A quick automatic temperature matching system and method for silk screen baking process

Abstract

The application relates to the field of PCB processing technology, and discloses a quick automatic temperature matching system and method for a silk-screen baking process, which comprises a multi-dimensional monitoring module and an intelligent adjusting module. The system obtains the plate material data, silk-screen data and baking data of all batches of PCBs through the multi-dimensional monitoring module, and classifies and forms data sets, the intelligent adjusting module analyzes the production quality of each batch of PCBs, generates a monitoring data group, ensures the consistency of the materials, analyzes the silk-screen effect of each batch of PCBs, generates a silk-screen index, avoids defective products from flowing into subsequent processes, is more timely in real-time monitoring and response, the intelligent adjusting module analyzes the baking state of each batch of PCBs, generates a baking data group, accurately identifies curing defects or uneven heating problems, evaluates the uniformity, silk-screen processing quality and baking state of each batch of PCBs, generates an early warning signal and a control instruction, automatically adjusts the baking parameters, ensures the best curing efficiency, reduces energy consumption cost, and multi-dimensionally evaluates product quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB processing, in particular to a quick automatic temperature matching system and method for silk screen baking process. BACKGROUND

[0002] PCB, which stands for Printed Circuit Board, is an indispensable basic component in electronic devices, mainly composed of an insulating base plate, connecting wires, and solder pads for assembling electronic components. Through precise design and manufacturing processes, PCB realizes the electrical connection between components in the circuit and provides mechanical support. In addition, in order to meet specific application requirements, silk screen baking processing may also be needed on the PCB. Before silk screen printing, a series of preparations need to be done, including cleaning the PCB, checking the silk screen, mixing the ink, fixing the installation, and printing the ink, etc. After completing the ink printing, the PCB needs to be baked to ensure the adhesion of the ink. First, the silk screen printed PCB is placed in the baking equipment for preheating, gradually warming up the PCB to reduce thermal stress caused by sudden temperature changes, preventing the PCB from deforming or being damaged. After preheating, the temperature of the baking equipment is raised to the set baking temperature, which needs to be determined according to the curing requirements of the ink and the heat resistance of the PCB, to ensure that the solvent in the ink is completely volatilized and the ink is fully cured, forming a firm and durable mark. After baking, the PCB is naturally cooled to room temperature in the baking equipment to avoid rapid temperature changes that may cause the PCB to deform or be damaged due to thermal stress. During the entire silk screen baking process, the process parameters and operation specifications of each link must be strictly controlled to ensure that the quality of the final product meets the requirements.

[0003] Currently, the temperature matching system of the traditional silk screen baking process lacks automatic control and monitoring means, making it difficult to realize real-time monitoring and dynamic adjustment of the baking process. In actual operation, due to factors such as structural limitations of the baking equipment or uneven heat conduction, cold spots may form on the surface of the PCB, where the temperature is lower than that of the surrounding area. The ink in these cold spots may not be fully cured, leading to the phenomenon of board explosion, ultimately resulting in decreased product adhesion and reliability. SUMMARY

[0004] In view of the shortcomings of the prior art, the present application provides a quick automatic temperature matching system and method for silk screen baking process, which has the advantages of real-time monitoring response, multi-dimensional evaluation of product quality, etc. The problem of decreased product adhesion due to the lack of automatic control means in the temperature matching system of the traditional silk screen baking process is solved.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a quick automatic temperature matching system for silk screen baking process, comprising a multi-dimensional monitoring module and an intelligent adjustment module.

[0006] The multi-dimensional monitoring module is composed of a board management unit, a silk screen printing monitoring unit and a baking monitoring unit, the board data unit collects board data sets through a network connection detection device, the silk screen printing monitoring unit collects silk screen printing data sets through a network connection detection device, and the baking monitoring unit collects baking data sets through a network connection sensing device and a detection device;

[0007] The intelligent adjustment module is composed of a board evaluation unit, a silk screen printing evaluation unit, a baking evaluation unit and a dynamic management unit, the board evaluation unit analyzes the production quality of each batch of PCB boards according to the board data set and generates a corresponding monitoring data set Jcsj, the silk screen printing evaluation unit analyzes the silk screen printing effect of each batch of PCB boards according to the silk screen printing data set and generates a corresponding silk screen printing index Syz, the baking evaluation unit analyzes the baking state of each batch of PCB boards according to the baking data set and generates a corresponding baking data set Hksj, and the dynamic management unit is provided with a fixed numerical thickness threshold HDY, a moisture threshold SFY, a transition threshold ZBY, a silk screen printing threshold SYY, a curing threshold GHY, a warm curing threshold WGY, an air volume threshold WLY and a humidity threshold SDY, and in combination with the monitoring data set Jcsj, the silk screen printing index Syz and the baking data set Hksj, the uniformity, the silk screen printing processing quality and the baking state of each batch of PCB boards are evaluated to generate a corresponding early warning signal and a control instruction.

