A semiconductor display module manufacturing process of pre-bonding and post-mounting single-sided welding

Abstract

The application discloses a kind of semiconductor display module manufacturing processes of first die bonding then patch single-sided welding, comprising the following steps: providing substrate;Solder paste is printed in the pad area of substrate, semiconductor chip is die bonded to the pad area;Chip is carried out single-sided welding using the welding mode of regional point heating, regional scanning heating or regional full area heating;Pre-underfilling treatment is carried out in the area of semiconductor chip welding on substrate;Solder paste is printed in the mounting area of substrate, and IC component is mounted in the mounting area;Mounting component is carried out single-sided welding using the welding mode of regional point heating, regional scanning heating or regional full area heating;Optical functional layer is laminated on substrate, and frame cutting is carried out to substrate laminated with optical functional layer, to form semiconductor display module.Both welding uses local heating welding mode, avoids substrate to be subjected to high temperature thermal stress, avoids solidified solder to occur secondary remelting, improves product yield.

Description

Technical Field

[0001] This invention relates to the field of semiconductor display technology, and in particular to a semiconductor display module manufacturing process that involves die bonding followed by single-sided surface mounting. Background Technology

[0002] With the development of display technology, semiconductor technologies such as Mini LED and Micro LED, due to their advantages of high brightness, high contrast, low power consumption, and ultra-thin design, have gradually become the core direction of next-generation display technology and are being applied to high-end TVs, smartphones, and various display devices. Therefore, the demand for Mini LED and Micro LED semiconductor technologies is also higher.

[0003] In traditional semiconductor display module manufacturing processes, the die bonding process typically uses methods such as eutectic bonding, conductive adhesive curing, or reflow soldering to achieve the initial mechanical connection between the chip and the substrate, while the surface mount process uses reflow soldering to complete the soldering of surface mount components.

[0004] However, both die bonding and chip mounting processes involve hot pressing. After two hot pressing impacts, the substrate is prone to expansion, contraction, and warping due to thermal stress, which reduces product yield. In addition, the two heat treatments may cause the solidified solder to melt back, resulting in defects such as electrode misalignment, floating, or cold solder joints. Especially when Mini LED and Micro LED chips are small in size, have small welding area, and small chip electrode spacing, the secondary melting increases the risk of solder bridging or tin whiskers, which is detrimental to the stability of the chip's electrical connection. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor display module manufacturing process that involves die bonding followed by single-sided soldering, thereby solving the problems of substrate deformation, poor solder joints, and short circuits caused by the two heat treatments in the die bonding and soldering processes.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A semiconductor display module manufacturing process that involves die bonding followed by single-sided surface mounting includes the following steps:

[0008] Provide substrate;

[0009] Solder paste is printed in the pad area of ​​the substrate to bond the semiconductor chip to the pad area;

[0010] Single-sided welding of die-bonded chips is performed using welding methods such as area point heating, area scanning heating, or area full-area heating.

[0011] The area where semiconductor chips are soldered on the substrate is pre-filled.

[0012] Solder paste is printed in the mounting area of ​​the substrate, and IC components are mounted in the mounting area;

[0013] Single-sided soldering of mounted components is performed using soldering methods such as area point heating, area scanning heating, or area full-area heating.

[0014] An optical functional layer is bonded onto the substrate, and the substrate with the bonded optical functional layer is cut into a frame to form a semiconductor display module.

[0015] Optionally, prior to providing the substrate, a surface treatment is performed on the substrate, the surface treatment including:

[0016] Residues on the substrate surface are removed by ultrasonic or electrostatic methods.

[0017] A water-based cleaning agent was used to remove oil and fingerprints from the substrate.

[0018] The substrate pretreatment is completed by water rinsing and heat drying.

[0019] The pretreated substrate is subjected to surface plasma treatment.

[0020] Optionally, when printing solder paste in the pad area of ​​the substrate and bonding the semiconductor chip to the pad area, after the bonding is completed, the semiconductor chip bonding quality is inspected, including chip position offset detection and coplanarity detection.

[0021] Optionally, in the single-sided welding of the die-bonded chip using the welding method of regional point heating, regional scanning heating, or regional full-area heating, and in the single-sided welding of the mounted components using the welding method of regional point heating, regional scanning heating, or regional full-area heating, the welding method of regional point heating, regional scanning heating, or regional full-area heating adopts laser heating welding or photon heating welding, and performs point-by-point welding, line scanning welding, or whole-area welding on the welding area, with the welding temperature controlled at 180℃-250℃, and the welding time of each solder joint less than or equal to 3 seconds.

