Fiber bragg grating temperature sensing array packaging equipment

Abstract

The invention discloses fiber bragg grating temperature sensing array packaging equipment which comprises a processing box, a first fixing assembly, a temperature sensor chip assembly, a packaging rack assembly and a packaging assembly. A rack is installed at the bottom of the processing box, a drawing box is installed on the front surface of the processing box through a sliding rail, a first fixing assembly and a second fixing assembly are installed on the front side and the rear side of the upper surface of the processing box, and a temperature sensor chip assembly is placed in the center of the upper surface of the processing box. A packaging rack assembly is installed on the first fixing assembly and the second fixing assembly, and a packaging assembly is installed on the inner side of the packaging rack assembly. The first fixing assembly and the second fixing assembly which are the same in structure are installed and can work cooperatively so as to adapt to fiber grating temperature sensing arrays of different specifications and types, equipment replacement or parameter adjustment is not needed, and the universality and flexibility of the equipment are improved.

Description

Technical Field

[0001] The present invention relates to the field of optical fiber sensing technology, in particular to an optical fiber Bragg grating temperature sensing array packaging device. Background Art

[0002] Fiber Bragg grating (FBG) temperature sensors are widely used in large structures, power generation, security, petrochemicals, medicine, mining, and military fields due to their advantages such as small size, light weight, corrosion resistance, resistance to electromagnetic interference, large measurement range, fast response speed, and high precision. Fiber Bragg grating (FBG) temperature sensor arrays combine multiple fiber Bragg grating (FBG) temperature sensors in a specific arrangement to simultaneously measure the temperature of multiple points, improving the efficiency and accuracy of temperature monitoring. However, during use, fiber Bragg grating (FBG) temperature sensor arrays require packaging to protect them from external environmental influences and ensure stable transmission of the sensing signal. However, in practical applications, fiber Bragg grating sensors are susceptible to environmental factors such as acid and alkali corrosion and mechanical damage, and therefore require packaging and protection.

[0003] The defects of existing fiber Bragg grating temperature sensor array packaging equipment are: Existing fiber Bragg grating temperature sensor array packaging equipment has a slow packaging speed when processing large-scale fiber Bragg grating temperature sensor arrays, which is difficult to meet the needs of rapid production.

[0004] 2. The existing fiber Bragg grating temperature sensor array packaging equipment has limited positioning and fixing accuracy for the fiber Bragg grating during the packaging process, which may affect the performance of the sensor array, such as signal attenuation and sensitivity reduction.

[0005] 3. Fiber Bragg grating temperature sensing arrays of different specifications and types may require different packaging equipment or adjustment of equipment parameters, which reduces the versatility and flexibility of the equipment. Therefore, it is necessary to propose a fiber Bragg grating temperature sensing array packaging device to solve the above-mentioned problems. Summary of the Invention

[0006] The object of the present invention is to provide a fiber Bragg grating temperature sensor array packaging device to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a fiber Bragg grating temperature sensor array packaging device, comprising a processing box, a frame, a first fixing component, a temperature sensor chip component, a packaging frame component and a packaging component; the frame is installed at the bottom of the processing box, balance adjustment support rods are installed at the edges of the bottom of the frame, and two storage cavities are provided on the lower side of the frame, a pull-out box is installed on the front surface of the processing box through a slide rail, and an anti-slip pull rod is fixed to the front surface of the pull-out box by screws, a first fixing component and a second fixing component are installed on the front and rear sides of the upper surface of the processing box, a temperature sensor chip component is placed at the center of the upper surface of the processing box, the packaging frame component is installed on the first fixing component and the second fixing component, a PLC controller is fixed on the front surface of the packaging frame component, and the packaging component is installed on the inner side of the packaging frame component.

[0008] Preferably, the first fixing component and the second fixing component have the same structure, and limiting support blocks are provided on both sides of the first fixing component, and a guide rail is installed between the limiting support blocks. A U-shaped slide is installed on the guide rail, and a locking screw is installed on the upper surface of the U-shaped slide, and the bottom of the locking screw is in contact with the guide rail, and an adjustment fixing structure is installed on one side wall of the U-shaped slide.

