Processing equipment

Abstract

A processing apparatus includes a supply unit, a receiving unit, and a moving unit. The supply unit has a plurality of supply sequences. At least a first supply subset and a second supply subset are arranged in each supply sequence. The receiving unit has a plurality of receiving sequences. At least a portion of the first reception subset is distributed in a reception sequence. At least a portion of the second reception subset is distributed in another reception sequence. The moving unit is used for controlling the supply unit and the receiving unit to move relatively, so that the first receiving subset and the second receiving subset are sequentially aligned with the first supply subset and the second supply subset in a supply sequence, and a first distribution pattern and a second distribution pattern are respectively defined on the supply surface of the supply unit. At least part of the first distribution pattern and at least part of the second distribution pattern are overlapped in one direction.

Description

Technical Field

[0001] The present invention relates to a processing technology, in particular to a processing equipment. Background Art

[0002] During the mass die repair process, die from the source substrate are transferred to the target substrate. Some locations on the source substrate may be missing die after providing die to the target substrate. As the amount of die needed for repair increases on the source substrate, these missing die conditions begin to affect the repair yield. This means that the source substrate's die supply capacity gradually decreases, making it impossible to fully meet the target substrate's repair needs. If only die from the remaining intact areas on the source substrate were used for repair each time, while the target substrate's repair needs could be met, the die utilization rate on the source substrate would inevitably be poor.

[0003] In an alternative solution, the positions of the remaining grains on the source substrate are matched with the positions to be repaired on the target substrate using a two-dimensional area of a specific size. However, this matching process using a two-dimensional area is not only time-consuming to calculate, but when the number of grains that can be matched is reduced to a certain ratio, it is almost impossible to continue to calculate a matching combination that can be fully supplied. Even if the size of the two-dimensional area on which the matching is based is reduced, the occurrence of the above-mentioned problem can only be delayed to a very limited extent, and the number of repairs and the time will be doubled. In addition, the uniformity of the epitaxial process will affect the consistency of the characteristics of the grains on the source substrate. If the consistency in characteristics between the repaired grains and the adjacent grains is also considered, the difficulty of two-dimensional matching will be higher. Summary of the Invention

[0004] The present invention is directed to a processing device that can improve the utilization rate of source crystal grains while taking into account the repair efficiency of the crystal grains.

[0005] According to an embodiment of the present invention, a processing device includes a supply unit, a receiving unit, and a moving unit. The supply unit has a plurality of supply sequences arranged along a first direction. Each supply sequence is provided with at least a first supply subset and a second supply subset. The receiving unit has a plurality of receiving sequences arranged along the first direction. These receiving sequences are provided with a first receiving subset and a second receiving subset. At least a portion of the first receiving subset is distributed in one of these receiving sequences. At least a portion of the second receiving subset is distributed in another of these receiving sequences. The moving unit is used to control the relative movement of the supply unit and the receiving unit so that the first receiving subset and the second receiving subset are sequentially aligned with the first supply subset and the second supply subset of one of the plurality of supply sequences, and a first distribution pattern and a second distribution pattern are respectively defined on the supply surface of the supply unit. At least a portion of the first distribution pattern and at least a portion of the second distribution pattern overlap in a second direction perpendicular to the first direction.

[0006] Based on the above, in a processing apparatus according to one embodiment of the present invention, the distribution patterns of at least two receiving subsets in different receiving sequences of a receiving unit on the supply surface of the supply unit overlap in a direction perpendicular to the arrangement direction of the supply sequences. This not only reduces the complexity of the pairing algorithm but also maintains the integrity of the distribution of the remaining supply sequences on the supply unit, thereby improving the component utilization rate of the supply unit and the efficiency of the execution of the processing steps. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a schematic top view of a receiving unit of a processing device according to a first embodiment of the present invention;

[0008] Figure 2 is a schematic top view of a supply unit of a processing device according to a first embodiment of the present invention;

[0009] Figures 3A to 3C It is the use of Figure 2 Supply unit pair Figure 1 A schematic diagram of a process of repairing a receiving unit;