[0008] Preferably, the board data set includes the number of PCB boards, the thickness of PCB boards, the moisture content of PCB boards and the glass transition temperature of PCB boards of each batch.

[0009] Preferably, the silk screen printing data set includes the silk screen tension, the squeegee flatness error, the ink viscosity and the ink transparency of each batch.

[0010] Preferably, the baking data set includes the processing temperature, the processing air volume, the processing humidity and the ink double bond conversion rate.

[0011] Preferably, the monitoring data set Jcsj calculation process is as follows:

[0012] According to the board data set, the board data of the i th batch is extracted, the number of PCB boards of the i th batch is marked as N, the thickness of each PCB board in the i th batch is marked as {h1, h2, h3,..., hN}, the moisture content of each PCB board in the i th batch is marked as {s1, s2, s3,..., sN}, and the glass transition temperature of each PCB board in the i th batch is marked as {z1, z2, z3,..., zN};

[0013]

[0014] In the formula, an average value of thickness of PCBs in the i-th batch, an average value of moisture content of PCBs in the i-th batch, an average value of glass transition temperature of PCBs in the i-th batch, hx represents thickness of the x-th PCB in the i-th batch, x ∈ N, sx represents moisture content of the x-th PCB in the i-th batch, zx represents glass transition temperature of the x-th PCB in the i-th batch, a standard deviation of thickness of PCBs in the i-th batch, a standard deviation of moisture content of PCBs in the i-th batch, a standard deviation of glass transition temperature of PCBs in the i-th batch, Jcsj i a monitoring data set of PCBs in the i-th batch.

[0015] Preferably, the screen printing index Syz is calculated as follows:

[0016] According to the screen printing data set, screen printing data of PCBs in the i-th batch is extracted, and screen tension of the i-th batch is marked as wz i , and squeegee flatness error of the i-th batch is marked as dp i , and ink viscosity of the i-th batch is marked as mn i , and ink transparency of the i-th batch is marked as mt i ;

[0017]

[0018] In the formula, BWZ represents a standard value for measuring screen tension, α1 represents a weight for the ratio of screen tension to the standard value, BDP represents a standard value for measuring squeegee flatness error, α2 represents a weight for the ratio of the standard value to squeegee flatness error, BMN represents a standard value for measuring ink viscosity, α3 represents a weight for the ratio of the standard value to ink viscosity, BMT represents a standard value for measuring ink transparency, α4 represents a weight for the ratio of ink transparency to the standard value, α1, α2, α3 and α4 are all constants, and α1+α2+α3+α4=1, Syz represents a screen printing index of the i-th batch calculated according to the weights of α1, α2, α3 and α4 i .

[0019] Preferably, the baking data set Hksj is calculated as follows:

[0020] According to the baking data set, the baking data of the i th batch of PCB boards is extracted, and the ink double bond conversion rate of each PCB board in the i th batch is marked as {g1, g2, g3,..., gN}, the processing temperature of the i th batch is marked as wd i The processing air volume of the i th batch is marked as fl i The processing humidity of the i th batch is marked as sd i

[0021]

[0022]

[0023] In the formula, The average value of the ink double bond conversion rate of the i th batch of PCB boards is represented by ge, and the ink double bond conversion rate of the e th PCB board in the i th batch is represented by ge The standard deviation of the ink double bond conversion rate of the i th batch of PCB boards is represented by ge The ratio of the average value of the ink double bond conversion rate to the processing temperature is represented by Hksj The ratio of the average value of the ink double bond conversion rate to the processing air volume is represented by Hksj The ratio of the average value of the ink double bond conversion rate to the processing humidity is represented by Hksj i The baking data set of the i th batch of PCB boards is represented by Hksj

