Control method and device of distributed detection system, medium and equipment

Abstract

The invention relates to the technical field of assembly detection, in particular to a control method and device of a distributed detection system, a medium and equipment. The method comprises the steps that after a to-be-assembled device reaches a target detection area, a detection subsystem is controlled to conduct defect detection on the to-be-assembled device according to the detection type of the target detection area, and defect detection information is obtained; if the to-be-assembled device has defects, controlling a conveying device to stop conveying the to-be-assembled device; marking the to-be-assembled device to obtain defect marking information; and sending the warning information and the defect marking information to the terminal equipment. On the basis of the structure of the distributed detection system, through full-automatic defect detection and defect marking, corresponding defect detection can be carried out on the to-be-assembled devices in different stages according to different detection subsystems, the detection efficiency and the detection accuracy are improved, the to-be-assembled devices with defects can be taken out in time, and the detection efficiency is improved. And manual processing and reinspection are not needed.

Description

Technical Field

[0001] The present application relates to the field of assembly detection technology, and in particular to a control method, device, medium and equipment for a distributed detection system. Background Art

[0002] In the electronics industry, whether it's home appliances or automotive electronics, component assembly is a crucial step in the production process, requiring multiple stages to complete the final assembly. For example, during the plug-in stage, in addition to machine insertion, there are also manual steps involved in removing plug-ins and screwing, making installation errors very common. Alternatively, during welding, problems such as poor soldering often occur, and manual inspection is often relied upon. This can easily lead to missed inspections, making defect detection an essential step. Existing inspection methods typically rely on manual re-inspection, but this approach is clearly inaccurate and carries high labor costs. Summary of the Invention

[0003] The present application provides a control method, device, medium and equipment for a distributed detection system to solve one or more technical problems existing in the prior art and at least provide a beneficial option or create conditions.

[0004] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by practice of the present application.

[0005] According to one aspect of an embodiment of the present application, a control method for a distributed inspection system is provided. The method is applied to the distributed inspection system, wherein the distributed inspection system is used to perform defect inspection on components to be assembled placed on a conveyor. The distributed inspection system includes multiple inspection subsystems, and the conveyor includes multiple inspection areas with sequence information. Each of the inspection subsystems corresponds to a single inspection area. The method includes: After the device to be assembled arrives at a target inspection area, controlling a detection subsystem corresponding to the target inspection area to perform defect detection on the device to be assembled according to an inspection type of the target inspection area to obtain defect detection information; determining whether the device to be assembled has defects according to the defect detection information; If the device to be assembled has a defect, controlling the conveying device to stop conveying the device to be assembled, so that the device to be assembled stops moving; Marking the device to be assembled to obtain defect marking information, where the defect marking information is used to indicate that the device to be assembled is defective when inspected in the target inspection area; The warning information and the defect mark information are sent to a terminal device so that the device to be assembled is taken out from the conveying device according to the warning information.

[0006] In one embodiment of the present application, based on the above solution, the detection subsystem is any one of a placement detection subsystem, a plug-in detection subsystem, a welding detection subsystem, and an assembly detection subsystem, and the method further includes: If the target detection area corresponds to the placement detection subsystem, determining that the detection type of the target detection area is a placement detection type; If the target detection area corresponds to the plug-in detection subsystem, determining that the detection type of the target detection area is a plug-in detection type; If the target detection area corresponds to the welding detection subsystem, determining that the detection type of the target detection area is a welding detection type; If the target inspection area corresponds to the assembly inspection subsystem, it is determined that the inspection type of the target inspection area is an assembly inspection type.

[0007] In one embodiment of the present application, based on the aforementioned solution, controlling the detection subsystem corresponding to the target detection area to perform defect detection on the device to be assembled according to the detection type of the target detection area to obtain defect detection information includes: If the detection type is the placement detection type, controlling the placement detection subsystem to perform a first defect detection on the device to be assembled to obtain placement defect detection information; If the detection type is the plug-in detection type, controlling the plug-in detection subsystem to perform a second defect detection on the device to be assembled to obtain plug-in defect detection information; If the inspection type is the welding inspection type, controlling the welding inspection subsystem to perform a third defect inspection on the device to be assembled to obtain welding defect inspection information; If the inspection type is the assembly inspection type, the assembly inspection subsystem is controlled to perform a fourth defect inspection on the device to be assembled to obtain assembly defect inspection information.

[0008] In one embodiment of the present application, based on the above solution, determining whether the device to be assembled has defects according to the defect detection information includes: If the defect detection information is the mounting defect detection information, determining first image information of the device to be assembled based on the mounting defect detection information, determining first images of each first detection point of the device to be assembled based on the first image information, and determining whether the device to be assembled has a defect based on each first image; If the defect detection information is the plug-in defect detection information, determining second image information of the device to be assembled based on the plug-in defect detection information, determining second images of each second detection point of the device to be assembled based on the second image information, and determining whether the device to be assembled has a defect based on each second image; If the defect detection information is the welding defect detection information, determining third image information of the device to be assembled based on the welding defect detection information, and determining third images of each third detection point of the device to be assembled based on the third image information, and determining whether the device to be assembled has a defect based on each third image; If the defect detection information is the assembly defect detection information, the fourth image information of the device to be assembled is determined based on the assembly defect detection information, and the fourth image of each fourth detection point of the device to be assembled is determined based on the fourth image information, and whether the device to be assembled has defects is determined based on each of the fourth images.

