Substrate processing method

Abstract

A substrate processing method includes: a first mounting process of positioning a first substrate at a first position among a first position, a second position, a third position, a fourth position, and a fifth position; a second mounting process of combining the second array and the substrate group so that the second substrate is positioned at the second position; a third mounting process in which the third array and the substrate group are combined so that the third substrate is positioned at the third position; a fourth mounting process in which the fourth array and the substrate group are combined so that the fourth substrate is positioned at the fourth position; and a fifth assembly process in which the fifth array and the substrate group are combined so that the fifth substrate is positioned at the fifth position.

Description

Technical Field

[0001] The present invention relates to a method for processing substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as those for liquid crystal displays or organic EL (Electroluminescence) displays, glass substrates for photomasks, and substrates for optical disks. Background Art

[0002] Patent document 1 describes a substrate processing device that takes out the same number of substrates from two carriers to form a first substrate group and a second substrate group. By inserting the second substrate group into the gaps between the substrates of the first substrate group, the spacing is converted to 1 / 2, forming a substrate group with twice the number of pieces, which are processed together.

[0003] <List of Prior Art Documents>

[0004] Japanese Patent Application Laid-Open No. 5-175179

[0005] In recent years, there has been a search for further efficiency improvements in substrate processing devices. In order to increase the number of substrates that can be processed at one time in a batch process, it is necessary to further reduce the arrangement pitch of the substrates. At this time, the orientation of the substrates becomes a problem. That is, in batch processing, from the viewpoint of preventing contamination of the device surface, it is more appropriate to arrange the substrates face to face to generate batches. In order to arrange the substrates face to face so that the device surfaces of the substrates are opposite to each other, it is only possible to combine the arrangement of the substrates obtained from the first carrier and the arrangement of the substrates obtained from the second carrier by rotating a half circle. Therefore, according to the existing structure, even if the arrangement pitch of the substrates can be halved, the arrangement pitch of the substrates cannot be further narrowed. When the substrates obtained from the second carrier are inserted into the gap of the arrangement of the substrates obtained from the first carrier to generate a batch, the arrangement pitch of the substrates in the batch is naturally determined to be half of the original pitch.

[0006] The present invention has been made in view of the above situation, and an object of the present invention is to provide a substrate processing method that can narrow the arrangement pitch of substrates and efficiently process substrates. Summary of the Invention

[0007] The present invention adopts the following configuration in order to solve the above-mentioned problems.

[0008] That is, the present invention is a substrate processing method for processing a plurality of substrates at once, characterized in that:

[0009] It has the process of generating and processing the substrate group.

[0010] In the process of generating the substrate group, a plurality of substrates are taken out from a carrier on which substrates defined by the front and back surfaces are arranged at a specific pitch, and a substrate group is generated in which the substrates are arranged in one direction at a pitch twice the specific pitch.

[0011] In the above treatment process, the following assembly processes are performed in an arbitrary order to generate batches, and the batches are immersed in the treatment liquid.

[0012] The above assembly processes include:

[0013] In a first assembly process, a first arrangement in which first substrates facing in a direction opposite to the one direction are arranged at predetermined intervals twice the specific interval is combined with the substrate group, so that the first substrate is located at a first position among a first position, a second position, a third position, a fourth position, and a fifth position that divides the predetermined interval in the substrate group into six parts;

[0014] In a second assembly process, the second substrates are arranged in the first direction at predetermined intervals and are combined with the substrate group, thereby positioning the second substrates at the second position.

[0015] In a third assembly process, the third substrates are arranged in the opposite direction at predetermined intervals and are combined with the substrate group to form a third arrangement, thereby positioning the third substrates at the third position.

[0016] a fourth assembly process, combining a fourth arrangement of fourth substrates facing the one direction and spaced apart at predetermined intervals with the substrate group, thereby positioning the fourth substrate at the fourth position; and

[0017] In a fifth assembly process, a fifth arrangement of fifth substrates facing the opposite direction and spaced apart at predetermined intervals is combined with the substrate group, thereby positioning the fifth substrate at the fifth position.

[0018] [Function and Effect] The above-described structure generates a substrate group arranged at a large pitch, and inserts the first, second, third, fourth, and fifth arrays of substrates into the gaps between the substrate groups, thereby narrowing the pitch of the substrate group. This structure allows for the free adjustment of the relative position of the substrate group and the inserted substrates. Therefore, a new substrate arrangement can be generated by combining a substrate group facing one direction, a first array consisting of substrates facing the opposite direction, a second array consisting of substrates facing one direction, a third array consisting of substrates facing the opposite direction, a fourth array consisting of substrates facing one direction, and a fifth array consisting of substrates facing the opposite direction. Consequently, the pitch between the substrates can be narrowed, and the substrate arrangement direction can be adjusted to the desired arrangement direction.

[0019] In addition, in the above structure, it is preferred that

[0020] The surface of the first substrate in the first assembly process is opposite to the surface of the substrate group.

[0021] The back surface of the second substrate in the second assembly process is opposite to the back surface of the first substrate.

[0022] The surface of the third substrate in the third assembly process is opposite to the surface of the second substrate.

[0023] The back surface of the fourth substrate in the fourth assembly process is opposite to the back surface of the third substrate.

[0024] In the fifth assembly process, the surface of the fifth substrate faces the surface of the fourth substrate, and the back surface of the fifth substrate faces the back surface of the substrate group.

[0025] [Function and Effect] According to the above structure, the front surface of the first substrate in the first assembly process faces the front surface of the substrate group, the back surface of the second substrate in the second assembly process faces the back surface of the first substrate, the front surface of the third substrate in the third assembly process faces the front surface of the second substrate, the back surface of the fourth substrate in the fourth assembly process faces the back surface of the third substrate, and the front surface of the fifth substrate in the fifth assembly process faces the front surface of the fourth substrate, and the back surface of the fifth substrate faces the back surface of the substrate group. According to the present invention, it is possible to create a substrate arrangement in which the front and back surfaces are arranged in this way.

[0026] In addition, in the above structure, it is preferred that

[0027] The first assembly process is performed after the first arrangement of the first substrates facing the one direction and spaced apart by the predetermined interval is rotated half a circle.

[0028] The third assembly process is performed after the third arrangement of the third substrates facing the one direction and spaced apart by the predetermined interval is rotated half a circle.

[0029] The fifth assembly process is performed after the fifth arrangement, in which the fifth substrates facing the one direction are spaced apart by the predetermined interval, is rotated half a circle.

[0030] [Function and Effect] According to the above structure, the first assembly process is performed after a first arrangement of first substrates facing one direction at predetermined intervals is rotated half a turn. The third assembly process is performed after a third arrangement of third substrates facing one direction at predetermined intervals is rotated half a turn. The fifth assembly process is performed after a fifth arrangement of fifth substrates facing one direction at predetermined intervals is rotated half a turn. In this way, the substrate arrangement can be completed by receiving a group of substrates arranged in one direction from a carrier.

[0031] In addition, in the above structure, it is preferable to have:

[0032] In a first step, the substrates are collectively taken from a substrate storage carrier that arranges the horizontally positioned substrates in a vertical direction; and

[0033] In the second step, the posture of each substrate is converted from a horizontal posture to a vertical posture.

[0034] The above-mentioned first process and the above-mentioned second process are performed before each assembly process.

[0035] [Function and Effect] With the above-described configuration, the first step of collectively receiving substrates from a substrate storage carrier that arranges horizontally positioned substrates in a vertical direction, and the second step of collectively converting the positions of the substrates from a horizontal position to a vertical position, are performed before each assembly step. With this configuration, the substrate arrangement can be completed by receiving a group of substrates arranged in a single direction from a carrier.

[0036] In addition, in the above structure, it is preferred that

[0037] The distance from the first position to the second position is 1 / 3 of the specific spacing in the carrier.

[0038] [Function and Effect] According to the above structure, the distance from the first position to the second position is 1 / 3 of the specific pitch in the carrier. With this structure, the pitch of the generated substrate array can be made less than 1 / 2 of the array pitch of the substrates accommodated in the carrier.

[0039] In addition, in the above structure, it is preferred that

[0040] The assembly processes are performed in the order of the first assembly process, the second assembly process, the third assembly process, the fourth assembly process, and the fifth assembly process.

[0041] [Function and Effect] According to the above structure, the assembly steps are performed in the order of the first assembly step, the second assembly step, the third assembly step, the fourth assembly step, and the fifth assembly step. This structure makes it easier to create a substrate arrangement.

[0042] In addition, in the above structure, it is preferred that

[0043] The substrate group is obtained from a first substrate storage carrier that arranges horizontal substrates in a vertical direction.

[0044] Obtain the first arrangement from the first carrier,

[0045] The second arrangement is obtained from a second substrate storage carrier that arranges substrates in a horizontal position in a vertical direction.

[0046] Obtain the third arrangement from the second carrier,

[0047] The fourth arrangement is obtained from a third substrate storage carrier that arranges substrates in a horizontal position in a vertical direction.

[0048] The fifth arrangement is obtained from the third carrier.

[0049] [Function and Effect] With the above structure, a substrate group is obtained from the first carrier, a first array is obtained from the first carrier, a second array is obtained from the second carrier, a third array is obtained from the second carrier, a fourth array is obtained from the third carrier, and a fifth array is obtained from the third carrier. This configuration makes it possible to easily generate substrate arrays from multiple carriers.

[0050] In addition, in the above structure, it is preferred that

[0051] The first position, the second position, the third position, the fourth position, and the fifth position divide the predetermined interval into six equal parts.

[0052] [Function and Effect] According to the above configuration, the first, second, third, fourth, and fifth positions divide the predetermined interval into six equal parts. This configuration allows for a more evenly aligned substrate arrangement.

[0053] In addition, in the above structure, it is preferred that

[0054] The substrate group generating process extracts every other substrate from the carrier to generate the substrate group.

[0055] [Function and Effect] According to the above structure, every other substrate is pulled out from the carrier to form a substrate group. With this structure, the substrate group can be easily formed.

[0056] In addition, in the above structure, it is preferred that

[0057] The substrate group generating process generates the substrate group by extracting every other substrate in a process of converting the substrate from a horizontal position to a vertical position after all substrates are extracted from the carrier.

[0058] [Function and Effect] According to the above configuration, during the latter stage of extracting all substrates from the carrier and converting the substrates from a horizontal position to a vertical position, the substrate group is produced by extracting each substrate one by one. This configuration facilitates the production of the substrate group.

