Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an isolation structure, a first packaging layer and a plurality of light-emitting devices, wherein the isolation structure, the first packaging layer and the light-emitting devices are located on the substrate. The isolation structure comprises a plurality of isolation openings, the light-emitting devices correspond to the isolation openings respectively, each light-emitting device comprises a first electrode, a light-emitting functional layer and a second electrode which are sequentially stacked on the substrate, and the light-emitting functional layers and the second electrodes are located in the corresponding isolation openings. The first packaging layer is located on the sides, away from the substrate, of the isolation structures and the light-emitting devices and comprises a plurality of packaging units, and the packaging units correspond to the isolation openings respectively so as to package the light-emitting devices. And at least part of the orthographic projection of the edge of the packaging unit, which is positioned on one side, deviating from the substrate, of the isolation structure, on the substrate is positioned outside or inside the orthographic projection of the first electrode on the substrate. The edge of the first electrode and the edge of the packaging unit are staggered, so that the risk of over-etching of the edge part of the packaging unit can be reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin-film electroluminescent device. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display. The structure of the electronic display product can be found in the relevant descriptions in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, CN117396039A, CN116669480A, CN116600606A, and CN117500332A, which are not repeated here.

[0003] However, current electronic display products are limited by their own structural design, making it difficult to improve the packaging quality of the display panel while ensuring a high pixel density (PPI). Summary of the Invention

[0004] According to a first aspect of the present disclosure, there is provided a display panel comprising a substrate and an isolation structure, a first encapsulation layer and a plurality of light-emitting devices located on the substrate. The isolation structure comprises a plurality of isolation openings, the light-emitting devices corresponding to the isolation openings respectively, the light-emitting devices comprising a first electrode, a light-emitting functional layer and a second electrode stacked in sequence on the substrate, the light-emitting functional layer and the second electrode being located in the corresponding isolation openings. The first encapsulation layer is located on a side of the isolation structure and the light-emitting device away from the substrate, and comprises a plurality of encapsulation units, the encapsulation units corresponding to the isolation openings respectively to encapsulate the light-emitting devices. At least a portion of the orthographic projection of the edge of the encapsulation unit located on the side of the isolation structure away from the substrate on the substrate is located outside or inside the orthographic projection of the first electrode on the substrate.

[0005] In the above scheme, the edge of the first electrode is at least partially offset from the edge of the packaging unit, so that in the entire process of preparing the light-emitting device, the film forming quality of the portion of the edge of the film layer formed above the first electrode (including the packaging unit, wherein part of the film layer may be etched away during the process) that does not correspond to the edge of the first electrode can be improved, thereby reducing the risk of over-etching the edge portion of the packaging unit, thereby protecting the light-emitting device and ensuring the quality of the display panel.

[0006] In a specific embodiment of the first aspect of the present disclosure, the substrate includes a driver circuit layer, the driver circuit layer includes pixel driver circuits corresponding to the light-emitting devices, and the first electrode includes a main body and a connecting portion located on at least one side of the main body, the pixel driver circuit being connected to the connecting portion. The main body of the first electrode is connected to the pixel driver circuit via the connecting portion, and the pixel driver circuit and the connecting portion are located on different layers, resulting in a transition design. This can cause the flatness of the connecting portion to be lower than that of the main body. Therefore, the above-mentioned technical solution of the present disclosure is more necessary to prevent the transition design between the connecting portion and the pixel driver circuit from affecting the quality of the package unit.

[0007] In a specific embodiment of the first aspect of the present disclosure, the substrate further includes a flat layer, which is located between the driving circuit layer and the first electrode. A via is provided in the flat layer, and the orthographic projection of the via on the substrate is located within the orthographic projection of the connecting portion on the substrate, and the connecting portion of the first electrode is connected to the pixel driving circuit through the via.

[0008] In one embodiment of the first aspect of the present disclosure, the orthographic projection of the connecting portion on the substrate lies within the orthographic projection of the isolation structure on the substrate. This prevents the poorly flat connecting portion from directly interfering with the portion of the first electrode that drives the light-emitting device to emit electroluminescent light, thereby preventing the connection portion from affecting the light-emitting device's luminous quality. Furthermore, the isolation structure covers the connecting portion, which can modify film undulations caused by the connecting portion, thereby improving the quality of subsequent film formation.

[0009] In one specific embodiment of the first aspect of the present disclosure, the orthographic projection of the edge of the main portion on the substrate lies within the orthographic projection of the isolation structure on the substrate. Thus, the isolation structure covers the edge of the main portion, thereby correcting any unevenness caused by the step difference at the edge of the main portion and improving the quality of subsequent film formation.

[0010] In a specific embodiment of the first aspect of the present disclosure, the isolation structure includes a support portion and a crown portion, the support portion is located between the crown portion and the substrate, the orthographic projection of the end of the support portion facing away from the substrate on the substrate is located within the orthographic projection of the crown portion on the substrate, and the orthographic projection of the edge of the main body portion on the substrate is located within the orthographic projection of the crown portion on the substrate.

[0011] In one specific embodiment of the first aspect of the present disclosure, the orthographic projection of the support portion on the substrate lies within the orthographic projection of the crown portion on the substrate, and the orthographic projection of the edge of the main body portion on the substrate lies within the orthographic projection of the support portion on the substrate. In this manner, the gap between adjacent first electrodes is covered by the support portion, and the step difference caused by the gap is not reflected in the isolation opening, thereby not affecting the film quality of the subsequently formed light-emitting functional layer and second electrode, thereby ensuring the luminous efficiency of the light-emitting device.

[0012] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a pixel defining layer, the pixel defining layer being located between the isolation structure and the substrate and including pixel openings corresponding to the isolation openings, the pixel openings being connected to the corresponding isolation openings, and portions of the light-emitting functional layer and the second electrode being located in the pixel openings. At the same isolation opening, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the main body of the first electrode on the substrate, and the edge of the main body is located between the pixel defining layer and the substrate. In this way, the gap between adjacent first electrodes is covered by the pixel defining layer to reduce the impact on the film formation quality of the film layer above the pixel defining layer.

[0013] In a specific embodiment of the first aspect of the present disclosure, the pixel defining layer is an inorganic film layer. The inorganic film layer is denser and has a high insulation effect. In the process of preparing the light-emitting device based on the isolation structure, the pixel defining layer does not need a high thickness to accommodate the light-emitting device, which is conducive to the lightweight design of the display panel; in addition, the pixel defining layer as an inorganic film layer can have a high bonding strength with the isolation structure and the cathode to reduce the risk of the isolation structure and the cathode falling off; in addition, the inorganic film layer has a high density and can more effectively block the intrusion of water, oxygen, etc., thereby improving the packaging effect of the display panel. It should be noted that the inorganic film layer can be formed in a conformal manner with the underlying film layer to have a high packaging effect. Accordingly, this characteristic also leads to the pixel defining layer as an inorganic film layer. The effect of modifying the flatness of the edge of the first electrode and the undulating part of the connecting portion of the first electrode is limited, so that the unevenness is reflected on the subsequent film layer. Therefore, it is more necessary to adopt the above-mentioned technical solution of the present disclosure to solve this problem.

