Visible light-short wave infrared wide spectrum imaging device based on colloidal quantum dots

Abstract

The invention discloses a visible light-short wave infrared wide spectrum imaging device based on colloidal quantum dots. The visible light-short wave infrared wide spectrum imaging device comprises an optical lens, an imaging sensor, an analog signal processing board and a digital signal processing board. The system has the advantages that power consumption is low, real-time image transmission is supported, an image cache circuit is not needed in system design, image data are directly output through an efficient data link, power can be supplied only by depending on a computer USB interface, an additional power module is not needed, and overall power consumption and system complexity are greatly reduced; the image output noise is low, the signal quality is high, the electrical coupling interference in the imaging chip output process is effectively inhibited by introducing the differential voltage isolation circuit, the low-noise power supply design and the high-precision analog-to-digital conversion unit, and the image output quality and stability of the system are remarkably improved.

Description

Technical Field

[0001] The present invention relates to a photoelectric imaging device, in particular to a visible light-shortwave infrared wide spectrum imaging device made of lead sulfide (PbS) colloidal quantum dot material, belonging to the technical field of photoelectric imaging. Background Art

[0002] Shortwave infrared (SWIR) has a wavelength range of approximately 1 to 3 microns. Infrared light in this wavelength range is less affected by Rayleigh scattering and can penetrate most gases and dust in the atmosphere. Furthermore, unlike longwave and mediumwave infrared (WIR) thermal imaging, SWIR relies primarily on diffuse reflectance, allowing for greater contrast and detailed information. Therefore, SWIR has broad applications in defect detection, space remote sensing, night vision imaging, and military reconnaissance.

[0003] Generally speaking, the main components of a shortwave infrared imaging system include an infrared optical lens, a focal plane detector, a signal processing circuit, and a display device. Specifically, the infrared optical lens is responsible for focusing the target's infrared radiation and diffuse reflection onto the focal plane. The focal plane detector converts the received optical signal into an electrical signal and outputs it to the signal processing circuit. The focal plane detector is composed of a large number of shortwave infrared detectors arranged in a two-dimensional array. Each detector can independently receive and convert infrared light signals and output them in an orderly manner to the back-end circuit through a readout circuit, thereby realizing infrared image acquisition. The signal processing circuit amplifies, filters, and performs analog-to-digital conversion on the electrical signal to obtain complete image data, which is then transmitted to the display device.

[0004] Currently, the mainstream technology focuses on focal plane detectors made of traditional materials such as InGaAs. FLIR (USA), Hamamatsu Photonics (Japan), Lynred (France), and Guohui Optoelectronics Technology (China) have all launched short-wave infrared imaging systems based on InGaAs detectors. Shortwave infrared imaging systems based on this type of detector have already accumulated profound technical expertise both domestically and internationally. For example, the shortwave infrared imaging system disclosed in patent publication number CN111601052A includes a shortwave infrared imaging objective lens, a spatial light modulator, a one-dimensional compression optical device, a shortwave infrared array sensor, a visible light camera, a spectroscope, and a computing device. The shortwave infrared imaging objective lens is used to image a scene and generate a two-dimensional image of the scene. The spatial light modulator is used to encode the two-dimensional image of the scene using a displayed two-dimensional code. The one-dimensional compression optical device is used to optically compress the encoded two-dimensional image into a one-dimensional image. The shortwave infrared array sensor is used to measure the one-dimensional image. The computing device is used to reconstruct the two-dimensional image based on a set number of two-dimensional codes and the measurement results of the corresponding one-dimensional image. This improves the imaging quality of shortwave infrared images, reduces costs, increases light flux, resolution, and frame rate, and enhances stability. However, the market size of shortwave infrared imaging remains relatively small, primarily due to the high material and process costs of the detectors. On the one hand, the mass production scale of InGaAs material is low. It can only be grown on InP single crystal substrates, and its size is limited by the substrate size. The existing single crystal InP substrate does not exceed 4 inches at most. On the other hand, the compatibility process requirements between InGaAs and CMOS are high. The most common practice at present is to integrate the In bumps on the InGaAs material with the CMOS electrodes through alignment bonding. This alignment bonding process has very high requirements, which further limits the reduction of the detector pixel size.

