Middle frame, electronic equipment and manufacturing method of middle frame

Abstract

The invention discloses a middle frame, electronic equipment and a manufacturing method of the middle frame, the middle frame comprises a middle plate and a frame, the frame is connected to the periphery of the middle plate, the middle frame comprises a battery jar, the middle plate comprises a first surface and a second surface, the first surface and the second surface are arranged in a back-to-back mode in the thickness direction of the middle plate, and the battery jar is arranged in the middle plate. The battery jar is arranged on the first surface; the battery groove comprises a groove bottom wall and a groove side wall arranged on the periphery of the groove bottom wall, a functional groove is concavely formed in the groove bottom wall, the functional groove is concavely formed in the groove bottom wall of the battery groove in the thickness direction of the middle plate, and a glue groove is concavely formed in the groove bottom wall of the functional groove; the glue groove is recessed towards the groove bottom wall of the functional groove along the thickness direction of the middle plate; the joint of the groove side wall of the battery groove and the groove bottom wall of the battery groove is inclined far away from the groove bottom wall of the battery groove and forms a slowly-changing included angle with the groove bottom wall of the battery groove, and the slowly-changing included angle is an acute angle.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and in particular to a middle frame, an electronic device, and a method for manufacturing the middle frame. Background Art

[0002] The increasing demand for portability and reliability in electronic devices like mobile phones and tablets is driving the trend toward thinner and lighter devices. Therefore, the midframes of mobile phones and other electronic devices, such as the back cover and mid-frame, as the primary load-bearing and protective components, not only need sufficient structural strength but also need to be thinner and lighter, thereby reducing the thickness and weight of the entire device. Therefore, how to reduce the thickness of electronic devices while maintaining the structural strength requirements of the midframe or back cover is a pressing issue in the field of this type of product technology. Summary of the Invention

[0003] The present application provides a middle frame, an electronic device, and a method for manufacturing the middle frame, so that the middle frame can reduce the thickness of the electronic device and ensure that the middle frame has sufficient rigidity.

[0004] The present application provides a middle frame, comprising a middle plate and a frame, wherein the frame is connected to the periphery of the middle plate, and the middle frame comprises a battery slot.

[0005] The middle plate includes a first surface and a second surface, the first surface and the second surface are arranged in opposite directions along the thickness direction of the middle plate, and the battery slot is arranged on the first surface;

[0006] The battery slot includes a slot bottom wall and slot side walls arranged at the periphery of the slot bottom wall. The slot bottom wall is recessed with a functional slot, and the functional slot is recessed into the slot bottom wall of the battery slot along the thickness direction of the middle plate.

[0007] A glue groove is recessed on the bottom wall of the functional groove; the glue groove is recessed into the bottom wall of the functional groove along the thickness direction of the middle plate;

[0008] The side wall of the battery slot is inclined away from the bottom wall of the battery slot and forms a gradually changing angle with the bottom wall of the battery slot, wherein the gradually changing angle is an acute angle.

[0009] In one embodiment, the gradually varying angle has an angle range of greater than or equal to 5 degrees and less than or equal to 15 degrees.

[0010] In one embodiment, the thickness of the bottom wall of the battery slot is 0.38 mm, and the thickness of the bottom wall of the glue slot is 0.2 mm.

[0011] The thickness of the bottom wall of the battery tank and the thickness of the bottom wall of the glue tank both refer to the distance from the surface of each bottom wall to the second surface.

[0012] In the embodiment of the present application, the first bottom wall 32 of the battery compartment 30 has a thickness of 0.38 mm, and the third bottom wall 361 of the adhesive compartment 36 has a thickness of 0.2 mm. The thickness of the first bottom wall 32 of the battery compartment 30 provides sufficient strength to withstand the bending of the entire electronic device and support the impact of the battery on the battery compartment, thereby ensuring the overall strength of the midframe and reducing the thickness of the electronic device. In the prior art, the bottom wall thickness of the battery compartment is at least 0.5 mm, while the bottom wall thickness of the adhesive compartment is 0.38 mm, which undoubtedly increases the thickness of the electronic device. Furthermore, preventing the electronic device from being too thick limits the battery volume, thereby reducing its capacity. However, the present application reduces the thickness of the bottom wall of the battery compartment 30 while maintaining the thickness of the electronic device. This allows for the accommodation of a larger battery and improves the battery life of the electronic device. In other words, the bottom walls of the adhesive compartment 36 and the battery compartment 30 of the present application are relatively thin. The resulting space saved can be used to achieve a thinner electronic device or increase the battery capacity.

[0013] In one embodiment, the thickness of the bottom wall of the functional groove is 0.23 mm to 0.25 mm.

[0014] In one embodiment, the middle plate and part of the frame are made of metal and formed through a die-casting process. The bottom wall of the battery slot is formed through multiple weak alkaline etching processes. This process results in a bottom wall thickness of 0.32mm for the battery slot of the middle frame, and 0.2mm for the adhesive slot. This thinning of the bottom walls of the battery slot and the adhesive slot ensures the overall strength of the middle plate, thus achieving a thinner middle plate.

[0015] In one embodiment, the surface of the bottom wall of the battery slot, the surface of the bottom wall of the functional slot, and the surface of the bottom wall of the glue slot are all formed with laser engraving patterns.

[0016] The embodiment of the present application provides a middle frame, comprising a middle plate and a frame, wherein the frame is connected to the periphery of the middle plate, and the middle frame comprises a battery slot.

