Server memory testing device

Abstract

The invention discloses a server memory testing device, which comprises a box body, a testing mainboard, a heating module and a clamping assembly, and is characterized in that the box body is provided with a box cover capable of moving up and down, the testing mainboard is arranged in a containing cavity, the heating module is used for heating the interior of the containing cavity, and the clamping assembly is arranged on the surface of one side, facing the containing cavity, of the box cover; the clamping assembly is used for clamping an ejector pin of the server memory and moving towards the test mainboard so that a golden finger of the server memory can be connected with the test mainboard. According to the testing device for the server memory, through the box cover capable of moving in the vertical direction and the clamping assembly arranged on the bottom face of the box cover, stable and rapid movement of the server memory is achieved, and the server memory can be inserted into the testing mainboard when the box cover descends; the efficiency of high-temperature testing of the server memory is effectively improved, and the problem that in the prior art, the efficiency is low when a single server memory is inserted and pulled is solved.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a server memory testing device. Background Art

[0002] Relevant technologies point out that server memory, also known as RAM (random access memory), is a key hardware component in the server for temporarily storing data and program instructions. When the server memory is used in the chassis, heat accumulation will occur, causing the server memory to be in a high-temperature environment. Memory that lacks high-temperature testing will fail at this time. The working efficiency and stability of the server memory largely depends on whether it can effectively cope with the heat generated during operation.

[0003] When a server is running under high load, the memory modules will also generate a lot of heat. If this heat cannot be dissipated in time, the memory operating temperature will increase. Server memory that has not been fully tested at high temperatures may malfunction in such an operating environment, such as data loss, blue screen of death, and other problems, seriously affecting the normal operation and reliability of the server, and thus affecting the use of the server. Although the existing technology can test server memory at high temperatures and understand the changes in memory performance parameters in a sealed high-temperature environment, the server memory needs to be inserted into the test motherboard during testing. The efficiency of single plug-in and pull-out during testing is low, affecting the testing efficiency of the server memory. Summary of the Invention

[0004] This application aims to solve at least one of the technical problems existing in the prior art. To this end, this application proposes a server memory testing device that improves the efficiency of high-temperature testing of server memory and solves the problem of low efficiency in single-plug server memory testing in the prior art.

[0005] The server memory testing device according to the present application includes: a box body, a accommodating cavity is formed in the box body, the box body has a box cover movable in the up and down directions, and the box cover can be opened to cover the accommodating cavity; a test motherboard, the test motherboard is arranged in the accommodating cavity; a heating module, the heating module is arranged on the box body, and the heating module is used to heat the accommodating cavity; the clamping assembly is arranged on a side surface of the box cover facing the accommodating cavity, the clamping assembly is used to clamp the ejector pin of the server memory and move it toward the test motherboard to connect the gold finger of the server memory to the test motherboard.

[0006] According to the server memory testing device of the present application, a box cover movable in the up and down directions and a clamping assembly provided on the bottom surface of the box cover are provided to achieve stable and rapid movement of the server memory, and the server memory can be inserted into the test motherboard when the box cover is lowered, thereby effectively improving the efficiency of high-temperature testing of the server memory and solving the problem of low efficiency in single plug-in and pull-out server memory testing in the prior art.

[0007] In some feasible embodiments of the present application, the clamping assembly includes: a mounting plate, which is connected to the box cover; a side panel, which includes two side panels arranged at intervals, and both side panels are connected to the mounting plate, and an airflow driving member is provided on the side panel; a clamping member, which is arranged between the two side panels, and one end of the clamping member in a first direction is connected to the side panel, and the clamping member includes two spaced apart, and a clamping space is defined between the two clamping members to accommodate the ejector pin of the server memory; a positioning member, which is provided at the fixed end of the clamping member, and the distance between the positioning member and the clamping member in the up and down directions is adjustable, and the positioning member is used to position the server memory.

[0008] In the above technical solution, by setting side panels and clamping members between the side panels, the server memory can be firmly installed on the test motherboard, and the test device can be applicable to server memories of different sizes and types, thereby improving the versatility and flexibility of the test device. By setting positioning members, it is ensured that the server memory can be accurately installed in the corresponding position on the test motherboard.

[0009] In some feasible embodiments of the present application, the clamping member has a rotating shaft, which extends in the up and down directions and the upper end is connected to the mounting plate, the clamping member and the rotating shaft are relatively rotatable, and a first elastic member is connected between one end of the clamping member and the side plate, and the first elastic member always has a force to rotate the one end of the clamping member toward the clamping space.

[0010] In the above technical solution, by setting a rotating shaft and a first elastic member on the clamping member, the clamping assembly can flexibly clamp the server memory, improve the stability and versatility of the testing device, and automatically adjust the clamping force according to the actual size of the server memory.

[0011] In some feasible embodiments of the present application, a connecting assembly is provided on the clamping assembly, and the connecting assembly includes a connecting rod and an elastic member, the connecting rod extends in the up and down directions, the connecting rod is connected to the bottom of the clamping assembly, the connecting rod is electrically connected to the test main board, the connecting rod includes a fixed rod and a movable rod, the movable rod is movable in the up and down directions relative to the fixed rod, the second elastic member is sleeved on the fixed rod and the upper end of the second elastic member abuts against the clamping assembly, the lower end of the second elastic member abuts against the movable rod, and the second elastic member always has a force to move the movable rod in a direction away from the clamping assembly.

[0012] In the above technical solution, a second elastic member is provided between the movable rod and the clamping assembly, and the second elastic member abuts between the movable rod and the clamping assembly, so that the movable rod and the clamping assembly can be stably connected, thereby ensuring that the server memory and the test motherboard can always be effectively electrically connected, thereby ensuring reliability during the test process.

[0013] In some feasible embodiments of the present application, the clamping assemblies are symmetrically arranged as a group in a first direction about the axis of the connecting rod, and multiple groups of the clamping assemblies are spaced apart in a second direction.

