Efficient heat dissipation of wood home with self-heating plate structure and preparation method thereof

Abstract

The application discloses a kind of high-efficiency heat dissipation's wood home self-heating plate structure and preparation method thereof, comprising: carbon nanotube / aluminum nitride / boron nitride modifier preparation;Wood substrate pretreatment: wood veneer is completely immersed in sodium chlorite solution, hydrothermal treatment, washing, freeze, vacuum drying, and wood substrate template is obtained;Wood substrate template is immersed in carbon nanotube / aluminum nitride / boron nitride modifier, and it is taken out after impregnation treatment, and high thermal conductivity substrate is obtained after solidification;Self-heating plate assembly: milling two grooves as lower substrate on the surface of high thermal conductivity substrate, milling two convex strips as upper substrate on the surface of high thermal conductivity substrate, spraying or spraying adhesive, and lower substrate, electrothermal film, copper foil electrode, upper substrate are sequentially stacked from bottom to top.The application has the advantages of high-efficiency heat dissipation performance, high structural stability, electrode does not shift in the process of assembly hot-pressing and process feasibility.

Description

Technical Field

[0001] This invention belongs to the field of engineered wood panel manufacturing technology, specifically a structure and preparation method of a high-efficiency heat-dissipating self-heating wooden furniture panel. Background Technology

[0002] With the rapid development of smart home technology, self-heating wood panels, due to their combination of decoration and functionality, have been widely used in underfloor heating, wall heating, and smart furniture. Traditional self-heating panels often employ a structural design that embeds electric heating films, carbon fiber heating wires, or metal heating elements into the wood substrate. However, in practical applications, the following technical defects have been found: First, wood, as a poor conductor of natural heat, easily causes heat to accumulate around the heating element, leading to excessively high local temperatures, resulting in carbonization, cracking, and fire hazards in the wood layer. Second, existing laminated structures often use planar glued heating elements and copper foil electrodes, which are prone to displacement of components due to uneven pressure, resulting in a high scrap rate during the manufacturing process. Third, the significant difference in the coefficients of thermal expansion between the wood substrate and the heating element can easily lead to interface separation during long-term hot and cold cycles, causing increased thermal resistance and structural failure.

[0003] Existing invention patent (CN104818824 B) reports an electric heating floor and its manufacturing method, introducing the concept of a self-heating floor made by compositing graphene or carbon crystal electric heating film with a wood substrate. However, it overlooks the poor thermal conductivity of the wood substrate, thus requiring further technological improvements in efficient heat dissipation. Invention patents (such as CN110409750 B) report a wooden electric heating floor and its large-format, high-efficiency manufacturing method, but the wood substrate used is fiberboard, which is prone to reduced integrity due to the filling of thermally conductive fillers. Furthermore, invention patent (CN 116277319 B) reports an electric heating bamboo particleboard, an electric heating floor based on it, and its preparation method, but this technology neglects the problem of electrode displacement during the hot pressing process, and the board is difficult to shape and process. Therefore, there is an urgent need to develop a novel wooden self-heating board structure and its preparation method that combines high heat dissipation performance, high structural stability, and process feasibility. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a high-efficiency heat dissipation wooden self-heating board structure and its preparation method, which addresses the shortcomings of the prior art. It uses a high thermal conductivity wooden substrate that has been vacuum impregnated with carbon nanotubes / aluminum nitride / boron nitride modifiers as the upper and lower layers. After surface milling, a raised strip and groove structure is formed. After being laminated and glued with an electric heating film and electrodes, a novel wooden self-heating board is obtained, which has high heat dissipation performance, high structural stability, no displacement of the electric heating film and electrodes during the hot pressing process, and process feasibility.

[0005] To achieve the above-mentioned technical objectives, the technical solution adopted by the present invention is as follows:

[0006] A method for preparing a high-efficiency heat dissipation self-heating board structure for wooden furniture includes the following steps:

[0007] S1. Preparation of carbon nanotube / aluminum nitride / boron nitride modifier: Aluminum nitride nanoparticles and boron nitride nanoparticles are mixed with epoxy resin solution respectively. After magnetic stirring at a certain speed, carbon nanotube powder is added and ultrasonic treatment is performed. The ultrasonically treated mixture is stirred evenly with epoxy resin curing agent and then ultrasonically treated a second time to finally obtain carbon nanotube / aluminum nitride / boron nitride modifier.

