Display unit and display panel

Abstract

The invention discloses a display unit and a display panel. The display unit comprises a substrate, wherein at least two chip electrodes and at least one connecting electrode are arranged on the substrate; the at least two light-emitting LED chips are arranged on one side of the substrate, each light-emitting LED chip comprises a first electrode, at least two first light-emitting units and a second electrode, the first electrodes are arranged in a stacked mode, the first light-emitting units are arranged in a stacked mode, the first electrodes are arranged on the sides, close to the substrate, of the first light-emitting units, and the at least two first light-emitting units are connected in series; each first electrode is connected with one chip electrode; the common electrode is arranged on the side, away from the substrate, of the LED chip, and each second electrode and the corresponding connecting electrode are connected with the common electrode. The performance of the light-emitting LED chip can be improved. And meanwhile, the occupied area of the display unit can be reduced on the basis of ensuring the performance of the display unit. When the display unit is used for forming the display panel, the pixel density of the display panel can be improved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the technical field of display, and in particular, to a display unit and a display panel. Background Art

[0002] Light-emitting diodes (LEDs) are increasingly used in the display field. Small-sized Micro-LEDs, in particular, are becoming the preferred next-generation display technology due to their low power consumption, high integration, high display quality, and long lifespan. Compared to traditional low-voltage Micro-LEDs, high-voltage Micro-LED chips offer advantages such as simple and stable circuit design, low drive current, higher voltage conversion efficiency, and lower energy loss.

[0003] Conventional high-voltage Micro-LED chips consist of a large chip divided into multiple small light-emitting units connected in series. This makes the chip relatively large, hindering the development of small, high-voltage displays. Summary of the Invention

[0004] The present invention provides a display unit and a display panel, which can reduce the area of the display unit and improve the pixel density of the display panel.

[0005] In a first aspect, an embodiment of the present invention provides a display unit, including:

[0006] a substrate, on which at least two chip electrodes and at least one connecting electrode are provided;

[0007] At least two light-emitting LED chips are disposed on one side of the substrate, each of the light-emitting LED chips includes a stacked first electrode, at least two stacked first light-emitting units, and a second electrode, the first electrode is disposed on a side of the first light-emitting unit close to the substrate, and at least two of the first light-emitting units are connected in series; each of the first electrodes is connected to one of the chip electrodes;

[0008] A common electrode is provided on a side of the light-emitting LED chip away from the substrate, and each of the second electrodes and the connecting electrode is connected to the common electrode.

[0009] Optionally, the display unit further includes a conductive structure; the conductive structure is provided between the common electrode and the connecting electrode, and the common electrode is connected to the connecting electrode via the conductive structure.

[0010] Optionally, the display unit further comprises a connected LED chip;

[0011] The connecting LED chip is arranged between the connecting electrode and the common electrode. The connecting LED chip includes a stacked third electrode, at least two stacked second light-emitting units and a fourth electrode. The third electrode is arranged on a side of the second light-emitting unit close to the substrate, and at least two second light-emitting units are connected in series; the third electrode is connected to the connecting electrode, and the fourth electrode is connected to the common electrode.

[0012] Optionally, the conductive structure is arranged on one side of the connected LED chip; or, the connected LED chip has a through hole in the thickness direction of the substrate, the through hole at least passes through the second light-emitting unit, and the conductive structure is arranged in the through hole.

[0013] Optionally, the display unit further includes a first type semiconductor layer and a second type semiconductor layer stacked together; the first type semiconductor layer and the second type semiconductor layer are arranged between the connecting electrode and the common electrode, and the common electrode is connected to the connecting electrode through the first type semiconductor layer and the second type semiconductor layer.

[0014] Optionally, the sum of the thicknesses of the first type semiconductor layer and the second type semiconductor layer is equal to the thickness of the light-emitting LED chip, or the sum of the thicknesses of multiple first type semiconductor layers and second type semiconductor layers repeatedly stacked in sequence is equal to the thickness of the light-emitting LED chip.

[0015] Optionally, the light-emitting LED chip includes a transparent electrode, and in the same light-emitting LED chip, adjacent first light-emitting units are connected in series through the transparent electrode.

[0016] Optionally, in the same light-emitting LED chip, different first light-emitting units emit the same light color.

[0017] Optionally, the display unit further includes a protective layer; the protective layer is arranged around the light-emitting LED chip and exposes the connection between the light-emitting LED chip and the chip electrode and the common electrode.

[0018] In a second aspect, an embodiment of the present invention further provides a display panel, comprising the display unit described in the first aspect.

