GIS equipment intelligent induction withstand voltage test system and method based on dynamic impedance matching, storage medium and electronic equipment

Abstract

The invention provides a GIS equipment intelligent induction withstand voltage test system and method based on dynamic impedance matching, a storage medium and electronic equipment, and relates to the field of power equipment detection, the system comprises a main control unit, a reactor adjusting module, a high frequency voltage generator, a capacitance sensor and a data acquisition unit; the main control unit is connected with the reactor adjusting module and controls the reactor adjusting module to adjust the inductance of the GIS equipment; the main control unit is also connected with the high-frequency voltage generator and is used for controlling the high-frequency voltage generator to output voltage to GIS (Gas Insulated Switchgear) equipment; the capacitance sensor is connected with the main control unit and transmits acquired equivalent capacitance information to the main control unit; and the data acquisition unit is connected with the main control unit and transmits the acquired current information, voltage information and environment parameter information to the main control unit. According to the technical scheme, the testing efficiency can be improved, manual intervention is reduced, and the labor cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of power equipment detection, and in particular to a GIS equipment intelligent induction withstand voltage test system, method, storage medium and electronic equipment based on dynamic impedance matching. Background Art

[0002] During operation, GIS equipment must withstand both normal operating voltages and various overvoltages (such as lightning overvoltage and switching overvoltage). If the equipment's insulation performance is insufficient, breakdown and flashover may occur under these voltages, impacting the safe and stable operation of the power system. Hipot testing can effectively verify the insulation strength of GIS equipment at different voltage levels and promptly identify potential insulation defects.

[0003] The existing GIS equipment voltage test has the following problems:

[0004] 1. Traditional GIS equipment pressure testing requires the installation of a dedicated test casing, which is complex to operate and poses the risk of foreign matter intrusion.

[0005] 2. The fixed reactor compensation method cannot adapt to the capacitance differences of different GIS equipment, which can easily lead to compensation failure.

[0006] 3. The risk of resonant overvoltage is high, and reliance on manual frequency modulation is inefficient. Summary of the Invention

[0007] The embodiments of the present application provide a GIS equipment intelligent induction withstand voltage test system, method, storage medium and electronic device based on dynamic impedance matching to solve the problems existing in the prior art.

[0008] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by practice of the present application.

[0009] According to a first aspect of an embodiment of the present application, there is provided a GIS equipment intelligent inductive withstand voltage test system based on dynamic impedance matching, comprising: a main control unit, a reactor adjustment module, a high-frequency voltage generator, a capacitance sensor, and a data acquisition unit;

[0010] The main control unit is connected to the reactor adjustment module to control the reactor adjustment module to adjust the inductance of the GIS equipment;

[0011] The main control unit also controls the high-frequency voltage generator to output voltage to the GIS equipment.

[0012] The capacitance sensor is used to collect the equivalent capacitance of the GIS device, and the capacitance sensor is connected to the main control unit to transmit the collected equivalent capacitance information to the main control unit;

[0013] The data acquisition unit is used to collect current, voltage and environmental parameters of the GIS equipment, and the data acquisition unit is connected to the main control unit to transmit the collected current information, voltage information and environmental parameter information to the main control unit.

[0014] In some embodiments of the present application, based on the aforementioned solution, the high-frequency voltage generator is coupled to the GIS device through the secondary side of the voltage transformer.

[0015] In some embodiments of the present application, based on the aforementioned solution, the voltage frequency range output by the high-frequency voltage generator is 20 Hz-300 Hz, and the peak value is 2 kV.

[0016] In some embodiments of the present application, based on the aforementioned solution, the data acquisition unit includes: a voltage sensor, a current sensor, a temperature sensor, and a humidity sensor;

[0017] The voltage sensor is used to collect the voltage of the GIS equipment and is connected to the main control unit to transmit the collected voltage information to the main control unit;

[0018] The current sensor is used to collect the current of the GIS equipment and is connected to the main control unit to transmit the collected current information to the main control unit;

[0019] The temperature sensor is used to collect the temperature of the GIS equipment and is connected to the main control unit to transmit the collected temperature information to the main control unit;

[0020] The humidity sensor is used to collect the humidity of the GIS equipment and is connected to the main control unit to transmit the collected humidity information to the main control unit.

