Twin heat dissipation adjusting system and method for radio frequency power amplifier

Abstract

The invention discloses a twin heat dissipation adjusting system and method for a radio frequency power amplifier. The system comprises a central processing unit module, a double-path physical channel, a double-radio-frequency power amplifier, four symmetrical radio-frequency switching devices, a power supply current sampling unit, an output power sampling unit and a temperature sensor, the four symmetrical radio frequency switch devices enable at least two communication modes to exist between the double-channel physical channel and the double radio frequency power amplifier. The power supply current sampling unit acquires power supply power consumption current data of the radio frequency power amplifier and transmits the power supply power consumption current data to the central processing unit module; the output power sampling unit obtains the radio frequency output power of the radio frequency power amplifier and transmits the radio frequency output power to the central processing unit module; the temperature sensor obtains temperature data of a printed board near the radio frequency power amplifier and transmits the temperature data to the central processor module. The problem that the radio frequency power amplifier cannot work stably for a long time can be solved at least.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to a twin heat dissipation adjustment system and method for a radio frequency power amplifier. Background Art

[0002] With the increasing application of wireless communication technology, the need for higher RF signal transmission power has become a common application scenario. The development of 5G mobile communications, in particular, has led to a widespread demand for high signal power in wireless communication devices, and as a result, the issue of heat generation in wireless communication products has become increasingly important. RF power amplifiers are core power-consuming components, and ensuring long-term stable and reliable operation of RF power amplifiers in wireless communication equipment is particularly challenging, especially in extremely high-temperature environments.

[0003] However, the inventors discovered that the related art has at least the following technical problems:

[0004] In existing technology, the RF power amplifier is directly soldered to a heat sink substrate, which is then internally connected to the RF power amplifier. During installation, the heat sink copper sheet directly contacts the grounding copper foil of the printed circuit board, resulting in low ground impedance. A soft, thermally conductive pad is placed between the heat sink copper sheet and the heat sink base to improve the heat dissipation performance of the RF power amplifier. This method is specific to RF power amplifier modules, resulting in high component procurement costs and inflexible structural design due to the module's shape.

[0005] These technical defects seriously restrict the long-term stable operation of RF power amplifiers. To solve the above problems, it is urgent to develop a new RF power amplifier heat dissipation regulation solution. Summary of the Invention

[0006] One purpose of the present application is to provide a radio frequency power amplifier twin heat dissipation adjustment system and method, at least to solve the problem that the radio frequency power amplifier cannot operate stably for a long time in wireless communication equipment.

[0007] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0008] In a first aspect, some embodiments of the present application provide a twin heat dissipation adjustment system for a radio frequency power amplifier, characterized in that the system comprises: a central processing unit module and a twin radio frequency power amplifier module; wherein,

[0009] The twin RF power amplifier module includes a dual physical channel, a dual RF power amplifier, four symmetrical RF switching devices, a power supply current sampling unit, an output power sampling unit, and a temperature sensor; wherein the four symmetrical RF switching devices are located between the dual physical channel and the dual RF power amplifier, and the four symmetrical RF switching devices enable at least two communication modes between the dual physical channel and the dual RF power amplifier;

[0010] The power supply current sampling unit is used to obtain power supply power consumption current data of the radio frequency power amplifier and transmit the power supply power consumption current data to the central processing unit module;

[0011] The output power sampling unit is used to obtain the radio frequency output power of the radio frequency power amplifier and transmit the radio frequency output power to the central processing unit module;

[0012] The temperature sensor is used to obtain temperature data of a printed circuit board near the radio frequency power amplifier and transmit the temperature data to the central processing unit module.

[0013] In a second aspect, some embodiments of the present application further provide a method for adjusting a twin heat dissipation system of an RF power amplifier, wherein the method is applied to a twin heat dissipation adjustment system of an RF power amplifier, and the method includes:

[0014] Determining default values of the twin radio frequency power amplifier in a normal operating state; the default values include a preset temperature threshold, a first temperature threshold, and a second temperature threshold;

[0015] Obtaining a first temperature value of a temperature sensor of the twin radio frequency power amplifier in a multi-input and output communication mode, and comparing the first temperature value with a preset temperature threshold;

[0016] If the first temperature value exceeds the preset temperature threshold range, shutting down the physical channel and the twin RF power amplifier;

[0017] Continuously detecting a first temperature value, and when the first temperature value is less than a first temperature threshold, restarting the twin RF power amplifier to a single input and output communication mode;

[0018] Obtain a second temperature value of a temperature sensor of the twin RF power amplifier in a single-input-output communication mode. If the second temperature value is less than a second temperature threshold, restart the twin RF power amplifier to a multi-input-output communication mode.

