Method and system for printing unique identifier on semiconductor die

Abstract

Various systems and methods for printing a unique identifier on a semiconductor die are disclosed herein. Exemplary embodiments involve receiving a substrate at a lithographic workstation, the substrate including a photosensitive layer and a region for forming semiconductor dies, forming circuitry on the substrate using a photomask, printing a unique identifier on each semiconductor die of the substrate using a digital photomask, and removing the substrate including the semiconductor dies from the lithographic workstation, the semiconductor die includes a circuit and a unique identifier. In some embodiments, each unique identifier is associated with a unique record for recording characteristics of the substrate, the semiconductor die, and the unique identifier. In some embodiments, the digital reticle includes dynamically controlled pixels that are controllable to define a unique pattern of each unique identifier. In some embodiments, the unique identifier is a two-dimensional code.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 421,612, filed on November 2, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Various embodiments described herein are generally directed to one or more systems and methods for printing a unique identifier on a semiconductor die. Background Art

[0004] Semiconductor dies are integrated circuits used in a wide range of applications, including microprocessors, systems-on-chips, signal processors, and amplifiers. With the increasing use of integrated circuits across various industries and the proliferation of related component suppliers, the traceability of semiconductor dies has become more complex.

[0005] The ability to trace semiconductor dies, or products containing them, plays a crucial role in supply chain forecasting and defect detection. When accurate, relevant, and timely data about semiconductor dies is collected, high-value decisions can be made more easily. These decisions can significantly impact semiconductor profitability and delivery, as well as the fulfillment of contractual obligations.

[0006] Currently, the primary approach for supply chain forecasting relies on feedback from semiconductor manufacturing. This feedback can be ad hoc or require a complex set of systems, databases, and processes that can be unreliable and subject to constraints imposed by communication channels. Summary of the Invention

[0007] Various embodiments described herein generally relate to systems and methods for printing unique identifiers on semiconductor dies.

[0008] According to one broad aspect of the present teachings, a method for printing a unique identifier on a semiconductor die is provided. The method involves receiving a substrate at a photolithography workstation, the substrate comprising a photosensitive layer and regions for forming a plurality of semiconductor dies; forming a plurality of circuits on the substrate using at least one photomask, each circuit corresponding to a semiconductor die; printing a unique identifier on each semiconductor die on the substrate using at least one digital photomask; and removing the substrate comprising the plurality of semiconductor dies, each semiconductor die comprising the circuit and the unique identifier, from the photolithography workstation.

[0009] In some embodiments, the method involves associating a unique identifier with a unique record for the semiconductor die.

[0010] In some embodiments, at least one digital mask includes dynamically controlled pixels that are controllable into a unique pattern that defines a unique identifier.

[0011] In some implementations, the method involves determining one or more of a location and a size of the unique identifier based on one or more of a location of the circuitry and a pattern of the circuitry for each semiconductor die.

[0012] In some embodiments, the record includes: the source of the substrate, the batch number of the semiconductor die, the batch number of the substrate, the batch of the semiconductor die, the batch of the substrate, the location of the semiconductor die on the substrate, the size of the die, one or more dimensions of the unique identifier, the thickness of the unique identifier, the location of the unique identifier on the semiconductor die, the type of material of the unique identifier, and / or the manufacturing history of the semiconductor die.

[0013] In some embodiments, printing the unique identifier involves printing a unique QR code.

[0014] In some embodiments, the unique two-dimensional code is a Data Matrix code, a QR code, an Aztec code, a Flash code, or a semantic code.

[0015] In some embodiments, printing the unique identifier includes printing the unique identifier on a film comprising at least a portion of the circuit.

[0016] According to another embodiment, a system for printing a unique identifier on a semiconductor die is provided. The system includes a processor operable to determine a unique identifier on a semiconductor die; a database in communication with the processor for storing records associated with the unique identifier; and a lithography workstation in communication with the processor. The lithography workstation is configured to: receive a substrate including a photosensitive layer and regions for forming a plurality of semiconductor dies; form a plurality of circuits on the substrate using at least one photomask, each circuit corresponding to a semiconductor die; print a unique identifier on each semiconductor die in the substrate using at least one digital photomask; and remove the substrate including the plurality of semiconductor dies, each semiconductor die including the circuit and the unique identifier, from the lithography workstation.

[0017] In at least one embodiment, at least one digital mask includes dynamically controlled pixels, and the processor is operable to control the pixels of the digital mask to define a unique pattern of the unique identifier.

[0018] In at least one embodiment, the processor is further operable to determine one or more of a location and a size of the unique identifier based on one or more of a location of the circuitry and a pattern of the circuitry for each semiconductor die.

[0019] In at least one embodiment, printing the unique identifier on each semiconductor die includes printing the unique identifier on a periphery of the semiconductor die.

[0020] In at least one embodiment, the record includes one or more of the following: the source of the substrate, the batch number of the semiconductor die, the batch number of the substrate, the batch of the semiconductor die, the batch of the substrate, the location of the semiconductor die on the substrate, the size of the die, one or more sizes of the unique identifier, the location of the unique identifier on the semiconductor die, the thickness of the unique identifier, the type of material of the unique identifier, and the manufacturing history of the semiconductor die.

[0021] In at least one embodiment, printing the unique identifier includes printing a unique QR code.

[0022] In at least one embodiment, the unique two-dimensional code is one of a Data Matrix code, a QR code, an Aztec code, a Flash code, and a semantic code.

[0023] In at least one embodiment, printing the unique identifier includes printing the unique identifier on a film comprising at least a portion of the circuit.

[0024] According to another embodiment, a method for printing a unique identifier on a semiconductor die is provided. The method includes receiving a substrate at a photolithography workstation, the substrate including a photosensitive layer and regions for forming a plurality of semiconductor dies; printing a pattern onto the substrate using at least one digital mask, the pattern defining a circuit for each semiconductor die and a unique identifier for each semiconductor die; and removing the substrate from the photolithography workstation, the substrate including the plurality of semiconductor dies, each semiconductor die including the circuit and the unique identifier.

[0025] In at least one embodiment, at least one digital mask includes dynamically controlled pixels that are controllable into a unique pattern that defines a unique identifier.

[0026] In at least one embodiment, the at least one digital mask further includes at least one region defining a static pattern of pixels.

[0027] In at least one embodiment, the method includes determining one or more of a location and a size of the unique identifier based on one or more of a location of the circuitry and a pattern of the circuitry for each semiconductor die.

[0028] In at least one embodiment, printing a pattern including a circuit and a unique identifier on each semiconductor die includes printing the unique identifier on a periphery of the semiconductor die.

[0029] In at least one embodiment, the record includes one or more of the following: the source of the substrate, the batch number of the semiconductor die, the batch number of the substrate, the batch of the semiconductor die, the batch of the substrate, the location of the semiconductor die on the substrate, the size of the die, one or more dimensions of the unique identifier, the thickness of the unique identifier, the location of the unique identifier on the semiconductor die, the type of material of the unique identifier, and the manufacturing history of the semiconductor die.

