Conductive heat dissipation integrated cable and method

Abstract

The application discloses a kind of electrically conductive heat dissipation integration cable and method, cable includes: multiple sequentially connected wire substructure;Each wire substructure includes: high-power electrically conductive section, insulating heat dissipation section and micro-slot array, high-power electrically conductive section is the cylindrical tube body of heat-conducting, electrically conductive material, one end is formed through precision cold bending process The bending section of right-angle structure;Insulating heat dissipation section is the cylindrical tube body structure of heat-conducting insulating ceramic material, seamlessly integrated with bending section;The micro-slot array of each wire substructure tubular shell inner wall is etched;Nano silver plating layer is inlaid in the micro-slot array of high-power electrically conductive section position, and super-hydrophilic layer is configured in the micro-slot array of insulating heat dissipation section position;The insulating phase change material of the application evaporates in high-power electrically conductive section, is drained to insulating heat dissipation section condensation by bending section, and continuous capillary pumping force is formed by capillary force, gravity combination, realizes no pump self-sustaining circulation, significantly improves the temperature control capability of high-power wire under extreme current density.

Description

Technical Field

[0001] The present invention relates to the technical field of cooling high-power charging cables, and in particular to a conductive and heat-dissipating integrated cable and method. Background Art

[0002] With the increasing popularity of industrial equipment, data centers, new energy facilities (such as charging stations and photovoltaic power plants), and high-power appliances (such as electric furnaces and air conditioners), the demand for high-power cables capable of carrying high currents has surged. In power transmission, these cables are used in long-distance, high-capacity transmission lines, such as those from power plants to substations and in backbone power grids between cities, to transport large amounts of electricity from power generation to concentrated power consumption areas. In the industrial sector, these cables power high-power equipment in large factories, such as large electric furnaces in steel mills and electrolytic cells in aluminum plants. These devices require large amounts of power and rely on high-power cables for transmission. In large data centers, numerous servers require continuous and stable high-power power supply, and high-power cables are responsible for transmitting power from the distribution room to the server clusters.

[0003] The stability challenges faced by high-power cables operating under high voltage (typically ≥35kV) and high temperature (long-term conductor operating temperature ≥90°C) conditions are essentially multi-physics coupling failures. When cables carry currents in the kiloampere range, even with low-resistivity conductors, the thermal power density per unit length can exceed 300W / m². The resulting heat poses significant risks in projects with transmission distances exceeding a kilometer or where the conductor cross-sectional area is limited.

[0004] Cable conductors generate a large amount of heat when loaded. This heat buildup can increase cable temperatures, degrading their electrical performance. The insulation resistance of insulating materials decreases at high temperatures, potentially leading to safety hazards such as leakage and short circuits, and increasing the risk of electrical fires. Cables typically consist of metal conductors, insulation layers, and sheaths. When temperatures are too high, metal conductors expand significantly, while the thermal expansion coefficients of outer materials such as the insulation layer and sheath differ. This can cause internal stress between the different materials. Prolonged exposure to this condition can weaken the bonding between the cable's various layers, causing the insulation layer to gradually peel away from the conductor, reducing the stability of the cable's overall structure.

[0005] Currently, the main thermal management methods for cables include air cooling and liquid cooling. Air cooling uses fans to create airflow to remove heat. In electrical cabinets where power cables are concentrated, small fans or ventilation systems are installed to continuously flow air over the cables, allowing air cooling to be used to cool the high-power conductors in the cabinet. Liquid cooling utilizes the high specific heat capacity of liquids (such as water or coolant) to absorb large amounts of heat, which is then removed through a circulation system. In some scenarios involving ultra-high power cables or those requiring strict temperature control, coolant is routed through specially designed pipes surrounding the cables or directly into contact with the cable's heat dissipation structure.

[0006] However, current thermal management technologies for high-power cables, both air and liquid cooling, have significant shortcomings. Air cooling systems are limited by the low specific heat capacity of air, only 1.005 kJ / kg·K. At current densities greater than 15 A / mm², the axial temperature rise gradient can reach as high as 80°C / m, making them ineffective in cooling high-power cables. Liquid cooling systems, due to laminar boundary effects and phase change hysteresis, can lead to axial temperature differences exceeding 35 K, resulting in uneven cable temperatures. Neither air nor liquid cooling systems can effectively suppress temperature rise and accumulation in high-power cables, making it difficult to ensure the electrical performance and structural stability of high-power cables. Summary of the Invention

[0007] The object of the present invention is to provide a conductive and heat dissipating integrated cable and method, which can effectively suppress the temperature rise and concentration of high-power cables and ensure the electrical performance and structural stability of the high-power cables.

