Heat dissipation integrated system of computer graphics card

Abstract

The invention relates to the technical field of graphics card heat dissipation, and discloses a computer graphics card heat dissipation integrated system which comprises a heat exchange shell, a cooling system and an inverter box, the heat exchange shell is used for direct heat dissipation of a graphics card chip, ammonium bicarbonate is injected into the heat exchange shell, and the ammonium bicarbonate is used for absorbing heat generated by the graphics card chip. The ammonium bicarbonate is heated and gasified to generate ammonia gas, carbon dioxide and water, the cooling system is used for cooling the water, the ammonia gas and the carbon dioxide generated after the ammonium bicarbonate is heated and decomposed, and the inverter box is used for recombining the heated and gasified ammonium bicarbonate, so that the ammonium bicarbonate can be heated and gasified again to take away heat emitted by a display card chip. And the heat exchange shell and the cooling system are linked with the inverter box and are used for heat dissipation of the display card chip and the display card mainboard.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of graphics cards, and in particular to a heat dissipation integrated system for computer graphics cards. Background Art

[0002] After extensive searching, it was discovered that the prior art publication number is CN112764501A, which discloses a heat dissipation integrated system for a computer graphics card. The metal shell of a computer chassis is used as a heat dissipation carrier, and a capillary tube is laid on the inner surface of the chassis shell, and then the heat in the graphics card is exported to the metal plate of the chassis through liquid cooling. In addition, the heat dissipation of the heat sink group can be performed secondary through air cooling of the device in this case. Secondly, by stacking the first hollow heat sink and the second hollow heat sink in sequence to form a heat sink group, the heat of the graphics card can be exchanged with the liquid cooling heat source of the capillary circulation.

[0003] Therefore, based on the above search and in combination with the existing, most graphics card cooling is air cooling and water cooling, and the cooling of water-cooled graphics cards is mostly done by water circulation cooling through a pump body. The water pump will generate noise when working, especially when the indoor noise level is low, the noise of the water pump may be more obvious, and while cooling the graphics card, it is unable to cool down the surrounding area of the graphics card and the graphics card motherboard, resulting in low cooling efficiency. The graphics card motherboard is in a high temperature state for a long time, which will lead to reduced performance and shortened service life. At the same time, the graphics card heats up very quickly. When the graphics card gradually heats up, the water circulation system is started to dissipate heat for the graphics card. At this time, the graphics card temperature is high, and it takes a long cycle time to lower the graphics card temperature. During this period, the graphics card is still in a high temperature state, shortening the service life of the graphics card. For this reason, we propose a heat dissipation integrated system for computer graphics cards. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the present invention provides a heat dissipation integrated system for a computer graphics card, which solves a series of problems such as high noise and poor cooling effect.

[0005] To achieve the above object, the present invention provides the following technical solution: a heat dissipation integrated system for a computer graphics card, comprising

[0006] Graphics card motherboard: A graphics card chip is fixedly installed on the top of the graphics card motherboard;

[0007] Graphics card support case: The graphics card support case is used to protect the graphics card motherboard and graphics card chip, and also supports the graphics card motherboard;

[0008] Heat exchange housing: used for direct heat dissipation of graphics card chips. Ammonium bicarbonate is stored inside the heat exchange housing and includes an elastic housing. The bottom of the elastic housing abuts the top of the graphics card chip. The elastic housing is conically arranged and made of elastic material. The top of the elastic housing is fixedly connected to a support housing made of brass with high thermal conductivity. The top of the support housing is fixedly connected to a telescopic housing, which abuts the top of the inner wall of the graphics card support housing. The outside of the heat exchange housing is connected to a cooling system for cooling the heated and vaporized ammonium bicarbonate.

[0009] Inverter box: The inverter box is fixedly connected to one side of the inner wall of the heat exchange shell, and is used to recombine the heated and vaporized ammonium bicarbonate, so that the ammonium bicarbonate can be heated and vaporized again, and take away the heat emitted by the graphics card chip. The heat exchange shell, cooling system and inverter box are linked to dissipate heat from the graphics card chip and the graphics card motherboard.

[0010] Preferably, the cooling system includes a first cooling pipe connected to the outside of the elastic shell, the first cooling pipe is arranged in a serpentine shape on the top of the graphics card mainboard, two first cooling pipes are provided and are arranged symmetrically, the first cooling pipes are made of rubber plastic material, and a first cooling fan is provided on the top of the two first cooling pipes, and the two first cooling fans are fixedly connected to both sides of the inner wall of the graphics card support shell.