[0005] To overcome these challenges, a new class of short-wave infrared detection solutions has emerged in recent years: detectors based on colloidal quantum dots (CQDs). These materials can be prepared at low cost via solution methods, have tunable band gaps, and are suitable for a variety of substrates, making them particularly well-suited for large-area and flexible devices. While their detectivity and response speed cannot yet fully rival those of InGaAs detectors, they offer significant advantages in material cost, fabrication process, and system integration.

[0006] Currently, research and development of detectors and imaging systems based on this new material is relatively limited at home and abroad. Compared with traditional InGaAs imaging solutions, colloidal quantum dot imaging systems are expected to expand the market size of short-wave infrared imaging technology in consumer electronics and industrial inspection due to their significant cost advantages. Summary of the Invention

[0007] The purpose of the present invention is to provide a visible light-shortwave infrared wide-spectrum imaging device based on colloidal quantum dots in order to solve at least one of the above-mentioned technical problems, which realizes wide-spectrum image detection from visible light to shortwave infrared bands, has the advantages of wide response band, high integration, low cost and power consumption, and is suitable for various application scenarios such as multispectral imaging, night vision monitoring, biological detection, and material sorting.

[0008] The present invention achieves the above-mentioned object through the following technical solutions: a colloidal quantum dot-based visible light-shortwave infrared wide-spectrum imaging device, comprising a shortwave infrared imaging system and a host computer, wherein the shortwave infrared imaging system comprises an optical lens and an imaging module, wherein the optical lens is connected to the front end of the imaging module, and the imaging module comprises a module housing and an imaging sensor, an analog signal processing board, and a digital signal processing board integrated and installed in the module housing, wherein the optical lens focuses optical signals in the visible light-shortwave infrared wide-band, the imaging sensor is located at the optical signal focusing position of the optical lens, and the analog signal processing board and the digital signal processing board are sequentially connected to the side of the imaging sensor away from the optical lens; The imaging sensor is composed of a two-dimensionally arranged colloidal quantum dot infrared detection unit, and the imaging sensor performs photoelectric conversion on the received short-wave infrared light signal and outputs an analog electrical signal. The analog signal processing board is electrically connected to the imaging sensor, and the analog signal processing board is integrated with an analog signal processing circuit. A cable is connected between the analog signal processing board and the digital signal processing board. The host computer is integrated with an image display module, and the digital signal processing board and the image display module are connected through signal transmission.

[0009] As a further solution of the present invention: a first connector and a second connector are connected between the imaging sensor and the analog signal processing board, the digital signal processing board is also integrated with a TYPE-C interface, and the digital signal processing board is connected to the image display module of the host computer through the TYPE-C interface through signal transmission.

[0010] As a further solution of the present invention: the analog signal processing circuit integrated in the analog signal processing board includes a pre-low noise amplifier, an analog-to-digital conversion module and a digital image receiving and processing module. The pre-amplifier is used for signal isolation and driving, the analog-to-digital conversion module is used to convert analog signals into digital signals, and the digital image receiving and processing module is used to receive digital image signals and perform related digital signal processing to improve imaging quality.

[0011] As a further solution of the present invention: the analog signal processing board also integrates a detector driving circuit, a digital-to-analog conversion circuit and an analog-to-digital conversion circuit. The detector driving circuit provides the power supply voltage required by the PbS colloidal quantum dot imaging chip, the digital-to-analog conversion circuit supplies an adjustable detection bias for the image detector, and the analog-to-digital conversion circuit receives the analog image signal output by the detector, converts it into a digital image signal, and transmits it to the digital signal processing board.

[0012] As a further solution of the present invention: the digital signal processing board includes an FPGA master control circuit, a USB slave control circuit and a digital power management circuit. The FPGA master control circuit is responsible for receiving and processing the digital image signal collected by the analog signal processing board. The USB slave control circuit is responsible for packaging the digital image signal processed by the FPGA according to the USB2.0 protocol and sending it to the host computer. The digital power management circuit is responsible for providing digital power and power-on timing for all components on the digital signal processing board.

[0013] As a further solution of the present invention: the short-wave infrared imaging system includes a detector driving circuit, a pixel sampling circuit, an FPGA main control circuit and a USB2.0 peripheral circuit that constitute a complete signal path. The short-wave infrared imaging system uses a USB 5V voltage input, which is divided into multiple voltages by a DC-DC switching regulator and an LDO low-dropout linear regulator to supply power to each circuit respectively; after the photoelectric signal passes through the detector driving circuit and the pixel sampling circuit, it is synchronously received and processed in the FPGA main control circuit and sent to the main control PC end through the USB interface. The user can obtain the imaging results in real time and adjust related parameters on the host computer.

