A non-contact ultra-precision polishing device based on liquid dynamic force driving

Abstract

The application belongs to the technical field of ultra-precision machining, and discloses a non-contact type ultra-precision polishing device based on liquid power driving, wherein a fixed table is installed on a machine tool, a to-be-machined element is installed at the bottom of the fixed table, and a polishing assembly comprises a support, a carrying table, a machining ball, a constant-temperature water tank and a water pump; the support is installed on the machine tool, the carrying table is installed on the support and below the fixed table, the carrying table is arranged in an inclined manner, a conical groove is formed at the top of the carrying table, the conical groove is used for placing the machining ball, the constant-temperature water tank is installed on the machine tool and stores polishing liquid in the constant-temperature water tank, the water pump is installed on the support and used for sucking the polishing liquid to the conical groove to lift the machining ball, the inclined arrangement of the carrying table realizes the rotation of the machining ball, and then drives the polishing liquid to polish the to-be-machined element; the liquid power is used to provide power for the machining ball, the stability of the liquid power is good during the machining process, mechanical transmission errors can be avoided, mechanical heat can be effectively eliminated, and thus the polishing effect on the optical element is optimized.

Description

Technical Field

[0001] This invention relates to the field of ultra-precision machining technology, and in particular to a non-contact ultra-precision polishing device based on hydrodynamic drive. Background Technology

[0002] Ultra-precision machining of optical components is a highly specialized process aimed at manufacturing optical components with extremely high surface quality and precision, such as lenses and mirrors. These optical components are widely used in various fields, from consumer electronics to scientific research equipment, including high-end manufacturing equipment such as lasers, telescopes, microscopes, and lithography machines. Ultra-precision machining of optical component surfaces includes roughing, grinding, polishing, and coating steps.

[0003] Traditional polishing methods typically involve a spindle driving a machining tool to rotate along a fixed axis. Under pressure, this process performs micro-cutting and smoothing on the surface of optical components, achieving sub-micron level surface roughness. However, traditional polishing methods have the following drawbacks: 1. Positioning errors of the spindle, roundness errors of the machining tool, coaxiality errors between the spindle and the machining tool, and radial runout of the spindle are difficult to completely eliminate, significantly impacting the polishing effect; 2. During prolonged operation, the mechanical heat from the spindle may cause the shaft to elongate and the machining tool to deform thermally, affecting the polishing effect. Summary of the Invention

[0004] The purpose of this invention is to provide a non-contact ultra-precision polishing device based on hydrodynamic drive, which can avoid mechanical transmission errors, effectively eliminate mechanical heat, and improve the polishing accuracy of optical components.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A non-contact ultra-precision polishing device based on hydrodynamic drive includes:

[0007] A support assembly, comprising a machine tool and a fixed table, wherein the fixed table is mounted on the machine tool and the element to be processed is mounted on the bottom of the fixed table;

[0008] A polishing assembly includes a support, a stage, a processing ball, a constant-temperature water tank, and a water pump. The support is mounted on the machine tool, and the stage is mounted on the support and located below the fixed platform. The stage is inclined, and a conical groove is formed on the top of the stage for placing the processing ball. The constant-temperature water tank is mounted on the machine tool and stores polishing fluid inside. The water pump is mounted on the support and positioned between the outlet of the constant-temperature water tank and the conical groove. The water pump is configured to draw the polishing fluid into the conical groove to lift and drive the processing ball to rotate. The processing ball drives the polishing fluid to polish the component to be processed.

[0009] Preferably, the processing ball includes a magnet and a sphere enclosing the magnet, a first coil is wound around the outer wall of the stage, and the processing ball rotates to generate a first symmetric current in the first coil.

[0010] Preferably, the processing ball includes a magnet and a sphere enclosing the magnet, the fixed platform includes a mounting plate and a second coil embedded in the mounting plate, the component to be processed is mounted on the mounting plate, and the processing ball rotates to cause the second coil to generate a second symmetric current.

