Power assembly and vehicle

Abstract

The invention relates to a power assembly and a vehicle, belongs to the technical field of vehicles, and aims to at least solve the problems of low heat dissipation efficiency, large three-phase junction temperature difference, high system pressure drop and insufficient platformization flexibility of a heat dissipation water channel of a power module in the prior art. The power assembly provided by the invention comprises a base and a plurality of power modules connected to the base, the base is provided with a heat dissipation flow channel, the plurality of power modules are in thermal conduction with the heat dissipation flow channel, and the heat dissipation efficiency of the plurality of power modules through the heat dissipation flow channel is consistent.

Description

Technical Field

[0001] The present invention relates to the technical field of vehicles, and in particular to a power component and a vehicle. Background Art

[0002] In the automotive-grade power semiconductor field for new energy vehicles, power modules, as core components of inverters, have a direct impact on vehicle reliability and efficiency. With the widespread adoption of 800V high-voltage platforms and SiC (Silicon Carbide) chips, the integration and thermal density of power modules have increased significantly. While chip size has decreased, heat generation has increased significantly, leading to increased junction temperature, widening the junction temperature difference between individual power modules, and even causing module failure. Therefore, designing an efficient heat sink that balances heat dissipation efficiency and junction temperature control has become a key technical challenge.

[0003] Existing power module heat sinks eliminate the gap between the PinFin (pin-fin) heat sink and the heat dissipation water channel by providing blind holes in the baseplate, allowing the coolant to fully contact the PinFin heat sink and increasing the flow rate, thereby improving heat dissipation efficiency. However, this solution has several drawbacks: First, the increased flow rate leads to increased energy loss when the coolant contacts the PinFin heat sink, significantly increasing the system pressure drop and placing higher demands on the water pump performance; second, this structure does not account for temperature differences between the power modules. The coolant gradually heats up along the flow direction, resulting in lower temperatures for the power modules near the inlet side and significantly higher temperatures for the power modules near the outlet side. This results in a large difference in junction temperature between the power modules, seriously affecting the lifespan and stability of the power modules.

[0004] In addition, some existing technologies use a microchannel liquid cooling plate design, which achieves efficient heat dissipation by etching staggered microchannels on both sides of the substrate. Although this solution can improve heat dissipation efficiency through high specific surface area, its tiny channel structure leads to a significant increase in fluid flow resistance, and the system pressure drop is higher than the traditional structure. In addition, the flow uniformity of the coolant in the microchannel is poor, which can easily cause local overheating. In addition, microchannel manufacturing relies on high-precision etching or 3D printing processes, with high equipment and technical barriers. The processing cost is higher than the traditional PinFin heat dissipation substrate structure, and it is difficult to adapt to the iterative upgrade needs of different power modules. Summary of the Invention

[0005] One of the purposes of the present invention is to provide a power component to solve the problems of low heat dissipation efficiency, large three-phase junction temperature difference, high system pressure drop and insufficient platform flexibility in the power module heat dissipation water channel in the prior art; the second purpose is to provide a vehicle.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is as follows: According to the first aspect of the present application, a power component includes a base and multiple power modules connected to the base. The base is provided with a heat dissipation channel. The multiple power modules are thermally connected to the heat dissipation channel. The heat dissipation efficiency of the multiple power modules through the heat dissipation channel is consistent.

[0007] According to the above technical means, through the reasonable design of the heat dissipation flow channel structure, the heat dissipation efficiency of multiple power modules is made consistent, which effectively solves the problem of large junction temperature difference among the power modules, ensures the balance of performance of each power module, and improves the stability and reliability of the entire power component.

[0008] In some optional embodiments, the heat dissipation channel has a liquid inlet hole and a liquid discharge hole, and an extension direction of the heat dissipation channel from the liquid inlet hole to the liquid discharge hole is consistent with an arrangement direction of the multiple power modules.

[0009] According to the above technical means, the coolant flows through each power module in sequence, which facilitates continuous heat dissipation of multiple power modules. The structure is relatively simple and targeted heat dissipation design can be performed according to the arrangement order of the power modules.

[0010] In some optional embodiments, the cross-sectional area of the heat dissipation channel gradually decreases from the liquid inlet hole to the liquid discharge hole.

[0011] According to the above technical means, as the coolant flows, the cross-sectional area of the heat dissipation channel gradually decreases, so that the flow rate of the coolant gradually increases, so that when the coolant temperature gradually increases, it can still maintain a good heat dissipation effect, balance the cooling efficiency between each power module, and further reduce the junction temperature difference between each power module.