[0011] Preferably, one end of the two first cooling pipes is connected to the second cooling pipe, the two second cooling pipes are arranged on the top of the corresponding first cooling fans, one end of the two first cooling fans is connected to the third cooling pipe, the two third cooling pipes are surrounded by the outside of the heat exchange shell, and one end of the two third cooling pipes is connected to the inverter box.

[0012] Preferably, one side of the inverter box is connected to a carbon dioxide pipe, one end of the carbon dioxide pipe is connected to the interior of the heat exchange shell, the top of the inverter box is connected to a pressure pipe, one end of the pressure pipe is connected to the interior of the heat exchange shell, the outside of the pressure pipe is connected to a connecting pipe, one side of the connecting pipe is connected to an ammonia pipe, one end of the ammonia pipe is connected to one side of the inverter box.

[0013] Preferably, a first pressure valve is installed at one end of each of the two third cooling pipes, and a second pressure valve is installed outside the carbon dioxide pipe, and the pressure value of the second pressure valve is greater than the pressure values of the two first pressure valves.

[0014] Preferably, sliding grooves are provided on both sides of the inner wall of the inverter box, two sliding rods are fixedly connected to the inside of the two sliding grooves, the outsides of the four sliding rods are slidably connected to the same sliding plate, the outsides of the four sliding rods are movably sleeved with telescopic springs, the four telescopic springs are fixedly connected to the bottom of the sliding plate, the top of the sliding plate is fixedly connected to a pressure block, and the pressure block is slidably connected to the inside of the pressure tube.

[0015] Preferably, a material discharge trough is provided at the bottom of the inner wall of the inverter box, and the bottom of the inner wall of the inverter box is arranged with both sides inclined toward the material discharge trough. Both sides of the material discharge trough are fixedly connected with material discharge baffles, and the bottom of the sliding plate is fixedly connected with a material discharge block, and the material discharge baffles are adapted to the material discharge block.

[0016] Preferably, a first fusion plate is fixedly connected to both sides of the inner wall of the inverter box, a second fusion plate is fixedly connected to both sides of the inner wall of the inverter box, and a third fusion plate is fixedly connected to both sides of the inner wall of the inverter box. The tops of the first fusion plate, the second fusion plate and the third fusion plate are all arranged at an angle, and fusion grooves are provided on the tops of the first fusion plate, the second fusion plate and the third fusion plate.

[0017] Compared with the prior art, the present invention provides a heat dissipation integrated system for a computer graphics card, which has the following beneficial effects:

[0018] 1. The heat exchange shell is set up to directly dissipate heat for the graphics card chip. Ammonium bicarbonate is injected into the heat exchange shell. The chemical properties of ammonium bicarbonate are used to centrally dissipate heat for the graphics card chip, and the reaction product can take away the heat generated by the chip motherboard, achieving targeted heat dissipation and improving the performance of the graphics card chip and the graphics card motherboard. At the same time, the fan built into the graphics card is used to cool the graphics card, and the reverse reactant of ammonium bicarbonate can also be cooled, so that the reverse reaction of ammonium bicarbonate can be realized, achieving low-noise and precise heat dissipation of the graphics card chip.

[0019] 2. When the operating temperature of the graphics card chip is lower than the vaporization temperature of ammonium bicarbonate, the fan is used to cool and dissipate heat inside the graphics card support shell. When the operating temperature of the graphics card chip is higher than the vaporization temperature of ammonium bicarbonate, the ammonium bicarbonate is directly heated and vaporized, absorbing and taking away the heat of the graphics card chip. Compared with traditional water circulation heat conversion, it can achieve step-by-step fanning of the graphics card motherboard and the chip graphics card, and at the same time has the effect of rapid heat absorption and heat conversion. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0021] Figure 2 This is a schematic structural diagram of the graphics card mainboard portion of the present invention;

[0022] Figure 3 for Figure 2 A schematic diagram of the enlarged structure of part A;

[0023] Figure 4 It is a structural schematic diagram of the first cooling pipe part of the present invention;

[0024] Figure 5 for Figure 4 A schematic diagram of the enlarged structure of part A;

[0025] Figure 6 Schematic diagram of the internal structure of the present invention;

