Image display method and device, electronic equipment and computer readable storage medium

Abstract

The embodiment of the invention provides an image display method and device, electronic equipment and a computer readable storage medium, and the method comprises the steps: firstly reading an image mark corresponding to each image in an ID list, and enabling the ID list to comprise a corresponding relation between the ID of each image and the image mark; determining an effective ID corresponding to the effective image in the ID list according to the image mark; and finally, the effective image data corresponding to the effective images are sequentially sent to the micro-display chip from small to large according to the size sequence of the effective IDs, so that the micro-display chip displays the effective images. After the electronic equipment is powered on, the effective images can be automatically sent to the micro display chip according to the size sequence to be displayed, a user does not need to reconfigure a display mode, and the user experience is improved.

Description

Technical Field

[0001] The present invention relates to the field of micro-display technology, and in particular to an image display method, device, electronic device and computer-readable storage medium. Background Art

[0002] Micro Light Emitting Diode (Micro LED) is a new type of LED structure obtained by thinning, miniaturizing and arraying the original LED structure. It integrates arrayed micron-level LED units on an actively addressed driving panel to form a micro display panel.

[0003] After existing micro-display panels leave the factory, when merchants want to demonstrate the display performance of the micro-display panels to users, they need to connect the micro-display panels to a control host, set the image playback mode through the control host, and then have the control host send the image to be displayed to the micro-display panel. Only then will the micro-display panel start to display the image to be displayed. This process is too cumbersome and the user experience is poor. Summary of the Invention

[0004] Embodiments of the present application provide an image display method and system to enhance user experience.

[0005] A first aspect of the present invention provides an image display method, comprising: Reading an image tag corresponding to each image in an ID list, wherein the ID list includes a correspondence between the ID of each image and the image tag; Determine, based on the image flag, a valid ID corresponding to a valid image in the ID list; The valid image data corresponding to the valid image is sent to the micro display chip in order of the size of the valid ID, from small to large, so that the micro display chip displays the valid image.

[0006] In a possible implementation of the present application, the ID list is stored in a storage module; and the step of reading the image identifier corresponding to each image in the ID list further includes: Reading the partition storage flags corresponding to the storage areas in the storage module; determining a valid storage area in the storage module according to the partition storage flag; The image flag corresponding to each image in the ID list is read from the valid storage area.

[0007] In a possible implementation of the present application, the valid image data is stored in the storage module; and the valid image data corresponding to the valid image is sent to the micro display chip in ascending order of the valid IDs, including: Loading the valid image data in the storage module into the cache module; The valid image data in the cache module is sent to the micro display chip in order of the size of the valid IDs, from small to large.

[0008] In a possible implementation of the present application, loading the valid image data in the storage module into the cache module includes: Based on a preset address calculation formula, the cache address of the valid image is calculated according to the valid ID; The valid image is loaded into the cache address in the cache module.

[0009] In one possible implementation of the present application, the image display method includes: In the process of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs, determining whether a trigger signal is received; If a trigger signal is received, the operation of sending the valid image data corresponding to the valid image to the micro display chip in order of the size of the valid ID from small to large is interrupted; The image data corresponding to the trigger signal is sent to the micro display chip.

[0010] In a possible implementation of the present application, sending the image data corresponding to the trigger signal to the micro display chip includes: Calling the execution function corresponding to the trigger signal; Based on the execution function, the last valid image data of the currently displayed valid image or the next valid image data is sent to the micro display chip.

[0011] In one possible implementation of the present application, the image display method includes: In the process of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs, determining whether a display command is received, the display command including the target ID corresponding to the image to be displayed; If a display command is received, the operation of sending the valid image data corresponding to the valid image to the micro display chip in order of the size of the valid IDs from small to large is interrupted; The image data to be displayed corresponding to the target ID is sent to the micro display chip.

[0012] In a possible implementation of the present application, before sending the to-be-displayed image data corresponding to the target ID to the micro display chip, the process includes: Based on the ID list, it is determined whether the target ID is valid. If the target ID is valid, the step of sending the to-be-displayed image data corresponding to the target ID to the micro display chip is performed.

[0013] In one aspect, an image display device includes: A first reading module is used to read the image mark corresponding to each image in the ID list, wherein the ID list includes the corresponding relationship between the ID of each image and the image mark; A determination module, configured to determine a valid ID corresponding to a valid image in the ID list according to the image flag; The first sending module is used to send the valid image data corresponding to the valid image to the micro display chip in order of the size of the valid IDs, from small to large, so that the display chip displays the valid image.

[0014] In a possible implementation of the present application, the ID list is stored in a storage module; and the reading module includes: A first reading submodule is used to read the partition storage flag corresponding to each storage area in the storage module; a determination submodule, configured to determine a valid storage area in the storage module according to the partition storage flag;

[0015] The second reading submodule is configured to read the image identifier corresponding to each image in the ID list from the valid storage area. In a possible implementation of the present application, the valid image data is stored in the storage module; the first sending module includes: A loading submodule, configured to load the valid image data in the storage module into the cache module; The first sending submodule is used to send the valid image data in the cache module to the micro display chip in order of the size of the valid IDs, from small to large.

[0016] In a possible implementation of the present application, the loading submodule is specifically configured to calculate the cache address of the valid image according to the valid ID based on a preset address calculation formula; and load the valid image to the cache address in the cache module.

[0017] In a possible implementation of the present application, an image display device includes: a second judgment module, configured to judge whether a trigger signal is received during the process of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs; a first interrupt module, configured to interrupt, upon receiving a trigger signal, the operation of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs; The second sending module is used to send the image data corresponding to the trigger signal to the micro display chip.

[0018] In a possible implementation of the present application, the second sending module includes: A calling submodule, used to call the execution function corresponding to the trigger signal; The second sending submodule is configured to send the previous valid image data or the next valid image data of the currently displayed valid image to the micro display chip based on the execution function.

[0019] In a possible implementation of the present application, an image display device includes: a third determining module, configured to determine whether a display command is received during the process of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs, the display command including the target ID corresponding to the image to be displayed; a second interrupt module, configured to interrupt the operation of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs if a display command is received; The third sending module is used to send the to-be-displayed image data corresponding to the target ID to the micro display chip.

[0020] In a possible implementation of the present application, before the third sending module, the image display device further includes: The fourth judgment module is configured to judge whether the target ID is valid based on the ID list, and if the target ID is valid, execute the step of sending the to-be-displayed image data corresponding to the target ID to the display chip.

