High-Temperature Aging Test Equipment, System, Method and Media for DPU Boards

Abstract

The application provides a DPU board card high-temperature aging test device, system, method and medium, relates to the technical field of high-temperature aging test, and includes a control module, the control module includes a pressing module, a supporting component and a contact module; the supporting component includes a connecting mechanism and a multilayer supporting mechanism; each layer of the supporting mechanism corresponds to each layer of the PCIE base one by one, a plurality of contact modules are arranged on each layer of the supporting mechanism, each contact module on each layer of the supporting mechanism corresponds to each slot on each layer of the PCIE base one by one and is arranged oppositely; the pressing module promotes the contact end of each contact module on the supporting component to contact the serial port point of the DPU board card in the corresponding slot through pressing operation. Through the high-temperature aging test device, the manual frequent plug-in serial port line switching mode operation is solved, the test efficiency is improved, the plug-in damage risk of the board card is reduced, the test result is automatically determined, the test log is saved and uploaded to the MES system, and the test process control ability is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent switch, in particular to a DPU board card high-temperature aging test device, system, method and medium. BACKGROUND

[0002] The DPU board card usually needs to be subjected to high-temperature aging test before mass production, to determine whether the PCBA appears failure condition under high-temperature state, so as to determine whether there is defect in the welding of the PCBA, which is a necessary test item before the DPU board card is put into the market.

[0003] The current high-temperature aging self-circulation test is completed by a high-temperature aging box, which can support 120 pcs of PCBA to simultaneously perform high-temperature aging test at a time, but during the high-temperature aging test, each DPU board card needs to be manually inserted into a serial port line to switch the self-circulation test mode, which results in low test efficiency and risks of damage to the board card interface. Moreover, the test result needs to be manually checked to determine whether the test information printed by each DPU board card is normal, which affects the high-temperature aging test efficiency, and the high-temperature aging test cannot be traced back when an abnormality occurs. SUMMARY

[0004] The present application provides a DPU board card high-temperature aging test device, system, method and medium, to solve the technical problems of low test efficiency, easy damage to the interface and difficulty in tracing back in the prior art when the DPU board card is subjected to high-temperature aging test, wherein the technical solutions provided by the present application are as follows:

[0005] In one aspect, the present application provides a DPU board card high-temperature aging test device, comprising a high-temperature aging box and a control module; the high-temperature aging box comprises a plurality of PCIE bases, and each PCIE base is provided with a plurality of slots; the control module comprises a control unit, a pressing module, a support component and a contact module; the control unit is connected with the pressing module; the support component comprises a connecting mechanism and a plurality of support mechanisms, a first end of the connecting mechanism is connected with a pressing end of the pressing module, and a second end of the connecting mechanism is connected with each support mechanism; each support mechanism corresponds to each PCIE base, and each support mechanism is provided with a plurality of contact modules; each contact module on each support mechanism corresponds to and is oppositely arranged with each slot on each PCIE base; the pressing module is controlled by the control unit to make the contact end of each contact module on the support component contact and connect with the serial port point of the DPU board card in the oppositely arranged slot through pressing operation.

[0006] Optionally, the pressing module comprises an electromagnetic valve, a cylinder and a bearing which are connected in sequence; the electromagnetic valve is connected with the control unit; a front end of the bearing is connected with the first end of the connecting mechanism.

[0007] Optionally, each contact module comprises a first communication cable and a plurality of probes; the first communication cable is connected with each probe respectively.

[0008] Optionally, the first communication cable is a USB cable or a DB line.

[0009] In another aspect, the application provides a DPU board card high-temperature aging test system, comprising the above-mentioned DPU board card high-temperature aging test device, a host computer and an MES system; the host computer is connected with the MES system, and the lower pressing module and each contact module in the DPU board card high-temperature aging test device respectively.

[0010] The host computer is used to send a lower pressing signal to the control unit, so that the control unit controls the lower pressing module to make the contact end of each contact module on the support component contact and connect with the serial port point of the DPU board card in the oppositely arranged slot through the lower pressing operation; after loading the serial communication interface driver of each DPU board card, the serial number of each DPU board card is identified; based on the serial number of each DPU board card, each DPU board card is controlled to enter a self-circulation test mode, and each piece of printing data when each DPU board card is in the self-circulation test mode is obtained; based on each piece of printing data of each DPU board card, the high-temperature aging test result of each DPU board card is determined, and the high-temperature aging test log of each DPU board card is generated; the high-temperature aging test result and the high-temperature aging test log of each DPU board card are reported to the MES system.

[0011] The MES system is used to save the high-temperature aging test result and the high-temperature aging test log of each DPU board card reported by the host computer.

[0012] Optionally, the host computer is connected with the first communication cable of each contact module through a second communication cable; the host computer is connected with the control unit of the control module through a third communication cable; and the host computer is connected with the MES system through a fourth communication cable.