[0059] According to the present invention, a substrate processing method capable of narrowing the arrangement pitch of substrates and efficiently processing substrates can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 It is a plan view illustrating the overall structure of the substrate processing apparatus according to the embodiment.

[0061] Figure 2 It is a schematic diagram illustrating the structure of the carrier of the example.

[0062] Figure 3 It is a perspective view illustrating each part constituting the transfer block of the embodiment.

[0063] Figure 4 This is a diagram comparing the structure of the carrier of the embodiment and the structure of the manipulation robot.

[0064] Figure 5 It is a perspective view illustrating the structure of the HVC posture conversion unit according to the embodiment.

[0065] Figure 6 It is a plan view illustrating the structure of each lever of the embodiment.

[0066] Figure 7 It is a plan view illustrating the structure of each lever of the embodiment.

[0067] Figure 8 This is a cross-sectional view illustrating the groove included in the clamping rod of the embodiment.

[0068] Figure 9 is a schematic diagram illustrating a pusher according to an embodiment.

[0069] Figure 10 is a schematic diagram illustrating a pusher according to an embodiment.

[0070] Figure 11A This is a schematic diagram for explaining the batch group of the embodiment.

[0071] Figure 11B This is a schematic diagram for explaining the batch group of the embodiment.

[0072] Figure 11C This is a schematic diagram for explaining the batch group of the embodiment.

[0073] Figure 11D This is a schematic diagram for explaining the batch group of the embodiment.

[0074] Figure 11E This is a schematic diagram for explaining the batch group of the embodiment.

[0075] Figure 11F This is a schematic diagram for explaining the batch group of the embodiment.

[0076] Figure 11G This is a schematic diagram for explaining the batch group of the embodiment.

[0077] Figure 11H This is a schematic diagram for explaining the batch group of the embodiment.

[0078] Figure 11I This is a schematic diagram for explaining the batch group of the embodiment.

[0079] Figure 11J This is a schematic diagram for explaining the batch group of the embodiment.

[0080] Figure 11K This is a schematic diagram for explaining the batch group of the embodiment.

[0081] Figure 11L This is a schematic diagram for explaining the batch group of the embodiment.

[0082] Figure 11M This is a schematic diagram for explaining the batch group of the embodiment.

[0083] Figure 11N This is a schematic diagram for explaining the batch group of the embodiment.

[0084] Figure 11O This is a schematic diagram for explaining the batch group of the embodiment.

[0085] Figure 11P This is a schematic diagram for explaining the batch group of the embodiment.

[0086] Figure 12 It is a schematic diagram for explaining the orientation of the substrate in the embodiment.

[0087] Figure 13 This is a flowchart illustrating the flow of substrates in the embodiment.

[0088] Figure 14 This is a flowchart illustrating the flow of substrates in the embodiment.

[0089] Figure 15 It is a schematic diagram illustrating a modified example of the operating robot of the embodiment.

[0090] Figure 16A This is a schematic diagram illustrating a modified example of the batch group of the embodiment.

[0091] Figure 16B This is a schematic diagram illustrating a modified example of the batch group of the embodiment.

[0092] Figure 16C This is a schematic diagram illustrating a modified example of the batch group of the embodiment.

[0093] Figure 16D This is a schematic diagram illustrating a modified example of the batch group of the embodiment.

[0094] Figure 16E This is a schematic diagram illustrating a modified example of the batch group of the embodiment.

[0095] Figure 16F This is a schematic diagram illustrating a modified example of the batch group of the embodiment. DETAILED DESCRIPTION

[0096] An embodiment of the present invention will be described below with reference to the accompanying drawings. In this embodiment, a substrate processing apparatus converts substrates arranged at a 10mm pitch into a 1 / 3 pitch (10 / 3mm) to form batches. Various substrate treatments, such as chemical immersion treatment, are performed on these batches simultaneously, implementing so-called batch processing. By narrowing the substrate pitch in this way, less chemical solution is required for substrate processing, reducing running costs and enabling environmentally friendly substrate processing.

[0097] The substrates processed by the substrate processing apparatus of this embodiment have an orientation defined by their front and back surfaces. The front surface of the substrate is the device side where film formation and exposure processing are performed. The back surface is the side opposite the device surface. When holding the substrate in a horizontal position, the front surface of the substrate faces upward.

[0098] Example

[0099] 1. Overall structure

[0100] The substrate processing apparatus 1 of the present invention is configured for batch processing. It includes a housing 1A that houses the various blocks. Housing 1A has a generally rectangular shape when viewed from above. Housing 1A houses a stocker block 3, a transfer block 5, and a processing block 6 arranged horizontally from one end. A loading port 9 is protruding from a wall surface at one end of housing 1A.

[0101] In this specification, for the sake of convenience, the direction in which the storage block 3, the transfer block 5, and the processing block 6 in the substrate processing device 1 are arranged is referred to as the "front-back direction X". The front-back direction X extends horizontally. The direction in the front-back direction X from the transfer block 5 of the substrate processing device 1 toward the storage block 3 is referred to as the "front". The direction on the side opposite to the front is referred to as the "rear". The direction extending horizontally and perpendicular to the front-back direction X is referred to as the "width direction Y". For the sake of convenience, one direction of the "width direction Y" is referred to as the "right", and the other direction is referred to as the "left". For the sake of convenience, the direction (height direction) perpendicular to the front-back direction X and the width direction Y is referred to as the "vertical direction Z". In each figure, front, back, right, left, top, and bottom are appropriately shown for reference.

[0102] 2. Storage Block

[0103] like Figure 1 As shown, the stocker block 3 includes a loading port 9, which is an entrance for loading carriers C into the block. The carriers C accommodate multiple substrates W in a horizontal position at predetermined intervals in the vertical direction. The loading port 9 is a structure that protrudes from the outer wall of the stocker block 3, which extends in the width direction (Y direction).

[0104] A plurality of (eg, 25) substrates W are stacked in a horizontal position at regular intervals and stored in one carrier C. The carrier C storing unprocessed substrates W carried into the substrate processing apparatus 1 is first placed on the load port 9 .

[0105] Figure 2 The structure of the carrier C is described below. The carrier C is formed with a plurality of narrow slots S extending in the horizontal direction to keep the surfaces of the substrates W separated from each other. The narrow slots S are arranged in the vertical direction at a specific pitch (for example, 10 mm), and each narrow slot S accommodates a substrate W. One carrier C is provided with 25 narrow slots S. Therefore, 25 substrates W are arranged in the vertical direction at a specific pitch on the carrier C. The loading plate 7 is located at a position dividing each narrow slot S, and supports both ends of the substrate W together with the paired loading plates 7. Therefore, the loading plates 7 are arranged so that one is provided on each side of the carrier C and on a surface parallel to the side. As the carrier C, for example, there is a closed FOUP (Front Opening Unify Pod). In the present invention, an open container can also be used as the carrier C.

[0106] The internal structure of the stocker block 3 will be described. The stocker block 3 includes a transport and storage unit ACB that stores and manages carriers C. The transport and storage unit ACB includes a carrier transport mechanism 11 that transports carriers C and a shelf 13 that places carriers C. The stocker block 3 can store one or more carriers C.

[0107] The stocker block 3 has a plurality of racks 13 for placing carriers C. The racks 13 are provided in a partition wall separating the stocker block 3 from the transfer block 5. The racks 13 include a storage rack 13b for temporarily placing carriers C, and a carrier placement rack 13a for removing substrates, which is accessed by the first handling robot HTR of the transfer block 5.

[0108] The carrier loading rack 13a is a structure capable of loading carriers C. The carrier loading rack 13a is a structure for loading carriers C for removing substrates W. In this embodiment, only one carrier loading rack 13a is provided, but multiple carrier loading racks 13a may be provided. The carrier transport mechanism 11 retrieves carriers C containing unprocessed substrates W from the load port 9 and loads them onto the substrate removal carrier loading rack 13a. In this case, the carrier transport mechanism 11 can also temporarily load the carriers C onto the storage rack 13b before loading them onto the carrier loading rack 13a. The number of carrier loading racks 13a included in the stocker block 3 is one or more.

[0109] Alternatively, the carrier loading rack 13a may be configured to hold empty carriers C for storing processed substrates W. Processed substrates W are stored on the carriers C waiting on the carrier loading rack 13a. The carrier transport mechanism 11 retrieves the carriers C storing the processed substrates W from the carrier loading rack 13a and transports them to the load port 9. When transporting the carriers C to the load port 9, the carrier transport mechanism 11 may temporarily place the carriers C on the storage rack 13b.

[0110] 3. Transfer block

[0111] The transfer block 5 is adjacent to the carrier loading shelf 13a. The transfer block 5 is positioned adjacent to the rear of the storage block 3. The transfer block 5 includes a handling robot HTR capable of accessing the carriers C loaded on the carrier loading shelf 13a for substrate removal, an HVC posture conversion unit 23 for collectively converting the postures of multiple substrates W from a horizontal position to a vertical position, and a pushing mechanism 25. The HVC posture conversion unit 23 converts the multiple substrates W from a horizontal position to a vertical position. Furthermore, a substrate transfer position PP is defined in the transfer block 5 for transferring the multiple substrates W to the forward / backward transport mechanism WTR located in the collective transport region R2.

[0112] like Figure 3 As shown, the handling robot HTR, the HVC posture conversion unit 23, and the pushing mechanism 25 are arranged in this order along the Y direction. The handling robot HTR has a manipulator 211 capable of holding a substrate W in a horizontal position. The manipulator 211 can hold a single substrate W. The manipulator 211 of the handling robot HTR is arranged in the vertical direction. The handling robot HTR can transport multiple substrates W at a time by using the manipulator 211 to hold each substrate separately. The moving support mechanism 213 is a mechanism that constitutes the handling robot HTR and is a structure that rotates the manipulator 211 around the vertical axis, raises and lowers the manipulator 211, and moves the manipulator 211 forward and backward in the front-to-back direction X or laterally in the left-to-right direction Y.

[0113] Figure 4FIG. 2 shows the operation of the handling robot HTR using the manipulator 211 to receive the substrate W in the carrier C. Figure 4 As shown, the manipulators 211 are arranged in the vertical direction at a pitch that is multiple of the arrangement pitch of the slots S provided on the carrier C. That is, the manipulators 211 are arranged at a pitch of 20 mm. 20 mm corresponds to the predetermined interval of the present invention. The handling robot HTR cannot transport all the substrates W arranged at a pitch of 10 mm on the carrier C at one time. The handling robot HTR is configured to generate a group of substrates arranged at a pitch of 20 mm by pulling out every other substrate W arranged at a pitch of 10 mm. The surfaces of the substrates W stored in the carrier C are all facing upward, so the substrates W pulled out by the handling robot HTR are all facing upward. In addition, guides 214 are provided on the manipulators 211 for making the peripheral edges of the substrates abut. The guides 214 are provided on the front end and base end of a pair of blades constituting the manipulator 211. Therefore, four guides 214 are provided on the manipulator 211.

