Electrical connection device

Abstract

Provided is an electrical connection device in which electrical connection between substrates is stable. An electrical connection device (1) is provided with: a probe (10); a wiring substrate (20) including a first electrode (21) electrically connected to the probe, an internal wiring (200), and a second electrode (22) electrically connected to the first electrode via the internal wiring; and a wiring sheet (30) having flexibility and including a first connection portion (31) disposed on a first surface (311), a second connection portion (32) disposed on a second surface (312) facing in a direction opposite to the first surface, and an internal circuit electrically connected to at least one of the first connection portion and the second connection portion. At least one of the first connection part and the second connection part is provided with a claw part (300) which protrudes obliquely with respect to a plane perpendicular to the thickness direction of the wiring sheet and has conductivity. The internal wiring of the wiring substrate and the internal circuit of the wiring sheet are electrically connected via the claw portion.

Description

Technical Field

[0001] The present invention relates to an electrical connection device used for inspecting electrical characteristics of an inspection object. Background Art

[0002] To measure the electrical characteristics of an object under test, such as an integrated circuit, an electrical connection device is used, which includes test terminals that contact the object. During measurements using the electrical connection device, the object under test is electrically connected to a tester or other testing device via the test terminals. To measure various characteristics of the object under test, the electrical connection device is constructed by stacking multiple substrates, such as printed circuit boards and space transformers.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-178901 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] If the flatness of the multiple substrates constituting the electrical connection device is different, gaps will be generated between the substrates, reducing the stability of the electrical connection between the substrates. An object of the present invention is to provide an electrical connection device in which the electrical connection between the substrates is stable.

[0008] Solutions for solving problems

[0009] An electrical connection device according to one embodiment of the present invention comprises: an inspection terminal; a wiring substrate including a first electrode electrically connected to the inspection terminal, internal wiring, and a second electrode; and a flexible wiring sheet including a first connecting portion disposed on a first sheet surface, a second connecting portion disposed on a second sheet surface, and an internal circuit electrically connected to at least one of the first and second connecting portions. A conductive claw is disposed on at least one of the first and second connecting portions, protruding obliquely relative to a surface perpendicular to the thickness direction of the wiring sheet. The internal wiring of the wiring substrate and the internal circuit of the wiring sheet are electrically connected via the claw.

[0010] Effects of the Invention

[0011] According to the present invention, it is possible to provide an electrical connection device in which electrical connection between substrates is stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram showing the structure of the electrical connection device according to the first embodiment.

[0013] Figure 2A It is a schematic plan view showing the structure of the electrical connecting device according to the first embodiment.

[0014] Figure 2B It is a schematic cross-sectional view showing the structure of the electrical connecting device according to the first embodiment.

[0015] Figure 3 This is a schematic cross-sectional view showing an example of the structure of the wiring sheet of the electrical connection device according to the first embodiment.

[0016] Figure 4 This is a schematic diagram showing an example of the structure of the claw portion of the wiring sheet of the electrical connection device according to the first embodiment.

[0017] Figure 5 It is a schematic diagram showing an example of arrangement of claw portions of a wiring sheet of the electrical connection device according to the first embodiment.

[0018] Figure 6 It is a schematic diagram showing an example of the extending direction of the claw portion of the wiring sheet of the electrical connection device according to the first embodiment.

[0019] Figure 7 This is a schematic diagram showing another example of the structure of the claw portion of the wiring sheet of the electrical connection device according to the first embodiment.

[0020] Figure 8 This is a schematic diagram showing still another example of the structure of the claw portion of the wiring sheet of the electrical connection device according to the first embodiment.

[0021] Figure 9 Schematic diagram showing an example of an internal circuit of a wiring sheet of the electrical connection device according to the embodiment.

[0022] Figure 10 This is a schematic diagram illustrating another example of the internal circuit of the wiring sheet of the electrical connection device according to the embodiment.

[0023] Figure 11 This is a schematic diagram illustrating another example of the internal circuit of the wiring sheet of the electrical connection device according to the embodiment.

[0024] Figure 12 Is shown using Figure 11 Schematic diagram of an example of a loopback circuit for a wiring sheet is shown.

[0025] Figure 13 This is a schematic diagram illustrating another example of the internal circuit of the wiring sheet of the electrical connection device according to the embodiment.

[0026] Figure 14 This is a schematic diagram illustrating another example of the internal circuit of the wiring sheet of the electrical connection device according to the embodiment.

[0027] Figure 15It is a schematic diagram showing the structure of the electrical connection device according to the second embodiment.

[0028] Figure 16 It is a schematic diagram showing the structure of the electrical connection device according to the third embodiment.

