Electronic device

Abstract

An electronic device includes: a first main body including a first element; a second body including a second element; and a circuit including a first element and a second element. The first main body further comprises a first cylindrical conductor connected with the grounding piece. The first element is a capacitor including a capacitor conductor layer. The capacitor conductor layer is disposed between the second element and the first columnar conductor.

Description

Technical Field

[0001] The present invention relates to an electronic device including a main body and a mounted device mounted on the main body. Background Art

[0002] Filters such as low-pass filters, high-pass filters, and bandpass filters are constructed using multiple resonators. Known resonators used in these filters include LC resonators, which are constructed using inductors and capacitors, and elastic wave resonators, which are constructed using elastic wave elements. An elastic wave element is an element that utilizes elastic waves. These include surface acoustic wave elements, which utilize surface acoustic waves, and bulk acoustic wave elements, which utilize bulk acoustic waves.

[0003] International Publication No. 2007 / 119356 discloses a stacked bandpass filter comprising a plurality of LC parallel resonators coupled to each other by adjacent LC parallel resonators. The LC parallel resonators are composed of capacitor electrodes and inductor electrodes. The inductor electrodes are formed into a coil shape by via electrodes and line electrodes. The via electrodes extend in the stacking direction of the dielectric layers, while the line electrodes extend perpendicular to the stacking direction.

[0004] International Publication No. 2013 / 061694 discloses an elastic wave filter including a surface acoustic wave filter having a ladder circuit structure and an elastic wave filter including a longitudinally coupled surface acoustic wave resonator filter.

[0005] In addition to filter devices constructed solely using LC resonators or solely using elastic wave resonators, hybrid filter devices constructed using both LC and elastic wave resonators are also known. In a hybrid filter device, for example, a first body containing an LC resonator is mounted with a second body containing an elastic wave resonator.

[0006] Generally speaking, the overall characteristics of a filter device are adjusted by adjusting the characteristics of each of its multiple components. In a hybrid filter device, the characteristics of the LC resonator and the elastic wave resonator are individually adjusted. However, depending on the product, overall adjustment may be difficult based solely on the characteristics of the elastic wave resonator, or adjustment of the elastic wave resonator characteristics itself may be difficult.

[0007] The above problem is not limited to the case where the second body includes an elastic wave resonator, but also applies to cases where it is difficult to adjust the overall characteristics of the elements included in the second body alone, or where adjustment of the characteristics of the elements included in the second body itself is difficult. Summary of the Invention

[0008] (1) Technical issues to be resolved

[0009] An object of the present disclosure is to provide an electronic device including a first body and a second body mounted on the first body, wherein the overall characteristics of the electronic device can be made desired by using components in the first body.

[0010] (2) Technical solution

[0011] An electronic device according to a first aspect of the present invention comprises: a first body comprising a plurality of stacked dielectric layers and a first element; a second body mounted on the first body and comprising a second element; and a circuit comprising the first element and the second element. The first body further comprises a first columnar conductor extending in a direction parallel to the stacking direction of the plurality of dielectric layers and connected to a grounding member. The first element is a capacitor comprising a capacitor conductor layer extending in a direction orthogonal to the stacking direction. The capacitor conductor layer is disposed between the second element and the first columnar conductor.

[0012] An electronic device according to a second aspect of the present invention comprises: a first body including a plurality of dielectric layers, a capacitor, and an inductor; a second body mounted on the first body and including an elastic wave element; and a circuit. The circuit includes a first signal port, a second signal port, and a signal path connecting the first signal port and the second signal port. The elastic wave element is disposed between the signal path and a ground in the circuit structure. The capacitor and the inductor are connected in series and disposed between the elastic wave element and the ground in the circuit structure.

[0013] (3) Beneficial effects

[0014] In the electronic device according to the first aspect of the present disclosure, the capacitor conductor layer is disposed between the second element and the first columnar conductor.

[0015] In the electronic device according to the second aspect of the present disclosure, the capacitor and the inductor are connected in series and provided between the acoustic wave element and the ground in terms of the circuit structure. Thus, according to the present disclosure, the overall characteristics of the electronic device can be made to be desired.

[0016] Other objects, features, and advantages of the present invention will become more apparent from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a perspective view showing an electronic device according to one embodiment of the present invention.

[0018] Figure 2 It is a perspective view showing a first body in one embodiment of the present invention.

[0019] Figure 3It is a perspective view showing a first body in one embodiment of the present invention.

[0020] Figure 4 This is a block diagram conceptually showing the circuit configuration of a bandpass filter circuit in one embodiment of the present invention.

[0021] Figure 5 This is a circuit diagram showing an example of the configuration of a third circuit portion in one embodiment of the present invention.

[0022] Figure 6 This is a perspective view showing a portion of the interior of a first body according to one embodiment of the present invention.

[0023] Figure 7 This is a plan view showing a portion of the interior of the first body in one embodiment of the present invention.

[0024] Figure 8 This is a side view showing a portion of the interior of the first body in one embodiment of the present invention.

[0025] Figure 9 3 is a characteristic diagram showing the pass-through attenuation characteristics of the sub-circuit obtained by the first simulation.

[0026] Figure 10 3 is a characteristic diagram showing the pass attenuation characteristics of the sub-circuit obtained by the second simulation.