[0021] On the one hand, an embodiment of the present application provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps in the above-mentioned image display method are implemented.

[0022] On the one hand, the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned image display method are implemented.

[0023] Embodiments of the present application provide an image display method, apparatus, electronic device, and computer-readable storage medium. Upon powering on the device, the present application automatically reads the image identifier corresponding to each image in an ID list, which includes the correspondence between each image ID and the image identifier. Based on the image identifier, the valid ID corresponding to a valid image in the ID list is determined. Finally, the valid image data corresponding to the valid image is sent sequentially, in ascending order of the valid IDs, to a microdisplay chip, enabling the microdisplay chip to display the valid image. The solution provided by this application eliminates the need for the user to reconfigure the display mode; images can be automatically played upon power-up, improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A first flow chart of the image display method provided in an embodiment of the present application.

[0026] Figure 2 A second flow chart of the image display method provided in an embodiment of the present application.

[0027] Figure 3 This is a schematic diagram of a third flow chart of the image display method provided in an embodiment of the present application.

[0028] Figure 4a A schematic diagram of the first scenario of the image display system provided in an embodiment of the present application.

[0029] Figure 4b A schematic diagram of the first scenario of the image display system provided in an embodiment of the present application.

[0030] Figure 5 This is a fourth flow chart of the image display method provided in an embodiment of the present application.

[0031] Figure 6 This is a schematic diagram of the first structure of the image display device provided in an embodiment of the present application.

[0032] Figure 7 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0033] Figure 8 A top view of the micro display chip provided in an embodiment of the present application. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0035] The terms "including" and "having" and any variations thereof appearing in the specification, claims, and drawings of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to the process, method, product, or device. In addition, the terms "first," "second," and "third," etc. are used to distinguish different objects, not to describe a specific order.

[0036] In the present application, a micro display chip is a display chip based on Micro LED (Microlight emitting diode, micro light emitting diode structure). The "micro" LED and "micro" device used in the present application refer to the descriptive size of certain devices or structures according to the embodiments of the present application. The term "micro" device or structure used herein is intended to represent a scale of 100 nanometers to 100 microns. However, it should be understood that the embodiments of the present application are not necessarily limited thereto, and certain aspects of the embodiments may be applicable to larger and possibly smaller size scales.

[0037] In the present application, the size of each micro-LED chip does not exceed 1 cm, preferably does not exceed 20 microns. The micro-LED structures are formed in an array within the micro-LED chip, with a resolution of, for example, 720*480, 640*480, 1920*1080, 1280*720, 2K, or 4K. The diameter of the micro-LED structures is on the nanometer scale, for example, 20 nm to 100 nm.

[0038] In this application, the electronic device is a hardware device that can execute the image display method, which can be at least one of FPGA, MCU, and SOC. This application uses the electronic device being FPGA as an example for explanation.

[0039] See also Figure 1 , Figure 1 This is a schematic diagram of a first flow chart of an image display method provided in an embodiment of the present application, which is applied to an electronic device. The image display method includes:

[0040] Step 101: Read the image mark corresponding to each image in the ID list, where the ID list includes the correspondence between the ID of each image and the image mark.

[0041] The ID list can be stored in a storage module of the electronic device, such as an SD card, or in a cache module of the electronic device, such as a DDR. The storage location of the ID list is not limited here, and can be determined based on the actual application scenario.

[0042] As shown in the ID list in Table 1, each image has a unique ID corresponding to it. Table 1 ID list ID 001 002 003 004 Image Logo 0xab 0xcd 0xab 0xab

[0043] Step 102: Determine the valid ID corresponding to the valid image in the ID list according to the image flag;

[0044] After the electronic device reads the image mark corresponding to each image, it determines whether the ID number corresponding to the image mark is valid according to each image mark.

[0045] In one embodiment, the image mark is compared with a preset standard image mark, and an image mark identical to the preset standard image mark is determined as a valid image; and the ID of the valid image is determined as a valid ID.

[0046] For example: the preset standard image flag is 0xab, and ID001, 003, and 004 in Table 1 are valid IDs.

[0047] In the above embodiment, the preset standard image logos of each image are the same. In actual applications, the preset standard image logos of each image may also be different, which is not limited here, as long as they meet the actual application scenario.

[0048] Step 103: Send the valid image data corresponding to the valid image to the micro display chip in order of the size of the valid ID, from small to large.

[0049] The valid image data corresponding to the valid image may be stored in a storage module or cached in a cache module, which is not limited here.

[0050] The electronic device sends the valid image data to the micro display chip in order of the size of the valid IDs, from small to large, so that the micro display chip displays the valid images in sequence.

[0051] Generally, electronic devices send image data to a microdisplay chip at fixed time intervals.

[0052] The present invention provides an image display method that first reads the image flag corresponding to each image in an ID list, where the ID list includes the correspondence between each image ID and the image flag; then, based on the image flag, determines the valid ID corresponding to the valid image in the ID list; and finally, sends the valid image data corresponding to the valid image to a micro-display chip in ascending order of the valid ID, so that the micro-display chip displays the valid image. Upon power-on, the electronic device of the present invention automatically sends the valid image to the micro-display chip in ascending order of the valid ID, eliminating the need for the user to reconfigure the display mode, thereby improving the user experience.

[0053] See also Figure 2 , Figure 2 This is a second flow chart of the image display method provided in an embodiment of the present application, which is applied to an electronic device. The ID list is stored in a target storage area of the storage module. Step 101 further includes:

[0054] Step 1011: Read the partition storage flags corresponding to the respective storage areas in the partition flag storage module of the target storage area;

[0055] Since there are multiple storage areas in the storage module, different storage areas store different data. In order to quickly locate the storage area of the ID list, it is necessary to judge the partition flags of different storage areas in the storage module. If the partition storage flag of the storage area is the same as the preset partition storage flag, it indicates that the storage area is a valid storage area for storing the ID list.

[0056] Step 1012: Determine a valid storage area in the storage module according to the partition storage flag.

[0057] The partition storage flag of each storage area may be compared with a preset partition storage flag. If the partition storage flag of a storage area is the same as the preset partition storage flag, the area is a valid storage area.

[0058] Step 1013: Read the image flag corresponding to each image in the ID list from the valid storage area.

[0059] After the valid storage area is determined, the image flag corresponding to each image in the ID list is read from the valid storage area.

[0060] Setting a partition storage flag in each storage area in the storage module is conducive to quickly locating the storage area where the ID list is stored, thereby improving the response speed of the device.