[0019] The technical solution of the embodiments of the present invention, by configuring each LED chip to include at least two first light-emitting units connected in series, allows the LED chip to be a high-voltage LED, thereby improving the performance of the LED chip. Furthermore, the at least two first light-emitting units in each LED chip are stacked, thereby reducing the area of the substrate occupied by the LED chip. This reduces the area occupied by the display unit while maintaining its performance. When the display unit is used to form a display panel, this helps increase the pixel density of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic structural diagram of a display unit provided by an embodiment of the present invention;

[0021] Figure 2 A schematic structural diagram of another display unit provided by an embodiment of the present invention;

[0022] Figure 3 A schematic structural diagram of a temporary substrate with a light-emitting LED chip is provided in an embodiment of the present invention;

[0023] Figure 4 A schematic structural diagram of a substrate provided in an embodiment of the present invention;

[0024] Figure 5 A schematic diagram of a structure for transferring a light-emitting LED chip onto a substrate provided by an embodiment of the present invention;

[0025] Figure 6 A schematic diagram of a structure for transferring two light-emitting LED chips onto a substrate provided by an embodiment of the present invention;

[0026] Figure 7 A schematic diagram of a structure of transferring three types of light-emitting LED chips onto a substrate provided by an embodiment of the present invention;

[0027] Figure 8 A schematic diagram of the structure of transferring three types of light-emitting LED chips on a substrate and connecting the LED chips provided by an embodiment of the present invention;

[0028] Figure 9 A schematic structural diagram of another display unit provided by an embodiment of the present invention;

[0029] Figure 10 A schematic structural diagram of a display panel provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0030] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0031] Figure 1 Schematic diagram of a display unit provided by an embodiment of the present invention. Figure 1 As shown, the display unit includes a substrate 110, on which at least two chip electrodes 111 and at least one connecting electrode 112 are provided; at least two light-emitting LED chips 120 are arranged on one side of the substrate 110, each light-emitting LED chip 120 includes a stacked first electrode 121, at least two stacked first light-emitting units 122 and a second electrode 123, the first electrode 121 is arranged on a side of the first light-emitting unit 122 close to the substrate 110, and at least two first light-emitting units 122 are connected in series; each first electrode 121 is connected to a chip electrode 111; a common electrode 130 is arranged on a side of the light-emitting LED chip 120 away from the substrate 110, and each second electrode 123 and the connecting electrode 112 are connected to the common electrode 130.

[0032] Specifically, chip electrodes 111 are provided on the substrate 110 . Each chip electrode 111 is connected to the first electrode 121 of a light-emitting LED chip 120 and is used to provide a driving signal to the first electrode 121 of the light-emitting LED chip 120 . Figure 1 The display unit exemplarily shows that it includes three light-emitting LED chips 120, each of which includes two stacked first light-emitting units 122. Three chip electrodes 111 are provided on the substrate 110. Each chip electrode 111 is connected to the first electrode 121 of a light-emitting LED chip 120 and is used to provide a driving signal to the first electrode 121 of the light-emitting LED chip 120. The first electrode 121 can be the anode of the light-emitting LED chip 120, in which case the second electrode 123 is the cathode of the light-emitting LED chip 120. The first electrode 121 can also be the cathode of the light-emitting LED chip 120, in which case the second electrode 123 is the anode of the light-emitting LED chip 120.

[0033] The common electrode 130 is arranged on the side of the light-emitting LED chip 120 away from the substrate 110, and the common electrode 130 is connected to the second electrode 123 of each light-emitting LED chip 120. At the same time, the common electrode 130 is connected to the connecting electrode 112, so that the connecting electrode 112 can be simultaneously connected to the second electrodes 123 of at least two light-emitting LED chips 120 through the common electrode 130, so that the same driving signal can be provided to the second electrodes 123 of at least two light-emitting LED chips 120 at the same time through the connecting electrode 112, thereby realizing the common electrode connection of different light-emitting LED chips 120, which is conducive to improving the consistency of the electrode arrangement and simplifying the electrode preparation process. Moreover, the transparency of the material of the common electrode 130 is very high to ensure the light output rate of the display unit. For example, when the first electrode 121 is the anode of the light-emitting LED chip 120, the second electrode 123 is the cathode of the light-emitting LED chip 120, and at this time, at least two light-emitting LED chips 120 can achieve a common cathode connection. When the first electrode 121 is the cathode of the light-emitting LED chip 120, and the second electrode 123 is the anode of the light-emitting LED chip 120, at least two light-emitting LED chips 120 can be connected to a common anode. In addition, the chip electrode 111 and the connecting electrode 112 on the substrate 110 can be made of the same material, for example, an alloy material. The thickness of the chip electrode 111 and the connecting electrode 112 can also be the same, which is not limited here. When the chip electrode 111 and the connecting electrode 112 are made of the same material, the chip electrode 111 and the connecting electrode 112 can be formed in the same process.