[0014] In a specific embodiment of the first aspect of the present disclosure, the pixel defining layer includes a first sub-defining layer and a second sub-defining layer stacked together, and the first sub-defining layer is located between the second sub-defining layer and the substrate. In this way, the pixel defining layer is formed by stacking multiple film layers, so that its structure can be adjusted according to different requirements (for example, the material properties required for the upper and lower layers of the pixel defining layer are different); in addition, the edge of the first electrode and the step difference caused by the connection part of the first electrode can be further modified to a greater extent by multiple film formations; in addition, this design also facilitates the adjustment of the shape of the side surface of the pixel defining layer to facilitate the film formation quality of the light-emitting functional layer and the second electrode at the side surface of the pixel opening, thereby ensuring the luminous efficiency of the light-emitting device.

[0015] In a specific embodiment of the first aspect of the present disclosure, the material of the first sub-defining layer includes silicon nitride, and the material of the second sub-defining layer includes at least one of silicon oxide and silicon oxynitride. Silicon nitride has an excellent barrier effect against water, gas, etc. However, silicon nitride has a large dielectric constant and is therefore disposed in the lower layer to avoid forming a parasitic capacitance between the upper layer and the first electrode. Accordingly, the material of the upper layer (the second sub-defining layer) of the pixel defining layer is replaced with silicon oxide and silicon oxynitride, which have a small dielectric constant.

[0016] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the encapsulation unit on the substrate. The pixel opening defines the actual light-emitting area of the light-emitting device. This ensures that the encapsulation unit structurally encapsulates the actual light-emitting area of the light-emitting device, further improving the luminous efficiency of the light-emitting device.

[0017] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the encapsulation unit on the substrate is located within the orthographic projection of the first electrode on the substrate.

[0018] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the packaging unit on the substrate is located within the orthographic projection of the main body of the first electrode on the substrate.

[0019] In a specific embodiment of the first aspect of the present disclosure, a distance between an orthographic projection of an edge of the encapsulation unit on the substrate and an orthographic projection of an edge of the first electrode on the substrate is 1 micrometer to 20 micrometers.

[0020] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the first electrode on the substrate is located within the orthographic projection of the packaging unit on the substrate.

[0021] In a specific embodiment of the first aspect of the present disclosure, a distance between an orthographic projection of an edge of the first electrode on the substrate and an orthographic projection of an edge of the packaging unit on the substrate is 1 micrometer to 20 micrometers.

[0022] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of a portion of the encapsulation unit on the substrate is located outside the orthographic projection of the first electrode on the substrate, and the orthographic projection of another portion of the encapsulation unit on the substrate is located within the orthographic projection of the first electrode on the substrate.

[0023] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the packaging unit on the substrate includes a notch, the portion of the main body of the first electrode that is connected to the connecting portion and the orthographic projection of the connecting portion on the substrate are located within the notch, and the orthographic projection of the other portions of the main body of the first electrode on the substrate are located within the orthographic projection of the packaging unit on the substrate.

[0024] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of an edge portion of a side of the main body of the first electrode that does not face the connecting portion on the substrate is located outside the orthographic projection of the packaging unit on the substrate, and the middle portion of the main body of the first electrode, the edge portion of a side of the main body facing the connecting portion, and the orthographic projection of the connecting portion on the substrate are located within the orthographic projection of the packaging unit on the substrate.

[0025] According to a second aspect of the present disclosure, there is provided a method for preparing a display panel, the method comprising: providing a substrate and forming a plurality of first electrodes spaced apart from each other on the substrate; forming an isolation structure on the substrate on which the first electrodes are formed, wherein the isolation structure encloses a plurality of isolation openings, and the isolation openings correspond to the first electrodes respectively; depositing a light-emitting material film and a conductive material film, wherein the light-emitting material film and the conductive material film cover the isolation structure and the isolation openings, wherein the portions of the light-emitting material film and the conductive material film located in the isolation openings form a light-emitting functional layer and a second electrode respectively, and at least a portion of the second sub-bottom overlaps the second electrode, and the first electrode, the light-emitting functional layer and the second electrode stacked on each other constitute a light-emitting device; depositing a film layer of packaging material to cover A light-emitting device; forming a photoresist layer on a packaging material film layer, and patterning the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening; etching the packaging material film layer and the light-emitting device based on the photoresist pattern, wherein the remaining portion of the packaging material film layer is formed into a packaging unit, and the light-emitting functional layer and the second electrode not covered by the packaging unit are etched, and at the isolation opening corresponding to the packaging unit, at least a portion of the positive projection of the edge of the packaging unit located on the side of the isolation structure away from the substrate on the substrate is located outside or inside the positive projection of the first electrode on the substrate; repeating the above process to form a light-emitting device and a packaging unit at the isolation opening where the light-emitting device is not formed, and all the packaging units constitute a first packaging layer. In the display panel obtained by the preparation method, the edge of the first electrode is at least partially offset from the edge of the packaging unit, so that in the entire process of preparing the light-emitting device, the film forming quality of the portion of the edge of the film layer formed above the first electrode (including the packaging unit, wherein part of the film layer may be etched away during the process) that does not correspond to the edge of the first electrode can be improved, thereby reducing the risk of over-etching the edge portion of the packaging unit, protecting the light-emitting device, and thus ensuring the quality of the display panel.

[0026] A third aspect of the present disclosure provides a display device, comprising the display panel of the first aspect or the display panel obtained by the preparation method of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the planar structure of a display panel provided in one embodiment of the present disclosure.

[0028] Figure 2 for Figure 1 The diagram shows an enlarged view of a region S1 of a display panel under one design.

[0029] Figure 3 for Figure 2 The cross-section of the display panel along line M1 - N1 in one design is shown.

[0030] Figure 4for Figure 2 The cross-section of the display panel along line M2 - N2 in one design is shown.

[0031] Figure 5A for Figure 2 The diagram shows a planar structure diagram of a sub-pixel structure of a display panel under one design.

[0032] Figure 5B for Figure 2 The diagram shows a planar structure diagram of a sub-pixel structure of a display panel under another design.

[0033] Figure 6 for Figure 2 The cross-section of the display panel along line M1 - N1 in another design is shown.

[0034] Figure 7 A schematic diagram of a partial structure of a display panel provided in an embodiment of the present disclosure under another design.

[0035] Figure 8 A schematic planar structural diagram of a sub-pixel structure included in another design of a display panel provided in an embodiment of the present disclosure.

[0036] Figure 9 A schematic planar structural diagram of a sub-pixel structure included in another design of a display panel provided in an embodiment of the present disclosure.

[0037] Figure 10 A schematic planar structural diagram of a sub-pixel structure included in another design of a display panel provided in an embodiment of the present disclosure.

[0038] Figure 11 A cross-sectional view of a portion of the structure of a display panel provided in one embodiment of the present disclosure.