[0024] Preferably, when the standard deviation of the thickness of the single batch of PCB boards in the monitoring data set Jcsj exceeds the thickness threshold HDY, it indicates that the thickness difference between the single batch of PCB boards is large, and a board abnormal signal is generated, if the standard deviation of the moisture content of the single batch of PCB boards exceeds the moisture threshold SFY, it indicates that the moisture content difference between the single batch of PCB boards is large, and a board abnormal signal is generated, if the standard deviation of the glass transition temperature of the single batch of PCB boards exceeds the transition threshold ZBY, it indicates that the glass transition temperature difference between the single batch of PCB boards is large, and a board abnormal signal is generated, the processing should be stopped immediately, and the PCB boards should be optimized, and when the silk printing index Syz is lower than the silk printing threshold SYY, it indicates that the silk printing quality of the single batch of PCB boards is poor, and a silk printing abnormal signal is generated, the silk printing should be stopped immediately, and the PCB boards should be reprocessed.

[0025] ​Preferably, when the standard deviation of the ink double bond conversion rate of the single batch of PCB exceeds the curing threshold GHY in the baking data set Hksj, it indicates that there is a problem of uneven heating between the single batch of PCB, and the baking should be stopped immediately and the PCB should be restacked, if the ratio of the average value of the ink double bond conversion rate and the processing temperature exceeds the temperature curing threshold WGY, it indicates that there is a problem of insufficient thermal curing reaction in the single batch of PCB, a thermal curing abnormal signal is generated, and the temperature curve should be optimized in time, if the ratio of the average value of the ink double bond conversion rate and the processing air volume exceeds the air volume threshold WLY, it indicates that there is a problem of poor curing in the single batch of PCB, an air volume abnormal signal is generated, and the processing air volume should be adjusted in time, if the ratio of the average value of the ink double bond conversion rate and the processing humidity exceeds the humidity threshold SDY, it indicates that there is a problem of poor curing in the single batch of PCB, a humidity abnormal signal is generated, and the processing humidity should be adjusted in time.

[0026] A quick automatic temperature matching method for screen printing baking process, comprising the following steps:

[0027] Step one: through network connection detection device and sensing device, obtain the board data, screen printing data and baking data of all batches of PCB, and classify to form board data set, screen printing data set and baking data set;

[0028] Step two: according to the board data set, analyze the production quality of each batch of PCB, and generate corresponding monitoring data set Jcsj;

[0029] Step three: according to the screen printing data set, analyze the screen printing effect of each batch of PCB, and generate corresponding screen printing index Syz;

[0030] Step four: according to the baking data set, analyze the baking state of each batch of PCB, and generate corresponding baking data set Hksj;

[0031] Step five: set the fixed numerical value of thickness threshold HDY, moisture threshold SFY, conversion threshold ZBY, screen printing threshold SYY, curing threshold GHY, temperature curing threshold WGY, air volume threshold WLY and humidity threshold SDY, and combine the monitoring data set Jcsj, screen printing index Syz and baking data set Hksj to evaluate the uniformity, screen printing processing quality and baking state of each batch of PCB, and generate corresponding warning signal and control instruction.

[0032] Compared with the prior art, the present application provides a quick automatic temperature matching system and method for screen printing baking process, which has the following beneficial effects:

[0033] 1、The present application obtains the board material data, silk printing data and baking data of all batches of PCB boards through the network connection detection device and sensing device of multi-dimensional monitoring module, and classifies and constitutes the board material data set, silk printing data set and baking data set, the intelligent adjustment module analyzes the production quality of each batch of PCB boards according to the board material data set, and generates the corresponding monitoring data group Jcsj, ensures the consistency of each batch of materials, the intelligent adjustment module analyzes the silk printing effect of each batch of PCB boards according to the silk printing data set, and generates the corresponding silk printing index Syz, quantifies the silk printing effect, avoids the defective products to flow into the subsequent process, and the real-time monitoring response is more timely.

