Thermoelectric cooling structure of BMS (battery management system)

Abstract

The invention discloses a thermoelectric cooling structure of a BMS (battery management system), and relates to the field of cooling structures, the thermoelectric cooling structure comprises a plastic shell, a semiconductor chilling plate is arranged in the plastic shell, and the bottom of the plastic shell is provided with a cold conducting surface in contact with the cold end of the semiconductor chilling plate; the heat dissipation assembly I is arranged above the semiconductor chilling plate and consists of a rotating wheel and a plurality of heat dissipation fan blades fixed on the rotating wheel; the power generation assembly is arranged above the heat dissipation fan blades; the second heat dissipation assembly is arranged above the plastic shell; the processing module is arranged on a main control board of the BMS; the driving assembly drives the rotating wheel and the second heat dissipation assembly to rotate, the power generation assembly supplies power to the semiconductor chilling plate, meanwhile, the hot end of the semiconductor chilling plate, the power generation assembly and the hollow motor can be cooled, the refrigeration effect of the semiconductor chilling plate can be maintained, energy consumption can be reduced, and the use cost can be reduced; and overheating of the power generation assembly and the hollow motor can be effectively avoided.

Description

Technical Field

[0001] The present invention relates to the technical field related to cooling structures, and in particular to a thermoelectric cooling structure for a BMS battery management system. Background Art

[0002] The BMS battery management system is a system used to manage batteries. It is mainly used for intelligent management and maintenance of each battery unit to ensure the normal operation of the battery. In order to make the BMS battery management system work properly, a thermoelectric cooling structure is generally used to dissipate heat from components in the BMS battery management system that are prone to overheating during operation, such as CPUs, MOSFET components, etc.

[0003] The core of the thermoelectric cooling structure's ability to achieve a cooling effect is based on the Peltier effect. In short, when current passes through a specific material, it absorbs heat on one side and releases it on the other side, thereby achieving a cooling effect. However, in actual use, there are still the following shortcomings: In order to ensure the cooling effect of the cold end of the semiconductor refrigeration plate, it is usually chosen to set an air-cooled radiator at the hot end. Compared with simply using a cooling fan to dissipate heat from the component, although it can improve the heat dissipation effect, the energy consumption is also higher, resulting in increased cost of use. Summary of the Invention

[0004] In order to solve the defects of the prior art, the present invention provides a BMS battery management system thermoelectric cooling structure.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: The present invention provides a BMS battery management system thermoelectric cooling structure, comprising a plastic housing, a semiconductor refrigeration plate disposed therein, and a cooling surface in contact with the cold end of the semiconductor refrigeration plate disposed at the bottom of the plastic housing; A heat dissipation component 1 is provided above the semiconductor refrigeration chip, which is composed of a rotating wheel and a plurality of heat dissipation fan blades fixed to the rotating wheel, and is used to remove the heat generated by the hot end of the semiconductor refrigeration chip; A power generation component is provided above the heat dissipation fan blades; a second heat dissipation component disposed above the plastic housing; A driving assembly disposed above the power generation assembly is used to drive the heat dissipation assembly 1 and the heat dissipation assembly 2 to rotate and enable the power generation assembly to generate electricity; The processing module installed on the main control board of the BMS battery management system processes the AC power generated by the power generation component to form a stable DC power supply to the semiconductor cooling plate.

[0006] As a preferred technical solution of the present invention, the power generation component includes a heat dissipation shell and several permanent magnets detachably mounted on the rotor, several heat dissipation parts are embedded on the outer wall of the heat dissipation shell, a stator coil is installed in the heat dissipation shell, and the stator coil is sleeved outside the rotor. The permanent magnets are driven by the rotor to rotate, so that the stator coil generates alternating current.