[0061] See also Figure 3 , Figure 3This is a schematic diagram of a third flow chart of the image display method provided in an embodiment of the present application, which is applied to an electronic device, wherein valid image data is stored in a storage module, and before step 103, the method further includes:

[0062] Step 1031: Load the valid image data in the storage module into the cache module.

[0063] In order to improve the image display speed, in actual applications, the image in the storage module is generally loaded into the cache module first, and then sent from the cache module to the micro display chip. The reason for this is that data is transferred from the cache module to the micro display chip faster than data is transferred from the storage module to the micro display chip.

[0064] Step 1032: Send the valid image data in the cache module to the micro display chip in order of the valid IDs, from small to large.

[0065] After the valid image data is cached in the cache module, the electronic device sends it to the micro display chip in order of the size of the valid ID, from small to large.

[0066] like Figure 4a This is a schematic diagram of the first scenario of an image display system, including a micro display chip 401 and an electronic device 402. FLASH and a crystal oscillator are peripheral components of the FPGA used to maintain normal operation. FLASH is used to store FPGA configuration files, and the crystal oscillator is used to provide a stable clock signal to the FPGA. The SD card is a storage module, and the DDR is a cache module.

[0067] The valid image data in the storage module is loaded into the cache module, and then the valid image data in the cache module is sent to the micro display chip in order of the size of the valid ID, from small to large, thereby improving the display speed of the image.

[0068] In actual applications, users may change the image playback mode during the automatic playback of images. Therefore, the playback mode needs to be switched according to user needs. For example, the user needs to specify a specific image to be displayed, or the previous or next image of the currently displayed image to be displayed.

[0069] In one embodiment, an image display method includes: in the process of sending valid image data corresponding to a valid image to a micro-display chip in order of the size of the valid ID, from small to large, determining whether a trigger signal is received; if a trigger signal is received, interrupting the operation of sending the valid image data corresponding to the valid image to the micro-display chip in order of the size of the valid ID, from small to large; and sending the image data corresponding to the trigger signal to the micro-display chip.

[0070] The trigger signal can be triggered by a physical button on the electronic device. The electronic device may include multiple physical buttons, each corresponding to a different trigger signal. Depending on the trigger signal, the electronic device performs different operations. For example, button 1 displays the previous image, while button 2 displays the next image. The correspondence between each button and the executed operation is manually set and modified.

[0071] For example: when the user presses button 1 on the electronic device, trigger signal 1 corresponding to button 1 will be triggered. According to trigger signal 1, the electronic device interrupts the operation of sending the valid image data corresponding to the valid image to the micro-display chip in order of the size of the valid ID, from small to large; and sends the image data of the previous image of the currently displayed image to the micro-display chip.

[0072] In one embodiment, sending image data corresponding to a trigger signal to a microdisplay chip includes: calling an execution function corresponding to the trigger signal; and based on the execution function, sending the previous valid image data of the currently displayed valid image or the next valid image data to the microdisplay chip.

[0073] In practice, users can instruct the microdisplay chip to display a specific image.

[0074] In one embodiment, in the process of sending the valid image data corresponding to the valid image to the micro display chip in sequence from small to large according to the size of the valid ID, it is determined whether a display command is received, and the display command includes the target ID corresponding to the image to be displayed; if the display command is received, the operation of sending the valid image data corresponding to the valid image to the micro display chip in sequence from small to large according to the size of the valid ID is interrupted; and the image data to be displayed corresponding to the target ID is sent to the micro display chip.

[0075] like Figure 4b As shown, for example: if a user wants to view an image with ID 003, the user can send a display command to the electronic device 402 through the serial port via the host computer 403. The display command includes the ID of the image. After receiving the display command, the electronic device 402 sends the image data corresponding to the image 003 to the micro display chip 401, so that the micro display chip 401 displays the image 003 after receiving the image data.

[0076] In some cases, not all stored images in the storage module are valid images. As shown in Table 1 above, images 001, 003, and 004 are valid images, while image 002 is invalid. Therefore, the user can only select images 001, 003, and 004 for display; image 002 cannot be displayed. To prevent the user from inputting an invalid image ID and causing the electronic device to freeze, before sending the image data to be displayed corresponding to the target ID to the micro-display chip, the ID list is used to determine whether the target ID is valid. If the target ID is valid, the image data to be displayed corresponding to the target ID is sent to the micro-display chip. If the target ID is invalid, the image data to be displayed corresponding to the target ID is not sent to the micro-display chip.

[0077] In one embodiment, before sending the image data to be displayed corresponding to the target ID to the micro display chip, the process includes: judging whether the target ID is valid based on the ID list; if the target ID is valid, sending the image data to be displayed corresponding to the target ID to the micro display chip.

[0078] By determining whether the target ID is valid before sending the to-be-displayed image data corresponding to the target ID to the micro-display chip, it is possible to avoid freezing of the electronic device and improve the user experience.

[0079] See also Figure 5 , Figure 5 A third flow chart of an image display method provided in an embodiment of the present application, which is applied to an electronic device, includes:

[0080] Step 501: Read ID List and Va lid Flag;

[0081] Place Figure 4a and Figure 4b As shown in FIG, after the FPGA is powered on, the Va lid Flag stored in the SD card is read. The Va lid Flag is a partition storage flag.

[0082] Step 502: Determine whether the Valid Flag is valid;

[0083] After reading the Valid Flag of each storage area in the SD card, first determine which storage area has a valid partition storage flag, and read the ID List from the valid storage area. The ID List is the ID list.

[0084] Step 503: Record the valid image ID and load the image into DDR;

[0085] Since the ID list includes the correspondence between the ID of each image and the image flag, the valid ID corresponding to the valid image in the ID list can be determined according to the image flag.

[0086] After the valid ID is determined, the valid image data corresponding to the valid ID is loaded into the DDR.

[0087] Step 504: Determine the play mode.

[0088] After the valid image data is loaded, the electronic device turns on the automatic playback mode by default, and sends the valid image data corresponding to the valid image to the micro display chip in order of the size of the valid ID, from small to large, so that the micro display chip displays the valid images in sequence.

[0089] While the microdisplay chip displays valid images sequentially, the user can choose to change the playback mode. This can be done using buttons on the electronic device. For example, pressing the "+" button displays the previous valid image, while pressing the "-" button displays the next valid image. Alternatively, a display command can be sent via the serial port to specify an image corresponding to a specific ID. The specific instructions for instructing the microdisplay chip to play a specific valid image have been detailed above and will not be repeated here.

