A CPU protection device for reinforcing a computer

Abstract

The application relates to a CPU protection device for reinforcing a computer applied to the field of electronic digital data processing, which is characterized in that a flexible sleeve is arranged between a CPU and a water cooling head of a water cooling radiator, the inside of the flexible sleeve is filled with low-viscosity heat-conducting silicone grease, dynamic heat transfer is carried out between the water cooling head and the CPU by using the flowing heat-conducting silicone grease, the problem that the heat-conducting performance is reduced or even lost due to hardening of the heat-conducting silicone grease is effectively avoided, the softness and the heat-conducting performance of the heat-conducting silicone grease are maintained, the heat absorption and heat dissipation effect on the CPU is effectively improved, and the flowing heat-conducting silicone grease in the application will sequentially carry out two heat exchange processes with the water cooling head and a cold plate and then carry out heat exchange with the CPU; compared with the single heat exchange technology of the water cooling head in the prior art, the heat-conducting silicone grease in the application has a greater temperature difference with the CPU, has a higher heat exchange effect on the CPU, and therefore the heat absorption and heat dissipation effect on the CPU is further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a CPU protection device, in particular to a CPU protection device for reinforcing a computer applied to the field of electronic digital data processing. BACKGROUND

[0002] The central processing unit (CPU) is one of the main devices of the electronic computer, the core component in the computer, which controls and allocates all hardware resources (such as memory, input and output units) of the computer and performs general-purpose operations.

[0003] With the continuous improvement of CPU performance, the heat generated by the CPU is also increasing. The heat dissipation device commonly used to solve this problem is a CPU water cooling radiator, which uses liquid to be forced to circulate under the drive of a pump to take away the heat of the radiator. The water cooling radiator generally includes a water cooling head, a cooling row, a water pipe, a water pump and a water tank, wherein the water cooling head needs to be attached to the surface of the CPU by using thermal silicone grease.

[0004] As disclosed in the specification of Chinese patent CN212364947U, an ultra-quiet high-efficiency heat dissipation water cooling circulation CPU radiator includes a heat dissipation base, a thermal silicone grease layer and a CPU are sequentially arranged at the bottom of the heat dissipation base, and the CPU is bonded to the heat dissipation base through the thermal silicone grease layer, a first heat insulation plate is fixedly installed at the top of the right side of the heat dissipation base and is arranged directly above the heat dissipation fins, a water tank is fixedly installed on the first heat insulation plate, and a water pump is arranged in the water tank, and the water outlet of the water pump penetrates the water tank and is threadedly connected with a circulation pipe. The ultra-quiet high-efficiency heat dissipation water cooling circulation CPU radiator achieves the maximum area cooling effect by winding the circulation pipe in a U-shaped structure, and the circulation pipe also winds in a U-shaped structure after extending upward. Through the heat dissipation fan, the heat dissipation fins and the circulating water in the circulation pipe achieve rapid and large-area cooling effect, and the heat dissipation performance is high.

[0005] As disclosed in the specification of Chinese patent CN112269448B, an intelligent manufacturing CPU heat dissipation mounting device includes a shell, a sliding groove is fixedly installed in the inside of the shell, a sliding ball is slidingly connected in the inside of the sliding groove, a limiting rod is fixedly installed at the opposite end of the sliding ball, a spring is fixedly installed at the end of the sliding ball away from the limiting rod, a sliding pin is slidingly connected at the middle of the left and right sides of the shell, a torsion spring is fixedly installed at the upper end of the sliding pin on the left and right sides of the shell, and a ball valve is fixedly installed at the rear end of the torsion spring. The intelligent manufacturing CPU heat dissipation mounting device can fix the CPU through the suction cup, has good fixing effect, prevents the equipment from being stuck due to the application of silicone grease, automatically cools the CPU when the temperature of the CPU rises, adjusts the air cooling speed according to the temperature change amplitude, and has higher practicality.