[0029] Description of Reference Numerals

[0030] 1. 1A, 1B, electrical connection device; 10. Probe; 20. Wiring substrate; 21. First electrode; 22. Second electrode; 30. Wiring sheet; 30A, First wiring sheet; 30B, Second wiring sheet; 31. First connecting portion; 32. Second connecting portion; 40. Printed circuit board; 41. First end portion; 42. Second end portion; 50. Reinforcement member; 60. Probe head; 200, internal wiring; 300, claw portion; 301, covering film; 302, conductive film; 303, insulating film; 310, supporting portion; 311, first side; 312, second side; 400, wiring pattern. DETAILED DESCRIPTION

[0031] Next, embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the following drawings, identical or similar parts are marked with identical or similar reference numerals. However, it should be noted that the drawings are schematic, and the ratio of the thickness of each part is different from the actual situation. In addition, the drawings naturally include parts with different dimensional relationships and ratios. The embodiments shown below are examples of devices and methods for concretizing the technical ideas of the present invention. The materials, shapes, structures, and configurations of the structural components in the embodiments of the present invention are not specific to the following.

[0032] (First embodiment)

[0033] Figure 1 The electrical connection device 1 of the first embodiment shown is used for inspecting an inspection object 2. The electrical connection device 1 includes: a plurality of probes 10 that are in contact with the inspection object 2 during inspection; a wiring substrate 20 that is connected to the probes 10; a wiring sheet 30 that is stacked on the wiring substrate 20; and a printed circuit board 40 that is stacked on the wiring sheet 30. The electrical connection device 1 also includes a reinforcement member 50 stacked on the printed circuit board 40. In the following description, the direction in which the electrical connection device 1 is located when viewed from the inspection object 2 is set as an upward direction, and the direction in which the inspection object 2 is located when viewed from the electrical connection device 1 is set as a downward direction. As Figure 1 As shown in FIG, the direction from the bottom to the top is defined as the Z direction, and the plane perpendicular to the Z direction is defined as the XY plane. Figure 1In the drawings, the left-right direction is the X direction, and the depth direction is the Y direction. In each component of the electrical connection device 1, the upward-facing surface is also referred to as the upper surface, and the downward-facing surface is also referred to as the lower surface.

[0034] The probe 10 functions as an inspection terminal that electrically connects the inspection object 2 and the inspection device. The probe 10 includes a tip portion configured to be in contact with the inspection object 2 and a base portion connected to the tip portion. Figure 1 As shown, the probe 10 may be supported by a probe head 60 that is passed through the probe 10. For example, the probe 10 is held while passing through a through hole formed in the probe head 60. The probe head 60 is fixed to the wiring substrate 20, for example. The base end of the probe 10 is connected to the wiring substrate 20.

[0035] The inspection object 2 is mounted on a table 3. The electrical connection device 1 and the table 3 are movable relative to each other in the vertical direction. When inspecting the inspection object 2, the distance between the electrical connection device 1 and the table 3 is narrowed, and the tip of the probe 10 contacts a signal terminal (not shown) of the inspection object 2. Figure 1 The probe 10 and the inspection object 2 are shown in a state where they are separated.

[0036] The wiring substrate 20 includes a first electrode 21 electrically connected to the probes 10, internal wiring 200, and a second electrode 22. The first electrode 21 is connected to the base ends of each of the plurality of probes 10 included in the electrical connection device 1. The second electrode 22 is electrically connected to the first electrode 21 via the internal wiring 200. A multilayer wiring substrate such as an MLO (Multi-Layer Organic) or MLC (Multi-Layer Ceramic) can also be used as the wiring substrate 20.

[0037] The wiring sheet 30 includes a first surface 311 facing the wiring substrate 20 and a second surface 312 facing the printed circuit board 40 in the opposite direction to the first surface 311. The first connecting portion 31 is arranged on the first surface 311, and the second connecting portion 32 is arranged on the second surface 312. In addition, the wiring sheet 30 has an internal circuit electrically connected to at least one of the first connecting portion 31 and the second connecting portion 32, but Figure 1 The wiring sheet 30 has flexibility and can be elastically deformed in the film thickness direction.

[0038] At least one of the first connecting portion 31 and the second connecting portion 32 of the wiring sheet 30 is provided with a conductive claw 300 that protrudes obliquely from a first sheet surface 311 and a second sheet surface 312 perpendicular to the thickness direction of the wiring sheet 30 .

[0039] Printed circuit board 40 is arranged opposite wiring substrate 20 with wiring sheet 30 interposed therebetween. Printed circuit board 40 includes a first end portion 41 arranged on the lower surface facing wiring sheet 30, a second end portion 42 arranged on the upper surface facing the direction opposite to the first main surface, and a wiring pattern 400 electrically connecting first end portion 41 and second end portion 42. Second end portion 42 of wiring pattern 400 is electrically connected to an inspection device (not shown).