[0039] Figure 12 A flowchart of a method for manufacturing a display panel provided in one embodiment of the present disclosure.

[0040] 13A to 13H An embodiment of the present disclosure provides a method for forming Figure 3 A process diagram of a method for preparing a display panel is shown.

[0041] Description of reference numerals:

[0042] 10-display panel; 11-display area; 12-frame area;

[0043] 100 - substrate; 110 - driving circuit layer; 111 - pixel driving circuit; 120 - planar layer; 121 - via;

[0044] 200 - light-emitting device; 210 - first electrode; 211 - main body; 212 - connection portion; 220 - light-emitting functional layer; 221 - first functional layer; 222 - light-emitting layer; 223 - second functional layer; 230 - second electrode;

[0045] 300 - isolation structure; 301 - isolation opening; 302 - pixel opening; 310 - support portion; 310a - first material layer; 320 - crown; 320a - second material layer; 330 - bottom;

[0046] 400 - packaging structure; 410 - first packaging layer; 410a - packaging material film layer; 411 - packaging unit; 411a - notch; 420 - second packaging layer; 430 - third packaging layer;

[0047] 500 - pixel definition layer; 500a - pixel definition material layer; 510 - first sub-definition layer; 520 - second sub-definition layer;

[0048] 600-Photoresist pattern. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this specification.

[0050] In some scenarios, some functional film layers in the light-emitting device are formed by evaporation, and each light-emitting device has multiple functional film layers, and some functional film layers (such as the light-emitting layer) in the light-emitting devices that emit different light have different material compositions. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by alignment accuracy errors, sufficient space (and a safety margin related to the alignment error) needs to be reserved between different light-emitting devices to ensure that the position of the actual light-emitting area of the light-emitting device can have a certain overlap rate with the designed position (design area), which is equivalent to compressing the design area of the light-emitting area of the light-emitting device, which not only limits the light-emitting area of the light-emitting device, but also prevents the arrangement density of the light-emitting device from being further increased, making it difficult to further improve the PPI (pixel density) of the display panel.

[0051] In the embodiment of the present disclosure, an isolation structure is provided at the gap between the light-emitting devices to separate the functional film layers of adjacent light-emitting devices. In this way, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel without using a mask to prepare the functional film layer of each light-emitting device separately. This process does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting devices can be designed to be smaller to increase the PPI (the principle of which can be seen in the following and 13A to 13H (See the relevant description in the relevant embodiments).

[0052] It should be noted that when preparing the light-emitting device based on the above-mentioned isolation structure, an encapsulation layer (encapsulation unit in the following embodiment) will be formed simultaneously, so that when preparing the next batch of light-emitting devices, the encapsulation layer can protect the light-emitting devices that have been prepared in the previous batch. In addition, in the entire preparation process, when preparing the next batch of light-emitting devices, a vapor-deposited film layer and other structures will be formed on the light-emitting devices that have been prepared in the previous batch and the encapsulation layer thereon, and these structures will protect the light-emitting devices in the lower layer during the etching process. Therefore, in the entire process, the film forming quality of the film layer formed on the upper layer of the light-emitting device will directly affect whether the area will be over-etched beyond expectations in the etching process. If over-etching occurs, it will cause damage to the edge of the encapsulation layer on the light-emitting device, thereby causing the protection of the lower film layer to fail, so that the isolation structure and the film layer of the light-emitting device are etched, thereby causing the luminous efficiency of the light-emitting device to decrease or even cause the light-emitting function to be lost.

[0053] In the display panel, there will be step differences at the locations of the independent electrodes between the light-emitting devices. The step differences will be reflected in the subsequently formed film layers, resulting in unevenness. If the uneven positions correspond to the main etched areas of the film layers formed on the light-emitting devices (such as the edges of the packaging units), these film layers will be over-etched or even damaged, thereby further leading to risks such as failure of the light-emitting device packaging.

[0054] At least one embodiment of the present disclosure provides a display panel, a method for manufacturing the same, and a display device to at least address the aforementioned technical issues. The display panel includes a substrate, an isolation structure located on the substrate, a first encapsulation layer, and a plurality of light-emitting devices. The isolation structure includes a plurality of isolation openings, with the light-emitting devices corresponding to the isolation openings. The light-emitting devices include a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate, with the light-emitting functional layer and the second electrode located in the corresponding isolation openings. The first encapsulation layer is located on a side of the isolation structure and the light-emitting devices that is away from the substrate and includes a plurality of encapsulation units, each corresponding to the isolation openings to encapsulate the light-emitting devices. At least a portion of the orthographic projection of the edge of the encapsulation unit located on the side of the isolation structure that is away from the substrate is located outside or inside the orthographic projection of the first electrode on the substrate. In this display panel, the edge of the first electrode is at least partially offset from the edge of the encapsulation unit. This improves the film quality of the portion of the edge of the film layer formed above the first electrode that does not correspond to the edge of the first electrode during the entire process of manufacturing the light-emitting devices, thereby reducing the risk of over-etching at the edge of the encapsulation unit, protecting the light-emitting devices, and thus ensuring the quality of the display panel.

[0055] The structure of the display panel according to at least one embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. Furthermore, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationships of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and Y-axis are parallel to the surface of the substrate, and the Z-axis is perpendicular to the surface of the substrate.

[0056] like Figures 1 to 5A As shown, the planar area of the display panel 10 can be divided into a display area 11 and a border area 12 surrounding the display area 11. Sub-pixels (which can be called sub-pixels, etc.) can be arranged in the display area 11, such as P1, P2, and P3 sub-pixels. The physical structure of the sub-pixels can be the light-emitting devices in the following embodiments. Adjacent sub-pixels with different colors of emitted light constitute a pixel (which can be called a pixel unit, a large pixel, etc.). The arrangement density of the pixels in the display area 11 represents the pixel density PPI.

[0057] The physical structure of the display panel 10 may include a substrate 100, an isolation structure 300, a first encapsulation layer 410, and a plurality of light emitting devices 200 located on the substrate 100. The isolation structure 300 includes a plurality of isolation openings 301, and the light emitting devices 200 correspond to the isolation openings 301 respectively.

[0058] The light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 stacked sequentially on a substrate 100. The light-emitting functional layer 220 and the second electrode 230 are located in corresponding isolation openings 301. The first encapsulation layer 410 is located on the side of the isolation structure 300 and the light-emitting device 200 away from the substrate 100 and includes a plurality of encapsulation units 411. The encapsulation units 411 correspond to the isolation openings 301 to encapsulate the light-emitting device 200. The encapsulation units 411 are located on the edge SD of the isolation structure 300 away from the substrate 100 (see Figure 3 ) at least part of the orthographic projection of the first electrode 210 on the substrate 100 is located outside or inside the orthographic projection of the first electrode 210 on the substrate 100.

