Display device

Abstract

A display device according to an embodiment of the present disclosure includes: a display panel including a display area, an optical area disposed in the display area and including a through hole, and a non-display area configured to surround the display area; a support member disposed below the display panel; a first adhesive layer disposed between the display panel and the support member; a frame including a lower frame disposed below the support member, and a side frame disposed on side surfaces of the display panel, the support member, and the first adhesive layer; and a molding member disposed between the display panel, the support member, and the frame, in which the first adhesive layer extends from a side of the display panel adjacent to the optical region and is disposed between the display panel and the molding member.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of Korean Patent Application No. 2024-0019686 filed on February 8, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device, and more particularly, to a display device capable of reducing stress applied to a display panel. Background Art

[0004] With the advent of the information age, display devices that visually display electrical information signals are rapidly developing. Various studies are being conducted to develop various display devices that are thin and lightweight, consume low power, and have improved performance.

[0005] Representative display devices include liquid crystal display (LCD) devices, field emission display (FED) devices, electrowetting display (EWD) devices, and organic light emitting display (OLED) devices.

[0006] As a representative organic light-emitting display device, an electroluminescent display device refers to a display device that emits light independently. Unlike a liquid crystal display device, an electroluminescent display device does not require a separate light source and can therefore be manufactured as a lightweight and thin display device. In addition, the electroluminescent display device is advantageous in terms of power consumption because the electroluminescent display device operates at a low voltage. In addition, since the electroluminescent display device is also excellent in terms of color, response speed, viewing angle and contrast (CR), it is expected that the electroluminescent display device will be adopted in various fields. Summary of the Invention

[0007] One object to be achieved by embodiments of the present disclosure is to provide a display device capable of reducing stress applied to a display panel.

[0008] An object to be achieved by another embodiment of the present disclosure is to provide a display device capable of minimizing the occurrence of cracks caused by thermal deformation in a high-temperature or low-temperature environment.

[0009] The objects of the present disclosure are not limited to the above objects, and other objects not mentioned above can be clearly understood by those skilled in the art from the following description.

[0010] A display device according to an embodiment of the present disclosure includes: a display panel, the display panel including a display area, an optical area arranged in the display area and including a through-hole, and a non-display area configured to surround the display area; a supporting member arranged below the display panel; a first bonding layer arranged between the display panel and the supporting member; a frame, the frame including a lower frame arranged below the supporting member, and lateral frames arranged on side surfaces of the display panel, the supporting member, and the first bonding layer; and a molding member arranged between the display panel, the supporting member, and the frame, wherein the first bonding layer extends from a side of the display panel adjacent to the optical area and is arranged between the display panel and the molding member.

[0011] Additional details of exemplary embodiments are included in the detailed description and accompanying drawings.

[0012] In the display device according to an embodiment of the present disclosure, the adhesive layer is provided between the display panel and the molding member on a side of the display panel adjacent to the optical area, so that the adhesive layer can serve as a buffer between the display panel and the molding member, which can reduce damage to the display panel.

[0013] In a display device according to an embodiment of the present disclosure, an adhesive layer having a relatively low modulus is provided between the display panel and the molding member on a side of the display panel adjacent to the optical area, which can reduce the occurrence of thermal stress caused by the difference in thermal strain rate between the display panel and the molding member in a high or low temperature environment.

[0014] The effects according to the present disclosure are not limited to those exemplified above, and more various effects are included in the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0016] Figure 1 is a block diagram for explaining a display device according to an embodiment of the present disclosure;

[0017] Figure 2 is a diagram schematically illustrating a circuit configuration of a sub-pixel according to an embodiment of the present disclosure;

[0018] Figure 3 is a top view of a display device according to an embodiment of the present disclosure;

[0019] Figure 4 It is along Figure 3 A cross-sectional view taken along line IV-IV';

[0020] Figure 5 It is along Figure 3 A cross-sectional view taken along line V-V';

[0021] Figure 6 is a cross-sectional view of a sub-pixel according to an embodiment of the present disclosure; and

[0022] Figure 7 It is along Figure 3 A cross-sectional view taken along line VII-VII'. DETAILED DESCRIPTION

[0023] The advantages and features of the present disclosure and the methods for achieving these advantages and features will be clear by referring to the exemplary embodiments described in detail below and the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only as examples so that those skilled in the art can fully understand what is disclosed in the present disclosure and the scope of the present disclosure.

[0024] The shapes, sizes, proportions, angles, quantities, etc. shown in the drawings for describing the exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Throughout the disclosure, the same reference numerals generally represent the same elements. In addition, in the following description of the present disclosure, detailed explanations of known related arts may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "including," "having," and "consisting of" used herein are generally intended to allow the addition of other components, unless these terms are used together with the term "only." Unless expressly stated otherwise, any reference to the singular may include the plural.

[0025] Even if not explicitly stated, the components are interpreted as including the ordinary error range.

[0026] When terms such as "on," "over," "below," and "next to" are used to describe a positional relationship between two parts, one or more parts may be located between the two parts unless these terms are used together with the terms "immediately" or "directly."

[0027] When an element or layer is referred to as being “on” another element or layer, the other layer or other elements can be directly interposed on the other element or interposed therebetween.

[0028] Although the terms "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below can be the second component in the technical concept of the present disclosure.

[0029] Like reference numerals generally refer to like elements throughout the disclosure.

[0030] The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present disclosure is not limited to the size and thickness of the components shown.

[0031] The features of the various embodiments of the present disclosure may be partially or completely coupled or combined with each other and may be technically interlocked and operated in various ways, and the embodiments may be performed independently of or in association with each other.

[0032] Hereinafter, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0033] Figure 1 is a block diagram of a display device for explaining an embodiment of the present disclosure.

[0034] refer to Figure 1 , the display device of an embodiment of the present disclosure may include an image processing part 151 , a timing control part 152 , a data driving part 153 , a scan driving part 154 and a display panel PN.

[0035] The image processing part 151 may output a data signal DATA and a data enable signal DE, etc., which are provided from the outside.

[0036] In addition, for example, the image processing part 151 may output one or more of a vertical synchronization signal, a horizontal synchronization signal, and a clock signal in addition to the data enable signal DE.

