Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate; the pixel definition layer is located on one side of the substrate, and the pixel definition layer is provided with a plurality of first-class openings and a plurality of second-class openings; at least part of each light-emitting unit is located in the corresponding first type of opening, and each light-emitting unit comprises a first electrode, a light-emitting functional layer and a second electrode which are sequentially arranged in a stacked mode in the direction away from the substrate; the isolation structure is located on the side, away from the substrate, of the pixel definition layer, a plurality of isolation openings are defined by the isolation structure, and the orthographic projection of the first type of openings on the substrate is located in the orthographic projection of the isolation openings on the substrate; the conductive layer is located between the substrate and the pixel definition layer, at least part of the conductive layer is exposed by the second-type opening, and the second electrode and the isolation structure are electrically connected through the conductive layer. According to the technical scheme, poor lap joint can be improved, and the reliability of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising new display technology for the next generation. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-luminescence, wide viewing angle, and fast response speed.

[0003] Traditionally, pixel patterning is achieved using a fine metal mask (FMM) during the production of OLED display panels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision and high cost. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-scale scalability, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe FMM-free technology for reference.

[0004] However, the reliability of current display panels needs to be improved. Summary of the Invention

[0005] In order to overcome the technical problems mentioned in the above background technology, embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device.

[0006] In a first aspect, an embodiment of the present application provides a display panel comprising: a substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer being provided with a plurality of first-type openings and a plurality of second-type openings; a plurality of light-emitting units, at least a portion of the light-emitting units being located within the first-type openings, the light-emitting units comprising a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence away from the substrate; an isolation structure located on a side of the pixel definition layer away from the substrate, the isolation structure enclosing a plurality of isolation openings, the orthographic projection of the first-type openings on the substrate being located within the orthographic projection of the isolation openings on the substrate; a conductive layer located between the substrate and the pixel definition layer, the second-type openings exposing at least a portion of the conductive layer, and the second electrode and the isolation structure being electrically connected through the conductive layer.

[0007] In combination with the first aspect, the second type of opening includes a plurality of adjacently arranged first openings and second openings, the second openings being located on the side of the first openings away from the first type of openings; the first openings expose the first portion of the conductive layer, the second openings expose the second portion of the conductive layer, the second electrode contacts the first portion of the conductive layer, and the isolation structure contacts the second portion of the conductive layer; the second electrode covers the first type of openings and extends in a direction close to the first opening and covers at least a portion of the first opening.

[0008] In combination with the first aspect, the pixel definition layer includes a first side surface corresponding to the first opening, and a first angle between the first side surface and a surface of the pixel definition layer close to the substrate is greater than 0 and less than or equal to 45°.

[0009] In combination with the first aspect, the second type of openings includes multiple third openings, the third openings expose at least part of the conductive layer, and the second electrode and the isolation structure are respectively electrically connected to the conductive layer exposed by the third openings; the second electrode covers the first type of openings and extends in a direction close to the third openings and covers at least part of the third openings.

[0010] In combination with the first aspect, the pixel definition layer includes a second side surface corresponding to the third opening, and a second angle between the second side surface and a surface of the pixel definition layer close to the substrate is greater than 0 and less than or equal to 45°.

[0011] In combination with the first aspect, the isolation structure includes a first part and a second part stacked in sequence along a direction away from the substrate, the orthographic projection of the first part on the substrate is located within the orthographic projection of the second part on the substrate, and the first part is in contact with the conductive layer; or, the isolation structure includes a third part, a first part and a second part stacked in sequence along a direction away from the substrate, the orthographic projection of the first part on the substrate is located within the orthographic projection of the second part on the substrate, the orthographic projection of the third part on the substrate is located within the orthographic projection of the second part on the substrate, and the third part is in contact with the conductive layer.

[0012] In combination with the first aspect, the orthographic projection of at least part of the side surface of the first portion facing the isolation opening on the substrate is located within the orthographic projection of the conductive layer on the substrate; and / or, the orthographic projection of at least part of the side surface of the third portion facing the isolation opening on the substrate is located within the orthographic projection of the conductive layer on the substrate.

[0013] In combination with the first aspect, the conductive layer includes a plurality of conductive portions arranged at intervals, and the orthographic projections of the conductive portions on the substrate at least partially surround the orthographic projection of the first electrode on the substrate.

[0014] In combination with the first aspect, the orthographic projection of the conductive portion on the substrate surrounds the orthographic projection of the first electrode on the substrate.

[0015] In combination with the first aspect, the orthographic projection of the conductive layer on the substrate includes a grid structure, the conductive layer is provided with a plurality of grid holes, and the orthographic projection of the first electrode on the substrate is located within the orthographic projection of the grid holes on the substrate.

[0016] In combination with the first aspect, the orthographic projection of the grid holes on the substrate at least partially overlaps with the orthographic projection of the isolation opening on the substrate; preferably, the orthographic projection of the grid holes on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0017] In combination with the first aspect, the conductive layer is in the same layer and is made of the same material as the first electrode; preferably, the conductive layer includes a first sub-conductive layer and a second sub-conductive layer stacked in sequence in a direction away from the substrate; or, the conductive layer includes a third sub-conductive layer, a first sub-conductive layer and a second sub-conductive layer stacked in sequence in a direction away from the substrate; preferably, the material of the first sub-conductive layer includes metal, and the materials of the second sub-conductive layer and the third sub-conductive layer include transparent conductive oxide.

[0018] In combination with the first aspect, it also includes a first encapsulation layer located on the side of the light-emitting unit away from the substrate, the first encapsulation layer includes a plurality of spaced encapsulation units, the encapsulation units correspond to the light-emitting units, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the encapsulation unit on the substrate; preferably, the display panel also includes a second encapsulation layer and a third encapsulation layer located on the side of the first encapsulation layer away from the substrate, the second encapsulation layer and the third encapsulation layer are stacked in sequence along the direction away from the substrate; preferably, the first encapsulation layer includes an inorganic encapsulation layer, the second encapsulation layer includes an organic encapsulation layer, and the third encapsulation layer includes an inorganic encapsulation layer.

[0019] In a second aspect, an embodiment of the present application further provides a display panel comprising: a substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer being provided with a plurality of first-type openings and a plurality of second-type openings, the second-type openings comprising a plurality of third openings; a plurality of light-emitting units, at least a portion of the light-emitting units being located within the first-type openings, the light-emitting units comprising a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence away from the substrate; an isolation structure located on the side of the pixel definition layer away from the substrate, the isolation structure enclosing a plurality of isolation openings, the orthographic projection of the first-type openings on the substrate being located within the orthographic projection of the isolation openings on the substrate; a conductive layer located between the substrate and the pixel definition layer, the third opening exposing at least a portion of the conductive layer, the second electrode and the isolation structure being electrically connected to the conductive layer exposed by the third opening, respectively.

[0020] In combination with the second aspect, the pixel definition layer includes a second side surface corresponding to the third opening, and a first angle between the second side surface and the surface of the pixel definition layer close to the substrate is greater than 0 and less than or equal to 45°; preferably, the second electrode covers the first type of opening and extends in a direction close to the third opening and covers at least a portion of the third opening; preferably, the conductive layer and the first electrode are in the same layer and are provided with the same material; preferably, the conductive layer includes a plurality of conductive portions arranged at intervals, and the conductive portions at least partially surround the first electrode; or, the orthographic projection of the conductive layer on the substrate includes a grid-like structure, the conductive layer is provided with a plurality of grid holes, and the first electrode is located in the grid holes.