[0027] Figure 11 : is a characteristic diagram showing the return attenuation characteristics of the sub-circuit obtained by the second simulation.

[0028] Figure 12 This is a side view showing a portion of the interior of a first body in a first modified example of the electronic device according to the embodiment of the present invention.

[0029] Figure 13 This is a side view showing a portion of the interior of the first body in a second modified example of the electronic device according to the embodiment of the present invention. DETAILED DESCRIPTION

[0030] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. Figures 1 to 3 , the structure of an electronic device 1 according to one embodiment of the present invention will be described. Figure 1 It is a perspective view showing the electronic device 1 . Figure 2 as well as Figure 3 It is a perspective view showing the first body.

[0031] The electronic device 1 of this embodiment includes a first body 50 and a second body 80 mounted on the first body 50. The electronic device 1 further includes a circuit including a plurality of elements provided in the first body 50 and at least one element provided in the second body 80. In this embodiment, the electronic device 1 includes a bandpass filter circuit 5 as the circuit, which selectively passes a signal having a frequency within a predetermined passband. The bandpass filter circuit 5 is described later. Figure 4 Shown in.

[0032] The first body 50 includes multiple stacked dielectric layers and multiple conductors (multiple conductor layers and multiple through-holes). The multiple dielectric layers are each made of a dielectric material. In this embodiment, the dielectric material is, for example, a low-temperature co-fired ceramic (LTCC). The relative dielectric constant of the dielectric material can be, for example, 8 or greater, and preferably 10 or greater.

[0033] The first body 50 has a first surface 50A and a second surface 50B located at opposite ends of the stacking direction T of the multiple dielectric layers, and four side surfaces 50C through 50F connecting the first surface 50A and the second surface 50B. Side surfaces 50C and 50D face opposite sides, and side surfaces 50E and 50F also face opposite sides. Side surfaces 50C through 50F are perpendicular to the first surface 50A and the second surface 50B.

[0034] Here, if Figures 1 to 3 As shown, the X direction, Y direction, and Z direction are defined. The X direction, Y direction, and Z direction are orthogonal to each other. In this embodiment, a direction parallel to the stacking direction T is referred to as the Z direction. The Z direction is also a direction parallel to the direction in which the first body 50 and the second body 80 are arranged. In addition, the direction opposite to the X direction is referred to as the -X direction, the direction opposite to the Y direction is referred to as the -Y direction, and the direction opposite to the Z direction is referred to as the -Z direction. In addition, the expression "when observed from a prescribed direction (for example, the stacking direction T)" means observing the object from a separate position along a prescribed direction or a direction parallel to the prescribed direction.

[0035] like Figures 1 to 3 As shown, the first surface 50A is located at the Z-direction end of the first body 50. The first surface 50A is both the top surface of the first body 50 and the mounting surface for mounting the second body 80. The second surface 50B is located at the -Z-direction end of the first body 50. The second surface 50B is also the bottom surface of the first body 50. Figure 2 The first body 50 is shown as viewed from the first surface 50A side. Figure 3 The first body 50 is shown as viewed from the second surface 50B side.

[0036] Side surface 50C is located at the -X end of first body 50. Side surface 50D is located at the X end of first body 50. Side surface 50E is located at the -Y end of first body 50. Side surface 50F is located at the Y end of first body 50.

[0037] The first body 50 further includes a plurality of electrodes 111, 112, 113, 114, 115, 116, 117, 118, and 119 disposed on the second surface 50B of the first body 50. Electrodes 111, 112, and 113 are arranged in this order along the X direction, closer to the side surface 50E than to the side surface 50F. Electrodes 115, 116, and 117 are arranged in this order along the -X direction, closer to the side surface 50F than to the side surface 50E.

[0038] Electrode 114 is arranged between electrode 113 and electrode 115. Electrode 118 is arranged between electrode 111 and electrode 117. Electrode 119 is arranged between electrode 112 and electrode 116. Electrode 119 is arranged substantially in the center of second surface 50B.

[0039] The first body 50 further includes four electrodes 121, 122, 123, and 124 disposed on the first surface 50A of the first body 50. Electrodes 121 and 122 are arranged in this order along the X direction, closer to the side surface 50E than to the side surface 50F. Electrodes 123 and 124 are arranged in this order along the -X direction, forward of electrodes 121 and 122 in the Y direction.

[0040] The second body 80 further includes four electrodes 81, 82, 83, and 84. When the second body 80 is mounted on the first body 50, the electrodes 81-84 are respectively opposed to the electrodes 121-124 of the first body 50. The electrodes 81-84 are physically connected to the electrodes 121-124 via, for example, solder bumps 7.

[0041] The size of the planar shape (the shape viewed from the stacking direction T) of the first body 50 is different from the size of the planar shape of the second body 80. Figure 1 In the illustrated example, the planar shape of the first body 50 is larger than the planar shape of the second body 80 .

[0042] In addition, Figure 1 In the illustrated example, the second body 80 is arranged to overlap with the center of gravity of the first surface 50A when viewed from the stacking direction T. The center of gravity of the second body 80 when viewed from the stacking direction T may or may not coincide with the center of gravity of the first surface 50A.