[0007] As a preferred technical solution of the present invention, the driving assembly includes a hollow motor, a driving shaft that can pass through the center hole of the hollow motor, and several positioning rods. The upper end of the driving shaft is connected to the second heat dissipation assembly, and the lower end of the driving shaft is connected to the rotor. The outer wall of the driving shaft is provided with a mounting plate for connecting to the rotating body of the hollow motor. The bottom of the mounting plate is provided with a connecting hole for installing the positioning rod, and the hollow motor is installed on the top of the heat dissipation shell. The hollow motor can drive the driving shaft to rotate, so that the rotor and the second heat dissipation assembly rotate, which is used to cool the hot end of the semiconductor refrigeration plate, the power generation assembly and the hollow motor.

[0008] As a preferred technical solution of the present invention, a ventilation cover is provided on the top of the plastic shell, and a connection interface electrically connected to the interface unit of the BMS battery management system is provided through the plastic shell. The connection interface is electrically connected to the power-on end of the semiconductor refrigeration plate, the output end of the stator coil and the hollow motor through a wire.

[0009] As a preferred technical solution of the present invention, the processing module includes a rectifier unit and a voltage stabilizing unit electrically connected to the main control unit of the BMS battery management system via a protection circuit, the input end of the rectifier unit is electrically connected to the output end of the stator coil via an interface unit and a connection interface, the rectifier unit converts the alternating current generated by the power generation component into direct current, the input end of the voltage stabilizing unit is electrically connected to the output end of the rectifier unit, the output end of the voltage stabilizing unit is electrically connected to the power-on end of the semiconductor refrigeration plate via the interface unit and the connection interface, and the hollow motor is electrically connected to the main control unit of the BMS battery management system through the connection interface and the interface unit.

[0010] As a preferred technical solution of the present invention, the runner is a cylindrical structure with openings at both ends, and a plurality of mounting slots for mounting permanent magnets are provided on the top of the runner. An expansion slot is provided at the top of the mounting slot, and a weight-reducing hole is provided between two adjacent mounting slots. A connecting portion for connecting to a drive shaft is provided inside the runner.

[0011] As a preferred technical solution of the present invention, the top of the heat dissipation shell is provided with an H-shaped connecting cylinder extending into the interior thereof, the H-shaped connecting cylinder is rotatably connected to the drive shaft through a bearing, and the bottom of the positioning rod is in contact with the annular waist platform inside the H-shaped connecting cylinder.

[0012] As a preferred technical solution of the present invention, the bottom of the heat dissipation shell is provided with an annular bottom plate that cooperates with the rotation of the wheel, and the center of the top of the heat dissipation shell is provided with a mounting hole that can accommodate the drive shaft to pass through. The top of the heat dissipation shell is also provided with a connecting bracket connected to the ventilation cover plate, and the heat dissipation shell is fixed to the bottom of the ventilation cover plate through the connecting bracket.

[0013] As a preferred technical solution of the present invention, a positioning ring for positioning the semiconductor refrigeration plate is provided in the plastic housing, and a notch for accommodating a wire is provided on the positioning ring.

[0014] The beneficial effects of the present invention are: 1. This type of BMS battery management system thermoelectric cooling structure drives the rotor and the heat dissipation component 2 to rotate through the driving component, so that the power generation component generates electricity, and provides the electricity generated by the power generation component to the semiconductor refrigeration plate through the processing module. The cold end of the semiconductor refrigeration plate is used to cool the heating elements in the BMS battery management system, and forced air cooling is performed through the rotating heat dissipation component 2 and the heat dissipation fan blades. At the same time, the hot end of the semiconductor refrigeration plate, the power generation component and the hollow motor are cooled. It can not only maintain the cooling effect of the semiconductor refrigeration plate, reduce energy consumption and reduce usage costs, but also effectively prevent the power generation component and the hollow motor from overheating.

[0015] 2. In this BMS battery management system's thermoelectric cooling structure, the alternating current generated by the power generation component is converted into direct current by the processing module and stabilized to power the semiconductor refrigeration chip. During this process, the main control unit monitors the current output by the voltage stabilization unit through the protection circuit, and can protect the semiconductor refrigeration chip, thereby improving the safety of the equipment. The processing module is set on the main control board of the BMS battery management system, which makes it more integrated and used in conjunction with the connection interface to make the installation of the cooling module more flexible.