[0030] In at least one embodiment, the unique identifier is a unique QR code.

[0031] In at least one embodiment, the unique two-dimensional code is one of a Data Matrix code, a QR code, an Aztec code, a Flash code, and a semantic code.

[0032] According to another embodiment, a system for printing a unique identifier on a semiconductor die is provided. The system includes a processor operable to determine a unique identifier on a semiconductor die; a database in communication with the processor for storing records associated with the unique identifier; and a lithography workstation in communication with the processor. The lithography workstation is configured to: receive a substrate comprising a photosensitive layer and regions for forming a plurality of semiconductor dies; print a pattern onto the substrate using a digital mask, the pattern defining circuitry for each semiconductor die and a unique identifier for each semiconductor die; and remove the substrate from the lithography workstation, the substrate comprising a plurality of semiconductor dies, each semiconductor die comprising circuitry and a unique identifier.

[0033] In at least one embodiment, at least one digital mask includes dynamically controlled pixels, wherein the processor is operable to control the pixels to define a unique pattern of the unique identifier.

[0034] In at least one embodiment, the at least one digital mask further includes at least one region defining a static pattern of pixels.

[0035] In at least one embodiment, the processor is further operable to determine one or more of a location and a size of the unique identifier based on one or more of a location of the circuitry and a pattern of the circuitry for each semiconductor die.

[0036] In at least one embodiment, printing the pattern defining the circuit and the unique identifier includes printing the unique identifier on a periphery of the semiconductor die.

[0037] In at least one embodiment, the record includes one or more of the following: the source of the substrate, the batch number of the semiconductor die, the batch number of the substrate, the batch of the semiconductor die, the batch of the substrate, the location of the semiconductor die on the substrate, the size of the die, one or more dimensions of the unique identifier, the thickness of the unique identifier, the location of the unique identifier on the semiconductor die, the type of material of the unique identifier, and the manufacturing history of the semiconductor die.

[0038] In at least one embodiment, the unique identifier is a unique QR code.

[0039] In at least one embodiment, the unique two-dimensional code is one of a Data Matrix code, a QR code, an Aztec code, a Flash code, and a semantic code.

[0040] According to another embodiment, a method for accessing a record associated with a semiconductor die is provided. The method involves: identifying a unique identifier of the semiconductor die, the unique identifier printed on the semiconductor die; determining at least one physical characteristic of the unique identifier; providing the unique identifier and the at least one physical characteristic to a database comprising records; determining at the database whether a record associated with the unique identifier includes the determined at least one physical characteristic; and providing access to the record in response to determining that the record associated with the unique identifier includes the determined at least one physical characteristic.

[0041] In some embodiments, the at least one physical characteristic is one of: a location of the unique identifier on the semiconductor die, a thickness of the unique identifier, and a size of the unique identifier.

[0042] It should be understood that the above overview sets forth representative aspects of the embodiments to assist those skilled in the art in understanding the following detailed description. Other features and advantages of the present application will become apparent from the following detailed description taken in conjunction with the accompanying drawings. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the present application, are given by way of illustration only, as various changes and modifications within the spirit and scope of the present application will become apparent to those skilled in the art from the detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] For a better understanding of the various embodiments described herein and to more clearly show how these various embodiments may be put into practice, reference will be made, by way of example, to the accompanying drawings which illustrate at least one exemplary embodiment, which will now be described. The drawings are not intended to limit the scope of the teachings described herein.

[0044] Figure 1 is a block diagram of an exemplary embodiment of a system for fabricating semiconductor dies.

[0045] Figure 2 yes Figure 1 Schematic diagram of a photolithography workstation of a system for manufacturing semiconductor die.

[0046] Figure 3 is a flow chart of an exemplary embodiment of a method for printing a unique identifier on a semiconductor die.

[0047] Figure 4 is a flow chart of another exemplary embodiment of a method for printing a unique identifier on a semiconductor die.

[0048] Figure 5A is a schematic diagram illustrating a cross-sectional view of an exemplary substrate that may be received by a lithography workstation according to the present invention.

[0049] Figure 5B is a schematic diagram illustrating a cross-sectional view of another exemplary substrate that may be received by a lithography workstation according to the present invention.

[0050] Figure 5C is a schematic diagram illustrating a cross-sectional view of another exemplary substrate that may be received by a lithography workstation according to the present invention.

[0051] Figure 6A is a schematic diagram of an exemplary substrate on which semiconductor grains have been formed.

[0052] Figure 6B yes Figure 6A Close-up view of the semiconductor grains of an exemplary substrate.

[0053] Figure 7 is a schematic diagram of an exemplary digital reticle according to the present invention.

[0054] Figure 8 is a flow chart of an exemplary embodiment of a method for accessing records associated with a semiconductor die.

[0055] Other aspects and features of the exemplary embodiments described herein will become apparent from the following description taken in conjunction with the accompanying drawings. DETAILED DESCRIPTION

[0056] The titles and abstracts of the invention provided herein are for convenience only and do not interpret the scope or meaning of the embodiments.

[0057] The various embodiments according to the teachings of this article will be described below to provide an example of at least one embodiment of the claimed subject matter. The embodiments described herein do not limit any claimed subject matter. The claimed subject matter is not limited to a device, system or method having all the features of any one of the devices, systems or methods described below, or is not limited to a plurality of or all common features of the devices, systems or methods described herein. There may be a device, system or method that is not an embodiment of any claimed subject matter described herein. Any subject matter described herein that is not claimed in this document may be the subject matter of another protective instrument (e.g., a continuing patent application), and the applicant, inventor or patentee does not intend to abandon, not claim protection or dedicate any such subject matter to the public through the disclosure in this document.

[0058] In addition, it should be understood that for simplicity and clarity of explanation, where appropriate, the reference numerals in the accompanying drawings may be repeated to indicate corresponding or similar elements or steps. In addition, many specific details are set forth to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other cases, well-known methods, processes, and components are not described in detail to avoid blurring the embodiments described herein. In addition, the description should not be considered to limit the scope of the embodiments described herein.

[0059] It should also be noted that the terms "couple" or "coupled" as used herein can have several different meanings depending on the context in which the terms are used. For example, the terms couple or coupled can have mechanical, electrical, or communication meanings. For example, as used herein, the terms couple or coupled can mean that two elements or devices can be connected to each other directly, or can be connected to each other via electrical elements, electrical signals, or mechanical elements through one or more intermediate elements or devices, depending on the particular context.

[0060] Throughout this specification and the appended claims, unless the context requires otherwise, the word "comprise" and variations thereof (eg, "includes" and "comprising") should be construed in an open, inclusive sense, i.e., "including, but not limited to."

[0061] Unless the context indicates otherwise, the various terms used throughout this specification should be read and understood as follows: singular articles and pronouns used throughout the specification include their plural forms, and vice versa. Terms may be further defined herein; as can be seen from the description of this specification, such definitions also apply to all instances in which these terms appear, both before and after.