[0022] Optionally, after single-sided soldering of the die-bonded chip using the soldering method of regional point heating, regional scanning heating, or regional full-area heating, and after single-sided soldering of the mounted components using the soldering method of regional point heating, regional scanning heating, or regional full-area heating, optical inspection is performed using an automatic optical inspection system. The optical inspection includes solder joint integrity inspection, chip offset inspection, and floating height inspection.

[0023] Optionally, the automatic optical inspection system is equipped with an automatic rework system. When the detection value of the automatic optical inspection system is higher than a preset value, the automatic rework system performs targeted rework.

[0024] Optionally, a trench is provided between the IC pad area and the semiconductor pad area on the substrate.

[0025] Optionally, in the pre-filling process of the area where the semiconductor chip is welded on the substrate, the thickness of the underfill adhesive is less than half the thickness of the chip.

[0026] Optionally, in the process of bonding the optical functional layer onto the substrate, the optical functional layer includes at least one of a quantum dot film, a brightness enhancement film, and a polarizing film.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] This invention provides a semiconductor display module manufacturing process that involves die bonding followed by single-sided soldering. The process utilizes spot heating, scanning heating, or full-area heating to perform single-sided soldering on the die-bonded chip, achieving the connection between the semiconductor chip and the substrate. After die bonding, the same spot heating, scanning heating, or full-area heating method is used to individually solder the IC components mounted on the substrate, achieving the connection between the IC components and the substrate. Both welding processes employ single-sided welding methods such as area point heating, area scanning heating, or area full-area heating, effectively avoiding high-temperature thermal stress on the substrate during welding, reducing the possibility of substrate expansion, contraction, and warping deformation, and improving product yield. Simultaneously, after die bonding, the areas on the substrate where the chip is welded undergo pre-filling treatment to reinforce the die-bonded chip. This further prevents the possibility of secondary melting of the solidified solder during subsequent welding, thus improving electrode misalignment, floating, or cold solder joints caused by secondary solder melting. It also effectively avoids solder bridging or the formation of solder whiskers caused by secondary melting, improving the stability of the chip's electrical connection. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0031] Figure 1 This is a flowchart of a semiconductor display module manufacturing process that involves die bonding followed by single-sided surface mounting.

[0032] Figure 2 This is a flowchart of the surface treatment process for a substrate. Detailed Implementation

[0033] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0034] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0035] In semiconductor display module manufacturing processes, the die bonding process uses eutectic bonding, conductive adhesive curing, or reflow soldering to connect the chip to the substrate, while the surface mount process also uses reflow soldering to connect surface mount components to the substrate. Therefore, both die bonding and surface mount processes involve thermal pressure. The substrate is prone to warping and deformation due to the thermal pressure impact from both sides, leading to low final product yield. Simultaneously, the two heat treatments may trigger a secondary remelting of the cured solder, causing defects such as cold solder joints and solder float. This is especially problematic for small semiconductors with small chip spacing, such as Mini LEDs and Micro LEDs, where secondary remelting can easily lead to solder bridging or the formation of solder whiskers, which is detrimental to the electrical connection of the chips.

[0036] Based on this, embodiments of the present invention provide a semiconductor display module manufacturing process that involves die bonding followed by single-sided surface mounting, comprising the following steps:

[0037] Provide substrate;

[0038] Solder paste is printed in the pad area of ​​the substrate to bond the semiconductor chip to the pad area;

[0039] Single-sided welding of die-bonded chips is performed using welding methods such as area point heating, area scanning heating, or area full-area heating.

[0040] The area where semiconductor chips are soldered on the substrate is pre-filled.

[0041] Solder paste is printed in the mounting area of ​​the substrate, and IC components are mounted in the mounting area;

[0042] Single-sided soldering of mounted components is performed using soldering methods such as area point heating, area scanning heating, or area full-area heating.

[0043] An optical functional layer is bonded onto the substrate, and the substrate with the bonded optical functional layer is cut into a frame to form a semiconductor display module.

