Preparation method of display panel, display panel and display device

Abstract

The invention discloses a preparation method of a display panel, the display panel and a display device.The method comprises the steps that a driving circuit layer and a light-emitting element are prepared on the first side of a first substrate, the driving circuit layer is provided with a first connecting terminal deviating from the first substrate, and the light-emitting element is provided with a second connecting terminal deviating from the first substrate; the light-emitting element emits light towards the first substrate; preparing a connecting wire on the first side of the second substrate; and after the first side of the first substrate and the first side of the second substrate are oppositely arranged, the first substrate and the second substrate are laminated, so that the connecting wire is electrically connected with the first connecting terminal and the second connecting terminal. Through the preparation method, the reliability of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for manufacturing a display panel, a display panel, and a display device. Background Art

[0002] With the development of display technology, bottom-emitting display panels have become the mainstream technology and are widely used. However, during use, display panels still have reliability issues, which affect the user experience. Summary of the Invention

[0003] The present application provides a method for manufacturing a display panel, a display panel, and a display device, which can improve the reliability of the display panel.

[0004] The present application provides a method for preparing a display panel, the method comprising: preparing a driving circuit layer and a light-emitting element on a first side of a first substrate, the driving circuit layer being provided with a first connecting terminal facing away from the first substrate, the light-emitting element being provided with a second connecting terminal facing away from the first substrate, and the light-emitting element emitting light toward the first substrate; preparing a connecting wire on a first side of a second substrate; after arranging the first side of the first substrate and the first side of the second substrate relative to each other, pressing the first substrate and the second substrate together so that the connecting wire is electrically connected to the first connecting terminal and the second connecting terminal.

[0005] In one embodiment, the second substrate is a flexible substrate, and the step of preparing the connecting wire on one side of the second substrate includes: forming the second substrate on one side of a third substrate, wherein the third substrate is a rigid substrate; preparing the connecting wire on a side of the second substrate facing away from the third substrate; and peeling the third substrate from the second substrate.

[0006] Preferably, the material of the second substrate includes polydimethylsiloxane.

[0007] Preferably, the third substrate is made of glass.

[0008] Preferably, the first substrate is made of glass.

[0009] In one embodiment, the step of preparing the connecting wires on the first side of the second substrate includes: preparing the connecting wires on the first side of the second substrate using a printing process.

[0010] Preferably, the material of the connecting wire includes indium tin oxide or silver.

[0011] In one embodiment, the step of pressing the first substrate and the second substrate together after arranging the first side of the first substrate and the first side of the second substrate relative to each other so that the connecting wire is electrically connected to the first connecting terminal and the second connecting terminal includes: pre-pressing the first substrate and the second substrate after arranging the first side of the first substrate and the first side of the second substrate relative to each other; and performing high-temperature reflow while performing the basic pressing on the first substrate and the second substrate so that the connecting wire is welded to the first connecting terminal and the second connecting terminal.

[0012] In one embodiment, a distance from the first connecting terminal to the first substrate is different from a distance from the second connecting terminal to the second substrate, and the connecting wire includes a first routing segment and a second routing segment electrically connected, wherein the second routing segment is arranged on a side of the first routing segment away from the second substrate.

[0013] Preferably, the first routing segment and the second routing segment are made of the same material.

[0014] Preferably, the driving circuit layer is provided with a through groove, and the light emitting element is located in the through groove.

[0015] Preferably, the distance from the first connecting terminal to the first substrate is smaller than the distance from the second connecting terminal to the second substrate.

[0016] The second aspect of the present application also provides a display panel, including: a first substrate; a driving circuit layer and a light-emitting element, which are arranged on a first side of the first substrate, the driving circuit layer is provided with a first connecting terminal facing away from the first substrate, the light-emitting element is provided with a second connecting terminal facing away from the first substrate, and the light-emitting element emits light toward the first substrate; a connecting wire, electrically connecting the first connecting terminal and the second connecting terminal, and the connecting wire is welded to the first connecting terminal and the second connecting terminal; a second substrate, which is arranged on the side of the connecting wire facing away from the first substrate.

