Efficient heat dissipation server case for ai digital human
By opening heat dissipation holes on the inner wall and the top and bottom surfaces of the server chassis and installing a heat dissipation fan to form an effective heat dissipation channel, the problem of insufficient heat dissipation in traditional chassis is solved, and efficient heat dissipation and stable operation of AI digital people is achieved.
Patent Information
- Application Number
- CN202510553412.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-29
- Publication Date
- 2025-08-15
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The thermal dissipation performance of traditional server chassis is insufficient, resulting in low and unstable operation efficiency of AI digital people in high temperature environments.
Design an efficient heat dissipation server chassis. By opening heat dissipation holes on the inner wall and top surface of the chassis case and installing a heat dissipation fan to form an effective heat dissipation channel, combined with silicone pads to increase friction and prevent sliding, achieving fast and efficient heat dissipation.
It realizes efficient heat dissipation of AI digital people, ensures stable operation in high-temperature environments, improves the heat dissipation effect of the system and prevents the chassis from sliding.
Smart Images

Figure CN120491765A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of server chassis, and in particular to an efficient heat dissipation server chassis for AI digital humans. Background Art
[0002] With the rapid development of artificial intelligence technology, AI digital humans are increasingly being used in various fields. The operation of AI digital humans relies on high-performance server chassis, and the heat dissipation performance of server chassis directly affects the operating efficiency and stability of AI digital humans. Traditional server chassis have many heat dissipation deficiencies, such as unreasonable heat dissipation structures, low heat dissipation efficiency, and high noise levels. These issues have seriously restricted the application and development of AI digital humans.
[0003] To address these issues, it is necessary to design an efficient heat dissipation server chassis for AI digital humans. This chassis needs to have excellent heat dissipation performance, able to quickly and effectively dissipate heat inside the chassis, ensuring that the AI digital human can still operate stably in high-temperature environments. Summary of the Invention
[0004] The purpose of the present invention is to provide a high-efficiency heat dissipation server chassis for AI digital humans to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an efficient heat dissipation server chassis for AI digital humans, comprising a chassis shell, a fixing plate fixed to the front end of the chassis shell, a reserved slot provided at the rear end of the chassis shell, a rear sealing plate installed at the rear end of the chassis shell by screws, heat dissipation holes 1 provided on two parallel inner walls of the chassis shell, a heat dissipation fan installed on the outer wall of the chassis shell, a through groove provided on the top surface and the bottom surface of the chassis shell, heat dissipation holes 3 provided on the surface of the through groove, and a silicone pad fixed on the surface of the through groove.
[0006] Preferably, the height of the chassis shell is equal to the height of the fixing plate, and bolt holes are provided at both ends of the fixing plate. The bolt holes are oblong holes, and the top surface and the bottom surface of the bolt hole are provided with side grooves. The side grooves are connected to the through grooves, and the height of the side grooves is equal to the height of the through grooves.
[0007] Preferably, the reserved groove is an annular groove, and angle plates are fixed at the four corners inside the reserved groove. The angle plates are in an "L"-shaped plate structure. The length of the angle plates is equal to the depth of the reserved groove. A through opening is provided on the surface of the angle plate, and the through opening is in an "L"-shaped opening. There are multiple through openings, and the multiple through openings are arranged at equal distances and sizes along the long side of the angle plate.
[0008] Preferably, a plugging strip is inserted between two adjacent angle plates, the plugging strip is fixed to the surface of the rear sealing plate, a screw groove is opened at one end of the angle plate, and a screw passes through the rear sealing plate and is screwed into the screw groove.
[0009] Preferably, the first heat dissipation hole is an oval opening, and the first heat dissipation hole communicates with the reserved groove. Heat dissipation holes II are provided on both sides of the chassis shell.
[0010] Preferably, mounting openings are provided on both sides of the chassis shell. The heat dissipation fans are inserted into the mounting openings. Grooves are provided on the top surface and the bottom surface of the chassis shell. Screws are screwed on the surfaces of the grooves, and one end of each screw is screwed on the surface of the heat dissipation fan.
[0011] Preferably, the through groove is a square groove, and the groove length of the through groove is equal to the frame length of the chassis shell. The third heat dissipation hole is an oval opening. There are two groups of the third heat dissipation holes, and each group has multiple third heat dissipation holes. The two groups of the third heat dissipation holes are arranged side by side. The third heat dissipation holes communicate the through groove and the reserved groove.
