Display panel and display device

Abstract

The invention provides a display panel and a display device, the display panel comprises a display area and a non-display area, and the display panel comprises a substrate, a light emitting unit, an isolation structure, a packaging layer and a dam structure; the light-emitting units are arranged on one side of the substrate and located in the display area, the isolation structure is arranged on one side of the substrate and located in the display area, and the isolation structure is provided with a plurality of isolation openings for containing the light-emitting units; the packaging layer comprises an organic packaging sub-layer covering the light-emitting unit; the dam structure is arranged on one side of the substrate and located in the non-display area, the dam structure comprises a first dam, and the first dam comprises a first metal layer.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular relates to a display panel and a display device. Background Art

[0002] Organic light-emitting diodes (OLEDs) and flat-panel displays based on LED technologies are widely used in consumer electronics such as mobile phones, televisions, laptops, and desktop computers due to their advantages of high image quality, power efficiency, thinness, and wide application range. They have become the mainstream display device. However, the reliability of current OLED display products needs to be improved. Summary of the Invention

[0003] The embodiments of the present application provide a display panel and a display device, which can reduce the risk of water and oxygen intrusion caused by overflow of the encapsulation material of the organic encapsulation sublayer, thereby improving product reliability.

[0004] On the one hand, an embodiment of the present application provides a display panel, including a display area and a non-display area, the display panel including a substrate, an isolation structure, an encapsulation layer and a dam structure; the light-emitting unit is arranged on one side of the substrate and is located in the display area; the isolation structure is arranged on one side of the substrate and is located in the display area, and the isolation structure is provided with multiple isolation openings for accommodating the light-emitting unit; the encapsulation layer includes an organic encapsulation sublayer covering the light-emitting unit; the dam structure is arranged on one side of the substrate and is located in the non-display area, the dam structure includes a first dam, and the first dam includes a first metal layer.

[0005] In some embodiments, the first dam further includes a first insulating layer stacked with the first metal layer;

[0006] Preferably, the display panel includes a driving circuit layer arranged on one side of the substrate, the driving circuit layer includes a first conductive layer, a second conductive layer, a third conductive layer and a fourth conductive layer arranged in a stacked manner, and the first metal layer is arranged in the same layer and material as at least one of the first conductive layer, the second conductive layer, the third conductive layer and the fourth conductive layer.

[0007] In some embodiments, the dam structure further comprises a second dam disposed adjacent to the first dam, with an overflow trough formed between the first dam and the second dam;

[0008] Preferably, the second dam is located on a side of the first dam away from the display area, and the height of the second dam is greater than that of the first dam;

[0009] Preferably, the dam structure is arranged around the display area.

[0010] In some embodiments, the second dam includes a second metal layer and a second insulating layer stacked with the second metal layer;

[0011] Preferably, the second metal layer is provided in the same layer and with the same material as at least one of the first conductive layer, the second conductive layer, the third conductive layer and the fourth conductive layer;

[0012] Preferably, the first metal layer and the second metal layer are spaced apart;

[0013] Preferably, the first metal layer and the second metal layer are conductive with each other;

[0014] Preferably, the first metal layer includes a first metal sublayer and a second metal sublayer sequentially stacked in a direction away from the substrate, the first metal sublayer and the third conductive layer are provided in the same layer and made of the same material, and the second metal sublayer and the fourth conductive layer are provided in the same layer and made of the same material;

[0015] Preferably, the second metal layer includes a third metal sub-layer and a fourth metal sub-layer sequentially stacked in a direction away from the substrate.

[0016] In some embodiments, the first metal sub-layer and the third metal sub-layer are disposed in the same layer and are conductive to each other;

[0017] Preferably, the first metal sublayer, the third metal sublayer and the third conductive layer are provided in the same layer and with the same material.

[0018] In some embodiments, the second metal sub-layer and the fourth metal sub-layer are disposed in the same layer and are conductive to each other;

[0019] Preferably, the second metal sub-layer, the fourth metal sub-layer and the fourth conductive layer are provided in the same layer and with the same material.

[0020] In some embodiments, the dam structure further includes a connection layer, which is disposed between the first dam and the second dam and conducts the first metal layer and the second metal layer;

[0021] Preferably, the connection layer includes a conductive area and a via area, the conductive area conducts the first metal layer and the second metal layer, the via area is formed with a via in a direction perpendicular to the substrate, and the overflow groove includes the via;

[0022] Preferably, there are plural conductive areas and plural via areas, and the plural conductive areas and plural via areas are staggered along the extension direction of the edge of the display area.

[0023] In some embodiments, the first insulating layer includes a first organic insulating sublayer and a first inorganic insulating sublayer, and the first metal layer, the first organic insulating sublayer, and the first inorganic insulating sublayer are stacked; the second insulating layer includes a second organic insulating sublayer and a second inorganic insulating sublayer, and the second metal layer, the second organic insulating sublayer, and the second inorganic insulating sublayer are stacked.

[0024] In some embodiments, the display panel includes a first planarization layer located in the display area, and the first planarization layer, the first organic insulating sublayer, and at least a portion of the second organic insulating sublayer are arranged in the same layer and the same material;

[0025] Preferably, the display panel further comprises a second planarization layer located in the display area, the second organic insulating sublayer comprises a first sublayer and a second sublayer, the first sublayer and the first planarization layer are provided in the same layer and with the same material, and the second sublayer and the second planarization layer are provided in the same layer and with the same material;

[0026] Preferably, the second sublayer extends from one end of the third metal sublayer to cover a portion of the third metal sublayer, the fourth metal sublayer covers the remaining portion of the third metal sublayer, and the first sublayer covers the second sublayer and the second metal layer;

[0027] Preferably, the first organic insulating sublayer covers the first metal layer.

[0028] In some embodiments, the display panel further includes a pixel definition layer located in the display area, the pixel definition layer including a pixel defining portion and a pixel opening enclosed by the pixel defining portion, the pixel opening being used to arrange the light-emitting unit, the isolation structure being arranged on a side of the pixel defining portion facing away from the substrate, and the first inorganic insulating sublayer, the second inorganic insulating sublayer, and the pixel definition layer being arranged in the same layer and made of the same material;

[0029] Preferably, the display panel further comprises a third inorganic insulating sublayer disposed between the first dam and the second dam, the third inorganic insulating sublayer, the first inorganic insulating sublayer, the second inorganic insulating sublayer, and the pixel definition layer being disposed in the same layer and made of the same material, and the overflow groove being located on a side of the third inorganic insulating sublayer facing away from the substrate;

[0030] Preferably, the display panel also includes a third insulating layer, which is located between the dam structure and the substrate in a direction perpendicular to the substrate. When the first metal layer and the second metal layer are spaced apart, the third inorganic insulating sublayer is attached to the side of the third insulating layer facing away from the substrate. When the connecting layer conducts the first metal layer and the second metal layer, the third inorganic insulating sublayer is attached to the side of the connecting layer facing away from the substrate.