[0114] The handling robot HTR has 13 manipulators 211. Using these manipulators, the handling robot HTR transports the 25 substrates stored on the carrier C in two batches. The handling robot HTR can first transport 12 substrates W and then transport 13 substrates W. Similarly, the handling robot HTR can first transport 13 substrates W and then transport 12 substrates W.

[0115] Figure 3 The HVC posture conversion unit 23 shown is a structure that converts the substrate W removed from the carrier C by the handling robot HTR from a horizontal posture to a vertical posture. The HVC posture conversion unit 23 includes a pair of loading rods 231 and a pair of clamping rods 232 extending in the longitudinal direction (Z direction). The support table 237 has a support surface extending along the XY plane for supporting the loading rods 231 and clamping rods 232. The rotation drive mechanism 239 is a structure that rotates the loading rods 231 and clamping rods 232 along with the support table 237 90 degrees. This rotation causes the loading rods 231 and clamping rods 232 to extend in the left-right direction (Y direction).

[0116] The loading rods 231 are equipped with rod drive mechanisms 235 that rotate about rotation axes extending along their extensions. The pair of rod drive mechanisms 235 allow the pair of loading rods 231 to rotate synchronously. Furthermore, the rod drive mechanisms 235 can extend and retract the loading rods 231. A specific example of how the loading rods 231 are driven by the rod drive mechanisms 235 will be described later.

[0117] The clamping rod 232 includes a rod rotating mechanism 236 that rotates around a rotation axis along the direction in which the clamping rod 232 extends. The pair of rod rotating mechanisms 236 allows the pair of clamping rods 232 to rotate synchronously.

[0118] Figure 5The flat plate 233 of the loading rod 231 is described. The flat plates 233 are arranged on the loading rod 231 at intervals of 20 mm along the direction in which the loading rod 231 extends. Each flat plate 233 is a plate extending along a plane perpendicular to the arrangement direction of the flat plates 233, and the substrate W is supported on the loading rod 231 by placing the end of the substrate W on the upper surface of the flat plate 233. In addition, it is not possible to hold the entire substrate W by holding only one end of the substrate W, so two loading rods 231 are provided in the HVC posture conversion unit 23. It is configured so that one end of the substrate W is held by the flat plate 233 of the loading rod 231 on one side, and the other end of the substrate W is held by the flat plate 233 of the loading rod 231 on the other side. One end and the other end are separated by a distance of the diameter of the substrate W. Therefore, as Figure 6 As shown, the pair of support rods 231 are separated by a distance equal to the diameter of the substrate W. This prevents the substrate W held by the plate 233 from floating off the plate 233. The weight of the substrate W is applied symmetrically to the plate 233, maintaining a balanced weight on the left and right sides of the plate 233. Furthermore, the pair of support rods 231 are parallel to each other.

[0119] Figure 5 The clamping plate 234 of the clamping rod 232 is described. The clamping plate 234 has an arcuate edge 234a along the curve of the substrate W, and a V-shaped groove 234b for clamping the substrate W is provided on the arcuate edge 234a. The substrate W has a shape along the curve of the arcuate edge 234a, so the substrate W is clamped by the V-shaped groove 234b of the arcuate edge 234a. The clamping plates 234 are arranged on the clamping rod 232 at a pitch of 20 mm in the direction in which the clamping rod 232 extends. Each clamping plate 234 is a plate extending along a plane perpendicular to the arrangement direction of the clamping plates 234. The substrate W is clamped by the clamping rod 232 by clamping a portion of the substrate W in the V-shaped groove 234b of the arcuate edge 234a.

[0120] In addition, the entire substrate W cannot be clamped by clamping only a part of the substrate W, so two clamping rods 232 are provided in the HVC posture conversion part 23. It is configured so that a part of the substrate W is clamped by the clamping plate 234 of the clamping rod 232 on one side, and a part of the substrate W is clamped by the clamping plate 234 of the clamping rod 232 on the other side. The pair of clamping rods 232 are separated by a distance shorter than the diameter of the substrate W. The pair of clamping rods 232 is a structure for clamping the substrate W in a vertical posture, so it is sufficient to clamp the lower side of the substrate W, and there is no need to separate them by a distance of the diameter of the substrate W like the loading rod 231. Nevertheless, as Figure 7 As shown, the clamping rod 232 is arranged at a position deviated from the bottom of the substrate W in the vertical posture, so two rods are required: a rod for clamping the right side of the substrate W when viewed from the bottom and a rod for clamping the left side of the substrate W when viewed from the bottom. Figure 8As shown, the two clamping bars 232 clamp the substrate W from both sides via the V-shaped grooves 234b of the clamping plate 234. The pair of clamping bars 232 are parallel to each other.

[0121] Figure 3 The pusher mechanism 25 includes a pusher 251 that can align substrates W in a vertical position horizontally. The pusher 251 is a half-tube shape that follows the curve of the bottom of the substrate W. In the initial state, the U-shaped groove 251a forming the half-tube of the pusher 251 extends in the left-right direction Y. In this state, the pusher 251 can receive the substrate W from the HVC position conversion unit 23.

[0122] Figure 9 2 is a cross-sectional view illustrating the structure of the pusher 251. The pusher 251 has a plurality of V-shaped clamping grooves 252. The clamping grooves 252 are arranged along the Figure 7 The U-shaped grooves are arranged in the extending direction. The arrangement spacing of the clamping grooves 252 is 10 / 3mm. Figure 9 As shown, each substrate W is clamped in the clamping grooves 252 .

[0123] Figure 10 The relationship between the pair of clamping rods 232 and the pusher 251 will be described. Figure 10 A pair of clamping rods 232 and Figure 3 The state is different, and the support platform 237 is tilted 90 degrees together with the rotation drive mechanism 239. Therefore, Figure 10 The clamping rod 232 extends in the horizontal direction. Figure 10 It can be seen that the pusher 251 is located between the pair of clamping bars 232 in the front-rear direction X. Therefore, the pair of clamping bars 232 and the pusher 251 can cooperate to clamp the substrate W in the vertical posture without interfering with each other.

[0124] Figure 3 The pusher rotating mechanism 253 can rotate the pusher 251 at least 180 degrees. The pusher rotating mechanism 253 can rotate the pusher 251 in the initial state to make the pusher 251 face the reverse direction, and can also rotate the pusher 251 facing the reverse direction to return the pusher 251 to the initial state.

[0125] The pusher shifting mechanism 254 can reciprocate the pusher 251 in the initial state in the left-right direction Y. The pusher shifting mechanism 254 can move the pusher 251 closer to the HVC posture conversion unit 23 or closer to the forward and backward transport mechanism WTR.

[0126] The pusher lifting mechanism 255 can raise the pusher 251 in the initial position to the upper position. In addition, the pusher lifting mechanism 255 can also return the pusher 251 in the upper position to the initial position.

[0127] 4. Change of the spacing between transfer blocks

[0128] The substrate processing apparatus of this embodiment can change the arrangement pitch of substrates W on the transfer block 5. This feature will be described below. Substrates W arranged at a 10 mm pitch on the carrier C are temporarily arranged at a 20 mm pitch on the transfer block 5 and then rearranged at a 10 / 3 mm pitch. This configuration will be described in detail below.

[0129] Figure 11A The arrangement pitch of the substrates in each configuration is described below. In the carrier C, the mounting plates 7 forming each slot S are arranged at 10 mm intervals. The mounting plates 7 are arranged vertically not only on one side of the carrier C but also on the other side. By placing both ends of the substrate W on a pair of opposing mounting plates 7, the carrier C holds the substrate W.

[0130] On the other hand, the flat plates 233 of the placement bars 231 of the HVC posture conversion unit 23 are arranged at a pitch of 20 mm. Therefore, if the placement plates 7 of the carrier C are arranged at a pitch of A, the pitch of the flat plates 233 is 2A. In other words, the pair of placement bars 231 can only hold approximately half of the 25 substrates W accommodated in the carrier C, or 13 substrates at a time.

[0131] Similarly, the clamping plates 234 of the clamping bars 232 of the HVC posture conversion unit 23 are arranged at a pitch of 20 mm. Therefore, if the arrangement pitch of the carrier C's mounting plates 7 is set to A, the arrangement pitch of the clamping plates 234 is 2A. In other words, the pair of clamping bars 232 can only hold approximately half of the 25 substrates W accommodated in the carrier C, or 13 substrates at a time.

[0132] Figure 11B The following diagram briefly shows how 25 substrates W are arranged on a carrier C. In the following description, three different carriers C appear, so Figure 11B The carrier C in the figure is called the first carrier C1. On the first carrier C1, 25 substrates W are arranged at a pitch of 10 mm.

[0133] Figure 11C The figure shows the state when a portion of the substrates W stored in the first carrier C1 is delivered to the HVC posture conversion unit 23 by the handling robot HTR. The handling robot HTR has manipulators 211 arranged in the vertical direction at a pitch of 20 mm. Therefore, the handling robot HTR can only hold about half of the substrates W in the first carrier C1 at a time. The handling robot HTR extracts the substrates W from the first carrier C1 one by one and delivers them to the HVC posture conversion unit 23. Thus, as shown in FIG. Figure 6 As shown, both ends of the substrate W are supported by a pair of mounting rods 231 .

[0134] At this point, the periphery of the substrate W contacts the clamping plates 234 of the pair of clamping bars 232. Specifically, the periphery of the substrate W is clamped in the V-grooves of the clamping plates 234. Therefore, even if the support table 237 is rotated 90° in this state, the substrate W is clamped by the V-grooves 234b of the clamping plates 234, preventing the substrate W from slipping off the HVC posture switching unit 23.

[0135] In addition, Figure 11C FIG also shows how the mounting rod 231 supports the substrate W via the flat plate 233. Figure 11C The clamping rods 232 are shown clamping the substrate W via the clamping plates 234 .

