Display panel, preparation method thereof and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a signal line, an inorganic insulating layer and a touch layer. The signal line is positioned on one side of the substrate; the inorganic insulating layer is located on the side, away from the substrate, of the signal line, the inorganic insulating layer is provided with a first through hole, and at least part of the signal line is exposed out of the first through hole; the touch layer comprises a first touch conducting layer, a first organic layer, a planarization layer, a second touch conducting layer and a second organic layer which are sequentially stacked on the side, away from the substrate, of the inorganic insulating layer. The touch layer is provided with a second through hole which is communicated with the first through hole and penetrates through the first organic layer, and the second touch conductive layer is electrically connected with the signal line through the second through hole and the first through hole; at least part of the surface of the side, close to the substrate, of the second touch conducting layer makes contact with the surface of the side, away from the substrate, of the planarization layer. The touch performance of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for preparing the same, and a display device. Background Art

[0002] With the development of display technology, display panels with touch functions are becoming more and more popular among users. Display panels with touch functions include a display substrate and a touch layer located on the display substrate. In the related art, the touch performance of the touch layer of the display panel still needs to be improved. Summary of the Invention

[0003] An embodiment of the present application provides a display panel, comprising:

[0004] substrate;

[0005] a signal line, located on one side of the substrate;

[0006] an inorganic insulating layer, located on a side of the signal line away from the substrate, the inorganic insulating layer being provided with a first through hole, the first through hole exposing at least a portion of the signal line;

[0007] A touch layer is located on a side of the inorganic insulating layer away from the substrate, and includes a first touch conductive layer, a first organic layer located on a side of the first touch conductive layer away from the substrate, a planarization layer located on a side of the first organic layer away from the substrate, a second touch conductive layer located on a side of the planarization layer away from the substrate, and a second organic layer located on a side of the second touch conductive layer away from the substrate; the touch layer is provided with a second through hole connected to the first through hole, the orthographic projection of the first through hole on the substrate is located within the orthographic projection of the second through hole on the substrate, the second through hole passes through the first organic layer, and the second touch conductive layer is electrically connected to the signal line through the second through hole and the first through hole; at least a portion of a surface of the second touch conductive layer on a side close to the substrate is in contact with a surface of the planarization layer on a side away from the substrate.

[0008] In some embodiments, the planarization layer is provided with a third through hole, the second touch conductive layer is electrically connected to the first touch conductive layer through the third through hole, the second through hole also passes through the planarization layer, and the orthographic projections of the planarization layer, the second through hole and the third through hole on the second surface cover the orthographic projection of the second touch conductive layer on the second surface.

[0009] In some embodiments, at least a portion of a surface of the second organic layer close to the substrate is in contact with a surface of the planarization layer away from the substrate.

[0010] In some embodiments, a portion of a surface of the second organic layer close to the substrate contacts a surface of the planarization layer away from the substrate, and the remaining portion contacts the second touch conductive layer.

[0011] In some embodiments, the material of the planarization layer is an inorganic insulating material.

[0012] In some embodiments, in a direction from the substrate to the touch layer, a thickness of the first organic layer is greater than or equal to 4000 angstroms.

[0013] In some embodiments, in a direction from the substrate to the touch layer, the thickness of the planarization layer ranges from 500 angstroms to 1000 angstroms.

[0014] In some embodiments, the first touch conductive layer includes multiple first connecting portions, the second touch conductive layer includes multiple second connecting portions, multiple first touch electrodes and multiple second touch electrodes; the multiple first touch electrodes are arranged in multiple rows, and the multiple second touch electrodes are arranged in multiple columns; two adjacent first touch electrodes located in the same row are connected through the first connecting portion, and two adjacent first touch electrodes located in the same column are connected through the second connecting portion; the first touch electrodes in each row are electrically connected to the signal line through one first through hole and one second through hole, and the second touch electrodes in each column are electrically connected to the signal line through one first through hole and one second through hole.

[0015] The present application also provides a method for preparing a display panel, the method comprising:

[0016] forming a signal line on a substrate;

[0017] forming an inorganic insulating thin film layer on a side of the signal line away from the substrate;

[0018] forming a first touch conductive layer and a first organic thin film layer in sequence on a side of the inorganic insulating thin film layer away from the signal line;

[0019] performing exposure and development processing on the first organic thin film layer to form a second through hole penetrating the first organic layer and obtain the first organic layer; the second through hole exposes a portion of the inorganic insulating thin film layer;

[0020] etching the inorganic insulating thin film layer through the second through hole to form a first through hole penetrating the inorganic insulating layer and obtain the inorganic insulating layer;

[0021] A planarization layer, a second touch conductive layer and a second organic layer are formed in sequence on the side of the first organic layer away from the substrate, and the second touch conductive layer is electrically connected to the signal line through the second through hole and the first through hole; at least a portion of the surface of the second touch conductive layer close to the substrate is in contact with the surface of the planarization layer away from the substrate.