[0006] The existing water-cooled radiator for cooling CPU is mostly coated with thermal conductive silicone grease to make the water-cooled head and CPU contact, which can transmit the heat of CPU to the water-cooled head through the thermal conductive silicone grease, but the thermal conductive silicone grease will gradually harden and the thermal conductivity will decrease after a period of use, which affects the cooling effect of CPU. SUMMARY

[0007] In view of the above prior art, the technical problem to be solved by the present application is that the thermal conductive silicone grease between the water-cooled head of the existing water-cooled radiator and the CPU will harden and the thermal conductivity will decrease during use, which affects the cooling effect of CPU.

[0008] To solve the above problems, the present application provides a CPU protection device for a ruggedized computer, which comprises a pair of vertical plates arranged on the upper side of the mainboard, and the vertical plates are respectively located on the left and right sides of the CPU, a flexible sleeve is fixedly connected between the pair of vertical plates, the flexible sleeve is located between the CPU and the water-cooled head of the water-cooled radiator and is attached to the surfaces of the two, the inside of the flexible sleeve is filled with low-viscosity thermal conductive silicone grease, a heat insulation plate is arranged inside the flexible sleeve between the pair of vertical plates, the left and right side ends of the heat insulation plate are connected with the vertical plates, and the other pair of side ends are fixedly connected with the inner wall of the flexible sleeve, the inside space of the flexible sleeve is divided into an upper area and a lower area by the heat insulation plate, a plurality of drainage holes are arranged on one end of the heat insulation plate, and the low-viscosity thermal conductive silicone grease in the flexible sleeve flows between the upper area and the lower area through the drainage holes.

[0009] One side of one of the vertical plates away from the flexible sleeve is provided with a delivery pump, the inlet end of the delivery pump is fixedly penetrated through the vertical plate and communicates with the lower area inside the flexible sleeve, the outlet end of the delivery pump is fixedly communicated with a shunt pipe, the pipe end of the shunt pipe is fixedly penetrated through the flexible sleeve and communicates with the upper area inside the flexible sleeve, a mounting hole is arranged on the other vertical plate, a cold plate is fixedly connected in the mounting hole, the cold end of a refrigeration device is fixedly connected to the end of the cold plate away from the vertical plate, and the mounting hole communicates with the lower area inside the flexible sleeve.

[0010] As a further supplement to the present application, the heat insulation plate is in a U-shaped structure, the drainage holes are arranged on the top area of the side of the heat insulation plate away from the delivery pump, a pair of temperature sensors are fixedly connected to the outer ends of the heat insulation plate, and the pair of temperature sensors are arranged on the bottom area of the pair of side ends of the heat insulation plate.

[0011] As a further supplement to the present application, a pair of hole plates are fixedly connected to the pair of side ends of the vertical plate, a plurality of mounting holes are arranged on the mainboard and distributed around the CPU, bolts are inserted into the mounting holes, and the hole plates are sleeved on the outer ends of the bolts and fixed by nuts.

[0012] As a further supplement to the present application, one end of the cold plate extends from the mounting hole to the outside world, the upper end of the cold plate is provided with an upper inclined surface, the side end of the cold plate is provided with a side inclined surface connected with the edge of the upper inclined surface, the side end of the vertical plate with the cold plate is fixedly connected with a humidity sensor, the sensing end of the humidity sensor is fixedly connected with a water-absorbing cotton, and the water-absorbing cotton is attached to the surface of the side inclined surface.

[0013] As a further supplement to the present application, the heat shield is fixedly connected to the end of the refrigerator away from the vertical plate, and the heat shield is sleeved on the outside of the hot end of the refrigerator.

[0014] As a further improvement of the present application, the heat shield includes a plate body and a pair of flexible cloth, the plate body is fixedly connected between the pair of flexible cloth, the end of the flexible cloth away from the plate body is fixedly connected with the inner wall of the flexible sleeve, and the drainage hole is arranged in the top area of the side of the plate body away from the delivery pump.

[0015] As a further improvement of the present application, the top of the left and right ends of the plate body is fixedly connected with a pair of sliding plates, the end of the vertical plate close to the flexible sleeve is provided with a pair of sliding grooves, and the plurality of sliding plates are respectively slidingly connected in the plurality of sliding grooves.