[0010] Figures 4A to 4F is a cross-sectional schematic diagram of a repair process of a processing device according to a first embodiment of the present invention;

[0011] Figure 5A and Figure 5B is a cross-sectional schematic diagram of a repair process of a processing device according to another modified embodiment of the present invention;

[0012] Figure 6 is a schematic top view of a receiving unit of a processing device according to a second embodiment of the present invention;

[0013] Figure 7 is a schematic top view of a supply unit of a processing device according to a second embodiment of the present invention;

[0014] Figures 8A to 8C It is the use of Figure 7 Supply unit pair Figure 6 A schematic diagram of a process of repairing a receiving unit;

[0015] Figure 9 is a schematic top view of a receiving unit of a processing device according to a third embodiment of the present invention;

[0016] Figure 10 is a schematic top view of a supply unit of a processing device according to a third embodiment of the present invention;

[0017] 11A to 11D It is the use of Figure 10 Supply unit pair Figure 9 Schematic diagram of the process of repairing the receiving unit.

[0018] Description of Reference Numerals

[0019] 10, 10A, 10B, 20: processing equipment;

[0020] 100, 101, 102, 103, 104, 200: components;

[0021] CR: component carrier;

[0022] D1: first direction;

[0023] D2: second direction;

[0024] DP1, DP2, DP1’, DP2’, DP1”, DP2”, DP3”: distribution pattern;

[0025] LB: laser beam;

[0026] LS: laser light source;

[0027] MU: mobile unit;

[0028] MV1, MV2, MV1”, MV2”: motion vector;

[0029] P1, P2: pitch;

[0030] PD, PD1, PD2, PD3: pads;

[0031] PUE: Pickup Element;

[0032] RS1, RS2, RS1-A, RS2-A, RS1-B, RS2-B, RS3-B: receiving subset;

[0033] RSF, RSF-A: receiving surface;

[0034] RSQ, RSQ1, RSQ2, RSQ', RSQ1', RSQ2', RSQ", RSQ1", RSQ2": receive sequence;

[0035] RU, RU-A, RU-B: receiving unit;

[0036] SS1, SS2, SS3, SS4, SS1-A, SS2-A, SS1-B, SS2-B, SS3-B: supply subset;

[0037] SSF: supply surface;

[0038] SSQ, SSQ1, SSQ2, SSQ’, SSQ”: supply sequence;

[0039] SU, SU-A, SU-B: supply unit;

[0040] TU, TU-A: transfer unit;

[0041] Vc1, Vc2, Vc1', Vc2', Vc1", Vc2": components;

[0042] WF, WF1, WF2: semiconductor wafers. DETAILED DESCRIPTION

[0043] In the accompanying drawings, for the sake of clarity, the thickness of layers, films, panels, regions, etc. is exaggerated. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to another element, or an intermediate element can also exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there is no intermediate element. As used herein, "connection" can refer to physical and / or electrical connection. Furthermore, "electrical connection" can refer to the presence of other elements between two elements.

[0044] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0045] Figure 1 1 is a schematic top view of a receiving unit of a processing device according to a first embodiment of the present invention. Figure 2 1 is a schematic top view of a supply unit of a processing device according to a first embodiment of the present invention. Figures 3A to 3C It is the use of Figure 2 Supply unit pair Figure 1 Schematic diagram of the process of repairing the receiving unit. Figures 4A to 4F 2 is a cross-sectional schematic diagram of a repair process of a processing device according to a first embodiment of the present invention. Figure 5A and Figure 5B It is a cross-sectional schematic diagram of a repair process of a processing device according to another modified embodiment of the present invention.

[0046] Please refer to Figure 1 、 Figure 2 and Figure 4A The processing apparatus 10 includes a supply unit SU, a receiving unit RU, and a moving unit MU. The receiving unit RU has a plurality of receiving sequences RSQ arranged along a first direction D1, and each of these receiving sequences RSQ has a plurality of receiving subsets. For example, receiving sequence RSQ1 has a receiving subset RS1, while another receiving sequence RSQ2 has another receiving subset RS2.

