Reconfigurable main frame with replaceable interface board with replaceable chamber port

Abstract

A main frame of a device manufacturing system includes a base, a plurality of facets on the base, and a cover over the plurality of facets. A first facet of the plurality of facets includes a frame. The base, the cover, and the plurality of facets together define an interior space including a robotic arm. A first replaceable interface board is attached to the first frame of the first facet. The first replaceable interface board includes a plurality of replaceable chamber ports. A first replaceable chamber port of the plurality of replaceable chamber ports is configured to provide access to a first processing chamber for the robotic arm. A second one of the plurality of replaceable chamber ports is configured to provide access to a second processing chamber for the robotic arm.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to electronic device manufacturing systems, and more particularly to a reconfigurable main frame for an electronic device manufacturing system that includes a replaceable interface plate having one or more replaceable chamber ports. Embodiments also relate to a replaceable interface plate for a main frame with attached replaceable chamber ports, and to a main frame with an integrated cover. Background Art

[0002] Conventional electronic device manufacturing systems (also referred to as device manufacturing systems) may include a main frame around which a plurality of process chambers and load lock chambers are arranged. The main frame may have a plurality of sidewalls (often referred to as "facets") to which the process chambers and / or load lock chambers are coupled. The facets of conventional main frames are machined to have a pre-arranged configuration, wherein the chamber ports have predetermined sizes, positions, etc. Once a conventional main frame is manufactured, the type, size, arrangement, and position of the chamber ports are fixed for that main frame. If the owner of the main frame desires a new configuration, a new main frame with the new configuration is then purchased. Summary of the Invention

[0003] According to a first aspect of the present disclosure, a main frame of a device manufacturing system includes a base, a plurality of facets on the base, and a cover above the plurality of facets. A first facet of the plurality of facets includes a first frame. The base, the cover, and the plurality of facets together define an interior space, which includes one or more robotic arms. A first replaceable interface plate is attached to the first frame of the first facet. The first replaceable interface plate includes a plurality of replaceable chamber ports. A first replaceable chamber port of the plurality of replaceable chamber ports is configured to couple to a first processing chamber and provide access to the first processing chamber for the robotic arm. A second replaceable chamber port of the plurality of replaceable chamber ports is configured to couple to a second processing chamber and provide access to the second processing chamber for the robotic arm.

[0004] According to a second aspect of the present disclosure, a replaceable interface plate for attachment to a facet of a main frame includes: a plurality of openings, each of the plurality of openings configured to receive a removable chamber port (also referred to as a replaceable chamber port). The replaceable interface plate further includes a first removable chamber port coupled to the replaceable interface plate at a first opening of the plurality of openings, wherein the first chamber port is configured to couple to a first processing chamber. The replaceable interface plate further includes a second removable chamber port coupled to the replaceable interface plate at a second opening of the plurality of openings, wherein the second chamber port is configured to couple to a second processing chamber.

[0005] According to a third aspect of the present disclosure, a method includes removing a first processing chamber from a main frame of a device manufacturing system, the main frame of the device manufacturing system including a base, a plurality of facets on the base, and a first replaceable interface plate, the first replaceable interface plate attached to the first frame of a first facet of the plurality of facets, the first replaceable interface plate including a plurality of replaceable chamber ports, wherein removing the first processing chamber from the main frame includes removing the first processing chamber from the first replaceable chamber port coupled to the first replaceable interface plate. The method further includes removing the first replaceable chamber port from a first opening of the first replaceable interface plate, wherein the first replaceable chamber port is configured to couple to the first processing chamber. The method further includes attaching a second replaceable chamber port to the first opening of the first replaceable interface plate, wherein the second replaceable chamber port is configured to couple to a second processing chamber different from the first processing chamber. The method further includes attaching the second processing chamber to the main frame by attaching the second processing chamber to the second replaceable chamber port. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The present disclosure is illustrated by way of example and not limitation, with like reference numerals indicating similar elements in the figures of the accompanying drawings. It should be noted that different references to "one" or "an" embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

[0007] Figure 1A A schematic top view of an electronic device manufacturing system with a reconfigurable main frame in a first configuration is shown, according to an embodiment of the present disclosure.

[0008] Figure 1B A schematic top view of an electronic device manufacturing system with a reconfigurable main frame in a second configuration is shown in accordance with an embodiment of the present disclosure.

[0009] Figure 1C A schematic top view of an electronic device manufacturing system with a reconfigurable main frame in a third configuration is shown in accordance with an embodiment of the present disclosure.

[0010] Figure 2A A perspective view of a reconfigurable main frame according to an embodiment of the present disclosure is shown.

[0011] Figure 2B A side view of a first exemplary replaceable interface plate according to an embodiment of the present disclosure is shown.

[0012] Figure 2C A side view of a second exemplary replaceable interface plate according to an embodiment of the present disclosure is shown.

[0013] Figure 2DShown is a side view of a third exemplary replaceable interface plate according to an embodiment of the present disclosure.

[0014] Figure 3 Depicted is a cross-sectional side view of a main frame and attached replaceable interface plate taken at the location of a chamber port, in accordance with an embodiment of the present disclosure.

[0015] Figure 4 A process for assembling a reconfigurable mainframe of an electronic device manufacturing system is shown in accordance with an embodiment of the present disclosure.

[0016] Figure 5A A first method for replacing a process chamber of a main frame according to an embodiment of the present disclosure is shown.

[0017] Figure 5B A second method for replacing a process chamber of a main frame according to an embodiment of the present disclosure is shown.

[0018] Figure 6 A schematic isometric view of a reconfigurable main frame for an electronic device manufacturing system is shown in accordance with an embodiment of the present disclosure.

[0019] Figure 7A A replaceable interface plate with replaceable chamber ports for a reconfigurable main frame of an electronic device manufacturing system is shown in accordance with an embodiment of the present disclosure.

[0020] Figure 7B The embodiment according to the present disclosure is shown Figure 7A The chamber side of the replaceable interface plate where the replaceable chamber port is removed.

[0021] Figure 7C The embodiment according to the present disclosure is shown Figure 7A The main frame side of the replaceable interface plate where the replaceable chamber port is removed.

[0022] Figure 8A Shown is a replaceable chamber port for a replaceable interface plate according to an embodiment of the present disclosure.

[0023] Figure 8B The embodiment according to the present disclosure is shown Figure 8A A top isometric view of the body of the replaceable chamber port.

[0024] Figure 8C The embodiment according to the present disclosure is shown Figure 8A Isometric view of the bottom of the body of the replaceable chamber port. DETAILED DESCRIPTION

[0025] Embodiments relate to a reconfigurable main frame (also referred to as a transfer chamber) having one or more replaceable interface plates, the one or more replaceable interface plates including one or more replaceable chamber ports. The reconfigurable main frame includes a plurality of facets, at least one of which includes a frame configured to receive a replaceable interface plate. In one embodiment, the reconfigurable main frame includes a frame for each facet of the reconfigurable main frame. A replaceable interface plate can be attached to each frame. A cover can be positioned above the frame of the facet and can be secured to the replaceable interface plate. In embodiments, the cover is an integral cover that is inseparable from the frame of the reconfigurable main frame. In embodiments, the replaceable interface plate is load-bearing, while the frame does not bear the load caused by exposing the main frame to a vacuum. Therefore, when the interior space of the main frame is evacuated to a vacuum, the replaceable interface plate is subjected to vertical (and horizontal) forces, but little or no force is applied to the frame. In some embodiments, the cover includes a first plurality of weight transfer features protruding from the integral cover, and some or all of the replaceable interface plates include a second plurality of weight transfer features disposed on the top surface of the replaceable interface plate. The first plurality of weight transfer features may be configured to engage with the second plurality of weight transfer features to transfer load from the integrated cover to the replaceable interface plate.

