Wet tool setting method based on dynamic current detection and wet tool setting process monitoring system

Abstract

The invention relates to the technical field of metal electro-deposition micro-additive manufacturing, and solves the technical problems that the deposition process is difficult to accurately observe by using an optical microscope in a micro-additive system, so that fine monitoring and regulation cannot be performed, and the manufacturing requirement of a high-precision three-dimensional micro-nano metal structure cannot be met. In particular to a wet method tool setting method based on dynamic current detection and a wet method tool setting process monitoring system. A current detection system is used in an electrolyte, so that the current change of an electro-deposition loop between a micro-anode and a cathode substrate can be accurately captured; and the distance between the micro-anode and the cathode substrate is adjusted through the motion control system. The method can be used for accurate tool setting of the electrode, the minimum tool setting gap can reach 0.5 micrometer, and the initial position of cathode surface micro-additive manufacturing can be determined. Meanwhile, the device can be used for monitoring the gap between the anode and deposited metal in the micro-additive manufacturing process in real time, and key data support is provided for accurate regulation and control of the micro-additive manufacturing process.

Description

Technical Field

[0001] The present invention relates to the technical field of metal electrodeposition micro-additive manufacturing, and in particular to a wet tool setting method based on dynamic current detection and a wet tool setting process monitoring system. Background Art

[0002] In recent years, with the surge in demand for metal micro-nanostructures with high dimensional precision and excellent surface quality in electronic components, metal micro-additive manufacturing technology, with its small size, multi-dimensionality, and high quality, has become a research hotspot in the additive manufacturing field. Electrodeposition technology achieves material formation and properties through the principle of metal ion reduction deposition on the cathode surface. In theory, simply by inducing the controlled accumulation of metal atoms generated by the reduction reaction, metal structures of arbitrary shapes and sizes can be constructed. Furthermore, by adjusting process conditions, the structure and properties of the deposited layer can be controlled, resulting in high-purity, high-density metal materials.

[0003] In recent years, many researchers have devoted themselves to the research of maskless electrodeposition 3D microfabrication technology and proposed innovative solutions that have successfully achieved the free accumulation of deposited metals in three-dimensional space, enabling the fabrication of complex metal micro- and nanostructures. FluidFM (fluid force microscopy) electrodeposition micro-additive manufacturing technology, based on the principles of atomic force microscopy (AFM), precisely monitors the manufacturing process, enables accurate control of the processing gap, and boasts a processing resolution of several microns. It is capable of fabricating complex 3D micro- and nanostructures, making it the most promising maskless electrodeposition 3D microfabrication technology. However, this technology suffers from complex monitoring systems and low processing rates, limiting its further industrial application.

[0004] LECD (localized electrochemical deposition) electrodeposition technology uses micro-anodes to continuously construct electrodeposition reaction microzones in a liquid environment, achieving localized electrodeposition and forming metal microstructures. This technology currently offers the highest processing rates. However, LECD lacks an effective process monitoring system to regulate the processing gap, resulting in low deposition localization. The gap between the anode and cathode often exceeds 50μm, the minimum size of the formed part exceeds 100μm, and the surface quality is poor. Summary of the Invention

[0005] In response to the shortcomings of the existing technology, the present invention provides a wet tool setting method based on dynamic current detection and a wet tool setting process monitoring system, which solves the technical problem that it is difficult to use an optical microscope to accurately observe the deposition process in the micro-additive system, resulting in the inability to perform fine monitoring and regulation, and the inability to meet the requirements of high-precision three-dimensional micro-nano metal structure manufacturing. The method aims to accurately monitor the electrode spacing during the electrodeposition micro-additive manufacturing process.

[0006] To solve the above technical problems, the present invention provides the following technical solution: a wet tool setting method based on dynamic current detection, the method comprising the following steps: S1. Install the cathode substrate into the electrodeposition micro-trough, and the motion control system moves the micro-anode so that it is located directly above the deposition area on the cathode substrate surface; S2, injecting the electrodeposition solution into the electrodeposition micro-groove so that the liquid level submerges the micro-anode; S3, starting the motion control system to control the micro-anode to approach the cathode substrate, while using an optical microscope to observe the movement position of the micro-anode; S4. Connect the positive and negative electrodes of the current detection system to the micro-anode and cathode substrate respectively, apply voltage between the anode and cathode, and slowly push the micro-anode toward the cathode substrate at a certain speed through the motion control system to observe the current change; When the current detection system detects a sudden change in current, the motion control system is stopped and the position is set to zero; S5. Rely on an optical microscope to record the position of the micro-anode and the current signal detected by the current detection system, establish the relationship between the gap between the cathode substrate and the micro-anode and the current signal, and set the current signal change threshold to control the micro-anode movement distance and final position during the tool setting process.