[0011] Preferably, the non-contact ultra-precision polishing device based on hydraulic drive further includes a fine-tuning component, which includes an X-axis drive unit, a Y-axis drive unit, and a Z-axis drive unit. The X-axis drive unit and the Z-axis drive unit are both mounted on the machine tool. The X-axis drive unit is driven and connected to the bracket to drive the bracket to move along the X-axis. The Z-axis drive unit is driven and connected to the Y-axis drive unit to drive the Y-axis drive unit to move along the Z-axis. The Y-axis drive unit is driven and connected to the fixed stage to drive the fixed stage to move along the Y-axis.

[0012] Preferably, the fine-tuning component further includes a rotation drive component, which is mounted on the machine tool and drives the stage to rotate. The rotation axis of the rotation drive component is parallel to the Z-direction.

[0013] Preferably, the polishing assembly further includes a mounting platform, with the bracket and the rotation drive assembly both mounted on the top of the mounting platform. The X-axis drive unit is connected to the bottom of the mounting platform and is used to drive the mounting platform to move along the X-axis, thereby causing the bracket to move along the X-axis.

[0014] Preferably, the platform includes a base and a tray. The base is mounted on the top of the bracket, and a conical mounting groove is formed on the top of the base. The tray is conical and is mounted in the mounting groove. The conical groove is formed on the top of the tray. The base and the tray are inclined at the same angle. The first coil is wound around the outer wall of the base.

[0015] Preferably, a liquid storage tank is provided at the top of the bracket, the platform is installed at the bottom of the liquid storage tank, and the liquid storage tank is connected to the recovery port of the constant temperature water tank.

[0016] Preferably, a plurality of vibration isolation bases are installed at intervals on the bottom of the machine tool. Each vibration isolation base includes telescopic legs and rubber pads installed at the bottom of the telescopic legs. The top of the telescopic legs is connected to the bottom of the machine tool.

[0017] Preferably, the sphere includes a base, the magnet is embedded inside the base, the outer wall of the base is wrapped with a processing layer, the processing layer is made of polyurethane material, and the center of gravity of the magnet, the center of gravity of the base and the center of gravity of the processing layer coincide.

[0018] The beneficial effects of this invention are:

[0019] This invention provides a non-contact ultra-precision polishing device based on hydraulic power drive, including a support assembly and a polishing assembly. The support assembly includes a machine tool and a fixed stage. The fixed stage is mounted on the machine tool, and the component to be processed is mounted on the bottom of the fixed stage. The polishing assembly includes a bracket, a stage, a processing ball, a constant temperature water tank, and a water pump. The bracket is mounted on the machine tool, and the stage is mounted on the bracket and located below the fixed stage. The stage is tilted, and a conical groove is formed on the top of the stage for placing the processing ball. The constant temperature water tank is mounted on the machine tool and stores polishing fluid inside. The water pump is mounted on the bracket and positioned between the outlet of the constant temperature water tank and the conical groove. The water pump is configured to draw polishing fluid into the conical groove to support the processing ball. Due to the tilted stage, the processing ball rotates, thereby driving the polishing fluid to polish the component to be processed. By using hydraulic power to provide power to the processing ball, the hydraulic power has good stability during processing, avoiding mechanical transmission errors and effectively eliminating mechanical heat, thus optimizing the polishing effect on optical components. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a non-contact ultra-precision polishing device based on hydrodynamic drive provided in an embodiment of the present invention;

[0021] Figure 2 This is a partial structural schematic diagram of a non-contact ultra-precision polishing device based on hydrodynamic drive provided in an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the polishing assembly provided in an embodiment of the present invention. Figure 1 ;

[0023] Figure 4 This is a schematic diagram of the polishing assembly provided in an embodiment of the present invention. Figure 2 ;

[0024] Figure 5 This is an exploded view of the stage provided in an embodiment of the present invention;

[0025] Figure 6 This is a cross-sectional view of the processed ball provided in an embodiment of the present invention;

[0026] Figure 7 This is an installation diagram of the fixed platform provided in an embodiment of the present invention.