[0026] In an embodiment, one or more replaceable interface plates include replaceable chamber ports. Thus, the reconfigurable main frame may include nested reconfigurability. If the chamber port position or number of chamber ports of the main frame is to be modified, the existing interface plate can be replaced with a new interface plate having a different number of chamber ports and / or different chamber port positions. However, if a new chamber using a different type of chamber port is to be attached to the main frame, the replaceable interface plate may not be changed, but rather the replaceable chamber port attached to the replaceable interface plate may be removed and replaced with a different replaceable chamber port. This maximizes the flexibility of the main frame's reconfiguration at minimal cost. Furthermore, in an embodiment, by separating the functionality of the chamber port from the functionality of the interface plate, the amount of material used to manufacture the interface plate can be reduced. For example, to manufacture an interface plate with an integrated chamber port, thick aluminum stock can be used to accommodate the features of the chamber port and the features of the rest of the interface plate. This can include machining away a large amount of aluminum stock for areas of the interface plate that are not part of the chamber port. However, by manufacturing the interface plate and the chamber port separately, it is possible to start with a thinner aluminum billet for the interface plate, thereby reducing material waste.

[0027] In some embodiments, the main frame may have a square or rectangular shape. One or more load lock chambers may be coupled to a facet of the main frame. In one embodiment, one or more load lock chambers are coupled to a replaceable interface plate on a facet of the main frame. In one embodiment, additional replaceable interface plates are connected to one or more additional facets of the main frame, and one or more processing chambers are coupled to some or all of the additional replaceable interface plates via one or more replaceable chamber ports attached to the additional replaceable interface plates. The processing chambers may implement various substrate processes, and the processing chambers coupled to different replaceable interface plates on the facets via different replaceable chamber ports may have different sizes, chamber ports of different sizes, different connection types, different heights, etc. For example, some chamber ports may include a height to accommodate two end effectors of different pitches. Moreover, different replaceable interface plates may be configured to couple to the same number or different numbers of processing and / or load lock chambers. For example, one replaceable interface plate may be configured to couple to a single processing chamber of a first size, a second replaceable interface plate may be configured to couple to two processing chambers, each having a second size different than the first size, and so on.

[0028] One or more replaceable chamber ports on each replaceable interface plate can connect each of the load lock chamber and the processing chamber to a transfer chamber to allow substrates to be transferred therebetween. Different types of replaceable chamber ports can be connected to the same and / or different replaceable interface plates, where the type of chamber port to be used can be based at least in part on the type of chamber to which the replaceable interface plate will be attached. The size and position of the chamber ports can be designed on each replaceable interface plate to accommodate the number and size of chambers that can be coupled to each facet, and can be selected based on the type of chamber to which they are to be connected. An electronic device manufacturing system having such a main frame can allow a wider variety and more diverse sequences of substrate processing to be implemented in a single system, thereby improving the versatility, capability and / or efficiency of such an electronic device manufacturing system. In other aspects, a method of assembling an electronic device manufacturing system is provided.

[0029] The reconfigurable main frame and replaceable interface plate with replaceable chamber ports disclosed in the embodiments offer several advantages over conventional main frames. Conventional main frames have a single design determined at the time of manufacture. This single design has a fixed number and type of chamber ports, with fixed sizes and locations. If, at any time, it becomes advantageous to change the configuration of such a conventional main frame, the available option is to purchase a new main frame with the new configuration. In contrast, the reconfigurable main frame can be reconfigured at any time by manufacturing new replaceable interface plates and / or by manufacturing new chamber ports. If the new configuration is advantageous, one or more new replaceable interface plates with the new configuration can be manufactured and / or the existing replaceable chamber ports can be replaced with one or more new chamber ports with the new configuration or type. The existing replaceable interface plate can then be removed from the main frame and the new one can be attached to it. Alternatively, the existing chamber ports can be removed from the replaceable interface plate and new ones can be installed on the replaceable interface plate. Thus, in the embodiments, the flexibility of the main frame is significantly improved. Furthermore, the useful life of the main frame can be extended because the main frame can be updated with new replaceable interface plates and / or new chamber ports as new processing chambers become available, new slit valve technology is developed, new local center finding (LCF) technology is developed (e.g., using light emitting diodes (LEDs), lasers, and / or other scanning methods to determine the location of a wafer within a pocket of a robot blade or end effector), etc. Old replaceable interface plates and / or replaceable chamber ports having outdated slit valve technology, outdated local center finding technology, etc. can, for example, be replaced with new replaceable interface plates and / or chamber ports having new slit valve technology and / or new local center finding technology, etc.

[0030] As used herein, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a substrate" includes a single substrate (e.g., a single wafer) as well as a mixture of two or more substrates; reference to "a processing chamber" includes the processing chamber as well as a mixture of two or more processing chambers, etc.

[0031] As used herein, the term "about" with respect to a measured amount refers to the normal variation in the measured amount as would be expected by one of ordinary skill in the art in making the measurements and exercising the level of care that would be expected of one of ordinary skill in the art, as well as the precision of the measuring equipment. In certain embodiments, the term "about" includes ±10% of the recited number, such that "about 10" would include 9 to 11.

[0032] Unless otherwise indicated herein, the enumeration of ranges of values herein is intended only to serve as a shorthand method of referring individually to each individual value falling within the range, and each individual value is incorporated into the specification as if it were individually enumerated herein. Unless otherwise indicated herein or clearly contradicted by the context, all methods described herein can be practiced in any suitable order. The use of any and all examples or exemplary language (e.g., "such as") provided herein is intended only to illustrate certain materials and methods and does not limit the scope. Any language in the specification should not be construed as indicating that any unrequested element is necessary for the practice of the disclosed materials and methods.

[0033] Figures 1A-1C A schematic top view of an electronic device manufacturing system having a reconfigurable main frame with one or more replaceable interface plates and / or replaceable chamber ports is shown. Figure 1A A schematic top view of a first configuration 100A of an electronic device manufacturing system according to an embodiment of the present disclosure is shown. Figure 1B A schematic top view of a second configuration 100B of an electronic device manufacturing system according to an embodiment of the present disclosure is shown. Figure 1C A schematic top view of a third configuration 100C of an electronic device manufacturing system according to an embodiment of the present disclosure is shown.

[0034] An electronic device manufacturing system is configured to process substrates and may include a main frame (also referred to as a transfer chamber) 104 having four facets 101A-101D. Although the four facets 101A-101D are shown as a rectangular configuration, the main frame 104 may alternatively have other numbers of facets (e.g., 5 facets, 6 facets, 7 facets, 8 facets, etc.) and / or other shapes. In embodiments, the facets may have the same size (e.g., the same width) or different sizes. In one embodiment, the main frame 104 has a rectangular shape, wherein facets 101A and 101C are approximately parallel to each other, facets 101B and 101D are approximately parallel to each other, and facets 101A and 101C are approximately perpendicular to facets 101B and 101D. In one embodiment, facets 101B and 101D have a first length that is at least twice the second length of facets 101A and 101C. In one embodiment, facets 101B and 101D have a length of approximately 100-150 inches, and facets 101A and 101C have a length of approximately 40-60 inches. In one embodiment, main frame 104 has a pentagonal shape. In one embodiment, main frame includes a first facet having a first length, a second facet and a third facet located on either side of the first facet, each of the second facet and the third facet having a second length greater than the first length, and a fourth facet and a fifth facet connected to the second facet and the third facet, respectively, each of the fourth facet and the fifth facet having a third length greater than or equal to the first length and less than the second length.

[0035] The main frame 104 may include an interior space 134, wherein the facets 101A-101D may define the sidewalls of the interior space 134. The main frame 104 may additionally include a base (not shown) and a cover (not shown). The facets 101A-101D, the base, and the cover may together define the interior space 134. In an embodiment, the cover is an integral, non-removable cover. One or more robotic arms (also referred to as a robot assembly) 136 may be disposed within the interior space 134 of the main frame 104. Although a single robotic arm 136 is shown, in some embodiments, the transfer chamber includes dual robotic arms (e.g., a first robotic arm and a second robotic arm). During operation of the main frame 104, the interior space 134 may typically be under vacuum.