[0031] In some embodiments, the orthographic projection of the first metal layer on the substrate and the orthographic projection of the first organic insulating sublayer on the substrate are both located within the orthographic projection of the first inorganic insulating sublayer on the substrate, and the orthographic projection of the second metal layer on the substrate and the orthographic projection of the second organic insulating sublayer on the substrate are both located within the orthographic projection of the second inorganic insulating sublayer on the substrate;

[0032] Preferably, the encapsulation layer also includes a second inorganic encapsulation sublayer covering the organic encapsulation sublayer, the second inorganic encapsulation sublayer extends to the non-display area and covers the dam structure, and the orthographic projection of the portion of the second inorganic encapsulation sublayer located in the non-display area on the substrate overlaps with the orthographic projection of the first inorganic insulating sublayer on the substrate and the orthographic projection of the second inorganic insulating sublayer on the substrate.

[0033] In a second aspect, an embodiment of the present application provides a display panel comprising a display area and a non-display area, the display panel comprising a substrate, a light-emitting unit, an encapsulation layer and a dam structure, the light-emitting unit being arranged on one side of the substrate and located in the display area; the encapsulation layer comprising an organic encapsulation sublayer covering the light-emitting unit; the dam structure being arranged on one side of the substrate and located in the non-display area, the dam structure comprising a first dam comprising a first metal layer and a first insulating layer stacked together.

[0034] In some embodiments, the dam structure further comprises a second dam disposed adjacent to the first dam, with an overflow trough formed between the first dam and the second dam;

[0035] Preferably, the second dam is located on a side of the first dam away from the display area, and the height of the second dam is greater than that of the first dam;

[0036] Preferably, the height H3 of the first dam satisfies: 3.5um≤H3≤5um;

[0037] Preferably, the height H4 of the second dam satisfies: 5.5um≤H4≤8.5um;

[0038] Preferably, the second dam comprises a second metal layer and a second insulating layer stacked together, the first metal layer and the second metal layer have the same thickness, and the second insulating layer has a thickness greater than that of the first insulating layer;

[0039] Preferably, the display panel further comprises a third insulating layer, the third insulating layer is located between the dam structure and the substrate in a direction perpendicular to the substrate, a groove is formed on a side of the third insulating layer facing away from the substrate, and the overflow groove comprises the groove.

[0040] In some embodiments, the first insulating layer includes a first organic insulating sublayer and a first inorganic insulating sublayer, the second insulating layer includes a second organic insulating sublayer and a second inorganic insulating sublayer, the first metal layer, the first organic insulating sublayer, and the first inorganic insulating sublayer are stacked, and the second metal layer, the second organic insulating sublayer, and the second inorganic insulating sublayer are stacked;

[0041] Preferably, the thickness of the second organic insulating sublayer along the direction perpendicular to the substrate is greater than the thickness of the first organic insulating sublayer along the direction perpendicular to the substrate.

[0042] In a third aspect, an embodiment of the present application further provides a display device comprising any one of the display panels described above.

[0043] Embodiments of the present application provide a display panel and a display device. The display panel includes a display area and a non-display area. The display panel includes a substrate, a light-emitting unit, an isolation structure, an encapsulation layer, and a dam structure. The light-emitting unit is disposed on one side of the substrate and located in the display area. The isolation structure is disposed on one side of the substrate and located in the display area. The isolation structure has multiple isolation openings for accommodating the light-emitting unit, thereby reducing carrier crosstalk within the light-emitting layer and improving the display quality of the display panel. Furthermore, the light-emitting unit can be manufactured without the use of a precision mask, thereby reducing the development and use of precision masks and reducing manufacturing costs. The encapsulation layer includes an organic encapsulation sublayer covering the light-emitting unit. The dam structure is disposed on one side of the substrate and located in the non-display area. The dam structure includes a first dam, which includes a first metal layer. The first dam is formed by stacking the first metal layer and a first insulating layer. This increases the thickness of the first dam in a direction perpendicular to the substrate, improves the dam structure's barrier effect on the encapsulation material of the organic encapsulation sublayer, reduces the risk of water and oxygen intrusion caused by overflow of the encapsulation material of the organic encapsulation sublayer, and improves product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0045] Figure 1 is a top view of a display panel provided in some embodiments of the present application;

[0046] Figure 2 is a schematic cross-sectional view of a display panel provided in some embodiments of the present application;

[0047] Figure 3 is another cross-sectional schematic diagram of a display panel provided by some embodiments of the present application;

[0048] Figure 4 is a schematic cross-sectional view of a display panel provided in some other embodiments of the present application;

[0049] Figure 5 is another cross-sectional schematic diagram of a display panel provided in other embodiments of the present application;

[0050] Figure 6 is another cross-sectional schematic diagram of a display panel provided in some other embodiments of the present application;

[0051] Figure 7 is another cross-sectional schematic diagram of a display panel provided in some other embodiments of the present application;

[0052] Figure 8 yes Figure 5 Schematic diagram of the cross section at AA in the middle;

[0053] Figure 9 is a schematic cross-sectional view of a display panel provided in some other embodiments of the present application;

[0054] Figure 10 is a schematic cross-sectional view of a display panel provided in some embodiments of the present application;

[0055] Figure 11 2 is a schematic cross-sectional view of a display panel provided in some further embodiments of the present application.

[0056] Tag Name:

[0057] Display panel 100; substrate 10; isolation structure 20; encapsulation layer 30; first inorganic encapsulation sublayer; second inorganic encapsulation sublayer 32; dam structure 40; first dam 41; first metal layer 411; first metal sublayer 4111; second metal sublayer 4112; first insulating layer 412; first organic insulating sublayer 4121; first inorganic insulating sublayer 4122; overflow groove 42; second dam 43; second metal layer 431; third metal sublayer 4311; fourth metal sublayer 4312; second insulating layer 432; second organic insulating sublayer 4321; second inorganic insulating sublayer 4322; second sublayer 4323; first sublayer 4324; connecting layer 44; conductive area 441; via area 442; third insulating layer 50; groove 51; driving circuit layer 60; third conductive layer 61; fourth conductive layer 62; display area AA; non-display area NA. DETAILED DESCRIPTION

[0058] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0059] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0060] To ensure product reliability and protect the display panel's materials from water and oxygen corrosion, flexible AMOLED display panels typically incorporate an encapsulation layer on the surface of the display panel. This encapsulation layer typically includes an organic encapsulation sublayer formed by inkjet printing. Due to the high fluidity of the encapsulation material forming the organic encapsulation sublayer during inkjet printing, the encapsulation material may flow outward and overflow to the edge of the encapsulation layer, thereby affecting the encapsulation effect of the encapsulation layer, increasing the risk of water and oxygen intrusion, and impacting the product reliability of the display panel. Therefore, to prevent the encapsulation material of the organic encapsulation sublayer from flowing outward and overflowing, a dam structure can be provided in the non-display area of the display panel to limit the encapsulation material of the organic encapsulation sublayer. Currently, this dam structure can be formed by stacking a pixel definition layer and support pillars for supporting a precision mask. However, some display panels' light-emitting units do not require a precision mask, eliminating the need for these support pillars in the display panel. This reduces the thickness of the dam structure, making it difficult for the dam structure to effectively limit the encapsulation material of the organic encapsulation sublayer. This increases the risk of water and oxygen intrusion in the encapsulation layer, impacting product reliability.

