Special micro-seismic prevention base for photoetching machine

Abstract

The invention relates to the technical field of lithography machine bases, and discloses a lithography machine special-purpose anti-microseismic base, which comprises two cement bases, and also comprises a first cement shell located at one side of the cement bases; the first isolation module is located in the first cement shell; the lower panel is fixed above the first cement shell; the stiffened plate is fixed above the lower panel and is used for supporting; the upper panel is fixed on the stiffened plate; the anti-microseismic base of the photoetching machine has a remarkable anti-microseismic effect; the upper panel and the lower panel form a symmetrical structure through the vertically distributed stiffened plates; the stiffened plate serves as a core damping unit, right-angle grooves and acute-angle grooves formed in the stiffened plate form a multi-stage vibration suppression system, and the right-angle grooves change the vibration wave conduction direction according to the stress wave reflection principle to force part of vibration energy to return to an original propagation medium. The acute-angle grooves refract and scatter vibration waves in multiple directions based on the stress wave refraction theory, so that vibration energy is diffused and attenuated to a three-dimensional space, and the broadband damping characteristic is formed.

Description

Technical Field

[0001] The present invention relates to the technical field of photolithography machine bases, and in particular to a special anti-micro-vibration base for photolithography machines. Background Art

[0002] As core equipment in the semiconductor manufacturing field, the operating accuracy of photolithography machines directly determines the level of advancement in chip manufacturing processes. The nano-scale processing environment places extremely high demands on the base's anti-microvibration performance. Existing photolithography bases generally face the following technical bottlenecks in microvibration suppression: Traditional base structures often use a single material or a simple laminated design, with a single damping mechanism that makes it difficult to cope with the multi-band, multi-directional microseismic excitations generated by moving parts. For example, some bases rely solely on the inertial mass of cement materials for vibration damping. Although they can suppress low-frequency vibrations through their large mass characteristics, they lack effective attenuation measures for medium- and high-frequency microseismic events in the 10-100Hz frequency range. Vibration energy can easily be directly transmitted to optical components through rigid connection structures, resulting in reduced imaging accuracy. At the same time, the damping properties of a single material are limited, making it impossible to achieve multi-level dissipation of vibration energy. In particular, the lack of targeted design in the stress wave propagation path makes it difficult to change the direction of vibration transmission through physical mechanisms such as reflection and refraction, resulting in significant energy concentration.

[0003] Existing vibration-damping structures have limitations in their mechanical design. Most reinforced panels provide only structural support and lack a systematic vibration suppression unit. For example, conventional grooves or through-hole structures can only reflect energy in a single direction, failing to construct a complex conductive maze. Their ability to scatter oblique vibration waves is insufficient, resulting in limited energy diffusion in three-dimensional space. Field measurements have shown that conventional structures typically reduce the energy density of oblique vibration by less than 30%, and lack wide bandwidth coverage, making them difficult to meet the comprehensive multi-modal vibration suppression requirements of lithography machines. Summary of the Invention

[0004] The present invention provides a special anti-micro-vibration base for a photolithography machine, which has the functions of preventing micro-vibration and facilitating wiring and pipe laying.

[0005] In order to solve the above technical problems, the technical solutions of the present invention are as follows: In a first aspect, a micro-vibration-proof base for a lithography machine includes two cement bases and: A first cement shell is located on one side of the cement base; a first isolation module is located inside the first cement shell; and a lower panel is fixed above the first cement shell; The stiffened plate is fixed above the lower panel to provide support; the upper panel is fixed on the stiffened plate; and the reserved plate is fixed on the upper panel.

[0006] The stiffened plate includes: two first stiffened plates, the two first stiffened plates are fixed above the lower panel and are symmetrically arranged on the same side of the lower panel; two second stiffened plates are provided, the two second stiffened plates are fixed above the lower panel and are symmetrically arranged between the two first stiffened plates; two third stiffened plates are provided, the two third stiffened plates are fixed above the lower panel and are symmetrically arranged on both sides of the middle area of the lower panel; two fourth stiffened plates are provided, the two fourth stiffened plates are fixed above the lower panel and are symmetrically arranged between the two third stiffened plates; a fifth stiffened plate is fixed above the lower panel and is located on a side of the lower panel away from the first stiffened plates; Right-angle grooves are provided on the first stiffening plate, the second stiffening plate, the third stiffening plate and the fifth stiffening plate to block horizontal vibrations; Sharp-angle grooves are provided on the first stiffening plate, the second stiffening plate and the third stiffening plate to guide the vertical vibration to disperse obliquely downward.