[0017] In one embodiment, the second substrate is a flexible substrate.

[0018] Preferably, the material of the second substrate includes polydimethylsiloxane.

[0019] Preferably, the first substrate is made of glass.

[0020] In one embodiment, a distance from the first connecting terminal to the first substrate is different from a distance from the second connecting terminal to the second substrate; the connecting wire includes an electrically connected first routing segment and a second routing segment, wherein the second routing segment is arranged on a side of the first routing segment away from the second substrate.

[0021] Preferably, the first routing segment and the second routing segment are made of the same material.

[0022] In one embodiment, the driving circuit layer is provided with a through groove, and the light emitting element is disposed in the through groove.

[0023] Preferably, the distance from the first connecting terminal to the first substrate is smaller than the distance from the second connecting terminal to the second substrate.

[0024] A third aspect of the present application further provides a display device, comprising the display panel in any one of the above embodiments.

[0025] The beneficial effect is: the present application prepares connecting wires on the second substrate, sets the first side of the first substrate and the first side of the second substrate relative to each other, and then presses the first substrate and the second substrate together to electrically connect the connecting wires to the first connecting terminal and the second connecting terminal. Compared with the prior art method of directly depositing metal traces on the first connecting terminal and the second connecting terminal, the present application avoids the poor contact between the deposited metal traces and the first connecting terminal and the second connecting terminal. The pressing connection can improve the pressing effect between the metal traces and the first connecting terminal and the second connecting terminal, making the connection tighter, thereby improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0027] Figure 1 It is a schematic flow chart of the method for preparing the display panel of the present application;

[0028] Figure 2 yes Figure 1 A schematic structural diagram of an embodiment of the display panel manufacturing process corresponding to step S100;

[0029] Figure 3 yes Figure 1 A schematic structural diagram of an embodiment of the display panel manufacturing process corresponding to step S200;

[0030] Figure 4 yes Figure 1 A schematic structural diagram of an embodiment of the display panel manufacturing process corresponding to step S300;

[0031] Figure 5 yes Figure 1 A schematic structural diagram of another embodiment of the display panel manufacturing process corresponding to step S300;

[0032] Figure 6 yes Figure 1 A flow chart of an embodiment of step S200;

[0033] Figure 7 yes Figure 6 Schematic diagram of the corresponding preparation process;

[0034] Figure 8 yes Figure 1 A flow chart of another embodiment of step S200;

[0035] Figure 9 yes Figure 1 A flow chart of an embodiment of step S300;

[0036] Figure 10 yes Figure 1 A schematic structural diagram of another embodiment of the display panel manufacturing process corresponding to step S300;

[0037] Figure 11 yes Figure 1 A schematic structural diagram of another embodiment of the display panel manufacturing process corresponding to step S200;

[0038] Figure 12 yes Figure 1 A structural diagram of another embodiment corresponding to step S200 in the manufacturing process of the display panel;

[0039] Figure 13 It is a structural schematic diagram of the display device of this application. DETAILED DESCRIPTION

[0040] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0041] It should be noted that the terms "first" and "second" in this application are only used for descriptive purposes and should not be understood as indicating or suggesting relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0042] Please combine Figures 1 to 4 The present application provides a method for preparing a display panel 10, the method comprising:

[0043] S100: Prepare a driving circuit layer 110 and a light-emitting element 120 on the first side 100A of the first substrate 100. The driving circuit layer 110 is provided with a first connecting terminal 111 facing away from the first substrate 100. The light-emitting element 120 is provided with a second connecting terminal 121 facing away from the first substrate 100. The light-emitting element 120 emits light toward the first substrate 100.