[0009] In one embodiment of the present application, based on the above solution, the distributed detection system further includes a gripping device disposed above the conveying device, and the marking of the components to be assembled to obtain defect marking information includes: If the defect detection information is the mounting defect detection information, controlling the gripping device to perform mounting defect marking on the device to be assembled to obtain mounting defect marking information; If the defect detection information is the plug-in defect detection information, controlling the grasping device to perform plug-in defect marking on the device to be assembled to obtain plug-in defect marking information; If the defect detection information is the welding defect detection information, controlling the grasping device to perform welding defect marking on the component to be assembled to obtain welding defect marking information; If the defect detection information is the assembly defect detection information, the grasping device is controlled to perform assembly defect marking on the device to be assembled to obtain assembly defect marking information.

[0010] In one embodiment of the present application, based on the above solution, after sending the warning information and the defect marking information to the terminal device, the method further includes: If the defect mark information is the placement defect mark information, controlling the gripping device to take the device to be assembled out of the target detection area of the conveying device and place it into a placement recovery area; If the defect mark information is the plug-in defect mark information, controlling the grasping device to take the device to be assembled out of the target detection area of the conveying device and placing it into a plug-in recovery area; If the defect mark information is the welding defect mark information, controlling the grasping device to take the component to be assembled out of the target detection area of the conveying device and placing it into the welding recovery area; If the defect mark information is the assembly defect mark information, the gripping device is controlled to take the device to be assembled out of the target detection area of the conveying device and place it into an assembly recovery area.

[0011] In one embodiment of the present application, based on the above solution, the method further includes: If there is no defect in the device to be assembled, instruction information indicating that the device to be assembled has been inspected normally is sent to the terminal device, so that the terminal device controls the conveying device to convey the device to be assembled to the next inspection area after the target inspection area according to the received instruction information, so as to perform defect inspection on the device to be assembled in the next inspection area.

[0012] According to one aspect of an embodiment of the present application, a control device for a distributed inspection system is provided. The control device is applied to the distributed inspection system. The distributed inspection system is used to perform defect inspection on components to be assembled placed on a conveyor. The distributed inspection system includes multiple inspection subsystems. The conveyor includes multiple inspection areas with sequence information. Each of the inspection subsystems corresponds to a single inspection area. The device includes: a first control unit, configured to control a detection subsystem corresponding to the target detection area to perform defect detection on the device to be assembled according to a detection type of the target detection area after the device to be assembled arrives at the target detection area, and obtain defect detection information; a judging unit, configured to judge whether the device to be assembled has a defect according to the defect detection information; a second control unit, configured to control the conveying device to stop conveying the device to be assembled if there is a defect in the device to be assembled, so as to stop the movement of the device to be assembled; a marking unit, configured to mark the device to be assembled to obtain defect marking information, wherein the defect marking information is used to indicate that the device to be assembled is defective when being inspected in the target inspection area; The sending unit is used to send the warning information and the defect mark information to the terminal device, so that the device to be assembled can be taken out from the conveying device according to the warning information.

[0013] According to one aspect of an embodiment of the present application, a computer-readable storage medium is provided, on which a computer program is stored. The computer program includes executable instructions. When the executable instructions are executed by a processor, the method described in the above embodiment is implemented.

[0014] According to one aspect of an embodiment of the present application, an electronic device is provided, comprising: one or more processors; and a memory for storing executable instructions of the processors, wherein when the executable instructions are executed by the one or more processors, the one or more processors implement the method described in the above embodiments.

[0015] The principle of this application is as follows: since each detection area has order information, the components to be assembled need to arrive at each detection area in sequence for detection, and the target detection area can be any detection area. Then, when the target detection area is the detection area ranked first, defect detection is required. If there are no defects in the device to be assembled, the conveyor device will be controlled to continue running and the device to be assembled will be transferred to the next detection area, which is the detection area ranked second. If a defect is detected, the conveyor device will stop running, and a warning message will be sent to the terminal device, and a defect mark corresponding to the target detection area will be made on the device to be assembled. In this way, it can be known which detection subsystem detected the defect, which facilitates the determination of the defect type.

[0016] The beneficial effects of the present application are as follows: Based on the structure of the distributed detection system, the present application can perform corresponding defect detection on the devices to be assembled at different stages according to different detection subsystems through fully automated defect detection and defect marking, thereby improving the detection efficiency and detection accuracy, and eliminating the need for manual re-inspection. At the same time, when a defect is detected in the device to be assembled in the target detection area, the operation of the conveyor device is stopped in time to prevent the device to be assembled from being conveyed to the next detection area of the target detection area, and the defective device to be assembled is removed from the conveyor device in time to prevent the defective device to be assembled from flowing into the next detection area, because the next detection area may be inconsistent with the defect detection type of the current target detection area. This can avoid the problem that the defect is not detected in the next detection area, resulting in the device that is finally assembled having an actual defect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the following briefly describes the drawings required for describing the embodiments. Obviously, the drawings described are only part of the embodiments of this application, not all of them. Those skilled in the art can also derive other design solutions and drawings based on these drawings without inventive effort.

