 3 The cross-sectional view of the display panel along M2-N2 is shown, and the sub-pixels intercepted in the cross-sectional view are Figure 5A The sub-pixels shown correspond to .

[0055] Figure 5C for Figure 3 The cross-sectional view of the display panel along M1-N1 under another design is shown, and the sub-pixels intercepted in the cross-sectional view are Figure 4A Compare with the structure shown.

[0056] Figure 6 for Figure 3 The cross-section of the display panel along line M1 - N1 in another design is shown.

[0057] Figure 7 for Figure 3 The cross-section of the display panel along line M1 - N1 in another design is shown.

[0058] Figure 8 for Figure 3 The cross-section of the display panel along line M1 - N1 in another design is shown.

[0059] Figure 9A A flowchart of a method for manufacturing a display panel provided in one embodiment of the present disclosure.

[0060] Figure 9B A flowchart of a method for manufacturing a display panel provided in one embodiment of the present disclosure.

[0061] 10A to 10J An embodiment of the present disclosure provides a method for forming Figure 7 A process diagram of a method for preparing a display panel is shown.

[0062] 10-display panel; 11-display area; 12-frame area; 100-substrate; 200-light-emitting device; 210-first electrode; 210a-first portion; 210b-second portion; 2101-first film layer; 2102-second film layer; 2103-third film layer; 211-groove; 220-light-emitting functional layer; 221-first functional layer; 222-light-emitting layer; 223-second functional layer; 230-second electrode; 300-isolation structure; 301-isolation opening; 302-pixel opening; 301a-first side; 301b-second side; 301c-third side; 301d-fourth side; 310-support portion; 310a-first material layer; 320-crown; 320a-second material layer; 330-pixel defining layer; 330a-pixel defining material layer; 340-bottom; 400 - packaging structure; 410 - first packaging layer; 410a - packaging material film layer; 411 - packaging unit; 4111 - suspended portion; 420 - second packaging layer; 430 - third packaging layer; 500-photoresist pattern; 500a-filling film. DETAILED DESCRIPTION

[0063] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this specification.

[0064] In some scenarios, some functional film layers in the light-emitting device are formed by evaporation. Each light-emitting device has multiple functional film layers, and the material composition of some functional film layers (such as the light-emitting layer) in the light-emitting devices that emit different light is different. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by alignment accuracy errors, sufficient space (and a safety margin related to the alignment error) needs to be reserved between different light-emitting devices to ensure that the position of the actual light-emitting area of the light-emitting device can have a certain overlap rate with the designed position (design area). This is equivalent to compressing the design area of the light-emitting area of the light-emitting device, which not only limits the light-emitting area of the light-emitting device, but also prevents the arrangement density of the light-emitting device from being further increased, making it difficult to further improve the PPI (pixel density) of the display panel.

[0065] In the embodiment of the present disclosure, an isolation structure is provided at the gap between the light-emitting devices to separate the functional film layers of adjacent light-emitting devices. In this way, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel, without using a mask to prepare the functional film layer of each light-emitting device separately. This process does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting devices can be designed to be smaller, thereby increasing the PPI (the principle of which can be seen in the following and 10A to 10J (See the relevant description in the relevant embodiments).

[0066] In the manufacturing process of display panels equipped with isolation structures, light-emitting devices with different light colors can be produced in batches based on the isolation structure. In the manufacturing process of each batch of light-emitting devices, partial film layers of light-emitting devices of the same color are formed in one layer on the entire display panel. Then, a process such as etching is used to selectively remove a portion of these film layers to obtain the light-emitting devices that are ultimately retained. In the process of manufacturing light-emitting devices in batches based on the isolation structure, if a wet etching process is performed directly after a dry etching process, the etching residues left in the dry etching process may adversely affect the wet etching process, thereby affecting the quality of the subsequently formed light-emitting devices.

[0067] At least one embodiment of the present disclosure provides a display panel and a method for manufacturing the same, and a display device to at least solve the above technical problems, such as Figure 1 As shown, the preparation method may include the following steps S100 to S900.

[0068] S100 , providing a substrate and forming a plurality of first electrodes spaced apart from each other on the substrate.

[0069] S200 , forming an isolation structure having a plurality of isolation openings on the substrate having the first electrode formed thereon.

[0070] S300, depositing a light-emitting material film and a conductive material film, the light-emitting material film and the conductive material film cover the isolation structure and the isolation opening, wherein the portions of the light-emitting material film and the conductive material film located in the isolation opening form a light-emitting functional layer and a second electrode respectively, and the first electrode, the light-emitting functional layer and the second electrode stacked on each other form a light-emitting device.

[0071] S400 , depositing a film layer of packaging material to cover the isolation structure and the light-emitting device.

[0072] S500 , forming a photoresist layer on the packaging material film layer, and performing a patterning process on the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening, and the isolation opening covered by the photoresist pattern is a target isolation opening.

[0073] S600 , dry-etching the packaging material film layer based on the photoresist pattern, removing the portion of the packaging material film layer not covered by the photoresist pattern, and forming a packaging unit covering the target isolation opening with the remaining portion of the packaging material film layer.

[0074] S700, performing a stripping process to remove etching residues of the packaging material film layer, the photoresist pattern and at least a portion of the light-emitting functional layer in the light-emitting device not covered by the packaging unit, and retaining the second electrode in the isolation opening not covered by the packaging unit.

[0075] S800, performing wet etching to remove the second electrode not covered by the encapsulation unit, wherein, in the isolation opening not covered by the encapsulation unit, at least a portion of the surface of the first electrode facing away from the substrate is etched. The etched portion of the first electrode is a first portion, and the first portion is located in a light-emitting area of the light-emitting device.

[0076] S900, repeating the above process to form light-emitting devices and packaging units at the isolation openings where no light-emitting devices are formed, and all the packaging units form a first packaging layer, wherein the light-emitting devices formed in different batches have different light-emitting colors, and at least the portion of the first electrode corresponding to the isolation opening of the light-emitting devices with different light-emitting colors is wet-etched a different number of times to have different thicknesses.

[0077] For the preparation method of the display panel shown in the above-mentioned steps S100 to S900, if the steps are not followed and the wet etching process is directly performed after the above-mentioned dry etching process of the packaging material film layer is performed, then the etching residues existing in the packaging material film layer during the dry etching may have an adverse effect on the wet etching process, resulting in incomplete etching of the film layer structure in the isolation opening (other isolation openings other than the target isolation opening), thereby affecting the quality of the light-emitting device subsequently formed (formed in "repeating the above process").

[0078] In the above-mentioned steps S100 to S900, after the dry etching process of the packaging material film layer is performed, a stripping process is first performed to remove the exposed organic material and clean the dry etching residue, the organic material includes the residual photoresist pattern and at least a portion of the light-emitting functional layer in the light-emitting device that is not covered by the packaging unit, wherein, in the process of preparing the light-emitting device based on the isolation structure, the second electrode of the light-emitting device will not completely cover the light-emitting functional layer in some areas, so that the stripping liquid of the stripping process can etch the light-emitting functional layer. In this way, because the surface of the display panel has been cleaned by the stripping process, the process quality of the subsequent wet etching can be improved.

[0079] It should be noted that due to the aforementioned adjustment in the process sequence, during the wet etching process, since the first electrode is no longer covered by the light-emitting functional layer, the etching solution will etch the surface of the first electrode to a certain extent during the etching of the second electrode. As a result, except for the light-emitting devices formed in the first batch, the first electrodes of light-emitting devices formed later will undergo more wet etching processes and thus be etched to a greater extent. This will result in light-emitting devices with different light emission colors having different thicknesses in at least the portion corresponding to the isolation opening in the first electrode.