[0021] According to a second aspect of an embodiment of the present application, a method for intelligent inductive withstand voltage testing of GIS equipment based on dynamic impedance matching is provided, which is applied to the system described in the first aspect, including:

[0022] The main control unit controls the high-frequency voltage generator to generate initial voltage to the GIS equipment;

[0023] The data acquisition unit collects the voltage, current and environmental parameters of the GIS equipment and feeds them back to the main control unit, and the capacitance sensor collects the equivalent capacitance of the GIS equipment and feeds it back to the main control unit;

[0024] The main control unit calculates the compensation inductance required by the GIS equipment based on voltage, current, environmental parameters and equivalent capacitance, and drives the reactor adjustment module to adjust the inductance value of the GIS equipment.

[0025] In some embodiments of the present application, based on the above solution, the following is further included:

[0026] The waveform distortion rate of the voltage of the GIS equipment is collected in real time. When the waveform distortion rate exceeds the set threshold, the voltage frequency is modified.

[0027] According to a third aspect of an embodiment of the present application, a computer-readable storage medium is provided, wherein the storage medium stores computer instructions. When the computer instructions are executed on a computer, the computer executes the method according to the first aspect.

[0028] According to a fourth aspect of the embodiments of the present application, there is provided an electronic device, including: a memory and a processor;

[0029] The memory is used to store computer instructions;

[0030] The processor is configured to call the computer instructions stored in the memory so that the electronic device executes the method according to the first aspect.

[0031] The technical solution of the present application can improve test efficiency, reduce manual intervention, and lower labor costs, while also improving the resonance suppression rate and adapting to GIS equipment testing under complex working conditions.

[0032] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings are incorporated into and constitute a part of the specification, illustrating embodiments consistent with the present application and, together with the specification, explaining the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can derive other drawings based on these drawings without inventive effort. In the drawings:

[0034] Figure 1 The following is a structural block diagram of a GIS equipment intelligent induction withstand voltage test system based on dynamic impedance matching according to one embodiment of the present application;

[0035] Figure 2 A block diagram of an electronic device according to an embodiment of the present application is shown;

[0036] Figure 3 A schematic diagram of the structure of a computer system suitable for implementing an electronic device according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0037] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art.

[0038] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner.In the following description, many specific details are provided so as to provide a full understanding of the embodiments of the present application. However, it will be appreciated by those skilled in the art that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps etc. can be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0039] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically separate entities. That is, these functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0040] The flowcharts shown in the accompanying drawings are for illustrative purposes only and do not necessarily include all contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may be decomposed, while others may be combined or partially combined. Therefore, the actual execution order may vary depending on the actual situation.

[0041] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0042] The following will describe some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0043] See also Figure 1 , shows a structural block diagram of a GIS equipment intelligent induction withstand voltage test system based on dynamic impedance matching according to an embodiment of the present application.

[0044] like Figure 1As shown in the figure, a GIS equipment intelligent induction withstand voltage test system based on dynamic impedance matching is demonstrated, including: a main control unit, a reactor adjustment module, a high-frequency voltage generator, a capacitance sensor and a data acquisition unit;

[0045] The main control unit is connected to the reactor adjustment module to control the reactor adjustment module to adjust the inductance of the GIS equipment;

[0046] The main control unit also controls the high-frequency voltage generator to output voltage to the GIS equipment.

[0047] The capacitance sensor is used to collect the equivalent capacitance of the GIS device, and the capacitance sensor is connected to the main control unit to transmit the collected equivalent capacitance information to the main control unit;

[0048] The data acquisition unit is used to collect current, voltage and environmental parameters of the GIS equipment, and the data acquisition unit is connected to the main control unit to transmit the collected current information, voltage information and environmental parameter information to the main control unit.