[0044] Specifically, Figure 2 What is shown is a bottom-emitting structure, in which the driving circuit layer 110 and the light-emitting element 120 are arranged on the first side 100A of the first substrate 100. The driving circuit layer 110 and the light-emitting element 120 can be arranged in the same layer, for example, the light-emitting element 120 can be embedded in the driving circuit 110; the driving circuit layer 110 and the light-emitting element 120 can also be stacked, for example, the light-emitting element 120 can be located on the side of the driving circuit layer 110 away from the first substrate 100. The first connection terminal 111 is located on the side of the driving circuit layer 110 facing away from the first substrate 100, and the second connection terminal 121 is located on the side of the light-emitting element 120 facing away from the first substrate 100. That is, the first connection terminal 111 and the second connection terminal 121 are electrically connected to the driving circuit layer 110 and the light-emitting element 120 on the side close to the first substrate 100, respectively, and the side facing away from the first substrate 100 is exposed. The distance between the first connection terminal 111 and the second connection terminal 121 on the side facing away from the first substrate 100 and the first substrate 100 can be the same. Of course, the distance may also be unequal due to product design or manufacturing process. The number of first connection terminals 111 and second connection terminals 121 can be one or more, and this application does not impose any restrictions.

[0045] S200 : preparing connecting wires 210 on the first side 200A of the second substrate 200 .

[0046] Specifically, see Figure 3 The second substrate 200 is a substrate different from the first substrate 100. The second substrate 200 is used alone to prepare the connecting wire 210. The connecting wire 210 is used to connect the first connecting terminal 111 and the second connecting terminal 121 later. The patterning of the connecting wire 210 is designed based on the first connecting terminal 111 and the second connecting terminal 121 on the first substrate 100. It only needs to correspond to the positions of the first connecting terminal 111 and the second connecting terminal 121 later. The side of the connecting wire 210 close to the second substrate 200 is in contact with the second substrate 200, and the side away from the second substrate 200 is exposed. In addition, in the actual preparation process, since step S200 and step S100 are two independent steps, they can be prepared in either order, at the same time, or in sequence. This application does not impose any restrictions.

[0047] S300 : After the first side 100A of the first substrate 100 and the first side 200A of the second substrate 200 are disposed opposite to each other, the first substrate 100 and the second substrate 200 are pressed together so that the connecting wires 210 are electrically connected to the first connecting terminals 111 and the second connecting terminals 121 .

[0048] Specifically, after completing the above steps S100 and S200, refer to Figure 4 The first side 100A of the first substrate 100 and the first side 200A of the second substrate 200 are arranged opposite to each other, that is, the exposed parts of the first connecting terminals 111 and the second connecting terminals 121 are opposite to the exposed parts of the connecting wires 210 and the corresponding positions are aligned. Then, the first substrate 100 and the second substrate 200 are pressed together through a pressing process, so that the connecting wires 210 and the first connecting terminals 111 and the second connecting terminals 121 are pressed together, making the electrical connection between the connecting wires 210 and the first connecting terminals 111 and the second connecting terminals 121 more reliable and stable, thereby improving the reliability of the display panel 10.

[0049] In the prior art, see Figure 2 ,exist Figure 2On the basis of the first connecting terminal 111 and the second connecting terminal 121, a patterned metal wiring layer (not shown) is deposited on the side away from the first substrate 100 to electrically connect the first connecting terminal 111 and the second connecting terminal 121. However, since the contact between the deposited metal wiring layer and the first connecting terminal 111 and the second connecting terminal 121 is not good, the electrical connection between the first connecting terminal 111 and the second connecting terminal 121 may be disconnected, thereby causing failure of the display panel. In the present application, by preparing a connecting wire 210 on the second substrate 200 and pressing the first substrate 100 and the second substrate 200 together, the externally applied pressing force makes the first connecting terminal 111 and the second connecting terminal 121 more closely contact with the connecting wire 210 during the pressing process, thereby avoiding the occurrence of poor contact and improving the reliability of the display panel 10.

[0050] Of course, it should be noted that when the method of the present application is used to prepare a display panel, the structure of the display panel is not limited to the drawings provided in the present application. For example, Figure 5 , a schematic diagram of a structure in which the first connection terminal 111 does not contact the light-emitting element 120 is shown, which can also be prepared using this method. Alternatively, in some other embodiments, the two first connection terminals 111 can be located on opposite sides of the light-emitting element 120, or on adjacent sides of the light-emitting element 120, etc., which are not listed one by one in this application.