[0012] In some optional embodiments, the base includes a bottom wall and a top wall located on opposite sides of the heat dissipation channel, the top wall is used to install multiple power modules, and the liquid inlet and liquid drain holes are provided on the bottom wall; the surface of the bottom wall facing the top wall is the first surface, and from the liquid inlet hole to the liquid drain hole, the first surface is inclined toward the top wall.

[0013] The above technical approach forms a sloped structure, gradually reducing the distance between the power modules and the cooling water channel. This results in a slow flow and low temperature of the coolant below the power module near the liquid inlet. As the coolant flows toward the remaining power modules, the flow speed and temperature gradually increase, balancing the cooling effect across the power modules, reducing the maximum junction temperature difference across the modules, and lowering the voltage drop.

[0014] In some optional embodiments, the heat dissipation channel includes a first main channel, a second main channel, and multiple branch channels connected between the first main channel and the second main channel, the first main channel has a liquid inlet hole, the second main channel has a liquid discharge hole, and the multiple power modules are thermally connected to the multiple branch channels respectively.

[0015] According to the above technical means, the coolant can enter multiple branch channels at the same time to dissipate heat for each power module respectively, thereby improving the heat dissipation efficiency and being able to more flexibly control the heat dissipation of each power module.

[0016] In some optional embodiments, the positions of the first main channel connecting multiple branch channels are arranged in sequence from the end close to the liquid inlet hole to the end away from the liquid inlet hole, and the cross-sectional size of the first main channel gradually decreases from the end close to the liquid inlet hole to the end away from the liquid inlet hole; among the multiple branch channels, the branch channel close to the liquid inlet hole is the first branch channel, and the branch channel away from the liquid inlet hole is the second branch channel, and the cross-sectional size of the second main channel gradually increases from the end connected to the first branch channel to the end connected to the second branch channel.

[0017] According to the above technical means, by rationally designing the cross-sectional dimension changes of the first main channel and the second main channel, the coolant can be more evenly distributed to each branch channel, thus avoiding the problem of excessive or insufficient coolant flow in some branch channels, further improving the balance of heat dissipation of each power module, and reducing the junction temperature difference of each power module.

[0018] In some optional embodiments, the first main channel and the second main channel are located in the same layer, and the plurality of branch channels are stacked with the first main channel and the second main channel.

[0019] According to the above technical means, this stacked structure makes the spatial layout of the power components more compact, reduces the overall volume, and also facilitates the flow of coolant between the main channel and the branch channel, thereby improving the heat dissipation efficiency.

[0020] In some optional embodiments, the extension direction of the first main channel from one end close to the liquid inlet to one end away from the liquid inlet is parallel to the extension direction of the second main channel from one end connected to the first branch channel to one end connected to the second branch channel.

[0021] According to the above technical means, the parallel arrangement of the first main channel and the second main channel makes the flow of the coolant in the main channel smoother, reduces the flow resistance, reduces the system pressure drop, and also facilitates the connection of the branch channels and the distribution of the coolant.

[0022] In some optional embodiments, the plurality of branch channels are arranged in sequence along the extension direction of the first main channel and the extension direction of the second main channel.

[0023] According to the above technical means, the orderly arrangement of the branch channels enables each power module to contact the coolant more evenly, thereby improving the uniformity of heat dissipation and further reducing the junction temperature difference of each power module.

[0024] In some optional embodiments, the portion of the base located between the first main channel and the second main channel is a connecting rib, and the connecting rib is inclined from one end to the other end relative to the extension direction of the first main channel and the extension direction of the second main channel.

[0025] According to the above technical means, the inclined connecting ribs can guide the flow of coolant between the main channel and the branch channel, so that the coolant can participate in heat exchange more fully, improve the heat dissipation efficiency, and also enhance the structural strength of the base.

[0026] In some optional embodiments, the extension path of the connecting rib from one end to the other end is stepped.

[0027] According to the above technical means, the connecting ribs of the stepped structure can further balance the coolant flow of heat exchange of each functional module, reduce the situation where some coolant flows directly out of the outlet, and enable the coolant under each functional module to fully participate in heat exchange, thereby improving cooling efficiency and reducing the junction temperature difference of each functional module.

[0028] In some optional embodiments, the power module includes a power device, a heat dissipation substrate provided on the power device, and heat dissipation fins provided on a surface of the heat dissipation substrate facing away from the power device, wherein the heat dissipation fins are provided in the heat dissipation channel.