[0008] S2. Pretreatment of wood substrate: The wood veneer is completely immersed in sodium chlorite solution, followed by hydrothermal treatment. After treatment for a certain period of time, lignin and hemicellulose are removed, and the pore size and porosity of the wood are expanded. The wood substrate template is washed multiple times with deionized water, then frozen for a certain period of time, and then vacuum dried to obtain a wood substrate template with three-dimensional interconnected pores. The wood substrate template is completely immersed in the carbon nanotube / aluminum nitride / boron nitride modifier obtained in S1, and after being impregnated with a certain degree of vacuum for a certain period of time, it is taken out and cured at room temperature to obtain a high thermal conductivity substrate.

[0009] S3. Self-heating board assembly: Two grooves are milled on the surface of a high thermal conductivity substrate to serve as the lower substrate, and two protrusions are milled on the surface of the high thermal conductivity substrate to match the grooves to serve as the upper substrate. The upper surface of the lower substrate with the milled grooves is coated or sprayed with adhesive, and the lower surface of the upper substrate with the milled protrusions is coated or sprayed with adhesive. The lower substrate with adhesive coating, the heating film, the electrode, and the upper substrate with adhesive coating are stacked sequentially from bottom to top, with the protrusions of the upper substrate embedded in the grooves of the lower substrate. The heating film and the electrode are located between the two grooves or the two protrusions. The stacked board is hot-pressed under certain temperature and pressure, and after cooling for a certain time, a new type of wood self-heating board is obtained.

[0010] As a further improvement to the present invention, S1 specifically refers to:

[0011] Aluminum nitride nanoparticles and boron nitride nanoparticles were respectively mixed with epoxy resin solution at an addition amount of 1 wt%. After stirring magnetically at 500 rpm for 30 min, carbon nanotube powder was added at an addition amount of 1-3 wt%, and the mixture was ultrasonically treated at 500 W for 30 min. The ultrasonically treated blended solvent and epoxy resin curing agent were stirred evenly at a mass ratio of 1:3, and then ultrasonically treated a second time for 15 min to finally obtain carbon nanotube / aluminum nitride / boron nitride modifier.

[0012] As a further improvement to the present invention, S2 specifically refers to:

[0013] Wood veneer was completely immersed in a 2%-8% sodium chlorite solution with a solid-liquid ratio of 4 g / L and a pH of 4-5. After hydrothermal treatment at 85℃ for 6 h, lignin and hemicellulose were removed, and the pore size and porosity of the wood were increased. The wood veneer was washed multiple times with deionized water, then frozen at -40℃ for 12 h, and vacuum dried for 24 h to obtain a wood substrate template with three-dimensional interconnected pores. The wood substrate template was completely immersed in the carbon nanotube / aluminum nitride / boron nitride modifier obtained in S1, and impregnated under a vacuum of 0.08-0.1 MPa for 5-8 h. After removal, it was cured at room temperature to obtain a high thermal conductivity substrate.

[0014] As a further improvement of the present invention, in S3, the electrothermal film is graphene or carbon crystal electrothermal film; the electrode is a copper foil electrode; the hot pressing temperature is 120°C, the hot pressing pressure is 0.9 MPa, the hot pressing time is 6 min, and the cooling time is 24 h.

[0015] To achieve the above-mentioned technical objectives, another technical solution adopted by the present invention is as follows:

[0016] A highly efficient heat dissipation self-heating wooden furniture board structure includes a lower substrate, an upper substrate, an electric heating film, and electrodes. The electrodes are respectively disposed at both ends of the electric heating film. The upper surface of the lower substrate has two grooves milled on it, and the lower surface of the upper substrate has two protrusions milled on it. The upper surfaces of the lower substrate and the lower surface of the upper substrate are coated with adhesive. The lower substrate, electric heating film, electrodes, and upper substrate are sequentially stacked and glued from bottom to top. At the same time, the protrusions of the upper substrate are embedded in the grooves of the lower substrate, and the electric heating film and electrodes are located between the two grooves or the two protrusions.