[0136] Figure 11D The figure shows the rotation drive mechanism 239 of the HVC posture conversion unit 23 in operation. This operation rotates the support table 237 90 degrees, and the placement rods 231 and clamping rods 232 are horizontally extended. As a result, the load of the substrate W is transferred from the placement rods 231 to the clamping rods 232, and the flat plate 233 of the placement rods 231 is in contact only with the substrate W. Figure 11D The figure shows the state when the placement rod 231 is retracted by the rod driving mechanism 235. When the placement rod 231 is retracted (slightly displaced so as to sink into the support table 237), the plate 233 separates from the substrate W. Even with this movement, the substrate W does not move with the movement of the plate 233 because it is supported by the clamping rods 232.

[0137] If the flat plate 233 is separated from the substrate W, the flat plate 233 will not damage the back surface of the substrate W even if the substrate W clamped by the clamping bars 232 is lifted by the pusher 251 .

[0138] Figure 11E The figure shows the state when the loading rod 231 is rotated 90 degrees by the rod driving mechanism 235. The flat plate 233 of the loading rod 231 is directed upward by the rotation of the loading rod 231. The movement of the flat plate 233 is performed above the pusher 251. The loading rod 231 and the substrate W clamped by the clamping rod 232 approach the pusher 251, but at this time, the flat plate 233 does not collide with the substrate W held by the pusher 251. In addition, Figure 11E The pusher 251 does not clamp the substrate W, so the rotation of the plate 233 can be omitted.

[0139] Figure 11FThe pusher 251 is then raised. The bottom of the substrate W, clamped by the clamping bars 232, then fits into the clamping grooves 252 of the pusher 251. Further raising the pusher 251 in this state causes the substrate W to detach from the clamping plates 234 of the clamping bars 232. This transfers the substrate W from the HVC posture conversion unit 23 to the pusher mechanism 25.

[0140] Thereafter, the pusher 251 rises to the upper position UR set above the placement rod 231. The pusher 251 at the upper position UR does not collide with the placement rod 231 that has returned to the upright state. Figure 11F The following describes how the loading rod 231 and the clamping rod 232 are moved to the imaginary position IR indicated by the dotted line by the rotation drive mechanism 239. At this time, the loading rod 231, which was originally retracted, returns to its original extended state. In addition, the loading rod 231 rotates in the reverse direction and returns to its original position. Figure 11C The original state described.

[0141] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture conversion unit 23 to the pushing mechanism 25. At this time, the clamping grooves 252 of the pusher 251 have grooves that clamp the substrates W and empty grooves that do not clamp the substrates W. The grooves that clamp the substrates W are separated from each other by a distance six times the arrangement pitch of the clamping grooves 252. This is because the arrangement pitch of the clamping grooves 252 is 10 / 3 mm. The arrangement pitch of the substrates W, that is, 20 mm, is exactly six times the arrangement pitch of the clamping grooves 252. For the sake of convenience, the substrates W arranged on the pusher 251 at this time are referred to as the initial substrate group, or simply as the initial substrate W0. The initial substrate group is equivalent to the substrate group of the present invention.

[0142] Figure 11G The pusher 251 that has been lowered and returned to its initial position is rotated half a circle by the pusher rotation mechanism 2253. The leftward pusher 251 is referred to as the L state. Figure 11F The pusher 251 is in the R state to the right. Figure 11G The half rotation of is called the first half rotation r1. Figure 11G The dotted line also illustrates how the substrates W remaining on the first carrier C1 and arranged at a 20 mm pitch are transported to the HVC posture conversion unit 23. This transport is achieved by a handling robot HTR having robot hands 211 arranged at a 20 mm pitch.

[0143] Figure 11H The following figure shows the state when the substrate W held by the HVC posture conversion unit 23 is delivered to the pusher 251. Figure 11D The description of the tilting of the loading rod 231 and the clamping rod 232 and the contraction of the loading rod 231 has been completed. Figure 11H In the Figure 11E The rotation of the loading rod 231 is described. Figure 11F The described operations include insertion of the substrate W into the pusher 251 , ascent and descent of the pusher 251 , rising of the placement rod 231 and the clamping rod 232 , extension of the placement rod 231 , and reverse rotation of the placement rod 231 .

[0144] As reference Figure 11H It can be seen that in this case, the substrates W arranged at a pitch of 20 mm are still delivered to the pusher 251 without changing their pitch. When the substrate W is delivered from the HVC posture conversion unit 23 to the push mechanism 25, the substrate W is delivered to any one of the clamping grooves 252 of the pusher 251. The clamping grooves 252 in which the initial substrate group is already embedded cannot clamp more substrates W. Therefore, the substrate W held by the HVC posture conversion unit 23 is transported to a position that is one pitch away from the arrangement of the clamping grooves 252 of the initial substrate group and is embedded in the clamping groove 252 there. This alignment of the substrate W and the pusher 251 is achieved by the pusher shifting mechanism 254.

[0145] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture conversion unit 23 to the pusher mechanism 25. At this time, the pusher 251 is alternately configured with two consecutive clamping grooves 252 clamping substrates W and four consecutive empty grooves without clamping substrates W. Figure 11H The substrates W newly arranged on the pusher 251 are referred to as a first arrangement, or simply as first substrates W1 .

[0146] Figure 11I The pusher 251 is shown as it is rotated half a circle by the pusher rotating mechanism 253. At this time, the pusher 251 is in the R state. Figure 11I The half rotation in is called the second half rotation r2. Figure 11G The dotted lines illustrate the process of transferring a substrate W from the second carrier C2 to the HVC posture conversion unit 23. The second carrier C2 is a new carrier that replaces the empty first carrier C1 and is transferred to the carrier loading shelf 13a by the carrier transfer mechanism 11. The second carrier C2 holds 25 substrates W arranged at a 10 mm pitch. Substrates W arranged at a 20 mm pitch are removed from the second carrier C2 and transferred to the HVC posture conversion unit 23. This transfer is performed by a handling robot HTR equipped with a manipulator 211 arranged at a 20 mm pitch.

[0147] Figure 11J The substrate W held by the HVC posture conversion unit 23 is then transferred to the pusher 251. Figure 11DThe specific actions of the described tilting of the loading rod 231 and the clamping rod 232 are similar to those of Figure 11H The same is omitted.

[0148] As reference Figure 11J As can be seen, in this case, the substrates W arranged at a 20 mm pitch are delivered to the pusher 251 without changing the pitch. The gripping grooves 252 of the pusher 251 already hold the first-row substrates W in the initial substrate group, and are unable to hold any more substrates W. Therefore, the substrate W held by the HVC posture conversion unit 23 is transported to a position offset from the first-row substrates W by one pitch in the gripping grooves 252 and is then positioned in the gripping grooves 252 there. This alignment of the substrates W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0149] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture conversion unit 23 to the push mechanism 25. At this time, the pusher 251 is alternately configured with three consecutive clamping grooves 252 clamping substrates W and three consecutive empty grooves without clamping substrates W. Figure 11J The substrate W newly arranged on the pusher 251 is referred to as a second substrate W2 .

[0150] Figure 11K The pusher 251 is shown as it is rotated half a circle by the pusher rotating mechanism 253. At this time, the pusher 251 is in the L state. Figure 11K The half rotation in is called the third half rotation r3. Figure 11K The dotted lines illustrate how the substrates W remaining on the second carrier C2 are transported to the HVC posture conversion unit 23. The substrates W remaining on the second carrier C2 are arranged at a 20 mm pitch. This transport is achieved by a handling robot HTR having robot arms 211 arranged at a 20 mm pitch.

[0151] Figure 11L The substrate W held by the HVC posture conversion unit 23 is then transferred to the pusher 251. Figure 11D The specific actions of the described tilting of the loading rod 231 and the clamping rod 232 are similar to those of Figure 11H The same is omitted.

[0152] As reference Figure 11LAs can be seen, in this case, the substrates W arranged at a 20 mm pitch are delivered to the pusher 251 without changing the pitch. The pusher 251 has gripping grooves 252 already holding substrates W from the initial substrate group, the first row, and the second row, and cannot hold any more substrates W. Therefore, the substrate W held by the HVC posture conversion unit 23 is transported to a position offset from the second row by one pitch in the gripping grooves 252 arrangement and is then gripped into the gripping grooves 252 there. This alignment of the substrates W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0153] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture conversion unit 23 to the push mechanism 25. At this time, the pusher 251 is alternately configured with four consecutive clamping grooves 252 clamping substrates W and two consecutive empty grooves without clamping substrates W. Figure 11L The substrate W newly arranged on the pusher 251 is referred to as a third array, or simply as a third substrate W3.

[0154] Figure 11M The pusher 251 is shown as it is rotated half a circle by the pusher rotating mechanism 253. At this time, the pusher 251 is in the R state. Figure 11M The half rotation in is called the fourth half rotation r4. Figure 11M The dotted lines illustrate the process of transferring a substrate W from the third carrier C3 to the HVC posture conversion unit 23. The third carrier C3 is a new carrier that replaces the empty second carrier C2 and is transferred to the carrier loading shelf 13a by the carrier transfer mechanism 11. The third carrier C3 holds 25 substrates W arranged at a 10 mm pitch. Substrates W arranged at a 20 mm pitch are removed from the third carrier C3 and transferred to the HVC posture conversion unit 23. This transfer is performed by a handling robot HTR equipped with a manipulator 211 arranged at a 20 mm pitch.

[0155] Figure 11N The substrate W held by the HVC posture conversion unit 23 is then transferred to the pusher 251. Figure 11D The specific actions of the described tilting of the loading rod 231 and the clamping rod 232 are similar to those of Figure 11H The same is omitted.

[0156] As reference Figure 11NAs can be seen, in this case, the substrates W arranged at a 20 mm pitch are delivered to the pusher 251 without changing the pitch. The gripping grooves 252 of the pusher 251, which already hold substrates W from the initial substrate group, the first row, the second row, and the third row, are unable to hold any more substrates W. Therefore, the substrate W held by the HVC posture conversion unit 23 is transported to a position offset from the third row by one pitch of the gripping grooves 252 and is then positioned in the gripping grooves 252 there. This alignment of the substrate W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0157] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture conversion unit 23 to the push mechanism 25. At this time, the clamping grooves 252 of the pusher 251 have grooves clamping substrates W and empty grooves without clamping substrates W. The empty grooves are separated from each other by a distance six times the arrangement pitch of the clamping grooves 252. For the sake of convenience, Figure 11N The substrate W newly arranged on the pusher 251 is referred to as a fourth arrangement, or simply as a fourth substrate W4 .