[0040] The first sheet surface 311 is the lower surface of the wiring sheet 30, facing the wiring substrate 20. The second sheet surface 312 is the upper surface of the wiring sheet 30, facing the printed circuit board 40. In the wiring sheet 30 disposed between the wiring substrate 20 and the printed circuit board 40, the claws 300 are disposed on both the first connecting portion 31 and the second connecting portion 32. Furthermore, the first connecting portion 31 of the wiring sheet 30 is connected to the second electrode 22 of the wiring substrate 20 via the claws 300, and the second connecting portion 32 is connected to the first end portion 41 of the wiring pattern 400 of the printed circuit board 40 via the claws 300. This electrically connects the internal wiring 200 of the wiring substrate 20 to the internal circuit of the wiring sheet 30, and the wiring pattern 400 of the printed circuit board 40 to the internal circuit of the wiring sheet 30.

[0041] As described above, first connection portion 31 of wiring sheet 30 is electrically connected to second electrode 22 of wiring substrate 20, and second connection portion 32 is electrically connected to wiring pattern 400 of printed circuit board 40. In other words, wiring sheet 30 functions as a relay between wiring substrate 20 and printed circuit board 40.

[0042] For example, the wiring substrate 20 may be a space transformer that increases the spacing between the base ends of the probes 10, as viewed in the direction normal to the main surface of the wiring substrate 20, to the spacing between the first ends 41 of the printed circuit board 40. By configuring the wiring substrate 20 as a space transformer, it is possible to electrically connect the base ends of the probes 10 corresponding to the spacing between the signal terminals arranged on the inspection object 2 to the wiring patterns 400 of the printed circuit board 40, which are arranged at a greater spacing than the spacing between the base ends. The increased spacing between the second ends 42 of the wiring patterns 400 facilitates electrical connection between the wiring patterns 400 of the printed circuit board 40 and the inspection device.

[0043] You can also Figure 1 As shown, a reinforcement member 50 is laminated on the printed circuit board 40. The reinforcement member 50 has a higher rigidity than the printed circuit board 40, preventing the printed circuit board 40 from bending, thereby ensuring the mechanical strength of the electrical connection device 1. Furthermore, the reinforcement member 50 can be used as a support to secure the various components of the electrical connection device 1. The reinforcement member 50 can also be secured to the printed circuit board 40 using screws, for example.

[0044] Figure 2A This is a plan view of a structure in which the wiring substrate 20 , the wiring sheet 30 , the printed wiring board 40 , and the reinforcement 50 are stacked, as viewed from the Z direction (hereinafter also referred to as a “plan view”). Figure 2B This is a cross-sectional view of the side surface viewed from the Y direction of the XY plane perpendicular to the Z direction. Figure 2B Illustration of the first electrode 21 and the second electrode 22 of the wiring substrate 20 , the first connecting portion 31 and the second connecting portion 32 of the wiring sheet 30 , the wiring pattern 400 of the printed circuit board 40 , and the like is omitted.

[0045] A reinforcing member 50 is disposed on the upper surface of the printed circuit board 40 which is circular in plan view. The reinforcing member 50 has, for example, Figure 2A The shape shown is formed by connecting an outer circular ring and an inner rectangular ring with spokes. Wiring substrate 20 and wiring sheet 30 are arranged near the center of the lower surface of printed circuit board 40. Wiring substrate 20, wiring sheet 30, printed circuit board 40, and reinforcement 50 are fixed to each other using, for example, screws. Figure 2B An example is shown in which the wiring substrate 20 , the wiring sheet 30 , and the printed circuit board 40 are joined together using screws 70 .

[0046] The wiring sheet 30 may have a structure in which a conductive film and an insulating film are laminated. For example, an internal circuit may be formed by a conductive pattern formed on the conductive film. Figure 3 An example of the structure of the wiring sheet 30 is shown. Figure 3 The first connection portion 31 and the second connection portion 32 are omitted in the figure.

[0047] Figure 3 The wiring sheet 30 shown has a structure in which a stack of a conductive film 302 and an insulating film 303 is sandwiched between a pair of covering films 301 of insulating material. The number of stacks of conductive films 302 and insulating films 303 can be set arbitrarily. The conductive film 302 can also be a metal material such as copper foil. The insulating film 303 can also be an insulating material such as a polyimide sheet. The covering film 301 can also be an insulating material such as a solder resist. The conductive film 302, the insulating film 303 and the covering film 301 can also be bonded to each other using, for example, an adhesive. In addition, the wiring sheet 30 can also be a structure in which a film of insulating material (also called a "base film") is sandwiched between the stack of layers including the conductive film 302 and the insulating film 303.

[0048] Because wiring sheet 30 is flexible, irregularities on the upper surface of wiring substrate 20 and the lower surface of printed circuit board 40 are absorbed by wiring sheet 30. Furthermore, even if the outer shapes of wiring substrate 20 or printed circuit board 40 are strained, the strain is absorbed by wiring sheet 30, thereby stabilizing the structure of electrical connection device 1. Consequently, a decrease in the accuracy of inspection of inspection object 2 using electrical connection device 1 can be suppressed.