[0026] Figure 7 for Figure 6 A schematic diagram of the enlarged structure of part A;

[0027] Figure 8 It is a structural schematic diagram of the inverter box part of the present invention;

[0028] Figure 9 It is a schematic structural diagram of the heat exchange shell portion of the present invention;

[0029] Figure 10 It is a schematic structural diagram of the interior of the heat exchange shell of the present invention;

[0030] Figure 11 A schematic structural diagram of the interior of the heat exchange housing of the present invention from another perspective;

[0031] Figure 12 for Figure 11 A schematic diagram of the enlarged structure of part A;

[0032] Figure 13 It is a structural schematic diagram of the sliding groove part of the present invention.

[0033] Figure: 1. Graphics card support housing; 2. Ventilation holes; 3. Dust screen; 4. Graphics card chip; 5. Heat exchange housing; 6. Graphics card motherboard; 7. Elastic housing; 8. Support housing; 9. Telescopic housing; 10. Cooling system; 11. Inverter box; 12. First cooling pipe; 13. First cooling fan; 14. Second cooling pipe; 15. Third cooling pipe; 16. Isolation net; 17. Heat sink; 18. CO2 pipe; 19. First pressure valve; 20. Pressure pipe; 21 , connecting pipe; 22, ammonia pipe; 23, sliding groove; 24, sliding rod; 25, sliding plate; 26, telescopic spring; 27, pressure block; 28, second pressure valve; 29, spring sheet; 30, spring slot; 31, discharge trough; 32, discharge partition; 33, discharge block; 34, second fusion plate; 35, third fusion plate; 36, fusion groove; 37, second cooling fan; 38, sealing groove; 39, sealing ring; 40, avoidance groove; 41, first fusion plate. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] As introduced in the background technology, there are deficiencies in the existing technology. In order to solve the above technical problems, this application proposes a heat dissipation integrated system for computer graphics cards.

[0036] Example 1, as Figure 1 、 Figure 2 、 Figure 9 and Figure 10 As shown, a heat dissipation integrated system for a computer graphics card includes:

[0037] The graphics card main board 6 has a graphics card chip 4 fixedly mounted on the top of the graphics card main board 6 .

[0038] The graphics card support shell 1 is used to protect the graphics card motherboard 6 and the graphics card chip 4, and at the same time support the graphics card motherboard 6. A number of ventilation holes 2 are opened on both sides of the graphics card support shell 1, and the ventilation holes 2 are arranged at intervals. The interiors of the ventilation holes 2 are fixedly connected with dustproof nets 3. Cold air can be sucked into the interior of the graphics card support shell 1 through the provided ventilation holes 2, and the dust in the air can be isolated from the outside through the provided dustproof net 3 to prevent dust from accumulating on the surface of the graphics card motherboard 6 and reducing the heat dissipation performance of the graphics card motherboard 6.

[0039] The heat exchange shell 5 is used for direct heat dissipation of the graphics card chip 4. Ammonium bicarbonate is stored inside the heat exchange shell 5. Specifically, ammonium bicarbonate is a white compound with the chemical formula NH4HCO3. It is in the form of granular, plate-like or columnar crystals. It is stable at room temperature, but will decompose at higher temperatures. When the ambient temperature reaches above 30°C, ammonium bicarbonate begins to decompose in large quantities to produce ammonia (NH3), carbon dioxide (CO2) and water vapor (H2O). As the temperature continues to rise, the decomposition speed accelerates until the ammonium bicarbonate is completely gasified at about 60°C. This process is endothermic, which means that during the decomposition process, carbon dioxide (CO2) and water vapor (H2O) are generated. Ammonium bicarbonate absorbs heat, and the chemical equation for the decomposition reaction is: NH4HCO3(s)→NH3(g)+H2O(g)+CO2(g). This reaction usually occurs above 36°C, and can be completely decomposed at 60°C. At the same time, the decomposition of ammonium bicarbonate is a reversible reaction, and the substances produced by the decomposition can be recombined to form ammonium bicarbonate. More specifically, at room temperature and pressure, water, ammonia and carbon dioxide can react to form ammonium bicarbonate. First, ammonia (NH3) dissolves in water to form ammonia water (NH3·H2O), and then reacts with carbon dioxide (CO2) to form ammonium bicarbonate (NH4HCO3). The process is expressed in the following chemical equation: NH3+H2O+CO2=NH4HCO3. It is worth mentioning that although ammonium bicarbonate decomposes into a mixed gas of NH3 (ammonia), CO2 (carbon dioxide), and H2O (water vapor) when heated and vaporized, the temperature of H2O (water vapor) is lower than 100° after decomposition, so that H2O (water vapor) will condense into water. The heat exchange shell 5 includes an elastic shell 7. The top of the elastic shell 7 abuts against the top of the graphics card chip 4. The elastic shell 7 is arranged in a cone shape and is made of elastic material. The top of the elastic shell 7 is fixedly connected to a support shell 8. The support shell 8 is made of brass and has high The top of the supporting shell 8 is fixedly connected with a telescopic shell 9, and the top of the telescopic shell 9 abuts against the top of the inner wall of the graphics card support shell 1, so that when the graphics card chip 4 works and reaches the decomposition temperature of ammonium bicarbonate, the ammonium bicarbonate is heated and vaporized to produce a large amount of gas, which increases the internal pressure of the heat exchange shell 5, causing the telescopic shell 9 to extend and act on the elastic shell 7, so that the bottom of the elastic shell 7 fits around the graphics card chip 4, cools the surrounding of the graphics card chip 4, and improves the service life of the graphics card mainboard 6 and the graphics card chip 4. The outside of the heat exchange shell 5 is connected to a cooling system 10 for cooling the heated and vaporized ammonium bicarbonate.