[0034] Each light-emitting LED chip 120 includes at least two stacked first light-emitting units 122. The first light-emitting units 122 may be micro-LEDs. Exemplarily, the first light-emitting units 122 may include a stacked P-type semiconductor layer, a light-emitting layer, and an N-type semiconductor layer. The P-type semiconductor layer is disposed on the side of the light-emitting layer close to the substrate 110. In this case, the electrode of the first light-emitting unit 122 close to the substrate 110 serves as the anode. The first electrode 121 of the light-emitting LED chip 120 serves as the anode, and the second electrode 123 serves as the cathode. Alternatively, the N-type semiconductor layer is disposed on the side of the light-emitting layer close to the substrate 110. In this case, the electrode of the first light-emitting unit 122 close to the substrate 110 serves as the cathode. The first electrode 121 of the light-emitting LED chip 120 serves as the cathode, and the second electrode 123 serves as the anode. Furthermore, different light-emitting LED chips 120 may emit different colors. By configuring the display unit to include at least two light-emitting LED chips 120, the display unit can achieve color display. For example, the display unit may include three LED chips 120, which may be a red LED chip, a green LED chip, and a blue LED chip. The film layer structure of the LED chips of different colors can be the same, but the difference lies in the different materials of the light-emitting layer, so that the LED chips of different colors can emit different colors of light.

[0035] By configuring each LED chip 120 to include at least two first light-emitting units 122 connected in series, the LED chip 120 can be configured as a high-voltage LED, thereby improving the performance of the LED chip 120. For example, the brightness of the LED chip 120 can be increased, the driving current of the LED chip 120 can be reduced, the voltage conversion efficiency of the LED chip 120 can be improved, and the energy loss of the LED chip 120 can be reduced. Moreover, the at least two first light-emitting units 122 in each LED chip 120 are stacked, thereby reducing the area occupied by the LED chip 120 on the substrate 110. This can reduce the area occupied by the display unit while maintaining its performance. When the display unit is used to form a display panel, this can help increase the pixel density of the display panel.

[0036] The technical solution of this embodiment, by configuring each LED chip to include at least two first light-emitting units connected in series, allows the LED chip to be a high-voltage LED, thereby improving the performance of the LED chip 120. Furthermore, the at least two first light-emitting units in each LED chip are stacked, thereby reducing the area of the substrate occupied by the LED chip. This reduces the area occupied by the display unit while maintaining its performance. When the display unit is used to form a display panel, this helps increase the pixel density of the display panel.

[0037] It should be noted that, in other embodiments, the light-emitting LED chip 120 may further include a transparent electrode layer, which is arranged on the side of the first light-emitting unit 122 close to the substrate 110. The first light-emitting unit 122 may be connected to the first electrode 121 through the transparent electrode layer to improve the current expansion capability of the first light-emitting unit 122. Exemplarily, the first light-emitting LED unit 122 includes a stacked P-type semiconductor layer, a light-emitting layer, and an N-type semiconductor layer. The P-type semiconductor layer is arranged on the side of the light-emitting layer close to the substrate 110. The material of the transparent electrode layer is, for example, indium tin oxide (ITO). By arranging ITO on the side of the P-type semiconductor layer close to the first electrode 121, the current expansion capability of the P-type semiconductor layer can be improved. In other embodiments, each light-emitting LED chip 120 may further include a plurality of stacked first light-emitting units 122. Exemplarily, Figure 2 FIG. 1 is a schematic diagram of another display unit provided by an embodiment of the present invention. Figure 2 As shown, the LED chip 120 includes three stacked first light-emitting units 122, which are connected in series. By configuring the LED chip 120 to include multiple first light-emitting units 122 connected in series, the voltage of the LED chip 120 can be further increased, thereby further improving the performance of the LED chip 120. Furthermore, while improving the performance of the LED chip 120, the area occupied by the LED chip 120 can be avoided. When the display unit is used to form a display panel, this can improve the pixel density of the display panel while improving its performance.