[0016] As a further improvement of the present application, the lower inner wall of the sliding groove is fixedly connected with an electric telescopic rod and a sealing cover, the sealing cover is sleeved on the outside of the electric telescopic rod, the telescopic end of the electric telescopic rod is movably penetrated through the sealing cover and fixedly connected with the lower end of the sliding plate.

[0017] In summary, the present application uses flowing heat-conducting silicone grease to perform dynamic heat transfer between the water cooling head and the CPU, effectively avoiding the problem of heat conduction performance decline or even loss caused by hardening of the heat-conducting silicone grease, maintaining the softness and heat conduction performance of the heat-conducting silicone grease, effectively improving the heat absorption and dissipation effect on the CPU. On the other hand, the flexible and flowing heat-conducting silicone grease in the present application will sequentially perform two heat exchange processes with the water cooling head and the cold plate, and then perform heat exchange with the CPU. Compared with the single heat exchange technology relying on the water cooling head in the prior art, the heat-conducting silicone grease in the present application has a larger temperature difference with the CPU, and has a more efficient heat exchange effect on the CPU, thereby further improving the heat absorption and dissipation effect on the CPU. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a perspective view of the installation of the first and second embodiments of the present application;

[0019] Figure 2 It is a perspective view of the installation of the first and second embodiments of the present application;

[0020] Figure 3 It is a front structure schematic of the installation of the first embodiment of the present application Figure 1 ;

[0021] Figure 4Fig. 1 is a perspective view of the heat insulation plate in the first embodiment of the present application;

[0022] Figure 5 Fig. 4 is a schematic view of the front structure when the heat insulation plate is used in the first embodiment of the present application;

[0023] Figure 6 Fig. 5 is a schematic view of the front structure after installation in the first embodiment of the present application Figure 2 ;

[0024] Figure 7 Fig. 6 is an exploded view of the refrigerator in the first embodiment of the present application;

[0025] Figure 8 Fig. 11 is a perspective view before installation in the second embodiment of the present application;

[0026] Figure 9 Fig. 12 is a perspective view of the heat insulation plate in the second embodiment of the present application;

[0027] Figure 10 Fig. 13 is a schematic view of the front structure after installation in the second embodiment of the present application;

[0028] Figure 11 Fig. 14 is a schematic view of the front structure when the heat insulation plate is adjusted in the second embodiment of the present application.

[0029] Explanation of reference numerals in the drawings:

[0030] 1 stand plate, 101 hole plate, 102 sliding groove, 2 flexible sleeve, 3 refrigerator, 301 heat insulation cover, 4 delivery pump, 5 shunt pipe, 6 cold plate, 601 upper inclined surface, 602 side inclined surface, 7 humidity sensor, 701 water absorbing cotton, 8 bolt, 9 heat insulation plate, 901 drainage hole, 91 plate body, 92 flexible cloth, 10 temperature sensor, 11 sliding plate, 12 electric telescopic rod, 13 sealing cover, 14 magnetic bar. DETAILED DESCRIPTION

[0031] The two embodiments of the present application will be described in detail below with reference to the drawings.

[0032] First embodiment:

[0033] The present application provides a CPU protection device for reinforcing a computer, please refer to Figure 1 and Figure 2(As shown in the figure, M represents a mainboard for installing a computer CPU, N represents the computer CPU, and K represents a water cooling head of a water cooling radiator installed on the computer), comprising a pair of vertical plates 1 arranged on the upper side of the mainboard, and the pair of vertical plates 1 are respectively located on the left and right sides of the CPU, and a flexible sleeve 2 is fixedly connected between the pair of vertical plates 1, the flexible sleeve 2 is located between the CPU and the water cooling head of the water cooling radiator, the position where the lower end of the flexible sleeve 2 is connected with the vertical plate 1 is close to the bottom edge of the vertical plate 1, and the position where the upper end of the flexible sleeve 2 is connected with the vertical plate 1 is close to the top edge of the vertical plate 1, so that the CPU and the water cooling head are pressed together, the flexible sleeve 2 is conveniently in a taut state, and is in close contact with the surfaces of the CPU and the water cooling head, and the inside of the flexible sleeve 2 is filled with low-viscosity heat-conducting silicone grease, such as silicone grease with a viscosity lower than 5000 cp, and the heat-conducting silicone grease has good fluidity, so that dynamic heat transfer between the CPU and the water cooling head is facilitated.