[0012] Preferably, the silica gel pad has a "匚"-shaped plate structure. The silica gel pad covers the bottom surface and the side wall of the through groove. Silica gel extension pieces are integrally formed on the two parallel side plates of the silica gel pad, and the silica gel extension pieces are fixed on the surface of the chassis shell.
[0013] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0014] The high-efficiency heat dissipation server chassis for AI digital humans proposed by the present invention forms an effective heat dissipation channel by providing the first heat dissipation holes on the two parallel inner walls of the chassis shell, which communicate with the reserved groove. Heat dissipation holes II are provided on both sides of the chassis shell, and heat dissipation fans are installed. Through the collaborative work of the heat dissipation fans, the hot air inside the chassis can be quickly led out to achieve high-efficiency heat dissipation. Through grooves and the third heat dissipation holes are provided on the top surface and the bottom surface of the chassis shell, further enhancing the heat dissipation effect. At the same time, the setting of the silica gel pad not only helps with heat dissipation but also increases the friction between the chassis and the supporting plate to prevent the chassis from sliding. Description of the Drawings
[0015] Figure 1 It is a schematic structural diagram of the present invention;
[0016] Figure 2 It is a schematic structural diagram of the connection between the chassis shell and the rear sealing plate of the present invention;
[0017] Figure 3 It is a side view of the structure of the present invention;
[0018] Figure 4 It is Figure 3 a sectional view of the structure at A-A in
[0019] Figure 5 It is Figure 4 an enlarged schematic diagram of the structure at A in
[0020] Figure 6This is a schematic diagram of the connection structure between the chassis shell and the angle plate of the present invention;
[0021] Figure 7 This is a schematic diagram of the connection structure between the plug strip and the rear sealing plate of the present invention;
[0022] Figure 8 This is a schematic diagram of the connection structure between the chassis shell and the fixing plate of the present invention;
[0023] Figure 9 It is a schematic diagram of the push plate structure of the present invention.
[0024] In the figure: chassis shell 1, fixing plate 2, reserved slot 3, angle plate 4, through-hole 5, plug strip 6, rear sealing plate 7, screw slot 8, screw 9, heat dissipation hole 1 10, heat dissipation hole 2 11, installation port 12, cooling fan 13, missing slot 14, screw 15, through-hole 16, heat dissipation hole 3 17, silicone pad 18, side slot 19, bolt port 20. DETAILED DESCRIPTION
[0025] In order to clearly and completely describe the objectives and technical solutions of the present invention and make the advantages more clearly understood, the embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, not all of them, and are only used to explain the embodiments of the present invention, not to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0026] See also Figures 1 to 9The present invention provides a technical solution: an efficient heat dissipation server chassis for ai digital people, comprising a chassis shell 1, a fixing plate 2 being fixed to the front end of the chassis shell 1, a reserved groove 3 being opened at the rear end of the chassis shell 1, the reserved groove 3 being an annular groove, angle plates 4 being fixed at the four corners inside the reserved groove 3, the angle plates 4 being an "L"-shaped plate structure, the plate length of the angle plates 4 being equal to the depth of the reserved groove 3, a through opening 5 being opened on the surface of the angle plates 4, the through opening 5 being an "L"-shaped opening, a plurality of through openings 5 being provided, and the plurality of through openings 5 being arranged at equal distances and equal sizes along the long sides of the angle plates 4, a rear sealing plate 7 being installed at the rear end of the chassis shell 1 by screws 9, a plugging strip 6 being inserted between two adjacent angle plates 4, the plugging strip 6 being fixed to the surface of the rear sealing plate 7, a screw groove 8 being opened at one end of the angle plate 4, the screw 9 passing through the rear sealing plate 7 and being screwed into the screw groove 8. Insert the host motherboard and its components into the chassis 1. The host motherboard and its components include: Processor: A high-performance Xeon processor with at least 12 physical cores and 24 threads. Memory: At least 128GB of DDR4 ECC memory, expandable to higher capacity as needed. Storage: A combination of high-speed SSD storage and large-capacity HDD storage to meet the requirements for data read and write speeds. GPU: A high-performance NVIDIA GPU, such as the Tesla series or Quadro series, to accelerate the training and inference of deep learning models. Network: A high-bandwidth, low-latency network connection, such as 10Gbps Ethernet or higher. Operating System: A Linux operating system, such as Ubuntu or CentOS. Processor and Memory Optimization: Leveraging the multi-threading capabilities of the high-performance Xeon processor, multiple AI digital human tasks can be processed in parallel, improving overall processing efficiency. 