[0007] Furthermore, the voltage applied during the tool setting process is 0.5-1.5V, and the moving speed of the micro-anode is 1-5 μm / s.

[0008] Furthermore, the set current signal change threshold is a sudden change of the current value of 2 to 5%.

[0009] Furthermore, a method for monitoring the gap between the micro-anode and the deposited metal layer during the electrodeposition micro-additive manufacturing process based on dynamic current detection includes the following steps: Step 1: Slice the microstructure to be formed into slices with a thickness of 0.5 to 5 μm, and set the initial gap between the micro-anode and the cathode substrate to the slice thickness; Step 2: According to the wet tool setting method, move the micro anode to contact the cathode substrate. After the tool setting operation is completed, the micro anode retreats one slice thickness; Step 3: Measure the cathode metal ion reduction potential using an electrochemical test method, apply a voltage between the micro-anode and the cathode substrate, and begin to grow a metal layer on the cathode substrate surface to form the first slice, during which the gap between the anode and the deposited metal gradually decreases; Step 4: When the current detection system detects that the current value suddenly changes and reaches the current signal change threshold, the micro-anode moves to the next growth point, and the gap between the micro-anode and the cathode substrate is reset to one slice thickness, and the next slice is formed; Step 5: Under the control of the motion control system, the micro-anode forms each slice in turn until the overall formation of the microstructure is completed.

[0010] The technical solution also provides a wet tool setting process monitoring system for implementing the above method, comprising: a motion control system connected to the micro-anode to control the distance between the micro-anode and the cathode substrate and to observe the motion position of the micro-anode by using an optical microscope; An electrodeposition microtrough is filled with an electrodeposition solution, and a cathode substrate is provided at the bottom of the electrodeposition microtrough; a metal layer grown on the surface of the cathode substrate; A micro-anode, which is placed in the electrodeposition solution and located directly above the deposition area on the surface of the cathode substrate; The current detection system has positive and negative electrodes connected to the micro-anode and cathode substrate respectively, and is used to accurately capture the current changes in the electrodeposition circuit between the micro-anode and the cathode substrate.

[0011] Furthermore, the tip surface of the micro-anode has a microstructure or is arranged in a specific shape.

[0012] Furthermore, the microstructure is a hydrophilic microstructure for promoting the discharge of bubbles.

[0013] Furthermore, the specific shape includes but is not limited to a cone and a parabola.

[0014] By means of the above technical solution, the present invention provides a wet tool setting method based on dynamic current detection and a wet tool setting process monitoring system, which have at least the following beneficial effects: 1. This invention can not only be used for precise electrode tool setting, with a minimum tool clearance of 0.5μm, to help determine the starting position of micro-additive manufacturing on the cathode surface. It can also be used to monitor the gap between the anode and the deposited metal during the micro-additive manufacturing process in real time, providing key data support for precise control of the micro-additive manufacturing process.

[0015] 2. This invention can accurately determine the tool clearance between the microanode and cathode substrate, with the minimum gap adjustable to 0.5μm. By integrating the current detection system with the motion control system, the tool position can be adjusted in real time, thereby precisely controlling the anode-cathode gap during the additive manufacturing process. This significantly improves deposition accuracy and achieves remarkable processing results.

[0016] 3. This invention uses a dynamic current detection system to achieve wet tool setting and accurately determine the tool clearance between the microanode and the deposit. This allows for accurate determination of the deposit growth location and placement of the deposition site, significantly improving the precision of electrodeposition micro-additive machining. Furthermore, the synergy between the motion control system and the dynamic current detection system enables real-time monitoring of growth and free control of the microanode deposition position, enabling continuous metal deposition in three-dimensional space. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 Schematic diagram of the wet tool setting process monitoring system of the present invention; Figure 2 This is a rendering of the present invention's use of a wet tool setting process monitoring method to manufacture micro-additive materials; Figure 3 is a curve diagram showing the change of current I over time t based on dynamic current detection in the present invention; Figure 4 Schematic diagram of bubbles escaping upward along the micro-anode tip during the deposition process of the present invention; Figure 5 This is an example diagram of the invention using LECD technology to additively manufacture micropillars; Figure 6 This is an example diagram of the wet tool setting method used in the present invention for additive manufacturing of micropillars.