[0043] The electronic device 1 may further include a sealing portion (not shown) that seals the second body 80. The sealing portion (not shown) covers the periphery of the second body 80 and at least a portion of the first surface 50A of the first body 50. The sealing portion may also cover the side surfaces 50C to 50F of the first body 50. The sealing portion is made of, for example, resin.

[0044] Next, refer to Figure 4 The circuit configuration of the bandpass filter circuit 5 of the electronic device 1 will be described. Figure 4 1 is a block diagram conceptually showing the circuit configuration of the bandpass filter circuit 5. The bandpass filter circuit 5 includes a first signal port 2, a second signal port 3, and a signal path 4 connecting the first signal port 2 and the second signal port 3.

[0045] The first signal port 2 and the second signal port 3 are ports for inputting or outputting signals, respectively. That is, when a signal is input to the first signal port 2, a signal is output from the second signal port 3. When a signal is input to the second signal port 3, a signal is output from the first signal port 2.

[0046] Figure 2 as well as Figure 3 Two of the electrodes 111 to 119 shown correspond to the first signal port 2 and the second signal port 3. Seven electrodes other than the two electrodes of the electrodes 111 to 119 may also be connected to a ground.

[0047] Bandpass filter circuit 5 further includes a first circuit portion 10, a second circuit portion 20, and a third circuit portion 30. First circuit portion 10 and second circuit portion 20 are disposed on signal path 4. Third circuit portion 30 is structurally disposed between signal path 4 and a ground element. Furthermore, in this application, the term "structurally" refers to the configuration on a circuit diagram, not the physical configuration.

[0048] The first circuit portion 10 has a first end 10a and a second end 10b. The second circuit portion 20 has a first end 20a and a second end 20b. The third circuit portion 30 has a first end 30a and a second end 30b. The first end 10a of the first circuit portion 10 is connected to the first signal port 2. The first end 20a of the second circuit portion 20 is connected to the second end 10b of the first circuit portion 10. The second end 20b of the second circuit portion 20 is connected to the second signal port 3.

[0049] A first end 30a of the third circuit portion 30 is connected to the signal path 4 between the second end 10b of the first circuit portion 10 and the first end 20a of the second circuit portion 20. A second end 30b of the third circuit portion 30 is connected to ground.

[0050] The bandpass filter circuit 5 is composed of first to third circuit sections 10, 20, and 30. The bandpass filter circuit 5 can be constructed, for example, by connecting a highpass filter circuit and a lowpass filter circuit in series. One of the first circuit section 10 and the second circuit section 20 may be a highpass filter circuit. The other of the first circuit section 10 and the second circuit section 20 may be a lowpass filter circuit. Alternatively, at least one of the first circuit section 10 and the second circuit section 20 may be a circuit including both a highpass filter circuit and a lowpass filter circuit.

[0051] The first circuit portion 10 and the second circuit portion 20 include multiple components disposed within a first body 50. The multiple components include multiple inductors and multiple capacitors. The multiple inductors are formed from multiple conductors within the first body 50. The multiple capacitors are formed from multiple conductors and multiple dielectrics within the first body 50. The multiple dielectrics are each part of the multiple dielectric layers that constitute the first body 50.

[0052] At least one of the first circuit portion 10 and the second circuit portion 20 may further include at least one element provided in the second body 80 .

[0053] The third circuit portion 30 includes a first element disposed in the first body 50 and a second element disposed in the second body 80. The first element and the second element are connected to each other via Figure 1 Several electrodes among the plurality of electrodes 81 to 84 shown and Figure 2 as well as Figure 3 Some of the multiple electrodes 121 to 124 shown are connected.

[0054] In this embodiment, the first element is a capacitor and the second element is an elastic wave element. The capacitor includes multiple capacitor conductor layers and a dielectric within a first body 50. The multiple capacitor conductor layers extend in directions orthogonal to the stacking direction T. The dielectric interposed between the multiple capacitor conductor layers is a portion of the multiple dielectric layers that constitute the first body 50. Hereinafter, the dielectric of the capacitor (first element) is referred to as the first dielectric. Various ceramic materials, various glass ceramic materials used in low-temperature co-fired ceramics (LTCC), and mixtures thereof can be used as the first dielectric.

[0055] An acoustic wave element includes a dielectric. Hereinafter, the dielectric of the acoustic wave element (second element) is referred to as the second dielectric. An acoustic wave element can be a bulk acoustic wave element or a surface acoustic wave element. In a bulk acoustic wave element, the vibration of the second dielectric is utilized. In a surface acoustic wave element, the second dielectric serves as the substrate. The second dielectric can be any dielectric commonly used in acoustic wave elements.

[0056] Figure 5An example of the structure of the third circuit portion 30 is shown. Figure 5 In FIG. 5 , reference numeral C1 denotes a capacitor as a first element, and reference numeral 31 denotes an elastic wave element as a second element. The third circuit portion 30 further includes an inductor L1 . The inductor L1 is provided in the first body 50 .