[0027] In the picture:

[0028] 10. Components to be processed;

[0029] 11. Machine tool; 111. Base plate; 112. Side plate; 12. Fixed platform; 121. Mounting plate; 13. Vibration isolation base;

[0030] 21. Bracket; 211. Support plate; 212. Fixing plate; 2121. Liquid storage tank; 22. Platform; 221. Base; 2211. Mounting groove; 222. Tray; 23. Processing ball; 231. Magnet; 232. Substrate; 233. Processing layer; 24. Constant temperature water tank; 25. Water pump; 26. Recovery hopper; 27. Mounting platform; 28. Adapter plate;

[0031] 31. First coil; 32. Second coil;

[0032] 41. X-axis drive unit; 42. Y-axis drive unit; 43. Z-axis drive unit; 44. Crossbeam; 45. Rotation drive assembly; 46. Swing assembly. Detailed Implementation

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0034] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0035] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0037] This embodiment provides a non-contact ultra-precision polishing device based on hydraulic power drive. The hydraulic power is used to provide power for the processing tool. During the processing, the hydraulic power has good stability and can avoid mechanical transmission errors. In addition, the hydraulic power drive can effectively eliminate mechanical heat, thereby improving the polishing accuracy of optical components and optimizing the polishing effect of optical components.

[0038] Please see Figures 1 to 7 This embodiment provides a non-contact ultra-precision polishing device based on hydrodynamic drive, which includes a support assembly and a polishing assembly. The component to be processed 10 is mounted on the support assembly, and the polishing assembly is mounted on the support assembly. The polishing assembly is used to perform ultra-precision polishing on the component to be processed 10.

[0039] Specifically, please refer to Figure 1 The support assembly includes a machine tool 11 and a fixed table 12. The fixed table 12 is mounted on the machine tool 11, and the component to be processed 10 is mounted on the bottom of the fixed table 12. For example, in this embodiment, the machine tool 11 includes a base plate 111 and a side plate 112 connected in an L-shape. The fixed table 12 is mounted on the side plate 112, and the polishing assembly is mounted on the base plate 111 so that the polishing assembly faces the component to be processed 10 mounted on the fixed table 12 and performs ultra-precision polishing on it.

[0040] Preferably, please continue reading. Figure 1 Several vibration isolation bases 13 are installed at intervals on the bottom of the machine tool 11. Each vibration isolation base 13 includes telescopic legs, the top of which is connected to the bottom of the machine tool 11. The length of the telescopic legs can be adjusted to adapt to different ground conditions. Telescopic legs are a common structure in the prior art, and their structure will not be described in detail here. Furthermore, rubber pads are installed at the bottom of the telescopic legs. The rubber pads are in direct contact with the ground and have good elastic deformation and energy absorption capabilities. When the machine tool 11 vibrates during operation, the rubber pads absorb vibration energy through their own deformation, preventing vibration transmission, thereby achieving the purpose of vibration reduction and noise reduction.

[0041] Further, please refer to Figure 1 , Figure 3 and Figure 4The polishing assembly includes a support 21, a stage 22, a processing ball 23, a constant temperature water tank 24, and a water pump 25. The bracket 21 is installed on the machine tool 11. In this embodiment, the bracket 21 is installed on the base plate 111 of the machine tool 11. The bracket 21 is used to support the stage 22. It should be noted that in this embodiment, the stage 22 is set at an angle. A conical groove is opened on the top of the stage 22. The processing ball 23 is placed in the conical groove. The stage 22 is set below the fixed platform 12 so that the processing ball 23 placed on it can smoothly approach the component 10 to be processed installed at the bottom of the fixed platform 12 and perform ultra-precision polishing on it. Furthermore, the constant temperature water tank 24 is installed on the machine tool 11 and stores polishing liquid inside. The water pump 25 is installed on the bracket 21 and is set between the outlet of the constant temperature water tank 24 and the conical groove. In this way, the polishing liquid in the constant temperature water tank 24 can be drawn into the conical groove through the outlet. The polishing liquid lifts the processing ball 23. The processing ball 23 rotates and drives the polishing liquid to polish the component 10 to be processed.