[0016] 3. This type of BMS battery management system has a thermoelectric cooling structure. The hollow motor drives the rotor to rotate through the drive shaft, and the rotor drives the permanent magnet to rotate, so that the power generation component can provide stable electrical energy to the semiconductor refrigeration chip, so that the semiconductor refrigeration chip can perform stable cooling, which is very reliable.

[0017] 4. This type of BMS battery management system thermoelectric cooling structure positions the power generation component and the drive component through the cooperation of the positioning rod and the annular waist platform, and can quickly assemble the drive component and the power generation component together.

[0018] 5. In this type of BMS battery management system thermoelectric cooling structure, the positioning ring not only positions the semiconductor refrigeration plate, but also provides support for the installation of the cooling surface. The notch on the positioning ring can accommodate the wire, so that the cold end of the semiconductor refrigeration plate can make good contact with the cooling surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 This is a schematic diagram of the first perspective structure of a BMS battery management system thermoelectric cooling structure of the present invention; Figure 2 This is a schematic structural diagram from a second perspective of a thermoelectric cooling structure of a BMS battery management system of the present invention; Figure 3 This is a structural schematic diagram of a BMS battery management system thermoelectric cooling structure (ventilation cover omitted) of the present invention; Figure 4 This is a schematic diagram of the internal structure of a plastic housing of a thermoelectric cooling structure of a BMS battery management system of the present invention; Figure 5 This is a schematic diagram of the connection structure of the power generation component and the heat dissipation component of the thermoelectric cooling structure of the BMS battery management system of the present invention and the drive component; Figure 6 This is a schematic diagram of the internal structure of a heat dissipation housing of a thermoelectric cooling structure of a BMS battery management system of the present invention; Figure 7 This is a structural diagram of the stator coil, permanent magnet and heat dissipation component of a thermoelectric cooling structure of a BMS battery management system of the present invention; Figure 8 This is a schematic diagram of the internal structure of the heat dissipation housing and the rotor of a thermoelectric cooling structure (omitting the stator coil) of a BMS battery management system of the present invention; Figure 9 This is a schematic diagram of the drive shaft and mounting plate structure of a BMS battery management system thermoelectric cooling structure of the present invention; Figure 10 This is a circuit principle block diagram of a thermoelectric cooling structure of a BMS battery management system of the present invention.

[0020] In the figure: 1. Plastic shell; 2. Ventilation cover; 3. Connection interface; 4. Heat dissipation component 2; 5. Cooling surface; 6. Semiconductor refrigeration plate; 7. Power generation component; 71. Heat dissipation shell; 72. Stator coil; 73. Permanent magnet; 74. Annular base plate; 75. Connection bracket; 76. H-shaped connecting cylinder; 77. Heat dissipation part; 8. Heat dissipation component 1; 81. Rotor; 82. Heat dissipation fan blade; 83. Connection part; 84. Weight reduction hole; 85. Expansion slot; 9. Drive component; 91. Hollow motor; 92. Drive shaft; 93. Mounting plate; 94. Connection hole; 95. Positioning rod. DETAILED DESCRIPTION

[0021] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0022] Example: Figures 1-4 As shown, the present invention provides a thermoelectric cooling structure for a BMS battery management system, comprising a plastic housing 1, inside which a semiconductor cooling plate 6 is provided, and a cooling surface 5 in contact with the cold end of the semiconductor cooling plate 6 is provided at the bottom of the plastic housing 1; A heat dissipation assembly 8 is provided above the semiconductor cooling plate 6, which is composed of a rotating wheel 81 and a plurality of heat dissipation blades 82 fixed to the rotating wheel 81, and is used to remove the heat generated by the hot end of the semiconductor cooling plate 6; A power generation assembly 7 is provided above the heat dissipation fan blades 82; A heat dissipation component 2 4 is provided above the plastic housing 1; The driving assembly 9 is provided above the power generation assembly 7, and is used to drive the heat dissipation assembly 1 8 and the heat dissipation assembly 2 4 to rotate and enable the power generation assembly 7 to generate electricity; The processing module provided on the main control board of the BMS battery management system processes the alternating current generated by the power generation component 7 to form a stable direct current to supply the semiconductor cooling plate 6.