[0057] Capacitor C1 is connected in series with elastic wave element 31 and is provided between signal path 4 and ground in terms of circuit structure. In addition, capacitor C1 is connected in series with inductor L1 and is provided between elastic wave element 31 and ground in terms of circuit structure. Figure 5 In the illustrated example, one end of elastic wave element 31 is connected to first end 30a of third circuit portion 30. One end of capacitor C1 is connected to the other end of elastic wave element 31. One end of inductor L1 is connected to the other end of capacitor C1. The other end of inductor L1 is connected to second end 30b of third circuit portion 30.

[0058] The inductor L1 may include multiple inductor sections. The multiple inductor sections may be connected in parallel to each other in the circuit structure. The multiple inductor sections will be described later.

[0059] Next, refer to Figures 6 to 8 The structural features of the electronic device 1 of this embodiment will be described. Figure 6 It is a perspective view showing a portion of the interior of the first body 50 . Figure 7 It is a plan view showing a portion of the interior of the first body 50 . Figure 8 It is a side view showing a part of the interior of the first body 50 .

[0060] First, the structure of capacitor C1 will be described. Capacitor C1 is composed of capacitor conductive layers C1a and C1b, which are arranged and opposed to each other at a predetermined distance in the stacking direction T, and a dielectric between capacitor conductive layers C1a and C1b. Capacitor conductive layers C1a and C1b each extend in a direction orthogonal to the stacking direction T.

[0061] like Figure 8 As shown in FIG. 1 , the capacitor conductive layers C1a and C1b are arranged in this order along the Z direction. The capacitor conductive layer C1a is disposed between the capacitor conductive layer C1b and the first surface 50A. Figure 7 As shown, the capacitor conductive layer C1a and the capacitor conductive layer C1b overlap when viewed from the Z direction. In this embodiment, in particular, the planar shape of the capacitor conductive layer C1a (the shape viewed from the Z direction) and the planar shape of the capacitor conductive layer C1b are similar. Figure 7In the example shown, the planar shapes of capacitor conductive layer C1a and capacitor conductive layer C1b are both L-shaped. Furthermore, capacitor conductive layer C1a is larger than capacitor conductive layer C1b. When viewed in the Z direction, capacitor conductive layer C1a and capacitor conductive layer C1b entirely overlap.

[0062] Capacitor conductive layer C1a is electrically connected to electrode 121 via a conductor such as a via. Although not shown, acoustic wave element 31 is electrically connected to electrode 81. Therefore, capacitor C1 is connected in series with acoustic wave element 31 via electrodes 81 and 121.

[0063] Next, the structure of inductor L1 is described. Inductor L1 includes a first inductor portion L1a and a second inductor portion L1b, which are connected in parallel. A columnar structure formed by connecting multiple vias in series is referred to as a columnar conductor. A columnar conductor extends parallel to the stacking direction T. The first body 50 includes a first columnar conductor T1 and a second columnar conductor T2. The first inductor portion L1a is composed of the first columnar conductor T1. The second inductor portion L1b is composed of the second columnar conductor T2.

[0064] like Figure 8 As shown, the first columnar conductor T1 is disposed between the capacitor conductive layer C1a and the second surface 50B of the first body 50. The first columnar conductor T1 has a first end T1a and a second end T1b located on opposite sides of each other in a direction parallel to the stacking direction T. The first end T1a of the first columnar conductor T1 is electrically connected to the capacitor conductive layer C1b via a conductor such as a via.

[0065] like Figure 8 As shown, the second columnar conductor T2 is disposed between the capacitor conductive layer C1a and the second surface 50B of the first body 50. The second columnar conductor T2 has a first end T2a and a second end T2b located on opposite sides of each other in a direction parallel to the stacking direction T. The first end T2a of the second columnar conductor T2 is electrically connected to the capacitor conductive layer C1b via a conductor such as a via.

[0066] As described above, the first end T1a of the first columnar conductor T1 and the first end T2a of the second columnar conductor T2 are connected to the capacitor conductive layer C1b via conductors such as vias. The capacitor conductive layer C1b serves as both a "capacitor conductive layer" and a "first conductive layer" in the present invention.

[0067] The first body 50 further includes a conductive layer 11 extending in a direction perpendicular to the stacking direction T. The second end T1b of the first columnar conductor T1 and the second end T2b of the second columnar conductor T2 are electrically connected to the conductive layer 11. The conductive layer 11 is connected to a ground via a conductor such as a via and several of the electrodes 111 to 119. The first columnar conductor T1 and the second columnar conductor T2 are connected in parallel via the capacitor conductive layer C1b, the conductive layer 11, and conductors such as vias. Furthermore, the first columnar conductor T1 and the second columnar conductor T2 are connected to a ground via the conductive layer 11, conductors such as vias, and several of the electrodes 111 to 119. The conductive layer 11 corresponds to the "second conductive layer" of the present invention.

[0068] Furthermore, the first end T1a of the first columnar conductor T1 may be directly connected to the capacitor conductive layer C1b without a via or other conductor. Similarly, the first end T2a of the second columnar conductor T2 may be directly connected to the capacitor conductive layer C1b without a via or other conductor.

[0069] Next, the features related to the arrangement of capacitor C1 and acoustic wave element 31 are described. Figure 7 In the figure, the area enclosed by the double-dashed rectangle labeled 80 represents the area on the first surface 50A of the first body 50 where the second body 80 is mounted. When viewed in the stacking direction T, the second body 80 partially overlaps with the capacitor C1. Although not shown, the elastic wave element 31 is positioned forward of the capacitor C1 in the Z direction. No other elements are positioned between the capacitor C1 and the elastic wave element 31.