[0008] The technical solution of the present invention is:

[0009] A conductive and heat-dissipating integrated cable comprises a plurality of conductor sub-body structures connected in sequence, each of the conductor sub-body structures being a tubular shell of an L-shaped structure, the tubular shell being filled with an insulating phase-change material, the tubular shell serving as a channel for the flow of the insulating phase-change material, each of the conductor sub-body structures comprising: a high-power conductive segment, which is a cylindrical tube body of thermally conductive and electrically conductive material, one end of which is configured as a bending section of a right-angle structure; an insulating heat-dissipating segment, which is a cylindrical tube body of high-thermal-conductive insulating ceramic material, one end of which is seamlessly integrated with an end of the bending section away from the high-power conductive segment, and the other end of which is seamlessly connected to an external independent heat-dissipating channel; a microgroove array, comprising: a plurality of microgrooves, each of which is arranged along the direction of the channel of the tubular shell, and a plurality of the microgrooves being evenly arranged in a ring array on the inner wall of the tubular shell, and a plurality of conductor sub-body structures being compositely connected in sequence along the axial direction of the high-power conductive segment through a precision sintering process. A precision sintering process such as spark plasma sintering, microwave sintering, etc. is used, between two adjacent wire sub-structures, the high-power conductive segment of one wire sub-structure is connected to the bending segment of the other wire sub-structure by tightly sintering.

[0010] Furthermore, the microgrooves of the microgroove array at the bending section adopt variable-section microgrooves with a gradient groove depth design, which gradually change the microgroove depth along the bending direction to maintain the capillary force gradient, ensure uniform liquid reflux, and form a dense conductive layer through the laser remelting process at the groove bottom.

[0011] The bend in the bend hinders the return flow of the liquid working fluid in the insulating phase change material. The vapor and liquid flow paths suddenly change at the bend, causing turbulence or stagnation. This imbalance in capillary force distribution leads to localized insufficient working fluid supply, which in turn causes local hotspots. By designing the microgroove array in the bend with a gradient groove depth, local hotspots are eliminated, the capillary force gradient is maintained, and uniform liquid return flow is ensured. The bend section also utilizes variable-section microgrooves to adjust the cross-sectional area of ​​the bend, reducing flow resistance and redistributing the flow paths of vapor and liquid. The combination of a gradient groove depth design and a variable-section microgroove design optimizes working fluid flow, reduces local hotspots, and enhances thermal efficiency.

[0012] Furthermore, the microgroove arrays at the high-power conductive segment are embedded with nanosilver coatings, and the microgroove arrays at the insulating heat dissipation segment are configured with a super-hydrophilic layer, such as a titanium oxide coating. The nanosilver coating can reduce resistance and ensure current density uniformity, thereby simultaneously enhancing capillary force and electron transmission efficiency. The capillary force and the nanosilver coating work synergistically to maintain a stable temperature of the conductor at high current density, and have the ability to operate stably under uniform current density, transient thermal shock, and complex mechanical conditions. The microgroove arrays at the insulating heat dissipation segment accelerate steam condensation through the super-hydrophilic coating.

[0013] Furthermore, the external independent heat dissipation channel adopts one of a copper micro-fin array or a liquid cooling plate.

[0014] Furthermore, the surface of the bending section is subjected to a local strengthening design using nano-processing and a stress-resistant treatment using laser shock peening to ensure mechanical stability.

[0015] A conductive heat dissipation method for a conductive heat dissipation integrated cable, utilizing the integrated cable for conductive heat dissipation, comprises the following steps:

[0016] The Joule heat generated by the current in the high-power conductive section drives the evaporation of the insulating phase change material inside the tubular shell through the nano-silver coating in the microgrooves, generating local high pressure to form a high-pressure evaporation section. The steam is guided from the high-pressure evaporation section through the variable-section microgrooves at the bending section to the insulating heat dissipation section. The insulating heat dissipation section guides the heat of the steam to an external independent heat dissipation channel. At the same time, the microgroove array and super-hydrophilic coating in the insulating heat dissipation section accelerate the condensation of the steam. After the liquid film is formed, the pressure is reduced to form a low-pressure condensation section, maintaining the pressure difference of the steam flow. The condensate is returned to the high-power conductive section by the capillary force combined with the assistance of gravity.