[0062] It should also be noted that the term "and / or," as used herein, is intended to mean an inclusive "or." That is, for example, "X and / or Y" is intended to mean X or Y or both. As another example, "X, Y and / or Z" is intended to mean X or Y or Z or any combination thereof.

[0063] It should be noted that terms of degree such as "substantially," "about," and "approximately" as used herein mean a reasonable amount of deviation of the modified term such that the end result is not significantly changed. These terms of degree can also be construed as including the deviation of the modified term if such deviation would not negate the meaning of the term it modifies.

[0064] Furthermore, the recitation of numerical ranges by endpoints herein includes all values and fractions subsumed within that range (e.g., 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.90, 4, and 5). It should also be understood that all values and fractions are considered to be modified by the word "about," which means that there may be a certain amount of variation, for example, 1%, 2%, 5%, or 10%, from the recited value without a significant change in the end result.

[0065] Reference throughout this specification to "one embodiment," "an embodiment," "at least one embodiment," or "some embodiments" means that one or more of the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments unless otherwise specified as not combinable or not available as an alternative.

[0066] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the content clearly dictates otherwise. It should also be noted that the term "or" is generally used in its broadest sense, i.e., in the sense of "and / or," unless the content clearly dictates otherwise.

[0067] It should be noted that, unless otherwise specified, the terms "substrate" and "wafer" are used interchangeably in this specification.

[0068] A portion of the exemplary embodiments of the systems, devices, or methods described in accordance with the teachings herein may be implemented as a combination of hardware or software. For example, a portion of the embodiments described herein may be implemented, at least in part, using one or more computer programs executed on one or more programmable devices, the one or more programmable devices comprising at least one processing element and at least one data storage element (including volatile and non-volatile memory). Depending on the nature of the device, the device may also have at least one input device (e.g., a keyboard, a mouse, a touch screen, etc.) and at least one output device (e.g., a display screen, a printer, a radio, etc.).

[0069] It should also be noted that there may be some elements for realizing at least a portion of the embodiments described herein, which may be implemented via software written in a high-level programming language (e.g., object-oriented programming). The program code may be written in C, C++, or any other suitable programming language, and may include modules or classes known to those skilled in the art of object-oriented programming. Alternatively or in addition, some of these elements implemented via software may be written in assembly language, machine language, or firmware as needed.

[0070] At least some of the software programs for implementing at least one embodiment described herein may be stored in a storage medium or device readable by a general-purpose or special-purpose programmable device. When the programmable device reads the software program code, the software program code configures the programmable device to operate in a new, specific, and predefined manner to perform at least one of the methods described herein.

[0071] In addition, at least some programs associated with the systems and methods of the embodiments described herein can be distributed in a computer program product comprising a computer-readable medium carrying computer-usable instructions (e.g., program code) for one or more processors. The program code can be pre-installed and embedded during the manufacturing process and / or can be installed later as an update to a deployed computing system. The medium can be provided in various forms, including non-transient forms, such as, but not limited to, one or more floppy disks, optical disks, tapes, chips, and magnetic and electronic storage devices. In alternative embodiments, the medium can be transient in nature, such as, but not limited to, wired transmission, satellite transmission, Internet transmission (e.g., downloading), media, digital and analog signals, etc. The computer-usable instructions can also be in various formats, including compiled and non-compiled code.

[0072] Thus, any module, unit, component, server, computer, terminal, or device that executes software instructions as described herein may include or otherwise access computer-readable media such as storage media, computer storage media, or data storage devices (removable and / or non-removable) such as disks, optical disks, or tapes. Computer storage media may include volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (e.g., computer-readable instructions, data structures, program modules, or other data). Examples of computer storage media include RAM, ROM, EEPROM, flash memory or other storage technology, CD-ROM, digital versatile disks (DVDs) or other optical storage devices, cassettes, magnetic tape, magnetic disk storage devices or other magnetic storage devices, or any other media that can be used to store the desired information and that can be accessed by the application, module, or both. Any such computer storage medium may be part of the device, or may be accessible or connectable to the device.

[0073] Existing techniques for identifying microchips containing semiconductor dies involve tracing the batch number or wafer number of each die. However, these techniques cannot trace individual dies and therefore may not be suitable for tracing microfabrication defects or microfabrication non-uniformities. Furthermore, because these techniques cannot identify individual dies, they struggle to distinguish defects caused by packaging from defects or variations caused by microfabrication.

[0074] Other existing technologies involve assigning virtual or physical identifiers to wafers and tracking individual die wafers based on the order in which they were extracted from the die wafer. In some cases, identifiers are also added to the die packages. However, these technologies can be imprecise, error-prone, and may require repeated verification. For example, when the die are extracted from the wafer and packaged, operational errors may occur and the die may be misplaced or mixed. Resolving these pick and place errors can be challenging.

[0075] Other existing techniques involve blowing resistors or transistors within a transistor matrix to create open circuits within the matrix, thereby generating recognizable patterns in digital memory. Similar techniques involve placing integrated circuit memory blocks on the die and exploiting natural variations in semiconductor processing to create a recognition matrix. However, these techniques only work with digital microcircuits, degrade over time, and fail when digital circuits are damaged.

[0076] Various exemplary embodiments are described herein that can be used to encode a unique identifier on a semiconductor die.Using a unique identifier on a semiconductor die can improve the traceability of microchips, thereby enabling defect detection and improving quality control.

[0077] The disclosed methods and systems may involve printing a unique identifier using techniques, devices, and / or machines for patterning circuits on a substrate during the manufacturing process of a semiconductor die prior to the substrate being singulated. The unique identifier may be printed as a two-dimensional barcode and may be associated with a record that may be used to record data about the semiconductor die and / or events related to its manufacture and / or use. The position and size of the unique identifier may be determined based on the design (e.g., size, location, type, physical design) of the circuit pattern printed on the semiconductor die and may be selected to minimize interference with the circuit. The unique identifier, and in some cases the circuit, may be printed on the substrate using a digital mask.

[0078] At least some embodiments described herein can print a unique identifier on a semiconductor die using existing components, machinery, and / or equipment used in the manufacture of semiconductor dies, and accordingly, can provide a cost-effective method for printing a unique identifier. At least some embodiments described herein can print a unique identifier using conventional equipment during a typical semiconductor die manufacturing process.

[0079] Printing an identifier on a semiconductor die allows for improved traceability of the semiconductor microchip on which the semiconductor die resides. For example, information related to the origin or manufacturing history of the semiconductor die can be associated with the identifier and set in a database for access by parties involved in the life cycle of the semiconductor die. For example, traceability can be used to comply with export regulations. For example, different geographic regions or countries may have different requirements for semiconductor microchips and may require that semiconductor microchips comply with specific standards, regulations, restrictions, tax requirements and / or quality control requirements. When a microchip is intercepted, the unique identifier printed on the semiconductor die can be read and information about the microchip can be provided that is useful in determining compliance. Accordingly, printing a unique identifier on a semiconductor makes it possible to identify weak links in the supply chain and / or distribution network.