[0013] Optionally, the second communication cable is a USB HUB; the third communication cable is a USB cable or a DB line; and the fourth communication cable is a LAN cable.

[0014] In another aspect, the application provides a DPU board card high-temperature aging test method, which is applied to the host computer in the above-mentioned DPU board card high-temperature aging test system, and comprises the following steps:

[0015] A lower pressing signal is sent to the control unit, so that the control unit controls the lower pressing module to make the contact end of each contact module on the support component contact and connect with the serial port point of the DPU board card in the oppositely arranged slot through the lower pressing operation.

[0016] After loading the serial communication interface driver of each DPU board card, the serial number of each DPU board card is identified;

[0017] controlling each DPU board card to enter a self-loop test mode based on a serial number of each DPU board card, and obtaining each piece of print data when each DPU board card is in the self-loop test mode;

[0018] determining a high-temperature aging test result of each DPU board card based on the print data of each DPU board card, and generating a high-temperature aging test log corresponding to each DPU board card;

[0019] reporting the high-temperature aging test result and the high-temperature aging test log of each DPU board card to an MES system.

[0020] Optionally, determining the high-temperature aging test result of each DPU board card based on the print data of each DPU board card, and generating the high-temperature aging test log corresponding to each DPU board card, comprises:

[0021] For each DPU board card, comparing at least two pieces of print data adjacent in time stamp to obtain each comparison result; if it is determined based on the comparison results that the print data of the DPU board card has always changed, it is determined that the high-temperature aging test result of the DPU board card is test passed; if it is determined based on the comparison results that the print data of the DPU board card has not changed, it is determined that the high-temperature aging test result of the DPU board card is test failed; based on the print data of the DPU board card and the comparison results of the at least two pieces of print data adjacent in time stamp, the high-temperature aging test log of the DPU board card is generated.

[0022] In another aspect, the present application provides a computer readable storage medium, which stores computer instructions, and the computer instructions are executed by a processor to implement the DPU board card high-temperature aging test method.

[0023] The beneficial effects of the present application are as follows:

[0024] The DPU board card high-temperature aging test equipment, system, method and medium provided by the application, on the one hand, the host computer controls the pressing module to perform the pressing operation, which can promote the contact end of each contact module on the support component to be in point contact connection with the serial port of the DPU board card in the corresponding slot, so that after loading the serial communication interface driver of each DPU board card and identifying the serial number of each DPU board card, the host computer can control each DPU board card to enter the self-circulation test mode based on the serial number of each DPU board card, thereby realizing automatic switching into the self-circulation test mode, effectively avoiding the technical problem of low test efficiency and the risk of damage to the board card interface caused by manually inserting each DPU board card into the serial port line for self-circulation test mode switching, on the other hand, the host computer obtains each piece of print data when each DPU board card is in the self-circulation test mode, and can automatically determine the high-temperature aging test result of each DPU board card based on each piece of print data of each DPU board card, thereby realizing automatic identification of the high-temperature aging test result, effectively avoiding the technical problem of low test efficiency caused by manual checking of the high-temperature aging test result of each DPU board card, and the host computer generates the high-temperature aging test log corresponding to each DPU board card and reports the high-temperature aging test result and the high-temperature aging test log of each DPU board card to the MES system, which can realize data tracing when the high-temperature aging test is abnormal, thereby improving the management and control ability of the high-temperature aging test process.

[0025] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the present application. The objects and other advantages of the present application can be realized and attained by the structure particularly pointed out in the written description and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed in the specific embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor. In the drawings:

[0027] Figure 1 A schematic diagram of the DPU board card high-temperature aging test equipment in the embodiments of the present application;

[0028] Figure 2 Another schematic diagram of the DPU board card high-temperature aging test equipment in the embodiments of the present application;

[0029] Figure 3 The architecture schematic diagram of the DPU board card high-temperature aging test system in the embodiments of the present application;

[0030] Figure 4 This is a flowchart illustrating the high-temperature aging test method for DPU boards in the embodiments of this application;

[0031] Figure 5 This is a schematic diagram of the functional structure of the host computer in the embodiments of this application;

[0032] Figure 6 This is a schematic diagram of the hardware structure of the host computer in an embodiment of this application. Detailed Implementation

[0033] To make the objectives, technical solutions, and beneficial effects of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0034] This application provides a high-temperature aging test device for DPU boards, see below. Figure 1 As shown, the high-temperature aging test equipment for DPU boards provided in this application embodiment includes a housing 10 and a high-temperature aging chamber 100 disposed within the housing 10; the housing 10 is provided with a temperature setting and display component 11, a main power button 12, an electrical junction box 13, a button start and timer power switch 14, indicator lights 15 (for displaying and alarming the high-temperature aging test status), and casters 16 (e.g., two directional casters and two omnidirectional casters, etc.); the high-temperature aging chamber 100 includes a multi-layer PCIe base 110, each layer of PCIe base 110 is provided with multiple slots 111 and an installation position switch 112;