[0014] In some feasible embodiments of the present application, slots and power connection slots are formed on the test motherboard, the slots are arranged in a one-to-one correspondence with the clamping spaces, the gold fingers of the server memory are inserted into the corresponding slots, the power connection slots are arranged in a one-to-one correspondence with the connecting rods, and an adjustment component is provided on the test motherboard. The adjustment component is provided at one end of each slot away from the power connection slot, and the adjustment component includes:

[0015] Adjustment seats, the adjustment seats are arranged on both sides of the slot in the second direction;

[0016] a bracket, the bracket being rotatably connected to the adjustment seat;

[0017] a rotating rod extending along the second direction, with both ends of the rotating rod connected to the bracket and rotatable relative to the bracket;

[0018] A third elastic member is connected between the bracket and the adjustment seat, and the third elastic member always has a force to rotate the rotating rod away from the test mainboard.

[0019] In the above technical solution, by setting an adjustment component, the server memory can be guided to move toward the corresponding slot, ensuring that the server memory can be accurately inserted into the corresponding slot, avoiding poor contact caused by position deviation between the server memory and the slot, and ensuring the accuracy of the test results. In this way, there is no need for the operator to pause the test device to manually adjust the server memory, which shortens the preparation time before the test and improves the testing efficiency of the server memory.

[0020] In some feasible embodiments of the present application, a warning member is provided on the box cover, and the warning member is arranged in one-to-one correspondence with the clamping assembly. A top plate is provided above the box cover, and a guide rod is connected between the top plate and the box body. A sliding hole is formed on the box cover, and the guide rod extends into the sliding hole to enable the box cover to move between the top plate and the box body.

[0021] In the above technical solution, when the server memory is not installed correctly or an abnormal situation occurs, the corresponding warning part will provide feedback in time, so that the operator can quickly and accurately adjust or replace the server memory, reducing the risk of accidents. The top plate is located above the box cover, and the box cover and the box body are connected by a guide rod. The guide rod cooperates with the sliding hole to limit the position of the box cover in the first direction and the second direction, preventing the box cover from unnecessary displacement during movement, thereby ensuring that the server memory can be accurately inserted into the corresponding slot.

[0022] In some feasible embodiments of the present application, the server memory testing device also includes: a driving module, which is arranged on the top plate, and the driving shaft of the driving module is connected to the box cover to drive the box cover to move between the top plate and the box body.

[0023] In some feasible embodiments of the present application, the heating module includes: a heating element, an airflow driving element and a sensor, the heating element is used to heat the air in the accommodating cavity, the airflow driving element is used to drive the airflow, and the sensor is used to detect the air temperature in the accommodating cavity.

[0024] In some feasible embodiments of the present application, the server memory testing device further includes: a control module, wherein the control module is electrically connected to the heating module and the driving module.

[0025] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] Figure 1 A schematic diagram of a server memory testing device provided in an embodiment of the present application;

[0028] Figure 2 for Figure 1 A schematic diagram of a server memory test device shown in , wherein the receiving cavity is open;

[0029] Figure 3 for Figure 2 A schematic diagram of the clamping assembly shown in ;

[0030] Figure 4 for Figure 2 Schematic diagram of the test motherboard shown in;

[0031] Figure 5 for Figure 4 A local enlarged schematic diagram of point A shown in FIG;

[0032] Figure 6 A flowchart of a server memory testing method provided in an embodiment of the present application.

[0033] The above drawings include the following reference numerals:

[0034] 100. Testing device;

[0035] 1. Box body; 11. Box cover; 111. Slide hole; 12. Top plate; 13. Guide rod; 14. Universal wheel;

[0036] 2. Test the motherboard; 21. Slot; 22. Power socket;

[0037] 3. Heating module;

[0038] 4. Clamping assembly; 41. Mounting plate; 42. Positioning member; 421. Positioning block; 422. Positioning rod; 43. Side plate; 44. Clamping member; 441. Clamping bar; 442. Rotating shaft; 45. First elastic member;

[0039] 5. Connecting assembly; 51. Connecting rod; 511. Fixed rod; 512. Movable rod; 52. Second elastic member;

[0040] 6. Drive module; 61. Drive shaft;

[0041] 7. Control module; 8. Warning device;

[0042] 9. Adjustment assembly; 91. Adjustment seat; 92. Bracket; 921. First part; 922. Second part; 93. Rotation rod; 94. Third elastic member; 95. Support;

[0043] 10. Air flow driving parts. DETAILED DESCRIPTION

[0044] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0045] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating positions or positional relationships, are based on the positions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present application. The terms "mounted", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two elements. The terms "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0047] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0048] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0049] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0050] In the description of the embodiments of the present application, the term "plurality" refers to more than two (including two).

[0051] Relevant technologies point out that server memory, also known as RAM (random access memory), is a key hardware component in the server for temporarily storing data and program instructions. When the server memory is used in the chassis, heat accumulation will occur, causing the server memory to be in a high-temperature environment. Memory that lacks high-temperature testing will fail at this time. The working efficiency and stability of the server memory largely depends on whether it can effectively cope with the heat generated during operation.

[0052] When a server is running under high load, the memory module will also generate a lot of heat. If this heat cannot be dissipated in time, the memory operating temperature will increase. Server memory that has not been fully tested at high temperatures may malfunction in such an operating environment, such as data loss, blue screen of death, and other problems, seriously affecting the normal operation and reliability of the server, and thus affecting the use of the server. Although the existing technology can test server memory at high temperatures and understand the changes in memory performance parameters in a sealed high-temperature environment, the server memory needs to be inserted into the test motherboard during testing. The efficiency of single plug-in and pull-out during testing is low, affecting the testing efficiency of the server memory. Therefore, how to improve the testing efficiency of server memory has become a problem that needs to be solved urgently.

[0053] Based on the above considerations, in order to improve the testing efficiency of server memory, the applicant has designed a server memory testing device after in-depth research. The following reference figure describes the server memory testing device 100 according to an embodiment of the present application.