[0017] The lower and upper substrates are made of high thermal conductivity substrates.

[0018] As a further improved technical solution of the present invention, the high thermal conductivity substrate is prepared from the following raw materials: wood veneer, sodium chlorite solution, deionized water and carbon nanotube / aluminum nitride / boron nitride modifier;

[0019] The carbon nanotube / aluminum nitride / boron nitride modifier is prepared from the following raw materials: aluminum nitride nanoparticles, boron nitride nanoparticles, epoxy resin solution, carbon nanotube powder, and epoxy resin curing agent.

[0020] The beneficial effects of this invention are as follows:

[0021] This invention involves completely immersing wood veneer in a 2-8% sodium chlorite solution (pH 4-5) at a solid-liquid ratio of 4 g / L. After hydrothermal treatment at 85°C for 6 hours, lignin and hemicellulose are removed, increasing the pore size and porosity of the wood. The veneer is then washed multiple times with deionized water, frozen at -40°C for 12 hours, and vacuum dried for 24 hours to obtain a wood-based template with three-dimensional interconnected pores.

[0022] The carbon nanotube / aluminum nitride / boron nitride modifier prepared in this invention is a high thermal conductivity impregnation modifier. This high thermal conductivity impregnation modifier fills the cell cavities of wood (resulting in cell cavities of a wood-based substrate template with three-dimensional interconnected pores), reducing the volume of low thermal conductivity air within the cell cavities and thus improving the thermal conductivity of the wood-based substrate. In the high thermal conductivity impregnation modifier, multi-walled carbon nanotubes (50 μm in length), aluminum nitride (2-8 μm in diameter, near-spherical), and boron nitride (100-300 nm in diameter, near-hexagonal) of different morphologies overlap to form a complete and interconnected thermal conductivity pathway.

[0023] In the self-heating plate structure of this invention, the grooves in the lower substrate and the protrusions in the upper substrate constrain the heating film and copper foil electrodes to a specified position, which facilitates better assembly. During the hot-pressing process, slippage of the heating film and electrodes is avoided, and the allowance on both sides facilitates tongue-and-groove machining around the plate, ensuring that the cutting tool does not damage the heating layer, resulting in good machinability. The self-heating plate formed after hot-pressing exhibits good integrity and high structural stability.

[0024] The self-heating board prepared by this invention has a high thermal conductivity and has broad application prospects in wall heating, floor heating, partitions, cabinets and other fields, and can play a role in heating, dehumidification and health care.

[0025] In summary, this invention uses a high thermal conductivity wood substrate that has been vacuum impregnated with carbon nanotubes / aluminum nitride / boron nitride modifiers as the upper and lower layers. After surface milling, a raised strip and groove structure is formed. This substrate is then laminated with an electric heating film and copper foil electrodes to produce a novel wood self-heating board that combines high heat dissipation performance, high structural stability, no electrode displacement during hot pressing of the preform, and process feasibility. Attached Figure Description

[0026] Figure 1 This is a flowchart illustrating the preparation process of the self-heating plate structure of the present invention.

[0027] Figure 2 This is a schematic diagram of the microstructure of a self-heating board.

[0028] Figure 3 This is a schematic diagram of the self-heating board structure.

[0029] Figure 3 (a) is an exploded cross-section of the self-heating plate structure.

[0030] Figure 3 (b) is a cross-sectional view of the self-heating board after lamination and bonding.

[0031] Figure 4 This is a comparison chart of the thermal conductivity of ordinary plywood and self-heating plywood structures.

[0032] Figure 5 This is a comparison of the surface temperature rise and fall curves of ordinary plywood and self-heating board structures.

[0033] Figure 6 This is a schematic diagram of the application of a self-heating sheet structure. Detailed Implementation

[0034] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings:

[0035] This invention uses a high thermal conductivity wood substrate that has been vacuum impregnated with carbon nanotubes / aluminum nitride / boron nitride modifiers as the upper and lower layers. After surface milling, a raised strip and groove structure is formed. After being laminated and glued with an electric heating film and copper foil electrodes, a novel wood self-heating board with high heat dissipation performance, structural stability and process feasibility is obtained.