[0017] The middle plate includes a first surface and a second surface, the first surface and the second surface are arranged in opposite directions along the thickness direction of the middle plate, and the battery slot is recessed in the first surface;

[0018] The battery slot includes a slot bottom wall and slot side walls arranged at the periphery of the slot bottom wall. The slot bottom wall is recessed with a functional slot, and the functional slot is recessed into the slot bottom wall of the battery slot along the thickness direction of the middle plate.

[0019] A glue groove is recessed on the bottom wall of the functional groove; the glue groove is recessed into the bottom wall of the functional groove along the thickness direction of the middle plate;

[0020] The groove sidewall of the functional groove is inclined away from the groove bottom wall of the functional groove and forms a gradually changing angle with the groove bottom wall of the functional groove, and the gradually changing angle is an acute angle.

[0021] In one embodiment, the gradually varying angle has an angle range of greater than or equal to 5 degrees and less than or equal to 15 degrees.

[0022] In one embodiment, the thickness of the bottom wall of the battery slot is 0.38 mm, and the thickness of the bottom wall of the glue slot is 0.2 mm.

[0023] The thickness of the bottom wall of the battery tank and the thickness of the bottom wall of the glue tank both refer to the distance from the surface of each bottom wall to the second surface.

[0024] In one embodiment, the thickness of the bottom wall of the functional groove is 0.23 mm to 0.25 mm.

[0025] The present application provides an electronic device, which includes the middle frame and a battery. The functional slot accommodates the cable of the electronic device, and a colloid is provided in the adhesive slot to fix the cable. The bottom wall of the battery slot is provided with an adhesive layer, and the adhesive layer avoids the functional slot. The battery is accommodated in the battery slot and the cable is enclosed in the functional slot, and the adhesive layer bonds the battery.

[0026] This application provides a method for manufacturing a middle frame.

[0027] Providing a middle frame substrate, the middle frame substrate comprising a middle plate substrate and a frame substrate, the frame substrate being connected to a periphery of the middle frame substrate, the middle plate substrate comprising a first surface and a second surface, a groove being formed on the first surface;

[0028] The bottom wall of the groove is provided with a first groove, and the first groove is recessed into the bottom wall of the groove along the thickness direction of the middle plate substrate.

[0029] A second groove is recessed on the bottom wall of the first groove; the second groove is recessed into the bottom wall of the first groove along the thickness direction of the middle plate;

[0030] forming a protective film on the outer surface of the middle frame substrate, exposing the bottom wall of the groove, the first groove, and the second groove;

[0031] The bottom wall of the groove, the first groove and the second groove are corroded multiple times using a weak base; the groove forms a battery groove, the first groove forms a functional groove, and the second groove forms a glue groove;

[0032] The protective film is removed, wherein the side wall of the battery container is inclined away from the bottom wall of the battery container and forms a first gradually changing angle with the bottom wall of the battery container, and the gradually changing angle is an acute angle.

[0033] In one embodiment, the middle frame substrate is formed by die-casting, the bottom wall thickness of the groove is 0.5 mm, and the bottom wall thickness of the glue groove is 0.32 mm;

[0034] The steps of multiple etching with weak alkali specifically include: etching the bottom wall of the groove, the first groove and the second groove four times with weak alkali, and each time etching away the bottom wall of the groove, the bottom wall of the first groove and the bottom wall of the second groove is 0.03 mm thick.

[0035] In one embodiment, the step of forming a protective film on the outer surface of the middle frame substrate includes:

[0036] forming a protective film on the outer surface of the middle frame substrate by electrophoretic coating;

[0037] The protective film covering the bottom wall of the groove and the first groove and the second groove is removed by a laser engraving process.

[0038] In one embodiment, the step of etching with a weak base multiple times further includes cleaning the middle frame substrate after each etching.

[0039] In one embodiment, the gradually varying angle has an angle range of greater than or equal to 5 degrees and less than or equal to 15 degrees.

[0040] In one embodiment, after multiple corrosions with weak alkali, laser engraving marks are found on the bottom walls of the battery slot, the functional slot, and the glue slot.

[0041] The present application provides a method for manufacturing a middle frame, comprising providing a middle frame substrate, the middle frame substrate comprising a middle plate substrate and a frame substrate, the frame substrate being connected to a periphery of the middle frame substrate, the middle plate substrate comprising a first surface and a second surface, a battery slot being formed on the first surface; the battery slot comprising a slot bottom wall and slot sidewalls provided at a periphery of the slot bottom wall, the slot bottom wall being recessed with a first groove, wherein the thickness of the slot bottom wall of the battery slot is 0.38 mm;

[0042] A second groove is recessed on the bottom wall of the first groove; the second groove is recessed into the bottom wall of the first groove along the thickness direction of the middle plate;

[0043] forming a protective film on the outer surface of the middle frame substrate, exposing the bottom wall of the first groove and the second groove;

[0044] Using weak alkali to etch the first groove and the bottom wall of the first groove multiple times, so that the first groove becomes a functional groove and the second groove becomes a glue groove;

[0045] The protective film is removed, wherein the groove side wall of the functional groove is inclined away from the groove bottom wall of the glue groove and forms a gradually changing angle with the groove bottom wall of the functional groove, and the gradually changing angle is an acute angle.

[0046] In one embodiment, the middle frame substrate is formed by die-casting, the bottom wall thickness of the first groove is 0.35 mm, and the bottom wall thickness of the basic groove is 0.32 mm.

[0047] The step of etching with a weak base multiple times specifically includes: etching the bottom wall of the first groove and the second groove four times with a weak base;

[0048] The thickness of the bottom wall of the functional groove is 0.23 mm, and the thickness of the bottom wall of the glue groove is 0.2 mm.

[0049] In one embodiment, the gradually varying angle has an angle range of greater than or equal to 5 degrees and less than or equal to 15 degrees.