[0037] The timing control section 152 may receive a data signal DATA, a data enable signal DE, and a driving signal (including a vertical synchronization signal, a horizontal synchronization signal, and a clock signal) from the image processing section 151. Furthermore, based on the driving signal, the timing control section 152 may output a gate timing control signal GDC for controlling the operation timing of the scan driving section 154, and output a data timing control signal DDC for controlling the operation timing of the data driving section 153.

[0038] In response to the data timing control signal DDC provided by the timing control section 152, the data driving section 153 can sample and latch the data signal DATA provided by the timing control section 152, convert the data signal DATA into a gamma reference voltage, and output the gamma reference voltage. The data driving section 153 can output the data signal DATA through the data lines DL1 to DLn. The data driving section 153 can be provided in the form of an integrated circuit (IC).

[0039] In addition, the scan driving portion 154 may output a scan signal in response to a gate timing control signal GDC provided from the timing control portion 152. The scan driving portion 154 may output the scan signal through the gate lines GL1 to GLm. The scan driving portion 154 may be provided in the form of an integrated circuit (IC) or formed on the display panel PN in a gate-in-panel (GIP) manner.

[0040] The display panel PN may display an image in response to the data signal DATA and the scan signal supplied from the data driving part 153 and the scan driving part 154 , respectively.

[0041] The display panel PN may include sub-pixels SP configured to display an image.

[0042] For example, the subpixel SP may include a red subpixel, a green subpixel, and a blue subpixel, or include a white subpixel, a red subpixel, a green subpixel, and a blue subpixel. Depending on the luminous properties, the subpixel SP may have one or more different luminous regions.

[0043] Figure 2 is a diagram schematically illustrating a circuit configuration of a sub-pixel according to an embodiment of the present disclosure.

[0044] refer to Figure 2 , one sub-pixel may include a switching transistor SW, a driving transistor DT, a capacitor Cst, a compensation circuit CC, and an organic light emitting element ED.

[0045] For example, the switching transistor SW can perform a switching operation in response to a scan signal provided via the first gate line GL1, so that a data signal provided via the first data line DL1 is stored as a data voltage in the capacitor Cst. Furthermore, for example, the driving transistor DT can operate based on the data voltage stored in the capacitor Cst, so that a driving current flows between the first power line EVDD (high potential voltage) and the second power line EVSS (low potential voltage). Furthermore, the organic light emitting element ED can operate based on the driving current generated by the driving transistor DT to emit light.

[0046] The compensation circuit CC refers to a circuit added to a sub-pixel to compensate for the threshold voltage of the driving transistor DT, etc. The compensation circuit CC may include one or more transistors. The compensation circuit CC may have various configurations depending on the external compensation method.

[0047] Figure 2 The subpixel shown has a 2T (transistor) 1C (capacitor) structure including a switching transistor SW, a driving transistor DT, a capacitor Cst, and a light-emitting element ED. However, when a compensation circuit CC is added, the subpixel can have various configurations such as 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, 7T2C, etc.

[0048] Figure 3 : is a top view of a display device according to an embodiment of the present disclosure. For ease of description, Figure 3 Only the display panel PN and the data driving part D-IC among various constituent elements of the display device 100 are shown.

[0049] The display panel PN may include a display area AA, an optical area OA disposed in the display area AA and including a through hole TH, and a non-display area NA configured to surround the display area AA.

[0050] The display area AA is a region of the display panel PN where an image is displayed.

[0051] Multiple sub-pixels SP and circuits for operating the multiple sub-pixels SP may be provided in the display area AA. The multiple sub-pixels SP may be the smallest unit constituting the display area AA. Display elements may be provided in each of the multiple sub-pixels SP. For example, an organic light-emitting element including an anode, a light-emitting layer, and a cathode may be provided in each of the multiple sub-pixels SP. However, the present disclosure is not limited thereto. In addition, the circuits configured to operate the multiple sub-pixels SP may include driving elements, circuits, and the like. For example, the circuits may include thin-film transistors, storage capacitors, gate lines, data lines, and the like. However, the present disclosure is not limited thereto.

[0052] The optical area OA is located within the display area AA, and a through hole TH may be provided within the optical area OA. The through hole TH may be provided within the display area AA of the display panel PN, thereby reducing the border area of the non-display area NA and maximizing the display area AA. Designs with a maximized display area AA maximize user screen immersion, thereby enhancing the aesthetic appearance.

[0053] The through hole TH may be formed to correspond to an electronic optical device. The electronic optical device may be a device that receives light passing through the display panel and performs a predetermined function in response to the received light. Therefore, the electronic optical device may be arranged to overlap with the through hole TH of the display panel PN. For example, the electronic optical device may be configured as a camera or various sensors. However, the present disclosure is not limited thereto. The electronic optical device may include all devices that perform a predetermined function in response to light. At the same time, because the electronic optical device is arranged below the display panel PN, the user may not visually recognize the electronic optical device. For example, in the case where the electronic optical device is a camera, the camera is arranged on the rear surface of the display panel PN. However, the camera may capture an image of the front surface of the display device 100 rather than the rear surface of the display device 100.

[0054] Figure 3 Two through holes TH are shown. However, the present disclosure is not limited thereto. Multiple through holes TH may be provided in various ways. For example, one or two holes may be provided in the display area AA. A camera may be provided in the first hole, and a distance detection sensor, a facial recognition sensor, or a wide-angle camera may be provided in the second hole.

[0055] The non-display area NA is an area where no images are displayed. Various lines and circuits for operating the display elements in the display area AA are arranged in the non-display area NA. For example, the non-display area NA may include link lines for transmitting signals to the multiple sub-pixels and circuits in the display area AA. The non-display area NA may also include gate in-panel (GIP) lines or driver ICs, such as a gate driver and a data driver D-IC.

[0056] The non-display area NA may be an area extending from the display area AA. However, the present disclosure is not limited thereto. The non-display area NA may be an area surrounding the display area AA. Figure 3 It is shown that the non-display area NA surrounds the display area AA with rounded corners. However, the shapes and arrangements of the display area AA and the non-display area NA are not limited to Figure 3 That is, the display area AA and the non-display area NA can be adapted to the design of an electronic device equipped with the display device 100. For example, the exemplary shape of the display area AA can also be a quadrangle, a pentagon, a hexagon, a circle, an ellipse, etc.

