Display panel, manufacturing method thereof and display device

Abstract

The invention relates to the technical field of display, and discloses a display panel and a manufacturing method thereof and a display device.The display panel comprises a substrate, a driving array layer, a plurality of light-emitting devices, a plurality of transparent retaining walls and a plurality of first shading parts, and the transparent retaining walls are located between every two adjacent light-emitting devices in the direction parallel to the plane where the substrate is located; the first shading part is located between two adjacent transparent retaining walls, and at least part of the first shading part is arranged between the side walls of the transparent retaining walls and the side wall of the light-emitting device; the orthographic projection of the first shading part on the substrate covers the orthographic projection of the light-emitting device on the substrate; in the direction perpendicular to the plane where the substrate is located, the light-emitting device comprises a first face and a second face which are opposite, and the first face is located on the side, away from the substrate, of the second face. The first shading part comprises an opening which at least exposes part of the first surface of the light-emitting device. The manufacturing method is used for manufacturing the display panel. The display device comprises the display panel. The display effect can be improved, and the light emitting efficiency is guaranteed.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Micro-LED (micro-light emitting diode) display technology uses micron-sized LEDs as light-emitting pixel units, assembling them with driver modules to form a high-density display array. Compared with current mainstream display technologies such as liquid crystal display (LCD) and organic light-emitting diode (OLED), micro-LEDs have significant advantages in brightness, resolution, energy consumption, lifespan, response speed, and thermal stability. Therefore, micro-LED and mini-LED display panels have broad application prospects. However, the light output efficiency and display quality of current micro-LED display devices need to be further improved.

[0003] How to further improve the display effect of existing micro LED display devices and ensure light extraction efficiency is a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Invention

[0004] In order to solve the above technical problems, the present disclosure provides a display panel and a manufacturing method thereof, and a display device to solve the problems in the prior art that the display effect of micro LED display devices needs to be further improved and the light extraction efficiency is low.

[0005] The present disclosure provides a display panel, comprising:

[0006] substrate;

[0007] A driving array layer, located on one side of the substrate;

[0008] A plurality of light-emitting devices, a plurality of transparent blocking walls, and a plurality of first light-shielding portions, wherein the light-emitting devices, the transparent blocking walls, and the first light-shielding portions are all located on a side of the driving array layer away from the substrate;

[0009] Along a direction parallel to the plane where the substrate is located, the transparent blocking wall is located between two adjacent light-emitting devices, the first light-shielding portion is located between the two adjacent transparent blocking walls, and at least a portion of the first light-shielding portion is included between the sidewall of the transparent blocking wall and the sidewall of the light-emitting device;

[0010] The orthographic projection of the first light shielding portion on the substrate covers the orthographic projection of the light emitting device on the substrate;

[0011] In a direction perpendicular to the plane where the substrate is located, the light emitting device includes a first surface and a second surface opposite to each other, and the first surface is located on a side of the second surface away from the substrate;

[0012] The first light shielding portion includes an opening, and the opening exposes at least a portion of the first surface of the light emitting device.

[0013] Based on the same inventive concept, the present disclosure further provides a method for manufacturing a display panel, which is used to manufacture the above-mentioned display panel; the manufacturing method comprises:

[0014] Providing an array substrate, the array substrate comprising a substrate and a driving array layer located on one side of the substrate;

[0015] Providing a plurality of light-emitting devices, the light-emitting devices are bound and electrically connected to the driving array layer;

[0016] A transparent cover layer is fabricated, and the transparent cover layer is exposed and developed to pattern the transparent cover layer, so that the transparent cover layer forms a plurality of transparent barrier walls; the transparent barrier walls are located between two adjacent light-emitting devices along a direction parallel to the plane of the substrate, and a space is formed between the sidewalls of the transparent barrier walls and the sidewalls of the light-emitting devices;

[0017] A light-shielding layer is manufactured, and the patterned light-shielding layer is exposed and developed so that the light-shielding layer forms a plurality of first light-shielding portions; along a direction parallel to the plane where the substrate is located, the first light-shielding portion is located between two adjacent transparent blocking walls, and at least a portion of the first light-shielding portion is filled in the gap; the first light-shielding portion includes an opening, and the opening at least exposes a portion of the first surface of the light-emitting device; wherein, in a direction perpendicular to the plane where the substrate is located, the light-emitting device includes a first surface and a second surface opposite to each other, and the first surface is located on the side of the second surface away from the substrate.

[0018] Based on the same inventive concept, the present disclosure also provides a display device, which includes the above-mentioned display panel.

[0019] The technical solution provided by the embodiments of the present disclosure has the following advantages over the prior art:

[0020] The display panel provided by the present disclosure includes a substrate, a driving array layer, a plurality of light-emitting devices, a plurality of transparent baffles, a plurality of first light-shielding portions, and other structures. A transparent baffle is provided between two adjacent light-emitting devices in a direction parallel to the plane where the substrate is located. The transparent baffle separates the two adjacent light-emitting devices, and the side walls of the transparent baffle do not make any contact with the side walls of the light-emitting devices, and there is a gap between the two. A portion of the first light-shielding portion is provided in the gap between the side walls of the transparent baffle and the side walls of the light-emitting devices. At least a portion of the first light-shielding portion is in contact with both the side walls of the light-emitting devices and the side walls of the transparent baffle. The first light-shielding portion is filled in the area where the light-emitting devices are located and which is surrounded by the transparent baffle. In order to ensure the light-emitting effect of the first surface of the light-emitting device and also to ensure the light-emitting effect of the light-emitting surface of the display panel, the first light-shielding portion is further provided with an opening, which at least exposes a portion of the first surface of the light-emitting device, so that the light emitted from the first surface of the light-emitting device can be better emitted from the light-emitting surface of the display panel, thereby ensuring the light-emitting display effect of the display panel. A partial first light-shielding portion is provided between the side wall of the light-emitting device disclosed herein and the side wall of the transparent blocking wall. When a mask is used to form an opening of the first light-shielding portion on the first surface of the light-emitting device, the first surface of the top of the light-emitting device can be shielded by the mask, and the remaining areas are exposed by the mask. The light-shielding material in the area other than the first surface of the top of the light-emitting device can be solidified. Since the sides of the light-emitting device are shielded by the first light-shielding portion of the light-shielding material, no light leakage in all directions will pass through the inside of the light-transmitting light-emitting device to illuminate the position of the top of the light-emitting device shielded by the mask. The light-shielding material at the position of the first surface of the top of the light-emitting device shielded by the mask can be completely dissolved and disappear. Therefore, the present disclosure provides a portion of the first light shielding portion between the sidewall of the light-emitting device and the sidewall of the transparent baffle, thereby preventing the light-transmitting light-emitting device from interfering with the exposure process and ensuring that the light-shielding material on the first surface of the top of the light-emitting device does not remain solidified. During the development process, the light-shielding material on the top of the light-emitting device can be completely removed, forming a completely light-transmitting, hollow opening of the first light shielding portion. No solidified light-shielding material remains in the opening area of the first light shielding portion, thereby effectively increasing the amount of light emitted from the first surface of the light-emitting device and ensuring the light extraction efficiency of the display panel. At least a portion of the first light shielding portion is provided between the sidewall of the transparent baffle and the sidewall of the light-emitting device, thereby blocking ambient light incident from the side of the light-emitting device, reducing the impact of ambient light on the thin-film transistors in the drive array layer, and reducing the reflection of ambient light by the display panel, thereby reducing the surface reflectivity of the display panel. Furthermore, it can avoid color crosstalk between adjacent light-emitting devices, thereby improving the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0022] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 This is a film layer structure diagram of a display panel in the prior art;

[0024] Figure 2 This is another film layer structure diagram of a display panel in the prior art;

[0025] Figure 3 yes Figure 2 Schematic diagram of the manufacturing process of the middle light-shielding layer;

[0026] Figure 4 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present disclosure;

[0027] Figure 5 yes Figure 4 A schematic diagram of a cross-sectional structure along the A-A' direction;

[0028] Figure 6 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present disclosure;

[0029] Figure 7 yes Figure 6 A schematic diagram of a cross-sectional structure along the B-B' direction;

[0030] Figure 8 yes Figure 6 Another cross-sectional structure schematic diagram along the B-B' direction;

[0031] Figure 9 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present disclosure;

[0032] Figure 10 yes Figure 9 A schematic diagram of a cross-sectional structure in the C-C' direction;

[0033] Figure 11 yes Figure 9 Schematic diagram of another cross-sectional structure in the C-C' direction;

[0034] Figure 12 This is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present disclosure;

[0035] Figure 13 yes Figure 12 A schematic diagram of the structure after the light-emitting device is bound and electrically connected to the driving array layer of the array substrate;

[0036] Figure 14 yes Figure 12 Schematic diagram of the structure after the transparent retaining wall is formed;

[0037] Figure 15 yes Figure 12 Schematic diagram of the structure after the light shielding layer is formed;

[0038] Figure 16 yes Figure 12 A schematic structural diagram of a mask exposing and developing a patterned light shielding layer to form a first light shielding portion is provided;

[0039] Figure 17 yes Figure 12 A schematic structural diagram of a first light shielding portion after an opening is formed;

[0040] Figure 18 is another flowchart of a method for manufacturing a display panel provided by an embodiment of the present disclosure;

[0041] Figure 19 yes Figure 18 A schematic diagram of the structure after the light-emitting device is bound and electrically connected to the driving array layer of the array substrate;

[0042] Figure 20 yes Figure 18 Schematic diagram of the structure after the transparent retaining wall is formed;

[0043] Figure 21 yes Figure 18 A schematic structural diagram of the transparent retaining wall after a recessed portion is formed on the side away from the substrate;

[0044] Figure 22 yes Figure 18 Schematic diagram of the structure after the light shielding layer is formed;

[0045] Figure 23 yes Figure 18 A schematic structural diagram of a mask exposing and developing a patterned light shielding layer to form a first light shielding portion is provided;

[0046] Figure 24 yes Figure 18 A schematic structural diagram of a first light shielding portion after an opening is formed;

[0047] Figure 25 It is a schematic diagram of a planar structure of a display device provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0048] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features therein can be combined with each other in the absence of conflict.