[0080] Furthermore, printing an identifier on a semiconductor die can help verify the authenticity of the semiconductor die and / or products containing the semiconductor die. In many cases, recycled, used, or illegally refurbished semiconductor microchips (e.g., semiconductor packages that have had information erased to meet qualification requirements) are sold to buyers. Such semiconductor microchips do not meet regulations, the quality standards provided by the original manufacturer, or the warranty. When the identifier is read, information about the semiconductor die can be obtained and help determine the die's authenticity.

[0081] At least some embodiments described herein provide a cost-effective system and / or method for printing a durable unique identifier on a semiconductor die that minimizes the risk of damage to the functionality of the semiconductor die, thereby improving production yield and product reliability. For example, the unique identifier can be printed on a functional film of the die and sealed through the conventional manufacturing process of the semiconductor die, thereby reducing the risk of tampering or removal. In addition, the unique identifier can be printed on a photoresist layer and then transferred to a constituent layer such as a film through a typical etching process in the manufacture of semiconductor die. Typical constituent layers use silicon compounds that can withstand high temperatures of, for example, 900°C to 1300°C, and accordingly, the unique identifier can be resistant to damage from electrical fires.

[0082] The various exemplary embodiments described herein can provide improvements for supply chain management, forecasting, and production planning for semiconductor microchips and devices including semiconductor microchips. For example, based on the number of dies included in a wafer and the manufacturing time of the dies, a production timeline for the dies, such as from the manufacturing stage to the end product stage, can be estimated. The various exemplary embodiments described herein can establish a record of semiconductor dies that can be accessed by stakeholders involved in the manufacturing, assembly, and use of the semiconductor dies and / or the semiconductor microchips in which the semiconductor dies reside, as well as by end users.

[0083] Now refer to Figure 1 , which shows a block diagram of a system 100 for manufacturing semiconductor dies. The system 100 includes a die design system 110, a sawing and sorting device 160, and an external data storage device 180 that communicate with a lithography workstation 160 via a network 130. The system 100 is provided as an example, and other embodiments of the system 100 may exist with different components or different configurations of components than described herein. In particular, there may be embodiments of the system 100 with a greater number of components, Figure 1 Each component shown can be further broken down into a number of different components. It should also be understood that the fabrication of the semiconductor die may involve components that are not Figure 1 The steps performed by the components are shown (for simplicity).

[0084] The die design system 110 includes a processor 112, a data storage device 114, and a communication interface 116. The die design system 110 can be a personal computer, a workstation, a server, a portable computer, an electronic tablet device, a notebook, or any other electronic device capable of creating a die design. The die design system 110 can be implemented using more than one computer server distributed over a wide geographic area and connected via a network 130. The processor 112, the data storage device 114, and the communication interface 116 can be combined into a smaller number of components or can be separated into a larger number of components.

[0085] The processor 112 can be implemented using any suitable processor, controller, digital signal processor, graphics processing unit, application specific integrated circuit (ASIC) and / or field programmable gate array (FPGA) that can provide sufficient processing power for the configuration, purpose and requirements of the die design system 110. The processor 112 can include more than one processor, each processor configured to perform a different dedicated task. The processor 112 can be configured to determine information related to the pattern to be formed on the substrate, including but not limited to the physical and functional characteristics of the circuit pattern, the physical characteristics of the unique identifier (including the location and size of the unique identifier). In some cases, the processor 112 can be operable to control the operation of the photomask used by the lithography workstation 160.

[0086] Communication interface 116 may include any interface that enables die design system 110 to communicate with various devices and other systems, as well as network 130. For example, communication interface 116 may receive a die design and store the design in data storage device 114 or an external storage device. In some embodiments, die design system 110 itself may be used to design the die.

[0087] In some embodiments, the communication interface 116 may include at least one of a serial port, a parallel port, or a USB port. The communication component 116 may also include an interface connected to the component via one or more of the Internet, a local area network (LAN), Ethernet, FireWire, a modem, fiber optics, or a digital subscriber line connection. Various combinations of these elements may be integrated into the communication interface 116. For example, depending on the requirements and implementation of the die design system 110, the communication interface 116 may receive input from various input devices (e.g., a mouse, keyboard, touch screen, thumbwheel, trackpad, trackball, card reader, voice recognition software, etc.).

[0088] The data storage device 114 may include RAM, ROM, one or more hard disk drives, one or more flash drives, or some other suitable data storage element (e.g., a disk drive). The data storage device 114 may include one or more databases for storing the die design, information related to the die design, the composition of the substrate and / or photosensitive film, and / or information related to the manufacturing history of the die.

[0089] In some embodiments, the data storage device 114 can be used to store an operating system and programs. For example, the operating system provides various basic operating processes for the processor 112. The programs include various user programs so that the user can interact with the processor 112 to perform various functions, such as, but not limited to, viewing and / or designing dies. For example, the programs may include a design program for designing dies. The data storage device 114 can also be used to store information about the dies. For example, the data storage device can store information related to the dies, including but not limited to the batch number of a particular die, the source of the wafer substrate, the source of the batch, events related to the manufacturing history of the die, and any other information that can improve the traceability of the die. The data storage device 114 can also store mask patterns and / or mask operation information used to configure the mask.

[0090] The external data storage device 180 can store data similar to the data in the data storage device 114, particularly data related to dies, such as records of semiconductor dies. The external data storage device 180 can be remotely accessed by a computing device (not shown) via the network 130. In at least one embodiment, the external data storage device 180 can be a secure data storage device accessible by authorized users. For example, the external data storage device 180 can be accessed through the platform, and each user can be associated with a dedicated account that allows the user to view and / or modify records related to semiconductor dies. For example, access can be restricted based on the type of user.

[0091] The network 130 may include any network capable of carrying data, including the Internet, Ethernet, plain old telephone service (POTS) lines, public switched telephone networks (PSTN), integrated services digital networks (ISDN), digital subscriber lines (DSL), coaxial cables, optical fibers, satellites, mobile networks, wireless (e.g., Wi-Fi, WiMAX), SS7 signaling networks, fixed networks, local area networks, wide area networks, etc., and any combination thereof, that can interact with the die design system, the external data storage device 180, and the projection device 140 and enable communication therebetween.

[0092] The photolithography workstation 160 includes a projection device 140. The projection device 140 may include any machine capable of printing a pattern of material (including a pattern of circuits used to produce semiconductor dies) on a substrate 150. For example, the projection device 140 may be any type of machine or device that uses photolithography to produce a pattern of material and may include one or more light sources and a combination of lenses and mirrors. The projection device 140 may receive a design of a semiconductor die and / or substrate from the die design system 110 via the network 130.

[0093] The sawing machine 170 may include any machine for separating the die 154 from the substrate 152 after the die pattern is printed on the substrate 152, and may include any combination of mechanical sawing, cleaving, and / or laser cutting. Although for simplicity, Figure 1 Only one die 154 is shown in FIG, but it will be understood that the substrate 152 may be segmented into a plurality of die 154 .