[0034] 2、The present application analyzes the baking state of each batch of PCB boards according to the baking data set through the intelligent adjustment module, and generates the corresponding baking data group Hksj, accurately identifies the curing defect or uneven heating problem, improves the reliability of finished products, the intelligent adjustment module is provided with fixed numerical thickness threshold HDY, moisture threshold SFY, transition threshold ZBY, silk printing threshold SYY, curing threshold GHY, temperature curing threshold WGY, air volume threshold WLY and humidity threshold SDY, and in combination with the monitoring data group Jcsj, the silk printing index Syz and the baking data group Hksj, the uniformity, silk printing processing quality and baking state of each batch of PCB boards are evaluated, the corresponding early warning signal and control instruction are generated, in the actual production process, the threshold configuration of all indexes can be flexibly adjusted, to adapt to the multi-variety and small-batch production scene, realize automatic adjustment of baking parameters, ensure the best curing efficiency, reduce energy consumption cost, and multi-dimensionally evaluate the product quality. BRIEF DESCRIPTION OF DRAWINGS

[0035] Fig. 1 The system flowchart of the present application is shown in the figure.

[0036] Fig. 2 The method step diagram of the present application is shown in the figure. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0038] Due to the temperature matching system of the traditional silk screen baking process is difficult to realize real-time monitoring and dynamic adjustment of the baking process due to the lack of automatic control and monitoring means, in actual operation, due to the structure limitation of baking equipment or uneven heat conduction, etc., the PCB board surface is easy to form a cold spot area with lower temperature than the surrounding area, the ink in these cold spot areas may cause board explosion due to insufficient curing, eventually leading to product adhesion and reliability reduction, therefore, a silk screen baking process fast automatic temperature matching system and method is provided, please refer to Figs. 1-2 A silk screen baking process fast automatic temperature matching system, comprising a multi-dimensional monitoring module and an intelligent adjustment module;

[0039] The multi-dimensional monitoring module is composed of a board management unit, a silk screen monitoring unit and a baking monitoring unit, the board data unit acquires board data set through network connection detection device, the board data set includes the number of PCB boards, PCB board thickness, PCB board moisture content and PCB board glass transition temperature of each batch;

[0040] Specifically, the moisture content of the PCB board directly reflects the drying degree of the board, when the moisture content is too high, it will directly affect the ink adhesion, thereby causing poor silk screen effect, the higher the glass transition temperature of the PCB board, the better the heat resistance and moisture resistance of the material, and it is not easy to absorb moisture and deform in high temperature and high humidity environment;

[0041] The silk screen monitoring unit acquires silk screen data set through network connection detection device, the silk screen data set includes silk screen tension, squeegee flatness error, ink viscosity and ink transparency of each batch;

[0042] Specifically, selecting appropriate tension silk screen, squeegee and low viscosity, high transparency silk screen ink can ensure that the ink can be well attached and spread on the surface of the PCB board to avoid latent image problem;

[0043] The baking monitoring unit acquires baking data set through network connection sensing device and detection device, the baking data set includes processing temperature, processing air volume, processing humidity and ink double bond conversion rate;

[0044] Specifically, the ink double bond conversion rate is a key indicator to measure the curing degree, when the double bond conversion rate reaches the maximum value and tends to be stable, it means that the ink has reached the highest curing degree;

[0045] The intelligent adjustment module is composed of a board evaluation unit, a silk screen evaluation unit, a baking evaluation unit and a dynamic management unit, the board evaluation unit analyzes the production quality of each batch of PCB boards according to the board data set, and generates corresponding monitoring data group Jcsj, the calculation process is as follows:

[0046] According to the plate data set, the plate data of the i th batch is extracted, and the number of PCB boards in the i th batch is marked as N, the thickness of each PCB board in the i th batch is marked as {h1, h2, h3, …, hN}, the moisture content of each PCB board in the i th batch is marked as {s1, s2, s3, …, sN}, and the glass transition temperature of each PCB board in the i th batch is marked as {z1, z2, z3, …, zN};

[0047]

[0048] In the formula, represents the average value of the thickness of the i th batch of PCB boards, represents the average value of the moisture content of the i th batch of PCB boards, represents the average value of the glass transition temperature of the i th batch of PCB boards, hx represents the thickness of the x th PCB board in the i th batch, x∈N, sx represents the moisture content of the x th PCB board in the i th batch, and zx represents the glass transition temperature of the x th PCB board in the i th batch, represents the standard deviation of the thickness of the i th batch of PCB boards, represents the standard deviation of the moisture content of the i th batch of PCB boards, represents the standard deviation of the glass transition temperature of the i th batch of PCB boards, Jcsj i represents the monitoring data set of the i th batch of PCB boards, ensuring the consistency of each batch of materials;