[0049] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0050] like Figure 1 As shown, Figure 1 It is a film layer structure diagram of a display panel in the prior art. The display panel 000' includes a display substrate 001' and a light-emitting unit layer 002' on one side of the display substrate 001'. The display substrate 001' includes a substrate 0011' and at least one metal layer 0012'. The metal layer 0012' can be a metal layer in the driving circuit layer, which can be used to make the connecting wires or driving transistor structures in the display panel, etc. The light-emitting unit layer 002' includes a plurality of repeating units, and each repeating unit includes at least three light-emitting devices 0021' of different colors (such as the light-emitting device 0021' can be a micro LED). When using the display panel 000', the metal film layer in the display panel 000' will reflect ambient light to the human eye, affecting the display effect and user experience. The reason is that when the external ambient light (such as Figure 1 When the ambient light L0' in the display panel 000' is incident on the interior of the display panel 000', part of the external ambient light will be reflected out of the display panel 000' through one or more film layers inside the display panel 000' (such as the metal layer 0012' or other film layers in the display panel 000'). The reflected ambient light is different in color from the light emitted by the light-emitting device 0021'. The human eye will receive the display light and the reflected ambient light at the same time, that is, the ambient light will interfere with the display light and weaken the display effect.

[0051] Therefore, Figure 2 As shown, Figure 2 This is another film structure diagram of a display panel in the prior art. In order to improve the display effect, the prior art will cover a light-shielding layer 003' after the light-emitting device 0021' such as micro LED is transferred to the display substrate 001' to reduce the reflectivity of the screen surface and also reduce the impact of light on the thin film transistors of the driving circuit in the display substrate 001'. Figure 2 and Figure 3 As shown, Figure 3 yes Figure 2 Schematic diagram of the manufacturing process of the middle light-shielding layer. First, a layer of light-shielding material is covered on the display substrate 001', and then the light-shielding material on the top light-emitting surface of the micro LED light-emitting device 0021' is removed by exposure and development. However, in actual production, since the micro LED chip is entirely transparent, even if the top light-emitting surface of the micro LED is blocked by the mask 00' (Mask), there will still be light leakage in various directions (such as Figure 3 The light leakage light L') in the light emitting device 0021' passes through the side and the inside of the light emitting device 0021' and shines on the top light shielding material of the light emitting device 0021', so that the light shielding material is exposed and cured at the top light emitting surface of the light emitting device 0021', resulting in the light shielding material remaining on the top light emitting surface of the light emitting device 0021' such as the micro LED (such as Figure 2 and Figure 3 The residual light-shielding material 0031' on the top light-emitting surface of the light-emitting device 0021' shown reduces the light output, affecting the light output efficiency of the light-emitting unit layer 002' of the display panel 000', thereby affecting the display panel's light utilization rate and causing light source loss.

[0052] To address the above issues, this application proposes a display panel, a method for manufacturing the same, and a display device that can reduce the reflectivity of the screen surface, improving the display effect while also increasing the amount of light emitted by the display panel and ensuring light extraction efficiency. Specific embodiments of the display panel, its method for manufacturing, and the display device proposed in this application are described in detail below.

[0053] Please refer to Figure 4 and Figure 5 , Figure 4 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present disclosure, Figure 5 yes Figure 4 A schematic cross-sectional structure diagram along the AA' line, the display panel 000 provided in this embodiment includes:

[0054] substrate 10;

[0055] The driving array layer 20 is located on one side of the substrate 10;

[0056] A plurality of light emitting devices 30, a plurality of transparent blocking walls 40, and a plurality of first light shielding portions 501, wherein the light emitting devices 30, the transparent blocking walls 40, and the first light shielding portions 501 are all located on a side of the driving array layer 20 away from the substrate 10;

[0057] Along a direction parallel to the plane of the substrate 10, the transparent barrier 40 is located between two adjacent light-emitting devices 30, the first light-shielding portion 501 is located between the two adjacent transparent barrier 40, and the sidewalls of the transparent barrier 40 and the sidewalls of the light-emitting device 30 include at least a portion of the first light-shielding portion 501;

[0058] The orthographic projection of the first light shielding portion 501 on the substrate 10 covers the orthographic projection of the light emitting device 30 on the substrate 10 ;

[0059] In a direction Z perpendicular to the plane where the substrate 10 is located, the light emitting device 30 includes a first surface 30A and a second surface 30B opposite to each other, and the first surface 30A is located on a side of the second surface 30B away from the substrate 10;

[0060] The first light shielding portion 501 includes an opening 501K. The opening 501K exposes at least a portion of the first surface 30A of the light emitting device 30 .

[0061] Specifically, the display panel 000 provided in this embodiment can be a micro-light-emitting diode (micro LED) display panel or a sub-millimeter light-emitting diode (mini LED) display panel. The film structure of the display panel 000 includes a substrate 10. The substrate 10 can serve as a carrier substrate for the display panel 000, and is used to manufacture and arrange the remaining structures of the display panel 000 on the substrate 10. For example, in this embodiment, the substrate 10 is used to manufacture structures such as the drive array layer 20, multiple light-emitting devices 30, multiple transparent baffles 40, and multiple first light-shielding portions 501 located on one side of the substrate 10. The multiple light-emitting devices 30, multiple transparent baffles 40, and multiple first light-shielding portions 501 are all located on the side of the drive array layer 20 away from the substrate 10. Optionally, the substrate 10 can also be used to manufacture multiple insulating layers. The drive array layer 20 is generally used to provide a conductive film layer for circuits and signal lines such as thin-film transistors 20T that drive the light-emitting devices 30 to emit light. Therefore, the conductive film layers can be insulated from each other by insulating layers such as inorganic layers and organic layers. The surface of the drive array layer 20 away from the substrate 10 can also be flattened by a planarization layer. It is understandable that the drive array layer 20 of this embodiment can be a combination of multiple metal conductive layers and multiple inorganic layers, or a combination of multiple metal conductive layers and multiple inorganic layers or organic layers. This embodiment does not limit this. During specific implementation, the film layer arrangement of the drive array layer 20 can be carried out according to the actual design requirements of the panel. Figure 5 As shown, in this embodiment, the driving array layer 20 may include a gate metal layer 20A where the gate of the thin film transistor 20T is located, a source and drain metal layer 20B where the source and drain of the thin film transistor 20T are located, a capacitor metal layer 20C where the capacitor plate is located, and a semiconductor layer 20P where the active portion of the thin film transistor 20T is located, and other conductive layers, and also includes inorganic layers or organic layers between adjacent conductive layers. Figure 5 This is only an example. In specific implementations, the film structure of the driving array layer 20 includes but is not limited to this.

[0062] Optionally, the packaging form of the light emitting device 30 in the display panel 000 of this embodiment can be a horizontal light emitting chip. In specific implementation, the packaging form of the light emitting device 30 can also be a vertical light emitting chip. This embodiment does not limit this. Figure 5 The light emitting device 30 is merely illustrated by taking a horizontal light emitting chip as an example.

[0063] In the display panel 000 provided in this embodiment, along the direction parallel to the plane where the substrate 10 is located (eg Figure 5In the first direction X), a transparent baffle 40 is provided between two adjacent light-emitting devices 30. It can be understood that the transparent baffle 40 separates the two adjacent light-emitting devices 30, and a gap is included between the side wall of the transparent baffle 40 and the side wall of the light-emitting device 30. The gap between the side wall of the transparent baffle 40 and the side wall of the light-emitting device 30 can be understood as that the side wall of the transparent baffle 40 does not make any contact with the side wall of the light-emitting device 30, and there is space between the two. A portion of the first light shielding portion 501 is disposed within the space between the sidewalls of the transparent barrier walls 40 and the sidewalls of the light-emitting device 30. Specifically, the first light shielding portion 501 is located between two adjacent transparent barrier walls 40, and at least a portion of the first light shielding portion 501 is located within the space between the sidewalls of the transparent barrier walls 40 and the sidewalls of the light-emitting device 30. At least a portion of the first light shielding portion 501 contacts both the sidewalls of the light-emitting device 30 and the sidewalls of the transparent barrier walls 40. The orthographic projection of the first light shielding portion 501 on the substrate 10 covers the orthographic projection of the light-emitting device 30 on the substrate 10, equivalent to the first light shielding portion 501 filling the region of the light-emitting device 30 enclosed by the transparent barrier walls 40. Furthermore, in this embodiment, the light-emitting device 30 is disposed in a direction Z perpendicular to the plane of the substrate 10. The light-emitting device 30 includes a first surface 30A and a second surface 30B that are opposed to each other. The first surface 30A is located on the side of the second surface 30B away from the substrate 10. The first surface 30A can be understood as the top portion of the light-emitting device 30 facing the light-emitting surface of the display panel 000. In order to ensure the light emitting effect of the first surface 30A of the light emitting device 30 and also to ensure the light emitting effect of the light emitting surface of the display panel 000, the first shading portion 501 filled in the area where the light emitting device 30 is located and surrounded by the transparent baffle 40 is further provided with an opening 501K. The opening 501K exposes at least part of the first surface 30A of the light emitting device 30, so that the light emitting from the first surface 30A of the light emitting device 30 can be better emitted from the light emitting surface of the display panel 000, thereby ensuring the light emitting display effect of the display panel 000.