[0009] Preferably, a fixed base is provided on the adjustment and fixing structure, and the fixed base is fixed to the upper surface of the processing box by screws, and a rotating shaft seat is fixed on the upper surface of the fixed base, and a rotating support rod is adjusted on the upper end of the rotating shaft seat, and an angle rotating grip is installed on the upper surface of one end of the rotating support rod, and the bottom rotating rod of the angle rotating grip passes through the rotating support rod and is fixedly connected to the upper surface of the rotating shaft seat, an adjusting slot is provided on the rotating support rod, and a rotating downward pressure rod is provided on the rotating support rod, a rotating disc is installed on the top of the rotating downward pressure rod, and an anti-slip rubber pressure plate is installed on the bottom of the rotating downward pressure rod.

[0010] Preferably, a chip substrate is provided on the temperature sensor chip assembly, data transmission lines are installed around the upper surface of the chip substrate, one end of the data transmission line is electrically connected to the control module, and a packaging shell is clamped on the control module.

[0011] Preferably, a disassembly lifting rod is installed on one side outer wall of the packaging shell, and a clamping groove is opened on the upper surface of the packaging shell, and the clamping groove and the clamping block are clamped and locked.

[0012] Preferably, the packaging rack assembly is provided with a rear support plate and a front support plate, four electromagnetic sliding rails are installed on the upper and lower sides of the rear support plate and the front support plate, and sliding rods are installed between the electromagnetic sliding rails.

[0013] Preferably, the sliding rod is mounted on the upper and lower ends of the central mounting sleeve rod, and annular clamps are mounted on the upper and lower ends of the inner side wall of the central mounting sleeve rod, and the annular clamps are fastened with a downward pressure cylinder.

[0014] Preferably, the packaging assembly is provided with a pressing cylinder, a fastening sleeve is installed on the output end of the pressing cylinder, an infrared locator is installed on the support rod of the fastening sleeve, and a detachable mounting sleeve is installed on the output end of the pressing cylinder.

[0015] Preferably, a lower pressing plate is installed at the bottom of the detachable mounting sleeve, and two locking rails are provided at the bottom of the lower pressing plate. The locking rails are installed with a clamping block through a locking slider.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention realizes high-speed and precise packaging operation through the coordinated use of a PLC controller, a temperature sensor chip assembly and a packaging assembly, thereby meeting the rapid production requirements of large-scale fiber Bragg grating temperature sensor arrays. The PLC controller serves as the intelligent brain of the packaging equipment, and is responsible for receiving temperature data from the temperature sensor chip assembly and issuing control instructions to the packaging assembly according to preset program logic. Its high-precision data processing capability and fast response speed ensure the efficiency and precision of the packaging process. In addition, through the coordinated work of the PLC controller and the packaging assembly, the entire packaging equipment can be operated in an automated and intelligent manner, greatly improving the packaging efficiency and quality.

[0017] The present invention improves the positioning and fixing accuracy through the coordinated use of the entire adjusting and fixing structure. The adjusting and fixing structure adopts a high-precision positioning system and fixing device to ensure the position and stability of the fiber Bragg grating during the packaging process. This design takes into account both the convenience of operation and the stability of the fixation and the safety of the sensor array, fully reflecting the care and exquisite craftsmanship in the detailed design of the packaging equipment, which not only improves the packaging efficiency, but also ensures the stability and reliability of the packaging quality.

[0018] 3. The present invention is equipped with a first fixing component and a second fixing component of the same structure, which can work together to adapt to fiber Bragg grating temperature sensor arrays of different specifications and types without replacing the equipment or adjusting the parameters, thereby improving the versatility and flexibility of the equipment and ensuring the precise fixation and stable packaging of the fiber Bragg grating temperature sensor array during the packaging process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is the left schematic diagram of the present invention; Figure 2 It is a right schematic diagram of the present invention; Figure 3 A schematic diagram of a packaging rack assembly of the present invention; Figure 4 is a schematic diagram of a packaging assembly of the present invention; Figure 5 It is a bottom view schematic diagram of the packaging assembly of the present invention; Figure 6 Schematic diagram of the fixing assembly and temperature sensor chip assembly of the present invention; Figure 7 It is a schematic diagram of the adjustment and fixing structure of the present invention.