[0094] Now refer to Figure 2 , which shows a schematic diagram of a lithography workstation 200 according to an embodiment. The lithography workstation may correspond to Figure 1 The lithography workstation 160 is provided.

[0095] The lithography workstation 200 includes a light source 242 that generates a light path 270, a lens 244, a mask 246, an optical column 248, and an alignment stage 252 for aligning a substrate received at the workstation 200 with optical components of the workstation.

[0096] The reticle 246 may be a digital reticle and may communicate with a processor (not shown) operable to send information (e.g., a pattern file and timing information for synchronizing the operation of the reticle 246 with other components of the lithography workstation 200 (e.g., light source 242, alignment stage 252)) to the reticle 246 to configure the reticle. The processor may be processor 112 or a separate processor. The digital reticle may be a digitally controllable pixel array capable of generating a pattern. For example, the pixel array may be comprised of microshutters that are dynamically configurable by the processor to transmit light (i.e., in an open (ON) state) or not transmit light (i.e., in a closed (OFF) state). The processor may control the pixel array during the lithography process (e.g., before each unique identifier is printed) to define the pattern. The processor operable to control the pixel array may be a processor that communicates with, or may be the same processor as, the processor operable to determine the pattern of unique identifiers and synchronize the reticle. In at least some embodiments, the reticle 246 is sized to be compatible with conventional lithography equipment (e.g., in place of a conventional reticle). Brief Reference Figure 7 , which illustrates an exemplary digital reticle 700 , each pixel of a pixel array 746 can be individually controlled such that a pattern is formed when the reticle 700 is exposed to light from a light source (eg, light source 242 ).

[0097] In some embodiments, the photomask 246 may also include a region defining a static pattern of pixels. For example, during the photolithography process, the pixels within the region defining the static pattern may remain unchanged. The pixels may correspond to pixels that have been pre-programmed to remain unchanged. Alternatively, the pixels may be non-programmable pixels. For example, the photomask 246 may include a conventional (i.e., non-programmable, passive) photomask region and a dynamic (i.e., programmable, active) region.

[0098] Now refer to Figure 3 , which shows a flowchart 300 of an exemplary method for printing a unique identifier on a semiconductor die. The method 300 can be performed by the system 100.

[0099] At step 302, method 300 involves receiving a substrate layer at a photolithography workstation. The substrate may be received, for example, at workstation 200. The received substrate may include one or more photosensitive layers and regions for forming semiconductor dies. Figure 5A, which shows a cross-section of an exemplary substrate that may be received at step 302 and the layers of the substrate, the substrate may include a substrate material 510 coated with a thin film 520 and a photoresist layer 530 .

[0100] Alternatively, in at least one embodiment, the receiving substrate may include multiple regions, each region associated with a die, each region including a complete circuit or a portion of a circuit printed on one or more films applied to a surface of the substrate. Figure 5C , which shows a cross-sectional view of an exemplary substrate and layers of the substrate that may be received at step 302, the received substrate may include a plurality of identical circuits patterned on the layers of the substrate. Figure 5C In the embodiment of the present invention, when the thin film 522 is patterned with an existing pattern, an additional thin film 524 and a photoresist layer 540 may be deposited at step 302 or before step 302. In some cases, the substrate may include circuits that have not yet been developed (i.e., the substrate may include patterned photoresist material 532 and unpatterned photoresist material 534), such as Figure 5B The circuit may be printed using methods and systems other than the method 200 and / or the system 100 .

[0101] In some cases, the received substrate may not include a photoresist layer. In this case, method 300 may involve applying a photoresist layer to the substrate. The surface of the substrate material may be coated with a thin film, and the photoresist may be deposited on the surface of the thin film.

[0102] As described, in some cases, the film on which the photoresist is deposited can be patterned with a complete circuit or a portion of a circuit so that the unique identifier is transferred to the layer comprising the circuit or portion of the circuit. In other cases, the film can be an unpatterned film. The photoresist layer can be deposited on the substrate using any technique suitable for depositing a photoresist layer on a prepared substrate (including, for example, spin coating techniques). The photoresist can be a positive photoresist or a negative photoresist. The film can be a film of any material used to manufacture semiconductor grains, such as, but not limited to, semiconductor materials, ceramic materials, and glass materials.

[0103] At step 304, method 300 involves forming circuits on the substrate received at step 302. Each circuit may correspond to a semiconductor die. At step 302, the entirety of the circuit to be formed on the substrate may be formed. The circuits may be formed using a photomask (e.g., a conventional photomask). If the received substrate already includes a portion of the circuit, step 304 may involve forming the remainder of the portion of the circuit.

[0104] At step 306, method 300 involves printing a unique identifier on the substrate. The unique identifier can be printed on each semiconductor die. The unique identifier can be printed using a digital mask (e.g., mask 246). For example, the mask used in step 304 can be replaced with a digital mask before step 306, so that the substrate can remain in the lithography workstation throughout steps 304 and 306 (i.e., the circuit and the unique identifier can be printed in the same lithography workstation). As shown in reference Figure 2 As described above, before printing each unique identifier, the pixels of the digital mask can be arranged to form a unique pattern. The pattern can be controlled by a processor in communication with the digital mask, as shown in FIG. Figure 2 In some cases, step 304 may involve developing the circuit, in which case a new film may be deposited prior to step 306, similar to Figure 5C In other cases, step 304 may not involve developing the formed circuit, in which case the unique identifier may be printed in the same photoresist layer as the circuit formed in step 304, similar to Figure 5B .

[0105] The unique identifier can be printed using photolithographic techniques that allow the design to be transferred to the film using physical and / or chemical processes. For example, if a positive photoresist is applied, printing the unique identifier can involve exposing the area where the photoresist was applied to alter the photoresist so that the areas of the photoresist are removed during development, thereby revealing the unique identifier. Alternatively, if a negative photoresist is applied, printing the unique identifier can involve exposing areas of the photoresist to strengthen the areas corresponding to the identifier, followed by a development process to dissolve the unexposed areas of the photoresist. The development process can involve exposing the substrate to a developer to remove either the exposed areas of the photoresist or the unexposed areas of the photoresist, depending on the properties of the photoresist. The film can then be etched to remove portions of the film not protected by the photoresist to reveal the unique identifier, and the photoresist can be removed, leaving the unique identifier as a film on the substrate. In some cases, the development and etching process may involve revealing the unique identifier and the circuit or portion of the circuit in the same step, for example, when the circuit or portion of the circuit included on the substrate has not yet been completely developed.

[0106] In some cases, the photoresist may be a permanent photoresist. For example, the permanent photoresist may be an epoxy resin, a benzocyclobutene (BCB) polymer, a sol-gel, or a spin-on film type photoresist. In this case, the photoresist may not be removed.

[0107] The unique identifier can be printed on an area of the die not covered by the circuitry. The location of the unique identifier can be determined based on the design of the circuitry. In some cases, the unique identifier can be printed on the periphery of a portion of the substrate corresponding to each semiconductor die, such that each semiconductor die includes a unique identifier. The identifier can be unique within a single substrate and / or across all substrates, such that no semiconductor die share the same identifier.