[0023] It should be noted that the plastic shell 1, the cooling surface 5, the semiconductor refrigeration plate 6, the heat dissipation component 8, the power generation component 7, etc. together constitute the cooling module; the cooling surface 5 can be made of ceramic materials such as alumina, or metal materials such as aluminum and copper.

[0024] In this embodiment, the heat dissipation component 2 4 is a heat dissipation impeller. If the heat dissipation component 2 4 is located outside the BMS battery management system housing, a protective structure such as a mesh cover needs to be provided to reduce the probability of injury caused by the rotating heat dissipation impeller. If it is located inside the BMS battery management system housing, the protective structure can be omitted, and the BMS battery management system housing can play a protective role.

[0025] Among them, Figure 3-Figure 7 As shown, the power generation component 7 includes a heat dissipation shell 71 and a plurality of permanent magnets 73 detachably mounted on a rotating wheel 81. A plurality of heat dissipation members 77 are embedded on the outer wall of the heat dissipation shell 71. A stator coil 72 is mounted in the heat dissipation shell 71. The stator coil 72 is sleeved on the outside of the rotating wheel 81. The permanent magnet 73 is driven by the rotating wheel 81 to rotate, so that the stator coil 72 generates alternating current.

[0026] In this embodiment, the heat sink 77 is composed of a heat conducting plate connected to the heat dissipation shell 71 and heat dissipation fins provided on one side of the heat conducting plate. This is one embodiment, and other embodiments may also be used. The specific structure of the heat sink 77 is not limited here. The heat generated by the stator coil 72 during power generation is guided to the outside of the heat dissipation shell 71 through the heat sink 77, and then forced air cooling is performed through the heat dissipation component 8 to further improve the heat dissipation effect.

[0027] Among them, Figure 6 、 Figure 8 and Figure 9 As shown, the driving assembly 9 includes a hollow motor 91, a driving shaft 92 that can pass through the center hole of the hollow motor 91, and a plurality of positioning rods 95. The upper end of the driving shaft 92 is connected to the heat dissipation assembly 24, and the lower end of the driving shaft 92 is connected to the runner 81. The outer wall of the driving shaft 92 is provided with a mounting plate 93 for connecting to the rotating body of the hollow motor 91. The bottom of the mounting plate 93 is provided with a connecting hole 94 for installing the positioning rod 95, and the hollow motor 91 is installed on the top of the heat dissipation shell 71. The hollow motor 91 can drive the driving shaft 92 to rotate, so that the runner 81 and the heat dissipation assembly 24 rotate, which is used to cool the hot end of the semiconductor refrigeration plate 6, the power generation assembly 7 and the hollow motor 91.

[0028] When the BMS battery management system is running, the hollow motor 91 is started, and the driving shaft 92 is controlled by the hollow motor 91 to drive the rotating wheel 81 and the heat dissipation component 2 4 to rotate, and the permanent magnet 73 and the heat dissipation fan blade 82 are driven to rotate by the rotating wheel 81. The stator coil 72 is caused to generate alternating current by the rotating permanent magnet 73, and the generated alternating current is processed by the processing module to form a stable direct current and provided to the semiconductor refrigeration plate 6, so that the semiconductor refrigeration plate 6 works, and the heating elements in the BMS battery management system are cooled by cooling the cold end of the semiconductor refrigeration plate 6. At the same time, the rotating heat dissipation component 2 4 and the heat dissipation fan blade 82 perform forced air cooling to dissipate heat, so that the hot end of the semiconductor refrigeration plate 6 is cooled to maintain the cooling effect of the semiconductor refrigeration plate 6.

[0029] It should be noted that the positioning rod 95 and the connecting hole 94 can be connected by threaded connection or by a detachable connection method such as a snap connection, and the connection method between the two is not limited here.