[0042] Specifically, through the above settings, the constant temperature water tank 24 stores polishing fluid at a certain temperature. By setting the constant temperature water tank 24, it is easy to control the temperature of the polishing fluid. The water pump 25 draws the polishing fluid from the outlet into the conical groove, so that a liquid film is generated between the wall of the conical groove and the processing ball 23 originally placed therein. This liquid film will suspend the processing ball 23. Furthermore, since the stage 22 itself is tilted, the conical groove has a certain tilt angle, resulting in a pressure difference between the liquid film between the processing ball 23 and the wall of the conical groove. The pressure difference drives the processing ball 23 to rotate. When the processing ball 23 is very close to the surface of the component 10 to be processed (less than 5μm), the polishing fluid attached to the surface of the processing ball 23 will be carried into the gap between the processing ball 23 and the component 10 to be processed, and a stable liquid film will be formed. Due to the rotation of the processing ball 23, the liquid film will generate hydrodynamic pressure. The hydrodynamic pressure causes the nanoparticles in the polishing fluid to move in a directional manner, thereby achieving ultra-precision polishing of the surface of the component 10 to be processed.

[0043] The bracket 21 provided in this embodiment includes an integrally formed support plate 211 and a fixing plate 212. Please refer to [link / reference]. Figure 3 and Figure 4 The bottom of the support plate 211 is connected to the base plate 111 of the machine tool 11. The fixing plate 212 is located on the top of the support plate 211, and a liquid storage tank 2121 is formed on the top of the fixing plate 212. The platform 22 is installed at the bottom of the liquid storage tank 2121. After the polishing liquid is drawn into the conical tank, it can be stored in the liquid storage tank 2121. Furthermore, the tank wall of the liquid storage tank 2121 is provided with an opening, and a recovery hopper 26 is installed in the opening. The recovery hopper 26 is connected to the recovery port of the constant temperature water tank 24. The polishing liquid in the liquid storage tank 2121 is guided to the recovery port of the constant temperature water tank 24 through the opening via the recovery hopper 26 to realize the circulation of the polishing liquid. Preferably, the water pump 25 is fixed to the support plate 211.

[0044] For example, please refer to Figure 3 and Figure 5 The platform 22 includes a base 221 and a tray 222. The base 221 is installed at the bottom of the liquid storage tank 2121. A conical mounting groove 2211 is opened on the top of the base 221. The tray 222 is conical and is installed in the mounting groove 2211. The base 221 and the tray 222 are inclined at the same angle. The conical groove is formed on the top of the tray 222.

[0045] Optionally, a through hole is formed on the outer wall of the base 221, connecting to the mounting groove 2211. A water inlet is provided at the bottom of the tray 222, connecting to a conical groove. A flexible hose is sealed and connected to the outlet of the constant temperature water tank 24. The hose passes through the fixing plate 212 of the bracket 21 and extends into the through hole, further sealing and connecting to the water inlet at the bottom of the tray 222. Preferably, a clamp is installed at the bottom of the liquid storage tank 2121 to fix the hose and prevent it from shifting.

[0046] Furthermore, the polishing assembly also includes a mounting platform 27, which is mounted on the base plate 111 of the machine tool 11. The constant temperature water tank 24 and the bracket 21 are both mounted on the mounting platform 27. Specifically, the bottom of the support plate 211 of the bracket 21 is mounted on the mounting platform 27. This configuration facilitates the modular production of the polishing assembly.

[0047] The non-contact ultra-precision polishing device based on hydraulic drive provided in this embodiment can also measure the rotational speed of the processing ball 23 so as to adjust the flow rate of the water pump 25 according to the processing requirements, thereby adjusting the rotational speed of the processing ball 23 to the expected value.

[0048] For example, please refer to Figure 1 , Figure 5 and Figure 6 The processing ball 23 includes a magnet 231 and a sphere enclosing the magnet 231. A first coil 31 is wound around the outer wall of the stage 22. Specifically, the first coil 31 is wound around the outer wall of the base 221. During the rotation of the processing ball 23, the first coil 31 cuts the magnetic field lines of the magnet 231 to generate a first interferometric current. The rotational speed of the processing ball 23 can be calculated by measuring the frequency of the interferometric current of the first coil 31. Furthermore, increasing the flow rate of the water pump 25 can increase the rotational speed of the processing ball 23, or decreasing the flow rate of the water pump 25 can decrease the rotational speed of the processing ball 23, so that the rotational speed of the processing ball 23 reaches the expected value. It should be noted that calculating the rotational speed of the processing ball 23 based on the frequency of the interferometric current of the first interferometric current is a conventional technology, and its principle will not be elaborated here.