[0090] Based on the above embodiment method, this embodiment will be further described from the perspective of the image display device. Figure 6 , Figure 6 The first structural diagram of the image display device provided by the embodiment of the present application is specifically described, including: A reading module 601 is used to read the image mark corresponding to each image in the ID list, where the ID list includes the corresponding relationship between the ID of each image and the image mark; A determination module 602 is used to determine a valid ID corresponding to a valid image in an ID list according to the image flag; The first sending module 603 is configured to send the valid image data corresponding to the valid image to the micro display chip in order of the size of the valid IDs, from small to large, so that the display chip displays the valid image.

[0091] In one embodiment, the ID list is stored in a storage module; the reading module 601 includes: A first reading submodule is used to read the partition storage flag corresponding to each storage area in the storage module; A determination submodule, configured to determine a valid storage area in the storage module according to a partition storage flag;

[0092] The second reading submodule is used to read the image identifier corresponding to each image in the ID list from the valid storage area. In one embodiment, the valid image data is stored in the storage module; the first sending module 603 includes: A loading submodule, used for loading valid image data in the storage module into the cache module; The first sending submodule is used to send the valid image data in the buffer module to the micro display chip in order of the valid IDs, from small to large.

[0093] In one embodiment, the loading submodule is specifically configured to calculate a cache address of a valid image according to a valid ID based on a preset address calculation formula; and load the valid image into the cache address in the cache module.

[0094] In one embodiment, the image display device comprises: The first judgment module is used to sort the valid image data corresponding to the valid image in the order of the size of the valid ID. In the process of sending the data from small to large to the micro display chip, it is determined whether the trigger signal is received; The first interrupt module is used to interrupt the valid image data corresponding to the valid image if a trigger signal is received. The operations of sending to the micro display chip in order of the size of the valid ID from small to large; The second sending module is used to send the image data corresponding to the trigger signal to the micro display chip.

[0095] In one embodiment, the second sending module includes: The calling submodule is used to call the execution function corresponding to the trigger signal; The second sending submodule is used to send the previous valid image data of the currently displayed valid image or the next valid image data to the micro display chip based on the execution function.

[0096] In one embodiment, the image display device further includes: The second judgment module is used to judge whether a display command is received during the process of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid ID, the display command including the target ID corresponding to the image to be displayed; The second interrupt module is used for interrupting the valid image data corresponding to the valid image if a display command is received. The operations of sending to the micro display chip in order of the size of the valid ID from small to large; The third sending module is used to send the to-be-displayed image data corresponding to the target ID to the micro display chip.

[0097] In one embodiment, before the third sending module, the image display device further includes: The third judgment module is used to judge whether the target ID is valid based on the ID list. If the target ID is valid, the step of sending the to-be-displayed image data corresponding to the target ID to the display chip is executed.

[0098] An embodiment of the present application provides an image display device that first reads an image identifier corresponding to each image in an ID list, wherein the ID list includes a correspondence between each image ID and the image identifier; then, based on the image identifier, determines the valid ID corresponding to the valid image in the ID list; and finally, sends the valid image data corresponding to the valid image to a micro-display chip in ascending order of the valid ID, so that the micro-display chip displays the valid image. Upon power-on, the electronic device of the present application can automatically send the valid images in ascending order of size to the micro-display chip for display, eliminating the need for the user to reconfigure the display mode, thereby improving the user experience.

[0099] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / units are based on the same concept as the method embodiment of this application. Their specific functions and technical effects can be found in the method embodiment section and will not be repeated here.

[0100] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment and will not be described in detail here.

[0101] Accordingly, the embodiment of the present application further provides an electronic device, such as Figure 7 As shown, the electronic device may include a radio frequency circuit 701, a memory 702 including one or more computer-readable storage media, an input unit 703, a display unit 704, a sensor 705, an audio circuit 706, a WiFi module 707, a processor 708 including one or more processing cores, and a power supply 709. Those skilled in the art will understand that Figure 7The electronic device structure shown in the figure does not constitute a limitation of the electronic device, and may include more or fewer components than shown in the figure, or combine certain components, or arrange components differently.

[0102] The radio frequency circuit 701 can be used to receive and send signals during information transmission or calls. In particular, after receiving downlink information from the base station, it is handed over to one or more processors 708 for processing; in addition, uplink data is sent to the base station. The memory 702 can be used to store software programs and modules. The processor 708 executes various functional applications and data processing by running the software programs and modules stored in the memory 702. The input unit 703 can be used to receive input digital or character information and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. The display unit 704 can be used to display information input by the user or information provided to the user, as well as various graphical user interfaces of the electronic device. These graphical user interfaces can be composed of graphics, text, icons, videos, or any combination thereof.

[0103] The electronic device may further include at least one sensor 705, such as a light sensor, a motion sensor, or other sensors. The audio circuit 706 may include a speaker, which may provide an audio interface between the user and the electronic device.

[0104] WiFi is a short-range wireless transmission technology. Electronic devices can help users send and receive emails, browse web pages, and access streaming media through WiFi module 707. It provides users with wireless broadband Internet access. Figure 7 A WiFi module 707 is shown, but it is understandable that it is not an essential component of the electronic device and can be omitted as needed without changing the essence of the application.

[0105] The processor 708 is the control center of the electronic device. It uses various interfaces and lines to connect various parts of the entire mobile phone. By running or executing software programs and / or modules stored in the memory 702 and calling data stored in the memory 702, it performs various functions of the electronic device and processes data, thereby monitoring the mobile phone as a whole.

[0106] The electronic device also includes a power supply 709 (such as a battery) for supplying power to various components. Preferably, the power supply can be logically connected to the processor 708 through a power management system, thereby managing charging, discharging, and power consumption through the power management system.

[0107] Although not shown, the electronic device may also include a camera, a Bluetooth module, etc., which will not be described in detail here. Specifically, in this embodiment, the processor 708 in the electronic device will load the executable files corresponding to the processes of one or more application programs into the memory 702 according to the following instructions, and the processor 708 will run the application programs stored in the memory 702, thereby achieving the following functions: Read the image mark corresponding to each image in the ID list. The ID list includes the corresponding relationship between the ID of each image and the image mark; According to the image flag, determine the valid ID corresponding to the valid image in the ID list; The valid image data corresponding to the valid image is sent to the micro display chip in order of the size of the valid ID, from small to large, so that the micro display chip displays the valid image.