[0059] In the case where the light emitting devices 200 are divided into multiple types emitting light of different colors, the light emitting devices 200 emitting different lights are manufactured independently, but the film layer (evaporated film layer such as light emitting functional layer, etc.) in each light emitting device 200 is evaporated on the entire surface of the display panel during evaporation. For example, Figures 2 to 4 As shown, the light-emitting devices 200 are classified into a first type of light-emitting device (P1), a second type of light-emitting device (P2), and a third type of light-emitting device (P3) that emit light of different colors. During the preparation process, the light-emitting devices P1, P2, and P3 are prepared in sequence. When preparing the light-emitting device P1, a light-emitting device P1 is formed in each isolation opening 301. A first encapsulation layer 410 is prepared on the display panel to cover the light-emitting device P2. Then, the first encapsulation layer 410 in part of the isolation openings 301 (used to form the light-emitting devices P2 and P3 in the final product) and the second electrode and the light-emitting functional layer of the light-emitting device P1 are removed to obtain an encapsulation unit 411. During this process, the encapsulation unit 411 is used to protect the light-emitting devices P1 in other isolation openings 301. Based on this method, the light-emitting devices P2 and P3 are prepared in sequence, and finally a display panel as shown in FIG. Figure 3 and Figure 4 The first encapsulation layer 410 shown, that is, the first encapsulation layer 410 on the entire display panel is prepared by multiple processes. The process can be seen below. 13A to 13H The relevant descriptions in the relevant embodiments are not repeated here.

[0060] For example, the first type of light emitting device (P1), the second type of light emitting device (P2), and the third type of light emitting device (P3) can respectively (regardless of order) emit red light, green light, and blue light.

[0061] It should be noted that if Figure 3 and Figure 4As shown, in the above process, because the film layers used to form the structure of the light-emitting device 200 are separated based on the isolation structure 300, these film layers will be evaporated on the display panel as a whole layer, that is, these film layers will cover the isolation structure 300. In the etching process of forming the packaging unit 411, the etching material will etch the part of the film layer covering the isolation structure 300, so that the edge part of the packaging unit 411 is suspended to form a suspended part.

[0062] When the light-emitting devices 200 are prepared in batches based on the isolation structure 300, due to the independent setting of the first electrode 210 of each light-emitting device 200, the edge of the first electrode 210 and the edge of the packaging unit 411 will be roughly located in the same area during the process, especially when etching using a mask plate with the same or similar pattern, the edge of the first electrode 210 and the edge of the packaging unit 411 will almost overlap, and at the edge of the first electrode 210, the step difference between the gap between the first electrode 210 and the adjacent first electrode 210 will affect the flatness of the upper film layer, and further reflected in the film forming quality of the upper film layer, such as the edge portion of the packaging unit 411, and in the etching process of the entire preparation process, the etching material will etch the upper structure of the first electrode 210, such as the edge portion of the packaging unit 411. If the etched portion of the upper film layer, such as the packaging unit 411, is located in the area with poor film forming quality, there is a risk of over-etching and damage to the packaging unit 411. If the edge of the packaging unit 411 is damaged by over-etching, the etching material will break through the packaging unit 411 and damage the underlying film layers, such as the second electrode 230, the light-emitting functional layer 220, and even the first electrode 210, thereby affecting the quality of the display panel and even causing poor display. After the edge of the first electrode 210 is at least partially offset from the edge of the packaging unit 411, the film forming quality of the portion of the edge of the film layer formed above the first electrode 210 that does not correspond to the edge of the first electrode 210 can be improved, thereby reducing the risk of over-etching the edge portion of the packaging unit 411, so as to protect the light-emitting device 200 and ensure the quality of the display panel. It should be noted that the film layers formed above the first electrode 210 referred to above may include film layers such as the packaging unit 411, and some film layers may be etched away during the process and thus will not be reflected in the final display panel. That is, these removed film layers can be considered as sacrificial layers. For details, please refer to the following and 13A to 13H The relevant descriptions in the relevant embodiments are not repeated here.

[0063] In at least one embodiment of the present disclosure, Figure 3 and Figure 4As shown, the light-emitting functional layer 220 includes at least one first functional layer 221, at least one light-emitting layer 222, and at least one second functional layer 223 sequentially stacked on the first electrode 210. The first functional layer 221 includes at least one of a hole injection layer and a hole transport layer. The second functional layer 223 may include an electron injection layer, an electron transport layer, etc. For example, the first functional layer 221 may further include an electron blocking layer, etc., and the second functional layer 223 may further include a hole blocking layer, etc.

[0064] In the embodiment of the present disclosure, one of the first electrode 210 and the second electrode 230 may be an anode, and the other may be a cathode. Figure 3 and Figure 4 The structure shown shows the case where the first electrode 210 is an anode and the second electrode 230 is a cathode. If the first electrode 210 is set as an anode and the second electrode 230 is a cathode, the positions of the first functional layer 221 and the second functional layer 223 will also be interchanged.

[0065] In at least one embodiment of the present disclosure, Figure 2 、 Figure 3 and Figure 5A As shown, the substrate 100 includes a driving circuit layer 110, and the driving circuit layer 110 includes pixel driving circuits 111 corresponding to the light-emitting devices 200. The first electrode 210 includes a main body 211 and a connecting portion 212 located on at least one side of the main body 211, and the pixel driving circuit 111 is connected to the connecting portion 212. The main body 211 of the first electrode 210 is connected to the pixel driving circuit 111 through the connecting portion 212. The pixel driving circuit 111 and the connecting portion 212 are located on different layers, so there will be a transition design (such as the via 121 mentioned below), which will cause the flatness of the connecting portion 212 to be lower than the flatness of the main body 211. Therefore, the above-mentioned technical solution of the present disclosure is more needed to prevent the transition design between the connecting portion 212 and the pixel driving circuit 111 from affecting the quality of the packaging unit 411.

[0066] For example, the pixel driving circuit may include multiple transistors (TFTs), capacitors, and the like, and may be formed in various forms, such as 7T1C (i.e., 7 transistors (TFTs) and 1 capacitor (C)), 8T1C, or 8T2C. The pixel driving circuit is connected to the light-emitting device 200 to control the switching state and the light-emitting brightness of the light-emitting device 200.

[0067] In at least one embodiment of the present disclosure, Figure 2 、 Figure 3 and Figure 5AAs shown, the substrate 100 also includes a flat layer, which is located between the driving circuit layer 110 and the first electrode 210. A via 121 is provided in the flat layer. The orthographic projection of the via 121 on the substrate 100 is located within the orthographic projection of the connecting portion 212 on the substrate 100, and the connecting portion 212 of the first electrode 210 is connected to the pixel driving circuit 111 through the via 121.

[0068] It should be noted that the portion of the connection portion 212 that overlaps the via hole 121 will conform to the shape of the via hole 121 and thus will also have a concave shape. The step (unevenness) caused by the concavity may be reflected in the film layer covering the connection portion 212 .

[0069] In at least one embodiment of the present disclosure, Figures 2 to 5A As shown, the orthographic projection of the connecting portion 212 on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. As such, the poorly flat connecting portion 212 does not directly contribute to the portion of the first electrode 210 that drives the electroluminescence of the light-emitting device 200, thereby preventing the connection portion 212 from affecting the light-emitting quality of the light-emitting device 200. Furthermore, the isolation structure 300 covers the connecting portion 212, which can modify the film undulations caused by the connecting portion 212, thereby improving the film quality of subsequent film formation.