[0038] Continue to refer Figure 2 The display unit further includes a conductive structure 140 ; the conductive structure 140 is disposed between the common electrode 130 and the connecting electrode 112 , and the common electrode 130 is connected to the connecting electrode 112 through the conductive structure 140 .

[0039] Specifically, such as Figure 2As shown, a light-emitting LED chip 120 is arranged between the common electrode 130 and the chip electrode 111. The chip electrode 111 and the connecting electrode 112 are both arranged on the substrate 110, so that there is a certain height difference between the common electrode 130 and the connecting electrode 112. The conductive structure 140 has conductive properties. By arranging the conductive structure 140 between the common electrode 130 and the connecting electrode 112, and the common electrode 130 is connected to the connecting electrode 112 through the conductive structure 140, the conductive structure 140 can support the common electrode 130, thereby improving the structural stability of the common electrode 130, and further improving the structural stability of the display unit. Exemplarily, the material of the conductive structure 140 can be metal, and by arranging the conductive structure 140 between the common electrode 130 and the connecting electrode 112, the connection between the common electrode 130 and the connecting electrode 112 can be directly achieved.

[0040] For example, continue to refer to Figure 2 The display unit also includes a connecting LED chip 150; the connecting LED chip 150 is arranged between the connecting electrode 112 and the common electrode 130, and the connecting LED chip 150 includes a stacked third electrode 151, at least two stacked second light-emitting units 152 and a fourth electrode 153, the third electrode 151 is arranged on the side of the second light-emitting unit 152 close to the substrate 110, and at least two second light-emitting units 152 are connected in series; the third electrode 151 is connected to the connecting electrode 112, and the fourth electrode 153 is connected to the common electrode 130.

[0041] Specifically, the structure of the connecting LED chip 150 can be the same as that of the light-emitting LED chip 120, so that the connecting LED chip 150 can fill the height difference between the common electrode 130 and the connecting electrode 112, thereby better supporting the common electrode 130. Moreover, when the connecting LED chip 150 has the same structure as the light-emitting LED chip 120, the connecting LED chip 150 can be manufactured at the same time as the light-emitting LED chip 120, which can avoid adding additional display unit manufacturing processes and help simplify the display unit manufacturing process. In addition, the third electrode 151 is connected to the connecting electrode 112, and the fourth electrode 153 is connected to the common electrode 130. At the same time, the common electrode 130 is connected to the connecting electrode 112 through the conductive structure 140, so that the third electrode 151 and the fourth electrode 153 are short-circuited, thereby preventing the connecting LED chip 150 from emitting light, so that the light-emitting state of the display unit is determined according to the light-emitting state of at least two light-emitting LED chips 120, and the light-emitting reliability of the display unit is ensured. At the same time, the electrode preparation process of the display unit is simplified and the electrode reliability is improved.

[0042] For example, Figure 2As shown, the third electrode 151 connecting the LED chip 150 is provided in the same layer as the first electrode 121 of the light-emitting LED chip 120, and the materials of the two can be the same. The fourth electrode 153 connecting the LED chip 150 is provided in the same layer as the second electrode 123 of the light-emitting LED chip 120, and the materials of the two can be the same. The number of second light-emitting units 152 is the same as the number of first light-emitting units 122. For example, when the light-emitting LED chip 120 includes three stacked first light-emitting units 122, the connecting LED chip 150 also includes three stacked second light-emitting units 152. The film structure of the second light-emitting unit 152 is the same as the film structure of the first light-emitting unit 122, so that the structure of the connecting LED chip 150 is the same as the structure of the light-emitting LED chip 120. When the light-emitting LED chip 120 includes a transparent electrode layer, the connecting LED chip 150 also includes a transparent electrode layer.

[0043] When different LED chips 120 emit different colors, the color emitted by the connected LED chip 150 can be the same as the color emitted by any of the LED chips 120. For example, if the display unit includes three LED chips 120, and the three LED chips 120 emit red, green, and blue colors, respectively, the color emitted by the connected LED chip 150 can be red, green, or blue. Furthermore, the colors emitted by at least two stacked second light-emitting units 152 in the connected LED chips 150 can be the same or different, without limitation herein.