[0108] In the above embodiments, the description of each embodiment has its own focus. For the part that is not described in detail in a certain embodiment, please refer to the detailed description above and will not be repeated here.

[0109] Those skilled in the art will appreciate that all or part of the steps in the various methods of the above embodiments may be accomplished by instructions, or by controlling related hardware through instructions. The instructions may be stored in a computer-readable storage medium and loaded and executed by a processor.

[0110] To this end, an embodiment of the present application provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, it implements the following functions: Read the image mark corresponding to each image in the ID list. The ID list includes the corresponding relationship between the ID of each image and the image mark; According to the image flag, determine the valid ID corresponding to the valid image in the ID list; The valid image data corresponding to the valid image is sent to the micro display chip in order of the size of the valid ID, from small to large, so that the micro display chip displays the valid image.

[0111] The specific implementation of the above operations can be found in the previous embodiments and will not be repeated here.

[0112] The storage medium may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0113] Since the instructions stored in the storage medium can execute the steps in any image display method provided in the embodiments of the present application, the beneficial effects that can be achieved by any image display method provided in the embodiments of the present application can be achieved. Please refer to the previous embodiments for details and will not be repeated here.

[0114] The above is a detailed introduction to an image display method, device, electronic device and computer-readable storage medium provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application; ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0115] In one embodiment of the present invention, the micro display chip includes a micro light emitting diode array located on a driving backplane.

[0116] like Figure 8 As shown, 801 is a micro light emitting diode and 802 is a driving backplane.

[0117] In some embodiments, the micro-LED array may include a single layer of micro-LED structures formed in an array.

[0118] The micro light-emitting diode structure includes a pixel driving backplane, a lower electrode layer, a conductive layer, a light-emitting table, an upper electrode layer, a passivation layer, and a microlens.

[0119] For convenience, "up" is used to mean away from the pixel driving backplane, "down" means towards the pixel driving backplane, and other directional terms such as top, bottom, above, below, directly below, below, etc. are also interpreted accordingly.

[0120] Micro-LEDs are the basic components of micro-LED pixels. Each micro-LED pixel may include one or more micro-LED structures. Multiple micro-LED pixels are arranged in an array to form a micro-LED display or micro-LED chip. For example, each pixel in a color micro-LED chip may include multiple micro-LED structures of different colors, while each pixel in a monochrome micro-LED chip may include a micro-LED structure of only one color.

[0121] In an embodiment of the present invention, the size of each micro-LED chip does not exceed 1 cm, preferably does not exceed 20 microns. The micro-LED structure is formed in the micro-LED chip in an array form, with a resolution of, for example, 720*480, 640*480, 1920*1080, 1280*720, 2K or 4K. The diameter of the micro-LED structure is in the nanometer range, for example, 20nm to 100nm. In some embodiments, the pitch of the micro-LED array, that is, the minimum center-to-center distance between the micro-LEDs, can be between about 2 microns and about 50 microns. In some embodiments, the number of pixels on the micro-LED chip can be between thousands and millions.

[0122] In some embodiments, the pixel driving backplane can adopt an integrated circuit chip. The pixel driving backplane includes a substrate, a driving circuit and a contact pad. Each micro light emitting diode corresponds to a contact pad, and the contact pad is electrically connected to the lower electrode layer. Each driving circuit is a pixel driver. In some cases, the driving circuit is a thin film transistor pixel driver or a silicon CMOS pixel driver. In one embodiment, the substrate of the pixel driving backplane is a Si substrate. In another embodiment, the substrate of the pixel driving backplane is a transparent substrate, such as a glass substrate. Examples of other substrates include GaAs, GaP, InP, SiC, ZnO and sapphire substrates. The pixel driving backplane is used to control the lighting and extinguishing of the micro light emitting diodes in each pixel. In one embodiment, the material of the contact pad is an alloy of one or more of the following metals: Ni, Al, Ti, Cu, Pt and Au.

[0123] In some embodiments of the present invention, the pixel driver backplane can be electrically connected to each micro-LED in the micro-LED array via separate metal interconnects. In some embodiments, each micro-LED can be individually electrically controlled by the pixel driver backplane. In some embodiments, the pixel driver backplane can be electrically connected to electrodes of the micro-LED chip via metal interconnects. In some embodiments, a dielectric layer can be formed in the gaps between the micro-LEDs. In some embodiments, a dielectric layer can also be formed in the gaps between the interconnects.

[0124] In one embodiment, the lower electrode layer can be a metal bonding composite layer. The light-emitting surface of the micro-LED can be bonded to the surface of the pixel driving backplane through the metal bonding composite layer, and the bonding can be achieved by eutectic bonding, hot pressing bonding, transient liquid phase (TLP) bonding, etc. In one embodiment, the metal bonding composite layer can be provided on the pixel driving backplane. In another embodiment, the metal bonding composite layer is grown on the pixel driving backplane. In one embodiment, the thickness of the metal bonding composite layer is 0.1 micron to 3 microns. In a preferred embodiment, the thickness of the metal bonding composite layer is 0.3 μm. In some embodiments, the material of the metal bonding composite layer is an alloy of one or more of the following metals: Cr, Al, Ti, Ni, Pt, Au, Ag, and Sn. The metal bonding composite layer may include an ohmic contact layer and a metal bonding layer. In some cases, the metal bonding composite layer includes two metal layers. One of the two metal layers is deposited on a layer above the metal bonding layer in the LED. The corresponding bonding metal layer is deposited on the pixel driving backplane. For example, the metal bonding composite layer can be Au-Au bonding, Au-Sn bonding, Au-In bonding, Ti-Ti bonding, Cu-Cu bonding, or a combination thereof. For example, if Au-Au bonding is selected, the two Au layers each require a Cr layer as an adhesion layer and a Pt layer as an anti-diffusion layer. The Pt layer is located between the Au layer and the Cr layer. The Cr and Pt layers are located at the top and bottom of the two bonded Au layers. In some embodiments, when the thickness of the two Au layers is approximately the same, under high pressure and high temperature, the Au on the two layers diffuse into each other, bonding the two layers together.

[0125] In some embodiments, the metal bonding composite layer may also act as a reflector to reflect light emitted from the light emitting mesa above.

[0126] In some embodiments, a conductive layer is formed on the bottom surface of the light-emitting mesa to form an electrical connection between the light-emitting mesa and the metal bonding composite layer. In some embodiments, the conductive layer can be a conductive transparent layer that is transparent to light emitted by the light-emitting mesa to improve conductivity and light transmittance. In some embodiments, a top electrode layer is formed on the top surface of the light-emitting mesa and is electrically connected to a current spreading structure or a top electrode (not shown).

