Electroplating device capable of enhancing electroplating effect of PCB (Printed Circuit Board)

Abstract

The invention discloses an electroplating device capable of enhancing the PCB electroplating effect, and belongs to the technical field of PCB electroplating, the electroplating device comprises an electrolysis cylinder and two limiting frames used for limiting a flexible plate, the outer side wall of the electrolysis cylinder is connected with two hydraulic lifting rods through two symmetrical right-angle retention plates, and the output ends of the hydraulic lifting rods are connected with retention rings. Through the arrangement of the coaxial different-direction assembly and the vortex impellers, the gear sets which rotate coaxially in different directions can be used for driving the adjacent vortex impellers to rotate reversely, alternate and reverse vortex groups are formed, the centrifugal force and the shearing force act synergistically, the liquid level of the center of the electrolyte is raised, and the flexible plate is gradually immersed into the electrolyte from the center to the edge; the progressive electroplating from the middle to the edge is realized, the situation that the edge coating is too thick and reverse eddy current breaks the static distribution of the traditional electrolyte is effectively prevented, the contact efficiency of the electrolyte and the surface of the flexible plate is enhanced, bubble residues are reduced, and the thickness uniformity of the coating is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB electroplating, and in particular to an electroplating device capable of enhancing the electroplating effect of a PCB board. Background Art

[0002] Flexible circuit boards are a special type of PCB boards. With the popularization of foldable screen devices and wearable technologies, the electroplating of flexible circuit boards is developing towards thinner, more bendable and higher frequency directions.

[0003] Currently, when electroplating large-sized flexible circuit boards, due to their large line length and area, uneven plating thickness can lead to local resistance differences, causing signal delay or loss. However, when electroplating a flexible circuit board immersed in an electrolyte, the electric field will concentrate at the edge of the board, resulting in a higher current density than the center area, which can easily cause the plating layer at the edge of the flexible circuit board after electroplating to thicken rapidly. To prevent it from bending in the plating solution and the edge plating layer from being too thick, a long clamp is usually used to confine the flexible circuit board within an electroplating frame, so that the edge of the flexible circuit board is limited during the electroplating process. However, this hinders the stress release of the flexible circuit board during the electroplating process, and is prone to generating internal stress during the electroplating process, affecting the performance of the flexible circuit board. In addition, the plating layer of the flexible circuit board needs to be ductile to avoid cracking during bending. However, when the adhesion between the plating layer and the flexible substrate is insufficient, the plating layer is prone to peeling during extension and bending, causing the flexible circuit board to be unqualified. Therefore, a plating device with enhanced PCB plating effect is proposed. Summary of the Invention

[0004] The purpose of the present invention is to solve the problems in the prior art and to propose an electroplating device with enhanced electroplating effect on PCB boards.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A plating device with enhanced electroplating effect for PCB boards, comprising an electrolytic cylinder and two limiting frames for limiting the position of a flexible board, wherein the outer wall of the electrolytic cylinder is connected to two hydraulic lifting rods respectively through two mutually symmetrical right-angle retaining plates, the output end of the hydraulic lifting rod is connected to a retaining ring, the top end of the retaining ring is connected to a drive motor through a mounting seat, the drive motor is connected to a main bevel gear through a sprocket assembly, the main bevel gear is respectively connected to a forward gear and a reverse gear through a coaxial and opposite direction assembly, the forward gear is meshed with a plurality of reverse planetary gears, the reverse gear is meshed with a plurality of forward planetary gears, and the reverse planetary gears and the forward planetary gears are both connected to a vortex impeller;

[0007] A magnetic limit assembly for clamping the flexible board is arranged between the two limiting frames, and an inclined guide groove is provided on the two opposite inner walls of the limiting frame. The inner wall of the inclined guide groove is connected to a test barrier rod, and electric push rods are provided on both sides of the hydraulic lifting rod. The output end of the electric push rod is connected to an airflow assembly for drying and bending detection of the flexible board after electroplating, and two electrostatic plates are arranged above the airflow assembly.