[0047] However, the present invention is not limited to this. In other embodiments, the receiving subset may be divided into multiple parts and distributed across different receiving sequences. That is, the correspondence between the receiving subset and the receiving sequence may not be a one-to-one relationship. For example, when the receiving subset is arranged across more than two receiving sequences RSQ, during the repair process, the number and distribution of the remaining components in the supply unit SU can be used to determine whether the repair of the receiving subset should be completed all at once (i.e., all of the multiple receiving sequences RSQ are transferred) or in multiple times (i.e., only one of the receiving sequences RSQ is transferred at a time).

[0048] In this embodiment, a receiving surface RSF of the receiving unit RU may be provided with a plurality of pads PD arranged in an array. More specifically, these pads PD may be arranged in a plurality of pad rows and a plurality of pad columns along the first direction D1 and the second direction D2, respectively. In this embodiment, each receiving sequence RSQ may optionally include one pad column. That is, the number of pads PD arranged along the first direction D1 in any receiving sequence RSQ is one, but this is not limited to one.

[0049] On the other hand, the aforementioned multiple receiving subsets may be defined by at least a portion of the multiple pads PD. For example, in this embodiment, the receiving subset RS1 in the receiving sequence RSQ1 may be composed of five pads PD1, and the receiving subset RS2 in the receiving sequence RSQ2 may be composed of three pads PD2, but the present invention is not limited thereto.

[0050] In this embodiment, the receiving unit RU is, for example, a component carrier CR, and a plurality of components 200 are provided on the receiving surface RSF. These components 200 are, for example, a plurality of micro-LEDs, each bonded to a plurality of pads PD. However, the present invention is not limited to this. In other embodiments, the receiving unit RU may be a display substrate, a semiconductor wafer, or a specific carrier on processing equipment, and the components 200 may be micro-transistors or other micro-components with different functions.

[0051] In this embodiment, the plurality of components 200 may be arranged along a first direction D1 at a pitch P1 and along a second direction D2 at a pitch P2. It is particularly noted that some components 200 may be removed due to operational abnormalities or damage, and the plurality of pads (e.g., pads PD1 and PD2) of the plurality of receiving subsets may be residual components 200 after removal, or may be re-applied connecting materials, such as temporary adhesive or bonding metal.

[0052] On the other hand, the supply unit SU has a plurality of supply sequences SSQ arranged along a first direction D1. Each supply sequence SSQ includes at least two supply subsets. For example, supply sequence SSQ1 includes supply subset SS1 and supply subset SS2, and supply sequence SSQ2 includes supply subset SS3 and supply subset SS4, but this is not limited to the above.

[0053] In this embodiment, a supply surface SSF of the supply unit SU may be provided with a plurality of components 100 arranged in an array. More specifically, these components 100 may be arranged in a plurality of component columns and a plurality of component rows along the first direction D1 and the second direction D2, respectively. In this embodiment, each supply sequence SSQ may optionally include one component row. That is, in any supply sequence SSQ, the number of components 100 arranged along the first direction D1 is one, but this is not a limitation.

[0054] The aforementioned plurality of supply subsets may be defined by at least a portion of the plurality of components 100. For example, in this embodiment, supply subset SS1 and supply subset SS2 in supply sequence SSQ1 may be composed of five components 101 and three components 102, respectively, while supply subset SS3 and supply subset SS4 in supply sequence SSQ2 may be composed of three components 103 and four components 104, respectively, but the present invention is not limited thereto.

[0055] In this embodiment, the supply surface SSF of the supply unit SU is located on a semiconductor wafer WF, for example, and the plurality of components 100 disposed on the supply surface SSF are, for example, micro light emitting diodes (micro-LEDs), but the present invention is not limited thereto. In other embodiments, the supply unit may be a chip-on-carrier (COC) or a specific carrier on processing equipment, and the components 100 may be micro transistors or other micro components with different functions.

[0056] In this embodiment, the moving unit MU is used to control the relative movement of the supply unit SU and the receiving unit RU, so that the multiple receiving subsets on the receiving unit RU are sequentially aligned with the multiple supply subsets on the supply unit SU, and multiple distribution patterns are defined on the supply surface SSF of the supply unit SU.