[0017] The circulation path of the insulating phase change material is: evaporation in the high-power conductive section, drainage through the bending section to the insulating heat dissipation section for condensation, and a continuous capillary pumping force is formed by capillary force combined with gravity assistance to achieve pump-free self-sustaining circulation of the working fluid on the super-hydrophilic surface.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The multiple conductor sub-body structures of the present invention are compositely connected in sequence through a precision sintering process, and each conductor sub-body structure includes a high-power conductive segment, a bending segment and an insulating heat dissipation segment. The tubular shell and the microgroove array within it together form a dual-channel coupling consisting of a current channel and a heat channel. The Joule heat generated by the current in the high-power conductive section drives the insulating phase-change material inside the tubular shell to evaporate through capillary forces, generating localized high pressure and forming a high-pressure evaporation section. From this high-pressure evaporation section, the vapor is guided through the variable-cross-section microgrooves in the bend section to the insulating heat dissipation section, which directs the vapor heat to an external independent heat dissipation channel. Simultaneously, the microgroove array and super-hydrophilic coating within the insulating heat dissipation section accelerate vapor condensation. Once a liquid film forms, the pressure decreases, forming a low-pressure condensation section that maintains the pressure differential for vapor flow. The condensate flows back from the insulating heat dissipation section to the high-power conductive section, driven by capillary forces and assisted by gravity. The insulating phase-change material within the entire conductor substructure self-sustains circulation without a pump and absorbs heat through phase change, significantly improving the temperature control capability of the high-power conductor under extreme current densities. The conductor temperature can be kept low at high power densities. The phase-change material also buffers transient thermal shock, significantly reducing temperature fluctuations and improving conductor temperature uniformity.

[0020] The cable of the present invention has the dual functions of electrical conduction and heat transfer, directly replacing the traditional discrete design of wires combined with external heat sinks, reducing the system volume by more than 60%. It is particularly suitable for the integrated packaging of high-density power electronic modules. In addition, the working fluid inside the cable of the present invention does not rely on external pumping conditions, avoiding damage to the wire machinery caused by active thermal management methods.

[0021] The present invention arranges variable-section microgrooves with a gradient groove depth design at the bending section to adjust the cross-sectional area of ​​the bending section, reduce flow resistance, and redistribute the flow paths of steam and liquid. By combining the gradient groove depth design and the variable-section microgroove design, the capillary force gradient is maintained, ensuring uniform liquid reflux, optimizing the flow of the working fluid, and significantly suppressing the formation of local hot spots in high-power conductors, thereby avoiding carbonization or breakdown of the insulation layer caused by local hot spots (>150°C) in traditional conductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0023] Figure 2 It is a schematic diagram of the conductor sub-body structure of the present invention.

[0024] Figure 3 It is a cross-sectional view of the conductor sub-body structure of the present invention.

[0025] Among them, 1. conductor sub-body structure, 2. insulation and heat dissipation section, 3. high-power conductive section, 4. bending section, 5. micro-groove array, 6. channel. DETAILED DESCRIPTION

[0026] The following combination Figures 1 to 3 , the specific embodiments of the present invention are described in detail. In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0027] Example