[0008] Preferably, the two hydraulic lifting rods are fixedly connected to the retaining ring through two relative fixed plates, and the outer side wall of the moving section of the hydraulic lifting rod is rotatably connected to the two fixed plates through a steering shaft. The outer side wall of the steering shaft on one side is fixedly connected to a steering gear, and the hydraulic lifting rod on the steering gear side is fixedly connected to an adjustment rack meshing with the steering gear.

[0009] Preferably, the sprocket assembly consists of a driving wheel, a chain and a driven wheel, the output end of the driving motor is fixedly connected to the driving wheel through a rotating shaft, the driving wheel is transmission-connected to the driven wheel through a chain, and the driven wheel is fixedly connected to the main bevel gear through a horizontal shaft.

[0010] Preferably, the coaxial and non-rotating components are composed of a forward bevel gear and a reverse bevel gear, the top of the retaining ring is fixedly connected to a three-limit sleeve through two fixing rods, the forward bevel gear is fixedly connected to the forward gear through a forward shaft, and the reverse bevel gear is fixedly connected to the reverse gear through a reverse shaft ring, and the three-limit sleeve is rotationally connected to the horizontal shaft, the forward shaft and the reverse shaft ring respectively.

[0011] Preferably, the plurality of reverse planetary gears and the plurality of forward planetary gears are staggered with each other, the reverse planetary gears are fixedly connected to the vortex impeller via a short shaft, and the forward planetary gears are fixedly connected to the vortex impeller via a long shaft, and the plurality of vortex impellers are located on the same horizontal plane.

[0012] Preferably, the magnetic limit assembly consists of a limit permanent magnet plate and a limit electromagnetic plate. The limit electromagnetic plate is slidably connected to the limit permanent magnet plate via a limit rod. A reset spring is sleeved on the outer side wall of the limit rod.

[0013] Preferably, the airflow assembly consists of a control air pump and a circulation cover, the top of the electrolysis cylinder is fixedly connected to the electric push rod through a fixed seat, the output end of the electric push rod is fixedly connected to the circulation cover through the control air pump, and the two electric push rods are respectively staggered with two hydraulic lifting rods.

[0014] Preferably, the inward side wall of the right-angle retaining plate on one side is fixedly connected to two mutually symmetrical drive motors, and the output ends of the drive motors are fixedly connected to the electrostatic plate via an adjustment shaft.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. This solution uses the magnetic limit assembly and the limiting frame to utilize the magnetic attraction of the limiting permanent magnet plate and the limiting electromagnetic plate to ensure the stable fixation of the flexible plate during the transportation and initial electroplating stages. After power failure, the reset spring separates the flexible plate, allowing the flexible plate to freely release stress during the electroplating process, reducing the risk of deformation. The flexible plate only maintains moderate constraints during electroplating to avoid stress accumulation caused by complete fixation, thereby improving the bonding strength and uniformity of the coating.

[0017] 2. This solution uses coaxial, counter-rotating components and vortex impellers to drive adjacent vortex impellers to rotate in opposite directions, forming alternating, counter-rotating vortex groups. Centrifugal force and shear force work together to raise the liquid level in the center of the electrolyte. The flexible board is gradually immersed in the electrolyte from the center to the edge, achieving progressive electroplating from the middle to the edge, effectively preventing the edge coating from being too thick. The reverse vortex breaks the static distribution of the traditional electrolyte, enhances the contact efficiency between the electrolyte and the surface of the flexible board, reduces residual bubbles, and ensures uniform coating thickness.