[0018] In the figure: 1. Motion control system; 2. Electrodeposition microgroove; 3. Metal layer; 4. Cathode substrate; 5. Electrodeposition solution; 6. Optical microscope; 7. Microanode; 8. Current detection system. DETAILED DESCRIPTION

[0019] To make the above-mentioned objectives, features, and advantages of the present invention more clearly understood, the present invention is further described below in detail with reference to the accompanying drawings and specific embodiments. This will enable a full understanding of how this application uses technical means to solve technical problems and achieve technical effects, and to implement the invention accordingly. Example 1

[0020] Please refer to Figure 1This embodiment proposes a wet tool setting process monitoring system based on dynamic current detection, including a motion control system 1 connected to a micro-anode 7, for controlling the distance between the micro-anode 7 and the cathode substrate 4, and observing the movement position of the micro-anode 7 by using an optical microscope 6; an electrodeposition liquid 5 is injected into an electrodeposition micro-groove 2, and a cathode substrate 4 is provided at the bottom of the electrodeposition micro-groove 2; a metal layer 3 is grown on the surface of the cathode substrate 4; the micro-anode 7 is placed in the electrodeposition liquid 5 and is located directly above the deposition area on the surface of the cathode substrate 4; the positive and negative poles of the current detection system 8 are respectively connected to the micro-anode 7 and the cathode substrate 4, for accurately capturing the current changes in the electrodeposition circuit between the micro-anode 7 and the cathode substrate 4.

[0021] The tip surface of the micro-anode has a microstructure or a specific shape, including but not limited to a cone, a parabola, etc. At the same time, the tip surface of the micro-anode also has a hydrophilic microstructure to promote the discharge of bubbles. Figure 4 As shown, the present invention promotes the discharge of bubbles and enhances the deposition stability by having a hydrophilic microstructure or a special shape on the surface of the micro-anode tip.

[0022] This invention uses a dynamic current detection system to achieve wet tool setting and accurately determine the tool clearance between the microanode and the deposit. This allows for accurate determination of the deposit growth location and placement of the deposition site, significantly improving the precision of electrodeposition micro-additive machining. Furthermore, the synergistic effect of the motion control system and the dynamic current detection system allows for real-time monitoring of growth and free control of the microanode deposition position, enabling continuous metal deposition in three-dimensional space. Example 2

[0023] Please refer to Figure 1-Figure 4 This embodiment proposes a wet tool setting method based on dynamic current detection. This method combines current detection with motion control and is applied to the manufacture of LECD metal micro-nanostructures. It has the characteristics of simple structure and convenient operation, and can dynamically detect the position of the metal layer and accurately control the tool setting gap. The method includes the following steps: S1. Install the cathode substrate 4 into the electrodeposition micro-groove 2. The motion control system 1 moves the micro-anode 7 so that it is located directly above the deposition area on the surface of the cathode substrate 4.

[0024] S2. Inject the electrodeposition liquid 5 into the electrodeposition micro-groove 2 so that the liquid level submerges the micro-anode 7.

[0025] S3 , starting the motion control system 1 to control the micro-anode 7 to approach the cathode substrate 4 , while using the optical microscope 6 to observe the moving position of the micro-anode 7 .

[0026] S4. Connect the positive and negative electrodes of current detection system 8 to micro-anode 7 and cathode substrate 4, respectively. Apply voltage between the anode and cathode. Use motion control system 1 to slowly move micro-anode 7 toward cathode substrate 4 at a constant speed, and observe current changes. When current detection system 8 detects a sudden change in current, motion control system 1 is stopped and the position is set to zero. The voltage applied during the tool setting process is 0.5 to 1.5 V, and the movement speed of micro-anode 7 is 1 to 5 μm / s.