[0036] like Figure 3 This embodiment provides a highly efficient heat dissipation self-heating board structure for wooden furniture, including a lower substrate 4, an upper substrate 1, an electric heating film 3, and copper foil electrodes 2. The copper foil electrodes 2 are respectively disposed at both ends of the electric heating film 3. The upper surface of the lower substrate 4 is milled with two grooves, and the lower surface of the upper substrate 1 is milled with two protrusions. The upper surface of the lower substrate 4 and the lower surface of the upper substrate 1 are coated with adhesive 5. The lower substrate 4, the electric heating film 3, the copper foil electrodes 2, and the upper substrate 1 are sequentially stacked and glued from bottom to top. At the same time, the protrusions of the upper substrate 1 are embedded in the grooves of the lower substrate 4, and the electric heating film 3 and the copper foil electrodes 2 are located between the two grooves or the two protrusions. The lower substrate 4 and the upper substrate 1 are made of high thermal conductivity substrates.

[0037] The high thermal conductivity substrate is prepared from the following raw materials: wood veneer, sodium chlorite solution, deionized water, and carbon nanotube / aluminum nitride / boron nitride modifier; wherein, the carbon nanotube / aluminum nitride / boron nitride modifier is prepared from the following raw materials: aluminum nitride nanoparticles, boron nitride nanoparticles, epoxy resin solution, carbon nanotube powder, and epoxy resin curing agent.

[0038] This embodiment also provides a method for preparing a high-efficiency heat dissipation self-heating board structure for wooden furniture, the preparation process is as follows: Figure 1 :

[0039] S1. Preparation of carbon nanotube / aluminum nitride / boron nitride modifier: Aluminum nitride (2-8 μm diameter, near-spherical) and boron nitride (100-300 nm diameter, near-hexagonal) nanoparticles were mixed with epoxy resin solution (solution A) at a 1 wt% addition rate. After magnetic stirring at 500 rpm for 30 min, carbon nanotube powder (approximately 50 μm in length) was added at a 2 wt% addition rate, and the mixture was ultrasonically treated at 500 W for 30 min. The blending solvent and epoxy resin curing agent (solution B) were mixed evenly at a 1:3 mass ratio and ultrasonically treated a second time for 15 min to finally obtain the carbon nanotube / aluminum nitride / boron nitride modifier (i.e., high thermal conductivity impregnation modifier).

[0040] S2. Pretreatment of Wood Substrate: Pine veneer (100cm long, 18cm wide, 3mm thick) is completely immersed in a 4-5% sodium chlorite solution (pH 4-5) at a solid-liquid ratio of 4g / L. After hydrothermal treatment at 85℃ for 6 hours, lignin and hemicellulose are removed, increasing the pore size and porosity of the wood. The veneer is washed multiple times with deionized water, then frozen at -40℃ for 12 hours, and vacuum dried for 24 hours to obtain a wood substrate template with three-dimensional interconnected pores. The wood substrate template is completely immersed in the carbon nanotube / aluminum nitride / boron nitride modifier obtained in S1, and impregnated under a vacuum of 0.08-0.1 MPa for 5-8 hours. After removal and curing at room temperature, a high thermal conductivity substrate is obtained (see microstructure of carbon nanotube / aluminum nitride / boron nitride modifier-epoxy resin). Figure 2 ).

[0041] S3. Self-heating board assembly: such as Figure 3 As shown, two grooves are milled on the surface of the high thermal conductivity substrate to form the lower substrate 4, and two raised strips are milled on the surface to form the upper substrate. Adhesive 5 (90-100 g / m² on one side) is coated or sprayed onto the upper surface of the lower substrate 4 and the lower surface of the upper substrate 1. 2 After being combined with heating film 3 (carbon crystal heating film) and copper foil electrode 2, and then hot-pressed at 120℃ and 0.9 MPa for 6 min after lamination and assembly, and cooled for 24 h, a new type of wood-based self-heating board with high heat dissipation performance, structural stability and process feasibility is obtained (see composite structure). Figure 3 The test results are shown below. Figure 4 and Figure 5 Before billet assembly, the copper foil electrode 2 is mounted (fixed) on the heating film 3, and the copper foil electrode 2 and the heating film 3 are electrically connected. After billet assembly, the copper foil electrode 2 and the heating film 3 are located between two grooves or two convex strips. The grooves and convex strips prevent the copper foil electrode 2 and the heating film 3 from slipping under the hot pressing state of the billet assembly.