[0127] In one embodiment, the conductive layer, the upper electrode layer and their connecting components can be a combination of one or more materials such as graphene, indium tin oxide (ITO), aluminum doped zinc oxide (AZO), fluorine doped tin oxide (FTO), or other transparent conductive oxides (TCO).

[0128] The light-emitting mesa includes a first-type epitaxial layer, a second-type epitaxial layer, and a light-emitting layer located therebetween. The first-type epitaxial layer is electrically connected to the conductive layer. The second-type epitaxial layer is electrically connected to the top electrode layer. In some embodiments, the light-emitting mesa of each micro-LED in the micro-LED array can be a micron-scale light-emitting mesa. In the three-layer structure, the first-type epitaxial layer is closest to the driver backplane; the light-emitting layer is located above the first-type epitaxial layer and further away from the driver backplane; and the second-type epitaxial layer is located above the light-emitting layer and farthest away from the driver backplane. In some embodiments, the light-emitting layer is formed by multiple stacked quantum well layers, particularly superlattice-stacked quantum well layers. Preferably, the superlattice-stacked quantum well layers include multiple pairs of quantum well layers stacked with quantum barrier layers. In some embodiments, the first-type epitaxial layer is a semiconductor material having a first conductivity type and includes multiple semiconductor layers. The primary matrix material of the first-type epitaxial layer can be, but is not limited to, Ga, N, As, P, In, or Al. Furthermore, the first type epitaxial layer may include, from top to bottom, but is not limited to, a waveguide layer, a confinement layer, a transition layer, and a window layer; furthermore, an ohmic contact layer may be formed below the window layer. In some embodiments, the second type epitaxial layer is a semiconductor material having a second conductivity type and includes multiple semiconductor layers. The primary matrix material of the second type epitaxial layer may be, but is not limited to, Ga, N, As, P, In, or Al. Furthermore, the second type epitaxial layer may include, from top to bottom, but is not limited to, a confinement layer and a waveguide layer; furthermore, in some embodiments, an ohmic contact layer may be formed on the confinement layer. In one embodiment, the first conductivity type is different from the second conductivity type.

[0129] In some embodiments, the first type epitaxial layer is an N-type GaN layer or an N-type AlGaN layer, and the second type epitaxial layer is a P-type GaN layer or a P-type AlGaN layer, that is, the material of the second type epitaxial layer can be a second conductivity type material layer composed of at least two or more elements of Ga, N, As, Al, In, and P, and the first type epitaxial layer can be a first conductivity type material layer composed of at least two or more elements of Ga, N, As, Al, In, and P. In some embodiments, the light-emitting layer includes a multi-quantum well layer and an electron blocking layer, and the multi-quantum well layer is an InGaN / GaN multi-quantum well layer or an InGaN / AlGaN multi-quantum well layer or an InGaAs / AlGaAs multi-quantum well layer. In some embodiments, the light-emitting layer also includes an electron blocking layer, and the electron blocking layer is disposed on a first side of the light-emitting layer, where the first side refers to a side along which electrons migrate out of the light-emitting layer. In another embodiment, the first type epitaxial layer can also be a P-type GaN layer or a P-type AlGaN layer, and the second type epitaxial layer can be an N-type GaN layer or an N-type AlGaN layer.

[0130] In some embodiments, the light-emitting layer includes at least one quantum well layer. The thickness of the quantum well layer is between 20 nm and 40 nm, for example, 30 nm. In some embodiments, the material of the quantum well layer is GalnP / (AlxGa1-x)yln1-yP, where x ranges from 0.5 to 0.9 and y ranges from 0.3 to 0.5. For example, x is 0.8 and y is 0.5. In some embodiments, the relationship between x and y is that x is 1 to 2 times y.

[0131] In some embodiments, one of the first-type epitaxial layer and the second-type epitaxial layer is an N-type semiconductor layer, and the other is a P-type semiconductor layer. In some embodiments, the N-type semiconductor layer further includes a doped N-type contact layer and an N-type cladding layer, and the N-type cladding layer is formed on the doped N-type contact layer. The material of the N-type cladding layer is Alxln1-xP, where x ranges from 0.1 to 0.5, for example, x is 0.5. In addition, in these embodiments, the thickness of the N-type cladding layer is no greater than 350 nm, for example, the thickness of the N-type cladding layer is 320 nm. The doping concentration of the N-type cladding layer is 5e17 cm-3 to 1e18 cm-3. The material of the doped N-type contact layer is GaAs. In some embodiments, the thickness of the doped N-type contact layer is 10 nm to 30 nm. In some embodiments, the doping concentration of the doped N-type contact layer is 2e18 cm-3 to 1e19 cm-3. In some embodiments, the N-type semiconductor layer further includes an N-type spacer layer formed on the N-type cladding layer. The material of the n-type spacer layer is (AlxGa1-x)yln1-yP, where x ranges from 0.5 to 0.9 and y ranges from 0.1 to 0.5. For example, x is 0.8 and y is 0.5. In some embodiments, the relationship between x and y is that x is 1 to 2 times y. The thickness of the n-type spacer layer is 50 nm to 75 nm, for example, 65 nm.

[0132] In some embodiments, the P-type semiconductor layer includes a P-type cladding layer and a doped P-type contact layer. The P-type cladding layer is formed on the light-emitting layer, and the doped P-type contact layer is formed on the P-type cladding layer. In some embodiments, the material of the P-type cladding layer is Alxln1-xP, where x is 0.3 to 0.5, for example, x is 0.5. In such an embodiment, the thickness of the P-type cladding layer is not greater than 380nm, for example, the thickness of the P-type cladding layer is 360nm. In some embodiments, the material of the doped P-type contact layer is GaAs. The thickness of the doped P-type contact layer is 10nm to 30nm, for example, 20nm.

[0133] In some embodiments, the P-type semiconductor layer further includes a P-type spacer layer formed under the P-type cladding layer, a first doped P-type transition layer formed on the P-type cladding layer, and a second doped P-type transition layer formed on the first doped P-type transition layer. In some embodiments, the material of the P-type spacer layer is (AlxGa1-x)yln1-yP, where x ranges from 0.5 to 0.9 and y ranges from 0.3 to 0.5. For example, x is 0.8 and y is 0.5. In some embodiments, the relationship between x and y is that x is 1 to 2 times y. In some embodiments, the thickness of the P-type spacer layer is 50nm to 70nm, for example 65nm.