[0049] Furthermore, the claws 300 of the wiring sheet 30 are formed on the surface of the cover film 301 in an elastically deformable manner. Specifically, the claws 300 receive external forces generated by the contact between the wiring substrate 20 and the printed circuit board 40 and the wiring sheet 30, thereby approaching the surface of the wiring sheet 30. When the external forces are removed, the claws 300 return to their original state. In this manner, the claws 300 are elastically deformable in the thickness direction of the wiring sheet 30.

[0050] When wiring sheet 30 is sandwiched between wiring substrate 20 and printed circuit board 40, claw portion 300 elastically deforms. This ensures the connection between first connecting portion 31 of wiring sheet 30 and second electrode 22 of wiring substrate 20. For example, even if the flatness of first surface 311 of wiring sheet 30 differs from the flatness of the top surface of wiring substrate 20, the electrical connection between the internal circuit of wiring sheet 30 and the internal wiring 200 of wiring substrate 20 remains stable. Furthermore, the connection between second connecting portion 32 of wiring sheet 30 and first end portion 41 of wiring pattern 400 on printed circuit board 40 is ensured. For example, even if the flatness of second surface 312 of wiring sheet 30 differs from the flatness of the bottom surface of printed circuit board 40, the electrical connection between the internal circuit of wiring sheet 30 and wiring pattern 400 on printed circuit board 40 remains stable.

[0051] The claw portion 300 having conductivity and being elastically deformable in the thickness direction of the wiring sheet 30 can be formed, for example, as follows. First, a portion of the insulating film on the surface of the wiring sheet 30 is lifted to form a protruding portion that protrudes obliquely from the surface. Thereafter, the protruding portion and its surroundings are plated with a conductive material. Thus, the protruding portion becomes the conductive claw portion 300. Figure 4 As shown, the periphery of claw 300 forms support portion 310 that supports claw 300. Claw 300 has a cantilever beam structure having a fixed end connected to support portion 310 and a free end separated from wiring sheet 30. Support portion 310, which is conductive, is electrically connected to the internal circuit of wiring sheet 30. Figure 4 The illustrated internal circuit is a short-circuit wiring 331 that electrically connects the first connection portion 31 and the second connection portion 32. For example, the claw portion 300 and the support portion 310 can be formed by copper plating.

[0052] like Figure 5As shown in FIG. 1 , the plurality of claws 300 may be arranged in a matrix when viewed from the normal direction (Z direction) of the thickness direction. The protruding direction of the claws 300 can be set arbitrarily. For example, Figure 5 In the arrangement of the claws 300 shown, the claws 300 arranged along the X direction protrude in the same direction. On the other hand, in the claws 300 arranged along the Y direction, the protruding directions of the adjacent claws 300 are opposite to each other. For example, Figure 4 is a cross-sectional view along the X direction. Or, Figure 6 As shown, among the plurality of claws 300 arranged in the same direction, the protruding directions of adjacent claws 300 may be staggered.

[0053] For example, Figure 6 As shown, by staggering the protruding directions of the claws 300, the directions of the forces applied to the wiring sheet 30 from the wiring substrate 20 and the printed circuit board 40 are dispersed. This can prevent the wiring substrate 20 or the printed circuit board 40 from being misaligned relative to the wiring sheet 30 in the XY plane.

[0054] In the above description, the case where one claw portion 300 is connected to one support portion 310 is exemplified, but the number of claw portions 300 connected to one support portion 310 may be multiple. Figure 7 As shown in FIG. 3 , two claws 300 with different protruding directions may be connected to one support portion 310. Alternatively, as shown in FIG. Figure 8 As shown, two claws 300 with the same protruding direction may be connected to one support portion 310 .

[0055] according to Figure 7 In the structure shown, since the claw portion 300 contacts the wiring substrate 20 and the printed circuit board 40 from different directions, the electrical connection between the wiring sheet 30 and the wiring substrate 20 and the printed circuit board 40 can be made stronger. Figure 8 The structure shown can shorten the length of the claw 300. If the claw 300 is shorter, the high-frequency characteristics of the inspection object 2 can be measured well. However, the length of the claw 300 is set so that the pressing force of the claw 300 is not reduced by shortening the claw 300.

[0056] As described above, in the electrical connection device 1 of the first embodiment, the conductive claws 300 that protrude obliquely are provided on the first connection portion 31 and the second connection portion 32 of the wiring sheet 30. Figure 1 The illustrated electrical connection device 1 can stabilize the electrical connection between the internal wiring 200 of the wiring substrate 20 and the wiring pattern 400 of the printed circuit board 40 even if there is a difference in flatness between the wiring substrate 20 and the printed circuit board 40 .