[0018] Figure 1 Schematic diagram of logic for testing a device to be assembled at different stages according to an embodiment of the present application; Figure 2 This is a flow chart of a control method for a distributed detection system according to an embodiment of the present application; Figure 3 1 is a flowchart of defect detection of a device to be assembled during the placement stage according to an embodiment of the present application; Figure 4 1 is a flowchart of defect detection of a device to be assembled at the insertion stage according to an embodiment of the present application; Figure 5 1 is a flowchart of defect detection of a device to be assembled during the welding stage according to an embodiment of the present application; Figure 6 1 is a flowchart of defect detection of a device to be assembled during the assembly stage according to an embodiment of the present application; Figure 7 1 is a block diagram of a control device of a distributed detection system according to an embodiment of the present application; Figure 8 Schematic diagram of the system structure of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the embodiments of the present application. They are merely examples of devices and methods consistent with some aspects of the embodiments of the present application as detailed in the appended claims.

[0020] It will be understood that the terms "first", "second", etc. used in this application may be used herein to describe various concepts, but unless otherwise specified, these concepts are not limited by these terms. These terms are only used to distinguish one concept from another. For example, without departing from the scope of the embodiments of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the words "if" and "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0021] The terms "at least one", "plurality", "each", "any", etc. used in this application include "at least one", "two" or more, "plurality" or "each", "any" or "any one", "each" or "any one" as used herein.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.

[0023] The following is a detailed explanation of the background technology of this application: The assembly of components needs to go through the mounting stage, plug-in stage, welding stage and assembly stage to form a complete device, and the device to be assembled described in this application is a device in any of the mounting stage, plug-in stage, welding stage and assembly stage. For example, the device to be assembled needs to be mounted in the mounting stage, and flows into the plug-in stage after the mounting is completed. Therefore, the shape and structure of the device to be assembled are different in different stages. Therefore, this application introduces a mounting detection subsystem, a plug-in detection subsystem, a welding detection subsystem and an assembly detection subsystem to correspond to the four stages of mounting stage, plug-in stage, welding stage and assembly stage respectively. In each different stage, the device to be assembled will be subjected to image analysis, but the image analysis and processing of defect detection performed in different stages are different.

[0024] Existing inspection methods typically utilize ICT (In-Circuit Test) and AOI (Automated Optical Inspection) equipment. AOI equipment can inspect component polarity and missing components on a circuit board, but it cannot identify solder quality directly beneath components, making it difficult to identify false solder joints or cold solder joints. ICT equipment is highly effective at detecting manufacturing defects such as solder shorts, missing components, component errors, and disconnected connections. Functional Circuit Test (FCT) equipment verifies the proper functioning of PCBA components by applying stimulus signals to the components and verifying their responses. This is a functional test. In the component production process, AOI equipment is typically deployed during the insertion stage, ICT equipment during the soldering stage, and FCT equipment during the assembly stage. Typically, a product (device to be assembled) requires multiple inspections during the placement, insertion, soldering, and assembly stages. For example, during the manual insertion stage, inspection equipment may be required at different points to prevent cumulative errors. This necessitates the installation of multiple AOI, ICT, and FCT equipment, which is costly and undoubtedly increases costs.

[0025] If only one AOI device is installed and one ICT device is connected after welding, although the cost can be effectively controlled, it is easy to cause processing errors to not be discovered in time, errors to accumulate, and the defective rate of finished products to increase significantly.

[0026] The following is a detailed introduction to the distributed detection system of this application: The distributed detection system of the embodiment of the present application includes a mounting detection subsystem, a plug-in detection subsystem, a welding detection subsystem and an assembly detection subsystem. In fact, the mounting detection subsystem, the plug-in detection subsystem, the welding detection subsystem and the assembly detection subsystem are all implemented based on the photographing device corresponding to each detection area. The photographing device is used to take pictures of the components to be assembled in the detection area, thereby performing defect detection and analysis on the pictures. The photographing angles and shooting positions of the photographing devices corresponding to different detection subsystems are different, and the corresponding defect detection detection methods and analysis processing steps are also different. Each detection subsystem may correspond to multiple detection areas. For example Figure 1 (A.1)-(A.14) are all detection areas, for example, (A.1)-(A.2) correspond to the placement detection subsystem.

[0027] Furthermore, the inspection areas described in this application can also be implemented using inspection points, with each inspection point corresponding to a camera, thereby ensuring that different inspection areas capture different types of images. The target inspection area can be any inspection area, but it should be noted that since the inspection areas have order information, each round of inspection (i.e., through four stages) must pass through the inspection areas from the first to the last in the order. This allows processing errors to be discovered and removed in a timely manner, avoiding the risk of product defects.

[0028] The following is a detailed description of the implementation details of the technical solution of the embodiment of the present application: According to one aspect of an embodiment of the present application, a control method for a distributed detection system is provided, which is applied to a distributed detection system, wherein the distributed detection system is used to perform defect detection on a device to be assembled placed on a conveying device, the distributed detection system includes multiple detection subsystems, the conveying device includes multiple detection areas with sequence information, and each of the detection subsystems corresponds to a single detection area. Figure 2 This is a flow chart of a control method for a distributed detection system according to an embodiment of the present application. The method includes at least steps S110 to S150, which are described in detail as follows: In step S110 , after the device to be assembled arrives at a target inspection area, the inspection subsystem corresponding to the target inspection area is controlled according to the inspection type of the target inspection area to perform defect inspection on the device to be assembled to obtain defect inspection information.