[0044] This invention provides a semiconductor display module manufacturing process that involves die bonding followed by single-sided soldering. The process utilizes spot heating, scanning heating, or full-area heating to perform single-sided soldering on the die-bonded chip, achieving the connection between the semiconductor chip and the substrate. After die bonding, the same spot heating, scanning heating, or full-area heating method is used to individually solder the IC components mounted on the substrate, achieving the connection between the IC components and the substrate. Both welding processes employ single-sided welding methods such as area point heating, area scanning heating, or area full-area heating, effectively avoiding high-temperature thermal stress on the substrate during welding, reducing the possibility of substrate expansion, contraction, and warping deformation, and improving product yield. After die bonding, the areas on the substrate where the chip is welded are pre-filled to reinforce the die-bonded chip, further preventing the possibility of secondary melting of the solidified solder during subsequent welding. This improves the situation of electrode misalignment, floating, or cold solder joints caused by secondary melting of solder. At the same time, it also effectively avoids solder bridging or the generation of solder whiskers caused by secondary melting, improving the stability of chip electrical connections.

[0045] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0046] like Figure 1As shown, this invention provides a semiconductor display module manufacturing process that involves die bonding followed by single-sided surface mounting and soldering. This process is suitable for manufacturing Mini LED or Micro LED display modules. Due to their small size, small chip spacing, and limited soldering space, Mini LED or Micro LED chips are prone to solder bridging or the formation of solder whiskers during manufacturing due to secondary reflow. The semiconductor display module manufacturing process provided by this invention effectively avoids the possibility of secondary reflow, thereby preventing defects such as solder bridging or solder whisker formation caused by secondary reflow. The semiconductor display module manufacturing process that involves die bonding followed by single-sided surface mounting and soldering provided by this invention is achieved through the following steps:

[0047] Step S1: Provide a substrate;

[0048] The substrate is a semiconductor circuit board substrate used to carry semiconductor LEDs, driver ICs and other electronic components, and to provide electrical connections and mechanical support. In this embodiment, it is not limited to copper plates, PCB boards, alumina ceramic substrates, aluminum nitride ceramic substrates, etc.

[0049] Step S2: Print solder paste on the pad area of ​​the substrate to bond the semiconductor chip to the pad area;

[0050] The pad area of ​​the substrate refers to the area on the substrate used to support the semiconductor chip. It is specifically set according to the display requirements of the semiconductor display module, and this invention does not impose any special limitations on it. Solder paste is a mixed material for surface soldering in the mounting process, mainly composed of tin alloy powder and flux.

[0051] Specifically, the substrate is precisely mounted in a solder paste printer, and the solder paste printer is used to evenly coat the solder pad area of ​​the substrate. The substrate is preheated to allow some of the flux to evaporate, forming a stable solder paste layer.

[0052] In this embodiment, die bonding utilizes needle-piercing mass transfer technology to transfer the semiconductor chip onto the substrate. For example, a dual-camera cooperative positioning system is used to identify the substrate pad positions and capture the chip position. A micro-needle array on the transfer head picks up the chip and moves it above the pads. Position calibration is performed using a vision system. The micro-needle array applies pressure to bring the chip electrodes into contact with the solder paste, and simultaneous local heating melts the solder paste. The transfer head then rises, and the micro-needles detach from the chip. This transfers the chip to the substrate pad area, achieving a preliminary mechanical connection between the chip and the substrate. Needle-piercing mass transfer technology is a relatively mature technology in the field, and will not be described in detail here.

[0053] Step S3: Perform single-sided welding on the die-bonded chip using a welding method that includes point heating, scanning heating, or full-area heating.

[0054] Specifically, welding methods can employ laser heating welding or photon heating welding to perform point-by-point heating welding, line-scanning heating welding, or area-wide heating welding of the chips within the welding area. During actual welding, the welding method is adaptively selected based on the distribution, quantity, material properties, and welding requirements of the chips in the pad area on the substrate. For example, if the chips in the pad area are irregularly distributed and few in number, area-point heating welding can be used; if the chips in the pad area are linearly distributed, area-scanning heating welding can be used; if the number of chips in the pad area is large and irregularly distributed, area-wide heating welding can be used.

[0055] Furthermore, during the welding process, a high-precision automatic positioning system assists in precisely aligning the welding equipment with the chip's welding position. After applying appropriate light energy, the laser or photon beam instantly heats the welding point, causing the solder to melt locally, thus forming a strong weld connection. The welding process involves only localized heating of the welding area, and the welding is completed quickly without prolonged exposure, preventing the substrate from being subjected to high-temperature thermal stress and effectively avoiding the possibility of substrate expansion, contraction, or warping deformation.

[0056] After welding is completed, the weld joint is cooled. For example, inert gas can be introduced to accelerate the cooling process, effectively inhibiting weld oxidation and ensuring the solidification and shape stability of the weld.