[0022] In some embodiments, at least a portion of a surface of the second organic layer close to the substrate is in contact with a surface of the planarization layer away from the substrate.

[0023] In some embodiments, the material of the planarization layer is an inorganic insulating material.

[0024] The present application also provides a display device, comprising the aforementioned display panel, or a display panel prepared by the aforementioned method for preparing a display panel.

[0025] The beneficial effects of this application include:

[0026] In this embodiment, the first organic layer is used as the insulating medium between the first touch conductive layer and the second touch conductive layer. Compared with inorganic materials, the thickness of the first organic layer can be prepared to be larger during the preparation process, thereby increasing the distance between the first touch conductive layer and the second touch conductive layer to avoid signal crosstalk between the two, thereby improving the touch performance of the display panel.

[0027] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0029] Figure 1 FIG2 is a top view of a display panel provided by an exemplary embodiment of the present application;

[0030] Figure 2 An exemplary embodiment of the present application is shown. Figure 1 A side sectional view along section line AA;

[0031] Figure 3 Shown Figure 2 Enlarged view of point A in the middle;

[0032] Figure 4 Shown Figure 2 Enlarged view of point B in the middle;

[0033] Figure 5Another exemplary embodiment of the present application is shown. Figure 1 A side sectional view along section line AA;

[0034] Figure 6 Another exemplary embodiment of the present application is shown. Figure 1 A side sectional view along section line AA;

[0035] Figures 7a to 7i Shown are side cross-sectional views of structures at various steps of a method for manufacturing a display panel provided by an exemplary embodiment of the present application.

[0036] In the figure: AA-display area; NA-non-display area; 100-substrate; 200-driving circuit layer; 210-active layer; 220-first insulating layer; 230-gate; 240-second insulating layer; 250-source-drain layer; 251-source; 252-drain; 253-signal line; 260-third insulating layer; 201-thin film transistor; 300-light-emitting functional layer; 310-pixel defining layer; 320-light-emitting element; 321-first electrode; 322-light-emitting layer; 323-second electrode; 400-encapsulation layer; 410-first inorganic encapsulation layer; 420-organic encapsulation Layer; 430-second inorganic encapsulation layer; 401-inorganic insulating layer; 401'-inorganic insulating thin film layer; 401a-first through hole; 500-touch layer; 510-first touch conductive layer; 511-first connecting portion; 520-first organic layer; 520'-first organic thin film layer; 501a-second through hole; 530-planarization layer; 530'-planarization thin film layer; 540-second touch conductive layer; 541-first touch electrode; 542-second touch electrode; 543-second connecting portion; 544-first routing; 502a-third through hole; 550-second organic layer. DETAILED DESCRIPTION

[0037] Hereinafter, the present application will be described more fully with reference to the accompanying drawings, in which embodiments are shown.

[0038] It should be noted that when element A, such as a layer, film, or region, is referred to as being "on the side of element B away from element C," this means that element A may be directly on the surface of element B away from element C, or that an intermediate layer, intermediate region, or intermediate element may exist between element B and element A. When element A, such as a layer, film, or region, is referred to as being "between element B and element C," this means that only element A exists between element B and element C, or that an intermediate layer, intermediate region, or intermediate element may exist between element A and element B, or between element A and element C.

[0039] Although terms such as "first", "second", etc. can be used to describe various components, such components are not limited by the above terms. These terms are only used to distinguish one component from another component and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "plurality" means two or more. In the absence of conflict, the features in the embodiments described below in this application can complement or combine with each other.

[0040] In the accompanying drawings, the symbols "x", "y", and "z" are used to indicate directions. The x, y, and z directions are not limited to three mutually perpendicular directions of a rectangular coordinate system and can be interpreted in a broader sense. For example, the x, y, and z directions can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. Exemplarily, x is used to indicate a first direction, y is used to indicate a second direction perpendicular to the first direction, and z is used to indicate a third direction perpendicular to the first and second directions. The first direction x, the second direction y, and the third direction z can correspond to the horizontal direction, the vertical direction, and the thickness direction of the display panel, respectively.