[0036] Each of each facet 101A-101D can include a frame and can have a replaceable interface plate attached thereto. Alternatively, a subset of facets 101A-101D can include a frame with a replaceable interface plate attached thereto. Other facets can be manufactured in a conventional manner, wherein the built-in sidewall has a fixed configuration. For each facet with a frame rather than a fixed configuration, a replaceable interface plate can be attached to the frame of the facet and can form the sidewall of the facet. In an embodiment, each facet is configured to receive at most a single replaceable interface plate. At any time, the existing replaceable interface plate attached to the facet can be removed, and a new replaceable interface plate with different designs can be attached to the facet. Therefore, main frame 104 is a reconfigurable main frame with a flexible design. In addition, one or more replaceable interface plates include one or more replaceable chamber ports, which further increases the design flexibility of the main frame.

[0037] exist Figure 1A 101C, replaceable interface plate 130A is attached to facet 101D, and replaceable interface plate 131 is attached to facet 101A. Replaceable interface plate 128A has three attached replaceable chamber ports 132. Each replaceable chamber port 132 can be configured to attach to a specific type of chamber (e.g., a specific type of processing chamber or load lock chamber) and allow a horizontally oriented substrate 140 to pass therethrough (e.g., into and out of the attached processing chamber). Substrate 140 can be a wafer (e.g., a semiconductor wafer or a non-semiconductor device substrate), a glass sheet or panel, and / or other workpiece used to manufacture electronic devices or circuit elements.

[0038] Each replaceable interface plate 128A, 130A may include an opening for each chamber port 132. This opening may be an elongated slot or slit formed in the sidewall of the replaceable interface plate 128A, 130A. The replaceable chamber port 132 may be attached to the replaceable interface plate 128A, 130A at each opening and may include, for example, a slit valve or other suitable device for opening and closing the chamber port 132 and / or including a local center finder (LCF) suitable for determining the position of the substrate 140 transferred through the chamber port 132. The replaceable chamber port 132 may additionally or alternatively include other sensors and / or metering devices for measuring the characteristics of the substrate passing through the chamber port 132. For example, the replaceable chamber port 132 may include a non-contact temperature sensor (for example, an infrared temperature sensor), a particle detection sensor, a film thickness sensor, etc. The slit valve may be any suitable conventional configuration, for example, an L-motion slit valve. Other suitable devices may also be used to open and close the chamber port 132. In embodiments, the replaceable chamber port 132 may include a single door or dual doors (eg, a first door on the interior of the replaceable interface plate at the chamber port and a second door on the exterior of the replaceable interface plate at the chamber port).

[0039] Three process chambers 106, 108, 110 are attached to a replaceable interface plate 128 A. Each process chamber 106-110 is aligned with a replaceable chamber port 132 mounted to the replaceable interface plate 128A.

[0040] The replaceable interface plate 130A has three replaceable chamber ports 132 attached thereto. Three process chambers 112, 114, 116 are attached to the replaceable interface plate 130A. Each process chamber 112-116 is aligned with a replaceable chamber port 132 mounted to the replaceable interface plate 130A.

[0041] The replaceable interface plate 129 is a solid plate without openings. The replaceable interface plate 131 includes an attached replaceable chamber port 132. The replaceable interface plate 131 is coupled to one or more load lock chambers 126 (e.g., it may include two side-by-side load lock chambers). In one embodiment, the replaceable interface plate 131 includes one or more integrated chamber ports that couple to the load lock chambers 126.

[0042] Each of the load lock chambers 126 can be a batch type or a single substrate type load lock chamber. In some embodiments, the load lock chamber 126 can be a stacked load lock chamber. For example, the load lock chamber 126 can be a double-stacked load lock chamber, a triple-stacked load lock chamber, a load lock chamber with four or more stacked load locks (e.g., a quad load lock chamber), etc. Alternatively, the load lock chamber 126 can be a single-space load lock chamber. Each of the load lock chambers 126 can be configured to couple to a corresponding chamber port 132. For example, a stacked load lock chamber 126 that may have two separate substrate spaces can have two vertically aligned ports that correspond to the vertically aligned chamber ports 132. A triple-stacked load lock chamber that may have three separate substrate spaces can have three vertically aligned ports corresponding to the vertically aligned chamber ports. A single-space load lock chamber can have a single port that corresponds to the single chamber port 132. Any one or more of the load lock chambers 126 can be stacked load lock chambers, triple-stacked load lock chambers, and / or single-space load lock chambers. Also, in some embodiments, any one or more of the load lock chambers 126 can be chambers with processing capabilities. That is, any one or more of the load lock chambers 126 or any space therein can be capable of performing substrate preheating, abatement, cooling, and / or other processing. Each load lock chamber 126 can include an additional port 137 configured to couple to a factory interface 102 (also referred to as an equipment front end module (EFEM)).

[0043] The mainframe 104, the processing chambers 106-116, and / or the load lock chamber 126 can each operate at vacuum pressure. The processing chambers 106-116 can perform the same or different processes on the substrate 140, including, for example, deposition, oxidation, nitridation, etching, grinding, cleaning, lithography, inspection, etc. Other processes can also be performed therein.

[0044] The main frame 104 may also include a robotic assembly 136 within the interior space 134. The robotic assembly 136 can be configured to transport one or more substrates 140 to and from each of the processing chambers 106-116 and the load lock chamber 126. The robotic assembly 136 can be configured to transfer substrates 140 directly from any chamber to any other chamber attached to the main frame 104. In some embodiments, the substrates 140 can be transferred by the robotic assembly 136 in any order or direction. In some embodiments, the robotic assembly 136 may have dual robotic arms and / or transport blades (or more transport blades, also known as end effectors), each of which can independently extend to and retract from any chamber attached to the main frame 104, thereby increasing system throughput by enabling simultaneous transfer of substrates. In some embodiments, the robotic assembly 136 may have a single transport blade. In some embodiments, the robotic assembly 136 may include one or more SCARA (Selective Compliance Articulated Robot Arm) robots. Alternatively, the robotic assembly 136 may be any suitable mechanism for transferring substrates between chambers attached to the main frame 104, such as a linear robot or a non-linear robot.

[0045] The load lock chambers 126 can be coupled to the factory interface 102, which can be coupled to one or more FOUPs (front opening unified pods) 118 or other substrate carriers. One or more load lock chambers 126 can provide a first vacuum interface between the factory interface 102 and the transfer chamber 126. In some embodiments, each load lock chamber 126 can increase substrate throughput by alternately connecting to the mainframe (transfer chamber) 104 and the factory interface 102. That is, while one load lock chamber 126, or any space in a stack or tri-stack of load lock chambers, is connected to the transfer chamber 104, other load lock chambers 126, or other spaces in the stack or tri-stack of load lock chambers, can be connected to the factory interface 102. Substrate transfer between the factory interface 102, the load lock chambers 126, and the transfer chamber 104 can be performed in any other suitable manner.

[0046] Each of the FOUPs 118 can be a container having a fixed cassette therein for holding a plurality of substrates. The FOUPs 118 can each have a front opening interface configured for use with the factory interface 102. The factory interface 102 can have a buffer chamber (not shown) and one or more robotic assemblies 138 configured to transfer substrates 140 by linear, rotational, and / or vertical movement between the FOUPs 118 and the load lock chambers 126. The substrates can be transferred between the FOUPs 118 and the load lock chambers 126 in any order or direction. Each of the load lock chambers 126 can be a batch type or a single substrate type load lock chamber.