[0018] 3. This solution uses airflow components and electrostatic plates to force the flexible board to bend and contact the test bar, simulating the deformation in actual use. If the coating adhesion is insufficient, the detached copper powder will be adsorbed by the electrostatic plate, directly visualizing the test results. By reversing the airflow and electrostatic plate positions at the same time, a comprehensive assessment of the coating quality on both sides of the flexible board can be quickly completed, improving detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the three-dimensional structure of an electroplating device for enhancing the electroplating effect of a PCB board proposed by the present invention;

[0020] Figure 2 This is an assembly diagram of an electroplating device proposed by the present invention that has enhanced electroplating effect on PCB boards;

[0021] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0022] Figure 4 This is a structural schematic diagram of the position of the main bevel gear in an electroplating device with enhanced electroplating effect on PCB boards proposed by the present invention;

[0023] Figure 5 This is an assembly diagram of a coaxial anisotropic component in an electroplating device for enhancing the electroplating effect of a PCB board, as proposed by the present invention;

[0024] Figure 6 This is a structural schematic diagram of the position of the electrostatic plate in an electroplating device with enhanced electroplating effect on PCB boards proposed by the present invention;

[0025] Figure 7 This is a structural schematic diagram of a magnetic limit assembly in an electroplating device with enhanced electroplating effect on PCB boards proposed by the present invention.

[0026] In the figure: 1. Electrolytic cylinder; 2. Limiting frame; 3. Flexible plate; 4. Hydraulic lifting rod; 5. Retaining ring; 6. Drive motor; 7. Drive wheel; 8. Chain; 9. Driven wheel; 10. Horizontal shaft; 11. Three-limit sleeve; 12. Main bevel gear; 13. Forward bevel gear; 14. Reverse bevel gear; 15. Forward gear; 16. Reverse planetary gear; 17. Reverse gear; 18. Forward planetary gear; 19. Vortex impeller; 20. Steering shaft; 21. Steering gear; 22. Adjustment rack; 23. Test lever; 24. Limit permanent magnet plate; 25. Return spring; 26. Limit electromagnetic plate; 27. Electric push rod; 28. Control air pump; 29. Circulation cover; 30. Drive motor; 31. Electrostatic plate. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "mounted / connected," and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention in specific circumstances.

[0030] Example, see Figures 1 to 7An electroplating device with enhanced electroplating effect for PCB boards includes an electrolytic cylinder 1 and two limiting frames 2 for limiting the position of a flexible board 3. The outer wall of the electrolytic cylinder 1 is connected to two hydraulic lifting rods 4 through two mutually symmetrical right-angle retaining plates.

[0031] Furthermore, the two hydraulic lifting rods 4 are fixedly connected to the retaining ring 5 through two opposite fixed plates. The outer wall of the movable section of the hydraulic lifting rod 4 is rotatably connected to the two fixed plates through the steering shaft 20. The outer wall of the steering shaft 20 on one side is fixedly connected to the steering gear 21. The hydraulic lifting rod 4 on one side of the steering gear 21 is fixedly connected to the adjustment rack 22 that meshes with the steering gear 21.

[0032] It should be noted that: after the electroplating is completed, the flexible board 3 is transported upward by the hydraulic lifting rod 4. At the same time, the flexible board 3 is fixed and limited by the limiting permanent magnet plate 24 and the limiting electromagnetic plate 26 to ensure stability during the transportation process. As it continues to rise, the steering gear 21 on the steering shaft 20 contacts and engages with the adjustment rack 22 (wherein the steering shaft 20 has rotation resistance and will not rotate in a free state). When the steering gear 21 travels and rotates on the adjustment rack 22, the rotation of the steering gear 21 will drive the two limiting frames 2 to rotate to a vertical state and stop through the steering shaft 20, thereby keeping the flexible board 3 in a vertical state;

[0033] The output end of the hydraulic lifting rod 4 is connected to a retaining ring 5, the top of the retaining ring 5 is connected to a drive motor 6 through a mounting seat, the drive motor 6 is connected to a main bevel gear 12 through a sprocket assembly, the main bevel gear 12 is respectively connected to a forward gear 15 and a reverse gear 17 through coaxial and opposite direction assemblies, the forward gear 15 is meshed with a plurality of reverse planetary gears 16, the reverse gear 17 is meshed with a plurality of forward planetary gears 18, and both the reverse planetary gears 16 and the forward planetary gears 18 are connected to a vortex impeller 19;