[0035] See Figure 2As shown in the embodiment of this application, the high-temperature aging test equipment for DPU boards also includes a control module 200; the control module 200 includes a control unit 210, a pressing module 220, a support component 230, and a contact module 240; the control unit 210 is connected to the pressing module 220; the support component 230 includes a connecting mechanism 231 and a multi-layer support mechanism 232, the first end of the connecting mechanism 231 is connected to the pressing end of the pressing module 220, and the second end of the connecting mechanism 231 is connected to each layer of the support mechanism 232; each Each layer support mechanism 232 corresponds to one layer of PCIe base 110. Each layer support mechanism 232 is provided with multiple contact modules 240. Each contact module 240 on each layer support mechanism 232 corresponds to one layer of slot 111 on each layer of PCIe base 110 and is arranged opposite to each other. Under the control of the control unit 210, the pressing module 220 causes the contact end of each contact module 240 on the support component 230 to make contact with the serial port point of the DPU board in the oppositely arranged slot 111 through the pressing operation.

[0036] In this embodiment, by adding a pressing module 220, a support component 230, and a contact module 240 to the DPU board high-temperature aging test equipment, the pressing module 220 can be controlled by the host computer to perform a pressing operation, causing the contact end of each contact module 240 on the support component 230 to make contact with the serial port of the DPU board in the corresponding slot 111. After loading the serial communication interface driver of each DPU board and identifying the serial port number of each DPU board, each DPU board can be controlled to enter the self-loop test mode based on the serial port number of each DPU board. This achieves automatic switching to the self-loop test mode, effectively avoiding the technical problems of low test efficiency and risk of board interface damage caused by manually inserting each DPU board into the serial port cable to switch the self-loop test mode.

[0037] In the high-temperature aging test equipment for DPU boards provided in this application embodiment, the pressure module 220 can have various specific structures to realize its function. In an optional embodiment, for example... Figure 2 As shown, the pressing module 220 may specifically include a solenoid valve 221, a cylinder 222 and a bearing 223 connected in sequence; the solenoid valve 221 is connected to the control unit 210; the front end of the bearing 223 is connected to the first end of the connecting mechanism 231.

[0038] In this embodiment, a pressure signal is sent from the host computer to the control unit 210. When the control unit 210 receives the pressure signal, it controls the solenoid valve 221 to open, and the cylinder 222 to start working. The cylinder 222 pushes the bearing 223 down, causing the contact end of each contact module 240 on the multi-layer support mechanism 232, which is connected to the front end of the bearing 223 through the connecting mechanism 231, to make contact with the serial port of the DPU board in the slot 111, thereby completing the insertion operation of each DPU board. This effectively avoids the technical problems of low testing efficiency and risk of damage to the board interface caused by manually inserting each DPU board into the serial port.

[0039] In the high-temperature aging test equipment for DPU boards provided in this application embodiment, the contact module 240 can have various specific structures to realize its function. In an optional embodiment, for example... Figure 2 As shown, each contact module 240 may specifically include a first communication cable and multiple probes; the first communication cable is connected to each probe respectively.

[0040] In this embodiment, each contact module 240 includes multiple probes as contact ends, which are respectively connected to multiple serial port points of the DPU board in the corresponding slot 111. For example, the contact module 240 includes four probes, which are respectively connected to the J9 UART serial port points of the DPU board: VCC3V3 (power point), RX (signal receiving point), TX (signal output point) and GND (ground point). After communicating with the host computer through the first communication cable, the host computer can be triggered to load the serial communication interface driver of each DPU board and identify the serial port number of each DPU board. Then, the host computer can control each DPU board to enter the self-loop test mode based on the serial port number of each DPU board, thereby realizing the automatic switching of the self-loop test mode. This effectively avoids the technical problem of low test efficiency and risk of damage to the board interface caused by manually inserting each DPU board into the serial port cable to switch the self-loop test mode.

[0041] In the high-temperature aging test equipment for DPU boards provided in this application embodiment, the first communication cable in each contact module 240 can have various specific types to realize its function. In an optional implementation, for example... Figure 2 As shown, the first communication cable can be specifically a USB cable or a DB cable.

[0042] In this embodiment, a USB cable or DB cable is used as the first communication cable between the probe and the host computer, which enables fast and accurate transmission of electrical signals.

[0043] The high-temperature aging test equipment for DPU boards provided in this application embodiment also includes a scanning component; the scanning component is communicatively connected to the control unit 210;

[0044] The scanning component is used to scan the QR code label printed on the bottom surface of each DPU board, identify the QR code label printed on the bottom surface of each DPU board to obtain the SN of each DPU board, and send the SN of each DPU board to the control unit 210.