[0029] Specifically, the above-mentioned detection subsystem is any one of a mounting detection subsystem, a plug-in detection subsystem, a welding detection subsystem and an assembly detection subsystem, and the method further includes: If the target detection area corresponds to the placement detection subsystem, determining that the detection type of the target detection area is a placement detection type; If the target detection area corresponds to the plug-in detection subsystem, determining that the detection type of the target detection area is a plug-in detection type; If the target detection area corresponds to the welding detection subsystem, determining that the detection type of the target detection area is a welding detection type; If the target inspection area corresponds to the assembly inspection subsystem, it is determined that the inspection type of the target inspection area is an assembly inspection type.

[0030] Furthermore, controlling the detection subsystem corresponding to the target detection area to perform defect detection on the device to be assembled according to the detection type of the target detection area to obtain defect detection information includes: If the detection type is the placement detection type, controlling the placement detection subsystem to perform a first defect detection on the device to be assembled to obtain placement defect detection information; If the detection type is the plug-in detection type, controlling the plug-in detection subsystem to perform a second defect detection on the device to be assembled to obtain plug-in defect detection information; If the inspection type is the welding inspection type, controlling the welding inspection subsystem to perform a third defect inspection on the device to be assembled to obtain welding defect inspection information; If the inspection type is the assembly inspection type, the assembly inspection subsystem is controlled to perform a fourth defect inspection on the device to be assembled to obtain assembly defect inspection information.

[0031] In other words, different inspection subsystems perform different inspection types. During the placement phase, defect detection related to placement inspection (i.e., primary defect detection) is performed. The captured images focus on the placement results, resulting in larger, clearer images that highlight any defects at the placement locations. Similarly, secondary defect detection corresponds to the insertion phase, performing defect detection operations by capturing images of the corresponding insertion locations and performing image analysis on the resulting images. Tertiary defect detection corresponds to the welding phase, and tertiary defect detection is performed during the assembly phase.

[0032] In step S120 , it is determined whether the device to be assembled has defects based on the defect detection information.

[0033] Specifically, judging whether the device to be assembled has defects according to the defect detection information includes: If the defect detection information is the mounting defect detection information, determining first image information of the device to be assembled based on the mounting defect detection information, determining first images of each first detection point of the device to be assembled based on the first image information, and determining whether the device to be assembled has a defect based on each first image; If the defect detection information is the plug-in defect detection information, determining second image information of the device to be assembled based on the plug-in defect detection information, determining second images of each second detection point of the device to be assembled based on the second image information, and determining whether the device to be assembled has a defect based on each second image; If the defect detection information is the welding defect detection information, determining third image information of the device to be assembled based on the welding defect detection information, and determining third images of each third detection point of the device to be assembled based on the third image information, and determining whether the device to be assembled has a defect based on each third image; If the defect detection information is the assembly defect detection information, the fourth image information of the device to be assembled is determined based on the assembly defect detection information, and the fourth image of each fourth detection point of the device to be assembled is determined based on the fourth image information, and whether the device to be assembled has defects is determined based on each of the fourth images.

[0034] Specifically, the first image information is used to represent the image captured by the photographing device corresponding to the mounting detection subsystem (i.e., the corresponding detection point) when the device to be assembled is in the mounting stage (i.e., the target detection area is the detection area corresponding to the mounting detection subsystem); the second image information is used to represent the image captured by the photographing device corresponding to the welding detection subsystem (i.e., the corresponding detection point) when the device to be assembled is in the welding stage (i.e., the target detection area is the detection area corresponding to the welding detection subsystem); the third image information is used to represent the image captured by the photographing device corresponding to the plug-in detection subsystem (i.e., the corresponding detection point) when the device to be assembled is in the plug-in stage (i.e., the target detection area is the detection area corresponding to the plug-in detection subsystem); the fourth image information is used to represent the image captured by the photographing device corresponding to the assembly detection subsystem (i.e., the corresponding detection point) when the device to be assembled is in the assembly stage (i.e., the target detection area is the detection area corresponding to the assembly detection subsystem).

[0035] In step S130 , if the device to be assembled has defects, the conveying device is controlled to stop conveying the device to be assembled, so that the device to be assembled stops moving.

[0036] Specifically, if it is determined that there is a defect in the device to be assembled in the current target inspection area, the operation of the conveying device is stopped, that is, the conveying device is controlled to stop conveying the device to be assembled, so that the device to be assembled stops moving, and prevents the defective device to be assembled from flowing into the next inspection area. Of course, as long as it is determined that there is a defect in the device to be assembled, the grasping device will respond within 1 second and take out the device to be assembled. This removal process is completed within only 3 seconds. Therefore, even if the operation of the conveying device is stopped immediately, it will only stop for a few seconds and will not affect the normal operation of the entire assembly line (conveyor device).