[0034] Furthermore, the sprocket assembly consists of a driving wheel 7, a chain 8 and a driven wheel 9. The output end of the driving motor 6 is fixedly connected to the driving wheel 7 through a rotating shaft. The driving wheel 7 is transmission-connected to the driven wheel 9 through the chain 8. The driven wheel 9 is fixedly connected to the main bevel gear 12 through a horizontal shaft 10. The coaxial and different-direction assembly consists of a forward bevel gear 13 and a reverse bevel gear 14. The top of the retaining ring 5 is fixedly connected to a three-limit shaft sleeve 11 through two fixing rods. The forward bevel gear 13 is fixedly connected to the forward gear 15 through the forward shaft, and the reverse bevel gear 14 is fixedly connected to the reverse gear 17 through a reverse shaft ring. The three-limit shaft sleeve 11 is rotatably connected to the horizontal shaft 10, the forward shaft and the reverse shaft ring respectively. A plurality of reverse planetary gears 16 and a plurality of forward planetary gears 18 are staggered with each other. The reverse planetary gear 16 is fixedly connected to the vortex impeller 19 through a short shaft, and the forward planetary gear 18 is fixedly connected to the vortex impeller 19 through a long shaft. The plurality of vortex impellers 19 are located on the same horizontal plane.

[0035] It should be noted that: the large-sized flexible board 3 to be electroplated is placed in the two limiting frames 2, and the edges of the flexible board 3 are placed between a plurality of limiting permanent magnetic plates 24 and limiting electromagnetic plates 26. After the limiting electromagnetic plates 26 are energized, they are magnetically attracted to the limiting permanent magnetic plates 24 to achieve fixed positioning of the flexible board 3 before electroplating. Subsequently, the hydraulic lifting rod 4 is activated to transport the flexible board 3 in the limiting frames 2 downward.

[0036] During the downward movement of the flexible plate 3, the drive motor 6 is started to drive the drive wheel 7 to rotate. The rotation of the drive wheel 7 will drive the driven wheel 9 to rotate synchronously through the chain 8. The rotation of the driven wheel 9 will drive the main bevel gear 12 at its end to rotate together. The rotation of the main bevel gear 12 will respectively drive the forward bevel gear 13 and the reverse bevel gear 14 above and below it to rotate in opposite directions, and keep the forward bevel gear 13 rotating clockwise and the reverse bevel gear 14 rotating counterclockwise. The forward bevel gear 13 drives the forward gear 15 to rotate clockwise through the forward shaft, and the forward gear 15 will drive the reverse planetary gear 16 on its outer side to keep rotating. The reverse bevel gear 14 drives the reverse gear 17 to rotate counterclockwise through the reverse shaft ring, and the reverse gear 17 drives the forward planetary gear 18 on its outer side to keep rotating in the reverse clockwise direction. The multiple vortex impellers 19 rotate with the reverse planetary gear 16 and the forward planetary gear 18 above them, respectively, so that the rotation directions of the two adjacent vortex impellers 19 are opposite. After the rotating vortex impeller 19 enters the electrolyte in the electrolytic cylinder 1, the vortex impeller 19 will form a vortex in its own rotation area that is consistent with its own rotation direction. Due to the rotation of the adjacent vortex impellers 19 If the directions are opposite, the rotation directions of adjacent vortices are also opposite, and a group of vortices alternating in opposite directions is formed on the periphery below the flexible plate 3. When a single vortex rotates, the centrifugal force causes the electrolyte to move outward, and the pressure in the central area decreases, causing the liquid level to sink. The annularly arranged vortices rotate alternately (multiple vortex impellers 19 rotate alternately clockwise and counterclockwise), and the adjacent vortices induce the fluid to converge toward the center and upward through shearing, causing the central liquid level to rise. In the process of the flexible plate 3 moving downward, the central area of the flexible plate 3 will first contact the raised electrolyte in the middle, thereby causing the central area of the gradually moving flexible plate 3 to The flexible board 3 is contacted with the electrolyte for electroplating (the descending speed of the flexible board 3 is slowed down at this time), and a gradual electroplating process is achieved on the flexible board 3 from the middle to the edge, thereby avoiding the situation where the edge plating layer of the flexible board 3 is thick during the electroplating process. Before the flexible board 3 is completely immersed in the electrolyte for electroplating, the power supply of the limit electromagnetic plate 26 is disconnected, so that the limit permanent magnetic plate 24 and the limit electromagnetic plate 26 are separated under the action of the reset spring 25. At this time, the flexible board 3 is limited within a certain range between the two limiting frames 2, which not only avoids the flexible board 3 from being greatly bent and deformed during the electroplating process, but also allows the electroplating stress to be freely released during the electroplating process.