[0041] In the accompanying drawings, the sizes and thicknesses of elements may be exaggerated for better understanding, clarity, and ease of description. However, the present application is not limited to the sizes and thicknesses shown in the accompanying drawings. In the accompanying drawings, the thicknesses of layers, films, panels, regions, and other elements may be exaggerated for clarity. Example embodiments are shown in the accompanying drawings, wherein like reference numerals represent like elements.

[0042] The display panel includes a display substrate and a touch layer located on the display substrate. The touch layer includes a first touch conductive layer, a touch insulating layer, and a second touch conductive layer, which are sequentially stacked on the display substrate. In related art, the touch insulating layer is made of an inorganic material. If the thickness of the touch insulating layer is too thick, it can cause cracks or stress mismatch in the display panel. Due to manufacturing process limitations, the thickness of the touch insulating layer is typically relatively small (approximately 3900 angstroms). This means that the distance between the first touch conductive layer and the second touch conductive layer is small, which can easily cause signal crosstalk between the two layers, thereby reducing the touch performance of the display panel.

[0043] The display panel, preparation method thereof, and display device provided in this application are intended to solve or improve the above technical problems.

[0044] Figure 1 FIG. 1 is a top view of a display panel provided by an exemplary embodiment of the present application. Figure 2 Shown Figure 1 The side section view along the section line AA. Figure 1 and Figure 2 As shown, the display panel includes a substrate 100, a signal line 253, an inorganic insulating layer 401, and a touch layer 500. The signal line 253 is located on one side of the substrate 100; the inorganic insulating layer 401 is located on the side of the signal line 253 away from the substrate 100, and the inorganic insulating layer 401 is provided with a first through hole 401a, which exposes at least a portion of the signal line 253; the touch layer 500 includes a first touch conductive layer 510, a first organic layer 520 located on the side of the first touch conductive layer 510 away from the substrate 100, a planarization layer 530 located on the side of the first organic layer 520 away from the substrate 100, and a planarization layer 530 located on the side of the planarization layer 530 away from the substrate 100. A second touch conductive layer 540 on one side, and a second organic layer 550 located on the side of the second touch conductive layer 540 away from the substrate 100; the touch layer 500 is provided with a second through hole 501a connected to the first through hole 401a, the second through hole 501a penetrates the first organic layer 520, and the second touch conductive layer 540 is electrically connected to the signal line 253 through the second through hole 501a and the first through hole 401a; at least a portion of the surface of the second touch conductive layer 540 on the side close to the substrate 100 is in contact with the surface of the planarization layer 530 on the side away from the substrate 100.

[0045] In this embodiment, the first organic layer 520 is used as an insulating medium between the first touch conductive layer 510 and the second touch conductive layer 540. Compared with inorganic materials, the thickness of the first organic layer can be prepared to be larger during the preparation process, thereby increasing the distance between the first touch conductive layer 510 and the second touch conductive layer 520 to avoid signal crosstalk between the two, thereby improving the touch performance of the display panel.

[0046] Furthermore, since the first organic layer 520 in this embodiment is made of an organic material, during the display panel manufacturing process, the first organic layer 520 can be first exposed and developed to form the second through-hole 501a. Subsequently, the first organic layer 520 with the second through-hole 501a can be used as a temporary mask material for an etching process to form the first through-hole 401a. Compared to first forming the first through-hole 401a on the inorganic insulating layer 401 and then forming the second through-hole 501a on the first organic layer 520, the steps of coating the temporary mask material and then exposing and developing the temporary mask material when forming the first through-hole 401a on the inorganic insulating layer 401 can be reduced, thereby reducing the cost of the temporary mask material. In this embodiment, when etching to form the first through-hole 401a, the etching process also causes a rough surface of the first organic layer 520. Forming the second touch conductive layer 540 directly on the first organic layer 520 can result in abnormal metal crystal growth in the second touch conductive layer 540, resulting in an excessively high resistance. In this embodiment, a planarization layer 530 is provided between the first organic layer 520 and the second touch conductive layer 540. This reduces the area of contact between the second touch conductive layer 540 and the first organic layer 520, thereby improving the problem of high resistance and enhancing touch performance. Furthermore, the addition of the planarization layer 520 further increases the distance between the first touch conductive layer 510 and the second touch conductive layer 540, reducing interference between the first touch conductive layer 510 and the second touch conductive layer 540, further enhancing touch performance.

[0047] In one embodiment, the roughness of the surface of the planarization layer 530 away from the substrate 100 is less than the roughness of the surface of the first organic layer 520 away from the substrate 100. Preferably, the surface of the planarization layer 530 away from the substrate 100 is substantially planar.