[0027] If the voltage is set too low, the current signal will be weak, increasing the difficulty of monitoring. If it is too high, it will trigger the oxygen evolution reaction of the micro-anode, generating excessive bubbles, which will affect the stability of the current signal. If the micro-anode speed is too low, the tool setting process and the anode movement process during the processing will take too long, resulting in a low proportion of effective processing time and low manufacturing efficiency. If the speed is set too high, the system may not respond in time, resulting in the micro-anode "colliding with the tool".

[0028] S5. Rely on the optical microscope 6 to record the position of the micro-anode 7 and the current signal detected by the current detection system 8, establish the relationship between the gap between the cathode substrate 4 and the micro-anode 7 and the current signal, and set the current signal change threshold to control the movement distance and final position of the micro-anode 7 during the tool setting process. The set current signal change threshold is a sudden change of the current value of 2 to 5%. If the threshold is less than 2%, the system's anti-interference ability is weak, and small fluctuations in the current may cause malfunctions; if the threshold is greater than 5%, the system response time is long, and the micro-anode is prone to "colliding with the tool".

[0029] The present invention can accurately determine the tool clearance between the microanode and cathode substrate, with the minimum gap adjustable to 0.5μm. By integrating the current detection system with the motion control system, the tool position can be adjusted in real time, thereby precisely controlling the anode-cathode gap during the additive manufacturing process. This significantly improves deposition accuracy and achieves remarkable processing results. Example 3

[0030] Please refer to Figure 1-Figure 4 This embodiment uses a method for monitoring the gap between the micro-anode and the deposited metal layer during electrodeposition micro-additive manufacturing based on dynamic current detection. This method can accurately determine the tool clearance between the micro-anode and the deposit, thereby accurately determining the growth position of the deposit and setting the deposition site, significantly improving the accuracy of electrodeposition micro-additive manufacturing. The method includes the following steps: Step 1: Slice the microstructure to be formed, with a slice thickness of 0.5 to 5 μm, and set the initial gap between the micro-anode 7 and the cathode substrate 4 to the slice thickness.

[0031] Step 2: According to the wet tool setting method, the micro-anode 7 is moved to contact the cathode substrate 4. After the tool setting operation is completed, the micro-anode 7 is retracted by a slice thickness (0.5-5 μm).

[0032] Step 3: Measure the cathode metal ion reduction potential by electrochemical testing method, apply voltage between micro anode 7 and cathode substrate 4, start growing metal layer 3 on the surface of cathode substrate 4 and form the first slice, during which the gap between the anode and the deposited metal gradually decreases.

[0033] Step 4: When the current detection system 8 detects that the current value suddenly changes and reaches the current signal change threshold, the micro-anode 7 moves to the next growth point, and resets the gap between the micro-anode 7 and the cathode substrate 4 to a slice thickness, and starts to form the next slice.

[0034] Step 5: Under the control of the motion control system 1, the micro-anode 7 forms each slice in turn until the overall formation of the microstructure is completed. The present invention can accurately determine the gap between the metal layer grown on the micro-anode and the cathode substrate, so as to accurately set the tool gap during the deposition process. The tool setting effect and process monitoring effect are as follows: Figure 2 and Figure 3 shown.

[0035] The present invention aims to accurately determine the gap between the micro-anode and the metal layer growing on the cathode substrate through dynamic current detection technology, thereby accurately setting the tool clearance during the deposition process, with the minimum adjustable value being 0.5μm. This method can significantly improve the deposition accuracy during the electrodeposition process.

[0036] The present invention uses a copper sulfate solution (220g / L CuSO4, 70g / L H2SO4) as the electrodeposition solution, the diameter of the platinum wire in the micro-anode needle tip is 25μm, and the initial gap between the micro-anode and the cathode substrate is 5μm. Before using the tool setting method of the present invention, the deposition gap exceeds 50μm, the minimum size of the deposition exceeds 100μm, and the surface quality and deposition localization of the structure are poor. Figure 5 After adopting the method of the present invention, the deposition gap is set to 5μm, the minimum size of the deposition is about 15μm, and the microstructure surface is smooth, as shown in FIG. Figure 6 Experiments have shown that the present invention can effectively set a precise machining gap, improve the surface quality and forming accuracy of the electrodeposited product, and provide an effective means for promoting electrodeposition micro-additive manufacturing technology.