[0054] like Figures 1-6 As shown, Figure 1 A schematic diagram of a server memory testing device provided in an embodiment of the present application; Figure 2 for Figure 1 A schematic diagram of a server memory test device shown in , wherein the receiving cavity is open; Figure 3 for Figure 2 A schematic diagram of the clamping assembly shown in ; Figure 4 for Figure 2 Schematic diagram of the test motherboard shown in; Figure 5 for Figure 4 A local enlarged schematic diagram of point A shown in FIG; Figure 6 A flowchart of a server memory testing method provided in an embodiment of the present application.

[0055] The server memory testing device 100 according to an embodiment of the present application includes: a box 1, a test mainboard 2, a heating module 3 and a clamping assembly 4.

[0056] Specifically, a housing 1 defines a storage chamber, which includes a lid 11 that is movable vertically. The lid 11 is removably secured to the storage chamber. A test motherboard 2 is positioned within the storage chamber, and a heating module 3 is mounted on the housing 1 to heat the storage chamber. A clamping assembly 4 is located on a surface of the lid 11 facing the storage chamber. The clamping assembly 4 is configured to clamp the ejector pins of the server memory and move toward the test motherboard 2 to connect the gold fingers of the server memory to the test motherboard 2. Therefore, rigorous testing of the memory's reliability under high-temperature conditions can significantly reduce the risk of failures due to overheating during actual use, improving the stability of servers and data centers.

[0057] It can be understood that the box body 1 is the basis of the entire test device 100. A closed accommodating cavity is formed inside the box body 1 for placing the server memory to be tested and other components for testing (such as the test motherboard 2 and the heating module 3). The box cover 11 is vertically (such as vertically) Figure 2 The box cover 11 is movable (up and down directions as shown), and the box cover 11 is openable design, which is convenient for users to install and remove server memory. When closed, the box cover 11 seals the box body 1 to prevent external temperature from affecting the test environment and helps to maintain the set high temperature conditions.

[0058] The test motherboard 2 is a key component used to simulate a real server environment. By connecting to the server memory, it can execute various test programs to evaluate the performance of the server memory under high-temperature conditions. A heating module 3, located on the housing 1, heats the interior of the storage chamber. This allows testing to be performed in a set high-temperature environment, verifying that the server memory can operate stably under high-temperature conditions similar to those encountered in real-world use.

[0059] The clamping component 4 is located on the side surface of the box cover 11 facing the accommodating cavity, and is used to clamp the server memory, thereby fixing the server memory and accurately connecting the gold fingers of the server memory to the test motherboard 2. By setting the clamping component 4, a stable connection of the server memory is ensured during the test process, and at the same time, it is convenient to quickly replace the server memory to be tested, thereby improving the test efficiency.

[0060] Reference Figure 1 and Figure 2 As shown, the bottom of the box body 1 is provided with a lockable universal wheel 14 to facilitate the operator to move and carry. The side wall of the box body 1 is provided with a heating module 3. The heating module 3 includes two heating modules, which are arranged in the width direction of the box body 1 (such as Figure 2 A heating module 3 is provided on the outer walls on both sides of the box body 1 (in the first direction shown), and the heating module 3 heats the accommodating cavity in the box body 1 so that the server memory can be tested under a set high temperature environment. The test motherboard 2 is arranged at the bottom of the accommodating cavity, and the test motherboard 2 is powered by being connected to the box body 1. The clamping assembly 4 is connected to the bottom surface of the box cover 11. The clamping assembly 4 is used to clamp the server memory, and in the process of the box cover 11 moving toward the box body 1, the clamping assembly 4 moves the server memory toward the test motherboard 2. Finally, the server memory contacts the test motherboard 2, and the heating module 3 is turned on to perform a high-temperature test on the server memory.

[0061] The following describes the steps of performing a high temperature test on the server memory using the testing device 100:

[0062] First, turn the box cover 11 toward the direction away from the box body 1 (such as Figure 2Move upward as shown) to expose the clamping assembly 4 outside the accommodating cavity, then clamp the server memory to be tested on the clamping assembly 4, and then move the box cover 11 toward the direction close to the box body 1 (as shown). Figure 2 The cover 11 is moved away from the box body 1 to expose the clamping assembly 4 to the outside of the accommodating cavity, and the tested server memory is removed and placed according to the judgment results.

[0063] According to the server memory testing device 100 of the embodiment of the present application, a box cover 11 movable in the up and down directions and a clamping assembly 4 provided on the bottom surface of the box cover 11 are provided to achieve stable and rapid movement of the server memory, and the server memory can be inserted into the test motherboard 2 when the box cover 11 is lowered, thereby effectively improving the efficiency of high-temperature testing of the server memory and solving the problem of low efficiency in single plug-in and pull-out server memory testing in the prior art.

[0064] In any embodiment of the present application, the clamping assembly 4 includes: a mounting plate 41, a side panel 43, a clamping member 44 and a positioning member 42. The mounting plate 41 is connected to the box cover 11. The side panel 43 includes two spaced apart panels, and both side panels 43 are connected to the mounting plate 41. An airflow driving member 10 is provided on the side panel 43. The clamping member 44 is provided between the two side panels 43. One end of the clamping member 44 in a first direction is connected to the side panel 43. The clamping member 44 includes two spaced apart panels, and a clamping space is defined between the two clamping members 44 to accommodate the ejector pin of the server memory. The positioning member 42 is provided at the fixed end of the clamping member 44. The distance between the positioning member 42 and the clamping member 44 in the up and down directions is adjustable. The positioning member 42 is used to position the server memory. Therefore, by setting the side panels 43 and setting the clamping members 44 between the side panels 43, the server memory can be firmly installed on the test motherboard 2, and the test device 100 can be applicable to server memories of different sizes and types, thereby improving the versatility and flexibility of the test device 100. By setting the positioning members 42, it is ensured that the server memory can be accurately installed in the corresponding position on the test motherboard 2.