[0045] In this embodiment, the scanning component can be at least one. By scanning the QR code label printed on the bottom surface of each DPU board using the scanning component (e.g., barcode scanner, camera, etc.), the serial number (SN) of each DPU board can be identified based on the QR code label printed on the bottom surface of each DPU board. By uploading the SN number of each DPU board to the control unit 210, the control unit 210 can associate the SN number of each DPU board with the slot identifier and upload it to the host computer for associated storage. This facilitates the traceability of the high-temperature aging test results of each DPU board in the future.

[0046] The high-temperature aging test equipment for DPU boards provided in this application embodiment also includes a camera and an indicator light module disposed near each slot; the camera and each indicator light module are respectively connected to the control unit 210.

[0047] In this embodiment, the indicator light module includes dual-color LEDs. The yellow LED represents the network speed of the DPU board, and the green LED represents the linkup status of the DPU board. A constantly lit yellow LED and a flashing green LED indicate normal self-loop communication and network speed of the DPU board, further indicating that the high-temperature aging test result of the DPU board is normal. If either the yellow or green LED is off, the high-temperature aging test result of the DPU board is considered abnormal. By observing the indicator light status of the indicator light module corresponding to each DPU board through a camera, the high-temperature aging test result of each DPU board can be viewed.

[0048] Based on the same inventive concept, this application also provides a high-temperature aging test system for DPU boards, see reference. Figure 3 As shown, the DPU board high temperature aging test system provided in this application embodiment includes the above-mentioned DPU board high temperature aging test equipment 310, host computer 320 and MES system 330; the host computer 320 is connected to the control unit 210 in the MES system 330 and each contact module 240 in the DPU board high temperature aging test equipment 310.

[0049] The host computer 320 sends a pressure signal to the control unit 210, so that the control unit 210 controls the pressure module 220 to make the contact end of each contact module 240 on the support component 230 make contact with the serial port point of the DPU board in the slot 111 through the pressure operation; after loading the serial communication interface driver of each DPU board, it identifies the serial port number of each DPU board; based on the serial port number of each DPU board, it controls each DPU board to enter the self-loop test mode and acquires each print data when each DPU board is in the self-loop test mode; based on each print data of each DPU board, it determines the high temperature aging test result of each DPU board and generates a high temperature aging test log for each DPU board; and reports the high temperature aging test result and high temperature aging test log of each DPU board to the MES system 330.

[0050] The MES system 330 is used to store the high-temperature aging test results and high-temperature aging test logs of each DPU board reported by the host computer 320.

[0051] In this embodiment, the host computer 320 sends a pressure signal to the control unit 210, causing the control unit 210 to control the pressure module 220 to perform a pressure operation. This enables the contact end of each contact module 240 on the support component 230 to make contact with the serial port of the DPU board in the corresponding slot 111. After loading the serial communication interface driver for each DPU board and identifying the serial port number of each DPU board, each DPU board can be controlled to enter the self-loop test mode based on its serial port number. This achieves automatic switching to the self-loop test mode, effectively avoiding the low testing efficiency and risk of damage to the board interface caused by manually inserting each DPU board into the serial port for self-loop test mode switching. On the other hand, regarding technical issues, by acquiring the print data of each DPU board in self-circulation test mode through the host computer 320, the high-temperature aging test results of each DPU board can be automatically determined based on the print data of each DPU board. This achieves automatic identification of high-temperature aging test results, effectively avoiding the technical problem of low testing efficiency caused by manual verification of the high-temperature aging test results of each DPU board. Furthermore, by generating a high-temperature aging test log for each DPU board through the host computer 320 and reporting the high-temperature aging test results and logs of each DPU board to the MES system 330, data traceability can be achieved when anomalies occur in the high-temperature aging test, thereby improving the control capability of the high-temperature aging test process.

[0052] In the high-temperature aging test system for DPU boards provided in this application embodiment, the host computer 320 is connected to the first communication cable of each contact module 240 via a second communication cable; the host computer is connected to the control unit 210 of the control module 200 via a third communication cable; and the host computer 320 is connected to the MES system 330 via a fourth communication cable.

[0053] In this application embodiment, the second, third, and fourth communication cables can have various specific types to implement their functions. In one optional implementation, for example... Figure 3 As shown, the second communication cable can be a USB hub; the third communication cable can be a USB cable or a DB cable; and the fourth communication cable can be a LAN cable. Using a USB hub as the second communication cable between the host computer 320 and each contact module 240, and using a USB cable or DB cable as the third communication cable between the host computer 320 and the control unit 210, enables fast and accurate transmission of electrical signals. Using a LAN cable as the second communication cable between the host computer 320 and the MES system 330 ensures that the host computer 320 and the MES system 330 are on the same network, enabling rapid transmission and analysis of high-temperature aging test results and logs.