[0028] like Figure 1 、 Figure 2 and Figure 3 As shown, a conductive and heat dissipating integrated cable includes multiple conductor sub-structures 1 formed by a precision sintering process. Each conductor sub-structure 1 is an L-shaped tubular shell. The inner cavity of the tubular shell is filled with an insulating phase change material. The tubular shell serves as a channel 6 for the insulating phase change material. The insulating phase change material can use perfluoropolyether material as a circulating working fluid, such as Figure 2 As shown, each conductor sub-body structure 1 includes: a high-power conductive segment 3, an insulating heat dissipation segment 2 and a microgroove array 5. The high-power conductive segment 3 is a cylindrical tube body made of thermally conductive and electrically conductive materials for current to pass through. One end of the high-power conductive segment 3 is configured as a bending segment 4 with a right-angle structure. The current passing through the high-power conductive segment 3 is above 1000A, and the power is between 190MW and 1.9GW. The insulating heat dissipation segment 2 is a cylindrical tube body made of high thermal conductivity insulating ceramic material. One end is seamlessly integrated with the end of the bending segment 4 away from the high-power conductive segment 3 through a precision sintering process, and the other end is seamlessly connected to an external independent heat dissipation channel, achieving electrical insulation isolation while maintaining high thermal conductivity. The external independent heat dissipation channel adopts one of a copper micro-fin array or a liquid cooling plate. The thermal conductivity of the insulating heat dissipation segment 2 is: 170W / (m·K)~330W / (m·K); as shown Figure 3 As shown, the microgroove array 5 includes a plurality of microgrooves, each of which is arranged along the direction of the channel 6 of the tubular shell, and the plurality of microgrooves are evenly arranged in a circular array on the inner wall of the tubular shell, and have formed a full-section arrangement of the conductor sub-body structure 1; between two adjacent conductor sub-body structures 1, the high-power conductive segment 3 of one conductor sub-body structure 1 is connected to the bending segment 4 of the other conductor sub-body structure 1, and multiple conductor sub-body structures 1 are connected in sequence along the axial direction of the high-power conductive segment 3.

[0029] In some embodiments, the microgrooves at the bending section 4 are configured as variable-section microgrooves with a gradient groove depth design, gradually changing the microgroove depth along the bending direction to maintain the capillary force gradient, ensure uniform liquid reflux, and form a dense conductive layer through a laser remelting process at the bottom of the groove.

[0030] Because the curved structure of bend section 4 easily obstructs the backflow of the working fluid in the insulating phase change material, the flow paths of vapor and liquid suddenly change at the bend, causing turbulence or stagnation. This imbalance in capillary force distribution leads to localized insufficient working fluid supply and the appearance of local hot spots. By designing the microgroove array 5 in bend section 4 with a gradient groove depth, local hot spots are eliminated, the capillary force gradient is maintained, and uniform liquid backflow is ensured. Furthermore, bend section 4 utilizes variable-section microgrooves to adjust the cross-sectional area of ​​bend section 4, reducing flow resistance and redistributing the flow paths of vapor and liquid. The combination of a gradient groove depth design and a variable-section microgroove design optimizes working fluid flow, reduces local hot spots, and enhances thermal conductivity.

[0031] The magnitude of the capillary force is determined by the surface tension between the liquid and the solid wall and the effective pore radius of the capillary structure. The width and depth of the microgroove directly affect the effective pore radius of the capillary structure.

[0032] The microgroove width of the microgroove array 5 of this embodiment is designed to be between 50 μm and 500 μm, and the microgroove depth is 1 to 5 times the groove width.

[0033] The variable cross-section microgroove of the bending section 4 is designed as follows:

[0034] Groove width gradient:

[0035] Entrance section (close to the high-pressure evaporation section): The groove width is narrow (such as 100 μm) and is used to enhance the capillary force to drive the phase change material working fluid into the bending section 4.

[0036] Bending part (curved part): The groove width gradually increases (such as 100μm→200μm) to reduce the flow resistance of the phase change material working fluid and adapt to the flow velocity changes caused by bending.

[0037] Outlet section (condensation section close to low pressure): The groove width is restored to the initial value (such as 100μm) to maintain capillary force balance.

[0038] The gradient groove depth of the bending section 4 is designed as follows:

[0039] Groove depth gradient:

[0040] Inside the bend (near the center of the bend): The groove depth increases (e.g., 150 μm → 250 μm) to compensate for the outward migration of liquid caused by centrifugal force.

[0041] Outside the bend (close to the inlet / outlet section of bend section 4): the groove depth is reduced (e.g., 150 μm → 50 μm) to suppress liquid accumulation.

[0042] Groove shape optimization:

[0043] The shallow groove near the inlet / outlet section of the bending section 4 adopts a V-groove design to enhance capillary pumping.

[0044] The deep groove near the center of the bend section 4 is designed as a trapezoidal groove to reduce the flow separation of the phase change material inside the bend.

[0045] In some embodiments, the microgrooves within the high-power conductive segment 3 are all embedded with nanosilver coatings. A super-hydrophilic layer is configured within the microgroove array 5 at the insulating heat dissipation segment 2. The nanosilver coating can reduce resistance, ensure current density uniformity, and simultaneously enhance capillary force and electron transmission efficiency. The capillary force of the entire microgroove structure and the nanosilver coating work synergistically to maintain a stable temperature of the conductor under high current density, and have the ability to operate stably under uniform current density, transient thermal shock, and complex mechanical conditions. The microgroove array 5 at the insulating heat dissipation segment 2 accelerates steam condensation through the super-hydrophilic coating.