[0049] To improve the stability and reliability of the machining of ball 23, please refer to [further details]. Figure 6The sphere provided in this embodiment includes a base 232, in which a magnet 231 is embedded inside the base 232, and a processing layer 233 is further wrapped around the outer wall of the base 232. The processing layer 233 has a uniform thickness, and the center of gravity of the magnet 231, the center of gravity of the base 232, and the center of gravity of the processing layer 233 are arranged to coincide. Preferably, the processing layer 233 is made of polyurethane material to give the processing layer 233 good wear resistance and heat insulation.

[0050] The non-contact ultra-precision polishing device based on hydrodynamic drive provided in this embodiment can also measure the distance between the processing ball 23 and the surface of the component 10 to be processed.

[0051] For example, please refer to Figure 7 The mounting platform 12 includes a mounting plate 121 and a second coil 32 embedded in the mounting plate 121. The mounting plate 121 is made of insulating material. Please refer to [link / reference needed]. Figure 1 The component to be processed 10 is mounted on the mounting plate 121. During the rotation of the processing ball 23, the second coil 32 cuts the magnetic field lines of the magnet 231 to generate a second symmetric current. By measuring the peak electromotive force of the second symmetric current, the distance between the surface of the processing ball 23 and the surface of the component to be processed 10 can be indirectly calculated. It should be noted that the method of indirectly calculating the distance between the surface of the processing ball 23 and the surface of the component to be processed 10 based on the peak electromotive force of the second symmetric current is a conventional technology, and its principle will not be elaborated here.

[0052] Furthermore, the magnet 231 is a cuboid with a uniform density distribution. During the processing, the magnetic pole direction of the magnet 231 is adjusted to be horizontal so that the first coil 31 and the second coil 32 can cut the magnetic field lines of the magnet 231 during the rotation of the processing ball 23.

[0053] The non-contact ultra-precision polishing device based on hydrodynamic drive provided in this embodiment also includes a fine-tuning component. The fine-tuning component is used to adjust the posture of the processing ball 23 and the distance between the processing ball 23 and the surface of the component 10 to be processed according to the processing requirements, so as to adapt the processing ball 23 to the curved surface processing of the component 10 to be processed.

[0054] For example, please refer to Figure 1 and Figure 2The fine-tuning components include an X-axis drive unit 41, a Y-axis drive unit 42, and a Z-axis drive unit 43. The X-axis drive unit 41 is mounted on the base plate 111 of the machine tool 11 and is connected to the mounting table 27. Activating the X-axis drive unit 41 drives the mounting table 27, causing the support 21 and its worktable 22 to move along the X-axis. The Z-axis drive unit 43 is mounted on the side plate 112 of the machine tool 11 and is connected to the Y-axis drive unit 42. Activating the Z-axis drive unit 43 drives the Y-axis drive unit 42 to move along the Z-axis. The Y-axis drive unit 42 is connected to the fixed table 12. Activating the Y-axis drive unit 42 drives the fixed table 12, causing the workpiece 10 on it to move along the Y-axis.

[0055] This embodiment, by setting up an X-axis drive unit 41, a Y-axis drive unit 42, and a Z-axis drive unit 43, can achieve adjustment of the distance between the processing ball 23 and the surface of the component 10 to be processed.

[0056] Preferably, the X-axis drive unit 41 includes an X-axis guide rail, an X-axis slider, and an X-axis drive component. The X-axis guide rail is mounted on the base plate 111 of the machine tool 11 along the X-axis. The X-axis slider is slidably mounted on the X-axis guide rail and connected to the bottom of the mounting table 27. The X-axis drive component is connected to the X-axis slider and is used to drive the X-axis slider to slide on the X-axis guide rail and synchronously drive the mounting table 27 and its bracket 21 and the worktable 22 to move along the X-axis.