[0050] In one embodiment, the step of forming a protective film on the outer surface of the middle frame substrate includes:

[0051] forming a protective film on the outer surface of the middle frame substrate by electrophoretic coating;

[0052] The protective films covering the bottom wall of the first groove and the second groove are removed by a laser engraving process.

[0053] In one embodiment, the step of etching with a weak base multiple times further includes cleaning the middle frame substrate after each etching.

[0054] The present invention utilizes any of the above-described methods for manufacturing a middle frame. Through multiple etching steps, the thickness of the bottom wall of the battery slot reaches 0.32 mm, and the thickness of the bottom wall of the adhesive slot reaches 0.2 mm. This achieves thinning of the bottom walls of the battery and adhesive slots while maintaining overall strength, thus thinning the middle plate. The remaining thinning margin can also be used to increase the capacity of the battery slot, and thus, the battery capacity. The manufacturing method of this embodiment does not require mechanical machining, such as CNC machining, ensuring the structural strength of the middle frame. Furthermore, it is not performed through a one-shot die-casting process, thus avoiding the problem of pinholes in the bottom wall of the battery slot due to insufficient metal solution filling in the mold due to the small die-casting dimensions (the bottom wall of the adhesive slot). This also avoids compromising the structural strength of the entire middle frame and improves the impact resistance of the battery slot to the battery. Overall, compared to existing methods, the middle frame of this embodiment achieves both thinness and sufficient strength, offering significant advantages in the industry and meeting the demand for thinner electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0056] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0057] Figure 2 for Figure 1 A schematic structural diagram of the middle frame shown;

[0058] Figure 3 for Figure 2 A schematic cross-sectional view of a first embodiment of the middle frame shown;

[0059] Figure 4 for Figure 2 A schematic cross-sectional view of a second embodiment of the middle frame shown;

[0060] Figure 5 for Figure 3 A method flow chart of a first embodiment of a method for manufacturing a middle frame shown;

[0061] Figure 6 for Figure 5 A schematic structural diagram of a middle frame substrate in one step of a method for manufacturing the middle frame is shown;

[0062] Figure 7 for Figure 5 A schematic structural diagram of a middle frame substrate in another step of the middle frame manufacturing method is shown;

[0063] Figure 8 for Figure 5A schematic structural diagram of a middle frame substrate in another step of the middle frame manufacturing method is shown;

[0064] Figure 9 for Figure 5 A schematic structural diagram of a middle frame substrate in another step of the middle frame manufacturing method is shown;

[0065] Figure 10 for Figure 4 The flowchart of the second embodiment of the method for manufacturing the middle frame is shown.

[0066] The nouns corresponding to the reference numerals are:

[0067] Electronic device 1000, middle frame 100, middle plate 10, first surface 101, second surface 102, frame 20, metal parts 21, plastic parts 22, battery slot 30, first slot side wall 31, first slot bottom wall 32, functional slot 34, second slot bottom wall 341, second slot side wall 342, glue slot 36, third slot bottom wall 361, third slot side wall 362, screen 200, gradually changing angle A, middle frame substrate 1, middle plate substrate 2, frame substrate 3, groove 4, first slot 5, second slot 6, protective film 7. DETAILED DESCRIPTION

[0068] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0069] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 2 for Figure 1 Schematic diagram of a partial structure of an electronic device. This embodiment of the present application provides an electronic device 1000, which includes but is not limited to a cell phone, a notebook computer, a tablet computer, a laptop computer, a personal digital assistant, a television, etc. In this embodiment of the present application, the electronic device 1000 is described using a cell phone as an example.

[0070] For ease of description, the width direction of the electronic device 1000 is defined as the X-axis direction, the length direction of the electronic device 1000 is defined as the Y-axis direction, and the thickness direction of the electronic device 1000 is defined as the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. It should be noted that the directional terms such as "top", "bottom", "up", "down", "left", and "right" involved in this application are referenced to the attached Figure 1 The description of the orientations shown, with the positive direction of the Y axis as the "top", the negative direction of the Y axis as the "bottom", the positive direction of the Z axis as the "up", the negative direction of the Z axis as the "down", the positive direction of the X axis as the "right", and the negative direction of the X axis as the "left", does not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present application.

[0071] The electronic device 1000 includes a middle frame 100, a screen 200 and a back shell (not shown in the figure). The screen 200 and the back shell are respectively installed on opposite sides of the middle frame 100. A battery slot for accommodating the electronic device 1000 will be formed on the middle frame, and the back shell is used to cover the battery of the electronic device 1000 and is also the back shell of the electronic device 1000. The battery is electrically connected to the circuit board of the electronic device 1000 to power the electronic device 1000. The screen 200 is used to display the display screen and information of the electronic device 1000. The middle frame 100 is the supporting body of the electronic device 1000 and is used to carry the electronic devices inside the electronic device 1000 (not shown in the figure). The electronic devices inside the electronic device 1000 include circuit boards, processors, speaker modules, cameras, antennas, batteries, etc. and devices that realize various functions of the electronic device 1000. It can be understood that the middle frame 100 and the back shell are both shells of the electronic device 1000.

[0072] See also Figure 2 and Figure 3 , Figure 3 for Figure 2 A schematic cross-sectional view of a first embodiment of the middle frame is shown.

[0073] The middle frame 100 includes a middle plate 10 and a frame 20, and the frame 20 and the middle plate 10 are integrally formed. The frame 20 is arranged around the periphery of the middle plate 10. In this embodiment, the middle plate 10 is a rectangular thin plate, which includes a first surface 101 and a second surface 102. The first surface 101 and the second surface 102 are arranged in back-to-back relationship along the thickness direction of the middle plate 10 (Z-axis direction in the figure). The second surface 102 carries the screen 200, and the frame 20 is connected to the edge of the first surface 101. The rear shell covers one side of the first surface 101 and is connected to the frame 20.