[0057] For example, the receiving unit RU is controlled to move so that the receiving subset RS1 in the receiving sequence RSQ1 and the receiving subset RS2 in the receiving sequence RSQ2 are aligned in sequence with the supply subset SS1 and the supply subset SS2 in the same supply sequence SSQ1 of the supply unit SU, and a distribution pattern DP1 (such as Figure 3A and Figure 4B) and the distribution pattern DP2 (as shown Figure 3B and Figure 4E It should be noted that, when the receiving subset is aligned with the supply subset, the distribution patterns DP1 and DP2 of the receiving subset mapped on the supply surface SSF refer to, for example, the minimum and continuous distribution range that can cover all components in the corresponding supply subset.

[0058] It is particularly noted that, on the supply surface SSF, at least a portion of the distribution pattern DP1 overlaps with at least a portion of the distribution pattern DP2 in the second direction D2 (eg, Figure 2 As shown), that is, the supply subset SS1 and the supply subset SS2 have the densest arrangement in the same supply sequence SSQ1, which helps to maintain the distribution integrity of the remaining components 100 on the supply unit SU, thereby improving the subsequent pairing success rate and the component utilization rate of the supply unit SU.

[0059] First, it should be noted that the processing equipment 10 of this embodiment pairs the supply unit SU with the receiving unit RU before the supply unit SU repairs or processes the receiving unit RU. Multiple supply subsets used to repair different receiving sequences are initially arranged within the same supply sequence SSQ. If the available space is exhausted or insufficient, the supply subsets are arranged in the next supply sequence SSQ. This ensures that the multiple supply subsets are arranged in the densest manner within the multiple supply sequences SSQs.

[0060] On the other hand, during the period from when the receiving subset RS1 is positioned in the supply subset SS1 to when the receiving subset RS2 is positioned in the supply subset SS1, the supply unit SU has a movement vector MV1 relative to the receiving unit RU (e.g. Figure 3A and Figure 3B As shown), that is, the supply unit SU moves relative to the receiving unit RU by three pitches P1 in the first direction D1 and moves in the opposite direction by a pitch P2 in the second direction D2.

[0061] Furthermore, the processing equipment 10 further includes a transfer unit TU (such as Figure 4C ), adapted to transfer the components of the corresponding supply subset to the receiving unit RU according to the distribution pattern. In this embodiment, the transfer unit TU includes, for example, a laser light source LS adapted to emit a laser beam LB, but is not limited thereto. For example, after the receiving subset RS1 (i.e., a plurality of pads PD1) is aligned with the supply subset SS1 (i.e., a plurality of components 101) (as shown in FIG. Figure 3A and Figure 4B As shown), the transfer unit TU is adapted to emit multiple laser beams LB toward the positions of the multiple components 101 of the supply subset SS1 according to the distribution pattern DP1, so that these components 101 are separated from the supply surface SSF and transferred to the corresponding multiple pads PD1 of the receiving subset RS1 (as shown in FIG. Figure 4C and Figure 4D shown).

[0062] After the transfer of the supply subset SS1 is completed, the receiving subset RS2 (ie, the plurality of pads PD2) is further aligned with the supply subset SS2 (ie, the plurality of components 102). Figure 3B and Figure 4E As shown), the transfer unit TU is adapted to emit multiple laser beams LB toward the positions of the multiple components 102 of the supply subset SS2 according to the distribution pattern DP2, so that these components 102 are separated from the supply surface SSF and transferred to the corresponding multiple pads PD2 of the receiving subset RS2 (as shown in FIG. Figure 3C 、 Figure 4E and Figure 4F shown).

[0063] However, the present invention is not limited thereto. In another variant embodiment, the transfer unit TU-A of the processing device 10A may further include a plurality of pickup elements PUE. These pickup elements PUE are respectively provided corresponding to the plurality of components 100 on the supply surface SSF. For example, during the transfer process of the component 101 of the supply subset SS1, the transfer unit TU-A is adapted to extract the corresponding plurality of components 101 on the supply unit SU according to the distribution pattern DP1 and transfer them to the receiving subset RS1 of the receiving unit RU (e.g., Figure 5A and Figure 5B The same method can also be applied to the transfer process of the plurality of components 102 of the supply subset SS2, and will not be described in detail here. Figure 3C shown.