[0049] It should be noted that, in this embodiment, the main control unit adjusts the compensation parameters based on the current, voltage and environmental parameters of the GIS equipment obtained by the data acquisition unit, and the internal equivalent capacitance of the GIS equipment obtained by the capacitive sensor in real time, combined with the dynamic algorithm, to achieve wide-band (20Hz-300Hz) adaptive compensation of the GIS equipment voltage.

[0050] It should be noted that, in this embodiment, the main control unit has a built-in ARM Cortex-A53 processor, which can run a real-time operating system and execute a dynamic compensation algorithm.

[0051] It can be understood that, in this embodiment, the main control unit is connected to the reactor adjustment module and the capacitance sensor via the CAN bus.

[0052] It can be understood that, in this embodiment, the main control unit and the high-frequency voltage generator are communicatively connected to enable the main control unit to send control instructions to the high-frequency voltage generator through communication.

[0053] It can be understood that in this embodiment, the capacitance sensor and the data acquisition unit are connected via a wireless communication module or wired communication to ensure that the capacitance sensor and the data acquisition unit can transmit the collected voltage, current, environmental parameters and equivalent capacitance data to the main control unit.

[0054] In some feasible embodiments, based on the above solution, the high-frequency voltage generator is coupled to the GIS equipment through the secondary side of the voltage transformer.

[0055] In some feasible embodiments, based on the above solution, the high-frequency voltage generator outputs a voltage with a frequency range of 20 Hz-300 Hz and a peak value of 2 kV.

[0056] In some feasible embodiments, based on the above solution, the data acquisition unit includes: a voltage sensor, a current sensor, a temperature sensor and a humidity sensor;

[0057] The voltage sensor is used to collect the voltage of the GIS equipment and is connected to the main control unit to transmit the collected voltage information to the main control unit;

[0058] The current sensor is used to collect the current of the GIS equipment and is connected to the main control unit to transmit the collected current information to the main control unit;

[0059] The temperature sensor is used to collect the temperature of the GIS equipment and is connected to the main control unit to transmit the collected temperature information to the main control unit;

[0060] The humidity sensor is used to collect the humidity of the GIS equipment and is connected to the main control unit to transmit the collected humidity information to the main control unit.

[0061] It should be noted that, in this embodiment, the voltage sensor, current sensor, temperature sensor and humidity sensor are connected to the main control unit using wireless communication modules or wired communication to ensure that the data collected by each sensor can be transmitted to the main control unit.

[0062] The following is a workflow of this system:

[0063] Step 1: The main control unit controls the high-frequency voltage generator to inject the initial frequency voltage (e.g., 50 Hz) into the GIS equipment through the secondary side of the voltage transformer;

[0064] Step 2: Real-time monitoring of the voltage waveform distortion rate of the primary side of the voltage transformer. The main control unit calculates the equivalent capacitance deviation based on the collected voltage, current, environmental parameters, and real-time equivalent capacitance.

[0065] Step 3: The main control unit dynamically adjusts the inductance value of the GIS equipment through the reactor adjustment module to maintain the stability of the GIS equipment output voltage.

[0066] Based on the same inventive concept, the present embodiment further provides a method for intelligent inductive withstand voltage testing of GIS equipment based on dynamic impedance matching. The method is implemented by the system described in the above embodiment and includes:

[0067] The main control unit controls the high-frequency voltage generator to generate initial voltage to the GIS equipment;

[0068] The data acquisition unit collects the voltage, current and environmental parameters of the GIS equipment and feeds them back to the main control unit, and the capacitance sensor collects the equivalent capacitance of the GIS equipment and feeds it back to the main control unit;

[0069] The main control unit calculates the compensation inductance required by the GIS equipment based on voltage, current, environmental parameters and equivalent capacitance, and drives the reactor adjustment module to adjust the inductance value of the GIS equipment.

[0070] It should be noted that during the test, in order to achieve closed-loop verification, the primary side voltage waveform of the voltage transformer is collected through a high-speed ADC. If the distortion rate is greater than 5%, the compensation inductance is recalculated.

[0071] In some feasible embodiments, based on the above solution, the method further includes:

[0072] The waveform distortion rate of the voltage of the GIS equipment is collected in real time. When the waveform distortion rate exceeds the set threshold, the voltage frequency is modified.