[0057] When using laser welding or photonic welding, the welding temperature can be controlled between 180℃ and 250℃, and the welding time for each weld point is less than or equal to 3 seconds. Rapid welding and cooling ensure welding reliability and prevent high heat transfer to the substrate.

[0058] Step S4: Perform pre-filling treatment on the area where the semiconductor chip is welded on the substrate;

[0059] Specifically, epoxy resin can be used as a pre-filler. For example, epoxy resin and curing agent are thoroughly mixed in a set ratio to ensure the uniformity of the filler material and its performance after curing. The mixed epoxy resin is then evenly coated onto the soldering area using processes such as molding, dispensing, or lamination, ensuring that the epoxy resin completely covers the soldering area and fills all gaps. Depending on the material's curing requirements, such as room temperature curing or heat curing, the pre-filler is cured to ensure that the filler material has good physical properties and can effectively protect the soldered chip. Pre-filling treatment can cover the solder that has been soldered and solidified, effectively avoiding the risk of solder bridging or the formation of solder whiskers.

[0060] It should be noted that in the pre-filling process, the thickness of the underfill adhesive is less than half the thickness of the semiconductor chip. This protects the chip without affecting its electrical conductivity.

[0061] Step S5: Print solder paste in the mounting area of ​​the substrate and mount IC components in the mounting area;

[0062] The mounting area is a specific area on the substrate used to mount electronic components, and it must meet the requirements for component soldering, electrical connection, heat dissipation and mechanical fixation.

[0063] Specifically, a solder paste printer is used to evenly apply solder paste to the mounting area on the substrate. Then, the substrate is preheated to allow some of the flux to evaporate, forming a stable solder paste layer. Finally, a pick-and-place machine is used to accurately place the IC components in the predetermined positions.

[0064] Step S6: Perform single-sided soldering on the mounted components using a soldering method that employs area point heating, area scanning heating, or area full-area heating.

[0065] Specifically, the welding methods of regional point heating, regional scanning heating, or regional full-area heating adopt laser heating welding or photon heating welding, and perform point-by-point welding, line scanning welding, or full-area welding on the welding area, thereby realizing single-sided welding of IC components.

[0066] During the soldering process, the laser or photon power and pulse width are adjusted according to the material properties of the IC components and the soldering requirements to ensure soldering reliability. Simultaneously, with the assistance of a high-precision automatic positioning system, the soldering equipment is precisely aligned with the soldering position of the IC components. After applying appropriate light energy, the laser or photon beam instantly heats the solder joint, causing the solder to melt locally, thus forming a strong soldered connection between the IC components and the substrate. The soldering process involves only localized heating of the soldering location, and the soldering is completed in a short time, avoiding prolonged exposure to high-temperature thermal stress on the substrate and effectively preventing the possibility of substrate expansion, contraction, or warping deformation. After soldering, the solder joint is cooled.

[0067] Step S7: Attach an optical functional layer to the substrate and cut the edge of the substrate with the attached optical functional layer to form a semiconductor display module.

[0068] Specifically, a photocurable adhesive layer is coated on the bonding surface of the functional layer and pre-cured to a semi-fluid state to enhance adhesion. Cross alignment marks are set in the non-display area of ​​the substrate, and transparent positioning marks are pre-placed at the corresponding positions of the optical functional layer. The substrate and functional layer marks are simultaneously imaged using a beam splitter, and a piezoelectric micro-displacement stage is used to compensate for alignment deviations caused by thermal expansion. Then, a segmented air cushion pressure head is used to apply positive pressure to the optical functional layer, with the pressure in the central area being higher than that in the edge areas to suppress bubble formation. After bonding is completed, the substrate is transferred into a vacuum chamber and held for 10-30 seconds to expel tiny bubbles.

[0069] Next, cross-shaped positioning marks are set on the non-functional area of ​​the substrate for precise positioning of the cutting path; the cutting path is generated according to the product design drawings; ultraviolet laser is used to scan along the cutting line to form a guide groove on the surface of the optical layer; a diamond-coated blade is used to perform precision cutting along the guide groove. The cut substrate is then immersed in a weakly acidic solution to remove edge burrs and form a passivation layer.

[0070] In this embodiment of the invention, before providing the substrate, a surface treatment of the substrate is further included. The surface treatment includes:

[0071] Residues on the substrate surface are removed by ultrasonic or electrostatic methods.

[0072] A water-based cleaning agent was used to remove oil and fingerprints from the substrate.