[0030] Among them, Figure 1 and Figure 3As shown, a ventilation cover 2 is provided on the top of the plastic shell 1, and a connection interface 3 electrically connected to the interface unit of the BMS battery management system is provided through the plastic shell 1. The connection interface 3 is electrically connected to the power end of the semiconductor refrigeration plate 6, the output end of the stator coil 72 and the hollow motor 91 through a wire. The wires connecting the power end of the semiconductor refrigeration plate 6, the output end of the stator coil 72 and the hollow motor 91 are concentrated through the provided connection interface 3, which is convenient for later maintenance.

[0031] It should be further explained that the wires connecting the power-on end of the semiconductor refrigeration plate 6, the output end of the stator coil 72 and the hollow motor 91 need to be fixed with wire fixings to avoid contact with the heat dissipation fan blades 82, thereby improving safety. The wire fixings can be wire fixing tapes, wire clamps, self-adhesive cable ties, etc. The specific structure and installation method of the wire fixings are not limited here, and therefore are not marked in the accompanying drawings.

[0032] Among them, Figure 10 As shown, the processing module includes a rectifier unit and a voltage stabilizing unit electrically connected to the main control unit of the BMS battery management system via a protection circuit. The input end of the rectifier unit is electrically connected to the output end of the stator coil 72 via the interface unit and the connection interface 3. The rectifier unit converts the AC power generated by the power generation component 7 into DC power. The input end of the voltage stabilizing unit is electrically connected to the output end of the rectifier unit. The output end of the voltage stabilizing unit is electrically connected to the power-on end of the semiconductor refrigeration plate 6 via the interface unit and the connection interface 3, and the hollow motor 91 is electrically connected to the main control unit of the BMS battery management system through the connection interface 3 and the interface unit.

[0033] The alternating current generated by the power generation component 7 is converted into direct current by the rectifier unit, and the direct current is stabilized by the voltage stabilizing unit to power the semiconductor refrigeration plate 6. In this process, the main control unit monitors the current output by the voltage stabilizing unit through the protection circuit, and can protect the semiconductor refrigeration plate 6 (overvoltage protection, overcurrent protection, etc.), thereby improving the safety of the equipment. The processing module is set on the main control board of the BMS battery management system, which makes the integration higher, and is used in conjunction with the connection interface 3 to make the installation of the cooling module more flexible.

[0034] Among them, Figure 7 and Figure 8As shown, the runner 81 is a cylindrical structure with openings at both ends. Several mounting grooves for mounting permanent magnets 73 are provided on the top of the runner 81. An expansion groove 85 is provided on the top of the mounting groove. The presence of the expansion groove 85 makes it more convenient to remove the permanent magnet 73. A weight-reducing hole 84 is provided between two adjacent mounting grooves. The weight-reducing holes 84 are provided to reduce the weight of the runner 81, thereby reducing the burden on the hollow motor 91. A connecting portion 83 for connecting to the drive shaft 92 is provided inside the runner 81. The connecting portion 83 can be annular or circular, and is connected to the drive shaft 92 by a flange connection. In addition, other detachable connection methods can also be used for connection. The specific connection method between the drive shaft 92 and the connecting portion 83 is not limited here.

[0035] Among them, Figure 8 As shown, the top of the heat dissipation shell 71 is provided with an H-shaped connecting cylinder 76 extending toward the interior thereof. The H-shaped connecting cylinder 76 is rotatably connected to the drive shaft 92 through a bearing, and the bottom of the positioning rod 95 is in contact with the annular waist in the H-shaped connecting cylinder 76. By cooperating with the positioning rod 95 and the annular waist, the power generation component 7 and the drive component 9 are positioned, and the drive component 9 and the power generation component 7 can be quickly assembled together.

[0036] Among them, Figure 7 and Figure 8 As shown, the bottom of the heat dissipation shell 71 is provided with an annular bottom plate 74 that rotates with the rotating wheel 81, and the center of the top of the heat dissipation shell 71 is provided with a mounting hole that can accommodate the driving shaft 92 to pass through, and a shaft sleeve is provided between the mounting hole and the driving shaft 92, so as to reduce the wear caused by the rotation of the driving shaft 92. The top of the heat dissipation shell 71 is also provided with a connecting bracket 75 connected to the ventilation cover 2. The heat dissipation shell 71 is fixed to the bottom of the ventilation cover 2 through the connecting bracket 75, and the top plate inside the heat dissipation shell 71 is in contact with the top of the rotating wheel 81. The heat dissipation shell 71 can prevent the permanent magnet 73 from escaping from the mounting slot.