[0040] The inverter box 11 is fixedly connected to one side of the inner wall of the heat exchange shell 5 and is used to recombine the heated and vaporized ammonium bicarbonate so that the ammonium bicarbonate can be heated and vaporized again, taking away the heat emitted by the graphics card chip 4. The heat exchange shell 5, the cooling system 10 and the inverter box 11 are linked to dissipate heat from the graphics card chip 4 and the graphics card motherboard 6.

[0041] like Figure 2-9As shown, the cooling system 10 includes a first cooling pipe 12 connected to the outside of the elastic shell 7, the first cooling pipe 12 is arranged in a serpentine shape on the top of the graphics card motherboard 6, two first cooling pipes 12 are provided and are symmetrically arranged, the first cooling pipe 12 is made of rubber plastic material, and a first cooling fan 13 is provided on the top of the two first cooling pipes 12. The two first cooling fans 13 are fixedly connected to both sides of the inner wall of the graphics card support shell 1, and one end of the two first cooling pipes 12 is connected to the second cooling pipe 14. The two second cooling pipes 14 are arranged in a serpentine shape. The two second cooling pipes 14 are arranged on the top of the corresponding first cooling fans 13, and one end of the two first cooling fans 13 is connected to the third cooling pipe 15. The two third cooling pipes 15 are The two third cooling pipes 15 are arranged in a serpentine shape, and are wrapped around the outside of the heat exchange shell 5. One end of the two third cooling pipes 15 is connected to the inverter box 11, so that the water decomposed by the heated and vaporized ammonium bicarbonate is pressed into the interior of the two first cooling pipes 12 by the mixed gas decomposed by the heated and vaporized ammonium bicarbonate. Since the heated vaporization of ammonium bicarbonate is a continuous process, the ammonium bicarbonate is continuously decomposed by heat to produce water, and then the mixed gas that is continuously decomposed by heat is pressed into the interior of the two first cooling pipes 12, so that the water inside the two first cooling pipes 12 circulates, and in the process of circulation, the heat generated by the operation of the graphics card motherboard 6 is taken away, thereby realizing the heat dissipation of the graphics card motherboard 6. When the water inside the two first cooling pipes 12 circulates to the interior of the second cooling pipe 14, The two first cooling fans 13 dissipate heat for the corresponding second cooling tubes 14, and indirectly dissipate heat for the water inside the two second cooling tubes 14, thereby reducing the temperature of the water inside the two second cooling tubes 14. After the water inside the two second cooling tubes 14 is cooled, the mixed gas generated by the continuous thermal decomposition of ammonium bicarbonate is used to press the low-temperature water inside the two second cooling tubes 14 into the interior of the two third cooling tubes 15, thereby cooling the outside of the heat exchange shell 5 and indirectly reducing the temperature inside the heat exchange shell 5, so that the water vapor decomposed after the ammonium bicarbonate is heated and gasified can be quickly condensed into water, thereby improving the efficiency of the water circulation and accelerating the cooling of the internal mixed gas, which is convenient for the subsequent reverse reaction to generate ammonium bicarbonate. Specifically, the two first cooling tubes 12 One end of each is fixedly connected to an isolation net 16 for blocking the unheated vaporized ammonium bicarbonate crystals, preventing the ammonium bicarbonate crystals from vaporizing inside the cooling system 10 and affecting the cooling of the graphics card motherboard 6 and the graphics card chip 4. More specifically, the outside of the two second cooling pipes 14 are fixedly sleeved with a plurality of heat sinks 17, and the plurality of heat sinks 17 are arranged equidistantly and obliquely, so that the heat carried by the water after the ammonium bicarbonate is heated and vaporized is transferred to the heat sink 17, and the two first cooling fans 13 blow cold air to one side of the plurality of heat sinks 17 to realize heat conversion, thereby quickly reducing the heat carried by the water after the ammonium bicarbonate is heated and vaporized. At the same time, the second cooling pipe 14, the third cooling pipe 15 and the plurality of heat sinks 17 are all made of brass, which improves the heat conversion efficiency.When ammonium bicarbonate is heated and vaporized inside the heat exchange housing 5, the bottom of the elastic housing 7 fits around the graphics card chip 4, driving the two first cooling tubes 12 and the two second cooling tubes 14 downward. This allows the two first cooling tubes 12 to better dissipate heat from the graphics card motherboard 6. At the same time, the distance between the two second cooling tubes 14 and the corresponding first cooling fans 13 is shortened, enabling better heat dissipation of the two second cooling tubes 14 and the liquid inside them.