[0014] As a further solution of the present invention: the detector driving circuit is used to provide a stable bias voltage and operating current for the colloidal quantum dot focal plane array, and the detector driving circuit constructs a voltage source through a low-voltage difference linear regulator, a high-precision resistor and a low-noise operational amplifier.

[0015] As a further solution of the present invention: the pixel sampling circuit is the core path connecting the detector output and the analog-to-digital conversion module. Each pixel signal of the pixel sampling circuit is first buffered by a differential voltage follower, and then the signal sampling is completed through the analog-to-digital converter. The pixel sampling circuit adopts a fully differential architecture design.

[0016] As a further solution of the present invention: the FPGA main control circuit is the control center and data processing platform of the short-wave infrared imaging system. The FPGA main control circuit is designed based on the Xilinx FPGA chip. The internal logic includes the initialization logic, image reception and processing logic, and image transmission logic of the short-wave infrared imaging system. The FPGA main control circuit controls the sampling timing and detector working mode through programming, and simultaneously receives, caches, and processes and outputs image data.

[0017] As a further solution of the present invention: the USB2.0 peripheral circuit is responsible for packaging the image data processed by the FPGA according to the USB2.0 protocol and transmitting it to the host computer through the USB link. The USB2.0 peripheral circuit includes a USB controller chip, a clock generation module and a program storage circuit. The USB2.0 peripheral circuit complies with the USB2.0 high-speed interface specification, supports a 480Mbps transmission rate, and realizes image data packet protocol parsing with the host computer through software.

[0018] The beneficial effects of the present invention are: 1) This invention overcomes the bottleneck of high material cost and complex preparation process of traditional short-wave infrared detectors, and realizes effective detection of a wide spectral band from visible light to short-wave infrared through colloidal quantum dot detectors; 2) The present invention has low power consumption and supports real-time image transmission. The short-wave infrared imaging system design does not require an image buffer circuit, directly outputs image data through an efficient data link, and relies solely on a computer USB interface for power supply, eliminating the need for an additional power module, significantly reducing overall power consumption and system complexity. 3) The image output noise of the present invention is low and the signal quality is high. By introducing a differential voltage isolation circuit, a low-noise power supply design, and a high-precision analog-to-digital conversion unit, the electrical coupling interference in the output process of the imaging chip is effectively suppressed, which significantly improves the image output quality and stability of the system, greatly reduces the system cost, and is suitable for large-scale integration and civilian promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the structure of the device of the present invention; Figure 2 This is a schematic diagram of the circuit connection structure between the analog signal processing board and the digital signal processing board of the present invention; Figure 3 Schematic diagram of the detector driving circuit structure of the present invention; Figure 4 Schematic diagram of the pixel sampling circuit structure of the present invention; Figure 5 This is a schematic diagram of the FPGA main control circuit structure of the present invention; Figure 6 This is a schematic diagram of the USB2.0 peripheral circuit structure of the present invention; In the figure: 1. Optical lens; 2. Imaging sensor; 3-1. First connector; 3-2. Second connector; 4. Analog signal processing board; 5. Digital signal processing board; 6. Cable; 7. TYPE-C interface. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Example 1, as Figures 1 to 2 As shown, a visible light-shortwave infrared wide-spectrum imaging device based on colloidal quantum dots includes a shortwave infrared imaging system and a host computer. The shortwave infrared imaging system includes an optical lens 1 and an imaging module. The optical lens 1 is connected to the front end of the imaging module. The imaging module includes a module housing and an imaging sensor 2, an analog signal processing board 4, and a digital signal processing board 5 integrated and installed in the module housing. The optical lens 1 focuses optical signals in the visible light-shortwave infrared wide-band. The imaging sensor 2 is located at the optical signal focusing position of the optical lens 1. The analog signal processing board 4 and the digital signal processing board 5 are sequentially connected to the side of the imaging sensor 2 away from the optical lens 1. The imaging sensor 2 is composed of a two-dimensionally arranged colloidal quantum dot infrared detection unit, and the imaging sensor 2 performs photoelectric conversion on the received short-wave infrared light signal and outputs an analog electrical signal. The analog signal processing board 4 is electrically connected to the imaging sensor 2. The analog signal processing board 4 is integrated with an analog signal processing circuit for amplifying, filtering and analog-to-digital conversion of the analog electrical signal to generate digital image data. A cable 6 is connected between the analog signal processing board 4 and the digital signal processing board 5. The host computer is integrated with an image display module, and the digital signal processing board 5 is connected to the image display module through signal transmission for real-time display of image data.