[0020] Figure: 1. Processing box; 2. Balance adjustment support rod; 3. Rack; 4. Storage chamber; 5. Anti-slip pull rod; 6. Pull-out box; 7. First fixing assembly; 71. Limit support block; 72. U-shaped slide; 73. Locking screw; 74. Guide rail; 75. Adjustment and fixing structure; 751. Fixed base; 752. Rotating shaft seat; 753. Angle rotation grip plate; 754. Rotating disk; 755. Rotating pressure rod; 756. Anti-slip rubber pressure plate; 757. Adjustment slide; 758. Rotating support rod; 8. Second fixing assembly; 9. Temperature sensor chip assembly; 91 , chip substrate; 92, data transmission line; 93, disassembly lifting rod; 94, packaging shell; 95, clamping slot; 10, packaging rack assembly; 101, rear support plate; 102, front support plate; 103, electromagnetic sliding track; 104, sliding rod; 105, center mounting sleeve rod; 106, annular clamp; 11, PLC controller; 12, packaging assembly; 121, lower pressure cylinder; 122, detachable mounting sleeve; 123, infrared locator; 124, lower pressure plate; 125, clamping block; 126, fastening sleeve; 127, locking slider; 128, locking track. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on the specific circumstances. Example

[0024] like Figure 1-7As shown, an embodiment of the present invention is: a fiber Bragg grating temperature sensor array packaging device, comprising a processing box 1, a frame 3, a first fixing component 7, a temperature sensor chip component 9, a packaging frame component 10 and a packaging component 12; the frame 3 is installed at the bottom of the processing box 1, and the frame 3 serves as a supporting structure, which can effectively enhance the overall stability of the processing box 1, prevent it from shaking or tilting during operation, and ensure the accuracy and safety of the processing process. Balance adjustment support rods 2 are installed on the edges of the bottom of the frame 3. The balance adjustment support rods 2 can ensure that the processing box 1 and the frame 3 remain horizontal and stable in various working states, and avoid tilting or collapse due to unstable center of gravity. When the balance adjustment support rod 2 is adjusted according to the actual working environment and ground conditions, the equipment can adapt to different terrains and ground conditions, ensuring the efficiency and safety of the work, and two storage chambers 4 are provided on the lower side of the frame 3. The two storage chambers 4 are respectively used to store different materials and tools required in the packaging process, such as optical fiber Bragg gratings, packaging glue, cleaning cloth, etc., which are convenient for workers to quickly take them out during the packaging process and improve work efficiency; the design of the storage chamber 4 not only saves space inside the equipment, but also makes the working environment more tidy and orderly, avoiding operational errors or safety hazards caused by the chaotic placement of materials and tools; in addition, the sealing performance of the storage chamber 4 is good, which can effectively prevent In order to prevent the influence of external factors such as dust and moisture on materials and tools, and to ensure the packaging quality and long-term stable operation of the equipment, a pull-out box 6 is installed on the front surface of the processing box 1 through a slide rail. The design of the pull-out box 6 is convenient for the staff to quickly access the interior of the processing box 1. The required items can be taken out or put in without opening the entire processing box 1. The pull-out box 6 can store some commonly used packaging accessories, measuring tools or emergency treatment supplies, such as spare fiber gratings, calibration tools, protective glasses, etc., so that the staff can quickly respond to various needs during the packaging process, further improving work efficiency and packaging quality. The front surface of the pull-out box 6 is fixed with an anti-slip pull rod 5 by screws. The setting of the anti-slip pull rod 5 enhances the pull-out box 6. The operation is convenient and safe. Even in a wet or oily working environment, workers can firmly hold the pull rod to avoid accidental injury caused by slipping. A first fixing assembly 7 and a second fixing assembly 8 are installed on the front and back sides of the upper surface of the processing box 1. The first fixing assembly 7 and the second fixing assembly 8 are designed to fix the fiber Bragg grating temperature sensor array and related components to ensure their stability and position accuracy during the packaging process. The first fixing assembly 7 is located on the front side of the upper surface of the processing box 1 and firmly fixes one end of the fiber Bragg grating through an adjustable clamping mechanism. The clamping mechanism is made of elastic material and can adapt to fiber Bragg gratings of different sizes and shapes without causing damage to the fiber Bragg grating.The second fixing component 8 is located on the rear side of the upper surface of the processing box 1. Its structure is more complex and includes multiple fine-tuning knobs, which can accurately adjust the position and angle of the fiber Bragg grating to ensure that the fiber Bragg grating can be arranged according to the predetermined path and layout during the packaging process, thereby meeting the accuracy requirements of the packaging equipment for the fiber Bragg grating temperature sensing array. Through the coordinated action of the first fixing component 7 and the second fixing component 8, the packaging equipment can achieve efficient and accurate packaging of the fiber Bragg grating temperature sensing array. A temperature sensor chip component 9 is placed at the center of the upper surface of the processing box 1. As the core component of the packaging equipment, the temperature sensor chip component 9 is precisely placed at the center of the upper surface of the processing box 1 to ensure accurate monitoring of the temperature of the fiber Bragg grating temperature sensing array. The temperature sensor chip component 9 is made of highly sensitive materials and can quickly respond to temperature changes and transmit temperature data to the control system in real time for subsequent data processing and analysis. A packaging rack component 10 is installed on the first fixing component 7 and the second fixing component 8. The installation of the packaging rack component 10 provides a stable support platform for the entire packaging process. The packaging rack component 1 The sophisticated design and compact structure not only ensure stability and reliability during the packaging process but also facilitate operation and maintenance. Precise adjustment and positioning of the packaging rack assembly 10 ensures that the fiber Bragg grating temperature sensor array maintains the correct position and angle during the packaging process, further improving packaging accuracy and efficiency. A PLC controller 11 is fixed to the front surface of the packaging rack assembly 10, and a packaging assembly 12 is mounted inside the packaging rack assembly 10. The PLC controller 11, serving as the intelligent brain of the packaging equipment, is responsible for receiving temperature data from the temperature sensor chip assembly 9 and issuing control instructions to the packaging assembly 12 according to preset program logic. Its high-precision data processing capabilities and fast response speed ensure efficient and accurate packaging. The packaging assembly 12, in turn, undertakes the specific packaging task. Through its precise mechanical structure and advanced packaging technology, it securely packages the fiber Bragg grating temperature sensor array in the designated position while ensuring its stable and reliable performance. The collaborative operation of the PLC controller 11 and the packaging assembly 12 enables automated and intelligent operation of the entire packaging equipment, significantly improving packaging efficiency and quality. Example