[0057] The non-display area NA includes a first non-display area NA1, a bending area BA, and a second non-display area NA2. The first non-display area NA1 extends from the display area AA and surrounds the display area AA. The bending area BA extends from one side of the first non-display area NA1 and curves. The second non-display area NA2 extends from the bending area BA and is positioned below the display area.

[0058] The first non-display area NA1 and the second non-display area NA2 may be areas arranged on the same plane as the display area AA or arranged parallel to the display area AA and maintained in a flat state. For example, the first non-display area NA1 may be arranged in a flat state on the same plane as the display area AA, and the second non-display area NA2 may be arranged in a flat state below the display area AA and arranged parallel to the display area AA. Therefore, for example, the display area AA, the first non-display area NA1, and the second non-display area NA2 may be referred to as non-curved areas. However, the present disclosure is not limited to this.

[0059] The driver IC D-IC may be disposed in the second non-display area NA2. The driver IC D-IC may provide data signals to the plurality of sub-pixels SP. For example, in response to a data timing control signal provided by a timing controller, the driver IC D-IC may sample and latch the data signal provided by the timing controller, convert the data signal into a gamma reference voltage, and output the gamma reference voltage. The driver IC D-IC may output the data signal via a plurality of data lines. For example, a pad portion may be disposed in the second non-display area NA2 in which the driver IC D-IC is disposed, and a printed circuit board electrically connected to the pad portion may also be disposed, and the printed circuit board may provide signals to the driver IC D-IC. However, the present disclosure is not limited thereto.

[0060] Meanwhile, the driver IC D-IC may be provided on one side of the display panel PN in the form of a chip-on-panel (COP) and connected to the display panel PN. Alternatively, the driver IC D-IC may be provided in the form of a chip-on-film (COF) provided on a separate flexible film and connected to the display panel PN. However, the present disclosure is not limited thereto.

[0061] When the display panel PN is bent, the driver IC D-IC disposed in the second non-display area NA2 is positioned below the display area AA. For example, the driver IC D-IC and the printed circuit board connected to the pad portion of the display panel PN can be moved to the rear surface side of the display panel PN and overlap the display area AA. Therefore, when viewed from above the display panel PN, circuit components such as the driver IC D-IC and the printed circuit board may not be visually discernible. Consequently, the size of the non-display area NA, as seen from above the display panel PN, can be reduced, enabling a narrow frame.

[0062] The display device 100 may further include various additional elements configured to generate various signals or operate pixels in the display area AA. Additional elements for operating pixels may include inverter circuits, multiplexers, electrostatic discharge (ESD) circuits, and the like. The display device 100 may further include additional elements related to functions other than pixel operation functions. For example, the display device 100 may further include additional elements that provide a touch detection function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure detection function, a tactile feedback function, and the like. The above-mentioned additional elements may be located in the non-display area NA and / or in an external circuit connected to the connection interface.

[0063] In the following, reference will be made to Figure 4 and Figure 5 The constituent elements of the display device 100 are described in more detail.

[0064] Figure 4 It is along Figure 3 A cross-sectional view taken along line IV-IV'. Figure 5 It is along Figure 3 A cross-sectional view taken along line V-V' in FIG.

[0065] refer to Figure 4 and Figure 5 The display device 100 may include a cover member 120, a third adhesive layer Adh3, a polarizing layer 110, a second adhesive layer Adh2, a display panel PN, a first-first adhesive layer Adh1-1, a supporting member 130, a fourth adhesive layer Adh4, a metal plate 140, a black matrix BM, a frame 150 and a molding member 160.

[0066] First, the display panel PN may include a substrate and a light emitting element.

[0067] The substrate may be a supporting member for supporting other components provided on the substrate of the display device 100, and the substrate may be made of an insulating material. For example, the substrate may be made of glass, resin, etc. In addition, the substrate may include plastic such as a polymer or polyimide (PI) and be made of a flexible material.

[0068] The light emitting element may be provided on the substrate. The light emitting element may be defined differently depending on the type of the display panel PN. For example, when the display panel PN is an organic light emitting display panel, the light emitting element may be an organic light emitting diode (OLED).

[0069] A driving transistor for operating the light-emitting element may be provided between the substrate and the light-emitting element. The driving transistor may be provided in a plurality of sub-pixel regions. For example, the driving transistor may include a gate electrode, an active layer, a source electrode, and a drain electrode. In addition, the driving transistor may further include a gate insulating layer for insulating the gate electrode from the active layer, and the driving transistor may further include an interlayer insulating layer for insulating the gate electrode from the source electrode and the drain electrode. Figure 6 The display panel PN is described in detail.

[0070] A polarizing layer 110 may be provided above the display panel PN. The polarizing layer 110 may be a layer for polarizing incident light. The polarizing layer 110 may be a film having a predetermined level of light transmittance, and absorbs external light and its reflected light to suppress a decrease in contrast. Specifically, the display panel PN includes various metal materials used for semiconductor elements, circuits, organic light-emitting elements, and the like. Therefore, external light entering the display panel PN may be reflected by the metal material. The reflection of external light may reduce the visibility of the display device 100. Therefore, the polarizing layer 110 may be provided to suppress the reflection of external light, thereby improving the outdoor visibility of the display device 100.

[0071] The second adhesive layer Adh2 may be disposed between the display panel PN and the polarizing layer 110. The second adhesive layer Adh2 may fix the display panel PN and the polarizing layer 110. The second adhesive layer Adh2 may minimize the occurrence of foreign matter or bubbles between the display panel PN and the polarizing layer 110, and an optically transparent adhesive such as an optically clear adhesive (OCA) or an optically clear resin (OCR) may be used. However, the present disclosure is not limited thereto.

[0072] The cover member 120 may be disposed on the polarizing layer 110. The cover member 120 may have a shape corresponding to the display panel PN and be disposed to cover the display panel PN. The cover member 120 may protect the display panel PN from external impacts, moisture, heat, etc. For example, the cover member 120 may be tempered glass. However, the present disclosure is not limited thereto.

[0073] refer to Figure 5, a black matrix BM may be disposed below the cover member 120. The black matrix BM may be disposed at the periphery of the cover member 120 and along the periphery of the cover member 120. In this case, the area where the black matrix BM is disposed may correspond to the first non-display area NA1. The black matrix BM may be made of a material having low permeability. Therefore, the black matrix BM can suppress external visual recognition of various components disposed below the first non-display area NA1. In addition, the black matrix BM may be made of a conductive material and discharge static electricity from the cover member 120.