[0074] The middle frame 100 of this embodiment includes a metal part and a plastic part, and the metal part is made of aluminum alloy. Specifically, the middle plate 10 and part of the frame are made of aluminum alloy and are made by a die-casting process. The frame 20 includes a metal part 21 and a plastic part 22. The metal part 21 is integrally formed with the middle plate 10. The metal part 21 and the plastic part 22 are formed by an in-mold injection molding process, and the plastic part 22 is embedded in part of the metal part 21. Embedded means that the plastic part 22 is partially covered by the metal part 21. The provision of the plastic part 22 facilitates the provision of an antenna on the metal part 21 and the middle plate 10, and facilitates the grounding of the frame 20 and the middle plate 10. For example, along the length direction of the frame 20 (the direction of the X-axis in the figure), part of the frame 20 includes only the metal part 21, and the metal part 21 not covered with the plastic part 22 can serve as the antenna of the electronic device 1000. The plastic part 22 can separate the antenna from the other metal parts 21. The connection position and shape of the plastic part 22 and the metal part 21 are not limited. The outer surface of the metal part 21 of this embodiment serves as the exterior surface of the frame 20.

[0075] The middle frame 100 also includes a battery slot 30 for accommodating a battery (not shown). The battery slot 30 is located on the first surface 101. The slot opening of the battery slot 30 is oriented in the same direction as the first surface 101. The battery slot 30 includes first sidewalls 31 and a first bottom wall 32. The first sidewalls 31 surround the perimeter of the first bottom wall 32. The thickness of the first bottom wall 32 of the battery slot 30 is the distance from the surface of the first bottom wall 32 to the second surface 102.

[0076] In one embodiment, two baffles are protruding from the first surface 101 of the middle plate 10. The baffles extend along the width of the middle plate 10 (the Y-axis in the figure), with each baffle connected to the frame 20 at opposite ends. The two baffles are spaced apart along the length of the middle plate 10 (the X-axis in the figure). The two baffles, a portion of the middle plate 10, and a portion of the frame 20 form a battery slot 30. A portion of the middle plate 10 forms the first bottom wall 32 of the battery slot 30, and a portion of the first surface 101 forms the bottom surface of the first bottom wall 32 of the battery slot 30. The two baffles and a portion of the frame 20 form the first side walls 31 of the battery slot 30. The dimensions of the battery slot 30 are compatible with the shape and size of the battery. A rear housing is placed on the middle frame 100 and covers the battery slot 30. A receiving slot is provided adjacent to the battery slot 30. The space formed by the rear housing and the receiving slot is used to accommodate electronic components (not shown) such as the circuit board and camera module of the electronic device 1000. In one embodiment, the first surface 101 of the middle plate 10 is recessed toward the second surface 102 to form the battery slot 30 , and the surface of the first bottom wall 32 of the battery slot 30 is lower than the first surface 101 .

[0077] In this embodiment, a functional groove 34 is recessed in the first groove bottom wall 32 of the battery groove 30 along the thickness direction (Z-axis direction) of the midplate 10. The functional groove 34 includes a second groove bottom wall 341 and a second groove side wall 342, and the second groove side wall 342 is connected to the periphery of the second groove bottom wall 341. It can be understood that the notch of the functional groove 34 is provided on the surface of the first groove bottom wall 32. The functional groove 34 extends along the Y-axis direction, and the portions of the second groove side wall 342 located at both ends of the length direction of the functional groove 34 can be part of the first groove side wall 31, or can be spaced apart from the first groove side wall 31.

[0078] The cable (not shown) connecting the electronic device 1000's circuit board is housed and positioned within the functional slot 34. The cable's ends pass through the first slot bottom wall 32 and first slot sidewall 31 to electrically connect to electronic components such as the circuit board, camera module, and screen 200 located elsewhere outside the battery slot 30. Specifically, along the Z-axis, the cable is secured to the second slot bottom wall 341 and extends along the length of the functional slot 34. The cable's thickness is less than or equal to the depth of the functional slot 34 to prevent it from occupying too much space within the battery slot 30.

[0079] In this embodiment, an adhesive layer (not shown) is provided on the first slot bottom wall 32, with the adhesive layer avoiding the functional slot 34. The battery is housed within the battery slot 30 and stacked with the first slot bottom wall 32. The battery is securely connected to the battery slot 30 via the adhesive layer on the first slot bottom wall 32. The battery covers the functional slot 34 and encapsulates the cable.

[0080] A glue groove 36 is recessed on the second groove bottom wall 341. The glue groove 36 is recessed into the second groove bottom wall 341 of the functional groove 34 along the thickness direction of the middle plate 10. The glue groove 36 is used to fill the colloid to fix the wiring contained in the functional groove 34, prevent the wiring from being out of position, affecting its connection stability, and prevent the wiring from protruding from the functional groove 34 to the first groove bottom wall 32 of the battery groove 30 to hinder the assembly of the battery. Specifically, the glue groove 36 includes a third groove bottom wall 361 and a third groove side wall 362 connected to the periphery of the third groove side wall. The glue groove 36 can be one or more. In this embodiment, there are multiple glue grooves 36, and they are arranged at intervals along the extension direction of the functional groove 34. The shape of the glue groove 36 can be regular or irregular, which is not limited here.