[0025] like Figure 6As shown, a fiber Bragg grating temperature sensing array packaging device proposed by the present invention, compared with the first embodiment, this embodiment further includes: the first fixing component 7 and the second fixing component 8 have the same structure, and limited support blocks 71 are provided on both sides of the first fixing component 7, and a guide rail 74 is installed between the limited support blocks 71. A U-shaped slide 72 is installed on the guide rail 74. The limited support block 71 not only provides a stable support for the guide rail 74, but also limits the horizontal movement range of the U-shaped slide 72, thereby ensuring the stability and accuracy of the packaging and facilitating the position adjustment of the fiber Bragg grating temperature sensing array. A locking screw 73 is installed on the upper surface of the U-shaped slide 72, and the bottom of the locking screw 73 is aligned with the guide rail. The U-shaped slide 72 is in contact with the guide rail 74. The function of the locking screw 73 is that when the U-shaped slide 72 is adjusted to the appropriate position, the locking screw 73 is rotated to press the bottom thereof against the guide rail 74, thereby fixing the U-shaped slide 72 to prevent displacement during the packaging process. An adjustment fixing structure 75 is installed on one side wall of the U-shaped slide 72. The design of the adjustment fixing structure 75 enables the position of the fiber Bragg grating temperature sensing array to be flexibly adjusted during the installation process to ensure precise positioning and ensure that no displacement or loosening occurs during the packaging process. Through such a sophisticated design, the first fixing component 7 and the second fixing component 8 can work together to ensure the precise fixation and stable packaging of the fiber Bragg grating temperature sensing array during the packaging process.