[0065] It can be understood that the mounting plate 41 is the basic component of the clamping assembly 4. The mounting plate 41 is directly connected to the box cover 11. The mounting plate 41 provides a stable mounting base for other components. The side panels 43 include two spaced apart panels. Both side panels 43 are connected to the mounting plate 41. The side panels 43 provide a mounting base for the assembly of the clamping member 44. The air flow driving member 10 is provided on the side panels 43 to help regulate the air flow in the accommodating cavity, ensuring uniform heat around each server memory, so that each server memory is tested at the same temperature, ensuring the accuracy and reliability of the test results; the clamping member 44 is between the two side panels 43, and the clamping member 44 is connected to the side panel 43 at one end in the first direction. A clamping space is defined between the two clamping members 44 for accommodating and fixing the ejector pin of the server memory, thereby ensuring the accuracy and reliability of the test results. The memory can be firmly clamped between the two clamping members 44 to avoid displacement in the clamping space, so that the server memory can be accurately connected to the test motherboard 2, avoiding poor contact or inability to assemble due to vibration or movement, thereby improving test efficiency; the positioning member 42 is provided at the fixed end of the clamping member 44, that is, the positioning member 42 is provided at the end of the clamping member 44 away from the operator's operation, so that the operator's assembly path will not be blocked, and the operator is convenient for assembly. The distance between the positioning member 42 and the clamping member 44 can be adjusted in the up and down directions, so that the clamping assembly 4 can adapt to server memories of different sizes and types, thereby enhancing the applicability of the test device 100, and the positioning member 42 can ensure that the server memory is accurately inserted into the corresponding position on the test motherboard 2, thereby improving the stability and accuracy of the test process.

[0066] Reference Figure 3 As shown, the clamping assembly 4 includes: a mounting plate 41, a positioning member 42, two side panels 43 and two clamping members 44. The positioning member 42 extends in the first direction in the horizontal direction. The mounting plate 41 is connected to the box cover 11 by fasteners. The upper ends of the two side panels 43 are connected to the mounting plate 41. The two clamping members 44 are arranged between the two side panels 43. A clamping space is defined between the two clamping members 44. The ejector pin of the server memory is arranged in the clamping space. The positioning member 42 is located at the fixed end of the clamping member 44, which is used to limit the position of the server memory in the up and down directions and the first direction. The positioning member 42 includes a positioning block 421 and a positioning rod 422. The length of the positioning rod 422 in the up and down directions is adjustable. The positioning block 421 contacts the server memory to limit the position of the server memory.

[0067] In any embodiment of the present application, the clamping member 44 has a rotating shaft 442 that extends in the vertical direction and is connected to the mounting plate 41 at its upper end. The clamping member 44 and the rotating shaft 442 are relatively rotatable. A first elastic member 45 is connected between one end of the clamping member 44 and the side plate 43. The first elastic member 45 always has a force that rotates one end of the clamping member 44 toward the clamping space. Thus, by providing the rotating shaft 442 and the first elastic member 45 on the clamping member 44, the clamping assembly 4 can flexibly clamp the server memory, improve the stability and versatility of the testing device 100, and automatically adjust the clamping force according to the actual size of the server memory.

[0068] It can be understood that the rotating shaft 442 extends in the up and down directions, and the upper end of the rotating shaft 442 is connected to the mounting plate 41. The rotating shaft 442 provides a fulcrum for the rotation of the clamping member 44. The clamping member 44 can rotate around the axis of the rotating shaft 442, so that the clamping member 44 can automatically adjust the angle according to the size and position of the server memory, ensuring the clamping accuracy and stability of the clamping member 44, and improving the compatibility of the test device 100. The first elastic member 45 is connected between the clamping member 44 and the side plate 43. The first elastic member 45 makes the clamping member 44 always maintain a tendency to clamp inward. The continuous force of the first elastic member 45 ensures that the server memory will not loosen due to vibration or external interference during the test process, thereby ensuring that the server memory does not shift, and further ensuring a reliable connection between the gold finger of the server memory and the test motherboard 2.

[0069] Reference Figure 3 As shown, the rotating shaft 442 extends in the up and down directions, the upper end of the rotating shaft 442 is fixedly connected to the mounting plate 41, the clamping member 44 has four clamping bars 441, the four clamping bars 441 are arranged at intervals in the up and down directions, the rotating shaft 442 is passed through the middle of each clamping bar 441, each clamping bar 441 can rotate around the axis of the rotating shaft 442 relative to the rotating shaft 442, and the first elastic member 45 is connected between each clamping bar 441 and the side plate 43. The first elastic member 45 has a continuous force on the clamping bar 441, so that the clamping member 44 can clamp server memories of different sizes, and also ensures that the clamping assembly 4 can stably clamp the server memory.

[0070] Optionally, the first elastic member 45 is a spring.

[0071] In any embodiment of the present application, a connecting assembly 5 is provided on the clamping assembly 4, and the connecting assembly 5 includes a connecting rod 51 and a second elastic member 52. The connecting rod 51 extends in the up-down direction, and the connecting rod 51 is connected to the bottom of the clamping assembly 4. The connecting rod 51 is electrically connected to the test main board 2. The connecting rod 51 includes a fixed rod 511 and a movable rod 512. The movable rod 512 is movable in the up-down direction relative to the fixed rod 511. The second elastic member 52 is sleeved on the fixed rod 511 and the upper end of the second elastic member 52 abuts against the clamping assembly 4, and the lower end of the second elastic member 52 abuts against the movable rod 512. The second elastic member 52 always has a force to move the movable rod 512 in a direction away from the clamping assembly 4. Therefore, by setting the second elastic member 52 between the movable rod 512 and the clamping assembly 4, and the second elastic member 52 abuts between the movable rod 512 and the clamping assembly 4, the movable rod 512 and the test motherboard 2 can be stably connected, ensuring that the server memory and the test motherboard 2 can always be effectively electrically connected, ensuring reliability during the test process.