[0108] The size of the identifier may depend on the size of the semiconductor die and / or the size of the circuit printed on the semiconductor die, the location of the circuit on the semiconductor die, and / or the design of the circuit pattern. The size of the identifier may be selected to minimize the need to adjust the size of the semiconductor die to accommodate the unique identifier.

[0109] The identifier can be printed in any QR code format, including but not limited to Data Matrix, QR, Aztec, Flash, or Semacode. The QR code can be generated using known algorithms for generating unique QR codes and can be printed by activating pixels in a predetermined area of the die. Using a QR code requires a smaller die surface area than using characters, which also require activating a greater number of pixels.

[0110] In some cases, method 300 may involve determining the location of the unique identifier before printing the unique identifier. The location may be determined based on the format of the identifier and the type of circuit design printed on the substrate. The location may be determined to minimize interference with the circuit printed on the substrate. The location may be determined during the design of the semiconductor die, for example, using a design program. Alternatively, method 300 may involve determining the size and location of the circuit printed on the substrate after step 304 but before step 306, and determining the location of the unique identifier based on the size and location of the circuit printed on the substrate.

[0111] In some cases, steps 304 and 306 may be iteratively performed until the desired circuit pattern and unique identifier are printed on the substrate. For example, the circuit and / or unique identifier may be printed on multiple films, and / or functional films may be interleaved with films containing the unique identifier. The photosensitive layer may be removed between each iteration and / or after the desired pattern is obtained.

[0112] At step 308, the method involves removing the substrate including the printed circuit and the unique identifier from the lithography workstation. Once the substrate is removed from the lithography workstation, it can be singulated to obtain semiconductor dies. Each semiconductor die extracted from the substrate can include a unique identifier and a circuit design (the circuit design can be the same for all semiconductor dies extracted from the substrate).

[0113] Now briefly refer to Figure 6A and Figure 6B , which respectively show a close-up view of an exemplary substrate and semiconductor die formed thereon. As shown, after steps 304 and 306, substrate 650 includes regions defining semiconductor die 660a, 660b, and 660c, and each region corresponding to semiconductor die 660 includes circuitry 680 and a unique identifier 670.

[0114] In at least some embodiments, method 300 also involves associating a unique identifier with a record of the semiconductor die. For example, the record can be stored in a data storage device, such as an external data storage device 180 that can be accessed via a network. The record can include information about the semiconductor die, including but not limited to a batch number, a production batch of the semiconductor die and / or wafer, the source of the wafer, the wafer number, the location of the die on the wafer, the size of the die, the size of the identifier, the thickness of the identifier, the type of material used to print the identifier, the location of the identifier on the die, and the date and time of production of the die. In some cases, the record can be dynamic and can be updated to include event information as the die is further processed (e.g., when the die is mounted on a frame to form a microchip) and can provide a history of the die throughout the manufacturing process. For example, as the semiconductor die flows through the manufacturing process (e.g., when a microchip including the semiconductor die is integrated into an end product or after characteristic measurements are performed), the unique identifier can be read and additional information can be recorded in the record associated with the unique identifier. The unique identifier can be read by any device suitable for reading a physical identifier on a die (e.g., an optical microscope, and devices using infrared microscopy or X-ray tomography). In some cases, additional characteristics of the unique identifier can be determined when reading the identifier, including but not limited to the location of the identifier, the thickness of the identifier, and the size of the identifier.

[0115] In some cases, the records can be accessed via a platform that can be shared among stakeholders involved in the manufacture, assembly, and distribution of semiconductor dies, as well as end users of semiconductor dies and / or products containing semiconductor dies. For example, each stakeholder and / or end user can be associated with a dedicated account that allows access to and / or modification of the records. This can enable stakeholders to access information about semiconductor dies that can be used to help stakeholders make decisions, such as to aid supply chain forecasting and production scheduling.

[0116] The unique identifier can also be read by stakeholders or end users upon detecting a failure in the circuit associated with the unique identifier and / or a process failure caused by the circuit failure. By accessing the records associated with the unique identifier, the root cause of the failure can be identified, for example, by identifying events in the manufacturing history of the semiconductor die, or semiconductor dies that may be susceptible to the same failure can be identified.

[0117] The data storage device can be a secure data storage accessible to stakeholders and / or end users associated with a dedicated account. Access can be based on, for example, the type of dedicated account and / or can be determined by the manufacturer and / or owner of each semiconductor die. In some cases, accessing the record can involve providing information related to one or more physical characteristics of the identifier, including but not limited to the location of the identifier on the die, the thickness of the identifier, and the size of the identifier. Providing additional information related to the characteristics of the identifier can serve as an additional layer of authentication, for example to ensure that a user attempting to access the record associated with the die is indeed the owner of the die. In this case, accessing the record can involve providing a unique identifier for the semiconductor and providing one or more physical characteristics of the unique identifier. The data storage device and / or the platform providing access to the data storage device can then compare the one or more physical characteristics provided with the physical characteristics of the identifier recorded in the record associated with the unique identifier. Access to the record can be based on the result of the comparison.

[0118] Now refer to Figure 4 , which shows a flow chart of another exemplary method 400 for printing a unique identifier on a semiconductor die. Method 400 can be performed by system 100. Method 400 can be substantially similar to method 300. However, method 400 can involve printing a circuit and a unique identifier using a digital mask. Similar to method 300, method 400 can involve forming the circuit and the unique identifier within the same lithography workstation without removing the substrate from the lithography workstation.

[0119] In step 402, method 400 involves receiving a substrate at a lithography workstation. For example, a substrate can be received at lithography workstation 200. The received substrate can be a substrate that has been prepared by a microfabrication process, including, for example, cleaning and coating with a photosensitive layer. Similar to method 300, the received substrate can include a substrate material coated with a thin film and a photoresist layer, but in some cases, method 400 can involve applying a photoresist to the substrate. In this case, the surface of the received substrate can be coated with a thin film, and the photoresist can be deposited on the surface of the thin film. The photoresist layer can be deposited on the substrate using any technique suitable for depositing photoresist on the prepared substrate (including, for example, spin coating technology). The photoresist can be a positive photoresist or a negative photoresist. The film can be a film of any material used to manufacture semiconductor grains, such as, but not limited to, semiconductor materials, ceramic materials, and glass materials.

[0120] At step 404, the method involves printing a pattern including a circuit design and a unique identifier onto each region of the substrate received at step 402 corresponding to the die, such that the unique identifier can be printed in the same film layer as the functional film layer of the die. The pattern can be printed using a digital mask (e.g., digital mask 246). As shown in FIG. Figure 2 As described above, before printing each unique identifier, the pixels of the digital mask can be arranged to form a unique pattern. The pattern can be controlled by a processor in communication with the digital mask, as shown in FIG. Figure 2 As stated.