[0037] The above advantages are as follows: in this way, the coaxial and counter-rotating components can be used to cooperate with the counter-rotating planetary gears 16 and the forward planetary gears 18 to make the adjacent vortex impellers 19 rotate in the opposite direction to form a reverse alternating vortex group, so that the central liquid level of the electrolyte is raised, and a gradual electroplating process from the middle to the edge of the flexible board 3 is achieved, ensuring that the electroplating of the flexible board 3 is more uniform. At the same time, the flexible board 3 is not fixedly limited during the electroplating process, so that the stress during the electroplating process can be freely released, thereby improving the electroplating quality of the flexible board 3.

[0038] A magnetic limit assembly for clamping the flexible board 3 is provided between the two limiting frames 2. An inclined guide groove is provided on the two opposite inner side walls of the limiting frame 2. A test block rod 23 is connected to the inner wall of the inclined guide groove. Electric push rods 27 are provided on both sides of the hydraulic lifting rod 4. The output end of the electric push rod 27 is connected to an airflow assembly for drying and bending detection of the flexible board 3 after electroplating. Two electrostatic plates 31 are provided above the airflow assembly.

[0039] Furthermore, the magnetic limit assembly is composed of a limit permanent magnet plate 24 and a limit electromagnetic plate 26. The limit electromagnetic plate 26 is slidably connected to the limit permanent magnet plate 24 through a limit rod. A return spring 25 is sleeved on the outer wall of the limit rod. The airflow assembly is composed of a control air pump 28 and a circulation cover 29. The top of the electrolytic cylinder 1 is fixedly connected to the electric push rod 27 through a fixed seat. The output end of the electric push rod 27 is fixedly connected to the circulation cover 29 through the control air pump 28. The two electric push rods 27 are respectively staggered with the two hydraulic lifting rods 4. The inward side wall of the right-angle retaining plate on one side is fixedly connected to two mutually symmetrical drive motors 30. The output end of the drive motor 30 is fixedly connected to the electrostatic plate 31 through an adjustment shaft.

[0040] It should be noted that: after the flexible board 3 rises and changes to a vertical state after electroplating, the electric push rod 27 is started to push the control air pump 28 and the circulation cover 29 to the side of the flexible board 3, and the two control air pumps 28 synchronously output a small airflow to perform preliminary air drying on the flexible board 3. After the air drying is completed, the control air pump 28 on one side is retracted, and the drive motor 30 on this side controls the electrostatic plate 31 to rotate to the side of the flexible board 3, and then controls the control air pump 28 on the other side to output a larger airflow. It should be noted that before this, the limit permanent magnet plate 24 and the limit electromagnetic plate 26 are released from the fixed limit, and at the same time, as the limit frame 2 rotates to the vertical state, the test lever 23 Under the action of its own gravity, it slides in the oblique guide groove to the middle part of the limiting frame 2. The large airflow on one side will cause the flexible board 3 to bend and press on the test barrier rod 23. As the airflow continues to change, the bending state of the flexible board 3 will also change continuously. If the bonding strength of the plating layer of the flexible board 3 after electroplating is insufficient, the electroplated copper powder will not have sufficient adhesion to the flexible board 3, and will fall off during the bending test, and then be adsorbed by the electrostatic plate 31 with static electricity. The above operation in the opposite direction is repeated to realize the detection of the other side of the flexible board 3. If the electrostatic plate 31 continuously adsorbs yellow powder during the test, it indicates that the surface coating quality of the flexible board 3 is poor.