[0074] The black matrix BM can be made of a resin containing chromium (Cr), graphite or conductive particles. In this case, the resin can be one or more materials selected from acrylic resin, epoxy resin, phenolic resin, polyamide-based resin, polyimide-based resin, unsaturated polyester-based resin, polyphenylene-based resin, polyphenylenesulfide-based resin and benzocyclobutene. However, the present disclosure is not limited thereto. In addition, the conductive particles can be made of any one of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), silver (Ag) and magnesium (Mg) or their alloys. However, the present disclosure is not limited thereto.

[0075] The third adhesive layer Adh3 may be provided between the polarizing layer 110 and the cover member 120. The third adhesive layer Adh3 may fix the polarizing layer 110 and the cover member 120. The third adhesive layer Adh3 may minimize the occurrence of foreign matter or bubbles between the polarizing layer 110 and the cover member 120, and an optically clear adhesive such as an optically clear adhesive (OCA) or an optically clear resin (OCR) may be used. However, the present disclosure is not limited thereto.

[0076] Meanwhile, the support member 130 may be provided below the display panel PN. The support member 130 may support the display panel PN and protect the display panel PN from external moisture, heat, impact, and the like. For example, the support member 130 may also be referred to as a backplane. The support member 130 may be made of a transparent organic insulating material to suppress curling and static electricity of the display device 100 and to check the appearance of the rear surface of the display device 100. For example, the support member 130 may be made of a plastic material such as polymethyl methacrylate (PMMA), polycarbonate (PC), polyvinyl alcohol (PVA), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), silicone resin, and polyurethane (PU). However, the present disclosure is not limited thereto.

[0077] The first-first adhesive layer Adh1-1 may be provided between the support member 130 and the display panel PN. The first-first adhesive layer Adh1-1 may fix the support member 130 and the display panel PN. The first-first adhesive layer Adh1-1 may be a pressure-sensitive adhesive that minimizes the presence of foreign matter or bubbles between the support member 130 and the display panel PN. However, the present disclosure is not limited thereto. For example, the display device may further include a first-second adhesive layer Adh1-2 ( Figure 4-5 ). Figure 7 The first-second adhesive layer Adh1-2 is described.

[0078] The metal plate 140 may be provided below the support member 130. The metal plate 140 may protect the support member 130 from external impacts that may be applied during the process of manufacturing the display device. In addition, the metal plate 140 may be used as a heat sink for dissipating heat generated from the display panel PN to the outside. The metal plate 140 may be made of a metal material such as stainless steel (SUS), stainless steel (SUS) containing different metals such as nickel (Ni), iron (Fe), aluminum (Al), and magnesium (Mg). In particular, stainless steel (SUS) may be applied to the metal plate 140. For example, because stainless steel (SUS) has high restoring force and rigidity, the metal plate 140 may maintain high rigidity even if the thickness of the metal plate 140 is reduced.

[0079] The fourth adhesive layer Adh4 may be provided between the support member 130 and the metal plate 140. The fourth adhesive layer Adh4 may fix the support member 130 and the metal plate 140. The fourth adhesive layer Adh4 may be a pressure sensitive adhesive (PSA) that minimizes the occurrence of foreign matter or bubbles between the support member 130 and the metal plate 140. However, the present disclosure is not limited thereto.

[0080] Reference together Figure 3 and Figure 5 , the additional back plate 130A and the additional metal plate 140A may be disposed under the metal plate 140 corresponding to the bending area BA.

[0081] The additional back plate 130A and the additional metal plate 140A can supplement the rigidity of the second non-display area NA2 of the display panel PN. At the same time, the additional back plate 130A and the additional metal plate 140A can be disposed so as not to overlap with the bending area BA. Therefore, the thickness of components disposed in the bending area BA can be minimized, and the flexibility of the bending area BA can be ensured by easily controlling the neutral surface of the bending area BA.

[0082] refer to Figure 5, a fifth adhesive layer Adh5 is disposed between the metal plate 140 and the additional metal plate 140A, and a sixth adhesive layer Adh6 is disposed between the additional metal plate 140A and the additional backing plate 130A. The fifth adhesive layer Adh5 can bond the metal plate 140 and the additional metal plate 140A, and the sixth adhesive layer Adh6 can bond the additional metal plate 140A and the additional backing plate 130A. For example, the fifth adhesive layer Adh5 and the sixth adhesive layer Adh6 can be configured as a pressure-sensitive adhesive (PSA). However, the present disclosure is not limited thereto.

[0083] The second non-display area NA2 of the display panel PN is disposed below the additional back plate 130A. Furthermore, a seventh adhesive layer Adh7 is disposed between the additional back plate 130A and the second non-display area NA2 of the display panel PN. The seventh adhesive layer Adh7 may bond the additional back plate 130A and the second non-display area NA2 of the display panel PN. For example, the seventh adhesive layer Adh7 may be configured as a pressure-sensitive adhesive (PSA). However, the present disclosure is not limited thereto.

[0084] The frame 150 is disposed below the metal plate 140. The frame 150 may be disposed below the metal plate 140 and along the periphery of the display device 100. That is, the frame 150 may include not only a lower frame 150-1 disposed below the metal plate 140, but also side frames 150-2 connected to the lower frame 150-1 and configured to surround the side surfaces of the display device 100. Therefore, the frame 150 may enhance the rigidity of the periphery of the display device 100.

[0085] For example, the frame 150 may be made of plastic such as polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), or a combination of these polymers, or metal such as copper (Cu) or stainless steel (SUS) to enhance the rigidity of the periphery of the display device 100. However, the present disclosure is not limited thereto.

[0086] In addition, a molding member 160 may be included that fills a space provided by the frame 150. Reference will be made to the following description of the molding member 160. Figure 7 The molding member 160 is described in detail.

[0087] refer to Figure 3 and Figure 5 The coating layer MCL can be disposed in the curved area BA of the display panel PN. For example, the coating layer MCL can be disposed adjacent to one side of the polarizing layer 110 disposed on the display panel PN. When the display panel PN is bent, tensile forces are applied to the display panel PN, potentially causing fine cracks in the display panel PN. Therefore, the coating layer MCL can be formed by coating the curved area with a thin resin to protect the display panel PN.