[0051] In one embodiment, combining Figure 6 and Figure 7 The second substrate 200 is a flexible substrate. The flexible substrate can ensure that the second substrate 200 has a certain elasticity when the second substrate 200 and the first substrate 100 are pressed together. This can make the elastic contact between the first connecting terminal 111 and the second connecting terminal 121 and the connecting wire 210 through the flexible substrate better. Figure 4 The flexible substrate and the first substrate 100 are located on both sides of the light emitting element 120 and the driving circuit layer 110 to provide protection.

[0052] S210 : forming a second substrate 200 on one side of a third substrate 300 , wherein the third substrate 300 is a rigid substrate.

[0053] Specifically, the second substrate 200 may be formed on the third substrate 300 by coating. Preparing the second substrate 200 on a rigid substrate can facilitate preparation and transportation.

[0054] S220 : preparing a connecting wire 210 on a side of the second substrate 200 facing away from the third substrate 300 .

[0055] Specifically, the connecting wire 210 is prepared on the side of the second substrate 200 away from the third substrate 300, that is, the first side 200A of the second substrate 200 mentioned above. The connecting wire 210 is a patterned structure corresponding to the positions of the first connecting terminal 111 and the second connecting terminal 121 on the first substrate 100.

[0056] S230 : peeling the third substrate 300 and the second substrate 200 .

[0057] Specifically, the third substrate 300 can be peeled off from the second substrate 200 by laser peeling, and the rigid substrate can be peeled off, leaving the flexible second substrate 200. In the subsequent pressing process of the first substrate 100 and the second substrate 200, the flexible elastic effect of the second substrate 200 can be used in conjunction with the pressing force to make the electrical connection between the first connecting terminal 111, the second connecting terminal 121 and the connecting wire 210 more reliable and stable.

[0058] In one embodiment, the second substrate 200 is made of polydimethylsiloxane (PDMS), which has excellent elasticity. The third substrate 300 is made of glass. The first substrate 100 is made of glass. Glass is a common rigid substrate in the display industry and provides excellent support.

[0059] Of course, in some other embodiments, the second substrate 200 may also be made of other flexible materials, and the first substrate 100 and the third substrate 300 may also be made of other rigid materials.

[0060] In another embodiment, combined Figure 3 and Figure 8 , the above step S200 includes:

[0061] S240 : preparing the connecting wires 210 on the first side 200A of the second substrate 200 by using a printing process.

[0062] Specifically, printing can be performed using printing processes such as inkjet printing or electrohydrodynamic printing (EHD Printing). The printing process can directly perform patterned printing according to the patterned design requirements, without the need to deposit a metal layer on the entire surface and then obtain patterned conductors through an etching process as in the prior art. The printing process also facilitates the repair of defects in the later stage.

[0063] In one embodiment, the material of the connecting wire 210 includes at least one of indium tin oxide (ITO) and silver. ITO and silver are suitable for printing processes and can achieve better printing effects. Of course, the material of the connecting wire 210 can also be other materials, and this application does not limit it.

[0064] In one embodiment, see Figure 9 , the above step S300 includes:

[0065] S310 : After the first side 100A of the first substrate 100 and the first side 200A of the second substrate 200 are arranged opposite to each other, the first substrate 100 and the second substrate 200 are pre-pressed.

[0066] Specifically, after the first side 100A of the first substrate 100 and the first side 200A of the second substrate 200 are arranged relative to each other, that is, the first connecting terminal 111, the second connecting terminal 121 and the connecting wire 210 are arranged relative to each other and aligned, the first substrate 100 and the second substrate 200 are pre-pressed. The pre-pressing is performed at room temperature or a temperature lower than the actual pressure to form a preliminary electrical connection between the first connecting terminal 111, the second connecting terminal 121 and the connecting wire 210.