[0044] On the basis of the above technical solutions, when the display unit includes three light-emitting LED chips 120, each light-emitting LED chip 120 includes three stacked first light-emitting units 122, and the light-emitting colors of the three light-emitting LED chips 120 are red, green and blue respectively. At the same time, the display unit includes a connecting LED chip 150. When making the display unit, the light-emitting LED chip 120 and the connecting LED chip 150 can be first placed on a temporary substrate, and then the light-emitting LED chip 120 and the connecting LED chip 150 can be transferred to the substrate 110 by a mass transfer method to form a display unit. For example, Figure 3 The present invention provides a schematic structural diagram of a temporary substrate with a light-emitting LED chip. Figure 3 As shown, Figure 3The figure exemplarily shows that three light-emitting LED chips 120 are arranged on a temporary substrate 101. Each light-emitting LED chip 120 includes three stacked first light-emitting units 122, and each light-emitting LED chip 120 emits the same color. For example, the three light-emitting LED chips 120 all emit red light. The three first light-emitting units 122 are connected in series to form a high-voltage light-emitting LED chip. Each first light-emitting unit 122 includes a P-type semiconductor layer 1221, a light-emitting layer 1222, and an N-type semiconductor layer 1223 stacked in sequence. The first light-emitting unit 122 away from the temporary substrate 101 also has a transparent electrode layer 1224 and a first electrode 121 arranged in sequence on the side away from the temporary substrate 101. Similarly, in the process of manufacturing a display unit, another temporary substrate with a green light-emitting LED chip, another temporary substrate with a red light-emitting LED chip, and another temporary substrate with a connecting LED chip can also be manufactured.

[0045] In addition, during the process of manufacturing the display unit, chip electrodes 111 and connecting electrodes 112 may be formed on the substrate 110. The number of chip electrodes 111 corresponds to the number of light-emitting LED chips 120. For example, Figure 4 A schematic structural diagram of a substrate provided in an embodiment of the present invention. Figure 4 As shown, when the display unit includes three light-emitting LED chips 120, three chip electrodes 111 and one connecting electrode 112 are provided on the substrate 110. Figure 4 A protective structure 113 is provided around the chip electrode 111 and the connecting electrode 112. The protective structure 113 has insulating properties and is used to protect the chip electrode 111 and the connecting electrode 112 while reducing the probability of short circuits between different electrodes. For example, the material of the protective structure 113 can be silicon oxide.

[0046] After forming each light-emitting LED chip 120 and the connecting LED chip 150, the light-emitting LED chip 120 and the connecting LED chip 150 can be transferred to the substrate 110 by a mass transfer method to form a display unit. Figure 5 This is a schematic diagram of a structure for transferring a light-emitting LED chip onto a substrate provided by an embodiment of the present invention. Figure 6 This is a schematic diagram of a structure of transferring two light-emitting LED chips onto a substrate provided by an embodiment of the present invention. Figure 7 This is a schematic diagram of a structure of transferring three types of light-emitting LED chips onto a substrate provided by an embodiment of the present invention. Figure 8 This is a schematic diagram of the structure of transferring three types of light-emitting LED chips on a substrate and connecting the LED chips provided by an embodiment of the present invention. Figures 5 to 8As shown, a mass transfer method can be used to first transfer LED chips 120 of the same color onto corresponding chip electrodes 111 on substrate 110. Then, a mass transfer method can be used to transfer LED chips 120 of a different color onto corresponding chip electrodes 111 on substrate 110. Similarly, a mass transfer method can be used to transfer LED chips 120 of a different color onto corresponding chip electrodes 111 on substrate 110 until all LED chips 120 are transferred onto substrate 110. Then, a mass transfer method can be used to transfer connecting LED chips 150 onto corresponding connecting electrodes 112 on substrate 110. A common electrode 130 is then formed on the side of the LED chips 120 and connecting LED chips 150 away from substrate 110. The common electrode 130 is connected to the second electrode 123 of the LED chips 120 and to the fourth electrode 153 of the connecting LED chips 150, thereby connecting substrate 110 to the LED chips 120.

[0047] It should be noted that when using the mass transfer method to transfer the light-emitting LED chips 120 and the connecting LED chips 150 to the corresponding electrodes on the substrate 110, the order of transferring the light-emitting LED chips 120 and the connecting LED chips 150 is not limited. For example, the light-emitting LED chips 120 can be transferred first, or the connecting LED chips 150 can be transferred first. When transferring the light-emitting LED chips 120, light-emitting LED chips 120 of any color can be transferred first, without limitation.

[0048] On the basis of the above technical solutions, continue to refer to Figures 1 to 8 , the conductive structure 140 is arranged on one side of the LED chip 150; or, the LED chip 150 is connected to a through hole in the thickness direction of the substrate 110, the through hole at least passes through the second light-emitting unit 152, and the conductive structure 140 is arranged in the through hole.