[0061] Patents PCT / CN2023 / 134518, 202311499823.9, 202310707209.0, 202311346196.5, 202310692671.8, and 202311091555.7 record the relevant contents of the isolation structure and encapsulation layer for reference.

[0062] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel, or may be other types of display panels, such as a micro light emitting diode (Micro-LED) or a quantum dot light emitting diode (QLED) display panel.

[0063] See also Figure 1 and Figure 2 On the one hand, an embodiment of the present application provides a display panel 100, including a display area AA and a non-display area NA, the display panel 100 includes a substrate 10, a light-emitting unit, an isolation structure 20, an encapsulation layer 30 and a dam structure 40; the light-emitting unit is arranged on one side of the substrate 10 and is located in the display area AA, the isolation structure 20 is arranged on one side of the substrate 10 and is located in the display area AA, the isolation structure 20 is provided with a plurality of isolation openings for accommodating the light-emitting unit; the encapsulation layer 30 includes an organic encapsulation sublayer 31 covering the light-emitting unit; the dam structure 40 is arranged on one side of the substrate 10 and is located in the non-display area NA, the dam structure 40 includes a first dam 41, and the first dam 41 includes a first metal layer 411.

[0064] The substrate 10 includes a substrate, which can be a rigid substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone PES (PES), polyacrylate PAR (PAR), polyetherimide PEI (PEI), polyethylene naphthalate PEN (PEN), polyethylene terephthalate PET (PET), polyphenylene sulfide PPS (PPS), polyarylate, polyimide (PI), polycarbonate PC (PC) or cellulose acetate propionate CAP (CAP).

[0065] The display area AA is the area where images can be displayed and is provided with sub-pixels. The non-display area NA is the area where images cannot be displayed and is generally used for wiring, or for placing cameras, bonding terminals, test terminals, etc. For example, the non-display area NA can surround the display area AA and form the outer frame of the display panel 100.

[0066] The isolation structure 20 can be wide at the top and narrow at the bottom, or it can have inwardly concave sidewalls, as long as the sidewalls of the isolation structure 20 cannot continuously deposit the evaporated material. For example, the longitudinal cross-section of the isolation structure 20 can be an inverted trapezoidal, X-shaped, T-shaped, or I-shaped structure.

[0067] The display panel 100 also includes a light-emitting unit, which is arranged in an isolation opening formed by the isolation structure 20. The light-emitting unit can be formed by stacking multiple film layer structures. For example, the light-emitting unit can include a stacked hole injection layer (Hole Inject Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), a light-emitting layer, an electron injection layer (Electron Inject Layer, EIL) and an electron transport layer (Electron Transport Layer, ETL).

[0068] It is understood that the organic encapsulation sublayer 31 is disposed on the side of the light-emitting unit facing away from the substrate 10, and serves to prevent external moisture, oxygen, etc. from entering the interior of the display panel 100. The organic encapsulation sublayer 31 includes an organic material. The organic encapsulation sublayer 31 can be made of an organic material such as a polymer.

[0069] In the display panel 100 provided in the embodiment of the present application, an isolation structure 20 is provided on one side of the substrate 10 and located in the display area AA. The isolation structure 20 has multiple isolation openings for accommodating light-emitting units, thereby reducing carrier crosstalk between the light-emitting units and improving the display quality of the display panel 100. Furthermore, the light-emitting units do not require the use of precision masks, which can reduce the development and use of precision masks and reduce production costs. An encapsulation layer 30 is provided on the side of the isolation structure 20 facing away from the substrate 10. The encapsulation layer 30 includes an organic encapsulation sublayer 31 covering the light-emitting units. A dam structure 40 is provided on one side of the substrate 10 and located in the non-display area NA. The dam structure 40 includes a first dam 41, which includes a first metal layer 411. The first dam 41 is formed by the first metal layer 411, thereby increasing the thickness of the first dam 41 in a direction perpendicular to the substrate 10, improving the barrier effect of the dam structure 40 on the encapsulation material of the organic encapsulation sublayer 31, reducing the risk of water and oxygen intrusion caused by overflow of the encapsulation material of the organic encapsulation sublayer 31, and improving product reliability.

[0070] Optionally, the encapsulation layer 30 further includes a first inorganic encapsulation sublayer, which is disposed on the side of the isolation structure 20 facing away from the array substrate 10 and between the isolation structure 20 and the organic encapsulation sublayer 31. The first inorganic encapsulation sublayer protects the subpixels from the external environment (such as air and water), preventing air and moisture from penetrating into the display panel 100, thereby extending the service life and stability of the light-emitting structure. The encapsulation layer 30 also prevents impurities and harmful substances from entering the display panel 100, thereby ensuring the performance and quality of the display panel 100.

[0071] Optionally, the first inorganic encapsulation sublayer includes an inorganic material. Exemplarily, the first inorganic encapsulation sublayer may be made of a material such as silicon oxide, silicon nitride, or silicon oxynitride, which can provide good mechanical support and encapsulation protection to protect the display panel 100 from environmental influences. Furthermore, the first inorganic encapsulation sublayer can effectively prevent harmful substances such as moisture and oxygen from entering the interior of the display panel 100, thereby improving the service life and stability of the display panel 100.

[0072] Optionally, the organic encapsulation sublayer 31 is thicker than the first inorganic encapsulation sublayer and has greater flexibility, so it can better adapt to the bending and curvature of the display panel 100. In addition, the organic material can also play a role in buffering external forces.

[0073] Please continue reading Figure 2 Optionally, the encapsulation layer 30 may further include a second inorganic encapsulation sublayer 32. The second inorganic encapsulation sublayer 32 may further protect the sub-pixels from the external environment (such as air and water), prevent air and moisture from penetrating into the display panel 100, and extend the service life and stability of the light-emitting structure. The second inorganic encapsulation sublayer 32 may also prevent impurities and harmful substances from entering the display panel 100, thereby ensuring the performance and quality of the display panel 100. The organic encapsulation sublayer 31 may be disposed between the first inorganic encapsulation sublayer and the second inorganic encapsulation sublayer 32. Therefore, the first inorganic encapsulation sublayer and the second inorganic encapsulation sublayer 32 may surround the organic encapsulation sublayer 31, preventing the encapsulation material of the organic encapsulation sublayer 31 from flowing outward and overflowing.

[0074] Please continue reading Figure 2 In some embodiments, the first dam 41 further includes a first insulating layer 412 stacked with the first metal layer 411 , thereby further increasing the thickness of the first dam 41 in a direction perpendicular to the substrate 10 .