[0019] Compared to related technologies, the solution provided in the embodiments of this application utilizes a twin RF power amplifier design that adjusts the operating mode of the twin RF power amplifiers by collecting the RF power amplifier's operating current and the operating environment's printed circuit board temperature parameters. Through the symmetrical layout design of the dual RF power amplifier's printed circuit boards and the dual, through-hole design of the heat sink components, an automatic adjustment mode for efficient heat dissipation of the RF power amplifiers is achieved within the device's structural dimensions. This improves the product's heat dissipation efficiency specifically for the core heat-generating component, the RF power amplifier, ensuring long-term stable and reliable operation of wireless communication equipment in high-temperature environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] One or more embodiments are exemplarily illustrated by the images in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0021] Figure 1 This is an exemplary structural diagram of a twin heat dissipation adjustment system for a radio frequency power amplifier provided according to some embodiments of the present application;

[0022] Figure 2 A schematic diagram of the logic design principle structure of a twin RF power amplifier provided according to some embodiments of the present application;

[0023] Figure 3 This is a left view of a printed circuit board layout of a twin RF power amplifier module provided according to some embodiments of the present application;

[0024] Figure 4 A top view of a printed circuit board layout of a twin RF power amplifier module provided according to some embodiments of the present application;

[0025] Figure 5 A front view of a printed circuit board layout of a twin RF power amplifier module provided according to some embodiments of the present application;

[0026] Figure 6 This is an exemplary flow chart of a method for adjusting twin heat dissipation of a radio frequency power amplifier according to some embodiments of the present application;

[0027] Figure 7 A schematic diagram of a control logic flow chart for operating mode conversion of a twin RF power amplifier module according to some embodiments of the present application;

[0028] Figure 8 This is a schematic diagram of an exemplary structure of an electronic device provided according to some embodiments of the present application. DETAILED DESCRIPTION

[0029] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0030] First embodiment

[0031] The first embodiment of the present application relates to a twin heat dissipation adjustment system for a radio frequency power amplifier, such as Figure 1 As shown, the system includes: a central processing unit module 110 and a twin RF power amplifier module 120; wherein,

[0032] The twin RF power amplifier module includes a dual physical channel, a dual RF power amplifier, four symmetrical RF switching devices, a power supply current sampling unit, an output power sampling unit, and a temperature sensor; wherein the four symmetrical RF switching devices are located between the dual physical channel and the dual RF power amplifier, and the four symmetrical RF switching devices enable at least two communication modes between the dual physical channel and the dual RF power amplifier;

[0033] The power supply current sampling unit is used to obtain power supply power consumption current data of the radio frequency power amplifier and transmit the power supply power consumption current data to the central processing unit module;

[0034] The output power sampling unit is used to obtain the radio frequency output power of the radio frequency power amplifier and transmit the radio frequency output power to the central processing unit module;

[0035] The temperature sensor is used to obtain temperature data of a printed circuit board near the radio frequency power amplifier and transmit the temperature data to the central processing unit module.

[0036] Among them, see Figure 2 , the RF power amplifier (PA) part in the RF communication link of the wireless communication device adopts the twin PA design within the dotted box, forming a group of twin RF power amplifier modules. The hardware principle of this module adopts dual physical channels RF CH1, RF CH2 and corresponding dual RF power amplifiers, and four symmetrical RF switch devices are used between PA and RF channel DAC devices. The four symmetrical RF switch devices enable at least two communication modes to exist between the dual physical channels and the dual RF power amplifiers, including a multi-input and output communication mode and a single-input and output communication mode; the single-input and output communication mode includes four communication modes. As Figure 2As shown, the four symmetrical RF switch devices in the embodiment of the present invention enable five communication modes between the dual physical channels and the dual RF power amplifiers, which are respectively represented as:

[0037] MIMO mode: CH1→PA-A→antenna A, CH2→PA-B→antenna B;

[0038] SISO-1 mode: CH1 → PA-A → Antenna A, CH2 and PA-B are turned off;

[0039] SISO-2 mode: CH2 → PA-B → Antenna B, CH1 and PA-A are turned off;

[0040] SISO-3 mode: CH1 → PA-B → Antenna B, CH2 and PA-A are turned off;

[0041] SISO-4 mode: CH2 → PA-A → Antenna A, CH1 and PA-B are turned off.

[0042] The MIMO mode represents a multiple-input-output mode, and the SISO-1 mode, SISO-2 mode, SISO-3 mode, and SISO-4 mode are four communication modes included in the single-input-output communication mode.

[0043] Among them, the twin RF power amplifier module (hereinafter referred to as the twin PA module) includes an output power sampling unit, which provides the collected RF output power to the central processing unit of the device, which can not only realize RF power self-calibration, but also provide deviation fluctuation data of the RF output power of the PA during actual operation as the ambient temperature changes.

[0044] The twin RF power amplifier module also includes a power supply current sampling unit, which provides the collected power supply power consumption current data to the central processing unit of the device, and provides deviation fluctuation data of the power supply power consumption current of the PA during actual operation as the ambient temperature changes.