[0073] The substrate pretreatment is completed by water rinsing and heat drying.

[0074] The pretreated substrate is subjected to surface plasma treatment.

[0075] Specifically, mechanical pretreatment is first performed using ultrasound or electrostatic methods. The substrate is first immersed in an ultrasonic cleaning tank containing deionized water or a neutral cleaning agent. High-frequency sound waves at 20 kHz-40 kHz are applied to the tank, and the solution temperature is controlled at 40℃-60℃. The ultrasonic treatment time is set according to the substrate material type, typically 5-20 minutes. Ultrasonic cleaning effectively removes particulate contaminants from the substrate surface. Alternatively, a voltaged electrostatic adsorption roller can be used to perform non-contact scanning at a height of 0.5mm-2mm above the substrate surface, effectively removing charged particles.

[0076] Next, chemical cleaning is performed. The prepared water-based cleaning agent is heated to 40℃-60℃ and applied to the substrate by spraying or immersion for 5-10 minutes to dissolve oil or fingerprints adhering to the substrate. Then, the substrate surface is rinsed with a high-pressure water gun to remove residual cleaning agent. Finally, the substrate is dried using a hot air drying device. Cleaning the substrate before die bonding and chip mounting reduces the rate of solder joint defects and improves product yield.

[0077] Furthermore, the substrate undergoes surface plasma activation treatment. The substrate is placed in a vacuum chamber, and a vacuum pump is used to evacuate it to a suitable pressure to remove air from the chamber. A pre-selected gas is injected into the vacuum chamber to form plasma. After the gas is activated, the plasma reacts with the substrate surface to remove contaminants and impurities, while forming an activation layer on the substrate surface. This is beneficial for improving soldering performance and adhesion, thereby increasing the success rate of die bonding and chip mounting.

[0078] In this embodiment of the invention, both the die bonding and chip mounting processes employ single-sided soldering methods such as area point heating, area scanning heating, or area full-area heating. The soldering process is completed in a short time, and the substrate is not subjected to overall high-temperature thermal stress during soldering, effectively preventing substrate expansion, contraction, and warping deformation, thus improving product yield. Furthermore, the single-sided soldering method, with precise local temperature control, avoids secondary melting of the solidified solder, mitigating defects such as electrode misalignment, floating, or cold solder joints caused by secondary melting. It also effectively avoids solder bridging or the formation of solder whiskers caused by secondary melting, improving the stability of the chip's electrical connection. After die bonding, a pre-filling treatment is performed on the area on the substrate where the chip is soldered to reinforce the die-bonded chip, further preventing the possibility of secondary melting of the solidified solder during subsequent soldering.

[0079] In one embodiment of the present invention, after completing the steps of printing solder paste on the pad area of ​​the substrate and bonding the semiconductor chip to the pad area, the semiconductor chip bonding quality is inspected, including chip position offset detection and coplanarity detection.

[0080] For example, high-precision automated optical inspection equipment combined with image processing software can be used for position detection. Before inspection, a reference position is set on the substrate; the automated optical inspection equipment's camera captures images of the die-bonded chip, obtaining real-time image data of the chip; the captured chip image is compared with the reference image to calculate the chip's offset relative to the designed position. By detecting the chip's position offset, the deviation between the actual position of the die-bonded chip and the designed position can be checked, ensuring the chip's precise positioning and guaranteeing subsequent electrical connections and optical output performance.

[0081] Coplanarity testing instruments, such as laser interferometers or 3D surface profilometers, are used to scan the surface of the die-bonded chip to obtain surface height information. Software is then used to process the scan data, generating a height distribution map and analyzing the height differences at each test point. Coplanarity testing verifies the surface flatness and coplanarity of the die-bonded chip, ensuring that multiple chips are on the same plane and guaranteeing the consistency and reliability of optoelectronic performance.

[0082] In another embodiment of the present invention, after completing the steps of single-sided welding of the die-bonded chip using a welding method of regional point heating, regional scanning heating, or regional full-area heating, and single-sided welding of the mounted components using a welding method of regional point heating, regional scanning heating, or regional full-area heating, optical inspection is performed using an automatic optical inspection system. The optical inspection includes solder joint integrity inspection, chip offset inspection, and floating height inspection.

[0083] Specifically, a spectrometer and illuminometer can be used to measure parameters such as light output intensity, wavelength, and spectral distribution of the welded semiconductor to ensure that it meets the design standards. In addition, the semiconductor can be powered on to observe whether it emits light normally, whether the changes in current and voltage are within the expected range, and to check for quality problems such as light leakage or dark spots, which helps to improve product yield.