[0049] Specifically, Figures 1 to 8 The figure exemplarily shows that the conductive structure 140 is arranged on the side connected to the LED chip 150. At this time, the conductive structure 140 can extend along the side wall connected to the LED chip 150 and be connected to the third electrode 151 and the fourth electrode 153 respectively. At the same time, the third electrode 151 is connected to the connecting electrode 112, and the fourth electrode 153 is connected to the common electrode 130, so that the common electrode 130 can be connected to the connecting electrode 112 through the fourth electrode 153, the conductive structure 140 and the third electrode 151.

[0050] Alternatively, in other embodiments, a through hole may be provided in the thickness direction X of the substrate 110 for connecting the LED chip 150, with the through hole penetrating at least the second light-emitting unit 152. When the conductive structure 140 is disposed within the through hole, the conductive structure 140 may connect the common electrode 130 and the connecting electrode 112 via the through hole. For example, when the through hole only penetrates the second light-emitting unit 152, the ends of the through hole contact the third electrode 151 and the fourth electrode 153. When the conductive structure 140 is disposed within the through hole, the conductive structure 140 may contact the third electrode 151 and the fourth electrode 153, respectively, thereby achieving a connection between the common electrode 130 and the connecting electrode 112 via the third electrode 151 and the fourth electrode 153. When the through hole simultaneously penetrates the entirety of the connecting LED chip 150, the ends of the through hole contact the connecting electrode 112 and the common electrode 130. When the conductive structure 140 is disposed within the through hole, the common electrode 130 and the connecting electrode 112 can be connected via the conductive structure 140.

[0051] On the basis of the above technical solutions, continue to refer to Figures 1 to 8 The light-emitting LED chip 120 includes a transparent electrode 124 . In the same light-emitting LED chip 120 , adjacent first light-emitting units 122 are connected in series through the transparent electrode 124 .

[0052] Specifically, the transparent electrodes 124 are disposed between adjacent first light-emitting units 122 to achieve a series connection of adjacent first light-emitting units 122. Furthermore, the transparent electrodes 124 have a high degree of transparency, thereby avoiding affecting the light extraction efficiency of the first light-emitting units 122 near the substrate 110 and ensuring the brightness of the display panel.

[0053] It should be noted that when the light-emitting LED chip 120 includes a transparent electrode 124, the connecting LED chip 150 can also include a transparent electrode and be arranged between adjacent second light-emitting units 152 to ensure that the structure of the connecting LED chip 150 is the same as that of the light-emitting LED chip 120, so that the thickness of the connecting LED chip 150 can be made as the same as that of the light-emitting LED chip 120 as possible, thereby improving the reliability of the connecting LED chip 150 supporting the common electrode 130, thereby ensuring the structural stability of the display unit.

[0054] On the basis of the above technical solutions, in the same light-emitting LED chip, different first light-emitting units emit the same light-emitting color.

[0055] Specifically, within the same LED chip, different first light-emitting units can emit the same color, making the LED chip a pure-color LED chip and improving the brightness of the LED chip. By providing at least two LED chips within the display unit, the color of the LED chips can be set to different colors as needed, facilitating control of the color of the display unit. For example, when a color display is required, the display unit can be configured to include three LED chips, each emitting red, green, and blue, respectively.

[0056] On the basis of the above technical solutions, continue to refer to Figures 1 to 8 The display unit further includes a protective layer 160 ; the protective layer 160 is arranged around the light-emitting LED chip 120 and exposes the connection between the light-emitting LED chip 120 and the chip electrode 111 and the common electrode 130 .

[0057] Specifically, the material of protective layer 160 can be silicon oxide. Providing protective layer 160 around LED chips 120 protects them. Protective layer 160 also has insulating properties, reducing the probability of short circuits between different LED chips 120, thereby improving the reliability of the display unit.

[0058] Figure 9 FIG. 1 is a schematic diagram of another display unit provided by an embodiment of the present invention. Figure 9 As shown, the display unit also includes a first type semiconductor layer 170 and a second type semiconductor layer 180 that are stacked; the first type semiconductor layer 170 and the second type semiconductor layer 180 are arranged between the connecting electrode 112 and the common electrode 130, and the common electrode 130 is connected to the connecting electrode 112 through the first type semiconductor layer 170 and the second type semiconductor layer 180.