[0121] In at least one embodiment, some pixels of the digital mask may define one or more static (i.e., passive) regions. Static regions may correspond to pixels that remain constant across different die, i.e., the pixels may form a pattern that remains constant. For example, the regions may correspond to circuits that are the same across different die within a substrate. Figure 2 As described, the pixels may correspond to pixels that are pre-programmed to remain unchanged. Alternatively, the pixels may be non-programmable pixels (e.g., standard mask areas). In such embodiments, the patterns formed on different semiconductor dies may include the same components as well as components that vary between different dies.

[0122] As described with reference to method 300, printing the pattern can involve exposing areas of the photoresist to alter the photoresist so that the areas are removed during development, revealing the pattern. Alternatively, printing the pattern can involve exposing areas of the photoresist to strengthen the areas corresponding to the pattern, and then dissolving the unexposed areas of the photoresist during a development process. The substrate can then be developed and etched, as described with reference to method 200. Step 404 can be performed by an apparatus, machine, or component commonly used to manufacture semiconductor dies, and the unique identifier can be printed in one or more of the same steps as the circuitry.

[0123] As with method 300, in some cases, the photoresist may be a permanent photoresist. For example, the permanent photoresist may be an epoxy resin, a benzocyclobutene (BCB) polymer, a sol-gel, or a spin-on film type photoresist. In this case, the photoresist may not be removed.

[0124] Because method 400 can reduce the number of layers and processes involved in substrate processing, method 400 can improve production yield and efficiency and reduce the risk of semiconductor die damage compared to method 300. In addition, method 400 does not require the replacement of a photomask during the semiconductor die manufacturing process.

[0125] In some cases, method 400 may involve determining the location of the unique identifier before printing the pattern. The location may be determined to minimize interference with circuits printed on the substrate. The location may be determined during the design of the semiconductor die using a design program.

[0126] The unique identifier printed during method 400 may be substantially similar to the unique identifier of method 300 .

[0127] In at least some embodiments, step 404 can be iteratively performed until the desired pattern is achieved on the substrate, whereby multiple films and photoresists can be applied to the surface of the substrate or to the surface of an existing film. At least some of the films can include a pattern that includes a combination of a portion of a circuit and a portion of an identifier. For example, at least one film applied last on the substrate can be patterned to form a combination of at least a portion of a circuit and an identifier. In such an embodiment, the state (i.e., ON or OFF) of at least a portion of the pixels of the digital mask can be changed between layers. After the desired pattern is obtained, the substrate can be processed using known techniques to remove excess material including excess film, photoresist, or substrate material. Alternatively or in addition, the substrate can be processed between each iteration to remove excess photosensitive material.

[0128] At step 406 , method 400 involves removing the substrate including the circuitry and the unique identifier from the lithography workstation.

[0129] In at least some embodiments, the method further involves associating the unique identifier with a record associated with the semiconductor die. Each unique identifier printed on the substrate can be associated with a separate record. For example, the record can be stored in a data storage device, such as an external data storage device 180 that can be accessed via a network. The record can be substantially similar to the record of method 200. In some cases, the record can be associated before any or all of steps 402, 404, and 406. For example, the unique identifier can be associated with the record when designing the pattern of the semiconductor die.

[0130] Once the substrate is removed from the lithography workstation, the substrate can be segmented to obtain semiconductor dies. Each semiconductor die extracted from the substrate may include a unique identifier and a circuit design (the circuit design may be the same for multiple semiconductor dies extracted from the substrate). Figure 3 as well as Figures 6A to 6B As described above, each semiconductor die formed may include a circuit and a unique identifier for identifying the semiconductor die.

[0131] The semiconductor die may then be packaged using techniques known to those skilled in the art.

[0132] Printing a unique identifier on each semiconductor die prior to singulation allows the location of each die within the substrate to be recorded, thereby improving traceability and allowing better identification of semiconductor dies that may be susceptible to defects when a portion of the substrate is known to contain defects.

[0133] refer to Figure 8 , which shows a flow chart of an exemplary method 800 for accessing a record associated with a semiconductor die. The record may correspond to, for example, the record described with reference to methods 300 and 400, and may be a secure record.

[0134] At step 802, method 800 involves identifying a unique identifier printed on a semiconductor die. For example, as described with reference to method 300, the unique identifier can be read using an optical microscope or a device using infrared microscopy or X-ray tomography. The unique identifier can be read electronically by these devices.

[0135] At step 804, method 800 involves determining physical characteristics of the unique identifier. For example, a measuring instrument and / or a device for or identifying the unique identifier can be used to determine the physical characteristics of the unique identifier. The physical characteristics can include, but are not limited to, the location of the identifier on the die, the thickness of the identifier, and the size of the identifier.

[0136] At step 806 , method 800 involves providing the unique identifier identified at step 802 and the physical characteristics determined at step 804 to a database or platform storing the record.

[0137] At step 808, method 800 involves the database determining whether the record associated with the unique identifier includes the physical characteristic provided at step 806. For example, the record may include the physical characteristic, and a processor associated with the database may compare the physical characteristic provided at step 806 to known physical characteristics associated with the unique identifier. The physical characteristic of the unique identifier may be recorded when the record is created.

[0138] At step 810, if the record includes the physical characteristics provided at step 806, then method 800 involves providing access to the record. For example, if the comparison at step 808 indicates that the provided characteristics match the recorded characteristics, then access to the record may be provided. Method 800 may ensure that only individuals who physically possess the semiconductor die can access the records associated with the semiconductor die.

[0139] Although the teachings of the applicant described herein are combined with various embodiments for illustrative purposes, it is not intended that the teachings of the applicant are limited to these embodiments. On the contrary, without departing substantially from the embodiments described herein, the teachings of the applicant described and illustrated herein include various alternative embodiments, modified embodiments, and equivalent embodiments. For example, although the teachings described and illustrated herein may include certain elements / components and steps, as known to those skilled in the art, they may be modified. For example, the features selected in one or more exemplary embodiments described herein according to the teachings of this article may be combined to create alternative embodiments that are not explicitly described. All values and subranges within the disclosed range are also disclosed. The subject matter described herein is intended to encompass and include all appropriate changes in the technology.

Claims

1. A method for printing a unique identifier on a semiconductor die, the method comprising: receiving a substrate at a photolithography workstation, the substrate comprising a photosensitive layer and a region for forming a plurality of semiconductor grains; forming a plurality of circuits on the substrate using at least one mask, each circuit corresponding to a semiconductor die; printing a unique identifier on each semiconductor die of the substrate using at least one digital mask; and A substrate including a plurality of semiconductor dies, each semiconductor die including circuitry and a unique identifier, is removed from a lithography workstation.

2. The method according to claim 1, wherein The method further includes associating the unique identifier with a unique record for the semiconductor die.

3. The method according to claim 1, wherein At least one digital mask includes dynamically controlled pixels that are controllable into a unique pattern that defines a unique identifier.

4. The method according to claim 1, further comprising: One or more of a location and a size of the unique identifier is determined based on one or more of a location of the circuitry and a pattern of the circuitry for each semiconductor die.

5. The method according to claim 1, wherein Printing the unique identifier on each semiconductor die includes printing the unique identifier on a periphery of the semiconductor die.