[0034] Please refer to Figure 3 and Figure 4 A heat insulation plate 9 is further arranged between the pair of vertical plates 1 and located inside the flexible sleeve 2, the left and right side ends of the heat insulation plate 9 are respectively connected with the pair of vertical plates 1, the other side end is fixedly connected with the inner wall of the flexible sleeve 2, the inside space of the flexible sleeve 2 is divided into an upper region and a lower region by the heat insulation plate 9, and the heat insulation plate 9 is made of heat insulation material, such as glass fiber plate, so that the heat-conducting silicone grease in the upper and lower regions is not easy to exchange heat with each other, the flexible sleeve 2 is made of heat-conducting material, such as flexible heat-conducting film, one end of the heat insulation plate 9 is provided with uniformly distributed drainage holes 901, and the heat insulation plate 9 has a U-shaped structure, and the drainage holes 901 are arranged at the top region of the heat insulation plate 9 away from the delivery pump 4.

[0035] One of the vertical plates 1 is provided with a delivery pump 4 away from the flexible sleeve 2, the inlet end of the delivery pump 4 is fixedly penetrated through the vertical plate 1 and communicates with the lower region inside the flexible sleeve 2, the outlet end of the delivery pump 4 is fixedly communicated with a shunt pipe 5, the pipe end of the shunt pipe 5 is fixedly penetrated through the flexible sleeve 2 and communicates with the upper region inside the flexible sleeve 2, and the low-viscosity heat-conducting silicone grease inside the flexible sleeve 2 flows between the upper region and the lower region through the drainage holes 901 and the transmission of the delivery pump 4, that is, as shown in Figure 5 , the delivery pump 4 sucks the heat-conducting silicone grease in the lower region, inputs it into the upper region through the shunt pipe 5, so that the content of the heat-conducting silicone grease in the upper region increases, and the excessive heat-conducting silicone grease enters the lower region with low pressure through the drainage holes 901, thereby realizing dynamic transfer of the heat of the CPU;

[0036] The delivery pump 4 has two installation modes, one is installed on the vertical plate 1 through a bolt fastener (as shown in Figure 1As shown, the second kind of installation mode can effectively reduce the influence of the existence of the delivery pump 4 on the installation of other elements on the mainboard, and can facilitate the installation of the vertical plate 1, and the second kind of installation mode can be preferred.

[0037] Another vertical plate 1 is provided with a mounting hole, and a cold plate 6 is fixedly connected inside the mounting hole. The cold plate 6 is fixedly connected with the cold end of the refrigeration device 3 away from the vertical plate 1. The refrigeration device 3 can adopt a semiconductor refrigeration sheet. The cold plate 6 is made of a heat-conducting material, which facilitates heat exchange with the cold end of the refrigeration device 3 and keeps itself in a low-temperature state. The mounting hole is in communication with the lower area inside the flexible sleeve 2, so that the heat-conducting silicone grease in the lower area can directly contact the cold plate 6 for cooling.

[0038] In the prior art, a layer of heat-conducting silicone grease is usually applied on the surface of the CPU, and then the water cooling head of the water-cooled radiator is attached to the heat-conducting silicone grease, so that the heat of the CPU is transmitted to the water cooling head through the heat-conducting silicone grease. However, this method has the following defects: the heat-conducting silicone grease will gradually dry and harden during use, which will significantly reduce its heat-conducting performance, and this will affect the heat dissipation of the CPU. Therefore, based on the above-mentioned existing problems, the present application realizes a dynamic heat transfer process of the heat-conducting silicone grease, which is as follows:

[0039] In combination Figure 5 As shown, during the circulation and delivery process of the heat-conducting silicone grease by the delivery pump 4, the inlet end of the delivery pump 4 will suck the heat-conducting silicone grease in the lower area inside the flexible sleeve 2, so that the heat-conducting silicone grease in the lower area flows horizontally under the heat insulation plate 9 from the refrigeration device 3 to the delivery pump 4, that is, it flows horizontally on the upper side of the CPU through the flexible sleeve 2, absorbs the heat of the CPU, and then the delivery pump 4 sucks out the heat-conducting silicone grease in the lower area which has been heated and absorbs heat, and transmits it to the upper area through the shunt pipe 5. At the same time, the heat-conducting silicone grease in the upper area exchanges heat with the water cooling head through the flexible sleeve 2, transfers its heat to the water cooling head, and realizes the first cooling and temperature reduction. Then the shunt pipe 5 continuously outputs the heat-conducting silicone grease, which has been cooled by the water cooling head, and the heat-conducting silicone grease flows horizontally on the upper side of the CPU again through the drainage hole 901, thereby realizing the dynamic cooling of the heat-conducting silicone grease on the CPU, effectively avoiding the problem of hardening of the heat-conducting silicone grease which leads to a decrease in heat-conducting performance or even loss of heat, and maintaining the softness and heat-conducting performance of the heat-conducting silicone grease.

[0040] And, in the above process, if the CPU is lightly heated (judged by the monitoring data of the temperature sensor 10 described below), the cooler 3 does not need to be started, and the existing water-cooled head can rely on the flowing heat-conducting silicone grease to perform a cooling effect, and if the CPU is severely heated, the cooler 3 is automatically started, at which time the cold end of the cooler 3 will cool the cold plate 6, and the cold plate 6 will transfer low temperature to the heat-conducting silicone grease in the lower area, so that the heat-conducting silicone grease in the lower area will be subjected to a second cooling effect of the cooler 3 and the cold plate 6, increasing the temperature difference between the heat-conducting silicone grease and the CPU. Finally, the low-temperature heat-conducting silicone grease after the two cooling processes flows horizontally on the top of the CPU, achieving high-efficiency cooling effect on the CPU.

[0041] Please refer to Figure 3 and Figure 5 The outer end of the heat insulation plate 9 is fixedly connected with a pair of temperature sensors 10, and the temperature sensor 10 and the cooler 3 are connected with the computer system. One of the pair of temperature sensors 10 is arranged at the bottom of one side end of the heat insulation plate 9, and the other temperature sensor 10 is arranged at the bottom of the other side end of the heat insulation plate 9. One of the pair of temperature sensors 10 is located in the area close to the cold plate 6, and the heat-conducting silicone grease in this area has been cooled once or twice. The other temperature sensor 10 is located in the area close to the conveying pump 4, and the heat-conducting silicone grease in this area has been heat-exchanged with the CPU. The temperature of the heat-conducting silicone grease in the area where the pair of temperature sensors 10 are arranged is monitored respectively, which can effectively judge the heat-exchange cooling effect of the heat-conducting silicone grease on the CPU and the cooling effect of the water-cooled head or the cold plate 6 on the heat-conducting silicone grease, and facilitate corresponding processing, which specifically includes but is not limited to the following cases: case one, if the temperature data monitored by the temperature sensor 10 close to the conveying pump 4 exceeds the preset value without starting the cooler 3, it can be indicated to a certain extent that the CPU temperature is high (i.e. the above-mentioned severe heating) or the cooling effect of the water-cooled head is insufficient, at which time the cooler 3 is automatically started, so that the flowing heat-conducting silicone grease is subjected to two cooling effects, and when the monitoring data of the temperature sensor 10 returns to the normal range, the operation of the cooler 3 is closed; case two, if the temperature data monitored by the temperature sensor 10 close to the cold plate 6 is too high while the cooler 3 is started, it can be indicated to a certain extent that the cooling effect of the water-cooled head and the cold plate 6 on the heat-conducting silicone grease is poor, at which time the running speed of the cooler 3 can be increased to improve the cooling efficiency.