[0048] In some embodiments, as Figure 2 As shown, the display panel includes a display area AA and a non-display area NA. The first and second touch conductive layers may be located partially in the display area AA and partially in the non-display area NA. A third through-hole 502a is provided in the planarization layer 530. The second touch conductive layer 540a is electrically connected to the first touch conductive layer 510 via the third through-hole 502a. The second through-hole 501a also penetrates the planarization layer 530. The orthographic projections of the planarization layer 530, the second through-hole 501a, and the third through-hole 502a on the substrate 100 overlap the orthographic projection of the second touch conductive layer 540 on the substrate 100. This prevents contact between the surface of the second touch conductive layer 540 near the substrate 100 and the surface of the first organic layer 520 away from the substrate 100, minimizing the problem of excessive resistance in the second touch conductive layer 540.

[0049] In some embodiments, the signal line 253 may be a touch signal line. For example, the signal line 253 may be located in the non-display area NA.

[0050] In some embodiments, as Figure 3 or Figure 4 As shown, Figure 3 Shown Figure 2 A in the middle is enlarged. Figure 4 Shown Figure 2 The first organic layer 520 has a rough surface on the side away from the substrate 100. Figure 3 As shown, the surface of the planarization layer 530 away from the substrate 100 is in contact with the second touch conductive layer 540. Figure 4 As shown, a surface of the planarization layer 530 away from the substrate 100 is in contact with the second organic layer 550 .

[0051] In some embodiments, the substrate 100 may be a flexible substrate or a rigid substrate. The flexible substrate may be made of one or more of polyimide, polyethylene terephthalate, polycarbonate, and an organic resin material. The organic resin material may include epoxy resin, triazine, silicone resin, or polyimide. The rigid substrate may include any one of a glass substrate, a quartz substrate, and a sapphire substrate.

[0052] In some embodiments, the material of the signal line 253 includes any one or more of a metal, an alloy, or a metal nitride. Furthermore, the material of the signal line 253 includes a metal such as silver (Ag), magnesium (Mg), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum (Pt), tantalum (Ta), neodymium (Nd), or scandium (Sc), their alloys, their nitrides, or any combination thereof. In one example, the material of the signal line 253 can be copper.

[0053] In some embodiments, the inorganic insulating layer 401 is made of one or any combination of silicon oxide, silicon nitride, silicon oxynitride, and a high-k dielectric material (such as aluminum oxide, hafnium oxide, zirconium oxide, etc.). In one example, the inorganic insulating layer 401 is made of silicon nitride.

[0054] In some embodiments, the first touch conductive layer 510 may include one or any combination of transparent conductive materials (TCOs) such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium zinc tin oxide (ITZO), or indium gallium zinc tin oxide. In one example, the first touch conductive layer 510 is made of ITO.

[0055] In some embodiments, the second touch conductive layer 540 may include one or any combination of transparent conductive materials (TCOs) such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium zinc tin oxide (ITZO), or indium gallium zinc tin oxide. In one example, the first touch conductive layer 510 is made of ITO.

[0056] In some embodiments, the material of the first organic layer 520 includes any one of polymethylmethacrylate (PMMA), silicone, epoxy resin, phenolic resin, and polyimide resin.

[0057] In some embodiments, as Figure 2As shown, the display panel also includes a driving circuit layer 200 and a light-emitting functional layer 300. The driving circuit layer 200 is located in the display area AA and the non-display area NA, and the light-emitting functional layer 300 is located in the display area AA. The driving circuit layer 200 includes an active layer 210, a first insulating layer 220, a gate 230, a second insulating layer 240, a source-drain electrode layer 250, and a third insulating layer 260, which are sequentially stacked on the substrate 100. The source-drain electrode layer 250 includes a source electrode 251 and a drain electrode 252. The active layer 210, the source electrode 251, the drain electrode 252, and the gate 230 together constitute a thin film transistor 201. The light-emitting functional layer 300 includes a pixel defining layer 310 and at least one light-emitting element 320. Each light-emitting element 320 includes a first electrode 321, a light-emitting layer 322, and a second electrode 323, which are sequentially stacked on the third insulating layer. The first electrode 321 is electrically connected to one of the source electrode 251 and the drain electrode 252. For example, the first electrode 321 is connected to the source electrode 251. The pixel defining layer 310 is located on a side of the first electrode 321 away from the third insulating layer 260. The pixel defining layer 310 has a plurality of pixel openings, each of which exposes at least a portion of a first electrode 321. At least a portion of the light-emitting layer 322 of each light-emitting element 320 is located within a pixel opening. One of the first electrode 321 and the second electrode 323 serves as an anode, and the other serves as a cathode.