[0021] In a third aspect, an embodiment of the present application further provides a display panel comprising: a substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer being provided with a plurality of first-type openings and a plurality of second-type openings; a plurality of light-emitting units, at least a portion of the light-emitting units being located within the first-type openings, the light-emitting units comprising a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence away from the substrate; an isolation structure located on the side of the pixel definition layer away from the substrate, the isolation structure enclosing a plurality of isolation openings, the orthographic projection of the first-type openings on the substrate being located within the orthographic projection of the isolation openings on the substrate; a conductive layer located between the substrate and the pixel definition layer, the orthographic projection of the conductive layer on the substrate comprising a grid-like structure, the conductive layer being provided with a plurality of grid holes, the orthographic projection of the first-type openings on the substrate being located within the orthographic projection of the grid holes on the substrate, the second-type openings exposing at least a portion of the conductive layer, and the conductive layer being in contact with the isolation structure and the second electrode, respectively.

[0022] In combination with the third aspect, the isolation structure includes a first part and a second part stacked in sequence along a direction away from the substrate, the orthographic projection of the first part on the substrate is located within the orthographic projection of the second part on the substrate, and the first part is in contact with the conductive layer; or, the isolation structure includes a third part, a first part and a second part stacked in sequence along a direction away from the substrate, the orthographic projection of the first part on the substrate is located within the orthographic projection of the second part on the substrate, the orthographic projection of the third part on the substrate is located within the orthographic projection of the second part on the substrate, and the third part is in contact with the conductive layer.

[0023] In combination with the third aspect, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the conductive layer on the substrate; and / or, the orthographic projection of the third portion on the substrate is located within the orthographic projection of the conductive layer on the substrate.

[0024] In combination with the third aspect, the second type of opening includes a third opening, and an orthographic projection of the first portion and / or the third portion on the substrate is located within an orthographic projection of the third opening on the substrate.

[0025] In combination with the third aspect, the light-emitting unit includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence away from the substrate, and the conductive layer is in contact with the second electrode; preferably, the second type of opening includes a plurality of adjacent first openings and second openings, and the second opening is located on the side of the first opening away from the first type of opening; the first opening exposes a first part of the conductive layer, the second opening exposes a second part of the conductive layer, the second electrode is in contact with the first part of the conductive layer, and the isolation structure is in contact with the second part of the conductive layer; or, the second type of opening includes a plurality of third openings, the third opening exposes at least part of the conductive layer, and the second electrode and the isolation structure are respectively electrically connected to the conductive layer exposed by the third opening.

[0026] In a fourth aspect, an embodiment of the present application also provides a method for preparing a display panel, comprising: preparing a first electrode and a conductive layer on a substrate, the first electrode and the conductive layer being arranged at intervals; preparing a pixel definition layer and an isolation structure on the side of the first electrode and the conductive layer facing away from the substrate, the pixel definition layer being provided with a plurality of first-type openings and a plurality of second-type openings, the first-type openings exposing at least a portion of the first electrode, the second-type openings exposing at least a portion of the conductive layer, the isolation structure enclosing a plurality of isolation openings, the orthographic projection of the first-type opening on the substrate being located within the orthographic projection of the isolation opening on the substrate; preparing a light-emitting functional layer and a second electrode in the isolation opening, the second electrode and the isolation structure being electrically connected through the conductive layer.

[0027] In combination with the fourth aspect, a pixel definition layer and an isolation structure are prepared on the side of the first electrode and the conductive layer facing away from the substrate, including: preparing a pixel definition material layer on the side of the first electrode and the conductive layer facing away from the substrate; performing a first patterning process on the pixel definition material layer to obtain a second type of opening; preparing an isolation structure on the side of the pixel definition material layer facing away from the substrate, the isolation structure covering a portion of the second type of opening to contact the conductive layer; performing a second patterning process on the pixel definition material layer to obtain a first type of opening.

[0028] In a fifth aspect, an embodiment of the present application further provides a display device, comprising: the above-mentioned display panel, or a display panel prepared according to the above-mentioned preparation method.

[0029] Through the above technical solution, a conductive layer is set between the substrate and the pixel definition layer, and the cathode (i.e., the second electrode) and the isolation structure are overlapped with the conductive layer respectively, that is, the cathode is overlapped with the conductive layer, and the conductive layer is overlapped with the isolation structure. In this way, the cathode and the isolation structure are electrically connected, which reduces the process requirements for overlapping the isolation structure and the cathode, widens the process margin, and can ensure the overlapping effect, avoid the occurrence of dark spots or dark spots, and improve the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 2 is a schematic structural diagram of a display panel provided in one embodiment of the present application.

[0032] Figure 2 2 is a schematic diagram of the cross-sectional structure of a display panel provided in one embodiment of the present application.

[0033] Figure 32 is a schematic structural diagram of a substrate of a display panel provided in one embodiment of the present application.

[0034] Figure 4 This is a pixel circuit diagram of a display panel provided in one embodiment of the present application.

[0035] Figure 5 3 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.

[0036] Figure 6 3 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.

[0037] Figure 7 3 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.

[0038] Figure 8 3 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.

[0039] Figure 9 3 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.

[0040] Figure 10 3 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.

[0041] Figure 11 3 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.

[0042] Figure 12 3 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.

[0043] Figure 13 3 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application.

[0044] Figure 14 1 is a flow chart of a method for manufacturing a display panel provided in one embodiment of the present application.

[0045] Figure 15 2 is a schematic structural diagram of a display device provided in one embodiment of the present application.

[0046] Description of reference numerals: 100. Display panel; 10. Substrate; 101. Transistor; 102. Planarization layer; 20. Pixel definition layer; 210. First type of opening; 220. Second type of opening; 221. First opening; 222. Second opening; 223. Third opening; 30. Light-emitting unit; 310. First electrode; 320. Light-emitting functional layer; 330. Second electrode; 40. Isolation structure; 401. Isolation opening; 410. First part; 420. Second part; 430. Third part; 50. Conductive layer; 510. Conductive part; 610. First encapsulation layer; 611. Encapsulation unit; 620. Second encapsulation layer; 630. Third encapsulation layer. DETAILED DESCRIPTION

[0047] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0049] It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0050] For ease of understanding, the drawings show mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is referred to as the X-direction, the direction along the Y-axis is referred to as the Y-direction, and the direction along the Z-axis is referred to as the Z-direction. The Z-direction is the normal direction relative to the plane containing the X-direction and the Y-direction. In addition, the situation where various elements are viewed parallel to the plane containing the X-direction and the Y-direction is referred to as a top view. Alternatively, the planes in the X-direction and the Y-direction are parallel to the display surface of the display panel, and the Z-direction is parallel to the thickness direction of the display panel.

[0051] For certain elements, terms such as "upper" or "above" are sometimes used to describe the position of the element in the Z direction, while "lower" or "below" is used to describe the position of the element in the opposite direction. In addition, when terms such as "upper," "above," "lower," "below," and "relatively" are used to define the relative position of two elements, they include not only a state in which the two elements are directly connected, but also a state in which the two elements are separated by a gap or other elements. In addition, terms such as "first," "second," and "third" are used only to distinguish and describe, and should not be understood to indicate or imply relative importance.