[0059] Specifically, the first-type semiconductor layer 170 and the second-type semiconductor layer 180 can be different types of semiconductor layers. For example, when the first-type semiconductor layer 170 is a P-type semiconductor layer, the second-type semiconductor layer 180 is an N-type semiconductor layer. When the first-type semiconductor layer 170 is an N-type semiconductor layer, the second-type semiconductor layer 180 is a P-type semiconductor layer. The first-type semiconductor layer 170 and the second-type semiconductor layer 180 are disposed adjacent to each other to form a PN junction, allowing the common electrode 130 to be connected to the connecting electrode 112 via the PN junction, thereby achieving a common-electrode connection of the light-emitting LED chip 120. Furthermore, the connection of the common electrode 130 to the connecting electrode 112 via the PN junction avoids the need for an additional conductive structure, thereby improving the connection reliability between the common electrode 130 and the connecting electrode 112. Furthermore, the PN junction is a unidirectional conductive structure that effectively prevents reverse electrode connection and avoids leakage caused by reverse current flow. Exemplarily, when the first-type semiconductor layer 170 is arranged on the side of the second-type semiconductor layer 180 close to the connecting electrode 112, the first electrode 121 of the light-emitting LED chip 120 is an anode and the second electrode 123 is a cathode, the common electrode 130 provides a low level for the second electrode 123. At this time, the first-type semiconductor layer 170 can be set as a P-type semiconductor layer, and the second-type semiconductor layer 180 can be set as an N-type semiconductor layer, so that the conduction direction of the PN junction formed by the first-type semiconductor layer 170 and the second-type semiconductor layer 180 is in the direction of the connecting electrode 112 pointing to the common electrode 130, thereby realizing the connection between the connecting electrode 112 and the common electrode 130. When the first-type semiconductor layer 170 is disposed on a side of the second-type semiconductor layer 180 close to the connecting electrode 112, the first electrode 121 of the light-emitting LED chip 120 serves as a cathode and the second electrode 123 serves as an anode, and the common electrode 130 provides a high voltage level to the second electrode 123, the first-type semiconductor layer 170 can be an N-type semiconductor layer and the second-type semiconductor layer 180 can be a P-type semiconductor layer. This allows the PN junction formed by the first-type semiconductor layer 170 and the second-type semiconductor layer 180 to conduct in the direction from the common electrode 130 to the connecting electrode 112, thereby achieving a connection between the connecting electrode 112 and the common electrode 130. Alternatively, in other embodiments, the first-type semiconductor layer 170 can be disposed on a side of the second-type semiconductor layer 180 away from the connecting electrode 112, and the types of the first-type semiconductor layer 170 and the second-type semiconductor layer 180 need only be determined based on the types of the first electrode 121 and the second electrode 123.

[0060] It should be noted that the first type semiconductor layer 170 and the second type semiconductor layer 180 can be prepared simultaneously with the light-emitting LED chip 120, without the need for additional connection processes of the common electrode 130 and the connection electrode 112, which is conducive to simplifying the manufacturing process of the display unit. Figure 9The display unit is exemplarily shown as including a first-type semiconductor layer 170 and a second-type semiconductor layer 180. In other embodiments, the display unit may include multiple layers of the first-type semiconductor layer 170 and the second-type semiconductor layer 180. The multiple layers of the first-type semiconductor layer 170 and the multiple layers of the second-type semiconductor layer 180 may be arranged alternately with the first-type semiconductor layer 170 and the second-type semiconductor layer 180 to form multiple PN junctions, with the multiple PN junctions having the same conduction direction. When the multiple PN junctions are conductive, the connection between the connecting electrode 112 and the common electrode 130 can be achieved.

[0061] Continue to refer Figure 9 The sum of the thicknesses of the first type semiconductor layer 170 and the second type semiconductor layer 180 is equal to the thickness of the light-emitting LED chip 120, or the sum of the thicknesses of multiple first type semiconductor layers and second type semiconductor layers repeatedly stacked in sequence is equal to the thickness of the light-emitting LED chip.

[0062] Specifically, when the thicknesses of the chip electrode 111 and the connecting electrode 112 are equal, the height difference between the common electrode 130 and the connecting electrode 112 is the thickness of the light-emitting LED chip 120. By setting the sum of the thicknesses of the first-type semiconductor layer 170 and the second-type semiconductor layer 180 to be equal to the thickness of the light-emitting LED chip 120, the first-type semiconductor layer 170 and the second-type semiconductor layer 180 can just fill the height difference between the common electrode 130 and the connecting electrode 112, thereby improving the stability of the first-type semiconductor layer 170 and the second-type semiconductor layer 180 in supporting the common electrode 130, and further improving the structural stability of the display unit.