[0037] In one embodiment of the present application, the method further includes: If there is no defect in the device to be assembled, instruction information indicating that the device to be assembled has been inspected normally is sent to the terminal device, so that the terminal device controls the conveying device to convey the device to be assembled to the next inspection area after the target inspection area according to the received instruction information, so as to perform defect inspection on the device to be assembled in the next inspection area.

[0038] Specifically, if no defects are detected in the current target detection area, then according to the order information of the target detection area, the first detection area (the next detection area described in this application) whose order information follows the target detection area is searched, and this detection area is used as the new target detection area to continue a new round of defect detection.

[0039] In step S140 , the device to be assembled is marked to obtain defect marking information, where the defect marking information is used to indicate that the device to be assembled is detected to have defects when inspected in the target inspection area.

[0040] Specifically, the distributed detection system further includes a gripping device disposed above the conveying device, and the marking of the components to be assembled to obtain defect marking information includes: If the defect detection information is the mounting defect detection information, controlling the gripping device to perform mounting defect marking on the device to be assembled to obtain mounting defect marking information; If the defect detection information is the plug-in defect detection information, controlling the grasping device to perform plug-in defect marking on the device to be assembled to obtain plug-in defect marking information; If the defect detection information is the welding defect detection information, controlling the grasping device to perform welding defect marking on the component to be assembled to obtain welding defect marking information; If the defect detection information is the assembly defect detection information, the gripping device is controlled to perform assembly defect marking on the device to be assembled to obtain assembly defect marking information.

[0041] Specifically, if the defect detection information is the mounting defect detection information, then it means that the current target detection area is the detection area corresponding to the mounting detection subsystem of the device to be assembled. At this time, the gripping device is controlled to mark the device to be assembled with mounting defects. The gripping device can be a robotic arm arranged above the conveying device. The mounting defect marking, plug-in defect marking, welding defect marking, and assembly defect marking can be operations for labeling the device to be assembled. At the same time, the mounting defect marking, plug-in defect marking, welding defect marking, and assembly defect marking will also send defect information related to mounting defects, plug-in defects, welding defects, and assembly defects (i.e., mounting defect marking information, plug-in defect marking information, welding defect marking information, and assembly defect marking information) to the terminal device. It should be noted that the terminal device in the embodiment of the present application can be a mobile phone, computer, or other device used by a user or administrator.

[0042] In step S150 , a warning message and the defect mark information are sent to a terminal device, so that the device to be assembled is taken out from the conveying device according to the warning message.

[0043] Specifically, the terminal device can be a mobile phone, computer or other device used by the user or administrator. After viewing the warning information and defect mark information displayed by the terminal device, the user can organize and count the defect mark information, such as the defect rate of a certain batch of components to be assembled, etc., for subsequent data processing and analysis. At the same time, the received warning information can be used manually to promptly determine whether the gripping device has taken the defective components to be assembled out of the conveying device in a timely manner. The conveying device can be specifically a conveyor belt, a conveyor belt or other equipment, such as Figure 1 The transmission channel where (3) is located.

[0044] In one embodiment of the present application, after sending the warning information and the defect marking information to the terminal device, the method further includes: If the defect mark information is the placement defect mark information, controlling the gripping device to take the device to be assembled out of the target detection area of the conveying device and place it into a placement recovery area; If the defect mark information is the plug-in defect mark information, controlling the grasping device to take the device to be assembled out of the target detection area of the conveying device and placing it into a plug-in recovery area; If the defect mark information is the welding defect mark information, controlling the grasping device to take the component to be assembled out of the target detection area of the conveying device and placing it into the welding recovery area; If the defect mark information is the assembly defect mark information, the gripping device is controlled to take the device to be assembled out of the target detection area of the conveying device and place it into an assembly recovery area.

[0045] Specifically, defective components to be assembled detected in different detection subsystems corresponding to different target detection areas can be placed in corresponding recycling areas (i.e., mounting recycling area, plug-in recycling area, welding recycling area, and assembly recycling area), which facilitates subsequent corresponding processing of defective components to be assembled and improves the assembly efficiency of the entire batch of products.

[0046] The following combination Figure 1 To describe the specific implementation of this application: Taking the PCBA board as an example, the process flow for PCBA boards is generally as follows: machine insertion - placement machine - reflow soldering - hand insertion - screwing - wave soldering - full soldering - assembly - drying oven - glue filling - FCT - packaging - warehousing. This can be summarized as the placement stage, insertion stage, soldering stage, and assembly stage. The various detection subsystems provided in this application can be distributed throughout all stages of the PCBA process flow.

[0047] Set standard points in the electronics industry (one standard point corresponds to one inspection area in this application). Set standard points in the placement, plug-in, soldering, and assembly stages: In the placement stage, due to the high degree of automation of automatic chip placement, a point is set after placement and a point is set after reflow soldering. In the plug-in stage, in addition to machine insertion, manual insertion is also required, so multiple points can be set. Here, a point is set every three stations, and a point is set for screwing. In the soldering stage, a point is set after wave soldering, a point is set after full soldering, and a point is set for re-soldering. In the assembly stage, a point is set after assembly, drying, and glue filling. Each point corresponds to an inspection area described in this application. A camera is placed above each point for photographing and analyzing the components to be assembled (PCBA boards). Each camera has serial number information. A processing platform is introduced, which can be equivalent to a server. The images captured by each point and the shooting device corresponding to each point (i.e., the first image information, second image information, third image information and fourth image information in this application) can be sent to the processing platform for analysis and processing. The processing platform can detect and analyze different defect types of the captured images based on a deep learning model to determine whether there are defects in the device to be assembled.