[0058] In some embodiments, the source-drain layer 250 includes a signal line 253, that is, the signal line 253 is provided in the same layer as the source 251 and the drain 252. The signal line 253 and the source 251 and the drain 252 can be formed in the same process.

[0059] In some embodiments, the display panel further includes an encapsulation layer 400 . The encapsulation layer 400 includes a first inorganic encapsulation layer 410 , an organic encapsulation layer 420 , and a second inorganic encapsulation layer 430 , which are sequentially stacked on the light-emitting functional layer 300 .

[0060] In some embodiments, as Figure 2 As shown, the second inorganic encapsulation layer 430 extends to the portion of the non-display area NA to form an inorganic insulating layer 401. In other embodiments, such as Figure 5 As shown, the first inorganic encapsulation layer 410 extends to the portion of the non-display area NA to form an inorganic insulating layer 401. In some other embodiments, as shown in FIG. Figure 6 As shown, the portions of the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 extending to the non-display area NA together form the inorganic insulating layer 401 .

[0061] In some embodiments, as Figure 2As shown, at least a portion of the surface of the second organic layer 550 near the substrate 100 contacts the surface of the planarization layer 530 away from the substrate 100. The second through hole 501a penetrates the planarization layer 530, and the surface of the first organic layer 520 away from the substrate 100 contacts the surface of the planarization layer 530 near the substrate 100. The planarization layer 530 can be used to isolate the first organic layer 520 and the second organic layer 550, thereby improving the flatness of the second organic layer 550 when the second organic layer 550 is formed on the planarization layer 530.

[0062] In some embodiments, as Figure 2 As shown, a portion of the second organic layer 550's surface near the substrate contacts the surface of the planarization layer away from the substrate, while the remaining portion contacts the second touch conductive layer. This prevents the second organic layer 550's surface near the substrate 100 from contacting the surface of the first organic layer 520 away from the substrate 100, maximizing the flatness of the second organic layer 550.

[0063] In some embodiments, the material of the second organic layer 550 includes any one of polymethylmethacrylate (PMMA), silicone, epoxy resin, phenolic resin, and polyimide resin.

[0064] In some embodiments, the planarization layer 530 is a continuous film layer.

[0065] In some embodiments, the material of the planarization layer 530 is an inorganic insulating material. In this embodiment, considering that the first organic layer 520 is made of an organic material (e.g., a material containing a silane group in its molecular structure), during the etching process, the surface of the first organic layer 520 will chemically react with the etching gas (e.g., chlorine / boron trichloride), causing the molecular structure of the first organic layer 520 to change, thereby causing the properties of the surface of the first organic layer 520 to change, which in turn causes at least a portion of the area above the first organic layer 520 to be covered with the second organic layer 550 of the same type (e.g., Figure 4 When the first organic layer 520 and the second organic layer 550 are formed, the adhesion between them is poor, which can easily lead to peeling. Therefore, in this embodiment, the planarization layer 530 is made of an inorganic insulating material to improve the adhesion between the first organic layer 520 and the planarization layer 530, thereby preventing peeling between them.

[0066] In some embodiments, as Figure 4As shown, part of the second organic layer 550 is in direct contact with the planarization layer 530. Compared with the second organic layer 550 being in direct contact with the surface-denatured first organic layer 520, the adhesion between the planarization layer 530 and the second organic layer 550 is stronger, which can effectively avoid the risk of peeling off between the first organic layer 520 and the adjacent film layer, and help to improve the touch performance.

[0067] In some embodiments, the material of the planarization layer 530 includes one or any combination of silicon oxide, silicon nitride, silicon oxynitride, and a high-k dielectric material (such as aluminum oxide, hafnium oxide, zirconium oxide, etc.). In one example, the material of the planarization layer 530 is silicon nitride.

[0068] In some embodiments, the thickness of the planarization layer 530 in the direction from the substrate 100 toward the touch layer 500 ranges from 500 angstroms to 1000 angstroms. This configuration allows the planarization layer 530 to fully cover the rough surface of the first organic layer 520 while avoiding excessively increasing the overall thickness of the display panel. In some embodiments, the thickness of the planarization layer 530 can be 500 angstroms, 600 angstroms, 700 angstroms, 800 angstroms, 900 angstroms, or 1000 angstroms.