[0158] Figure 11O The pusher 251 is shown as it is rotated half a circle by the pusher rotating mechanism 253. At this time, the pusher 251 is in the L state. Figure 11O The half rotation in is called the fifth half rotation r5. Figure 11O The dotted lines illustrate how the substrates W remaining on the third carrier C3 are transported to the HVC posture conversion unit 23. The substrates W remaining on the third carrier C3 are arranged at a 20 mm pitch. This transport is achieved by a handling robot HTR having robot arms 211 arranged at a 20 mm pitch.

[0159] Figure 11P The substrate W held by the HVC posture conversion unit 23 is then transferred to the pusher 251. Figure 11D The specific actions of the described tilting of the loading rod 231 and the clamping rod 232 are similar to those of Figure 11H The same is omitted.

[0160] As reference Figure 11PAs can be seen, in this case, the substrates W arranged at a 20 mm pitch are delivered to the pusher 251 without changing the pitch. The pusher 251 has gripping grooves 252 already holding substrates W from the initial substrate group, the first row, the second row, the third row, and the fourth row, and cannot hold any more substrates W. Therefore, the substrate W held by the HVC posture conversion unit 23 is transported to a position offset from the fourth row by one pitch in the gripping grooves 252 arrangement and is then gripped into the gripping grooves 252 there. This alignment of the substrates W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0161] In this way, the substrates W arranged at a pitch of 20 mm are delivered from the HVC posture conversion unit 23 to the push mechanism 25. At this time, the clamping grooves 252 of the pusher 251 all clamp the substrates W. Figure 11P The substrate W newly arranged on the pusher 251 is referred to as a fifth array, or simply as a fifth substrate W5 .

[0162] In this way, 75 substrates W are arranged at a pitch of 10 / 3 mm on the pusher 251. The substrate array thus generated is referred to as a batch BL.

[0163] 5. Batch consisting of transfer blocks

[0164] Figure 12 The orientation of the substrates W in the batch BL is described below. In the batch BL, the initial substrate W0 from the first carrier C1, the first substrate W1 from the first carrier C1, the second substrate W2 from the second carrier C2, the third substrate W3 from the second carrier C2, the fourth substrate W4 from the third carrier C3, and the fifth substrate W5 from the third carrier C3 are arranged in this order with a 10 / 3 mm pitch. The initial substrate W0, the second substrate W2, and the fourth substrate W4 are received from the HVC posture conversion unit 23 by the pusher 251 in the rightward-facing R position, so the orientation of these substrates W is aligned in one direction. On the other hand, the first substrate W1, the third substrate W3, and the fifth substrate W5 are received from the HVC posture conversion unit 23 by the pusher 251 in the leftward-facing L position, so the orientation of these substrates is aligned in the opposite direction.

[0165] That is, the device surface of the first substrate W1 faces the front surface of the initial substrate W0, the back surface of the second substrate W2 faces the back surface of the first substrate W1, the device surface of the third substrate W3 faces the device surface of the second substrate W2, the back surface of the fourth substrate W4 faces the back surface of the third substrate W3, the device surface of the fifth substrate W5 faces the device surface of the fourth substrate W4, and the back surface of the fifth substrate W5 faces the back surface of the initial substrate W0. In this way, the batch BL completed by the pusher 251 is formed by arranging the substrates W in a face-to-face manner.

[0166] If the substrates W are transferred while the pusher 251 is rotated as in this example, the substrates W can be arranged face to face to generate a batch BL based on the initial substrate W0, the first substrate W1, the second substrate W2, the third substrate W3, the fourth substrate W4, and the fifth substrate W5, all of which have the same orientation in one direction.

[0167] Next, the relationship between the clamping groove 252 of the pusher 251 and the substrates W will be described. The clamping groove 252 is located at six positions: the reference position P for the initial substrate W0; the first position P1 for the first substrate W1; the second position P2 for the second substrate W2; the third position P3 for the third substrate W3; the fourth position P4 for the fourth substrate W4; and the fifth position P5 for the fifth substrate W5. The reference positions P are arranged at 20 mm intervals within the pusher 251. The first position P1, second position P2, third position P3, fourth position P4, and fifth position P5 divide the 20 mm distance between the reference positions P into six equal parts. Specifically, the first position P1, second position P2, third position P3, fourth position P4, and fifth position P5 divide the 20 mm distance between the reference positions P into six equal parts. Therefore, the distance from the reference position P to the first position P1 is 1 / 3 of the 10 mm arrangement pitch of the substrates W in the carrier C, i.e., 10 / 3 mm. Similarly, the distance from the first position P1 to the second position P2, the distance from the second position P2 to the third position P3, the distance from the third position P3 to the fourth position P4, the distance from the fourth position P4 to the fifth position P5, and the distance from the fifth position P5 to the reference position P are all 10 / 3 mm.

[0168] Moreover, a substrate W facing in one direction is set at the reference position P, a substrate W facing in the opposite direction is set at the first position P1, a substrate W facing in one direction is set at the second position P2, a substrate W facing in the opposite direction is set at the third position P3, a substrate W facing in one direction is set at the fourth position P4, and a substrate W facing in the opposite direction is set at the fifth position P5.

[0169] 6. Maintaining batches in the transfer block

[0170] The transfer block 5 has two locations for holding the batches BL. One of these locations is a pusher 251. The pusher 251 is capable of reciprocating between an initial position, where it receives and delivers substrates W to the HVC posture conversion unit 23, and a transfer position PP, where it delivers the batches BL to the forward / reverse transport mechanism WTR. This reciprocating movement is achieved by a pusher shift mechanism 254.

[0171] The transfer block 5 includes a batch support 33 as a portion capable of holding the batches BL separately from the pusher 251. The batch support 33 is a batch holding portion for temporarily evacuating the batches BL when congestion of the batches BL occurs between the transfer block 5 and the processing block 6.

[0172] 7. Processing Block

[0173] The following is the Figure 1 The structure of the processing block 6 described above will now be explained. The processing block 6 is adjacent to the transfer block 5. The processing block 6 performs batch processing on the aforementioned batches BL. The processing block 6 is divided into a batch processing area R1 and a collective transfer area R2, which are arranged in the width direction (Y direction). Each area extends in the front-to-back direction (X direction). Specifically, the batch processing area R1 is located within the processing block 6. The collective transfer area R2 is adjacent to the batch processing area R1 and is located at the far left of the processing block 6.

[0174] The batch processing area R1 in the processing block 6 is a rectangular area extending in the front-to-back direction (X direction). One end (front side) of the batch processing area R1 is adjacent to the transfer block 5. The other end (rear side) of the batch processing area R1 extends away from the transfer block 5. The forward and backward transport mechanism WTR of the processing block 6 is used to transport the batch BL from the transfer block 5 to the processing block 6.

[0175] The forward / backward transport mechanism WTR collectively transports a plurality of vertically positioned substrates W between the transfer block 5, the batch processing units BPU1-BPU6, and the batch drying chamber DC. The forward / backward transport mechanism WTR can hold a batch BL consisting of substrates W arranged at a 10 / 3 mm pitch.

[0176] Batch processing region R1 includes a batch processing section for performing batch processing. Specifically, batch processing region R1 includes a batch drying chamber DC for collectively drying multiple substrates W, and a plurality of batch processing units BPU1 to BPU6 arranged along the direction in which batch processing region R1 extends, for collectively immersing multiple substrates W. Batch processing units BPU1 to BPU6 collectively immerse multiple substrates in a vertical position. The configuration of batch drying chamber DC and batch processing units BPU1 to BPU6 will be described in detail. Batch drying chamber DC is adjacent to transfer block 5 from the rear. First batch processing unit BPU1 is adjacent to batch drying chamber DC from the rear. Second batch processing unit BPU2 is adjacent to first batch processing unit BPU1 from the rear. Third batch processing unit BPU3 is adjacent to second batch processing unit BPU2 from the rear. Fourth batch processing unit BPU4 is adjacent to third batch processing unit BPU3 from the rear. Fifth batch processing unit BPU5 is adjacent to fourth batch processing unit BPU4 from the rear. The sixth batch processing unit BPU6 is adjacent to the rear of the fifth batch processing unit BPU5. Therefore, the batch drying chamber DC, the first batch processing unit BPU1, the second batch processing unit BPU2, the third batch processing unit BPU3, the fourth batch processing unit BPU4, the fifth batch processing unit BPU5, and the sixth batch processing unit BPU6 are arranged in this order to be separated from the transfer block 5.

[0177] Batch processing units BPU1-BPU6 have batch processing tanks capable of holding liquids. These tanks hold chemical solutions or pure water. The chemical solution is an acidic aqueous solution, such as a phosphoric acid solution. In this specification, the chemical solution and pure water are collectively referred to as the processing liquid. The batch processing tanks holding chemical solutions are referred to as batch chemical solution processing tanks CHB2-CHB6, and the batch processing tank holding pure water is referred to as batch rinse processing tank ONB.

[0178] Specifically, the second batch processing unit BPU2 includes a batch chemical liquid processing tank CHB2 for collectively processing the batches BL with chemical liquid, and a lifter LF2 for lifting the batches BL between the substrate transfer position and the chemical liquid processing position (see FIG. Figure 2 ). The substrate transfer position is a position set above the batch chemical liquid treatment tank CHB2 that can be accessed by the forward and backward transport mechanism WTR. The chemical liquid treatment position is a position set in the tank of the batch chemical liquid treatment tank CHB2 that can immerse the batch BL in the chemical liquid. The batch chemical liquid treatment tank CHB2 performs an acid treatment on the batch BL. The acid treatment can be a phosphoric acid treatment or a treatment using other acids. The phosphoric acid treatment etches the multiple substrates W that constitute the batch BL. The etching treatment chemically etches the nitride film on the surface of the substrate W, for example.

[0179] The lifter LF2 can hold a batch BL consisting of substrates W arranged at a 10 / 3 mm pitch. Like the lifter LF2, lifters installed in other processing tanks can also hold the batch BL. The batch drying chamber DC can accommodate the batch BL.

[0180] The batch chemical processing tank CHB2 contains an acid solution such as a phosphoric acid solution. The batch chemical processing tank CHB2 is equipped with an elevator LF2 that moves the batch lot BL up and down. The elevator LF2 moves up and down in the vertical direction (Z direction). Specifically, the elevator LF2 moves between a processing position within the batch chemical processing tank CHB2 and a transfer position above the batch chemical processing tank CHB2. The elevator LF2 holds the batch lot BL, which is composed of substrates W, in a vertical position. At the transfer position, the elevator LF2 transfers the batch lot BL between the forward and backward transport mechanism WTR. When the elevator LF2 descends from the transfer position to the processing position while holding the batch lot BL, the entire area of the substrate W is below the liquid surface of the chemical solution. When the elevator LF2 ascends from the processing position to the transfer position while holding the batch lot BL, the entire area of the substrate W is above the liquid surface of the chemical solution. The elevator LF2 can simultaneously immerse the batch lot BL in the batch processing tank. At this time, the elevator LF2 descends from the transfer position to the processing position.