128GB of DDR4 ECC memory provides the AI digital human with ample memory resources to support the operation of more complex and larger-scale models. ECC memory also effectively prevents data errors and improves system stability. Storage strategy: High-speed SSD storage is used to store AI digital human model files and temporary data, ensuring high-speed data reading and writing, and improving the loading and inference speed of the model. Large-capacity HDD storage is used to store historical data and log files to meet the needs of long-term storage and backup. GPU acceleration: High-performance NVIDIA GPUs (such as the Tesla series or Quadro series) are key accelerators for AI digital human training and inference. Through the parallel computing capabilities of the GPU, the time for model training and inference can be significantly shortened, and the real-time performance of the system can be improved. High-bandwidth, low-latency network: 10Gbps Ethernet or higher bandwidth network connections can ensure the data transmission speed between AI digital humans and other systems (such as databases, user terminals, etc.), reduce communication delays, and improve the response speed of the system. Data security measures: Deploy security devices such as firewalls and intrusion detection systems on the server to prevent external attacks and data leaks. Encrypt sensitive data for storage and transmission to ensure data security.Back up data regularly to prevent data loss or corruption. Linux operating system: Choose a stable and reliable Linux operating system such as Ubuntu or CentOS to provide a stable operating environment for the AI digital human. The open source nature of the Linux system allows for easy installation and configuration of various AI-related software and libraries. Software environment configuration: Install AI-related programming languages and frameworks such as Python, TensorFlow, and PyTorch to provide the necessary software support for the development and operation of the AI digital human. Configure containerization technologies such as Docker to enable rapid deployment and version management of the AI digital human. Task allocation and scheduling: Rationally allocate tasks based on the AI digital human's capabilities and business needs. Leveraging the server's multi-core processing power, multiple tasks can be processed in parallel, improving overall processing efficiency. Use a task scheduling system (such as Kubernetes) to manage the AI digital human's task queue and resource allocation to ensure timely task execution and rational resource utilization. Monitoring and log analysis: Use monitoring tools (such as Prometheus and Grafana) to monitor server performance indicators (such as CPU usage, memory utilization, network bandwidth, etc.) in real time to promptly identify and resolve potential problems. Analyze log files to understand the operation status and performance bottlenecks of AI digital humans, providing a basis for optimization and improvement. Continuous integration and continuous deployment: Use CI / CD tools (such as Jenkins and GitLab CI) to achieve continuous integration and continuous deployment of AI digital humans, accelerate development and iteration, and improve system stability and reliability.
[0027] After the host motherboard and its components are pushed into the chassis shell 1, the rear sealing plate 7 is sealed at the rear end of the chassis shell 1. At this time, the plug strip 6 is inserted into the reserved groove 3, and then the screw 9 is passed through the reserved hole opened on the surface of the rear sealing plate 7 and screwed into the screw groove 8 to fix the rear sealing plate 7 to the thickness of the chassis shell 1, thereby protecting the host motherboard and its components.
[0028] On the two parallel inner walls of the chassis housing 1, there are heat dissipation holes one 10, the heat dissipation holes one 10 are oblong openings, the heat dissipation holes one 10 are connected to the reserved groove 3, on both sides of the chassis housing 1, there are heat dissipation holes two 11, on the outer wall of the chassis housing 1, there is a heat dissipation fan 13, on both sides of the chassis housing 1, there are installation openings 12, the heat dissipation fan 13 is inserted into the installation openings 12, on the top surface and the bottom surface of the chassis housing 1, there are missing grooves 14, on the surface of the missing grooves 14, there is a screw rod 15 screwed, and one end of the screw rod 15 is screwed on the surface of the heat dissipation fan 13. The heat dissipation holes two 11 and the heat dissipation holes one 10 form a heat dissipation structure on both sides of the chassis housing 1 to realize the heat discharge work inside the chassis housing 1. When it is necessary to quickly and efficiently dissipate heat from the chassis housing 1, the switch of the heat dissipation fan 13 is triggered, and the two heat dissipation fans 13 work together to draw out the hot air inside the chassis housing 1, that is, one heat dissipation fan 13 introduces external air into the chassis housing 1, and the other heat dissipation fan 13 discharges the hot air inside the chassis housing 1.