[0057] The wiring sheet 30 may be selected from a plurality of wiring sheet candidates. Each wiring sheet candidate includes a first connecting portion 31 disposed on the first sheet surface 311, a second connecting portion 32 disposed on the second sheet surface 312, and an internal circuit. Each wiring sheet candidate may include an internal circuit having a structure different from that of other wiring sheet candidates. One wiring sheet 30 selected from a plurality of wiring sheet candidates is stacked on the wiring substrate 20 in such a manner that the first connecting portion 31 is connected to the second electrode 22 of the wiring substrate 20. The electrical connection device 1 may also be configured so that the wiring sheet 30 can be installed and removed between the wiring substrate 20 and the printed circuit board 40. For example, the wiring sheet 30 can be installed and removed between the wiring substrate 20 and the printed circuit board 40 to replace the wiring sheet 30 stacked on the wiring substrate 20 with another wiring sheet candidate.

[0058] Hereinafter, an example of the configuration of the wiring sheet candidates included in the wiring sheet group will be described. Hereinafter, the wiring sheet candidates will be referred to as wiring sheets 30 without being individually limited.

[0059] Alternatively, the internal circuit of any one of the wiring sheets 30 included in the wiring sheet group may include a circuit (hereinafter also referred to as a "relay circuit") that electrically connects the first connection portion 31 and the second connection portion 32. For example, Figure 3 When a relay circuit is formed in wiring sheet 30 having the structure shown, wiring is formed from first surface 311 to second surface 312 of wiring sheet 30 , penetrating cover film 301 , conductive film 302 , and insulating film 303 .

[0060] When the internal circuit of the wiring sheet 30 includes a relay circuit, Figure 9 As shown, the internal circuit of the wiring sheet 30 includes a circuit for short-circuiting the first connecting portion 31 and the second connecting portion 32 . Figure 9 In the internal circuit of the wiring sheet 30 shown, the first connecting portion 31 and the second connecting portion 32 are electrically short-circuited by the short-circuit wiring 331 .

[0061] By installing the electrical connection device 1 Figure 9 The wiring sheet 30 shown is used to short-circuit the probe 10 and the wiring pattern 400 of the printed circuit board 40 by means of the internal circuit of the wiring sheet 30. As a result, the inspection object 2 and the inspection device are electrically connected. As a result, an electrical signal is transmitted between the inspection device such as an IC tester and the inspection object 2, and the characteristics of the inspection object 2 are measured. For example, the first connecting portion 31 and the second connecting portion 32 are connected one-to-one using the internal circuit of the wiring sheet 30. Alternatively, one first connecting portion 31 can be connected to multiple second connecting portions 32 using the internal circuit, or multiple first connecting portions 31 can be connected to one second connecting portion 32 using the internal circuit.

[0062] When the internal circuit of the wiring sheet 30 includes a relay circuit, Figure 10 As shown, the internal circuit includes a matching circuit 332 whose first terminal is connected to the first connecting portion 31 and whose second terminal is connected to the second connecting portion 32. The matching circuit 332 may be a circuit that achieves impedance matching between the first connecting portion 31 and the second connecting portion 32. For example, the matching circuit 332 may include a π-type filter.

[0063] The internal circuit of the wiring sheet 30 may also include a circuit that electrically connects any one first connecting portion 31 to another first connecting portion 31. In other words, the internal circuit of the wiring sheet 30 may also include a circuit (hereinafter also referred to as a "loopback circuit") that electrically connects the output terminal and input terminal of the inspection object 2. The loopback circuit electrically connects the two signal terminals of the inspection object 2.

[0064] It can also be, for example, Figure 11 As shown, the internal circuit of the wiring sheet 30 includes a circuit that short-circuits any one first connecting portion 31 and the other first connecting portion 31 . Figure 11 The internal circuit of the wiring sheet 30 shown in the figure uses the loopback wiring 333 to electrically short-circuit one first connection portion 31 and another first connection portion 31. Figure 11 The wiring sheet 30 shown is connected to the other probe 10, thereby short-circuiting one probe 10 and the other probe 10 via the internal circuit of the wiring sheet 30. As a result, one signal terminal and the other signal terminal of the inspection target 2 are electrically connected.

[0065] Figure 12 The diagram shows a structure in which the first signal terminal 2A of the inspection object 2, contacted by one probe 10, and the second signal terminal 2B of the inspection object 2, contacted by another probe 10, are electrically connected via the return wiring 333 of the wiring sheet 30. For example, if the inspection object 2 is a receiving circuit, the first signal terminal 2A is the output terminal of the inspection object 2, and the second signal terminal 2B is the input terminal of the inspection object 2, a transmission test can be performed by returning the output from the inspection object 2 to the input. In other words, even without a target device for transmission, it is possible to test whether the output and input sections of the inspection object 2 are functioning properly. For example, as part of a jitter tolerance test for the receiving circuit, the output signal output from the first signal terminal 2A (output terminal) can be input as an input signal to the second signal terminal 2B (input terminal) to check whether a specified error rate is maintained.

[0066] When the internal circuit of the wiring sheet 30 includes a loopback circuit, Figure 13As shown, the internal circuit includes a circuit including a capacitor 34 connected in series between one first connecting portion 31 and another first connecting portion 31. One terminal of the capacitor 34 is connected to one first connecting portion 31, and the other terminal of the capacitor 34 is connected to the other first connecting portion 31. Capacitor 34 can be formed using a semiconductor manufacturing process (hereinafter also referred to as a "process capacitor"), etc.