[0181] Specifically, the third batch processing unit BPU3 includes a batch chemical liquid treatment tank CHB3 and an elevator LF3 for raising and lowering the batch lot BL between the substrate handover position and the chemical liquid treatment position. The batch chemical liquid treatment tank CHB3 has the same structure as the batch chemical liquid treatment tank CHB2 described above. That is, the batch chemical liquid treatment tank CHB3 contains the above-mentioned chemical liquid and is equipped with an elevator LF3. The batch chemical liquid treatment tank CHB3 performs the same treatment on the batch lot BL as the batch chemical liquid treatment tank CHB2. The substrate processing device 1 of this example includes multiple treatment tanks that can perform the same chemical liquid treatment. This is because phosphoric acid treatment takes more time than other treatments. Phosphoric acid treatment takes a longer time (for example, 60 minutes). Therefore, the device of this example can perform acid treatment in parallel through multiple batch chemical liquid treatment tanks.

[0182] The fourth through sixth batch processing units BPU4 through BPU6 have the same structure as the second and third batch processing units BPU2 and BPU3. Specifically, the fourth batch processing unit BPU4 includes a batch chemical liquid treatment tank CHB4 and an elevator LF4 for raising and lowering the batch lot BL between the substrate transfer position and the chemical liquid treatment position. Similarly, the fifth batch processing unit BPU5 includes a batch chemical liquid treatment tank CHB5 and an elevator LF5 for raising and lowering the batch lot BL between the substrate transfer position and the chemical liquid treatment position. Furthermore, the sixth batch processing unit BPU6 includes a batch chemical liquid treatment tank CHB6 and an elevator LF6 for raising and lowering the batch lot BL between the substrate transfer position and the chemical liquid treatment position. Therefore, the batch lot BL undergoes acid treatment in any of the batch chemical liquid treatment tanks CHB2 through CHB6. By performing chemical liquid treatment in parallel across five processing units in this manner, the throughput of the apparatus is improved.

[0183] Specifically, the first batch processing unit BPU1 includes a batch rinse tank ONB that holds a rinse liquid and an elevator LF1 that raises and lowers the batches BL between a substrate transfer position and a rinse position. The substrate transfer position is a location above the batch rinse tank ONB that can be accessed by the forward and backward transport mechanism WTR. The rinse position is a location within the batch rinse tank ONB that allows the batches BL to be immersed in the rinse liquid. The batch rinse tank ONB has the same structure as the batch chemical treatment tank CHB2 described above. That is, the batch rinse tank ONB holds a rinse liquid and is equipped with an elevator LF1. Unlike other treatment tanks, the batch rinse tank ONB holds pure water and is provided for cleaning chemical liquid adhered to multiple substrates W. In the batch rinse tank ONB, the cleaning process ends when the resistivity of the pure water within the tank rises to a predetermined value.

[0184] Thus, the batch rinsing tank ONB of this embodiment is located closer to the transfer block 5 than the batch chemical liquid processing tanks CHB2 through CHB6. This configuration allows the various mechanisms that comprise the transfer block 5 to be separated from the batch chemical liquid processing tanks CHB2 through CHB6 as much as possible, preventing the pusher mechanism 25 and other components from being adversely affected by acids such as phosphoric acid. Furthermore, by locating the transfer block 5 and batch drying chamber DC close together, batches B after rinsing are transported a short distance and returned directly to the transfer block 5.

[0185] 8. Collective transport area in the processing block

[0186] The batch transfer area R2 in the processing block 6 is a rectangular area extending in the front-to-back direction (X direction). It is located along the outer edge of the batch processing area R1, with one end extending to the transfer block 5 and the other end extending away from the transfer block 5.

[0187] The collective transfer area R2 is equipped with a forward / reverse transfer mechanism WTR for collectively transferring multiple substrates W. The forward / reverse transfer mechanism WTR collectively transfers multiple substrates W (specifically, batches BL) between the substrate transfer position PP, the batch support 33, the batch drying chamber DC, and each of the batch processing units BPU1-BPU6 within the transfer block 5. The forward / reverse transfer mechanism WTR is configured to reciprocate in the front-to-back direction (X direction) across the transfer block 5 and the processing block 6. In addition to the collective transfer area R2 within the processing block 6, the forward / reciprocating transfer mechanism WTR can also enter the substrate transfer position PP and the batch support 33 within the transfer block 5.

[0188] The forward-backward transport mechanism WTR is equipped with a pair of chucks 29 for transporting the batch lot BL. The pair of chucks 29 can be changed into a closed state in which they are close to each other and an open state in which they are separated from each other. The chuck 29 is a component extending in the Y direction and having grooves for holding the substrates W arranged at a pitch of 10 / 3 mm. The pair of chucks 29 is in a closed state to receive the multiple substrates W constituting the batch lot BL. Furthermore, the pair of chucks 29 is in an open state to deliver the multiple substrates W constituting the batch lot BL to other components (elevator LF1, etc.). The forward-backward transport mechanism WTR delivers the batch lot BL between the substrate delivery position PP in the transfer block 5 and the batch support portion 33. In addition, the forward-backward transport mechanism WTR delivers the batch lot BL between the elevators LF1 to LF6 belonging to the batch processing units BPU1 to BPU6 in the processing block 6 and the batch drying chamber DC.

[0189] The collective transport region R2 is equipped with a guide rail 31 extending in the X direction to guide the forward / retractable transport mechanism WTR. The forward / retractable transport mechanism WTR can move forward and backward in the X direction along this guide rail 31. Therefore, the guide rail 31 extends from the processing block 6 to the transfer block 5. More specifically, the guide rail 31 faces the substrate transfer position PP in the transfer block 5 in the Y direction and the sixth batch processing unit BPU6 in the processing block 6 in the Y direction. Furthermore, the guide rail 31 faces the batch support 33 in the transfer block 5, the batch drying chamber DC in the processing block 6, and the first to sixth batch processing units BPU1 to BPU6 in the Y direction.

[0190] 9. Other structures in the processing block

[0191] The batch drying chamber DC is arranged at a position sandwiched between the first batch processing unit BPU1 and the transfer block 5. The batch drying chamber DC has a drying chamber for accommodating batches BL in which substrates W are arranged in a vertical position. The drying chamber has an inert gas supply nozzle for supplying inert gas into the chamber and a steam supply nozzle for supplying vapor of an organic solvent into the tank. The batch drying chamber DC first supplies inert gas to the batches BL supported in the chamber, replacing the ambient air in the chamber with inert gas. Then, the pressure inside the chamber is started to be reduced. In the state where the chamber is depressurized, vapor of an organic solvent is supplied into the chamber. The organic solvent is discharged to the outside of the chamber along with the moisture attached to the substrates W. In this way, the batch drying chamber DC performs drying of the batches BL. The inert gas at this time can be, for example, nitrogen, and the organic solvent can be, for example, IPA (isopropyl alcohol).

[0192] The substrate processing apparatus 1 is arranged along the front-to-back direction, along the carrier loading shelf 13a, the batch drying chamber DC, and the batch processing units BPU1-BPU6. Specifically, the carrier loading shelf 13a is located at the front, with the batch drying chamber DC located behind it. The batch processing units BPU1-BPU6 are located further back. The substrate processing apparatus 1 of this embodiment optimizes the internal layout of the apparatus to minimize the travel distance of the forward / reverse transport mechanism WTR.

[0193] 10. Control Department

[0194] The control unit 131 of the substrate processing apparatus 1 can be referred to Figure 1 In addition, although Figure 1 Although not shown, a storage unit corresponding to the control unit 131 is provided. The control unit 131 is composed of, for example, a CPU (Central Processing Unit). The specific structure of the control unit is not limited; for example, each control unit may be composed of a single processor or may be composed of separate processors.

[0195] As controls related to the control unit 131, for example, there are controls related to the carrier transport mechanism 11, the handling robot HTR, the HVC posture conversion unit 23, the pushing mechanism 25, the forward and backward transport mechanism WTR, the batch processing units BPU1~BPU6, and the batch drying chamber DC.

[0196] The storage unit stores control-related programs, parameters, etc. The storage unit can be composed of a single device or a separate device corresponding to each control unit. In addition, the substrate processing system of this embodiment has no particular limitation on the structure of the device that realizes the storage unit.

[0197] 11. Substrate processing process

[0198] Below, refer to Figure 13 、 Figure 14 The flow chart of the substrate processing in this example is described.

[0199] Step S10: The handling robot HTR extracts every other initial substrate W0 from the first carrier C1. The extracted initial substrates W0 are arranged at a pitch of 20 mm.

[0200] Initially, the substrate W0 is shifted from a horizontal posture to a vertical posture. The pusher 251 takes the initial substrate W0 in the vertical posture. The first carrier C1 corresponds to the first carrier of the present invention.

[0201] Step S11: The handling robot HTR extracts the remaining first substrates W1 from the first carrier C1. The first substrates W1 are also arranged at a pitch of 20 mm. The HVC posture conversion unit 23 takes the first substrates W1.

[0202] Step S12: The pusher 251 of the initial substrate group, which is held in a vertical position, is rotated half a turn, thereby orienting the initial substrate group in one direction.

[0203] Step S13: The pusher 251 performs a batch assembly of the initial substrate W0 and the first substrate W1. The initial substrate group is assembled, with the first substrates W1 arranged in a first arrangement with 20 mm intervals, facing in opposite directions. The first substrates W1 are positioned at the first position P1 of the pusher 251. This arrangement positions the initial substrate W0 and the first substrate W1 with their device surfaces facing each other and at a 10 / 3 mm interval. Step S13 corresponds to the first assembly process of the present invention.

[0204] Step S14: The handling robot HTR extracts every other second substrate W2 from the second carrier C2. The extracted second substrates W2 are arranged at a 20 mm pitch. The HVC posture conversion unit 23 receives the second substrate W2. The second carrier C2 corresponds to the second carrier of the present invention.

[0205] Step S15 : performing a half-turn rotation of the pusher 251 holding the initial substrate W0 and the first substrate W1 .