[0057] Preferably, the Z-axis drive unit 43 includes a Z-axis guide rail, a Z-axis slider, and a Z-axis drive component. The Z-axis guide rail is mounted along the Z-axis on the side plate 112 of the machine tool 11. The Z-axis slider is slidably mounted on the Z-axis guide rail. The Z-axis drive component is driven and connected to the Z-axis slider to drive the Z-axis slider to slide on the Z-axis guide rail. In this embodiment, two Z-axis drive units 43 are installed at intervals on the side plate 112 of the machine tool 11. At the same time, a crossbeam 44 is provided to connect the two Z-axis sliders, and the Y-axis drive unit 42 is mounted on the crossbeam 44 to improve the driving stability of the Y-axis drive unit 42 and indirectly improve the machining precision.

[0058] Preferably, the Y-axis drive unit 42 includes a Y-axis guide rail, a Y-axis slider, and a Y-axis drive member. The Y-axis guide rail is mounted on the crossbeam 44 along the Y-axis, the Y-axis slider is slidably mounted on the Y-axis guide rail, and the Y-axis slider is connected to the fixed table 12. The Y-axis drive member is driven and connected to the Y-axis slider to drive the Y-axis slider to slide on the Y-axis guide rail and synchronously drive the fixed table 12 and the workpiece 10 on it to move along the Y-axis.

[0059] For example, in this embodiment, the platform 22 is rotatably mounted on the bottom of the liquid storage tank 2121; specifically, the base 221 is rotatably mounted on the bottom of the liquid storage tank 2121. For an adapted version, please refer to... Figure 3 and Figure 4The fine-tuning component also includes a rotation drive component 45, which drives the base 221 connected to the stage 22 to rotate the base 221 and the tray 222 around a rotation axis parallel to the Z direction, thereby adjusting the posture of the machining ball 23 to adapt to the surface machining of the component 10 to be machined.

[0060] Specifically, the rotation drive assembly 45 is mounted on the top of the mounting platform 27. The rotation drive assembly 45 includes a rotation drive component, a rotating shaft, and a turntable. The rotation drive component is mounted on the mounting platform 27. The output shaft of the rotation drive component is connected to one end of the rotating shaft, and the other end of the rotating shaft is connected to the bottom of the turntable. The top of the turntable is connected to the base 221. It should be noted that the axis of the output shaft of the rotation drive component and the axis of the rotating shaft are both parallel to the Z-direction. With the above settings, when the rotation drive component is started, the output shaft of the rotation drive component drives the rotating shaft, the turntable, and the base 221 to rotate. Due to the tilted setting of the stage 22 itself, the posture of the processing ball 23 placed on it changes during the rotation of the stage 22.

[0061] Please see Figure 3 and Figure 4 An adapter plate 28 is installed on the top of the mounting platform 27. The adapter plate 28 is located between the fixing plate 212 of the bracket 21 and the mounting platform 27. The rotation drive component is installed on the top of the adapter plate 28.

[0062] In other feasible embodiments, a swing assembly 46 can be provided on the top of the turntable to achieve fine adjustment of the position of the stage 22 on the horizontal plane. For example, the swing assembly 46 includes a swing guide rail, a swing slider, and a swing drive. The swing guide rail is horizontally mounted on the top of the turntable, the swing slider is slidably mounted on the swing guide rail, and the swing slider is connected to the base 221 of the stage 22. The swing drive is driven and connected to the swing slider to drive the swing slider to slide on the swing guide rail and synchronously drive the stage 22 to move.