[0007] Furthermore, the cement base includes: The second cement shell is located on one side of the cement base; the second isolation module is located in the second cement shell; the steel frame is fixed in the second cement shell; and the embedded plate is fixed on the steel frame.

[0008] Furthermore, a first docking hole is provided on the upper portion of the first cement shell; a second docking hole is provided on the lower panel, and the first docking hole is connected to the second docking hole.

[0009] Furthermore, six first isolation modules are provided, and the six first isolation modules are distributed in a matrix of two rows and three columns.

[0010] Furthermore, the upper panel is provided with a reserved groove, the reserved groove is provided with a first threaded hole, the reserved plate is provided with a second threaded hole, and the first threaded hole is connected to the second threaded hole.

[0011] Furthermore, a cross bracing plate is fixed below the reserved plate.

[0012] Furthermore, the intersection of the diagonals of the right-angle grooves is chamfered.

[0013] Furthermore, the included angle of the acute-angle groove is 60°, and the intersection of the diagonals of the acute-angle groove is chamfered.

[0014] Furthermore, the steel reinforcement frame is located above the second isolation module.

[0015] Furthermore, the embedded plate is provided with embedded holes.

[0016] The above solution of the present invention includes at least the following beneficial effects: The anti-micro-seismic base of the lithography machine of the present invention has a significant anti-micro-seismic effect: the upper panel and the lower panel form a symmetrical structure through vertically distributed reinforced plates; the reinforced plates serve as the core shock-absorbing units, and the right-angle grooves and acute-angle grooves opened thereon constitute a multi-stage vibration suppression system. The right-angle grooves use the stress wave reflection principle to change the transmission direction of the vibration wave, forcing part of the vibration energy to return to the original propagation medium; the acute-angle grooves refract and scatter the vibration waves in multiple directions based on the stress wave refraction theory, so that the vibration energy diffuses and attenuates into three-dimensional space. The two cooperate to form a broadband shock-absorbing characteristic; the residual vibration is transmitted to the first cement shell through a rigid connection, and the internal isolation module is absorbed by secondary buffering through viscoelastic material. The cement base layer uses the high damping characteristics of the material and the large mass inertia effect to convert the vibration energy into heat energy through the friction energy consumption mechanism and gradually dissipate it, ensuring the nano-precision environment requirements for the operation of the lithography machine.

[0017] The present invention is installed in the reserved groove of the upper panel through the reserved plate, and is fixed with bolts through the first threaded hole of the reserved groove and the second threaded hole of the reserved plate. When necessary, the bolts can be removed to remove the reserved plate and retain the reserved opening. The reserved groove has a large area to facilitate wiring and piping. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The disclosure of the present invention is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. In the accompanying drawings, the same reference numerals are used to refer to the same components. Among them: Figure 1 A schematic diagram of the overall structure of a first-view anti-vibration base for a lithography machine provided by an embodiment of the present invention; Figure 2 A schematic diagram of the overall structure of a first-view anti-vibration base for a lithography machine provided by an embodiment of the present invention; Figure 3 A schematic structural diagram of an upper panel of an anti-microvibration base for a lithography machine provided by an embodiment of the present invention; Figure 4 A schematic structural diagram of a lower panel of an anti-microvibration base for a lithography machine provided by an embodiment of the present invention; Figure 5 A schematic structural diagram of a first cement shell of a microvibration-proof base for a lithography machine provided in an embodiment of the present invention; Figure 6 A schematic structural diagram of a reserved plate of a micro-vibration-proof base for a lithography machine provided in an embodiment of the present invention; Figure 7 A schematic structural diagram of a pre-embedded plate of a micro-vibration-proof base for a lithography machine provided by an embodiment of the present invention; Figure 8 A schematic structural diagram of a first stiffening plate of a micro-vibration-proof base for a lithography machine provided in an embodiment of the present invention; Figure 9 A schematic structural diagram of a second stiffening plate of a micro-vibration-proof base for a lithography machine provided in an embodiment of the present invention; Figure 10 A schematic structural diagram of a third stiffening plate of a micro-vibration-proof base for a lithography machine provided by an embodiment of the present invention; Figure 11 A schematic structural diagram of a fourth stiffening plate of an anti-microvibration base for a lithography machine provided in an embodiment of the present invention; Figure 12 A schematic structural diagram of the fifth stiffening plate of an anti-microvibration base dedicated to a lithography machine provided in an embodiment of the present invention.