[0064] It can be understood that the side wall of the transparent baffle 40 and the side wall of the light-emitting device 30 in this embodiment can be understood as follows: when a transparent baffle 40 is set between two adjacent light-emitting devices 30, the side of the light-emitting device 30 facing the transparent baffle 40 is the side wall of the light-emitting device 30, and the side of the transparent baffle 40 facing the light-emitting device 30 is the side wall of the transparent baffle 40.

[0065] In this embodiment, a transparent barrier wall 40 is provided between two adjacent light-emitting devices 30. The transparent barrier wall 40 can be fabricated after the light-emitting devices 30 are transferred to the drive array layer 20. Specifically, after the light-emitting devices 30 are transferred from the display substrate side of the drive array layer 20 and electrically connected to the drive array layer 20, the transparent barrier wall 40 is fabricated. During the laser or hot pressing process for transferring the light-emitting devices 30, the transparent barrier wall 40 can be prevented from obstructing the transfer and imprinting of the light-emitting devices 30 when pressure is applied to the light-emitting devices 30. The transparent barrier wall 40 can be made of an optically transparent material (such as an OC material) and directly patterned by development. The transparent barrier wall 40 is located between the two adjacent light-emitting devices 30. A light-shielding material is then applied to form the first light-shielding portion 501. Due to the transparent barrier wall 40, the light-shielding material can be concentrated in the area surrounding the light-emitting devices 30 enclosed by the transparent barrier wall 40, covering the top of the light-emitting devices 30, i.e., the first surface 30A of the light-emitting devices 30. At this time, when the mask is used for exposure and development to form the opening 501K of the first light-shielding portion 501, if the light-shielding material of the first light-shielding portion 501 is a negative photoresist material, the mask is used to expose the area outside the first surface 30A at the top of the light-emitting device 30, and the light-shielding material in the area outside the first surface 30A at the top of the light-emitting device 30 is solidified to form the first light-shielding portion 501, while the light-shielding material in the area on the first surface 30A at the top of the light-emitting device 30 blocked by the mask is dissolved and disappears to form the opening 501K of the first light-shielding portion 501.

[0066] In this embodiment, a partial first light shielding portion 501 is provided between the side wall of the light emitting device 30 and the side wall of the transparent blocking wall 40. When the opening 501K of the first light shielding portion 501 is formed on the first surface 30A of the light emitting device 30 using a mask, the area outside the first surface 30A of the top of the light emitting device 30 is exposed, that is, the first surface 30A of the top of the light emitting device 30 is shielded by the mask, and the remaining area is exposed by the mask. The light shielding material in the area outside the first surface 30A of the top of the light emitting device 30 can be cured. Since the side edges of the light emitting device 30 are shielded by the first light shielding portion 501 of the light shielding material, no light leakage in all directions will pass through the inside of the light-transmitting light emitting device 30 to illuminate the position of the top of the light emitting device 30 shielded by the mask. Therefore, the light shielding material at the position of the first surface 30A of the top of the light emitting device 30 shielded by the mask can be completely dissolved and disappear. Therefore, in this embodiment, a partial first light-shielding portion 501 is set between the side wall of the light-emitting device 30 and the side wall of the transparent blocking wall 40, which can avoid the interference of the translucent light-emitting device 30 on the exposure process, and ensure that the light-shielding material on the first surface 30A on the top of the light-emitting device 30 will not be cured and remain. During the development process, the light-shielding material on the top of the light-emitting device 30 can be completely removed to form an opening 501K of the first light-shielding portion 501 that is completely translucent and hollow. There will be no cured light-shielding material remaining in the opening 501K area of the first light-shielding portion 501, which can effectively improve the light output of the first surface 30A of the light-emitting device 30 and ensure the light output efficiency of the display panel 000. At least part of the first light-shielding portion 501 is arranged between the side wall of the transparent baffle 40 and the side wall of the light-emitting device 30, which can also block the ambient light incident from the side of the light-emitting device 30, reduce the impact of the ambient light on the thin film transistor 20T in the driving array layer 20, and at the same time reduce the reflection of the display panel to the ambient light, thereby reducing the surface reflectivity of the display panel. It can also avoid color crosstalk between adjacent light-emitting devices 30, which is beneficial to improving the display effect.

[0067] It should be noted that the figure of this embodiment only illustrates the structure of the display panel. In specific implementation, the structure of the display panel includes but is not limited to this, and may also include other structures that can realize the display function. For specific understanding, please refer to the structure of the mini LED or micro LED display panel in the relevant technology. This embodiment will not be described in detail here.

[0068] In some optional embodiments, please refer to Figure 6 and Figure 7 , Figure 6 is another schematic diagram of the planar structure of the display panel provided by the embodiment of the present disclosure (it can be understood that in order to clearly illustrate the positional relationship between the first light shielding portion and the first surface of the light emitting device, Figure 6 Transparency filled), Figure 7 yes Figure 6A schematic cross-sectional structure diagram along the BB′ line is shown in FIG. 1 . In this embodiment, the first surface 30A of the light-emitting device 30 includes a plurality of optical structures 301 .

[0069] This embodiment explains that the light-emitting device 30 provided in the display panel 000 can be designed to include multiple optical structures 301 on its top, i.e., the first surface 30A. The optical structure 301 can be a concave-convex structure. For example, the optical structure 301 can be a PSS (Patterned Sapphire Substrate) structure or a microprism structure, so that the first surface 30A of the light-emitting device 30 has a rough surface, breaking the total reflection of the surface, which is beneficial to improving the light extraction rate of the light-emitting device 30, reducing light loss, and improving the uniformity of light output, thereby further improving the light output efficiency and display effect of the display panel.

[0070] Optional, such as Figure 6 and Figure 7 As shown, in this embodiment, at least a portion of the first light shielding portion 501 is located on the first surface 30A and covers a portion of the optical structure 301 .

[0071] This embodiment explains that when the first surface 30A of the light-emitting device 30 is provided with a plurality of optical structures 301 to form a concave-convex structure, at least part of the first light-shielding portion 501 is located on the first surface 30A of the light-emitting device 30 and covers part of the first surface 30A, that is, at least part of the first light-shielding portion 501 only covers part of the optical structure 301, which does not affect the normal light emission of the light-emitting device 30 at the opening 501K of the first light-shielding portion 501, and the light extraction efficiency can still be improved by exposing other optical structures 301 not covered by the first light-shielding portion 501 in the opening 501K area. In the area near the edge of the light-emitting device 30, at least part of the first light-shielding portion 501 covers part of the first surface 30A in the edge area, which can effectively increase the actual contact area between the first surface 30A of the light-emitting device 30 and the first light-shielding portion 501, avoid the first light-shielding portion 501 from peeling off, and is beneficial to improving the production yield of the display panel 000 while ensuring the light extraction efficiency of the display panel 000 and improving the display quality.

[0072] Optional, such as Figure 6 and Figure 7As shown, the orthographic projection area of the opening 501K of the first light shielding portion 501 on the substrate 10 is smaller than the orthographic projection area of the first surface 30A on the substrate 10, thereby allowing at least a portion of the first light shielding portion 501 to be located on the first surface 30A, and at least a portion of the first light shielding portion 501 only covers a portion of the optical structure 301 on the first surface 30A. Considering the limited alignment accuracy of the mask during exposure and development, the mask shielding area is generally set to be larger than the area of the first surface 30A at the top of the light-emitting device 30, or the mask shielding area is set to be smaller than the area of the first surface 30A at the top of the light-emitting device 30. If the mask shielding area is larger than the area of the first surface 30A at the top of the light-emitting device 30, the light shielding material around the sidewalls of the light-emitting device 30 may become partially cured and in an uncertain state, resulting in severe angular unevenness in the light emitted by the light-emitting device 30. Therefore, in this embodiment, when the manufacturing process is performed, the shielding area of the mask provided is smaller than the area of the first surface 30A at the top of the light-emitting device 30, and the orthographic projection area of the opening 501K of the first light-shielding portion 501 formed on the first surface 30A on the substrate 10 is smaller than the orthographic projection area of the first surface 30A on the substrate 10, so that the light-shielding material around the side wall of the light-emitting device 30 can be completely exposed and cured, ensuring that the first light-shielding portion 501 can completely block the peripheral area of the light-emitting device 30, and further ensuring that the opening 501K of the first light-shielding portion 501 that is completely transparent and hollow can be formed. There will be no cured light-shielding material residue in the opening 501K area of the first light-shielding portion 501, which can effectively increase the light output of the first surface 30A of the light-emitting device 30, and is conducive to more effectively improving the light output efficiency of the display panel 000.

[0073] In some optional embodiments, please continue to refer to Figure 6 and Figure 7 In this embodiment, in the direction Z perpendicular to the plane of the substrate 10, the distance between the first surface 30A of the light-emitting device 30 and the substrate 10 is H1, and the distance between the surface of the transparent blocking wall 40 away from the substrate 10 and the substrate 10 is H2; wherein, H2>H1.