[0070] In at least one embodiment of the present disclosure, Figures 2 to 5A As shown, the orthographic projection of the edge of the main body 211 on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. In this way, the isolation structure 300 covers the edge of the main body 211, thereby modifying the unevenness caused by the step difference at the edge of the main body 211 and improving the film formation quality of subsequent film layers.

[0071] In at least one embodiment of the present disclosure, Figure 3 and Figure 4As shown, the isolation structure 300 includes a support portion 310 and a crown portion 320. The support portion 310 is located between the crown portion 320 and the substrate 100. The orthographic projection of the end of the support portion 310 facing away from the substrate 100 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. The orthographic projection of the edge of the main portion 211 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. It should be noted that the film layer used to form the crown portion 320 will cover the underlying film layer, thereby modifying the step difference and unevenness caused by the underlying film layer. In addition, this arrangement can limit the evaporation angle of the film layer of the light-emitting device 200 during evaporation, thereby ensuring that the second electrode 230 can overlap with the isolation structure 300 while reducing or avoiding the overlapping area between the light-emitting functional layer 220 and the isolation structure 300, thereby preventing or reducing leakage current.

[0072] In at least one embodiment of the present disclosure, Figure 3 and Figure 4 As shown, the support portion 310 is a conductive structure, and the second electrode 230 is connected to the side surface of the support portion 310. In this way, the conductive support portion 310 can connect the second electrodes 230 of each light-emitting device 200 in series to form a common electrode. The support portion 310 is located in the gap between the light-emitting devices 200, so it does not need to be light-transmissive and is not restricted by thickness. This reduces the impedance of the common electrode, thereby alleviating the voltage drop problem on each second electrode 230 when driving the light-emitting device 200.

[0073] In at least one embodiment of the present disclosure, Figure 3 and Figure 4 As shown, the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100, and the orthographic projection of the edge of the main portion 211 on the substrate 100 is also located within the orthographic projection of the support portion 310 on the substrate 100. In this way, the gap between adjacent first electrodes 210 is covered by the support portion 310, and the step difference caused by the gap is not reflected in the isolation opening 301, thereby not affecting the film quality of the subsequently formed light-emitting functional layer 220 and second electrode 230, thereby ensuring the luminous efficiency of the light-emitting device 200.

[0074] In at least one embodiment of the present disclosure, Figure 6 and Figure 7 As shown, the isolation structure 300 further includes a bottom 330 , which is located between the support portion 310 and the substrate 100 , and the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the bottom 330 on the substrate 100 .

[0075] For example, the bottom portion 330 is a conductive structure, and the second electrode 230 is in electrical contact with a portion of the surface of the bottom portion 330 facing away from the substrate 100 that is not covered by the support portion 310. The second electrode 230 is more easily deposited on the surface area of the bottom portion 330 facing away from the substrate 100 than on the sidewalls of the support portion 310, thereby reducing the impedance at the connection between the second electrode 230 and the isolation structure 300.

[0076] For example, the orthographic projection of the bottom portion 330 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. In this way, the isolation effect of the isolation structure 300 on the light-emitting functional layer 220 can be enhanced.

[0077] For example, the materials of the bottom 330, the support portion 310 and the crown portion 320 can be molybdenum, aluminum, and titanium, respectively. The corrosion resistance of aluminum, molybdenum, and titanium increases in sequence. When etching, the film layers formed by these materials can form the following Figure 6 and Figure 7 Isolation structure 300 is shown.

[0078] In at least one embodiment of the present disclosure, Figure 6 and Figure 7 As shown, the display panel may further include a pixel defining layer 500, which is located between the isolation structure 300 and the substrate 100 and includes pixel openings 302 corresponding to the isolation openings 301. The pixel openings 302 are connected to the corresponding isolation openings 301, and portions of the light-emitting functional layer 220 and the second electrode 230 are located in the pixel openings 302. At the same isolation opening 301, the orthographic projection of the pixel opening 302 on the substrate 100 is located within the orthographic projection of the main portion 211 of the first electrode 210 on the substrate 100, and the edge of the main portion 211 is located between the pixel defining layer 500 and the substrate 100. In this way, the gaps between adjacent first electrodes 210 are covered by the pixel defining layer 500 to reduce the impact on the film forming quality of the film layer above the pixel defining layer 500. In addition, when the pixel defining layer 500 is provided in the display panel, the first electrode 210 of the light-emitting device 200 can be designed to have a larger area to avoid positional offset (error caused by process accuracy) between the first electrode 210 and the isolation structure 300 in the actual process, which makes it difficult to ensure the actual light-emitting area of the light-emitting device, thereby improving the aperture ratio (related to the light-emitting area of the light-emitting device) and brightness of the display image of the display panel. For example, when the pixel defining layer 500 is not provided, in order to avoid the first electrode 210 from being connected to the isolation structure 300, the design area of the first electrode 210 is limited. If the position of the first electrode 210 is offset, the light-emitting area of the light-emitting device may be smaller than the design area (the light-emitting area expected during design), thereby reducing the brightness of the light-emitting device.

[0079] In at least one embodiment of the present disclosure, Figure 6 and Figure 7 As shown, the pixel defining layer 500 is an inorganic film layer. Inorganic film layers are denser and have a high insulation effect. In the process of preparing the light-emitting device 200 based on the isolation structure 300, the pixel defining layer 500 does not need to be thick enough to accommodate the light-emitting device 200, which is conducive to the lightweight design of the display panel. In addition, as an inorganic film layer, the pixel defining layer 500 can have a high bonding strength with the isolation structure 300 and the cathode, thereby reducing the risk of the isolation structure 300 and the cathode falling off. In addition, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the packaging effect of the display panel. It should be noted that the inorganic film layer can be formed in a conformal manner with the underlying film layer, thereby having a high packaging effect. Correspondingly, this characteristic also results in the pixel defining layer 500 as an inorganic film layer having limited effect in modifying the flatness of the edge of the first electrode 210 and the undulating portion of the connecting portion 212 of the first electrode 210, so that the unevenness is reflected in the subsequent film layer. Therefore, it is more necessary to adopt the above-mentioned technical solution of the present disclosure to solve this problem.

[0080] In at least one embodiment of the present disclosure, Figure 7 As shown, the pixel defining layer 500 includes a first sub-defining layer 510 and a second sub-defining layer 520 stacked together, with the first sub-defining layer 510 located between the second sub-defining layer 520 and the substrate 100. Thus, the pixel defining layer 500 is formed by stacking multiple film layers, so that its structure can be adjusted according to different requirements (e.g., different material properties required for the upper and lower layers of the pixel defining layer 500); in addition, multiple film formations can be performed to further modify unevenness such as the edge of the first electrode 210 and the step difference caused by the connecting portion 212 of the first electrode 210; in addition, this design also facilitates adjustment of the shape of the side surface of the pixel defining layer 500, so as to improve the film formation quality of the light-emitting functional layer 220 and the second electrode 230 at the side surface of the pixel opening 302, thereby ensuring the luminous efficiency of the light-emitting device 200.