[0080] The display panel obtained by the preparation method of the above steps S100 to S900 includes at least a substrate, an isolation structure located on the substrate, and a plurality of light-emitting devices. The isolation structure is located on the substrate and encloses a plurality of isolation openings. The light-emitting devices correspond to the isolation openings respectively, and each light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on the substrate. The light-emitting functional layer and the second electrode are located in the corresponding isolation opening. The plurality of light-emitting devices are classified to emit light of a plurality of colors respectively, and the thickness of at least the portion corresponding to the isolation opening in the first electrode of the light-emitting devices with different light-emitting colors is different. In the preparation process of the display panel, light-emitting devices with different light-emitting colors can be prepared in batches based on the isolation structure. In the preparation process of each batch of light-emitting devices, part of the film layer of the light-emitting devices of the same color is formed as a whole layer on the entire display panel, and then a portion of these film layers is selectively removed by etching and other processes to obtain the light-emitting devices that need to be retained in the end. During the entire fabrication process of these light-emitting devices, dry etching is performed first, followed by a stripping process before the wet etching process (etching the film layer corresponding to the second electrode) to remove exposed organic material and clean the dry etching residue. This organic material includes at least a portion of the light-emitting functional layer to be etched. This stripping process cleans the surface of the display panel, thereby improving the quality of the subsequent wet etching process and ensuring the quality of subsequent light-emitting devices of other colors. It should be noted that due to the specificity of the above process sequence, during the wet etching process, because the first electrode is no longer covered by the light-emitting functional layer, the etching solution will etch the surface of the first electrode to a certain extent during the etching of the second electrode. As a result, except for the light-emitting devices formed in the first batch, the first electrodes of light-emitting devices formed later undergo more wet etching processes and are etched to a greater extent. This results in different thicknesses of at least the portions of the first electrodes corresponding to the isolation openings in light-emitting devices of different light-emitting colors.

[0081] At least a portion of the structure of the display panel obtained by the manufacturing method of steps S100 to S900 is as follows: Figures 2 to 4BThe specific process steps of the above-mentioned preparation method and the specific structure of the corresponding display panel are described below in conjunction with the accompanying drawings. In these drawings, a spatial rectangular coordinate system is established with the substrate in the display panel as a reference to more intuitively present the positional relationship of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the surface of the substrate, and the Z-axis is perpendicular to the surface of the substrate.

[0082] like Figures 2 to 4B As shown, the planar area of the display panel 10 can be divided into a display area 11 and a border area 12 surrounding the display area 11. Sub-pixels (which may be called sub-pixels, etc.) can be arranged in the display area 11, such as P1, P2, and P3 sub-pixels. The physical structure of the sub-pixels can be the light-emitting devices in the following embodiments. Adjacent sub-pixels with different colors of emitted light constitute a pixel (which may be called a pixel unit, a large pixel, etc.). The arrangement density of the pixels in the display area 11 represents the pixel density PPI.

[0083] The physical structure of the display panel 10 may include a substrate 100, an isolation structure 300 located on the substrate 100, and a plurality of light-emitting devices 200. The isolation structure 300 is located on the substrate 100 and encloses a plurality of isolation openings 301. The light-emitting devices 200 correspond to the isolation openings 301, respectively. Each light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 stacked sequentially on the substrate 100 and in a direction away from the substrate 100. At least a portion of the light-emitting functional layer 220 and at least a portion of the second electrode 230 are located in the corresponding isolation opening 301. The first electrode 210 includes a first portion, which is located in the light-emitting region of the light-emitting device 200. These light emitting devices 200 are classified as emitting light of multiple colors respectively. The thickness of at least the portion of the first electrode 210 corresponding to the isolation opening 301 of the light emitting devices 200 with different light emitting colors is different. For example, these light emitting devices include a first type of light emitting device P1 and a second type of light emitting device P2. The light emitting colors of the first type of light emitting device P1 and the second type of light emitting device P2 are different. The thickness of the first portion of the first electrode 210 of the first type of light emitting device P1 and the first portion of the first electrode 210 of the second type of light emitting device P2 are different. The principle of the different thicknesses of the first electrode 210 can be referred to below. 10A to 10J The relevant descriptions in the relevant embodiments are not repeated here.

[0084] For example, the light-emitting functional layer 220 may include at least one first functional layer 221, at least one light-emitting layer 222, and at least one second functional layer 223 sequentially stacked on the first electrode 210. The first functional layer 221 includes at least one hole-type film layer, such as at least one of a hole injection layer and a hole transport layer, and the second functional layer 223 may include at least one electron-type film layer, such as an electron injection layer, an electron transport layer, etc. For example, the first functional layer 221 may further include an electron blocking layer, and the second functional layer 223 may further include a hole blocking layer, etc.

[0085] For example, the first electrode 210 may be an anode, and the second electrode 230 may be a cathode.

[0086] It should be noted that the positions of the first functional layer 221 and the second functional layer 223 can be interchanged. In this case, the first electrode 210 is a cathode and the second electrode 230 is an anode.

[0087] In the embodiments of the present disclosure, there is no restriction on the number and types of colors of light emitted by the light emitting device, and the colors can be selected according to actual design requirements.

[0088] In at least one embodiment of the present disclosure, Figures 2 to 4BAs shown, the light-emitting devices 200 are classified as emitting three colors of light. That is, the display panel includes a first type of light-emitting device P1, a second type of light-emitting device P2, and a third type of light-emitting device P3. The light-emitting colors of the first type of light-emitting device P1, the second type of light-emitting device P2, and the third type of light-emitting device P3 are different. For example, the first type of light-emitting device P1, the second type of light-emitting device P2, and the third type of light-emitting device P3 are configured to be prepared sequentially. In this way, the thickness of the first portion 210a of the first electrode 210 of the first type of light-emitting device P1 corresponding to the isolation opening 301 is greater than the thickness of the first portion 210a of the first electrode 210 of the second type of light-emitting device P2 corresponding to the isolation opening 301. The thickness of the first portion 210a of the first electrode 210 of the second type of light-emitting device P2 corresponding to the isolation opening 301 is greater than the thickness of the first portion 210a of the first electrode 210 of the third type of light-emitting device P3 corresponding to the isolation opening 301. In the preparation process corresponding to the display panel, the first type of light-emitting device P1, the second type of light-emitting device P2 and the third type of light-emitting device P3 are prepared in batches in sequence. After the preparation of the first type of light-emitting device P1, no impurities will remain in the isolation opening 301 corresponding to the second type of light-emitting device P2 (the second type of light-emitting device P2 has not yet been formed at this time), thereby ensuring the preparation quality of the second type of light-emitting device P2. During this process, the surfaces of the first electrodes 210 of the second type of light-emitting device P2 and the third type of light-emitting device P3 are partially etched; similarly, after the preparation of the second type of light-emitting device P2, no impurities will remain in the isolation opening 301 corresponding to the third type of light-emitting device P3 (the third type of light-emitting device P3 has not yet been formed at this time), thereby ensuring the preparation quality of the third type of light-emitting device P3. During this process, the surface of the first electrode 210 of the third type of light-emitting device P3 (the area where the first part 210a is located) is partially etched again.

[0089] In at least one embodiment of the present disclosure, the first type light emitting device P1, the second type light emitting device P2 and the third type light emitting device P3 can respectively (in no particular order) emit red light, green light and blue light.

[0090] It should be noted that in the embodiments of the present disclosure, for the first electrode whose surface is etched, only the partial area exposed during wet etching in the surface area of the first electrode can be etched. If a partial area of the first electrode, such as the edge part, is covered by a protective film layer, the area will not be etched and the original thickness of the position will be restored.

[0091] In at least one embodiment of the present disclosure, Figure 4A and Figure 4BAs shown, the display panel may further include a pixel defining layer 330, which is located between the isolation structure 300 and the substrate 100. Alternatively, the pixel defining layer 330 may be provided with a clearance opening, with the isolation structure 300 located in the clearance opening. The pixel defining layer 330 may include pixel openings 302 corresponding to the isolation openings 301, respectively. The pixel openings 302 are connected to the corresponding isolation openings 301, and the light-emitting functional layer 220 and the second electrode 230 of the light-emitting device 200 are located in the corresponding isolation openings 301. When the pixel defining layer 330 is provided in the display panel, the first electrode 210 of the light-emitting device 200 can be designed to have a larger area to avoid positional offset (error caused by process accuracy) between the first electrode 210 and the isolation structure 300 during actual processing, which may make it difficult to ensure the actual light-emitting area of the light-emitting device. This thereby improves the aperture ratio (related to the light-emitting area of the light-emitting device) and brightness of the displayed image of the display panel. For example, when the pixel defining layer 330 is not provided, in order to avoid the first electrode 210 from being connected to the isolation structure 300, the design area of the first electrode 210 is limited. If the position of the first electrode 210 is offset, the light-emitting area of the light-emitting device may be smaller than the design area (the light-emitting area expected during the design), thereby reducing the brightness of the light-emitting device.