[0069] In some embodiments, the thickness of the first organic layer 520 in the direction from the substrate 100 toward the touch layer 500 is greater than or equal to 4000 angstroms. This configuration allows for a larger distance between the first touch conductive layer 510 and the second touch conductive layer 540, thereby reducing the risk of signal crosstalk between the first touch conductive layer 510 and the second touch conductive layer 540 and improving the touch performance of the display panel. In some embodiments, the thickness of the first organic layer 520 can be 4000 angstroms, 5000 angstroms, 7000 angstroms, 10,000 angstroms, 15,000 angstroms, or 20,000 angstroms.

[0070] In some embodiments, as Figure 1 and Figure 2 As shown, the first touch conductive layer 510 includes multiple first connecting parts 511, and the second touch conductive layer 540 includes multiple second connecting parts 543, multiple first touch electrodes 541 and multiple second touch electrodes 542; the multiple first touch electrodes 541 are arranged into multiple rows along the second direction y, and the multiple second touch electrodes 542 are arranged into multiple columns along the first direction x; two adjacent first touch electrodes 541 located in the same row are connected to each other through the first connecting part 511, and two adjacent first touch electrodes 541 located in the same column are connected to each other through the second connecting part 543; each row of first touch electrodes 541 is electrically connected to the signal line 253 through a first through hole 401a and a second through hole 501a, and each column of second touch electrodes 542 is electrically connected to the signal line 253 through a first through hole 401a and a second through hole 501a (not shown in the figure).

[0071] In this embodiment, the second touch conductive layer further includes a first trace 544 and a second trace located in the non-display area. The first trace 544 is electrically connected to the first touch electrode and is electrically connected to the signal line 253 via the first through-hole 401a and the second through-hole 501a. The second trace is electrically connected to the second touch electrode and is electrically connected to the signal line 253 via the first through-hole 401a and the second through-hole 501a.

[0072] Based on the same inventive concept, the present application also provides a method for preparing a display panel, comprising the following steps:

[0073] Step 100: Figure 7a As shown, a signal line 253 is formed on the substrate 100;

[0074] Step 200: Figure 7b As shown, an inorganic insulating thin film layer 401 ′ is formed on the side of the signal line 253 away from the substrate 100 ;

[0075] Step 300: Figure 7c As shown, a first touch conductive layer 510 and a first organic thin film layer 520 ′ are sequentially formed on a side of the inorganic insulating thin film layer 401 ′ away from the signal line 253 ;

[0076] Step 400: Figure 7d As shown, the first organic thin film layer 520' is exposed and developed to form a second through hole 501a penetrating the first organic layer 520 and obtain the first organic layer 520, and the second through hole 501a exposes a portion of the inorganic insulating thin film layer 401';

[0077] Step 500: Figure 7e As shown, the inorganic insulating film layer 401 ′ is etched through the second through hole 501 a to form a first through hole 401 a penetrating the inorganic insulating layer 401 and obtain the inorganic insulating layer 401 ;

[0078] Step 600: Figure 7f 、 Figure 7g 、 Figure 7h as well as Figure 7i As shown, a planarization layer 530, a second touch conductive layer 540 and a second organic layer 550 are sequentially formed on the side of the first organic layer 520 away from the substrate 100. The second touch conductive layer 540 is electrically connected to the signal line 253 through the second through hole 501a and the first through hole 401a. At least a portion of the surface of the second touch conductive layer 540 on the side close to the substrate 100 is in contact with the surface of the planarization layer 530 on the side away from the substrate 100.

[0079] In this embodiment, the first organic layer 520 is used as an insulating medium between the first touch conductive layer 510 and the second touch conductive layer 540. Compared with inorganic materials, the thickness of the first organic layer can be prepared to be larger during the preparation process, thereby increasing the distance between the first touch conductive layer 510 and the second touch conductive layer 520 to avoid signal crosstalk between the two, thereby improving the touch performance of the display panel.

[0080] Furthermore, in this embodiment, the first organic layer 520 is first exposed and developed to form the second through hole 501a, and then the first organic layer 520 having the second through hole 501a is used as a temporary mask material for an etching process to form the first through hole 401a, so as to prepare the first through hole 401a and the second through hole 501a for connecting the signal line 253 and the second touch conductive layer 540. Compared with first forming the first through hole 401a on the inorganic insulating layer 401 and then forming the second through hole 501a on the first organic layer 520, the steps of coating the temporary mask material and exposing and developing the temporary mask material when forming the first through hole 401a on the inorganic insulating layer 401 can be reduced, and the consumption cost of the temporary mask material can be reduced. In this embodiment, when etching the first through-hole 401a, the etching process also causes the surface of the first organic layer 520 to become rough. Forming the second touch conductive layer 540 directly on the first organic layer 520 can lead to abnormal metal crystal growth in the second touch conductive layer 540, resulting in an excessively high resistance. In this embodiment, the planarization layer 530 is formed after forming the first organic layer 520 and before forming the second touch conductive layer 540. This reduces the area of contact between the second touch conductive layer 540 and the first organic layer 520, thereby improving the excessively high resistance and enhancing touch performance. Furthermore, the addition of the planarization layer 520 further increases the spacing between the first touch conductive layer 510 and the second touch conductive layer 540, reducing interference between the first touch conductive layer 510 and the second touch conductive layer 540 and further enhancing touch performance.