[0042] like Figure 10 As shown, the inverter box 11 is made of heat-insulating material, so that the temperature outside the inverter box 11 is isolated from the temperature inside the inverter box 11, thereby preventing the heat outside the inverter box 11 from being transferred to the inside of the graphics card support shell 1 and affecting the inversion of ammonium bicarbonate. A carbon dioxide pipe 18 is connected to one side of the inverter box 11, and one end of the carbon dioxide pipe 18 is connected to the inside of the heat exchange shell 5. A pressure pipe 20 is connected to the top of the inverter box 11, and one end of the pressure pipe 20 is connected to the inside of the heat exchange shell 5. The outside of the pressure pipe 20 is connected to a connecting pipe 21, and one side of the connecting pipe 21 is connected to an ammonia pipe 22, and one end of the ammonia pipe 22 is connected to one side of the inverter box 11. Specifically, under the same temperature and pressure, the density of ammonia is approximately 0.771 kg / m 3 , and the density of carbon dioxide is about 1.977kg / m 3 Therefore, the density of ammonia is less than that of carbon dioxide, so when they are mixed, ammonia will be located at the top and carbon dioxide will be located at the bottom. The carbon dioxide pipe 18 connected to one side of the inverter box 11 facilitates the inflow of carbon dioxide, and the pressure pipe 20 connected to the top of the inverter box 11 facilitates the inflow of ammonia.

[0043] A first pressure valve 19 is installed at one end of each of the two third cooling pipes 15, and a second pressure valve 28 is installed outside the carbon dioxide pipe 18. The pressure value of the second pressure valve 28 is greater than the pressure value of the two first pressure valves 19, so that there is sufficient pressure to allow the water vaporized by the heat of ammonium bicarbonate to circulate inside the cooling system 10.

[0044] like Figure 13As shown, sliding grooves 23 are provided on both sides of the inner wall of the inverter box 11, and two sliding rods 24 are fixedly connected to the inside of the two sliding grooves 23. The outsides of the four sliding rods 24 are slidably connected to the same sliding plate 25. The outsides of the four sliding rods 24 are movably sleeved with telescopic springs 26. The four telescopic springs 26 are fixedly connected to the bottom of the sliding plate 25. The top of the sliding plate 25 is fixedly connected to a pressure block 27. The pressure block 27 is slidably connected to the inside of the pressure tube 20. Specifically, when ammonium bicarbonate is heated and vaporized inside the heat exchange shell 5, since the pressure value of the second pressure valve 28 is greater than the pressure value of the two first pressure valves 19, water circulates inside the cooling system 10 through the pressure of the mixed gas. Since the two first pressure valves 19 limit the flow of the two third cooling tubes 15, the mixed gas in the heat exchange shell 5 gradually accumulates inside, causing the pressure inside the heat exchange shell 5 to gradually increase. At this time, the pressure pushes the pressure block 27 to slide inside the pressure tube 20, the four telescopic springs 26 are compressed, and the spring slot 30 is separated from the spring sheet 29, allowing the ammonia at the top to enter the interior of the inverter box 11 and first combine with the water inside the inverter box 11 to form ammonia water. At this time, the ammonium bicarbonate inside the heat exchange shell 5 is still being heated and vaporized, and the pressure inside the heat exchange shell 5 is still continuing to rise. The pressure opens the second pressure valve 28, allowing carbon dioxide to enter the interior of the inverter box 11 and react with ammonia water to form ammonium bicarbonate. This process is expressed by the following chemical equation: NH3+H2O+CO2=NH4HCO3, so that the water, ammonia and carbon dioxide inside the inverter box 11 are recombined into ammonium bicarbonate and fall to the bottom of the inner wall of the heat exchange shell 5.