[0064] Depend on Figure 1 、 Figure 2 and Figure 3C It can be seen that the supply subsets corresponding to at least two receiving subsets within different receiving sequences RSQ of a receiving unit RU can be distributed within the same supply sequence. For example, in this embodiment, the supply subset SS1 corresponding to the receiving subset RS1 within receiving sequence RSQ1 and the supply subset SS2 corresponding to the receiving subset RS2 within receiving sequence RSQ2 are distributed within the same supply sequence SSQ1. When the receiving subset RS1 and the receiving subset RS2 are sequentially aligned with the supply subsets SS1 and SS2, the distribution patterns DP1 and DP2 defined by the receiving subsets RS1 and RS2 on the supply surface SSF, respectively, at least partially overlap within the same supply sequence SSQ1.

[0065] In this embodiment, the supply unit SU and the receiving unit RU are paired and analyzed based on a one-dimensional area. The one-dimensional area here refers to the distribution area of any supply sequence SSQ on the supply unit SU or the distribution area of any receiving sequence RSQ on the receiving unit RU, and within the distribution area, the number of components and pads arranged along the first direction D1 is 1. Figure 1 and Figure 2 For example, the supply sequences SSQ1, SSQ2 or the receiving sequences RSQ1, RSQ2 of each pairing analysis are elements distributed in a single row.

[0066] Compared to the current method of pairing with two-dimensional areas, the computational complexity of one-dimensional area pairing is lower, and it is easier to quickly obtain a fully matched combination. In addition, pairing with one-dimensional areas can also increase the configuration flexibility of the supply subsets on the supply unit SU. For example, the multiple supply subsets obtained by matching the multiple receiving subsets on the receiving unit RU can first be arranged as densely as possible along the second direction D2, that is, they can be arranged first within the same supply sequence SSQ. If the configurable space is exhausted or insufficient, the arrangement will be carried out in the next supply sequence SSQ. Through such an arrangement, the distribution integrity of the remaining components 100 on the supply unit SU can be maintained, thereby improving the subsequent pairing success rate and the component utilization rate of the supply unit SU.

[0067] Some other embodiments will be listed below to illustrate the present invention in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the above embodiments and will not be repeated below.

[0068] Figure 6 2 is a schematic top view of a receiving unit of a processing device according to a second embodiment of the present invention. Figure 7 FIG. 1 is a schematic top view of a supply unit of a processing device according to a second embodiment of the present invention. Figures 8A to 8C It is the use of Figure 7 Supply unit pair Figure 6 Schematic diagram of the process of repairing the receiving unit.

[0069] Please refer to Figure 6 and Figure 7 The processing equipment 20 of this embodiment is Figure 1 and Figure 2The difference between the processing equipment 10 is that the number of components arranged along the first direction D1 in the supply sequence is different and the number of pads arranged along the first direction D1 in the receiving sequence is different. For example, in this embodiment, the number of components arranged along the first direction D1 in each supply sequence SSQ' of the supply unit SU-A may be two, and the number of pads arranged along the first direction D1 in each receiving sequence RSQ' of the receiving unit RU-A may be two. That is, each supply sequence SSQ' may be provided with two rows of components, and each receiving sequence RSQ' may be provided with two rows of pads. However, the present invention is not limited to this. In another embodiment not shown, the number of components arranged along the first direction D1 in each supply sequence and receiving sequence may be greater than 2.

[0070] In this embodiment, the multiple pads PD1 of the receiving subset RS1-A of the receiving unit RU-A can be dispersed within different component rows of the receiving sequence RSQ1'. Since the receiving subset RS1-A is configured as two component rows, the receiving subset RS2-A can adopt the same configuration. For example, in the figure, the multiple pads PD2 are arranged within the bottom pad row of the receiving sequence RSQ2'.