[0070] Furthermore, capacitor conductive layers C1a and C1b forming capacitor C1 are positioned between acoustic wave element 31 and the first columnar conductor T1 forming first inductor portion L1a and the second columnar conductor T2 forming second inductor portion L1b. When viewed in the Z direction, capacitor conductive layers C1a and C1b entirely cover the first columnar conductor T1 and the second columnar conductor T2.

[0071] Next, the functions and effects of the electronic device 1 according to this embodiment will be described. In this embodiment, the capacitor conductive layers C1a and C1b are arranged between the acoustic wave element 31 and the first and second columnar conductors T1 and T2. Consequently, according to this embodiment, magnetic coupling between the acoustic wave element 31 and the first and second columnar conductors T1 and T2 can be suppressed. Consequently, according to this embodiment, the overall characteristics of the electronic device 1 can be prevented from deviating from the desired characteristics due to magnetic coupling between the acoustic wave element 31 and the first and second columnar conductors T1 and T2. In other words, according to this embodiment, the capacitor conductive layers C1a and C1b enable the overall characteristics of the electronic device 1 to be achieved as desired.

[0072] Furthermore, in this embodiment, the first end T1a of the first columnar conductor T1 and the first end T2a of the second columnar conductor T2 are both connected to the capacitor conductive layer C1b, while the second end T1b of the first columnar conductor T1 and the second end T2b of the second columnar conductor T2 are both connected to the conductive layer 11. Therefore, in this embodiment, the current flowing in the first columnar conductor T1 and the current flowing in the second columnar conductor T2 coincide with each other, and the magnetic field generated around the first columnar conductor T1 and the magnetic field generated around the second columnar conductor T2 cancel each other out. Consequently, according to this embodiment, the overall characteristics of the electronic device 1 can be suppressed from deviating from the desired characteristics due to magnetic coupling between the acoustic wave element 31 and the first and second columnar conductors T1 and T2. In other words, according to this embodiment, the overall characteristics of the electronic device 1 can be achieved as desired through the capacitor conductive layer C1b, the first and second columnar conductors T1 and T2, and the conductive layer 11.

[0073] In this embodiment, acoustic wave element 31 is disposed between signal path 4 and ground. Capacitor C1 is connected in series with inductor L1 and disposed between acoustic wave element 31 and ground. Capacitor C1 functions to increase the resonant frequency of the subcircuit including third circuit portion 30. This function will be described below with reference to the results of a first simulation.

[0074] The first simulation used a model of a subcircuit that included third circuit section 30. The subcircuit model included a first signal port, a second signal port, a signal path connecting the first and second signal ports, and third circuit section 30 disposed between the signal path and ground. In the subcircuit model, third circuit section 30 included an elastic wave element disposed between the signal path and ground, and a capacitor disposed between the signal path and the elastic wave element.

[0075] In the first simulation, using the aforementioned subcircuit model, the subcircuit's attenuation characteristics were determined while varying the capacitor's capacitance from 0.3 to ∞pF. The attenuation characteristics for a capacitor with a capacitance of ∞pF represent the attenuation characteristics when no capacitor is installed. In the first simulation, the Q value at the resonant frequency and the Q value at the antiresonant frequency of the acoustic wave element were set to 300, respectively, and the electromechanical coupling coefficient of the acoustic wave element was set to 0.091.

[0076] Figure 9 is a characteristic diagram showing the attenuation characteristics of the sub-circuit obtained by the first simulation. Figure 9 In the figure, the horizontal axis represents frequency and the vertical axis represents attenuation. Figure 9, reference numeral 91 represents the through-attenuation characteristics when the capacitance of the capacitor is ∞pF, reference numeral 92 represents the through-attenuation characteristics when the capacitance of the capacitor is 10pF, reference numeral 93 represents the through-attenuation characteristics when the capacitance of the capacitor is 3pF, reference numeral 94 represents the through-attenuation characteristics when the capacitance of the capacitor is 1pF, and reference numeral 95 represents the through-attenuation characteristics when the capacitance of the capacitor is 0.3pF.

[0077] like Figure 9 As shown, the resonant frequency of the subcircuit increases as the capacitance of the capacitor decreases. According to this embodiment, the resonant frequency of the subcircuit including the third circuit portion 30 can be adjusted using the capacitor. In particular, the resonant frequency of the subcircuit with the capacitor is higher than the resonant frequency of the subcircuit when the capacitor has a capacitance of ∞ pF, i.e., when no capacitor is provided.

[0078] Furthermore, the characteristics of the subcircuit can also be adjusted using the acoustic wave element. The following describes a second simulation that investigated the characteristics of the subcircuit when the characteristics of the acoustic wave element were modified. In this second simulation, the subcircuit model was used to determine the transmission and reflection attenuation characteristics of the subcircuit for the first scenario. In this first scenario, the capacitor capacitance was set to 0.3 pF, the Q value of the acoustic wave element at the resonant frequency and the Q value at the antiresonant frequency were set to 500, and the electromechanical coupling coefficient of the acoustic wave element was set to 0.13. Furthermore, in this second simulation, the subcircuit model was used to determine the transmission and reflection attenuation characteristics of the subcircuit for the second scenario. In this second scenario, the capacitor capacitance was set to 0.3 pF, the Q value of the acoustic wave element at the resonant frequency and the Q value at the antiresonant frequency were set to 300, and the electromechanical coupling coefficient of the acoustic wave element was set to 0.091.