[0046] In some embodiments, the surface of the bending section 4 is subjected to a local strengthening design with nano-processing and a stress-resistant treatment with laser shock peening to ensure mechanical stability.

[0047] A conductive heat dissipation method for a conductive heat dissipation integrated cable, utilizing the integrated cable for conductive heat dissipation, comprises the following steps:

[0048] The Joule heat generated by the current in the high-power conductive section 3 drives the insulating phase change material inside the tubular shell to evaporate through the nano-silver coating in the microgrooves, generating local high pressure and forming a high-pressure evaporation section. The steam from the high-pressure evaporation section is guided through the variable-section microgrooves at the bend section 4 to the insulating heat dissipation section 2. The insulating heat dissipation section 2 conducts the heat of the steam to an external independent heat dissipation channel. At the same time, the axial microgroove array 5 and the super-hydrophilic coating in the insulating heat dissipation section 2 accelerate the condensation of the steam. After the liquid film is formed, the pressure is reduced, forming a low-pressure condensation section. The pressure difference of the steam flow is maintained. The condensate is returned from the insulating heat dissipation section 2 to the high-power conductive section 3 by capillary force, assisted by gravity.

[0049] Since the bending structure of the bending section 4 easily hinders the reflux of the working fluid liquid; the flow paths of the steam and liquid suddenly change at the bend, causing turbulence or retention; the capillary force distribution is unbalanced, resulting in insufficient local working fluid supply and the appearance of local hot spots. This embodiment eliminates local hot spots by combining the variable cross-section microgroove structure of the bending section 4 with a gradient groove depth design; variable cross-section microgroove: adjusts the cross-sectional area of ​​the bending section 4, reduces flow resistance, and redistributes the flow paths of steam and liquid. Gradient groove depth: gradually changes the microgroove depth along the bending direction, such as from the inside to the outside, maintains the capillary force gradient, and ensures uniform reflux of the liquid. The combination of the two can greatly optimize the flow of the working fluid, reduce local hot spots, and enhance thermal conductivity efficiency.

[0050] The circulation path of the insulating phase change material is: evaporation in the high-power conductive section 3, drainage to the insulating heat dissipation section 2 through the bending section 4 for condensation, and a continuous capillary pumping force is formed by capillary force combined with gravity assistance to achieve pump-free self-sustaining circulation of the working fluid on the super-hydrophilic surface.

[0051] The working principle of a conductive and heat dissipating integrated cable is as follows: in each conductor sub-structure 1, the physical separation of current and heat flow is achieved through the high-power conductive segment 3 and the insulating heat dissipation segment 2.

[0052] Current channel: High-frequency current flows along the microgroove array 5 and channel 6 in the high-power conductive segment 3.

[0053] Hot channel: The Joule heat generated by the high current density in the high-power conductive section 3 drives the evaporation of the insulating phase change material inside the channel 6 through the microgroove array 5, generating local high pressure. Under the action of the pressure difference, the vapor is transported along the bending section 4 to the insulating heat dissipation section 2. After condensation, the pressure decreases and the pressure difference is maintained. The condensed working fluid is refluxed by capillary force combined with gravity assistance, forming an independent heat circulation path.

[0054] Current is transmitted along the surface of the high-power conductive segment 3, while heat is removed through the microgroove array 5 and channels 6, achieving an integrated electrical-thermal dual-channel system and physical separation of electrical and thermal states. The capillary pumping force of the entire microgroove 5, combined with the nano-silver coating, maintains a stable conductor temperature at high current densities, ensuring uniform current density, and robust operation under transient thermal shock and complex mechanical conditions.

[0055] Phase change cooling technology leverages the high latent heat of matter during phase transitions to achieve efficient heat absorption and transfer under near-isothermal conditions. Its heat storage capacity per unit mass is over three times that of traditional convection cooling, significantly improving thermal conductivity compared to air- and liquid-cooled systems while overcoming the significant drawbacks of the latter two systems. Because it absorbs large amounts of heat during the cooling process while maintaining relatively minimal temperature fluctuations, it can quickly extract heat from the heat source, keeping it at a relatively low temperature. This is particularly true in scenarios with high heat flux densities generated by high-power cables, enabling rapid and efficient heat transfer while maintaining a relatively stable temperature range. This improves temperature uniformity across the high-power conductors and provides more stable heat dissipation.