[0048] like Figure 1 As shown: Serial numbers (1) and (2) indicate the inflow and outflow directions of each stage of PCBA; (3) is the conveyor belt (the conveying device described in this application). Each stage can be in the same space or in different spaces. Figure 3 As shown, Figure 3 This is the inspection process of the mounting stage: a circuit board (device to be assembled) flows in from the mounting stage, passes through the mounting machine (4), the inspection area (A.1) of the mounting inspection subsystem, reflow soldering (5), the inspection area (A.2) of the mounting inspection subsystem, and then flows out to the plug-in stage.

[0049] like Figure 4 As shown, Figure 4 This is the inspection process of the plug-in stage: PCBA passes through (6.1) (A.3) (6.2) (A.4) (6.3) (A.5) (6.4) (A.6) and flows into the screw-driving station (7). (A.7) is the inspection point corresponding to the screw-driving. (6.1), (6.2), (6.3) and (6.4) are different plug-in processing stations in the plug-in stage, and (A.3), (A.4), (A.5) and (A.6) correspond to each plug-in processing station respectively.

[0050] like Figure 5 As shown, Figure 5 The inspection process for the welding stage: When the PCBA flows to the welding stage, it passes through wave soldering (8), the inspection area corresponding to the welding inspection subsystem (A.8), whole soldering (9), and the inspection area corresponding to the welding inspection subsystem (A.9) and flows to the assembly stage.

[0051] like Figure 6 As shown, Figure 6 The inspection process for the assembly stage is as follows: assembly (10), inspection area corresponding to the assembly inspection subsystem (A.10), machine assembly (11), inspection area corresponding to the assembly inspection subsystem (A.11), drying tunnel (12), inspection area corresponding to the assembly inspection subsystem (A.12), glue filling (13), inspection area corresponding to the assembly inspection subsystem (A.13), packaging (14), inspection area corresponding to the assembly inspection subsystem (A.14), and finally shipment. The above are common points for a complete line. The camera corresponding to any point can be turned on or off according to the actual situation. That is, (A.1)-(A.14) can be turned on or off according to the actual situation.

[0052] In summary, based on the structure of the distributed detection system, the present application can perform corresponding defect detection on the devices to be assembled at different stages according to different detection subsystems through fully automated defect detection and defect marking, thereby improving the detection efficiency and detection accuracy, and eliminating the need for manual re-inspection. At the same time, when a defect is detected in the device to be assembled in the target detection area, the operation of the conveying device is stopped in time to prevent the device to be assembled from being conveyed to the next detection area of the target detection area, and the defective device to be assembled is removed from the conveying device in time to prevent the defective device to be assembled from flowing into the next detection area, because the next detection area may be inconsistent with the defect detection type of the current target detection area. This can avoid the problem that the defect is not detected in the next detection area, resulting in actual defects in the device that is finally assembled.

[0053] Figure 7 This is a block diagram of a control device 300 of a distributed detection system according to an embodiment of the present application. The control device 300 of a distributed detection system according to an embodiment of the present application is applied to a distributed detection system, wherein the distributed detection system is used to perform defect detection on devices to be assembled placed on a conveying device. The distributed detection system includes multiple detection subsystems, and the conveying device includes multiple detection areas with sequence information. Each of the detection subsystems corresponds to a single detection area. The device 300 includes: a first control unit 301, a judgment unit 302, a second control unit 303, a marking unit 304, and a sending unit 305.

[0054] A first control unit 301 is configured to control a detection subsystem corresponding to a target detection area to perform defect detection on the device to be assembled according to a detection type of the target detection area after the device to be assembled arrives at the target detection area, and obtain defect detection information; A judging unit 302 is configured to judge whether the device to be assembled has defects based on the defect detection information; A second control unit 303 is configured to control the conveying device to stop conveying the device to be assembled if there is a defect in the device to be assembled, so as to stop the movement of the device to be assembled; a marking unit 304 for marking the device to be assembled to obtain defect marking information, wherein the defect marking information is used to indicate that the device to be assembled is defective when inspected in the target inspection area; The sending unit 305 is configured to send a warning message and the defect marking information to a terminal device, so that the device to be assembled can be taken out from the conveying device according to the warning message.

[0055] As another aspect, the present application further provides a computer-readable storage medium having stored thereon a program product capable of implementing the methods provided above in this specification. In some possible implementations, various aspects of the present application may also be implemented in the form of a program product, which includes program code. When the program product is executed on a terminal device, the program code is used to cause the terminal device to perform the steps described in the "Example Method" section above in accordance with various exemplary embodiments of the present application.

[0056] According to an embodiment of the present application, a program product for implementing the above method can be a portable compact disc read-only memory (CD-ROM) and include program code, and can be run on a terminal device, such as a personal computer. However, the program product of the present application is not limited thereto. In this document, a readable storage medium can be any tangible medium containing or storing a program, which can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0057] The program product may utilize any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or component, or any combination thereof. More specific examples (a non-exhaustive list) of readable storage media include: an electrical connection having one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof.