[0072] It is understandable that, referring to Figure 3 As shown, the connecting assembly 5 includes a connecting rod 51 and a second elastic member 52. The connecting rod 51 extends in the up-down direction (as shown in FIG. Figure 3 The connecting rod 51 includes a fixed rod 511 and a movable rod 512. The upper end of the fixed rod 511 is connected to the clamping assembly 4. The movable rod 512 is movable in the upper and lower directions relative to the fixed rod 511. The lower end of the movable rod 512 is electrically connected to the test motherboard 2. The movable rod 512 is electrically connected to the fixed rod 511. The fixed rod 511 is electrically connected to the server memory, thereby electrically connecting the server memory to the test motherboard 2. The second elastic member 52 is sleeved on the fixed rod 511. The upper end of the second elastic member 52 is electrically connected to the fixed rod 511. The clamping assembly 4 is in contact with each other, and the lower end of the second elastic member 52 is in contact with the movable rod 512. The second elastic member 52 always has the force to move the movable rod 512 downward, so that the movable rod 512 can be stably connected to the test motherboard 2, and then the movable rod 512 and the test motherboard 2 can be stably electrically connected, ensuring the electrical connection stability of the server memory during the test process, ensuring the accuracy of the test results of the server memory, and avoiding the phenomenon of the movable rod 512 being damaged due to squeezing of the movable rod 512 and the power slot.

[0073] At the same time, the movable rod 512 is electrically connected to the test main board 2, the lower end of the movable rod 512 is electrically connected to the test main board 2, the movable rod 512 is electrically connected to the fixed rod 511, and the fixed rod 511 is electrically connected to the airflow driving component 10 on the clamping assembly 4 to supply power to the airflow driving component 10.

[0074] In any embodiment of the present application, the clamping assemblies 4 are symmetrically arranged in a first direction about the axis of the connecting rod 51 to form a group, and multiple groups of clamping assemblies 4 are spaced apart in a second direction. It is understood that the two clamping assemblies 4 are symmetrically arranged about the axis of the connecting rod 51, and the two symmetrically arranged clamping assemblies 4 form a group. This balances the weight on both sides of the connecting rod 51 and improves the stability of the clamping assemblies 4. The multiple groups of clamping assemblies 4 are spaced apart in the second direction, thereby increasing the test capacity of the test device 100, that is, the test device 100 can test the memory of multiple servers simultaneously, thereby improving test efficiency.

[0075] Reference Figure 2 As shown, there are 26 clamping assemblies 4 , and the 26 clamping assemblies 4 are symmetrically arranged in pairs as a group, that is, 13 groups of clamping assemblies 4 are arranged at intervals in the second direction.

[0076] In any embodiment of the present application, a slot 21 and a power connection slot 22 are formed on the test motherboard 2, the slot 21 is arranged in one-to-one correspondence with the clamping space, the gold finger of the server memory is inserted into the corresponding slot 21, the power connection slot 22 is arranged in one-to-one correspondence with the connecting rod 51, and an adjustment component 9 is provided on the test motherboard 2. The adjustment component 9 is provided at one end of each slot 21 away from the power connection slot 22, and the adjustment component 9 includes: an adjustment seat 91, a bracket 92, a rotating rod 93 and a third elastic member 94. The adjustment seat 91 is provided on both sides of the slot 21 in the second direction, the bracket 92 is rotatably connected to the adjustment seat 91, the rotating rod 93 extends along the second direction, both ends of the rotating rod 93 are connected to the bracket 92 and are rotatable relative to the bracket 92, the third elastic member 94 is connected between the bracket 92 and the adjustment seat 91, and the third elastic member 94 always has a force to rotate the rotating rod 93 away from the test motherboard 2. Therefore, by setting the adjustment component 9, the server memory can be guided to move toward the corresponding slot 21, ensuring that the server memory can be accurately inserted into the corresponding slot 21, avoiding the occurrence of poor contact due to position deviation between the server memory and the slot 21, and reducing damage to the gold fingers of the server memory, thereby ensuring the accuracy of the test results. In this way, there is no need for the operator to pause the test device 100 to manually adjust the server memory, which shortens the preparation time before the test and improves the test efficiency of the server memory.

[0077] Reference Figure 4As shown, 26 slots 21 and 13 power connection slots 22 are formed on the test mainboard 2. The 26 slots 21 are arranged in a one-to-one correspondence with the 26 clamping components 4. A power connection slot 22 is provided between two slots 21 in the first direction. An adjustment component 9 is provided at one end of each slot 21 away from the power connection slot. The adjustment component 9 includes an adjustment seat 91, a bracket 92, a rotating rod 93 and a third elastic member 94. The slots 21 are provided with adjustment seats 91 on both sides of the second direction. The bracket 92 and the adjustment seat 91 are rotatably connected through a support 95. The bracket 92 includes a first part 9 21 and the second part 922, the second part 922 extends in the up and down direction, one end of the first part 921 is rotatably connected to the support 95, the other end of the first part 921 is connected to one end of the second part 922 and is connected in a circular arc transition, the upper end of the third elastic member 94 is connected to the other end of the first part 921, and the lower end of the third elastic member 94 is connected to the adjustment seat 91, there are 9 rotating rods 93, and the 9 rotating rods 93 are arranged in sequence in the up and down direction, and both ends of the 9 rotating rods 93 are rotatably connected to the second part 922 of the corresponding bracket 92.

[0078] In any embodiment of the present application, a warning member 8 is provided on the cover 11, and the warning member 8 is arranged in a one-to-one correspondence with the clamping assembly 4. A top plate 12 is provided above the cover 11, and a guide rod 13 is connected between the top plate 12 and the housing 1. A sliding hole 111 is formed in the cover 11, and the guide rod 13 extends into the sliding hole 111 to enable the cover 11 to move between the top plate 12 and the housing 1. It is understood that each clamping assembly 4 is provided with a corresponding warning member 8. In this way, when the server memory is not installed correctly or an abnormality occurs, the corresponding warning member 8 provides timely feedback, allowing the operator to quickly and accurately adjust or replace the server memory, reducing the risk of accidents. The top plate 12 is located above the cover 11, and the cover 11 is connected to the housing 1 by the guide rod 13. The guide rod 13 cooperates with the sliding hole 111 to define the position of the cover 11 in the first direction and the second direction, preventing unnecessary displacement of the cover 11 during movement, thereby ensuring that the server memory can be accurately inserted into the corresponding slot 21.