[0042] Combined with Figure 1 and Figure 2As shown, the pair of side ends of the vertical plate 1 are fixedly connected with the hole plate 101, a plurality of mounting holes distributed around the CPU are formed on the main plate, the bolt 8 is inserted in the mounting hole, the hole plate 101 is sleeved on the outer end of the bolt 8 and is fixed through the nut, the mounting mode of the application comprises the following: before the water cooling head of the water cooling radiator is mounted, the pair of vertical plates 1 are unfolded and are respectively arranged on the two sides of the CPU on the main plate, and the hole plate 101 is sleeved on the outer side of the bolt 8, the vertical plate 1 is positioned and fixed, in this process, the flexible sleeve 2 is unfolded, the bottom of the flexible sleeve 2 covers the upper end of the CPU, the flexible sleeve 2 is manually adjusted, so that the part of the lower end of the flexible sleeve 2 in contact with the CPU is in a flat state (the excess flexible sleeve 2 extends to the four sides of the CPU and has no influence), after the vertical plate 1 is fixed, the water cooling head is pressed on the upper end of the flexible sleeve 2, and the flexible sleeve 2 is manually adjusted again, so that the part of the upper end of the flexible sleeve 2 in contact with the water cooling head is in a flat state, the flexible sleeve 2 is in a normal taut state as a whole, the heat insulation plate 9 is in a suspended state in the flexible sleeve 2, and there is a gap between the upper and lower inner walls of the flexible sleeve 2, so that the flow of the heat-conducting silicone grease is facilitated, after the water cooling head is attached and pressed on the upper end of the flexible sleeve 2, the water cooling head is fixed on the main plate in the existing mode (that is, the buckle is mounted on the water cooling head, and the buckle is connected with the main plate through the screw).

[0043] Supplementary explanation: the bolt 8 is inserted into the mounting hole from the back of the main plate, the vertical plate 1 is installed in the empty part around the CPU, does not cause influence and damage to the remaining elements on the front of the main plate, and when the vertical plate 1 is installed, the vertical plate 1 can be directly placed on the upper end of the main plate and attached to each other, or a gasket with a certain thickness can be sleeved on the outer end of the bolt 8 in advance, and then the hole plate 101 is sleeved on the bolt 8, at this time, the vertical plate 1 can be lifted through the thickness of the gasket, as shown in Figure 6 , which can be applied to a thicker CPU (N' in Figure 6 ), so that the heat insulation plate 9 is not easy to contact the upper end of the CPU, and the application range of the application can be improved to a certain extent, and the vertical plate 1 is not easy to cause influence to other elements.

[0044] In combination with Figure 6 and Figure 7The upper end of the cold plate 6 is provided with an upper inclined surface 601, and the side end of the cold plate 6 is provided with a side inclined surface 602 connected with the edge of the upper inclined surface 601. The side end of the vertical plate 1 with the cold plate 6 is fixedly connected with a humidity sensor 7. The sensing end of the humidity sensor 7 is fixedly connected with a water-absorbing cotton 701, and the water-absorbing cotton 701 is attached to the surface of the side inclined surface 602. The cold plate 6 extending to the outside has a condensation effect on the humidity in the environment where the mainboard is located. The humidity condenses into water droplets on the surfaces of the upper inclined surface 601 and the side inclined surface 602, and flows downward along the inclined surfaces of the two surfaces, gathers into large water droplets and flows to the water-absorbing cotton 701, which is absorbed by the water-absorbing cotton 701, so that the humidity data monitored by the sensing end of the humidity sensor 7 increases significantly. The humidity sensor 7 is connected with the computer system, and the abnormal humidity data is transmitted to the computer system, so that the user can be informed in time. The water droplets on the surface of the cold plate 6 can be cleaned manually, thereby having a certain dehumidification effect on the environment where the mainboard is located, improving the protection of the mainboard and electrical elements, and when the humidity data of the humidity sensor 7 increases significantly frequently, it can be used as a reminding means to remind the user that the environment where the computer is located has high humidity, so that the user can perform additional moisture-proof treatment on the computer.

[0045] The heat shield 301 is made of hard thermal insulation material, such as polyurethane foam board, so that the heat of the hot end of the refrigerator 3 is not easily quickly dissipated to the environment where the mainboard is located, and is not easy to affect the use of the mainboard and other electrical elements.