[0092] In at least one embodiment of the present disclosure, the pixel defining layer 330 is an inorganic film layer. In the process of preparing the light-emitting device 200 based on the isolation structure 300, the pixel defining layer 330 does not need to be thick enough to accommodate the light-emitting device 200, which is conducive to the lightweight design of the display panel. The thickness of the inorganic film layer is greatly reduced compared to the thickness of the organic film layer, thereby meeting the thickness requirement of the pixel defining layer 330 for preparing the light-emitting device 200 based on the isolation structure 300. In addition, as an inorganic film layer, the pixel defining layer 330 can have a high bonding strength with the isolation structure 300 and the first electrode 210, thereby reducing the risk of the isolation structure 300 and the first electrode 210 falling off. In addition, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the packaging effect of the display panel.

[0093] In at least one embodiment of the present disclosure, Figure 4A and Figure 4BAs shown, the orthographic projection of the pixel opening 302 on the substrate 100 is within the orthographic projection of the corresponding isolation opening 301 on the substrate 100. The thickness of the portion of the first electrode 210 corresponding to the pixel opening 302 (the first portion 210a) of the light-emitting devices 200 with different light emission colors is different. When a pixel defining layer 330 is provided, the pixel opening 302 defines the area of the first electrode 210 exposed during the wet etching process. Therefore, the pixel opening 302 can define the area of reduced thickness in the first electrode 210 of the light-emitting device 200 (the area where the first portion 210a is located). For example, for the same light-emitting device, the orthographic projection of the corresponding pixel opening 302 on the substrate 100 coincides with the orthographic projection of the corresponding light-emitting area on the substrate 100, i.e., they have the same size and shape.

[0094] In at least one embodiment of the present disclosure, Figures 4A to 4C As shown, the orthographic projection of the pixel opening 302 on the substrate 100 lies within the orthographic projection of the first electrode 210 on the substrate 100. The first electrode 210 includes a second portion 210b, which is covered by the pixel-defining layer 330 and thus protected from wet etching. Consequently, the thickness H1 of the etched center portion of the first electrode 210 (the first portion 210a corresponding to the pixel opening 302) is less than the thickness H2 of the edge portion (the second portion 210b). For example, for light-emitting devices 200 not manufactured in the first batch (the second type light-emitting device P2 and the third type light-emitting device P3), the first electrode 210 has a groove 211 on the side opposite the substrate 100. The orthographic projection of the groove 211 on the substrate 100 coincides with the orthographic projection of the pixel opening 302 on the substrate 100. For the first type of light emitting device P1, the surface of the first electrode 210 opposite to the substrate 100 is a plane in the light emitting area of the first type of light emitting device P1, and the orthographic projection of the light emitting area on the substrate 100 coincides with the orthographic projection of the pixel opening on the substrate 100.

[0095] In at least one embodiment of the present disclosure, Figures 4A to 4CAs shown, the depth of the groove 211 of the first electrode 210 of the second-type light-emitting device P2 is less than the depth of the groove 211 of the first electrode 210 of the third-type light-emitting device P3. For example, the thickness of the first portion 210a of the first electrode 210 of the second-type light-emitting device P2 is greater than the thickness of the first portion 210a of the first electrode 210 of the third-type light-emitting device P3. The first electrode 210 includes a first film layer 2101, a second film layer 2102, and a third film layer 2103 stacked in sequence in a direction away from the substrate 100. The thickness of the third film layer 2103 of the first portion 210a of the first electrode 210 of the first-type light-emitting device P1 is greater than the thickness of the third film layer 2103 of the first portion 210a of the first electrode 210 of the second-type light-emitting device P2. The thickness of the third film layer 2103 of the first portion 210a of the first electrode 210 of the second-type light-emitting device P2 is greater than the thickness of the third film layer 2103 of the first portion 210a of the first electrode 210 of the third-type light-emitting device P3.

[0096] In at least one embodiment of the present disclosure, when the first electrode 210 is an anode, the third film layer 2103 may be a high-work function material, and the second film layer 2102 may be a highly reflective material to improve the light extraction efficiency of the light-emitting device 200. For example, the first film layer 2101 may include an indium tin oxide film, the second film layer 2102 may include silver, and the third film layer 2103 may include an indium tin oxide film. The second film layer 2102 is highly active and easily activated by high temperatures during the entire display panel manufacturing process, resulting in ion migration, oxidation, etc. Therefore, the second film layer 2102 can be protected by the first film layer 2101 and the third film layer 2103 on both sides.

[0097] In at least one embodiment of the present disclosure, Figure 4A and Figure 4B As shown, in the first type of light-emitting device P1, the thickness of the second portion 210b of the first electrode 210 covered by the pixel defining layer 330 is equal to the thickness of the first portion 210a of the first electrode 210 corresponding to the pixel opening 302. In the second type of light-emitting device P2 and the third type of light-emitting device P3, the thickness of the second portion 210b of the first electrode 210 covered by the pixel defining layer 330 is greater than the thickness of the first portion 210a of the first electrode 210 corresponding to the pixel opening 302. For the light-emitting devices 200 formed in the first batch (the first type of light-emitting device P1), when wet etching is performed, the light-emitting devices 200 are covered by the encapsulation unit 411 and are not affected by the wet etching. As a result, the thickness of each portion of the first electrode 210 is the same.

[0098] In at least one embodiment of the present disclosure, Figure 4A and Figure 4BAs shown, the first electrodes 210 of the first type light-emitting device P1, the second type light-emitting device P2 and the third type light-emitting device P3 can be prepared in the same layer and the same material. In this way, in the second type light-emitting device P2 and the third type light-emitting device P3, the thickness of the second part 210b of the first electrode 210 covered by the pixel defining layer 330 can be equal to the thickness of the first electrode 210 of the first type light-emitting device P1.

[0099] In the embodiments of the present disclosure, the isolation structure is not limited in its specific design, provided that it can be used to batch-fabricate light-emitting devices and isolate the film layers of each light-emitting device. The isolation structure can be designed based on actual process requirements. The specific design of the isolation structure and the relationship between the isolation structure and the light-emitting devices are described below using various embodiments.

[0100] In at least one embodiment of the present disclosure, Figure 4A and Figure 4B As shown, the isolation structure 300 includes a support portion 310 and a crown portion 320. The support portion 310 is located between the crown portion 320 and the substrate 100. The orthographic projection of the end of the support portion 310 distal from the substrate 100 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. The edge of the crown portion 320 constitutes the edge of the isolation opening 301. For example, the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. In this manner, the isolation structure 300 as a whole appears wider at the top and narrower at the bottom, ensuring that the isolation structure 300 blocks the film layer of the light-emitting device 200. Furthermore, this arrangement can limit the evaporation angle of the film layer of the light-emitting device 200 during evaporation, thereby ensuring that the second electrode 230 can overlap the isolation structure 300 while reducing the overlap area of the light-emitting functional layer 220 and the isolation structure 300, or preventing overlap of the light-emitting functional layer 220 and the isolation structure 300.

[0101] It should be noted that, for the isolation opening 301, the edge of the crown 320 is the edge of the isolation opening 301 away from the substrate 100, and the side wall of the isolation structure 300, such as the side surface of the support portion 310 and the side surface of the crown 320, together constitute the side surface of the isolation opening 301.

[0102] For example, the support portion 310 is a conductive structure, and the second electrode 230 is connected to the side surface of the support portion 310. Thus, the crown portion 320 is larger than the top of the support portion 310 to ensure that the isolation structure 300 can block the film layer of the light-emitting device 200. Furthermore, the conductive support portion 310 can connect the second electrodes 230 of each light-emitting device 200 in series to form a common electrode. Furthermore, the support portion 310 is located between the light-emitting devices 200, eliminating the need for light transmission and being unrestricted by thickness. This reduces the impedance of the common electrode, thereby alleviating the voltage drop across each second electrode 230 when the light-emitting device 200 is driven.