[0029] On the top surface and the bottom surface of the chassis housing 1, there are through grooves 16, on the surface of the through grooves 16, there are heat dissipation holes three 17, on the surface of the through grooves 16, there is a silica gel pad 18 fixed, the through grooves 16 are square grooves, the groove length of the through grooves 16 is equal to the frame length of the chassis housing 1, the heat dissipation holes three 17 are oblong openings, there are two groups of heat dissipation holes three 17, each group of heat dissipation holes three 17 has multiple ones, the two groups of heat dissipation holes three 17 are arranged side by side, the heat dissipation holes three 17 are connected to the through grooves 16 and the reserved groove 3, the silica gel pad 18 is in a "匚"-shaped plate structure, the silica gel pad 18 covers the bottom surface and the side wall of the through groove 16, on the two parallel side plates of the silica gel pad 18, there are silica gel extension pieces integrally formed, and the silica gel extension pieces are fixed on the surface of the chassis housing 1; the height of the chassis housing 1 is equal to the height of the fixing plate 2, at both ends of the fixing plate 2, there are bolt holes 20, the bolt holes 20 are oblong openings, on the top surface and the bottom surface of the bolt holes 20, there are side grooves 19, the side grooves 19 are connected to the through grooves 16, and the height of the side grooves 19 is equal to the height of the through grooves 16. When the chassis housing 1 is placed on the main cabinet, the two sides of the bottom surface of the chassis housing 1 are lapped on the supporting plate of the main cabinet, at this time, the through groove 16 does not contact the supporting plate, reducing the contact area between the chassis housing 1 and the supporting plate. After the heat dissipation holes three 17 draw out the heat inside the chassis housing 1, it is adsorbed by the silica gel pad 18 and then dissipated, and the silica gel pad 18 increases the friction between the chassis housing 1 and the supporting plate, avoiding the chassis housing 1 from sliding on the supporting plate.
[0030] The usage process of the high-efficiency heat dissipation server chassis for AI digital humans is as follows:
[0031] Make sure the host's motherboard, processor (high-performance Xeon processor), memory (at least 128GB DDR4ECC memory), storage (high-speed SSD and large-capacity HDD), GPU (high-performance NVIDIA GPU), network card and other hardware are ready. Install the operating system (Linux, such as Ubuntu or CentOS), and configure the necessary AI-related software and libraries (such as Python, TensorFlow, PyTorch). Assemble the motherboard and its components in the usual way, and ensure that all hardware connections are correct and function normally. Open the front of the chassis shell 1 and temporarily remove or fix the fixing plate 2 in place. Carefully push the assembled motherboard and its components into the chassis shell 1 to ensure that the components do not collide with the inside of the chassis. Insert the plug strip 6 between the two adjacent angle panels 4, ensuring that the plug strip 6 fits tightly against the angle panel 4. Align the rear sealing plate 7 with the rear end of the chassis shell 1, and ensure that the plug strip 6 is inserted into the reserved slot 3. Use screws 9 to penetrate the reserved holes on the surface of the rear cover 7, screw them into the screw grooves 8 of the angle plate 4, and fix the rear cover 7 to the chassis shell 1. Insert the cooling fan 13 into the mounting holes 12 on both sides of the chassis shell 1. Use screws 15 to fix the cooling fan 13 to the outer wall of the chassis shell 1, ensuring that the cooling fan 13 is stable and does not shake. Seal the silicone pad 18 on the through grooves 16 on the top and bottom surfaces of the chassis shell 1, ensuring that the silicone pad 18 fits tightly with the through groove 16. Check whether the silicone extension piece is firmly fixed to the surface of the chassis shell 1. Connect the power cord, start the server, and ensure that the system starts normally and enters the Linux operating system. Install and configure AI-related programming languages and frameworks (such as Python, TensorFlow, PyTorch) as required. Configure containerization technologies such as Docker to achieve rapid deployment and version management of AI digital humans. Rationally allocate tasks based on the capabilities and business needs of AI digital humans. Use a task scheduling system (such as Kubernetes) to manage the task queue and resource allocation of AI digital humans. Use monitoring tools (such as Prometheus and Grafana) to monitor the performance indicators of the server in real time. Analyze log files to understand the operation status and performance bottlenecks of the AI digital human. When fast and efficient heat dissipation is required, trigger the switch of the cooling fan 13 to ensure that the two cooling fans 13 work together. Regularly check the cleanliness of the heat dissipation holes and the cooling fans to ensure good heat dissipation. Deploy security devices such as firewalls and intrusion detection systems to prevent external attacks and data leaks. Encrypt sensitive data for storage and transmission to ensure data security. Back up data regularly to prevent data loss or damage. Use CI / CD tools (such as Jenkins and GitLab CI) to achieve continuous integration and continuous deployment of AI digital humans. Speed up development and iteration and improve system stability and reliability. Regularly check the hardware connections inside the chassis to ensure that all components are firmly connected. Clean the dust and debris inside the chassis to keep the inside of the chassis clean and the heat dissipation effect.