[0134] In some embodiments, the material of the first doped P-type transition layer is (AlxGa1-x)yln1-yP, where x ranges from 0.1 to 0.3 and y ranges from 0.3 to 0.5. For example, x is 0.17 and y is 0.5. In some embodiments, the relationship between x and y is y is 1 to 5 times x. In some embodiments, the thickness of the first doped P-type transition layer is 20 nm to 40 nm, for example, 30 nm.

[0135] In some embodiments, the material of the second doped P-type transition layer is AlxGa1-xAs, where x ranges from 0.5 to 0.9, for example, x is 0.6. In some embodiments, the thickness of the second doped P-type transition layer is 10 nm to 30 nm, for example, 20 nm.

[0136] In some embodiments, the doping concentration of the second doped P-type transition layer is greater than the doping density of the first doped P-type transition layer, and the doping concentration of the doped P-type contact layer is 1 to 10 times the doping concentration of the second doped P-type transition layer.

[0137] In some embodiments, the doping concentration of the doped P-type contact layer is greater than the doping concentration of the second doped P-type transition layer. In addition, in some embodiments, the doping concentration of the second doped P-type transition layer is 2 to 4 times the doping concentration of the first doped P-type transition layer.

[0138] For example, the doping concentration of the first doped P-type transition layer is greater than 1e18 cm-3, the doping density of the second doped P-type transition layer is in the range of 2e18 cm-3-4e18 cm-3, and the doping density of the doped P-type contact layer is greater than 5e18 cm-3.

[0139] In some embodiments, the electrode polarity of the conductive layer is determined by the first type epitaxial layer, and the electrode polarity of the upper electrode layer is determined by the second type epitaxial layer. The electrode polarity of the conductive layer is opposite to the electrode polarity of the upper electrode layer. The conductive layer can be, for example, a P electrode or an anode electrode, and the upper electrode layer is an electrode with an opposite polarity to that of the conductive layer, such as an N electrode or a cathode electrode, and vice versa.

[0140] In one embodiment, the light-emitting mesa can be a platform with a trapezoidal cross-section, and the bottom lateral dimension of the light-emitting mesa is larger than the top lateral dimension. There is an inclination angle between the sidewall of the semiconductor light-emitting mesa and the bottom of the semiconductor light-emitting mesa, and the inclination angle is less than or equal to 90°. In one embodiment, the inclination angle of the sidewall of the light-emitting mesa ranges from 45° to 90°. In one embodiment, the bottom lateral dimension of the light-emitting mesa exceeds 2 microns. In one embodiment, the top lateral dimension of the light-emitting mesa does not exceed 1.5 microns. In one embodiment, the lateral dimension of the metal bonding composite layer is larger than the bottom lateral dimension of the light-emitting mesa.

[0141] In some embodiments, the light-emitting mesa can emit red light, blue light, green light, or light of any other color.

[0142] In some embodiments, the passivation layer covers the side surfaces of the metal bonding composite layer, the conductive layer, and the light-emitting table. In some embodiments of the present invention, the passivation layer may also cover a portion of the side surfaces of the upper electrode layer, with a portion of the top surface of the upper electrode layer exposed so as to form an electrical connection with the top electrode. In other embodiments of the present invention, the passivation layer does not cover the top surface and side surfaces of the upper electrode layer, so that the upper electrode layers of adjacent LED structures can be connected to each other as a whole to form a common cathode or anode. In some embodiments of the present invention, the passivation layer covers the metal bonding composite layer, the conductive layer, the first type epitaxial layer, the side surfaces of the light-emitting layer, and a portion of the side surfaces of the second type epitaxial layer.

[0143] In one embodiment, the material of the passivation layer is a transparent insulating material, for example, one or more of silicon oxide, silicon oxynitride, aluminum oxide, and silicon nitride.

[0144] In one embodiment, the insulating medium fills the gaps between the light-emitting mesas and is transparent to the light emitted by the light-emitting mesas.

[0145] In some embodiments, the insulating medium is made of a dielectric material such as a solid inorganic material or a plastic material. In some embodiments, the solid inorganic material includes SiO2, Al2O3, Si3N4, SiCN, HfO2, Ta2O5, TiO2, ZrO2, La2O3, MgO, phosphosilicate glass (PSG), borophosphosilicate glass, or any combination thereof. In some embodiments, the plastic material includes a polymer such as SU-8, PermiNex, benzocyclobutene (BCB), or a transparent plastic (resin) including spin-on glass (SOG), or an adhesive such as MicroResist BCL-O, or any combination thereof. In some embodiments, the insulating medium can facilitate the passage of light emitted from the LED structure.

[0146] In some embodiments, the microlens is formed on top of the light-emitting mesa. The lateral dimension of the bottom of the microlens can be larger than the lateral dimension of the light-emitting area of the micro-LED. In some embodiments, the lateral dimension of the bottom of the microlens can be equal to the lateral dimension of the light-emitting area of the micro-LED.

[0147] In some embodiments, one microlens can cover multiple lens-less micro-light emitting diodes. Multiple microlenses constitute a microlens array. The microlens array is arranged above the micro-light emitting diode array, wherein at least one microlens is arranged on the surface of the top conductive layer of the micro-light emitting diode, and the horizontal profile of the microlens is greater than the maximum horizontal profile of the micro-light emitting diode. The microlens is mainly used to converge and / or collimate light. For example, the focus of the microlens can be located in the light-emitting table of the micro-light emitting diode by adjusting the thickness, curvature and other parameters of the microlens. The microlenses in the microlens array are usually the same. Examples of microlenses include spherical microlenses, aspherical microlenses, Fresnal microlenses and cylindrical microlenses. In one embodiment, typical shapes of the bottom cross-section of each microlens include circular, square, rectangular and hexagonal. The individual microlenses in the microlens array of the display panel can be the same or different in shape, curvature, optical power, size, base, spacing, etc.

[0148] In some embodiments, the shape of the microlens can be a curved hemisphere or a perfect hemisphere. In some embodiments, the height of the microlens is no greater than 2 microns. In some embodiments, the height of the microlens is no greater than 1 micron. In some embodiments, the height of the microlens is no greater than 0.5 microns. In some embodiments, the width of the microlens is no greater than 4 microns. In some embodiments, the width of the microlens is no greater than 3 microns. In some embodiments, the width of the microlens is no greater than 2 microns. In some embodiments, the width of the microlens is no greater than 1 micron. In some embodiments, the ratio of the width to the height of the microlens is greater than 1.5.