[0088] For example, the coating layer MCL may be disposed adjacent to one end of the polarizing layer 110 disposed in the first non-display area NA1, and the coating layer MCL may extend to the bending area BA and the second non-display area NA2. For example, the coating layer MCL may be coated in the area between the polarizing layer 110 in the first non-display area NA1 and the driver IC D-IC disposed in the second non-display area NA2. For example, one end of the coating layer MCL may be adjacent to the polarizing layer 110 of the first non-display area NA1, and the other end of the coating layer MCL may be adjacent to the driver IC D-IC disposed in the second non-display area NA2. However, the present disclosure is not limited thereto. The other end of the coating layer MCL may be spaced apart from the driver IC D-IC disposed in the second non-display area NA2.

[0089] In the following, reference will be made to Figure 6 The constituent elements of the display panel PN are described in more detail.

[0090] Figure 6 is a cross-sectional view showing a cross-sectional structure of a sub-pixel disposed in a display area according to an embodiment of the present disclosure. Specifically, Figure 6 Only constituent elements included in one sub-pixel SP provided in the display area AA in the display panel PN are shown.

[0091] refer to Figure 6 In the sub-pixel SP provided in the display area AA, the transistor layer TRL may be provided on the substrate SUB, and the planarization layer PLN may be provided on the transistor layer TRL. In addition, the light emitting element layer EDL may be provided on the planarization layer PLN, the encapsulation layer ENCAP may be provided on the light emitting element layer EDL, the touch sensing layer TSL may be provided on the encapsulation layer ENCAP, and the protection layer PAC may be provided on the touch sensing layer TSL. In addition, the polarization layer ( Figure 6 (not shown) can be set above the protective layer PAC.

[0092] The substrate SUB is a component for supporting various components included in the display device 100 and can be made of an insulating material. The substrate SUB may include a first substrate 110a, a second substrate 110b, and an interlayer insulating layer 110c. The interlayer insulating layer 110c may be provided between the first substrate 110a and the second substrate 110b. As described above, the substrate SUB may include the first substrate 110a, the second substrate 110b, and the interlayer insulating layer 110c, which may inhibit moisture penetration. For example, the first substrate 110a and the second substrate 110b may each be a substrate made of polyimide (PI).

[0093] Various types of patterns GE, DE, SE, and ACT for forming transistors such as a driving transistor DT, various types of insulating layers 111a, 111b, 112, 113a, 113b, and 114, and various types of metal patterns LS may be disposed on the transistor layer TRL in the display area AA.

[0094] Hereinafter, the stacked structure of the transistor layer TRL will be described in more detail.

[0095] A multi-buffer layer 111 a may be disposed on the second substrate 110 b , and an active buffer layer 111 b may be disposed on the multi-buffer layer 111 a .

[0096] A light blocking layer LS serving as a light shielding portion may be disposed on the multi-buffer layer 111 a .

[0097] The active buffer layer 111 b may be disposed on the light blocking layer LS.

[0098] The active layer ACT of the driving transistor DT may be disposed on the active buffer layer 111b. For example, the active layer ACT may be made of polycrystalline silicon (p-Si), amorphous silicon (a-Si), or an oxide semiconductor. However, the present disclosure is not limited thereto.

[0099] The gate insulating layer 112 may be disposed on the active layer ACT. The gate insulating layer 112 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof.

[0100] In addition, the gate electrode GE of the driving transistor DT may be disposed on the gate insulating layer 112. The gate electrode GE is disposed on the gate insulating layer 112 and overlaps the active layer ACT. The gate electrode GE may be made of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof. However, the present disclosure is not limited thereto.

[0101] A first interlayer insulating layer 113 a may be provided to cover the gate electrode GE. A second interlayer insulating layer 113 b may be provided on the first interlayer insulating layer 113 a.

[0102] The source electrode SE and the drain electrode DE of the driving transistor DT may be disposed on the second interlayer insulating layer 113 b .

[0103] The source electrode SE and the drain electrode DE may be connected to one side and the other side of the active layer ACT, respectively, through contact holes provided in the second interlayer insulating layer 113 b, the first interlayer insulating layer 113 a, and the gate insulating layer 112. The source electrode SE and the drain electrode DE may each be made of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof. However, the present disclosure is not limited thereto.

[0104] A portion of the active layer ACT overlapping the gate electrode GE may be a channel region. One of the source electrode SE and the drain electrode DE is connected to one side of the channel region of the active layer ACT, and the other is connected to the other side of the channel region of the active layer ACT.

[0105] A passivation layer 114 may be disposed on the source electrode SE and the drain electrode DE. The passivation layer 114 may serve to protect the driving transistor DT and may be configured as an inorganic layer, such as silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof.

[0106] A planarization layer PLN may be located over the transistor layer TRL.

[0107] The planarization layer PLN may include a first planarization layer 115a and a second planarization layer 115b. The planarization layer PLN protects the driving transistor DT and planarizes an upper portion of the driving transistor DT.

[0108] The first planarization layer 115 a may be disposed on the passivation layer 114 .

[0109] The connection electrode CE may be disposed on the first planarization layer 115 a .

[0110] The connection electrode CE may be connected to one of the source electrode SE and the drain electrode DE through a contact hole provided in the first planarization layer 115 a .

[0111] The second planarization layer 115 b may be disposed on the connection electrode CE.

[0112] The light emitting element layer EDL may be located on the second planarization layer 115 b .

[0113] Hereinafter, the stacked structure of the light emitting element layer EDL will be described in detail.

[0114] The anode E1 may be disposed on the second planarization layer 115B. In this case, the anode E1 may be electrically connected to the connection electrode CE through a contact hole disposed in the second planarization layer 115b. The anode E1 may be made of a metal material.

[0115] If the display device 100 is a top-emission display device in which light emitted from the light-emitting elements ED propagates toward the upper side of the substrate SUB on which the light-emitting elements ED are disposed, the anode E1 may further include a transparent conductive layer and a reflective layer disposed below the transparent conductive layer. For example, the transparent conductive layer may be made of a transparent conductive oxide such as ITO or IZO. For example, the reflective layer may be made of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof.