[0081] In at least one embodiment of the present disclosure, Figure 7 As shown, the material of the first sub-defining layer 510 includes silicon nitride, and the material of the second sub-defining layer 520 includes at least one of silicon oxide and silicon oxynitride. Silicon nitride has a very good barrier effect against water, gas, etc. However, silicon nitride has a large dielectric constant, so it is arranged in the lower layer to avoid forming a parasitic capacitance between it and the first electrode 210 when it is in the upper layer. Accordingly, the material of the upper layer (second sub-defining layer 520) of the pixel defining layer 500 is replaced by silicon oxide and silicon oxynitride, which have a small dielectric constant.

[0082] In at least one embodiment of the present disclosure, Figure 7As shown, the orthographic projection of the pixel opening 302 on the substrate 100 is located within the orthographic projection of the encapsulation unit 411 on the substrate 100. The pixel opening 302 defines the actual light-emitting area of the light-emitting device 200. In this way, the encapsulation unit 411 can ensure the structural encapsulation of the actual light-emitting area of the light-emitting device 200, thereby further ensuring the luminous efficiency of the light-emitting device 200.

[0083] In the embodiments of the present disclosure, the aforementioned technical problems can be solved by ensuring that the edges of the packaging unit and the edges of the first electrode are interlaced as much as possible. On this basis, there are no restrictions on the shape and overlapping relationship between the packaging unit and the first electrode, and these can be selected based on actual process requirements. This will be explained below with reference to various embodiments.

[0084] In some embodiments of the present disclosure, it is possible to refer to Figure 5A and Figure 5B The orthographic projection of the encapsulation unit 411 on the substrate 100 is located within the orthographic projection of the first electrode 210 on the substrate 100 .

[0085] For example, in one example, refer back to Figure 5A , a part of the orthographic projection of the packaging unit 411 on the substrate 100 overlaps with the orthographic projection of the main body 211 of the first electrode 210 on the substrate 100, and another part of the orthographic projection of the packaging unit 411 on the substrate 100 overlaps with the orthographic projection of the connecting portion 212 of the first electrode 210 on the substrate 100.

[0086] For example, in another example, Figure 5B As shown, the orthographic projection of the encapsulation unit 411 on the substrate 100 is located within the orthographic projection of the main body 211 of the first electrode 210 on the substrate 100 .

[0087] For example, at the edge of the packaging unit 411 is as follows Figure 5A and Figure 5B In the case shown as being retracted within the edge of the first electrode 210, the distance D between the orthographic projection of the edge of the packaging unit 411 on the substrate 100 and the orthographic projection of the edge of the first electrode 210 on the substrate 100 can be 1 micron to 20 microns; specifically, it can be 1 micron, 3 microns, 6 microns, 10 microns, 15 microns and 20 microns.

[0088] In other embodiments of the present disclosure, Figure 8 As shown, the orthographic projection of the first electrode 210 on the substrate 100 is located within the orthographic projection of the encapsulation unit 411 on the substrate 100 .

[0089] For example, at the edge of the packaging unit 411 is as follows Figure 8In the case of expansion beyond the edge of the first electrode 210 as shown, the distance D between the orthographic projection of the edge of the first electrode 210 on the substrate 100 and the orthographic projection of the edge of the packaging unit 411 on the substrate 100 can be 1 micron to 20 microns; specifically, it can be 1 micron, 3 microns, 6 microns, 10 microns, 15 microns and 20 microns.

[0090] In some other embodiments of the present disclosure, the edge of the packaging unit and the edge of the first electrode are partially staggered and partially overlapped. Figure 9 and Figure 10 As shown, the orthographic projection of a portion of the encapsulation unit 411 on the substrate 100 is outside the orthographic projection of the first electrode 210 on the substrate 100 , and the orthographic projection of another portion of the encapsulation unit 411 on the substrate 100 is inside the orthographic projection of the first electrode 210 on the substrate 100 .

[0091] For example, in one example, Figure 9 As shown, the orthographic projection of the packaging unit 411 on the substrate 100 includes a notch 411a, the portion of the main body 211 of the first electrode 210 that is connected to the connecting portion 212 and the orthographic projection of the connecting portion 212 on the substrate 100 are located within the notch 411a, and the orthographic projection of the other portions of the main body 211 of the first electrode 210 on the substrate 100 are located within the orthographic projection of the packaging unit 411 on the substrate 100.

[0092] For example, in another example, Figure 10 As shown, the orthographic projection of the side edge portion of the main body 211 of the first electrode 210 that does not face the connecting portion 212 on the substrate 100 is located outside the orthographic projection of the packaging unit 411 on the substrate 100, and the middle portion of the main body 211 of the first electrode 210, the side edge portion of the main body 211 facing the connecting portion 212, and the orthographic projection of the connecting portion 212 on the substrate 100 are located within the orthographic projection of the packaging unit 411 on the substrate 100.

[0093] In at least one embodiment of the present disclosure, Figure 11As shown, the display panel further includes a second encapsulation layer 420 and a third encapsulation layer 430 covering the first encapsulation layer 410. The second encapsulation layer 420 is located between the first encapsulation layer 410 and the third encapsulation layer 430, and the third encapsulation layer 430 is located on the side of the second encapsulation layer 420 facing away from the substrate 100. The first encapsulation layer 410, the second encapsulation layer 420, and the third encapsulation layer 430 constitute the encapsulation structure 400. Optionally, the second encapsulation layer 420 is a planarization layer. Optionally, the second encapsulation layer 420 is an organic film layer, and the third encapsulation layer 430 is an inorganic film layer. Optionally, the second encapsulation layer 420 and the third encapsulation layer 430 are continuous film layers. The second encapsulation layer 420 can improve the flatness of the display panel surface, so as to facilitate the arrangement of other components on the encapsulation layer; in addition, the second encapsulation layer 420 can have a certain degree of flexibility to relieve the stress of the first encapsulation layer 410 and the third encapsulation layer 430, thereby improving the reliability of the display panel and being more conducive to the application of the display panel in the field of flexible displays; in addition, the third encapsulation layer 430 has high density and has a high barrier effect against water, oxygen, etc., and the third encapsulation layer 430 has higher strength, so as to facilitate the preparation of other components thereon (such as structures related to touch functions, optical film layers, etc.).

[0094] At least one embodiment of the present disclosure provides a method for preparing the above-mentioned display panel, which may include: Figure 12 Steps S100 to S700 are specifically as follows.

[0095] S100 , providing a substrate and forming a plurality of first electrodes spaced apart from each other on the substrate.

[0096] S200 , forming an isolation structure on the substrate on which the first electrode is formed, wherein the isolation structure encloses a plurality of isolation openings, and the isolation openings correspond to the first electrodes respectively.