[0058] A computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, which carries readable program code. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A readable signal medium may also be any readable medium other than a readable storage medium that can transmit, propagate, or transfer a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0059] The program code embodied on the readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

[0060] The program code used to perform the operations of the present application can be written in any combination of one or more programming languages, including object-oriented programming languages such as Java, C++, and conventional procedural programming languages such as "C" or similar programming languages. The program code can be executed entirely on the user computing device, partially on the user device, as a stand-alone software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server. In the case of a remote computing device, the remote computing device can be connected to the user computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0061] As another aspect, the present application also provides an electronic device capable of implementing the above method.

[0062] Those skilled in the art will appreciate that various aspects of the present application can be implemented as systems, methods, or program products. Therefore, various aspects of the present application can be specifically implemented in the following forms: a complete hardware implementation, a complete software implementation (including firmware, microcode, etc.), or an implementation that combines hardware and software aspects, which may be collectively referred to herein as a "circuit," "module," or "system."

[0063] Refer to the following Figure 8 4 to describe an electronic device 400 according to this embodiment of the present application. Figure 8 The electronic device 400 shown is merely an example and should not limit the functions and scope of use of the embodiments of the present application.

[0064] like Figure 8 As shown, electronic device 400 is implemented as a general-purpose computing device. Components of electronic device 400 may include, but are not limited to, the aforementioned at least one processing unit 410, the aforementioned at least one storage unit 420, and a bus 430 connecting various system components (including storage unit 420 and processing unit 410).

[0065] The storage unit stores program code, which can be executed by the processing unit 410, so that the processing unit 410 performs the steps described in the above "Example Method" section of this specification according to various exemplary embodiments of the present application.

[0066] The storage unit 420 may include a readable medium in the form of a volatile storage unit, such as a random access memory unit (RAM) 421 and / or a cache memory unit 422 , and may further include a read-only memory unit (ROM) 423 .

[0067] The storage unit 420 may also include a program / utility 424 having a set (at least one) of program modules 425, such program modules 425 including but not limited to: an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment.

[0068] Bus 430 may represent one or more of several types of bus structures, including a memory unit bus or memory unit controller node, a peripheral bus, an accelerated graphics port, a processing unit, or a local bus using any of a variety of bus architectures.

[0069] The electronic device 400 can also communicate with one or more external devices 1200 (e.g., a keyboard, pointing device, Bluetooth device, etc.), one or more devices that enable a user to interact with the electronic device 400, and / or any device that enables the electronic device 400 to communicate with one or more other computing devices (e.g., a router, modem, etc.). This communication can occur via an input / output (I / O) interface 450. Furthermore, the electronic device 400 can communicate with one or more networks (e.g., a local area network (LAN), a wide area network (WAN), and / or a public network such as the Internet) via a network adapter 460. As shown, the network adapter 460 communicates with other modules of the electronic device 400 via a bus 430. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with the electronic device 400, including but not limited to microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0070] Through the description of the above embodiments, it is easy for those skilled in the art to understand that the example embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solution according to the embodiments of the present application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, USB flash drive, mobile hard disk, etc.) or on a network, and includes instructions to enable a computing device (which can be a personal computer, server, terminal device, or network device, etc.) to execute the method according to the embodiments of the present application.

[0071] The embodiments described in the embodiments of this application are intended to more clearly illustrate the technical solutions of the embodiments of this application and do not constitute a limitation on the technical solutions provided by the embodiments of this application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0072] Those skilled in the art will understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0073] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but are not intended to limit the scope of the present invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and essence of the present invention should be within the scope of the present invention.

Claims

1. A control method for a distributed detection system, characterized in that: The method is applied to a distributed inspection system for performing defect inspection on a device to be assembled placed on a conveyor. The distributed inspection system includes multiple inspection subsystems. The conveyor includes multiple inspection areas with sequence information. Each of the inspection subsystems corresponds to a single inspection area. The method includes: After the device to be assembled arrives at a target inspection area, controlling a detection subsystem corresponding to the target inspection area to perform defect detection on the device to be assembled according to an inspection type of the target inspection area to obtain defect detection information; determining whether the device to be assembled has defects according to the defect detection information; If the device to be assembled has a defect, controlling the conveying device to stop conveying the device to be assembled, so that the device to be assembled stops moving; Marking the device to be assembled to obtain defect marking information, where the defect marking information is used to indicate that the device to be assembled is defective when inspected in the target inspection area; The warning information and the defect mark information are sent to a terminal device so that the device to be assembled is taken out from the conveying device according to the warning information.

2. The control method of the distributed detection system according to claim 1, characterized in that: The detection subsystem is any one of a mounting detection subsystem, a plug-in detection subsystem, a welding detection subsystem, and an assembly detection subsystem, and the method further includes: If the target detection area corresponds to the placement detection subsystem, determining that the detection type of the target detection area is a placement detection type; If the target detection area corresponds to the plug-in detection subsystem, determining that the detection type of the target detection area is a plug-in detection type; If the target detection area corresponds to the welding detection subsystem, determining that the detection type of the target detection area is a welding detection type; If the target inspection area corresponds to the assembly inspection subsystem, it is determined that the inspection type of the target inspection area is an assembly inspection type.