[0046] The second embodiment:

[0047] Based on the first embodiment, the heat insulation plate 9 is provided with the following settings and the sliding plate 11, the electric telescopic rod 12 and the like are additionally provided, and the specific implementation is as follows: please refer to Figure 8 and Figure 9 The heat insulation plate 9 includes a plate body 91 and a pair of flexible cloth 92. The plate body 91 is fixedly connected between the pair of flexible cloth 92. The end of the flexible cloth 92 away from the plate body 91 is fixedly connected with the inner wall of the flexible sleeve 2, and the flexible cloth 92 is in a relaxed state. The plate body 91 can be made of glass fiber plate, and the flexible cloth 92 can be made of glass fiber cloth. The drainage hole 901 is arranged at the top region of the side of the plate body 91 away from the delivery pump 4. The plate body 91 is fixedly connected with a pair of sliding plates 11 at the top of the left and right ends. A pair of sliding grooves 102 are arranged at the end of the vertical plate 1 close to the flexible sleeve 2. A plurality of sliding plates 11 are respectively and slidably connected in the plurality of sliding grooves 102. Please refer to Figure 10The lower inner wall of the chute 102 is fixedly connected with an electric telescopic rod 12 and a sealing cover 13, and the sealing cover 13 covers the outer side of the electric telescopic rod 12, the telescopic end of the electric telescopic rod 12 is movably penetrated through the sealing cover 13 and is fixedly connected with the lower end of the sliding plate 11, the lower end of the heat insulation plate 9 is fixedly connected with a pair of magnetic rods 14, and the pair of magnetic rods 14 are respectively located on the left and right sides of the bottom of the heat insulation plate 9, and the lower end of the flexible sleeve 2 is also fixedly connected with a plurality of magnetic rods 14, and the plurality of magnetic rods 14 are dispersedly arranged on the left and right sides of the lower end of the flexible sleeve 2, so as not to easily affect the close contact between the lower end surface of the flexible sleeve 2 and the CPU, the magnetic rods 14 adopt a transverse magnetic pole distribution mode, and the magnetic rods 14 on the heat insulation plate 9 and the magnetic rods 14 on the flexible sleeve 2 have a mutual repulsion magnetic force.

[0048] Since different CPUs may have certain thickness differences, the first embodiment can increase the gasket on the bolt 8 to raise the position of the vertical plate 1, thereby preliminarily improving the application range (mainly applicable to the case that the CPU is relatively thick), and the present embodiment further ensures the suspended state of the heat insulation plate 9 inside the flexible sleeve 2 and improves the use range of the application, by the arrangement of the upper segment structure, the heat insulation plate 9 has a certain up-down position adjustment function, and can be better applied to the CPU with a smaller thickness. Figure 11 The present embodiment is indicated by n, and the specific implementation is as follows: in combination with Figure 10 and Figure 11 During the process of installing the vertical plate 1 and making the lower surface of the flexible sleeve 2 close to the CPU, the electric telescopic rod 12 can be started to drive the heat insulation plate 9 to move upward or downward, the position of the heat insulation plate 9 is adjusted, the heat insulation plate 9 is not easy to be in contact with the upper end of the CPU, and a proper gap, such as 1-2 mm, is left therebetween, so as to facilitate the flow of the heat-conducting silicone grease. In order to improve the sufficiency of the contact between the lower end of the flexible sleeve 2 and the CPU, the present embodiment further provides the magnetic rods 14, so that the excess flexible sleeve 2 on the left and right sides of the CPU is concave downward under the magnetic repulsion force, so that the flexible sleeve 2 on the upper side of the CPU is in a tight state, and the two are in full contact, thereby facilitating the heat exchange between the heat-conducting silicone grease and the CPU.

[0049] In combination with the current actual demand, the above-mentioned embodiments of the present application are not limited to the scope, and various changes made within the knowledge range of the person skilled in the art without departing from the concept of the present application still fall within the protection scope of the present application.