[0073] Exemplarily, the threshold value of the waveform distortion rate is set to 8%. When the waveform distortion rate is greater than 8%, the protection mechanism is triggered to modify the voltage frequency.

[0074] It can be understood that, in this embodiment, the voltage frequency is modified by switching the current frequency to an adjacent frequency, for example, switching from the current 200 Hz to 210 Hz.

[0075] In summary, the technical solution of this application solves the problems of complex disassembly and assembly of special bushings and high risk of foreign objects in traditional testing; solves the risks of compensation failure and resonant overvoltage of fixed inductors, improves test efficiency by more than 90%, and the resonance suppression rate is ≥95%; and improves the adaptability of the test system to different GIS equipment.

[0076] like Figure 2 As shown, an embodiment of the present application also provides an electronic device 200, including a memory 210, a processor 220, and a computer program 211 stored in the memory 210 and executable on the processor. When the processor 220 executes the computer program 211, the steps of the above-mentioned intelligent induction withstand voltage test method for GIS equipment based on dynamic impedance matching are implemented.

[0077] Since the electronic device introduced in this embodiment is a device used to implement an intelligent inductive withstand voltage testing device for GIS equipment based on dynamic impedance matching in an embodiment of the present application, based on the method introduced in the embodiment of the present application, technical personnel in this field can understand the specific implementation of the electronic device of this embodiment and its various variations. Therefore, how the electronic device implements the method in the embodiment of the present application will not be introduced in detail here. As long as the equipment used by technical personnel in this field to implement the method in the embodiment of the present application falls within the scope of protection of this application.

[0078] During the specific implementation process, when the computer program 211 is executed by the processor, any implementation method in the embodiments corresponding to the first aspect can be implemented.

[0079] Figure 3 A schematic diagram of the structure of a computer system suitable for implementing an electronic device according to an embodiment of the present application is shown.

[0080] It should be noted that Figure 3 The computer system 300 of the electronic device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0081] like Figure 3 As shown, the computer system 300 includes a central processing unit (CPU) 301, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 302 or the program loaded from the storage part 308 to the random access memory (RAM) 303, such as executing the method described in the above embodiment. Various programs and data required for system operation are also stored in the RAM 303. The CPU 301, ROM 302 and RAM 303 are connected to each other via a bus 304. An input / output (I / O) interface 305 is also connected to the bus 304.

[0082] The following components are connected to the I / O interface 305: an input section 306 including a keyboard, a mouse, and the like; an output section 307 including devices such as a cathode ray tube (CRT), a liquid crystal display (LCD), and a speaker; a storage section 308 including a hard disk and the like; and a communication section 309 including a network interface card such as a LAN (Local Area Network) card or a modem. The communication section 309 performs communication processing via a network such as the Internet. A drive 310 is also connected to the I / O interface 305 as needed. Removable media 311, such as a magnetic disk, an optical disk, a magneto-optical disk, or a semiconductor memory, is installed in the drive 310 as needed, so that computer programs read therefrom can be installed into the storage section 308 as needed.

[0083] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via the communication section 309, and / or installed from a removable medium 311. When the computer program is executed by the central processing unit (CPU) 301, the various functions defined in the system of the present application are executed.

[0084] It should be noted that the computer-readable medium shown in the embodiments of the present application can be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media can include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device. In the present application, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, which carries a computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium that can transmit, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer-readable medium may be transmitted using any suitable medium, including but not limited to wireless, wired, or any suitable combination thereof.

[0085] The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. Among them, each box in the flowchart or block diagram can represent a module, program segment, or part of the code, and the above-mentioned module, program segment, or part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of boxes in the block diagram or flowchart, can be implemented with a dedicated hardware-based system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0086] The units involved in the embodiments described in this application may be implemented by software or hardware, and the units described may also be set in a processor. In some cases, the names of these units do not constitute limitations on the units themselves.