[0052] In this application, there is no need to use a mask. A full-surface evaporation process is adopted to separately evaporate and encapsulate light-emitting units of different colors (also called different sub-pixels). There is no need to consider the alignment accuracy during evaporation. Therefore, the gap between the light-emitting units can be designed to be smaller, thereby increasing the pixel density. In this method, an isolation structure is set between adjacent light-emitting units. The isolation structure can isolate adjacent light-emitting units, and the cathode needs to overlap with the isolation structure to reduce the overall surface resistance and improve display uniformity. However, the inventors found that there is a poor overlap between the cathode and the isolation structure, which increases the reliability risk of the display panel.

[0053] The inventors found that one of the reasons for the poor overlap is that the isolation structure is usually a three-layer structure of titanium, aluminum and molybdenum, which is obtained by first dry etching and then wet etching. The uniformity of each process in the preparation of the isolation structure, such as the deposition film forming process, dry etching process and wet etching process, is above 10%. The stability after the superposition of each process cannot be controlled within 10%, resulting in the horizontal distance from the edge of the titanium layer to the edge of the aluminum layer (ie, the SA length) being too long or too short, or the length of the molybdenum layer extending out of the aluminum layer being too short or shrinking relative to the aluminum layer, which will lead to poor overlap between the cathode and the isolation structure, and then dark spots or dark spots will appear.

[0054] Based on the above problems, an embodiment of the present application provides a display panel, in which a conductive layer is arranged between the substrate and the pixel definition layer, and the cathode (i.e., the second electrode) and the isolation structure are overlapped with the conductive layer respectively, that is, the cathode is overlapped with the conductive layer, and the conductive layer is overlapped with the isolation structure. In this way, the cathode and the isolation structure are electrically connected, which reduces the process requirements for overlapping the isolation structure and the cathode, widens the process margin, and can ensure the overlapping effect, avoid the occurrence of dark spots or dark spots, and improve the reliability of the display panel.

[0055] Figure 1This is a schematic diagram of the structure of a display panel provided in one embodiment of the present application. Display panel 100 may be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. Display panel 100 includes a display area AA having a display function and a non-display area NA.

[0056] The display area AA of the display panel 100 may be in a rectangular shape, or in other shapes such as a square, a circle, or an ellipse.

[0057] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. The pixels PX include a plurality of sub-pixels SPX that display different colors. In some embodiments, the pixels PX include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, in addition to the sub-pixels SPX1, SPX2, and SPX3, the pixels PX also include sub-pixels SPX that emit white light or other colors. The order of arrangement of the plurality of sub-pixels SPX is merely an example and is not limiting.

[0058] Subpixels SPX include pixel circuits and light-emitting units driven by the pixel circuits to emit light of corresponding colors. The first subpixel SPX1 includes a first light-emitting unit, the second subpixel SPX2 includes a second light-emitting unit, and the third subpixel SPX3 includes a third light-emitting unit. Each pixel circuit drives at least one light-emitting unit to emit light. For example, the display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is the display area corresponding to the sensor and has light-transmitting properties, while the normal display area is the display area not corresponding to the sensor. In the normal display area, one pixel circuit drives one light-emitting unit to emit light, while in the light-transmitting display area, one pixel circuit drives one or more light-emitting units to emit light.

[0059] Figure 2 : is a schematic diagram of a cross-sectional structure of a display panel provided in one embodiment of the present application. Specifically, Figure 2 Shown Figure 1 The schematic diagram of the cross-sectional structure of a portion of the film layer in the BB direction of a local area of the display panel is shown. Figure 2 As shown, the display panel 100 includes a substrate 10 , a pixel definition layer 20 , a plurality of light emitting units 30 , an isolation structure 40 and a conductive layer 50 .

[0060] In the embodiments of this application, Figure 3As shown, the substrate 10 includes a pixel circuit layer and a planarization layer 102. The pixel circuit layer includes a pixel circuit for driving the light-emitting unit 30 to emit light. Figure 3 The transistor 101 in the pixel circuit is shown. A via is provided in the planarization layer 102, and the first electrode 310 is electrically connected to the transistor 101 in the pixel circuit layer through the via. In addition, the pixel circuit layer also includes at least one insulating layer, which can include at least one of an inorganic layer and an organic layer. In addition, the substrate 10 also includes a scan line that provides a scan signal Scan to the pixel circuit and a data line that provides a data signal Data.

[0061] refer to Figure 4 The pixel circuit includes a driving transistor T1 and a data transistor T2, the source of the data transistor T2 is connected to a data line providing a data signal Data, the gate of the data transistor T2 is connected to a scan line providing a scan signal Scan, the drain of the data transistor T2 is connected to the gate of the driving transistor T1, the two ends of the storage capacitor C1 are respectively connected to the gate and source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting unit. Figure 4 This is an embodiment of the pixel circuit. The pixel circuit of this application is not limited to Figure 4 The 2T1C pixel circuit shown may also be other pixel circuits, such as 5T1C, 6T1C, 7T1C, 8T1C pixel circuits, etc.

[0062] In the embodiment of the present application, the substrate 10 further includes a substrate, which can be a rigid substrate such as glass, polymethyl methacrylate (PMMA), a silicon substrate, etc., or a flexible substrate such as polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), etc.

[0063] Continue to refer Figure 2 , the pixel definition layer 20 is located on one side of the substrate 10, and the pixel definition layer 20 is provided with a plurality of first-type openings 210 and a plurality of second-type openings 220. For example, the pixel definition layer 20 encloses a plurality of first-type openings 210 and a plurality of second-type openings 220. In an embodiment of the present application, the pixel definition layer 20 includes an organic material or an inorganic material, which is not limited in this application. Optionally, the material of the pixel definition layer is an inorganic material, such as the pixel definition layer is made of an inorganic insulating material of at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON). In Figure 2In the embodiment, the second type of opening 220 includes a first opening 221 and a second opening 222. The second opening 222 is located on a side of the first opening 221 away from the first type of opening 210.

[0064] At least a portion of the light-emitting unit 30 is located within the first-type opening 210. The light-emitting unit 30 includes a first electrode 310, a light-emitting functional layer 320, and a second electrode 330, which are stacked in a sequence away from the substrate 10. In the embodiment of the present application, the first electrode 310 comprises an anode, and the second electrode 330 comprises a cathode; alternatively, the first electrode 310 comprises a cathode, and the second electrode 330 comprises an anode. The first electrode 310 is located between the substrate 10 and the pixel definition layer 20, with the first-type opening 210 exposing at least a portion of the first electrode 310. The first electrode 310 may comprise a multilayer structure, for example, comprising a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, from a metal material such as silver, which has excellent light reflectivity. Each conductive oxide layer can be formed from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 330 is formed of a metal material such as an alloy of magnesium and silver (MgAg), for example.

[0065] In the embodiment of the present application, the light-emitting functional layer 320 includes a plurality of stacked film layers. Optionally, the light-emitting functional layer 320 includes at least one of a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer.