3. The control method of the distributed detection system according to claim 2, characterized in that: The controlling, according to the detection type of the target detection area, the detection subsystem corresponding to the target detection area to perform defect detection on the device to be assembled to obtain defect detection information includes: If the detection type is the placement detection type, controlling the placement detection subsystem to perform a first defect detection on the device to be assembled to obtain placement defect detection information; If the detection type is the plug-in detection type, controlling the plug-in detection subsystem to perform a second defect detection on the device to be assembled to obtain plug-in defect detection information; If the inspection type is the welding inspection type, controlling the welding inspection subsystem to perform a third defect inspection on the device to be assembled to obtain welding defect inspection information; If the inspection type is the assembly inspection type, the assembly inspection subsystem is controlled to perform a fourth defect inspection on the device to be assembled to obtain assembly defect inspection information.

4. The control method of the distributed detection system according to claim 3, characterized in that: The determining whether the device to be assembled has a defect according to the defect detection information includes: If the defect detection information is the mounting defect detection information, determining first image information of the device to be assembled based on the mounting defect detection information, determining first images of each first detection point of the device to be assembled based on the first image information, and determining whether the device to be assembled has a defect based on each first image; If the defect detection information is the plug-in defect detection information, determining second image information of the device to be assembled based on the plug-in defect detection information, determining second images of each second detection point of the device to be assembled based on the second image information, and determining whether the device to be assembled has a defect based on each second image; If the defect detection information is the welding defect detection information, determining third image information of the device to be assembled based on the welding defect detection information, and determining third images of each third detection point of the device to be assembled based on the third image information, and determining whether the device to be assembled has a defect based on each third image; If the defect detection information is the assembly defect detection information, the fourth image information of the device to be assembled is determined based on the assembly defect detection information, and the fourth image of each fourth detection point of the device to be assembled is determined based on the fourth image information, and whether the device to be assembled has defects is determined based on each of the fourth images.

5. The control method of the distributed detection system according to claim 4, characterized in that: The distributed detection system further includes a gripping device disposed above the conveying device, and the marking of the components to be assembled to obtain defect marking information includes: If the defect detection information is the mounting defect detection information, controlling the gripping device to perform mounting defect marking on the device to be assembled to obtain mounting defect marking information; If the defect detection information is the plug-in defect detection information, controlling the grasping device to perform plug-in defect marking on the device to be assembled to obtain plug-in defect marking information; If the defect detection information is the welding defect detection information, controlling the grasping device to perform welding defect marking on the component to be assembled to obtain welding defect marking information; If the defect detection information is the assembly defect detection information, the grasping device is controlled to perform assembly defect marking on the device to be assembled to obtain assembly defect marking information.

6. The control method of the distributed detection system according to claim 5, characterized in that: After sending the warning information and the defect marking information to the terminal device, the method further includes: If the defect mark information is the placement defect mark information, controlling the gripping device to take the device to be assembled out of the target detection area of the conveying device and place it into a placement recovery area; If the defect mark information is the plug-in defect mark information, controlling the grabbing device to take the device to be assembled out of the target detection area of the conveying device and place it into a plug-in recovery area; If the defect mark information is the welding defect mark information, controlling the grasping device to take the component to be assembled out of the target detection area of the conveying device and place it into the welding recovery area; If the defect mark information is the assembly defect mark information, the gripping device is controlled to take the device to be assembled out of the target detection area of the conveying device and place it into an assembly recovery area.

7. The control method of the distributed detection system according to claim 1, characterized in that: The method further comprises: If there is no defect in the device to be assembled, instruction information indicating that the device to be assembled has been inspected normally is sent to the terminal device, so that the terminal device controls the conveying device to convey the device to be assembled to the next inspection area after the target inspection area according to the received instruction information, so as to perform defect inspection on the device to be assembled in the next inspection area.

8. A control device for a distributed detection system, characterized in that: Applied to a distributed inspection system for defect detection of components to be assembled placed on a conveyor. The distributed inspection system includes multiple inspection subsystems. The conveyor includes multiple inspection areas with sequence information. Each inspection subsystem corresponds to a single inspection area. The device includes: a first control unit, configured to control a detection subsystem corresponding to the target detection area to perform defect detection on the device to be assembled according to a detection type of the target detection area after the device to be assembled arrives at the target detection area, and obtain defect detection information; a judging unit, configured to judge whether the device to be assembled has a defect according to the defect detection information; a second control unit, configured to control the conveying device to stop conveying the device to be assembled if there is a defect in the device to be assembled, so as to stop the movement of the device to be assembled; a marking unit, configured to mark the device to be assembled to obtain defect marking information, wherein the defect marking information is used to indicate that the device to be assembled is defective when being inspected in the target inspection area; The sending unit is used to send the warning information and the defect mark information to the terminal device, so that the device to be assembled can be taken out from the conveying device according to the warning information.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores at least one program code, and the at least one program code is loaded and executed by a processor to implement the operations performed by the method according to any one of claims 1 to 7.

10. An electronic device, characterized in that: The electronic device includes one or more processors and one or more memories, wherein the one or more memories store at least one program code, and the at least one program code is loaded and executed by the one or more processors to implement the operations performed by the method according to any one of claims 1 to 7.

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