[0047] Controller 171 can control the operation of robotic assembly 138, robotic assembly 136, and / or the electronic device manufacturing system. Controller 171 can control the processing and transport of substrates 140 within and through the electronic device manufacturing system. Controller 171 can be, for example, a general-purpose computer and / or can include a microprocessor or other suitable CPU (central processing unit), memory for storing software routines for controlling the electronic device manufacturing system, input / output peripherals, and supporting circuitry (e.g., a power supply, clock circuitry, circuitry for driving robotic assemblies 138, 136, cache, and / or the like). Controller 171 can be programmed, for example, to sequentially process one or more substrates through each of the processing chambers attached to mainframe 104. In other embodiments, controller 171 can be programmed to process substrates through the processing chambers in any order. In yet another embodiment, controller 171 can be programmed to skip and / or repeat processing of one or more substrates in one or more processing chambers. Alternatively, controller 171 can be programmed to process one or more substrates in the electronic device manufacturing system in any suitable manner.

[0048] The electronic device manufacturing system may have other suitable numbers of FOUPs 118 and / or load lock chambers 126 than those shown. In some embodiments, the number of load lock chambers coupled to facet 101A can be independent of the number of process chambers coupled to any of facets 101B-101D. For example, the number of load lock chambers can be different from the maximum number of process chambers coupled to a facet. Furthermore, in some embodiments, up to four process chambers can be coupled to a single facet, or more than four process chambers can be coupled to a single facet, depending on the size of mainframe 104 relative to the size of the four process chambers.

[0049] Figure 1B Shown with Figure 1A The same FOUP 118, factory interface 102, load lock 126 and main frame 104 are shown. However, Figure 1B10. In the second configuration 100B, replaceable interface plate 128A has been removed from facet 101B and replaceable interface plate 128B has been attached to facet 101B. Similarly, replaceable interface plate 130A has been removed from facet 101D and replaceable interface plate 130B has been attached to facet 101D. Replaceable interface plate 128B has two attached replaceable chamber ports 132, opposite the three replaceable chamber ports 132 of replaceable interface plate 128A. Similarly, replaceable interface plate 130B has two replaceable chamber ports 132, opposite the three replaceable chamber ports 132 of replaceable interface plate 130A. Thus, in the second configuration 100B, process chambers 106, 108, 112, and 114 have been repositioned, and process chambers 110 and 116 have been removed.

[0050] Figure 1C Shown with Figures 1A-1B The same FOUP 118, factory interface 102, load lock 126 and main frame 104 are shown. However, Figure 1C 10. In the third configuration 100C, replaceable interface plate 128A has been removed from facet 101B, and replaceable interface plate 128C has been attached to facet 101B. Similarly, replaceable interface plate 130A has been removed from facet 101D, and replaceable interface plate 130C has been attached to facet 101D. Replaceable interface plate 128C has four replaceable chamber ports 132, opposite the three replaceable chamber ports 132 of replaceable interface plate 128A. Replaceable interface plate 130C has three replaceable chamber ports 132, but they are in a different position than the three replaceable chamber ports 132 of replaceable interface plate 130A. In the third configuration 100C, process chamber 112 is in the same position, but process chambers 106, 108, 110, 114, and 116 have been removed and replaced by process chambers 122, 124, 125, and 127.

[0051] As shown, any type of process chamber can be connected to the facet of the main frame 104 via a replaceable interface plate. Although not shown, any replaceable chamber port can be removed from one of the replaceable interface plates and replaced with a different replaceable chamber port without changing the replaceable interface plate itself, thereby providing greater flexibility in the configuration of the electronic processing system. Some examples of process chambers include a quad process chamber (e.g., including process chambers 106-116), a single process chamber (e.g., including process chambers 125 and 127), and a dual process chamber (e.g., including process chambers 122 and 124).

[0052] Each replaceable chamber port 132 may share a size and / or shape, or have a different size and / or shape. Each replaceable interface plate 128A-128C, 130A-130C, 129, 131 may include the same or different numbers of replaceable chamber ports 132, which may have similar or different sizes and / or shapes. For example, some replaceable chamber ports may have a slit valve having a first width (e.g., to receive a 200 mm wafer), some replaceable chamber ports may have a slit valve having a second width (e.g., to receive a 300 mm wafer), and some replaceable chamber ports may have a slit valve having a third width. The width of the slit valve of each replaceable chamber port 132 is at least wide enough to allow the substrate 140 to pass therethrough. The different sized replaceable chamber ports may allow the robot assembly 136 to reach different areas within the chamber coupled to one of the facets 101A-101D. In some embodiments where the replaceable interface plate has two or more replaceable chamber ports, the replaceable chamber ports may not be laterally centered in the baseboard interface plate and / or spaced equidistant from one another. In some embodiments where the replaceable interface plate has a single replaceable chamber port, the replaceable chamber port may be laterally centered or offset in the facet.

[0053] In an example, the replaceable interface plate 128A is interchangeable with a plurality of additional replaceable interface plates having a) a different number of attached replaceable chamber ports than the replaceable interface plate 128A, b) a different location of one or more of the replaceable chamber ports as compared to the plurality of replaceable chamber ports in the replaceable interface plate 128A, c) a different size of one or more of the replaceable chamber ports as compared to the plurality of replaceable chamber ports in the replaceable interface plate 128A, d) a different type of slit valve in the replaceable chamber port than the slit valve of the replaceable interface plate 128A, and / or e) a different type of local center finder than that of the replaceable interface plate 128A.

[0054] Each replaceable interface plate can have various numbers, sizes, and / or combinations of openings for attaching replaceable chamber ports, as long as the width of the facet is suitable for accommodating these numbers, sizes, and / or combinations of replaceable chamber ports. For example, in some embodiments, a replaceable interface plate may have one attached replaceable chamber port 132 instead of three replaceable chamber ports 132. In other embodiments, one replaceable interface plate may have one replaceable chamber port 132 of a first width and one replaceable chamber port 132 of a second width, while another replaceable interface plate may have one replaceable chamber port 132 of a first width and one replaceable chamber port 132 of a third width. As long as the facet has the appropriate width, various combinations of replaceable chamber ports are possible. This allows the main frame 104 to be customized to couple to a specific type and number of processing chambers and load lock chambers. In an example, the first width can be approximately 1.2 meters, the second width can be approximately 2.4 meters, and the third width can be approximately 800 mm.

[0055] In some embodiments, two electronic device manufacturing systems can be clustered. That is, a facet of each main frame 104, such as facet 101C of the first main frame and facet 202 of the second main frame, can each include a replaceable interface board that enables the two main frames to be coupled (e.g., with one or more load locks inserted between the two main frames). Alternatively, a single interface board can be coupled to the first main frame on a first side and to the second main frame on an opposite side. Such an interface board can be referred to as a pass-through interface board. The main frames can be coupled in a manner that provides a pass-through chamber for transferring substrates between the two main frames. This can further enhance the versatility, capability, and / or efficiency of such an electronic device manufacturing system.

[0056] Figure 2A A perspective view of a reconfigurable main frame 200 according to an embodiment of the present disclosure is shown. In one embodiment, the reconfigurable main frame 200 may correspond to Figure 1A-1C main frame 104.

[0057] The reconfigurable main frame 200 includes a base 206 (also referred to as a floor) upon which a set of frames are mounted. Each frame can correspond to and frame a side or facet of the main frame 200. Conceptually, the set of frames can be a single three-dimensional frame 201 having multiple frame faces, each of which frames a facet of the main frame 200. The frame 201 can include columns 204A-204D and can further include beams 208A-D connecting the columns 204A-204D. Each frame (or frame face) can include a portion of the base, a pair of columns, and corresponding beams connecting the pair of columns. For example, the base 206, columns 204B-204C and beam 208A can constitute a first frame (or frame face) of a first small face, the base 206, columns 204A-204B and beam 208B can constitute a second frame (or frame face) of a second small face, the base 206, columns 204A and 204D and beam 208C can constitute a third frame (or frame face) of a third small face, and the base 206, columns 204C-204D and beam 208D can constitute a fourth frame (or frame face) of a fourth small face.