[0054] Based on the above embodiments, this application provides a high-temperature aging test method for DPU boards, applied to the host computer 320 in the above-mentioned high-temperature aging test system for DPU boards. (See attached document.) Figure 4 As shown in the embodiments of this application, the general flow of the high-temperature aging test method for DPU boards is as follows:

[0055] Step 401: The host computer 320 sends a scanning signal to the control unit 210 so that the control unit 210 obtains the SN (Serial Number) of each DPU board obtained by scanning and identifying the QR code label on each DPU board through the scanning component, and obtains the physical address (such as bus number-device number-function number BDF or logical slot number) of the slot 111 into which each DPU board is inserted as the slot identifier. After associating the SN of each DPU board with the slot identifier of the corresponding slot, the control unit 210 reports the information to the host computer 320.

[0056] In this embodiment, a QR code label is printed on the bottom surface of each DPU board. Scanning the QR code label allows identification of the DPU board's serial number (SN). Optionally, in one embodiment, at least one scanning component (e.g., a 2D barcode automatic scanner) can be installed on the DPU board high-temperature aging test equipment. Each scanning component is connected to the control unit 210 via a USB cable, and the control unit 210 is connected to the host computer 320 via a USB cable. Before placing each DPU board into slot 111, the host computer 320 sends a scanning signal to the control unit 210. Specifically, in response to a click operation on the test preparation button on the test interface, the host computer 320 sends a scanning signal to the control unit 210. When the control unit 210 receives the scanning signal, it controls the scanning component to sequentially scan the QR code label on the bottom surface of each DPU board. Each time a QR code label on the bottom surface of a DPU board is scanned, the serial number (SN) of the DPU board is identified. The QR code label on the bottom surface identifies the serial number (SN) of the DPU board. After detecting the slot insertion event, it determines that the DPU board has been inserted into slot 111, obtains the physical address of slot 111 (such as bus number-device number-function number BDF or logical slot number) as the slot identifier, associates the SN of the DPU board with the slot identifier, and further uploads the association relationship between the SN of each DPU board and the corresponding slot identifier to the host computer 320 to provide data support for the traceability of the high temperature aging test results of each DPU board.In another embodiment, at least one scanning component (e.g., a 2D barcode scanner, camera, etc.) can be installed on each layer of support structure 232. The scanning range of the scanning component on each layer of support structure 232 can cover each slot on the PCIe dock opposite to the support structure 232. Each scanning component on each layer of support structure 232 is connected to the control unit 210 via a USB cable. The control unit 210 is connected to the host computer 320 via a USB cable. After placing each DPU board with its bottom side facing up on the slot 111, the host computer 320 sends a scanning signal to the control unit 210. Specifically, the host computer 320 sends a scanning signal to the control unit 210 in response to a click operation on the test preparation button on the test interface. When the control unit 210 receives the scanning signal, it controls each scanning component on each layer of support structure 232 to scan the QR code label on the bottom side of each DPU board. Based on the QR code label of each DPU board, each The serial number (SN) of each DPU board is determined, and based on the scanning range of each scanning component, the slot 111 into which each DPU board is inserted is determined. The physical address of each slot 111 into which each DPU board is inserted is obtained (such as bus number-device number-function number BDF or logical slot number) as a slot identifier. The SN of each DPU board is associated with the slot identifier of the corresponding slot. Furthermore, the association between the SN of each DPU board and the slot identifier of the corresponding slot is uploaded to the host computer 320 to provide data support for the traceability of the high-temperature aging test results of each DPU board.

[0057] Step 402: The host computer 320 associates and stores the SN number of each DPU board with the slot identifier of the slot 111 into which each DPU board is inserted.

[0058] Step 403: The host computer 320 sends a pressure signal to the control unit 210 so that the control unit 210 controls the pressure module 220 to cause the contact end of each contact module 240 on the support component 230 to make contact with the serial port point of the DPU board in the opposite slot 111 through the pressure operation.

[0059] In this embodiment, the host computer 320 and the control unit 210 are connected via a USB cable. In response to the click operation of the test run button on the test interface, the host computer 320 sends a pressure signal to the control unit 210. When the control unit 210 receives the pressure signal, it controls the solenoid valve 221 to open, and the cylinder 222 starts to work. The cylinder 222 pushes the bearing 223 down, causing the support component 230 installed at the front end of the bearing 223 to press down, so that the probe 242 in each contact module 240 set on the support component 230 contacts the J9 UART serial port point on the DPU board. Specifically, there are 4 pin points, namely VCC3V3 (power point), RX (signal receiving point), TX (signal output point) and GND (ground point), which serve as the switching contact points for the self-loop test mode.

[0060] Step 404: After the host computer 320 loads the serial communication interface driver for each DPU board, it identifies the serial port number of each DPU board.