[0097] S300, depositing a light-emitting material film and a conductive material film, the light-emitting material film and the conductive material film cover the isolation structure and the isolation opening, wherein the portions of the light-emitting material film and the conductive material film located in the isolation opening form a light-emitting functional layer and a second electrode respectively, at least a portion of the second sub-bottom overlaps with the second electrode, and the first electrode, the light-emitting functional layer and the second electrode stacked on each other constitute a light-emitting device.

[0098] S400 , depositing a film layer of packaging material to cover the light-emitting device.

[0099] S500 , forming a photoresist layer on the packaging material film layer, and performing a patterning process on the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening.

[0100] S600, etching the packaging material film layer and the light-emitting device based on the photoresist pattern, wherein the remaining part of the packaging material film layer is formed into a packaging unit, and the light-emitting functional layer and the second electrode not covered by the packaging unit are etched, and at the isolation opening corresponding to the packaging unit, at least a part of the orthographic projection of the edge of the packaging unit located on the side of the isolation structure away from the substrate on the substrate is located outside or inside the orthographic projection of the first electrode on the substrate.

[0101] S700 , repeating the above process to form light-emitting devices and encapsulation units at the isolation openings where no light-emitting devices are formed, and all the encapsulation units constitute a first encapsulation layer.

[0102] In the display panel obtained in steps S100 to S700, the edge of the first electrode is at least partially offset from the edge of the encapsulation unit. This improves the film quality of the portion of the edge of the film layer formed above the first electrode (including the encapsulation unit, where part of the film layer may be etched away during the process) that does not correspond to the edge of the first electrode during the entire process of manufacturing the light-emitting device. This reduces the risk of over-etching the edge of the encapsulation unit, protects the light-emitting device, and thus ensures the quality of the display panel. The specific structure of the display panel obtained by this manufacturing method, the technical problems solved, and the corresponding technical effects can be found in the relevant descriptions of the aforementioned embodiments and are not elaborated here.

[0103] Below, as Figure 3 Taking the display panel shown as an example, the method for preparing the display panel is exemplarily described.

[0104] like Figure 13A As shown, a substrate 100 is provided and first electrodes 210 arranged in an array are formed on the substrate 100 .

[0105] like Figure 13B As shown, a pixel defining material layer 500 a is formed on the substrate 100 on which the first electrode 210 is formed.

[0106] like Figure 13C As shown, a first material layer 310 a and a second material layer 320 a are formed on the pixel defining material layer 500 a .

[0107] For example, the material of the first material layer 310 a may be aluminum, and the material of the second material layer 320 a may be titanium.

[0108] like Figure 13DAs shown, the first material layer 310a and the second material layer 320a are patterned so that the first material layer 310a is formed into a support portion 310 and the second material layer 320a is formed into a crown portion 320. The edge of the crown portion 320 defines the edge of the isolation opening 301. The specific structure of the isolation structure 300 and the bottom portion 330 included therein can be found in the relevant description of the above embodiments and will not be repeated here.

[0109] In an embodiment of the present disclosure, the patterning process may be a photolithography patterning process, which may include, for example, coating a photoresist on a structural layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (e.g., the photoresist pattern described below) includes photoresist, the structural layer may be directly exposed through a mask to form the desired pattern.

[0110] like Figure 13E As shown, the pixel defining material layer 500 a is patterned based on the isolation structure 300 to form a pixel defining layer 500 . The pixel defining layer 500 covers the gaps between adjacent first electrodes 210 . Thus, the planar shape of the pixel defining layer 500 is a grid.

[0111] like Figure 13F As shown, a light-emitting material film and a conductive material film are evaporated on the substrate 100 to form a light-emitting functional layer 220 and a second electrode 230 in each isolation opening 301 of the isolation structure 300. The first electrode 210, the light-emitting functional layer 220 and the second electrode 230 stacked on each other at the isolation opening 301 form a light-emitting device 200. No mask plate is used in the evaporation process, so the evaporated material will also be deposited on the crown 320. It should be noted that in the actual process, the evaporated material will be deposited on the upper surface of the crown 320 away from the substrate 100 and the side wall (not shown in the figure); then the packaging material film layer 410a is deposited to cover the light-emitting device 200 and the isolation structure 300.

[0112] For example, the light-emitting layer in the evaporated light-emitting functional layer 220 can emit light of a color corresponding to the second type light-emitting device P2 , that is, at this stage, a second type light-emitting device P2 is formed in each isolation opening 301 of the isolation structure 300 .

[0113] like Figure 13G As shown, a photoresist is formed (eg, coated) on the substrate 100 with the packaging material film layer 410 a formed thereon, and then patterned to form a photoresist pattern 600 . The photoresist pattern 600 only covers a portion of the isolation opening 301 of the isolation structure 300 .

[0114] like Figure 13H As shown, the surface of the display panel is etched using the photoresist pattern 600 as a mask to remove the packaging material film layer 410a, the second electrode 230 and the light-emitting functional layer 220 that are not covered by the photoresist pattern 600. The remaining part of the packaging material film layer 410a forms the packaging unit of the first packaging layer 410; then the remaining photoresist pattern 600 is removed.

[0115] It should be noted that the light-emitting material film and the conductive material film will cover the crown 320, and in this etching process, the light-emitting material film and the conductive material film covering the crown 320 will act as a sacrificial layer to block the etching, thereby preventing the structure at the edge of the packaging unit 411 from being over-etched.

[0116] Repeat the above Figures 13F to 13H The steps of forming the first type light emitting device P1 and the third type light emitting device P3 in the other isolation openings 301 are performed, and forming the following Figure 3 The process of forming the first type light emitting device P1 and the third type light emitting device P3 is different from that of forming the second type light emitting device P2 in that the isolation openings 301 covered by the photoresist pattern 600 are different.

[0117] It should be noted that after forming the second type light-emitting device P2 and in the process of preparing the first type light-emitting device P1, the light-emitting material film and the conductive material film will cover the crown 320 and the packaging unit 411 corresponding to the second type light-emitting device P2, thereby acting as a sacrificial layer in the etching process of forming the first type light-emitting device P1 to protect the packaging unit 411 corresponding to the second type light-emitting device P2. During this process, if the film quality of the light-emitting material film and the conductive material film at the edge of the packaging unit 411 corresponding to the second type light-emitting device P2 is poor, the protection effect of the packaging unit 411 will be reduced, resulting in excessive etching (lateral and vertical etching) of the packaging unit 411, thereby damaging the packaging unit 411 and further causing the second type light-emitting device P2 below to be etched and damaged. In the embodiment of the present disclosure, the edge of the first electrode 210 and the edge of the packaging unit 411 are staggered to at least improve the film forming quality of the light-emitting material film and the conductive material film at the edge of the packaging unit 411, thereby protecting the structure at the edge of the packaging unit 411 (the packaging unit 411 and the crown 320 below, etc.).