[0037] In this embodiment, the heat dissipation housing 71 , the annular bottom plate 74 and the rotating wheel 81 are used in conjunction to prevent dust from entering the heat dissipation housing 71 . In order to improve the waterproof effect, a waterproof sealing ring can be provided between the annular bottom plate 74 and the rotating wheel 81 .

[0038] Among them, Figure 3 and Figure 4 As shown, a positioning ring for positioning the semiconductor refrigeration plate 6 is provided in the plastic shell 1, and a notch for accommodating the wire is provided on the positioning ring. In addition to positioning the semiconductor refrigeration plate 6, the positioning ring also provides support for the installation of the cooling surface 5; the notch can accommodate the wire, so that the cold end of the semiconductor refrigeration plate 6 can make good contact with the cooling surface 5.

[0039] In addition, a limiting column is provided in the plastic housing 1 , which can be used to limit the semiconductor cooling plate 6 and is also used to connect with the ventilation cover plate 2 .

[0040] During operation, the thermoelectric cooling structure is installed at a suitable position of the BMS battery management system (such as near the heating element). When the BMS battery management system is running, the main control unit starts the hollow motor 91, and the driving shaft 92 is controlled by the hollow motor 91 to drive the runner 81 and the heat dissipation component 2 4 to rotate, and the permanent magnet 73 and the heat dissipation fan blades 82 are driven to rotate by the runner 81. The rotating permanent magnet 73 causes the stator coil 72 to generate alternating current, and the generated alternating current is processed by the processing module to form a stable direct current and provided to the semiconductor refrigeration plate 6, so that the semiconductor refrigeration plate 6 works, and the heating element in the BMS battery management system is cooled by cooling the cold end of the semiconductor refrigeration plate 6. At the same time, the rotating heat dissipation component 2 4 and the heat dissipation fan blades 82 perform forced air cooling to dissipate heat, so that the hot end of the semiconductor refrigeration plate 6 is cooled to maintain the cooling effect of the semiconductor refrigeration plate 6. At the same time, the heat generated by the stator coil 72 during power generation is guided to the outside of the heat dissipation housing 71 through the heat dissipation element 77. The heat dissipation component 2 4 and the heat dissipation fan blades 82 can also be used to cool the power generation component 7 and the hollow motor 91.

[0041] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A BMS battery management system thermoelectric cooling structure, characterized in that: include: A plastic housing (1) is provided with a semiconductor refrigeration plate (6) therein, and a cooling surface (5) in contact with the cold end of the semiconductor refrigeration plate (6) is provided at the bottom of the plastic housing (1); A heat dissipation component (8) is provided above the semiconductor refrigeration plate (6), which is composed of a rotating wheel (81) and a plurality of heat dissipation fan blades (82) fixed on the rotating wheel (81) and is used to remove heat generated by the hot end of the semiconductor refrigeration plate (6); A power generation assembly (7) disposed above the heat dissipation fan blades (82); A second heat dissipation component (4) disposed above the plastic housing (1); A driving assembly (9) disposed above the power generation assembly (7) is used to drive the heat dissipation assembly 1 (8) and the heat dissipation assembly 2 (4) to rotate and enable the power generation assembly (7) to generate electricity; A processing module is provided on the main control board of the BMS battery management system, and processes the alternating current generated by the power generation component (7) through the processing module to form a stable direct current to supply the semiconductor cooling plate (6).

2. A BMS battery management system thermoelectric cooling structure according to claim 1, characterized in that: The power generation assembly (7) includes a heat dissipation housing (71) and a plurality of permanent magnets (73) detachably mounted on a rotating wheel (81). A plurality of heat dissipation members (77) are embedded on the outer wall of the heat dissipation housing (71). A stator coil (72) is mounted in the heat dissipation housing (71). The stator coil (72) is sleeved outside the rotating wheel (81). The permanent magnets (73) are driven by the rotating wheel (81) to rotate, so that the stator coil (72) generates alternating current.

