Efficient electrolytic copper foil copper dissolving and liquid preparing device and using method

Abstract

The invention relates to the technical field of electrolytic copper foil processing, and discloses an efficient electrolytic copper foil copper dissolving and liquid preparing device which comprises a base and a copper dissolving tank fixed to the base and used for copper dissolving operation, a liquid storage cavity is formed in the top of the base, and a top spraying mechanism is installed at the upper end of the interior of the copper dissolving tank; a spraying column is installed in the center of the copper dissolving tank, a copper material soaking mechanism used for dissolving small copper materials is installed at the lower end of the interior of the copper dissolving tank, and an air supply structure used for providing air for reaction of electrolyte and the copper materials is arranged above the copper material soaking mechanism. And a supporting filtrate layer for filtering a high-concentration copper-containing solution is mounted at the upper end in the liquid storage cavity. The high-efficiency electrolytic copper foil copper dissolving and liquid preparing device is fully utilized, and according to the characteristics of different layers of copper materials, through different copper dissolving structures and modes, the dissolving speed of the copper materials on the lower layer can be increased after the spraying type copper dissolving tank is used for dissolving copper for a long time, so that the overall copper dissolving efficiency is improved, the manual feeding frequency is reduced, and the labor cost is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of electrolytic copper foil processing, and in particular to a high-efficiency electrolytic copper foil copper dissolving and liquid making device and a use method thereof. Background Art

[0002] The main purpose of the copper dissolution process is to convert solid copper materials into water-soluble copper ions through a chemical reaction, providing the necessary raw materials for the production of electrolytic copper foil. During the copper dissolution process, copper materials are typically reacted with sulfuric acid and oxygen from the air to produce a copper sulfate solution. The basic chemical equation involved in this process involves the reaction of copper with oxygen to form copper oxide, which then reacts with sulfuric acid to form copper sulfate and water.

[0003] After searching, the patent application number 202410541807.X discloses a device for quickly switching the copper dissolving mode of a copper dissolving tank for the production of electrolytic copper foil, including a copper dissolving tank and a low-level tank. One end of the circulation pipeline is connected to the top cover plate of the copper dissolving tank through a valve, and the other end is connected to the lower part of the copper dissolving tank through a valve. The middle section of the circulation pipeline is connected to the low-level tank through an upper liquid pipeline. The side wall of the copper dissolving tank is also pierced with a liquid inlet pipe. The end of the liquid inlet pipe located outside the copper dissolving tank is connected to the middle section of the circulation pipeline through a valve and is located above the upper liquid pipeline. The side wall of the copper dissolving tank is connected to a lower overflow pipe located below the liquid inlet pipe. The bottom of the copper dissolving tank is connected to the low-level tank through a valve with an overflow pipeline, and one end of the lower overflow pipe is connected to the overflow pipeline. This invention can quickly switch the copper dissolving mode of the copper dissolving tank between spraying and immersion by switching the valve, effectively improving production efficiency.

[0004] However, in the copper dissolution process of the single spray-type copper dissolving tank and immersion-type copper dissolving tank in the existing technology, some copper materials with relatively small area and mass will be deposited on the spray support layer after long-term use. After the lower layer solution is consumed by the upper layer, the number of acid ions in it is reduced, and the oxygen in the air in the lower layer is consumed, the dissolution reaction speed of the copper material in the lower layer will drop sharply, resulting in the inability to dissolve the copper material in the lower layer in time, thereby reducing the overall copper dissolving tank rate. Therefore, we need to propose a high-efficiency electrolytic copper foil copper dissolving liquid preparation device and use method to improve the copper material dissolution rate, reduce the number of copper material additions, and save labor costs. Summary of the Invention