[0066] To enable the light-emitting functional layer 320 to emit light, a pixel voltage is applied to the first electrode 310 and a common voltage is applied to the second electrode 330. This creates a potential difference between the first electrode 310 and the second electrode 330, causing the light-emitting functional layer 320 disposed therebetween to emit light. For example, if a potential difference is formed between the first electrode 310 and the second electrode 330 of a blue light-emitting unit, the light-emitting functional layer 320 emits blue light; if a potential difference is formed between the first electrode 310 and the second electrode 330 of a green light-emitting unit, the light-emitting functional layer 320 emits red light; and if a potential difference is formed between the first electrode 310 and the second electrode 330 of a red light-emitting unit, the light-emitting functional layer 320 emits red light. The pixel voltage for the first electrode 310 is provided by the pixel circuit, while the common voltage for the second electrode 330 is provided by the isolation structure 40. Specifically, the second electrode 330 is electrically connected to the isolation structure 40. By supplying the common voltage to the isolation structure 40, the common voltage is supplied to the second electrode 330. That is, the isolation structure 40 has a function of supplying a common voltage to the second electrode 330 .

[0067] The isolation structure 40 is located on the side of the pixel definition layer 20 facing away from the substrate 10. The isolation structure 40 encloses a plurality of isolation openings 401. The orthographic projection of the first-type openings 210 on the substrate 10 is located within the orthographic projection of the isolation openings 401 on the substrate 10, that is, the first-type openings 210 are connected to the isolation openings 401. Optionally, the orthographic projection of the isolation structure 40 on the substrate 10 includes a grid-like structure.

[0068] The conductive layer 50 is located between the substrate 10 and the pixel definition layer 20. The second type opening 220 exposes at least a portion of the conductive layer 50, and the second electrode 330 and the isolation structure 40 are electrically connected through the conductive layer 50. Figure 2 In the embodiment, the first opening 221 exposes the first portion of the conductive layer 50, the second opening 222 exposes the second portion of the conductive layer 50, the second electrode 330 contacts the first portion of the conductive layer 50, and the isolation structure 40 contacts the second portion of the conductive layer 50. In this way, the second electrode 330 overlaps the conductive layer 50, and the conductive layer 50 overlaps the isolation structure 40, thereby achieving electrical connection between the second electrode 330 and the isolation structure 40. In an embodiment of the present application, the conductive layer 50 is arranged between the substrate 10 and the pixel definition layer 20. When preparing the first electrode 310, the conductive layer 50 is formed simultaneously, without adding additional preparation steps, and the process requirements are relatively low, reducing the process difficulty and cost. Secondly, the second electrode 330 overlaps the conductive layer 50, which reduces the difficulty of overlapping and can ensure a good overlapping effect, avoid the occurrence of dark spots or dark spots, and improve the reliability of the display panel 100. In addition, this solution reduces the process requirements for the isolation structure 40. Even if the length of the molybdenum layer (i.e., the third portion 430) extending out of the aluminum layer is too short or shrinks relative to the aluminum layer, it will not affect the electrical connection between the cathode and the isolation structure 40.

[0069] Alternatively, as Figure 2 As shown, the isolation structure 40 includes a first portion 410 (also referred to as an isolation portion) and a second portion 420 (also referred to as a blocking portion), stacked sequentially in a direction away from the substrate 10. The orthographic projection of the first portion 410 on the substrate 10 is located within the orthographic projection of the second portion 420 on the substrate 10. That is, the ends of the second portion 420 protrude from the sides of the first portion 410. This isolation structure 40 is shaped as an overhang. Optionally, the first portion 410 and the second portion 420 are made of different materials, and the etching rate of the first portion 410 is greater than the etching rate of the second portion 420, thereby obtaining an overhang-shaped structure. Optionally, the material of the first portion 410 includes a conductive material, such as aluminum (Al) or an aluminum alloy, wherein the aluminum alloy may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The second part 420 may be a single-layer structure or a multi-layer structure. When the second part 420 is a single-layer structure, the material of the second part 420 includes at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. When the second part 420 is a multi-layer structure, one layer of the second part 420 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy, and another layer of the second part 420 may be made of a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO). For example, the material of the first part 410 includes aluminum, and the material of the second part 420 includes titanium. Figure 2 As shown, the first portion 410 is in contact with the conductive layer 50. The orthographic projection of at least a portion of the side surface of the first portion 410 facing the isolation opening 401 on the substrate 10 is located within the orthographic projection of the conductive layer 50 on the substrate 10. In other words, the orthographic projection of the first portion 410 on the substrate 10 at least partially overlaps with the orthographic projection of the conductive layer 50 on the substrate 10, thereby achieving contact between the first portion 410 and the conductive layer 50.

[0070] Alternatively, as Figure 5As shown, the isolation structure 40 includes a third part 430 (also called a base), a first part 410 (also called an isolation part) and a second part 420 (also called a blocking part) stacked in sequence in a direction away from the substrate 10. The orthographic projection of the first part 410 on the substrate 10 is located within the orthographic projection of the second part 420 on the substrate 10, and the orthographic projection of the third part 430 on the substrate 10 is located within the orthographic projection of the second part 420 on the substrate 10. The embodiment of the present application does not limit the setting length of the first part 410 and the third part 430. The third part 430 can be protruded relative to the first part 410, or the third part 430 can be retracted relative to the first part 410, that is, the process requirements of the isolation structure 40 of the present application are relatively low. For the description of the first part 410 and the second part 420, please refer to the description of other parts of this application and will not be repeated here. The material of the third part 430 includes at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum tungsten alloy (MoW) or molybdenum niobium alloy (MoNb). As Figure 5 As shown, the third portion 430 is in contact with the conductive layer 50. In the embodiment of the present application, the orthographic projection of at least a portion of the side surface of the third portion 430 facing the isolation opening 401 on the substrate 10 is located within the orthographic projection of the conductive layer 50 on the substrate 10. That is, the orthographic projection of the third portion 430 on the substrate 10 at least partially overlaps with the orthographic projection of the conductive layer 50 on the substrate 10, thereby achieving contact between the third portion 430 and the conductive layer 50. Optionally, the orthographic projection of at least a portion of the side surface of the first portion 410 facing the isolation opening 401 on the substrate 10 is located within the orthographic projection of the conductive layer 50 on the substrate 10. That is, the orthographic projection of the first portion 410 on the substrate 10 at least partially overlaps with the orthographic projection of the conductive layer 50 on the substrate 10.

[0071] It should be noted that, because the side surfaces of the first portion 410 (e.g., aluminum) are easily oxidized during the manufacturing process, a third portion 430 (e.g., molybdenum) is required. The second electrode 330 is first overlapped with the third portion 430, and the second electrode 330 is overlapped with the first portion 410 via the third portion 430. In the embodiment of the present application, since the first portion 410 can directly contact the conductive layer 50, the second electrode 330 overlaps with the first portion 410 via the conductive layer 50, and thus the third portion 430 can be omitted.