[0042] like Figure 2 As shown, Figure 2The cell wall structure serves as the template for the wood-based substrate. Carbon nanotubes / aluminum nitride / boron nitride modifiers (high thermal conductivity impregnation modifiers) fill the cell cavities of the wood, reducing the volume of low thermal conductivity air within the cell cavities and thus improving the thermal conductivity of the wood-based substrate. In the high thermal conductivity impregnation modifier, multi-walled carbon nanotubes of different morphologies (approximately 50 μm in length), aluminum nitride (2-8 μm in diameter, near-spherical), and boron nitride (100-300 nm in diameter, near-hexagonal) overlap to form a complete and interconnected thermal conductivity pathway.

[0043] like Figure 3 As shown in (a)-(b), the structure of the groove and the convex strip confines the electrothermal film 3 and the copper foil electrode 2 in a specified position, which helps to better assemble the blank. Under hot pressing, the slippage of the electrothermal layer is avoided, and the allowance on both sides is conducive to tongue and groove processing around the plate. The cutting tool does not damage the electrothermal layer, and it has good machinability.

[0044] like Figure 4 As shown, the thermal conductivity of the self-heating board (high thermal conductivity wood substrate) is approximately 2.93 times that of ordinary plywood of the same thickness (e.g. Figure 4 As shown, the energy consumption of ordinary plywood is 0.1372 W / (m·K), and that of self-heating plywood is 0.4018 W / (m·K).

[0045] 500W / m 2 Under high power, the surface temperature of a 5 mm thick self-heating wooden floor can reach a maximum of 62°C, with an average stable temperature of approximately 58°C, which is significantly higher than the average stable temperature of 50°C for ordinary plywood. Figure 5 The temperature rise and fall curve trend graph shows the average stable temperature.

[0046] The preparation process of ordinary plywood (similar to S3, see reference) Figure 3 ): Two grooves are milled on the surface of a pine veneer of the same material and size (100cm long, 18cm wide, and 3mm thick) to serve as the lower substrate, and two raised strips are milled on the surface to serve as the upper substrate. Adhesive is then applied by spraying or coating onto the upper surface of the lower substrate and the lower surface of the upper substrate (90-100 g / m² per side). 2 After being combined with an electric heating film (carbon crystal electric heating film) and copper foil electrodes, and then hot-pressed at 120℃ and 0.9 MPa for 6 minutes after lamination and assembly, and cooled for 24 hours, a control sample heating board was obtained. The dimensions and specifications of the electric heating film and copper foil electrodes in ordinary plywood are the same as those in the self-heating board.

[0047] like Figure 6 As shown, self-heating wood panels have broad application prospects in wall heating, floor heating, partitions, cabinets and other fields, and can play a role in heating, dehumidification and health care.

[0048] The scope of protection of this invention includes, but is not limited to, the above embodiments. The scope of protection of this invention is defined by the claims. Any substitutions, modifications, or improvements to this technology that are easily conceived by those skilled in the art fall within the scope of protection of this invention.