[0029] According to the above technical means, the heat dissipation area is increased by providing heat dissipation fins, the heat dissipation efficiency is improved, the heat generated by the power device can be more effectively transferred to the coolant, and the chip junction temperature is reduced.

[0030] In some optional embodiments, the heat dissipation channel has a liquid inlet hole and a liquid discharge hole, at least one of the liquid inlet hole and the liquid discharge hole includes a main body section and a flared section, and the flared section is connected between the main body section and the heat dissipation channel.

[0031] According to the above technical means, by setting a gradual expansion structure at the coolant inlet and outlet, the pressure loss of the coolant can be reduced, the pressure drop of the system can be reduced, thereby reducing energy consumption and improving the efficiency of the entire system.

[0032] According to a second aspect of the present application, the present application provides a vehicle, which includes the above-mentioned power assembly.

[0033] According to the above technical means, by applying high-performance power components to vehicles, the performance and reliability of the vehicle's power modules can be improved, the vehicle's heat dissipation requirements for high-voltage platform power semiconductor modules can be met, and the overall performance and stability of the vehicle can be improved.

[0034] Beneficial effects of the present invention: (1) The present invention effectively reduces the chip junction temperature by setting a ramp or step structure in the series path and setting a step or ramp structure in the parallel path, thereby reducing the junction temperature difference of each power module and reducing the system voltage drop; (2) The present invention adopts a wavy heat dissipation substrate structure to increase the heat dissipation area and turbulence effect, thereby improving the heat exchange efficiency; (3) The present invention reduces pressure loss and system pressure drop by designing the coolant inlet and outlet into a gradually expanding structure; (4) The present invention can set the slope-type or step-type structure as an independent replaceable structure, which has high platform flexibility and is conducive to product iteration and upgrading. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of the packaging structure of a power module provided by the present invention; Figure 2 A schematic structural diagram of a series heat dissipation substrate provided by the present invention; Figure 3 A schematic structural diagram of a parallel heat dissipation substrate provided by the present invention; Figure 4 A schematic diagram of the connection structure between a power module and a series heat dissipation channel provided by the present invention; Figure 5 This is a left view of the connection structure between a power module and a series heat dissipation channel provided by the present invention; Figure 6 A front view of a series heat dissipation channel structure provided by the present invention; Figure 7 A top view of a series heat dissipation channel structure provided by the present invention; Figure 8 A left side view of a series heat dissipation channel structure provided by the present invention; Figure 9 A schematic diagram of the connection structure between a power module and parallel heat dissipation channels provided by the present invention; Figure 10 A left view of the connection structure between a power module and parallel heat dissipation channels provided by the present invention; Figure 11 A bottom view of a parallel heat dissipation channel structure provided by the present invention; Figure 12 A top view of a parallel heat dissipation channel structure provided by the present invention; Figure 13 A front view of a parallel heat dissipation channel structure provided by the present invention; Figure 14 This is a left view of a parallel heat dissipation channel structure provided by the present invention.

[0036] Among them, 100, power component; 10, base; 11, bottom wall; 12, top wall; 20, power module; 21, power device; 22, heat dissipation substrate; 23, heat dissipation fins; 30, heat dissipation channel; 31, first main channel; 32, second main channel; 33, branch channel; 310, liquid inlet hole; 320, liquid drain hole; 301, main section; 302, flared section; 40, connecting rib. DETAILED DESCRIPTION

[0037] The following describes the embodiments of the present invention with reference to the accompanying drawings and preferred embodiments. Those skilled in the art will readily appreciate the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the various details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are intended only to illustrate the present invention and are not intended to limit the scope of protection of the present invention.

[0038] It should be noted that the illustrations provided in the following embodiments are merely schematic illustrations of the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0039] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0040] In the description of the embodiments of the present application, the term "plurality" refers to more than two (including two).

[0041] In some embodiments, embodiments of the present application provide a vehicle. The embodiments of the present application do not specifically limit the specific type of vehicle. For example, the vehicle provided in the embodiments of the present application may be an electric vehicle, a hybrid vehicle, or a solar-powered vehicle. Furthermore, the vehicle provided in the embodiments of the present application may also be a vehicle of different forms. For example, the vehicle provided in the embodiments of the present application may be a sedan, a sport utility vehicle (SUV), or a multi-purpose vehicle (MPV).

[0042] Next, see Figures 1-14 , the power groups provided in some embodiments of the present application will be described.