[0067] S320 : performing high-temperature reflow while pressing the first substrate 100 and the second substrate 200 , so that the connecting wires 210 are connected to the first connecting terminals 111 and the second connecting terminals 121 by welding.

[0068] Specifically, after a preliminary electrical connection is formed between the first and second connection terminals 111, 121, and the connecting wires 210, a basic pressure is applied to the first and second substrates 100, 200, and high-temperature reflow is performed simultaneously, thereby fully electrically connecting the connecting wires 210 to the first and second connection terminals 111, 121. Under high-temperature conditions, the materials of the connecting wires 210 and the first and second connection terminals 111, 121 undergo physical or chemical changes, such as melting or forming an alloy, thereby increasing the strength of the connecting wires 210 and the first and second connection terminals 111, 121, and improving the reliability of the display panel 10. This connection effect cannot be achieved with existing metal wiring layers formed by deposition.

[0069] Of course, in some other embodiments, the first substrate 100 and the second substrate 200 may also be pressed together using other pressing methods, such as welding by laser irradiation and pressing.

[0070] In one embodiment, see Figures 2 to 4 The distance between the first connecting terminal 111 and the first substrate 100 is not equal to the distance between the second connecting terminal 121 and the second substrate 200, and the connecting wire 210 includes an electrically connected first routing segment 211 and a second routing segment 212, wherein the second routing segment 212 is arranged on the side of the first routing segment 211 away from the second substrate 200.

[0071] Specifically, due to the design dimensions or process factors of the driving circuit layer 110 and the light-emitting element 120, or the design dimensions or process factors of the first and second connection terminals 111 and 121, the distance between the first connection terminal 111 and the first substrate 100 and the distance between the second connection terminal 121 and the second substrate 200 are unequal. This makes it impossible to electrically connect the first and second connection terminals 111 and 121 using a single flat connecting conductor. Therefore, the connecting conductor 210 includes a first electrically connected trace segment 211 and a second trace segment 212. The second trace segment 212 is disposed on the side of the first trace segment 211 facing away from the second substrate 200 to form a height difference. This height difference is equal to the relative distance between the first and second connection terminals 111 and 121, thereby ensuring a good electrical connection during press-fitting.

[0072] In one embodiment, the first trace segment 211 and the second trace segment 212 are made of the same material.

[0073] Specifically, the first trace segment 211 and the second trace segment 212 are made of the same material, which can improve the efficiency of the layer preparation of the connecting wire 210 and avoid the problem of poor contact between different materials.

[0074] Of course, in some other embodiments, the materials of the first routing segment 211 and the second routing segment 212 may also be different. For example, the first routing segment 211 is made of indium tin oxide, and the second routing segment 212 is made of silver.

[0075] In one embodiment, the driving circuit layer 110 is provided with a through groove (not shown), and the light emitting element 120 is located in the through groove.

[0076] Specifically, the light emitting element 120 is embedded in the driving circuit layer 110 , so that the light emitted by the light emitting element 120 can be transmitted directly through the first substrate 100 without passing through other film layers, thereby improving the light extraction efficiency of the display panel 10 .

[0077] Of course, in some other embodiments, the light emitting element 120 may also be disposed on a side of the driving circuit layer 110 facing away from the first substrate 100 .

[0078] In one embodiment, see Figure 4 , the distance between the first connection terminal 111 and the first substrate 100 is smaller than the distance between the second connection terminal 121 and the second substrate 200 .

[0079] Specifically, in the prior art, the thickness of the driving circuit layer 110 can be made relatively thin, while the thickness of the light-emitting element 120 can be made relatively thick, which will indirectly cause the distance from the first connection terminal 111 to the first substrate 100 to be smaller than the distance from the second connection terminal 121 to the second substrate 200. This problem can be well solved by connecting the first routing segment 211 and the second routing segment 212 of the wire 210 in the above embodiment.

[0080] Of course, in some other embodiments, for example, see Figure 10 The distance from the first connection terminal 111 to the first substrate 100 may be greater than the distance from the second connection terminal 121 to the second substrate 200. Of course, in some other embodiments, the distance from the first connection terminal 111 to the first substrate 100 may also be equal to the distance from the second connection terminal 121 to the second substrate 200.