[0019] Description of reference numerals: In the figure: 1. Cement base; 2. First cement shell; 201. First docking hole; 3. First isolation module; 4. Lower panel; 401. Second docking hole; 5. Reinforced plate; 501. First reinforced plate; 502. Second reinforced plate; 503. Third reinforced plate; 504. Fourth reinforced plate; 505. Fifth reinforced plate; 6. Upper panel; 601. Reserved groove; 602. First threaded hole; 7. Reserved plate; 701. Second threaded hole; 702. Cross brace; 8. Right-angle groove; 9. Sharp-angle groove; 10. Second cement shell; 11. Second isolation module; 12. Steel bar frame; 13. Embedded plate; 1301. Embedded hole. DETAILED DESCRIPTION

[0020] It is easy to understand that according to the technical solution of the present invention, without changing the essential spirit of the present invention, a person skilled in the art can propose a variety of interchangeable structural modes and implementation modes. Therefore, the following specific embodiments and drawings are only exemplary descriptions of the technical solution of the present invention and should not be regarded as the entire invention or as a limitation or restriction of the technical solution of the present invention.

[0021] like Figures 1 to 12 As shown, an embodiment of the present invention provides a special anti-microvibration base for a lithography machine, including: two cement bases 1, and also including: a first cement shell 2, located on one side of the cement base 1; a first isolation module 3, located in the first cement shell 2; a lower panel 4, fixed above the first cement shell 2; a stiffening plate 5, fixed above the lower panel 4; an upper panel 6, fixed on the stiffening plate 5; and a reserved plate 7, fixed on the upper panel 6.

[0022] The stiffening plate 5 includes: a first stiffening plate 501, which is provided with two, and the two first stiffening plates 501 are fixed above the lower panel 4, and are symmetrically arranged on the same side of the lower panel 4; a second stiffening plate 502, which is provided with two, and the two second stiffening plates 502 are fixed above the lower panel 4, and are symmetrically arranged between the two first stiffening plates 501; a third stiffening plate 503, which is provided with two, and the two third stiffening plates 503 are fixed above the lower panel 4, and are symmetrically arranged on both sides of the middle area of the lower panel 4; a fourth stiffening plate 504, which is provided with two, and the two fourth stiffening plates 504 are fixed above the lower panel 4, and are symmetrically arranged between the two third stiffening plates 503; a fifth stiffening plate 505, which is fixed above the lower panel 4 and is located on the side of the lower panel 4 away from the first stiffening plate 501; a right-angle groove 8 is provided on the first stiffening plate 501, the second stiffening plate 502, and the third stiffening plate The reinforced plate 503 and the fifth reinforced plate 505 are used to block horizontal vibrations; the acute-angle groove 9 is opened on the first reinforced plate 501, the second reinforced plate 502 and the third reinforced plate 503, and is used to guide the vertical vibration to disperse obliquely downward; a first docking hole 201 is opened above the first cement shell 2; a second docking hole 401 is opened on the lower panel 4, and the first docking hole 201 is connected to the second docking hole 401; there are six first isolation modules 3, and the six first isolation modules 3 are distributed in a matrix of two rows and three columns; a reserved groove 601 is opened on the upper panel 6, and a first threaded hole 602 is opened on the reserved groove 601, and a second threaded hole 701 is opened on the reserved plate 7, and the first threaded hole 602 is connected to the second threaded hole 701; a cross bracing plate 702 is fixed below the reserved plate 7; the diagonal intersection of the right-angle groove 8 is chamfered; the acute-angle groove 9 has an angle of 60°, and the diagonal intersection of the acute-angle groove 9 is chamfered.

[0023] Specifically, the lower panel 4, the first stiffened plate 501, the second stiffened plate 502, the third stiffened plate 503, the fourth stiffened plate 504, the fifth stiffened plate 505, the upper panel 6 and the reserved plate 7 are made of SS41 steel plates, and the bearing weight of the steel plates is 20 tons.

[0024] As a preferred embodiment of the present invention, the cement base 1 includes: The second cement shell 10 is located on one side of the cement base 1; the second isolation module 11 is located inside the second cement shell 10; the steel frame 12 is fixed inside the second cement shell 10; the embedded plate 13 is fixed on the steel frame 12; the steel frame 12 is located above the second isolation module 11; the embedded plate 13 is provided with embedded holes 1301.

[0025] Specifically, the embedded hole 1301 is used to connect the optical components of the lithography machine.