[0067] Furthermore, the internal circuit of the wiring sheet 30 may include a relay circuit that switches so as to electrically connect one first connection portion 31 to either one second connection portion 32 or another first connection portion 31. Figure 14 The internal circuit shown includes a relay circuit 334 that constitutes either a relay circuit connecting the first connection portion 31 and the second connection portion 32 or a loopback circuit connecting the first connection portions 31 to each other.

[0068] exist Figure 14 When the relay circuit 334 shown in the figure forms a relay circuit, the first contact terminal 334a is connected to the second contact terminal 334b, and the third contact terminal 334c is connected to the fourth contact terminal 334d. This electrically connects the first connecting portion 31 to the second connecting portion 32. When the relay circuit 334 forms a loopback circuit, the first contact terminal 334a of the relay circuit 334 is connected to the common contact terminal 334e, and the third contact terminal 334c is connected to the common contact terminal 334e. This electrically connects one first connecting portion 31 to the other first connecting portion 31.

[0069] Reference Figures 9 to 14 The example of the internal circuit of the wiring sheet 30 has been described, but the structure of the internal circuit is of course not limited to the above. For example, the internal circuit may include an inductor instead of Figure 13 The capacitor 34 shown may also include both a capacitor and an inductor in the internal circuit. In other words, the internal circuit of the wiring sheet 30 may also include a passive circuit, and the passive circuit may include any element. In addition, the internal circuit may include a switching circuit using a diode or the like instead of Figure 14 Relay circuit 334 is shown.

[0070] The elements included in the internal circuit of the wiring sheet 30 may also be formed using, for example, a MEMS (Micro Electro Mechanical Systems) process. By using the MEMS process, miniaturized elements can be formed integrally with the wiring sheet 30 .

[0071] As mentioned above, according to Figure 1The electrical connection device 1 shown in the figure can realize, for example, Figures 9 to 14 The various circuit structures shown are shown. Therefore, the electrical connection device 1 can be used to perform a variety of measurements on the inspection object 2. For example, a DC test can be performed on the inspection object 2 by mounting a wiring sheet 30 containing an internal circuit that short-circuits the first connector 31 and the second connector 32 on the electrical connection device 1. Furthermore, a high-frequency test can be performed on the inspection object 2 by mounting a wiring sheet 30 containing an internal circuit that short-circuits the first connector 31 and the second connector 32 on the electrical connection device 1.

[0072] Furthermore, according to the electrical connection device 1, by Figure 14 By arranging the relay circuit 334 on the wiring sheet 30 as shown, the wiring lengths of the relay circuit and the loopback circuit can be shortened compared to when the relay elements are arranged on the printed circuit board 40. Thus, the electrical connection device 1 can shorten the transmission path of the electrical signal and suppress electrical signal loss and noise.

[0073] Furthermore, according to the electrical connection device 1, by Figure 10 As shown, by arranging matching circuit 332 on wiring sheet 30, it is possible to shorten the wiring connected to matching circuit 332. For example, matching circuit 332 can be arranged immediately adjacent to the wiring where impedance matching is desired, thereby enabling efficient impedance matching.

[0074] Furthermore, during the measurement of inspection object 2, stage 3 becomes a heat source. Consequently, the ambient temperature of the lower surface of wiring substrate 20, facing stage 3, is higher than that of other areas. Therefore, by placing wiring sheet 30 on the upper surface of wiring substrate 20, the temperature rise of the electronic components constituting the internal circuits of wiring sheet 30 can be suppressed compared to the case where the electronic components are placed on the lower surface of wiring substrate 20. As a result, the electronic components function at ambient temperatures that do not exceed the permissible temperature, enabling accurate measurement of inspection object 2.

[0075] By detachably placing the wiring sheet 30 described above, which includes an internal circuit capable of forming any desired circuit, between the wiring substrate 20 and the printed circuit board 40, the electrical connection device 1 can be configured as any desired measurement system. Consequently, the electrical connection device 1 can measure the characteristics of the inspection object 2 with high accuracy.

[0076] (Second embodiment)

[0077] like Figure 15As shown, an electrical connection device 1A according to the second embodiment includes a first wiring sheet 30A disposed between a wiring substrate 20 and a printed circuit board 40, and a second wiring sheet 30B disposed between a probe head 60 and the wiring substrate 20. Hereinafter, the first wiring sheet 30A and the second wiring sheet 30B will be referred to as wiring sheets 30 without specifying them separately. Figure 15 The electrical connection device 1A shown in the figure is different from the electrical connection device 1 of the first embodiment in that a wiring sheet 30 is provided between the probe head 60 and the wiring substrate 20. Figure 1 The same as the first embodiment shown.