[0049] The silk screen evaluation unit analyzes the silk screen effect of each batch of PCB boards according to the silk screen data set, and generates the corresponding silk screen index Syz, and the calculation process is as follows:

[0050] According to the silk screen data set, the silk screen data of the i th batch of PCB boards is extracted, and the silk screen tension of the i th batch is marked as wz i , the doctor flatness error of the i th batch is marked as dp i , the ink viscosity of the i th batch is marked as mn i , the ink transparency of the i th batch is marked as mt i ;

[0051]

[0052] In the formula, BWZ represents a standard value for measuring the screen tension, a1 represents a weight for the ratio of the screen tension to the standard value, BDP represents a standard value for measuring the squeegee flatness error, a2 represents a weight for the ratio of the standard value to the squeegee flatness error, BMN represents a standard value for measuring the ink viscosity, a3 represents a weight for the ratio of the standard value to the ink viscosity, BMT represents a standard value for measuring the ink transparency, a4 represents a weight for the ratio of the ink transparency to the standard value, a1, a2, a3, and a4 are constants, and a1+a2+a3+a4=1, represents the screen printing index Syz of the i-th batch calculated according to the weights a1, a2, a3, and a4 i , quantifies the screen printing effect, and avoids substandard products from flowing into subsequent processes;

[0053] The baking evaluation unit analyzes the baking state of each batch of PCBs according to the baking data set and generates a corresponding baking data group Hksj. The calculation process is as follows:

[0054] According to the baking data set, the baking data of the i-th batch of PCBs is extracted, and the ink double bond conversion rate of each PCB in the i-th batch is marked as {g1, g2, g3,..., gN}. The processing temperature of the i-th batch is marked as wd i The processing air volume of the i-th batch is marked as fl i The processing humidity of the i-th batch is marked as sd i ;

[0055]

[0056] In the formula, represents the average value of the ink double bond conversion rate of the i-th batch of PCBs, ge represents the ink double bond conversion rate of the e-th PCB in the i-th batch, e∈N, represents the standard deviation of the ink double bond conversion rate of the i-th batch of PCBs, represents the ratio of the average value of the ink double bond conversion rate to the processing temperature, represents the ratio of the average value of the ink double bond conversion rate to the processing air volume, represents the ratio of the average value of the ink double bond conversion rate to the processing humidity, Hksj i represents the baking data group of the i-th batch of PCBs, accurately identifies the curing failure or uneven heating problem, and improves the reliability of finished products;

[0057] The dynamic management unit is provided with a fixed numerical thickness threshold HDY, a moisture threshold SFY, a transition threshold ZBY, a silk printing threshold SYY, a curing threshold GHY, a warm curing threshold WGY, an air volume threshold WLY and a humidity threshold SDY, combined with the monitoring data set Jcsj, the silk printing index Syz and the baking data set Hksj, to evaluate the uniformity, silk printing processing quality and baking state of each batch of PCB boards, and generate corresponding warning signals and control instructions;

[0058] In the monitoring data set Jcsj, when the standard deviation of the thickness of a single batch of PCB boards exceeds the thickness threshold HDY, it indicates that the thickness difference between the single batch of PCB boards is large, and an abnormal board signal is generated. If the standard deviation of the moisture content of a single batch of PCB boards exceeds the moisture threshold SFY, it indicates that the moisture content difference between the single batch of PCB boards is large, and an abnormal board signal is generated. If the standard deviation of the glass transition temperature of a single batch of PCB boards exceeds the transition threshold ZBY, it indicates that the glass transition temperature difference between the single batch of PCB boards is large, and an abnormal board signal is generated. Processing should be stopped immediately, and the PCB board should be optimized. When the silk printing index Syz is lower than the silk printing threshold SYY, it indicates that the silk printing processing quality of a single batch of PCB boards is poor, and a silk printing abnormal signal is generated. The silk printing should be stopped immediately, and the PCB board should be reprocessed. Problems can be found at the beginning of batch production, avoiding large-scale rework or scrap, and reducing material and energy waste.