[0026] The lithography machine base consists of two parts: a cement base 1 and a steel structure base. The two parts have clear division of labor and work together to support the optical and moving parts; the cement base 1 is mainly used to support the heavier optical components of the lithography machine, while the steel structure base supports the lighter moving parts through the upper panel 6.

[0027] In terms of the production of the cement base, the steel frame 12 is first fixed in the second cement shell 10 by simple welding, and then the second isolation module 11 and the embedded plate 13 are simply welded to the steel frame 12 in sequence; the side of the second cement shell 10 with the second isolation module 11 is facing downward, and cement is poured; after the cement dries, the first cement base 1 is completed, and the second cement base 1 is also produced according to the same steps.

[0028] The steel structure base structure consists of a first cement shell 2, a first isolation module 3, a lower panel 4, a reinforced plate 5, an upper panel 6, and a reserved plate 7. During its production, the first isolation module 3 is first placed in the first cement shell 2 in sequence with the help of an external auxiliary positioning tool. After the cement is poured and dried, the external auxiliary positioning tool is removed. The lower panel 4 is placed on top of the first cement shell 2, and the first docking hole 201 of the first cement shell 2 is precisely docked with the second docking hole 401 of the lower panel 4, and the two are firmly fixed with fixing bolts. Next, vertically weld the first stiffening plate 501, the second stiffening plate 502, the third stiffening plate 503, the fourth stiffening plate 504 and the fifth stiffening plate 505 to the lower panel 4, and then fix the upper panel 6 on these stiffening plates; install the reserved plate 7 in the reserved groove 601 of the upper panel 6, and fix it with bolts through the first threaded hole 602 of the reserved groove 601 and the second threaded hole 701 of the reserved plate 7. If necessary, remove the bolts and remove the reserved plate 7, retaining the reserved opening. The reserved groove 601 has a large area to facilitate wiring and piping.

[0029] Under the operating conditions of the lithography machine, the micro-seismic excitation generated by the moving parts is in the form of stress waves, starting from the upper panel 6 in direct contact with the lithography machine as the initial transmission interface; the upper panel 6 and the lower panel 4 are arranged parallel and symmetrically, and a "sandwich" mechanical structure is formed between the two through the vertically distributed stiffening plates 5, so that the stress wave produces an initial energy diffusion effect between the planar layers of the upper panel 6 and the lower panel 4; this mechanical structure converts the concentrated stress generated by the local vibration source into distributed stress within the structural surface through the uniform distribution characteristics of the in-plane stiffness, thereby realizing the initial dissipation of vibration energy.

[0030] The stiffened plate 5 serves as the core vibration-damping unit. The dual-angle groove structures (right-angle grooves 8 and acute-angle grooves 9) on the first, second, third, and fifth stiffened plates 501, 502, 503, and 505 comprise a multi-stage vibration suppression system. The 90-degree right-angle grooves 8 are based on the principle of total reflection of stress waves in elastic mechanics. When a vibration wave propagates to the groove interface, due to the sudden change in the acoustic impedance of the medium, some of the vibration energy returns to the original propagation path in the form of reflected waves. According to wave theory, a single reflection can achieve a horizontal vibration energy reflectivity of approximately 60%. This also changes the propagation direction of the vibration wave, forcing it to undergo complex multiple reflections within the plate. The 60-degree acute-angle grooves 9, based on the theory of stress wave refraction at oblique interfaces, refract and scatter vertical and oblique vibration waves at multiple angles, causing the vibration energy to diffuse and attenuate in three-dimensional space. Finite element simulations have shown that this structure can reduce oblique vibration energy density by over 45%. The symmetrical spatial distribution of the two grooves creates broadband vibration-damping characteristics covering the 10-100 Hz frequency range.

[0031] After multi-stage attenuation treatment by the reinforced plate 5, the residual vibration energy is transmitted to the first cement shell 2 through the rigid connection structure formed by the first docking hole 201 and the second docking hole 401 between the lower panel 4 and the first cement shell 2; as a transition layer of the steel-concrete structure, the six first isolation modules 3 distributed in a matrix of two rows and three columns inside the first cement shell 2 perform secondary buffering and absorption of the incoming vibration through the dynamic mechanical properties of the viscoelastic material; the arrangement of the first isolation modules 3 utilizes the modal decoupling principle in structural dynamics to effectively suppress the resonant response in a specific frequency band; when the vibration is transmitted to the cement base layer below the first cement shell 2, based on the high damping characteristics of the cement material (the damping ratio can reach 0.05-0.1) and the large mass inertia effect, the vibration energy is converted into heat energy and gradually dissipated through the friction energy consumption mechanism of the pores inside the material, ultimately achieving effective suppression of vibration excitation and ensuring the nano-precision environment requirements required for the operation of the lithography machine.