[0087] As another aspect, the present application further provides a computer program product or computer program, which includes computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the intelligent inductive withstand voltage testing method for GIS equipment based on dynamic impedance matching as described in the above embodiment.

[0088] As another aspect, the present application also provides a computer-readable medium, which may be included in the electronic device described in the above embodiments, or may exist independently and not incorporated into the electronic device. The computer-readable medium carries one or more programs. When executed by the electronic device, the electronic device implements the intelligent inductive withstand voltage testing method for GIS equipment based on dynamic impedance matching as described in the above embodiments.

[0089] It should be noted that, although several modules or units of the device for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiment of the application, the features and functions of two or more modules or units described above can be concretized in one module or unit. On the contrary, the features and functions of one module or unit described above can be further divided into multiple modules or units to be concretized.

[0090] Through the description of the above embodiments, it is easy for those skilled in the art to understand that the example embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solution according to the embodiments of the present application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, and includes several instructions to enable a computing device (which can be a personal computer, a server, a touch terminal, or a network device, etc.) to execute the method according to the embodiments of the present application.

[0091] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in this application. It should be understood that this application is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of this application is limited only by the appended claims.

Claims

1. An intelligent inductive withstand voltage test system for GIS equipment based on dynamic impedance matching, characterized in that: include: Main control unit, reactor adjustment module, high-frequency voltage generator, capacitance sensor and data acquisition unit; The main control unit is connected to the reactor adjustment module to control the reactor adjustment module to adjust the inductance of the GIS equipment; The main control unit also controls the high-frequency voltage generator to output voltage to the GIS equipment. The capacitance sensor is used to collect the equivalent capacitance of the GIS device, and the capacitance sensor is connected to the main control unit to transmit the collected equivalent capacitance information to the main control unit; The data acquisition unit is used to collect current, voltage and environmental parameters of the GIS equipment, and the data acquisition unit is connected to the main control unit to transmit the collected current information, voltage information and environmental parameter information to the main control unit.

2. The system according to claim 1, wherein: The high-frequency voltage generator is coupled to the GIS equipment through the secondary side of the voltage transformer.

3. The system according to claim 2, characterized in that The voltage frequency range of the high-frequency voltage generator output is 20Hz-300Hz, and the peak value is 2kV.

4. The system according to claim 1, wherein: The data acquisition unit includes: a voltage sensor, a current sensor, a temperature sensor and a humidity sensor; The voltage sensor is used to collect the voltage of the GIS equipment and is connected to the main control unit to transmit the collected voltage information to the main control unit; The current sensor is used to collect the current of the GIS equipment and is connected to the main control unit to transmit the collected current information to the main control unit; The temperature sensor is used to collect the temperature of the GIS equipment and is connected to the main control unit to transmit the collected temperature information to the main control unit; The humidity sensor is used to collect the humidity of the GIS equipment and is connected to the main control unit to transmit the collected humidity information to the main control unit.

5. A method for intelligent induction withstand voltage testing of GIS equipment based on dynamic impedance matching, applied to the system according to any one of claims 1 to 4, characterized in that: include: The main control unit controls the high-frequency voltage generator to generate initial voltage to the GIS equipment; The data acquisition unit collects the voltage, current and environmental parameters of the GIS equipment and feeds them back to the main control unit, and the capacitance sensor collects the equivalent capacitance of the GIS equipment and feeds it back to the main control unit; The main control unit calculates the compensation inductance required by the GIS equipment based on voltage, current, environmental parameters and equivalent capacitance, and drives the reactor adjustment module to adjust the inductance value of the GIS equipment.

6. The method according to claim 5, characterized in that Also includes: The waveform distortion rate of the voltage of the GIS equipment is collected in real time. When the waveform distortion rate exceeds the set threshold, the voltage frequency is modified.

7. A computer-readable storage medium, characterized in that The storage medium stores computer instructions, which, when executed on a computer, enable the computer to execute the method according to any one of claims 5 to 6.

8. An electronic device, characterized in that: include: memory and processor; The memory is used to store computer instructions; The processor is configured to call the computer instructions stored in the memory so that the electronic device executes the method according to any one of claims 5 to 6.

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