[0022] The design of the entire system revolves around the PbS colloidal quantum dot imaging chip, forming a complete design process from hardware design, firmware development, to software implementation.

[0023] The hardware design of the system is the core of the whole solution, covering four links from the signal acquisition of the imaging chip to the data transmission of the pixel. Taking into account the requirements of these links, the hardware architecture is as follows: Figure 1As shown in the figure, the entire system's hardware circuitry consists of an analog signal processing board 4 and a digital signal processing board 5, connected via a flat cable 6. The analog signal processing board 4 is designed around the imaging chip as a driver and analog-to-digital conversion circuit. It then transmits the output digital image signal via flat cable 6 to the digital signal processing board 5, where it is received and processed by the FPGA main control chip. The digital signal processing board 5 is a driver and configuration circuit designed around the FPGA and USB controller. The image digital signal passes through the FPGA's internal pixel reception and processing logic, and is then transmitted to the host computer software via the USB controller for real-time image display.

[0024] Embodiment 2. In addition to all the technical features of Embodiment 1, this embodiment also includes: a first connector 3-1 and a second connector 3-2 are connected between the imaging sensor 2 and the analog signal processing board 4, the digital signal processing board 5 is also integrated with a TYPE-C interface 7, and the digital signal processing board 5 is connected to the image display module of the host computer through the TYPE-C interface 7 through signal transmission.

[0025] The analog signal processing circuit integrated in the analog signal processing board 4 includes a pre-low noise amplifier, an analog-to-digital conversion module (ADC) and a digital image receiving and processing module. The pre-amplifier is used for signal isolation and driving, the analog-to-digital conversion module is used to convert analog signals into digital signals, and the digital image receiving and processing module is used to receive digital image signals and perform related digital signal processing to improve imaging quality.

[0026] The analog signal processing board 4 also integrates a detector driving circuit, a digital-to-analog conversion circuit, and an analog-to-digital conversion circuit. The detector driving circuit provides the power supply voltage required by the PbS colloidal quantum dot imaging chip. The digital-to-analog conversion circuit supplies an adjustable detection bias for the image detector. The analog-to-digital conversion circuit receives the analog image signal output by the detector, converts it into a digital image signal, and transmits it to the digital signal processing board 5.

[0027] In addition to all the technical features of the first embodiment, the third embodiment also includes: Figure 1 、 Figures 3 to 6 As shown, the digital signal processing board 5 includes an FPGA master control circuit, a USB slave control circuit and a digital power management circuit. The FPGA master control circuit is responsible for receiving and processing the digital image signal collected by the analog signal processing board 4. The USB slave control circuit is responsible for packaging the digital image signal processed by the FPGA according to the USB2.0 protocol and sending it to the host computer. The digital power management circuit is responsible for providing digital power and power-on timing for all components on the digital signal processing board.

[0028] The short-wave infrared imaging system includes a detector drive circuit, a pixel sampling circuit, an FPGA main control circuit, and a USB2.0 peripheral circuit that constitute a complete signal path. The short-wave infrared imaging system uses a USB 5V voltage input, which is divided by multiple voltages through a DC-DC switching regulator and a low-dropout linear regulator to power each circuit separately, simplifying the overall structure and supporting plug-and-play functionality. After passing through the detector drive circuit and the pixel sampling circuit, the photoelectric signal is synchronously received and processed in the FPGA main control circuit and sent to the main control PC via the USB interface. Users can obtain imaging results in real time and adjust related parameters on the host computer. It should be noted that the entire short-wave infrared imaging system consumes less than 2.5W of power, does not require an independent power module, and can operate solely on USB power supply. It has good portability and system integration capabilities. The various circuits work together to achieve efficient acquisition, real-time processing, and low-power transmission of wide-spectrum image signals.

[0029] The detector drive circuit is used to provide a stable bias voltage and operating current for the colloidal quantum dot focal plane array, ensuring that the detector operates in a high response range. The detector drive circuit constructs a voltage source through a low-voltage difference linear regulator, high-precision resistors and low-noise operational amplifier to ensure the linear stability of the output signal.