[0081] In some embodiments, at least a portion of the surface of the second organic layer 550 close to the substrate 100 contacts the surface of the planarization layer 530 away from the substrate 100; the first organic layer 520 and the second organic layer 550 can be isolated by the planarization layer 530, thereby improving the flatness of the second organic layer 550 when the second organic layer 550 is formed on the planarization layer 530.

[0082] In some embodiments, the material of the planarization layer 530 is an inorganic insulating material. In this embodiment, considering that the first organic layer 520 is made of an organic material (e.g., a material containing a silane group in its molecular structure), during the etching process, the surface of the first organic layer 520 will chemically react with the etching gas (e.g., chlorine / boron trichloride), causing the molecular structure of the first organic layer 520 to change, thereby causing the properties of the surface of the first organic layer 520 to change. This will in turn cause the adhesion between the first organic layer 520 and the second organic layer 550 to be poor when at least a portion of the area above the first organic layer 520 is covered with a second organic layer 550 of the same type, which can easily lead to peeling between the two. Therefore, in this embodiment, the planarization layer 530 is made of an inorganic insulating material, and the planarization layer 530 is used as an intermediate medium, which can improve the adhesion between the first organic layer 520 and the planarization layer 530 and prevent peeling between the two.

[0083] In some embodiments, the step of forming the planarization layer 530 includes:

[0084] like Figure 7f As shown, a planarization film layer 530' is formed, and at least a portion of the planarization film layer 530' is located in the first through hole 401a and the second through hole 501a;

[0085] like Figure 7g As shown, at least a portion of the planarization film layer 530 ′ located in the first through hole 401 a is removed to expose the surface of the signal line 253 , thereby obtaining the planarization layer 530 .

[0086] In this embodiment, at least a portion of the planarization film layer located in the first through hole 401a is removed to expose the surface of the signal line 253 so that the subsequent Figure 7h When the second touch conductive layer 540 is formed, an electrical connection is formed between the second touch conductive layer 540 and the signal line 253 .

[0087] In this embodiment, compared with the related art, when the touch insulating layer between the first touch conductive layer 510 and the second touch conductive layer 540 is an inorganic material, the preparation process for forming the touch layer on the display substrate includes: applying a temporary mask material on the inorganic insulating film layer 401' → exposing and developing the temporary mask material → etching the inorganic insulating film layer 401' to form an inorganic insulating layer 401 and a first through hole 401a passing through the inorganic insulating layer 401 → forming the first touch conductive layer 510 → depositing a touch insulating film layer (inorganic material) → applying a temporary mask material on the touch insulating film layer (inorganic material) → exposing and developing the temporary mask material → etching the touch insulating film layer (inorganic material) to form a first organic layer 520 and a second through hole 501a passing through the first organic layer 520, a total of 8 process steps. The preparation method provided in this embodiment includes the following steps: forming a first touch conductive layer 510 on the inorganic insulating film layer 401' → depositing a first organic film layer 520' → exposing and developing the first organic film layer 520' to form the first organic layer 520 and a second through hole 501a penetrating the first organic layer 520 → etching the inorganic insulating film layer 401' using the second through hole 501a to form the inorganic insulating layer 401 and the first through hole 401a penetrating the inorganic insulating layer 401 → depositing a planarization film layer 530' → applying a temporary mask material on the planarization film layer 530' → exposing and developing the temporary mask material → etching the planarization film layer 530' to expose the surface of the signal line 253 to obtain the planarization layer 530, a total of 8 process steps. Therefore, the preparation method of the display panel provided in this application can improve the touch performance of the display panel without increasing the number of process steps.

[0088] In some embodiments, when removing at least the portion of the planarization film layer 530' located within the first through-hole 401a, the material of the planarization film layer 530' covering the entire surface of the signal line 253 can be completely removed to further stabilize the electrical connection between the second touch conductive layer 540 and the signal line 253. In this case, the contour of the end of the first through-hole 401a away from the substrate 100 coincides with the contour of the end of the second through-hole 501 close to the substrate 100.