Claims

1. A method for preparing a high-efficiency heat dissipation self-heating board structure for wooden furniture, characterized in that, Includes the following steps: S1. Preparation of carbon nanotube / aluminum nitride / boron nitride modifier: Aluminum nitride nanoparticles and boron nitride nanoparticles were mixed with epoxy resin solution respectively. After magnetic stirring at 500 rpm, carbon nanotube powder was added and ultrasonically treated. The ultrasonically treated mixture was stirred evenly with epoxy resin curing agent and ultrasonically treated a second time to finally obtain carbon nanotube / aluminum nitride / boron nitride modifier. S2. Pretreatment of wood substrate: The wood veneer is completely immersed in sodium chlorite solution, and then hydrothermally treated at 85℃ for 6 h to remove lignin and hemicellulose, thereby expanding the pore size and porosity of the wood. It is washed multiple times with deionized water, then frozen at -40℃ for 12 h, and vacuum dried for 24 h to obtain a wood substrate template with three-dimensional interconnected pores. The wood substrate template is completely immersed in the carbon nanotube / aluminum nitride / boron nitride modifier obtained in step S1, and impregnated at a vacuum degree of 0.08-0.1 MPa for 5-8 h. After removal, it is cured at room temperature to obtain a high thermal conductivity substrate. S3. Self-heating board assembly: Two grooves are milled on the surface of a high thermal conductivity substrate to serve as the lower substrate, and two protrusions are milled on the surface of the high thermal conductivity substrate to match the grooves to serve as the upper substrate. The upper surface of the lower substrate with the milled grooves is coated or sprayed with adhesive, and the lower surface of the upper substrate with the milled protrusions is coated or sprayed with adhesive. The lower substrate, heating film, electrode, and upper substrate are stacked sequentially from bottom to top, and the protrusions of the upper substrate are embedded in the grooves of the lower substrate. The heating film and electrode are located between the two grooves or the two protrusions. The stacked board is hot-pressed for 6 minutes at a temperature of 120℃ and a pressure of 0.9 MPa, and then cooled for 24 hours to obtain a wood-based self-heating board.

2. The method for preparing the high-efficiency heat dissipation self-heating wooden furniture board structure according to claim 1, characterized in that, Step S1 is as follows: Aluminum nitride nanoparticles and boron nitride nanoparticles were respectively mixed with epoxy resin solution at an addition amount of 1 wt%. After magnetic stirring at 500 rpm for 30 min, carbon nanotube powder was added at an addition amount of 1-3 wt%, and ultrasonic treatment was performed at 500 W for 30 min. The ultrasonically treated blended solvent and epoxy resin curing agent were stirred evenly at a mass ratio of 1:3, and then ultrasonically treated a second time for 15 min to finally obtain carbon nanotube / aluminum nitride / boron nitride modifier.

3. The method for preparing the high-efficiency heat dissipation self-heating wooden furniture board structure according to claim 1, characterized in that, In step S2, the wood veneer is completely immersed in a sodium chlorite solution with a concentration of 2%-8% at a solid-liquid ratio of 4 g / L. The pH value of the sodium chlorite solution is 4-5.

4. The method for preparing the high-efficiency heat dissipation self-heating wooden furniture board structure according to claim 1, characterized in that, In step S3, the heating film is graphene or carbon crystal heating film; the electrode is a copper foil electrode.

5. A self-heating wooden furniture board structure with high-efficiency heat dissipation, characterized in that: The structure of this self-heating wooden furniture board is: The material prepared according to the preparation method of claim 1 includes a lower substrate, an upper substrate, an electrothermal film, and electrodes. The electrodes are respectively disposed at both ends of the electrothermal film. The upper surface of the lower substrate has two grooves milled on it, and the lower surface of the upper substrate has two protrusions milled on it. The upper surface of the lower substrate and the lower surface of the upper substrate are coated with adhesive. The lower substrate, electrothermal film, electrodes, and upper substrate are sequentially stacked and glued from bottom to top. At the same time, the protrusions of the upper substrate are embedded in the grooves of the lower substrate, and the electrothermal film and electrodes are located between the two grooves or the two protrusions. The lower and upper substrates are made of high thermal conductivity substrates.

6. The high-efficiency heat dissipation self-heating board structure for wooden furniture according to claim 5, characterized in that, The high thermal conductivity substrate is prepared from the following raw materials: Wood veneer, sodium chlorite solution, deionized water, and carbon nanotube / aluminum nitride / boron nitride modifiers; The carbon nanotube / aluminum nitride / boron nitride modifier is prepared from the following raw materials: Aluminum nitride nanoparticles, boron nitride nanoparticles, epoxy resin solution, carbon nanotube powder, and epoxy resin curing agent.

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