[0084] Furthermore, the automatic optical inspection system is equipped with an automatic rework system. When the detection value of the automatic optical inspection system is higher than the preset value, the automatic rework system performs targeted rework.

[0085] Optical inspection can determine the quality of solder joints and quickly locate problematic solder joints after detecting defects, enabling precise rework. This reduces manual intervention, improves the stability of welding quality, and helps increase product yield.

[0086] For example, trench structures can be formed in the IC pad area and semiconductor pad area on the substrate, which can form a barrier layer by filling the bottom with adhesive, effectively reducing thermal crosstalk during soldering.

[0087] In one exemplary real-time mode of the present invention, the optical functional layer includes at least one of a quantum dot film, a brightness enhancement film, and a polarizing film.

[0088] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A manufacturing process of a semiconductor display module with pre-bonding and post-mounting single-sided soldering, characterized in that, The method comprises the following steps: providing a substrate; printing tin paste on the pad area of the substrate, and die bonding a semiconductor chip to the pad area; single-sided welding of the die-bonded chip by using a regional point heating, regional scanning heating or regional full-area heating welding method; pre-underfilling the area on the substrate where the semiconductor chip is welded to isolate the thermal influence of the subsequent steps on the chip; printing tin paste on the mounting area of the substrate, and mounting IC components on the mounting area; single-sided welding of the mounted components by using a regional point heating, regional scanning heating or regional full-area heating welding method; mounting an optical functional layer on the substrate, and performing frame cutting on the substrate with the mounted optical functional layer to form a semiconductor display module; in the single-sided welding of the die-bonded chip by using a regional point heating, regional scanning heating or regional full-area heating welding method, and in the single-sided welding of the mounted components by using a regional point heating, regional scanning heating or regional full-area heating welding method, the regional point heating, regional scanning heating or regional full-area heating welding method uses laser heating welding or photon heating welding to perform point-by-point welding, line scanning welding or full-area welding on the welding area, and the welding temperature is controlled at 180-250°C, and the welding time of each welding point is less than or equal to 3 seconds; according to the distribution, quantity and material characteristics of the chip in the pad area on the substrate and the welding requirement, the regional point heating, regional scanning heating or regional full-area heating welding method is selected.

2. The process for manufacturing a pre-bonding and post die-attaching single-side welding semiconductor display module according to claim 1, wherein, Before the step of providing the substrate, the substrate is subjected to surface treatment, and the surface treatment comprises the following steps: removing the surface residues of the substrate by ultrasonic or electrostatic method; removing the oil stains and fingerprints on the substrate by using a water-based cleaning agent; completing the pretreatment of the substrate through water rinsing and heat drying; performing surface plasma treatment on the pretreated substrate.

3. The process for manufacturing a pre-bonding and post die-attaching single-side welding semiconductor display module according to claim 1, wherein After the step of printing tin paste on the pad area of the substrate and die bonding a semiconductor chip to the pad area, the die-bonded semiconductor chip is subjected to quality detection, including chip position offset detection and coplanarity detection.

4. The process of claim 1, wherein the process further comprises: After the single-sided welding of the die-bonded chip by using a regional point heating, regional scanning heating or regional full-area heating welding method, and after the single-sided welding of the mounted components by using a regional point heating, regional scanning heating or regional full-area heating welding method, optical detection is performed by using an automatic optical detection system, and the optical detection comprises welding point integrity detection, chip offset detection and floating height detection.

5. The process for manufacturing a pre-bonding and post-attaching single-side welding semiconductor display module according to claim 4, wherein The automatic optical detection system is provided with an automatic repair system, and when the detection value of the automatic optical detection system is higher than a preset value, the automatic repair system is used for point repair.

6. The process of claim 1, wherein the process further comprises: A groove is arranged between the IC pad area and the semiconductor pad area on the substrate.

7. The process for manufacturing a pre-bonding and post-attaching single-side welding semiconductor display module according to claim 6, wherein In the step of pre-underfilling the area on the substrate where the semiconductor chip is welded, the thickness of the underfilling glue is less than half of the thickness of the chip.

8. The process for manufacturing a pre-bonding and post die-attaching single-side welding semiconductor display module according to claim 1, wherein, In the step of mounting an optical functional layer on the substrate, the optical functional layer comprises at least one of a quantum dot film, a brightness enhancement film and a polarized film.

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