[0061] Step 405: The host computer 320 controls each DPU board to enter the self-loop test mode based on the serial port number of each DPU board, and obtains each print data when each DPU board is in the self-loop test mode.

[0062] In this embodiment, before the host computer 320 controls each DPU board to enter the self-loop test mode based on the serial port number of each DPU board, it needs to configure the parameters of the serial communication interface of each DPU board. For example, in the test software installed on the host computer 320, click the "File" menu, select "New" to create a new session, select "SERIAL" as the protocol, and then select the "Serial Port" tab in the session properties window, and enter the relevant parameters of the serial port: port number, baud rate (e.g., 115200), data bits (e.g., 8 bits), stop bits (e.g., 1 bit), parity bits (e.g., None, no parity), etc., and save the settings. Different DPU boards are configured according to the above operation once, so as to ensure the protocol consistency between the host computer 320 and the DPU board at the physical layer and data link layer, and avoid communication failure or data error due to parameter mismatch. Furthermore, in this embodiment, a USB cable is connected to the probe 242, which in turn connects to a USB hub. The USB hub connects to a host computer 320. The host computer 320 can support up to 256 serial port numbers. After configuring the parameters of the serial communication interface of each DPU board, the host computer 320 loads the serial communication interface driver and identifies the corresponding serial port number. By running the command `yscom.exe -p serial port number -t`, each DPU board is switched from normal mode to self-looping test mode for high-temperature aging test. During the high-temperature aging test, the serial communication interface is in a connected state. The host computer 320 can call the serial communication interface to view the printed data of the DPU board. For example, it can call the serial communication interface to view the printed data of the DPU board once every 10 seconds, thereby obtaining each piece of printed data from each DPU board. Each piece of printed data includes an address (e.g., register address) and a data value (e.g., the value of a random data packet sent by the DPU board).

[0063] Step 406: The host computer 320 determines the high-temperature aging test results of each DPU board based on each printed data of each DPU board, and generates a high-temperature aging test log for each DPU board.

[0064] In this embodiment of the application, when the host computer 320 determines the high-temperature aging test result of each DPU board based on each printed data of each DPU board and generates the high-temperature aging test log corresponding to each DPU board, it may use, but is not limited to, the following methods:

[0065] For each DPU board, at least two adjacent timestamps in each print data entry of the DPU board are compared to obtain comparison results. If the comparison results indicate that the print data of the DPU board has been changing, the high-temperature aging test result of the DPU board is determined to be a pass. If the comparison results indicate that the print data of the DPU board has not changed, the high-temperature aging test result of the DPU board is determined to be a fail. Based on each print data entry of the DPU board and the comparison results of at least two adjacent timestamps in each print data entry, a high-temperature aging test log of the DPU board is generated.

[0066] Step 407: The host computer 320 reports the high-temperature aging test results and high-temperature aging test logs of each DPU board to the MES system.

[0067] In this embodiment of the application, when the host computer 320 reports the high-temperature aging test results and high-temperature aging test logs of each DPU board to the MES system, it may use, but is not limited to, the following methods:

[0068] According to the station, serial number, slot identifier, and high-temperature aging test results of each DPU board, the high-temperature aging test log of each DPU board is saved to a local folder. The local folder is then packaged and uploaded to the MES system so that the MES system can trace the high-temperature aging test results of the DPU boards.

[0069] Next, the functional structure of the host computer 320 provided in the embodiments of this application will be briefly introduced. (See reference...) Figure 5 As shown, the host computer 320 provided in this application embodiment includes at least:

[0070] The first control unit 321 is used to send a pressing signal to the control unit so that the control unit controls the pressing module to cause the contact end of each contact module on the support component to make contact connection with the serial port point of the DPU board in the opposite slot through the pressing operation.

[0071] The loading identification unit 322 is used to identify the serial port number of each DPU board after loading the serial communication interface driver of each DPU board.

[0072] The second control unit 323 is used to control each DPU board to enter the self-loop test mode based on the serial port number of each DPU board.

[0073] The data acquisition unit 324 is used to acquire each print data when each DPU board is in self-looping test mode;

[0074] The aging test unit 325 is used to determine the high-temperature aging test results of each DPU board based on each printed data of each DPU board, and to generate a high-temperature aging test log for each DPU board.

[0075] The data upload unit 326 is used to report the high-temperature aging test results and high-temperature aging test logs of each DPU board to the MES system.

[0076] In one possible implementation, the aging test unit 325 is specifically used to compare at least two print data points with adjacent timestamps in each print data point of the DPU board for each DPU board to obtain various comparison results; if it is determined based on the various comparison results that the print data of the DPU board has been changing, then the high temperature aging test result of the DPU board is determined to be a pass; if it is determined based on the various comparison results that the print data of the DPU board has not changed, then the high temperature aging test result of the DPU board is determined to be a fail; and a high temperature aging test log of the DPU board is generated based on each print data point of the DPU board and the comparison results of at least two print data points with adjacent timestamps in each print data point.