[0045] Optionally, the collected power consumption current data and RF output power are provided to the central processing control unit through the I2C communication interface, and the collected power consumption current data and RF output power statistics are stored in the data storage unit included in the twin PA module.

[0046] The twin RF power amplifier module also includes a temperature sensor, located near the dual RF power amplifiers. This sensor collects temperature parameters of the nearby printed circuit board (PCB) during PA operation. Based on these temperature parameters, the twin PA module automatically switches and adjusts its operating mode to accommodate complex field application scenarios, ensuring safe and reliable operation in complex temperature-stable environments.

[0047] Optionally, the system may use at least two pairs of twin RF power amplifier modules to construct a RF power amplifier twin heat dissipation regulation system.

[0048] in, Figure 2 The design in this example shows a pair of twin PA modules. Actual applications can use multiple pairs of twin PA modules based on specifications, such as two pairs of twin PA modules for a 4x4 MIMO design, three pairs of twin PA modules for a 6x6 MIMO design, or four pairs of twin PA modules for an 8x8 MIMO design. This application does not impose a specific limit on the number of twin PA modules; you can design your own based on your actual needs.

[0049] Optionally, the dual RF power amplifiers are located on both sides of the printed circuit board and are symmetrically distributed on the top and bottom layers of the printed circuit board; wherein, the heat dissipation and thermal conductivity area of the top RF power amplifier is the bare copper heat dissipation and thermal conductivity area of the bottom RF power amplifier, and the heat dissipation and thermal conductivity area of the bottom RF power amplifier is the bare copper heat dissipation and thermal conductivity area of the top printed circuit board.

[0050] Among them, see Figure 3 The dual RF power amplifiers are not placed on the same surface, but are symmetrically arranged on the top and bottom layers of the PCB. The heat dissipation and heat conduction areas of the PA devices are the bare copper on the back of the PCB facing the front of each device. Figure 4 as well as Figure 5 That is, the heat dissipation and heat conduction area of the PA device on the top layer is the bare copper heat dissipation and heat conduction area of the PCB on the bottom layer opposite it, and the heat dissipation and heat conduction area of the PA device on the bottom layer is the bare copper heat dissipation and heat conduction area of the PCB on the top layer opposite it.

[0051] Optionally, the printed circuit board is hollowed out in the middle, and the heat dissipation and heat conduction areas of the dual RF power amplifiers are expanded to twice by the printed circuit board.

[0052] The PCB of the twin PA module features a hollowed-out center. This allows the corresponding heat sinks of the twin symmetrical RF power amplifiers to come into close contact through the hollowed-out center, effectively forming a single, integrated heat sink. When one PA is operating, the heat dissipation area of that PA is doubled. The PCB schematics in this application use a serrated heat sink. This application does not impose specific restrictions on the PCB's heat dissipation shape; other types of heat sinks may be designed based on actual product specifications.

[0053] According to the temperature rise coefficient and the effective area S (square centimeters cm 2 ) square root is inversely proportional. If the wireless communication device switches the twin PA module from dual PA working in MIMO mode to single PA working in SISO mode, the current twin PA module PCB and heat dissipation layout design will double the effective area S of the heat sink when the single PA device works in SISO mode. At this time, the temperature rise coefficient of the PA device working in SISO mode at the current ambient temperature Ta is Among them, k s is the temperature rise coefficient in SISO mode, k m is the temperature rise coefficient in MIMO mode.

[0054] When downgrading from MIMO mode to SISO mode, the PA device's heat sink area doubles, improving heat dissipation. The ambient temperature near the PA gradually decreases, and the temperature parameter T read by the temperature sensor gradually approaches the normal range. This prevents the PA from exceeding the junction temperature under extreme operating conditions and causing damage. Automatically switching the PA's operating mode ensures communication reliability, ensuring safe and reliable operation. Automatic switching of operating modes, automatic adjustment of the device's heat dissipation coefficient, and automatic restoration of communication connections all contribute to safe and reliable operation.

[0055] It is not difficult to find that compared with related technologies, the solution provided in the embodiment of this application adopts a twin dual PA design approach, which adjusts the operating mode of the twin PA by collecting the PA's operating current and the working environment PCB temperature parameters. Through the symmetrical layout design of the dual PA PCB and the dual through-design of the heat dissipation mechanism components, an automatic adjustment mode for efficient heat dissipation of the PA device is achieved within the limited scope of the device structure size, thereby improving the product's heat dissipation efficiency specifically for the core heat-generating component PA, ensuring the long-term stable and reliable operation of wireless communication equipment in high-temperature working environments.

[0056] Second embodiment

[0057] The second embodiment of the present application relates to a method for adjusting the twin heat dissipation of a radio frequency power amplifier. The method for adjusting the twin heat dissipation of a radio frequency power amplifier is applied to a radio frequency power amplifier twin heat dissipation adjustment system. The embodiment of the present invention can be combined with each optional solution in one or more of the above embodiments. Figure 6 As shown, the RF power amplifier twin heat dissipation adjustment method provided in the embodiment of the present invention may include the following steps:

[0058] S610: Determine a default value of the twin radio frequency power amplifier in normal operation.