[0071] On the other hand, the multiple components 101 of the supply subset SS1-A are determined by the positions of the multiple pads PD1 of the receiving subset RS1-A, so the multiple components 101 are dispersed within different component rows. Specifically, the upper component rows within the supply sequence SSQ' may not be able to accommodate the positions of another supply subset SS2-A due to missing chips or inconsistent physical properties (such as luminous wavelength or brightness), and therefore are instead arranged within the lower component rows. In other words, when the number of pad rows corresponding to each receiving sequence RSQ' is greater than two, and the pad positions of these receiving sequences RSQ1' and RSQ2' can be configured in the same group, each supply sequence SSQ' can increase the arrangement flexibility of the supply subsets by setting up multiple component rows.

[0072] Please refer to Figure 8A and Figure 8B For example, during the processing or repair process, the receiving subset RS1-A and the receiving subset RS2-A are sequentially and respectively positioned on the supply subset SS1-A and the supply subset SS2-A, and distribution patterns DP1' (such as Figure 8A ) and the distribution pattern DP2' (as shown Figure 8B During the period from when the receiving subset RS1-A is positioned at the supply subset SS1-A to when the receiving subset RS2-A is positioned at the supply subset SS2-A, the supply unit SU-A has a motion vector MV2 relative to the receiving unit RU-A (as shown in FIG. Figure 8A and Figure 8BThat is, the supply unit SU-A moves relative to the receiving unit RU-A by two pitches P1 in the first direction D1 and by two pitches P2 in the second direction D2.

[0073] It should be noted that the supply unit SU-A only moves unidirectionally, or does not move, relative to the receiving unit RU-A in the first direction D1 and does not move in the opposite direction of the first direction D1. This means that repairs on the receiving unit RU-A are performed not only according to the order of the receiving sequence but also according to the order of the supply sequence. However, the supply unit SU-A can move back and forth in the second direction D2, allowing different receiving subsets within the same or different receiving sequences to be aligned with multiple supply subsets within the same supply sequence. This significantly improves component repair efficiency.

[0074] In this embodiment, the Figure 4D Transfer unit TU or Figure 5A The transfer unit TU-A transfers the multiple components 101 of the supply subset SS1-A and the multiple components 102 of the supply subset SS2-A to the multiple pads PD1 of the receiving subset RS1-A and the multiple pads PD2 of the receiving subset RS2-A respectively. Therefore, please refer to the relevant paragraphs of the above embodiment for detailed description, which will not be repeated here. The repaired receiving unit RU-A is as follows Figure 8C shown.

[0075] Depend on Figure 6 、 Figure 7 and Figure 8C It can be seen that the supply subsets corresponding to at least two receiving subsets within different receiving sequences RSQ' of receiving unit RU-A can be distributed within the same supply sequence. For example, in this embodiment, the supply subset SS1-A corresponding to receiving subset RS1-A within receiving sequence RSQ1' and the supply subset SS2-A corresponding to receiving subset RS2-A within receiving sequence RSQ2' are distributed within the same supply sequence SSQ'. When receiving subsets RS1-A and RS2-A are sequentially aligned with supply subsets SS1-A and SS2-A, the distribution patterns DP1' and DP2' defined on the supply surface by receiving subsets RS1-A and RS2-A, respectively, at least partially overlap within the same supply sequence SSQ'.

[0076] In this embodiment, the distribution pattern DP2' of receiving subset RS2-A on the supply surface can completely overlap the distribution pattern DP1' of receiving subset RS1-A on the supply surface. In other words, the multiple components 102 of supply subset SS2-A can be arranged between the multiple components 101 of supply subset SS1-A. By maximizing the density of these supply subsets within supply sequence SSQ', the distribution integrity of the remaining components 100 on supply unit SU-A can be effectively maintained, thereby improving the subsequent pairing success rate and the component utilization rate of supply unit SU-A.

[0077] Figure 9 4 is a schematic top view of a receiving unit of a processing device according to a third embodiment of the present invention. Figure 10 FIG. 1 is a schematic top view of a supply unit of a processing device according to a third embodiment of the present invention. 11A to 11D It is the use of Figure 10 Supply unit pair Figure 9 Schematic diagram of the process of repairing the receiving unit.