[0077] In one possible implementation, the data upload unit 326 is specifically used to save the high-temperature aging test log of each DPU board to a local folder according to the station, SN number, slot identifier and high-temperature aging test results of each DPU board, and then package the local folder and upload it to the MES system.

[0078] The hardware structure of the host computer 320 provided in the embodiments of this application is briefly described below. (See reference...) Figure 6 As shown, the host computer 320 provided in this application embodiment includes at least a processor 601, a memory 602, and a computer program stored in the memory 602 and run on the processor 601. When the processor 601 executes the computer program, it implements the above-mentioned high-temperature aging test method for DPU board provided in this application embodiment.

[0079] The host computer provided in this application embodiment can also be connected to a bus 603 of different components (including processor 601 and memory 602). The bus 603 represents one or more types of bus structures, including memory bus, peripheral bus, local area bus, etc.

[0080] Memory 602 may include a readable storage medium in the form of volatile memory, such as random access memory (RAM) 6021 and / or cache memory 6022, and may further include read-only memory (ROM) 6023. Memory 602 may also include a program tool 6025 having a set (at least one) of program modules 6024, including but not limited to an operating subsystem, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0081] Processor 601 can be a single processing element or a collective term for multiple processing elements. For example, processor 601 can be a Central Processing Unit (CPU), or one or more integrated circuits configured to implement the high-temperature aging test method for DPU boards provided in the embodiments of this application. Specifically, processor 601 can be a general-purpose processor, including but not limited to CPUs, Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0082] The host computer can also communicate with one or more devices that allow users to interact with it (such as mobile phones, computers, etc.), and / or with external devices 604 that enable the host computer to communicate with one or more other smart home appliances (such as smart speakers, etc.). This communication can be achieved through a communication module 605 (such as a Bluetooth module, ZigBee module, WiFi module, etc.). Furthermore, the host computer can also communicate with one or more networks (such as local area networks (LANs), wide area networks (WANs), and / or public networks, such as the Internet) through a network adapter 606. Figure 6 As shown, network adapter 606 communicates with other modules of the host computer via bus 603. It should be understood that, although... Figure 6 As not shown in the diagram, it can be combined with a host computer to use other hardware and / or software modules, including but not limited to microcode, device drivers, redundant processors, external disk drive arrays, Redundant Arrays of Independent Disks (RAID) subsystems, tape drives, and data backup storage subsystems.

[0083] It should be noted that, Figure 6 The host computer shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0084] Furthermore, this application embodiment also provides a computer-readable storage medium storing computer instructions. When executed by a processor, these computer instructions implement the high-temperature aging test method for DPU boards provided in this application embodiment. Specifically, the computer instructions can be built into or installed in the processor, so that the processor can implement the high-temperature aging test method for DPU boards provided in this application embodiment by executing the built-in or installed computer instructions.

[0085] In addition, the high-temperature aging test method for DPU boards provided in the embodiments of this application can also be implemented as a computer program product. The computer program product includes program code, which implements the high-temperature aging test method for DPU boards provided in the embodiments of this application when running on a processor.

[0086] The computer program product provided in this application embodiment may employ one or more computer-readable storage media, which may be, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination thereof. Specifically, more specific examples (a non-exhaustive list) of computer-readable storage media include connections with one or more wires, portable disks, hard disks, RAM, ROM, erasable programmable read-only memory (EPROM), optical fibers, portable compact disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0087] The computer program product provided in this application embodiment can be a CD-ROM and include program code, and can also run on devices such as computers and mobile phones. However, the computer program product provided in this application embodiment is not limited to this. In this application embodiment, the computer-readable storage medium can be any tangible medium that contains or stores program code, which can be used by or in conjunction with an instruction execution system, device, or apparatus.

[0088] It should be noted that although several units or sub-units of the device have been mentioned in the detailed description above, this division is merely exemplary and not mandatory. In fact, according to embodiments of this application, the features and functions of two or more units described above can be embodied in one unit. Conversely, the features and functions of one unit described above can be further divided and embodied by multiple units.

[0089] Furthermore, although the operations of the method of this application are described in a specific order in the accompanying drawings, this does not require or imply that these operations must be performed in that specific order, or that all the operations shown must be performed to achieve the desired result. Additionally or alternatively, certain steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps.

[0090] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0091] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the spirit and scope of the embodiments of this application. Therefore, if these modifications and variations to the embodiments of this application fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations.