[0089] Based on the same inventive concept, the present application also provides a display device, comprising the aforementioned display panel or a display panel prepared by the aforementioned method for preparing a display panel, and a housing.

[0090] It should be noted that the display device can be any device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether text or images. More specifically, it is contemplated that embodiments may be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, automotive displays (e.g., speedometer displays, etc.), navigation systems, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0091] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should generally be considered as applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the claims and their equivalents.

Claims

1. A display panel, characterized in that: include: substrate; a signal line, located on one side of the substrate; an inorganic insulating layer, located on a side of the signal line away from the substrate, the inorganic insulating layer being provided with a first through hole, the first through hole exposing at least a portion of the signal line; A touch layer is located on a side of the inorganic insulating layer away from the substrate, and includes a first touch conductive layer, a first organic layer located on a side of the first touch conductive layer away from the substrate, a planarization layer located on a side of the first organic layer away from the substrate, a second touch conductive layer located on a side of the planarization layer away from the substrate, and a second organic layer located on a side of the second touch conductive layer away from the substrate; the touch layer is provided with a second through hole connected to the first through hole, the second through hole passes through the first organic layer, and the second touch conductive layer is electrically connected to the signal line through the second through hole and the first through hole; at least a portion of a surface of the second touch conductive layer on a side close to the substrate is in contact with a surface of the planarization layer on a side away from the substrate.

2. The display panel according to claim 1, wherein: The planarization layer is provided with a third through hole, the second touch conductive layer is electrically connected to the first touch conductive layer through the third through hole, the second through hole also passes through the planarization layer, and the orthographic projections of the planarization layer, the second through hole, and the third through hole on the substrate cover the orthographic projection of the second touch conductive layer on the substrate.

3. The display panel according to claim 1, wherein: At least a portion of a surface of the second organic layer close to the substrate contacts a surface of the planarization layer away from the substrate.

4. The display panel according to claim 3, wherein: A portion of a surface of the second organic layer close to the substrate contacts a surface of the planarization layer away from the substrate, and the remaining portion contacts the second touch conductive layer.

5. The display panel according to claim 1, wherein: The material of the planarization layer is an inorganic insulating material.

6. The display panel according to claim 1, wherein: In the direction from the substrate to the touch layer, the thickness of the planarization layer ranges from 500 angstroms to 1000 angstroms.

7. The display panel according to claim 1, wherein: In a direction from the substrate to the touch layer, the thickness of the first organic layer is greater than or equal to 4000 angstroms.

8. The display panel according to claim 1, wherein: The first touch conductive layer includes multiple first connecting parts, and the second touch conductive layer includes multiple second connecting parts, multiple first touch electrodes and multiple second touch electrodes; the multiple first touch electrodes are arranged in multiple rows, and the multiple second touch electrodes are arranged in multiple columns; two adjacent first touch electrodes located in the same row are connected through the first connecting part, and two adjacent first touch electrodes located in the same column are connected through the second connecting part; the first touch electrodes in each row are electrically connected to the signal line through one first through hole and one second through hole, and the second touch electrodes in each column are electrically connected to the signal line through one first through hole and one second through hole.

9. A method for preparing a display panel, characterized in that: The preparation method comprises: forming a signal line on a substrate; forming an inorganic insulating thin film layer on a side of the signal line away from the substrate; forming a first touch conductive layer and a first organic thin film layer in sequence on a side of the inorganic insulating thin film layer away from the signal line; performing exposure and development processing on the first organic thin film layer to form a second through hole penetrating the first organic layer and obtain the first organic layer; the second through hole exposes a portion of the inorganic insulating thin film layer; etching the inorganic insulating thin film layer through the second through hole to form a first through hole penetrating the inorganic insulating layer and obtain the inorganic insulating layer; A planarization layer, a second touch conductive layer and a second organic layer are formed in sequence on the side of the first organic layer away from the substrate, and the second touch conductive layer is electrically connected to the signal line through the second through hole and the first through hole; at least a portion of the surface of the second touch conductive layer close to the substrate is in contact with the surface of the planarization layer away from the substrate.

10. The method for manufacturing a display panel according to claim 8, wherein: At least a portion of a surface of the second organic layer close to the substrate contacts a surface of the planarization layer away from the substrate.

11. The method for manufacturing a display panel according to claim 8, wherein: The material of the planarization layer is an inorganic insulating material.

12. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 6, or a display panel prepared by the method for preparing a display panel according to any one of claims 7 to 11.

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