[0079] Reference Figure 2 As shown, a warning member 8 is provided on the peripheral wall of the box cover 11, and the warning members 8 include 26. The 26 warning members 8 are arranged in a one-to-one correspondence with the 26 clamping components 4. Four guide rods 13 are connected between the top plate 12 and the box body 1. The four guide rods 13 are respectively arranged at the four corners of the top plate 12. Sliding holes 111 are respectively formed on the four corners of the box cover 11. Each guide rod 13 is respectively inserted into a sliding hole 111. The box cover 11 can move up and down along the axial direction of the guide rod 13.

[0080] In any embodiment of the present application, the server memory testing device 100 further includes: a driving module 6, the driving module 6 is provided on the top plate 12, and the driving shaft 61 of the driving module 6 is connected to the box cover 11 to drive the box cover 11 to move between the top plate 12 and the box body 1. Figure 1 and Figure 2 As shown, the driving module 6 drives the box cover 11 to move in the up and down directions along the direction of the guide rod 13, thereby realizing the automatic control of the opening and closing of the box cover 11, reducing the need for manual intervention, and improving the test efficiency. The driving module 6 can very accurately control the opening and closing speed and position of the box cover 11, thereby reducing the variables during the test.

[0081] In any embodiment of the present application, the heating module 3 includes: a heater, an airflow driving element 10, and a sensor. The heater is used to heat the air in the receiving chamber, the airflow driving element 10 is used to drive the airflow, and the sensor is used to detect the air temperature in the receiving chamber. It is understood that the heater is used to heat the air in the receiving chamber to simulate the high temperature environment that the server may encounter during actual operation. The airflow driving element 10 is used to promote the flow of air in the receiving chamber to ensure that heat is evenly distributed throughout the receiving chamber to avoid temperature gradients or localized high temperatures. The sensor is used to monitor the air temperature in the receiving chamber in real time and provide feedback information to the control module 7 to accurately control the heating process and the temperature in the receiving chamber.

[0082] Specifically, when the heating module 3 starts working, the air temperature in the accommodating chamber is gradually increased. The sensor continuously monitors the temperature in the accommodating chamber and feeds back the data to the control module 7. If it is detected that the temperature in the accommodating chamber has not reached the set value or there is unevenness, the system will automatically adjust the power of the heating element or the speed of the airflow driving element 10 until the temperature is stabilized within the target range and is evenly distributed in the accommodating chamber. When the predetermined temperature is reached, the control module 7 enters the constant temperature mode, maintains the working state of the heating element and the airflow driving element 10, and ensures the temperature stability during the entire test process.

[0083] Reference Figure 1 and Figure 2 As shown, there are two heating modules 3 , which are respectively arranged on both sides of the box body 1 .

[0084] In any embodiment of the present application, the server memory test device 100 further includes a control module 7 electrically connected to both the heating module 3 and the driver module 6. Thus, the control module 7 interacts with the heating module 3 and the driver module 6 to ensure efficient and accurate operation of the entire test device 100. Furthermore, the control module 7 includes a human-computer interaction interface, allowing the user to set test parameters, view the current status, and receive warning messages. This enables comprehensive management and precise control of the server memory test device 100, improving not only the test efficiency of the test device 100 but also its intelligence and safety.

[0085] The following will refer to Figure 1-Figure 5 A server memory testing device 100 according to a specific embodiment of the present application is described.

[0086] Reference Figure 1-Figure 5 As shown, the testing device 100 includes: a box 1, a testing mainboard 2, a heating module 3, a clamping assembly 4, a driving module 6 and a control module 7.

[0087] Specifically, the bottom of the box body 1 is provided with a lockable universal wheel 14 to facilitate the operator to move and carry. The side wall of the box body 1 is provided with a heating module 3. The heating module 3 includes two heating modules, one in the width direction of the box body 1 (such as Figure 1 A heating module 3 is provided on the outer walls on both sides of the box body 1 (in the first direction shown), and the heating module 3 heats the accommodating cavity in the box body 1 so that the server memory can be tested under a set high temperature environment. The test motherboard 2 is arranged at the bottom of the accommodating cavity, and the test motherboard 2 is powered by being connected to the box body 1. The clamping assembly 4 is connected to the bottom surface of the box cover 11. The clamping assembly 4 is used to clamp the server memory, and in the process of the box cover 11 moving toward the box body 1, the clamping assembly 4 moves the server memory toward the test motherboard 2. Finally, the server memory contacts the test motherboard 2, and the heating module 3 is turned on to perform a high-temperature test on the server memory.

[0088] The clamping assembly 4 includes: a mounting plate 41, a positioning member 42, two side panels 43 and two clamping members 44. The mounting plate 41 extends in the first direction in the horizontal direction. The mounting plate 41 is connected to the box cover 11 by fasteners. The upper ends of the two side panels 43 are connected to the mounting plate 41. The two clamping members 44 are arranged between the two side panels 43. A clamping space is defined between the two clamping members 44. The ejector pin of the server memory is arranged in the clamping space. The positioning member 42 is located at the fixed end of the clamping member 44, which is used to limit the position of the server memory in the up and down directions and the first direction. The positioning member 42 includes a positioning block 421 and a positioning rod 422. The length of the positioning rod 422 in the up and down directions is adjustable. The positioning block 421 contacts the server memory to limit the position of the server memory.

[0089] The rotating shaft 442 extends in the up and down directions, and the upper end of the rotating shaft 442 is fixedly connected to the mounting plate 41. The clamping member 44 has four clamping bars 441, and the four clamping bars 441 are arranged at intervals in the up and down directions. The rotating shaft 442 passes through the middle of each clamping bar 441, and each clamping bar 441 can rotate around the axis of the rotating shaft 442 relative to the rotating shaft 442. The first elastic member 45 is connected between each clamping bar 441 and the side plate 43. The first elastic member 45 has a continuous force on the clamping bar 441, so that the clamping member 44 can clamp server memories of different sizes, and also ensures that the clamping assembly 4 can stably clamp the server memory.