[0081] In this embodiment, the middle plate and a portion of the frame 20 (metal part 21) are made of an alloy material and are formed by a die-casting process combined with corrosion. The first bottom wall 32 and the first side wall 31 of the battery slot 30 are both made of an alloy material. Specifically, the middle plate 10 and a portion of the frame 20 are made of an aluminum alloy or a magnesium alloy. The thickness of the first bottom wall 32 of the battery slot 30 is 0.38 mm, and the thickness of the third bottom wall 361 of the glue slot 36 is 0.2 mm. The thickness of the bottom wall of the functional slot 34 is 0.23 mm to 0.25 mm, such as 0.23 mm.

[0082] The thickness of the first bottom wall 32 of the battery slot 30, the thickness of the second bottom wall 341 of the functional slot 34, and the thickness of the third bottom wall 361 of the adhesive slot 36 all refer to the distance from the surface of the first bottom wall 32, the surface of the second bottom wall 341, and the surface of the third bottom wall 361 to the second surface 102. It should be noted that the thickness of the first bottom wall 32 of the battery slot 30, the thickness of the second bottom wall 341 of the functional slot 34, and the thickness of the third bottom wall 361 of the adhesive slot 36 are allowed to have a certain thickness tolerance range. The surfaces of the first bottom wall 32, the surfaces of the second bottom wall 341, the surfaces of the third bottom wall 361, and the second surface 102 can be understood as flat surfaces, and are also allowed to have a certain tolerance range. It can also be understood that the thickness of the area of the middle plate 10 corresponding to the first bottom wall 32 is uniform. The thickness of the area of the middle plate 10 corresponding to the second bottom wall 341 is uniform. The thickness of the area of the middle plate 10 corresponding to the third bottom wall 361 is uniform. It is not necessary to limit the second surface 102 to be entirely flat. It should be noted that the second groove sidewall 342 is an arcuate surface that smoothly connects the first groove bottom wall 32 and the second groove bottom wall 341 , and the third groove sidewall 362 is an arcuate surface that smoothly connects the second groove bottom wall 341 and the third groove bottom wall 361 .

[0083] In the embodiment of the present application, the first bottom wall 32 of the battery compartment 30 has a thickness of 0.38 mm, and the third bottom wall 361 of the adhesive compartment 36 has a thickness of 0.2 mm. The thickness of the first bottom wall 32 of the battery compartment 30 provides sufficient strength to withstand the bending of the entire electronic device and support the impact of the battery on the battery compartment, thereby ensuring the overall strength of the midframe and reducing the thickness of the electronic device. In the prior art, the bottom wall thickness of the battery compartment is at least 0.5 mm, while the bottom wall thickness of the adhesive compartment is 0.38 mm, which undoubtedly increases the thickness of the electronic device. Furthermore, preventing the electronic device from being too thick limits the battery volume, thereby reducing its capacity. However, the present application reduces the thickness of the bottom wall of the battery compartment 30 while maintaining the thickness of the electronic device. This allows for the accommodation of a larger battery and improves the battery life of the electronic device. In other words, the bottom walls of the adhesive compartment 36 and the battery compartment 30 of the present application are relatively thin. The resulting space saved can be used to achieve a thinner electronic device or increase the battery capacity.

[0084] In one embodiment, the junction between the first sidewall 31 and the first bottom wall 32 of the battery tray 30 is inclined away from the first bottom wall 32 and forms a gradually varying angle A with the first bottom wall 32. The gradually varying angle A is an acute angle. The surfaces of the first bottom wall 32, the second bottom wall 341, and the third bottom wall 361 are all formed with laser-engraved patterns, such as parallel and spaced stripes. Laser-engraved patterns can be understood as surfaces that have been processed through a laser engraving process.

[0085] like Figure 4 , Figure 4 for Figure 2 A schematic cross-sectional view of a second embodiment of the middle frame is shown. In one embodiment, the junction between the second sidewall 342 of the functional slot 34 and the second bottom wall 341 is angled away from the second bottom wall 341 of the functional slot 34, forming a gradually varying angle A with the second bottom wall 341 of the functional slot 34. This gradually varying angle A is an acute angle. Both the second bottom wall 341 and the third bottom wall 361 are laser-engraved with patterns, such as parallel, spaced-apart stripes. Laser-engraved patterns can be understood as surfaces that have been processed through a laser engraving process.

[0086] The angle range of the gradually varying angle A in any of the above embodiments is greater than or equal to 5 degrees and less than or equal to 15 degrees, such as 12 degrees.

[0087] The following describes in detail the middle frame and the manufacturing method of this embodiment with reference to the accompanying drawings.

[0088] See also Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 and Figure 9 , Figure 5 for Figure 3A method flow chart of a first embodiment of a method for manufacturing a middle frame shown; Figure 6 for Figure 5 A schematic structural diagram of a middle frame substrate in one step of a method for manufacturing the middle frame is shown; Figure 7 for Figure 5 A schematic structural diagram of a middle frame substrate in another step of the middle frame manufacturing method is shown; Figure 8 for Figure 5 The figure shows a schematic structural diagram of a middle frame substrate in another step of the middle frame manufacturing method. Figure 9 for Figure 5 The schematic diagram of the structure of the middle frame substrate in another step of the middle frame manufacturing method is shown. In the first embodiment of the middle frame manufacturing method, the method includes:

[0089] Step S1 , providing a middle frame substrate 1 , the middle frame substrate 1 includes a middle plate substrate 2 and a frame substrate 3 , the frame substrate 3 is connected to the periphery of the middle plate substrate 2 , the middle plate substrate 2 includes a first surface and a second surface, and a groove 4 is formed on the first surface.