[0063] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A non-contact ultra-precision polishing device based on hydrodynamic drive, characterized in that, include: A support assembly, comprising a machine tool (11) and a fixed table (12), wherein the fixed table (12) is mounted on the machine tool (11) and the component to be processed (10) is mounted on the bottom of the fixed table (12); The polishing assembly includes a bracket (21), a stage (22), a processing ball (23), a constant temperature water tank (24), and a water pump (25). The bracket (21) is mounted on the machine tool (11). The stage (22) is mounted on the bracket (21) and located below the fixed platform (12). The stage (22) is inclined and has a conical groove at its top. The conical groove is used to place the processing ball (23). The constant temperature water tank (24) is mounted on the machine tool (11) and stores polishing liquid inside. The water pump (25) is mounted on the bracket (21) and located between the outlet of the constant temperature water tank (24) and the conical groove. The water pump (25) is configured to draw the polishing liquid into the conical groove to lift and drive the processing ball (23) to rotate. The processing ball (23) drives the polishing liquid to polish the component (10) to be processed. The processing ball (23) includes a magnet (231) and a sphere enclosing the magnet (231). A first coil (31) is wound around the outer wall of the stage (22). The processing ball (23) rotates to generate a first symmetric current in the first coil (31). The fixed stage (12) includes a mounting plate (121) and a second coil (32) embedded in the mounting plate (121). The component to be processed (10) is mounted on the mounting plate (121). The processing ball (23) rotates to generate a second symmetric current in the second coil (32).

2. The non-contact ultra-precision polishing device based on hydrodynamic drive according to claim 1, characterized in that, The non-contact ultra-precision polishing device based on hydrodynamic drive also includes a fine-tuning component, which includes an X-axis drive unit (41), a Y-axis drive unit (42), and a Z-axis drive unit (43). The X-axis drive unit (41) and the Z-axis drive unit (43) are both mounted on the machine tool (11). The X-axis drive unit (41) drives and connects to the bracket (21) to drive the bracket (21) to move along the X-axis. The Z-axis drive unit (43) drives and connects to the Y-axis drive unit (42) to drive the Y-axis drive unit (42) to move along the Z-axis. The Y-axis drive unit (42) drives and connects to the fixed stage (12) to drive the fixed stage (12) to move along the Y-axis.

3. The non-contact ultra-precision polishing device based on hydrodynamic drive according to claim 2, characterized in that, The fine-tuning component also includes a rotation drive component (45), which is mounted on the machine tool (11) and drives the stage (22) to rotate. The rotation drive component (45) has a rotation axis parallel to the Z direction.

4. The non-contact ultra-precision polishing device based on hydrodynamic drive according to claim 3, characterized in that, The polishing assembly also includes a mounting platform (27), the bracket (21) and the rotation drive assembly (45) are both mounted on the top of the mounting platform (27), and the X-axis drive unit (41) drives the bottom of the mounting platform (27) to drive the mounting platform (27) to move along the X-axis, thereby driving the bracket (21) to move along the X-axis.

5. The non-contact ultra-precision polishing device based on hydrodynamic drive according to claim 1, characterized in that, The platform (22) includes a base (221) and a tray (222). The base (221) is mounted on the top of the bracket (21). A conical mounting groove (2211) is opened on the top of the base (221). The tray (222) is conical and is mounted in the mounting groove (2211). The conical groove is formed on the top of the tray (222). The base (221) and the tray (222) are inclined at the same angle. The first coil (31) is wound around the outer wall of the base (221).

6. A non-contact ultra-precision polishing device based on hydrodynamic drive according to any one of claims 1-4, characterized in that, A liquid storage tank (2121) is provided on the top of the bracket (21), the platform (22) is installed at the bottom of the liquid storage tank (2121), and the liquid storage tank (2121) is connected to the recovery port of the constant temperature water tank (24).

7. A non-contact ultra-precision polishing device based on hydrodynamic drive according to any one of claims 1-4, characterized in that, The bottom of the machine tool (11) is equipped with several vibration isolation bases (13) at intervals. The vibration isolation base (13) includes telescopic legs and rubber pads installed at the bottom of the telescopic legs. The top of the telescopic legs is connected to the bottom of the machine tool (11).

8. The non-contact ultra-precision polishing device based on hydrodynamic drive according to claim 1, characterized in that, The sphere includes a base (232), the magnet (231) is embedded inside the base (232), the outer wall of the base (232) is wrapped with a processing layer (233), the processing layer (233) is made of polyurethane material, and the center of gravity of the magnet (231), the center of gravity of the base (232) and the center of gravity of the processing layer (233) coincide.

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