[0059] In the baking data set Hksj, when the standard deviation of the ink double bond conversion rate of a single batch of PCB boards exceeds the curing threshold GHY, it indicates that there is a problem of uneven heating between the single batch of PCB boards. The baking should be stopped immediately, and the PCB boards should be re-stacked. If the ratio of the average value of the ink double bond conversion rate to the processing temperature exceeds the warm curing threshold WGY, it indicates that there is a problem of insufficient thermal curing reaction in a single batch of PCB boards. A thermal curing abnormal signal is generated, and the temperature curve should be optimized in time. If the ratio of the average value of the ink double bond conversion rate to the processing air volume exceeds the air volume threshold WLY, it indicates that there is a problem of poor curing in a single batch of PCB boards. An air volume abnormal signal is generated, and the processing air volume should be adjusted in time. If the ratio of the average value of the ink double bond conversion rate to the processing humidity exceeds the humidity threshold SDY, it indicates that there is a problem of poor curing in a single batch of PCB boards. A humidity abnormal signal is generated, and the processing humidity should be adjusted in time. In actual production process, the threshold configuration of all indicators can be flexibly adjusted to adapt to multi-variety and small-batch production scenes, realize automatic adjustment of baking parameters, ensure the best curing efficiency, and reduce energy consumption cost.

[0060] A quick automatic temperature matching method for silk printing and baking process, comprising the following steps:

[0061] Step one: through the network connection detection device and sensing device, obtain the board data, silk screen data and baking data of all batches of PCB boards, and classify to form a board data set, a silk screen data set and a baking data set;

[0062] Step two: according to the board data set, analyze the production quality of each batch of PCB boards, and generate a corresponding monitoring data group Jcsj;

[0063] Step three: according to the silk screen data set, analyze the silk screen effect of each batch of PCB boards, and generate a corresponding silk screen index Syz, which can respond more timely in real time;

[0064] Step four: according to the baking data set, analyze the baking state of each batch of PCB boards, and generate a corresponding baking data group Hksj;

[0065] Step five: set the fixed numerical thickness threshold HDY, moisture threshold SFY, transition threshold ZBY, silk screen threshold SYY, solidification threshold GHY, temperature solidification threshold WGY, air volume threshold WLY and humidity threshold SDY, and then combine the monitoring data group Jcsj, the silk screen index Syz and the baking data group Hksj to evaluate the uniformity, silk screen processing quality and baking state of each batch of PCB boards, generate corresponding warning signals and control instructions, and multi-dimensionally evaluate product quality.

[0066] Example 1:

[0067] In this experiment, 5 PCB boards were selected as experimental objects, and the 5 PCB boards belonged to the same batch. The thickness of the PCB boards in this batch was 1.2mm, 1.3mm, 1.1mm, 1.4mm and 1.0mm, the moisture content of the PCB boards was 0.3%, 0.4%, 0.2%, 0.5% and 0.1%, the glass transition temperature of the PCB boards was 130℃, 132℃, 128℃, 135℃ and 125℃, and the monitoring data group Jcsj of the PCB boards in this batch was i The calculation process is as follows:

[0068]

[0069] In the formula, represents the average value of the thickness of the PCB boards in this batch, represents the average value of the moisture content of the PCB boards in this batch, represents the average value of the glass transition temperature of the PCB boards in this batch, represents the standard deviation of the thickness of the PCB boards in this batch, represents the standard deviation of the moisture content of the PCB boards in this batch, The standard deviation of the glass transition temperature of the batch of PCBs is represented, the thickness threshold HDY is set to 0.3mm, the moisture threshold SFY is set to 0.5%, and the transition threshold ZBY is set to 3℃, it is judged that the standard deviation of the glass transition temperature of the batch of PCBs has exceeded the transition threshold ZBY, indicating that the difference in the glass transition temperature of the batch of PCBs is large, and the board material abnormal signal is generated, the processing should be stopped immediately, and the PCBs should be optimized and processed.