[0090] The bottom wall of the groove 4 is recessed with a first groove, which is recessed into the bottom wall of the groove 4 along the thickness direction of the mid-plate substrate 2. The bottom wall of the first groove 5 is recessed with a second groove 6, which is recessed into the bottom wall of the first groove 5 along the thickness direction of the mid-plate substrate 2. It should be noted that the connection between the bottom wall of the groove 4 and the sidewalls of the first groove 5 is an arcuate transition surface, and the connection between the bottom wall of the first groove 5 and the sidewalls of the second groove 6 is also an arcuate transition surface.

[0091] In this embodiment, the middle frame substrate 1 is formed by die-casting, specifically alloy die-casting. The bottom wall thickness of the groove 4 is 0.5 mm, and the bottom wall thickness of the second groove 6 is 0.32 mm. The middle plate substrate 2 and the frame substrate 3 are made of aluminum alloy or magnesium alloy.

[0092] The die-casting process is a precision casting method that uses high pressure to force molten metal into a complex-shaped mold. During the molding of the middle frame substrate 1, a molten metal injection port is positioned on the X-axis side of the groove 4. The molten metal flows in the X-direction. Because the first groove 5 extends along the Y-axis along the bottom wall of the groove 4, if the bottom wall of the first groove 5 is thin, the flowing molten metal will slow down and reduce in volume as it passes through the first groove 5, affecting the uniformity and strength of the bottom wall on the other side of the groove 4. In this embodiment, the thickness of the bottom wall of the first groove 5 is greater than 0.23 mm to ensure the overall strength of the bottom wall of the groove 4 during die-casting of the middle frame substrate 1.

[0093] In step S2, a protective film 7 is formed on the outer surface of the middle frame substrate 1, exposing the bottom wall of the groove 4, the first groove 5, and the second groove 6. Specifically, the protective film 7 is formed on the outer surface of the middle frame substrate 1 by electrophoretic coating. Electrophoretic coating deposits an organic film, such as an organic resin film, on the surface of the casting. Specifically, the metal part is immersed in a resin solvent, then removed and baked to dry, so that the resin film covers the metal part and solidifies. The protective film 7 covers the entire outer surface of the middle frame substrate 1.

[0094] The protective film 7 covering the bottom wall of the groove 4 and the first groove 5 and the second groove 6 is removed by a laser engraving process.

[0095] In step S3, a weak base is used to repeatedly etch the bottom wall of the groove 4, the first groove 5, and the second groove 6. The groove 4 forms the battery groove 30, the first groove 5 forms the functional groove 34, and the second groove 6 forms the adhesive groove 36. There is no specific limit to the number of etching cycles. If the thickness to be thinned is relatively large, multiple micro-etching cycles can be performed. During multiple weak base etching cycles, the thickness of the groove bottom wall, the bottom wall of the first groove 5, and the bottom wall of the second groove 6 is 0.01 mm to 0.03 mm each time.

[0096] In this embodiment, a weak base was used to etch the bottom wall of the groove 4, the first groove 5, and the second groove 6 four times. Each etching step removed a thickness of 0.03 mm from the bottom wall of the groove 4, the bottom wall of the first groove 5, and the bottom wall of the second groove 6. In this embodiment, a weak base was used as the etchant. In other embodiments, a weak acid may also be used as the etchant.

[0097] The side wall of the first slot 5 of the battery container is inclined away from the bottom wall of the first slot 5 of the battery container and forms a gradually changing angle A with the bottom wall of the first slot 5 of the battery container. The gradually changing angle A is an acute angle. The angle range of the gradually changing angle is greater than or equal to 5 degrees and less than or equal to 15 degrees.

[0098] The step of etching with weak alkali multiple times also includes cleaning the middle frame substrate 1 after each etching. For example, if the middle frame substrate 1 is etched four times, it is cleaned four times to remove impurities remaining on the surface of the middle frame substrate 1.

[0099] After multiple etchings with weak alkali, laser engraving marks are found on the bottom walls of the battery slot 30, the functional slot 34, and the adhesive slot 36. The laser engraving marks are formed when part of the protective film 7 is removed and remain after etching.

[0100] Step S4: removing the protective film 7 to form a middle frame metal insert. Specifically, the protective film 7 is removed and the middle frame substrate 1 forms the middle frame metal insert.

[0101] In step S5, the middle frame metal insert is placed in an injection mold for metal injection molding. A plastic part is formed on the middle frame metal insert to form the middle frame 100. The plastic part covers a portion of the frame substrate. For example, when the frame serves as an antenna, a plastic part is required for isolation. Of course, various surface coatings can also be applied to achieve coloring, supplemented by various foams, copper sheets, etc., to achieve the desired appearance of a plastic phone.

[0102] See also Figure 10 , Figure 10 for Figure 4 The flowchart of the second embodiment of the method for manufacturing the middle frame is shown. The second embodiment of the method for manufacturing the middle frame differs from the first embodiment in steps S11 and S13, as well as the angle between the sidewalls and bottom wall of the functional groove 34 formed. The specific processing steps in this embodiment are not shown in the figure; for similar structures, reference can be made to the figures in the above embodiment.

[0103] In step S11, a middle frame substrate is provided, wherein a battery slot is formed on a first surface of the middle frame substrate; the battery slot includes a slot bottom wall and slot sidewalls provided around the periphery of the slot bottom wall, wherein the slot bottom wall is recessed with a first slot, wherein the thickness of the slot bottom wall of the battery slot is 0.38 mm.

[0104] A second groove is recessed on the bottom wall of the first groove; the second groove is recessed into the bottom wall of the first groove along the thickness direction of the middle plate; it should be noted that the thickness of the bottom wall of the first groove is 0.35 mm, and the thickness of the bottom wall of the second groove is 0.32 mm, and the above dimensions are allowed to have a certain tolerance.