[0005] The object of the present invention is to provide a high-efficiency electrolytic copper foil copper dissolving and liquid preparation device and a method for using the same, which makes full use of the high-efficiency electrolytic copper foil copper dissolving and liquid preparation device, and by targeting the characteristics of copper materials at different levels and using different copper dissolving structures and methods, can improve the dissolution rate of the lower layer of copper material after long-term use of a spray-type copper dissolving tank for copper dissolving, thereby improving the overall copper dissolving efficiency, reducing the number of manual feeding times, and saving labor costs, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a high-efficiency electrolytic copper foil copper dissolving and liquid preparation device, comprising a base, a copper dissolving tank fixed on the base and used for copper dissolving operations, a liquid storage chamber for temporarily storing a high-concentration copper-containing solution is provided on the top of the base, a top spraying mechanism is installed at the upper end of the interior of the copper dissolving tank, a spray column is installed at the center of the copper dissolving tank, the top spraying mechanism and the spray column dissolve large copper materials through the sprayed electrolyte, a copper material immersion mechanism for dissolving small copper materials is installed at the lower end of the interior of the copper dissolving tank, an air supply structure for providing air for the reaction between the electrolyte and the copper material is provided above the copper material immersion mechanism, and a supporting filtrate layer for filtering the high-concentration copper-containing solution is installed at the upper end of the interior of the liquid storage chamber.

[0007] Preferably, a stepped groove is provided at the upper end of the inner wall of the liquid storage cavity, and the supporting filtrate layer is installed inside the stepped groove. The supporting filtrate layer includes a porous filter plate and an overhead support structure.

[0008] Preferably, the outer wall of the base is provided with an overflow port which is in communication with the liquid storage cavity and connected to the overflow pipe.

[0009] Preferably, the top spray mechanism includes a plurality of coaxially arranged spray ring tubes installed on the top of the copper dissolving tank, and the plurality of spray ring tubes are arranged at equal intervals up and down.

[0010] Preferably, a plurality of nozzles equidistantly arranged in a ring shape are provided at the bottom of the spray ring pipe, and a water inlet pipe communicating with the plurality of spray ring pipes is installed on the outer wall of the copper dissolving tank.

[0011] Preferably, the outer wall of the spray column is provided with a plurality of evenly distributed spray holes, a plurality of copper material spray plates are installed inside the copper dissolving tank, the spray column passes through the copper material spray plates, and the copper material spray plates are provided with a plurality of through holes.

[0012] Preferably, the copper material soaking mechanism includes a bottom plate installed on the inner wall of the copper dissolving tank, a support column is connected between the bottom plate and the supporting filtrate layer, and a porous overflow tower is installed on the bottom plate.

[0013] Preferably, the air supply structure includes multiple air supply pipes passing through the copper material spray plate, the bottom of the air supply pipes is close to the surface of the base plate, the inner top of the copper dissolving tank is provided with an air intake ring pipe connected to the multiple air supply pipes, and the outer wall of the copper dissolving tank is installed with an air inlet connected to the air intake ring pipe.

[0014] Based on the above-described high-efficiency electrolytic copper foil copper dissolving and liquid preparation device, the present invention also provides a high-efficiency electrolytic copper foil copper dissolving and liquid preparation device and a method for using the device, comprising the following steps:

[0015] S1. Place the small copper material in the copper material immersion mechanism and the large copper material on the copper material spray plate;

[0016] S2. Turn on the top spray mechanism and spray column switches to evenly spray the electrolyte onto multiple copper material spray plates. The large copper material is fully exposed to the electrolyte and air to react and dissolve.

[0017] S3. Open the air supply pipe and introduce air into the air supply pipe through the air inlet ring pipe. The air is transported to the copper material immersion mechanism. The small copper materials are fully exposed to the air, and the sprayed electrolyte flows downward to the copper material immersion mechanism, where the small copper materials react and dissolve.