[0116] A bank 116 may be provided to cover the anode E1. Furthermore, a portion of the bank 116 corresponding to the light-emitting region of the sub-pixel may have an opening. A portion of the anode E1 may be exposed through the opening portion of the bank 116 (hereinafter referred to as the opening region). In this case, the bank 116 may be made of an inorganic insulating material, such as silicon nitride (SiNx) or silicon oxide (SiOx), or the bank 116 may be made of an organic insulating material, such as a benzocyclobutene-based resin, an acrylic resin, or an imide-based resin. However, the present disclosure is not limited thereto.

[0117] The light emitting layer EL may be provided in the opening region of the bank 116. Therefore, the light emitting layer E1 may be provided on the anode E1 exposed through the opening region of the bank 116.

[0118] The cathode E2 may be provided on the light emitting layer EL.

[0119] The light emitting element ED may be formed of an anode E1, a light emitting layer EL, and a cathode E2. The light emitting layer EL may include a plurality of organic layers.

[0120] The encapsulation layer ENCAP may be located over the light emitting element layer EDL.

[0121] The encapsulation layer ENCAP may have a single-layer or multi-layer structure. For example, the encapsulation layer ENCAP may include a first encapsulation layer 117a, a second encapsulation layer 117b, and a third encapsulation layer 117c.

[0122] In this case, the first encapsulating layer 117a and the third encapsulating layer 117c may each be configured as an inorganic layer, and the second encapsulating layer 117b may be configured as an organic layer. Among the first encapsulating layer 117a, the second encapsulating layer 117b and the third encapsulating layer 117c, the second encapsulating layer 117b may be the thickest and serve as a planarization layer.

[0123] The first encapsulating layer 117a may be disposed on the cathode E2 and closest to the light-emitting element ED. The first encapsulating layer 117a may be made of an inorganic insulating material that can be deposited at low temperatures. For example, the first encapsulating layer 117a may be made of silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), aluminum oxide (Al2O3), or the like. Because the first encapsulating layer 117a is deposited at low temperatures, damage to the light-emitting layer EL, which is made of an organic material susceptible to high temperatures, can be suppressed during the deposition process.

[0124] The second encapsulation layer 117b may have a smaller area than the first encapsulation layer 117a. In this case, the second encapsulation layer 117b may be formed to expose two opposite ends of the first encapsulation layer 117a. The second encapsulation layer 117b may serve as a buffer for relieving stress between layers. The second encapsulation layer 117b may be used to improve planarization performance.

[0125] For example, the second encapsulating layer 117b may be made of an organic insulating material such as acrylic resin, epoxy resin, polyimide, polyethylene, or silicon oxycarbide (SiOC). For example, the second encapsulating layer 117b may also be formed in an inkjet manner. However, the present disclosure is not limited thereto.

[0126] The third encapsulating layer 117c may be formed over the second encapsulating layer 117b to cover the top and side surfaces of each of the second encapsulating layer 117b and the first encapsulating layer 117a. In this case, the third encapsulating layer 117c may minimize or block external moisture or oxygen from penetrating into the first encapsulating layer 117a and the second encapsulating layer 117b. For example, the third encapsulating layer 117c may be made of an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3).

[0127] The touch sensing layer TSL may be disposed over the encapsulation layer ENCAP.

[0128] Specifically, the touch sensing layer TSL may include a touch buffer layer 118 a disposed on the encapsulation layer ENCAP, a bridging electrode BE disposed on the touch buffer layer 118 a, a touch interlayer insulating layer 118 b disposed on the touch buffer layer 118 a and the bridging electrode BE, and a plurality of touch electrodes TE disposed on the touch interlayer insulating layer 118 b.

[0129] The touch buffer layer 118 a may suppress external moisture, foreign matter, or liquid chemicals (such as a developer or an etching solution) used during a process of manufacturing a touch electrode formed on the touch buffer layer 118 a from penetrating into the light emitting element.

[0130] The plurality of touch electrodes TE may include a plurality of first touch electrodes extending in a first direction, and a plurality of second touch electrodes extending in a second direction intersecting the first direction.

[0131] For example, the plurality of first touch electrodes and the plurality of second touch electrodes may be provided on the same layer. However, the plurality of second touch electrodes may be provided so as to be separated from each other in the region where the plurality of first touch electrodes and the plurality of second touch electrodes intersect. The plurality of separated second touch electrodes may be connected by a bridge electrode BE. The touch interlayer insulating layer 118b may be provided between the plurality of second touch electrodes and the bridge electrode BE.

[0132] A protective layer PAC 119 may be provided to cover the touch sensing layer TSL. The protective layer 119 may be configured as an organic insulating layer. The protective layer 119 may suppress a level difference of the uppermost layer of the display device 100 , thereby improving visibility of the display device 100 .

[0133] In the following, reference will be made to Figure 7 A side of the display device 100 adjacent to the optical area OA is described in more detail.

[0134] Figure 7 It is along Figure 3 The cross-sectional view taken along line VII-VII' in FIG. Figure 4 and Figure 5 The description of the constituent elements that are substantially the same as those shown in FIG. 1 is repeated. The same reference numerals are used for the same parts.

[0135] refer to Figure 7 In the display device 100 according to an embodiment of the present disclosure, similar to the display area AA of the display device 100, one side of the display device 100 adjacent to the optical area OA may include a covering member 120, a third adhesive layer Adh3, a polarizing layer 110, a second adhesive layer Adh2, a display panel PN, a first adhesive layer Adh1, a supporting member 130, a fourth adhesive layer Adh4, a metal plate 140 and a frame 150.

[0136] In the display device 100 according to an embodiment of the present disclosure, the frame 150 may be disposed below the metal plate 140 and along the periphery of the display device 100. That is, the frame 150 may include not only a lower frame 150-1 disposed below the metal plate 140, but also a side frame 150-2 connected to the lower frame 150-1 and configured to surround the side surface of the display device 100.

[0137] The display device 100 according to an embodiment of the present disclosure may include a molding member 160 configured to fill the space provided by the frame 150. For example, the molding member 160 may be disposed between the frame 150 and the cover member 120, the polarizing layer 110, the display panel PN, the support member 130, and the metal plate 140. The molding member 160 may be formed to seal the lower portion of the cover member 120, the side surfaces of the polarizing layer 110, the side surfaces of the display panel PN, the side surfaces of the support member 130, and the side surfaces of the metal plate 140. Because the molding member 160 seals the lower portion of the cover member 120, the side surfaces of the polarizing layer 110, the side surfaces of the display panel PN, the side surfaces of the support member 130, and the side surfaces of the metal plate 140, it is possible to suppress the penetration of moisture, oxygen, or foreign matter into the display device 100. In addition, the molding member 160 may protect the components of the display device 100 and mitigate impacts applied to the display device 100.