[0059] The default values of the twin RF power amplifier in normal operation are obtained, including but not limited to a preset temperature threshold, a first temperature threshold, a second temperature threshold, a RF output power threshold, and a power consumption current threshold.

[0060] Among them, the preset temperature threshold refers to the temperature warning value of the printed circuit board obtained by the temperature sensor when the twin RF power amplifier is in normal operation; the first temperature threshold refers to the temperature warning value when the twin RF power amplifier is converted to single input and output mode; the second temperature threshold refers to the temperature warning value when the twin RF power amplifier is converted to multi-input and output mode.

[0061] Optionally, the twin PA module device operating mode switching logic and RF switch control truth value configuration information are shown in Table 1 below. The parameter description information in the truth table is as follows:

[0062] 1. The temperature sensor placed near the PA on the PCB reads the parameters T, T mmax Indicates the temperature warning value in MIMO mode; T smax Indicates the temperature warning value in SISO mode.

[0063] 2. The difference between the PA's RF output power in the actual application environment and the normal temperature calibration output power ΔP r Parameter: The default setting value P when the system is at room temperature and the dual PA is working r0 ; Dynamic detection value P of RF output power during operation of PA device A ra ; Dynamic detection value P of RF output power during operation of PA device B rb .

[0064] Among them, when the dual PA is working, the detection and calculation of each P r Parameters, take N test value data, calculate |P r0 -P ra |with|P r0 -P rb |, take the average:

[0065] PA-A RF output power ΔPr The parameter is expressed as: ΔP ra =(|P r0 -P ra1 |+|P r0 -P ra2 |+…+|P r0 -P raN |) / N;

[0066] PA-B RF output power ΔP r The parameter is expressed as: ΔP rb =(|Pr0-P rb1 |+|P r0 -P rb2 |+…+|P r0 -P rbN |) / N.

[0067] 3. The difference between the PA power consumption current and the power consumption current at room temperature in the actual application environment ΔI parameter: the default setting value I0 at room temperature when the system is working normally at full load; the dynamic detection value of the power supply current of PA device A during operation I a ; Dynamic detection value of power supply current I during operation of PA device B b .

[0068] When the dual PAs are working, the power supply current I parameter of each PA is detected and calculated. The N detection value data are taken to calculate |I0-I a |with|I0-I b |, take the average:

[0069] The ΔI parameter of the PA-A power consumption current is expressed as: ΔI a =(|I0-I a1 |+|I0-I a2 |+…+|I0-I aN |) / N;

[0070] The ΔI parameter of the PA-B power consumption current is expressed as: ΔI b =(|I0-I b1 |+|I0-I b2 |+…+|I0-I bN |) / N.

[0071] Table 1: A pair of twin PA module device operating mode switching logic and RF switch control truth table

[0072]

[0073]

[0074] Among them, see Figure 7, while ensuring that the maximum junction temperature T of the PA device does not exceed jmax In the case of PA thermal parameter specifications, the maximum ambient temperature limit T near the device after the PA device is heated is calculated. pamax , the thermal resistance parameter R between the junction of the PA device and the working environment temperature ja , the absolute maximum operating power consumption limit P recommended by PA device manufacturers max To ensure the normal operation of the PA device, the actual power consumption of the PA device P0≤P max , so the maximum ambient temperature near the PA device after it heats up is T pamax Should meet the following requirements: T pamax +R ja *P max ≤T jmax →T pamax ≤T jmax -R ja *P max , take T pamax =T jmax -R ja *P max The temperature sensor in the device system is placed near the PA device on the PCB layout, so the temperature sensor measures the PCB temperature near the PA when it is working, which can be approximated as the ambient temperature near the device after the PA device in the wireless communication device system is heated. To ensure the safe and reliable operation of the twin PA devices, a certain margin is reserved in the MIMO mode to set the warning temperature parameter limit of the temperature sensor to T mmax This limit parameter can be set by performing thermal simulation according to the actual wireless communication device system design specification requirements. For example, in this embodiment, a 15% margin is set as T mmax Parameter, that is, T mmax =0.85*T pamax , when the temperature parameter reaches T mmax The twin PA modules are degraded to SISO mode. In this embodiment, a 10% margin is set to set the next level warning temperature parameter limit of the temperature sense to T. smax =0.9*T pamax When the temperature parameter reaches T smax In order to ensure that the PA device does not exceed the device temperature, thereby avoiding the problem of physical damage caused by overheating of the device, the communication channel and PA will be temporarily shut down and sleep, and the RF communication function will be gradually restarted after the temperature drops to the normal range. This embodiment of the solution restarts the RF function to the temperature parameter limit T of the SISO mode rs =0.8*T pamax , first restart to the SISO mode before sleep; if the temperature continues to drop to the temperature parameter limit T of the restart RF function MIMO mode after restart rm, then restart the MIMO mode; where T rm =0.7*T pamax .