[0037] Each embodiment in this specification is described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Reference can be made to the same or similar parts between the embodiments. For the above embodiments, since they are basically similar to the method embodiments, the description is relatively simple. For relevant parts, refer to the partial description of the method embodiments.

[0038] The above embodiments provide a detailed introduction to the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core ideas. At the same time, for those skilled in the art, according to the ideas of the present invention, there may be changes in the specific implementation methods and application scopes. In summary, the contents of this specification should not be understood as limiting the present invention.

Claims

1. A wet tool setting method based on dynamic current detection, characterized in that: The method comprises the following steps: S1. Install the cathode substrate into the electrodeposition micro-trough, and the motion control system moves the micro-anode so that it is located directly above the deposition area on the cathode substrate surface; S2, injecting the electrodeposition solution into the electrodeposition micro-groove so that the liquid level submerges the micro-anode; S3, starting the motion control system to control the micro-anode to approach the cathode substrate, while using an optical microscope to observe the movement position of the micro-anode; S4. Connect the positive and negative electrodes of the current detection system to the micro-anode and cathode substrate respectively, apply voltage between the anode and cathode, and slowly push the micro-anode toward the cathode substrate at a certain speed through the motion control system to observe the current change; When the current detection system detects a sudden change in current, the motion control system is stopped and the position is set to zero; S5. Rely on an optical microscope to record the position of the micro-anode and the current signal detected by the current detection system, establish the relationship between the gap between the cathode substrate and the micro-anode and the current signal, and set the current signal change threshold to control the micro-anode movement distance and final position during the tool setting process.

2. The wet tool setting method according to claim 1, characterized in that: The voltage applied during the tool setting process is 0.5-1.5V, and the moving speed of the micro anode is 1-5 μm / s.

3. The wet tool setting method according to claim 1, characterized in that: The set current signal change threshold is a current value mutation of 2 to 5%.

4. The wet tool setting method according to claim 3, characterized in that: The invention also includes a method for monitoring the gap between a micro-anode and a deposited metal layer in an electrodeposition micro-additive manufacturing process based on dynamic current detection, comprising the following steps: Step 1: Slice the microstructure to be formed into slices with a thickness of 0.5 to 5 μm, and set the initial gap between the micro-anode and the cathode substrate to the slice thickness; Step 2: According to the wet tool setting method, move the micro anode to contact the cathode substrate. After the tool setting operation is completed, the micro anode retreats one slice thickness; Step 3: Measure the cathode metal ion reduction potential using an electrochemical test method, apply a voltage between the micro-anode and the cathode substrate, and begin to grow a metal layer on the cathode substrate surface to form the first slice, during which the gap between the anode and the deposited metal gradually decreases; Step 4: When the current detection system detects that the current value suddenly changes and reaches the current signal change threshold, the micro-anode moves to the next growth point, and the gap between the micro-anode and the cathode substrate is reset to one slice thickness, and the next slice is formed; Step 5: Under the control of the motion control system, the micro-anode forms each slice in turn until the overall formation of the microstructure is completed.

5. A wet tool setting process monitoring system for implementing the method according to any one of claims 1 to 4, characterized in that: include: a motion control system (1) connected to the micro-anode (7) for controlling the distance between the micro-anode (7) and the cathode substrate (4) and observing the motion position of the micro-anode (7) by using an optical microscope (6); An electrodeposition microtrough (2) into which an electrodeposition liquid (5) is injected, and a cathode substrate (4) is provided at the bottom of the electrodeposition microtrough (2); A metal layer (3) grown on the surface of a cathode substrate (4); A micro anode (7) is placed in the electrodeposition solution (5) and is located directly above the deposition area on the surface of the cathode substrate (4); The current detection system (8), whose positive and negative electrodes are connected to the micro-anode (7) and the cathode substrate (4) respectively, is used to accurately capture the current changes in the electrodeposition circuit between the micro-anode (7) and the cathode substrate (4).

6. The wet tool setting process monitoring system according to claim 5, characterized in that: The tip surface of the micro anode (7) has a microstructure or presents a specific shape.

7. The wet tool setting method according to claim 6, characterized in that: The microstructure is a hydrophilic microstructure for promoting the discharge of bubbles.

8. The wet tool setting method according to claim 6, characterized in that: The specific shape includes but is not limited to a cone and a parabola.

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