[0043] In some embodiments, see Figures 1-14 This application proposes a power assembly comprising a base 10 and a plurality of power modules 20 connected to the base 10. The base 10 is provided with a heat dissipation channel 30. The plurality of power modules 20 are thermally connected to the heat dissipation channel 30, and the heat dissipation efficiency of the plurality of power modules 20 through the heat dissipation channel 30 is consistent. It should be noted that the heat dissipation channel 30 described in this embodiment is used to allow the flow of a coolant, wherein the coolant can be a water-based coolant, an oil-based coolant, a fluorinated liquid (electronic fluorinated liquid), a boiling coolant (e.g., boiling electronic fluorinated liquid), etc.

[0044] It should be noted that the multiple power modules 20 described in this embodiment may be two, three, four, five, six power modules 20, etc. The specific number of settings can be designed and configured according to the specific vehicle model and technical requirements (for example, three power modules 20), which is not limited here.

[0045] It should be noted that consistent heat dissipation efficiency across the multiple power modules 20 through the heat dissipation channels 30 means that during operation, the heat transfer capacity across the multiple power modules through the heat dissipation channels is balanced, thereby controlling the junction temperature differences between the modules within a reasonable range. "Consistent" here does not require absolute consistency; rather, a reasonable degree of variation is permitted in practical engineering.

[0046] Exemplarily, multiple power modules 20 are thermally connected to the heat dissipation channel 30 respectively. At least part of the power module 20 can be placed in the heat dissipation channel 30, and heat exchange with the power module 20 can be achieved by flowing coolant through the heat dissipation channel 30.

[0047] It should be noted that at least a portion of the power module 20 described in this embodiment refers to the physical contact between the key components in the power module that directly participate in heat conduction (such as heat sink fins, heat sink substrate, etc.) and the heat dissipation flow channel. The core of this is to enable heat to be efficiently transferred to the coolant through structural design.

[0048] On this basis, by optimizing the structure of the heat dissipation channel 30, the coolant flow rate, flow velocity, and temperature distribution beneath each power module 20 are uniform, thereby achieving consistent heat dissipation efficiency. This effectively solves the problem of large junction temperature differences between the power modules, ensures balanced performance among the power modules, and improves the stability and reliability of the entire power assembly.

[0049] In some embodiments, see Figure 4-Figure 8 The heat dissipation channel 30 has a liquid inlet hole 310 and a liquid outlet hole 320 . The extension direction of the heat dissipation channel 30 from the liquid inlet hole 310 to the liquid outlet hole 320 is consistent with the arrangement direction of the multiple power modules 20 .

[0050] On this basis, since the extension direction of the heat dissipation channel 30 is consistent with the arrangement direction of the multiple power modules 20, the coolant entering the heat dissipation channel 30 flows through each power module 20 in sequence to achieve continuous heat dissipation for the multiple power modules 20.

[0051] In some embodiments, see Figure 4 and Figure 6 From the liquid inlet hole 310 to the liquid outlet hole 320 , the cross-sectional area of the heat dissipation channel 30 gradually decreases.

[0052] For example, to achieve a gradually decreasing cross-sectional area of the heat dissipation channel 30, the bottom surface of the heat dissipation channel 30 can be configured as an inclined slope, or an inclined guide plate can be provided within the heat dissipation channel 30, with the guide plate and the slope tilted upward toward the drainage hole 320. Alternatively, the heat dissipation channel 30 can be configured as a stepped pipe, where the cross-sectional area of the pipe gradually decreases from one end near the liquid inlet hole 310 to the other end.

[0053] Specifically, when the heat dissipation channel is a series structure, the cross-sectional area of the heat dissipation channel 30 gradually decreases from the liquid inlet hole 310 to the liquid discharge hole 320, so that the flow rate of the coolant entering the heat dissipation channel 30 gradually accelerates, so that when the coolant temperature gradually increases, it can still maintain a good heat dissipation effect, balance the cooling efficiency between the power modules 20, and further reduce the junction temperature difference between the power modules 20.

[0054] It is understood that by designing the cross-sectional area of the heat dissipation channel 30 to gradually decrease from the liquid inlet hole 310 to the liquid outlet hole 320, the coolant can have a slow flow rate and low temperature in the area near the liquid inlet hole 310 due to the larger cross-sectional area of the heat dissipation channel 30 near the liquid inlet hole 310. According to the principles of fluid mechanics, a slow flow rate means that the coolant stays longer in the area near the liquid inlet hole 310, fully absorbing the heat from the power module 20 near the liquid inlet hole 310, causing the coolant's own temperature to rise. The heated coolant does not accumulate rapidly, but gradually flows to the remaining power modules 20. At this time, the coolant that first flows through the liquid inlet hole 310 has already carried some heat. When flowing through the remaining power modules 20, the cross-sectional area of the heat dissipation channel 30 gradually decreases, and the flow rate increases, quickly flushing the surfaces of the remaining power modules 20 and removing more heat. That is, the power module 20 close to the liquid inlet hole 310 is fully heat-absorbed at low speed and low temperature by the coolant, and the other power modules 20 dissipate heat through high-speed strong convection, thereby avoiding a certain power module 20 from having too high a temperature due to untimely heat dissipation, thereby balancing the junction temperature difference between the power modules 20.