[0032] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.
Claims
1. An efficient heat dissipation server chassis for AI digital humans, comprising a chassis shell (1), a fixing plate (2) fixed to the front end of the chassis shell (1), characterized in that: A reserved groove (3) is provided at the rear end of the chassis housing (1). The rear end of the chassis housing (1) is installed with a rear sealing plate (7) by screws (9). Heat dissipation holes one (10) are provided on both inner walls of the chassis housing (1) that are parallelly distributed. A heat dissipation fan (13) is installed on the outer wall of the chassis housing (1). Through grooves (16) are provided on both the top surface and the bottom surface of the chassis housing (1). Heat dissipation holes three (17) are provided on the surface of the through groove (16). A silica gel pad (18) is fixed on the surface of the through groove (16).
2. The high-efficiency heat dissipation server chassis for AI digital humans according to claim 1, characterized in that: The height of the chassis housing (1) is equal to the height of the fixing plate (2). Bolt holes (20) are provided at both ends of the fixing plate (2). The bolt holes (20) are oblong holes. Edge grooves (19) are provided on both the top surface and the bottom surface of the bolt holes (20). The edge grooves (19) are communicated with the through grooves (16), and the height of the edge grooves (19) is equal to the height of the through grooves (16).
3. The high-efficiency heat dissipation server chassis for AI digital humans according to claim 1, characterized in that: The reserved groove (3) is an annular groove. Angle plates (4) are fixed at the four corners inside the reserved groove (3). The angle plates (4) are in an "L"-shaped plate structure. The plate length of the angle plates (4) is equal to the depth of the reserved groove (3). Through holes (5) are provided on the surface of the angle plates (4). The through holes (5) are in an "L"-shaped hole. There are multiple through holes (5), and the multiple through holes (5) are arranged in an equidistant and equal-size manner along the long side of the angle plates (4).
4. The high-efficiency heat dissipation server chassis for AI digital humans according to claim 3, characterized in that: A plug strip (6) is inserted between two adjacent angle plates (4). The plug strip (6) is fixed on the surface of the rear sealing plate (7). A screwing groove (8) is provided at one end of the angle plate (4). The screw (9) penetrates through the rear sealing plate (7) and is screwed into the screwing groove (8).
5. The high-efficiency heat dissipation server chassis for AI digital humans according to claim 1, characterized in that: The heat dissipation holes one (10) are oblong holes. The heat dissipation holes one (10) are communicated with the reserved groove (3). Heat dissipation holes two (11) are provided on both sides of the chassis housing (1).
6. The high-efficiency heat dissipation server chassis for AI digital humans according to claim 1, characterized in that: Installation openings (12) are provided on both sides of the chassis housing (1). The heat dissipation fan (13) is inserted into the installation openings (12). Missing grooves (14) are provided on both the top surface and the bottom surface of the chassis housing (1). A screw rod (15) is screwed on the surface of the missing groove (14). One end of the screw rod (15) is screwed on the surface of the heat dissipation fan (13).
7. The high-efficiency heat dissipation server chassis for AI digital humans according to claim 1, characterized in that: The through groove (16) is a square groove. The groove length of the through groove (16) is equal to the frame length of the chassis housing (1). The heat dissipation holes three (17) are oblong holes. There are two groups of heat dissipation holes three (17), and each group has multiple heat dissipation holes three (17). The two groups of heat dissipation holes three (17) are arranged side by side. The heat dissipation holes three (17) are communicated with the through groove (16) and the reserved groove (3).
8. The high-efficiency heat dissipation server chassis for AI digital humans according to claim 1, characterized in that: The silica gel pad (18) is in a "匚"-shaped plate structure. The silica gel pad (18) covers the bottom surface and the side wall of the through groove (16). Silica gel extension pieces are integrally formed on two parallel side plates of the silica gel pad (18), and the silica gel extension pieces are fixed on the surface of the chassis housing (1).