[0090] The connecting assembly 5 includes a connecting rod 51 and a second elastic member 52. The connecting rod 51 is arranged in an up-down direction (such as Figure 3 The connecting rod 51 includes a fixed rod 511 and a movable rod 512. The upper end of the fixed rod 511 is connected to the clamping assembly 4. The movable rod 512 is movable in the upper and lower directions relative to the fixed rod 511. The lower end of the movable rod 512 is electrically connected to the test motherboard 2. The movable rod 512 is electrically connected to the fixed rod 511. The fixed rod 511 is electrically connected to the server memory, thereby electrically connecting the server memory to the test motherboard 2. The second elastic member 52 is sleeved on the fixed rod 511. The upper end of the second elastic member 52 is electrically connected to the fixed rod 511. The clamping assembly 4 is in contact with each other, and the lower end of the second elastic member 52 is in contact with the movable rod 512. The second elastic member 52 always has the force to move the movable rod 512 downward, so that the movable rod 512 can be stably connected to the test motherboard 2, and then the movable rod 512 and the test motherboard 2 can be stably electrically connected, ensuring the electrical connection stability of the server memory during the test process, ensuring the accuracy of the test results of the server memory, and avoiding the phenomenon of the movable rod 512 being damaged due to squeezing of the movable rod 512 and the power slot.

[0091] The clamping components 4 include 26, and the 26 clamping components 4 are arranged symmetrically in pairs as a group, that is, 13 groups of clamping components 4 are arranged at intervals in the second direction. The test motherboard 2 is formed with 26 slots 21 and 13 power connection slots 22. The 26 slots 21 are arranged one-to-one with the 26 clamping components 4. There is a power connection slot 22 between two slots 21 in the first direction. Each slot 21 is provided with an adjustment component 9 at the end away from the power connection slot. The adjustment component 9 includes an adjustment seat 91, a bracket 92, a rotating rod 93 and a third elastic member 94. The slot 21 is provided with an adjustment seat 91 on both sides of the second direction. The bracket 92 and the adjustment seat 91 are rotatably connected through a support 95. The bracket 92 includes a first part 92 1 and the second part 922, the second part 922 extends in the up-down direction, one end of the first part 921 is rotatably connected to the support 95, the other end of the first part 921 is connected to one end of the second part 922 and is connected in an arc transition, the upper end of the third elastic member 94 is connected to the other end of the first part 921, and the lower end of the third elastic member 94 is connected to the adjustment seat 91, there are 9 rotating rods 93, and the 9 rotating rods 93 are arranged in sequence in the up-down direction, and both ends of the 9 rotating rods 93 are rotatably connected to the second part 922 of the corresponding bracket 92.

[0092] The peripheral wall of the box cover 11 is provided with a warning member 8, which includes 26 warning members 8. The 26 warning members 8 are arranged in a one-to-one correspondence with the 26 clamping assemblies 4. Four guide rods 13 are connected between the top plate 12 and the box body 1. The four guide rods 13 are respectively arranged at the four corners of the top plate 12. Slide holes 111 are formed on the four corners of the box cover 11. Each guide rod 13 is respectively inserted into a slide hole 111. The box cover 11 can move up and down along the axis of the guide rod 13. The drive module 6 is provided on the top plate 12 to drive the box cover 11 to move in the vertical direction along the direction of the guide rod 13. The heating module 3 includes two, and the two heating modules 3 are respectively arranged on both sides of the box body 1. The control module 7 has a human-computer interaction interface, which allows the user to set test parameters, view the current status, and receive warning information.

[0093] The server memory testing method according to the embodiment of the present application is applied to the testing device 100 according to the embodiment of the present application, such as Figure 6 As shown, the test methods include:

[0094] Step S1: Place the ejector pin of the server memory to be tested into the clamping space and start the testing device 100;

[0095] Step S2: setting a predetermined temperature and a predetermined time, and starting the driving module 6 to make the box cover 11 cover the accommodating cavity;

[0096] Step S3, start the heating module 3 and transmit the test data to the control module 7;

[0097] Step S4: stop the heating module 3 and start the driving module 6 to move the box cover 11 away from the box body 1;

[0098] Step S5: Analyze and judge the test results. If the test results meet the requirements, the server memory is put into use. If the test results do not meet the requirements, the server memory is checked and processed.

[0099] Specifically, first, check the test device 100 to ensure that all components of the test device 100 are intact and not loose in the simulated high-temperature environment of the server memory; then, place the ejector pin of the server memory to be tested into the clamping space, ensure that the end of the server memory with the gold finger is facing downward, adjust the length of the positioning rod 422, so that the positioning block 421 is inserted into the position of the mounting port on the side of the server memory, further fix the server memory, and start the test device 100; then, set the predetermined temperature and predetermined time, start the drive module 6 to make the box cover 11 cover the accommodating cavity, and during the descent process, adjust the component 9 to pressurize and adjust the end of the server memory away from the positioning piece 42, so that the server memory can be more stably inserted into the slot 21; then, start the heating module 3. When the heating module 3 starts working, it gradually increases the air temperature in the accommodating cavity. The sensor continuously monitors the temperature in the accommodating cavity and The data is fed back to the control module 7. If it is detected that the temperature in the accommodating chamber has not reached the set value or there is unevenness, the system will automatically adjust the power of the heating element or the speed of the airflow driving element 10 until the temperature is stabilized within the target range and evenly distributed in the accommodating chamber. When the predetermined temperature is reached, the control module 7 enters the constant temperature mode, maintains the working state of the heating element and the airflow driving element 10, ensures the temperature stability during the entire test process, transmits test data such as read and write speed, stability, etc. to the control module 7 during the test, and records the test data; then, stop the heating module 3 and start the driving module 6 to make the box cover 11 away from the box body 1; then, analyze and judge the test results. If it meets the requirements, the server memory is put into use. If it does not meet the requirements, the server memory is checked and processed; finally, the test equipment is sorted out, the power is turned off, and the test device 100 is restored to its initial state for next use.