[0103] In at least one embodiment of the present disclosure, Figure 6 As shown, isolation structure 300 includes a bottom portion 340, which is located between support portion 310 and substrate 100. The orthographic projection of the end of support portion 310 facing substrate 100 on substrate 100 is located within the orthographic projection of bottom portion 340 on substrate 100. Bottom portion 340 is a conductive structure, and the edge of second electrode 230 is connected to the portion of the surface of bottom portion 340 facing away from substrate 100 that is not covered by support portion 310. Compared to the sidewalls of support portion 310, second electrode 230 is more easily deposited on the surface area of bottom portion 340 facing away from substrate 100, thereby reducing the impedance at the connection between second electrode 230 and isolation structure 300.

[0104] For example, the orthographic projection of the bottom portion 340 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. In this way, the isolation effect of the isolation structure 300 on the light-emitting functional layer 220 can be enhanced.

[0105] For example, the materials of the bottom 340, the support portion 310 and the crown portion 320 can be molybdenum, aluminum, and titanium, respectively. The corrosion resistance of aluminum, molybdenum, and titanium increases in sequence. When etching, the film layers formed by these materials can form the following Figure 6 Isolation structure 300 is shown.

[0106] In at least one embodiment of the present disclosure, Figures 3 to 5C As shown, the isolation opening 301 includes a first side 301a and a second side 301b that are opposite to each other along a first direction (e.g., the X-axis direction), and a third side 301c and a fourth side 301d that are opposite to each other along a second direction (e.g., the Y-axis direction). The climbing height of the edge of the second electrode 230 on the side surface of the support portion 310 at the location of the first side 301a and / or the second side 301b is greater than the climbing height of the edge of the second electrode 230 on the side surface of the support portion 310 at the location of the third side 301c and the fourth side 301d ( Figure 5B If no contact is shown, the climb height is considered to be zero); or Figure 5BAs shown, at the first side 301a and / or the second side 301b, the edge of the second electrode 230 extends to the side surface of the support portion 310, and at the third side 301c and the fourth side 301d, there is a gap between the edge of the second electrode 230 and the support portion 310. During the evaporation process of the light-emitting functional layer 220 and the second electrode 230 of the light-emitting device 200, in a direction perpendicular to the moving direction of the evaporation source (the direction from the third side 301c to the fourth side 301d, the Y-axis direction) (the direction from the first side 301a to the second side 301b, the X-axis direction), the evaporation range of the evaporation material radiated by the evaporation source is larger (the evaporation angle is larger), thereby making it easier for the evaporation material to gather below the crown 320, that is, at the first side 301a and the second side 301b, the edge of the evaporated film layer is more likely to be deposited on the side surface of the support portion 310; conversely, in the moving direction of the evaporation source (the direction from the third side 301c to the fourth side 301d), that is, at the third side 301c and the fourth side 301d, the edge of the evaporated film layer is difficult to be deposited on the side surface of the support portion 310. In this way, during actual evaporation, at the third side 301c and the fourth side 301d, it is difficult for the second electrode 230 to cover the side surface of the light-emitting functional layer 220, or the film quality of the covered part is poor, so that when the stripping process is performed, the stripping liquid can easily invade under the second electrode 230 at this position to etch the light-emitting functional layer 220, thereby removing at least part of the light-emitting functional layer 220.

[0107] In at least one embodiment of the present disclosure, the climbing height of the edge of the second electrode 230 on the side surface of the support portion 310 at the location of the first side 301a is greater than the climbing height of the edge of the second electrode 230 on the side surface of the support portion 310 at the location of the second side 301b; or, at the first side 301a, the edge of the second electrode 230 extends to the side surface of the support portion 310, and at the second side 301b, there is a gap between the edge of the second electrode 230 and the support portion 310, such as Figure 5C If the tilt direction of the display panel and the evaporation source is controlled, the evaporation material can be evaporated to different degrees at the first side 301a and the second side 301b, so that the second electrode 230 is overlapped with the isolation structure 300 on one side of the first side 301a and the second side 301b on one side. Correspondingly, the overlap degree of the second electrode 230 with the isolation structure 300 on the other side of the first side 301a and the second side 301b is limited or there is a gap. This method can ensure that at least one area between the second electrode 230 and the isolation structure 300 is overlapped and has high overlap quality, thereby ensuring low impedance between the second electrode 230 and the isolation structure 300.

[0108] In at least one embodiment of the present disclosure, Figure 4A and Figure 5B As shown, at the first side 301a and / or the second side 301b, the edge of the light-emitting functional layer 220 is covered by the second electrode 230, and at the third side 301c and the fourth side 301d, at least part of the side surface of the edge of the light-emitting functional layer 220 is not covered by the second electrode 230. During the stripping process, although the second electrode 230 is difficult to be etched, at the third side 301c and the fourth side 301d, because the second electrode 230 is difficult to completely cover the light-emitting functional layer 220 below, the stripping liquid can enter from the third side 301c and the fourth side 301d under the second electrode 230 to etch the light-emitting functional layer 220.

[0109] In at least one embodiment of the present disclosure, Figure 5A As shown, the distance T1 between the orthographic projections of the first side 301a and the second side 301b on the substrate 100 is less than the distance T2 between the orthographic projections of the third side 301c and the fourth side 301d on the substrate 100. For example, the lengths of the first side 301a and the second side 301b are greater than the lengths of the third side 301c and the fourth side 301d. As such, the first side 301a and the second side 301b are effectively the long sides of the isolation opening 301. During vapor deposition of the light-emitting functional layer 220 of the light-emitting device 200, the length direction of the evaporation source (e.g., a linear evaporation source) can be parallel to the direction from the first side 302a to the second side 302b. That is, the scanning direction of the evaporation source is perpendicular to this direction. When forming the second electrode 230, the evaporated material is more easily deposited on the first side 301a and the second side 301b, thereby resulting in relatively low impedance between the second electrode 230 and the isolation structure 300.

[0110] In at least one embodiment of the present disclosure, Figure 7 As shown, the display panel may further include a first encapsulation layer 410, which is located on a side of the isolation structure 300 and the light-emitting device 200 away from the substrate 100. The first encapsulation layer 410 includes encapsulation units 411 corresponding to the light-emitting devices 200, respectively. The encapsulation units 411 cover the isolation openings 301 corresponding to the light-emitting devices 200 to encapsulate the light-emitting devices 200. During the process of preparing the light-emitting devices 200 in batches based on the isolation structure 300, the encapsulation units 411 are prepared in batches synchronously with the light-emitting devices 200. Therefore, during the process of preparing a subsequent batch of light-emitting devices 200 (including etching), the light-emitting devices 200 can protect the already prepared light-emitting devices 200.

[0111] In the case where the light emitting devices 200 are divided into multiple types emitting light of different colors, the light emitting devices 200 emitting different lights are manufactured independently, but the film layer (evaporated film layer such as light emitting functional layer, etc.) in each light emitting device 200 is evaporated on the entire surface of the display panel during evaporation. Figure 3 As shown, the light-emitting devices P1, P2, and P3 are prepared in sequence as an example. When preparing the light-emitting device P1, a light-emitting device P1 is formed in each isolation opening 301. A first encapsulation layer 410 is prepared on the display panel to cover the light-emitting device P2. Then, the first encapsulation layer 410 in part of the isolation openings 301 (used to form the light-emitting devices P2 and P3 in the final product) and the second electrode and the light-emitting functional layer of the light-emitting device P1 are removed to obtain an encapsulation unit 411. During this process, the encapsulation unit 411 is used to protect the light-emitting devices P1 in other isolation openings 301. Based on this method, the light-emitting devices P2 and P3 are prepared in sequence, and finally a light-emitting device as shown in FIG. Figure 7 The first encapsulation layer 410 shown, that is, the first encapsulation layer 410 on the entire display panel is prepared by multiple processes. The process can be seen below. 10A to 10J The relevant descriptions in the relevant embodiments are not repeated here.