[0138] For example, the molding member 160 may be formed by filling the inside of the frame 150 with a material constituting the molding member 160 and curing the material. However, the method of forming the molding member 160 is not limited thereto.

[0139] The molding member 160 may include a curable resin. For example, the molding member 160 may be made of one or more materials selected from acrylic resin, epoxy resin, phenolic resin, polyamide-based resin, polyimide-based resin, unsaturated polyester-based resin, polyphenylene resin, polyphenylene sulfide-based resin, and benzocyclobutene. However, the present disclosure is not limited thereto.

[0140] In a display device according to an embodiment of the present disclosure, the first adhesive layer Adh1 disposed between the display panel PN and the support member 130 may include a first-first adhesive layer Adh1-1 disposed between the display panel PN and the support member 130, and a first-second adhesive layer Adh1-2 extending from the first-first adhesive layer Adh1-1 on a side of the display device 100 adjacent to the optical area OA and disposed between the display panel PN and the molding member 160. For example, the first-second adhesive layer Adh1-2 may be disposed between the display panel PN and the molding member 160 and cover the side surface of the display panel PN. The first adhesive layer Adh1 may serve as a buffer between the display panel PN and the molding member 160, thereby suppressing cracking of the display panel PN. In addition, the structure formed by extending the first adhesive layer Adh1 serves as a buffer between the display panel PN and the molding member 160, eliminating the need for a separate process for adding a buffer structure, which can reduce process costs and time.

[0141] In addition, the first adhesive layer Adh1 may cover not only the side surface of the display panel PN but also the side surface of the constituent elements provided on the display panel PN. For example, the first-second adhesive layer Adh1-2 extending from the first-first adhesive layer Adh1-1 may be provided to extend to the bottom surface of the cover member 120 and cover the side surface of the constituent elements provided between the first-first adhesive layer Adh1-1 and the bottom surface of the cover member 120. For example, the first-second adhesive layer Adh1-2 may cover the side surface of the display panel PN, the side surface of the second adhesive layer Adh2, the side surface of the polarizing layer 110, and the side surface of the third adhesive layer Adh3.

[0142] In the display device 100 according to an embodiment of the present disclosure, a material having a low modulus may be applied to the first adhesive layer Adh1. For example, the first adhesive layer Adh1 may be a pressure-sensitive adhesive, i.e., a pressure-sensitive adhesive having a modulus that is approximately 30% lower than that of a general pressure-sensitive adhesive. For example, the modulus of the first adhesive layer Adh1 may be lower than the modulus of the fourth adhesive layer Adh4. The modulus of the first adhesive layer Adh1 may be 1.0×10 4 Pa to 9.9×10 4 Pa, and the modulus of the fourth adhesive layer Adh4 may be 1.0×10 5 Pa to 9.9×10 5 However, the present disclosure is not limited thereto. Since the first adhesive layer Adh1 has a relatively low modulus, the first adhesive layer Adh1 may function as a buffer to relieve stress.

[0143] In addition, in the display device 100 according to the embodiment of the present disclosure, the side surfaces of the constituent elements disposed below the first adhesive layer Adh1 (i.e., the side surface of the support member 130, the side surface of the fourth adhesive layer Adh4, and the side surface of the metal plate 140) may be sealed by the molding member 160. That is, the first adhesive layer may not be disposed on the side surface of the fourth adhesive layer Adh4 and the side surface of the metal plate 140, nor may it extend to the side surface of the fourth adhesive layer Adh4 and the side surface of the metal plate 140.

[0144] A material having high rigidity against external impact may be applied to the metal plate 140 , so that the metal plate 140 may not be damaged even if a separate buffer structure is not provided between the metal plate 140 and the molding member 160 .

[0145] After the display device is manufactured, a reliability assessment process of repeatedly providing high and low temperatures can be performed to identify the stability of the product. In the related art, since there is no gap between the display panel and the molding member, there is the following problem: during the reliability assessment process, the thermal stress caused by the difference in thermal strain rate between the display panel and the molding member accumulates between the display panel and the molding member. When the thermal stress accumulates on the edge of the through hole, a dark spot is formed at the edge of the through hole, and a growing dark spot (GDS) defect in which the dark spot gradually becomes larger is caused. In order to solve the problem in the related art, attempts have been made to reduce the deformation between the display panel and the molding member by applying ink between the display panel and the molding member. However, applying ink causes the problem of increased cost. In addition, because the ink is applied after the display device is manufactured, the ink used as a buffer between the display panel and the molding member during the trimming process for forming the through hole in the optical area does not exist, which leads to the problem of moisture penetration.

[0146] Therefore, in the display device 100 according to an embodiment of the present disclosure, the adhesive layer Adh1 having a relatively low modulus is provided between the display panel PN and the molding member 160. Therefore, the adhesive layer Adh1 having a relatively low modulus may function as a buffer layer and may reduce the occurrence of thermal stress caused by the difference in thermal strain rate between the display panel PN and the molding member 160 in a high or low temperature environment.

[0147] Furthermore, the first adhesive layer Adh1, which has a relatively low modulus, extends and is disposed between the display panel PN and the molding member 160. This can protect the side surface of the display panel PN and suppress moisture from penetrating into the side surface of the display panel PN. Furthermore, the first adhesive layer Adh1 can serve as a buffer between the display panel PN and the molding member 160. Therefore, thermal stress accumulation on one side of the display panel PN, particularly at the edge of the through hole TH, can be suppressed. Consequently, the reliability of the display device 100 according to an embodiment of the present disclosure can be improved.

[0148] In addition, in the display device 100 according to an embodiment of the present disclosure, during the trimming process for forming the through hole TH in the optical area OA, the first adhesive layer Adh1 extends to cover the side surface of the display panel PN. Therefore, since the first adhesive layer protects the side surface of the display panel during this process, the effect of suppressing moisture penetration into the side surface of the display panel PN can be further improved.

[0149] Hereinafter, the effects of the above-described embodiments according to the present disclosure will be described in more detail with reference to the present embodiment and comparative examples.