[0081] It should be noted that, see Figure 11 and Figure 12 The present application does not limit the specific shape of the prepared connecting wire 210. It can be a combination of one or more shapes such as rectangle, trapezoid, polygon or arc, as long as it can ensure electrical connection between the first connecting terminal 111 and the second connecting terminal 121 after pressing.

[0082] Furthermore, after step S300 of the present application, the second substrate 200 can be peeled off by continuing the peeling process, for example, by laser peeling technology, and then an encapsulation layer can be formed on the surface of the side of the light-emitting element 120, the driving circuit layer 110, the first connecting terminal 111 and the second connecting terminal 121 facing away from the first substrate 100 to protect the display panel. Of course, the encapsulation layer can be made of encapsulation glue, for example, organic OC glue. The organic OC glue can also fully flow into the gap between the film layers before curing and then be cured, which can make the structure of the display panel more reliable.

[0083] The present application also provides a display panel 10, see Figure 4 The display panel 10 includes a first substrate 100, a driving circuit layer 110, a light-emitting element 120, a connecting wire 210, and a second substrate 200. The driving circuit layer 110 and the light-emitting element 120 are arranged on a first side 100A of the first substrate 100. The driving circuit layer 110 has a first connecting terminal 111 facing away from the first substrate 100, and the light-emitting element 120 has a second connecting terminal 121 facing away from the first substrate 100. The light-emitting element 120 emits light toward the first substrate 100. The connecting wire 210 electrically connects the first connecting terminal 111 and the second connecting terminal 121, and the connecting wire 210 is soldered to the first connecting terminal 111 and the second connecting terminal 121. The second substrate 200 is arranged on the side of the connecting wire 210 facing away from the first substrate 100.

[0084] Specifically, the driving circuit layer 110 is electrically connected to the first connecting terminal 111, the light-emitting element 120 is electrically connected to the second connecting terminal 121, and the first connecting terminal 111 and the second connecting terminal 121 are electrically connected to the connecting wire by welding. Unlike the prior art, the problem of poor contact between the first connecting terminal 111 and the second connecting terminal 121 is avoided by directly depositing a metal wiring layer. At the same time, the second substrate 200 provided in the present application can be matched with the first substrate 100, so that the connecting wire 210 and the first connecting terminal 111 and the second connecting terminal 121 are press-welded to improve the electrical connection effect between the connecting wire 210 and the first connecting terminal 111 and the second connecting terminal 121, thereby improving the reliability of the display panel 10.

[0085] Of course, it should be noted that the structure of the display panel of this application is not limited to the drawings provided in this application. For example, Figure 5 , a schematic diagram of a structure in which the first connection terminal 111 does not contact the light-emitting element 120 is shown. Alternatively, in some other embodiments, the two first connection terminals 111 can be located on opposite sides of the light-emitting element 120, or on adjacent sides of the light-emitting element 120, etc., which are not listed one by one in this application.

[0086] In one embodiment, the second substrate 200 is a flexible substrate. The flexible substrate can provide better elasticity when the first substrate 100 and the second substrate 200 are welded, thereby improving the electrical connection effect between the connecting wire 210 and the first connecting terminal 111 and the second connecting terminal 121. Figure 4 The flexible substrate and the first substrate 100 are located on both sides of the light emitting element 120 and the driving circuit layer 110 to provide protection.

[0087] In one embodiment, the second substrate 200 is made of polydimethylsiloxane (PDMS). PDMS has good elasticity. The first substrate 100 is made of glass. Glass is a common rigid substrate in the display industry and provides excellent support.

[0088] Of course, in some other embodiments, the second substrate 200 may also be made of other flexible materials, and the first substrate 100 may also be made of other rigid materials.

[0089] In one embodiment, see Figure 3 and Figure 4 , the distance between the first connection terminal 111 and the first substrate 100 is different from the distance between the second connection terminal 121 and the second substrate 200 .