[0078] The first connecting portion 31 disposed on the first sheet surface 311 of the second wiring sheet 30B contacts the base end portion of the probe 10 exposed from the probe head 60 without the aid of the claw portion 300. Meanwhile, the second connecting portion 32 disposed on the second sheet surface 312 of the second wiring sheet 30B is connected to the first electrode 21 of the wiring substrate 20 via the claw portion 300. In other words, in the second wiring sheet 30B, the claw portion 300 is disposed only on the second connecting portion 32; no claw portion 300 is disposed on the first connecting portion 31. Other than this, the structure of the second wiring sheet 30B is the same as that of the wiring sheet 30 described in the first embodiment.

[0079] In addition, the first wiring sheet 30A and Figure 1 Similarly, the wiring sheet 30 of the illustrated electrical connection device 1 includes a first connecting portion 31 and a second connecting portion 32 each including a claw portion 300. The first connecting portion 31 of the first wiring sheet 30A is connected to the second electrode 22 of the wiring substrate 20 via the claw portion 300, and the second connecting portion 32 is connected to the wiring pattern 400 of the printed circuit board 40 via the claw portion 300.

[0080] Electrical connection device 1A has a structure in which a flexible wiring sheet 30 is disposed between the base end of probe 10 and wiring substrate 20. With electrical connection device 1A, the preload function provided by wiring sheet 30 generates a thrust between wiring sheet 30 and probe 10, thereby stabilizing contact between probe 10 and object under inspection 2. As a result, the accuracy of measurement of object under inspection 2 can be improved.

[0081] Furthermore, in the electrical connection device 1A, both the first wiring sheet 30A and the second wiring sheet 30B can carry electronic components. This increases the number of electronic components that can be mounted on the electrical connection device 1A. Furthermore, with the electrical connection device 1A, by mounting electronic components on the second wiring sheet 30B, the electronic components can be positioned near the inspection object 2. This shortens the wiring length between the inspection object 2 and the electronic components. Consequently, the accuracy of measurement of the inspection object 2 can be improved.

[0082] Furthermore, according to the electrical connection device 1A, by disposing the flexible second wiring sheet 30B between the probe head 60 and the wiring substrate 20, the second wiring sheet 30B can absorb warping and unevenness of the surfaces of the probe head 60 and the wiring substrate 20. This can suppress shaking and poor contact of the electrical connection device 1A caused by the gap between the probe head 60 and the wiring substrate 20.

[0083] The electrical connection device 1A of the second embodiment is substantially the same as that of the first embodiment except for this, and duplicate descriptions are omitted. Figures 9 to 14 The wiring sheet 30 including the internal circuit that can constitute an arbitrary circuit as described above is detachably arranged between the probe head 60 and the wiring substrate 20 .

[0084] (Third embodiment)

[0085] like Figure 16 As shown, the electrical connection device 1B of the third embodiment does not have a wiring sheet 30 disposed between the wiring substrate 20 and the printed circuit board 40, but has a wiring sheet 30 disposed between the probe head 60 and the wiring substrate 20. Figure 15 The same as the second embodiment shown.

[0086] exist Figure 16 In the electrical connection device 1B shown, the first connection portion 31 disposed on the first surface 311 of the wiring sheet 30 contacts the base end portion of the probe 10 without the aid of the claw portion 300. On the other hand, the second connection portion 32 disposed on the second surface 312 of the wiring sheet 30 is connected to the first electrode 21 of the wiring substrate 20 via the claw portion 300. In other words, Figure 16 In the illustrated wiring sheet 30 , the claw portion 300 is disposed only on the second connecting portion 32 , and no claw portion 300 is disposed on the first connecting portion 31 .

[0087] According to electrical connection device 1B, in which flexible wiring sheet 30 is disposed between the base end of probe 10 and wiring substrate 20, the preload function provided by wiring sheet 30 stabilizes contact between probe 10 and inspection object 2. As a result, the measurement accuracy of inspection object 2 can be improved.

[0088] Furthermore, according to the electrical connection device 1B, by placing the flexible wiring sheet 30 between the probe head 60 and the wiring substrate 20, the wiring sheet 30 can absorb warping and unevenness of the surfaces of the probe head 60 and the wiring substrate 20. This can suppress shaking of the electrical connection device 1B and poor contact caused by the gap between the probe head 60 and the wiring substrate 20.

[0089] The electrical connection device 1B of the third embodiment is substantially the same as the first and second embodiments except for this, and duplicate descriptions are omitted. Figures 9 to 14 The wiring sheet 30 including the internal circuit that can constitute an arbitrary circuit as described above is detachably arranged between the probe head 60 and the wiring substrate 20 .

[0090] (Other Embodiments)

[0091] As described above, the present invention is described through the embodiments, but it should not be understood that the discussion and drawings constituting part of this disclosure limit the present invention. For those skilled in the art, various alternative embodiments, examples, and application techniques will be apparent based on this disclosure.