[0074] This embodiment explains that after the light-emitting device 30 is transferred onto the drive array layer 20 of the display substrate, the height requirement of the transparent baffle 40 can be such that, in a direction Z perpendicular to the plane of the substrate 10, the distance H2 between the surface of the transparent baffle 40 away from the substrate 10 and the substrate 10 is greater than the distance H1 between the first surface 30A of the light-emitting device 30 and the substrate 10. That is, the height of the transparent baffle is higher than the height H1 of the light-emitting device 40. This can prevent the subsequent light-shielding material from being formed on the surface of the transparent baffle 40 away from the substrate 10 if the distance H2 between the surface of the transparent baffle 40 away from the substrate 10 and the substrate 10 is less than the distance H1 between the first surface 30A of the light-emitting device 30 and the substrate 10. As a result, the subsequently applied light-shielding material can be concentrated in the area surrounding the light-emitting device 30 enclosed by the transparent baffle 40, thereby preventing side light leakage from the translucent light-emitting device 30 from interfering with the exposure process of the light-shielding material, thereby ensuring product yield.

[0075] In some optional embodiments, please continue to refer to Figure 6 and Figure 7 In this embodiment, in the direction Z perpendicular to the plane of the substrate 10, the distance between the first surface 30A of the light-emitting device 30 and the substrate 10 is H1, and the distance between the surface of the first light-shielding portion 501 away from the substrate 10 and the substrate 10 is H3; wherein, H3>H1.

[0076] This embodiment explains that after the light emitting devices 30 are transferred to the driving array layer 20 of the display substrate and transparent baffles 40 are formed between adjacent light emitting devices 30, the height requirement of the first light shielding portion 501 formed around the area where the light emitting devices 30 are located, which is surrounded by the transparent baffles 40, can be that in the direction Z perpendicular to the plane where the substrate 10 is located, the distance H3 between the surface of the first light shielding portion 501 away from the substrate 10 and the substrate 10 is greater than the distance H1 between the first surface 30A of the light emitting device 30 and the substrate 10. Optionally, the distance H3 between the surface of the first light shielding portion 501 away from the substrate 10 and the first surface 30A of the light emitting device 30 can be greater than the distance H1 between the first surface 30A of the light emitting device 30 and the substrate 10. 0A (i.e., the value of H3-H1) can be 1-2μm, which can make the surface of the first shading portion 501 away from the substrate 10 slightly higher than the first surface 30A of the light-emitting device 30, thereby forming a design of the optical structure 301 in which at least part of the first shading portion 501 is located on the first surface 30A and covers part of the first surface 30A. This effectively achieves the effect of increasing the actual contact area between the first surface 30A of the light-emitting device 30 and the first shading portion 501, avoids the peeling of the first shading portion 501, and is beneficial to improving the production yield of the display panel 000 while ensuring the light extraction efficiency of the display panel 000.

[0077] In some optional embodiments, please continue to refer to Figure 6 and Figure 7In this embodiment, in the direction Z perpendicular to the plane of the substrate 10, the distance from the surface of the transparent blocking wall 40 away from the substrate 10 to the substrate 10 is H2, and the distance from the surface of the first light shielding portion 501 away from the substrate 10 to the substrate 10 is H3; wherein, H2>H3.

[0078] This embodiment explains that after the light-emitting devices 30 are transferred to the drive array layer 20 of the display substrate and transparent baffles 40 are formed between adjacent light-emitting devices 30, the height requirement of the first light-shielding portion 501 formed around the area where the light-emitting devices 30 are located, which is surrounded by the transparent baffles 40, can be such that the distance H3 between the surface of the first light-shielding portion 501 on the side away from the substrate 10 and the substrate 10 is less than the distance H2 between the surface of the transparent baffles 40 on the side away from the substrate 10 and the substrate 10, that is, the height of the coated first light-shielding portion 501 is still slightly lower than the height of the transparent baffles 40. As a result, when the opening 501K of the first light-shielding portion 501 is formed using a mask, the exposure light can cure the first light-shielding portion 501 from the side thereof, thereby facilitating an improved overall curing effect of the first light-shielding portion 501.

[0079] It can be understood that, in this embodiment, if the first surface 30A of the light-emitting device 30 includes multiple optical structures 301, then the distance H1 from the first surface 30A of the light-emitting device 30 to the substrate 10 can be understood as the distance between the point on the first surface 30A of the light-emitting device 30 that is farthest from the substrate 10 and the substrate 10 in the direction Z perpendicular to the plane where the substrate 10 is located.

[0080] In some optional embodiments, please refer to Figure 6 and Figure 8 , Figure 8 yes Figure 6 Another cross-sectional structural diagram along the BB′ line is shown. In this embodiment, a first planarization layer 60 is further included between the driving array layer 20 and the light emitting device 30 .

[0081] Optionally, a binding electrode layer 70 is included between the first planarization layer 60 and the light emitting device 30 . The binding electrode layer 70 includes a plurality of binding electrodes 701 . The light emitting device 30 is electrically connected to the driving array layer 20 via the binding electrodes 701 .

[0082] This embodiment illustrates that a first planarization layer 60 is further provided between the drive array layer 20 and the light-emitting device 30. Optionally, a binding electrode layer 70 is provided between the first planarization layer 60 and the light-emitting device 30. The binding electrode layer 70 is used to form a plurality of binding electrodes 701, which are used to electrically connect and bind the light-emitting device 30 to the drive array layer 20. It is understood that the binding electrode layer 70 in this embodiment can also be used to form electrodes located outside the frame of the display panel 000 for transmitting drive signals provided by a subsequently bonded driver chip or flexible circuit board. The plurality of binding electrodes 701 in this embodiment can be understood to be located in a non-frame area of the display panel 000, such as the display area or light-emitting area of the display panel 000. After the light-emitting device 30 is bonded to the binding electrodes 701, the drive array layer 20 transmits the signal driving the light-emitting device 30 to the bonded light-emitting device 30. In this embodiment, the first planarization layer 60 is located on the side of the binding electrode layer 70 facing the substrate 10. Before the binding electrode layer 70 is formed, the first planarization layer 60 can flatten the surface of the drive array layer 20 on the side away from the substrate 10, so that the surface of the display substrate after the drive array layer 20 is formed is as flat as possible. The binding electrode layer 70 can be formed on the first planarization layer 60 with high flatness, which can effectively ensure the flatness of the binding electrode 701, thereby facilitating improved bonding stability of the light-emitting device 30 subsequently bonded to the binding electrode 701.

[0083] Optionally, the binding electrode layer 70 in this embodiment can be made of a metal material or a transparent conductive material. This is not limited in this embodiment, and the binding electrode layer 70 only needs to have conductive properties. The first planarization layer 60 can be made of an organic material, which can further improve the planarization effect of the first planarization layer 60.

[0084] Optional, such as Figure 8 As shown, the drive array layer 20 can be made into a circuit structure such as a thin film transistor 20T that drives the light-emitting device to emit light. The source or drain of the thin film transistor 20T can be electrically connected to the anode pin of the light-emitting device 30 through the binding electrode 701, and the cathode pin of the light-emitting device 30 can be electrically connected to the cathode signal line (not shown in the figure) in the display panel 000 through the binding electrode 701. The drive array layer 20 can also include multiple conductive signal lines (such as scan signal lines, data signal lines, power signal lines, etc.) to realize the transmission of drive signals to each light-emitting device 30 and drive the normal light-emitting display effect of the light-emitting device 30 ( Figure 6Different fill patterns represent light-emitting devices 30 of different colors. The light-emitting device 30 of this embodiment can be a micro LED or mini LED. In a specific implementation, the light-emitting device 30 can be transferred to a display substrate on which film layers such as the drive array layer 20, the first planarization layer 60, and the binding electrode layer 70 have been fabricated using mass transfer technology. The anode pin and cathode pin of the light-emitting device 30 are respectively electrically connected to the binding electrode 701 of the binding electrode layer 70 on the substrate, thereby realizing the drive circuit structure of the drive array layer 20 to drive the light-emitting device 30 to emit light, thereby realizing a display function.

[0085] Optionally, the light-emitting device 30 of this embodiment can be electrically bonded by providing a conductive structure such as solder or a eutectic layer (not shown) between the bonding electrode 701 and the anode pin and cathode pin of the light-emitting device 30. When the light-emitting device 30 is transferred, the cathode pin and anode pin of the light-emitting device 30 can be aligned with the bonding electrode 701 on the display substrate using a microstamp. The downward pressure of the microstamp presses the conductive structure such as the solder or eutectic layer, thereby achieving an electrical bond between the light-emitting device 30 and the bonding electrode 701. It will be understood that the eutectic layer can be made of a high-melting-point eutectic material, such as a eutectic material of solder and silver or gold.

[0086] It is understandable that the binding electrode layer 70 of this embodiment may include not only a plurality of binding electrodes 701 , but also other patterned conductive structures, such as signal traces, a plate structure of a capacitor, etc., which is not limited in this embodiment.

[0087] In some optional embodiments, such as Figure 6 and Figure 8 As shown, in this embodiment, the material used to make the first planarization layer 60 includes an opaque material. This embodiment explains that the first planarization layer 60 not only flattens the surface of the drive array layer 20 away from the substrate 10, making the surface of the display substrate after the drive array layer 20 is made as flat as possible, but also that the bonding electrode layer 70 can be formed on the highly flat first planarization layer 60, effectively ensuring the flatness of the bonding electrode 701, thereby improving the bonding stability of the light-emitting device 30 subsequently bonded to the bonding electrode 701. The first planarization layer 60 can also be made of an opaque material, such as an organic photosensitive adhesive containing carbon black, to further enable the first planarization layer 60 to block the circuit of the drive array layer 20 on the display substrate, preventing the circuit structures of the drive array layer 20, such as the thin-film transistor 20T, from being affected by the light emitted by the light-emitting device 30. The first planarization layer 60 made of an opaque material can also effectively reduce the surface reflectivity of the panel to improve the display effect.