[0078] Please refer to Figure 9 and Figure 10 , the processing equipment 10B of this embodiment and Figure 1 and Figure 2 The primary difference between the processing equipment 10 and the processing equipment 10 is the different implementation of the receiving unit. For example, in the processing equipment 10B of this embodiment, the receiving unit RU-B may be a combination of multiple semiconductor wafers (e.g., semiconductor wafer WF1 and semiconductor wafer WF2), and multiple receiving sequences RSQ are provided on at least a portion of the surface of these semiconductor wafers (i.e., receiving surface RSF-A).

[0079] In this embodiment, multiple receiving subsets are provided on multiple semiconductor wafers, and the corresponding supply subsets are all provided on the same semiconductor wafer WF (i.e., supply unit SU-B). For example, receiving sequences RSQ1″ and RSQ2″ on semiconductor wafer WF1 respectively include receiving subset RS1-B and receiving subset RS3-B, while receiving sequence RSQ1″ on semiconductor wafer WF2 includes receiving subset RS2-B. Supply subsets SS1-B, SS2-B, and SS3-B, used to repair these receiving subsets, can be provided within the same supply sequence SSQ″ of supply unit SU-B.

[0080] Please refer to Figures 11A to 11C During the processing or repair of the receiving unit RU-B, the receiving subset RS1-B, the receiving subset RS2-B and the receiving subset RS3-B are sequentially positioned on the supply subset SS1-B, the supply subset SS2-B and the supply subset SS3-B, and distribution patterns DP1 are defined on the supply surface. Figure 11A As shown), distribution pattern DP2" (as shown Figure 11B ) and the distribution pattern DP3 (as shown) Figure 11C As shown). Moreover, the distribution pattern DP1", the distribution pattern DP2" and the distribution pattern DP3" are alternately arranged in the same supply sequence SSQ". For example, Figure 9 As shown, the elements 101 , 102 , and 103 corresponding to the above distribution pattern partially overlap with each other in the second direction D2 .

[0081] During the period from when the receiving subset RS1-B is positioned at the supply subset SS1-B to when the receiving subset RS2-B is positioned at the supply subset SS2-B, the supply unit SU-B has a movement vector MV1 relative to the receiving unit RU-B (e.g. Figure 11A and Figure 11B ), and the movement vector MV1″ is parallel to the second direction D2.

[0082] During the period from when the receiving subset RS2-B is positioned at the supply subset SS2-B to when the receiving subset RS3-B is positioned at the supply subset SS3-B, the supply unit SU-B has a motion vector MV2 relative to the receiving unit RU-B (e.g. Figure 11B and Figure 11C shown).

[0083] Specifically, because the arrangement of multiple supply subsets within multiple supply sequences SSQ" simultaneously considers the repair order of multiple receive sequences RSQ", the densest arrangement not only improves component utilization within the supply unit SU-B but also simplifies the relative movement of the supply unit SU-B and receive unit RU-B, thereby enhancing component repair efficiency. During each relative movement of the supply unit SU-B and receive unit RU-B, the component of the motion vector of the supply unit SU-B relative to the receive unit RU-B in the first direction D1 is greater than zero (e.g., motion vector MV2") or equal to zero (e.g., motion vector MV1"), and the supply unit SU-B does not move in the opposite direction of the first direction D1. In other words, as the supply unit SU-B sequentially positions receive subsets RS1-B, RS2-B, and RS3-B, it moves unidirectionally in the first direction D1 and does not reverse. Therefore, repair of the receive unit RU-B is performed not only according to the order of the receive sequences but also according to the order of the supply sequences. However, the supply unit SU-B can be moved back and forth in the second direction D2, so that different receiving subsets on the same or different semiconductor wafers are sequentially aligned with multiple supply subsets in the same supply sequence, thereby significantly improving the device repair efficiency.

[0084] The repaired receiving unit RU-B is as follows Figure 11Dshown.