[0072] In the embodiment of the present application, the pixel definition layer 20 includes a first side surface corresponding to the first opening 221. A first angle α between the first side surface and the surface of the pixel definition layer 20 proximate to the substrate 10 is greater than 0 and less than or equal to 45°, for example, 5°, 10°, 20°, 30°, 40°, or 45°. In the embodiment of the present application, since the second electrode 330 is required to extend into the first opening 221, the first angle α cannot be too large to prevent the second electrode 330 from having difficulty climbing the slope and breaking. In the embodiment of the present application, the second electrode 330 covers the first-type opening 210 and extends toward the first opening 221, covering at least a portion of the first opening 221. This allows the second electrode 330 to overlap with the conductive layer 50. Alternatively, whether the second electrode 330 can overlap with the conductive layer 50, and the overlap area, depends on the position of the second portion 420 (i.e., the blocking portion) of the isolation structure 40 toward the edge of the isolation opening 401 and the first opening 221, as well as the deposition angle of the second electrode material. After determining the position of the edge of the second portion 420 (i.e., the blocking portion) of the isolation structure 40 facing the isolation opening 401 and the first opening 221, selecting a suitable evaporation angle can ensure that the second electrode 330 and the conductive layer 50 have sufficient overlapping area. It should be noted that the embodiment of the present application does not limit the location of the edge of the second portion 420 of the isolation structure 40 and the first opening 221, as long as the evaporation angle is matched to achieve overlapping between the second electrode 330 and the conductive layer 50. For example, the orthographic projection of the edge of the second portion 420 facing the isolation opening 401 on the substrate 10 can be located within the orthographic projection of the first opening 221 on the substrate 10, or the orthographic projection of the edge of the second portion 420 facing the isolation opening 401 on the substrate 10 can be located outside the orthographic projection of the first opening 221 on the substrate 10 (i.e., the edge of the second portion 420 facing the isolation opening 401 is closer to the first type of opening 210 than the first opening 221).

[0073] In the embodiment of the present application, the light-emitting functional layer 320 covers at least the first type of opening 210. Optionally, the light-emitting functional layer 320 may also extend toward the first opening 221. For example, the light-emitting functional layer 320 may cover a portion of the first side surface corresponding to the first opening 221; alternatively, the light-emitting functional layer 320 may also cover a portion of the bottom surface of the first opening 221. In the embodiment of the present application, the vapor deposition area of the second electrode 330 only needs to be larger than the vapor deposition area of the light-emitting functional layer 320 to ensure that the second electrode 330 can overlap with the conductive layer 50.

[0074] In the embodiment of the present application, the conductive layer 50 is formed from the same material as the first electrode 310. Optionally, the conductive layer 50 includes a first sub-conductive layer and a second sub-conductive layer stacked sequentially in a direction away from the substrate 10. Optionally, the first sub-conductive layer is made of a metal, and the second sub-conductive layer is made of a transparent conductive oxide. For example, the first sub-conductive layer is made of silver, and the second sub-conductive layer is made of ITO.

[0075] Optionally, the conductive layer 50 includes a third sub-conductive layer, a first sub-conductive layer, and a second sub-conductive layer stacked in sequence away from the substrate 10. Optionally, the first sub-conductive layer is made of metal, and the second and third sub-conductive layers are made of transparent conductive oxides. For example, the first sub-conductive layer is made of silver, and the second and third sub-conductive layers are made of ITO. That is, the conductive layer 50 includes a stacked structure of ITO / Ag / ITO.

[0076] Optionally, the display panel 100 further includes a first encapsulation layer 610 located on the side of the light-emitting unit 30 facing away from the substrate 10. The first encapsulation layer 610 includes a plurality of spaced-apart encapsulation units 611. The encapsulation units 611 are located on the side of the second electrode 330 facing away from the substrate 10 and extend through the sidewall of the isolation structure 40 to the side of the isolation structure 40 facing away from the substrate 10. The encapsulation units 611 correspond to the light-emitting units 30, and the orthographic projection of the light-emitting unit 30 on the substrate 10 is located within the orthographic projection of the encapsulation units 611 on the substrate 10. It should be noted that because the light-emitting functional material and the second electrode material between the encapsulation units 611 and the isolation structure 40 are etched away, a gap exists between the encapsulation units 611 and the isolation structure 40.

[0077] like Figure 6 As shown, the display panel 100 further includes a second encapsulation layer 620 and a third encapsulation layer 630 located on the side of the first encapsulation layer 610 facing away from the substrate. The second encapsulation layer 620 and the third encapsulation layer 630 are stacked sequentially in a direction away from the substrate 10. Optionally, the first encapsulation layer 610 and the third encapsulation layer 630 include inorganic encapsulation layers, and the second encapsulation layer 620 includes an organic encapsulation layer. The material of the first encapsulation layer 610 and the third encapsulation layer 630 includes at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The material of the second encapsulation layer 620 includes a resin material such as epoxy resin and acrylic resin. The second encapsulation layer 620 and the third encapsulation layer 630 are continuously disposed at least throughout the display area AA, and a portion thereof is also disposed in the frame area NA.

[0078] The display panel 100 may further include at least one film layer such as a touch layer, a polarizer, a color filter layer, a cover plate, etc. The film layer may also be bonded to the display panel 100 via an adhesive layer such as an OCA (Optical Clear Adhesive).

[0079] Figure 7 3 is a schematic diagram of the cross-sectional structure of a display panel provided in another embodiment of the present application. Figure 7 The display panel 100 is shown with Figure 2 The difference between the display panel 100 shown is that the second-type openings 220 include multiple third openings 223, which expose at least a portion of the conductive layer 50. The second electrode 330 and the isolation structure 40 are respectively electrically connected to the conductive layer 50 exposed by the third openings 223. Optionally, the second electrode 330 covers the first-type openings 210 and extends toward the third openings 223 to cover at least a portion of the third openings 223. Optionally, the pixel definition layer 20 includes a second side surface corresponding to the third openings 223. The second angle β between the second side surface and the surface of the pixel definition layer 20 near the substrate 10 is greater than 0 and less than or equal to 45°, for example, 5°, 10°, 20°, 30°, 40°, 45°, etc., to prevent the second electrode 330 from breaking.

[0080] In the embodiment of the present application, the second type of opening 220 includes only the third opening 223, which simplifies the etching process compared to simultaneously etching the first opening 221 and the second opening 222. Furthermore, because the second electrode 330 and the isolation structure 40 are both overlapped with the conductive layer 50 within the third opening 223 in this embodiment, the third opening 223 can be designed to be relatively large, making it easier to control the size of the second angle, resulting in a relatively small second angle. This ensures the climbing ability of the second electrode 330, prevents breakage of the second electrode 330, further improves the overlap success rate, and thus enhances the stability of the display panel 100.

[0081] Figures 8 to 13 They are cross-sectional structural diagrams of a display panel provided by an embodiment of the present application. Specifically, Figures 8 to 13 yes Figure 1 The cross-sectional structure diagram of the display panel along the CC line is shown. Figure 2 and Figure 7 Only a cross-sectional structure including one light emitting unit 30 is shown. Figures 8 to 13 The cross-sectional structure includes two light emitting units 30. It should be noted that for structures or structural details not mentioned below, reference can be made to the description in other parts of this application.

[0082] like Figures 8 to 10As shown, the second type of opening 220 includes a plurality of adjacently arranged first openings 221 and second openings 222, the second openings 222 being located on the side of the first openings 221 away from the first type of openings 210, the first openings 221 exposing a first portion of the conductive layer 50, the second openings 222 exposing a second portion of the conductive layer 50, the second electrode 330 being in contact with the first portion of the conductive layer 50, and the isolation structure 40 being in contact with the second portion of the conductive layer 50.

[0083] exist Figure 8 In the embodiment, the conductive layer 50 includes a plurality of conductive portions 510 arranged at intervals, and the orthographic projections of the conductive portions 510 on the substrate 10 at least partially surround the orthographic projections of the first electrode 310 on the substrate 10. For example, the orthographic projections of the conductive portions 510 on the substrate 10 surround a portion of the orthographic projections of the first electrode 310 on the substrate 10, that is, the conductive portions 510 only contact a portion of the edge region of the second electrode 330 within the isolation opening 401. In this case, it is sufficient to ensure that the second electrode 330 and the conductive portions 510 have a sufficient overlapping area. Optionally, the orthographic projections of the conductive portions 510 on the substrate 10 surround the orthographic projections of the first electrode 310 on the substrate 10. That is, the conductive portions 510 contact the entire edge region of the second electrode 330 within the isolation opening 401. Similarly, the orthographic projections of the conductive portions 510 on the substrate 10 at least partially surround the orthographic projections of the first type of openings 210 on the substrate 10.