[0058] Each frame (or frame face) can include a lip 210A, 210B in the base 206. The lips 210A-210B can be configured to support forces transmitted to the lips 210A-210B through a replaceable interface plate attached to the facet. Additionally, each frame (or frame face) can include a groove or other feature that receives an O-ring 215, 220. The O-ring can seal the replaceable interface plate to the frame (or frame face).

[0059] As shown, a replaceable interface plate 230 is attached to the facet frame (or frame face) of the main frame 200. The replaceable interface plate 230 can be attached to the frame by bolts, screws, and / or other attachment mechanisms. The replaceable interface plate 230 may include a number, size, and position of openings and receiving areas 234, 236 for attaching replaceable chamber ports, each of which may be configured to provide a path to the processing chamber for the robot arm. Each attached replaceable chamber port may include one or more slit valves (not shown), LCFs (not shown), and / or other elements attached thereto or integrated therein.

[0060] The replaceable interface plate 230 can be a metal plate. For example, the replaceable interface plate can be formed from aluminum, an aluminum alloy, steel, or other metals. In some embodiments, the replaceable interface plate includes a surface treatment, such as a coating or an anodizing layer (e.g., an Al2O3 anodizing layer). Examples of coatings include coatings deposited by chemical vapor deposition (CVD), atomic layer deposition (ALD), electroplating, and the like. Some example coatings include dielectric coatings, Al2O3 coatings, nickel plating, Y2O3 coatings, and the like. The replaceable interface plate 230 can be coated before being attached to the main frame 200. Alternatively, the main frame 200 can be coated after the replaceable interface plate is attached. Therefore, in some embodiments, a portion of the replaceable interface plate 230 has a surface treatment.

[0061] In some embodiments, the replaceable interface plate 230 additionally includes a step 232 on the interior bottom surface of the replaceable interface plate 230. This step can mate with a lip on the sidewall of the base 206, which forms a frame (or frame face) to which the replaceable interface plate 230 is mounted. In some embodiments, the base 206 extends beyond the frame, and the bottom of the replaceable interface plate 230 can rest on the base 206 for load transfer.

[0062] The main frame is configured to operate under vacuum, which may result in large vertical and horizontal forces being applied to the main frame 200 based on the pressure difference between the interior space of the main frame and the exterior of the main frame (e.g., which may be at atmospheric pressure). Frame 201 may bend and / or buckle if subjected to force. Therefore, in an embodiment, a replaceable interface plate (e.g., replaceable interface plate 230) is designed to support the main frame 200, and the frame of the first facet does not support the forces caused by the vacuum. Therefore, the replaceable interface plate 230 withstands the vertical forces caused by the pressure difference between the interior space of the main frame and the exterior of the main frame on the main frame 200. These vertical forces can be transmitted from the integrated cover (not shown) to the replaceable interface plate 230 and transmitted to the base at the interface between the step 232 and the lip of the base that cooperates with the step 232 (or another interface between the replaceable interface plate 230 and the base 206).

[0063] In one embodiment, when the main frame 200 is under vacuum, a vertical force of approximately 95,000 pounds of pressure is applied to the main frame 200. In an embodiment where the two facets have a length of approximately 100-150 inches and the two facets have a length of approximately 40-60 inches, approximately 30-40% of the vertical force is supported by each replaceable interface plate attached to the long facet, and approximately 10-15% of the force is supported by each replaceable interface plate connected to the short facet. Thus, a single replaceable interface plate can be configured to withstand a force of approximately 28,500 to 38,000 pounds without bending.

[0064] In another embodiment, a step and lip are not used to transmit vertical forces from one or more replaceable interface plates to the base 206. Instead of mating steps and lips, the replaceable interface plate 230 may include pins on the inner bottom surface of the replaceable interface plate. The pins may be, for example, square or round pins and may be periodically spaced. The plurality of pins may mate with one or more features in the sidewall of the base, and the vertical forces may be transmitted from the replaceable interface plate to the base at the interface of the plurality of pins and the one or more features. The features may be, for example, holes, lips, or other features that mate with the pins.

[0065] In an alternative embodiment, the base extends out from under the replaceable interface plate, and vertical forces can be transferred from the replaceable interface plate to the base without the use of any steps, lips, pins, or other features in the base or replaceable interface plate.

[0066] Although not shown, additional replaceable interface plates can be attached to the remaining facets of main frame 200. Additionally, an integrated cover can be formed on top of the main frame above frame 201 and above the replaceable interface plates. In an embodiment, the integrated cover includes a first plurality of load-transferring features that contact a second plurality of load-transferring features on the replaceable interface plate. In one embodiment, the first plurality of load-transferring features are set screws extending vertically downward from the cover toward the replaceable interface plate, and the second plurality of load-transferring features are inserts or attachments on the top surface of the replaceable interface plate. The replaceable interface plate can be made of a relatively soft metal (e.g., aluminum), and the second plurality of load-transferring features can be made of a harder metal (e.g., steel). Therefore, if the first plurality of load-transferring features directly engage the material from which the replaceable interface plate is made, they will damage the replaceable interface plate. However, the first plurality of load-transferring features will not damage the second plurality of load-transferring features in the top surface of the replaceable interface plate.

[0067] Figure 2B A side view of a first exemplary replaceable interface plate 250 according to an embodiment of the present disclosure is shown. The first replaceable interface plate 250 includes a step 232 and three openings 252, 254, 256, all having the same width, height, and vertical position.

[0068] Figure 2C A side view of a second exemplary replaceable interface plate 260 according to an embodiment of the present disclosure is shown. The second replaceable interface plate 260 includes a step 232 and three openings 262, 264, 266 having different widths and heights.

[0069] Figure 2DA side view of a third exemplary replaceable interface plate 270 according to an embodiment of the present disclosure is shown. The third replaceable interface plate 270 includes a step 232 and two openings 272, 274 having equal width and height, but different vertical positions.

[0070] In an embodiment, any one of the first exemplary replaceable interface plate 250 , the second exemplary replaceable interface plate 260 , or the third exemplary replaceable interface plate 270 may be attached to the main frame 200 .

[0071] Figure 3 A cross-sectional side view of a main frame 300 and an attached replaceable interface plate 330 is depicted, taken at the location of an opening 335 machined into the replaceable interface plate 330, in accordance with an embodiment of the present disclosure. The main frame 300 includes a base 315, a frame face (including beams 320, a plurality of columns (not shown), and a portion of the base), and an integrated cover 325 attached to and / or a portion of the frame including the beams 320, base 315, and columns (not shown). The frame may include beams 320, bases 315, and columns for one or more facets 310 of the main frame 300. The replaceable interface plate 330 is attached to the frame framing the facets 310 of the main frame 300.

[0072] The base 315 includes a lip 340 on a sidewall of the base 315. The replaceable interface plate 330 includes a step 342 on the inner bottom surface of the replaceable interface plate 330, wherein the step 342 mates with the lip 340 on the sidewall of the base 315. As previously described, when the interior space 305 of the main frame 300 is evacuated, forces 350 may be applied to the main frame 300. These forces may be concentrated forces 352 that the replaceable interface plate 330 is subjected to. As shown, a first load transfer feature 370 of the cover engages a second load transfer feature 372 of the replaceable interface plate. In one embodiment, the first and second load transfer features 370, 372 are constructed of a harder material than the rest of the cover and / or replaceable interface plate. Therefore, the first and second load transfer features 370, 372 can engage with considerable force without deforming or damaging the integrated cover 325 or the replaceable interface plate 330. Force may be transferred from the integrated cover 325 through the replaceable interface plate 330 to the lip 352 of the base 315 .