Claims

1. A DPU board card high temperature aging test device, characterized in that, The application relates to a DPU board card high-temperature aging test device which comprises a high-temperature aging box and a control module; the high-temperature aging box comprises multiple layers of PCIE bases, each layer of the PCIE bases is provided with multiple slot positions; the control module comprises a control unit, a pressing-down module, a supporting component and a contact module; the control unit is connected with the pressing-down module; the supporting component comprises a connecting mechanism and multiple layers of supporting mechanisms; the first end of the connecting mechanism is connected with the pressing end of the pressing-down module; the second end of the connecting mechanism is connected with each layer of the supporting mechanisms respectively; each layer of the supporting mechanisms corresponds to each layer of the PCIE bases; each layer of the supporting mechanisms is provided with multiple contact modules; each contact module on each layer of the supporting mechanisms corresponds to and is oppositely arranged with each slot position on each layer of the PCIE bases; the pressing-down module is controlled by the control unit to make the contact end of each contact module on the supporting component contact and connect with the serial port point of a DPU board card in the oppositely arranged slot position through pressing-down operation.

2. The DPU board card high temperature burn-in test device of claim 1, wherein, The pressing-down module comprises an electromagnetic valve, a cylinder and a bearing which are connected in sequence; the electromagnetic valve is connected with the control unit; the front end of the bearing is connected with the first end of the connecting mechanism.

3. The DPU board card high temperature burn-in test device of claim 1, wherein, Each contact module comprises a first communication cable and multiple probes; the first communication cable is connected with each probe respectively.

4. The DPU board card high temperature burn-in test apparatus of claim 3, wherein, The first communication cable is a USB cable or a DB line.

5. A DPU board card high temperature burn-in test system, characterized in that, The application further discloses a DPU board card high-temperature aging test device, an upper computer and an MES system; the upper computer is connected with the MES system, the control unit in the DPU board card high-temperature aging test device and each contact module respectively. The upper computer is used for sending a pressing-down signal to the control unit so that the control unit controls the pressing-down module to make the contact end of each contact module on the supporting component contact and connect with the serial port point of a DPU board card in the oppositely arranged slot position through pressing-down operation; after the serial communication interface driver of each DPU board card is loaded, the serial number of each DPU board card is identified; Based on the serial number of each DPU board card, each DPU board card is controlled to enter a self-circulation test mode, and each piece of printing data of each DPU board card in the self-circulation test mode is acquired; Based on each piece of printing data of each DPU board card, the high-temperature aging test result of each DPU board card is determined, and the high-temperature aging test log of each DPU board card is generated; the high-temperature aging test result and the high-temperature aging test log of each DPU board card are reported to the MES system; The MES system is used for saving the high-temperature aging test result and the high-temperature aging test log of each DPU board card reported by the upper computer.

6. The DPU board card high temperature burn-in test system of claim 5, wherein, The upper computer is connected with the first communication cable of each contact module through a second communication cable; the upper computer is connected with the control unit of the control module through a third communication cable; The upper computer is connected with the MES system through a fourth communication cable.

7. The DPU board card high temperature burn-in test system of claim 6, wherein, The second communication cable is a USB HUB; the third communication cable is a USB cable or a DB line; and the fourth communication cable is a LAN cable.

8. A method for DPU board card high temperature burn-in test, characterized in that, The DPU board card high-temperature aging test system is implemented based on the DPU board card high-temperature aging test system according to any one of claims 5-7. The control unit is sent a pressing signal to control the pressing module to press the contact end of each contact module on the support component to contact and connect with the serial port point of the DPU board card in the corresponding slot; After the serial communication interface driver of each DPU board card is loaded, the serial number of each DPU board card is identified; Based on the serial number of each DPU board card, each DPU board card is controlled to enter a self-circulation test mode, and each piece of print data of each DPU board card in the self-circulation test mode is obtained; Based on each piece of print data of each DPU board card, the high-temperature aging test result of each DPU board card is determined, and a high-temperature aging test log corresponding to each DPU board card is generated; The high-temperature aging test result and the high-temperature aging test log of each DPU board card are reported to an MES system.

9. The DPU board card high temperature burn-in test method of claim 8, wherein, Based on each piece of print data of each DPU board card, the high-temperature aging test result of each DPU board card is determined, and a high-temperature aging test log corresponding to each DPU board card is generated, including: For each DPU board card, at least two pieces of print data adjacent in time stamp in the print data of the DPU board card are compared to obtain each comparison result; If it is determined based on each comparison result that the print data of the DPU board card has always changed, it is determined that the high-temperature aging test result of the DPU board card is test passed; If it is determined based on each comparison result that the print data of the DPU board card has not changed, it is determined that the high-temperature aging test result of the DPU board card is test failed; Based on each piece of print data of the DPU board card and the comparison result of at least two pieces of print data adjacent in time stamp in each piece of print data, a high-temperature aging test log of the DPU board card is generated.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer instructions, and the computer instructions are executed by the processor to implement the DPU board card high-temperature aging test method according to any one of claims 8-9.

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