[0088] In some optional embodiments, please continue to refer to Figure 6and Figure 8 In this embodiment, the driving array layer 20 includes a first metal layer 201 . No other conductive layer is included between the first metal layer 201 and the binding electrode layer 70 . The first metal layer 201 includes a plurality of first conductive portions 2011 .

[0089] The first planarization layer 60 includes a plurality of first via holes 60K1 , and the binding electrode 701 is electrically connected to the first conductive portion 2011 through the first via holes 60K1 ;

[0090] The orthographic projection of the first via hole 60K1 on the substrate 10 is located within the orthographic projection range of the light emitting device 30 on the substrate 10 .

[0091] This embodiment explains that after the first planarization layer 60 is provided between the binding electrode layer 70 and the driving array layer 20, in order to achieve electrical connection between the binding electrodes 701 of the binding electrode layer 70 and circuit structures such as the thin-film transistors 20T in the driving array layer 20, the driving array layer 20 includes a first metal layer 201. The first metal layer 201 is the conductive layer closest to the binding electrode layer 70 in the driving array layer 20, and no other conductive layers are between the first metal layer 201 and the binding electrode layer 70. The binding electrodes 701 of the binding electrode layer 70 are electrically connected to the first conductive portions 2011 of the first metal layer 201, thereby enabling the driving array layer 20 to provide driving light-emitting signals to the light-emitting devices 30 through the binding electrodes 701. In this case, a plurality of first via holes 60K1 are required to be provided in the first planarization layer 60, thereby achieving electrical connection between the binding electrodes 701 of the binding electrode layer 70 and the first conductive portions 2011 of the first metal layer 201 through the first via holes 60K1. In the prior art, due to the limitations of the mass transfer process of the light-emitting device 30, in order to avoid affecting the via holes in the underlying film layer when pressing down the light-emitting device 30, the via holes opened in the film layer below the binding electrode layer 70 are generally arranged to avoid the area directly below the binding electrode 701 to which the light-emitting device 30 is connected. In this embodiment, the orthographic projection of the first via 60K1 on the substrate 10 is located within the orthographic projection range of the light-emitting device 30 on the substrate 10, that is, the first via 60K1 opened in the first planarization layer 60 is located as directly below the light-emitting device 30 as possible, and even as directly below the binding electrode 701 connected to the light-emitting device 30 as possible. As a result, the space occupied by the binding electrode 701 can be minimized, and the gap between the side wall of the transparent blocking wall 40 and the side wall of the light-emitting device 30 can be narrowed as much as possible. That is, in the direction parallel to the plane of the substrate 10, the distance between the side wall of the transparent blocking wall 40 and the side wall of the light-emitting device 30 is narrowed as much as possible. Then, the width of the first light-shielding portion 501 in the gap between the side wall of the transparent blocking wall 40 and the side wall of the light-emitting device 30 filled after the light-shielding material is subsequently applied is also narrowed in the direction parallel to the plane of the substrate 10. The first light-shielding portion 501 will not be spread over a large area along the direction parallel to the plane of the substrate 10 due to the occupation of the binding electrode 701. Therefore, by reducing the width of the first light shielding portion 501 in a direction parallel to the plane of the substrate 10, which is filled in the gap between the sidewalls of the transparent barrier 40 and the sidewalls of the light-emitting device 30, the risk of side curing of the first light shielding portion 501 in the gap between the sidewalls of the transparent barrier 40 and the sidewalls of the light-emitting device 30 can be reduced, which helps improve product yield. In the case of limited production area of the bonding electrode 701, it can also avoid the formation of voids when bonding the bonding electrode 701 and the cathode pin (anode pin) of the light-emitting device 30, which helps improve the transfer bonding yield of the light-emitting device 30.

[0092] It can be understood that, in this embodiment, Figure 8As shown, the distance W1 between the edge of the binding electrode 701 on the side facing the transparent baffle wall 40 and the transparent baffle wall 40 is smaller than the distance W2 between the side wall of the light-emitting device 30 and the transparent baffle wall 40, so that the edge of the binding electrode 701 on the side facing the transparent baffle wall 40 can extend as little as possible beyond the side wall of the light-emitting device 30, and the width of the edge of the binding electrode 701 on the side facing the transparent baffle wall 40 is smaller than the thickness of the first light-shielding portion 501 in the direction parallel to the plane of the substrate 10, which can better reduce the risk of solidification on the side of the first light-shielding portion 501.

[0093] In some optional embodiments, please refer to Figure 9 and Figure 10 , Figure 9 is another schematic diagram of the planar structure of the display panel provided by the embodiment of the present disclosure (it can be understood that in order to clearly illustrate the positional relationship between the first light shielding portion and the first surface of the light emitting device, Figure 9 Transparency filled), Figure 10 yes Figure 9 A schematic cross-sectional structure diagram taken along the C-C' direction in this embodiment shows that, along a direction Z perpendicular to the plane of the substrate 10, the transparent barrier wall 40 includes a recessed portion 40K on a side away from the substrate 10. The depth D2 of the recessed portion 40K is less than the thickness D1 of the transparent barrier wall 40. The recessed portion 40K is filled with a second light shielding portion 502.

[0094] The binding electrode layer 70 includes a first signal line 702 , and an orthographic projection of the second light shielding portion 502 on the substrate 10 at least partially overlaps with an orthographic projection of the first signal line 702 on the substrate 10 .

[0095] This embodiment illustrates that the binding electrode layer 70 may include not only a plurality of binding electrodes 701 for electrically connecting the light-emitting devices 30 to the drive array layer 20, but also other patterned conductive structures, such as signal traces, a plate structure of a capacitor, and the like. For example, the binding electrode layer 70 includes a first signal line 702, which can be any type of signal trace in the display panel 000 for providing a drive signal to drive the light-emitting devices 30 to emit light. Because the binding electrode layer 70 is located on the side of the first planarization layer 60 away from the substrate 10, the first signal line 702 is covered by the transparent barrier 40 between adjacent light-emitting devices 30. The transparent barrier 40 has a highly transparent structure, so the first signal line 702 is susceptible to metal reflection, which affects the display effect. In this embodiment, a recessed portion 40K is provided on a side of the transparent blocking wall 40 away from the substrate 10 along a direction Z perpendicular to the plane where the substrate 10 is located. The depth D2 of the recessed portion 40K is less than the thickness D1 of the transparent blocking wall 40. The recessed portion 40K does not penetrate the entire thickness of the transparent blocking wall 40. The recessed portion 40K is filled with a second light-shielding portion 502. The second light-shielding portion 502 can be made of the same material and process as the first light-shielding portion 501. The orthographic projection of the second light-shielding portion 502 on the substrate 10 at least partially overlaps with the orthographic projection of the first signal line 702 on the substrate 10. The optional orthographic projection of the second light-shielding portion 502 on the substrate 10 covers the orthographic projection of the first signal line 702 on the substrate 10. The metal circuit of the first signal line 702 below it can be shielded by the second light-shielding portion 502 to reduce the reflection of the metal circuit, thereby improving the display quality.

[0096] It should be noted that, in this embodiment, the layout direction and number of the first signal line 702 included in the binding electrode layer 70 are only examples. During specific implementation, the layout of the first signal line 701 can be set according to actual needs. This embodiment does not limit this. It only needs to satisfy that the positive projection of the second shading portion 502 on the substrate 10 and the positive projection of the first signal line 702 on the substrate 10 at least partially overlap, and the second shading portion 502 filled in the recessed portion 40K of the transparent retaining wall 40 plays the role of shielding the metal circuit.

[0097] In some optional embodiments, please refer to Figure 9 and Figure 11 , Figure 11 yes Figure 9 Another cross-sectional structural diagram taken along the C-C' line, in this embodiment, the transparent barrier wall 40 includes a first bottom portion 40A close to the substrate 10 and a first top portion 40B away from the substrate 10. Along a direction parallel to the plane of the substrate 10, a width W3 of the first bottom portion 40A is smaller than a width W4 of the first top portion 40B.

[0098] The recessed portion 40K includes a second bottom portion 40KA close to the substrate 10 and a second top portion 40KB away from the substrate 10 . Along a direction parallel to the plane of the substrate 10 , a width W5 of the second bottom portion 40KA is smaller than a width W6 of the second top portion 40KB.