[0073] The frame for the facet to which the replaceable interface plate 330 is attached (e.g., the sidewalls including the beams 320, posts (not shown), and base) may each include a notch or groove 344 into which an O-ring may be inserted to ensure a seal between the replaceable interface plate 330 and the frame.

[0074] In one embodiment, the replaceable interface plate 330 includes a lip 390 located at the top of the inner surface of the replaceable interface plate 330. The beam 320 may include a corresponding step 392 that mates with the lip 390. Notably, the top of the step 392 does not contact the bottom of the lip 390. In other embodiments, the replaceable interface plate 330 does not include a lip, and the beam 320 does not include a step.

[0075] Figure 4 A method 400 for assembling a reconfigurable mainframe of an electronic device manufacturing system according to an embodiment of the present disclosure is shown. Some operations of method 400 may be performed by processing logic that can be executed on a computing device such as a general-purpose computer. For example, some operations may be performed using computer-aided design and / or computer-aided manufacturing (CAM) software installed on the computer.

[0076] At block 402 of method 400, a mainframe configuration is determined, including determining a first plurality of process chambers to be coupled to a first facet of the mainframe. Additionally, load locks and / or process chambers connected to one or more other facets of the mainframe may be determined.

[0077] At block 404, the locations of chamber ports appropriate for the determined mainframe configuration (e.g., to accommodate access to each process chamber and / or load lock) may be determined. At block 406, the configuration of one or more replaceable interface plates may be determined. The replaceable interface plates may be configured with openings and / or receiving areas for attaching replaceable chamber ports at each determined location. At block 408, the replaceable interface plates may be fabricated. This may include machining metal (e.g., aluminum) and / or applying a surface treatment to at least a portion of the replaceable interface plates.

[0078] At block 409, a chamber port design is determined for each receiving area of the replaceable interface plate. The replaceable chamber ports are manufactured based on the determined chamber port designs. At block 410, the replaceable chamber ports are mounted to the replaceable interface plate. This may include bolting or screwing the replaceable chamber ports to the replaceable interface plate at the receiving area.

[0079] At block 411, the replaceable interface plate is attached to the main frame (transfer chamber). This may include bolting or screwing the replaceable interface plate to the frame of the appropriate facet of the main frame. At block 412, the determined process chamber and / or load lock can then be attached to the appropriate replaceable chamber port according to the determined configuration.

[0080] The engineer can determine a new configuration of the main frame at any time. At this point, method 400 can be repeated. For example, a second plurality of process chambers can be determined to be coupled to the first facet of the main frame, new locations of a second plurality of chamber ports on the facet that will accommodate the second plurality of process chambers can be determined, a configuration of a second replaceable interface plate can be determined, the second replaceable interface plate having a receiving area for one of the second plurality of replaceable chamber ports at each new location, and the second replaceable interface plate can be manufactured. If the positions of the chamber ports do not change, the same replaceable interface plate can be used, but one or more replaceable chamber ports can be removed from the replaceable interface plate and replaced with different chamber ports.

[0081] The second replaceable interface plate may have at least one of: a) a different number of receiving areas for chamber ports than the first replaceable interface plate, b) a different location of one or more chamber ports compared to the plurality of chamber ports in the first replaceable interface plate, c) a different size of the one or more receiving areas for the replaceable chamber ports compared to the plurality of receiving areas for chamber ports in the first replaceable interface plate, etc.

[0082] A new replaceable chamber port may differ from a previously used replaceable chamber port in, for example, the type of slit valve used, the type of local center finder used, etc.

[0083] Prior to block 410, the existing process chamber may be removed from the chamber ports attached to the first replaceable interface plate, and the first replaceable chamber ports may then be removed from the first replaceable interface plate. Alternatively, prior to block 411, the existing process chamber may be removed from the chamber ports attached to the first replaceable interface plate, and the first replaceable interface plate may be removed from the main frame. Subsequently, the operations of blocks 410 and / or 411 may be performed such that the main frame has a completely new configuration (e.g., having a different number of chamber ports, chamber ports in different locations, a different number and / or type of process chambers, different types of chamber ports, etc.).

[0084] Figure 5A A first method 500 for replacing a process chamber of a mainframe according to an embodiment of the present disclosure is shown. The first method 500 can be performed to update the mainframe configuration when the size and / or location of the chamber ports of the original process chamber attached to the mainframe and the new process chamber to be replaced are the same.

[0085] At block 502 of method 500, a first process chamber is detached from a main frame of a device manufacturing system. The main frame includes a base, a plurality of facets on the base, and a first replaceable interface plate of the first frame attached to a first facet of the plurality of facets. The first replaceable interface plate includes a plurality of replaceable chamber ports. Detaching the first process chamber from the main frame includes detaching the first process chamber from the first replaceable chamber port coupled to the first replaceable interface plate.

[0086] At block 505 , the method includes detaching a first replaceable chamber port from a first opening of a first replaceable interface plate, wherein the first replaceable chamber port is configured to couple to a first processing chamber.

[0087] At block 506 , the method includes attaching a second replaceable chamber port to the first opening of the first replaceable interface plate, wherein the second replaceable chamber port is configured to couple to a second process chamber different from the first process chamber.

[0088] At block 508, the method includes attaching a second process chamber to the mainframe by attaching the second process chamber to the second replaceable chamber port. The second process chamber may have a differently shaped area for connecting to the chamber port and may not properly interface with the first chamber port. However, because the replaceable interface plate includes the replaceable chamber port, the first chamber port can be interchanged with the second chamber port to accommodate the different shape of the second process chamber.

[0089] Figure 5B A second method 550 for replacing a process chamber of a mainframe according to an embodiment of the present disclosure is shown. The second method 550 can be performed to update the mainframe configuration when the size and / or location of the chamber ports differ between the original process chamber attached to the mainframe and the new process chamber to be replaced. For example, the method 550 can be performed if the new process chamber has ports at a different height or level than the original process chamber attached to the mainframe.

[0090] At block 552 of method 550, the method includes removing a first process chamber from a main frame of a device manufacturing system. The main frame includes a base, a plurality of facets on the base, and a first replaceable interface plate of the first frame attached to a first facet of the plurality of facets. The first replaceable interface plate includes a plurality of replaceable chamber ports. Removing the first process chamber from the main frame includes removing the first process chamber from the first replaceable chamber port coupled to the first replaceable interface plate.

[0091] At block 555, the method includes removing a first replaceable interface plate from a first frame of a main frame.

[0092] At block 556, the method includes attaching a second replaceable interface plate to the first frame of the main frame, wherein the second replaceable interface plate has a second opening different from the first opening.

[0093] At block 560 , the method includes attaching a second replaceable chamber port to a second opening of a second replaceable interface plate, wherein the second replaceable chamber port is configured to couple to a second process chamber different from the first process chamber.

[0094] At block 568, the method includes attaching the second process chamber to the mainframe by attaching the second process chamber to the second replaceable chamber port. The second process chamber may have a port located in a different location than the first process chamber. Therefore, attaching the second process chamber to the mainframe may not be possible using the first replaceable interface plate. Therefore, a second replaceable interface plate may be manufactured and attached to the mainframe, wherein the second replaceable interface plate may have an opening at a new location suitable for the second process chamber.

[0095] Figure 6 A schematic isometric view of a reconfigurable main frame 605 for an electronic device manufacturing system according to an embodiment of the present disclosure is shown. The reconfigurable main frame 605 includes a frame (not shown) having four side facets (e.g., one side facet on each side of the frame). An integrated cover 610 is disposed above the frame. The integrated cover 610 includes one or more access panels 630, 632, 634, 636 that can be opened to gain access to the interior of the reconfigurable main frame 605. In one embodiment, the larger access panel 630 includes one or more smaller sub-access panels 632, 634.