[0084] exist Figure 9 and Figure 10 In the embodiment, the orthographic projection of the conductive layer 50 on the substrate 10 includes a grid-like structure, the conductive layer 50 is provided with a plurality of grid holes, and the orthographic projection of the first electrode 310 on the substrate 10 is located within the orthographic projection of the grid holes on the substrate 10. Optionally, the orthographic projection of the grid holes on the substrate 10 at least partially overlaps with the orthographic projection of the isolation opening 401 on the substrate 10. For example, the orthographic projection of the grid holes on the substrate 10 is located within the orthographic projection of the isolation opening 401 on the substrate 10. Optionally, the orthographic projection of the first portion 410 on the substrate 10 is located within the orthographic projection of the conductive layer 50 on the substrate 10. If the isolation structure 40 includes a third portion 430, the orthographic projection of the third portion 430 on the substrate 10 is located within the orthographic projection of the conductive layer 50 on the substrate 10. Wherein, in Figure 9 In the embodiment, two second openings 222 are provided between two adjacent first openings 221, and a portion of the pixel definition layer 20 is provided between the two second openings 222. Figure 10 In the embodiment, a second opening 222 is provided between two adjacent first openings 221 , which can reduce the difficulty of preparing the second opening 222 and simplify the preparation process.

[0085] like Figures 11 to 13As shown, the second type of openings 220 include a plurality of adjacent third openings 223 , which expose at least a portion of the conductive layer 50 . The second electrode 330 and the isolation structure 40 are electrically connected to the conductive layer 50 exposed by the third openings 223 .

[0086] exist Figure 11 In the embodiment, the conductive layer 50 includes a plurality of conductive portions 510 arranged at intervals, and the orthographic projections of the conductive portions 510 on the substrate 10 at least partially surround the orthographic projections of the first electrode 310 on the substrate 10. For example, the orthographic projections of the conductive portions 510 on the substrate 10 surround a portion of the orthographic projections of the first electrode 310 on the substrate 10, that is, the conductive portions 510 only contact a portion of the edge region of the second electrode 330 within the isolation opening 401. In this case, it is sufficient to ensure that the second electrode 330 and the conductive portions 510 have a sufficient overlapping area. Optionally, the orthographic projections of the conductive portions 510 on the substrate 10 surround the orthographic projections of the first electrode 310 on the substrate 10. That is, the conductive portions 510 contact the entire edge region of the second electrode 330 within the isolation opening 401. Similarly, the orthographic projections of the conductive portions 510 on the substrate 10 at least partially surround the orthographic projections of the first type of openings 210 on the substrate 10.

[0087] exist Figure 12 and Figure 13 In the embodiment, the orthographic projection of the conductive layer 50 on the substrate 10 includes a grid-like structure, the conductive layer 50 is provided with a plurality of grid holes, and the orthographic projection of the first electrode 310 on the substrate 10 is located within the orthographic projection of the grid holes on the substrate 10. Optionally, the orthographic projection of the grid holes on the substrate 10 at least partially overlaps with the orthographic projection of the isolation opening 401 on the substrate 10. For example, the orthographic projection of the grid holes on the substrate 10 is located within the orthographic projection of the isolation opening 401 on the substrate 10. Optionally, the orthographic projection of the first portion 410 on the substrate 10 is located within the orthographic projection of the conductive layer 50 on the substrate 10. If the isolation structure 40 includes a third portion 430, the orthographic projection of the third portion 430 on the substrate 10 is located within the orthographic projection of the conductive layer 50 on the substrate 10. Wherein, in Figure 12 In FIG, a portion of the pixel definition layer 20 is disposed between the conductive layer 50 and the isolation structure 40. Figure 13 In the embodiment, there is no pixel definition layer 20 between the conductive layer 50 and the isolation structure 40, which simplifies the etching process. Optionally, the orthographic projection of the first portion 410 on the substrate 10 is located within the orthographic projection of the third opening 223 on the substrate 10. If the isolation structure 40 includes the third portion 430, the orthographic projection of the third portion 430 on the substrate 10 is located within the orthographic projection of the third opening 223 on the substrate 10. In this embodiment, the conductive layer 50 can serve as one of the conductive film layers of the isolation structure 40.

[0088] The embodiment of the present application further provides a display panel 100, such as Figures 1 to 13As shown, the display panel 100 includes a substrate 10, a pixel definition layer 20, a plurality of light-emitting units 30, an isolation structure 40 and a conductive layer 50. The pixel definition layer 20 is located on one side of the substrate 10. The pixel definition layer 20 is provided with a plurality of first-type openings 210 and a plurality of second-type openings 220. The second-type openings 220 include a plurality of third openings 223. At least part of the light-emitting unit 30 is located in the first-type opening 210. The light-emitting unit 30 includes a first electrode 310, a light-emitting functional layer 320 and a second electrode 330 stacked in sequence away from the substrate 10. The isolation structure 40 is located on the side of the pixel definition layer 20 away from the substrate 10. The isolation structure 40 encloses a plurality of isolation openings 401. The orthographic projection of the first-type opening 210 on the substrate 10 is located within the orthographic projection of the isolation opening 401 on the substrate 10. The conductive layer 50 is located between the substrate 10 and the pixel definition layer 20. The third opening 223 exposes at least part of the conductive layer 50. The second electrode 330 and the isolation structure 40 are respectively electrically connected to the conductive layer 50 exposed by the third opening 223. In the embodiment of the present application, the second electrode 330 contacts the conductive layer 50, and the conductive layer 50 contacts the isolation structure 40, thereby achieving electrical connection between the second electrode 330 and the isolation structure 40, reducing the difficulty of overlapping, ensuring the overlapping effect, and improving the reliability of the display panel 100. In addition, in this solution, the second type of opening 220 only includes the third opening 223, which simplifies the etching process compared to etching the first opening 221 and the second opening 222 at the same time. In addition, since in this solution, the second electrode 330 and the isolation structure 40 are both overlapped with the conductive layer 50 within the third opening 223, the size of the third opening 223 can be designed to be relatively large, making it easier to control the size of the second angle, making the second angle relatively small, thereby ensuring the climbing ability of the second electrode 330, avoiding the second electrode 330 from breaking, further improving the overlap success rate, and thus improving the stability of the display panel 100.

[0089] The embodiments of the present application may be combined with some or all of the features of the above embodiments, which will not be described in detail here.