[0099] This embodiment explains that the transparent barrier wall 40 disposed between the light-emitting devices 30 in the display panel 000 may be shaped such that, in a direction Z perpendicular to the plane of the substrate 10, the transparent barrier wall 40 includes a first bottom portion 40A close to the substrate 10 and a first top portion 40B away from the substrate 10. The first bottom portion 40A and the first top portion 40B may be understood as two opposing surfaces of the transparent barrier wall 40 in the direction Z perpendicular to the plane of the substrate 10. Along a direction parallel to the plane of the substrate 10, one light-emitting device 30 may be directed toward another adjacent light-emitting device 30. The width W3 of the first bottom portion 40A is smaller than the width W4 of the first top portion 40B, i.e., the transparent barrier wall 40 is a structure that is wide at the top and narrow at the bottom. Figure 11 The cross-section of the transparent retaining wall 40 shown in the figure is an inverted trapezoidal shape that is wide at the top and narrow at the bottom. The cross-section of the area where the light-emitting device 30 is located is a trapezoidal shape that is narrow at the top and wide at the bottom. As a result, the area where the light-emitting device 30 is located has a larger space close to the binding electrode 701, which allows the binding electrode 701 bound to the anode pin of the light-emitting device 30 to be as far away as possible from the other binding electrode 701 bound to the cathode pin of the same light-emitting device 30, thereby avoiding the melting of the binding eutectic layer and causing a short circuit between the anode pin and the cathode pin of the light-emitting device 30, which is beneficial to improving the binding yield of the light-emitting device 30. Moreover, along a direction parallel to the plane where the substrate 10 is located, the width W3 of the first bottom 40A is smaller than the width W4 of the first top 40B, that is, the transparent blocking wall 40 has a structure that is wide at the top and narrow at the bottom, thereby forming a region where the light-emitting device 30 is located with a larger space near the binding electrode 701, while being narrowed on the side away from the binding electrode 701. This can relatively reduce the capacity of the light-shielding material used to form the first light-shielding portion 501 between the sidewall of the light-emitting device 30 and the sidewall of the transparent blocking wall 40 in the spacing region, thereby preventing the first light-shielding portion 501 from covering too much area on the first surface 30A of the light-emitting device 30 and affecting light emission. In addition, the transparent blocking wall 40 has a structure that is wide at the top and narrow at the bottom, thereby forming a region where the light-emitting device 30 is located with a narrowed shape on the side away from the binding electrode 701. This is beneficial for better fixing the light-emitting device 30 within the curing range of the first light-shielding portion 501 after the first light-shielding portion 501 is cured, thereby improving the overall stability and reliability of the light-emitting device 30 after being bound.

[0100] The recessed portion 40K of the transparent barrier 40 of this embodiment includes a second bottom portion 40KA close to the substrate 10 and a second top portion 40KB away from the substrate 10. The second bottom portion 40KA and the second top portion 40KB can be understood as two opposing surfaces of the recessed portion 40K in a direction perpendicular to the plane of the substrate 10. Along the direction parallel to the plane of the substrate 10, it can be the direction in which one light emitting device 30 points to another light emitting device 30 adjacent thereto. The width W5 of the second bottom portion 40KA is smaller than the width W6 of the second top portion 40KB, that is, the recessed portion 40K has a structure that is wide at the top and narrow at the bottom. Figure 11 The cross-section of the recessed portion 40K presented in the figure is an inverted trapezoidal shape that is wide at the top and narrow at the bottom, which makes it easy to etch the recessed portion 40K on the surface of the transparent retaining wall 40, and the recessed portion 40K is only used to fill the second light-shielding portion 502, which plays the role of shielding the first metal signal line 702 below it. Therefore, the cross-section of the second light-shielding portion 502 formed in the recessed portion 40K with a cross-section that is a wide at the top and narrow at the bottom is also an inverted trapezoidal shape that is wide at the top and narrow at the bottom, which can make the width of the second light-shielding portion 502 as wide as possible, and can effectively increase the shielding range of the second light-shielding portion 502, and play a better effect of shielding the reflected light from the metal wiring.

[0101] In some optional embodiments, please refer to Figure 4-Figure 8 、 Figure 12 , Figure 12 This is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present disclosure. The method for manufacturing a display panel provided by this embodiment is used to manufacture the display panel 000 of any of the above embodiments. The display panel 000 manufactured using the method of this embodiment has the beneficial effects of the display panel 000 provided by any of the above embodiments. This embodiment will not be described in detail here. The method for manufacturing a display panel provided by this embodiment includes:

[0102] J11: Providing an array substrate 001, the array substrate 001 including a substrate 10 and a driving array layer 20 located on one side of the substrate 10; optionally, the provided array substrate 001 further includes a first planarization layer 60 and a binding electrode layer 70, that is, before binding the light-emitting device 30, the first planarization layer 60 and the binding electrode layer 70 are formed on a side of the driving array layer 20 away from the substrate 10, and the binding electrode layer 70 is patterned to form a plurality of binding electrodes 701;

[0103] J12: Provide a plurality of light emitting devices 30, the light emitting devices 30 are electrically connected to the driving array layer 20 by binding; optionally, the light emitting devices 30 are electrically connected to the driving array layer 20 via the binding electrodes 701 of the binding electrode layer 70; Figure 13 As shown, Figure 13 yes Figure 12 A schematic diagram of the structure after the light-emitting device is bound and electrically connected to the driving array layer of the array substrate;

[0104] J13: Fabricate a transparent cover layer, expose and develop the patterned transparent cover layer, so that the transparent cover layer forms a plurality of transparent barrier walls 40; along a direction parallel to the plane where the substrate 10 is located, the transparent barrier walls 40 are located between two adjacent light-emitting devices 30, and a space 00 is included between the sidewalls of the transparent barrier walls 40 and the sidewalls of the light-emitting devices 30; Figure 14 As shown, Figure 14 yes Figure 12 Schematic diagram of the structure after the transparent retaining wall is formed;

[0105] J14: Make a light shielding layer 50, which is filled in the area where the light emitting device is located and surrounded by the transparent barrier wall 40, such as Figure 15 As shown, Figure 15 yes Figure 12 Schematic diagram of the structure after the light shielding layer is formed;

[0106] J15: Expose and develop the patterned light-shielding layer 50, so that the light-shielding layer 50 forms a plurality of first light-shielding portions 501; along a direction parallel to the plane where the substrate 10 is located, the first light-shielding portion 501 is located between two adjacent transparent blocking walls 40, and at least a portion of the first light-shielding portion 501 is filled in the gap 00; the first light-shielding portion 501 includes an opening 501K, which exposes at least a portion of the first surface 30A of the light-emitting device 30; wherein, in a direction Z perpendicular to the plane where the substrate 10 is located, the light-emitting device 30 includes a first surface 30A and a second surface 30B opposite to each other, and the first surface 30A is located on the side of the second surface 30B away from the substrate 10; as shown in FIG. Figure 16 and Figure 17 As shown, Figure 16 yes Figure 12 A schematic structural diagram of a mask exposing and developing a patterned light shielding layer to form a first light shielding portion is provided. Figure 17 yes Figure 12 Schematic diagram of the structure of the first light shielding portion after the opening is formed.

[0107] The display panel manufacturing method provided in this embodiment is used to manufacture the display panel 000 of any of the above-described embodiments. In this manufacturing method, an array substrate 001 is provided, and a light-emitting device 30 is bonded to one side of the array substrate 001 through a transfer process, so that the light-emitting device 30 and the drive array layer 20 are electrically connected via the bonding electrode 701. It will be understood that the specific structure of the array substrate 001 and the process of bonding and electrically connecting the light-emitting device 30 to the array substrate 001 are not described in detail in this embodiment. For details, please refer to the description of the display panel 000 structure embodiment described above and the array substrate manufacturing process in related technologies.

[0108] After the light emitting device 30 is bound and electrically connected to the driving array layer 20 of the array substrate 001, a transparent cover layer is made. The material of the transparent cover layer can be an optically transparent material (OC material, etc.) with good light transmittance. Then, the transparent cover layer is exposed and developed to form a patterned transparent barrier rib 40, such as Figure 14 As shown, and along a direction parallel to the plane where the substrate 10 is located, the transparent blocking wall 40 is located between two adjacent light-emitting devices 30, and there is a gap 00 between the side wall of the transparent blocking wall 40 and the side wall of the light-emitting device 30, that is, there is no contact between the side wall of the transparent blocking wall 40 and the side wall of the light-emitting device 30.

[0109] After the transparent barrier 40 is formed, the light shielding layer 50 is made, such as Figure 15 As shown, the light shielding layer 50 can be filled in the area where the light emitting device is located and surrounded by the transparent barrier wall 40 by a coating process. Then a mask MK is provided, such as Figure 16 As shown, the patterned light shielding layer 50 is exposed and developed, so that the light shielding layer 50 forms a plurality of first light shielding portions 501, and along a direction parallel to the plane where the substrate 10 is located, the first light shielding portion 501 is located between two adjacent transparent blocking walls 40, and at least a portion of the first light shielding portion 501 is filled in the gap 00. The material of the light shielding layer 50 can be a photoresist material, specifically a negative photoresist material, and the opening of the provided mask MK exposes the area outside the first surface 301A, and the mask MK blocks a portion of the first surface 30A, so that the first light shielding portion 501 forms an opening 501K, and the opening exposes at least a portion of the first surface 30A of the light emitting device 30. The first surface 30A can be understood as the side surface of the light emitting device 30 facing the light emitting surface of the display panel 000, as shown in FIG. Figure 17 shown.

[0110] Since a portion of the light-shielding layer material is arranged between the side walls of the light-emitting device 30 and the side walls of the transparent baffle 40 when the mask MK is used to expose and develop the patterned light-shielding layer 50, interference of the light-transmitting light-emitting device 30 with the exposure process can be avoided, ensuring that the light-shielding material on the first surface 30A at the top of the light-emitting device 30 will not be cured and remain. The light-shielding material on the top of the light-emitting device 30 can be completely removed during the development process, and finally an opening 501K of the first light-shielding portion 501 that is completely light-transmitting and hollow is formed on the first surface 30A of the light-emitting device 30. There will be no cured light-shielding material remaining in the opening 501K area of the first light-shielding portion 501, which can effectively improve the light output of the first surface 30A of the light-emitting device 30 and ensure the light output efficiency of the display panel 000. After the final curing, at least part of the first light-shielding portion 501 is formed between the side wall of the transparent baffle 40 and the side wall of the light-emitting device 30, which can also block the ambient light incident from the side of the light-emitting device 30, reduce the impact of the ambient light on the thin film transistor 20T in the driving array layer 20, and at the same time reduce the reflection of the display panel to the ambient light, thereby reducing the surface reflectivity of the display panel, and can also avoid color crosstalk between adjacent light-emitting devices 30, which is beneficial to improving the display effect.