[0075] Optionally, the setting of the above-mentioned temperature threshold in this application is only the data for example in the embodiments of this application, and the specific temperature threshold is not specifically limited in this application.

[0076] S620: Obtain a first temperature value of a temperature sensor of the twin RF power amplifier in a multi-input and output communication mode, and compare the first temperature value with a preset temperature threshold.

[0077] The preset temperature threshold is T smax and T mmax Indicates that it is determined whether the first temperature value is less than T smax and greater than or equal to T mmax , to compare the first temperature value with a preset temperature threshold.

[0078] S630: If the first temperature value exceeds the preset temperature threshold range, shut down the physical channel and the twin RF power amplifier.

[0079] Wherein, when it is determined that the first temperature value exceeds the preset temperature threshold range and is greater than T smax When the device is in sleep mode, the physical channel and the twin RF power amplifier are turned off and the device is in sleep mode.

[0080] S640: Continuously detect a first temperature value, and when the first temperature value is less than a first temperature threshold, restart the twin RF power amplifier to a single input and output communication mode.

[0081] The first temperature value is continuously detected, and when the first temperature value is less than a first temperature threshold, the previous single-input-output communication mode is restarted. For example, when the twin RF power amplifier is switched to the multi-input-output mode or the twin RF power amplifier is shut down in the single-input-output mode, if it is detected that the first temperature value is less than the first temperature threshold, the twin RF power amplifier is restarted to the single-input-output communication mode before the mode switch.

[0082] S650. Obtain a second temperature value of a temperature sensor of the twin RF power amplifier in a single-input-output communication mode. If the second temperature value is less than a second temperature threshold, restart the twin RF power amplifier to a multi-input-output communication mode.

[0083] Among them, the first temperature value is continuously detected to obtain the second temperature value of the temperature sensor of the twin RF power amplifier in the single input and output communication mode. If the second temperature value is less than the second temperature threshold, the twin RF power amplifier is restarted to the multi-input and output communication mode, and the device RF function restart warning information is transmitted to the network management.

[0084] Optionally, thermal simulation is used to calculate the RF power amplifier under high temperature environment temperature T a (For example, the temperature rise coefficient when working in MIMO mode under the setting of high temperature 85℃ is K m (℃ / W), then the temperature near the device after the PA device is heated when working in MIMO mode is the temperature parameter T read by the sensor. mpa =T a +K m *P m , where the actual working power consumption of the PA device is P m Only when the following conditions are met: T mpa <T pmax When T mpa ≥T pmax , the CPU control unit of the wireless communication device will trigger the switch from the dual PA to the SISO working mode of the single PA or further degrade to the PA being temporarily shut down in the OFF state.

[0085] According to the temperature rise coefficient and the effective area S (square centimeters cm 2 ) is inversely proportional to the square root. If the device is switched to SISO mode, the effective area S of the heat sink will double when a single RF power amplifier is working. At this time, the PA device working in SISO mode, at this ambient temperature T a Temperature rise coefficient under The ambient temperature near the device after the PA device is heated when working in SISO mode is the temperature parameter read by the sensor. The actual working power consumption of the PA device is P s Under normal circumstances, it is expected that after downgrading from MIMO mode to SISO mode, the heat dissipation effect of the PA device will be improved due to the doubling of the heat sink area. After the PA switches from MIMO to SISO, the ambient temperature near the PA will gradually decrease, and the temperature parameter T read by the temperature sensor will be spa To prevent the PA device from exceeding the junction temperature and causing irreversible physical damage to the device, the following conditions must be met: T mmax ≤T spa <T smax When T spa ≥Tsmax , the CPU control unit of the wireless communication device will immediately trigger the switch to the SISO working mode of the single PA, further degrading it to temporarily shutting down all PAs in the OFF state to protect the PA from irreversible physical damage caused by exceeding the device junction temperature. When the ambient temperature is within the normal range, the RF communication function will be re-enabled.

[0086] In an optional but non-limiting implementation of the present application, obtaining a first temperature value of a temperature sensor of the twin RF power amplifier in a multi-input and output communication mode, and comparing the first temperature value with a preset temperature threshold, further includes:

[0087] If the first temperature value is within the preset temperature threshold range, obtaining the radio frequency output power fluctuation parameter and the power consumption current fluctuation parameter stored in the data storage unit;

[0088] A corresponding single-input-output communication mode is determined according to the radio frequency output power fluctuation parameter and the power supply power consumption current fluctuation parameter.