[0112] In at least one embodiment of the present disclosure, the edge of the packaging unit 411 extends to the side of the isolation structure 300 away from the substrate 100 to overlap with the isolation structure 300. The portion of the edge of the packaging unit 411 that overlaps with the isolation structure 300 is separated from the isolation structure 300 to form a suspended portion 4111. In the above-mentioned process for forming the light-emitting device, because the film layers used to form the structure of the light-emitting device 200 are separated by the isolation structure 300, these film layers are evaporated on the display panel in their entirety, that is, these film layers cover the isolation structure 300. In the etching process for forming the packaging unit 411, the etching material etches the portion of the film layer covering the isolation structure 300, thereby causing the edge portion of the packaging unit 411 to be suspended, thereby forming the suspended portion 4111.

[0113] In at least one embodiment of the present disclosure, the first encapsulation layer 410 is an inorganic film layer.

[0114] In at least one embodiment of the present disclosure, the packaging units 411 corresponding to adjacent light-emitting devices 200 with different light-emitting colors are spaced or overlapped with each other (the figure shows the spacing). This structure is related to the process of preparing the light-emitting device 200 based on the isolation structure 300. For details, please refer to the following. 10A to 10J The relevant descriptions in the relevant embodiments are not repeated here.

[0115] In at least one embodiment of the present disclosure, Figure 8As shown, the display panel further includes a second encapsulation layer 420 and a third encapsulation layer 430 covering the first encapsulation layer 410. The second encapsulation layer 420 is located between the first encapsulation layer 410 and the third encapsulation layer 430, and the third encapsulation layer 430 is located on the side of the second encapsulation layer 420 facing away from the substrate 100. The first encapsulation layer 410, the second encapsulation layer 420, and the third encapsulation layer 430 constitute the encapsulation structure 400. Optionally, the second encapsulation layer 420 is a planarization layer. For example, the second encapsulation layer 420 is an organic film layer, and the third encapsulation layer 430 is an inorganic film layer. For example, the second encapsulation layer 420 and the third encapsulation layer 430 are continuous film layers. The second encapsulation layer 420 can improve the flatness of the display panel surface, so as to facilitate the arrangement of other components on the encapsulation layer; in addition, the second encapsulation layer 420 can have a certain degree of flexibility to relieve the stress of the first encapsulation layer 410 and the third encapsulation layer 430, thereby improving the reliability of the display panel and being more conducive to the application of the display panel in the field of flexible displays; in addition, the third encapsulation layer 430 has high density and has a high barrier effect against water, oxygen, etc., and the third encapsulation layer 430 has higher strength, so as to facilitate the preparation of other components thereon (such as structures related to touch functions, optical film layers, etc.).

[0116] At least one embodiment of the present disclosure provides a display panel that can be re-referenced Figures 1 to 3 、 Figures 4A to 4C The display panel includes a substrate 100, an isolation structure 300 located on the substrate 100, and a plurality of light-emitting devices 200. The isolation structure 300 is located on the substrate 100 and encloses a plurality of isolation openings. The light-emitting devices 200 correspond to the isolation openings, and each light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 stacked sequentially on the substrate 100 and away from the substrate 100. At least a portion of the light-emitting functional layer 220 and at least a portion of the second electrode 230 are located in the corresponding isolation opening. The plurality of light-emitting devices 200 include a first type of light-emitting device P1 and a second type of light-emitting device P2. The first type of light-emitting device P1 and the second type of light-emitting device P2 emit different colors of light. The surface of the first electrode 210 of the first type of light-emitting device P1, facing away from the substrate 100, is flat in the light-emitting region of the first type of light-emitting device P1. The surface of the first electrode 210 of the second type of light-emitting device P2, facing away from the substrate 100, has a groove in the light-emitting region of the second type of light-emitting device P2. The structure of this display panel, the technical problems it solves, and potential further improvements can be found in the relevant descriptions of the aforementioned embodiments and are not further elaborated here. This embodiment can be combined with some or all of the features of the aforementioned embodiments and is not further elaborated here. For example, the first type of light-emitting device P1 is manufactured before the second type of light-emitting device P2. For example, the isolation opening corresponding to the first type of light-emitting device P1 and the isolation opening corresponding to the second type of light-emitting device P2 can be manufactured simultaneously.

[0117] At least one embodiment of the present disclosure provides a display panel that can be re-referenced Figures 1 to 3 、 Figures 4A to 4C The display panel includes a substrate 100, an isolation structure 300 located on the substrate 100, and a plurality of light-emitting devices 200. The isolation structure 300 is located on the substrate 100 and encloses a plurality of isolation openings. The light-emitting devices 200 correspond to the isolation openings, and each light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 sequentially stacked on the substrate 100 and in a direction away from the substrate 100. At least a portion of the light-emitting functional layer 220 and at least a portion of the second electrode 230 are located in the corresponding isolation opening. The multiple light-emitting devices 200 include second-type light-emitting devices P2 and third-type light-emitting devices P3. The second-type light-emitting devices P2 and the third-type light-emitting devices P3 emit different colors of light. The first electrode 210 of the third-type light-emitting device P3 has a groove on the surface opposite the substrate 100 in the light-emitting area of the third-type light-emitting device P3. The first electrode 210 of the second-type light-emitting device P2 has a groove on the surface opposite the substrate 100 in the light-emitting area of the second-type light-emitting device P2. The depth of the groove of the first electrode 210 of the second-type light-emitting device P2 is less than the depth of the groove of the first electrode 210 of the third-type light-emitting device P3. The structure of this display panel, the technical problems it solves, and potential improvements can be found in the relevant descriptions of the aforementioned embodiments and are not further elaborated here. This embodiment may combine some or all of the features of the aforementioned embodiments and is not further elaborated here. For example, the second-type light-emitting device P2 may be fabricated before the third-type light-emitting device P3. For example, the isolation opening corresponding to the second-type light-emitting device P2 and the isolation opening corresponding to the third-type light-emitting device P3 may be fabricated simultaneously.

[0118] For example, first make the isolation openings corresponding to the first type light emitting device P1 and the isolation openings corresponding to the second type light emitting device P2, then make the first type light emitting device P1, then make the second type light emitting device P2, and then make the third type light emitting device P3.

[0119] The above embodiments have described the specific structural design of the display panel. Now, the manufacturing process of the display panel will be described with respect to the different design structures provided in the above embodiments, as follows.

[0120] In at least one embodiment of the present disclosure, Figure 9A As shown, the method for preparing a display panel may further include the following steps S101 and S102.

[0121] S101 , after forming the first electrode and before forming the isolation structure, forming a pixel definition material layer covering the first electrode on the substrate.

[0122] S102: After forming the isolation structure, patterning the pixel defining material layer to form a pixel defining layer. The pixel defining layer is positioned between the isolation structure and the substrate and has a plurality of pixel openings formed therein. The pixel openings correspond to and communicate with the isolation openings. After forming the light-emitting functional layer and the second electrode, the light-emitting functional layer and the second electrode of the light-emitting device are positioned within the corresponding isolation openings and pixel openings.

[0123] Regarding the specific structure of the display panel with the pixel defining layer formed in the above steps, reference may be made to the relevant description in the above embodiments, which will not be elaborated here.

[0124] In at least one embodiment of the present disclosure, in the light-emitting devices formed in the first batch, the thickness of the portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening. In the light-emitting devices not formed in the first batch, the thickness of the portion of the first electrode covered by the pixel defining layer is greater than the thickness of the first portion of the first electrode corresponding to the pixel opening. For the light-emitting devices formed in the first batch, when facing wet etching, the light-emitting devices will be covered by the packaging unit and will not be affected by the wet etching. In this way, the thickness of each portion of the first electrode is the same. Regarding the factors concerning the relationship between the positions of the portions of different thicknesses of the pixel defining layer and the first electrode in the display panel, please refer to the relevant description in the aforementioned embodiments and will not be elaborated here.