[0111] Optionally, the light shielding layer 50 in this embodiment can be made of a photoresist material, specifically a negative photoresist material. The mask MK is used to expose and develop the patterned light shielding layer 50. Specifically, ultraviolet light (UV) is irradiated on the light shielding layer 50 of the negative photoresist material to trigger a photochemical reaction, and then the photoresist in the specific area is dissolved by a developer to form a pattern of the first light shielding portion 501 including the opening 501K. The exposure and development principle of the negative photoresist material is that the photoinitiator of the photoresist in the exposed area absorbs UV photons and then cross-links and polymerizes to form a three-dimensional network structure, which reduces the solubility of the exposed area in the developer and is easily solidified and formed, while the unexposed and UV-irradiated area is dissolved. The light shielding layer 50 is made of a photoresist material. During the process, the light shielding layer 50 can be patterned by exposure and development. After the patterning is completed by development, it can remain on the substrate and does not need to be removed, thereby simplifying the process steps and improving process efficiency.

[0112] It should be noted that the light shielding layer 50 may also be made of a positive photoresist material, and the exposure and development principles thereof are opposite to those of a negative photoresist material, which will not be described in detail in this embodiment.

[0113] In some optional embodiments, please refer to Figure 9 、 Figure 11 、 Figure 18 , Figure 18This is another flowchart of a method for manufacturing a display panel provided in an embodiment of the present disclosure. The method for manufacturing a display panel provided in this embodiment is used to manufacture the display panel 000 of any of the above embodiments. The display panel 000 manufactured using the method of this embodiment has the beneficial effects of the display panel 000 provided in any of the above embodiments. This embodiment will not be described in detail here. The method for manufacturing a display panel provided in this embodiment includes:

[0114] J21: An array substrate 001 is provided. The array substrate 001 includes a substrate 10 and a driving array layer 20 located on one side of the substrate 10. The provided array substrate 001 also includes a first planarization layer 60 and a binding electrode layer 70. That is, before the light-emitting device 30 is bonded, the first planarization layer 60 and the binding electrode layer 70 are formed on a side of the driving array layer 20 away from the substrate 10. The binding electrode layer 70 is patterned to form a plurality of binding electrodes 701. The binding electrode layer 70 of the display panel 000 also includes a first signal line 702.

[0115] J22: Provide a plurality of light emitting devices 30, the light emitting devices 30 are electrically connected to the driving array layer 20 by binding; optionally, the light emitting devices 30 are electrically connected to the driving array layer 20 through the binding electrodes 701 of the binding electrode layer 70, such as Figure 19 As shown, Figure 19 yes Figure 18 A schematic diagram of the structure after the light-emitting device is bound and electrically connected to the driving array layer of the array substrate;

[0116] J23: Fabricate a transparent cover layer, expose and develop the patterned transparent cover layer, so that the transparent cover layer forms a plurality of transparent barrier walls 40; along a direction parallel to the plane where the substrate 10 is located, the transparent barrier wall 40 is located between two adjacent light-emitting devices 30, and a gap 00 is included between the sidewalls of the transparent barrier wall 40 and the sidewalls of the light-emitting device 30; among the plurality of transparent barrier walls 40 formed by the transparent cover layer, the transparent barrier wall 40 includes a first bottom portion 40A close to the substrate 10 and a first top portion 40B away from the substrate 10; along a direction parallel to the plane where the substrate 10 is located, a width W3 of the first bottom portion 40A is smaller than a width W4 of the first top portion 40B; as shown in FIG. Figure 20 As shown, Figure 20 yes Figure 18 Schematic diagram of the structure after the transparent retaining wall is formed;

[0117] J24: Continue exposing and developing the patterned transparent barrier wall 40, so that in the direction Z perpendicular to the plane of the substrate 10, a recessed portion 40K is formed on the side of the transparent barrier wall 40 away from the substrate, and the depth D2 of the recessed portion 40K is less than the thickness D1 of the transparent barrier wall 40; the orthographic projection of the recessed portion 40K on the substrate 10 at least partially overlaps with the orthographic projection of the first signal line 702 on the substrate 10; the recessed portion 40K includes a second bottom portion 40KA close to the substrate 10 and a second top portion 40KB away from the substrate 10, and along the direction parallel to the plane of the substrate 10, the width W5 of the second bottom portion 40KA is less than the width W6 of the second top portion 40KB; as shown in FIG. Figure 21 As shown, Figure 21 yes Figure 18 A schematic structural diagram of the transparent retaining wall after a recessed portion is formed on the side away from the substrate;

[0118] J25: Make a light shielding layer 50. The light shielding layer 50 formed by the coating process is filled in the area where the light emitting device is located and surrounded by the transparent barrier 40. The light shielding layer 50 is filled in the recessed portion 40K to form a second light shielding portion 502. Figure 22 As shown, Figure 22 yes Figure 18 Schematic diagram of the structure after the light shielding layer is formed;

[0119] J26: Then, the mask MK is used to expose and develop the patterned light shielding layer 50, so that the light shielding layer 50 forms a plurality of first light shielding portions 501; along a direction parallel to the plane where the substrate 10 is located, the first light shielding portion 501 is located between two adjacent transparent blocking walls 40, and at least a portion of the first light shielding portion 501 is filled in the gap 00; the first light shielding portion 501 includes an opening 501K, which exposes at least a portion of the first surface 30A of the light-emitting device 30; wherein, in a direction Z perpendicular to the plane where the substrate 10 is located, the light-emitting device 30 includes a first surface 30A and a second surface 30B opposite to each other, and the first surface 30A is located on the side of the second surface 30B away from the substrate 10; as shown in FIG. Figure 23 and Figure 24 As shown, Figure 23 yes Figure 18 A schematic structural diagram of a mask exposing and developing a patterned light shielding layer to form a first light shielding portion is provided. Figure 24 yes Figure 18 Schematic diagram of the structure of the first light shielding portion after the opening is formed.

[0120] In the manufacturing method provided in this embodiment, when forming the transparent barrier 40, the formed transparent barrier 40 includes a first bottom 40A close to the substrate 10 and a first top 40B away from the substrate 10. The first bottom 40A and the first top 40B can be understood as two opposing surfaces of the transparent barrier 40 in a direction Z perpendicular to the plane of the substrate 10. Along the direction parallel to the plane of the substrate 10, it can be the direction from one light-emitting device 30 to another adjacent light-emitting device 30. The width W3 of the first bottom 40A is smaller than the width W4 of the first top 40B, that is, the transparent barrier 40 has a structure that is wide at the top and narrow at the bottom. Figure 20 The cross-section of the transparent retaining wall 40 shown in the figure is an inverted trapezoidal shape that is wide at the top and narrow at the bottom. The cross-section of the area where the light-emitting device 30 is located is a trapezoidal shape that is narrow at the top and wide at the bottom. As a result, the area where the light-emitting device 30 is located has a larger space close to the binding electrode 701, which allows the binding electrode 701 bound to the anode pin of the light-emitting device 30 to be as far away as possible from the other binding electrode 701 bound to the cathode pin of the same light-emitting device 30, thereby avoiding the melting of the binding eutectic layer and causing a short circuit between the anode pin and the cathode pin of the light-emitting device 30, which is beneficial to improving the binding yield of the light-emitting device 30. Furthermore, along a direction parallel to the plane of the substrate 10, the width W3 of the first bottom portion 40A of the transparent blocking wall 40 is smaller than the width W4 of the first top portion 40B, that is, the transparent blocking wall 40 has a structure that is wider at the top and narrower at the bottom. As a result, the area where the light-emitting device 30 is located has a larger space near the binding electrode 701, while being narrower on the side away from the binding electrode 701. This can relatively reduce the volume of the light-shielding layer 50 filled between the sidewalls of the light-emitting device 30 and the sidewalls of the transparent blocking wall 40 in the gap 00 in the subsequent process, thereby preventing the ultimately formed first light-shielding portion 501 from excessively covering the first surface 30A of the light-emitting device 30 and affecting light emission. In addition, the transparent blocking wall 40 has a structure that is wider at the top and narrower at the bottom, so that the area where the light-emitting device 30 is located is narrower on the side away from the binding electrode 701. This facilitates better fixing of the light-emitting device 30 within the curing range of the first light-shielding portion 501 after curing, thereby improving the overall stability and reliability of the light-emitting device 30 after being bound.