[0045] like Figure 12As shown, a feed chute 31 is provided at the bottom of the inner wall of the inverter box 11. The bottom of the inner wall of the inverter box 11 is arranged with both sides inclined toward the feed chute 31. Both sides of the feed chute 31 are fixedly connected with a feed baffle 32. The bottom of the sliding plate 25 is fixedly connected with a feed block 33. The feed baffle 32 is adapted to the feed block 33. Specifically, when the water, ammonia and carbon dioxide inside the inverter box 11 are recombined into ammonium bicarbonate, they fall to the top of the two feed baffles 32. At this time, the pressure inside the inverter box 11 is reduced. The pressure inside the heat exchange shell 5 is relatively low, and the pressure inside the heat exchange shell 5 is relatively high, so that the mixed gas pushes the pressure block 27 to slide inside the pressure tube 20, driving the blanking block 33 to move downward to push the granular ammonium bicarbonate on the top of the two blanking partitions 32 into the interior of the inverter box 11, and drop to the bottom of the inner wall of the heat exchange shell 5, absorb the heat generated by the graphics card chip 4, continue to be heated and gasified for circulation, and at the same time, when the pressure block 27 moves downward, the mixed gas inside the heat exchange shell 5 enters the interior of the inverter box 11, making The pressure inside the inverter box 11 increases. At this time, the rebound force of the four telescopic springs 26 is added to cause the pressure block 27 to return to its position. After the water, ammonia and carbon dioxide inside the inverter box 11 are recombined into ammonium bicarbonate, the pressure is continued to open to realize the gasification and inversion of the ammonium bicarbonate to re-form the ammonium bicarbonate cycle. More specifically, an avoidance groove 40 is provided inside the pressure tube 20, and a spring sheet 29 is fixedly connected to the inside of the avoidance groove 40. A spring clamping groove 30 is provided on the outside of the pressure block 27. The spring clamping groove 30 is adapted to the spring sheet 29 so that when the pressure block 27 moves to one side of the spring sheet 29, the spring sheet 29 applies a certain downward pressure to the pressure block 27. When the pressure inside the inverter box 11 increases, the rebound force of the four telescopic springs 26 is added to cause the pressure block 27 to return to its position. At this time, the lifting force of the pressure block 27 is greater than the downward pressure given by the inside of the heat exchange shell 5, which increases the rising distance of the pressure block 27, making it easier for the granular ammonium bicarbonate to fall on the top of the two blanking partitions 32.

[0046] Example 2, as Figure 12As shown, a heat dissipation integrated system for a computer graphics card is provided. Based on Example 1, a first fusion plate 41 is fixedly connected to both sides of the inner wall of the inverter box 11, a second fusion plate 34 is fixedly connected to both sides of the inner wall of the inverter box 11, and a third fusion plate 35 is fixedly connected to both sides of the inner wall of the inverter box 11. The tops of the first fusion plate 41, the second fusion plate 34 and the third fusion plate 35 are all arranged at an angle, and a fusion groove 36 is provided on the tops of the first fusion plate 41, the second fusion plate 34 and the third fusion plate 35. Specifically, when water flows into the interior of the inverter box 11 through one end of the two third cooling pipes 15, it falls to the top of the first fusion plate 41, passes through the top of the first fusion plate 41 to the top of the second fusion plate 34, and then flows from the top of the second fusion plate 34 to the top of the third fusion plate 35. During this period, the fusion groove 36 allows the water to generate vortices during the flow, which can better contact with ammonia and carbon dioxide, thereby accelerating the solidification of ammonium bicarbonate.