[0055] In some embodiments, see Figure 4The base 10 includes a bottom wall 11 and a top wall 12 located on opposite sides of the heat dissipation channel 30. The top wall 12 is used to mount multiple power modules 20. A liquid inlet 310 and a liquid drain hole 320 are provided on the bottom wall 11. The surface of the bottom wall 11 facing the top wall 12 is a first surface. From the liquid inlet 310 to the liquid drain hole 320, the first surface is inclined toward the top wall 12. The inclination angle of the first surface can be designed according to actual conditions and is not limited here.

[0056] It should be noted that the top wall 12 described in this embodiment may be a connecting rib between two adjacent power modules 20 .

[0057] For example, multiple power modules 20 are thermally connected to the heat dissipation channel 30. The heat dissipation substrate 22 of the power module 20 can be fixed to the top wall 12 of the base 10 by mechanical pressing or welding. The top wall 12 is the upper wall surface of the heat dissipation channel 30. The contact surface between the heat dissipation substrate 22 and the top wall 12 can be achieved through precision machining to ensure that there is no gap. Heat is transferred from the power device 21 to the heat dissipation substrate 22, the top wall 12 of the base, and then to the coolant in the channel. The conduction path is short and relies on the high thermal conductivity of the metal substrate (such as copper or aluminum). It is suitable for modules with uniform heating and moderate power density (such as IGBT modules); the channel structure needs to be simplified (no fin insertion position needs to be designed).

[0058] On this basis, by forming a sloped structure (the first surface slopes toward the top wall 12), the cross-sectional area of the heat dissipation channel 30 gradually decreases from the liquid inlet 310 to the liquid outlet 320. For example, the initial cross-sectional area is A1, the terminal cross-sectional area is A2, and A1>A2. By reducing the flow cross-sectional area, the fluid flow rate is increased, compensating for the decrease in heat dissipation capacity caused by the increase in coolant temperature. This results in a slow flow rate and low temperature of the coolant below the power module 20 near the liquid inlet 310. As the coolant flows toward the remaining power modules 20, the flow rate gradually increases and the temperature gradually rises. This balances the cooling effect of each power module 20 and reduces the maximum junction temperature difference among the power modules 20.

[0059] In some embodiments, see Figures 9-13 The heat dissipation channel 30 includes a first main channel 31, a second main channel 32, and a plurality of branch channels 33 connected between the first main channel 31 and the second main channel 32. The first main channel 31 has a liquid inlet hole 310, and the second main channel 32 has a liquid discharge hole 320. The plurality of power modules 20 are thermally connected to the plurality of branch channels 33 respectively.

[0060] Exemplarily, the multiple power modules 20 are thermally connected to the multiple branch channels 33 respectively. At least part of the power module 20 can be placed in the branch channel 33, and heat exchange with the power module 20 can be achieved by flowing coolant through the branch channel 33.

[0061] On this basis, when the heat dissipation channel 30 is a parallel structure, the coolant can enter multiple branch channels 33 at the same time to dissipate heat for each power module 20 respectively, thereby improving the heat dissipation efficiency and being able to more flexibly control the heat dissipation of each power module.

[0062] In some embodiments, see Figures 9-13 The positions of the first main channel 31 connecting multiple branch channels 33 are arranged in sequence from the end close to the liquid inlet hole 310 to the end away from the liquid inlet hole 310, and the cross-sectional size of the first main channel 31 gradually decreases from the end close to the liquid inlet hole 310 to the end away from the liquid inlet hole 310.

[0063] Among the multiple branch channels 33, the branch channel 33 close to the liquid inlet hole 310 is the first branch channel, and the branch channel 33 away from the liquid inlet hole 310 is the second branch channel. From the end connected to the first branch channel to the end connected to the second branch channel, the cross-sectional size of the second main channel 32 gradually increases.

[0064] On this basis, by rationally designing the cross-sectional dimension changes of the first main channel 31 and the second main channel 32, the coolant can be more evenly distributed to each branch channel 33, thus avoiding the problem of excessive or insufficient coolant flow in some branch channels 33, further improving the balance of heat dissipation of each power module, and reducing the junction temperature difference of each power module.