[0090] Specifically, due to the design size or process factors of the driving circuit layer 110 and the light-emitting element 120 themselves, or the design size or process factors of the first connecting terminal 111 and the second connecting terminal 121 themselves, the distance from the first connecting terminal 111 to the first substrate 100 is not equal to the distance from the second connecting terminal 121 to the second substrate 200.

[0091] In one embodiment, the connecting wire 210 includes a first routing segment 211 and a second routing segment 212 , wherein the second routing segment 212 is disposed on a side of the first routing segment 211 away from the second substrate 200 .

[0092] Specifically, the connecting wire 210 includes two layers of routing segments, which are electrically connected to the first routing segment 211 and the second routing segment 212. By forming a height difference that matches the relative distance between the first connecting terminal 111 and the second connecting terminal 121, the electrical connection effect between the connecting wire 210 and the first connecting terminal 111 and the second connecting terminal 121 can be improved.

[0093] In one embodiment, the first trace segment 211 and the second trace segment 212 are made of the same material.

[0094] Specifically, the first trace segment 211 and the second trace segment 212 are made of the same material, which can improve the efficiency of the layer preparation of the connecting wire 210 and avoid the problem of poor contact between different materials.

[0095] In one embodiment, the driving circuit layer 110 is provided with a through groove (not shown), and the light emitting element 120 is disposed in the through groove.

[0096] Specifically, the light emitting element 120 is embedded in the driving circuit layer 110 , so that the light emitted by the light emitting element 120 can be transmitted directly through the first substrate 100 without passing through other film layers, thereby improving the light extraction efficiency of the display panel 10 .

[0097] Of course, in some other embodiments, the light emitting element 120 may also be disposed on a side of the driving circuit layer 110 facing away from the first substrate 100 .

[0098] In one embodiment, see Figure 4 , the distance between the first connection terminal 111 and the first substrate 100 is smaller than the distance between the second connection terminal 121 and the second substrate 200 .

[0099] Specifically, in the prior art, the thickness of the driving circuit layer 110 can be made relatively thin, while the thickness of the light-emitting element 120 can be made relatively thick, which will indirectly cause the distance from the first connection terminal 111 to the first substrate 100 to be smaller than the distance from the second connection terminal 121 to the second substrate 200. This problem can be well solved by connecting the first routing segment 211 and the second routing segment 212 of the wire 210 in the above embodiment.

[0100] Of course, in some other embodiments, for example, see Figure 10 The distance between the first connection terminal 111 and the first substrate 100 may be greater than the distance between the second connection terminal 121 and the second substrate 200. Of course, in some other embodiments, the distance between the first connection terminal 111 and the first substrate 100 may also be equal to the distance between the second connection terminal 121 and the second substrate 200. Figure 11 and Figure 12 The present application does not limit the specific shape of the prepared connecting wire 210. It can be a combination of one or more shapes such as rectangle, trapezoid, polygon or arc, as long as it can ensure electrical connection between the first connecting terminal 111 and the second connecting terminal 121 after pressing.

[0101] Furthermore, the second substrate 200 in the display panel 10 of the present application may be retained or peeled off in subsequent manufacturing processes, and this application does not impose any restrictions. In one embodiment, the second substrate 200 is peeled off using a peeling process, and an encapsulation layer is provided on the surface of the light-emitting element 120, the driving circuit layer 110, the first connection terminal 111, and the second connection terminal 121 on the side facing away from the first substrate 100 to protect the display panel. Of course, the encapsulation layer can be made of an encapsulating adhesive, such as an organic OC adhesive. The organic OC adhesive can also be allowed to fully flow into the gaps between the film layers before curing and then be cured, which can make the structure of the display panel more reliable.

[0102] The display panel in this embodiment is prepared by using the preparation method in any of the above embodiments. The detailed preparation method can be found in the above related content and will not be described again here.

[0103] See also Figure 13 The present application also provides a display device 20, which includes the display panel 10 as in any of the above embodiments.