Claims

1. A CPU protection device for ruggedizing computers, characterized in that: The utility model provides a water cooling heat radiator for CPU, including setting a pair of stand (1) on the upper side of mainboard, and a pair of stand (1) is located CPU's left and right sides respectively, a pair of described stand (1) between fixedly connected with flexible sleeve (2), flexible sleeve (2) is located CPU and the water cooling head of water cooling radiator between and with two surface surface adjoins, the inside filling of flexible sleeve (2) has low viscosity heat conduction silicone grease, a pair of described stand (1) between still be equipped with the heat insulation board (9) in flexible sleeve (2) inboard, the left and right sides end of heat insulation board (9) is connected with a pair of stand (1) respectively, and its other pair of side end is fixedly connected with the inner wall of flexible sleeve (2), through heat insulation board (9) the inboard space of flexible sleeve (2) is divided into upper area and lower area, one end of heat insulation board (9) is equipped with the drainage hole (901) of evenly distribution, and the low viscosity heat conduction silicone grease in the inside of flexible sleeve (2) passes through drainage hole (901) and circulates between upper area and lower area, one of a pair of described stand (1) is equipped with the delivery pump (4) on the side away from flexible sleeve (2), and the import end of delivery pump (4) is fixedly penetrated stand (1) and is communicated with the lower area inboard of flexible sleeve (2), and the outlet end of delivery pump (4) is fixedly communicated with the shunt pipe (5), and the pipe orifice end of shunt pipe (5) is fixedly penetrated flexible sleeve (2) and is communicated with the upper area inboard thereof, and the other one of a pair of described stand (1) is equipped with the mounting hole, and the inside fixedly connected with cold plate (6) of mounting hole, and the cold end of refrigerating machine (3) is fixedly connected with the end away from stand (1) of cold plate (6), and the mounting hole is communicated with the lower area inboard of flexible sleeve (2).

2. The CPU protection device for reinforcing a computer according to claim 1, characterized by: The heat insulation board (9) is in U-shaped structure, the drainage hole (901) is arranged on the top region of the heat insulation board (9) away from the delivery pump (4), and a pair of temperature sensors (10) are fixedly connected to the outer ends of the heat insulation board (9) and arranged at the bottom regions of the opposite side ends of the heat insulation board (9).

3. The CPU protection device for reinforcing a computer according to claim 1, wherein: The opposite side ends of the stand (1) are fixedly connected with the hole plate (101), a plurality of mounting holes are arranged on the mainboard and distributed around the CPU, the bolts (8) are inserted into the mounting holes, and the hole plate (101) is sleeved on the outer ends of the bolts (8) and fixed by nuts.

4. The CPU protection device for reinforcing a computer according to claim 1, characterized by: One end of the cold plate (6) extends to the outside from the mounting hole, the upper end of the cold plate (6) is provided with an upper inclined surface (601), the side end of the cold plate (6) is provided with a side inclined surface (602) connected with the edge of the upper inclined surface (601), the side end of the stand (1) with the cold plate (6) is fixedly connected with a humidity sensor (7), the sensing end of the humidity sensor (7) is fixedly connected with a water-absorbing cotton (701), and the water-absorbing cotton (701) is attached to the surface of the side inclined surface (602).

5. The CPU shield for reinforcing a computer according to claim 1, wherein: The end away from the stand (1) of the refrigerating machine (3) is fixedly connected with a heat shield (301), and the heat shield (301) is sleeved on the outside of the hot end of the refrigerating machine (3).

6. The CPU protection device for reinforcing a computer according to claim 1, wherein: The heat insulation plate (9) comprises a plate body (91) and a pair of flexible cloth (92), the plate body (91) is fixedly connected between the pair of flexible cloth (92), one end of the flexible cloth (92) away from the plate body (91) is fixedly connected with the inner wall of the flexible sleeve (2), and the drainage hole (901) is arranged at the top area of the plate body (91) away from the delivery pump (4).

7. The CPU shield for reinforcing a computer according to claim 6, wherein: The left and right ends of the plate body (91) are fixedly connected with a pair of sliding plates (11), and the one end of the vertical plate (1) close to the flexible sleeve (2) is provided with a pair of sliding grooves (102), and a plurality of sliding plates (11) are respectively and slidably connected in the plurality of sliding grooves (102).

8. The CPU shield for reinforcing a computer according to claim 7, wherein: The lower inner wall of the sliding groove (102) is fixedly connected with an electric telescopic rod (12) and a sealing cover (13), the sealing cover (13) covers the outer side of the electric telescopic rod (12), and the telescopic end of the electric telescopic rod (12) is movably penetrated through the sealing cover (13) and fixedly connected with the lower end of the sliding plate (11).

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