[0096] Each facet of the reconfigurable main frame 605 includes an attached replaceable interface plate 612, 614, 616, 618. The replaceable interface plate 618 has no openings and is not configured to accommodate any chamber ports. In an embodiment, the replaceable interface plate 616 has two integrated chamber ports 640, 642 and is configurable to be coupled to a load lock chamber. The replaceable interface plates 612, 614 each include two attached replaceable chamber ports 620. As shown, the replaceable interface plate 614 includes a plate body 615 and attached replaceable chamber ports 620.

[0097] Figure 7A A replaceable interface plate assembly 614 with replaceable chamber ports 620 for a reconfigurable mainframe of an electronic device manufacturing system according to an embodiment of the present disclosure is shown. Figure 7AThe chamber side of the replaceable interface plate assembly 614 is shown. As shown, two replaceable chamber ports 620 are attached to receiving areas formed in the body of the replaceable interface plate 615. Each replaceable chamber port 620 includes a chamber port body to which a top plate 710 is mounted. Each replaceable chamber port 620 further includes one or more arms 705 extending vertically below the chamber port body. Each arm 705 can be moved vertically to open or close the slit valve of the replaceable chamber port 620.

[0098] The replaceable interface plate 615 includes a plurality of load transfer features 730 along the length of the top surface of the replaceable interface plate 615. Each load transfer feature can be a disk, a plate, or other object formed from a material having a higher hardness than the material of the body of the replaceable interface plate 615. For example, the body of the replaceable interface plate 615 can be made of aluminum, and the load transfer features 730 can be made of steel or iron. In one embodiment, the replaceable interface plate body 615 includes a plurality of threaded holes (e.g., rather than through holes), each of which receives a threaded insert. Each threaded insert can be a load transfer feature and can be configured to contact a load transfer feature (e.g., a set screw) on an integrated cover of the reconfigurable main frame.

[0099] The cover of the main frame, the replaceable interface plate 615 and / or the base may include one or more LCF devices or elements. The local center finders are each configured to determine the center of an object (e.g., a ring, a wafer, a substrate, etc.) passing through an associated chamber port 620 (e.g., which may include a slit value). The LCF may include an arrangement of laser and detector pairs. Each laser may project a laser beam that may be received by a corresponding detector in the laser and detector pair. In an embodiment, the laser directs the laser beam vertically or at an angle relative to the vertical direction. Each detector is located in the path of the laser beam from the corresponding laser. When a substrate (e.g., a wafer) passes through the chamber port 620, it blocks the laser beam so that the laser beam is not received by the detector. Based on known information about the size and shape of the substrate passing through the chamber port 620, known information about the positions of the laser and detector, and known information about the corresponding position of the transfer chamber robot at which the corresponding detector stops receiving the laser beam, the center of the substrate can be determined. Other types of LCFs may also be used, such as a camera-based local center finder and / or a runout ribbon-based local center finder.

[0100] In some embodiments, the base of the main frame includes one or more lasers that emit laser beams, and the cover of the main frame includes one or more laser detectors that receive the laser beams unless an object passes between the laser source and the laser detectors. In some embodiments, the base of the main frame includes one or more lasers, and the replaceable interface plate 615 includes one or more laser detectors. In some embodiments, the base of the main frame includes the lasers and detectors, and optical elements (e.g., optical fibers) in the replaceable interface plate 615 guide the beams from the lasers and / or to the detectors. In some embodiments, the lasers and detectors are integrated into the chamber port 620. In some embodiments, the lasers and detectors are integrated into the replaceable interface plate 615. In some embodiments, the lasers and detectors are integrated into the cover of the main frame, and optical elements (e.g., optical fibers) in the replaceable interface plate 615 guide the beams from the lasers and / or to the detectors.

[0101] In one embodiment, the replaceable interface plate body 615 includes one or more (e.g., a plurality) through-holes 732 through which a local center finder (LCF) beam (e.g., a laser beam) is directed. The through-holes can be configured to allow a laser beam from a laser of the local center finder (LCF) to pass through the replaceable chamber port 620 and reach a detector of the LCF. When a substrate passes through the chamber port, the LCF beam may be disrupted or interrupted, and the detector can detect the substrate. In one embodiment, an LCF device (e.g., a laser source and / or a detector) is integrated into and / or attached to the replaceable interface plate. In one embodiment, the LCF device is integrated into a cover of the main frame. In one embodiment, the replaceable interface plate body 615 includes a channel 734 for receiving a fiber optic cable that can guide one or more LCF beams so that they pass through the chamber port 620. Thus, the replaceable interface plate 615 may include one or more fiber optic cables disposed therein that are configured to direct a laser beam from a local center finder (LCF) to and through the chamber port 620 and / or to direct a laser beam from the chamber port to a detector of the LCF.

[0102] Figure 7B The embodiment according to the present disclosure is shown Figure 7A620 .

[0103] Figure 7C The embodiment according to the present disclosure is shown Figure 7A The main frame side of the replaceable interface plate is shown, wherein the replaceable chamber port is removed. As shown, the channel 734 may include a through hole at one end to allow the fiber optic cable to pass vertically through the replaceable interface plate so that it can illuminate the LCF beam through one or more LCF holes 732. The main frame side of the interface plate body 615 (also referred to as the replaceable interface plate) includes a lip 760 at the top of the replaceable interface plate 615, which extends toward the main frame and includes the load transfer feature 730. The main frame side of the replaceable interface plate 615 further includes a lip 762 at the bottom of the replaceable interface plate, which extends toward the main frame and is configured to contact the base plate or receiving area of the main frame. The main frame side of the replaceable interface plate 615 may further include an O-ring groove 764 for receiving an O-ring and / or a gasket groove 766 for receiving a radio frequency (RF) gasket for sealing the main frame.

[0104] Figure 8A A replaceable chamber port 620 for a replaceable interface plate is shown in accordance with an embodiment of the present disclosure. As shown, the replaceable chamber port 620 includes one or more arms 705 extending vertically below the chamber port 620. Each arm 705 can be moved vertically to open or close a slit valve of the replaceable chamber port 620. The replaceable chamber port further includes a top plate 710 that is removably secured to the top of the chamber port 620. The top plate 710 is removable to provide access to the interior of the chamber port 620, for example, for maintenance. In an embodiment, the chamber port 620 further includes an opening 804 for the slit valve and a groove 802 for receiving an O-ring to seal the processing chamber.

[0105] Figure 8B The embodiment according to the present disclosure is shown Figure 8A A top isometric view of the body of the replaceable chamber port with the arms 705 and top plate 710 removed. In particular, Figure 8BThe process chamber side of the replaceable chamber port 620 is shown. In one embodiment, the replaceable chamber port 620 includes dual O-ring grooves, each configured to receive an O-ring that seals the process chamber. In an embodiment, the dual O-ring grooves are concentric and enable differential pumping.

[0106] The area between the O-ring grooves 802A and 802B may be an intermediate vacuum region. The chamber port 620 may include one or more channels (i.e., holes) that fluidically couple the intermediate vacuum region to the vacuum port. A differential pump may be implemented to pump the intermediate vacuum region to a pressure between the pressure of the interior space of the mainframe and atmospheric pressure. A first O-ring may be disposed in the groove 802A of the chamber port 620, wherein the outer surface of the first O-ring is exposed to the external environment, and wherein the inner surface of the first O-ring is exposed to the intermediate vacuum region. A second O-ring may be disposed in the groove 802B of the chamber port 620, wherein the outer surface of the second O-ring is exposed to the intermediate vacuum region, and wherein the inner surface of the second O-ring is exposed to the interior space of the mainframe. The external environment may have a first pressure, the intermediate vacuum region may maintain a second pressure lower than the first pressure, and the interior space may maintain a third pressure lower than the second pressure.