[0090] The embodiment of the present application further provides a display panel 100, such as Figures 1 to 13As shown, the display panel 100 includes a substrate 10, a pixel definition layer 20, a plurality of light-emitting units 30, an isolation structure 40, and a conductive layer 50. The pixel definition layer 20 is located on one side of the substrate 10 and is provided with a plurality of first-type openings 210 and a plurality of second-type openings 220; the plurality of light-emitting units 30, at least part of which is located within the first-type openings 210, and the light-emitting units 30 include a first electrode 310, a light-emitting functional layer 320, and a second electrode 330 stacked in sequence away from the substrate 10; the isolation structure 40 is located on the side of the pixel definition layer 20 away from the substrate 10, and the isolation structure 40 encloses a plurality of isolation openings 401, the first The orthographic projection of the first-class opening 210 on the substrate 10 is located within the orthographic projection of the isolation opening 401 on the substrate 10. The conductive layer 50 is located between the substrate 10 and the pixel definition layer 20. The orthographic projection of the conductive layer 50 on the substrate 10 includes a grid-like structure. The conductive layer 50 is provided with a plurality of grid holes. The orthographic projection of the first-class opening 210 on the substrate 10 is located within the orthographic projection of the grid holes on the substrate 10. The second-class opening 220 exposes at least a portion of the conductive layer 50. The conductive layer 50 is in contact with the isolation structure 40 and the second electrode 330, respectively. In the embodiment of the present application, in this solution, the conductive layer 50 is in contact with the isolation structure 40, and subsequently the second electrode 330 is in contact with the conductive layer 50. In this way, the second electrode 330 is electrically connected to the isolation structure 40, reducing the difficulty of overlapping, ensuring the overlapping effect, and improving the reliability of the display panel 100.

[0091] The embodiments of the present application may be combined with some or all of the features of the above embodiments, which will not be described in detail here.

[0092] The present application also provides a method for preparing a display panel, which is used to prepare the above-mentioned display panel. Figure 14 As shown, the preparation method includes the following steps.

[0093] Step S1401: preparing a first electrode and a conductive layer on a substrate.

[0094] Optionally, a conductive material layer is prepared on the substrate, and the conductive material layer is patterned to obtain a first electrode and a conductive layer, respectively. The first electrode and the conductive layer are spaced apart. For example, the conductive layer includes a plurality of conductive blocks, and the orthographic projections of the conductive blocks on the substrate at least partially surround the orthographic projection of the first electrode on the substrate. For another example, the orthographic projection of the conductive layer on the substrate includes a grid-like structure, and the grid-like structure includes a plurality of grid holes, and the orthographic projection of the first electrode on the substrate is located within the grid holes. In an embodiment of the present application, the conductive layer and the first electrode are prepared simultaneously, and no additional preparation process is added. Only the mask plate needs to be adjusted to simultaneously prepare the first electrode and the conductive layer, and the preparation process is simple.

[0095] Step S1402 : preparing a pixel definition layer and an isolation structure on a side of the first electrode and the conductive layer facing away from the substrate.

[0096] Optionally, the pixel definition layer is provided with a plurality of first-type openings and a plurality of second-type openings, wherein the first-type openings expose at least a portion of the first electrode, and the second-type openings expose at least a portion of the conductive layer. The isolation structure encloses the plurality of isolation openings, and the orthographic projections of the first-type openings on the substrate are located within the orthographic projections of the isolation openings on the substrate, i.e., the first-type openings and the isolation openings are connected.

[0097] In an embodiment of the present application, the preparation method includes: preparing a pixel definition material layer on the side of the first electrode and the conductive layer facing away from the substrate; performing a first patterning process on the pixel definition material layer to obtain a second type of opening; preparing an isolation structure on the side of the pixel definition material layer facing away from the substrate, the isolation structure covering a portion of the second type of opening to contact the conductive layer; and performing a second patterning process on the pixel definition material layer to obtain a first type of opening.

[0098] Step S1403: preparing a light-emitting functional layer and a second electrode in the isolation opening.

[0099] In the embodiment of the present application, the second electrode is electrically connected to the isolation structure through the conductive layer. Specifically, when the second electrode is evaporated, the second electrode covers the first type of opening and extends to at least a portion of the second type of opening to overlap with the conductive layer.

[0100] Optionally, the preparation method includes sequentially preparing a light-emitting functional layer, a second electrode, and an encapsulation unit in the isolated openings. In an embodiment of the present application, light-emitting units of different colors are prepared in steps. Optionally, a first preparation material layer corresponding to a first color light-emitting unit is prepared, the first preparation material layer of the first type of opening corresponding to the first color light-emitting unit is retained, and a light-emitting functional layer, a second electrode, and an encapsulation unit corresponding to the first color light-emitting unit are formed, and the first preparation material layer of the first type of opening corresponding to the second color light-emitting unit and the third color light-emitting unit is etched; then, a second preparation material layer corresponding to the second color light-emitting unit is prepared, the second preparation material layer of the first type of opening corresponding to the second color light-emitting unit is retained, and a light-emitting functional layer, a second electrode, and an encapsulation unit corresponding to the second color light-emitting unit are formed, and the second preparation material layer of the first type of opening corresponding to the first color light-emitting unit and the third color light-emitting unit is etched; then, a third preparation material layer corresponding to the third color light-emitting unit is prepared, the third preparation material layer of the first type of opening corresponding to the third color light-emitting unit is retained, and a light-emitting functional layer, a second electrode, and an encapsulation unit corresponding to the third color light-emitting unit are formed, and the third preparation material layer of the first type of opening corresponding to the first color light-emitting unit and the second color light-emitting unit is etched. For example, the first color light emitting unit, the second color light emitting unit, and the third color light emitting unit emit different colors.

[0101] Optionally, when preparing a red light-emitting unit, a red light-emitting functional layer, a second electrode and an encapsulation unit are prepared in sequence within the first type of opening corresponding to the red light-emitting unit; when preparing a green light-emitting unit, a green light-emitting functional layer, a second electrode and an encapsulation unit are prepared in sequence within the first type of opening corresponding to the green light-emitting unit; when preparing a blue light-emitting unit, a blue light-emitting functional layer, a second electrode and an encapsulation unit are prepared in sequence within the first type of opening corresponding to the blue light-emitting unit.

[0102] Optionally, the preparation method further comprises: sequentially preparing a second encapsulation layer and a third encapsulation layer on a side of the encapsulation unit facing away from the substrate.

[0103] An embodiment of the present application provides a display device, which includes the display panel described in the above embodiment.

[0104] Figure 15 Schematic diagram of the structure of a display device provided by an embodiment of the present application. Figure 15 As shown, the display device 1500 is a product with an image display function. For example, the display device 1500 can be used to display static images, such as pictures or photos. The display device 1500 can also be used to display dynamic images, such as videos.

[0105] The display device 1500 can be a laptop computer, a mobile phone, a handheld or portable computer, a camera, a video camera, a vehicle-mounted smart central control screen, a calculator, a smart watch, a GPS navigator, an electronic photo, an electronic billboard or sign, a projector, etc.

[0106] The display device 1500 includes a display panel provided by any of the above embodiments, which may be an organic light emitting diode display panel or a quantum dot electroluminescent display panel.

[0107] In addition, the display device 1500 may also have functions such as taking photos, recording videos, fingerprint recognition, and face recognition. Accordingly, the display device 1500 also includes at least one functional module for implementing the above functions, such as an under-screen camera, an under-screen fingerprint recognition sensor, etc.

[0108] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0109] The block diagrams of the devices, devices, equipment, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0110] It should also be noted that in the apparatus, device, and method of the present application, each component or each step can be decomposed and / or recombined, and such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0111] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0112] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

[0113] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that: include: substrate; A pixel definition layer is located on one side of the substrate, and the pixel definition layer is provided with a plurality of first-type openings and a plurality of second-type openings; a plurality of light-emitting units, at least part of each of which is located in the first type of opening, each of which comprises a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked away from the substrate; an isolation structure located on a side of the pixel definition layer facing away from the substrate, the isolation structure enclosing a plurality of isolation openings, wherein the orthographic projection of the first type of openings on the substrate is located within the orthographic projection of the isolation openings on the substrate; A conductive layer is located between the substrate and the pixel definition layer, the second-type opening exposes at least a portion of the conductive layer, and the second electrode and the isolation structure are electrically connected through the conductive layer.