[0026] In this embodiment, Figure 7As shown, a fixed base 751 is provided on the adjustment and fixing structure 75, and the fixed base 751 is fixed to the upper surface of the processing box 1 by screws. A rotating shaft seat 752 is fixed on the upper surface of the fixed base 751, and a rotating support rod 758 is adjusted on the upper end of the rotating shaft seat 752. An angle rotating grip 753 is installed on the upper surface of one end of the rotating support rod 758, and the bottom rotating rod of the angle rotating grip 753 passes through the rotating support rod 758 and is fixedly connected to the upper surface of the rotating shaft seat 752. The fixed connection between the bottom rotating rod of the angle rotating grip 753 and the rotating shaft seat 752 ensures the stability and reliability of the rotation action. The user can rotate the grip plate 753 by rotating the angle, driving the rotating support rod 758 and the rotating pressing rod 755 to rotate together, thereby adjusting the angle of the fiber Bragg grating temperature sensing array to meet different packaging requirements. The rotating support rod 758 is provided with an adjustment slide 757. The setting of the adjustment slide 757 allows the user to flexibly adjust the position of the rotating pressing rod 755 according to the specific position and size of the sensing array, thereby achieving accurate fixation of the fiber Bragg grating temperature sensing array in different directions. The rotating support rod 758 is provided with a rotating pressing rod 755. The top of the rotating pressing rod 755 is installed with a rotating disk 754, and the bottom of the rotating pressing rod 755 is installed with an anti-slip rubber pressure plate 756. The design allows the user to easily rotate the rotary pressing rod 755, and then stably press down and fix the fiber Bragg grating temperature sensor array through the anti-slip rubber pressing plate 756; the anti-slip rubber pressing plate 756 can fit tightly on the surface of the fiber Bragg grating temperature sensor array, not only providing sufficient friction to prevent the sensor array from sliding during the packaging process, but also protecting the sensor array from damage due to its soft material; the design of the entire adjustment and fixing structure 75 takes into account the convenience of operation, the stability of the fixation and the safety of the sensor array, and fully reflects the care and exquisite craftsmanship in the detail design of this packaging equipment. Such a design not only improves the packaging efficiency, but also ensures the stability and reliability of the packaging quality.

[0027] In this embodiment, Figure 6As shown, a chip substrate 91 is provided on the temperature sensor chip assembly 9. The chip substrate 91 is the core part of the temperature sensor chip assembly 9. Its good thermal conductivity ensures the accurate collection of temperature information. Data transmission lines 92 are installed around the upper surface of the chip substrate 91. The data transmission line 92 is responsible for efficiently and accurately transmitting the collected temperature information to the control module for subsequent processing and analysis. One end of the data transmission line 92 is electrically connected to the control module, and a packaging shell 94 is clamped on the control module. The design of the packaging shell 94 not only protects the control module from interference from the external environment, but also ensures the stability and reliability of the connection between the data transmission line 92 and the control module; the structural design of the entire temperature sensor chip assembly 9 is compact and reasonable, which not only meets the high-precision requirements of the packaging equipment for the temperature sensor array, but also facilitates user installation and maintenance.

[0028] In this embodiment, Figure 6 As shown, a disassembly lifting rod 93 is installed on the outer wall of one side of the packaging shell 94, and a snap-in groove 95 is opened on the upper surface of the packaging shell 94, and the snap-in groove 95 and the snap-in block 125 are snap-locked. The design of the disassembly lifting rod 93 provides the user with a convenient disassembly method, so that when the temperature sensor chip assembly 9 needs to be maintained or replaced, the user can easily remove the packaging shell 94 from the control module; and the snap-in locking structure between the snap-in groove 95 and the snap-in block 125 further enhances the connection stability between the packaging shell 94 and the control module, and avoids loosening or falling off of the connection due to external factors; this design not only improves the reliability and durability of the entire temperature sensor chip assembly 9, but also brings a more convenient and safe operation experience to the user.