6. The method according to claim 2, wherein: The record includes one or more of the following: the source of the substrate, the batch number of the semiconductor die, the batch number of the substrate, the batch of the semiconductor die, the batch of the substrate, the location of the semiconductor die on the substrate, the size of the die, one or more sizes of the unique identifier, the location of the unique identifier on the semiconductor die, the thickness of the unique identifier, the type of material of the unique identifier, and the manufacturing history of the semiconductor die.

7. The method according to claim 1, wherein Printing the unique identifier includes printing a unique QR code.

8. The method according to claim 7, wherein: The unique two-dimensional code is one of a data matrix code, a QR code, an Aztec code, a flash code and a semantic code.

9. The method according to claim 1, wherein Printing the unique identifier includes printing the unique identifier on a film that includes at least a portion of the circuit.

10. A system for printing a unique identifier on a semiconductor die, the system comprising: a processor operable to determine a unique identifier on the semiconductor die; a database, in communication with the processor, for storing records associated with the unique identifier; A lithography workstation in communication with the processor, wherein the lithography workstation is configured to: receiving a substrate comprising a photosensitive layer and an area for forming a plurality of semiconductor grains; forming a plurality of circuits on the substrate using at least one mask, each circuit corresponding to a semiconductor die; printing a unique identifier on each semiconductor die of the substrate using at least one digital mask; and A substrate including a plurality of semiconductor dies, each semiconductor die including circuitry and a unique identifier, is removed from a lithography workstation.

11. The system according to claim 10, wherein: At least one digital mask includes dynamically controlled pixels, wherein the processor is operable to control the pixels of the digital mask to define a unique pattern of unique identifiers.

12. The system according to claim 10, wherein: The processor is further operable to determine one or more of a location and a size of the unique identifier based on one or more of a location of the circuitry and a pattern of the circuitry for each semiconductor die.

13. The system according to claim 10, wherein: Printing the unique identifier on each semiconductor die includes printing the unique identifier on a periphery of the semiconductor die.

14. The system according to claim 10, wherein: The record includes one or more of the following: the source of the substrate, the batch number of the semiconductor die, the batch number of the substrate, the batch of the semiconductor die, the batch of the substrate, the location of the semiconductor die on the substrate, the size of the die, one or more sizes of the unique identifier, the location of the unique identifier on the semiconductor die, the thickness of the unique identifier, the type of material of the unique identifier, and the manufacturing history of the semiconductor die.

15. The system according to claim 10, wherein: Printing the unique identifier includes printing a unique QR code.

16. The system according to claim 15, wherein: The unique two-dimensional code is one of a data matrix code, a QR code, an Aztec code, a flash code and a semantic code.

17. The system according to claim 10, wherein: Printing the unique identifier includes printing the unique identifier on a film that includes at least a portion of the circuit.

18. A method for printing a unique identifier on a semiconductor die, the method comprising: receiving a substrate at a photolithography workstation, the substrate comprising a photosensitive layer and a region for forming a plurality of semiconductor grains; printing a pattern onto the substrate using at least one digital mask, the pattern defining a circuit for each semiconductor die and a unique identifier for each semiconductor die; as well as A substrate is removed from a lithography workstation, the substrate comprising a plurality of semiconductor dies, each semiconductor die comprising circuitry and a unique identifier.

19. The method according to claim 18, wherein At least one digital mask includes dynamically controlled pixels that are controllable into a unique pattern that defines a unique identifier.

20. The method according to claim 19, wherein The at least one digital mask further includes at least one region defining a static pattern of pixels.

21. The method of claim 18, further comprising: One or more of a location and a size of the unique identifier is determined based on one or more of a location of the circuitry and a pattern of the circuitry for each semiconductor die.

22. The method according to claim 18, wherein Printing a pattern including the circuit and the unique identifier includes printing the unique identifier on a periphery of the semiconductor die.

23. The method according to claim 18, wherein The record includes one or more of the following: the source of the substrate, the batch number of the semiconductor die, the batch number of the substrate, the batch of the semiconductor die, the batch of the substrate, the location of the semiconductor die on the substrate, the size of the die, one or more sizes of the unique identifier, the thickness of the unique identifier, the location of the unique identifier on the semiconductor die, the type of material of the unique identifier, and the manufacturing history of the semiconductor die.

24. The method according to claim 18, wherein The unique identifier is a unique QR code.

25. The method according to claim 24, wherein The unique two-dimensional code is one of a data matrix code, a QR code, an Aztec code, a flash code and a semantic code.

26. A system for printing a unique identifier on a semiconductor die, the system comprising: a processor operable to determine a unique identifier on the semiconductor die; a database, in communication with the processor, for storing records associated with the unique identifier; as well as A lithography workstation in communication with the processor, wherein the lithography workstation is configured to: receiving a substrate comprising a photosensitive layer and an area for forming a plurality of semiconductor grains; printing a pattern onto the substrate using a digital mask, the pattern defining a circuit for each semiconductor die and a unique identifier for each semiconductor die; as well as A substrate is removed from a lithography workstation, the substrate comprising a plurality of semiconductor dies, each semiconductor die comprising circuitry and a unique identifier.

27. The system of claim 26, wherein: At least one digital mask includes dynamically controlled pixels, wherein the processor is operable to control the pixels to define a unique pattern of unique identifiers.

28. The system of claim 27, wherein: The at least one digital mask further includes at least one region defining a static pattern of pixels.

29. The system of claim 26, wherein: The processor is further operable to determine one or more of a location and a size of the unique identifier based on one or more of a location of the circuitry and a pattern of the circuitry for each semiconductor die.

30. The system of claim 26, wherein: Printing a pattern defining the circuit and the unique identifier includes printing the unique identifier on a periphery of the semiconductor die.

31. The system of claim 26, wherein: The record includes one or more of the following: the source of the substrate, the batch number of the semiconductor die, the batch number of the substrate, the batch of the semiconductor die, the batch of the substrate, the location of the semiconductor die on the substrate, the size of the die, one or more sizes of the unique identifier, the thickness of the unique identifier, the location of the unique identifier on the semiconductor die, the type of material of the unique identifier, and the manufacturing history of the semiconductor die.

32. The system of claim 26, wherein: The unique identifier is a unique QR code.

33. The system of claim 32, wherein: The unique two-dimensional code is one of a data matrix code, a QR code, an Aztec code, a flash code and a semantic code.

34. A method for accessing a record associated with a semiconductor die, the method comprising: a unique identifier identifying the semiconductor die, the unique identifier being printed on the semiconductor die; determining at least one physical characteristic of the unique identifier; providing the unique identifier and the at least one physical characteristic to a database comprising records; determining, at a database, whether a record associated with the unique identifier includes the determined at least one physical characteristic; as well as In response to determining that the record associated with the unique identifier includes the determined at least one physical characteristic, access to the record is provided.

35. The method according to claim 34, wherein The at least one physical characteristic is one of: a location of the unique identifier on the semiconductor die, a thickness of the unique identifier, and a size of the unique identifier.

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