[0075] See also Figure 3 Preferably, the display panel 100 includes a driving circuit layer 60 disposed on one side of the substrate 10. The driving circuit layer 60 includes a first conductive layer, a second conductive layer, a third conductive layer 61, and a fourth conductive layer 62 that are stacked. The first metal layer 411 is formed in the same layer and material as at least one of the first conductive layer, the second conductive layer, the third conductive layer 61, and the fourth conductive layer 62. Therefore, the first metal layer 411 can be formed using the same process as at least one of the first conductive layer, the second conductive layer, the third conductive layer 61, and the fourth conductive layer 62. Alternatively, the first metal layer 411 can be formed by extending toward the non-display area NA together with at least one of the first conductive layer, the second conductive layer, the third conductive layer 61, and the fourth conductive layer 62, thereby simplifying the process steps and reducing manufacturing costs.

[0076] See also Figure 4 In some embodiments, the dam structure 40 further includes a second dam 43 disposed adjacent to the first dam 41. An overflow channel 42 is formed between the first dam 41 and the second dam 43. The first dam 41 and the second dam 43 sequentially limit the encapsulation material of the organic encapsulation sublayer 31, thereby more effectively preventing the encapsulation material from flowing outward from the organic encapsulation sublayer 31. When the encapsulation material overflows the first dam 41, it flows into the overflow channel 42 and is blocked by the second dam 43. This allows the organic encapsulation sublayer 31 to be confined within the dam structure 40, preventing the encapsulation material from flowing outward from the organic encapsulation sublayer 31.

[0077] Preferably, the second dam 43 is located on a side of the first dam 41 away from the display area AA. The height H3 of the second dam 43 is greater than the height H3 of the first dam 41 , thereby further improving the limiting effect of the dam structure 40 on the organic encapsulation sublayer 31 .

[0078] Please continue reading Figure 1 Preferably, the dam structure 40 is arranged around the display area AA, so that the organic encapsulation sublayer 31 can be confined within the dam structure 40 along the circumference of the display area AA, preventing the encapsulation material of the organic encapsulation sublayer 31 from flowing outward and overflowing.

[0079] Please continue reading Figure 4 In some embodiments, the second dam 43 includes a second metal layer 431 and a second insulating layer 432 stacked with the second metal layer 431, thereby increasing the thickness of the second dam 43 in a direction perpendicular to the substrate 10 and improving the blocking effect of the dam structure 40 on the encapsulation material of the organic encapsulation sublayer 31.

[0080] Please continue reading Figure 3 Preferably, the second metal layer 431 is provided in the same layer and with the same material as at least one of the first conductive layer, the second conductive layer, the third conductive layer 61 and the fourth conductive layer 62. Therefore, the second metal layer 431 can be prepared and formed by the same process as at least one of the first conductive layer, the second conductive layer, the third conductive layer 61 and the fourth conductive layer 62. Alternatively, the second metal layer 431 can be formed by extending to the non-display area NA together with at least one of the first conductive layer, the second conductive layer, the third conductive layer 61 and the fourth conductive layer 62, thereby simplifying the process steps and reducing the manufacturing cost.

[0081] Please continue reading Figure 4Preferably, the first metal layer 411 and the second metal layer 431 are spaced apart from each other, so that the first metal layer 411 and the second metal layer 431 are insulated from each other. When the first metal layer 411 and the second metal layer 431 are connected to different voltages, the first metal layer 411 and the second metal layer 431 are insulated from each other to prevent interference between the voltage carried by the first metal layer 411 and the voltage carried by the second metal layer 431.

[0082] Optionally, the first metal layer 411 or the second metal layer 431 can be connected to any one of the initialization voltage, reference voltage and clock signal of the display panel 100. Of course, it can also be connected to the positive power supply voltage or the negative power supply voltage, which is not limited in this embodiment.

[0083] See also Figure 5-7 Preferably, the first metal layer 411 and the second metal layer 431 are conductively connected to each other. When the first metal layer 411 and the second metal layer 431 are connected to the same voltage at the same time, the conductively connected first metal layer 411 and the second metal layer 431 can improve the resistance conductivity.

[0084] Preferably, the first metal layer 411 includes a first metal sublayer 4111 and a second metal sublayer 4112 stacked in sequence in a direction away from the substrate 10, so that the thickness of the first metal layer 411 in a direction perpendicular to the substrate 10 can be increased to further increase the thickness of the dam structure 40 in a direction perpendicular to the substrate 10.

[0085] Please continue reading Figure 3 The first metal sub-layer 4111 and the third conductive layer 61 are provided in the same layer and with the same material, and the second metal sub-layer 4112 and the fourth conductive layer 62 are provided in the same layer and with the same material.

[0086] It can be understood that in the driving circuit layer 60, the thickness of the third conductive layer 61 and the thickness of the fourth conductive layer 62 are greater than the thickness of the first conductive layer and the thickness of the second conductive layer. Therefore, in this embodiment, the first metal sublayer 4111 is set to be in the same layer and material as the third conductive layer 61, and the second metal sublayer 4112 is set to be in the same layer and material as the fourth conductive layer 62. Compared with setting the first metal sublayer 4111 to be in the same layer and material as the first conductive layer and the second metal sublayer 4112 to be in the same layer and material as the second conductive layer, the thickness of the first metal sublayer 4111 and the second metal sublayer 4112 can be increased, and the thickness of the dam structure 40 in the direction perpendicular to the substrate 10 can be further increased.

[0087] Please continue reading Figure 4 Preferably, the second metal layer 431 includes a third metal sublayer 4311 and a fourth metal sublayer 4312 stacked in sequence in a direction away from the substrate 10, so as to further increase the thickness of the second dam 43 in a direction perpendicular to the substrate 10.

[0088] It can be understood that when the first metal layer 411 includes the first metal sublayer 4111 and the second metal sublayer 4112, and the second metal layer 431 includes the third metal sublayer 4311 and the fourth metal sublayer 4312, the first metal layer 411 and the second metal layer 431 are conductive to each other. The first metal sublayer 4111 and the third metal sublayer 4311 may be conductive to each other, or the second metal sublayer 4112 and the fourth metal sublayer 4312 may be conductive to each other, or the first metal sublayer 4111 and the third metal sublayer 4311 may be conductive to each other while the second metal sublayer 4112 and the fourth metal sublayer 4312 are conductive to each other.

[0089] See also Figure 5 In some embodiments, the first metal sublayer 4111 and the third metal sublayer 4311 are arranged on the same layer and are conductive to each other. Therefore, when the first metal layer 411 and the second metal layer 431 are connected to the same voltage at the same time, the resistance conductivity between the first metal layer 411 and the second metal layer 431 can be improved.

[0090] Please continue reading Figure 3 Preferably, the first metal sublayer 4111, the third metal sublayer 4311 and the third conductive layer 61 are provided in the same layer and with the same material. Therefore, the first metal sublayer 4111, the third metal sublayer 4311 and the third conductive layer 61 can be prepared and formed by the same process, or the first metal sublayer 4111 and the third metal sublayer 4311 can be formed by extending the third conductive layer 61 toward the non-display area NA, so as to simplify the process steps and reduce manufacturing costs.