[0065] In some embodiments, see Figure 11-13 The first main channel 31 and the second main channel 32 are located in the same layer, and the plurality of branch channels 33 are stacked with the first main channel 31 and the second main channel 32 .

[0066] On this basis, this stacked structure makes the spatial layout of the power component 100 more compact, reduces the overall volume, and also facilitates the flow of coolant between the main channel (the first main channel 31 and the second main channel 32) and the branch channel 33, thereby improving the heat dissipation efficiency.

[0067] In some embodiments, see Figure 11-13 The extending direction of the first main channel 31 from one end close to the liquid inlet hole 310 to one end away from the liquid inlet hole 310 is parallel to the extending direction of the second main channel 32 from one end connected to the first branch channel to one end connected to the second branch channel.

[0068] On this basis, the parallel arrangement of the first main channel 31 and the second main channel 32 makes the flow of the coolant in the main channel smoother, reduces the flow resistance, reduces the system pressure drop, and also facilitates the connection of the branch channel 33 and the distribution of the coolant.

[0069] It is understood that the cross-sectional dimensions of the first main channel 31 gradually decrease from the end closest to the liquid inlet hole 310 to the end further away from the liquid inlet hole 310. This gradual decrease in cross-sectional dimensions balances the inlet pressures of the branch channels 33. The cross-sectional dimensions of the second main channel 32 gradually increase from the end connected to the first branch channel to the end connected to the second branch channel, thereby reducing the outlet back pressure.

[0070] In some embodiments, see Figure 11 and Figure 12 The plurality of branch channels 33 are sequentially arranged along the extending direction of the first main channel 31 and the extending direction of the second main channel 32 .

[0071] On this basis, the orderly arrangement of the branch channels enables each power module 20 to be in contact with the coolant more evenly, thereby improving the uniformity of heat dissipation and further reducing the junction temperature difference of each power module 20 .

[0072] It can be understood that the multiple branch channels 33 correspond to a single power module 20 respectively, and are stacked with the main channel (such as an upper and lower layer structure), reducing flow resistance through short straight channels, thereby effectively improving heat dissipation efficiency.

[0073] In some embodiments, see Figure 11 The portion of the base 10 located between the first main channel 31 and the second main channel 32 is a connecting rib 40, and the connecting rib 40 is inclined relative to the extension direction of the first main channel 31 and the extension direction of the second main channel 32 from one end to the other end.

[0074] On this basis, the inclined connecting ribs 40 can guide the flow of the coolant between the main channel and the branch channel 33, so that the coolant can participate in heat exchange more fully, improve the heat dissipation efficiency, and also enhance the structural strength of the base 10.

[0075] In some embodiments, see Figure 11 The extension path of the connecting rib 40 from one end to the other end is stepped.

[0076] Furthermore, by sloping the connecting ribs 40 between the two main channels (the first main channel 31 and the second main channel 32) on the base 10 in a stepped manner, the fluid is effectively distributed evenly to each branch channel 33, avoiding the problem of "excess flow at the proximal end and insufficient flow at the distal end." This further balances the coolant flow rate for heat exchange among the functional modules, reducing the amount of coolant flowing directly out of the outlet. This allows the coolant beneath each functional module to fully participate in heat exchange, improving cooling efficiency and reducing the junction temperature difference between the functional modules.

[0077] In some embodiments, see Figure 4 and Figure 5The power module 20 includes a power device 21, a heat dissipation substrate 22 disposed on the power device 21, and heat dissipation fins 23 disposed on a surface of the heat dissipation substrate 22 facing away from the power device 21. The heat dissipation fins 23 are disposed in a heat dissipation channel 30. By disposing the heat dissipation fins 23 in the heat dissipation channel 30, the contact area between the heat dissipation fins 23 and the coolant passing through the heat dissipation channel 30 is increased, the turbulence effect is enhanced, and the heat exchange efficiency is improved.

[0078] For example, multiple power modules 20 are thermally connected to the heat dissipation channel 30. Heat dissipation fins 23 can be installed on the side of the heat dissipation substrate 22 of the power module 20 facing away from the power device 21. These fins 23 extend directly into the heat dissipation channel 30, directly contacting the coolant (e.g., a water-ethylene glycol mixture). The heat dissipation fins 23 can be designed as straight fins, wavy fins (e.g., with a sinusoidal profile), or pin-shaped fins (PinFin) to increase the contact area. Heat generated by the power device 21 is transferred to the heat dissipation fins 23 through the heat dissipation substrate 22. The heat dissipation fins 23 then directly convect with the flowing coolant, utilizing the surface area of the fins 23 to enhance heat transfer. This design is suitable for high-power density modules (e.g., SiC chips) that require rapid removal of concentrated heat.