[0150] First, the present embodiment shown in Table 1 below is a display device 100 according to an embodiment of the present disclosure. In this case, the applied modulus is 1.0×10 4 Pa to 9.9×10 4 The pressure-sensitive adhesive of Pa is used as the first adhesive layer Adh1, and its modulus is about 30% lower than that of a general pressure-sensitive adhesive.

[0151] On the other hand, the comparative embodiment differs from the present embodiment in structure in that in the comparative embodiment, the display panel PN and the molding member 160 are in contact with each other on the side of the display device 100 adjacent to the optical area OA. That is, the display device of the comparative embodiment has a structure in which no adhesive layer is provided between the display panel PN and the molding member 160 on the side of the display device 100 adjacent to the optical area OA.

[0152] When the display devices of this embodiment and the comparative embodiment were alternately exposed to a high temperature (65°C) environment and a low temperature (-20°C) environment, the maximum principal stress at the edge of the through hole TH was measured. The maximum principal stress is shown in Table 1 below. In this case, the maximum principal stress refers to the normal stress when only normal stress is applied to any surface, including any point in an object subjected to an external force, without applying shear stress to the surface.

[0153] [Table 1]

[0154]

[0155] As shown in Table 1, it can be determined that, as in this embodiment, when the first adhesive layer Adh1 extends and is provided on the side surface of the display panel PN, the first adhesive layer Adh1 acts as a buffer, resulting in a reduction in maximum principal stress of approximately 26% compared to the display device of the comparative embodiment. Therefore, in the display device 100 of this embodiment, since the maximum principal stress accumulated at the edge of the through hole TH is reduced compared to the display device of the comparative embodiment, the occurrence of cracks in the display panel PN at the edge of the through hole TH can be reduced. As a result, the reliability of the display device 100 can be improved.

[0156] Exemplary embodiments of the present disclosure may also be described as follows:

[0157] According to one aspect of the present disclosure, a display device includes: a display panel, the display panel including a display area, an optical area arranged in the display area and including a through hole, and a non-display area configured to surround the display area; a supporting member arranged below the display panel; a first adhesive layer arranged between the display panel and the supporting member; a frame, the frame including a lower frame arranged below the supporting member, and side frames arranged on side surfaces of the display panel, the supporting member and the first adhesive layer; and a molding member arranged between the display panel, the supporting member and the frame, wherein the first adhesive layer extends from a side of the display panel adjacent to the optical area and is arranged between the display panel and the molding member.

[0158] The first adhesive layer may cover a side surface of the display panel at a side of the display panel adjacent to the optical region.

[0159] The display device may further include a polarizing layer disposed on the display panel, and a second adhesive layer disposed between the display panel and the polarizing layer, wherein the first adhesive layer may cover a side surface of the polarizing layer and a side surface of the second adhesive layer on a side of the display panel adjacent to the optical region.

[0160] The display device may further include a cover member disposed on the polarizing layer, and a third adhesive layer disposed between the cover member and the polarizing layer, and the first adhesive layer may cover a side surface of the third adhesive layer on a side of the display panel adjacent to the optical region.

[0161] The molding member may include a curable resin.

[0162] The display device may further include a metal plate disposed under the support member, and a fourth adhesive layer disposed between the support member and the metal plate, and side surfaces of the metal plate and the fourth adhesive layer may be sealed by the molding member.

[0163] The modulus of the fourth adhesive layer may be greater than the modulus of the first adhesive layer.

[0164] The modulus of the first adhesive layer may be 1.0×10 4 Pa to 9.9×10 4 Pa, and the modulus of the fourth adhesive layer may be 1.0×10 5 Pa to 9.9×10 5 Pa.

[0165] The display panel may be bent in a bending region extending and bending from one side of the non-display region at the other side of the display panel opposite to one side of the display panel adjacent to the optical region.

[0166] The display device may further include an electro-optical device disposed to overlap the optical region.

[0167] The first adhesive layer is provided to extend to a bottom surface of the cover member.

[0168] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto, and the present disclosure can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within their equivalent scope should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device comprising: a display panel including a display area, an optical area provided in the display area and including a through hole, and a non-display area configured to surround the display area; a supporting member, the supporting member being disposed below the display panel; a first adhesive layer disposed between the display panel and the supporting member; a frame including a lower frame disposed below the supporting member, and side frames disposed on side surfaces of the display panel, the supporting member, and the first adhesive layer, and a molding member disposed between the display panel, the supporting member, and the frame, The first adhesive layer extends from a side of the display panel adjacent to the optical region and is disposed between the display panel and the molding member.

2. The display device according to claim 1, wherein The first adhesive layer covers a side surface of the display panel at a side of the display panel adjacent to the optical region.

3. The display device according to claim 1, further comprising: a polarizing layer, the polarizing layer being disposed on the display panel; as well as a second adhesive layer, the second adhesive layer being disposed between the display panel and the polarizing layer; The first adhesive layer covers a side surface of the polarizing layer and a side surface of the second adhesive layer on a side of the display panel adjacent to the optical region.

4. The display device according to claim 3, further comprising: a covering member disposed on the polarizing layer; as well as a third adhesive layer provided between the cover member and the polarizing layer, The first adhesive layer covers a side surface of the third adhesive layer on a side of the display panel adjacent to the optical region.

5. The display device according to claim 1, wherein The molding member includes a curable resin.

6. The display device according to claim 1, further comprising: a metal plate disposed below the support member; as well as a fourth adhesive layer provided between the supporting member and the metal plate, wherein a side surface of the metal plate and a side surface of the fourth adhesive layer are sealed by the molding member.

7. The display device according to claim 6, wherein: The modulus of the fourth adhesive layer is greater than the modulus of the first adhesive layer.

8. The display device according to claim 7, wherein: The modulus of the first adhesive layer is 1.0×10 4 Pa to 9.9×10 4 Pa, and the modulus of the fourth adhesive layer is 1.0×10 5 Pa to 9.9×10 5 Pa.

9. The display device according to claim 1, wherein The display panel is bent in a bending region extending and bending from one side of the non-display region at the other side of the display panel, the other side of the display panel being opposite to one side of the display panel adjacent to the optical region.

10. The display device according to claim 1, further comprising: An electro-optical device is disposed so as to overlap with the optical region.

11. The display device according to claim 4, wherein The first adhesive layer is provided to extend to a bottom surface of the cover member.

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