[0091] See also Figure 6 In some embodiments, the second metal sublayer 4112 and the fourth metal sublayer 4312 are arranged on the same layer and are conductive to each other. Therefore, when the first metal layer 411 and the second metal layer 431 are connected to the same voltage at the same time, the resistance conductivity between the first metal layer 411 and the second metal layer 431 can be improved.

[0092] Please continue reading Figure 3 Preferably, the second metal sublayer 4112, the fourth metal sublayer 4312 and the fourth conductive layer 62 are provided in the same layer and with the same material. Therefore, the second metal sublayer 4112, the fourth metal sublayer 4312 and the fourth conductive layer 62 can be prepared and formed by the same process, or the second metal sublayer 4112 and the fourth metal sublayer 4312 can be formed by extending the fourth conductive layer 62 toward the non-display area NA, so as to simplify the process steps and reduce manufacturing costs.

[0093] Please continue reading Figure 5-7In some embodiments, the dam structure 40 further includes a connecting layer 44, which is disposed between the first dam 41 and the second dam 43 and conducts the first metal layer 411 and the second metal layer 431. Compared with connecting the first metal layer 411 and the second metal layer 431 through other conductive methods such as wires, the resistance conductivity between the first metal layer 411 and the second metal layer 431 can be improved.

[0094] The connecting layer 44 located between the first metal sublayer 4111 and the third metal sublayer 4311 can be set at the same layer and material as the first metal sublayer 4111 and the third metal sublayer 4311, and the connecting layer 44 located between the second metal sublayer 4112 and the fourth metal sublayer 4312 can be set at the same layer and material as the second metal sublayer 4112 and the fourth metal sublayer 4312 to further simplify the process steps.

[0095] See also Figure 8 Preferably, the connection layer 44 includes a conductive area 441 and a via area 442, the conductive area 441 connects the first metal layer 411 and the second metal layer 431, the via area 442 has a via formed in a direction perpendicular to the substrate 10, and the overflow groove 42 includes a via.

[0096] The conductive region 441 is used to conduct electricity between the first metal layer 411 and the second metal layer 431. The via region 442 has a via formed in a direction perpendicular to the substrate 10. The overflow groove 42 includes the via, thereby increasing the depth of the overflow groove 42 in the direction perpendicular to the substrate 10 and increasing the volume of the overflow groove 42. This allows the overflow groove 42 to accommodate more encapsulation material of the organic encapsulation sublayer 31 and prevents the encapsulation material from flowing outward.

[0097] Preferably, the number of conductive areas 441 and the number of via areas 442 are respectively multiple, and the multiple conductive areas 441 and the multiple via areas 442 are staggered along the extension direction of the edge of the display area AA, so as to increase the volume of the overflow groove 42 on the basis of ensuring the resistance conductivity between the first metal layer 411 and the second metal sublayer 4112 by reasonably setting the number and setting position of the conductive areas 441 and the via areas 442 in the connecting layer.

[0098] In some embodiments, when the first metal layer 411 and the second metal layer 431 are simultaneously connected to a non-power supply voltage, the ratio of the length L1 of the conductive area 441 in the extension direction along the edge of the display area AA to the length L2 of the via area 442 in the extension direction along the edge of the display area AA satisfies the range of: 0:10<L1:L2<5:5, so that when the first metal layer 411 and the second metal layer 431 are simultaneously connected to a non-power supply voltage, by reasonably setting the length L1 of the conductive area 441 and the via area 442, the range of the via area 442 is increased on the basis of ensuring the resistance conductivity of the first metal layer 411 and the second metal layer 431, thereby increasing the size of the via located in the via area 442, so as to further increase the volume of the overflow groove 42.

[0099] Preferably, when the first metal layer 411 and the second metal layer 431 are connected to the non-power supply voltage at the same time, the ratio of the length L1 of the conductive area 441 in the extension direction along the edge of the display area AA to the length L2 of the via area 442 in the extension direction along the edge of the display area AA is 1:9, thereby ensuring the resistance conductivity of the first metal layer 411 and the second metal layer 431 and maximizing the range of the opening area.

[0100] In some embodiments, when the first metal layer 411 and the second metal layer 431 are connected to the power supply voltage at the same time, the ratio of the length L1 of the conductive area 441 along the extension direction of the edge of the display area AA to the length L2 of the via area 442 along the extension direction of the edge of the display area AA satisfies the range of: 5:5≤L1:L2≤9:1, so that when the first metal layer 411 and the second metal layer 431 are connected to the power supply voltage at the same time, the length L1 of the conductive area 441 and the via area 442 are reasonably set, and on the basis of ensuring the resistance conductivity of the first metal layer 411 and the second metal layer 431, the range of the opening area is increased, thereby increasing the size of the via located in the opening area, so as to further increase the volume of the overflow groove 42.

[0101] Preferably, when the first metal layer 411 and the second metal layer 431 are connected to the power supply voltage at the same time, the ratio of the length L1 of the conductive area 441 in the extension direction along the edge of the display area AA to the length L2 of the via area 442 in the extension direction along the edge of the display area AA is 5:5, thereby maximizing the range of the opening area while ensuring the resistance conductivity of the first metal layer 411 and the second metal layer 431.

[0102] It can be understood that in the display panel 100, the power supply voltage value is greater than other non-power supply voltage values. Therefore, when the first metal layer 411 and the second metal layer 431 are connected to the power supply voltage at the same time, compared to when both are connected to the non-power supply voltage at the same time, the length L1 of the conductive area 441 can be correspondingly increased and the length L1 of the via area 442 can be shortened, thereby improving the resistance conductivity between the first metal layer 411 and the second metal layer 431.

[0103] See also Figure 9 In some embodiments, the first insulating layer 412 includes a first organic insulating sublayer 4121 and a first inorganic insulating sublayer 4122, and the first metal layer 411, the first organic insulating sublayer 4121, and the first inorganic insulating sublayer 4122 are stacked. The second insulating layer 432 includes a second organic insulating sublayer 4321 and a second inorganic insulating sublayer 4322, and the second metal layer 431, the second organic insulating sublayer 4321, and the second inorganic insulating sublayer 4322 are stacked, so as to increase the thickness of the first insulating layer 412 along the direction perpendicular to the substrate 10 and the thickness of the second insulating layer 432 along the direction perpendicular to the substrate 10, so as to further increase the thickness of the dam structure 40 along the direction perpendicular to the substrate 10.

[0104] It can be understood that the first insulating layer 412 and the second insulating layer 432 are respectively formed by stacking an organic layer and an inorganic layer, which can not only buffer the external force but also enable the dam structure 40 to have good mechanical support performance.

[0105] See also Figure 10 In some embodiments, the display panel 100 includes a first planarization layer 70 located in the display area AA. The first planarization layer 70, the first organic insulating sublayer 4121, and at least a portion of the second organic insulating sublayer 4321 are arranged in the same layer and the same material. Therefore, the first organic insulating sublayer 4121 and at least a portion of the second organic insulating sublayer 4321 can be prepared and formed using the same process as the first planarization layer 70 to simplify the process steps and reduce manufacturing costs.