[0104] Specifically, the display device 20 can be any display device such as a notebook, a desktop computer, a tablet computer, a mobile phone, a smart watch, a virtual display terminal, etc., and is not limited here.

[0105] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for preparing a display panel, characterized in that: The method comprises: A driving circuit layer and a light-emitting element are prepared on a first side of a first substrate, wherein the driving circuit layer is provided with a first connecting terminal facing away from the first substrate, and the light-emitting element is provided with a second connecting terminal facing away from the first substrate, and the light-emitting element emits light toward the first substrate; preparing connecting wires on the first side of the second substrate; After the first side of the first substrate and the first side of the second substrate are arranged opposite to each other, the first substrate and the second substrate are pressed together so that the connecting wire is electrically connected to the first connecting terminal and the second connecting terminal.

2. The method according to claim 1, characterized in that The second substrate is a flexible substrate, and the step of preparing a connecting wire on one side of the second substrate includes: forming the second substrate on one side of the third substrate, wherein the third substrate is a rigid substrate; preparing the connecting wire on a side of the second substrate facing away from the third substrate; peeling the third substrate from the second substrate; Preferably, the material of the second substrate includes polydimethylsiloxane; Preferably, the material of the third substrate includes glass; Preferably, the first substrate is made of glass.

3. The method according to claim 1, characterized in that The step of preparing the connecting wires on the first side of the second substrate comprises: preparing the connecting wires on the first side of the second substrate by a printing process; Preferably, the material of the connecting wire includes indium tin oxide or silver.

4. The method according to claim 1, wherein The step of placing the first side of the first substrate and the first side of the second substrate opposite to each other and then pressing the first substrate and the second substrate together so that the connecting wire is electrically connected to the first connecting terminal and the second connecting terminal includes: After the first side of the first substrate and the first side of the second substrate are arranged opposite to each other, the first substrate and the second substrate are pre-pressed; The first substrate and the second substrate are pressed and simultaneously subjected to high-temperature reflow, so that the connecting wires are welded to the first connecting terminals and the second connecting terminals.

5. The method according to claim 1, wherein The distance between the first connecting terminal and the first substrate is different from the distance between the second connecting terminal and the second substrate, and the connecting wire includes a first routing segment and a second routing segment electrically connected, wherein the second routing segment is arranged on a side of the first routing segment away from the second substrate; Preferably, the first routing segment and the second routing segment are made of the same material; Preferably, the driving circuit layer is provided with a through groove, and the light emitting element is located in the through groove; Preferably, a distance from the first connecting terminal to the first substrate is smaller than a distance from the second connecting terminal to the second substrate.

6. A display panel, characterized in that: include: a first substrate; A driving circuit layer and a light-emitting element are provided on a first side of the first substrate, the driving circuit layer is provided with a first connecting terminal facing away from the first substrate, the light-emitting element is provided with a second connecting terminal facing away from the first substrate, and the light-emitting element emits light toward the first substrate; a connecting wire electrically connecting the first connecting terminal and the second connecting terminal, wherein the connecting wire is welded to the first connecting terminal and the second connecting terminal; The second substrate is arranged on a side of the connecting wire facing away from the first substrate.

7. The display panel according to claim 6, wherein: The second substrate is a flexible substrate; Preferably, the material of the second substrate includes polydimethylsiloxane; Preferably, the first substrate is made of glass.

8. The display panel according to claim 6, wherein: The distance between the first connecting terminal and the first substrate is different from the distance between the second connecting terminal and the second substrate; The connecting wire includes a first routing segment and a second routing segment electrically connected, wherein the second routing segment is arranged on a side of the first routing segment away from the second substrate; Preferably, the first routing segment and the second routing segment are made of the same material.

9. The display panel according to claim 8, wherein: The driving circuit layer is provided with a through groove, and the light emitting element is arranged in the through groove; Preferably, the distance from the first connecting terminal to the first substrate is smaller than the distance from the second connecting terminal to the second substrate.

10. A display device, characterized in that: Comprising the display panel according to any one of claims 6 to 9.

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