[0030] The pixel sampling circuit is the core path connecting the detector output and the analog-to-digital conversion module. Each pixel signal in the pixel sampling circuit is first buffered by a differential voltage follower, and then the signal is sampled by the analog-to-digital converter. The pixel sampling circuit adopts a fully differential architecture design to effectively suppress ground noise and crosstalk. While maintaining accuracy, the sampling rate can be dynamically adjusted through an external control signal, thereby taking into account both image quality and frame rate requirements.

[0031] The FPGA main control circuit is the control center and data processing platform of the system. The FPGA main control circuit is designed based on the Xilinx FPGA chip. The internal logic includes the system initialization logic, image reception and processing logic, and image transmission logic. The FPGA main control circuit controls the sampling timing and detector working mode through programming, and simultaneously receives, caches, and processes and outputs image data. In order to improve processing efficiency, the system also introduces a FIFO-based pipeline cache mechanism to realize the synchronous transmission of multi-channel image data.

[0032] The USB2.0 peripheral circuit is responsible for packaging the image data processed by the FPGA according to the USB2.0 protocol and transmitting it to the host computer through the USB link. The USB2.0 peripheral circuit includes a USB controller chip, a clock generation module and a program storage circuit. The USB2.0 peripheral circuit complies with the USB2.0 high-speed interface specification and supports a transmission rate of 480Mbps. At the same time, the image data packet protocol parsing with the host computer is realized through software.

[0033] Among other alternatives, the FPGA master control circuit can also utilize an ARM core-based SoC chip to achieve a hardware-software integrated design. The pixel sampling circuit can be integrated within the chip using a CMOS APS array and on-chip ADC architecture to further enhance integration and imaging speed. Furthermore, the USB interface used by the USB 2.0 peripheral circuit can be expanded to USB 3.0 or Gigabit Ethernet to meet the needs of higher-speed, longer-distance data transmission.

[0034] Working Principle: Optical lens 1 is responsible for focusing the infrared radiation and diffuse reflection of the target onto the focal plane. Imaging sensor 2 can convert the received light signal into an electrical signal and output it to the back-end signal processing circuit. The lead sulfide colloidal quantum dot imaging sensor is composed of a large number of photodetectors arranged in a two-dimensional array. The lead sulfide colloidal quantum dot photosensitive material (thin film) serves as the photosensitive layer of the photodetector. When irradiated by visible-shortwave infrared light, it absorbs photons and stimulates electron transitions, generating new electron-hole pairs (internal photoelectric effect). Under the action of the bias electric field, an electrical signal is generated, which is output in an orderly manner through the readout circuit integrated in the imaging sensor, thereby realizing image acquisition. The back-end signal processing circuit receives the voltage signal output by the imaging sensor, filters, amplifies and performs analog-to-digital conversion on the signal to obtain complete digital image data, which is then transmitted to the host computer for real-time image display.

[0035] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0036] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A visible light-shortwave infrared wide spectrum imaging device based on colloidal quantum dots, comprising a shortwave infrared imaging system and a host computer, characterized by: The short-wave infrared imaging system comprises an optical lens (1) and an imaging module, wherein the optical lens (1) is connected to the front end of the imaging module; The imaging module comprises a module housing and an imaging sensor (2), an analog signal processing board (4), and a digital signal processing board (5) integrated in the module housing; the optical lens (1) focuses a light signal in a wide band from visible light to short-wave infrared; the imaging sensor (2) is located at the light signal focusing position of the optical lens (1); and the analog signal processing board (4) and the digital signal processing board (5) are sequentially connected to a side of the imaging sensor (2) away from the optical lens (1); The imaging sensor (2) is composed of a two-dimensionally arranged colloidal quantum dot infrared detection unit, and the imaging sensor (2) performs photoelectric conversion on the received short-wave infrared light signal and outputs an analog electrical signal. The analog signal processing board (4) is electrically connected to the imaging sensor (2), and the analog signal processing board (4) is integrated with an analog signal processing circuit. A wiring (6) is connected between the analog signal processing board (4) and the digital signal processing board (5); An image display module is integrated on the host computer, and the digital signal processing board (5) is connected to the image display module via signal transmission.