[0125] In an embodiment of the present disclosure, step S300 may include: relative movement of the evaporation source and the display panel along the second direction to evaporate a light-emitting material film and a conductive material film, so that after forming the light-emitting functional layer and the second electrode, the edge of the light-emitting functional layer is covered by the second electrode at the first side and / or the second side, and at least a portion of the side surface of the edge of the light-emitting functional layer is not covered by the second electrode at the third side and the fourth side. In this way, in the direction perpendicular to the movement direction of the evaporation source (the direction from the first side to the second side), the evaporation range of the evaporation material radiated by the evaporation source is larger (the evaporation angle is larger), thereby making it easier for the evaporation material to accumulate below the crown portion, that is, the edge of the evaporated film layer is more likely to be deposited on the side surface of the support portion at the first and second sides. Conversely, in the movement direction of the evaporation source (the direction from the third side to the fourth side), that is, at the third side and the fourth side, the edge of the evaporated film layer is less likely to be deposited on the side surface of the support portion. As such, during actual evaporation, the second electrode may have difficulty covering the side surface of the light-emitting functional layer at the third and fourth sides, or the film quality of the covered portion may be poor. Consequently, during the stripping process, the stripping liquid may easily intrude beneath the second electrode at these locations, etching the light-emitting functional layer and removing at least a portion of the light-emitting functional layer. The structure of the display panel corresponding to this manufacturing method can be found in the relevant description of the aforementioned embodiments and will not be elaborated upon here.

[0126] In an embodiment of the present disclosure, step S700 may include: in the isolation opening of the uncovered packaging unit, the stripping liquid used in the stripping process enters between the second electrode and the first electrode at least from the third side and the fourth side to remove the light-emitting functional layer, wherein, after at least a portion of the light-emitting functional layer is removed, at least a portion of the second electrode sinks on the first electrode. In the stripping process, the second electrode is difficult to etch, and the light-emitting functional layer under the second electrode will be etched and removed, so the second electrode will directly sink and contact the first electrode. In this way, in the subsequent wet etching process of the second electrode, in order to ensure that the second electrode is completely etched, it is inevitable to etch the surface of the first electrode. The structure of the display panel corresponding to this preparation method can be referred to the relevant description in the aforementioned embodiment, and will not be repeated here.

[0127] In at least some embodiments of the present disclosure, after the second electrode is wet-etched, step S300 may be continued to prepare a new light-emitting device.

[0128] In at least some embodiments of the present disclosure, before performing step S900, the manufacturing method may further include: performing a stripping process to remove etching residues in the isolation opening after performing wet etching to remove the second electrode not covered by the encapsulation unit. In this way, any residues that may be present in the isolation opening after the wet etching process can be further removed to ensure the quality of the light-emitting device formed in subsequent processes.

[0129] At least one embodiment of the present disclosure provides a method for manufacturing a display panel, such as Figure 9B As shown, the preparation method may include the following steps S100a to S900a.

[0130] S100a, providing a substrate and forming a plurality of first electrodes spaced apart from each other on the substrate.

[0131] S200a, forming an isolation structure having a plurality of isolation openings on the substrate having the first electrode formed thereon.

[0132] S300a, the plurality of isolation openings include a first isolation opening and a second isolation opening.

[0133] S400a, depositing a light-emitting material film, a conductive material film, and an encapsulation material film layer, the portions of the light-emitting material film and the conductive material film located in the first isolation opening respectively form a light-emitting functional layer and a second electrode, and the first electrode, the light-emitting functional layer and the second electrode stacked on each other form a first type of light-emitting device.

[0134] S500a, forming a photoresist layer on the packaging material film layer, and performing a patterning process on the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers the first isolation opening and exposes the second isolation opening.

[0135] S600a, dry-etching the packaging material film layer based on the photoresist pattern to remove the packaging material film layer at the second isolation opening and retaining the packaging material film layer at the first isolation opening.

[0136] S700a, performing a stripping process to remove the photoresist pattern, etching residues of the packaging material film layer at the second isolation opening, and at least a portion of the light-emitting material film at the second isolation opening, while retaining the second electrode at the second isolation opening.

[0137] S800a, performing wet etching to remove the conductive material film at the second isolation opening, wherein at least a portion of the surface of the first electrode at the second isolation opening facing away from the substrate is etched.

[0138] S900a, forming at least a portion of a film layer of a second type of light-emitting device at the second isolation opening.

[0139] The structure of the display panel obtained by the method for manufacturing the display panel shown in steps S100 to S900, the technical problems solved, and the possible further improvements can be found in the relevant descriptions of the above embodiments and will not be repeated here. This embodiment can be combined with some or all of the features of the above embodiments and will not be repeated here.

[0140] Below, as 10A to 10J As shown, Figure 7 Taking the display panel shown as an example, the method for preparing the display panel is exemplarily described.

[0141] like Figure 10A As shown, a substrate 100 is provided and first electrodes 210 arranged in an array are formed on the substrate 100 .

[0142] like Figure 10B As shown, a pixel defining material layer 330 a is formed on the substrate 100 on which the first electrode 210 is formed.

[0143] like Figure 10C As shown, a first material layer 310 a and a second material layer 320 a are formed on the pixel defining material layer 330 a .

[0144] For example, the material of the first material layer 310 a may be aluminum, and the material of the second material layer 320 a may be titanium.

[0145] like Figure 10D As shown, the first material layer 310a and the second material layer 320a are patterned to form the first material layer 310a into the support portion 310 and the second material layer 320a into the crown portion 320. The support portion 310 and the crown portion 320 define the isolation opening 301 and form at least a portion of the isolation structure 300.

[0146] In embodiments of the present disclosure, the patterning process may be a photolithography patterning process, which may include, for example, coating a structural layer to be patterned with photoresist, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (e.g., the photoresist pattern described below) includes photoresist, the structural layer may be directly exposed through a mask to form the desired pattern.

[0147] It should be noted that if the corrosion resistance of the second material layer 320a (such as titanium) is greater than that of the first material layer 310a (such as aluminum), the etching rate of the first material layer 310a will be greater than the etching rate of the second material layer 320a, so that the width of the crown portion 320 will be greater than the width of the support portion 310, so as to form the following: Figure 10DThe structure shown.

[0148] like Figure 10E As shown, the pixel defining material layer 330a is patterned based on the isolation structure 300 to form a pixel defining layer 330, and the pixel defining layer 330 covers the gap between the adjacent first electrodes 210. In this way, the pixel defining layer 330 forms a pixel opening corresponding to the isolation opening 301, so that the planar shape of the pixel defining layer 330 is a grid.

[0149] like Figure 10F As shown, a light-emitting material film and a conductive material film are evaporated on the substrate 100 to form a light-emitting functional layer 220 and a second electrode 230 in each isolation opening 301 of the isolation structure 300. The first electrode 210, the light-emitting functional layer 220 and the second electrode 230 stacked on each other at the isolation opening 301 form the light-emitting device 200. No mask plate is used in the evaporation process, so the evaporated material will also be deposited on the crown 320. It should be noted that in the actual process, the evaporated material will be deposited on the upper surface of the crown 320 away from the substrate 100 and the side wall (not shown in the figure) to form a filling film 500a; then, a packaging material film layer 410a is deposited to cover the light-emitting device 200 and the isolation structure 300.

[0150] For example, the light-emitting layer in the evaporated light-emitting functional layer 220 can emit light of a color corresponding to the first type light-emitting device P1 , that is, at this stage, a first type light-emitting device P1 is formed in each isolation opening 301 of the isolation structure 300 .

[0151] like Figure 10G As shown, a photoresist is formed (eg, coated) on the substrate 100 on which the packaging material film layer 410 a is formed, and then patterned to form a photoresist pattern 500 . The photoresist pattern 500 only covers a portion of the isolation opening 301 (set as the target isolation opening) of the isolation structure 300 .

[0152] like Figure 10H As shown, the surface of the display panel is dry-etched using the photoresist pattern 500 as a mask to remove the portion of the packaging material film layer 410a not covered by the photoresist pattern 500. The remaining portion of the packaging material film layer 410a forms the packaging unit of the first packaging layer 410. During this process, the packaging unit of the target isolation opening will not be etched because it is protected by the photoresist pattern 500.