[0079] Figure 10 3 is a characteristic diagram showing the pass attenuation characteristics of the sub-circuit obtained by the second simulation. Figure 11 is a characteristic diagram showing the reflection attenuation characteristics of the sub-circuit obtained by the second simulation. Figure 10 as well as Figure 11 In the figure, the horizontal axis represents frequency and the vertical axis represents attenuation. Figure 10 as well as Figure 11 In FIG, the solid line curve represents the characteristics of the first case, and the dotted line curve represents the characteristics of the second case. Figure 10 as well as Figure 11 It can be understood that the characteristics of the sub-circuit can also be adjusted by the elastic wave element.

[0080] As can be understood from the results of the first and second simulations, according to this embodiment, the characteristics of the sub-circuit can be adjusted using capacitor C1 and acoustic wave element 31 .

[0081] Next, other effects of the present embodiment will be described. The dielectric has a characteristic that changes according to temperature. Therefore, the bandpass filter circuit 5 composed of elements including the dielectric also has a characteristic that changes according to temperature. Here, attention is paid to the resonant frequency of the dielectric material. As an indicator representing the temperature dependence of the resonant frequency of the dielectric material, there is a temperature coefficient of resonant frequency TCF. The temperature coefficient of resonant frequency TCF (unit is ppm / K) is defined in Japanese Industrial Standard R1627 (JIS R1627) (Test method for dielectric properties of fine ceramics for microwave use) and is expressed by the following formula (1). In addition, f ref Indicates the reference temperature t ref The resonant frequency, f T Indicates the resonant frequency at a specified temperature t.

[0082] TCF=[(f T -f ref ) / {f ref (tt ref )}]×10 6 …(1)

[0083] Generally speaking, the temperature dependence of the pass-through attenuation characteristics of bandpass filter circuit 5 can be suppressed by using components containing dielectrics with a small absolute value of the temperature coefficient TCF of the resonant frequency. However, depending on the component, it may be difficult to use dielectrics with a small absolute value of the temperature coefficient TCF of the resonant frequency. The absolute value of the temperature coefficient TCF of the resonant frequency can be reduced by combining materials with different temperature coefficients TCF of the resonant frequency. However, using a combination of dielectric materials with multiple materials to construct elastic wave element 31 increases the cost of elastic wave element 31. Furthermore, it is difficult to achieve a material combination that satisfies both the characteristics of elastic wave element 31 and the characteristics of bandpass filter circuit 5.

[0084] In this embodiment, the first dielectric used in capacitor C1 (first element) is formed of a first dielectric material having a temperature coefficient of resonant frequency (TCF) of a first value, and the second dielectric used in acoustic wave element 31 (second element) is formed of a second dielectric material having a temperature coefficient of resonant frequency (TCF) of a second value.

[0085] The first and second dielectrics can be selected so that the absolute value of the sum of the first and second values, or the absolute value of the average of the first and second values, is smaller than the absolute value of the second value. Thus, even when it is difficult to reduce the absolute value of the temperature coefficient of resonant frequency TCF of one of the first and second dielectrics, by selecting the other dielectric to satisfy the aforementioned requirements, it is possible to suppress variations in the characteristics (resonant frequency) of the sub-circuit including the third circuit portion 30. As a result, according to this embodiment, variations in the pass attenuation characteristics of the bandpass filter circuit 5 due to temperature can be suppressed.

[0086] For example, if one of the first and second values is negative, the absolute value of the sum of the first and second values can be made smaller than the absolute value of the second value by setting the other value to a positive value. In one example, the first value is 40 ppm / K and the second value is -25 ppm / K.

[0087] Furthermore, when both the first value and the second value are negative, the absolute value of the first value can be made smaller than the absolute value of the second value so that the absolute value of the average of the first and second values can be made smaller than the absolute value of the second value. In one example, the first value is -5 ppm / K and the second value is -25 ppm / K.

[0088] The sum of the first value and the second value and the average of the first value and the second value may both be within a range of, for example, −75 to 40 ppm / K.

[0089] [Variation]

[0090] Next, a first modification and a second modification of the electronic device 1 of this embodiment will be described. Figure 12 A first modified example will be described. Figure 12 This is a side view showing a portion of the interior of the first body 50 according to the first modification. In the first modification, inductor L1 includes inductor portions L1a1 and L1b1 connected in parallel with each other, inductor portions L1a2 and L1b2 connected in parallel with each other, and inductor portions L1a3 and L1b3 connected in parallel with each other, instead of first inductor portion L1a and second inductor portion L1b.

[0091] In the first modified example, the first body 50 includes columnar conductors T1A, T1B, T1C, T2A, T2B, and T2C instead of the first and second columnar conductors T1 and T2. Inductors L1a1, L1a2, and L1a3 are formed by columnar conductors T1A, T1B, and T1C, respectively. Inductors L1b1, L1b2, and L1b3 are formed by columnar conductors T2A, T2B, and T2C, respectively.