2. The visible light-shortwave infrared wide spectrum imaging device according to claim 1, characterized in that: A first connector (3-1) and a second connector (3-2) are connected between the imaging sensor (2) and the analog signal processing board (4); the digital signal processing board (5) is further integrated with a TYPE-C interface (7); and the digital signal processing board (5) is connected to an image display module of a host computer via the TYPE-C interface (7) through signal transmission.

3. The visible light-shortwave infrared wide spectrum imaging device according to claim 1, characterized in that: The analog signal processing circuit integrated in the analog signal processing board (4) includes a pre-low noise amplifier, an analog-to-digital conversion module and a digital image receiving and processing module; Among them, the preamplifier is used for signal isolation and driving, the analog-to-digital conversion module is used to convert analog signals into digital signals, and the digital image receiving and processing module is used to receive digital image signals and perform related digital signal processing to improve imaging quality.

4. The visible light-shortwave infrared wide spectrum imaging device according to claim 1, characterized in that: The analog signal processing board (4) further integrates a detector driving circuit, a digital-to-analog conversion circuit, and an analog-to-digital conversion circuit; The detector driving circuit provides the power supply voltage required by the PbS colloidal quantum dot imaging chip, the digital-to-analog conversion circuit supplies an adjustable detection bias voltage to the image detector, and the analog-to-digital conversion circuit receives the analog image signal output by the detector, converts it into a digital image signal, and transmits it to the digital signal processing board (5).

5. The visible light-shortwave infrared wide spectrum imaging device according to claim 1, characterized in that: The digital signal processing board (5) includes an FPGA master control circuit, a USB slave control circuit and a digital power management circuit; The FPGA master control circuit is responsible for receiving and processing the digital image signal collected by the analog signal processing board (4); the USB slave control circuit is responsible for packaging the digital image signal processed by the FPGA according to the USB2.0 protocol and sending it to the host computer; the digital power management circuit is responsible for providing digital power and power-on timing for all components on the digital signal processing board.

6. The visible light-shortwave infrared wide spectrum imaging device according to claim 1, characterized in that: The short-wave infrared imaging system includes a detector drive circuit, a pixel sampling circuit, an FPGA main control circuit, and a USB2.0 peripheral circuit that form a complete signal path. The short-wave infrared imaging system uses a USB 5V voltage input, which is divided into multiple voltages by a DC-DC switching regulator and an LDO low-dropout linear regulator to supply power to each circuit. After passing through the detector drive circuit and pixel sampling circuit, the photoelectric signal is synchronously received and processed in the FPGA main control circuit and sent to the main control PC through the USB interface. The user can obtain the imaging results in real time and adjust related parameters on the host computer.

7. The visible light-shortwave infrared wide spectrum imaging device according to claim 6, characterized in that: The detector driving circuit is used to provide a stable bias voltage and operating current for the colloidal quantum dot focal plane array. The detector driving circuit constructs a voltage source through a low-voltage difference linear regulator, a high-precision resistor and a low-noise operational amplifier.

8. The visible light-shortwave infrared wide spectrum imaging device according to claim 6, characterized in that: The pixel sampling circuit is the core path connecting the detector output and the analog-to-digital conversion module. Each pixel signal in the pixel sampling circuit is first buffered by a differential voltage follower, and then the signal is sampled by the analog-to-digital converter. The pixel sampling circuit adopts a fully differential architecture design.

9. The visible light-shortwave infrared wide spectrum imaging device according to claim 6, characterized in that: The FPGA main control circuit is the control center and data processing platform of the short-wave infrared imaging system. The FPGA main control circuit is designed based on the Xilinx FPGA chip. The internal logic includes the initialization logic, image reception and processing logic, and image transmission logic of the short-wave infrared imaging system. The FPGA main control circuit controls the sampling timing and detector working mode through programming, and simultaneously receives, caches, and processes and outputs image data.

10. The visible light-shortwave infrared wide spectrum imaging device according to claim 6, characterized in that: The USB2.0 peripheral circuit is responsible for packaging the image data processed by the FPGA according to the USB2.0 protocol and transmitting it to the host computer through the USB link. The USB2.0 peripheral circuit includes a USB controller chip, a clock generation module and a program storage circuit. The USB2.0 peripheral circuit complies with the USB2.0 high-speed interface specification, supports a 480Mbps transmission rate, and implements image data packet protocol parsing with the host computer through software.

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