[0153] like Figure 10IAs shown, a stripping process is performed, and a stripping solution removes the exposed organic material. Specifically, this process removes the remaining photoresist pattern 500, the filling film 500a between the encapsulation unit and the isolation structure 300, and the light-emitting functional layer 220 in the isolation opening 301 that does not cover the encapsulation unit. The principle of the stripping solution passing over the second electrode 230 to etch the underlying light-emitting functional layer 220 in this process can be found in the relevant description of the previous embodiment and is not repeated here.

[0154] In such Figure 10I After the illustrated process is completed, in the isolation opening 301 that does not cover the encapsulation unit, the second electrode 230 falls on the first electrode 210 because the light-emitting functional layer 220 is removed.

[0155] like Figure 10J As shown, a wet etching process is performed to remove the second electrode 230 in the isolation opening 301 that does not cover the package unit. During this process, after the second electrode 230 is etched, the surface of the exposed portion of the first electrode 210 (the area where the pixel opening 302 is located) is etched.

[0156] In at least one embodiment of the present disclosure, the stripping solution used in the stripping process is alkaline, and the chemical solution used in the wet etching process is acidic.

[0157] In an embodiment of the present disclosure, the material of the packaging material film layer 410a may include silicon oxide, silicon nitride, silicon oxynitride, etc. Thus, before performing the stripping process, in other isolation openings 301 (i.e., non-target isolation openings) other than the target isolation opening, at least part of the etching residues of the packaging material film layer 410a is attached to the side wall of the isolation structure 300 facing the isolation opening 301. The etching residues of the packaging material film layer 410a are acid-resistant, so an alkaline stripping solution is required to remove them, thereby ensuring the process quality of subsequent wet etching.

[0158] Optionally, the corrosion resistance of the etching residue of the packaging material film layer to the wet etching solution is greater than the corrosion resistance of the etching residue of the packaging material film layer to the stripping solution used in the stripping process. If the stripping process is performed after the wet etching process for etching the second electrode and after the dry etching of the packaging material film layer, the sidewalls of the isolation structure facing the non-target isolation opening are attached with etching residue of the packaging material film layer, which will not be removed by the wet etching solution for etching the second electrode, which will cause the sidewalls of the isolation structure facing the non-target isolation opening to be uneven, thereby affecting the overlapping effect of the isolation structure and the second electrode, and / or the packaging effect. If the stripping process is performed before the wet etching process for etching the second electrode, the sidewalls of the isolation structure facing the non-target isolation opening are attached with etching residue of the packaging material film layer, which will be removed by the stripping solution used in the stripping process to improve the smoothness of the sidewalls of the isolation structure facing the non-target isolation opening, thereby improving the overlapping effect of the isolation structure and the second electrode, and / or the packaging effect.

[0159] Repeat the above Figures 10F to 10J The steps of forming the second type light emitting device P2 and the third type light emitting device P3 in the other isolation openings 301 are performed, and forming the following steps: Figure 7 The process of forming the second type light emitting device P2 and the third type light emitting device P3 is different from that of forming the first type light emitting device P1 in that the isolation openings 301 covered by the photoresist pattern 500 are different.

[0160] At least one embodiment of the present disclosure provides a display device, which may include the display panel described in the above embodiments or the display panel obtained by the manufacturing method described in the above embodiments. For example, the display device may include a touch structure, an optical film (e.g., a microlens, a polarizer), a cover plate, and other structures disposed on the light-emitting side of the display panel.

[0161] For example, the display device may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, or a navigator.

[0162] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0163] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that: include: substrate; an isolation structure, located on the substrate and enclosing a plurality of isolation openings; as well as a plurality of light-emitting devices, each corresponding to the isolation openings, and each of the light-emitting devices comprising a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate and in a direction away from the substrate, wherein at least a portion of the light-emitting functional layer and at least a portion of the second electrode are located in the corresponding isolation opening, and the first electrode comprises a first portion, which is located in a light-emitting region of the light-emitting device; Among them, the multiple light-emitting devices include a first type of light-emitting device and a second type of light-emitting device, the light output colors of the first type of light-emitting device and the second type of light-emitting device are different, and the thicknesses of the first part of the first electrode of the first type of light-emitting device and the first part of the first electrode of the second type of light-emitting device are different.

2. The display panel according to claim 1, wherein: The plurality of light emitting devices further include a third type of light emitting device, wherein the first type of light emitting device, the second type of light emitting device and the third type of light emitting device have different light emission colors. The thickness of the first portion of the first electrode of the first type of light emitting device is greater than the thickness of the first portion of the first electrode of the second type of light emitting device, and A thickness of the first portion of the first electrode of the second type light emitting device is greater than a thickness of the first portion of the first electrode of the third type light emitting device.

3. The display panel according to claim 2, wherein: Also included is a pixel defining layer, wherein the pixel defining layer is located between the isolation structure and the substrate and includes pixel openings corresponding to the isolation openings respectively; and The pixel opening is connected to the corresponding isolation opening, at least part of the light-emitting functional layer and at least part of the second electrode of the light-emitting device are located in the corresponding pixel opening, and the orthographic projection of the pixel opening on the substrate overlaps with the orthographic projection of the first part on the substrate.

4. The display panel according to claim 3, wherein: The orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, and The thicknesses of the first portion of the first electrode of the light emitting devices with different light emission colors that is exposed by the pixel opening are different.

5. The display panel according to claim 4, wherein: For the second type of light-emitting device, a surface of the first electrode opposite to the substrate has a groove, and an orthographic projection of the groove on the substrate coincides with an orthographic projection of the pixel opening on the substrate. For the first type of light-emitting device, a surface of the first electrode opposite to the substrate is a plane in a light-emitting area of the first type of light-emitting device, and an orthographic projection of the light-emitting area on the substrate coincides with an orthographic projection of the pixel opening on the substrate; For the third type of light-emitting device, a surface of the first electrode opposite to the substrate has a groove, and an orthographic projection of the groove on the substrate coincides with an orthographic projection of the pixel opening on the substrate; The depth of the groove of the first electrode of the second type light emitting device is smaller than the depth of the groove of the first electrode of the third type light emitting device.

6. The display panel according to claim 4, wherein: The orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the first electrode on the substrate, the first electrode includes a second portion, and the second portion is covered by the pixel defining layer. In the first type of light emitting device, the thickness of the second portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening, and In the second and third light-emitting devices, a thickness of the second portion of the first electrode covered by the pixel defining layer is greater than a thickness of the first portion of the first electrode corresponding to the pixel opening.

7. The display panel according to any one of claims 1 to 6, characterized in that: The isolation structure includes a support portion and a crown portion, wherein the support portion is located between the crown portion and the base plate. The orthographic projection of the end of the support portion away from the substrate on the substrate is located within the orthographic projection of the crown portion on the substrate. The support portion is a conductive structure, and the second electrode is connected to a side surface of the support portion.

8. The display panel according to claim 7, wherein: The isolation opening includes a first side and a second side opposite to each other along a first direction, and a third side and a fourth side opposite to each other along a second direction, and A climbing height of the edge of the second electrode on the side surface of the support portion at the location of the first side edge and / or the second side edge is greater than a climbing height of the edge of the second electrode on the side surface of the support portion at the location of the third side edge and the fourth side edge; or At the first side and / or the second side, the edge of the second electrode extends to the side surface of the support portion, and at the third side and the fourth side, there is a gap between the edge of the second electrode and the support portion.

9. The display panel according to claim 8, wherein: At the first side and / or the second side, the edge of the light-emitting functional layer is covered by the second electrode, and At the third side and the fourth side, at least part of the side surface of the edge of the light-emitting functional layer is not covered by the second electrode, and the distance between the orthographic projections of the first side and the second side on the substrate is smaller than the distance between the orthographic projections of the third side and the fourth side on the substrate.

10. The display panel according to any one of claims 1 to 6, characterized in that: The device further comprises a first encapsulation layer, wherein the first encapsulation layer is located on a side of the isolation structure and the light-emitting device away from the substrate. The first encapsulation layer includes encapsulation units corresponding to the light-emitting devices, respectively. The encapsulation units cover the isolation openings corresponding to the light-emitting devices to encapsulate the light-emitting devices.