[0018] S4. The high-concentration copper-containing solution after the reaction is filtered through the supporting filtrate layer and flows into the liquid storage chamber, and finally flows into the low-level dirty liquid tank through the overflow port.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention makes full use of the high-efficiency electrolytic copper foil copper dissolving and liquid preparation device. By targeting the characteristics of copper materials at different levels and using different copper dissolving structures and methods, it can increase the dissolution rate of the lower layer of copper material after long-term use of the spray-type copper dissolving tank, thereby improving the overall copper dissolving efficiency, reducing the number of manual feeding times, and saving labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the present invention;

[0022] Figure 2 Schematic diagram of the internal structure of the present invention;

[0023] Figure 3 is a cross-sectional view of the present invention;

[0024] Figure 4 It is an exploded view of the present invention.

[0025] In the figure: 1. Base; 11. Liquid storage chamber; 12. Step trough; 2. Overflow port; 3. Copper dissolving tank; 4. Support filtrate layer; 5. Top spray mechanism; 51. Spray ring pipe; 52. Nozzle; 53. Water inlet pipe; 6. Spray column; 61. Spray hole; 7. Copper material spray plate; 71. Through hole; 8. Copper material immersion mechanism; 81. Bottom plate; 82. Support column; 83. Multi-porous overflow tower; 9. Air supply pipe; 91. Air inlet ring pipe; 92. Air inlet. DETAILED DESCRIPTION

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] See also Figure 1-4 The present invention provides a technical solution: a high-efficiency electrolytic copper foil copper dissolving and liquid preparation device, comprising a base 1, a copper dissolving tank 3 fixed on the base 1 and used for copper dissolving operation, a liquid storage chamber 11 for temporarily storing a high-concentration copper-containing solution is provided on the top of the base 1, a top spraying mechanism 5 is installed at the upper end of the inner portion of the copper dissolving tank 3, and a spray column 6 is installed at the center of the copper dissolving tank 3. The top spraying mechanism 5 is used to evenly spray the electrolyte from top to bottom onto the upper layer of copper material (the large copper material on the copper material spray plate 7), and the spray column 6 is used to spray the electrolyte from different heights onto the large copper materials on the copper material spray plate 7 at different heights.

[0028] The top spray mechanism 5 and the spray column 6 dissolve the large copper material by spraying the electrolyte. The lower end of the inner part of the copper dissolving tank 3 is installed with a copper material immersion mechanism 8 for dissolving the small copper material. The small copper material is immersed in the electrolyte. An air supply structure for providing air for the reaction between the electrolyte and the copper material is provided above the copper material immersion mechanism 8. The air supply structure transports air to the copper material immersion mechanism 8 for the reaction and dissolution of the small copper material with the electrolyte and air.

[0029] A support filtrate layer 4 for filtering high-concentration copper-containing solutions is installed at the upper end of the liquid storage chamber 11. A stepped trough 12 is defined on the upper end of the inner wall of the liquid storage chamber 11. The support filtrate layer 4 is mounted within the stepped trough 12 and comprises a porous filter plate and an overhead support structure. The support filtrate layer 4 is used to filter larger impurities from the high-concentration copper-containing solution, which then flows into the lower liquid storage chamber 11.

[0030] The outer wall of the base 1 is provided with an overflow port 2 which is in communication with the liquid storage chamber 11 and connected to the overflow pipe. The overflow port 2 is used to overflow the high-concentration copper-containing solution into the low-position waste liquid tank.

[0031] The top spray mechanism 5 comprises a plurality of coaxially arranged spray ring pipes 51 installed on the top of the copper dissolving tank 3. The plurality of spray ring pipes 51 are arranged at equal intervals up and down, which can better dissolve the large copper material.

[0032] The bottom of the spray ring tube 51 is provided with a plurality of nozzles 52 arranged in a ring shape and at equal intervals. The nozzles 52 are arranged at an angle, and the water in the nozzles 52 is sprayed toward the surface of the copper material. The outer wall of the copper dissolving tank 3 is installed with a water inlet pipe 53 connected to the plurality of spray ring tubes 51. The water inlet pipe 53 is used to transport the electrolyte.