[0107] Figure 8C The embodiment according to the present disclosure is shown Figure 8A 6. A bottom isometric view of the main frame side of the body of the replaceable chamber port 620. As shown, the replaceable chamber port 620 can include an oval surface 820 that engages with one or more O-rings on the replaceable interface plate. Additionally, the chamber port 620 includes one or more alignment features (e.g., a pair of alignment features) 825 for aligning the placement of the chamber port 620 against the replaceable interface plate. In embodiments, the alignment features 825 can be configured to mate with alignment features on the replaceable interface plate. For example, the alignment features 825 can include cylindrical protrusions that mate with cylindrical holes in the replaceable interface plate.

[0108] In the foregoing description, many specific details, such as specific materials, dimensions, processing parameters, etc., are set forth to provide a thorough understanding of the present disclosure. In one or more embodiments, specific features, structures, materials, or characteristics may be combined in any appropriate manner. As used herein, the terms "example" or "exemplary" mean serving as an example, instance, or illustration. Any aspect or design described herein as "example" or "exemplary" is not necessarily to be construed as being better or advantageous than other aspects or designs. On the contrary, the use of the terms "example" or "exemplary" is merely to present the concepts in a concrete manner. As used in this application, the term "or" is intended to represent an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X includes A or B" is intended to represent any natural inclusive arrangement. That is, if X includes A; X includes B; or X includes both A and B, then "X includes A or B" is satisfied in any of the foregoing cases. Throughout this specification, references to "one embodiment," "a specific embodiment," or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, appearances of the phrases "one embodiment," "a specific embodiment," or "one embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment.

[0109] The present disclosure has been described with reference to specific exemplary embodiments thereof. Accordingly, the description and drawings are to be regarded in an illustrative rather than a restrictive sense. Various modifications of the present disclosure in addition to those shown and described herein will be apparent to those skilled in the art and are intended to fall within the scope of the appended claims.

Claims

1. A main frame of a device manufacturing system, the main frame comprising: base; a plurality of facets on the base, wherein a first facet of the plurality of facets comprises a first frame; a cover over the plurality of facets, wherein the base, the cover, and the plurality of facets together define an interior space; one or more robotic arms, the one or more robotic arms being within the interior space; and a first replaceable interface plate attached to the first frame of the first facet, the first replaceable interface plate comprising a plurality of replaceable chamber ports, wherein: A first exchangeable chamber port of the plurality of exchangeable chamber ports is configured to couple to a first processing chamber and provide access to the first processing chamber for the robot arm; and A second exchangeable chamber port of the plurality of exchangeable chamber ports is configured to couple to a second processing chamber and provide access to the second processing chamber for the robot arm.

2. The main frame according to claim 1, further comprising: a first plurality of weight transfer features protruding from the cover; and A second plurality of weight transfer features is disposed on a top surface of the first replaceable interface plate, wherein the first plurality of weight transfer features engage the second plurality of weight transfer features to transfer a load from the cover to the first replaceable interface plate.

3. The main frame of claim 2, wherein the first plurality of weight transfer features comprises a first plurality of set screws extending vertically downward from the cover toward the first replaceable interface plate.

4. The main frame of claim 3, wherein the first replaceable interface plate is constructed of a first material having a first hardness, and wherein the second plurality of weight transfer features includes a plurality of features constructed of a second material having a second hardness greater than the first hardness.

5. The main frame of claim 4, wherein the plurality of features comprises a plurality of discs.

6. The main frame of claim 4, wherein the first replaceable interface plate comprises aluminum, and wherein the first plurality of weight transfer features and the second plurality of weight transfer features comprise at least one of steel or iron.

7. The main frame of claim 1, wherein the cover is integral with the main frame such that the cover cannot be removed from the plurality of facets.

8. The main frame of claim 7, wherein the integrated cover includes a plurality of access plates that are openable to provide access to the interior space.

9. The mainframe of claim 1 , wherein the first exchangeable chamber port has a first configuration suitable for coupling to the first processing chamber, and wherein the second exchangeable chamber port has a second configuration different from the first configuration suitable for coupling to the second processing chamber.

10. The main frame according to claim 1, further comprising: At least one of a laser or a detector of a local center finder integrated into the cover, wherein the local center finder is configured to detect a center of a substrate passing through the first exchangeable chamber port.

11. The main frame of claim 1, wherein the one or more robotic arms include a first robotic arm and a second robotic arm.

12. The main frame of claim 1 , wherein the first replaceable interface plate comprises one or more through holes configured to allow a laser beam from a laser of a local center finder (LCF) to pass through the first replaceable chamber port and reach a detector of the LCF.

13. The main frame of claim 1 , wherein the first replaceable interface board includes one or more fiber optic cables disposed therein, the one or more fiber optic cables being configured to direct a laser beam in at least one of the following ways: a) from a laser of a local center finder (LCF) to the first replaceable chamber port or b) from the first replaceable chamber port to a detector of the LCF.

14. A replaceable interface plate for attachment to a facet of a main frame, the replaceable interface plate comprising: a plurality of openings, each opening of the plurality of openings being configured to receive a replaceable chamber port; a first replaceable chamber port coupled to the replaceable interface plate at a first opening of the plurality of openings, wherein the first replaceable chamber port is configured to couple to a first processing chamber; and A second replaceable chamber port is coupled to the replaceable interface plate at a second opening of the plurality of openings, wherein the second replaceable chamber port is configured to couple to a second processing chamber.

15. The replaceable interface plate of claim 14, wherein the replaceable interface plate is configured to withstand a vertical force on the main frame caused by a pressure differential between an interior space of the main frame and an exterior of the main frame.

16. The replaceable interface plate of claim 14, wherein the first replaceable chamber port has a first configuration suitable for coupling to the first processing chamber, and wherein the second replaceable chamber port has a second configuration different from the first configuration suitable for coupling to the second processing chamber.

17. The replaceable interface plate of claim 14, wherein at least one of the first replaceable chamber port or the second replaceable chamber port is a dual-gate chamber port.

18. The replaceable interface plate of claim 14, further comprising at least one of: one or more through holes configured to allow a laser beam from a laser of a local center finder (LCF) to pass through the first exchangeable chamber port and reach a detector of the LCF; or One or more fiber optic cables disposed therein, the one or more fiber optic cables being configured to direct a laser beam in at least one of the following ways: a) from a laser of a local center finder (LCF) to the first replaceable chamber port or b) from the first replaceable chamber port to a detector of the LCF.

19. A method comprising: Removing a first process chamber from a main frame of a device manufacturing system, the main frame of the device manufacturing system comprising a base, a plurality of facets on the base, and a first replaceable interface plate, the first replaceable interface plate attached to a first frame of a first facet of the plurality of facets, the first replaceable interface plate comprising a plurality of replaceable chamber ports, wherein removing the first process chamber from the main frame comprises: removing the first process chamber from the first replaceable chamber port coupled to the first replaceable interface plate; removing the first replaceable chamber port from the first opening of the first replaceable interface plate, wherein the first replaceable chamber port is configured to couple to the first processing chamber; attaching a second replaceable chamber port to the first opening of the first replaceable interface plate, wherein the second replaceable chamber port is configured to couple to a second process chamber different from the first process chamber; and The second processing chamber is attached to the main frame by attaching the second processing chamber to the second exchangeable chamber port.

20. The method of claim 19, further comprising: Detaching the second process chamber from the main frame of the device manufacturing system, wherein detaching the second process chamber from the main frame comprises: detaching the second process chamber from a second replaceable chamber port coupled to the first replaceable interface plate; removing the first replaceable interface board from the first frame of the main frame; attaching a second replaceable interface plate to the first frame of the main frame, wherein the second replaceable interface plate has a second opening different from the first opening; attaching a third replaceable chamber port to the second opening of the second replaceable interface plate, wherein the third replaceable chamber port is configured to couple to a third process chamber different from the first process chamber and the second process chamber; and The third processing chamber is attached to the third exchangeable chamber port.

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