[0105] In step S12 , a protective film is formed on the outer surface of the middle frame substrate, and the bottom wall of the first groove and the second groove are exposed.

[0106] In step S13, the bottom walls of the second groove and the first groove are repeatedly etched with a weak base, so that the first groove forms a functional groove 34 and the second groove forms a glue groove 36. The bottom wall thickness of the functional groove 34 is 0.23 mm, and the bottom wall thickness of the glue groove 36 is 0.2 mm. The sidewalls of the functional groove 34 are inclined away from the bottom wall of the glue groove 36 and form a gradually changing angle with the bottom wall of the functional groove 34. The gradually changing angle is an acute angle and ranges from 5 degrees to 15 degrees.

[0107] Step S14: removing the protective film to form a middle frame metal insert. Specifically, the protective film is removed and the middle frame substrate is formed into the middle frame metal insert.

[0108] In step S15, the middle frame metal insert is placed in an injection mold for metal injection molding. A plastic part is formed on the metal insert to form the middle frame, wherein the plastic part covers a portion of the frame substrate. For example, when the frame is used as an antenna, the plastic part is required for isolation. Of course, various surface coatings can also be applied to achieve coloring, supplemented by various foams, copper sheets, etc., to achieve the desired appearance of a plastic phone.

[0109] The present application is manufactured by any of the above-described methods for manufacturing a middle frame. Through multiple etchings, the thickness of the bottom wall of the battery slot 30 of the middle frame 100 reaches 0.32 mm, and the thickness of the bottom wall of the glue slot 36 is 0.2 mm. The thinning of the bottom wall of the battery slot 30 and the bottom wall of the glue slot 36 is achieved, while ensuring the overall strength of the middle plate, that is, achieving a thinner middle plate. The thinning margin can also be used to increase the capacity of the battery slot, thereby increasing the capacity of the battery. The manufacturing method of this embodiment is implemented without the need for mechanical processing such as CNC machining, which can ensure the structural strength of the middle frame. Furthermore, it is not completed by one-time die casting, which can avoid the problem of sand holes in the bottom wall of the battery slot due to insufficient filling of the metal solution in the mold due to the small die casting size (the bottom wall of the glue slot); it also avoids affecting the structural strength of the entire middle frame and improves the impact impedance performance of the battery slot to the battery. In general, compared with the prior art, the middle frame of this embodiment can be thinner and have sufficient strength, which has a great advantage in the industry and meets the demand for thinner electronic devices.

[0110] The above is a detailed introduction to the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of the present application. At the same time, for those skilled in the art, based on the ideas of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A middle frame, characterized in that: It includes a middle plate and a frame, wherein the frame is connected to the periphery of the middle plate, and the middle frame includes a battery slot. The middle plate includes a first surface and a second surface, the first surface and the second surface are arranged in opposite directions along the thickness direction of the middle plate, and the battery slot is arranged on the first surface; The battery slot includes a slot bottom wall and slot side walls arranged at the periphery of the slot bottom wall. The slot bottom wall is recessed with a functional slot, and the functional slot is recessed into the slot bottom wall of the battery slot along the thickness direction of the middle plate. A glue groove is recessed on the bottom wall of the functional groove; the glue groove is recessed into the bottom wall of the functional groove along the thickness direction of the middle plate; The connection between the side wall of the battery slot and the bottom wall of the battery slot is inclined away from the bottom wall of the battery slot and forms a gradually changing angle with the bottom wall of the battery slot, and the gradually changing angle is an acute angle.

2. The middle frame according to claim 1, characterized in that: The angle range of the gradually changing angle is greater than or equal to 5 degrees and less than or equal to 15 degrees.

3. The middle frame according to claim 1 or 2, characterized in that: The thickness of the bottom wall of the battery tank is 0.38 mm, and the thickness of the bottom wall of the glue tank is 0.2 mm; The thickness of the bottom wall of the battery tank and the thickness of the bottom wall of the glue tank both refer to the distance from the surface of each bottom wall to the second surface.

4. The middle frame according to claim 3, characterized in that: The thickness of the bottom wall of the functional groove is 0.23mm-0.25mm.

5. The middle frame according to claim 1, characterized in that: The middle plate and part of the frame are made of metal and are formed by a die-casting process. The bottom wall of the battery tank is formed by multiple weak alkaline corrosion.

6. The middle frame according to claim 1, characterized in that: The surface of the bottom wall of the battery slot, the surface of the bottom wall of the functional slot, and the surface of the bottom wall of the glue slot are all formed with laser engraving patterns.

7. A middle frame, characterized in that: It includes a middle plate and a frame, wherein the frame is connected to the periphery of the middle plate, and the middle frame includes a battery slot. The middle plate includes a first surface and a second surface, the first surface and the second surface are arranged in opposite directions along the thickness direction of the middle plate, and the battery slot is recessed in the first surface; The battery slot includes a slot bottom wall and slot side walls arranged at the periphery of the slot bottom wall. The slot bottom wall is recessed with a functional slot, and the functional slot is recessed into the slot bottom wall of the battery slot along the thickness direction of the middle plate. A glue groove is recessed on the bottom wall of the functional groove; the glue groove is recessed into the bottom wall of the functional groove along the thickness direction of the middle plate; A connection between the groove side wall of the functional groove and the groove bottom wall of the functional groove is inclined away from the groove bottom wall of the functional groove and forms a gradually changing angle with the groove bottom wall of the functional groove, and the gradually changing angle is an acute angle.

8. The middle frame according to claim 7, characterized in that: The angle range of the gradually changing angle is greater than or equal to 5 degrees and less than or equal to 15 degrees.