[0206] Step S16: The pusher 251 batches the substrate array consisting of the initial substrate W0 and the first substrate W1 with the second substrate W2. This second array, in which the second substrates W2 are arranged in a single direction at intervals of 20 mm, is combined with the substrate array in the pusher 251, positioning the second substrates W2 at the second position P2 of the pusher 251. This positions the first and second substrates W1 and W2 with their backs facing each other and at intervals of 10 / 3 mm. Step S16 corresponds to the second assembly process of the present invention.

[0207] Step S17: The handling robot HTR extracts the remaining third substrates W3 from the second carrier C2. The third substrates W3 are arranged at a pitch of 20 mm. The HVC posture conversion unit 23 takes the third substrates W3.

[0208] Step S18 : performing a half-turn rotation of the pusher 251 holding the initial substrate W0 , the first substrate W1 , and the second substrate W2 .

[0209] Step S19: The pusher 251 batch-assembles the substrate array consisting of the initial substrate W0, the first substrate W1, and the second substrate W2 with the third substrate W3. The third array, in which the third substrates W3 are arranged in opposite directions with 20 mm intervals, is combined with the substrate array in the pusher 251, positioning the third substrate W3 at the third position P3 of the pusher 251. This positions the second and third substrates W2 and W3 with their device surfaces facing each other and at a 10 / 3 mm interval. Step S19 corresponds to the third assembly process of the present invention.

[0210] Step S20: The handling robot HTR removes every other fourth substrate W4 from the third carrier C3. The removed fourth substrates W4 are arranged at a 20 mm pitch. The HVC posture conversion unit 23 receives the fourth substrates W4. The third carrier C3 corresponds to the third carrier of the present invention.

[0211] Step S21 : performing a half-turn rotation of the pusher 251 holding the initial substrate W0 , the first substrate W1 , the second substrate W2 , and the third substrate W3 .

[0212] Step S22: The pusher 251 batch-assembles the fourth substrate W4 with the initial array of substrates W0, the first substrate W1, the second substrate W2, and the third substrate W3. The fourth array, in which the fourth substrates W4 are arranged at 20 mm intervals, is combined with the pusher 251 array, positioning the fourth substrates W4 at a fourth position P4 on the pusher 251. This positions the third and fourth substrates W3 and W4 with their backs facing each other and at a 10 / 3 mm interval. Step S22 corresponds to the fourth assembly process of the present invention.

[0213] Step S23: The handling robot HTR extracts the remaining fifth substrates W5 from the third carrier C3. The fifth substrates W5 are arranged at a pitch of 20 mm. The HVC posture conversion unit 23 receives the fifth substrates W5.

[0214] Step S24 : performing a half-turn rotation of the pusher 251 holding the initial substrate W0 , the first substrate W1 , the second substrate W2 , the third substrate W3 , and the fourth substrate W4 .

[0215] Step S25: The pusher 251 batch-assembles the substrate array consisting of the initial substrate W0, the first substrate W1, the second substrate W2, the third substrate W3, and the fourth substrate W4 with the fifth substrate W5. The fifth array, in which the fifth substrates W5 are arranged in opposite directions with 20 mm intervals, is combined with the substrate array in the pusher 251, positioning the fifth substrate W5 at the fifth position P5 of the pusher 251. This positions the fourth and fifth substrates W4 and W5 with their device surfaces facing each other and at a 10 / 3 mm interval. Step S25 corresponds to the third assembly process of the present invention.

[0216] Step S31 : The generated batch lot BL is transported from the transfer block 5 to the processing block 6 by the forward and backward transport mechanism WTR.

[0217] Step S32: Performing chemical liquid treatment on the batch BL. Step S32 corresponds to the processing procedure of the present invention.

[0218] Step S33: The batch BL is rinsed. Step S33 corresponds to the processing of the present invention.

[0219] Step S34: Drying the batch BL.

[0220] In this way, substrate processing is achieved in batch units.

[0221] Figure 14 The flowchart is shown when the substrate processing batch BL is returned to the carrier C. The operation of returning the substrate W is basically a chronological reversal of the above-mentioned method.

[0222] Step S41 : The substrate-processed batch BL is transported from the processing block 6 to the transfer block 5 by the forward / retractable transport mechanism WTR.

[0223] Step S42: The pusher 251 rotates half a circle after obtaining the batch BL. Through this action, the fifth substrate W5 originally facing in the opposite direction is turned in one direction.

[0224] Step S43 : The HVC posture conversion unit 23 receives the fifth substrate W5 from the batch BL in the pusher 251 and breaks the batch BL.

[0225] Step S44 : After the posture of the fifth substrate W5 is changed by the HVC posture changing unit 23 , the handling robot HTR returns the fifth substrate W5 to the third carrier C3 .

[0226] Step S45: The pusher 251 rotates half a circle. By this action, the fourth substrate W4, which was originally facing the opposite direction, faces one direction.

[0227] Step S46 : The HVC posture conversion unit 23 receives the fourth substrate W4 from the batch BL in the pusher 251 and breaks the batch BL.

[0228] Step S47 : After the fourth substrate W4 undergoes posture conversion by the HVC posture conversion unit 23 , it is returned to the third carrier C3 by the handling robot HTR.

[0229] Step S48: The pusher 251 rotates half a circle. By this action, the third substrate W3, which was originally facing the opposite direction, faces one direction.

[0230] Step S49 : The HVC posture conversion unit 23 receives the third substrate W3 from the batch BL in the pusher 251 and breaks the batch BL.

[0231] Step S50 : After the posture of the third substrate W3 is changed by the HVC posture changing unit 23 , the handling robot HTR returns the third substrate W3 to the second carrier C2 .

[0232] Step S51: The pusher 251 rotates half a circle. By this action, the second substrate W2 originally facing in the opposite direction is turned in one direction.

[0233] Step S52 : The HVC posture conversion unit 23 receives the second substrate W2 from the batch BL in the pusher 251 and breaks the batch BL.

[0234] Step S53 : After the posture of the second substrate W2 is changed by the HVC posture changing unit 23 , the handling robot HTR returns the second substrate W2 to the second carrier C2 .

[0235] Step S54: The pusher 251 rotates half a circle. By this action, the first substrate W1 originally facing in the opposite direction is turned in one direction.

[0236] Step S55 : The HVC posture conversion unit 23 receives the first substrate W1 from the batch BL in the pusher 251 and breaks the batch BL.

[0237] Step S56 : After the first substrate W1 undergoes posture conversion by the HVC posture conversion unit 23 , it is returned to the first carrier C1 by the handling robot HTR.

[0238] Step S57: The pusher 251 rotates half a circle. By this action, the substrate W0 originally facing in the opposite direction is turned in one direction.

[0239] Step S58: The HVC posture converter 23 receives the first substrate W0 from the batch BL in the pusher 251. After the HVC posture converter 23 converts the first substrate W0 into a new substrate, the handling robot HTR returns the substrate W0 to the first carrier C1.

[0240] 12. Effect of this example

[0241] As described above, according to the structure of this example, a substrate group arranged at a large pitch is obtained, and the first, second, third, fourth, and fifth arrays of substrates W are inserted into the gaps between the substrate group, thereby narrowing the pitch of the substrate group. This structure allows the relative position of the substrate group and the inserted substrates to be freely changed. Therefore, a new batch BL can be generated by combining a substrate group facing one direction, a first array consisting of first substrates W1 facing the opposite direction, a second array consisting of second substrates W2 facing the one direction, a third array consisting of third substrates W3 facing the opposite direction, a fourth array consisting of fourth substrates W4 facing the one direction, and a fifth array consisting of fifth substrates W5 facing the opposite direction. Consequently, the pitch of the substrates W can be narrowed, and the arrangement direction of the substrates W can be adjusted to the desired direction.

[0242] According to the configuration of this example, the front surface of the first substrate W1 in step S13 faces the front surface of the initial substrate group, the back surface of the second substrate W2 in step S16 faces the back surface of the first substrate W1, the front surface of the third substrate W3 in step S18 faces the front surface of the second substrate W2, the back surface of the fourth substrate W4 in step S22 faces the back surface of the third substrate W3, the front surface of the fifth substrate W5 in step S25 faces the front surface of the fourth substrate W4, and the back surface of the fifth substrate W5 faces the back surface of the initial substrate group. According to this example, a batch BL with the front and back surfaces aligned in this manner can be generated.

[0243] According to the configuration of this example, step S13 is performed after a first arrangement of first substrates facing in one direction at predetermined intervals is rotated half a turn, step S18 is performed after a third arrangement of third substrates facing in one direction at predetermined intervals is rotated half a turn, and step S25 is performed after a fifth arrangement of fifth substrates facing in one direction at predetermined intervals is rotated half a turn. In this way, the generation of a batch BL column can be completed by receiving a group of substrates arranged in one direction from the carrier C.

[0244] According to the configuration of this example, the first step of collectively receiving the substrates W from the carrier C, which stores the substrates W in a horizontal position and arranges them in a vertical direction, and the second step of collectively converting the position of the substrates W from a horizontal position to a vertical position are performed before each assembly process. With this configuration, a batch BL can be created by receiving a group of substrates arranged in a single direction from the carrier C.

[0245] According to the configuration of this example, the distance from the first position P1 to the second position P2 is 1 / 3 of the specific pitch of 10 mm in the carrier C. With this configuration, the pitch of the generated substrate array can be made less than 1 / 2 of the array pitch of the substrates W accommodated in the carrier C.

[0246] According to the structure of this example, the steps related to the batch group are performed in the order of step S13 for the first substrate W1, step S16 for the second substrate W2, step S18 for the third substrate W3, step S22 for the fourth substrate W4, and step S25 for the fifth substrate W5. This structure makes it easy to generate a batch BL.

[0247] According to the structure of this example, the initial substrate group is obtained from the first carrier C, the first array is obtained from the first carrier C, the second array is obtained from the second carrier C, the third array is obtained from the second carrier C, the fourth array is obtained from the third carrier C, and the fifth array is obtained from the third carrier C. With this structure, a batch BL can be easily generated from multiple carriers C.

[0248] According to the configuration of this example, the first position P1, the second position P2, the third position P3, the fourth position P4, and the fifth position P5 divide the predetermined interval, 20 mm, into six equal parts.

[0249] According to the structure of this embodiment, every other substrate W is pulled out from the first carrier C1 to generate the initial substrate group. With this structure, the initial substrate group can be easily generated.