[0149] In some embodiments, the microlenses can be made of various materials that are transparent to the wavelengths of light emitted by the micro-LEDs. Exemplary transparent materials for the microlenses include polymers and dielectric materials. In some embodiments, the dielectric material includes one or more materials such as silicon oxide, silicon nitride, silicon carbide, titanium oxide, zirconium oxide, aluminum oxide, etc. In some embodiments, the microlenses are made of photoresist. In some embodiments, the microlenses are deposited directly on the surface of the micro-LEDs using chemical vapor deposition (CVD) techniques.

[0150] In an embodiment of the present invention, the micro LEDs described above or other similar micro LEDs constitute micro LED pixels, and a plurality of micro LED pixels are arranged in an array to form a micro LED display chip.

[0151] It should be understood that in some other embodiments of the present invention, the display module may also adopt other common micro-LED array structures in the art, wherein the structure of the micro-LED is not limited to the above embodiments.

[0152] Although various embodiments of the present invention have been described above, it should be understood that they are presented by way of example only and not limitation. It will be apparent to those skilled in the relevant art that various combinations, modifications, and variations may be made thereto without departing from the spirit and scope of the present invention. Therefore, the breadth and scope of the present invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined solely in accordance with the appended claims and their equivalents.

Claims

1. An image display method, characterized in that: include: Reading an image tag corresponding to each image in an ID list, wherein the ID list includes a correspondence between the ID of each image and the image tag; Determine, based on the image flag, a valid ID corresponding to a valid image in the ID list; The valid image data corresponding to the valid image is sent to the micro display chip in order of the size of the valid ID, from small to large, so that the micro display chip displays the valid image.

2. The image display method according to claim 1, wherein: The ID list is stored in the storage module, and the image mark corresponding to each image in the ID list is read, including: Reading the partition storage flags corresponding to the storage areas in the storage module; determining a valid storage area in the storage module according to the partition storage flag; The image flag corresponding to each image in the ID list is read from the valid storage area.

3. The image display method according to claim 2, wherein: The valid image data is stored in the storage module; The valid image data corresponding to the valid image is sent to the micro display chip in order of the size of the valid IDs, from small to large, including: Loading the valid image data in the storage module into the cache module; The valid image data in the cache module is sent to the micro display chip in order of the size of the valid IDs, from small to large.

4. The image display method according to claim 3, wherein: The step of loading the valid image data in the storage module into the cache module comprises: Based on a preset address calculation formula, the cache address of the valid image is calculated according to the valid ID; The valid image is loaded into the cache address in the cache module.

5. The image display method according to claim 1, wherein: include: In the process of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs, determining whether a trigger signal is received; If a trigger signal is received, the operation of sending the valid image data corresponding to the valid image to the micro display chip in order of the size of the valid ID from small to large is interrupted; The image data corresponding to the trigger signal is sent to the micro display chip.

6. The image display method according to claim 5, wherein: Sending image data corresponding to the trigger signal to the micro display chip includes: Calling the execution function corresponding to the trigger signal; Based on the execution function, the last valid image data of the currently displayed valid image or the next valid image data is sent to the micro display chip.

7. The image display method according to claim 1, wherein: include: In the process of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs, determining whether a display command is received, the display command including the target ID corresponding to the image to be displayed; If a display command is received, the operation of sending the valid image data corresponding to the valid image to the micro display chip in order of the size of the valid IDs from small to large is interrupted; The image data to be displayed corresponding to the target ID is sent to the micro display chip.

8. The image display method according to claim 7, wherein: Before sending the to-be-displayed image data corresponding to the target ID to the micro display chip, the method includes: Based on the ID list, it is determined whether the target ID is valid. If the target ID is valid, the step of sending the to-be-displayed image data corresponding to the target ID to the micro display chip is performed.

9. An image display device, characterized in that: include: A reading module, configured to read an image mark corresponding to each image in an ID list, wherein the ID list includes a correspondence between the ID of each image and the image mark; A determination module, configured to determine a valid ID corresponding to a valid image in the ID list according to the image flag; The first sending module is used to send the valid image data corresponding to the valid image to the micro display chip in order of the size of the valid IDs, from small to large, so that the display chip displays the valid image.

10. The image display device according to claim 9, wherein The ID list is stored in a storage module; The reading module includes: a first reading submodule, configured to read a partition storage flag corresponding to each storage area in the storage module; and a determining submodule, configured to determine a valid storage area in the storage module according to the partition storage flag; The second reading submodule is configured to read the image identifier corresponding to each image in the ID list from the valid storage area.

11. The image display device according to claim 10, wherein The valid image data is stored in the storage module; The first sending module includes: A loading submodule, configured to load the valid image data in the storage module into the cache module; The first sending submodule is used to send the valid image data in the cache module to the micro display chip in order of the size of the valid IDs, from small to large.

12. The image display device according to claim 11, wherein The loading submodule is specifically configured to calculate the cache address of the valid image according to the valid ID based on a preset address calculation formula; and load the valid image into the cache address in the cache module.

13. The image display device according to claim 9, wherein The image display device further includes: a first judging module, configured to judge whether a trigger signal is received during the process of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs; a first interrupt module, configured to interrupt, upon receiving a trigger signal, the operation of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs; The second sending module is used to send the image data corresponding to the trigger signal to the micro display chip.

14. The image display device according to claim 13, wherein The second sending module includes: A calling submodule, used to call the execution function corresponding to the trigger signal; The second sending submodule is configured to send the previous valid image data or the next valid image data of the currently displayed valid image to the micro display chip based on the execution function.

15. The image display device according to claim 9, wherein The image display device further includes: a second determining module, configured to determine whether a display command is received during the process of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs, the display command including the target ID corresponding to the image to be displayed; a second interrupt module, configured to interrupt the operation of sending the valid image data corresponding to the valid image to the micro display chip in ascending order of the valid IDs if a display command is received; The third sending module is used to send the to-be-displayed image data corresponding to the target ID to the micro display chip.

16. The image display device according to claim 15, wherein Before the third sending module, the image display device further includes: The third judgment module is configured to judge whether the target ID is valid based on the ID list, and if the target ID is valid, execute the step of sending the to-be-displayed image data corresponding to the target ID to the display chip.

17. An electronic device, characterized in that: The electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the image display method according to any one of claims 1 to 8 are implemented.

18. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the image display method according to any one of claims 1 to 8 are implemented.

Images