[0041] The above advantages are as follows: the airflow on the circulating hood 29 can be used to preliminarily dry the flexible board 3, so that when the bonding strength performance of the coating on the flexible board 3 is subsequently tested, the copper powder that falls off in the bending state can be electrostatically adsorbed by the electrostatic plate 31, making the test faster and more intuitive;

[0042] When the present invention is in use, a large-sized flexible board 3 to be electroplated is placed between two limiting frames 2, and the edges of the flexible board 3 are respectively placed between a plurality of limiting permanent magnetic plates 24 and limiting electromagnetic plates 26. After the limiting electromagnetic plates 26 are energized, they are magnetically attracted to the limiting permanent magnetic plates 24 to achieve fixed positioning of the flexible board 3 before electroplating. Subsequently, the hydraulic lifting rod 4 is activated to transport the flexible board 3 in the limiting frames 2 downward.

[0043] During the downward movement of the flexible plate 3, the drive motor 6 is started to drive the drive wheel 7 to rotate. The rotation of the drive wheel 7 will drive the driven wheel 9 to rotate synchronously through the chain 8. The rotation of the driven wheel 9 will drive the main bevel gear 12 at its end to rotate together. The rotation of the main bevel gear 12 will respectively drive the forward bevel gear 13 and the reverse bevel gear 14 above and below it to rotate in opposite directions, and keep the forward bevel gear 13 rotating clockwise and the reverse bevel gear 14 rotating counterclockwise. The forward bevel gear 13 drives the forward gear 15 to rotate clockwise through the forward shaft, and the forward gear 15 will drive the reverse planetary gear 16 on its outer side to keep rotating counterclockwise in the opposite direction. The reverse bevel gear 14 drives the reverse gear 17 to rotate counterclockwise through the reverse shaft ring, and the reverse bevel gear 17 rotates counterclockwise. The gear 17 will drive the forward planetary gear 18 on its outer side to keep rotating in the opposite clockwise direction. The multiple vortex impellers 19 rotate respectively with the reverse planetary gear 16 and the forward planetary gear 18 above them, so that the rotation directions of the two adjacent vortex impellers 19 are opposite. After the vortex impeller 19 to be rotated enters the electrolyte in the electrolytic cylinder 1, the vortex impeller 19 will form a vortex with the same rotation direction as its own within its own rotation area. Since the rotation directions of adjacent vortex impellers 19 are opposite, the rotation directions of adjacent vortices are also opposite, forming a reverse alternating vortex group on the periphery below the flexible plate 3. When a single vortex rotates, the centrifugal force causes the electrolyte to move outward, the pressure in the central area decreases, causing the liquid level to sink, and the surrounding The vortexes arranged in a shape rotate alternately (the rotation of multiple vortex impellers 19 is alternately clockwise and counterclockwise), and the adjacent vortices induce the fluid to converge toward the center and upward through shearing, resulting in an increase in the central liquid level. In the process of the flexible plate 3 moving downward, the central area of the flexible plate 3 will first contact the raised electrolyte in the middle, and then the central area of the gradually moving downward flexible plate 3 will contact the electrolyte for electroplating (at this time, the descending speed of the flexible plate 3 is slowed down), realizing a gradual electroplating process from the middle to the edge of the flexible plate 3, avoiding the situation where the edge plating layer of the flexible plate 3 is thicker during the electroplating process. Before the flexible plate 3 is completely immersed in the electrolyte for electroplating, the power of the limit electromagnetic plate 26 is disconnected, so that the limit permanent magnet plate 24 and the limit electromagnetic plate 26 are reset. When the flexible plate 3 is separated under the action of the spring 25, the flexible plate 3 is limited within a certain range between the two limiting frames 2, which not only avoids large bending deformation of the flexible plate 3 during the electroplating process, but also allows the electroplating stress to be freely released during the electroplating process. In this way, the coaxial and different-direction components can be used to cooperate with the reverse rotation of the reverse planetary gear 16 and the forward planetary gear 18, so that the adjacent vortex impellers 19 rotate in the opposite direction to form a reverse alternating vortex group, so that the central liquid level of the electrolyte is raised, and a gradual electroplating process from the middle to the edge of the flexible plate 3 is achieved, ensuring that the electroplating of the flexible plate 3 is easier to achieve uniformity. At the same time, the flexible plate 3 is not fixedly limited during the electroplating process, so that the stress in the electroplating process can be freely released, thereby improving the electroplating quality of the flexible plate 3;