[0250] 13. Modification

[0251] The present invention is not limited to the configuration of the above-described embodiment, and can be implemented in various modifications as described below.

[0252] <Variation 1>

[0253] According to the above structure, batch assembly is performed in the order of the first substrate W1, the second substrate W2, the third substrate W3, the fourth substrate W4, and the fifth substrate W5. However, this order can be changed to any order. In particular, if the order is changed to batch assembly the first substrate W1, the third substrate W3, and the fifth substrate W5 together, the half-turn rotation of the pusher 251 can be partially omitted.

[0254] <Variation 2>

[0255] The handling robot HTR of the above-mentioned structure is configured to be able to take only about half of the substrates W in the carrier C at a time, but the present invention is not limited to this structure. Figure 15As shown, the present invention can also be applied to a substrate processing apparatus including a handling robot HTR in which the robot hands 211 are arranged at a pitch of 10 mm.

[0256] Hereinafter, a method for transporting the substrate W according to this modification will be described. Figure 16A The arrangement pitch of the substrates in each structure is compared: On the carrier C, the mounting plates 7 constituting the slits S are arranged at a pitch of 10 mm.

[0257] On the other hand, the HVC posture conversion unit 23 can only hold 13 substrates W, approximately half of the 25 substrates stored in the carrier C, at a time. This is because the flat plates 233 of the placement bars 231 are arranged at 20 mm intervals. Also, the clamping plates 234 of the clamping bars 232 are arranged at 20 mm intervals.

[0258] The handling robot HTR of this modification can hold 25 substrates W stored in the carrier C at a time. This is because the robot hands 211 of the handling robot HTR are arranged at a pitch of 10 mm.

[0259] According to this variation, even if the handling robot HTR can hold 25 substrates W stored in the carrier C at one time, it cannot deliver all of the held substrates W to the HVC posture conversion unit 23 at once. Therefore, the handling robot HTR in this variation is configured to deliver approximately half of the substrates W stored in the carrier C to the HVC posture conversion unit 23 and temporarily hold the remaining half. The remaining substrates W held by the handling robot HTR are delivered to the HVC posture conversion unit 23 at the next opportunity.

[0260] Figure 16B The figure simply shows a state where 25 substrates W are arranged on the carrier C. On the carrier C, the 25 substrates W are arranged at a pitch of 10 mm.

[0261] Figure 16C The handling robot HTR is shown pulling all the substrates W accommodated in the carrier C out of the carrier C. The handling robot HTR has robot hands 211 arranged vertically at a pitch of 10 mm. Therefore, the handling robot HTR can hold all the substrates W in the carrier C1 at once.

[0262] Figure 16DThe figure shows the state when the handling robot HTR delivers about half of the substrate W it is holding to the HVC posture conversion unit 23. The handling robot HTR causes the manipulator 211 to enter between a pair of loading rods 231 in the HVC posture conversion unit 23. Then, the loading rods 231 support a portion of the conveyed substrate W via the flat plate 233. Specifically, the loading rods 231 selectively support the substrates W conveyed by the handling robot HTR in such a manner that the substrates W to be supported and the substrates W not to be supported are arranged alternately. The substrates W to be supported are arranged at a pitch of 20 mm. The substrates W not to be supported are also arranged at a pitch of 20 mm. The adjacent substrates W to be supported and the substrates W not to be supported are separated by 10 mm.

[0263] The handling robot HTR partially releases its grip on the substrate W. In other words, the handling robot HTR releases its grip on the substrate W supported by the placement rods 231. In this way, the substrates W arranged at a pitch of 20 mm are transferred from the handling robot HTR to the posture conversion unit 23.

[0264] On the other hand, the grip of the substrate W by the handling robot HTR is not released for the substrate W that is not to be supported by the placement pins 321 .

[0265] Figure 16D The figure shows how the operating robot HTR subsequently withdraws the manipulator 211 from the HVC posture conversion unit 23. Such measures are taken so that the manipulator 211 does not hinder the standing of the substrate W during the posture conversion of the substrate W to be performed later. The operating robot HTR withdraws the manipulator 211 from the HVC posture conversion unit 23 while holding the substrate W outside the support object. On the other hand, the substrate W of the support object is left in the HVC posture conversion unit 23 by the movement of the manipulator 211. Among these, the substrates W that have been delivered to the HVC posture conversion unit 23 are arranged at a pitch of 20 mm, so that they can be aligned with the substrates W that have been delivered to the HVC posture conversion unit 23. Figure 11A to Figure 11P The substrates W supported by the HVC posture conversion unit 23 described above are handled equivalently. That is, these substrates W can be used to perform the same operations as the batch combination described in the embodiment.

[0266] exist Figure 16D The substrate W remaining outside the support object of the handling robot HTR is delivered to the HVC posture conversion unit 23 at the next opportunity.

[0267] Figure 16E Shown Figure 16D The HVC posture conversion unit 23 has completed delivering the substrate W to the pusher 251. All the flat plates 233 of the placement rods 231 are in an empty state without supporting a substrate W. Therefore, in this state, the substrate W left on the handling robot HTR can be received.

[0268] Figure 16F The figure shows the operation of the operating robot HTR delivering the remaining substrates W it holds to the HVC posture conversion unit 23. The operating robot HTR causes the manipulator 211 to enter between a pair of loading rods 231 in the HVC posture conversion unit 23. The remaining substrates W are arranged at a pitch of 20 mm on the operating robot HTR, and the flat plates 233 are arranged at a pitch of 20 mm on the loading rods 231. Therefore, the operating robot HTR can deliver all the remaining substrates W to the HVC posture conversion unit 23. The substrates W delivered to the HVC posture conversion unit 23 are arranged at a pitch of 20 mm, so they can be aligned with the substrates in the HVC posture conversion unit 23. Figure 11A to Figure 11P The substrates W supported by the HVC posture conversion unit 23 described in the above are processed equivalently. That is, the same operation as the batch combination described in the embodiment can be performed using these substrates W.

[0269] In addition, Figure 16E When the second substrate W is delivered, the robot 211 moves to the position Figure 16D The robot arm 211 then moves horizontally from this position and enters the HVC posture conversion unit 23. This prevents the placement rods 231 from being left idle during the transfer of substrates W, allowing for reliable transfer of substrates W.

[0270] As described above, according to this variation, all substrates W are removed from the carrier C at once. As the substrates are transitioned from a horizontal position to a vertical position, alternate substrates are removed one at a time. This separates the substrates W, which are arranged at 10 mm pitch, into substrates W to be supported, arranged at 20 mm pitch, and substrates W not to be supported, arranged at 20 mm pitch. Specifically, the first, second, and fourth substrates W0, W2, and W4 are substrates W to be supported, while the first, third, and fifth substrates W1, W3, and W5 are substrates W not to be supported. This structure allows for reliable production of each substrate.

Claims

1. A substrate processing method for processing multiple substrates at once, characterized in that: It has the process of generating and processing the substrate group. In the process of generating the substrate group, a plurality of substrates are taken out from a carrier on which substrates defined by the front and back surfaces are arranged at a specific pitch, and a substrate group is generated in which the substrates are arranged in one direction at a pitch twice the specific pitch. In the above treatment process, the following assembly processes are performed in an arbitrary order to generate batches, and the batches are immersed in the treatment liquid. The above assembly processes include: In a first assembly process, a first arrangement in which first substrates facing in a direction opposite to the one direction are arranged at predetermined intervals twice the specific interval is combined with the substrate group, so that the first substrate is located at a first position among a first position, a second position, a third position, a fourth position, and a fifth position that divides the predetermined interval in the substrate group into six parts; In a second assembly process, the second substrates are arranged in the first direction at predetermined intervals and are combined with the substrate group, thereby positioning the second substrates at the second position. In a third assembly process, the third substrates are arranged in the opposite direction at predetermined intervals and are combined with the substrate group to form a third arrangement, thereby positioning the third substrates at the third position. a fourth assembly process, combining a fourth arrangement of fourth substrates facing the one direction and spaced apart at predetermined intervals with the substrate group, thereby positioning the fourth substrate at the fourth position; and In a fifth assembly process, a fifth arrangement of fifth substrates facing the opposite direction and spaced apart at predetermined intervals is combined with the substrate group, thereby positioning the fifth substrate at the fifth position.

2. The substrate processing method according to claim 1, wherein: The surface of the first substrate in the first assembly process is opposite to the surface of the substrate group. The back surface of the second substrate in the second assembly process is opposite to the back surface of the first substrate. The surface of the third substrate in the third assembly process is opposite to the surface of the second substrate. The back surface of the fourth substrate in the fourth assembly process is opposite to the back surface of the third substrate. In the fifth assembly process, the surface of the fifth substrate faces the surface of the fourth substrate, and the back surface of the fifth substrate faces the back surface of the substrate group.

3. The substrate processing method according to claim 1, wherein: The first assembly process is performed after the first arrangement of the first substrates facing the one direction and spaced apart by the predetermined interval is rotated half a circle. The third assembly process is performed after the third arrangement of the third substrates facing the one direction and spaced apart by the predetermined interval is rotated half a circle. The fifth assembly process is performed after the fifth arrangement, in which the fifth substrates facing the one direction are spaced apart by the predetermined interval, is rotated half a circle.

4. The substrate processing method according to claim 1, wherein: The distance from the first position to the second position is 1 / 3 of the specific spacing in the carrier.

5. The substrate processing method according to claim 1, wherein: The assembly processes are performed in the order of the first assembly process, the second assembly process, the third assembly process, the fourth assembly process, and the fifth assembly process.

6. The substrate processing method according to claim 5, wherein: The substrate group is obtained from a first substrate storage carrier that arranges horizontal substrates in a vertical direction. Obtain the first arrangement from the first carrier, The second arrangement is obtained from a second substrate storage carrier that arranges substrates in a horizontal position in a vertical direction. Obtain the third arrangement from the second carrier, The fourth arrangement is obtained from a third substrate storage carrier that arranges substrates in a horizontal position in a vertical direction. The fifth arrangement is obtained from the third carrier.

7. The substrate processing method according to claim 1, wherein: The first position, the second position, the third position, the fourth position, and the fifth position divide the predetermined interval into six equal parts.

8. The substrate processing method according to claim 1, wherein: The substrate group generating process extracts every other substrate from the carrier to generate the substrate group.

9. The substrate processing method according to claim 1, wherein: The substrate group generating process generates the substrate group by extracting every other substrate in a process of converting the substrate from a horizontal position to a vertical position after all substrates are extracted from the carrier.

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