[0089] Among them, this application solves the emergencies that arise when wireless communication equipment is used in complex actual field environments, such as when the equipment is installed in special application scenarios; for example, in a closed and narrow space with high temperature and poor ventilation, or in a relatively closed environment such as an elevator shaft or underground mine. In a relatively closed and narrow high-temperature environment, the equipment needs to be able to automatically adjust its working mode to cope with the problem of continuous heating of the equipment.

[0090] In order to achieve safe and reliable operation of wireless communication equipment, this application enables SISO mode in wireless communication equipment. It further uses the PA RF output power fluctuation parameter ΔP collected by the equipment to adjust the self-heating of the core heat dissipation high-power PA device working mode change. r The power consumption current fluctuation parameter ΔI during PA operation is combined with the temperature sensing parameter T. From the twin PA devices and physical channels, the PA device and physical channel with smaller fluctuation will be selected to operate in SISO mode, and the channel and PA device with larger fluctuation will be adjusted to the OFF state. When the temperature sensing parameter T satisfies the following conditions: T mmax ≤T spa <T smax When the wireless communication device is downgraded to the SISO mode with a single PA, it will first switch to the SISO mode with a single PA. At the same time, it will select the following four SISO modes based on the PA RF output power fluctuation parameter ΔPr and the power consumption current fluctuation parameter ΔI when the dual PAs are working in the MIMO mode:

[0091] SISO-1 mode: ΔP ra ≤ΔP rb &ΔI a≤ΔI b , CH1→PA-A→ANT1, CH2 is OFF

[0092] state;

[0093] SISO-2 mode: ΔP ra >ΔP rb &ΔI a >ΔI b , CH2→PA-B→ANT2, CH1 is in

[0094] OFF state;

[0095] SISO-3 mode: ΔP ra ≤ΔP rb &ΔI a >ΔI b , CH1→PA-B→ANT2, CH2 is OFF

[0096] state;

[0097] SISO-4 mode: ΔP ra >ΔP rb &ΔI a ≤ΔI b , CH2→PA-A→ANT1, CH1 is OFF

[0098] state.

[0099] In an optional but non-limiting implementation of the present application, the method further includes:

[0100] Obtain the second temperature value of the temperature sensor of the twin RF power amplifier in the single input and output communication mode. If the second temperature value continues to rise and is greater than the preset temperature threshold, shut down the physical channel and the twin RF power amplifier.

[0101] Among them, if the device adjusts the twin PA modules to work in SISO mode, the ambient temperature continues to rise. When the temperature sensing parameter reaches T spa ≥T smax When the temperature drops to the normal range, the CPU control unit of the wireless communication device will immediately trigger the switch to shut down the physical channel communication and further downgrade the PA to temporarily shut down in the OFF state to protect the PA from irreversible physical damage caused by exceeding the device temperature. After the ambient temperature is within the normal range, the RF communication function is re-enabled. To ensure that the wireless communication device can work stably and reliably, the RF communication function is gradually restarted when the temperature drops to the normal range. The temperature sensing parameter satisfies a certain margin range to restart the RF communication function. The embodiment of the present application restarts the RF function to the temperature sensing parameter limit T of the SISO mode. rs =0.8*T pamax, first restart to the SISO mode before sleep, if the temperature continues to drop to the temperature parameter limit Trm of the restart RF function MIMO mode after restart (this solution embodiment T rm =0.7*T pamax ), then restart the MIMO mode. Restart the temperature parameter limit T of the RF function rs and T rm Thermal simulation is performed according to the equipment design specifications to ensure that the equipment can restore communication functions in a timely and reliable manner. If the equipment experiences RF communication restart, the wireless communication device reports an early warning information, providing early warning information to the network communication management to facilitate subsequent network maintenance.

[0102] In an optional but non-limiting implementation of the present application, the method further includes:

[0103] When the communication mode of the twin RF power amplifier changes, the RF communication function restart warning information of the twin RF power amplifier is sent to the network management to maintain the twin RF power amplifier.

[0104] Among them, if the device has a radio frequency communication function sleep state and records multiple radio frequency communication function restart events, and frequently reports radio frequency communication function restart warning information to the network management center, the remote network management center can consider maintenance and management of the wireless communication equipment in this application scenario and can remotely terminate the operation of the equipment.

[0105] It is not difficult to find that compared with related technologies, the solution provided in the embodiments of the present application can automatically adapt to the improvement of the heat dissipation efficiency of the PA operating state of wireless communication equipment. It also pre-fabricates solutions in different application scenarios based on the temperature parameters, RF power calibration parameters, power amplifier power supply electrical characteristic parameters, and wireless communication status in the actual application environment, optimizes and automatically adjusts the input and output parameters of the core power amplifier (PA) device, and achieves a stable improvement in the heat dissipation efficiency of the wireless power amplifier (PA) device to cope with different working conditions, thereby achieving a certain degree of intelligent decision-making to maintain the long-term stable and reliable operation of wireless communication equipment. The solution improves the safe and reliable operation of wireless communication in the complex temperature-varying environments of actual application scenarios. At the same time, it also designs and implements the automatic adjustment of the heat dissipation mode of the core power module such as the PA device of wireless communication equipment in complex temperature-varying environments, improving the stable, safe and reliable operation of the PA device in complex temperature-varying environments, thereby also improving the reliability of the wireless communication device connection and the user experience.