[0106] Please continue reading Figure 9 and Figure 10 Preferably, the display panel 100 also includes a second planarization layer 80 located in the display area AA, the second organic insulating sublayer 4321 includes a first sublayer 4324 and a second sublayer 4323, the first sublayer 4324 and the first planarization layer 70 are arranged in the same layer and material, and the second sublayer 4323 and the second planarization layer 80 are arranged in the same layer and material.

[0107] In this embodiment, the second organic insulating sublayer 4321 includes a first sublayer 4324 and a second sublayer 4323. The first sublayer 4124 is formed from the same layer and material as the first planarization layer 70. Therefore, the thickness of the second organic insulating sublayer 4321 is greater than that of the first organic insulating sublayer 4121. In other words, the thickness of the second dam 43 can be greater than that of the first dam 41, thereby further enhancing the position-limiting effect of the dam structure 40 on the organic encapsulation sublayer 31. Furthermore, the first sublayer 4324 and the first planarization layer 70 are formed using the same process, and the second sublayer 4323 and the second planarization layer 80 are formed using the same process, which simplifies the process steps, improves production efficiency, and reduces production costs.

[0108] Preferably, the second sublayer 4323 extends from one end of the third metal sublayer 4311 to cover part of the third metal sublayer 4311, the fourth metal sublayer 4312 covers the remaining part of the third metal sublayer 4311, and the first sublayer 4324 covers the second sublayer 4323 and the second metal layer 431, so that by reasonably arranging the positions of the first sublayer 4324, the second sublayer 4323, the third metal sublayer 4311 and the fourth metal sublayer 4312, the thickness of the second organic insulating sublayer 4321 is increased while ensuring that the third metal sublayer 4311 and the fourth metal sublayer 4312 are conductive with each other.

[0109] Preferably, the first organic insulating sub-layer 4121 covers the first metal layer 411 to protect the first metal layer 411 and ensure relative insulation of the first metal layer 411 .

[0110] Please continue reading Figure 10 In some embodiments, the display panel 100 further includes a pixel definition layer 90 located in the display area AA, the pixel definition layer 90 includes a pixel defining portion 91 and a pixel opening 92 formed by the pixel defining portion, the pixel opening 92 is used to set the light-emitting unit, the isolation structure 20 is set on the side of the pixel defining portion 91 away from the substrate 10, and the first inorganic insulating sublayer 4122, the second inorganic insulating sublayer 4322 and the pixel definition layer 90 are set in the same layer and the same material.

[0111] In this embodiment, the first inorganic insulating sublayer 4122, the second inorganic insulating sublayer 4322, and the pixel definition layer 90 are formed from the same material. Therefore, the first inorganic insulating sublayer 4122 and the second inorganic insulating sublayer 4322 can be formed using the same process as the pixel definition layer 90, which can reduce process steps and lower manufacturing costs. Furthermore, in this embodiment, the first inorganic insulating sublayer 4122, the second inorganic insulating sublayer 4322, and the pixel definition layer 90 are formed from the same material. That is, the pixel definition layer 90 is formed from an inorganic material. This effectively isolates water and oxygen, ensuring the encapsulation of individual pixels, while reducing the thickness of the pixel definition layer 90 and the overall thickness of the display panel 100, making the display panel 100 thinner and lighter.

[0112] It can be understood that since the pixel definition layer 90 in this embodiment is made of a lighter and thinner inorganic material, the first dam 41 in the dam structure 40 is formed by stacking a first metal layer 411 and a first insulating layer 412, and the first insulating layer 412 includes a first organic insulating sublayer 4121 and a first inorganic insulating sublayer 4122, so that the first metal layer 411 and the organic insulating sublayer 4121 can compensate for the thinned first inorganic insulating sublayer 4122, ensuring that the dam 41 has sufficient thickness to limit the encapsulation material in the organic encapsulation sublayer 31.

[0113] Please continue to refer to Figure 10 Preferably, the display panel 100 also includes a third inorganic insulating sublayer 45 arranged between the first dam 41 and the second dam 43. The third inorganic insulating sublayer 45, the first inorganic insulating sublayer 4122, the second inorganic insulating sublayer 4322 and the pixel definition layer 90 are arranged in the same layer and the same material, and the overflow groove 42 is located on the side of the third inorganic insulating sublayer 45 away from the substrate 10.

[0114] Preferably, the display panel 100 also includes a third insulating layer, which is located between the dam structure 40 and the substrate 10 in a direction perpendicular to the substrate 10. When the first metal layer 411 and the second metal layer 431 are spaced apart, the third inorganic insulating sublayer 45 is attached to the side of the third insulating layer 50 facing away from the substrate 10. When the connecting layer 44 connects the first metal layer 411 and the second metal layer 431, the third inorganic insulating sublayer 45 is attached to the side of the connecting layer 44 facing away from the substrate 10, so that the depth of the overflow groove 42 in the direction perpendicular to the substrate 10 can be reasonably adjusted to ensure the blocking effect of the dam structure 40.

[0115] Please continue reading Figure 10In some embodiments, the orthographic projection of the first metal layer 411 on the substrate 10 and the orthographic projection of the first organic insulating sublayer 4121 on the substrate 10 are both located within the orthographic projection of the first inorganic insulating sublayer 4122 on the substrate 10, and the orthographic projection of the second metal layer 431 on the substrate 10 and the orthographic projection of the second organic insulating sublayer 4321 on the substrate 10 are both located within the orthographic projection of the second inorganic insulating sublayer 4322 on the substrate 10. Therefore, the first inorganic insulating sublayer 4122 can protect the first metal layer 411 and the first organic insulating sublayer 4121, and the second inorganic insulating sublayer 4322 can protect the second metal layer 431 and the second organic insulating sublayer 4321.

[0116] Please continue reading Figure 3 and Figure 10 Preferably, the encapsulation layer 30 also includes a second inorganic encapsulation sublayer 32 covering the organic encapsulation sublayer 31. The second inorganic encapsulation sublayer 32 extends to the non-display area NA and covers the dam structure 40. The orthographic projection of the portion of the second inorganic encapsulation sublayer 32 located in the non-display area NA on the substrate 10 overlaps with the orthographic projection of the first inorganic insulating sublayer 4122 on the substrate 10 and the orthographic projection of the second inorganic insulating sublayer 4322 on the substrate 10, so that the second inorganic encapsulation sublayer 32 can protect the dam structure 40 and further prevent air and moisture from penetrating into the interior of the display panel 100.

[0117] Please refer to Figure 11 In the second aspect, the embodiment of the present application further provides a display panel 100, including a display area AA and a non-display area NA. The display panel 100 includes a substrate 10, a light-emitting unit, an encapsulation layer 30 and a dam structure 40. The light-emitting unit is arranged on one side of the substrate 10 and is located in the display area AA; the encapsulation layer 30 includes an organic encapsulation sublayer 31 covering the light-emitting unit; the dam structure 40 is arranged on one side of the substrate 10 and is located in the non-display area NA, the dam structure 40 includes a first dam 41, and the first dam 41 includes a first metal layer 411 and a first insulating layer 412 stacked.