[0079] Preferably, the heat dissipation fins 23 can adopt a continuous wavy PinFin structure. Such a design can greatly increase the heat dissipation area of the heat dissipation substrate 22. At the same time, the curved structure of the heat dissipation fins 23 can greatly improve the turbulence effect between the fluid and the wall, thereby increasing the heat dissipation efficiency and reducing the chip junction temperature.

[0080] For example, see Figure 2 When the heat dissipation channel is a series structure, multiple wavy fins can be arranged in accordance with the wave extension direction of the wavy fins and the flow direction of the coolant. In this design, when the coolant flows along the wavy gaps of the wavy fins, it can produce a disturbance effect on the coolant and increase the contact area between the coolant and the wavy fins, thereby increasing the heat dissipation efficiency and reducing the chip junction temperature.

[0081] For example, see Figure 3 and Figure 12 When the heat dissipation channels are in parallel, multiple wavy fins can be arranged so that the wave extension direction of the wavy fins is consistent with the flow direction of the coolant in the branch channel 33. This design can also effectively enhance the disturbance effect on the coolant, thereby increasing heat dissipation efficiency and reducing chip junction temperature.

[0082] It is understandable that by providing the heat dissipation fins 23 , the heat dissipation area can be increased, the heat dissipation efficiency can be improved, and the heat generated by the power device 21 can be more effectively transferred to the coolant, thereby reducing the chip junction temperature.

[0083] Specifically, when the heat dissipation channels 30 are in a parallel structure, the coolant flows from the liquid inlet hole 310 into the first main channel 31. As the cross-section of the first main channel 31 gradually narrows, the inlet pressures of the branch channels 33 tend to be consistent. The fluid flows vertically upward through the branch channels 33 to the bottom of the power module 20, evenly flushes the heat dissipation fins 23, and then merges into the second main channel 32. The stepped connecting ribs 40 can guide the lateral diffusion of the fluid, eliminate the flow deviation of the parallel branches, ensure the consistent cooling intensity of each power module 20, balance the cooling flow of each power module 20, and avoid the coolant flowing to the power module 20 close to the drain hole 320. Instead, each power module 20 can be fully cooled, reducing the chip temperature and narrowing the temperature difference between the power modules 20.

[0084] In some embodiments, see Figure 4 The heat dissipation channel 30 has a liquid inlet hole 310 and a liquid discharge hole 320 . At least one of the liquid inlet hole 310 and the liquid discharge hole 320 includes a main body section 301 and a flared section 302 . The flared section 302 is connected between the main body section 301 and the heat dissipation channel 30 .

[0085] On this basis, by setting a gradual expansion structure in the coolant inlet hole 310 and the drain hole 320, the fluid can be smoothly transitioned, the pressure loss of the coolant can be reduced, the pressure drop of the system can be reduced, thereby reducing energy consumption and improving the efficiency of the entire system.

[0086] It's understandable that as the coolant flows from the narrow section (main section 301) to the wide section (flared section 302), the cross-sectional area of the flow path gradually increases. According to the continuity equation, the fluid velocity gradually decreases. This decrease in velocity translates to a decrease in kinetic energy. According to Bernoulli's equation, this decrease in kinetic energy translates into an increase in pressure energy (i.e., an increase in static pressure), thereby compensating for pressure losses caused by friction, turbulence, and other factors during the fluid flow process and reducing overall pressure drop.

[0087] It should be noted that the sloped structure described in the above embodiments (i.e., the surface of the bottom wall 11 facing the top wall 12 is the first surface, and the first surface slopes toward the top wall 12 from the liquid inlet hole 310 to the liquid outlet hole 320) and the stepped structure (i.e., the cross-sectional dimension of the first main channel 31 gradually decreases from the end closest to the liquid inlet hole 310 to the end farther from the liquid inlet hole 310, or the cross-sectional dimension of the second main channel 32 gradually increases from the end connected to the first branch channel to the end connected to the second branch channel) can both be applied to series and parallel heat dissipation channels. Specifically, the stepped structure can be used in series heat dissipation channels, and the sloped structure can also be used in parallel heat dissipation channels. Both structures can be integrated with the heat dissipation channel 30 or be independent, interchangeable structures. The slope of the sloped structure and the height difference of the stepped structure depend on the specific cooling efficiency and are not limited here. This allows for adaptability to different power modules 20, helping SiC devices achieve better performance and accelerating product upgrades.