[0106] The steps of the various methods above are divided only for the purpose of clear description. During implementation, they can be combined into one step or some steps can be split and decomposed into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent. Adding insignificant modifications or introducing insignificant designs to the algorithm or process without changing the core design of the algorithm and process are all within the scope of protection of this patent.

[0107] Third embodiment

[0108] In addition, some embodiments of the present application further provide an electronic device. The electronic device may be various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, etc. The electronic device may also be various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices, and other similar computing devices.

[0109] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, enable the processor to perform the steps of the method provided in any one or more of the above embodiments. Figure 8 An exemplary structural diagram of the electronic device is disclosed. Figure 8 As shown, the electronic device includes: one or more processors 1101, a memory 1102, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common motherboard or installed in other ways as needed. The processor can process instructions executed within the electronic device, including instructions stored in or on the memory to display graphical information of a GUI (Graphical User Interface) on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, each device providing some of the necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and / or required herein.

[0110] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103 and the output device 1104 may be connected via a bus or other means. Figure 8 The bus connection is taken as an example.

[0111] The input device 1103 can receive input digital or character information and generate key signal input related to user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a trackpad, a touch pad, an indicator stick, one or more mouse buttons, a trackball, a joystick, and other input devices. The output device 1104 may include a display device, an auxiliary lighting device (e.g., an LED), and a tactile feedback device (e.g., a vibration motor). The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display, and a plasma display. In some embodiments, the display device may be a touch screen.

[0112] To provide interaction with a user, the electronic device may be a computer. The computer may include: a display device (e.g., a cathode ray tube (CRT) or an LCD monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0113] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium. When executed by a processor, the computer program / instruction implements the steps of the method provided in any one or more of the above embodiments. The computer-readable medium may be included in the electronic device described in the above embodiments, or it may exist independently and not be incorporated into the device. The computer-readable medium carries one or more computer-readable instructions.

[0114] The memory 1102 can be used as a non-transitory computer-readable storage medium to store non-transitory software programs, non-transitory computer executable programs, and modules. The processor 1101 executes the non-transitory software programs, instructions, and modules stored in the memory 1102 to execute various functional applications and data processing of the server, thereby implementing the program instructions / modules corresponding to the method provided in any one or more of the above embodiments of the present application.

[0115] The memory 1102 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and applications required for at least one function; the data storage area may store data created based on the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1102 may optionally include a memory remotely located relative to the processor 1101, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0116] It should be noted that the computer-readable medium described in this application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or component, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0117] Computer-readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change random-access memory (PRAM), static random-access memory (SRAM), dynamic random-access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disc (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0118] The computer program code for performing the operations of the present application can be written in one or more programming languages or a combination thereof, including object-oriented programming languages such as Java, Smalltalk, C++, and conventional procedural programming languages such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (e.g., using an Internet service provider to connect via the Internet).

[0119] In the above-described embodiment, can realize wholly or in part by software, hardware, firmware or its arbitrary combination.For example, can adopt application-specific integrated circuit (ASIC, Application-Specific Integrated Circuit), general computer or any other similar hardware device to realize.In certain embodiments, the software program of the present application can be carried out to realize above steps or function by processor.Similarly, the software program of the present application (comprising relevant data structure) can be stored in computer readable recording medium, for example, RAM memory, magnetic or optical drive or floppy disk and similar device.In addition, some steps or functions of the present application can adopt hardware to realize, for example, as the circuit that cooperates with processor to perform each step or function.

[0120] The computer program product provided by the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, all or part of the process or function described in the embodiment of the present application is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instruction can be stored in a computer-readable storage medium, or transmitted from a computer-readable storage medium to another computer-readable storage medium. For example, the computer instruction can be transmitted from a website, a computer, a server or a data center by wired (such as coaxial cable, optical fiber, digital subscriber line (DSL, Digital Subscriber Line)) or wireless (such as infrared, wireless, microwave, etc.) mode to another website, a computer, a server or a data center. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server, a data center that includes one or more available media integrations. The available medium can be a magnetic medium, (such as a floppy disk, a hard disk, a magnetic tape), an optical medium (such as a DVD), or a semiconductor medium (such as a solid-state drive, SSD, solid state disk) etc.