[0047] like Figure 1 As shown, two second cooling fans 37 are fixedly installed on the top of the graphics card support case 1, so that the heat inside the graphics card support case 1 can be extracted through the two second cooling fans 37. Figure 12 As shown, a sealing groove 38 is provided on the outside of the pressure block 27, and a sealing ring 39 is installed inside the sealing groove 38, so that when the pressure block 27 is inside the pressure tube 20, ammonia will not enter the interior of the inverter box 11 through the gap between the pressure tube 20 and the pressure block 27.

[0048] The working principle of the present invention is as follows: when the graphics card chip 4 is working and reaches the decomposition temperature of ammonium bicarbonate, the ammonium bicarbonate is heated and vaporized to produce ammonia, carbon dioxide and water vapor. However, since the temperature inside the inverter box 11 cannot reach the temperature for water to evaporate, the water vapor condenses into water and falls to the bottom of the inner wall of the inverter box 11 and gathers. At this time, since part of the ammonium bicarbonate inside the inverter box 11 continues to absorb heat and vaporize, the internal pressure of the inverter box 11 increases, driving the telescopic shell 9 to extend, so that the bottom of the elastic shell 7 fits around the graphics card chip 4, cooling the area around the graphics card chip 4. At the same time, When the pressure value of the second pressure valve 28 is greater than the pressure value of the two first pressure valves 19, the two first pressure valves 19 are opened, and the pressure presses the gathered water into the interior of the two first cooling pipes 12 to dissipate heat for the graphics card motherboard 6, and then flows to the interior of the second cooling pipe 14. At this time, the two first cooling fans 13 are started to dissipate heat for the corresponding second cooling pipe 14 and the water inside the two second cooling pipes 14, and then the two second cooling fans 37 are started to extract the hot air inside the graphics card support shell 1. At this time, the low-temperature water flows to the two third cooling pipes 1 through the pressure inside the heat exchange shell 5. 5, the heat exchange shell 5 is cooled and flows back to the interior of the inverter box 11. At the same time, since the two first pressure valves 19 limit the flow of the two third cooling pipes 15, the mixed gas gradually accumulates inside the heat exchange shell 5, causing the pressure inside the heat exchange shell 5 to gradually increase. At this time, the pressure pushes the pressure block 27 to slide inside the pressure tube 20, allowing the ammonia gas to enter the interior of the inverter box 11, and first combines with the water inside the inverter box 11 to form ammonia water. At this time, the ammonium bicarbonate inside the heat exchange shell 5 is still being heated and gasified, and the pressure inside the heat exchange shell 5 is still continuing to increase. As the pressure increases, the second pressure valve 28 is opened, allowing carbon dioxide to enter the interior of the inverter box 11 and react with ammonia water to generate ammonium bicarbonate. While the pressure block 27 slides inside the pressure tube 20, the pressure block 27 moves, driving the sliding plate 25 to slide inside the sliding groove 23. The sliding of the sliding plate 25 drives the blanking block 33 to move, pushing the fused ammonium bicarbonate particles on the top of the two blanking partitions 32 out of the interior of the inverter box 11, so that the fused ammonium bicarbonate particles absorb the heat inside the heat exchange shell 5 and re-gasify and cool, thereby realizing the circulating cooling of the graphics card motherboard 6 and the graphics card chip 4.

[0049] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation integrated system for a computer graphics card, characterized by: include A graphics card mainboard (6), a graphics card chip (4) being fixedly mounted on the top of the graphics card mainboard (6); A graphics card support shell (1), the graphics card support shell (1) is used to protect the graphics card mainboard (6) and the graphics card chip (4), and at the same time supports the graphics card mainboard (6); A heat exchange shell (5) is used for direct heat dissipation of a graphics card chip (4). Ammonium bicarbonate is stored inside the heat exchange shell (5). The heat exchange shell (5) includes an elastic shell (7). The bottom of the elastic shell (7) abuts against the top of the graphics card chip (4). The elastic shell (7) is conical and made of elastic material. The top of the elastic shell (7) is fixedly connected to a support shell (8). The support shell (8) is made of brass material and has a high thermal conductivity. The top of the support shell (8) is fixedly connected to a telescopic shell (9). The top of the telescopic shell (9) abuts against the top of the inner wall of the graphics card support shell (1). The outside of the heat exchange shell (5) is connected to a cooling system (10) for cooling the heated and vaporized ammonium bicarbonate. An inverter box (11) is fixedly connected to one side of the inner wall of the heat exchange housing (5) and is used to recombine the heated and vaporized ammonium bicarbonate so that the ammonium bicarbonate can be heated and vaporized again, thereby taking away the heat emitted by the graphics card chip (4). The heat exchange housing (5), the cooling system (10) and the inverter box (11) are linked together to dissipate heat from the graphics card chip (4) and the graphics card mainboard (6).