[0088] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or modification made by those skilled in the art based on the present invention is within the protection scope of the present invention.

Claims

1. A power component, characterized in that: The invention comprises a base (10) and a plurality of power modules (20) connected to the base (10); the base (10) is provided with a heat dissipation channel (30); the plurality of power modules (20) are thermally connected to the heat dissipation channel (30); and the heat dissipation efficiency of the plurality of power modules (20) through the heat dissipation channel (30) is consistent.

2. The power component according to claim 1, characterized in that: The heat dissipation channel (30) has a liquid inlet hole (310) and a liquid discharge hole (320), and the extension direction of the heat dissipation channel (30) from the liquid inlet hole (310) to the liquid discharge hole (320) is consistent with the arrangement direction of the multiple power modules (20).

3. The power component according to claim 2, characterized in that: From the liquid inlet hole (310) to the liquid outlet hole (320), the cross-sectional area of the heat dissipation channel (30) gradually decreases.

4. The power component according to claim 3, characterized in that: The base (10) comprises a bottom wall (11) and a top wall (12) located on opposite sides of the heat dissipation channel (30); the top wall (12) is used for mounting the plurality of power modules (20); and the liquid inlet hole (310) and the liquid drain hole (320) are provided on the bottom wall (11); The surface of the bottom wall (11) facing the top wall (12) is a first surface, and from the liquid inlet hole (310) to the liquid discharge hole (320), the first surface is inclined toward the top wall (12).

5. The power component according to claim 1, characterized in that: The heat dissipation channel (30) comprises a first main channel (31), a second main channel (32), and a plurality of branch channels (33) connected between the first main channel (31) and the second main channel (32); the first main channel (31) has a liquid inlet hole (310), the second main channel (32) has a liquid discharge hole (320), and the plurality of power modules (20) are respectively thermally connected to the plurality of branch channels (33).

6. The power component according to claim 5, characterized in that: The positions of the first main channel (31) connected to the plurality of branch channels (33) are arranged in sequence from an end close to the liquid inlet hole (310) to an end away from the liquid inlet hole (310), and the cross-sectional size of the first main channel (31) gradually decreases from the end close to the liquid inlet hole (310) to the end away from the liquid inlet hole (310); Among the multiple branch channels (33), the branch channel (33) close to the liquid inlet hole (310) is a first branch channel, and the branch channel (33) away from the liquid inlet hole (310) is a second branch channel. From one end connected to the first branch channel to the end connected to the second branch channel, the cross-sectional size of the second main channel (32) gradually increases.

7. The power component according to claim 6, characterized in that: The first main channel (31) and the second main channel (32) are located in the same layer, and the plurality of branch channels (33) are stacked with the first main channel (31) and the second main channel (32).

8. The power component according to claim 7, characterized in that: The direction in which the first main flow channel (31) extends from an end close to the liquid inlet hole (310) to an end away from the liquid inlet hole (310) is parallel to the direction in which the second main flow channel (32) extends from an end connected to the first branch flow channel to an end connected to the second branch flow channel.

9. The power component according to claim 8, characterized in that: The plurality of branch channels (33) are sequentially arranged along the extending direction of the first main channel (31) and the extending direction of the second main channel (32).

10. The power component according to claim 8, characterized in that: The portion of the base (10) located between the first main channel (31) and the second main channel (32) is a connecting rib (40), and the connecting rib (40) is tilted relative to the extension direction of the first main channel (31) and the extension direction of the second main channel (32) from one end to the other end.

11. The power component according to claim 10, characterized in that: The connecting rib (40) extends from one end to the other end in a stepped manner.

12. The power component according to claim 1, characterized in that The power module (20) comprises a power device (21), a heat dissipation substrate (22) provided on the power device (21), and heat dissipation fins (23) provided on a surface of the heat dissipation substrate (22) facing away from the power device (21), wherein the heat dissipation fins (23) are provided on the heat dissipation channel (30).

13. The power component according to claim 1, characterized in that The heat dissipation channel (30) has a liquid inlet hole (310) and a liquid discharge hole (320), at least one of the liquid inlet hole (310) and the liquid discharge hole (320) comprises a main body section (301) and a flared section (302), and the flared section (302) is connected between the main body section (301) and the heat dissipation channel (30).

14. A vehicle, characterized in that: The invention comprises the power component (100) according to any one of claims 1 to 13.

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