2. The display panel according to claim 1, wherein: The second type of openings includes a plurality of adjacent first openings and second openings, the second openings being located on a side of the first openings away from the first type of openings; the first openings expose a first portion of the conductive layer, the second openings expose a second portion of the conductive layer, the second electrode contacts the first portion of the conductive layer, and the isolation structure contacts the second portion of the conductive layer; The second electrode covers the first type of openings and extends toward the first openings to cover at least a portion of the first openings.

3. The display panel according to claim 2, wherein: The pixel definition layer includes a first side surface corresponding to the first opening, and a first angle between the first side surface and a surface of the pixel definition layer close to the substrate is greater than 0 and less than or equal to 45°.

4. The display panel according to claim 1, wherein: The second type of openings includes a plurality of third openings, wherein the third openings expose at least a portion of the conductive layer, and the second electrode and the isolation structure are electrically connected to the conductive layer exposed by the third openings respectively; The second electrode covers the first type of openings and extends toward the third opening and covers at least a portion of the third opening.

5. The display panel according to claim 4, wherein: The pixel definition layer includes a second side surface corresponding to the third opening, and a second angle between the second side surface and a surface of the pixel definition layer close to the substrate is greater than 0 and less than or equal to 45°.

6. The display panel according to claim 1, wherein: The isolation structure includes a first portion and a second portion stacked in sequence in a direction away from the substrate, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the second portion on the substrate, and the first portion is in contact with the conductive layer; or The isolation structure includes a third part, a first part, and a second part stacked in sequence in a direction away from the substrate, the orthographic projection of the first part on the substrate is located within the orthographic projection of the second part on the substrate, the orthographic projection of the third part on the substrate is located within the orthographic projection of the second part on the substrate, and the third part is in contact with the conductive layer.

7. The display panel according to claim 6, wherein: An orthographic projection of at least a portion of a side surface of the first portion facing the isolation opening on the substrate is located within an orthographic projection of the conductive layer on the substrate; And / or, an orthographic projection of at least a portion of a side surface of the third portion facing the isolation opening on the substrate is located within an orthographic projection of the conductive layer on the substrate.

8. The display panel according to claim 1, wherein: The conductive layer includes a plurality of conductive portions that are spaced apart from each other, and orthographic projections of the conductive portions on the substrate at least partially surround orthographic projections of the first electrode on the substrate.

9. The display panel according to claim 8, wherein: The orthographic projection of the conductive portion on the substrate surrounds the orthographic projection of the first electrode on the substrate.

10. The display panel according to claim 1, wherein The orthographic projection of the conductive layer on the substrate includes a grid structure. The conductive layer is provided with a plurality of grid holes. The orthographic projection of the first electrode on the substrate is located within the orthographic projection of the grid holes on the substrate.

11. The display panel according to claim 10, wherein: The orthographic projection of the grid holes on the substrate at least partially overlaps with the orthographic projection of the isolation opening on the substrate.

12. The display panel according to any one of claims 1 to 11, characterized in that: The conductive layer and the first electrode are formed in the same layer and made of the same material.

13. The display panel according to any one of claims 1 to 11, characterized in that: The invention also includes a first encapsulation layer located on a side of the light-emitting unit facing away from the substrate, the first encapsulation layer including a plurality of encapsulation units arranged at intervals, the encapsulation units corresponding to the light-emitting units, and the orthographic projections of the light-emitting units on the substrate being located within the orthographic projections of the encapsulation units on the substrate; The display panel further includes a second encapsulation layer and a third encapsulation layer located on a side of the first encapsulation layer away from the substrate. The second encapsulation layer and the third encapsulation layer are sequentially stacked in a direction away from the substrate.

14. A display panel, characterized in that: include: substrate; a pixel definition layer, located on one side of the substrate, the pixel definition layer being provided with a plurality of first-type openings and a plurality of second-type openings, wherein the second-type openings include a plurality of third openings; a plurality of light-emitting units, at least part of each of which is located in the first type of opening, each of which comprises a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked away from the substrate; an isolation structure located on a side of the pixel definition layer facing away from the substrate, the isolation structure enclosing a plurality of isolation openings, wherein the orthographic projection of the first type of openings on the substrate is located within the orthographic projection of the isolation openings on the substrate; A conductive layer is located between the substrate and the pixel definition layer, the third opening exposes at least a portion of the conductive layer, and the second electrode and the isolation structure are respectively electrically connected to the conductive layer exposed by the third opening.

15. A display panel, characterized in that: include: substrate; A pixel definition layer is located on one side of the substrate, and the pixel definition layer is provided with a plurality of first-type openings and a plurality of second-type openings; a plurality of light-emitting units, at least part of each of which is located in the first type of opening, each of which comprises a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked away from the substrate; an isolation structure located on a side of the pixel definition layer facing away from the substrate, the isolation structure enclosing a plurality of isolation openings, wherein the orthographic projection of the first type of openings on the substrate is located within the orthographic projection of the isolation openings on the substrate; A conductive layer is located between the substrate and the pixel definition layer, the orthographic projection of the conductive layer on the substrate includes a grid-like structure, the conductive layer is provided with a plurality of grid holes, the orthographic projection of the first type of opening on the substrate is located within the orthographic projection of the grid hole on the substrate, the second type of opening exposes at least a portion of the conductive layer, and the conductive layer is in contact with the isolation structure and the second electrode, respectively.

16. The display panel according to claim 15, wherein: The isolation structure includes a first part and a second part stacked in sequence along a direction away from the substrate, the orthographic projection of the first part on the substrate is located within the orthographic projection of the second part on the substrate, and the first part is in contact with the conductive layer; or, the isolation structure includes a third part, a first part and a second part stacked in sequence along a direction away from the substrate, the orthographic projection of the first part on the substrate is located within the orthographic projection of the second part on the substrate, the orthographic projection of the third part on the substrate is located within the orthographic projection of the second part on the substrate, and the third part is in contact with the conductive layer.

17. The display panel according to claim 16, wherein: The orthographic projection of the first portion on the substrate is located within the orthographic projection of the conductive layer on the substrate; and / or the orthographic projection of the third portion on the substrate is located within the orthographic projection of the conductive layer on the substrate.

18. The display panel according to claim 17, wherein: The second type of opening includes a third opening, and an orthographic projection of the first portion and / or the third portion on the substrate is located within an orthographic projection of the third opening on the substrate.

19. The display panel according to claim 15, wherein: The second type of openings includes a plurality of adjacent first openings and second openings, the second openings being located on a side of the first openings away from the first type of openings; the first openings expose a first portion of the conductive layer, the second openings expose a second portion of the conductive layer, the second electrode contacts the first portion of the conductive layer, and the isolation structure contacts the second portion of the conductive layer; Alternatively, the second type of openings includes a plurality of third openings, the third openings exposing at least a portion of the conductive layer, and the second electrode and the isolation structure are electrically connected to the conductive layer exposed by the third openings, respectively.

20. A display device, characterized in that: include: The display panel according to any one of claims 1 to 19.

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