[0118] At least one embodiment of the present disclosure provides a display device, which may include the display panel of the above-described embodiment or the display panel obtained by the preparation method of the above-described embodiment. For example, the display device may include a touch structure, an optical film (such as a microlens or a polarizer), a cover plate, and other structures disposed on the light-emitting side of the display panel.

[0119] For example, the display device may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, or a navigator.

[0120] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0121] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that: include: substrate; an isolation structure located on the substrate and comprising a plurality of isolation openings; a plurality of light-emitting devices disposed on the substrate and corresponding to the isolation openings, wherein the light-emitting devices include a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate, and the light-emitting functional layer and the second electrode are located in the corresponding isolation openings; a first encapsulation layer, located on a side of the isolation structure and the light-emitting device away from the substrate, and comprising a plurality of encapsulation units, wherein the encapsulation units correspond to the isolation openings respectively to encapsulate the light-emitting device; Wherein, at least a portion of an orthographic projection of an edge of the encapsulation unit located on a side of the isolation structure facing away from the substrate on the substrate is located outside or inside an orthographic projection of the first electrode on the substrate.

2. The display panel according to claim 1, wherein: The substrate includes a driving circuit layer, and the driving circuit layer includes pixel driving circuits corresponding to the light-emitting devices respectively. The first electrode includes a main body portion and a connecting portion located on at least one side of the main body portion, and the pixel driving circuit is connected to the connecting portion; Preferably, the substrate further includes a flat layer, which is located between the driving circuit layer and the first electrode, and a via is provided in the flat layer, the orthographic projection of the via on the substrate is located within the orthographic projection of the connecting portion on the substrate, and the connecting portion of the first electrode is connected to the pixel driving circuit through the via.

3. The display panel according to claim 2, wherein: The orthographic projection of the connecting portion on the substrate is located within the orthographic projection of the isolation structure on the substrate.

4. The display panel according to claim 2, wherein: The orthographic projection of the edge of the main body portion on the substrate is located within the orthographic projection of the isolation structure on the substrate.

5. The display panel according to claim 4, wherein: The isolation structure includes a support portion and a crown portion, wherein the support portion is located between the crown portion and the base plate. The orthographic projection of the end of the support portion facing away from the base plate is located within the orthographic projection of the crown portion on the base plate, and the orthographic projection of the edge of the main body portion on the base plate is located within the orthographic projection of the crown portion on the base plate.

6. The display panel according to claim 5, wherein: The orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the orthographic projection of the edge of the main body portion on the substrate is located within the orthographic projection of the support portion on the substrate.

7. The display panel according to claim 2, wherein: It also includes a pixel defining layer, wherein the pixel defining layer is located between the isolation structure and the substrate and includes pixel openings corresponding to the isolation openings, the pixel openings are connected to the corresponding isolation openings, and the light-emitting functional layer and a portion of the second electrode are located in the pixel openings; At the same isolation opening, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the main body of the first electrode on the substrate, and the edge of the main body is located between the pixel defining layer and the substrate.

8. The display panel according to claim 7, wherein: The pixel defining layer is an inorganic film layer.

9. The display panel according to claim 8, wherein: The pixel defining layer includes a first sub-defining layer and a second sub-defining layer stacked together, and the first sub-defining layer is located between the second sub-defining layer and the substrate.

10. The display panel according to claim 9, wherein: The material of the first sub-defining layer includes silicon nitride, and the material of the second sub-defining layer includes at least one of silicon oxide and silicon oxynitride; Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the packaging unit on the substrate.

11. The display panel according to any one of claims 2 to 10, characterized in that: The orthographic projection of the encapsulation unit on the substrate is located within the orthographic projection of the first electrode on the substrate.

12. The display panel according to claim 11, wherein: The orthographic projection of the packaging unit on the substrate is located within the orthographic projection of the main body of the first electrode on the substrate.

13. The display panel according to claim 11, wherein: The distance between the orthographic projection of the edge of the packaging unit on the substrate and the orthographic projection of the edge of the first electrode on the substrate is 1 micrometer to 20 micrometers.

14. The display panel according to any one of claims 2 to 10, characterized in that: The orthographic projection of the first electrode on the substrate is located within the orthographic projection of the packaging unit on the substrate.

15. The display panel according to claim 14, wherein: The distance between the orthographic projection of the edge of the first electrode on the substrate and the orthographic projection of the edge of the packaging unit on the substrate is 1 micrometer to 20 micrometers.

16. The display panel according to any one of claims 2 to 10, characterized in that: The orthographic projection of a portion of the encapsulation unit on the substrate is outside the orthographic projection of the first electrode on the substrate, and the orthographic projection of another portion of the encapsulation unit on the substrate is inside the orthographic projection of the first electrode on the substrate.

17. The display panel according to claim 16, wherein: The orthographic projection of the packaging unit on the substrate includes a notch, the portion of the main body of the first electrode that is connected to the connecting portion and the orthographic projection of the connecting portion on the substrate are located within the notch, and the orthographic projection of the other portions of the main body of the first electrode on the substrate are located within the orthographic projection of the packaging unit on the substrate.

18. The display panel according to claim 16, wherein: The orthographic projection of an edge portion of the main body of the first electrode that does not face the connecting portion on the substrate is outside the orthographic projection of the packaging unit on the substrate. The middle portion of the main body of the first electrode, the edge portion of the main body facing the connecting portion, and the orthographic projection of the connecting portion on the substrate are located within the orthographic projection of the packaging unit on the substrate.

19. A method for preparing a display panel, characterized in that: include: providing a substrate and forming a plurality of first electrodes spaced apart from each other on the substrate; forming an isolation structure on the substrate on which the first electrode is formed, wherein the isolation structure encloses a plurality of isolation openings, and the isolation openings correspond to the first electrodes respectively; Depositing a light-emitting material film and a conductive material film, wherein the light-emitting material film and the conductive material film cover the isolation structure and the isolation opening, wherein portions of the light-emitting material film and the conductive material film located in the isolation opening form a light-emitting functional layer and a second electrode, respectively, and at least a portion of the second sub-bottom portion overlaps the second electrode. The first electrode, the light-emitting functional layer, and the second electrode stacked on each other constitute a light-emitting device; Depositing a film layer of packaging material to cover the light-emitting device; forming a photoresist layer on the packaging material film layer, and performing a patterning process on the photoresist layer to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening; Etching the packaging material film layer and the light-emitting device based on the photoresist pattern, wherein the remaining portion of the packaging material film layer forms an encapsulation unit, and the light-emitting functional layer and the second electrode not covered by the encapsulation unit are etched, and at the isolation opening corresponding to the encapsulation unit, at least a portion of an orthographic projection on the substrate of an edge of the encapsulation unit located on a side of the isolation structure facing away from the substrate is located outside or inside the orthographic projection of the first electrode on the substrate; and The above process is repeated to form the light emitting device and the encapsulation unit at the isolation opening where the light emitting device is not formed, and all the encapsulation units constitute a first encapsulation layer.

20. A display device, characterized in that: A display panel comprising any one of claims 1 to 18 or a display panel obtained by the preparation method according to claim 19.

Images