[0033] The outer wall of the spray column 6 is provided with multiple groups of evenly distributed spray holes 61, and the multiple groups of spray holes 61 are arranged at equal vertical intervals, which can spray electrolyte to the copper material spray plates 7 at different heights. Multiple copper material spray plates 7 are also installed inside the copper dissolving tank 3. The spray column 6 passes through the copper material spray plate 7, and the copper material spray plate 7 is provided with multiple through holes 71.

[0034] The copper material soaking mechanism 8 includes a bottom plate 81 installed on the inner wall of the copper dissolving tank 3 , a support column 82 is connected between the bottom plate 81 and the supporting filtrate layer 4 , and a porous overflow tower 83 is installed on the bottom plate 81 .

[0035] The air supply structure includes multiple air supply pipes 9 that penetrate the copper material spray plate 7. The bottom of the air supply pipe 9 is close to the surface of the bottom plate 81. The inner top of the copper dissolving tank 3 is provided with an air intake ring pipe 91 that is connected to the multiple air supply pipes 9. The outer wall of the copper dissolving tank 3 is installed with an air inlet 92 that is connected to the air intake ring pipe 91.

[0036] Air is transported to the copper material soaking mechanism 8 through the air intake ring pipe 91 and the air supply pipe 9. The small copper materials are fully contacted with the air, and with the cooperation of the electrolyte, the small copper materials in the lower layer are dissolved.

[0037] Based on the above-described high-efficiency electrolytic copper foil copper dissolving and liquid preparation device, the present invention also provides a high-efficiency electrolytic copper foil copper dissolving and liquid preparation device and a method for using the device, comprising the following steps:

[0038] S1. Place small copper materials in the copper material soaking mechanism 8 and large copper materials on the copper material spraying plate 7; small copper materials include short copper rods, small copper blocks, small copper plates and other smaller copper materials, and large copper materials include larger copper wires, large copper plates and waste foil and other large-volume copper materials.

[0039] S2. Turn on the switches of the top spray mechanism 5 and the spray column 6 to evenly spray the electrolyte (such as sulfuric acid) onto the multiple copper material spray plates 7. The large copper material is fully in contact with the electrolyte and air to react and dissolve;

[0040] S3. Open the air supply pipe 9 and introduce air into the air supply pipe 9 through the air inlet ring pipe 91. The air is transported to the copper material immersion mechanism 8. The small copper materials are fully in contact with the air, and the sprayed electrolyte flows downward to the copper material immersion mechanism 8, and the small copper materials react and dissolve. The large copper materials in the upper layer and the small copper materials in the lower layer can react and dissolve at the same time, which improves the copper dissolution rate.

[0041] S4. The high-concentration copper-containing solution after the reaction is filtered through the supporting filtrate layer 4 and flows into the liquid storage chamber 11, and finally flows into the low-position dirty liquid tank through the overflow port 2.

[0042] The present invention mainly combines the two copper dissolving structures of spraying and immersion. The upper copper material is generally loose, the electrolyte can fully contact the copper material and be exposed to the air, which can provide sufficient reaction conditions. The lower copper material is generally thicker. By transporting air into the copper material immersed in the electrolyte, the reaction and dissolution speed of the lower copper material can be increased. By improving the internal structure of the copper dissolving tank 3, different copper dissolving methods are combined for copper materials of different properties, thereby increasing the reaction and dissolution speed of the overall copper material, increasing the dissolution speed of the copper material, reducing the number of copper material additions, and saving labor costs.

[0043] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency electrolytic copper foil dissolving and copper preparation device, comprising a base (1), a copper dissolving tank (3) fixed on the base (1) and used for copper dissolving operations, characterized in that: The top of the base (1) is provided with a liquid storage chamber (11) for temporarily storing a high-concentration copper-containing solution, the upper end of the inner part of the copper-dissolving tank (3) is provided with a top spraying mechanism (5), and the center of the copper-dissolving tank (3) is provided with a spraying column (6), the top spraying mechanism (5) and the spraying column (6) dissolve large copper materials by spraying electrolyte, the lower end of the inner part of the copper-dissolving tank (3) is provided with a copper material soaking mechanism (8) for dissolving small copper materials, and an air supply structure for providing air for the reaction between the electrolyte and the copper material is provided above the copper material soaking mechanism (8), and the upper end of the inner part of the liquid storage chamber (11) is provided with a supporting filtrate layer (4) for filtering the high-concentration copper-containing solution.