[0044] After the electroplating is completed, the flexible board 3 is transported upward by the hydraulic lifting rod 4. At the same time, the flexible board 3 is fixed and limited by the limiting permanent magnet plate 24 and the limiting electromagnetic plate 26 to ensure stability during the transportation process. As it continues to rise, the steering gear 21 on the steering shaft 20 contacts and engages with the adjustment rack 22 (wherein the steering shaft 20 has rotation resistance and will not rotate in a free state). When the steering gear 21 moves and rotates on the adjustment rack 22, the rotation of the steering gear 21 will drive the two limiting frames 2 to rotate to a vertical state and stop through the steering shaft 20, thereby keeping the flexible board 3 in a vertical state. Then, the electric push rod 27 is started to push the control air pump 28 and the circulation cover 29 to the side of the flexible board 3. The two control air pumps 28 synchronously output a small airflow to perform preliminary air drying on the flexible board 3. After the air drying is completed, the control air pump 28 on one side is retracted, and the drive motor 30 on this side controls the electrostatic plate 31 to rotate to the side of the flexible board 3, and then controls the control air pump 28 on the other side to output a larger airflow. It should be noted that before this, The limiting permanent magnetic plate 24 and the limiting electromagnetic plate 26 are released from the fixed limit. At the same time, as the limiting frame 2 rotates to the vertical state, the test blocking rod 23 slides in the oblique guide groove to the middle part of the limiting frame 2 under the action of its own gravity. The large airflow on one side will cause the flexible plate 3 to bend and bend on the test blocking rod 23. As the airflow continues to change, the bending state of the flexible plate 3 will also change continuously. If the bonding strength of the plating layer on the flexible plate 3 is insufficient, the electroplated copper powder will not have sufficient adhesion to the flexible plate 3 and fall off during the bending test. It will then be adsorbed by the electrostatic plate 31 with static electricity. The above-mentioned operation in the opposite direction is repeated to realize the inspection of the other side of the flexible plate 3. If the electrostatic plate 31 continuously adsorbs yellow powder during the test, it indicates that the surface coating quality of the flexible plate 3 is poor. In this way, the airflow on the circulating air hood 29 can be used to preliminarily dry the flexible plate 3, so that when the bonding strength performance of the plating layer on the flexible plate 3 is subsequently tested, the copper powder that falls off in the bending state can be electrostatically adsorbed by the electrostatic plate 31, making the inspection faster and more intuitive.

[0045] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. An electroplating device with enhanced electroplating effect on PCB boards, comprising an electrolytic cylinder (1) and two limiting frames (2) for limiting the position of a flexible board (3), characterized in that: The outer wall of the electrolysis cylinder (1) is connected to two hydraulic lifting rods (4) through two mutually symmetrical right-angled retaining plates, the output end of the hydraulic lifting rod (4) is connected to a retaining ring (5), the top of the retaining ring (5) is connected to a driving motor (6) through a mounting seat, the driving motor (6) is connected to a main bevel gear (12) through a sprocket assembly, the main bevel gear (12) is connected to a forward gear (15) and a reverse gear (17) through a coaxial and opposite direction assembly, the forward gear (15) is meshed with a plurality of reverse planetary gears (16), the reverse gear (17) is meshed with a plurality of forward planetary gears (18), and the reverse planetary gears (16) and the forward planetary gears (18) are both connected to a vortex impeller (19); A magnetic limit assembly for clamping the flexible plate (3) is provided between the two limiting frames (2), an oblique guide groove is provided on the two opposite inner side walls of the limiting frame (2), a test blocking rod (23) is connected to the inner side wall of the oblique guide groove, an electric push rod (27) is provided on both sides of the hydraulic lifting rod (4), an airflow assembly for drying and bending detection of the flexible plate (3) after electroplating is connected to the output end of the electric push rod (27), and two electrostatic plates (31) are provided above the airflow assembly.