[0092] The columnar conductors T1A, T1B, and T1C are arranged in this order along the -Z direction. Figure 12 In the example shown, the columnar conductors T1A and T1C are arranged at the same position in a direction parallel to the Y direction. The columnar conductor T1B is arranged ahead of the columnar conductors T1A and T1C in the Y direction.

[0093] The columnar conductor T1A has a first end T1Aa and a second end T1Ab located on opposite sides of each other in a direction parallel to the stacking direction T. The columnar conductor T1B has a first end and a second end located on opposite sides of each other in a direction parallel to the stacking direction T. The columnar conductor T1C has a first end and a second end located on opposite sides of each other in a direction parallel to the stacking direction T.

[0094] The columnar conductors T2A, T2B, and T2C are arranged in this order along the -Z direction. Figure 12 In the example shown, the columnar conductors T2A and T2C are arranged at the same position in a direction parallel to the Y direction. The columnar conductor T2B is arranged ahead of the columnar conductors T2A and T2C in the −Y direction.

[0095] The columnar conductor T2A has a first end T2Aa and a second end T2Ab located on opposite sides of each other in a direction parallel to the stacking direction T. The columnar conductor T2B has a first end and a second end located on opposite sides of each other in a direction parallel to the stacking direction T. The columnar conductor T2C has a first end and a second end located on opposite sides of each other in a direction parallel to the stacking direction T.

[0096] The first end T1Aa of the columnar conductor T1A and the first end T2Aa of the columnar conductor T2A are electrically connected to the capacitor conductive layer C1b constituting the capacitor C1.

[0097] In the first modified example, the first body 50 further includes two conductive layers 12 and 13, each extending in a direction perpendicular to the stacking direction T. Conductive layers 12 and 13 are arranged between the capacitor conductive layer C1b and the conductive layer 11. Furthermore, conductive layer 12 is arranged closer to the capacitor conductive layer C1b than conductive layer 13. Conductive layer 13 is arranged closer to conductive layer 11 than conductive layer 12.

[0098] The second end T1Ab of columnar conductor T1A, the second end T2Ab of columnar conductor T2A, the first end of columnar conductor T1B, and the first end of columnar conductor T2B are connected to conductive layer 12. The second end of columnar conductor T1B, the second end of columnar conductor T2B, the first end of columnar conductor T1C, and the first end of columnar conductor T2C are connected to conductive layer 13. The second end of columnar conductor T1C and the second end of columnar conductor T2C are connected to conductive layer 11.

[0099] Next, refer to Figure 13 A second modified example will be described. Figure 13 This is a side view showing a portion of the interior of the first body 50 in the second variation. In the second variation, the second columnar conductor T2 is positioned forward of the first columnar conductor T1 in the -Z direction. The first end T1a of the first columnar conductor T1 is electrically connected to the capacitor conductive layer C1b. The second end T2b of the second columnar conductor T2 is electrically connected to the conductive layer 11.

[0100] In the second modification, the first body 50 includes a conductive layer 14 extending in a direction perpendicular to the stacking direction T. In the second modification, the second end T1 b of the first columnar conductor T1 and the first end T2 a of the second columnar conductor T2 are electrically connected to the conductive layer 14 .

[0101] Furthermore, the present invention is not limited to the above-described embodiments and can be modified in various ways. For example, the electronic device of the present invention is not limited to bandpass filters, but can be applied to other filters such as low-pass filters and high-pass filters, and electronic devices including multiple resonators, such as splitters that separate multiple signals of different frequency bands.

[0102] As described above, an electronic device according to one embodiment of the first aspect of the present invention comprises: a first body comprising a plurality of stacked dielectric layers and a first element; a second body mounted on the first body and comprising a second element; and a circuit comprising the first element and the second element. The first body further comprises a first columnar conductor extending in a direction parallel to the stacking direction of the plurality of dielectric layers and connected to a grounding member. The first element is a capacitor comprising a capacitor conductor layer extending in a direction orthogonal to the stacking direction. The capacitor conductor layer is disposed between the second element and the first columnar conductor.

[0103] In the electronic device according to one embodiment of the first aspect of the present invention, the first body may further include a first surface on which the second body is mounted and a second surface opposite to the first surface. The first columnar conductor may be disposed between the capacitor conductive layer and the second surface.

[0104] In the electronic device according to one embodiment of the first aspect of the present invention, the first columnar conductor may constitute an inductor. The circuit may further include an inductor.

[0105] In the electronic device according to one embodiment of the first aspect of the present invention, the second element may be connected to the capacitor conductive layer.

[0106] In addition, in an electronic device according to one embodiment of the first aspect of the present invention, the first body may further include: a first conductor layer extending in an orthogonal direction; and a second columnar conductor extending in a direction parallel to the stacking direction. One end of the first columnar conductor and one end of the second columnar conductor may be connected to the first conductor layer. The first conductor layer and the capacitor conductor layer may be opposite to each other. The first body may further include a second conductor layer extending in an orthogonal direction. The other end of the first columnar conductor and the other end of the second columnar conductor may be connected to the second conductor layer. The first columnar conductor and the second columnar conductor may respectively constitute a first inductor and a second inductor. The circuit may further include a first inductor and a second inductor. The first inductor and the second inductor may be connected in parallel with each other.