[0029] In this embodiment, Figure 3 As shown, the packaging rack assembly 10 is provided with a rear support plate 101 and a front support plate 102, and four electromagnetic sliding rails 103 are installed on the upper and lower sides of the rear support plate 101 and the front support plate 102, and a sliding rod 104 is installed between the electromagnetic sliding rails 103. The sliding rod 104 achieves stable and precise sliding through the electromagnetic force of the electromagnetic sliding rails 103. This design not only improves the positioning accuracy of the temperature sensor chip assembly 9 during the packaging process, but also ensures its stability under different temperature environments; the rear support plate 101 and the front support plate 102 serve as the main supporting structures of the packaging rack assembly 10, providing a solid foundation for the entire packaging process; the uniform distribution of the four electromagnetic sliding rails 103 further enhances the stability of the sliding rod 104 in the horizontal direction, so that it can be quickly and accurately moved to the specified position when needed. This structural design not only optimizes the packaging process, but also improves the packaging efficiency, bringing users a more efficient and reliable packaging experience.

[0030] In this embodiment, Figure 3 As shown, the sliding rod 104 is installed at the upper and lower ends of the central mounting sleeve rod 105. The central mounting sleeve rod 105 serves as a supporting structure for the sliding rod 104, which not only enhances the load-bearing capacity of the sliding rod 104, but also provides it with a stable guiding effect. Annular clamps 106 are installed at the upper and lower ends of the inner wall of the central mounting sleeve rod 105. The annular clamps 106 are fastened with a downward pressure cylinder 121. The downward pressure cylinder 121 is tightly connected to the central mounting sleeve rod 105 through the annular clamps 106. This design ensures the stability and accuracy of the downward pressure cylinder 121 during the packaging process; and the design of the annular clamps 106 further ensures that the connection between the downward pressure cylinder 121 and the central mounting sleeve rod 105 is firm and reliable, avoiding the problem of inaccurate positioning or poor packaging effect caused by loosening during the packaging process; through such a structural design, the entire packaging equipment can maintain a high degree of stability and accuracy when packaging the fiber Bragg grating temperature sensor array, thereby improving the packaging efficiency and quality.

[0031] In this embodiment, Figure 4 and Figure 5 As shown, the packaging assembly 12 is provided with a pressing cylinder 121, and a fastening sleeve 126 is installed on the output end of the pressing cylinder 121. The fastening sleeve 126 further fixes the output end of the pressing cylinder 121, ensuring that the output end of the pressing cylinder 121 can stably apply pressure during the packaging process, thereby ensuring the stability and consistency of the packaging effect. The support rod of the fastening sleeve 126 is installed with an infrared locator 123. The addition of the infrared locator 123 greatly improves the positioning accuracy during the packaging process. Through precise infrared measurement, the fiber Bragg grating temperature sensor array can be accurately positioned, avoiding the problem of poor packaging effect or sensor performance damage caused by inaccurate positioning. The output end of the pressing cylinder 121 is installed with a detachable mounting sleeve 122. The design of the detachable mounting sleeve 122 makes it easier and faster to operate when replacing or maintaining the fiber Bragg grating temperature sensor array, improving the flexibility and ease of use of the equipment. Such a design not only improves the packaging efficiency, but also further ensures the performance and quality of the packaged fiber Bragg grating temperature sensor array.

[0032] In this embodiment, Figure 4 and Figure 5As shown, a lower pressing plate 124 is installed at the bottom of the detachable mounting sleeve 122. Two locking rails 128 are provided at the bottom of the lower pressing plate 124. The locking rails 128 are installed with a clamping block 125 through a locking slider 127. The design of the clamping block 125 enables the lower pressing plate 124 to be firmly clamped to the packaging position of the fiber Bragg grating temperature sensor array, ensuring the stability of the lower pressing plate 124 during the packaging process; and the cooperation of the locking rails 128 and the locking slider 127 provides a flexible locking and releasing mechanism, allowing the operator to easily adjust the position and tightening degree of the lower pressing plate 124 as needed.