2. The electroplating device for enhancing the electroplating effect of a PCB according to claim 1, characterized in that: The two hydraulic lifting rods (4) are fixedly connected to the retaining ring (5) through two opposite fixed plates, and the outer side walls of the movable sections of the hydraulic lifting rods (4) are rotatably connected to the two fixed plates through a steering shaft (20). The outer side wall of the steering shaft (20) on one side is fixedly connected to a steering gear (21), and the hydraulic lifting rod (4) on one side of the steering gear (21) is fixedly connected to an adjustment rack (22) meshing with the steering gear (21).

3. The electroplating device for enhancing the electroplating effect of a PCB according to claim 1, characterized in that: The sprocket assembly consists of a driving wheel (7), a chain (8) and a driven wheel (9); the output end of the driving motor (6) is fixedly connected to the driving wheel (7) via a rotating shaft; the driving wheel (7) is transmission-connected to the driven wheel (9) via the chain (8); and the driven wheel (9) is fixedly connected to the main bevel gear (12) via a horizontal shaft (10).

4. The electroplating device for enhancing the electroplating effect of a PCB according to claim 3, characterized in that: The coaxial and different-direction assembly consists of a forward bevel gear (13) and a reverse bevel gear (14); the top of the retaining ring (5) is fixedly connected to a three-limit shaft sleeve (11) through two fixing rods; the forward bevel gear (13) is fixedly connected to the forward gear (15) through a forward shaft; the reverse bevel gear (14) is fixedly connected to the reverse gear (17) through a reverse shaft ring; and the three-limit shaft sleeve (11) is rotatably connected to the horizontal shaft (10), the forward shaft and the reverse shaft ring respectively.

5. The electroplating device for enhancing the electroplating effect of a PCB according to claim 1, characterized in that: The plurality of reverse planetary gears (16) and the plurality of forward planetary gears (18) are arranged in an interlaced manner. The reverse planetary gears (16) are fixedly connected to the vortex impeller (19) via a short shaft, and the forward planetary gears (18) are fixedly connected to the vortex impeller (19) via a long shaft. The plurality of vortex impellers (19) are located on the same horizontal plane.

6. The electroplating device for enhancing the electroplating effect of a PCB according to claim 1, characterized in that: The magnetic limit assembly consists of a limit permanent magnet plate (24) and a limit electromagnetic plate (26); the limit electromagnetic plate (26) is slidably connected to the limit permanent magnet plate (24) via a limit rod; and a reset spring (25) is sleeved on the outer side wall of the limit rod.

7. The electroplating device for enhancing the electroplating effect of a PCB according to claim 1, characterized in that: The airflow assembly is composed of a control air pump (28) and an annular flow cover (29); the top end of the electrolysis cylinder (1) is fixedly connected to the electric push rod (27) via a fixed seat; the output end of the electric push rod (27) is fixedly connected to the annular flow cover (29) via the control air pump (28); and the two electric push rods (27) are respectively arranged in an interlaced manner with the two hydraulic lifting rods (4).

8. The electroplating device for enhancing the electroplating effect of a PCB according to claim 1, characterized in that: Two mutually symmetrical drive motors (30) are fixedly connected to the inward side wall of the right-angle retaining plate on one side, and the output end of the drive motor (30) is fixedly connected to the electrostatic plate (31) via an adjustment shaft.

Images