2. The high-efficiency electrolytic copper foil dissolving and liquid preparation device according to claim 1, characterized in that: A stepped groove (12) is provided at the upper end of the inner wall of the liquid storage chamber (11), and the supporting filtrate layer (4) is installed inside the stepped groove (12). The supporting filtrate layer (4) comprises a porous filter plate and an overhead support structure.

3. The high-efficiency electrolytic copper foil dissolving and liquid preparation device according to claim 1, characterized in that: The outer wall of the base (1) is provided with an overflow port (2) that is in communication with the liquid storage cavity (11) and connected to the overflow pipe.

4. The high-efficiency electrolytic copper foil dissolving and copper liquid preparation device according to claim 1, characterized in that: The top spray mechanism (5) comprises a plurality of coaxially arranged spray ring tubes (51) installed on the top of the copper dissolving tank (3), and the plurality of spray ring tubes (51) are arranged at equal intervals up and down.

5. The high-efficiency electrolytic copper foil dissolving and copper liquid preparation device according to claim 4, characterized in that: The bottom of the spray ring tube (51) is provided with a plurality of nozzles (52) arranged in an annular shape and at equal intervals, and the outer wall of the copper dissolving tank (3) is provided with a water inlet pipe (53) connected with the plurality of spray ring tubes (51).

6. The high-efficiency electrolytic copper foil dissolving and liquid preparation device according to claim 1, characterized in that: The outer wall of the spray column (6) is provided with a plurality of evenly distributed spray holes (61); a plurality of copper material spray plates (7) are also installed inside the copper dissolving tank (3); the spray column (6) passes through the copper material spray plates (7); and a plurality of through holes (71) are provided on the copper material spray plates (7).

7. The high-efficiency electrolytic copper foil dissolving and liquid preparation device according to claim 1, characterized in that: The copper material soaking mechanism (8) comprises a bottom plate (81) mounted on the inner wall of the copper dissolving tank (3), a support column (82) is connected between the bottom plate (81) and the supporting filtrate layer (4), and a porous overflow tower (83) is mounted on the bottom plate (81).

8. The high-efficiency electrolytic copper foil dissolving and liquid preparation device according to claim 6, characterized in that: The air supply structure includes a plurality of air supply pipes (9) penetrating the copper material spray plate (7), the bottom of the air supply pipe (9) is close to the surface of the bottom plate (81), the inner top of the copper dissolving tank (3) is provided with an air intake ring pipe (91) connected to the plurality of air supply pipes (9), and the outer wall of the copper dissolving tank (3) is installed with an air inlet (92) connected to the air intake ring pipe (91).

9. A high-efficiency electrolytic copper foil copper dissolving and liquid preparation device and a method of use, based on the high-efficiency electrolytic copper foil copper dissolving and liquid preparation device according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1. Place the small copper material in the copper material soaking mechanism (8) and the large copper material on the copper material spraying plate (7); S2. Turn on the switches of the top spray mechanism (5) and the spray column (6) to evenly spray the electrolyte onto the multiple copper material spray plates (7). The large copper material is fully in contact with the electrolyte and air to react and dissolve. S3, opening the air supply pipe (9), and introducing air into the air supply pipe (9) through the air inlet ring pipe (91), the air is transported to the copper material soaking mechanism (8), the small copper material is fully in contact with the air, and the sprayed electrolyte flows downward to the copper material soaking mechanism (8), and the small copper material reacts and dissolves; S4. The high-concentration copper-containing solution after the reaction is filtered through the supporting filtrate layer (4) and flows into the liquid storage chamber (11), and finally flows into the low-position dirty liquid tank through the overflow port (2).

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