[0033] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A fiber Bragg grating temperature sensor array packaging device, comprising a processing box (1), a frame (3), a first fixing assembly (7), a temperature sensor chip assembly (9), a packaging frame assembly (10) and a packaging assembly (12); characterized in that: A frame (3) is installed at the bottom of the processing box (1), balance adjustment support rods (2) are installed at the edges of the bottom of the frame (3), and two storage cavities (4) are provided on the lower side of the frame (3). A pull-out box (6) is installed on the front surface of the processing box (1) through a slide rail, and an anti-slip pull rod (5) is fixed to the front surface of the pull-out box (6) through screws. A first fixing component (7) and a second fixing component (8) are installed on the front and rear sides of the upper surface of the processing box (1), a temperature sensor chip component (9) is placed at the center of the upper surface of the processing box (1), a packaging frame component (10) is installed on the first fixing component (7) and the second fixing component (8), a PLC controller (11) is fixed on the front surface of the packaging frame component (10), and a packaging component (12) is installed on the inner side of the packaging frame component (10).

2. A fiber Bragg grating temperature sensor array packaging device according to claim 1, characterized in that: The first fixing assembly (7) and the second fixing assembly (8) have the same structure. Limiting support blocks (71) are provided on both sides of the first fixing assembly (7). A guide rail (74) is installed between the limiting support blocks (71). A U-shaped slide (72) is installed on the guide rail (74). A locking screw (73) is installed on the upper surface of the U-shaped slide (72), and the bottom of the locking screw (73) is in contact with the guide rail (74). An adjusting fixing structure (75) is installed on one side wall of the U-shaped slide (72).

3. A fiber Bragg grating temperature sensor array packaging device according to claim 2, characterized in that: The adjusting and fixing structure (75) is provided with a fixed base (751), which is fixed to the upper surface of the processing box (1) by screws, and a rotating shaft seat (752) is fixed on the upper surface of the fixed base (751), and the upper end of the rotating shaft seat (752) is adjusted with a rotating support rod (758), and an angle rotating grip (753) is installed on the upper surface of one end of the rotating support rod (758), and the bottom rotating rod of the angle rotating grip (753) passes through the rotating support rod (758) and is fixedly connected to the upper surface of the rotating shaft seat (752), and an adjusting groove (757) is provided on the rotating support rod (758), and a rotating pressing rod (755) is provided on the rotating support rod (758), and a rotating disc (754) is installed on the top of the rotating pressing rod (755), and an anti-slip rubber pressure plate (756) is installed on the bottom of the rotating pressing rod (755).

4. A fiber Bragg grating temperature sensor array packaging device according to claim 1, characterized in that: A chip substrate (91) is provided on the temperature sensor chip assembly (9), and data transmission lines (92) are installed around the upper surface of the chip substrate (91). One end of the data transmission line (92) is electrically connected to the control module, and a packaging shell (94) is clamped on the control module.

5. A fiber Bragg grating temperature sensor array packaging device according to claim 4, characterized in that: A disassembly lifting rod (93) is installed on one side outer wall of the packaging shell (94), and a clamping groove (95) is opened on the upper surface of the packaging shell (94), and the clamping groove (95) and the clamping block (125) are clamped and locked.

6. A fiber Bragg grating temperature sensor array packaging device according to claim 1, characterized in that: A rear support plate (101) and a front support plate (102) are provided on the packaging frame assembly (10), four electromagnetic sliding rails (103) are installed on the upper and lower sides of the rear support plate (101) and the front support plate (102), and sliding rods (104) are installed between the electromagnetic sliding rails (103).

7. A fiber Bragg grating temperature sensor array packaging device according to claim 6, characterized in that: The sliding rod (104) is installed at the upper and lower ends of the central mounting sleeve rod (105), and the upper and lower ends of the inner side wall of the central mounting sleeve rod (105) are installed with an annular clamp (106), and the annular clamp (106) is fastened with a lower pressure cylinder (121).

8. A fiber Bragg grating temperature sensor array packaging device according to claim 1, characterized in that: The packaging assembly (12) is provided with a pressing cylinder (121), a fastening sleeve (126) is installed on the output end of the pressing cylinder (121), an infrared locator (123) is installed on the support rod of the fastening sleeve (126), and a detachable mounting sleeve (122) is installed on the output end of the pressing cylinder (121).

9. A fiber Bragg grating temperature sensor array packaging device according to claim 8, characterized in that: A lower pressing plate (124) is installed at the bottom of the detachable mounting sleeve (122), and two locking rails (128) are provided at the bottom of the lower pressing plate (124). The locking rails (128) are installed with a clamping block (125) through a locking slider (127).

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