9. The middle frame according to claim 7 or 8, characterized in that: The thickness of the bottom wall of the battery tank is 0.38 mm, and the thickness of the bottom wall of the glue tank is 0.2 mm; The thickness of the bottom wall of the battery tank and the thickness of the bottom wall of the glue tank both refer to the distance from the surface of each bottom wall to the second surface.

10. The middle frame according to claim 9, characterized in that: The thickness of the bottom wall of the functional groove is 0.23mm-0.25mm.

11. An electronic device, characterized in that: The electronic device comprises the middle frame and the battery according to any one of claims 1 to 10, the functional slot houses the cable of the electronic device, and a colloid is provided in the adhesive slot for fixing the cable; the bottom wall of the battery slot is provided with an adhesive layer, the adhesive layer avoids the functional slot, the battery is housed in the battery slot and the cable is sealed in the functional slot, and the adhesive layer bonds the battery.

12. A method for manufacturing a middle frame, characterized in that: Providing a middle frame substrate, the middle frame substrate comprising a middle plate substrate and a frame substrate, the frame substrate being connected to a periphery of the middle frame substrate, the middle plate substrate comprising a first surface and a second surface, a groove being formed on the first surface; The bottom wall of the groove is provided with a first groove, and the first groove is recessed into the bottom wall of the groove along the thickness direction of the middle plate substrate. A second groove is recessed on the bottom wall of the first groove; the second groove is recessed into the bottom wall of the first groove along the thickness direction of the mid-plate substrate; forming a protective film on the outer surface of the middle frame substrate, exposing the bottom wall of the groove, the first groove, and the second groove; The bottom wall of the groove, the first groove, and the second groove are repeatedly corroded using a weak base; the groove forms a battery groove, the first groove forms a functional groove, and the second groove forms a glue groove; wherein the groove sidewall of the battery groove is inclined away from the groove bottom wall of the battery groove and forms a first gradually changing angle with the groove bottom wall of the battery groove, and the gradually changing angle is an acute angle; The protective film is removed to form a middle frame metal insert.

13. The method for manufacturing the middle frame according to claim 12, wherein: The middle frame substrate is formed by a die-casting process, the bottom wall thickness of the groove is 0.5 mm, and the bottom wall thickness of the second groove is 0.32 mm; The steps of multiple etching with weak alkali specifically include: etching the bottom wall of the groove, the first groove and the second groove four times with weak alkali, and each time etching away the bottom wall of the groove, the bottom wall of the first groove and the bottom wall of the second groove is 0.03 mm thick.

14. The method for manufacturing the middle frame according to claim 12, wherein: The step of forming a protective film on the outer surface of the middle frame substrate includes: forming a protective film on the outer surface of the middle frame substrate by electrophoretic coating; The protective film covering the bottom wall of the groove and the first groove and the second groove is removed by a laser engraving process.

15. The method for manufacturing the middle frame according to claim 12, wherein: The step of etching with weak alkali multiple times further includes cleaning the middle frame substrate after each etching.

16. The method for manufacturing the middle frame according to claim 12, wherein: The angle range of the gradually changing angle is greater than or equal to 5 degrees and less than or equal to 15 degrees.

17. The method for manufacturing the middle frame according to claim 14, wherein: After multiple corrosions with weak alkali, laser engraving marks are found on the bottom walls of the battery slot, the functional slot, and the glue slot.

18. A method for manufacturing a middle frame, characterized in that: The middle frame base material is made of metal through die casting process. The middle frame substrate includes a middle plate substrate and a frame substrate, the frame substrate is connected to the periphery of the middle frame substrate, the middle plate substrate includes a first surface and a second surface, a battery slot is formed on the first surface; the battery slot includes a slot bottom wall and slot sidewalls provided at the periphery of the slot bottom wall, the slot bottom wall is recessed with a first slot; the slot bottom wall of the first slot is recessed with a second slot; the second slot is recessed into the slot bottom wall of the first slot along the thickness direction of the middle plate substrate; forming a protective film on the outer surface of the middle frame substrate, exposing the bottom wall of the first groove and the second groove; The second groove and the bottom wall of the first groove are repeatedly etched with a weak base, so that the first groove becomes a functional groove and the second groove becomes a glue groove; wherein the groove sidewall of the functional groove is inclined away from the groove bottom wall of the glue groove and forms a gradually changing angle with the groove bottom wall of the functional groove, and the gradually changing angle is an acute angle; The protective film is removed to form a middle frame metal insert.

19. The method for manufacturing the middle frame according to claim 18, wherein: The middle frame substrate is formed by die casting. The bottom wall thickness of the battery tank is 0.38 mm, the bottom wall thickness of the first tank is 0.35 mm, and the bottom wall thickness of the second tank is 0.32 mm. The step of etching with a weak base multiple times specifically includes: etching the bottom wall of the first groove and the second groove four times with a weak base; The first groove forms a functional groove, and the second groove forms a glue groove; The thickness of the bottom wall of the functional groove is 0.23 mm, and the thickness of the bottom wall of the glue groove is 0.2 mm.

20. The method for manufacturing the middle frame according to claim 19, wherein: The angle range of the gradually changing angle is greater than or equal to 5 degrees and less than or equal to 15 degrees.

21. The method for manufacturing the middle frame according to claim 18, wherein: The step of forming a protective film on the outer surface of the middle frame substrate includes: forming a protective film on the outer surface of the middle frame substrate by electrophoretic coating; The protective films covering the bottom wall of the first groove and the second groove are removed by a laser engraving process.

22. The method for manufacturing the middle frame according to claim 21, wherein: The step of etching with weak alkali multiple times further includes cleaning the middle frame substrate after each etching.

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