3. A BMS battery management system thermoelectric cooling structure according to claim 2, characterized in that: The driving assembly (9) includes a hollow motor (91), a driving shaft (92) capable of passing through the center hole of the hollow motor (91), and a plurality of positioning rods (95). The upper end of the driving shaft (92) is connected to the second heat dissipation assembly (4), and the lower end of the driving shaft (92) is connected to the rotating wheel (81). The outer wall of the driving shaft (92) is provided with a mounting plate (93) for connecting to the rotating body of the hollow motor (91). The bottom of the mounting plate (93) is provided with a connecting hole (94) for installing the positioning rod (95). The hollow motor (91) is installed on the top of the heat dissipation shell (71). The hollow motor (91) can drive the driving shaft (92) to rotate, so as to rotate the rotating wheel (81) and the second heat dissipation assembly (4), so as to cool the hot end of the semiconductor refrigeration plate (6), the power generation assembly (7) and the hollow motor (91).

4. A BMS battery management system thermoelectric cooling structure according to claim 3, characterized in that: A ventilation cover plate (2) is provided on the top of the plastic shell (1), and a connection interface (3) electrically connected to an interface unit of a BMS battery management system is provided through the plastic shell (1), and the connection interface (3) is electrically connected to the power supply end of the semiconductor refrigeration plate (6), the output end of the stator coil (72), and the hollow motor (91) through a wire.

5. A BMS battery management system thermoelectric cooling structure according to claim 4, characterized in that: The processing module includes a rectifier unit and a voltage stabilizing unit electrically connected to a main control unit of a BMS battery management system via a protection circuit. The input end of the rectifier unit is electrically connected to the output end of the stator coil (72) via an interface unit and a connection interface (3). The rectifier unit converts the alternating current generated by the power generation component (7) into direct current. The input end of the voltage stabilizing unit is electrically connected to the output end of the rectifier unit. The output end of the voltage stabilizing unit is electrically connected to the power-on end of the semiconductor refrigeration plate (6) via the interface unit and the connection interface (3). The hollow motor (91) is electrically connected to the main control unit of the BMS battery management system via the connection interface (3) and the interface unit.

6. A BMS battery management system thermoelectric cooling structure according to claim 3, characterized in that: The runner (81) is a cylindrical structure with openings at both ends. A plurality of mounting slots for mounting permanent magnets (73) are provided on the top of the runner (81). An expansion slot (85) is provided at the top of the mounting slots. A weight-reducing hole (84) is provided between two adjacent mounting slots. A connecting portion (83) for connecting to a drive shaft (92) is provided inside the runner (81).

7. A BMS battery management system thermoelectric cooling structure according to claim 6, characterized in that: An H-shaped connecting cylinder (76) extending inwardly of the heat dissipation housing (71) is provided on the top of the heat dissipation housing (71). The H-shaped connecting cylinder (76) is rotatably connected to the drive shaft (92) via a bearing, and the bottom of the positioning rod (95) contacts the annular waist in the H-shaped connecting cylinder (76).

8. A BMS battery management system thermoelectric cooling structure according to claim 7, characterized in that: The bottom of the heat dissipation housing (71) is provided with an annular bottom plate (74) that is rotatably engaged with the rotating wheel (81). The center of the top of the heat dissipation housing (71) is provided with a mounting hole capable of accommodating the driving shaft (92) to pass through. The top of the heat dissipation housing (71) is also provided with a connecting bracket (75) connected to the ventilation cover (2). The heat dissipation housing (71) is fixed to the bottom of the ventilation cover (2) via the connecting bracket (75).

9. The BMS battery management system thermoelectric cooling structure according to claim 1, characterized in that: A positioning ring for positioning the semiconductor refrigeration plate (6) is provided in the plastic housing (1), and a notch for accommodating a wire is provided on the positioning ring.

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