[0121] In the manufacturing method provided in this embodiment, after forming the transparent barrier wall 40, a recessed portion 40K is further formed on the surface of the transparent barrier wall 40 away from the substrate 10 through an exposure and development process. Optionally, a half-tone mask can be used to make the depth of the formed recessed portion 40K smaller than the thickness of the transparent barrier wall 40, and the recessed portion 40K does not penetrate the entire thickness of the transparent barrier wall 40. The formed recessed portion 40K includes a second bottom portion 40KA close to the substrate 10 and a second top portion 40KB away from the substrate 10. The second bottom portion 40KA and the second top portion 40KB can be understood as two opposing surfaces of the recessed portion 40K in a direction perpendicular to the plane of the substrate 10. Along the direction parallel to the plane of the substrate 10, it can be the direction from one light-emitting device 30 to another light-emitting device 30 adjacent thereto. The width W5 of the second bottom portion 40KA is smaller than the width W6 of the second top portion 40KB, that is, the recessed portion 40K has a structure that is wide at the top and narrow at the bottom. Figure 21 The cross-section of the recessed portion 40K presented in the figure is an inverted trapezoidal shape that is wide at the top and narrow at the bottom, which makes it easy to etch the recessed portion 40K on the surface of the transparent blocking wall 40. Moreover, in the subsequent process of manufacturing the light-shielding layer 50, the material in the recessed portion 40K is only used to fill the portion 50 to form the second light-shielding portion 502, which serves to shield the first metal signal line 702 below it. Therefore, the cross-section of the second light-shielding portion 502 formed in the recessed portion 40K having an inverted trapezoidal shape that is wide at the top and narrow at the bottom is also an inverted trapezoidal shape that is wide at the top and narrow at the bottom, which can make the width of the second light-shielding portion 502 as wide as possible, effectively increase the shielding range of the second light-shielding portion 502, and better shield the reflected light from the metal wiring.

[0122] Optionally, in the manufacturing method of this embodiment, when manufacturing the transparent baffle 40, along the direction parallel to the plane where the substrate 10 is located, it can be understood that one light-emitting device 30 points to the direction of another light-emitting device 30 adjacent to it, and the width W0 of the gap 00 between the side wall of the light-emitting device 30 and the side wall of the transparent baffle 40 is approximately 1μm, which can avoid the light-shielding layer 50 material filled in the gap 00 from affecting the subsequent curing effect (1μm is the thickness that the general light-shielding material can be cured), which is beneficial to ensuring the product yield.

[0123] Optionally, in this embodiment, after the first light-shielding portion 501 is manufactured, the first light-shielding portion 501 is further exposed and cured. After the opening 501K is formed by development, the entire substrate including the light-emitting device 30, the transparent blocking wall 40, the array substrate 001, the first light-shielding portion 501, and the second light-shielding portion 502 can be exposed and cured in UV light as a whole. This can further solidify the material of the light-shielding layer 50 filled on the side of the bottom of the light-emitting device 30 facing the substrate 10, thereby improving the reliability of the entire panel.

[0124] In some alternative embodiments, please refer to Figure 25, Figure 25 1 is a schematic diagram of a planar structure of a display device provided in an embodiment of the present disclosure. The display device 111 provided in this embodiment includes the display panel 000 provided in the above embodiment of the present invention. Figure 25 This embodiment uses a mobile phone as an example to illustrate the display device 111. It is understood that the display device 111 provided in the embodiment of the present invention can be a computer, a television, an in-vehicle display device, or other display device 111 having a display function, and the present invention does not impose any specific limitations thereon. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the display panel 000 provided in the embodiment of the present invention. For details, please refer to the detailed description of the display panel 000 in the above embodiments, and this embodiment will not be repeated here.

[0125] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0126] The foregoing description is intended only to provide specific embodiments of the present disclosure, intended to enable those skilled in the art to understand and implement the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the embodiments described herein, but rather to be construed in the broadest manner consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that: include: substrate; A driving array layer, located on one side of the substrate; a plurality of light-emitting devices, a plurality of transparent baffles, and a plurality of first light-shielding portions, wherein the light-emitting devices, the transparent baffles, and the first light-shielding portions are all located on a side of the driving array layer away from the substrate; Along a direction parallel to the plane of the substrate, the transparent blocking wall is located between two adjacent light-emitting devices, the first light-shielding portion is located between the two adjacent transparent blocking walls, and at least a portion of the first light-shielding portion is included between the sidewall of the transparent blocking wall and the sidewall of the light-emitting device; The orthographic projection of the first light shielding portion on the substrate covers the orthographic projection of the light emitting device on the substrate; In a direction perpendicular to the plane where the substrate is located, the light emitting device includes a first surface and a second surface opposite to each other, and the first surface is located on a side of the second surface away from the substrate; The first light shielding portion includes an opening, and the opening exposes at least a portion of the first surface of the light emitting device.

2. The display panel according to claim 1, wherein: The first face of the light emitting device includes a plurality of optical structures.

3. The display panel according to claim 2, wherein: At least a portion of the first light shielding portion is located on the first surface and covers a portion of the optical structure.

4. The display panel according to claim 1, wherein: An orthographic projection area of the opening on the substrate is smaller than an orthographic projection area of the first surface on the substrate.

5. The display panel according to claim 1, wherein: In a direction perpendicular to the plane of the substrate, the distance from the first surface to the substrate is H1, and the distance from the surface of the transparent barrier away from the substrate to the substrate is H2; wherein H2>H1.

6. The display panel according to claim 1, wherein: In a direction perpendicular to the plane of the substrate, the distance from the first surface to the substrate is H1, and the distance from the surface of the first light shielding portion away from the substrate to the substrate is H3; wherein H3>H1.

7. The display panel according to claim 1, wherein: In a direction perpendicular to the plane of the substrate, the distance from the surface of the transparent barrier away from the substrate to the substrate is H2, and the distance from the surface of the first light shielding portion away from the substrate to the substrate is H3; wherein H2>H3.

8. The display panel according to claim 1, wherein: A first planarization layer is further provided between the driving array layer and the light emitting device. The first planarization layer is made of a light-proof material.

9. The display panel according to claim 8, wherein: A binding electrode layer is provided between the first planarization layer and the light emitting device, the binding electrode layer includes a plurality of binding electrodes, and the light emitting device is electrically connected to the driving array layer via the binding electrodes; The driving array layer includes a first metal layer, no other conductive layer is included between the first metal layer and the binding electrode layer, and the first metal layer includes a plurality of first conductive parts; The first planarization layer includes a plurality of first via holes, and the binding electrode is electrically connected to the first conductive portion through the first via holes; The orthographic projection of the first via hole on the substrate is located within the orthographic projection range of the light emitting device on the substrate.

10. The display panel according to claim 9, wherein: Along a direction perpendicular to the plane where the substrate is located, the side of the transparent barrier away from the substrate includes a recessed portion, the depth of the recessed portion is less than the thickness of the transparent barrier; the recessed portion is filled with a second light shielding portion; The binding electrode layer includes a first signal line, and an orthographic projection of the second light shielding portion on the substrate at least partially overlaps with an orthographic projection of the first signal line on the substrate.

11. The display panel according to claim 10, wherein: The transparent barrier wall comprises a first bottom portion close to the substrate and a first top portion away from the substrate, wherein a width of the first bottom portion is smaller than a width of the first top portion along a direction parallel to a plane where the substrate is located; The recessed portion includes a second bottom portion close to the substrate and a second top portion away from the substrate. Along a direction parallel to a plane where the substrate is located, a width of the second bottom portion is smaller than a width of the second top portion.

12. A method for manufacturing a display panel, characterized in that: Used to manufacture the display panel according to any one of claims 1 to 11; the manufacturing method comprises: Providing an array substrate, the array substrate comprising a substrate and a driving array layer located on one side of the substrate; Providing a plurality of light-emitting devices, wherein the light-emitting devices are bound and electrically connected to the driving array layer; A transparent cover layer is fabricated, and the transparent cover layer is patterned by exposure and development, so that the transparent cover layer forms a plurality of transparent barrier walls; the transparent barrier walls are located between two adjacent light-emitting devices along a direction parallel to the plane of the substrate, and a space is formed between the sidewalls of the transparent barrier walls and the sidewalls of the light-emitting devices; A light-shielding layer is produced, and the light-shielding layer is patterned by exposure and development, so that the light-shielding layer forms a plurality of first light-shielding portions; along a direction parallel to the plane where the substrate is located, the first light-shielding portion is located between two adjacent transparent blocking walls, and at least a portion of the first light-shielding portion is filled in the gap; the first light-shielding portion includes an opening, and the opening at least exposes a portion of the first surface of the light-emitting device; wherein, in a direction perpendicular to the plane where the substrate is located, the light-emitting device includes a first surface and a second surface opposite to each other, and the first surface is located on the side of the second surface away from the substrate.

13. The manufacturing method according to claim 12, characterized in that: Among the multiple transparent blocking walls formed by the transparent covering layer, the transparent blocking walls include a first bottom close to the substrate and a first top away from the substrate; along a direction parallel to the plane where the substrate is located, the width of the first bottom is smaller than the width of the first top.

14. The manufacturing method according to claim 12, characterized in that: The display panel further includes a first signal line; Before forming the light-shielding layer, the method further includes: exposing and developing the transparent blocking wall to pattern the transparent blocking wall, so that a recessed portion is formed on a side of the transparent blocking wall away from the substrate in a direction perpendicular to the plane of the substrate, and the depth of the recessed portion is less than the thickness of the transparent blocking wall; the orthographic projection of the recessed portion on the substrate at least partially overlaps with the orthographic projection of the first signal line on the substrate; the recessed portion includes a second bottom portion close to the substrate and a second top portion away from the substrate, and the width of the second bottom portion is less than the width of the second top portion in a direction parallel to the plane of the substrate; When manufacturing the light shielding layer, the method further includes: exposing and developing the light shielding layer to pattern the light shielding layer, so that the light shielding layer forms a plurality of second light shielding portions, and the second light shielding portions are filled in the recessed portions.

15. The manufacturing method according to claim 12, characterized in that: After the first light shielding portion is manufactured, the method further includes exposing and curing the first light shielding portion.

16. The manufacturing method according to claim 12, characterized in that: The light shielding layer is made of a material comprising photoresist.

17. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 11.

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