[0118] In the display panel 100 provided in the embodiment of the present application, a dam structure 40 is provided including a first dam 41, and the first dam 41 includes a first metal layer 411 and a first insulating layer 412 that are stacked. Thus, the first dam 41 is formed by stacking the first metal layer 411 and the first insulating layer 412. This can increase the thickness of the first dam 41 in a direction perpendicular to the substrate 10, improve the blocking effect of the dam structure 40 on the encapsulation material of the organic encapsulation sublayer 31, reduce the risk of water and oxygen intrusion caused by overflow of the encapsulation material of the organic encapsulation sublayer 31, and improve product reliability.

[0119] In some embodiments, the dam structure 40 further includes a second dam 43 disposed adjacent to the first dam 41. An overflow channel 42 is formed between the first dam 41 and the second dam 43. The first dam 41 and the second dam 43 sequentially limit the encapsulation material of the organic encapsulation sublayer 31, thereby more effectively preventing the encapsulation material from flowing outward from the organic encapsulation sublayer 31. When the encapsulation material overflows the first dam 41, it flows into the overflow channel 42 and is blocked by the second dam 43. This allows the organic encapsulation sublayer 31 to be confined within the dam structure 40, preventing the encapsulation material from flowing outward from the organic encapsulation sublayer 31.

[0120] Preferably, the second dam 43 is located on a side of the first dam 41 away from the display area AA. The height of the second dam 43 is greater than that of the first dam 41 , thereby further improving the limiting effect of the dam structure 40 on the organic encapsulation sublayer 31 .

[0121] Preferably, the height H3 of the first dam 41 satisfies: 3.5 μm≤H3≤5 μm, so that the height of the first dam 41 is reasonably set.

[0122] Preferably, the height H4 of the second dam 43 satisfies: 5.5 μm≤H4≤8.5 μm, so that the height of the second dam 43 is reasonably set.

[0123] Preferably, the second dam 43 includes a second metal layer 431 and a second insulating layer 432 stacked together. The first metal layer 411 and the second metal layer 431 have the same thickness, and the second insulating layer 432 is thicker than the first insulating layer 412 .

[0124] It will be appreciated that in the display panel 100, the first metal layer 411 and the second metal layer 431 can be formed using a PVD sputtering process. Therefore, in this embodiment, the thickness of the first metal layer 411 is set to be equal to the thickness of the second metal layer 431, which can reduce the difficulty of manufacturing the first metal layer 411. At the same time, the thickness of the second insulating layer 432 is set to be greater than the thickness of the first insulating layer 412, which can make the height of the dam structure 40 gradually increase in the direction away from the display area AA, thereby ensuring the limiting effect on the encapsulation material of the organic encapsulation sublayer 31.

[0125] like Figure 11 As shown, preferably, the display panel 100 also includes a third insulating layer 50, which is located between the dam structure 40 and the substrate 10 in a direction perpendicular to the substrate 10. A groove 51 is formed on the side of the third insulating layer 50 facing away from the substrate 10. The overflow groove 42 includes the groove 51, thereby increasing the depth of the overflow groove 42 in a direction perpendicular to the substrate 10, so that the overflow groove 42 can accommodate more packaging material of the organic packaging sublayer 31, thereby preventing the packaging material from flowing outward and overflowing.

[0126] Optionally, the third insulating layer 50 can be reused as an insulating layer formed by inorganic materials in the display area AA of the display panel 100. The third insulating layer 50 includes but is not limited to at least one of a buffer sublayer, a gate insulating sublayer, a capacitor insulating sublayer, and an interlayer insulating sublayer, so that there is no need to separately process the third insulating layer 50 or the above-mentioned insulating layers in the display area AA, thereby simplifying the preparation process of the display panel 100.

[0127] In some embodiments, the first insulating layer 412 includes a first organic insulating sublayer and a first inorganic insulating sublayer, the second insulating layer 432 includes a second organic insulating sublayer and a second inorganic insulating sublayer, the first metal layer 411 and the first organic insulating sublayer and the first inorganic insulating sublayer are stacked, and the second metal layer 431 and the second organic insulating sublayer and the second inorganic insulating sublayer are stacked, so as to increase the thickness of the first insulating layer 412 along the direction perpendicular to the substrate 10 and the thickness of the second insulating layer 432 along the direction perpendicular to the substrate 10, so as to further increase the thickness of the dam structure 40 along the direction perpendicular to the substrate 10, improve the blocking effect of the dam structure 40 on the packaging material of the organic packaging sublayer 31, reduce the risk of water and oxygen intrusion caused by overflow of the packaging material of the organic packaging sublayer 31, and improve the reliability of the product.

[0128] Preferably, the thickness of the second organic insulating sublayer along the direction perpendicular to the substrate 10 is greater than the thickness of the first organic insulating sublayer along the direction perpendicular to the substrate 10, so as to increase the height of the second dam 43 and improve the limiting effect of the dam structure 40 on the encapsulation material of the organic encapsulation sublayer 31.

[0129] Optionally, the first organic insulating sublayer and the second organic insulating sublayer can be prepared using multi-grayscale mask technology, so that there can be a thickness difference between the first organic insulating sublayer and the second organic insulating sublayer. At the same time, the first organic insulating sublayer and the second organic insulating sublayer can be formed by one exposure, thereby reducing manufacturing costs.

[0130] Thirdly, embodiments of the present application further provide a display device comprising any of the above-described display panels 100. The display device provided by embodiments of the present application has the technical effects of the technical solutions of the display panel 100 in any of the above-described embodiments, and the explanations of the structures and terms identical or corresponding to those in the above-described embodiments are not further elaborated herein.

[0131] The display device may be any device having a display function, for example, a mobile device such as a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA); it may also be a non-mobile device such as a personal computer (PC), a television (TV), an ATM, or an kiosks.

[0132] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area, and comprises: substrate; a light emitting unit, disposed on one side of the substrate and located in the display area; an isolation structure, disposed on one side of the substrate and located in the display area, the isolation structure being provided with a plurality of isolation openings for accommodating the light-emitting units; an encapsulation layer, comprising an organic encapsulation sublayer covering the light-emitting unit; The dam structure is arranged on one side of the substrate and located in the non-display area. The dam structure includes a first dam, and the first dam includes a first metal layer.

2. The display panel according to claim 1, wherein: The first dam further includes a first insulating layer stacked with the first metal layer; Preferably, the display panel includes a driving circuit layer arranged on one side of the substrate, the driving circuit layer includes a first conductive layer, a second conductive layer, a third conductive layer and a fourth conductive layer arranged in a stacked manner, and the first metal layer is arranged in the same layer and material as at least one of the first conductive layer, the second conductive layer, the third conductive layer and the fourth conductive layer.

3. The display panel according to claim 2, wherein: The dam structure further includes a second dam disposed adjacent to the first dam, with an overflow trough formed between the first dam and the second dam; Preferably, the second dam is located on a side of the first dam away from the display area, and the height of the second dam is greater than that of the first dam; Preferably, the dam structure is arranged around the display area.