[0070] Embodiment 2:

[0071] In this experiment, the silk screen tension of the silk screen printing equipment is 18N, the detected flatness error of the squeegee of the equipment when processing a single batch of PCBs is 0.03mm, the ink viscosity is 800Pa·s, the ink transparency is 75%, and the silk printing index Syz of the batch of PCBs is i The calculation process is as follows:

[0072]

[0073] In the formula, BWZ=20 represents the standard value for measuring the silk screen tension, a1=0.3 represents the weight of the ratio of the silk screen tension to the standard value, BDP=0.05 represents the standard value for measuring the flatness error of the squeegee, a2=0.2 represents the weight of the ratio of the standard value to the flatness error of the squeegee, BMN=1000 represents the standard value for measuring the ink viscosity, a3=0.4 represents the weight of the ratio of the standard value to the ink viscosity, BMT=0.8 represents the standard value for measuring the ink transparency, and a4=0.1 represents the weight of the ratio of the ink transparency to the standard value. a1, a2, a3 and a4 are all constants, and 0.3+0.2+0.4+0.1=1. According to the weights of a1, a2, a3 and a4, the silk printing index Syz of the batch of PCBs is calculated i about 1.197, the silk printing threshold SYY is set to 1.5, it is judged that the silk printing index Syz4 of the batch of PCBs is lower than the silk printing threshold SYY, indicating that the silk printing quality of the batch of PCBs is poor, the silk printing abnormal signal is generated, and the PCBs should be processed immediately.

[0074] Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A quick automatic temperature matching system for screen printing baking process, characterized in that: It comprises a multi-dimensional monitoring module and an intelligent adjustment module; The multi-dimensional monitoring module is composed of a board management unit, a silk screen printing monitoring unit and a baking monitoring unit, the board management unit collects board data sets through network connection detection devices, the silk screen printing monitoring unit collects silk screen printing data sets through network connection detection devices, and the baking monitoring unit collects baking data sets through network connection sensing devices and detection devices; The intelligent adjustment module consists of a board material evaluation unit, a screen printing evaluation unit, a baking evaluation unit, and a dynamic management unit. The board material evaluation unit analyzes the production quality of each batch of PCB boards based on the board material dataset and generates corresponding monitoring data sets. The screen printing evaluation unit analyzes the screen printing effect of each batch of PCB boards based on the screen printing dataset and generates a corresponding screen printing index. The baking evaluation unit analyzes the baking status of each batch of PCB boards based on the baking dataset and generates corresponding baking data sets. The dynamic management unit is set with a fixed thickness threshold value. Moisture threshold Transition threshold Screen printing threshold Curing threshold Temperature-solid threshold Air volume threshold and humidity threshold Combined with monitoring data sets Silkscreen index and baking data group The system assesses the uniformity, silkscreen printing quality, and baking status of each batch of PCB boards, generating corresponding warning signals and control commands. The baking data set includes processing temperature, processing air volume, processing humidity and ink double bond conversion rate, The roasting data set The calculation proceeds as follows: According to the baking data set, the baking data of the first batch of PCB boards is extracted, and the ink double bond conversion rate of each PCB board in the first batch is marked as , the processing temperature of the first batch is marked as , the processing air volume of the first batch is marked as , and the processing humidity of the first batch is marked as ; ； ； in the formula, represents the average value of the ink double bond conversion of the PCBs of the first batch, represents the ink double bond conversion of the PCB of the first batch, , represents the standard deviation of the ink double bond conversion of the PCBs of the first batch, represents the ratio of the average value of the ink double bond conversion to the processing temperature, represents the ratio of the average value of the ink double bond conversion to the processing air volume, represents the ratio of the average value of the ink double bond conversion to the processing humidity, represents the baking data set of the PCBs of the first batch.

2. A quick automatic temperature matching system for screen printing and baking process according to claim 1, characterized in that: The board data set includes the number of PCB boards, PCB board thickness, PCB board moisture content and PCB board glass transition temperature of each batch.

3. A quick automatic temperature matching system for screen printing and baking process according to claim 2, characterized in that: The silk screen printing data set includes silk screen tension, squeegee flatness error, ink viscosity and ink transparency of each batch.