[0085] In summary, in a processing apparatus according to one embodiment of the present invention, the distribution patterns of at least two receiving subsets in different receiving sequences on the supply surface of the supply unit overlap in a direction perpendicular to the arrangement direction of the supply sequences. This not only reduces the complexity of the pairing algorithm but also maintains the integrity of the distribution of the remaining supply sequences on the supply unit, thereby improving component utilization of the supply unit and the efficiency of processing steps.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A processing equipment, characterized in that, include: The supply unit has a plurality of supply sequences arranged along a first direction, and each of the plurality of supply sequences includes at least a first supply subset and a second supply subset; a receiving unit having a plurality of receiving sequences arranged along the first direction, wherein a first receiving subset and a second receiving subset are provided within the plurality of receiving sequences, at least a portion of the first receiving subset is distributed in one of the plurality of receiving sequences, and at least a portion of the second receiving subset is distributed in another of the plurality of receiving sequences; as well as a moving unit for controlling the relative movement of the supply unit and the receiving unit so that the first receiving subset and the second receiving subset are sequentially aligned with the first supply subset and the second supply subset of one of the multiple supply sequences, and a first distribution pattern and a second distribution pattern are respectively defined on the supply surface of the supply unit, wherein at least a portion of the first distribution pattern and at least a portion of the second distribution pattern overlap in a second direction perpendicular to the first direction.

2. The processing equipment according to claim 1, characterized in that A plurality of elements are provided on the supply surface of the supply unit, at least a portion of the plurality of elements defines the first supply subset and the second supply subset, and the processing equipment further comprises: The transfer unit is adapted to transfer a portion of the plurality of components defining the first supply subset and the second supply subset to the receiving unit according to the first distribution pattern and the second distribution pattern.

3. The processing equipment according to claim 2, characterized in that The multiple elements are multiple micro light emitting diodes.

4. The processing equipment according to claim 2, characterized in that The transfer unit includes a laser light source or a plurality of pickup elements.

5. The processing equipment according to claim 2, characterized in that The supply unit includes a semiconductor wafer or a component carrier.

6. The processing equipment according to claim 1, characterized in that During a period from when the first receiving subset is positioned at the first supplying subset to when the second receiving subset is positioned at the second supplying subset, the supplying unit and the receiving unit move relative to each other in the first direction and / or the second direction.

7. The processing equipment according to claim 1, characterized in that A plurality of elements are provided on the supply surface of the supply unit, at least a portion of the plurality of elements define the first supply subset and the second supply subset, and the number of the plurality of elements arranged in any one of the plurality of supply sequences and along the first direction is greater than or equal to 2.

8. The processing equipment according to claim 1, characterized in that A plurality of elements are disposed on the supply surface of the supply unit, at least a portion of the plurality of elements defines the first supply subset and the second supply subset, and the number of the plurality of elements arranged in any one of the plurality of supply sequences and along the first direction is 1.

9. The processing equipment according to claim 1, characterized in that The receiving unit includes at least one semiconductor wafer or at least one component carrier, and at least a portion of a surface of the at least one semiconductor wafer or the at least one component carrier is provided with the multiple receiving sequences of the receiving unit.

10. The processing equipment according to claim 9, characterized in that The at least one semiconductor wafer or the at least one component carrier is a plurality of semiconductor wafers or a plurality of component carriers, and the first receiving subset and the second receiving subset are respectively disposed on two of the plurality of semiconductor wafers or the plurality of component carriers.

11. The processing equipment according to claim 1, characterized in that A third supply subset is further provided in each of the plurality of supply sequences, and a third receive subset is further provided in the plurality of receive sequences. After the first receive subset and the second receive subset are sequentially aligned with the first supply subset and the second supply subset of one of the plurality of supply sequences, the movement unit further controls the supply unit and the receive unit to move relative to each other so that the third receive subset is aligned with the third supply subset. During a period from when the first receiving subset is positioned at the first supplying subset to when the second receiving subset is positioned at the second supplying subset, the supplying unit has a first movement vector relative to the receiving unit. During the period from when the second receiving subset is positioned at the second supply subset to when the third receiving subset is positioned at the third supply subset, the supply unit has a second motion vector relative to the receiving unit, and the components of the first motion vector and the second motion vector in the first direction are greater than or equal to 0.

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