[0063] When the display unit includes multiple layers of first-type semiconductor layers 170 and multiple layers of second-type semiconductor layers 180, the multiple layers of first-type semiconductor layers 170 and the multiple layers of second-type semiconductor layers 180 can be arranged alternately with the first-type semiconductor layers 170 and the second-type semiconductor layers 180 to form a plurality of first-type semiconductor layers 170 and second-type semiconductor layers 180 repeatedly stacked in sequence to form a plurality of PN junctions. In this case, the sum of the thicknesses of the multiple repeatedly stacked first-type semiconductor layers 170 and second-type semiconductor layers 180 can be set to be equal to the thickness of the light-emitting LED chip 120. This can ensure that the multiple repeatedly stacked first-type semiconductor layers 170 and second-type semiconductor layers 180 exactly fill the height difference between the common electrode 130 and the connecting electrode 112, thereby improving the stability of the multiple repeatedly stacked first-type semiconductor layers 170 and second-type semiconductor layers 180 supporting the common electrode 130, thereby improving the structural stability of the display unit.

[0064] It should be noted that, in other embodiments, the thicknesses of the chip electrode 111 and the connecting electrode 112 can be set to be unequal. In this case, the sum of the thicknesses of the first type semiconductor layer 170 and the second type semiconductor layer 180 can be adjusted according to the height difference between the common electrode 130 and the connecting electrode 112 to ensure the support stability of the common electrode 130. This is not limited here.

[0065] An embodiment of the present invention further provides a display panel. Figure 10 Schematic diagram of the structure of a display panel provided by an embodiment of the present invention. Figure 10 As shown, the display panel 100 includes the display unit 10 provided by any embodiment of the present invention.

[0066] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display unit, characterized in that: include: a substrate, on which at least two chip electrodes and at least one connecting electrode are provided; At least two light-emitting LED chips are disposed on one side of the substrate, each of the light-emitting LED chips includes a stacked first electrode, at least two stacked first light-emitting units, and a second electrode, the first electrode is disposed on a side of the first light-emitting unit close to the substrate, and at least two of the first light-emitting units are connected in series; each of the first electrodes is connected to one of the chip electrodes; A common electrode is provided on a side of the light-emitting LED chip away from the substrate, and each of the second electrodes and the connecting electrode is connected to the common electrode.

2. The display unit according to claim 1, wherein It also includes a conductive structure; the conductive structure is arranged between the common electrode and the connecting electrode, and the common electrode is connected to the connecting electrode through the conductive structure.

3. The display unit according to claim 2, wherein It also includes connecting LED chips; The connecting LED chip is arranged between the connecting electrode and the common electrode. The connecting LED chip includes a stacked third electrode, at least two stacked second light-emitting units and a fourth electrode. The third electrode is arranged on a side of the second light-emitting unit close to the substrate, and at least two second light-emitting units are connected in series; the third electrode is connected to the connecting electrode, and the fourth electrode is connected to the common electrode.

4. The display unit according to claim 3, characterized in that The conductive structure is arranged on one side of the connected LED chip; or, the connected LED chip has a through hole in the thickness direction of the substrate, the through hole at least passes through the second light-emitting unit, and the conductive structure is arranged in the through hole.

5. The display unit according to claim 1, wherein It also includes a first type semiconductor layer and a second type semiconductor layer stacked together; the first type semiconductor layer and the second type semiconductor layer are arranged between the connecting electrode and the common electrode, and the common electrode is connected to the connecting electrode through the first type semiconductor layer and the second type semiconductor layer. The display unit according to claim 5 , wherein: The sum of the thicknesses of the first type semiconductor layer and the second type semiconductor layer is equal to the thickness of the light-emitting LED chip, or the sum of the thicknesses of multiple first type semiconductor layers and second type semiconductor layers repeatedly stacked in sequence is equal to the thickness of the light-emitting LED chip.

7. The display unit according to any one of claims 1 to 6, characterized in that: The light-emitting LED chip includes a transparent electrode. In the same light-emitting LED chip, adjacent first light-emitting units are connected in series through the transparent electrode.

8. The display unit according to any one of claims 1 to 6, characterized in that: In the same light-emitting LED chip, different first light-emitting units emit light of the same color.

9. The display unit according to any one of claims 1 to 6, characterized in that: It also includes a protective layer; the protective layer is arranged around the light-emitting LED chip and exposes the connection between the light-emitting LED chip, the chip electrode and the common electrode.

10. A display panel, characterized in that: The display unit comprises the display unit according to any one of claims 1 to 9.

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