[0056] The above disclosures are only several preferred specific embodiments of the present invention. However, the embodiments of the present invention are not limited thereto. Any changes that can be conceived by those skilled in the art should fall within the scope of protection of the present invention.

Claims

1. A conductive and heat dissipating integrated cable, characterized in that: The invention comprises a plurality of sequentially connected conductor sub-body structures, each of which is an L-shaped tubular shell filled with an insulating phase change material. The tubular shell serves as a channel for the insulating phase change material to flow. Each conductor sub-body structure comprises: The high-power conductive section is a tube made of heat-conducting and conductive materials, with one end configured as a bent section; The insulating heat dissipation section is a tube made of high thermal conductivity insulating ceramic material. One end is seamlessly integrated with the end of the bending section away from the high-power conductive section, and the other end is seamlessly connected to the external independent heat dissipation channel; A microgroove array comprising: a plurality of microgrooves, each of which is arranged along the direction of the channel of the tubular shell, and the plurality of microgrooves are evenly distributed on the inner wall of the tubular shell in an annular array; The plurality of conductor sub-body structures are sequentially connected along the axial direction of the high-power conductive segment, and between two adjacent conductor sub-body structures, the high-power conductive segment of one conductor sub-body structure is connected to the bending segment of the other conductor sub-body structure; The bending section is a right-angle structure formed by a precision cold bending process; The microgrooves of the microgrooves array at the bending section are microgrooves with variable cross-sections and a gradient groove depth design, and the groove bottoms of the microgrooves at the bending section are provided with a dense conductive layer; The microgroove arrays at the high-power conductive segment are all embedded with nano-silver coatings, and the microgroove arrays at the insulating heat dissipation segment are configured with super-hydrophilic layers; The Joule heat generated by the current in the high-power conductive section drives the insulating phase change material inside the tubular shell to evaporate through capillary force, generating local high pressure to form a high-pressure evaporation section. The steam is guided from the high-pressure evaporation section through the variable-section microgrooves at the bending section to the insulating heat dissipation section. The insulating heat dissipation section guides the heat of the steam to an external independent heat dissipation channel. At the same time, the microgroove array and super-hydrophilic coating in the insulating heat dissipation section accelerate the condensation of the steam. After the liquid film is formed, the pressure is reduced to form a low-pressure condensation section, maintaining the pressure difference of the steam flow. The condensate is returned from the insulating heat dissipation section to the high-power conductive section by capillary force combined with gravity assistance; the insulating phase change material inside the entire conductor sub-body structure maintains self-circulation without a pump and absorbs heat through phase change.

2. The conductive and heat dissipating integrated cable according to claim 1, characterized in that: The external independent heat dissipation channel adopts one of a copper micro-fin array or a liquid cooling plate.

3. A conductive heat dissipation method for a conductive heat dissipation integrated cable, characterized in that: Using the cable according to any one of claims 1-2 for conductive heat dissipation comprises the following steps: The Joule heat generated by the current in the high-power conductive section drives the insulating phase change material inside the tubular shell to evaporate, generating local high pressure, forming a high-pressure evaporation section. The steam flows from the high-pressure evaporation section through the bending section to the insulating heat dissipation section. The insulating heat dissipation section conducts the heat of the steam to an external independent heat dissipation channel. At the same time, the steam condenses in the microgroove array of the insulating heat dissipation section. After forming a liquid film, the pressure decreases, forming a low-pressure condensation section, maintaining the pressure difference of the steam flow. The condensate is returned to the high-power conductive section by the capillary force combined with the assistance of gravity.

4. The conductive heat dissipation method of a conductive heat dissipation integrated cable according to claim 3, characterized in that: The Joule heat generated by the current in the high-power conductive section drives the evaporation of the insulating phase change material inside the tubular shell through the nano-silver coating in the micro-groove array.

5. The conductive heat dissipation method of a conductive heat dissipation integrated cable according to claim 3, characterized in that: The microgroove array in the insulating heat dissipation section accelerates steam condensation through the super-hydrophilic coating.

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