[0107] In one embodiment of the first aspect of the present invention, the first body may further include a first conductive layer extending in a perpendicular direction. The shape of the capacitor conductive layer when viewed in the stacking direction may be similar to the shape of the first conductive layer when viewed in the stacking direction.

[0108] In addition, in an electronic device according to one embodiment of the first aspect of the present invention, the circuit may further include a subcircuit, the subcircuit including a first signal port, a second signal port, and a signal path connecting the first signal port and the second signal port. The first element and the second element may also be connected in series and arranged between the signal path and the ground member in the circuit structure. The resonant frequency of the subcircuit may also be higher than the resonant frequency of the subcircuit in the case where the first element is not provided.

[0109] In the electronic device according to one embodiment of the first aspect of the present invention, the second body may overlap with a portion of the first element when viewed in the stacking direction.

[0110] In the electronic device according to one embodiment of the first aspect of the present invention, the second element may be an elastic wave element.

[0111] An electronic device according to one embodiment of a second aspect of the present invention includes: a first body including a plurality of dielectric layers, a capacitor, and an inductor; a second body mounted on the first body and including an elastic wave element; and a circuit. The circuit includes a first signal port, a second signal port, and a signal path connecting the first signal port and the second signal port. The elastic wave element is disposed between the signal path and a ground in the circuit structure. The capacitor and the inductor are connected in series and disposed between the elastic wave element and the ground in the circuit structure.

[0112] In the electronic device according to one embodiment of the second aspect of the present invention, the inductor may include a plurality of inductor portions. The plurality of inductor portions may be connected in parallel to each other in terms of circuit structure.

[0113] It is clear from the above description that the present invention can be implemented in various forms and modifications. Therefore, within the scope of the equivalents of the claims, the present invention can be implemented in forms other than the above-described embodiment.

Claims

1. An electronic device, characterized in that: have: a first body comprising a plurality of stacked dielectric layers and a first element; A second body mounted on the first body and comprising a second element; and a circuit comprising the first element and the second element, The first body further includes a first columnar conductor, the first columnar conductor extending in a direction parallel to the stacking direction of the plurality of dielectric layers and connected to a grounding member. The first element is a capacitor including a capacitor conductive layer, the capacitor conductive layer extending in a direction perpendicular to the stacking direction. The capacitor conductive layer is disposed between the second element and the first columnar conductor.

2. The electronic device according to claim 1, wherein The first body further comprises a first surface on which the second body is mounted and a second surface opposite to the first surface. The first columnar conductor is arranged between the capacitor conductive layer and the second surface.

3. The electronic device according to claim 1, wherein The first columnar conductor constitutes an inductor, The circuit also includes the inductor.

4. The electronic device according to claim 1, wherein The second element is connected to the capacitor conductor layer.

5. The electronic device according to claim 1, wherein The first body further includes: a first conductor layer extending along the orthogonal direction; and a second columnar conductor extending in a direction parallel to the stacking direction. One end of the first columnar conductor and one end of the second columnar conductor are connected to the first conductor layer.

6. The electronic device according to claim 5, characterized in that The first conductor layer and the capacitor conductor layer face each other.

7. The electronic device according to claim 5, characterized in that The first body further comprises a second conductor layer extending along the orthogonal direction, The other end of the first columnar conductor and the other end of the second columnar conductor are connected to the second conductor layer.

8. The electronic device according to claim 5, wherein: The first columnar conductor and the second columnar conductor constitute a first inductor and a second inductor, respectively. The circuit further includes the first inductor and the second inductor, The first inductor and the second inductor are connected to each other in parallel.

9. The electronic device according to claim 1, wherein: The first body further comprises a first conductor layer extending along the orthogonal direction, The shape of the capacitor conductive layer when viewed from the stacking direction is similar to the shape of the first conductive layer when viewed from the stacking direction.

10. The electronic device according to claim 1, wherein The circuit further includes a sub-circuit, the sub-circuit including a first signal port, a second signal port, and a signal path, the signal path connecting the first signal port and the second signal port. The first element and the second element are connected in series and are arranged between the signal path and the grounding element in the circuit structure. The resonant frequency of the sub-circuit is higher than the resonant frequency of the sub-circuit when the first element is not provided.

11. The electronic device according to claim 1, wherein When viewed from the stacking direction, the second body overlaps with a portion of the first element.

12. The electronic device according to any one of claims 1 to 11, characterized in that The second element is an elastic wave element.

13. An electronic device, characterized in that: have: a first body comprising a plurality of dielectric layers, a capacitor, and an inductor; a second body mounted on the first body and comprising an elastic wave element; and Circuit, The circuit includes a first signal port, a second signal port, and a signal path connecting the first signal port and the second signal port. The elastic wave element is arranged between the signal path and the ground member in the circuit structure. The capacitor is connected in series with the inductor and is provided between the elastic wave element and the ground in terms of circuit structure.

14. The electronic device according to claim 13, wherein: The inductor comprises a plurality of inductor sections, The plurality of inductor portions are connected in parallel to one another in a circuit configuration.

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