[0032] In the anti-micro-vibration base specially used for the lithography machine of the present invention, the angle combination of the right-angle groove 8 and the acute-angle groove 9 on the stiffened plate 5 realizes an unconventional change to the vibration conduction path; the present invention constructs a complex vibration conduction "maze" through the special angle setting of the 90° right-angle groove 8 and the 60° acute-angle groove 9.

[0033] When the vibration wave is transmitted to the reinforced plate 5, the 90° right-angle groove 8 uses the principle of stress wave reflection to cause the vibration wave to be strongly reflected at the interface of the groove body, changing its original conduction direction and forcing part of the vibration energy to return to the original propagation medium; the 60° acute-angle groove 9 is based on the stress wave refraction theory to refract and scatter the vibration wave in multiple directions, so that the vibration energy diffuses into three-dimensional space; the grooves of the two angles cooperate with each other, so that the vibration wave no longer follows the conventional conduction path in the reinforced plate 5, but constantly changes direction during multiple reflections and refractions, greatly increasing the conduction path length of the vibration wave to achieve the anti-microseismic effect.

[0034] The technical scope of the present invention is not limited to the contents of the above description. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical concept of the present invention, and these deformations and modifications should all fall within the protection scope of the present invention.

Claims

1. A micro-vibration-proof base for a lithography machine, comprising: Two cement bases, characterized in that they also include: A first cement shell is located on one side of the cement base; a first isolation module is located inside the first cement shell; and a lower panel is fixed above the first cement shell; The stiffened plate is fixed above the lower panel to provide support; the upper panel is fixed on the stiffened plate; and the reserved plate is fixed on the upper panel. The stiffened plate includes: two first stiffened plates, the two first stiffened plates are fixed above the lower panel and are symmetrically arranged on the same side of the lower panel; two second stiffened plates are provided, the two second stiffened plates are fixed above the lower panel and are symmetrically arranged between the two first stiffened plates; two third stiffened plates are provided, the two third stiffened plates are fixed above the lower panel and are symmetrically arranged on both sides of the middle area of the lower panel; two fourth stiffened plates are provided, the two fourth stiffened plates are fixed above the lower panel and are symmetrically arranged between the two third stiffened plates; a fifth stiffened plate is fixed above the lower panel and is located on a side of the lower panel away from the first stiffened plates; Right-angle grooves are provided on the first stiffening plate, the second stiffening plate, the third stiffening plate and the fifth stiffening plate to block horizontal vibrations; Sharp-angle grooves are provided on the first stiffening plate, the second stiffening plate and the third stiffening plate to guide the vertical vibration to disperse obliquely downward.

2. The micro-vibration-proof base for a lithography machine according to claim 1, characterized in that: The cement base comprises: The second cement shell is located on one side of the cement base; the second isolation module is located in the second cement shell; the steel frame is fixed in the second cement shell; and the embedded plate is fixed on the steel frame.

3. The anti-microvibration base for a lithography machine according to claim 1, characterized in that: A first docking hole is formed on the upper portion of the first cement shell; a second docking hole is formed on the lower panel, and the first docking hole is connected to the second docking hole.

4. The anti-microvibration base for a lithography machine according to claim 1, characterized in that: Six first isolation modules are provided, and the six first isolation modules are distributed in a matrix of two rows and three columns.

5. The anti-microvibration base for photolithography equipment according to claim 1, characterized in that: The upper panel is provided with a reserved groove, the reserved groove is provided with a first threaded hole, the reserved plate is provided with a second threaded hole, and the first threaded hole is connected to the second threaded hole.

6. The anti-microvibration base for a lithography machine according to claim 1, characterized in that: A cross bracing plate is fixed below the reserved plate.

7. The anti-microvibration base for a lithography machine according to claim 1, characterized in that: The intersection of the diagonals of the right-angle grooves is chamfered.

8. The anti-microvibration base for photolithography equipment according to claim 1, characterized in that: The included angle of the acute-angle groove is 60°, and the intersection of the diagonals of the acute-angle groove is chamfered.

9. The anti-microvibration base for a lithography machine according to claim 1, characterized in that: The steel reinforcement frame is located above the second isolation module.

10. The anti-microvibration base for photolithography equipment according to claim 1, characterized in that: The embedded plate is provided with embedded holes.

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