[0100] According to the server memory testing method of the embodiment of the present application, by applying the server memory testing device 100 of the embodiment of the present application, the efficiency of high-temperature testing of the server memory is effectively improved, the problem of low efficiency in single plug-in server memory testing in the prior art is solved, and the stability and accuracy of the testing process are enhanced.

[0101] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A server memory testing device (100), characterized in that: include: A box body (1), wherein a receiving cavity is formed in the box body (1), and the box body (1) has a box cover (11) movable in an up-down direction, and the box cover (11) is openably sealed on the receiving cavity; A test mainboard (2), the test mainboard (2) being arranged in the accommodating cavity; A heating module (3), the heating module (3) being arranged on the box body (1), and the heating module (3) being used to heat the interior of the accommodating cavity; A clamping assembly (4) is provided on a side surface of the box cover (11) facing the accommodating cavity, and the clamping assembly (4) is used to clamp the ejector pin of the server memory and move toward the test mainboard (2) so that the gold finger of the server memory is connected to the test mainboard (2).

2. The server memory testing device (100) according to claim 1, characterized in that: The clamping assembly (4) comprises: A mounting plate (41), wherein the mounting plate (41) is connected to the box cover (11); Side panels (43), the side panels (43) comprising two spaced apart, both of the side panels (43) being connected to the mounting plate (41), and the side panels (43) being provided with airflow driving members (10); A clamping member (44), the clamping member (44) is provided between the two side plates (43), one end of the clamping member (44) in a first direction is connected to the side plate (43), the clamping member (44) comprises two clamping members (44) arranged at intervals, and a clamping space is defined between the two clamping members (44) to accommodate the ejector pin of the server memory; A positioning member (42) is provided at a fixed end of the clamping member (44); the distance between the positioning member (42) and the clamping member (44) in the vertical direction is adjustable; and the positioning member (42) is used to position the server memory.

3. The server memory testing device (100) according to claim 2, characterized in that: The clamping member (44) has a rotating shaft (442), which extends in the up-down direction and the upper end of which is connected to the mounting plate (41). The clamping member (44) and the rotating shaft (442) are relatively rotatable. A first elastic member (45) is connected between the one end of the clamping member (44) and the side plate (43). The first elastic member (45) always has a force to rotate the one end of the clamping member (44) toward the clamping space.

4. The server memory testing device (100) according to claim 3, characterized in that: The clamping assembly (4) is provided with a connecting assembly (5), and the connecting assembly (5) includes a connecting rod (51) and a second elastic member (52). The connecting rod (51) extends in the up-down direction, and the connecting rod (51) is connected to the bottom of the clamping assembly (4). The connecting rod (51) is electrically connected to the test mainboard (2). The connecting rod (51) includes a fixed rod (511) and a movable rod (512). The movable rod (512) is movable in the up-down direction relative to the fixed rod (511). The second elastic member (52) is sleeved on the fixed rod (511) and the upper end of the second elastic member (52) abuts against the clamping assembly (4), and the lower end of the second elastic member (52) abuts against the movable rod (512). The second elastic member (52) always has a force to move the movable rod (512) in a direction away from the clamping assembly (4).

5. The server memory testing device (100) according to claim 4, characterized in that: The clamping assemblies (4) are symmetrically arranged as a group in a first direction about the axis of the connecting rod (51), and multiple groups of the clamping assemblies (4) are spaced apart in a second direction.

6. The server memory testing device (100) according to claim 4, characterized in that: The test mainboard (2) is formed with a slot (21) and a power connection slot (22), the slot (21) and the clamping space are arranged in a one-to-one correspondence, the gold finger of the server memory is inserted into the corresponding slot (21), the power connection slot (22) and the connecting rod (51) are arranged in a one-to-one correspondence, and the test mainboard (2) is provided with an adjustment component (9), the adjustment component (9) is arranged at one end of each slot (21) away from the power connection slot (22), and the adjustment component (9) includes: An adjustment seat (91), the adjustment seat (91) being arranged on both sides of the slot (21) in the second direction; a bracket (92), the bracket (92) being rotatably connected to the adjustment seat (91); a rotating rod (93), the rotating rod (93) extending along the second direction, both ends of the rotating rod (93) being connected to the bracket (92) and being rotatable relative to the bracket (92); A third elastic member (94) is connected between the bracket (92) and the adjustment seat (91), and the third elastic member (94) always has a force to rotate the rotating rod (93) away from the test main board (2).

7. The server memory testing device (100) according to any one of claims 1 to 6, characterized in that: The box cover (11) is provided with a warning member (8), and the warning member (8) is arranged in a one-to-one correspondence with the clamping assembly (4). A top plate (12) is provided above the box cover (11), and a guide rod (13) is connected between the top plate (12) and the box body (1). A sliding hole (111) is formed on the box cover (11), and the guide rod (13) extends into the sliding hole (111) to enable the box cover (11) to move between the top plate (12) and the box body (1).

8. The server memory testing device (100) according to claim 7, characterized in that: Also includes: A driving module (6) is provided on the top plate (12), and a driving shaft (61) of the driving module (6) is connected to the box cover (11) to drive the box cover (11) to move between the top plate (12) and the box body (1).

9. The server memory testing device (100) according to claim 8, characterized in that: The heating module (3) comprises: a heating element, an airflow driving element (10) and a sensor, wherein the heating element is used to heat the air in the accommodating chamber, the airflow driving element (10) is used to drive the airflow, and the sensor is used to detect the air temperature in the accommodating chamber.

10. The server memory testing device (100) according to claim 9, characterized in that: Also includes: A control module (7), wherein the control module (7) is electrically connected to the heating module (3) and the driving module (6).

Images