11. A display panel, characterized in that: include: substrate; an isolation structure, located on the substrate and enclosing a plurality of isolation openings; as well as a plurality of light-emitting devices, each corresponding to the isolation openings, and each of the light-emitting devices comprising a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate and in a direction away from the substrate, wherein at least a portion of the light-emitting functional layer and at least a portion of the second electrode are located in the corresponding isolation opening; The plurality of light-emitting devices include a first type of light-emitting device and a second type of light-emitting device, the first type of light-emitting device and the second type of light-emitting device have different light emission colors, the surface of the first electrode of the first type of light-emitting device opposite to the substrate is flat in the light-emitting area of the first type of light-emitting device, and the surface of the first electrode of the second type of light-emitting device opposite to the substrate has a groove in the light-emitting area of the second type of light-emitting device; Alternatively, the multiple light-emitting devices include a second type of light-emitting device and a third type of light-emitting device, the second type of light-emitting device and the third type of light-emitting device have different light emission colors, the surface of the first electrode of the second type of light-emitting device opposite to the substrate has a groove in the light-emitting area of the second type of light-emitting device, and the surface of the first electrode of the third type of light-emitting device opposite to the substrate has a groove in the light-emitting area of the third type of light-emitting device; the depth of the groove of the first electrode of the second type of light-emitting device is less than the depth of the groove of the first electrode of the third type of light-emitting device.

12. A method for preparing a display panel, characterized in that: include: providing a substrate and forming a plurality of first electrodes spaced apart from each other on the substrate; forming an isolation structure having a plurality of isolation openings on the substrate on which the first electrode is formed; Depositing a light-emitting material film and a conductive material film, wherein the light-emitting material film and the conductive material film cover the isolation structure and the isolation opening, wherein portions of the light-emitting material film and the conductive material film located in the isolation opening form a light-emitting functional layer and a second electrode, respectively, and the first electrode, the light-emitting functional layer, and the second electrode stacked on each other form a light-emitting device; Depositing a film layer of packaging material to cover the isolation structure and the light-emitting device; forming a photoresist layer on the packaging material film layer, and performing a patterning process on the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening, and the isolation opening covered by the photoresist pattern is a target isolation opening; dry-etching the packaging material film layer based on the photoresist pattern, removing a portion of the packaging material film layer not covered by the photoresist pattern, and forming a packaging unit covering the target isolation opening with a remaining portion of the packaging material film layer; Performing a stripping process to remove etching residues of the packaging material film layer, the photoresist pattern, and at least a portion of the light-emitting functional layer in the light-emitting device not covered by the packaging unit, and retaining the second electrode in the isolation opening not covered by the packaging unit; performing wet etching to remove the second electrode not covered by the encapsulation unit, wherein, in the isolation opening not covered by the encapsulation unit, at least a portion of a surface of the first electrode facing away from the substrate is etched, the etched portion of the first electrode being a first portion, and the first portion being located in a light-emitting region of the light-emitting device; and The above process is repeated to form the light-emitting device and the packaging unit at the isolation opening where the light-emitting device is not formed, and all the packaging units form a first packaging layer, wherein the light-emitting devices formed in different batches have different light-emitting colors, and at least the portion of the first electrode of the light-emitting devices with different light-emitting colors corresponding to the isolation opening is wet-etched a different number of times to have different thicknesses.

13. The preparation method according to claim 12, characterized in that The plurality of light-emitting devices include a first type of light-emitting device, a second type of light-emitting device, and a third type of light-emitting device. The light-emitting colors of the first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device are different. The first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device are prepared in batches in sequence. The surface of the first electrode of the second type of light-emitting device facing away from the substrate is wet-etched at least once, and the surface of the first electrode of the third type of light-emitting device facing away from the substrate is wet-etched at least twice, so that the thickness of the first part of the first electrode of the first type of light-emitting device is greater than the thickness of the first part of the first electrode of the second type of light-emitting device, and the thickness of the first part of the first electrode of the second type of light-emitting device is greater than the thickness of the first part of the first electrode of the third type of light-emitting device.

14. The preparation method according to claim 12 or 13, characterized in that: Also includes: After forming the first electrode and before forming the isolation structure, forming a pixel definition material layer covering the first electrode on the substrate; After forming the isolation structure, the pixel defining material layer is patterned to form a pixel defining layer, wherein the pixel defining layer is located between the isolation structure and the substrate and a plurality of pixel openings are formed in the pixel defining layer, the pixel openings correspond to the isolation openings respectively and are connected to each other, and the light-emitting functional layer and the second electrode of the light-emitting device are located in the corresponding isolation openings and the pixel openings.

15. The preparation method according to claim 14, characterized in that The orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the first electrode on the substrate. For the wet-etched first electrode, a region of the first electrode exposed by the pixel opening in a surface facing away from the substrate is etched so that portions of the first electrode corresponding to the pixel opening of the light-emitting devices that emit light of different colors have different thicknesses. In the first batch of the light-emitting devices, the thickness of the portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening; and In the light-emitting devices formed in a batch other than the first batch, a thickness of a portion of the first electrode covered by the pixel defining layer is greater than a thickness of the first portion of the first electrode corresponding to the pixel opening.

16. The preparation method according to claim 12 or 13, characterized in that: The isolation structure includes a support portion and a crown portion, wherein the support portion is located between the crown portion and the base plate. The orthographic projection of the end of the support portion away from the substrate on the substrate is located within the orthographic projection of the crown portion on the substrate, and the edge of the crown portion is the edge of the isolation opening; and The support portion is a conductive structure, and the second electrode is connected to a side surface of the support portion.

17. The preparation method according to claim 16, characterized in that The isolation opening includes a first side and a second side opposite to each other along a first direction, and a third side and a fourth side opposite to each other along a second direction, and The depositing of the light-emitting material film and the conductive material film comprises: relatively moving an evaporation source and the display panel along the second direction to evaporate the light-emitting material film and the conductive material film, so that after forming the light-emitting functional layer and the second electrode, an edge of the light-emitting functional layer at the first side and / or the second side is covered by the second electrode, and at least a portion of a side surface of the edge of the light-emitting functional layer at the third side and the fourth side is not covered by the second electrode; and The stripping process is performed to remove the etching residues of the packaging material film layer, the photoresist pattern and at least a portion of the light-emitting functional layer in the light-emitting device not covered by the packaging unit, including: in the isolation opening that does not cover the packaging unit, the stripping liquid used in the stripping process enters between the second electrode and the first electrode at least from the third side and the fourth side to remove the light-emitting functional layer, wherein after at least a portion of the light-emitting functional layer is removed, at least a portion of the second electrode sinks on the first electrode.

18. The preparation method according to claim 12 or 13, characterized in that: Also includes: After performing the wet etching to remove the second electrode not covered by the packaging unit, a stripping process is performed to remove etching residues in the isolation opening.

19. A method for preparing a display panel, characterized in that: include: providing a substrate and forming a plurality of first electrodes spaced apart from each other on the substrate; An isolation structure having a plurality of isolation openings is formed on the substrate having the first electrode formed thereon, and a light-emitting material thin film, a conductive material thin film, and an encapsulation material film layer are deposited, wherein the plurality of isolation openings include a first isolation opening and a second isolation opening, portions of the light-emitting material thin film and the conductive material thin film located in the first isolation opening form a light-emitting functional layer and a second electrode, respectively, and the first electrode, the light-emitting functional layer, and the second electrode stacked on each other form a first-type light-emitting device; forming a photoresist layer on the packaging material film layer, and performing a patterning process on the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers the first isolation opening and exposes the second isolation opening; dry-etching the packaging material film layer based on the photoresist pattern to remove the packaging material film layer at the second isolation opening and retain the packaging material film layer at the first isolation opening; Performing a stripping process to remove the photoresist pattern, etching residues of the packaging material film layer at the second isolation opening, and at least a portion of the light-emitting material film at the second isolation opening, while retaining the second electrode at the second isolation opening; Performing wet etching to remove the conductive material film at the second isolation opening, wherein at least a portion of a surface of the first electrode at the second isolation opening facing away from the substrate is etched; At least a portion of the film layer of the second type light emitting device is formed at the second isolation opening.

20. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 11 or a display panel obtained by the preparation method according to any one of claims 12 to 19.

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