[0121] The flowcharts or block diagrams in the accompanying drawings illustrate the possible architectures, functions and operations of the devices, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, program segment or part of code, and the module, program segment or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, as well as the combination of boxes in the block diagram and / or flowchart, can be implemented with a dedicated hardware-specific system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0122] The scope of this application is defined by the appended claims rather than the foregoing description and is therefore intended to encompass within this application all changes that come within the meaning and range of equivalents of the claims. Any reference signs in the claims should not be construed as limiting the claims to which they relate. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in a device claim may also be implemented by one unit or device through software or hardware. Words such as "first" and "second" are only used to distinguish the description and do not indicate any particular order, nor should they be understood as indicating or implying relative importance.

[0123] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art may easily propose variations or substitutions within the technical scope disclosed in the present application, and such variations or substitutions shall be encompassed within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the scope of protection of the claims, and the above embodiments shall be regarded as exemplary and non-limiting.

Claims

1. A radio frequency power amplifier twin heat dissipation adjustment system, characterized in that: The system includes: a central processing unit module and a twin radio frequency power amplifier module; wherein, The twin RF power amplifier module includes a dual physical channel, a dual RF power amplifier, four symmetrical RF switching devices, a power supply current sampling unit, an output power sampling unit, and a temperature sensor; wherein the four symmetrical RF switching devices are located between the dual physical channel and the dual RF power amplifier, and the four symmetrical RF switching devices enable at least two communication modes between the dual physical channel and the dual RF power amplifier; The power supply current sampling unit is used to obtain power supply power consumption current data of the radio frequency power amplifier and transmit the power supply power consumption current data to the central processing unit module; The output power sampling unit is used to obtain the radio frequency output power of the radio frequency power amplifier and transmit the radio frequency output power to the central processing unit module; The temperature sensor is used to obtain temperature data of a printed circuit board near the radio frequency power amplifier and transmit the temperature data to the central processing unit module.

2. The system according to claim 1, wherein: The dual RF power amplifiers are located on both sides of the printed circuit board and are symmetrically distributed on the top and bottom layers of the printed circuit board; wherein the heat dissipation and thermal conductivity area of the top RF power amplifier is the bare copper heat dissipation and thermal conductivity area of the bottom RF power amplifier, and the heat dissipation and thermal conductivity area of the bottom RF power amplifier is the bare copper heat dissipation and thermal conductivity area of the top PCB.

3. The system according to claim 2, characterized in that The printed circuit board is hollowed out in the middle, and the heat dissipation and heat conduction areas of the dual radio frequency power amplifiers are doubled through the printed circuit board.

4. The system according to claim 1, wherein: The at least two communication modes between the dual physical channels and the dual RF power amplifiers include a multi-input-output communication mode and a single-input-output communication mode; the single-input-output communication mode includes four communication modes.

5. The system according to claim 1, wherein: The system further includes a data storage unit; wherein, The data storage unit is used to store the radio frequency output power collected by the output power sampling unit and the power supply power consumption current data collected by the power supply current sampling unit.

6. The system according to claim 1, wherein: The system further comprises: At least two pairs of twin RF power amplifier modules are used to build a RF power amplifier twin heat dissipation adjustment system.

7. A method for adjusting the heat dissipation of a radio frequency power amplifier twin, characterized in that: The RF power amplifier twin heat dissipation adjustment method is applied to a RF power amplifier twin heat dissipation adjustment system, and the method includes: Determining default values of the twin radio frequency power amplifier in a normal operating state; the default values include a preset temperature threshold, a first temperature threshold, and a second temperature threshold; Obtaining a first temperature value of a temperature sensor of the twin radio frequency power amplifier in a multi-input and output communication mode, and comparing the first temperature value with a preset temperature threshold; If the first temperature value exceeds the preset temperature threshold range, shutting down the physical channel and the twin RF power amplifier; Continuously detecting a first temperature value, and when the first temperature value is less than a first temperature threshold, restarting the twin RF power amplifier to a single input and output communication mode; Obtain a second temperature value of a temperature sensor of the twin RF power amplifier in a single-input-output communication mode. If the second temperature value is less than a second temperature threshold, restart the twin RF power amplifier to a multi-input-output communication mode.

8. The method according to claim 7, characterized in that The obtaining of a first temperature value of a temperature sensor of the twin RF power amplifier in a multi-input and output communication mode and comparing the first temperature value with a preset temperature threshold value further includes: If the first temperature value is within the preset temperature threshold range, obtaining the radio frequency output power fluctuation parameter and the power consumption current fluctuation parameter stored in the data storage unit; A corresponding single-input-output communication mode is determined according to the radio frequency output power fluctuation parameter and the power supply power consumption current fluctuation parameter.

9. The method according to claim 7, characterized in that The method further comprises: Obtain the second temperature value of the temperature sensor of the twin RF power amplifier in the single input and output communication mode. If the second temperature value continues to rise and is greater than the preset temperature threshold, shut down the physical channel and the twin RF power amplifier.

10. The method according to claim 7, characterized in that The method further comprises: When the communication mode of the twin RF power amplifier changes, the RF communication function restart warning information of the twin RF power amplifier is sent to the network management to maintain the twin RF power amplifier.

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