4. A quick automatic temperature matching system for screen printing and baking process according to claim 3, characterized in that: The monitoring data set The calculation proceeds as follows: According to the plate data set, the plate data of the first batch is extracted, and the number of PCB plates in the first batch is marked as , the thickness of each PCB plate in the first batch is marked as , the moisture content of each PCB plate in the first batch is marked as , and the glass transition temperature of each PCB plate in the first batch is marked as . ； ； ； ； In the formula, represents the average value of the thickness of the PCBs in the th batch, represents the average value of the moisture content of the PCBs in the th batch, represents the average value of the glass transition temperature of the PCBs in the th batch, represents the thickness of the th PCB in the th batch, , represents the moisture content of the th PCB in the th batch, represents the glass transition temperature of the th PCB in the th batch, represents the standard deviation of the thickness of the PCBs in the th batch, represents the standard deviation of the moisture content of the PCBs in the th batch, represents the standard deviation of the glass transition temperature of the PCBs in the th batch, represents the set of monitoring data of the PCBs in the th batch.​ 5. A quick automatic temperature matching system for screen printing and baking process according to claim 4, characterized in that: The silk printing index The calculation procedure is as follows: According to the silk screen data set, the silk screen data of the first batch of PCB boards is extracted, and the silk screen tension mark of the first batch is marked as , the squeegee flatness error mark of the first batch is marked as , the ink viscosity mark of the first batch is marked as , and the ink transparency mark of the first batch is marked as ; ； In the formula, This represents the standard value used to measure wire mesh tension. This indicates the weighting of the ratio of wire mesh tension to the standard value. This represents the standard value used to measure the flatness error of a scraper. This indicates the weight of the ratio between the standard value and the scraper flatness error. This represents a standard value used to measure ink viscosity. This indicates the weighting of the standard value relative to the ink viscosity ratio. This represents a standard value used to measure the transparency of ink. This indicates the weighting of the ratio of ink transparency to a standard value. , , and All are constants, and , Indicates according to , , and Weights, calculated to obtain the first Silk screen printing index for each batch .

6. A quick automatic temperature matching system for screen printing and baking process according to claim 5, characterized in that: The monitoring data set When the standard deviation of the thickness of the single batch of PCBs exceeds a thickness threshold , it indicates that the thickness difference between the single batch of PCBs is large, and a board material abnormal signal is generated. If the standard deviation of the moisture content of the single batch of PCBs exceeds a moisture threshold , it indicates that the moisture content difference between the single batch of PCBs is large, and a board material abnormal signal is generated. If the standard deviation of the glass transition temperature of the single batch of PCBs exceeds a transition threshold , it indicates that the glass transition temperature difference between the single batch of PCBs is large, and a board material abnormal signal is generated. The silk screen printing index is lower than a silk screen printing threshold , it indicates that the silk screen printing quality of the single batch of PCBs is poor, and a silk screen printing abnormal signal is generated. The silk screen printing should be immediately stopped, and the PCBs should be reprocessed.

7. A quick automatic temperature matching system for screen printing and baking process according to claim 5, characterized in that: The monitoring data set When the standard deviation of the thickness of the single batch of PCBs exceeds a thickness threshold , it indicates that the thickness difference between the single batch of PCBs is large, and a board material abnormal signal is generated. If the standard deviation of the moisture content of the single batch of PCBs exceeds a moisture threshold , it indicates that the moisture content difference between the single batch of PCBs is large, and a board material abnormal signal is generated. If the standard deviation of the glass transition temperature of the single batch of PCBs exceeds a transition threshold , it indicates that the glass transition temperature difference between the single batch of PCBs is large, and a board material abnormal signal is generated. The silk screen index is lower than a silk screen threshold , it indicates that the silk screen processing quality of the single batch of PCBs is poor, and a silk screen abnormal signal is generated. The silk screen should be immediately stopped, and the PCBs should be reprocessed.

8. A method for quick automatic temperature matching in a silk screen baking process, applied to the system for quick automatic temperature matching in a silk screen baking process according to any one of claims 1-7, characterized in that, It comprises the following steps: Step one: through network connection detection devices and sensing devices, obtain the board data, silk screen printing data and baking data of all batches of PCB boards, and classify them into board data sets, silk screen printing data sets and baking data sets; Step two: According to the plate data set, analyze the production quality of each batch of PCB board, and generate the corresponding monitoring data set ; Step three: According to the silk screen data set, analyze the silk screen effect of each batch of PCB boards, and generate the corresponding silk screen index ; Step four: According to the baking data set, analyze the baking state of each batch of PCB boards, and generate the corresponding baking data set ; Step five: set fixed numerical thickness threshold , moisture threshold , transition threshold , silk screen threshold , curing threshold , temperature curing threshold , air volume threshold , and humidity threshold , combined with the monitoring data set , silk screen index , and baking data set , to evaluate the uniformity, silk screen processing quality and baking state of each batch of PCBs, and generate corresponding warning signals and control instructions.

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