2. The heat dissipation integrated system for a computer graphics card according to claim 1, characterized in that: The cooling system (10) includes a first cooling pipe (12) connected to the outside of the elastic shell (7), the first cooling pipe (12) is arranged in a serpentine shape on the top of the graphics card motherboard (6), two first cooling pipes (12) are provided and are arranged symmetrically, the first cooling pipes (12) are made of rubber plastic material, and the tops of the two first cooling pipes (12) are both provided with first cooling fans (13), and the two first cooling fans (13) are both fixedly connected to the inner walls of the graphics card support shell (1).

3. The heat dissipation integrated system for a computer graphics card according to claim 2, characterized in that: One end of each of the two first cooling pipes (12) is connected to a second cooling pipe (14), and each of the two second cooling pipes (14) is arranged on the top of the corresponding first cooling fan (13). One end of each of the two first cooling fans (13) is connected to a third cooling pipe (15), and each of the two third cooling pipes (15) surrounds the outside of the heat exchange shell (5), and one end of each of the two third cooling pipes (15) is connected to the inverter box (11).

4. The heat dissipation integrated system for a computer graphics card according to claim 1, characterized in that: One side of the inverter box (11) is connected to a carbon dioxide pipe (18), one end of the carbon dioxide pipe (18) is connected to the interior of the heat exchange shell (5), the top of the inverter box (11) is connected to a pressure pipe (20), one end of the pressure pipe (20) is connected to the interior of the heat exchange shell (5), the outside of the pressure pipe (20) is connected to a connecting pipe (21), one side of the connecting pipe (21) is connected to an ammonia pipe (22), one end of the ammonia pipe (22) is connected to one side of the inverter box (11).

5. The heat dissipation integrated system for a computer graphics card according to claim 4, characterized in that: A first pressure valve (19) is installed at one end of each of the two third cooling pipes (15), and a second pressure valve (28) is installed outside the carbon dioxide pipe (18), and the pressure value of the second pressure valve (28) is greater than the pressure values of the two first pressure valves (19).

6. The heat dissipation integrated system for a computer graphics card according to claim 4, characterized in that: Sliding grooves (23) are provided on both sides of the inner wall of the inverter box (11), and two sliding rods (24) are fixedly connected to the inside of the two sliding grooves (23), and the outsides of the four sliding rods (24) are slidably connected to the same sliding plate (25). The outsides of the four sliding rods (24) are movably sleeved with telescopic springs (26), and the four telescopic springs (26) are fixedly connected to the bottom of the sliding plate (25). The top of the sliding plate (25) is fixedly connected to a pressure block (27), and the pressure block (27) is slidably connected to the inside of the pressure pipe (20).

7. The heat dissipation integrated system for a computer graphics card according to claim 6, characterized in that: A material discharge trough (31) is provided at the bottom of the inner wall of the inverter box (11), and the bottom of the inner wall of the inverter box (11) is arranged with both sides inclined toward the material discharge trough (31). Both sides of the material discharge trough (31) are fixedly connected with material discharge partitions (32), and the bottom of the sliding plate (25) is fixedly connected with a material discharge block (33), and the material discharge partitions (32) are adapted to the material discharge block (33).

8. The heat dissipation integrated system for a computer graphics card according to claim 1, characterized in that: A first fusion plate (41) is fixedly connected to both sides of the inner wall of the inverter box (11), a second fusion plate (34) is fixedly connected to both sides of the inner wall of the inverter box (11), and a third fusion plate (35) is fixedly connected to both sides of the inner wall of the inverter box (11). The tops of the first fusion plate (41), the second fusion plate (34) and the third fusion plate (35) are all arranged in an inclined manner, and the tops of the first fusion plate (41), the second fusion plate (34) and the third fusion plate (35) are all provided with fusion grooves (36).

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