4. The display panel according to claim 3, wherein: The second dam includes a second metal layer and a second insulating layer stacked with the second metal layer; Preferably, the second metal layer is provided in the same layer and the same material as at least one of the first conductive layer, the second conductive layer, the third conductive layer and the fourth conductive layer; Preferably, the first metal layer and the second metal layer are spaced apart from each other; Preferably, the first metal layer and the second metal layer are conductive with each other; Preferably, the first metal layer includes a first metal sublayer and a second metal sublayer sequentially stacked in a direction away from the substrate, the first metal sublayer and the third conductive layer are provided in the same layer and made of the same material, and the second metal sublayer and the fourth conductive layer are provided in the same layer and made of the same material; Preferably, the second metal layer includes a third metal sub-layer and a fourth metal sub-layer sequentially stacked in a direction away from the substrate.

5. The display panel according to claim 4, wherein: The first metal sublayer and the third metal sublayer are arranged in the same layer and are conductive to each other; Preferably, the first metal sublayer, the third metal sublayer and the third conductive layer are provided in the same layer and with the same material.

6. The display panel according to claim 4 or 5, characterized in that: The second metal sublayer and the fourth metal sublayer are arranged in the same layer and are conductive to each other; Preferably, the second metal sublayer, the fourth metal sublayer and the fourth conductive layer are provided in the same layer and with the same material.

7. The display panel according to claim 4, wherein: The dam structure further includes a connection layer, which is disposed between the first dam and the second dam and conducts the first metal layer and the second metal layer; Preferably, the connection layer includes a conductive area and a via area, the conductive area conducts electricity between the first metal layer and the second metal layer, the via area is formed with a via in a direction perpendicular to the substrate, and the overflow groove includes the via; Preferably, there are plural conductive areas and plural via areas, and the plural conductive areas and the plural via areas are staggered along the extending direction of the edge of the display area.

8. The display panel according to claim 7, wherein: The first insulating layer includes a first organic insulating sublayer and a first inorganic insulating sublayer, and the first metal layer, the first organic insulating sublayer and the first inorganic insulating sublayer are stacked. The second insulating layer includes a second organic insulating sublayer and a second inorganic insulating sublayer, and the second metal layer, the second organic insulating sublayer and the second inorganic insulating sublayer are stacked.

9. The display panel according to claim 8, wherein: The display panel includes a first planarization layer located in the display area, wherein the first planarization layer, the first organic insulating sublayer, and at least a portion of the second organic insulating sublayer are provided in the same layer and the same material; Preferably, the display panel further includes a second planarization layer located in the display area, the second organic insulating sublayer includes a first sublayer and a second sublayer, the first sublayer and the first planarization layer are provided in the same layer and the same material, and the second sublayer and the second planarization layer are provided in the same layer and the same material; Preferably, the second sub-layer extends from one end of the third metal sub-layer to cover a portion of the third metal sub-layer, the fourth metal sub-layer covers the remaining portion of the third metal sub-layer, and the first sub-layer covers the second sub-layer and the second metal layer; Preferably, the first organic insulating sublayer covers the first metal layer.

10. The display panel according to claim 8, wherein The display panel further includes a pixel definition layer located in the display area, the pixel definition layer including a pixel defining portion and a pixel opening enclosed by the pixel defining portion, the pixel opening being used to arrange the light-emitting unit, the isolation structure being arranged on a side of the pixel defining portion facing away from the substrate, the first inorganic insulating sublayer, the second inorganic insulating sublayer, and the pixel definition layer being arranged in the same layer and made of the same material; Preferably, the display panel further comprises a third inorganic insulating sublayer disposed between the first dam and the second dam, the third inorganic insulating sublayer, the first inorganic insulating sublayer, the second inorganic insulating sublayer, and the pixel definition layer being provided in the same layer and made of the same material, and the overflow groove being located on a side of the third inorganic insulating sublayer facing away from the substrate; Preferably, the display panel also includes a third insulating layer, which is located between the dam structure and the substrate in a direction perpendicular to the substrate. When the first metal layer and the second metal layer are spaced apart, the third inorganic insulating sublayer is attached to the side of the third insulating layer facing away from the substrate. When the connecting layer conducts the first metal layer and the second metal layer, the third inorganic insulating sublayer is attached to the side of the connecting layer facing away from the substrate.

11. The display panel according to claim 8, wherein The orthographic projection of the first metal layer on the substrate and the orthographic projection of the first organic insulating sublayer on the substrate are both located within the orthographic projection of the first inorganic insulating sublayer on the substrate, and the orthographic projection of the second metal layer on the substrate and the orthographic projection of the second organic insulating sublayer on the substrate are both located within the orthographic projection of the second inorganic insulating sublayer on the substrate; Preferably, the encapsulation layer also includes a second inorganic encapsulation sublayer covering the organic encapsulation sublayer, the second inorganic encapsulation sublayer extends to the non-display area and covers the dam structure, and the orthographic projection of the portion of the second inorganic encapsulation sublayer located in the non-display area on the substrate overlaps with the orthographic projection of the first inorganic insulating sublayer on the substrate and the orthographic projection of the second inorganic insulating sublayer on the substrate.

12. A display panel, characterized in that: The display panel includes a display area and a non-display area, and comprises: substrate; a light emitting unit, disposed on one side of the substrate and located in the display area; an encapsulation layer, comprising an organic encapsulation sublayer covering the light-emitting unit; The dam structure is arranged on one side of the substrate and located in the non-display area. The dam structure includes a first dam. The first dam includes a first metal layer and a first insulating layer that are stacked.

13. The display panel according to claim 12, wherein: The dam structure further includes a second dam disposed adjacent to the first dam, with an overflow trough formed between the first dam and the second dam; Preferably, the second dam is located on a side of the first dam away from the display area, and the height of the second dam is greater than that of the first dam; Preferably, the height H3 of the first dam satisfies: 3.5um≤H3≤5um; Preferably, the height H4 of the second dam satisfies: 5.5um≤H4≤8.5um; Preferably, the second dam includes a second metal layer and a second insulating layer stacked together, the first metal layer and the second metal layer have the same thickness, and the second insulating layer has a thickness greater than that of the first insulating layer; Preferably, the display panel further includes a third insulating layer, which is located between the dam structure and the substrate in a direction perpendicular to the substrate. A groove is formed on a side of the third insulating layer away from the substrate, and the overflow groove includes the groove 51.

14. The display panel according to claim 13, wherein: The first insulating layer includes a first organic insulating sublayer and a first inorganic insulating sublayer, the second insulating layer includes a second organic insulating sublayer and a second inorganic insulating sublayer, the first metal layer, the first organic insulating sublayer, and the first inorganic insulating sublayer are stacked, and the second metal layer, the second organic insulating sublayer, and the second inorganic insulating sublayer are stacked; Preferably, a thickness of the second organic insulating sublayer along a direction perpendicular to the substrate is greater than a thickness of the first organic insulating sublayer along a direction perpendicular to the substrate.

15. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 11.

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