[0092] For example, wiring sheet 30 may include an internal circuit with a mix of multiple circuit configurations. For example, wiring sheet 30 may include an internal circuit with a mix of short-circuit wiring 331 and matching circuit 332. Alternatively, wiring sheet 30 may include an internal circuit with a mix of relay circuits and loopback circuits. For example, an internal circuit may include short-circuit wiring 331, matching circuit 332, and loopback wiring 333, or may also include relay circuit 334. Furthermore, a loopback circuit may also include matching circuit 332. In this way, any desired circuit can be configured within the internal circuit of wiring sheet 30.

[0093] As described above, by mounting the wiring sheet 30 including internal circuits having mixed arbitrary circuit structures on the electrical connection device 1 , it is possible to perform multiple types of measurements on the inspection object 2 using one wiring sheet 30 .

[0094] In addition, the above description shows the case where the inspection terminal that contacts the signal terminal of the inspection object 2 is the probe 10. In the case where the inspection terminal is the probe 10, for example, the electrical characteristics of the inspection object 2 in a state where it is not separated from the wafer or in a chip state can be measured. On the other hand, in correspondence with the measurement of electrical characteristics in a state where the inspection object 2 is mounted in a package or the like, a wiring sheet 30 can be mounted on the electrical connection device including the test socket. For example, it is also possible to replace Figure 1 The probe 10 of the illustrated electrical connection device 1 is provided on the wiring substrate 20 with a test socket provided with test terminals connectable to external terminals of a package on which the test object 2 is mounted.

[0095] As described above, the present invention naturally includes various embodiments not described above, etc. Therefore, the scope of protection of the present invention is determined only by the invention-specific matters according to the appropriate claims derived from the above description.

Claims

1. An electrical connection device used for inspecting an object, wherein: The electrical connection device has: an inspection terminal having a distal end portion arranged to be contactable with the inspection object and a proximal end portion connected to the distal end portion; a wiring substrate including a first electrode electrically connected to the inspection terminal, an internal wiring, and a second electrode electrically connected to the first electrode via the internal wiring; as well as A wiring sheet having flexibility and including a first connecting portion arranged on a first sheet surface, a second connecting portion arranged on a second sheet surface facing in a direction opposite to the first sheet surface, and an internal circuit electrically connected to at least one of the first connecting portion and the second connecting portion. A claw portion is provided on at least one of the first connecting portion and the second connecting portion. The claw portion projects obliquely with respect to a surface perpendicular to the thickness direction of the wiring sheet and has conductivity. The internal wiring of the wiring substrate and the internal circuit of the wiring sheet are electrically connected via the claw portion.

2. The electrical connection device according to claim 1, wherein: The electrical connection device further comprises a printed circuit board including a wiring pattern. The wiring sheet is arranged between the wiring substrate and the printed circuit board. The claw portion is arranged on the first connecting portion and the second connecting portion, The first connecting portion is connected to the second electrode via the claw portion. The second connecting portion is connected to the wiring pattern via the claw portion.

3. The electrical connection device according to claim 1 or 2, wherein: The electrical connection device further comprises a probe head for holding the inspection terminal. The wiring sheet is arranged between the probe head and the wiring substrate. The claw portion is only arranged on the second connecting portion, The second connecting portion is connected to the first electrode via the claw portion. The first connection portion is connected to the base end portion of the inspection terminal exposed from the probe head without the intermediary of the claw portion.

4. The electrical connection device according to claim 1, wherein: The claw portion is elastically deformable in the thickness direction.

5. The electrical connection device according to claim 4, wherein: At least one of the first connecting portion and the second connecting portion includes a support portion fixed to the wiring sheet. The claw portion has a cantilever beam structure having a fixed end connected to the support portion and a free end separated from the wiring sheet.

6. The electrical connection device according to claim 5, wherein: Two claws having the same protruding direction are connected to one of the support portions.

7. The electrical connection device according to claim 5, wherein: The two claws having different protruding directions are connected to one of the support portions.

8. The electrical connection device according to claim 1, wherein: The plurality of claws are arranged in a matrix when viewed from above in a direction normal to the thickness direction.

9. The electrical connection device according to claim 8, wherein: The claws protruding in opposite directions are adjacent to each other.

10. The electrical connection device according to claim 1, wherein The wiring sheet has a structure in which a laminated body of a conductive film and an insulating film is sandwiched between cover films of an insulating material.

11. The electrical connection device according to claim 1, wherein: The wiring substrate is a space transformer that increases the interval between the base end portions of the inspection terminals when viewed in a normal direction to a main surface of the wiring substrate.

12. The electrical connection device according to claim 1, wherein The inspection terminal is a probe whose base end portion is connected to the first electrode of the wiring substrate and whose tip end portion is in contact with a signal terminal of the inspection object.

13. The electrical connection device according to claim 1, wherein The inspection terminal is disposed in a test socket and is connected to an external terminal of a package on which the inspection target object is mounted.

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